Process for the production of a separator of ceramic powder dispersed in a base film, ceramic separator and equipment

Abstract

The present disclosure provides a ceramic powder and base film dispersed diaphragm preparation process, a ceramic diaphragm and equipment thereof. The ceramic powder and base film dispersed diaphragm preparation process comprises the following steps: obtaining a ceramic powder; introducing a gas source into the ceramic powder, the flow rate of the gas source being 80-100 sccm; performing plasma treatment on the gas source to obtain a modified ceramic powder, wherein the plasma power is 400-800 W, the discharge voltage is 700-1000 V, the discharge current is 0.5-3 A, and the temperature is 80-150 DEG C; mixing a binder, a dispersant and the modified ceramic powder in a solvent to obtain a modified ceramic powder coating slurry, the ratio of the binder, the modified ceramic powder and the dispersant being 5:93-94:1-2; and coating the modified ceramic powder coating slurry on a base film to obtain a modified ceramic powder composite diaphragm.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of lithium batteries, in particular to a ceramic powder and base film dispersed diaphragm preparation process, ceramic diaphragm and equipment thereof. BACKGROUND

[0002] The diaphragm is one of the four main materials of lithium ion batteries, and the performance of the diaphragm is crucial to the charge-discharge, lightweight and safety of the lithium ion battery. The polyolefin diaphragm and the ceramic composite diaphragm widely used in the market have their own advantages and disadvantages. The traditional polyolefin diaphragm has the advantages of high mechanical strength and good electrochemical stability, but it has the disadvantages of poor electrolyte wettability, high interfacial resistance, poor thermal stability, easy shrinkage under heat, etc., which is not conducive to the use of the battery in harsh environments; the ceramic composite diaphragm has high thermal stability and chemical stability, and has stronger wettability and liquid retention capacity for electrolyte, which can improve the electrochemical performance, safety and service life of the battery, but when the ceramic particles are coated on the surface of the diaphragm, the particles will agglomerate and disperse unevenly, the ceramic particles will fall off after coating, causing the pores to be blocked, and the ceramic composite diaphragm is prone to damp, which will adversely affect the cycle performance and service life of the battery.

[0003] In order to make the dispersion effect of the ceramic powder better, a modified ceramic diaphragm for lithium ion batteries and a preparation method thereof are disclosed in Chinese Patent No. CN104538576B, which modifies the surface of the ceramic powder by using alkyl anion surfactant and vinyl or amino silane coupling agent, and performs plasma treatment on the polyolefin base film, so as to reduce the powder agglomeration and improve the dispersibility and compatibility. However, the use of surfactants to modify the ceramic powder is complex and energy-consuming, and the organic solvents or acid-base solutions will produce a large amount of waste liquid, causing environmental pollution, and at the same time, the surface modification of the powder at the atomic scale cannot be realized, i.e., the dispersibility and compatibility of the ceramic powder are not high enough.

[0004] Therefore, there is an urgent need for a ceramic powder modification process and equipment that can make the dispersibility and compatibility of the ceramic powder higher, be friendly to the environment and have higher production efficiency. SUMMARY

[0005] The purpose of the present disclosure is to overcome the shortcomings in the prior art, and to provide a ceramic powder and base film dispersed diaphragm preparation process, ceramic diaphragm and equipment thereof, which can make the dispersibility and compatibility of the ceramic powder higher, be friendly to the environment and have higher production efficiency.

[0006] The purpose of the present disclosure is achieved by the following technical solutions:

[0007] A ceramic powder and base film dispersed diaphragm preparation process comprises the following steps:

[0008] obtaining a ceramic powder;

[0009] A gas source is introduced into the ceramic powder to fluidize it, so that the gas source and the ceramic powder are mixed. The flow rate of the gas source is 80 sccm-100 sccm.

[0010] The gas source is subjected to plasma treatment to form plasma, and the plasma is used to impact the surface of the ceramic powder to obtain modified ceramic powder. The plasma power supply has a power of 400W-800W, a discharge voltage of 700V-1000V, a discharge current of 0.5A-3A, and a temperature of 80℃-150℃.

[0011] A binder, a dispersant, and the modified ceramic powder are mixed in a solvent to obtain a modified ceramic powder coating slurry, wherein the ratio of the binder, the modified ceramic powder, and the dispersant is 5:93~94:1~2.

[0012] The modified ceramic powder coating slurry is coated onto the base film to obtain a modified ceramic powder composite diaphragm.

[0013] In one embodiment, a gas source is introduced into the ceramic powder to fluidize it, thereby mixing the gas source with the ceramic powder. This specifically includes the following steps:

[0014] A first gas source is introduced into the ceramic powder;

[0015] A second gas source is introduced into the ceramic powder to mix the first gas source with the second gas source, wherein the mixing ratio of the first gas source to the second gas source is 1:2~3.

[0016] In one embodiment, the first gas source is one of nitrogen, helium, argon, oxygen, ammonia, methane, and air.

[0017] In one embodiment, the second gas source is one of nitrogen, helium, argon, oxygen, ammonia, methane, and air.

[0018] In one embodiment, the dispersant is polyvinylpyrrolidone.

[0019] In one embodiment, the solvent is either N-methylpyrrolidone or water.

[0020] In one embodiment, the adhesive is one of polyvinylidene fluoride, sodium carboxymethyl cellulose, and styrene-butadiene rubber.

[0021] In one embodiment, the base film is either polypropylene or polyethylene.

[0022] A ceramic diaphragm manufacturing apparatus, comprising:

[0023] reaction chamber;

[0024] The material conveying mechanism includes a feeding hopper and a discharging hopper, which are respectively connected to the reaction chamber. The feeding hopper is used to convey the ceramic powder into the reaction chamber, and the discharging hopper is used to collect and output the ceramic powder in the reaction chamber.

[0025] A gas source mechanism is connected to the reaction chamber and is used to deliver the gas source into the reaction chamber.

[0026] A plasma reaction mechanism is connected to the reaction chamber, and the working end of the plasma reaction mechanism is located inside the reaction chamber. The plasma reaction mechanism is used to ionize the gas source.

[0027] The controller is electrically connected to both the gas source mechanism and the plasma reaction mechanism, so that the gas source mechanism fluidizes the ceramic powder in the reaction chamber and the plasma reaction mechanism ionizes the gas source in the reaction chamber.

[0028] A ceramic diaphragm is prepared using the ceramic diaphragm manufacturing equipment described in any of the above embodiments.

