Process for simultaneously die-cutting two sets of material belt products

Abstract

The invention relates to a process for simultaneously die-cutting two sets of material belt products, which comprises the following specific steps: S1, material belt lamination: laminating a cover film, a second bonding layer, a first bonding layer, a bottom film and a protective film in sequence to form a material belt; s2, punching is conducted, specifically, the material belt is punched according to the shape of a cutting die on a die cutting machine, a first-stage crude product material belt is obtained, and a die cutting part semi-product A and a die cutting part semi-product B after die cutting are arranged on the first-stage crude product material belt at intervals; s3, waste discharging is conducted, specifically, waste discharging is conducted on frame waste of the first-stage crude product material belt, and a second-stage crude product material belt is obtained; s4, disassembling is conducted, specifically, the second-stage crude product material belt obtained after waste discharging is disassembled into a third-stage crude product material belt A and a third-stage crude product material belt B, the third-stage crude product material belt A is composed of a cover film, a second bonding layer, a first bonding layer and a bottom film, and the third-stage crude product material belt B is composed of a cover film, a second bonding layer, a first bonding layer and a protective film; and S5, rolling is conducted, specifically, the third-level crude product material belt A and the third-level crude product material belt B are rolled.

Description

Technical Field

[0001] The present invention relates to the field of die-cut part processing, and in particular to a process for simultaneously die-cutting two sets of tape products. Background Art

[0002] Die-cutting processing is to form specific spare parts from raw materials according to a predetermined shape through precision processing and cutting. Die-cutting processing is realized through processes such as compounding, die-cutting, waste discharging, and slicing.

[0003] Die-cut products are widely used in industrial fields such as the electronic and electrical industry, the automotive manufacturing industry, and the flat panel display industry. Especially for products that use laminated thin materials in the preparation process, such as insulating materials, shock-proof materials, heat-resistant materials, adhesive materials, dust-proof materials, shielding materials, etc., all require die-cutting technology for processing and manufacturing. Die-cut products have a very wide range of applications and are widely used in high-tech products such as electronics, electrical appliances, instruments, communication equipment, digital products, and medical devices, playing different roles in different products.

[0004] Such as Figure 1 and Figure 2 shown, in the products of the existing die-cutting industry, due to the limitations of the product structure, the waste material area of the main material is large, and the utilization rate of the main material is only 40%. Summary of the Invention

[0005] The purpose of the present invention is to provide a process for simultaneously die-cutting two sets of tape products. This process improves the material utilization rate, utilizes the materials in the original waste area, disassembles the product after one-pass punching into two one-pass semi-finished products, which can save the main material and improve efficiency.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A process for simultaneously die-cutting two sets of tape products, the specific steps are as follows:

[0008] S1. Tape lamination: Laminate the cover film, the second adhesive layer, the first adhesive layer, the bottom film, and the protective film in sequence to form a tape;

[0009] S2. Punching: Punch the tape according to the shape of the upper die of the die-cutting machine to obtain a first-level rough tape, and semi-finished die-cut parts A and semi-finished die-cut parts B after die-cutting are arranged at intervals on the first-level rough tape;

[0010] S3. Waste discharging: Discharge the border waste of the first-level rough tape to obtain a second-level rough tape;

[0011] S4. Disassembly: The secondary crude product tape after waste discharge is disassembled into a tertiary crude product tape A and a tertiary crude product tape B. The tertiary crude product tape A is composed of a cover film, a second adhesive layer, a first adhesive layer, and a bottom film. The tertiary crude product tape B is composed of a cover film, a second adhesive layer, a first adhesive layer, and a protective film.

[0012] S5. Rewinding: The tertiary crude product tape A and the tertiary crude product tape B are respectively rewound.

[0013] Furthermore, in step S1, the model of the protective film is HC-P006L, the model of the bottom film is YSPT503, the model of the first adhesive layer is CRT-DG100B, the model of the second adhesive layer is test 68767, and the model of the cover film is YSPT504.

[0014] Furthermore, in step S2, the die cutter is provided with a first cutting line and a second cutting line that match the die-cutting pattern.

[0015] Still further, the first cutting line and the second cutting line are distributed at intervals.

[0016] Still further, the first cutting line cuts to obtain a semi-finished die-cut product A, and the second cutting line cuts to obtain a semi-finished die-cut product B.

