A bipolar figure-eight magnetron sputtering machine

Abstract

This invention proposes a bipolar figure-eight magnetron sputtering machine, comprising a support frame, symmetrically arranged first and second main chamber modules, a transfer buffer chamber module, multiple processing chamber modules, and infeed / outfeed chamber modules. A movable transport frame enables rapid replacement, allowing for free combination of process chambers to meet diverse process requirements. An inclined gate valve design reduces floor space and enhances structural stress uniformity, extending equipment lifespan. The transfer buffer chamber provides cooling and temporary storage functions, isolating thermal influences between upstream and downstream processes and ensuring the stability of the material handling environment. Real-time adjustment of media flow and mixing ratio via branch pipelines and an intelligent distribution unit precisely matches process parameters in each chamber, reducing energy consumption.

Description

Technical Field

[0001] This invention relates to the field of vacuum equipment technology, and more specifically, to a bipolar figure-eight magnetron sputtering machine. Background Technology

[0002] With the development of science and technology, vacuum coating technology has advanced rapidly. Thin film technology can modify the surface properties of workpieces, improving their wear resistance, oxidation resistance, and corrosion resistance, thereby extending their service life. Thin film technology can also be used to fabricate optical, electrical, and semiconductor thin film devices, possessing high economic value. Magnetron sputtering technology can prepare various superhard films, corrosion-resistant friction films, superconducting films, magnetic films, optical films, and various films with special functions, and its applications in industrial thin film preparation are very extensive.

[0003] The patent closest to the prior art, application publication number: CN118374778A, discloses a sputtering coating system, including a vacuum transfer chamber, at least one sputtering coating device, a sample transfer arm mechanism, and a vacuum drive mechanism. The sputtering coating device includes a vacuum coating chamber, a substrate support mechanism, and a cathode target. The vacuum coating chamber is connected to the vacuum transfer chamber. The substrate support mechanism is located at the top of the vacuum coating chamber and is used to support the substrate. The cathode target is vacuum-sealed to the vacuum coating chamber and is disposed opposite to the substrate support mechanism. The sample transfer arm mechanism is at least partially disposed within the vacuum transfer chamber. The vacuum drive mechanism is connected to the sample transfer arm mechanism and is used to drive the sample transfer arm mechanism to transfer the substrate between at least one sputtering coating device.

[0004] Existing sputtering coating technologies require external gas-liquid pipeline connections, which limits the flexibility of sputtering coating systems. Therefore, sputtering coating systems cannot be configured with different processing chambers depending on different processes.

[0005] In view of this, the present invention proposes a bipolar figure-eight magnetron sputtering machine that is efficient in operation and has a simple structure. Summary of the Invention

[0006] In view of this, the present invention proposes a bipolar figure-eight magnetron sputtering machine that is efficient in operation and has a simple structure.

[0007] A bipolar figure-eight magnetron sputtering machine includes a support frame, symmetrically arranged first and second main chamber modules, a transfer buffer chamber module, multiple processing chamber modules, and an infeed / outfeed chamber module, characterized in that:

[0008] The first main cavity module and the second main cavity module are connected by a frame structure to form a transfer buffer chamber module located in the central area;

[0009] The outer periphery of the first main cavity module and the second main cavity module has a plurality of detachable processing chamber modules radially distributed, and each processing chamber module is detachably connected to the main cavity module;

[0010] Each first main chamber module and second main chamber module is equipped with an independently controlled clamping and conveying device, which is a conveying mechanism that can move in three-dimensional space and is used to transfer materials across chambers.

[0011] The support frame integrates a gas-liquid supply module, which dynamically distributes the process medium to each processing chamber module through branch pipelines.

[0012] The transit buffer chamber module contains at least two independently temperature-controlled buffer units to achieve material temporary storage and isolation from the process environment.

[0013] In some embodiments, the processing chamber module includes a processing chamber body and a movable transport frame. The processing chamber body is fixedly mounted on the movable transport frame. The processing chamber body is detachably connected to the first main chamber module and the second main chamber module through fasteners. When the fasteners are released, the processing chamber body is moved by moving the movable transport frame, and the processing chamber module is replaced according to processing requirements.

[0014] In some embodiments, multiple closed gate valve modules are inclinedly spaced within the first main cavity module and the second main cavity module. One end of each closed gate valve module is fixedly connected to the frame structure of the first main cavity module and the second main cavity module, and the other end of each closed gate valve module is connected to the input end of each processing chamber module. The closed gate valve modules are used to open and close the closed gate valve modules during the operation of the clamping and conveying device, so that the environment between the chambers does not contaminate each other.