[0029] Compared with the prior art, this disclosure has at least the following advantages:

[0030] 1. In the above-mentioned membrane preparation process of dispersing ceramic powder and base film, a gas source is introduced into the ceramic powder for fluidization treatment. The flow rate of the gas source is 80 sccm-100 sccm, which keeps the ceramic powder in a suspended state to reduce agglomeration between ceramic powder particles and to ensure thorough mixing between the gas source and the ceramic powder. Then, the gas source is subjected to plasma treatment, wherein the plasma power supply is 400W-800W, the discharge voltage is 700V-1000V, the discharge current is 0.5A-3A, and the temperature is 80℃-150℃, so that the gas source forms plasma, and the plasma impacts the ceramic powder. The surface modification generates numerous defects and active sites on the ceramic powder surface, thereby modifying the ceramic powder. The presence of these defects and active sites allows the ceramic powder to chemically adsorb onto the base film, forming a cross-linked structure. This also improves the dispersibility and compatibility of the ceramic powder on the base film, enabling the ceramic powder to be uniformly coated on the base film surface. Compared to traditional techniques that use surfactants to modify ceramic powder, the proposed method is simple to operate, environmentally friendly, and highly efficient. It also achieves atomic-scale surface modification of the ceramic powder, further improving its dispersibility and compatibility on the base film.

[0031] 2. The defects and active sites on the surface of the modified ceramic powder undergo chemical adsorption with the base film to form a cross-linked structure. The cross-linked structure makes the structure of the separator more stable, thereby improving the problem of ceramic powder falling off the separator after long-term immersion in electrolyte, thus improving the structural stability of the separator. At the same time, plasma modification can also generate hydrophilic groups, such as carbonyl and hydroxyl groups, on the surface of the ceramic powder, thereby improving the wetting ability of the electrolyte on the separator, reducing the internal resistance of the battery, and giving the battery a better capacity retention rate.

[0032] 3. Since the shape retention of ceramic powder is much greater than that of the base film, the presence of ceramic powder hinders the thermal shrinkage of the separator, improves the separator's resistance to thermal deformation, and thus improves the battery performance. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a process flow diagram of a membrane preparation process for dispersing ceramic powder and a base film, as shown in one embodiment.

[0035] Figure 2 This is a schematic diagram of a ceramic diaphragm manufacturing apparatus according to one embodiment. Detailed Implementation

[0036] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0037] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0039] This disclosure provides a membrane preparation process for dispersing ceramic powder and a base film, comprising the following steps: obtaining ceramic powder; introducing a gas source into the ceramic powder to fluidize it, thereby mixing the gas source with the ceramic powder, wherein the flow rate of the gas source is 80 sccm-100 sccm; subjecting the gas source to plasma treatment to form plasma, and causing the plasma to impact the surface of the ceramic powder to obtain modified ceramic powder, wherein the plasma power supply is 400W-800W, the discharge voltage is 700V-1000V, the discharge current is 0.5A-3A, and the temperature is 80℃-150℃; mixing a binder, a dispersant, and the modified ceramic powder in a solvent to obtain a modified ceramic powder coating slurry, wherein the ratio of the binder, the modified ceramic powder, and the dispersant is 5:93. ~94:1~2; The modified ceramic powder coating slurry is coated on a base film to obtain a modified ceramic powder composite membrane; wherein, a gas source is introduced into the ceramic powder to fluidize the ceramic powder so that the gas source and the ceramic powder are mixed, specifically including the following steps: a first gas source is introduced into the ceramic powder to impact the surface of the ceramic powder; a second gas source is introduced into the ceramic powder to impact the surface of the ceramic powder; and the gas type of the second gas source is obtained; the gas type is multiplied with a preset type to obtain a gas source gas reaction product; whether the gas source gas reaction product is greater than or equal to a preset reaction product is detected; when the gas source gas reaction product is greater than or equal to the preset reaction product, the first gas source and the second gas source are introduced in a time-division manner to perform a primary plasma treatment and a secondary plasma treatment.

[0040] The aforementioned membrane preparation process, which disperses ceramic powder with a base film, involves fluidizing the ceramic powder by introducing a gas source at a flow rate of 80-100 sccm, keeping the ceramic powder in suspension to reduce agglomeration and ensure thorough mixing. The gas source is then subjected to plasma treatment with a power of 400-800W, a discharge voltage of 700-1000V, a discharge current of 0.5A-3A, and a temperature of 80℃-150℃. This process generates plasma, which impacts the surface of the ceramic powder, creating numerous defects and active sites. This modification of the ceramic powder allows for chemical adsorption between the powder and the base film, forming a cross-linked structure. Furthermore, it improves the dispersibility and compatibility of the ceramic powder on the base film, enabling uniform coating of the powder onto the base film surface. Compared to traditional methods... Traditional techniques use surfactants to modify ceramic powders. The proposed method is simple to operate, environmentally friendly, and highly efficient. It also achieves atomic-scale surface modification of the ceramic powder, improving its dispersibility and compatibility with the base film. Defects and active sites on the modified ceramic powder surface chemically adsorb onto the base film, forming a cross-linked structure. This cross-linking structure makes the separator more stable, mitigating the problem of ceramic powder detachment after prolonged electrolyte immersion, thus improving the separator's structural stability. Furthermore, plasma modification generates hydrophilic groups, such as carbonyl and hydroxyl groups, on the ceramic powder surface, improving the electrolyte's wetting ability and reducing the battery's internal resistance, resulting in better capacity retention. Since the ceramic powder's shape retention is much greater than that of the base film, its presence hinders thermal shrinkage of the separator, improving its resistance to thermal deformation and ultimately enhancing battery performance.

[0041] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0042] like Figure 1 As shown, a membrane preparation process for dispersing ceramic powder and a base film in one embodiment includes the following steps:

[0043] S100: Obtaining ceramic powder. Understandably, base membranes are generally made of polyolefin materials, which have advantages such as high mechanical strength and good electrochemical stability. However, they also have drawbacks such as poor electrolyte wettability, high interfacial resistance, poor thermal stability, and easy shrinkage upon heating. To solve these problems, a layer of ceramic powder can be coated onto the base membrane. The ceramic powder can improve the thermal stability of the base membrane and simultaneously enhance its wettability and electrolyte retention capacity, thereby improving the electrochemical performance of the battery. However, when ceramic particles are coated onto the membrane surface, uneven particle agglomeration and dispersion occur, leading to pore blockage after coating and easy moisture absorption of the ceramic composite membrane. Traditional techniques using surfactants to modify ceramic powder are complex, energy-intensive, and generate large amounts of waste liquid, causing environmental pollution. Therefore, this application uses ceramic powder and performs atomic-scale surface modification on the ceramic powder to improve the performance of the membrane.

