Sonar receiving electronic cabin, receiving device and assembling method thereof

Abstract

The invention discloses a sonar receiving electronic cabin, a receiving device and an assembling method thereof, and relates to the technical field of underwater detection, and the assembling method comprises the following steps: (a) a receiving mainboard is accommodated in an accommodating cavity of a bottom shell through a bottom shell opening of the bottom shell so as to obtain an electronic module, wherein one end part is connected to a leading-out flexible board of the receiving mainboard, and the leading-out flexible board extends to the outside of the bottom shell through a notch in one side of the bottom shell; (b) covering the bottom shell of the electronic module with a top cover, so that the bottom shell opening of the bottom shell is closed by the top cover; and (c) bending the leading-out flexible plate, so that a leading-out rigid plate connected to the other end part of the leading-out flexible plate is overlapped on the top cover, and the receiving device is manufactured.

Description

Technical Field

[0001] The present invention relates to a sonar, belonging to the technical field of underwater detection, and particularly relates to a receiving electronic cabin of a sonar, a receiving device and an assembly method thereof. Background Art

[0002] The receiving electronic cabin is one of the main components of a sonar. It is connected to the receiving array of the transceiver array of the sonar and is used to receive and amplify echo signals, condition signals, process data, etc. The existing receiving electronic cabin directly installs the receiving main board in the electronic cabin. For example, in a Chinese invention patent application with the publication number CN117930248A, extension columns are provided on the peripheral wall of the electronic cabin, and card slots are formed between the extension columns. The opposite sides of the circuit board are snapped into the card slots from top to bottom for directly installing the receiving main board (circuit board) in the electronic cabin, and the middle part of the receiving main board is suspended in the electronic cabin. The defects of this method are as follows: First, the end of each receiving main board is the stress point. Since the circuit of each receiving main board is relatively fragile and the middle part of the circuit board is suspended, when assembling the receiving electronic cabin, if the installed receiving main board is slightly collided, it may cause a large deformation of the receiving main board, affecting the circuit of the circuit board and even causing a circuit break. Second, the heat generated by the chips on each receiving main board during operation needs to be radiated to the internal space of the electronic cabin first, then to the electronic cabin, and then the heat exchange between the electronic cabin and the external environment is carried out to achieve heat dissipation, resulting in low heat dissipation efficiency, affecting the heat dissipation capacity of the receiving electronic cabin, and further affecting the performance of the sonar. Summary of the Invention

[0003] An object of the present invention is to provide a receiving electronic cabin of a sonar, a receiving device and an assembly method thereof, wherein the receiving device adopts a modular design, and two or more electronic modules can be stacked to form the receiving device to meet the performance requirements of the receiving device.

[0004] An object of the present invention is to provide a receiving electronic cabin of a sonar, a receiving device and an assembly method thereof, wherein the receiving device adopts a modular design, and the receiving main board is hidden between the top cover and the bottom shell, so that when assembling the receiving electronic cabin subsequently, the receiving main board can be avoided from being collided to ensure the reliability of the receiving main board.

[0005] An object of the present invention is to provide a receiving electronic cabin of a sonar, a receiving device and an assembly method thereof, wherein the distance between the receiving main board, the top cover and the bottom shell can be small, so that the heat generated by the receiving main board during operation can be quickly radiated to the top cover and the bottom shell to achieve rapid heat dissipation of the receiving device.

[0006] An object of the present invention is to provide a receiving electronic cabin of a sonar, a receiving device and an assembling method thereof. Since the receiving device adopts a modular design, the receiving main board can be hidden between the top cover and the bottom shell. Thus, when assembling the receiving electronic cabin subsequently, the top cover can be pressed against the inner wall of the electronic cabin without worrying about damaging the receiving main board. By allowing the top cover and the electronic cabin to fit closely, the heat radiated to the top cover can be directly conducted to the electronic cabin, which is beneficial to realizing fast heat dissipation of the receiving electronic cabin.

[0007] According to an aspect of the present invention, the present invention provides an assembling method of a receiving device, wherein the assembling method includes the following steps: (a) Receiving a receiving main board in a receiving cavity of a bottom shell through a bottom shell opening of the bottom shell to obtain an electronic module, wherein a lead-out flexible board with one end connected to the receiving main board extends to the outside of the bottom shell through a side notch of the bottom shell; (b) Covering a top cover on the bottom shell of the electronic module to close the bottom shell opening of the bottom shell by the top cover; and (c) Bending the lead-out flexible board so that a lead-out rigid board connected to the other end of the lead-out flexible board is stacked on the top cover to manufacture the receiving device.

[0008] According to an embodiment of the present invention, before the step (b), the assembling method further includes the step of receiving at least one heat-conducting element in the receiving cavity of the bottom shell, wherein the middle part of the heat-conducting element is adjacent to or abuts against the chip of the receiving main board.

[0009] According to an embodiment of the present invention, before the step (b), the assembling method further includes the step of stacking one electronic module on another electronic module, wherein the bottom shell of the electronic module located above closes the bottom shell opening of the bottom shell of the electronic module located below. In the step (b), the top cover is covered on the bottom shell of the electronic module located above.

[0010] According to an embodiment of the present invention, after the step (b), the electronic module covered with the top cover is stacked on another electronic module, and the bottom shell opening of the bottom shell of another electronic module is closed by the bottom shell of the electronic module covered with the top cover.

[0011] According to an embodiment of the present invention, before the step (c), glue is poured into the receiving cavity of the bottom shell through the side notch of the bottom shell.

[0012] According to an embodiment of the present invention, before the step (c), glue is respectively filled into the receiving cavity of each of the bottom cases through the side notches of each of the bottom cases.

[0013] According to an embodiment of the present invention, during the glue filling process, the glue filled into the receiving cavity of the bottom case of one of the electronic modules is allowed to flow into the receiving cavity of the bottom case of another electronic module.

[0014] According to an embodiment of the present invention, after the step (c), the assembling method further includes the steps of: (d) Stacking one end of a connecting flexible board on the leading-out rigid board, and conducting the connecting flexible board and the leading-out rigid board; (e) Installing a cover board on the top cover in a manner that the cover board and the top cover clamp the connecting flexible board and the leading-out rigid board.

[0015] In another aspect of the present invention, the present invention further provides a receiving device for assembling a receiving electronic cabin, wherein the receiving device includes a top cover and at least one electronic module, and the electronic module further includes: A bottom case, wherein the bottom case has a receiving cavity, a bottom case opening respectively communicating with the receiving cavity, and at least one side notch; and A leading-out circuit board, wherein the leading-out circuit board includes a receiving main board, a leading-out flexible board, and a leading-out rigid board. The opposite ends of the leading-out flexible board are respectively connected to the receiving main board and the leading-out rigid board. The receiving main board is received in the receiving cavity of the bottom case through the bottom case opening of the bottom case, the leading-out flexible board extends to the outside of the bottom case through the side notch of the bottom case, and the top cover is covered on the bottom case to close the bottom case opening of the bottom case. After the leading-out flexible board is bent, the leading-out rigid board is stacked on the top cover.

