High-current contact device for transmitting electrical energy

Abstract

A high-current contact device (1) for transmitting electrical energy, in particular for a vehicle, having a contact housing (2), having at least one contact element (3) fixed to the contact housing (2), having at least one temperature sensor (10), and having a support plate (6), the support plate (6) having a top side (7) and a bottom side (8), the top side (7) transitioning into the bottom side (8) by a side wall (9), wherein a side wall (9) of the support plate (6) faces the contact element (3), and wherein a temperature sensor (10) is arranged on the side wall (9) of the support plate (6), and wherein the temperature sensor (10) is designed to detect a temperature of the contact element (3).

Description

Technical Field

[0001] The present invention relates to a high-current contact device for transmitting electrical energy, in particular for vehicles, and a method for manufacturing a high-current contact device. Background Art

[0002] DE 10 2020 116 533 A1 discloses a high-current contact device, in which the high-current contact device has an electrical contact element and a temperature sensor. The temperature sensor is located on the top side of the support plate and is spaced apart from the electrical contact element. The support plate is arranged perpendicular to the longitudinal axis of the contact element.

[0003] The object of the present invention is to provide a high-current contact device in which the measurement of the temperature of the electrical contact element is improved. In addition, the task of the present invention is to provide an improved method for manufacturing a high-current contact device. Summary of the Invention

[0004] The object of the present invention is achieved by the independent patent claims.

[0005] Advantageous improvements are given in the dependent claims.

[0006] A high-current contact device for transmitting electrical energy, in particular for vehicles, is proposed. The high-current contact device has a contact housing and at least one contact element fixed to the contact housing. A temperature sensor fixed to a support plate is also provided. The support plate has a top side and a bottom side, wherein the top side of the support plate transitions into the bottom side of the support plate through a side wall. The side wall of the support plate faces the contact element. The temperature sensor is fixed to the side wall of the support plate. The temperature sensor is designed to detect the temperature of the contact element. The arrangement of the temperature sensor on the side wall of the support plate and on the front side of the support plate facing the contact element means that the temperature sensor is arranged closer to the contact element. In addition, this arrangement means that a larger surface area of the temperature sensor is arranged closer to the electrical contact element. This improves the temperature transfer from the contact element to the temperature sensor. In addition, the support plate does not shield the temperature radiation. Additionally, this arrangement of the contact element means that the support plate with the contact element can have a low installation height and can thus be arranged in a space-saving manner near the contact element in the high-current contact device. This improves the temperature transfer between the contact element and the temperature sensor. The longitudinal axis of the contact element is preferably arranged parallel to the outer surface of at least a part of the contact element.

[0007] In one embodiment, the sidewalls of the support plate are oriented at an angle between 0 degrees and 45 degrees with respect to the longitudinal axis of the contact element. The sidewalls are preferably arranged parallel to the longitudinal axis of the contact element. The top and bottom sides of the support plate are preferably arranged parallel to each other, and the sidewalls are oriented at right angles to the top and bottom sides of the support plate. Depending on the selected embodiment, the sidewalls can also be oriented at different angles with respect to the top and / or bottom sides. Depending on the selected embodiment, the support plate can also be arranged at a different angle with respect to the longitudinal axis of the contact element. In this embodiment, although it can be arranged perpendicular to the top and bottom sides of the support plate, the sidewalls are not arranged parallel to the longitudinal axis of the contact element. However, due to the arrangement of the temperature sensor on the front side of the sidewall of the support plate, these arrangements also have improved heat transfer between the contact element and the temperature sensor compared to the arrangement of the temperature sensor on the top or bottom side of the support plate.

[0008] In a further embodiment, the support plate has a first electrical contact on the sidewall. The first electrical contact can be designed in the form of a conductive coating. Depending on the selected embodiment, the first electrical contact can be arranged in a recess in the sidewall. For example, the recess can be formed in a cross-section perpendicular to the plane of the sidewall having a circular segment shape. Additionally, the coating constituting the first electrical contact can be formed as a coating in the shape of a sleeve segment. The temperature sensor has a further electrical contact, wherein the second electrical contact is conductively connected to the first electrical contact of the support plate. For example, a conductive connecting material, in particular solder, is used for the conductive connection between the first and second electrical contacts.