[0044] S200: A gas source is introduced into the ceramic powder to fluidize it, thereby mixing the gas source with the ceramic powder. The flow rate of the gas source is 80 sccm-100 sccm. Understandably, after placing the ceramic powder in the reaction chamber of the equipment, the gas source mechanism is activated to introduce gas into the reaction chamber at a flow rate of 80 sccm-100 sccm. This flow rate is the fluidization flow rate of the ceramic powder, ensuring that the ceramic powder remains in a suspended state under the action of the gas source. This fluidization process causes the ceramic powder to vibrate violently, colliding and dispersing adjacent particles, thus reducing agglomeration and ensuring thorough mixing between the gas source and the ceramic powder. This results in better plasma treatment of the ceramic powder.

[0045] S300: The gas source is subjected to plasma treatment to form plasma, and the plasma is used to impact the surface of the ceramic powder to obtain modified ceramic powder. The plasma power supply is 400W-800W, the discharge voltage is 700V-1000V, the discharge current is 0.5A-3A, and the temperature is 80℃-150℃. Understandably, after the gas source and ceramic powder are fully mixed, the agglomeration between the ceramic powder particles is reduced. The plasma equipment is then activated to perform plasma treatment on the gas source. The plasma power supply is 400W-800W, the discharge voltage is 700V-1000V, the discharge current is 0.5A-3A, and the temperature is 80℃-150℃. This causes the gas source to form plasma, and the plasma impacts the surface of the ceramic powder, resulting in many defects and active sites on the surface of the ceramic powder. These defects and active sites can cause the ceramic powder to chemically adsorb onto the base film and form a cross-linked structure, thereby improving the dispersibility and compatibility of the ceramic powder on the base film. This modifies the ceramic powder, allowing it to be uniformly coated on the surface of the base film.

[0046] S400: The binder, dispersant, and modified ceramic powder are mixed in a solvent to obtain a modified ceramic powder coating slurry. The ratio of the binder, the modified ceramic powder, and the dispersant is 5:93~94:1~2. It is understood that by mixing the binder, dispersant, and modified ceramic powder in the solvent, the binder is mainly used to improve the adhesion strength between the ceramic powder and the base film, ensuring the ceramic powder adheres firmly to the surface of the base film. The dispersant is mainly used to reduce the attractive force between the ceramic powder particles, preventing agglomeration and ensuring the ceramic powder is uniformly dispersed in the solvent, forming a stable suspension, thereby avoiding agglomeration and sedimentation of the ceramic powder in the slurry.

[0047] S500: The modified ceramic powder coating slurry is coated onto a base film to obtain a modified ceramic powder composite membrane. It is understood that by coating the modified ceramic powder coating slurry onto the base film using a coating machine, the ceramic powder undergoes plasma treatment with a gas source, resulting in numerous defects and active sites on its surface. This modifies the ceramic powder. The presence of these defects and active sites allows the ceramic powder to chemically adsorb onto the base film, forming a cross-linked structure. This improves the dispersibility and compatibility of the ceramic powder on the base film, enabling the ceramic powder to be uniformly coated onto the base film surface.

[0048] The process of introducing a gas source into the ceramic powder to fluidize it and mix the gas source with the ceramic powder includes the following steps:

[0049] A first air source is introduced into the ceramic powder to impact the surface of the ceramic powder;

[0050] A second air source is introduced into the ceramic powder to impact the surface of the ceramic powder;

[0051] as well as,

[0052] Obtain the gas type of the second gas source;

[0053] The gas type is multiplied with a preset type to obtain the gas source gas reaction product;

[0054] Detect whether the gas-source gas reaction product is greater than or equal to a preset reaction product;

[0055] When the product of the gas source reaction is greater than or equal to the preset product of the reaction, the first gas source and the second gas source are introduced in a time-sharing manner to perform the initial plasma treatment and the secondary plasma treatment.

[0056] Understandably, to make the active sites and defects formed on the surface of ceramic powder more complex and diverse, two gas sources can be used to bombard the ceramic powder. However, if both the first and second gas sources are relatively active gases, they will react under plasma discharge conditions, leading to internal friction between the first and second gas sources. This results in the active sites and defects formed on the surface of the ceramic powder not achieving the desired effect. Furthermore, the discharge reaction of the first and second gas sources at high concentrations carries certain risks, even potentially leading to an explosion. Therefore, in this embodiment, the gas type of the second gas source is detected before it is introduced. A gas detector can accurately detect the gas type of the second gas source to determine whether the second and first gas sources can be introduced simultaneously.Furthermore, after determining the gas type of the second gas source, the gas type of the second gas source is multiplied with a preset type. The preset type is the gas type of the first gas source. The specific operation of the gas type multiplication and obtaining the gas-reaction product is to pre-mark the active and inert gases. For example, inert gases (such as helium, argon, etc.) are marked as "1", active gases (such as oxygen, ammonia, methane, etc.) are marked as "2", and the preset reaction product can be set to "3". The reaction product between the first and second gas sources is used to reflect the intensity of the reaction between the two gas sources, specifically in the following four cases: 1. When the first gas source is introduced... 1. When the first gas source is an inert gas and the second gas source is also an inert gas, the product of the reactions of the two gas sources is multiplied by "1". This product "1" is less than the preset product "3", indicating that the first and second gas sources will not react under discharge conditions and can be introduced simultaneously. 2. When the first gas source is an inert gas and the second gas source is an active gas, the product of the reactions of the two gas sources is multiplied by "2". This product "2" is less than the preset product "3", indicating that the first and second gas sources will not react under discharge conditions and can be introduced simultaneously. 3. When the first gas source is an active gas... When the second gas source is an inert gas, the product of the reactions of the two gas sources is 2. This product is less than the preset product of 3, indicating that the first and second gas sources will not react under discharge conditions and can be introduced simultaneously. 4. When both the first and second gas sources are active gases, the product of the reactions of the two gas sources is 4. This product is greater than the preset product of 3, indicating that the first and second gas sources will react under discharge conditions, and the reaction will be quite vigorous. Therefore, the first and second gas sources cannot be introduced simultaneously. The first and second gas sources need to be introduced separately, and primary and secondary plasma treatments should be performed separately. That is, primary plasma treatment is performed after the first gas source is introduced so that the first gas source forms plasma to bombard the ceramic powder. After the first gas source is consumed, the second gas source is introduced, and secondary plasma treatment is performed so that the second gas source forms plasma to bombard the ceramic powder. In this way, while ensuring that the first and second gas sources modify the ceramic powder together, internal friction between the first and second gas sources is avoided, thereby reducing production costs. At the same time, the risks caused by the reaction between the first and second gas sources under discharge conditions are also avoided.