[0015] In some embodiments, a feeding chamber is provided on the frame structure between the input ends of the first main cavity module, the second main cavity module and each processing chamber module. A sealing block is provided in each feeding chamber, and a feeding channel is provided in the middle of each sealing block. The clamping and conveying module uses a clamping and conveying device to grab the material and send it to the designated processing chamber module through the feeding channel. The surface of the sealing block near the sealing gate valve module is inclined to facilitate the contact between the sealing gate valve module and the sealing block.

[0016] In some embodiments, the closed gate valve module includes a mounting base, a drive cylinder, and a sealing gate. The mounting base is located below the second main chamber module, and the drive cylinder is mounted on the mounting base. The sealing gate is mounted on the drive shaft of the drive cylinder, and the sealing gate abuts against the side of the sealing block.

[0017] Furthermore, a sealing ring is provided on the surface of the sealing gate near the sealing block. The sealing ring plays a role in buffering and assisting in sealing, thereby improving the sealing performance.

[0018] In some embodiments, the vapor-liquid supply module includes an intelligent distribution unit that can adjust the medium flow rate and mixing ratio in real time according to the process parameters of the processing chamber module.

[0019] In some embodiments, the processing chamber module includes at least one of a magnetron sputtering chamber, a plasma cleaning chamber, and an ion plating chamber, and the process sequence of each chamber is arranged by a programmable logic controller.

[0020] A method for controlling a bipolar figure-eight magnetron sputtering machine, characterized by comprising the following steps:

[0021] Step 1: The material is conveyed to the first main chamber module through the inlet and outlet chamber module. The clamping and conveying system then transfers the material to multiple processing chamber modules in sequence according to the preset path for the first-level processing.

[0022] Step 2: After the material has completed the first stage of processing and is cooled by the transfer buffer chamber module, it is transferred by the clamping and conveying system of the second main chamber module to multiple processing chamber modules on the side of the second main chamber module for the second stage of processing in sequence.

[0023] Step 3: After being cooled by the buffer chamber module, the final product is output by the conveying system through the inlet and outlet chamber modules.

[0024] The beneficial effects of this invention are as follows: This invention proposes a bipolar figure-eight magnetron sputtering machine, including a support frame, symmetrically arranged first and second main chamber modules, a transfer buffer chamber module, multiple processing chamber modules, and infeed / outfeed chamber modules. A movable transport frame enables rapid replacement, and the process chambers can be freely combined according to process requirements to meet diverse process needs. The inclined gate valve design reduces the footprint and enhances the uniformity of structural stress, extending equipment life. The transfer buffer chamber provides cooling and temporary storage functions, isolating the thermal influence between upstream and downstream processes and ensuring the stability of the material handling environment. Through branch pipelines and an intelligent distribution unit, the medium flow rate and mixing ratio are adjusted in real time to accurately match the process parameters of each chamber, reducing energy consumption. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of the bipolar figure-eight magnetron sputtering machine of the present invention.

[0026] Figure 2 This is a schematic diagram of the support frame structure of the bipolar figure-eight magnetron sputtering machine of the present invention.

[0027] Figure 3 This is a cross-sectional view showing the connection between the closed gate valve module and the processing chamber module of the bipolar figure-eight magnetron sputtering machine of the present invention.

[0028] Explanation of main component symbols

[0029] Support frame 1, first main chamber module 2, second main chamber module 3, transfer buffer chamber module 4, processing chamber module 5, processing chamber body 51, movable transport frame 52, inlet and outlet chamber module 6, frame structure 7, feeding chamber 71, closed gate valve module 8, mounting base 81, drive cylinder 82, sealing gate 83, sealing ring 84, gas-liquid supply module 9, clamping and conveying device 10.

[0030] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation Example 1:

[0031] like Figure 1 The diagram shown is a structural schematic of the bipolar figure-eight magnetron sputtering machine of the present invention; as shown... Figure 2 The diagram shown is a schematic representation of the support frame structure of the bipolar figure-eight magnetron sputtering machine of the present invention; as shown... Figure 3 The image shown is a cross-sectional view of the connection between the closed gate valve module and the processing chamber module of the bipolar figure-eight magnetron sputtering machine of the present invention.

[0032] A bipolar figure-eight magnetron sputtering machine includes a support frame 1, a symmetrically arranged first main cavity module 2 and second main cavity module 3, a transfer buffer chamber module 4, multiple processing chamber modules 5, and an infeed / outfeed chamber module 6, characterized in that:

[0033] The first main cavity module 2 and the second main cavity module 3 are connected by a frame structure 7 to form a transfer buffer chamber module 4 located in the central area;

[0034] The outer periphery of the first main cavity module 2 and the second main cavity module 3 is provided with a plurality of detachable processing chamber modules 5, and each processing chamber module 5 is detachably connected to the main cavity module.