[0009] In a further embodiment, the support plate has at least one recess on the sidewall, wherein the first electrical contact is arranged in the recess. The first electrical contact can have a conductive coating applied to the sidewall. The conductive coating is electrically connected to the electrical circuit of the support plate. A welding material can be provided for forming a conductive connection between the conductive coating of the support plate and the second electrical contact of the temperature sensor.

[0010] The first recess and the second recess can be arranged parallel to each other and preferably have a similar or identical shape.

[0011] In a further embodiment, the support plate has at least two recesses spaced apart from each other on the sidewall. The recesses are arranged laterally at a predetermined distance. The first electrical contact of the support plate is formed in the first recess. Another first electrical contact of the support plate is formed in the second recess. Depending on the selected embodiment, the two recesses can be formed in the base region of another recess mounted in the sidewall of the support plate.

[0012] In a further embodiment, the notch is guided along the thickness of the support plate starting from the top side and / or the bottom side of the support plate for at least a predetermined distance. The notch is preferably formed from the top side to the bottom side of the support plate. The electrical circuit of the support plate can be arranged on the top side of the support plate and extend up to the notch or into the notch, and in particular form an electrically conductive connection with the conductive coating of the first electrical contact of the support plate.

[0013] In a further embodiment, a soldering material is arranged on the side wall of the support plate, wherein the soldering material creates an electrically conductive connection between the first electrical contact of the support plate and the second electrical contact of the temperature sensor. Depending on the selected embodiment, the soldering material can in particular be arranged in the notch.

[0014] In a further embodiment, the side wall of the support plate has an additional notch, wherein the temperature sensor is at least partially arranged in the additional notch, and wherein the first electrical contact of the support plate is arranged in the additional notch. Depending on the selected embodiment, the temperature sensor can be completely arranged in the additional notch. Furthermore, two notches can be arranged in the additional notch for forming the first electrical contact of the support plate. In particular, the two notches of the first electrical contact are arranged in the base region of the additional notch. The base region is retracted from the side wall and is preferably arranged parallel to the side wall.

[0015] In a further embodiment, the support plate has a portion protruding from the side wall with a predetermined width. The thickness of this portion corresponds to the thickness of the carrier plate, and this portion is part of the carrier plate.

[0016] The temperature sensor is arranged on the side wall of the protruding portion. Due to the protruding portion, the thermal connection of the temperature sensor to other materials of the support plate is less. Thus, the temperature sensitivity of the temperature sensor for detecting the temperature of the contact element is improved.

[0017] In a further embodiment, a heat-conducting element is arranged between the electrical contact element and the temperature sensor. The heat-conducting element is designed to conduct heat from the contact element towards the temperature sensor. The heat-conducting element can in particular have an electrically insulating design. Furthermore, the heat-conducting element is made of a heat-conducting material. In a further embodiment, the heat-conducting element is thermally coupled to the contact element and, for example, directly abuts against the contact element. Additionally, in one embodiment, the heat-conducting element is thermally coupled to the temperature sensor and, for example, directly abuts against the temperature sensor. Providing the heat-conducting element improves the heat conduction between the contact element and the temperature sensor.

[0018] In one embodiment, the heat-conducting element has a recess, wherein the temperature sensor is at least partially arranged in the recess. Depending on the selected embodiment, the temperature sensor can also be completely arranged in the recess of the heat-conducting element. In particular, the temperature sensor can directly abut against the heat-conducting element at least by means of one side surface and in particular by means of several side surfaces. This arrangement of the temperature sensor in the heat-conducting element improves the thermal connection between the contact element and the temperature sensor. Depending on the selected embodiment, a section of the carrier plate can also be arranged in the recess of the heat-conducting element. This further improves the thermal connection between the contact element and the temperature sensor.

[0019] In a further embodiment, the electrical contact is arranged in a recess in the side wall, wherein the recess is formed in a circular segment shape in a cross-section perpendicular to the plane of the side wall.