[0057] The aforementioned membrane preparation process, which disperses ceramic powder with a base film, involves fluidizing the ceramic powder by introducing a gas source at a flow rate of 80-100 sccm, keeping the ceramic powder in suspension to reduce agglomeration and ensure thorough mixing. The gas source is then subjected to plasma treatment with a power of 400-800W, a discharge voltage of 700-1000V, a discharge current of 0.5A-3A, and a temperature of 80℃-150℃. This process generates plasma, which impacts the surface of the ceramic powder, creating numerous defects and active sites. This modification of the ceramic powder allows for chemical adsorption between the powder and the base film, forming a cross-linked structure. Furthermore, it improves the dispersibility and compatibility of the ceramic powder on the base film, enabling uniform coating of the powder onto the base film surface. Compared to traditional methods... Traditional techniques use surfactants to modify ceramic powders. The proposed method is simple to operate, environmentally friendly, and highly efficient. It also achieves atomic-scale surface modification of the ceramic powder, improving its dispersibility and compatibility with the base film. Defects and active sites on the modified ceramic powder surface chemically adsorb onto the base film, forming a cross-linked structure. This cross-linking structure makes the separator more stable, mitigating the problem of ceramic powder detachment after prolonged electrolyte immersion, thus improving the separator's structural stability. Furthermore, plasma modification generates hydrophilic groups, such as carbonyl and hydroxyl groups, on the ceramic powder surface, improving the electrolyte's wetting ability and reducing the battery's internal resistance, resulting in better capacity retention. Since the ceramic powder's shape retention is much greater than that of the base film, its presence hinders thermal shrinkage of the separator, improving its resistance to thermal deformation and ultimately enhancing battery performance.

[0058] In one embodiment, after detecting whether the gas source gas reaction product is greater than or equal to a preset reaction product, the following steps are further included:

[0059] When the product of the gas source reaction is less than the preset product of the reaction, the first gas source and the second gas source are simultaneously introduced to perform three plasma treatments, wherein the mixing ratio of the first gas source and the second gas source is 1:2~3.

[0060] In this embodiment, when the product of the gas source reaction is less than the preset product, it indicates that the first gas source and the second gas source cannot both be active gases simultaneously. Therefore, there are three possibilities: 1. The first gas source is an inert gas, and the second gas source is also an inert gas; 2. The first gas source is an inert gas, and the second gas source is an active gas; 3. The first gas source is an active gas, and the second gas source is an inert gas. In all three cases, the first and second gas sources can be introduced simultaneously. This is because when the first and second gas sources are not simultaneously active gases, they will not react under discharge conditions. However, by simultaneously introducing and mixing the first and second gas sources before performing three plasma treatments, the ceramic powder is simultaneously impacted by both gas sources to modify it. Since the first and second gas sources do not need to undergo two separate plasma treatments, production efficiency is improved. Furthermore, the active sites and defects on the modified ceramic powder are related to the mixing ratio of the first and second gas sources. This is because the impact paths of the first and second gas sources on the ceramic powder are different, and the resulting functional groups are also inconsistent. This leads to a greater number of active sites and defects on the modified ceramic powder. Simultaneously, when the second gas source uses oxygen or an oxygen-containing gas source, the oxygen element will form hydrophilic groups with the ceramic powder. The higher the proportion of the second gas source, the more hydrophilic groups are formed in the ceramic powder. While ensuring the dispersibility and compatibility of the modified ceramic powder with the base film, the proportion of dispersant can be reduced to lower production costs. In this embodiment, the first gas source is an inert gas, the second gas source is oxygen, and the mixing ratio of the first and second gas sources is 1:3, thus enabling the ceramic powder to form more hydrophilic groups.

[0061] Understandably, for the first and second gas sources that may react under high-power discharge conditions, to prevent the first and second gas sources from reacting under plasma discharge conditions after mixing, such as when the first gas source is nitrogen and the second gas source is oxygen, nitrogen reacts with oxygen to generate nitric oxide under discharge conditions, resulting in a reduction in the amount of gas source reacting with the ceramic powder, thereby reducing the defects and active sites formed on the surface of the ceramic powder. Therefore, in another embodiment, the process of introducing gas sources into the ceramic powder and performing plasma treatment on the gas sources specifically includes the following steps:

[0062] The ceramic powder is introduced into a first gas source, and the first gas source is subjected to initial plasma treatment. The plasma power supply is 700W-800W, the discharge voltage is 900V-1000V, the discharge current is 2A-3A, the temperature is 130℃-150℃, and the reaction time is 20s-30s.

[0063] A second gas source is introduced into the ceramic powder, and the second gas source is subjected to secondary plasma treatment. The plasma power supply is 400W-500W, the discharge voltage is 700V-800V, the discharge current is 0.5A-1A, the temperature is 80℃-100℃, and the reaction time is 50s-60s.

[0064] In this embodiment, the ceramic powder undergoes initial plasma treatment after being introduced into a first gas source. Under discharge conditions, the first gas source forms plasma to impact and chemically react with the ceramic powder surface, causing the ceramic powder to form corresponding functional groups. The time the ceramic powder is introduced into the first gas source is controlled between 20-30 seconds. After the preset time is reached, the input of the first gas source is stopped. At this point, the first gas source has completely reacted with the ceramic powder to generate functional groups under discharge conditions, meaning the first gas source is completely consumed. Specifically, the power parameters of the initial plasma are relatively high, allowing the plasma and ceramic powder to react effectively. The impact and reaction are relatively more intense to ensure that the first gas source is consumed during the initial plasma treatment. Then, the ceramic powder is subjected to a second plasma treatment after the second gas source is introduced. At this time, there is no first gas source in the reaction chamber. Under the condition of discharge, the second gas source forms plasma to impact the ceramic surface and cause a chemical reaction, so that the ceramic powder and the second gas source form corresponding groups. That is, the power parameters of the second plasma treatment are relatively small, making the impact and reaction between the plasma and the ceramic powder more gentle, so that the second gas source reacts completely with the ceramic powder within a preset time of 50s-60s. Specifically, by introducing the first gas source and the second gas source separately, and by subjecting the first gas source to plasma treatment before introducing the second gas source, the first gas source is completely consumed when the second gas source is introduced. This avoids the first and second gas sources reacting during device discharge, thus preventing waste of the first and second gas sources. It also ensures that the first and second gas sources act on ceramic powder, making the defects and active sites formed on the surface of the ceramic powder more diverse and complex, thereby improving the dispersibility and compatibility of the ceramic powder on the base film.

[0065] Furthermore, to ensure that the first gas source has been completely consumed when the second gas source is introduced, and to ensure that the second gas source can only react with the ceramic powder, in one embodiment, after the first gas source is introduced into the ceramic powder and the first gas source is subjected to initial plasma treatment, and before the second gas source is introduced into the ceramic powder and the second gas source is subjected to secondary plasma treatment, the following steps are also included:

[0066] Obtain the concentration of the first plasma treatment from the first gas source;

[0067] Match the concentration of the first gas source with the preset concentration;

[0068] When the concentration of the first gas source is greater than or equal to the preset concentration, the power, discharge voltage, discharge current and temperature of the plasma power supply are increased, and the reaction time is reduced.