[0016] According to an embodiment of the present invention, the electronic module further includes at least one heat conducting element, and the opposite ends of the heat conducting element are respectively leaned against the bottom case, and the middle part of the heat conducting element is adjacent to or abuts against the chip of the receiving main board.

[0017] According to an embodiment of the present invention, at least one positioning groove is respectively provided at the opposite ends of the bottom case, and the end of the heat conducting element is positioned in the positioning groove of the bottom case.

[0018] According to an embodiment of the present invention, the number of the electronic modules is two, the two electronic modules are stacked, and the bottom case of the upper electronic module closes the bottom case opening of the bottom case of the lower electronic module.

[0019] According to an embodiment of the present invention, the bottom case of one of the upper electronic modules has at least one communication channel, and the communication channel communicates the receiving cavity of the bottom case of one of the upper electronic modules and the receiving cavity of the bottom case of one of the lower electronic modules.

[0020] According to an embodiment of the present invention, the receiving device further includes a connection circuit board and a cover plate. The connection circuit board includes a connection flexible board and a connection rigid board disposed at one end of the connection flexible board. The other end of the connection flexible board is stacked on the export rigid board, and the connection flexible board and the export rigid board are electrically connected. The cover plate is installed on the top cover, and the cover plate and the bottom cover clamp the connection flexible board and the export rigid board.

[0021] In another aspect of the present invention, the present invention further provides a receiving electronic cabin of a sonar, which includes an electronic cabin and a receiving device disposed in the cabin space of the watertight cabin. The receiving device includes a top cover and at least one electronic module. The electronic module further includes: A bottom case, where the bottom case has a receiving cavity and a bottom case opening and at least one side notch respectively communicating with the receiving cavity; and An export circuit board, where the export circuit board includes a receiving main board, an export flexible board, and an export rigid board. Opposite ends of the export flexible board are respectively connected to the receiving main board and the export rigid board. The receiving main board is received in the receiving cavity of the bottom case through the bottom case opening of the bottom case, and the export flexible board extends to the outside of the bottom case through the side notch of the bottom case. The top cover is covered on the bottom case to close the bottom case opening of the bottom case. After the export flexible board is bent, the export rigid board is stacked on the top cover. Description of the Drawings

[0022] Figure 1 is a perspective view of one of the assembly processes of a receiving device according to a preferred embodiment of the present invention.

[0023] Figure 2 is a perspective view of the second assembly process of the receiving device according to the above preferred embodiment of the present invention.

[0024] Figure 3 is a perspective view of the third assembly process of the receiving device according to the above preferred embodiment of the present invention.

[0025] Figure 4 is a perspective view of the fourth assembly process of the receiving device according to the above preferred embodiment of the present invention.

[0026] Figure 5 It is a perspective view of the fifth step in the assembly process of the receiving device according to the above-mentioned preferred embodiment of the present invention.

[0027] Figure 6 It is a perspective view of the sixth step in the assembly process of the receiving device according to the above-mentioned preferred embodiment of the present invention.

[0028] Figure 7 It is a perspective view of the seventh step in the assembly process of the receiving device according to the above-mentioned preferred embodiment of the present invention.

[0029] Figure 8 It is a perspective view of the eighth step in the assembly process of the receiving device according to the above-mentioned preferred embodiment of the present invention.

[0030] Figures 9 to 11 They are perspective views of the ninth step in the assembly process of the receiving device according to the above-mentioned preferred embodiment of the present invention, respectively showing the three-dimensional states of different perspectives of the receiving device.

[0031] Figure 12 It is an exploded view of one perspective of the receiving device according to the above-mentioned preferred embodiment of the present invention.

[0032] Figure 13 It is an exploded view of another perspective of the receiving device according to the above-mentioned preferred embodiment of the present invention.

[0033] Figure 14 It is an exploded view of yet another perspective of the receiving device according to the above-mentioned preferred embodiment of the present invention.

[0034] Figure 15 It is a cross-sectional view of one position of the receiving device according to the above-mentioned preferred embodiment of the present invention.

[0035] Figure 16 It is a cross-sectional view of another position of the receiving device according to the above-mentioned preferred embodiment of the present invention.

[0036] Figure 17 It is a cross-sectional view of one position of a receiving electronic cabin according to a preferred embodiment of the present invention.

[0037] Figure 18 It is a cross-sectional view of another position of the receiving electronic cabin according to the above-mentioned preferred embodiment of the present invention.

[0038] Figure 19 It is a cross-sectional view of yet another position of the receiving electronic cabin according to the above-mentioned preferred embodiment of the present invention. Detailed implementation manners

[0039] Before describing any embodiments of the present invention in detail, it should be understood that the present invention is not limited in its application to the details of the construction and arrangement of components set forth in the following description or illustrated in the following drawings. The present invention is capable of other embodiments and of being practiced or carried out in various ways. Additionally, it should be understood that the terminology and phrases used herein are for the purpose of description and should not be regarded as limiting. As used herein, the terms "comprising" or "having" and their variants are intended to cover the listed items and their equivalents as well as additional items. Unless otherwise specified or limited, the terms "mounted", "connected", "supported" and "coupled" and their variants are used broadly and cover both direct and indirect mounting, connection, support and coupling. Further, "connected" and "coupled" are not limited to physical or mechanical connection or coupling.

[0040] And, in a first aspect, in the disclosure of the present invention, the orientation or positional relationship indicated by terms such as "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting the present invention; in a second aspect, the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of this element can be multiple. The term "a" should not be construed as limiting the quantity.

[0041] Refer to the attached drawings in the specification of the present invention Figures 1 to 16, the receiving device 100 of the receiving electronic cabin of a sonar according to a preferred embodiment of the present invention will be disclosed and described hereinafter. The receiving device 100 adopts a modular design. The receiving device 100 includes at least one electronic module 10 and a top cover 20. The electronic module 10 further includes a bottom shell 11 and a lead-out circuit board 12. The bottom shell 11 has a receiving cavity 111, a bottom shell opening 112 and at least one side notch 113 that are respectively communicated with the receiving cavity 111. The lead-out circuit board 12 includes a receiving main board 121, a lead-out rigid board 122 and a lead-out flexible board 123 connecting the receiving main board 121 and the lead-out rigid board 122. The receiving main board 121 is received in the receiving cavity 111 of the bottom shell 11 through the bottom shell opening 112 of the bottom shell 11. The lead-out flexible board 123 extends to the outside of the bottom shell 11 through the side notch 113 of the bottom shell 11. In this way, the bottom shell 11 and the lead-out circuit board 12 form the electronic module 10. The top cover 20 is covered on the bottom shell 11, and the top cover 20 closes the bottom shell opening 112 of the bottom shell 11.