[0020] In a further embodiment, there is provided an embodiment of a circuit for a temperature sensor on a support plate, wherein the finished circuit is connected to the temperature sensor via an electrical line.

[0021] The support plate can be designed as, for example, a printed circuit board.

[0022] An improved method for manufacturing a contact device is proposed, wherein first the temperature sensor is fixed to the side wall of the support plate, and two solder deposits are arranged on the top side of the support plate adjacent to the temperature sensor. The solder deposits are spaced laterally from each other. The solder deposits are melted by heat treatment, as a result of which the liquid solder of the solder deposits at the top side of the support plate flows into two separate solder flows on the side wall of the support plate. The liquid solder is thus introduced between the first electrical contact of the support plate and the second electrical contact of the temperature sensor. After cooling, the solidified solder forms an electrically conductive connection between the first electrical contact of the support plate and the second electrical contact of the temperature sensor.

[0023] The temperature sensor can be fixed, for example, using an adhesive to the support surface of the side wall. The support surface is preferably between two first contact portions of the support plate.

[0024] In a further embodiment, at least one recess is introduced into the side wall of the support plate before the temperature sensor is fixed to the side wall of the support plate. Preferably two recesses are introduced into the side wall, wherein each of the recesses is arranged to form the first electrical contact of the support plate. The recess can be formed, for example, in a circular segment shape in a cross-section perpendicular to the side wall.

[0025] The recess can extend a predetermined distance from the top side of the support plate towards the bottom side, in particular all the way to the bottom side.

[0026] Furthermore, additional recesses can preferably be formed in the side walls of the support plate. The recess for the first electrical contact can be introduced into the base region of the additional recess. The base region is retracted from the plane of the side wall. The additional recess is for receiving at least partially and in particular completely the temperature sensor. Description of the Drawings

[0027] The present invention will be explained in more detail below with reference to the drawings. In the drawings:

[0028] Figure 1 A schematic illustration of a high-current contact device having a contact housing, electrical contact elements, and a support plate with a temperature sensor is shown;

[0029] Figure 2 A schematic cross-sectional illustration of the support plate and the temperature sensor arranged on the front side wall of the support plate is shown;

[0030] Figure 3 A perspective illustration of the support plate and the temperature sensor according to Figure 1 is shown;

[0031] Figure 4 A further embodiment of the support plate is shown, in which two notches are provided on the side wall of the support plate for forming the first electrical contact;

[0032] Figure 5 A schematic illustration of the temperature sensor of the support plate conductively connected to Figure 4 by means of the first electrical contact is shown;

[0033] Figure 6 A schematic illustration of a further embodiment of the support plate is shown, which support plate has additional notches and two notches for forming the first electrical contact;

[0034] Figure 7 A schematic perspective illustration of a further embodiment of the support plate is shown, with the arrangement of the temperature sensor in the additional recess;

[0035] Figure 8 A further embodiment of the support plate having additional recesses is shown, in which the temperature sensor is arranged in the additional recess;

[0036] Figure 9 A further embodiment of the support plate having additional recesses is shown, in which the temperature sensor is arranged in the additional recess;

[0037] Figure 10 A further embodiment of the support plate is shown, in which the support plate has a protruding portion, and the temperature sensor is arranged on the side wall of the protruding portion;

[0038] Figure 11 A further illustration ofFigure 1 Schematic illustration of an arrangement in which a heat-conducting element is provided between a contact element and a temperature sensor;

[0039] Figure 12 shows Figure 11 a top view of the arrangement;

[0040] Figure 13 shows a schematic illustration of a further embodiment of a heat-conducting element with a support plate according to Figure 10 ;

[0041] Figure 14 shows a schematic illustration of a method for manufacturing a high-current contact device. Detailed Description of the Invention