[0035] Each first main chamber module 2 and second main chamber module 3 is equipped with an independently controlled clamping and conveying device 10. The clamping and conveying device 10 is a conveying mechanism that can move in three-dimensional space and is used to transfer materials across chambers.

[0036] The support frame 1 integrates a gas-liquid supply module 9, which dynamically distributes the process medium to each processing chamber module 5 through branch pipelines.

[0037] The transit buffer chamber module 4 contains at least two independently temperature-controlled buffer units to achieve temporary material storage and isolation from the process environment.

[0038] The processing chamber module 5 includes a processing chamber body 51 and a movable transport frame 52. The processing chamber body 51 is fixedly mounted on the movable transport frame 52. The processing chamber body 51 is detachably connected to the first main chamber module 2 and the second main chamber module 3 through fasteners. When the fasteners are released, the processing chamber body 51 is moved by the movable transport frame 52. The processing chamber module 5 can be replaced according to processing requirements.

[0039] Multiple closed gate valve modules 8 are inclinedly spaced within the first main cavity module 2 and the second main cavity module 3. One end of each closed gate valve module 8 is fixedly connected to the frame structure 7 of the first main cavity module 2 and the second main cavity module 3, and the other end of each closed gate valve module 8 is connected to the input end of each processing chamber module 5. The closed gate valve module 8 is used to open and close the closed gate valve module 8 when the clamping and conveying device 10 is running, so that the environment between the chambers does not contaminate each other.

[0040] A feeding chamber 71 is provided on the frame structure 7 between the input ends of the first main cavity module 2, the second main cavity module 3 and each processing chamber module 5. Each feeding chamber 71 is provided with a sealing block. Each sealing block is provided with a feeding channel in the middle. The clamping and conveying module uses the clamping and conveying device 10 to grab the material and send it to the designated processing chamber module 5 through the feeding channel. The surface of the sealing block near the sealing gate valve module 8 is inclined to facilitate the contact between the sealing gate valve module 8 and the sealing block.

[0041] The closed gate valve module 8 includes a mounting base 81, a drive cylinder 82, and a sealing gate 83. The mounting base 81 is located below the second main chamber module 3. The drive cylinder 82 is located on the mounting base 81. The sealing gate 83 is located on the drive shaft of the drive cylinder 82. The sealing gate 83 abuts against the side of the sealing block.

[0042] The sealing gate 83 is also provided with a sealing ring 84 on the surface near the sealing block. The sealing ring 84 plays a role in buffering and auxiliary sealing, thereby improving the sealing performance.

[0043] The vapor-liquid supply module 9 includes an intelligent distribution unit that can adjust the medium flow rate and mixing ratio in real time according to the process parameters of the processing chamber module 5.

[0044] The processing chamber module 5 includes at least one of a magnetron sputtering chamber, a plasma cleaning chamber, and an ion plating chamber, and the process sequence of each chamber is arranged by a programmable logic controller.

[0045] A method for controlling a bipolar figure-eight magnetron sputtering machine, characterized by comprising the following steps:

[0046] Step 1: The material is conveyed to the first main chamber module 2 through the inlet / outlet chamber module 6, and the clamping and conveying system sequentially transfers the material to multiple processing chamber modules 5 according to the preset path for the first-level processing.

[0047] Step 2: After the material has completed the first stage of processing and is cooled by the transfer buffer chamber module 4, it is transferred by the clamping and conveying system of the second main chamber module 3 to multiple processing chamber modules 5 on the side of the second main chamber module 3 for the second stage of processing in sequence.

[0048] Step 3: After being cooled by the buffer chamber module, the final product is output by the clamping and conveying system through the inlet and outlet chamber module 6.

[0049] The beneficial effects of this invention are as follows: This invention proposes a bipolar figure-eight magnetron sputtering machine, including a support frame 1, symmetrically arranged first main chamber module 2 and second main chamber module 3, a transfer buffer chamber module 4, multiple processing chamber modules 5, and an inlet / outlet chamber module 6. A movable transport frame enables rapid replacement, and the process chambers can be freely combined according to process requirements to meet diverse process needs. The inclined gate valve design reduces the footprint and enhances the uniformity of structural stress, extending equipment life. The transfer buffer chamber provides cooling and temporary storage functions, isolates the thermal influence between upstream and downstream processes, and ensures the stability of the material handling environment. Through branch pipelines and an intelligent distribution unit, the medium flow rate and mixing ratio are adjusted in real time to accurately match the process parameters of each chamber, reducing energy consumption.