[0069] It is understandable that after the first gas source is introduced and the initial plasma treatment is performed, there may still be cases where the first gas source is not completely consumed. If the second gas source is introduced at this time and a second plasma treatment is performed, the introduced second gas source will react with the remaining first gas source under discharge conditions, resulting in a reduction in the amount of ceramic powder reacted by the introduced second gas source per unit time, which in turn leads to a reduction in the number of active sites and defects generated in the ceramic powder. In this embodiment, after the first gas source is introduced and the initial plasma treatment is performed, the concentration of the first gas source in the reaction chamber of the equipment is detected to obtain the concentration of the first gas source and match it with the preset concentration. The preset concentration can be designed according to the flow rate of the first gas source introduced per unit time. For example, the preset concentration is designed to be 2%-3%. When the obtained concentration of the first gas source is greater than the preset concentration, it indicates that there is a lot of residual first gas source in the reaction chamber at this time, that is, the first gas source has not completely reacted with the ceramic powder. At this time, the power, amplification voltage, amplification current and temperature of the plasma power supply are increased. That is, the plasma power supply power is greater than 800W, the discharge voltage is greater than 1000V, the discharge current is greater than 3A and the temperature is greater than 150℃. After increasing the parameters of the plasma reaction, the plasma formed by the residual first gas source reacts more violently with the ceramic powder, thereby consuming the residual first gas source, and thus making the ceramic powder form more active sites and defects after the initial plasma treatment. Furthermore, while increasing the parameters of the plasma reaction, it is also necessary to reduce the plasma start-up time, that is, the reaction time should be less than 20 seconds. This is because if the reaction time is too long after increasing the parameters of the plasma reaction, it will cause the bond energy on the surface of the ceramic powder itself to break, which will result in poor performance of the formed membrane.

[0070] In another embodiment, matching the concentration of the first gas source with a preset concentration further includes the following steps:

[0071] When the concentration of the first gas source is less than the preset concentration, the vacuum device is activated to remove the remaining first gas source.

[0072] In this embodiment, when the concentration of the first gas source after the initial plasma treatment is less than the preset concentration, i.e., the concentration of the first gas source is less than 2%, it indicates that the first gas source has basically reacted completely with the ceramic powder. That is, the residual first gas source has little effect on the modification effect of the ceramic powder. At this time, the residual first gas source is extracted by activating the vacuum device, so that when the second gas source is introduced into the reaction chamber, there is no residue of the first gas source in the reaction chamber. This allows the second gas source to better collide and react with the ceramic powder, resulting in a better modification effect of the ceramic powder.

[0073] Furthermore, to ensure complete reaction between the introduced second gas source and the ceramic powder, thereby ensuring the performance of the modified ceramic powder, in one embodiment, after introducing the second gas source into the ceramic powder and subjecting the second gas source to secondary plasma treatment, the following steps are also included:

[0074] Obtain the concentration of the second gas source;

[0075] The concentration of the second gas source is matched with the preset concentration;

[0076] When the concentration of the second gas source is greater than or equal to the preset concentration, the power, discharge voltage, discharge current and temperature of the plasma power supply are increased, and the reaction time is reduced.

[0077] In this embodiment, after introducing the second gas source and performing secondary plasma treatment, the residual concentration of the second gas source is detected. When the concentration of the second gas source is greater than the preset concentration (e.g., the preset concentration is set to 1%-2%), it indicates that the residual amount of the second gas source is relatively large, meaning that the second gas source has not completely reacted with the ceramic powder, and the modification of the ceramic powder has not achieved the expected effect. At this time, by increasing the power, discharge voltage, discharge current, and temperature of the plasma power supply (specifically, the plasma power supply power is greater than 500W, the discharge voltage is greater than 800V, the discharge current is greater than 1A, and the temperature is greater than 100℃), the plasma reaction parameters are increased, and the reaction between the plasma formed by the residual second gas source and the ceramic powder becomes more intense, thereby consuming the residual second gas source. This results in a greater number of active sites and defects formed in the ceramic powder after the secondary plasma treatment, leading to a better modification effect of the ceramic powder. Furthermore, while increasing the plasma reaction parameters, the reaction time of the secondary plasma treatment is reduced, i.e., the reaction time of the secondary plasma treatment is less than 50 seconds, in order to avoid the breakage of the bond energy on the surface of the ceramic powder due to excessive reaction time, which would result in poor performance of the formed membrane.

[0078] In one embodiment, the first gas source is one of nitrogen, helium, argon, oxygen, ammonia, methane, and air. It is understood that different gas sources will result in different numbers and types of active sites on the ceramic powder surface from the resulting plasma. In this embodiment, nitrogen is used as the first gas source so that it forms plasma during plasma treatment, which then impacts the ceramic powder surface and reacts with the ceramic powder to form functional groups.

[0079] In one embodiment, the second gas source is one of nitrogen, helium, argon, oxygen, ammonia, methane, and air. It is understood that trace impurities may exist in ceramic powder during production. These impurities carry trace amounts of hydrogen and carbon. When an active gas is selected as the gas source, it reacts with these elements in a plasma state to generate hydrophilic groups, such as carbonyl or hydroxyl groups. In this embodiment, oxygen is used as the second gas source. During plasma treatment, oxygen forms plasma that impacts the surface of the ceramic powder and reacts with it to form groups. This diversifies the defects and active sites on the ceramic powder surface. Simultaneously, oxygen can react with the ceramic powder to form hydrophilic groups (carbonyl or hydroxyl groups). These hydrophilic groups can improve the wetting effect of the electrolyte on the separator, thereby reducing the battery's internal resistance and resulting in good capacity retention. Furthermore, when an inert gas is selected as the gas source, the inert gas will not react with the ceramic powder during discharge; that is, the inert gas and ceramic powder will not react to form hydrophilic groups.

[0080] In one embodiment, the dispersant is polyvinylpyrrolidone (PVP). In this embodiment, PVP has excellent dispersing properties, enabling it to quickly disperse ceramic powder into the solvent. Simultaneously, PVP can form a protective layer on the surface of the ceramic powder, preventing agglomeration and sedimentation, thereby improving the dispersibility and compatibility of the ceramic powder with the base film.

[0081] In one embodiment, the solvent is either N-methylpyrrolidone (NMP) or water. In this embodiment, the solvent is NMP or water, which allows the modified ceramic powder to dissolve well in the solvent and then be coated onto the surface of the base film.