[0042] Figure 1 shows a schematic illustration of a high-current contact device 1 having a contact housing 2, in which a conductive contact element 3 is fixed to the contact housing 2. In the illustrated embodiment, the contact element is in the form of a contact pin, the first end of which has an electrical connection area for a cable line. The contact element 3 has a longitudinal axis 5, as shown by the dashed line. For example, the contact element 3 has a cylindrical shape aligned along the longitudinal axis 5 at least in a sub-section. A support plate 6 is arranged laterally spaced from the contact element 3, and the support plate is also mechanically connected to the contact housing 2. The support plate 6 has a top side 7 and a bottom side 8. The top side 7 of the support plate 6 transitions into the bottom side 8 of the support plate 7 through a side wall 9. The side wall 9 faces the contact element 3. A temperature sensor 10 is arranged on the side wall 9. Arranging the temperature sensor 10 on the side wall 9 instead of on the top side 7 or the bottom side 8 means that the temperature sensor 10 is arranged closer to the contact element 3. In addition, the heat transfer from the contact element 3 to the temperature sensor 10 is not covered by the support plate 6.

[0043] In the illustrated exemplary embodiment, the support plate 6 is of a plate-like design. Depending on the selected embodiment, the support plate 6 can be of a strip-like or block-like design. In addition, in the illustrated embodiment, the top side 7 and the bottom side 8 are arranged parallel to each other. Depending on the selected embodiment, the top side 7 and the bottom side 8 can also be arranged at different angles to each other. In addition, in the illustrated embodiment, the plane of the side wall 9 is arranged perpendicular to the plane of the top side 7 and perpendicular to the plane of the bottom side 8. Depending on the selected embodiment, the plane of the side wall 9 can also be arranged at different angles to the top side and to the bottom side. The advantages of the proposed arrangement of the temperature sensor 10 on the front side wall 9 of the support plate 6 are also achieved when the side wall 9 is not arranged parallel to the longitudinal axis 5 of the contact element 3. For example, the side wall 9 and the longitudinal axis 5 of the contact element 3 can also be arranged at an angle of 0 to 45 degrees. An angle of 0 degrees indicates an arrangement in which the side wall 9 is parallel to the longitudinal axis 5.

[0044] Figure 2A schematic enlarged illustration shows the arrangement of the first electrical contact 11 on the side wall 9 of the support plate 6. The first electrical contact 11 is connected, for example, via an electrical circuit (not shown) arranged on or in the support plate 6 to an evaluation circuit. In addition, the temperature sensor 10 has a second electrical contact 12 which faces the first electrical contact 11 and is directly connected to the first electrical contact 11 or is connected to the first electrical contact 11 via a conductive connecting material.

[0045] Figure 3 A schematic perspective partial illustration of the support plate 6 shows the arrangement of the first electrical contact 11 on the side wall 9. In this illustration, the temperature sensor 10 is shown as transparent so that the arrangement of the first electrical contact 11 is more visible. The first electrical contact 11 is guided up to the top side 7 of the support plate 6 and extends over the central part of the side wall 9, in particular down to the bottom side 8 of the support plate 6. The first electrical contact 11 is made of a conductive material and is designed in particular as a coated surface.

[0046] Figure 4 A schematic perspective partial illustration shows an embodiment of the support plate 6 which has a first notch 14 and a second notch 15 on the side wall 9. In the embodiment shown, the notches 14, 15 are formed from the top side 7 to the bottom side 8. The notches have, for example, the shape of a cylindrical section. The notches 14, 15 are perpendicular to the side wall 9 in cross-section and thus preferably have a profile in the shape of a cylindrical section. Conductive coatings 16, 17 are arranged in the notches 14, 15 and are guided in the embodiment shown up to the top side 7 of the support plate 6 and are conductively connected to the electrical circuit 13. A support surface 18 represented by the side wall 9 is formed between the two notches 14, 15. In the exemplary embodiment shown, the support surface 18 is arranged in a plane with respect to the side wall 9.