[0042] That is to say, the receiving main board 121 of the lead-out circuit board 12 is hidden between the top cover 20 and the bottom shell 11, so that when the receiving device 100 is assembled into the receiving electronic cabin as shown in Figures 17 to 19 , the receiving main board 121 can be avoided from being collided, thereby ensuring the reliability of the receiving main board 121.

[0043] In addition, the extending direction of the bottom shell 11, the extending direction of the receiving main board 121 and the extending direction of the top cover 20 are the same. The bottom shell 11, the receiving main board 121 and the top cover 20 form a sheet-like structure. In this way, the receiving device 100 can have a smaller size. At the same time, the distance between the receiving main board 121 and the bottom shell 11 can be smaller, and the distance between the receiving main board 121 and the top cover 20 can be smaller. Thus, the heat generated by the receiving main board 121 during operation can be quickly radiated to the top cover 20 and the bottom shell 11 to achieve the rapid heat dissipation of the receiving device 100.

[0044] In the embodiment where the receiving device 100 includes more than two of the electronic modules 10, for example, in the attached Figures 1 to 16In this specific example where the number of the illustrated electronic modules 10 is two, the two electronic modules 10 are stacked, and the bottom case 11 of the upper electronic module 10 closes the bottom case opening 112 of the bottom case 11 of the lower electronic module 10. That is, the bottom case 11 of the upper electronic module 10 serves as a cover for the lower electronic module 10. In this way, it not only helps to reduce the spare parts of the receiving device 100, thereby reducing the cost of the receiving device 100 and making the receiving device 100 lighter, but also can reduce the size of the receiving device 100. When the overall size of the receiving electronic compartment remains unchanged, more electronic modules 10 can be arranged in the receiving electronic compartment to improve the performance of the receiving electronic compartment. Since the receiving device 100 of the present invention adopts a modular design, more than two electronic modules 10 can be stacked to form the receiving device 100 to meet the performance requirements of the receiving device 100. That is to say, in the Figures 1 to 16 In this specific example of the receiving device 100 of the present invention shown, the receiving device 100 includes two electronic modules 10 and a top cover 20. The bottom case 11 of the upper electronic module 10 is stacked on the bottom case 11 of the lower electronic module 10, and the bottom case 11 of the upper electronic module 10 closes the bottom case opening 112 of the bottom case 11 of the lower electronic module 10. The top cover 20 is stacked on the bottom case 11 of the upper electronic module 10, and the top cover 20 closes the bottom case opening 112 of the bottom case 11 of the upper electronic module 10.

[0045] Refer to the appendix Figures 12 to 16 As shown, the electronic module 10 further includes at least one heat conducting element 13. Opposite ends of the heat conducting element 13 are respectively abutted against the bottom case 11, and the middle part of the heat conducting element 13 is adjacent to or in contact with the chip 1211 of the receiving main board 121. In this way, the heat generated by the chip 1211 of the receiving main board 121 during operation can be quickly conducted to the bottom case 11 through the heat conducting element 13 and dissipated outward through the bottom case 11. Preferably, in some specific examples of the receiving device 100 of the present invention, the heat conducting element 13 is a heat conducting copper tube, which has good heat conducting ability, so that the heat generated by the chip 1211 of the receiving main board 121 during operation can be quickly conducted to the bottom case 11 and dissipated outward through the bottom case 11.

[0046] Continue to refer to the appendix Figure 12, the bottom case 11 includes a case plate 114, two end enclosures 115 and two side enclosures 116. The two end enclosures 115 respectively extend from opposite ends of the case plate 114 in a direction perpendicular to the case plate 114, and the two side enclosures 116 respectively extend from opposite sides of the case plate 114 in a direction perpendicular to the case plate 114. Opposite ends of one end enclosure 115 respectively extend to one end of the two side enclosures 116, and opposite ends of the other end enclosure 115 respectively extend to the other end of the two side enclosures 116. In this way, the bottom case 11 forms the receiving cavity 111 between the case plate 114, the two side enclosures 116 and the two end enclosures 115, and the bottom case opening 112 of the bottom case 11 is surrounded by the two side enclosures 116 and the two end enclosures 115. The side notch 113 of the bottom case 11 is formed in one of the side enclosures 116.

[0047] In a specific example of the receiving device 100 of the present invention, the material of the bottom case 11 is metal or alloy, and it can be formed by milling process so that the bottom case 11 has good heat dissipation ability.

[0048] After the receiving main board 121 is received in the receiving cavity 111 through the bottom case opening 112 of the bottom case 11, the receiving main board 121 is attached to the case plate 114 of the bottom case 11, and the receiving main board 121 is surrounded by the two end enclosures 115 and the two side enclosures 116 of the bottom case 11. Opposite ends of the heat conducting element 13 are respectively supported by the two end enclosures 115 of the bottom case 11, so that opposite ends of the heat conducting element 13 are respectively leaned against the bottom case 11 and the middle part of the heat conducting element 13 is adjacent to or abuts against the chip 1211 of the receiving main board 121. It can be understood that since the middle part of the heat conducting element 13 is adjacent to or abuts against the chip 1211 of the receiving main board 121, and the ends of the heat conducting element 13 are directly in contact with the end enclosures 115 of the bottom case 11, the heat conducting element 13 can efficiently conduct the heat generated by the chip 1211 of the receiving main board 121 during operation to the bottom case 11 and dissipate the heat to the outside through the bottom case 11.

[0049] Further, refer to the appendix Figure 12 and Figure 16, each of the end enclosures 115 of the bottom case 11 has a positioning groove 1151, and the distance D between the bottom of the positioning groove 1151 and the inner wall of the shell plate 114 is greater than or equal to the thickness T of the receiving main board 121 at the position of the chip 1211. The end of the heat conducting element 13 is located in the positioning groove 1151 of the end enclosure 115. In this way, the position of the heat conducting element 13 relative to the bottom case 11 and the receiving main board 121 is stable, avoiding displacement of the heat conducting element 13 relative to the receiving main board 121, and the middle part of the heat conducting element 13 can be adjacent to or in contact with the chip 1211 of the receiving main board 121. This can not only prevent the middle part of the heat conducting element 13 from applying pressure to the chip 1211 of the receiving main board 121, but also avoid affecting the heat conduction effect of the heat conducting element 13 due to the excessive distance between the heat conducting element 13 and the chip 1211 of the receiving main board 121.