[0082] In one embodiment, the binder is one of polyvinylidene fluoride, sodium carboxymethyl cellulose, and styrene-butadiene rubber. In this embodiment, the binder is one of polyvinylidene fluoride (PVDF), sodium carboxymethyl cellulose (CMC), and styrene-butadiene rubber (SBR), which allows the modified ceramic powder coating slurry to be well fixed on the surface of the base film.

[0083] In one embodiment, the base membrane is either polypropylene or polyethylene. In this embodiment, the base membrane is made of either polypropylene (PP) or polyethylene (PE), which gives the diaphragm good mechanical strength and high-temperature resistance.

[0084] This application also provides a ceramic diaphragm manufacturing apparatus for implementing a diaphragm preparation process that disperses ceramic powder and a base membrane to obtain modified ceramic powder. Please refer to [link to relevant documentation]. Figure 2One embodiment of the ceramic diaphragm manufacturing equipment 10 includes a reaction chamber 100, a material conveying mechanism 200, a gas source mechanism 300, a plasma reaction mechanism 400, and a controller (not shown). The material conveying mechanism 200 includes a feed chamber 210 and a discharge chamber 220, which are respectively connected to the reaction chamber 100. The feed chamber 210 is used to convey the ceramic powder into the reaction chamber 100, and the discharge chamber 200 is used to collect and output the ceramic powder in the reaction chamber 100. The gas source mechanism 300 is connected to the reaction chamber 100 and is used to convey the gas source into the reaction chamber 100. The plasma reaction mechanism 400 is connected to the reaction chamber 100, and the active end of the plasma reaction mechanism 400 is located inside the reaction chamber 100. The plasma reaction mechanism 400 is used to ionize the gas source. The controller is electrically connected to both the gas source mechanism 300 and the plasma reaction mechanism 400, enabling the gas source mechanism 300 to fluidize the ceramic powder within the reaction chamber 100 and the plasma reaction mechanism 400 to ionize the gas within the reaction chamber 100. Specifically, the controller controls the flow rate of the gas source mechanism, as well as the power, discharge voltage, discharge current, and temperature of the plasma reaction mechanism.

[0085] This application also provides a ceramic diaphragm, which is prepared using the ceramic diaphragm manufacturing equipment described in any of the above embodiments.

[0086] Compared with the prior art, this disclosure has at least the following advantages:

[0087] 1. In the above-mentioned membrane preparation process of dispersing ceramic powder and base film, a gas source is introduced into the ceramic powder for fluidization treatment. The flow rate of the gas source is 80 sccm-100 sccm, which keeps the ceramic powder in a suspended state to reduce agglomeration between ceramic powder particles and to ensure thorough mixing between the gas source and the ceramic powder. Then, the gas source is subjected to plasma treatment, wherein the plasma power supply is 400W-800W, the discharge voltage is 700V-1000V, the discharge current is 0.5A-3A, and the temperature is 80℃-150℃, so that the gas source forms plasma, and the plasma impacts the ceramic powder. The surface modification generates numerous defects and active sites on the ceramic powder surface, thereby modifying the ceramic powder. The presence of these defects and active sites allows the ceramic powder to chemically adsorb onto the base film, forming a cross-linked structure. This also improves the dispersibility and compatibility of the ceramic powder on the base film, enabling the ceramic powder to be uniformly coated on the base film surface. Compared to traditional techniques that use surfactants to modify ceramic powder, the proposed method is simple to operate, environmentally friendly, and highly efficient. It also achieves atomic-scale surface modification of the ceramic powder, further improving its dispersibility and compatibility on the base film.

[0088] 2. The defects and active sites on the surface of the modified ceramic powder undergo chemical adsorption with the base film to form a cross-linked structure. The cross-linked structure makes the structure of the separator more stable, thereby improving the problem of ceramic powder falling off the separator after long-term immersion in electrolyte, thus improving the structural stability of the separator. At the same time, plasma modification can also generate hydrophilic groups, such as carbonyl and hydroxyl groups, on the surface of the ceramic powder, thereby improving the wetting ability of the electrolyte on the separator, reducing the internal resistance of the battery, and giving the battery a better capacity retention rate.

[0089] 3. Since the shape retention of ceramic powder is much greater than that of the base film, the presence of ceramic powder hinders the thermal shrinkage of the separator, improves the separator's resistance to thermal deformation, and thus improves the battery performance.

[0090] The following are some specific examples. When %, it refers to a percentage by weight. It should be noted that the following examples do not exhaustively list all possible scenarios, and unless otherwise specified, the materials used in the following examples are commercially available.

[0091] Example 1

[0092] Add ceramic powder to the plasma feed hopper, open the feed valve to allow the ceramic powder to enter the reactor, then introduce air and adjust the air flow rate to fluidize the ceramic powder. At the same time, open the exhaust valve and vacuum pump, and finally turn on the plasma power supply. Adjust the plasma power, discharge voltage, discharge current, and temperature. The processing time is 90 seconds. Then close the exhaust valve, open the discharge valve to discharge the modified ceramic powder and collect it.

[0093] A slurry was prepared with PVDF binder comprising 6% by mass. Modified ceramic powder was added to a slurry tank and stirred at low speed for 2 hours. The slurry tank was then opened and a vacuum (5.2 × 10⁻⁶) was applied. －3 Pa) Stir at high speed for 20 h, and finally add 1% dispersant PVP to fully disperse the material and form a uniform ceramic powder slurry.

[0094] The above slurry was uniformly coated onto both sides of a dry-process PP base film using a microgravure coating machine. The coated base film was then placed under vacuum at 80 ℃ (5.2 × 10⁻⁶). －3 After drying for 24 hours, the modified ceramic / PP composite membrane is obtained.

[0095] Example 2

[0096] Add ceramic powder to the plasma feed hopper, open the feed valve to allow the ceramic powder to enter the reactor, then introduce air and adjust the air flow rate to fluidize the ceramic powder. At the same time, open the exhaust valve and vacuum pump, and finally turn on the plasma power supply. Adjust the plasma power, discharge voltage, discharge current, and temperature. The processing time is 90 seconds. Then close the exhaust valve, open the discharge valve to discharge the modified ceramic powder and collect it.

[0097] The adhesive solution was prepared with PVDF as the binder at a mass fraction of 6%. Modified ceramic powder was added to a slurry tank and stirred at low speed for 2 hours. The slurry tank was then opened and a vacuum (5.2 × 10⁻⁶) was applied. －3 Pa) Stir at high speed for 20 h, and finally add 0.8% dispersant PVP to fully disperse the material and form a uniform ceramic powder slurry.

[0098] The above slurry was evenly coated onto both sides of a dry-process PP base film using a microgravure coating machine. The coated base film was then placed under vacuum at 80 ℃ (5.2 × 10⁻⁶). －3 After drying for 24 hours, the modified ceramic / PP composite membrane is obtained.