[0047] Figure 5 Shows Figure 4 A schematic illustration of the support plate 6 in which the temperature sensor 10 is attached to the support surface 18 via a connecting layer 19. In addition, the temperature sensor 10 has two of the electrical contacts 12, each of the electrical contacts facing one of the notches 14, 15 and being connected via a conductive material to the conductive coatings 16, 17 of the first electrical contact 11. For example, the second electrical contact 12 of the temperature sensor 10 can be connected to the first electrical contact 11 of the support plate 6 via a welding material as the conductive connecting material 20. The connecting layer 19 can be formed, for example, from an adhesive material. Depending on the embodiment chosen, another connecting material can also be used to form the connecting layer 19.

[0048] Figure 6A schematic perspective view shows a further embodiment of the support plate 6, in which further notches 21 are introduced into the side wall 9. In the illustrated embodiment, the further notches 21 extend from the top side 7 to the bottom side 8 of the support plate 6. Depending on the selected embodiment, the further notches 21 may only be introduced into the side wall 9 without reaching the top side and / or the bottom side of the support plate.

[0049] The further notch 21 has a base region 22 arranged to retract from an adjacent region of the side wall 9. The base region 22 may be arranged perpendicular to the top side 7 and the bottom side 8 of the support plate. The first electrical contact 11 is arranged on the base region 22. Depending on the selected embodiment, the first electrical contact 11 may be formed in the notches 14, 15, as Figure 4 shown and schematically explained. For this purpose, the conductive coatings 16, 17 connected to the electrical line 13 are arranged in the notches 14, 15.

[0050] The further notch 21 preferably has dimensions such that the temperature sensor 10 can be at least partially, in particular completely, arranged in the further notch 21. Depending on the selected embodiment, when arranged in the further notch 21, the temperature sensor 10 may laterally protrude beyond the front side of the side wall 9. The electrical contact of the temperature sensor 10 arranged in the further notch 21 can be carried out, for example, as Figure 5 shown.

[0051] Figure 7 A schematic perspective view shows a further embodiment of the support plate with the further notch 21. In this embodiment, the further notch 21 again extends from the top side 7 to the bottom side 8 of the support plate 6. The notch 8 is formed in the form of two notches 23, 24 having a cylindrical segment shape, which are connected to each other via the contact surface 18. The support surface 18 retracts inwardly from the side wall 9. Thus, as schematically shown in the figure, at least a part of the temperature sensor 10 can be received in the further notch 21. The first recess 23 and the second recess 24 are provided with the conductive coatings 16, 17.

[0052] The support surface 18 does not have a conductive coating, so that the two coatings 16, 17 are electrically insulated from each other. In the illustrated embodiment, the coatings 16, 17 are guided to the top side 7, where the electrical line 13 connected to the coatings 16, 17 is arranged at the top side 7. The temperature sensor 10 is supported against the support surface 18 by means of the bottom side and is connected to the support surface, for example, via the connecting layer 19. In addition, the second electrical contact 12 of the temperature sensor 10 is connected to the coatings 16, 17 via a conductive material, in particular via a welding material, and the second electrical contact of the temperature sensor is also constructed on the bottom side of the temperature sensor 10.

[0053] Figure 8 Shows substantially according to Figure 7A further embodiment of the support plate 6 formed according to the embodiment, but in which the further notch 21 is formed deeper so that the temperature sensor 10 can be completely arranged in the further notch 21 without protruding beyond the side wall 9 on the front side.

[0054] Figure 9 Shows a further embodiment of the support plate 6 which is also substantially formed according to Figure 7 the embodiment, but in which the bearing surface 18 along the side wall 9 is designed to be longer than in the Figure 7 and Figure 8 embodiments. In other respects, the arrangement and fixation of the temperature sensor 10 are formed in the same manner as in the Figure 7 and Figure 8 embodiments.