[0050] It is worth mentioning that the number of the heat conducting elements 13 of the electronic module 10 is not limited in the receiving device 100 of the present invention. For example, in Figures 1 to 16 this specific example of the receiving device 100 of the present invention shown in the appendix, the receiving main board 121 has two columns of the chips 1211. Therefore, the number of the heat conducting elements 13 can be two. One heat conducting element 13 is suspended above one column of the chips 1211 of the receiving main board 121, so that the middle part of this heat conducting element 13 can be adjacent to or in contact with each of the chips 1211 in this column of chips 1211. The other heat conducting element 13 is suspended above the other column of the chips 1211 of the receiving main board 121, so that the middle part of this heat conducting element 13 can be adjacent to or in contact with each of the chips 1211 in this column of chips 1211. In this way, the heat generated by all the chips 1211 during operation can be quickly conducted to the bottom case 11 through the heat conducting elements 13.

[0051] Refer to the appendix Figures 12 to 14, the shell plate 114 of the bottom shell 11 has at least one positioning post 1141, the positioning post 1141 protrudes towards the receiving cavity 111 of the bottom shell 11, the receiving main board 121 has at least one positioning hole 1212, when the receiving main board 121 is received in the receiving cavity 111 of the bottom shell 11 through the bottom shell opening 112 of the bottom shell 11, the positioning post 1141 of the shell plate 114 is inserted into the positioning hole 1212 of the receiving main board 121 to position the position of the receiving main board 121 in the receiving cavity 111 of the bottom shell 11, and prevent the receiving main board 121 from moving along the length direction and / or the width direction in the receiving cavity 111 of the bottom shell 11, where the length direction and the width direction are perpendicular to the thickness direction of the receiving device 100. Preferably, after the receiving main board 121 is received in the receiving cavity 111 of the bottom shell 11, a plurality of screws 30 are used to lock the receiving main board 121 on the shell plate 114 of the bottom shell 11 to prevent the receiving main board 121 from falling off from the receiving cavity 111 of the bottom shell 11.

[0052] Continue to refer to the attached Figures 10 to 16 , the bottom shell 11 of the electronic module 10 located below further includes two stoppers 117, the two stoppers 117 respectively extend upward from the outer sides of the two end enclosures 115, when the bottom shell 11 of the electronic module 10 located above is stacked on the bottom shell 11 of the electronic module 10 located below, the two stoppers 117 of the bottom shell 11 of the electronic module 10 located below are respectively abutted by the two end enclosures 115 of the bottom shell 11 of the electronic module 10 located above, so as to limit the length direction of the electronic module 10 located above by the bottom shell 11 of the electronic module 10 located below. That is to say, the two stoppers 117 of the bottom shell 11 of the electronic module 10 located below can block the bottom shell 11 at the two ends of the bottom shell 11 of the electronic module 10 located above, and prevent the bottom shell 11 of the electronic module 10 located above from generating displacement in the length direction.

[0053] Furthermore, refer to the attached Figures 12 to 15, at least one side wall 116 of the bottom case 11 of the electronic module 10 has at least one pin hole 1161. The receiving device 100 includes at least one limit pin 40. One end of the limit pin 40 is inserted into the pin hole 1161 of the side wall 116 of the bottom case 11 of the lower electronic module 10, and the other end of the limit pin 40 is inserted into the pin hole 1161 of the side wall 116 of the bottom case 11 of the upper electronic module 10. In this way, the limit pin 40 can limit the upper electronic module 10 in the width direction.

[0054] In this specific example of the receiving device 100 of the present invention, each of the opposite ends of the side wall 116 of the bottom case 11 has a pin hole 1161. Correspondingly, the number of limit pins 40 is two. One ends of the two limit pins 40 are respectively inserted into the two pin holes 1161 of the side wall 116 of the bottom case 11 of the lower electronic module 10, and the other ends of the two limit pins 40 are respectively inserted into the two pin holes 1161 of the side wall 116 of the bottom case 11 of the upper electronic module 10.

[0055] Preferably, the pin hole 1161 of the side wall 116 of the bottom case 11 of the lower electronic module 10 is a blind hole, and the pin hole 1161 of the side wall 116 of the bottom case 11 of the upper electronic module 10 is a through hole. In this way, after the two electronic modules 10 are stacked, the limit pin 40 is inserted into the pin holes 1161 of the side walls 116 of the bottom cases 11 of the two electronic modules 10 to prevent the upper electronic module 10 from shifting in the width direction.

[0056] When the top cover 20 is stacked on the bottom case 11 of the upper electronic module 10, the two stoppers 117 of the bottom case 11 of the lower electronic module 10 are respectively abutted against the opposite ends of the top cover 20, so as to limit the length of the top cover 20 by the bottom case 11 of the lower electronic module 10.

[0057] Refer to the appendix Figures 10 to 14, the top cover 20, the bottom case 11 of the upper electronic module 10, and the bottom case 11 of the lower electronic module 10 are locked by the screw 30. Specifically, the top cover 20 has at least one first assembly hole 21, and the bottom case 11 of the electronic module 10 has at least one second assembly hole 118. After the bottom case 11 of the upper electronic module 10 is stacked on the bottom case 11 of the lower electronic module 10 and the top cover 20 is stacked on the bottom case 11 of the upper electronic module 10, the positions of the first assembly hole 21 of the top cover 20, the second assembly hole 118 of the bottom case 11 of the upper electronic module 10, and the second assembly hole 118 of the bottom case 11 of the lower electronic module 10 correspond to each other. One end of the screw 30 extends to the second assembly hole 118 of the bottom case 11 of the lower electronic module 10 after passing through the first assembly hole 21 of the top cover 20 and the second assembly hole 118 of the bottom case 11 of the upper electronic module 10, and the screw 30 is screwed with the bottom case 11 of the lower electronic module 10 to allow the screw 30 to lock the top cover 20, the bottom case 11 of the upper electronic module 10, and the bottom case 11 of the lower electronic module 10.

[0058] Preferably, each of the four corners of the top cover 20 has one of the first assembly holes 21, and each of the four corners of the bottom case 11 of the electronic module 10 has one of the second assembly holes 118. In this way, the four screws 30 can cooperate with each other to reliably lock the top cover 20, the bottom case 11 of the upper electronic module 10, and the bottom case 11 of the lower electronic module 10.