[0017] Still further, the cutting level of the first cutting line is the cover film, the second adhesive layer, and the first adhesive layer.

[0018] Still further, the cutting level of the second cutting line is the cover film, the second adhesive layer, the first adhesive layer, and the bottom film.

[0019] Furthermore, the die cutter is also provided with a positioning hole cutting line.

[0020] Still further, the cutting level of the positioning hole cutting line is the cover film, the second adhesive layer, the first adhesive layer, the bottom film, and the protective film.

[0021] Still further, the positioning hole cutting lines are provided at both the upper and lower ends of the first cutting line and the second cutting line.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] The process provided by the present invention adds a protective film under the original die-cut bottom film, skips the original product and adds another die-cut product in the gap. The cutting depth of the newly added product is increased by one level as a whole. After the waste is discharged, the tape is disassembled into two parts and then the next processes are carried out respectively. Using the disassembly process, one main material is disassembled into two, doubling the efficiency and material utilization rate; that is, the main material utilization rate increases from 40% before to 80% after the improvement, saving half of the main material, and the punching efficiency can be doubled. Brief Description of the Drawings

[0024] Figure 1 is the layout diagram of the die-cutting parts product in the prior art;

[0025] Figure 2 is the schematic diagram of the die-cutting layer in the prior art;

[0026] Figure 3 is the layout diagram of the die-cutting parts product in the present invention;

[0027] Figure 4 is the schematic diagram of the die-cutting layer in the present invention;

[0028] Figure 5 is the structural schematic diagram of the punching machine;

[0029] Figure 6 is the layout diagram of the die-cutting parts product after disassembling the material tape in the present invention.

[0030] Description of the drawing reference numerals: 1. protective film, 2. bottom film, 3. first adhesive layer, 4. second adhesive layer, 5. cover film, 6. positioning hole cutting line, 7. first punching cutting line, 8. second punching cutting line. Detailed Embodiment

[0031] The present invention will be described in detail below with reference to the drawings and specific embodiments. This embodiment is implemented on the premise of the technical solution of the present invention, and the detailed implementation manners and specific operation processes are given, but the protection scope of the present invention is not limited to the following embodiments.

[0032] It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0033] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0034] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] The following will describe in detail some embodiments of the present invention with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0036] Embodiment

[0037] Refer to Figures 3 to 6 , this embodiment provides a process for simultaneously die-cutting two sets of tape products, and the specific steps are as follows:

[0038] S1. Tape lamination: The cover film 5, the second adhesive layer 4, the first adhesive layer 3, the base film 2, and the protective film 1 are laminated in sequence to form a tape.

[0039] S2. Die-cutting: The tape is die-cut according to the shape of the cutting die on the die-cutting machine to obtain a primary rough tape, and semi-products A and B of the die-cut parts after die-cutting are arranged at intervals on the primary rough tape.

[0040] S3. Scrap removal: The border waste of the primary rough tape is removed to obtain a secondary rough tape.

[0041] S4. Disassembly: The secondary rough tape after scrap removal is disassembled into a tertiary rough tape A and a tertiary rough tape B. The tertiary rough tape A is composed of the cover film 5, the second adhesive layer 4, the first adhesive layer 3, and the base film 2, and the tertiary rough tape B is composed of the cover film 5, the second adhesive layer 4, the first adhesive layer 3, and the protective film 1.

[0042] S5. Rewinding: The tertiary rough tape A and the tertiary rough tape B are rewound respectively.

[0043] In this embodiment, in step S1, the model of the protective film 1 is HC-P006L, the model of the base film 2 is YSPT503, the model of the first adhesive layer 3 is CRT-DG100B, the model of the second adhesive layer 4 is test 68767, and the model of the cover film 5 is YSPT504.

[0044] In this embodiment, in step S2, the cutting die is provided with a first cutting knife line 7 and a second cutting knife line 8 that match the die-cut pattern.

[0045] In this embodiment, the first die-cutting line 7 and the second die-cutting line 8 are spaced apart.

[0046] In this embodiment, the first die-cutting line 7 cuts to obtain the semi-finished product A of the die-cut part, and the second die-cutting line 8 cuts to obtain the semi-finished product B of the die-cut part.

[0047] In this embodiment, the die-cutting level of the first die-cutting line 7 is the cover film 5, the second adhesive layer 4, and the first adhesive layer 3.