[0099] Example 3

[0100] Add ceramic powder to the plasma feed chamber, open the feed valve to allow the ceramic powder to enter the reactor, then introduce helium gas, adjust the air flow rate to fluidize the ceramic powder, open the outlet valve and vacuum pump at the same time, turn on the plasma power supply, adjust the plasma power, discharge voltage, discharge current and temperature, and process for 90 seconds. Then close the outlet valve, open the discharge valve to discharge and collect the modified ceramic powder.

[0101] The adhesive solution was prepared with PVDF as the binder at a mass fraction of 6%. Modified ceramic powder was added to a slurry tank and stirred at low speed for 2 hours. The slurry tank was then opened and a vacuum (5.2 × 10⁻⁶) was applied. －3 Pa) Stir at high speed for 20 h, and finally add 1% dispersant PVP to fully disperse the material and form a uniform ceramic powder slurry.

[0102] The above slurry was evenly coated onto both sides of a dry-process PP base film using a microgravure coating machine. The coated base film was then placed under vacuum at 80 ℃ (5.2 × 10⁻⁶). －3 After drying for 24 hours, the modified ceramic / PP composite membrane is obtained.

[0103] Example 4

[0104] Ceramic powder is added to the plasma feed hopper, the feed valve is opened to allow the ceramic powder to enter the reactor, oxygen is then introduced, the air flow rate is adjusted to fluidize the ceramic powder, the exhaust valve and vacuum pump are opened at the same time, the plasma power supply is turned on, and the plasma power, discharge voltage, discharge current and temperature are adjusted. The processing time is 90 seconds. Then the exhaust valve is closed, the discharge valve is opened to discharge and collect the modified ceramic powder.

[0105] The adhesive solution was prepared with PVDF as the binder at a mass fraction of 6%. Modified ceramic powder was added to a slurry tank and stirred at low speed for 2 hours. The slurry tank was then opened and a vacuum (5.2 × 10⁻⁶) was applied. －3 Pa) Stir at high speed for 20 h, and finally add 1% dispersant PVP to fully disperse the material and form a uniform ceramic powder slurry.

[0106] The above slurry was evenly coated onto both sides of a dry-process PP base film using a microgravure coating machine. The coated base film was then placed under vacuum at 80 ℃ (5.2 × 10⁻⁶). －3 After drying for 24 hours, the modified ceramic / PP composite membrane is obtained.

[0107] Example 5

[0108] Add ceramic powder to the plasma feed chamber, open the feed valve to allow the ceramic powder to enter the reactor, then introduce helium gas, adjust the air flow rate to fluidize the ceramic powder, open the outlet valve and vacuum pump at the same time, turn on the plasma power for 30 seconds, adjust the plasma power, discharge voltage, discharge current and temperature, then stop introducing helium gas and start introducing oxygen. After 60 seconds, close the outlet valve, open the discharge valve to discharge and collect the modified ceramic powder.

[0109] The adhesive solution was prepared with PVDF as the binder at a mass fraction of 6%. Modified ceramic powder was added to a slurry tank and stirred at low speed for 2 hours. The slurry tank was then opened and a vacuum (5.2 × 10⁻⁶) was applied. －3 Pa) Stir at high speed for 20 h, and finally add 1% dispersant PVP to fully disperse the material and form a uniform ceramic powder slurry.

[0110] The above slurry was evenly coated onto both sides of a dry-process PP base film using a microgravure coating machine. The coated base film was then placed under vacuum at 80 ℃ (5.2 × 10⁻⁶). －3 After drying for 24 hours, the modified ceramic / PP composite membrane is obtained.

[0111] Example 6

[0112] Add ceramic powder to the plasma feed chamber, open the feed valve to allow the ceramic powder to enter the reactor, then introduce helium gas, adjust the air flow rate to fluidize the ceramic powder, open the outlet valve and vacuum pump at the same time, turn on the plasma power for 30 seconds, adjust the plasma power, discharge voltage, discharge current and temperature, then stop introducing helium gas and start introducing oxygen. After 60 seconds, close the outlet valve, open the discharge valve to discharge and collect the modified ceramic powder.

[0113] The adhesive solution was prepared with PVDF as the binder at a mass fraction of 6%. Modified ceramic powder was added to a slurry tank and stirred at low speed for 2 hours. The slurry tank was then opened and a vacuum (5.2 × 10⁻⁶) was applied. －3 Pa) Stir at high speed for 20 h, and finally add 0.8% dispersant PVP to fully disperse the material and form a uniform ceramic powder slurry.

[0114] The above slurry was evenly coated onto both sides of a dry-process PP base film using a microgravure coating machine. The coated base film was then placed under vacuum at 80 ℃ (5.2 × 10⁻⁶). －3 After drying for 24 hours, the modified ceramic / PP composite membrane is obtained.

[0115] Comparative Example 1

[0116] Purchased dry-process PP diaphragm.

[0117] Comparative Example 2

[0118] A slurry was prepared with 6% PVDF by mass. Unmodified ceramic powder was added to a slurry tank and stirred at low speed for 2 hours. The slurry tank was then opened and a vacuum (5.2 × 10⁻⁶) was applied. －3 Pa) Stir at high speed for 20 h, and finally add 1% dispersant PVP to fully disperse the material and form a uniform ceramic powder slurry.

[0119] The above slurry was evenly coated onto both sides of a dry-process PP base film using a microgravure coating machine. The coated base film was then placed under vacuum at 80 ℃ (5.2 × 10⁻⁶). －3 After drying for 24 hours, the unmodified ceramic / PP composite membrane is obtained.

[0120] The modified ceramic / PP composite separators of Examples 1 to 6 and the unmodified ceramic / PP composite separators of Comparative Examples 1 to 2 were used to prepare coin cells. The positive electrode active material of the coin cells was lithium iron phosphate, and the negative electrode active material was graphite. The tensile strength, puncture strength, thermal shrinkage, and cycle performance of the separators of the above coin cells were tested. The data obtained are shown in the figure below:

[0121]

[0122] As shown in the table above, the ceramic / PP composite separator outperforms the ordinary dry-process PP separator in Comparative Case 1 in all aspects of performance. The separator prepared using ceramic powder modified by a plasma powder modifier also outperforms the unmodified ceramic / PP separator in Comparative Case 2, with a significant reduction in thermal shrinkage. This is because the modified ceramic powder surface contains numerous defects and active sites. The presence of these defects and active sites allows the ceramic particles to chemically adsorb onto the PP base membrane, forming a cross-linked structure. This also improves the dispersibility and compatibility of the ceramic slurry on the PP base membrane, enabling the ceramic to be uniformly coated on the PP separator surface. Furthermore, the cross-linked structure makes the separator structure more stable, thus mitigating the problem of ceramic detachment after prolonged electrolyte immersion. Moreover, since the ceramic's shape retention is much greater than that of the base membrane, its presence hinders thermal shrinkage of the separator, improving its resistance to thermal deformation. Plasma modification can also generate hydrophilic groups, such as carbonyl and hydroxyl groups, on the surface of ceramic powder, thereby improving the wetting ability of the electrolyte on the separator, reducing the internal resistance of the battery, and giving the battery a better capacity retention rate.