[0059] After the top cover 20, the bottom case 11 of the upper electronic module 10, and the bottom case 11 of the lower electronic module 10 are locked, the bottom case opening 112 of the bottom case 11 of the lower electronic module 10 is closed by the bottom case 11 of the upper electronic module 10, allowing the receiving cavity 111 of this bottom case 11 to form a substantially enclosed space. Correspondingly, the bottom case opening 112 of the bottom case 11 of the upper electronic module 10 is closed by the top cover 20, allowing the receiving cavity 111 of this bottom case 11 to form a substantially enclosed space. The receiving cavity 111 of the bottom case 11 of the lower electronic module 10 and the receiving cavity 111 of the bottom case 11 of the upper electronic module 10 are both filled with thermal conductive glue, and the thermal conductive glue coats the receiving main board 121 and the thermal conductive element 13. In this way, the thermal conductive glue can not only prevent the thermal conductive element 13 from shifting, but also quickly conduct the heat generated by the receiving main board 121 during operation to the thermal conductive element 13 and the bottom case 11, and dissipate the heat to the outside through the bottom case 11.

[0060] To facilitate the pouring of glue into the receiving cavity 111 of the bottom case 11 of the upper electronic module 10 and the receiving cavity 111 of the bottom case 11 of the lower electronic module 10, refer to the appendix Figures 12 to 14 , the bottom case 11 of the upper electronic module 10 has at least one communication channel 119, and the communication channel 119 communicates the receiving cavity 111 of the bottom case 11 of the upper electronic module 10 and the receiving cavity 111 of the bottom case 11 of the lower electronic module 10. In this way, after the glue is poured into the receiving cavity 111 of the bottom case 11 of the upper electronic module 10, the glue can flow through the communication channel 119 to the receiving cavity 111 of the bottom case 11 of the lower electronic module 10. Preferably, the number of the communication channels 119 of the bottom case 11 is two to improve the glue pouring efficiency.

[0061] Preferably, the top cover 20 has at least one glue pouring port 22, and the glue pouring port 22 communicates with the receiving cavity 111 of the bottom case 11 of the upper electronic module 10, and the glue is allowed to be poured through the glue pouring port 22 of the top cover 20.

[0062] During the potting process, in order to prevent the glue poured into the receiving cavity 111 of the bottom shell 11 from overflowing through the side notch 113 of the bottom shell 11, the electronic module 10 further includes a notch cover 14. The notch cover 14 has an avoidance groove 141. The notch cover 14 is installed on the side wall 116 of the bottom shell 11 to cover the side notch 113 of the bottom shell 11 by the notch cover 14. The position of the avoidance groove 141 of the notch cover 14 corresponds to the position of the lead-out flexible board 123, and the size of the avoidance groove 141 of the notch cover 14 is slightly larger than the size of the lead-out flexible board 123 corresponding to the position of the avoidance groove 141 of the notch cover 14. In this way, the notch cover 14 can prevent the glue from overflowing through the side notch 113 of the bottom shell 11 while avoiding applying pressure to the lead-out flexible board 123.

[0063] In a specific example of the receiving device 100 of the present invention, the screw 30 can be used to install the notch cover 14 and the side wall 116 of the bottom shell 11. Specifically, the notch cover 14 has at least one first screw hole 142, and the side wall 116 of the bottom shell 11 has at least one first threaded hole 1162. The position of the first screw hole 142 of the notch cover 14 corresponds to the position of the first threaded hole 1162 of the side wall 116 of the bottom shell 11. One end of the screw 30 extends to the first threaded hole 1162 of the side wall 116 of the bottom shell 11 after passing through the first screw hole 142 of the notch cover 14, and the screw 30 is screwed with the side wall 116 of the bottom shell 11 to install the notch cover 14 and the side wall 116 of the bottom shell 11 by the screw 30.

[0064] Continue to refer to the attached Figures 10 to 12 The receiving device 100 further includes a connection circuit board 50. The connection circuit board 50 includes a connection flexible board 51 and a connection rigid board 52 disposed at one end of the connection flexible board 51. The other end of the connection flexible board 51 is connected to the lead-out rigid board 122.

[0065] In order to facilitate the connection between the connection flexible board 51 and the lead-out rigid board 122, in this specific example of the receiving device 100 of the present invention, after the lead-out flexible board 123 is bent, the lead-out rigid board 122 is stacked on the outer surface of the top cover 20. The end of the connection flexible board 51 away from the connection rigid board 52 is stacked on the lead-out rigid board 122, and the connection flexible board 51 and the lead-out rigid board 122 can be welded or inserted to conduct the connection flexible board 51 and the lead-out rigid board 122.

[0066] Preferably, after the connecting flexible plate 51 is stacked on the leading-out rigid plate 122, the screw 30 can be used to fix the connecting flexible plate 51 and the leading-out rigid plate 122 to the top cover 20. Specifically, the connecting flexible plate 51 has at least one second screw hole 511, the leading-out rigid plate 122 has at least one third screw hole 1221, the top cover 20 has at least one second threaded hole 23, the positions of the second screw hole 511 of the connecting flexible plate 51, the third screw hole 1221 of the leading-out rigid plate 122 and the second threaded hole 23 of the top cover 20 correspond to each other. One end of the screw 30 extends to the second threaded hole 23 of the top cover 20 after passing through the second screw hole 511 of the connecting flexible plate 51 and the third screw hole 1221 of the leading-out rigid plate 122, and the screw 30 and the top cover 20 are screwed together, so that the screw 30 fixes the connecting flexible plate 51 and the leading-out rigid plate 122 to the top cover 20.

[0067] Furthermore, the receiving device 100 includes a cover plate 60, the cover plate 60 is installed on the top cover 20, and the cover plate 60 and the top cover 20 clamp the end of the leading-out rigid plate 122 where the connecting flexible plate 51 is stacked on the leading-out rigid plate 122, so as to prevent the connecting flexible plate 51 from falling off the leading-out rigid plate 122 by the cover plate 60, thereby ensuring the reliability of the connection relationship between the connecting circuit board 50 and the leading-out circuit board 12.

[0068] In a specific example of the receiving device 100 of the present invention, the screw 30 can be used to install the cover plate 60 and the top cover 20. Specifically, the cover plate 60 has at least one fourth screw hole 61, the top cover 20 has at least one third threaded hole 24, the positions of the fourth screw hole 61 of the cover plate 60 and the third threaded hole 24 of the top cover 20 correspond to each other. One end of the screw 30 extends to the third threaded hole 24 of the top cover 20 after passing through the fourth screw hole 61 of the cover plate 60, and the screw 30 and the top cover 20 are screwed together, so that the screw 30 installs the cover plate 60 on the top cover 20.

[0069] Refer to the attached Figure 12, one side of the top cover 20 has two plate grooves 25 and a cover plate groove 26. The export rigid plate 122 of the export circuit board 12 of the electronic module 10 located below is arranged in one of the plate grooves 25 of the top cover 20, and the export rigid plate 122 of the export circuit board 12 of the electronic module 10 located above is arranged in the other plate groove 25 of the top cover 20. The cover plate 60 is arranged in the cover plate groove 26 of the top cover 20. In this way, the surface of the other side of the top cover 20 and the surface of the cover plate 60 can be flush, so that the appearance of the receiving device 100 is more regular, thereby facilitating the subsequent assembly of the receiving device 100 into the receiving electronic cabin.