[0050] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A bipolar figure-eight magnetron sputtering machine, comprising a support frame (1), a symmetrically arranged first main cavity module (2) and second main cavity module (3), a transfer buffer chamber module (4), multiple processing chamber modules (5), and an infeed / outfeed chamber module (6), characterized in that: The first main cavity module (2) and the second main cavity module (3) are connected by a frame structure (7) to form a transfer buffer chamber module (4) set in the central area. The outer periphery of the first main cavity module (2) and the second main cavity module (3) is provided with a plurality of detachable processing chamber modules (5), and each processing chamber module (5) is detachably connected to the main cavity module. Each first main chamber module (2) and second main chamber module (3) is equipped with an independently controlled clamping and conveying device (10), which is a conveying mechanism that can move in three-dimensional space and is used to transfer materials across chambers; The support frame (1) integrates a gas-liquid supply module (9), which dynamically distributes the process medium to each processing chamber module (5) through branch pipelines; The transit buffer chamber module (4) includes at least two independently temperature-controlled buffer units to achieve material temporary storage and isolation from the process environment. The processing chamber module (5) includes a processing chamber body (51) and a movable transport frame (52). The processing chamber body (51) is fixedly mounted on the movable transport frame (52). The processing chamber body (51) is detachably connected to the first main chamber module (2) and the second main chamber module (3) through a fixing member. When the fixing member is loosened, the processing chamber body (51) is moved by moving the movable transport frame (52). The processing chamber module (5) is replaced according to the processing requirements. Multiple closed gate valve modules (8) are inclinedly arranged at intervals in the first main chamber module (2) and the second main chamber module (3). One end of each closed gate valve module (8) is fixedly connected to the frame structure (7) of the first main chamber module (2) and the second main chamber module (3). The other end of each closed gate valve module (8) is connected to the input end of each processing chamber module (5). Block (8) is used to open and close the gate valve module (8) during the operation of the clamping and conveying device (10) to prevent environmental contamination between chambers. The frame structure (7) between the input end of the first main chamber module (2), the second main chamber module (3) and each processing chamber module (5) is provided with a feeding chamber (71). Each feeding chamber (71) is provided with a sealing block, and each sealing block is provided with a feeding channel in the middle. The clamping and conveying module uses the clamping and conveying device (10) to grab the material and send it to the designated processing chamber via the feeding channel. The working chamber module (5) has a sloping surface on the sealing block near the closed gate valve module (8) to facilitate the contact between the closed gate valve module (8) and the sealing block. The closed gate valve module (8) includes a mounting base (81), a driving cylinder (82), and a sealing gate plate (83). The second main chamber module (3) is provided with a mounting base (81) below it. The mounting base (81) is provided with a driving cylinder (82). The driving shaft of the driving cylinder (82) is provided with a sealing gate plate (83). The sealing gate plate (83) abuts against the side of the sealing block.

2. The bipolar figure-eight magnetron sputtering machine as described in claim 1, characterized in that: The sealing gate (83) is also provided with a sealing ring (84) on the surface near the sealing block. The sealing ring (84) plays a role in buffering and auxiliary sealing, thereby improving the sealing performance.

3. The bipolar figure-eight magnetron sputtering machine as described in claim 1, characterized in that: The vapor-liquid supply module (9) includes an intelligent distribution unit that can adjust the medium flow rate and mixing ratio in real time according to the process parameters of the processing chamber module (5).

4. The bipolar figure-eight magnetron sputtering machine as described in claim 1, characterized in that: The processing chamber module (5) includes at least one of a magnetron sputtering chamber, a plasma cleaning chamber, and an ion plating chamber. The process sequence of each chamber is arranged by a programmable logic controller.

5. A method for using the bipolar figure-eight magnetron sputtering machine as described in claim 1, characterized in that, Includes the following steps: Step 1: The material is transported to the first main chamber module (2) through the inlet and outlet chamber module (6), and the material is then transferred to multiple processing chamber modules (5) in sequence according to the preset path by the clamping and conveying system for the first-level processing. Step 2: After the material that has completed the first-level processing is cooled by the transfer buffer chamber module (4), it is transferred by the clamping and conveying system of the second main chamber module (3) to multiple processing chamber modules (5) on the side of the second main chamber module (3) for the second-level processing in sequence; Step 3: After being cooled by the buffer chamber module, the final product is output by the clamping and conveying system through the inlet and outlet chamber module (6).

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