[0055] Figure 10 Shows a further embodiment of the support plate 6, in which the support plate 6 has a protruding part 25. The protruding part 25 can be realized by two recesses 26, 27, for example. Also in this embodiment, the temperature sensor 10 is arranged on the front side of the side wall 9 of the support plate 6. An improved thermal insulation of the temperature sensor 10 with respect to the support plate 6 is achieved by means of the protruding part 25. The electrical contact between the temperature sensor 10 and the first electrical contact 11 of the support plate 6 can be realized according to the previously described embodiments of the electrical contact. In the illustrated embodiment, two notches 14, 15 are introduced into the side wall 9. The coatings 16, 17 of the electrical line 13 connected to the support plate 6 are arranged in the notches 14, 15. A non-conductive bearing surface 18 is formed between the coatings 16, 17, and the temperature sensor 10 is mechanically connected to this bearing surface, for example by means of a connecting layer 19. In addition, two of the electrical contacts 12 formed on the bottom side of the temperature sensor 10 are connected to the coatings 16, 17, for example via a connecting material 20 (in particular a welding material).

[0056] Figure 11 Shows Figure 1 a schematic illustration of the arrangement, in which a heat-conducting element 28 is additionally provided between the contact element 3 and the temperature sensor 10. The heat-conducting element 28 is formed of a heat-conducting material and is preferably electrically insulating. Depending on the selected embodiment, the heat-conducting element is thermally coupled to the contact element 3, in particular the heat-conducting element 28 directly bears against the contact element 3. In addition, the heat-conducting element 28 is thermally coupled to the temperature sensor, in particular the heat-conducting element 28 directly bears against the temperature sensor. Depending on the selected embodiment, the heat-conducting element 28 can also bear against the support plate 6. Depending on the selected embodiment, the heat-conducting element has a recess 29, in which the temperature sensor is at least partially arranged. Depending on the selected embodiment, the temperature sensor can also be completely arranged in the recess 29. In addition, at least a part of the support plate can also be arranged in the recess 29 of the heat-conducting element 28.

[0057] Figure 12 shows a schematic cross-section through the Figure 11 arrangement, in which it can be seen that the temperature sensor 10 and a part of the support plate 6 are arranged in the recess 29 of the heat-conducting element 28. In a similar manner, all embodiments of the described support plate can be thermally coupled to the heat-conducting element, at least partially abutted against the heat-conducting element, and in particular can be arranged in the recess 29 of the heat-conducting element. As already explained, the recess 29 can be omitted, and the heating element is only partially supported against the temperature sensor or is also arranged spaced apart from the temperature sensor 10.

[0058] Figure 13 shows a schematic illustration of a cross-section through a high-current contact device 1 designed substantially according to Figure 1 , but in which the support plate 6 is designed according to Figure 10 , and the protruding part 25 is arranged together with the temperature sensor 10 in the recess 29 of the heat-conducting element 28.

[0059] The heat-conducting element can also have an elastic design. For example, the heat-conducting element has at least one matrix material, which includes at least silicone and / or polyethylene and / or polyurethane and / or temperature-stable plastics. For example, the following particulate fillers can be embedded in the matrix material: copper, aluminum, silver, aluminum oxide, aluminum nitride, silicon oxide, silicon nitride, boron, boron nitride, conductive metals, non-conductive and heat-conductive metal compounds, preferably based on iron or non-ferrous metals. The heat-conducting element can have an elastic deformability of at least 1%, preferably 10% or up to 40%. The thermal conductivity of the heat-conducting element can be in the range from 0.9 watts per meter times Kelvin to 2 watts per meter times Kelvin. The heat-conducting element is ideally designed to be electrically insulating, such that no conductive connection is produced between the electrical contact element and the temperature sensor or the support plate even when the heat-conducting element abuts against the electrical contact element and the temperature sensor or the support plate.

[0060] The temperature sensor can be, for example, in the form of an SMD component, in particular an NTC element. For example, the high-current contact device can be arranged to transmit electrical energy (for example in the range from 10 kW to 300 kW) at a high current (for example between 3 amperes and 500 amperes). The electrical contact element gets hot during this process. The temperature sensor is used to monitor the heating of the electrical contact element. The temperature sensor can be connected to an evaluation circuit, which outputs a warning signal or outputs a shutdown signal, which is used to shut down the power line via the high-current contact device when the maximum temperature of the contact element is reached.

[0061] The contact housing is at least partially formed of an electrically insulating material, such that the contact element is electrically insulated.