[0070] Furthermore, the receiving device 100 includes a filtering part 70, and the filtering part 70 is installed on one of the end enclosures 115 of the bottom shell 11. In the receiving device 100 of the present invention, the screw 30 can be used to install the filtering part 70 and the bottom shell 11. Specifically, the filtering part 70 has at least one fifth screw hole 71, and one of the end enclosures 115 of the bottom shell 11 has at least one fourth threaded hole 1152. The position of the fifth screw hole 71 of the filtering part 70 corresponds to the position of the fourth threaded hole 1152 of the end enclosure 115 of the bottom shell 11. One end of the screw 30 extends to the fourth threaded hole 1152 of the end enclosure 115 of the bottom shell 11 after passing through the fifth screw hole 71 of the filtering part 70, and the screw 30 and the end enclosure 115 of the bottom shell 11 are screwed together, so that the filtering part 70 is installed on one of the end enclosures 115 of the bottom shell 11 by the screw 30.

[0071] Preferably, opposite ends of the end enclosure 115 of the bottom shell 11 have a support arm 1153 and a protection space 1154 formed between the support arms 1153. The filtering part 70 is located in the protection space 1154, so that the filtering part 70 is protected by the two support arms 1153 of the bottom shell 11.

[0072] Attached Figures 1 to 11 shows the assembly process of the receiving device 100 of the present invention. At the same time, attached Figures 9 to 11 shows the three-dimensional state of the receiving device 100 from different perspectives.

[0073] Specifically, referring to attached Figure 1 and Figure 2, the receiving main board 121 is received in the receiving cavity 111 of the bottom case 11 through the bottom case opening 112 of the bottom case 11 in such a way that the positioning posts 1141 of the shell plate 114 of the bottom case 11 pass through the positioning holes 1212 of the receiving main board 121. The leading flexible board 123 extends to the outside of the bottom case 11 through the side notch 113 of the bottom case 11, and the leading rigid board 122 is located outside the bottom case 11. A plurality of the screws 30 are used to lock the receiving main board 121 on the bottom case 11.

[0074] Reference appendix Figure 3 , the two end portions of the heat conducting element 13 are respectively placed in the positioning grooves 1151 of the end enclosures 115 of the bottom case 11, so that the end portions of the heat conducting element 13 abut against the bottom case 11, and the middle portion of the heat conducting element 13 is adjacent to or abuts against the chip 1211 of the receiving main board 121, so as to obtain an electronic module 10.

[0075] Reference appendix Figure 4 , an electronic module 10 is stacked above another electronic module 10. At this time, the bottom case 11 of the upper electronic module 10 closes the bottom case opening 112 of the bottom case 11 of the lower electronic module 10, so that the receiving cavity 111 of the bottom case 11 of the lower electronic module 10 forms a substantially closed space.

[0076] When an electronic module 10 is stacked above another electronic module 10, the stoppers 117 of the bottom case 11 of the lower electronic module 10 can block the bottom case 11 at both ends of the bottom case 11 of the upper electronic module 10, preventing the bottom case 11 of the upper electronic module 10 from displacing in the length direction.

[0077] In some examples of the present invention, before stacking one electronic module 10 on top of another electronic module 10, one end of the limit pin 40 is inserted into the pin hole 1161 of the side wall 116 of the bottom case 11 of one electronic module 10. Thus, when stacking another electronic module 10 on top of this electronic module 10, the other end of the limit pin 40 is inserted into the pin hole 1161 of the side wall 116 of the bottom case 11 of the upper electronic module 10, so as to limit the upper electronic module 10 in the width direction by the limit pin 40. In other examples of the present invention, after stacking the two electronic modules 10, the limit pin 40 is inserted into the pin hole 1161 of the side wall 116 of the bottom case 11 of the lower electronic module 10 through the pin hole 1161 of the side wall 116 of the bottom case 11 of the upper electronic module 10, so as to limit the upper electronic module 10 in the width direction by the limit pin 40.

[0078] It can be understood that since the two stacked electronic modules 10 are limited in both the length direction and the width direction, the positions of the second assembly holes 118 of the bottom case 11 of the upper electronic module 10 and the positions of the second assembly holes 118 of the bottom case 11 of the lower electronic module 10 are aligned.

[0079] Refer to the attached Figure 5 , after covering the top cover 20 on the bottom case 11 of the upper electronic module 10, it is allowed that the screw 30 extends to the second assembly hole 118 of the bottom case 11 of the lower electronic module 10 after sequentially passing through the first assembly hole 21 of the top cover 20 and the second assembly hole 118 of the bottom case 11 of the upper electronic module 10, and the screw 30 is screwed to the bottom case 11 of the lower electronic module 10, so as to lock the top cover 20 and the two electronic modules 10 by the screw 30.

[0080] Refer to the attached Figure 6 , the notch cover 14 is installed on the side wall 116 of the bottom case 11 to cover the side notch 113 of the bottom case 11. Optionally, before stacking the two electronic modules 10, the notch cover 14 can be installed on the side wall 116 of the bottom case 11 first.

[0081] After the notch cover 14 is installed on the side wall 116 of the bottom case 11, glue is poured into the receiving cavity 111 of the bottom case 11 of the two electronic modules 10 through the glue filling port 22 of the top cover 20. The glue wraps the receiving main board 121 and the heat conducting element 13, and the glue can be cured after the glue filling is completed.

[0082] Refer to the appendix Figure 7 , bend the lead-out flexible board 123 of the lead-out circuit board 12 of the lower electronic module 10 below, so that the lead-out rigid board 122 connected to the lead-out flexible board 123 is stacked on the surface of the top cover 20 and located in one of the board grooves 25 of the top cover 20. Bend the lead-out flexible board 123 of the lead-out circuit board 12 of the upper electronic module 10 above, so that the lead-out rigid board 122 connected to the lead-out flexible board 123 is stacked on the surface of the top cover 20 and located in the other board groove 25 of the top cover 20.

[0083] Refer to the appendix Figure 8 , stack the end of the connection flexible board 51 far from the connection rigid board 52 on the lead-out rigid board 122, and make the connection flexible board 51 and the lead-out rigid board 122 conduct. Then, allow one end of the screw 30 to extend to the second threaded hole 23 of the top cover 20 after passing through the second screw hole 511 of the connection flexible board 51 and the third screw hole 1221 of the lead-out rigid board 122 in sequence, and screw the screw 30 onto the top cover 20, so that the connection flexible board 51 and the lead-out rigid board 122 are locked to the top cover 20 by the screw 30.

