The invention provides a method for rapidly solving a
plane segmentation via hole in a multilayer
integrated circuit board. The method comprises the following steps: calculating a connection relation of all elements in the multilayer
integrated circuit board, determining a vertical position of each via hole, identifying a
plane layer intersected with the via hole, recording connection information, allocating a priority value to each
plane layer, sorting according to the priority values, and creating a
data structure QMaplt; a QPair is used as a QPair; int, int, and intgt; , QSett, QSett; a Viagt; gt; the
data structure is converted into QMaplt; via, QSetlt, Via, QSetlt; a QPair is used as a QPair; int, int, and intgt; gt; gt; and on the basis of the obtained relation that each via hole is
cut by the plane,
cutting holes segmented by the plane. According to the method, through an
automatic data processing and optimization
algorithm, the accuracy and efficiency of via hole segmentation are improved, the design and manufacturing cost is reduced, the
production cycle is shortened, and powerful
technical support is provided for design and manufacturing of a multilayer
integrated circuit board.