[0062] Figure 14Shows a schematic method sequence for manufacturing a support plate for a high-current contact device. At program point 100, the support plate is provided with a first electrical contact on the side wall. Subsequently, at program point 110, a temperature sensor is fixed, for example by means of a connecting layer 19, to the bearing surface 18 between two electrical contact elements. On the top side of the support plate, two solder accumulations are arranged adjacent to the first notch 14 and the second notch 15. At the subsequent program point 120, the solder accumulations are melted, where the liquid solder flows into the notches 14, 15 and is arranged between the coating 16, 17 and the second electrical contact 12 of the temperature sensor 10. After the liquid solder has cooled, the solder creates an electrically conductive connection between the second electrical contact 12 of the temperature sensor 10 and the coating 16, 17, that is, the first electrical contact 11 of the support plate 6.

[0063] Then, the support plate 6 with the temperature sensor can be fixed to one of the described high-current contact devices, such as Figure 1 shown in or 11.

[0064] The described method applies to all the shown exemplary embodiments of the support plate.

[0065] List of reference numerals

[0066] 1 High-current contact device

[0067] 2 Contact housing

[0068] 3 Contact element

[0069] 4 First connection area

[0070] 5 Longitudinal axis

[0071] 6 Support plate

[0072] 7 Top side

[0073] 8 Bottom side

[0074] 9 Side wall

[0075] 10 Temperature sensor

[0076] 11 First electrical contact

[0077] 12 Second electrical contact

[0078] 13 Electrical circuit

[0079] 14 First notch

[0080] 15 Second notch

[0081] 16 First coating

[0082] 17 Second coating

[0083] 18 Support surface

[0084] 19 Connection layer

[0085] 20 Conductive connection material

[0086] 21 Further notch

[0087] 22 Base region

[0088] 23 First cylindrical-section-shaped recess

[0089] 24 Second cylindrical-section-shaped recess

[0090] 25 Portion

[0091] 26 First recess

[0092] 27 Second recess

[0093] 28 Heat-conducting element

[0094] 29 Recess

[0095] 30 Evaluation circuit

Claims

1. A high-current contact device (1) for transmitting electrical energy, in particular for use in vehicles, comprising a contact housing (2), at least one contact element (3) fixed to the contact housing (2), at least one temperature sensor (10) and a support plate (6), wherein the support plate (6) has a top side (7) and a bottom side (8), wherein the top side (7) transitions into the bottom side (8) via a side wall (9), wherein the side wall (9) of the support plate (6) faces the contact element (3), wherein the temperature sensor (10) is arranged on the side wall (9) of the support plate (6), and wherein the temperature sensor (10) is designed to detect the temperature of the contact element (3).

2. A high-current contact device (1) according to claim 1, wherein an angle of 0° to 45° is formed between the side wall (9) and the longitudinal axis (5) of the contact element (3), wherein in particular, the side wall is arranged parallel to the longitudinal axis (5) of the contact element (3).

3. A high-current contact device (1) according to claim 1 or 2, wherein the support plate (6) has a first electrical contact (11) on the side wall (9), wherein the first electrical contact (11) is particularly arranged in a recess (14, 15) of the side wall (9), wherein in particular, the recess (14, 15) is formed in a cross section in the shape of a circular segment perpendicular to the plane of the side wall (9), wherein the temperature sensor (10) has a second electrical contact (12), wherein the second electrical contact (12) is conductively connected to the first electrical contact (11).

4. A high-current contact device (1) according to any of the preceding claims, wherein the support plate (6) has at least one additional recess (21) on the side wall (9), wherein the first electrical contact (11) is arranged in the additional recess (21), wherein the first electrical contact has a conductive coating (16, 17) on the side wall (9), wherein the coating (16, 17) is connected to the electrical line (13) of the support plate (6), and wherein in particular, a conductive connecting material (20) is arranged between the coating (16, 17) and the second electrical contact of the temperature sensor (10) so as to produce a conductive connection.