[0084] Refer to the appendix Figures 9 to 11 , after covering the connection position of the connection flexible board 51 and the lead-out rigid board 122 with the cover plate 60, allow one end of the screw 30 to pass through the fourth screw hole 61 of the cover plate 60 and then extend to the third threaded hole 24 of the top cover 20, and screw the screw 30 onto the top cover 20, so that the cover plate 60 is reliably installed on the top cover 20 by the screw 30.

[0085] That is to say, another aspect of the present invention also provides an assembly method of the receiving device 100, wherein the assembly method includes the following steps: (a) Receive the receiving main board 121 into the receiving cavity 111 of the bottom case 11 through the bottom case opening 112 of the bottom case 11 to obtain the electronic module 10, wherein the lead-out flexible board 123 with one end connected to the receiving main board 121 extends to the outside of the bottom case 11 through the side notch 113 of the bottom case 11; (b) Cover the top cover 20 on the bottom case 11 of the electronic module 10 to close the bottom case opening 112 of the bottom case 11 by the top cover 20; and (c) Bend the lead flexible plate 123 so that the lead rigid plate 122 connected to the other end of the lead flexible plate 123 is stacked on the top cover 20 to obtain the receiving device 100.

[0086] Appendix Figures 17 to 19 The specific structure of the receiving electronic cabin of the present invention is shown. The receiving electronic cabin includes the receiving device 100, a signal processing device 200 and a watertight cabin 300. The receiving device 100 and the signal processing device 200 are arranged in the watertight cabin 300, and the receiving device 100 and the signal processing device 200 are connected.

[0087] Specifically, the watertight cabin 300 includes a cabin body 310 and a wiring terminal 320. The cabin body 310 has a cabin space 311 and a terminal through hole 312 communicating with the cabin space 311 at the bottom of the cabin body 310. The wiring terminal 320 is watertightly arranged in the terminal through hole 312 of the cabin body 310. The receiving device 100 and the signal processing device 200 are arranged in the cabin space 311 of the cabin body 310, and the signal processing device 200 is connected to the wiring terminal 320.

[0088] More specifically, the signal processing device 200 includes a first housing 210, a second housing 220, a first processing board 230, a second processing board 240, a connecting board 250 and a packaging part 260. The packaging part 260 packages the first processing board 230 in the first housing 210. The second processing board 240 is installed in the first housing 210, and there is a gap between the second processing board 240 and the first processing board 230. The second housing 220 is installed on the first housing 210 so that the first processing board 230 and the second processing board 240 are between the first housing 210 and the second housing 220. In this way, the first housing 210 and the second housing 220 can protect the first processing board 230 and the second processing board 240. The connecting board 250 is a flexible board. One end of the connecting board 250 extends into the space between the first housing 210 and the second housing 220 for connecting the first processing board 230 and the second processing board 240. The other end of the connecting board 250 is used to connect the lead rigid board 52 of the lead circuit board 50 of the receiving device 100. The wiring terminal 320 is connected to the second processing board 240.

[0089] In the receiving electronic cabin of the present invention, the encapsulation part 260 can be formed of heat-conducting glue. The encapsulation part 260 directly encapsulates the first processing board 230 with a relatively large calorific value in the first housing 210, and a gap is provided between the second processing board 240 with a small calorific value and the first processing board 230. In this way, on the one hand, the heat generated by the first processing board 230 during operation can be directly conducted to the first housing 210, and on the other hand, the second processing board 240 is not easily affected by the heat generated by the first processing board 230.

[0090] In order to fixedly mount the receiving device 100 and the signal processing device 200 in the cabin space 311 of the cabin body 310 and improve the heat dissipation capacity of the receiving electronic cabin, the receiving electronic cabin of the present invention further includes an assembly device 400. The assembly device 400 includes an assembly frame 410, an assembly pin 420 and two assembly rods 430.

[0091] The assembly frame 410 includes an assembly gland 411 and two extension legs 412, and the assembly frame 410 has two frame body through holes 413. The two extension legs 412 respectively extend downward from the opposite ends of one side of the assembly gland 411, and the two frame body through holes 413 respectively extend from the opposite ends of one side of the assembly gland 411 to the bottoms of the two extension legs 412. The assembly gland 411 has a pin groove 4111. The cabin body 310 has two screw holes 313.

[0092] The receiving device 100 and the signal processing device 200 are respectively placed below the assembly gland 411 on the opposite sides of the assembly gland 411, and the pin groove 4111 of the assembly gland 411 corresponds to the space between the receiving device 100 and the signal processing device 200. The receiving device 100, the signal processing device 200 and the assembly frame 410 are placed in the cabin space 311 of the cabin body 310. The bottoms of the two assembly rods 430 respectively extend to the two screw holes 313 of the cabin body 310 after passing through the two frame body through holes 413 of the assembly frame 410, and the bottoms of the assembly rods 430 and the cabin body 310 are screwed together so that the assembly gland 411 presses the receiving device 100 and the signal processing device 200 against the bottom of the cabin body 310.

[0093] When inserting the assembly pin 420 from top to bottom through the pin slot 4111 of the assembly gland 411 into the space between the receiving device 100 and the signal processing device 200, the assembly pin 420 pushes the receiving device 100 and the signal processing device 200 towards opposite sides, and makes the top cover 20 and the cover plate 60 of the receiving device 100 closely adhere to one side of the inner wall of the cabin body 310, and makes the first housing 210 of the signal processing device 200 closely adhere to the other side of the inner wall of the cabin body 310. In this way, the heat generated by the receiving device 100 during operation can be directly conducted to the cabin body 310, and the heat generated by the signal processing device 200 can also be directly conducted to the cabin body 310, thereby improving the heat dissipation capacity of the receiving electronic cabin. At the same time, since the assembly gland 411 presses the receiving device 100 and the signal processing device 200 towards the bottom of the cabin body 310 and the assembly pin 420 presses the receiving device 100 and the signal processing device 200 towards the side wall of the cabin body 310, the receiving device 100 and the signal processing device 200 are fixedly installed in the cabin space 311 of the cabin body 310.

[0094] It can be understood that when inserting the assembly pin 420 from top to bottom through the pin slot 4111 of the assembly gland 411 into the space between the receiving device 100 and the signal processing device 200, in order to ensure that the assembly pin 420 can push the receiving device 100 and the signal processing device 200 towards opposite sides, the thickness dimension of the bottom of the assembly pin 420 is smaller than the space width between the receiving device 100 and the signal processing device 200, and the thickness dimension of the middle part of the assembly pin 420 is larger than the width dimension between the receiving device 100 and the signal processing device 200. After the bottom and middle parts of the assembly pin 420 are inserted into the space between the receiving device 100 and the signal processing device 200, the top of the assembly pin 420 can be locked to the assembly gland 411 through the screw 30.