[0048] In this embodiment, the die-cutting level of the second die-cutting line 8 is the cover film 5, the second adhesive layer 4, the first adhesive layer 3, and the bottom film 2.

[0049] In this embodiment, a positioning hole die-cutting line 6 is further provided on the die mold.

[0050] In this embodiment, the die-cutting level of the positioning hole die-cutting line 6 is the cover film 5, the second adhesive layer 4, the first adhesive layer 3, the bottom film 2, and the protective film 1.

[0051] In this embodiment, positioning hole die-cutting lines 6 are provided at both the upper and lower ends of the first die-cutting line 7 and the second die-cutting line 8.

[0052] The above description of the embodiments is for the convenience of those of ordinary skill in the art to understand and use the invention. It is obvious that those skilled in the art can easily make various modifications to these embodiments and apply the general principles described herein to other embodiments without creative labor. Therefore, the present invention is not limited to the above embodiments, and the improvements and modifications made by those skilled in the art without departing from the scope of the present invention should be within the protection scope of the present invention.

Claims

1. A process for simultaneously die-cutting two sets of strip products, characterized in that, The specific steps are as follows: S1. Tape lamination: Laminate the cover film (5), the second adhesive layer (4), the first adhesive layer (3), the bottom film (2), and the protective film (1) in sequence to form a tape; S2. Die-cutting: Die-cut the tape according to the shape of the upper die of the die-cutting machine to obtain a first-level semi-finished tape, and semi-finished die-cut parts A and semi-finished die-cut parts B after die-cutting are arranged at intervals on the first-level semi-finished tape; S3. Scrap discharging: Discharge the border waste of the first-level semi-finished tape to obtain a second-level semi-finished tape; S4. Disassembly: Disassemble the second-level semi-finished tape after scrap discharging into a third-level semi-finished tape A and a third-level semi-finished tape B. The third-level semi-finished tape A is composed of the cover film (5), the second adhesive layer (4), the first adhesive layer (3), and the bottom film (2), and the third-level semi-finished tape B is composed of the cover film (5), the second adhesive layer (4), the first adhesive layer (3), and the protective film (1); S5. Rewinding: Rewind the third-level semi-finished tape A and the third-level semi-finished tape B respectively.

2. The process of simultaneously die-cutting two sets of strip products according to claim 1, characterized in that, In step S1, the model of the protective film (1) is HC-P006L, the model of the bottom film (2) is YSPT503, the model of the first adhesive layer (3) is CRT-DG100B, the model of the second adhesive layer (4) is test 68767, and the model of the cover film (5) is YSPT504.

3. The process of simultaneously die-cutting two sets of strip products according to claim 1, characterized in that, In step S2, a first die-cutting line (7) and a second die-cutting line (8) matching the die-cut pattern are provided on the upper die.

4. A process for simultaneously die-cutting two sets of strip products according to claim 3, characterized in that, The first die-cutting line (7) and the second die-cutting line (8) are distributed at intervals.

5. A process for simultaneously die-cutting two sets of strip products according to claim 3, characterized in that, The first die-cutting line (7) die-cuts to obtain semi-finished die-cut part A, and the second die-cutting line (8) die-cuts to obtain semi-finished die-cut part B.

6. A process for simultaneously die-cutting two sets of strip products according to claim 3, characterized in that The die-cutting level of the first die-cutting line (7) is the cover film (5), the second adhesive layer (4), and the first adhesive layer (3).

7. A process for simultaneously die-cutting two sets of strip products according to claim 3, characterized in that, The die-cutting level of the second die-cutting line (8) is the cover film (5), the second adhesive layer (4), the first adhesive layer (3), and the bottom film (2).

8. A process for simultaneously die-cutting two sets of strip products according to claim 3, characterized in that, A positioning hole line (6) is also provided on the upper die.

9. A process for simultaneously die-cutting two sets of strip products according to claim 8, characterized in that, The die-cutting level of the positioning hole line (6) is the cover film (5), the second adhesive layer (4), the first adhesive layer (3), the bottom film (2), and the protective film (1).

10. A process for simultaneously die-cutting two sets of strip products according to claim 8, characterized in that, Positioning hole lines (6) are provided at both the upper and lower ends of the first die-cutting line (7) and the second die-cutting line (8).

Images