5. A high-current contact device (1) according to any of the preceding claims, wherein the support plate (6) has at least two recesses (14, 15) on the side wall (9), wherein the recesses (14, 15) are laterally spaced apart from each other, wherein the corresponding first electrical contacts (11) of the support plate (6) are arranged in the recesses (14, 15), wherein in particular, the two recesses are formed in the base area of ​​the other recess (21).

6. A high-current contact device (1) according to any one of claims 4 or 5, wherein starting from the top side (7) and / or the bottom side (8) of the support plate (6), the recess (14, 15) extends at least a predetermined distance along the thickness of the support plate (6), wherein in particular, the recess (14, 15) extends from the top side (7) of the support plate (6) to the bottom side (8), wherein an electrical line (13) is arranged on the support plate (6), wherein the electrical line (13) extends up to the recess (14, 15) or extends into the recess (14, 15) and the electrical line (13) is connected to the first electrical contact (11).

7. A high-current contact device (1) according to any one of claims 3 to 6, wherein a welding material (20) is arranged on the side wall (9) of the support plate (6) and produces a conductive connection between the first electrical contact (11) of the support plate (6) and the second electrical contact (12) of the temperature sensor (10), wherein the welding material is particularly arranged in the recess (14, 15).

8. A high current contact device (1) according to any of the preceding claims, wherein the side wall (9) of the support plate (6) has an additional recess (21), wherein the temperature sensor (10) is at least partially arranged in the additional recess (21), wherein in particular, the temperature sensor (10) is completely arranged in the additional recess (21), and wherein the first electrical contact (11) is arranged in the additional recess (21).

9. The high-current contact device (1) according to any one of the preceding claims, wherein the support plate (6) has a lateral protrusion (25) with a predetermined width, wherein the temperature sensor (10) is arranged on a side wall (9) of the protrusion (25).

10. A high-current contact device (1) according to any of the preceding claims, wherein a heat-conducting element (28) is arranged between the contact element (3) and the temperature sensor (10), wherein the heat-conducting element (28) conducts heat from the contact element (3) in the direction of the temperature sensor (10), wherein the heat-conducting element (28) is particularly of electrically insulating design, wherein the heat-conducting element (28) is particularly thermally coupled to the contact element (3) and particularly bears against the contact element (3), and / or wherein the heat-conducting element (28) is particularly thermally coupled to the temperature sensor (10), particularly bears against the temperature sensor (10).

11. A high-current contact device (1) according to claim 10, wherein the heat-conducting element (28) has a recess (29), wherein the temperature sensor (10) is at least partially arranged in the recess (29), wherein the temperature sensor (10) is in particular completely arranged in the recess (29), and wherein in particular the heat-conducting element (28) is in direct contact with the surface of the temperature sensor (10). 12 . The high-current contact device according to claim 10 , wherein a section of the support plate is arranged in the recess of the heat conducting element.

13. A high-current contact device (1) according to any of the preceding claims, wherein the first electrical contact (11) is arranged in a recess (14, 15) of the side wall (9), wherein the recess (14, 15) is formed in a cross section perpendicular to the plane of the side wall (9) in the shape of a circular segment, wherein in particular the support plate (6) has an evaluation circuit (30) for the temperature sensor (10), wherein, In particular, the evaluation circuit (30) is connected to the temperature sensor (10) via an electrical line (13).

14. A method for producing a high-current contact device according to any one of the preceding claims, wherein: First, the temperature sensor is fixed to the side wall of the support plate, wherein two solder accumulation parts are arranged on the top side of the support plate adjacent to the temperature sensor, wherein the solder accumulation parts are melted by heat treatment, wherein the liquid solder of the solder accumulation parts flows from the top side of the support plate to the side wall of the support plate in two separate solder flows, wherein after the solder flowing between the side wall of the support plate and the electrical contact of the temperature sensor is cooled, the cooled solder forms a conductive connection between the first electrical contact of the support plate and the second electrical contact of the temperature sensor.

15. The method according to claim 14, wherein: Before fixing the temperature sensor to the side wall of the support plate, at least one recess is inserted into the side wall starting from the top side, wherein the recess is arranged to receive at least a part of at least one electrical contact of the support plate and / or the temperature sensor.

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