[0123] The difference between Implementation Case 1 and Implementation Case 3 lies in the use of different plasma gas sources. Different plasma gas sources can cause differences in the number and types of active sites generated on the particle surface. The compressed air used in Implementation Case 1 contains a variety of gas molecules such as nitrogen and oxygen, which makes the active sites generated on the alumina ceramic surface more diversified. In addition, the oxygen molecules can cause the organic matter on the particle surface to undergo an oxidation reaction to generate more hydrophilic groups, thus making the membrane prepared in Example 1 superior to the membrane prepared in Example 3 (gas source is He).

[0124] Compared to Implementation Case 1, and compared to Implementation Case 6, Implementation Case 2 showed a reduction in the amount of dispersant added during the preparation of ceramic slurry. However, the performance of the diaphragm prepared using the slurry did not change significantly. This indicates that the plasma-modified alumina ceramic particles have good dispersibility, and the amount of dispersant can be appropriately reduced during slurry preparation to achieve cost reduction and efficiency improvement.

[0125] Compared with Implementation Cases 3 and 4, Implementation Case 5 shows a certain degree of improvement in diaphragm performance. This is because when He is used alone as the plasma gas source, it mainly plays the role of physical bombardment, which can remove some impurities on the particle surface and create defects on the particle surface. However, this role has certain limitations. When He is first introduced for physical bombardment for 30 seconds and then O2 is introduced as the plasma gas source, O2 can better contact the particle surface and generate more defects and hydrophilic groups.

[0126] In summary, plasma treatment of the ceramic powder surface creates more active sites, defects, and hydrophilic groups, which in turn leads to chemical adsorption between the ceramic powder and the base membrane, forming a cross-linked structure. This improves the dispersibility and compatibility of the ceramic slurry on the base membrane, allowing for more uniform coating of the ceramic slurry onto the base membrane surface. Consequently, the overall performance (mechanical, thermal, and electrochemical properties) of the alumina ceramic diaphragm is optimized.

[0127] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A process for preparing a separator by dispersing ceramic powder with a base film, characterized in that, Includes the following steps: Obtain ceramic powder; A gas source is introduced into the ceramic powder to fluidize it, so that the gas source and the ceramic powder are mixed. The flow rate of the gas source is 80 sccm-100 sccm. The gas source is subjected to plasma treatment to form plasma, and the plasma is used to impact the surface of the ceramic powder to obtain modified ceramic powder. The plasma power supply has a power of 400W-800W, a discharge voltage of 700V-1000V, a discharge current of 0.5A-3A, and a temperature of 80℃-150℃. A binder, a dispersant, and the modified ceramic powder are mixed in a solvent to obtain a modified ceramic powder coating slurry, wherein the ratio of the binder, the modified ceramic powder, and the dispersant is 5:93~94:1~2. The modified ceramic powder coating slurry is coated onto a base film to obtain a modified ceramic powder composite separator; wherein, A gas source is introduced into the ceramic powder to fluidize it, thereby mixing the gas source with the ceramic powder. This process specifically includes the following steps: A first air source is introduced into the ceramic powder to impact the surface of the ceramic powder; A second air source is introduced into the ceramic powder to impact the surface of the ceramic powder; as well as, Obtain the gas type of the second gas source; The gas type is multiplied with a preset type to obtain the gas source gas reaction product; Detect whether the gas-source gas reaction product is greater than or equal to a preset reaction product; When the product of the gas source reaction is greater than or equal to the preset product of the reaction, the first gas source and the second gas source are introduced in a time-sharing manner to perform the initial plasma treatment and the secondary plasma treatment. After detecting whether the gas source gas reaction product is greater than or equal to the preset reaction product, the following steps are also included: when the gas source gas reaction product is less than the preset reaction product, the first gas source and the second gas source are simultaneously introduced to perform three plasma treatments.

2. The membrane preparation process for dispersing ceramic powder and a base film according to claim 1, characterized in that, The mixing ratio of the first gas source to the second gas source is 1:2~3.

3. The membrane preparation process for dispersing ceramic powder and a base film according to claim 1, characterized in that, The first gas source is one of nitrogen, helium, argon, oxygen, ammonia, methane, and air.

4. The membrane preparation process for dispersing ceramic powder and a base film according to claim 1, characterized in that, The second gas source is one of nitrogen, helium, argon, oxygen, ammonia, methane, and air.

5. The membrane preparation process for dispersing ceramic powder and a base film according to claim 1, characterized in that, The dispersant is polyvinylpyrrolidone.

6. The membrane preparation process for dispersing ceramic powder and a base film according to claim 1, characterized in that, The solvent is either N-methylpyrrolidone or water.

7. The membrane preparation process for dispersing ceramic powder and a base film according to claim 1, characterized in that, The adhesive is one of polyvinylidene fluoride, sodium carboxymethyl cellulose, and styrene-butadiene rubber.

8. The membrane preparation process for dispersing ceramic powder and a base film according to claim 1, characterized in that, The base film is either polypropylene or polyethylene.

9. A ceramic diaphragm manufacturing device, characterized in that, A membrane preparation process for dispersing ceramic powder and a base membrane as described in any one of claims 1 to 8, wherein the ceramic membrane fabrication equipment comprises: reaction chamber; The material conveying mechanism includes a feeding hopper and a discharging hopper, which are respectively connected to the reaction chamber. The feeding hopper is used to convey the ceramic powder into the reaction chamber, and the discharging hopper is used to collect and output the ceramic powder in the reaction chamber. A gas source mechanism is connected to the reaction chamber and is used to deliver the gas source into the reaction chamber. A plasma reaction mechanism is connected to the reaction chamber, and the working end of the plasma reaction mechanism is located inside the reaction chamber. The plasma reaction mechanism is used to ionize the gas source. The controller is electrically connected to both the gas source mechanism and the plasma reaction mechanism, so that the gas source mechanism fluidizes the ceramic powder in the reaction chamber and the plasma reaction mechanism ionizes the gas source in the reaction chamber.

10. A ceramic diaphragm, characterized in that, The ceramic diaphragm is prepared using the ceramic diaphragm manufacturing equipment described in claim 9.

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