[0095] In addition, after the receiving device 100, the signal processing device 200 and the assembly frame 410 are placed in the cabin space 311 of the cabin body 310, the bottom shell 11 of the receiving device 100 and the second housing 220 of the signal processing device 200 face each other, so that there is a space between the receiving device 100 and the signal processing device 200. Therefore, when inserting the assembly pin 420, the side surface of the assembly pin 420 always contacts the bottom shell 11 and the second housing 220, so that damage to the receiving device 100 and the signal processing device 200 can be avoided.

[0096] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The object of the present invention has been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and without departing from the said principles, any variations or modifications can be made to the embodiments of the present invention.

Claims

1. The sonar receiving electronic cabin is characterized by: include: a receiving device; a signal processing device; a watertight compartment, wherein the watertight compartment has a compartment space, and the receiving device and the signal processing device are respectively arranged in the compartment space of the watertight compartment; and An assembly device, wherein the assembly device includes an assembly frame, an assembly pin and two assembly rods, the assembly frame includes an assembly cover and two extension legs, and the assembly frame has two frame body through holes, the two extension legs extend downward from the opposite ends of one side of the assembly cover respectively, the two frame body through holes extend from the opposite ends of one side of the assembly cover to the bottom of the two extension legs respectively, the assembly cover has a pin groove, wherein the receiving device and the signal processing device are respectively placed below the assembly cover on opposite sides of the assembly cover, and the pin groove of the assembly cover corresponds to the space between the receiving device and the signal processing device, and the thickness of the bottom of the assembly pin is smaller than the width of the space between the receiving device and the signal processing device. The thickness dimension of the middle part of the assembly pin is larger than the width dimension of the space between the receiving device and the signal processing device. When the assembly pin is inserted from top to bottom into the space between the receiving device and the signal processing device through the pin groove of the assembly pressure cover, the assembly pin pushes the receiving device and the signal processing device toward opposite sides, and makes the receiving device close to one side of the inner wall of the cabin and makes the signal processing device close to the other side of the inner wall of the cabin. The bottoms of the two assembly rods extend to the two screw holes of the cabin after passing through the two through holes of the assembly frame respectively, and the bottoms of the assembly rods and the cabin are screwed so that the receiving device and the signal processing device are pressed to the bottom of the cabin by the assembly pressure cover.

2. An electronic receiving cabin according to claim 1, wherein the receiving device includes a top cover and an electronic module, the electronic module further includes a bottom shell and an export circuit board, the bottom shell has a receiving cavity and a bottom shell opening and a side notch respectively connected to the receiving cavity, the export circuit board includes a receiving main board, an export flexible board and an export hard board, the opposite ends of the export flexible board are respectively connected to the receiving main board and the export hard board, wherein the receiving main board is received in the receiving cavity of the bottom shell through the bottom shell opening of the bottom shell, the export flexible board extends to the outside of the bottom shell through the side notch of the bottom shell, the top cover is covered on the bottom shell to close the bottom shell opening of the bottom shell, and after the export flexible board is bent, the export hard board is stacked on the top cover.

3. A receiving electronic cabin according to claim 2, wherein the signal processing device includes a first shell, a second shell, a first processing board, a second processing board, a connecting plate and a packaging portion, the packaging portion encapsulates the first processing board in the first shell, the second processing board is installed in the first shell, and there is a gap between the second processing board and the first processing board, the second shell is installed in the first shell so that the first processing board and the second processing board are between the first shell and the second shell, the connecting plate is a flexible board, one end of which extends to the space between the first shell and the second shell for connecting the first processing board and the second processing board, and the other end is used to connect the export hard board of the export circuit board of the receiving device, wherein the side of the assembly pin always contacts the bottom shell and the second shell. 4 . The receiving electronic cabin according to claim 3 , wherein a middle portion of the bottom shell protrudes toward the second shell body, and a middle portion of the second bottom shell protrudes toward the bottom shell.

5. A receiving device, used for assembling a receiving electronic cabin, characterized in that: The invention comprises a top cover and at least one electronic module, wherein the electronic module further comprises: A bottom shell, wherein the bottom shell has a receiving cavity and a bottom shell opening and at least one side notch respectively connected to the receiving cavity; and An export circuit board, wherein the export circuit board includes a receiving main board, an export flexible board and an export hard board, the opposite ends of the export flexible board are respectively connected to the receiving main board and the export hard board, wherein the receiving main board is received in the receiving cavity of the bottom shell through the bottom shell opening of the bottom shell, the export flexible board extends to the outside of the bottom shell through the side notch of the bottom shell, the top cover is covered on the bottom shell to close the bottom shell opening of the bottom shell, and after the export flexible board is bent, the export hard board is stacked on the top cover.

6. The receiving device according to claim 5, wherein the electronic module further comprises at least one heat-conducting element, opposite ends of the heat-conducting element are respectively placed against the bottom shell, and the middle part of the heat-conducting element is adjacent to or attached to the chip of the receiving mainboard. 7 . The receiving device according to claim 6 , wherein two opposite ends of the bottom shell respectively have at least one positioning groove, and the end of the heat conducting element is positioned in the positioning groove of the bottom shell.

8. The receiving device according to any one of claims 5 to 7, wherein the number of the electronic modules is two, the two electronic modules are stacked, and the bottom shell of the upper electronic module closes the bottom shell opening of the bottom shell of the lower electronic module.

9. The receiving device according to claim 18, wherein the bottom shell of the electronic module located at the top has at least one connecting channel, and the connecting channel connects the receiving cavity of the bottom shell of the electronic module located at the top and the receiving cavity of the bottom shell of the electronic module located at the bottom.

10. A receiving device according to any one of claims 5 to 7, wherein the receiving device further includes a connecting circuit board and a cover plate, the connecting circuit board includes a connecting flexible board and a connecting hard board arranged at one end of the connecting flexible board, the other end of the connecting flexible board is stacked on the exporting hard board, and the connecting flexible board and the exporting hard board are connected, the cover plate is installed on the top cover, and the cover plate and the bottom cover clamp the connecting flexible board and the exporting hard board.

11. A method for assembling a receiving device, characterized in that: The assembly method comprises the following steps: (a) accommodating a receiving mainboard in a receiving cavity of a bottom shell through a bottom shell opening of the bottom shell to obtain an electronic module, wherein a lead-out flexible board having one end connected to the receiving mainboard extends to the outside of the bottom shell through a side notch of the bottom shell; (b) providing a top cover on the bottom shell of the electronic module so that the bottom shell opening of the bottom shell is closed by the top cover; as well as (c) The lead-out flexible plate is bent so that a lead-out rigid plate connected to the other end of the lead-out flexible plate is overlapped with the top cover to obtain the receiving device.

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