Resin coating dissolving agent, preparation method and application thereof, and method for removing resin coating on surface of electrical equipment

Abstract

The invention provides a resin coating dissolving agent, a preparation method and application thereof, and a method for removing a resin coating on the surface of electrical equipment. The resin coating dissolving agent can efficiently and cheaply remove the resin coating on the surface of the electrical equipment; a cured resin coating such as an epoxy resin coating material is decomposed into small particles under the room temperature condition, the small resin particles can be recycled, and metal materials are recycled and reused while electric appliance parts are not damaged; especially, a good degradation effect is achieved on a resin coating in a large electronic component, the cured epoxy resin coating is rapidly decomposed through the rapid swelling effect of small organic molecules, and the larger the size is, the more remarkable the effect is. The process can be carried out at room temperature, does not need high-temperature and high-pressure conditions, and is simple in operation procedure and convenient for large-scale factory popularization and application. The dissolving agent has a good dissolving effect on different types of epoxy resin coatings, can be repeatedly decomposed for multiple times, and is high in repeatability and recycling performance.

Description

Technical Field

[0001] The present invention relates to the technical field of solvents, and particularly to a resin coating solvent, a preparation method and application thereof, and a method for removing a resin coating on the surface of an electrical device. Background Art

[0002] At present, a large amount of insulating resin materials are used in the encapsulation and pouring of electrical devices in industrial production because of their excellent mechanical properties, good corrosion resistance and good electrical insulation properties. However, the cured resin material has a stable three-dimensional network structure, resulting in the difficulty of recycling the encapsulated electronic devices and metal materials again, causing a large amount of resource waste and environmental pollution. The most common current treatment processes are mechanical crushing and landfill and high-temperature incineration. The non-degradability of the waste and the toxic gases generated by incineration will cause more serious secondary environmental pollution, and some available metal materials can only be forced to be recycled at a lower grade. Therefore, it is very necessary to find a method for efficiently and cheaply removing the resin coating on the surface of electronic devices.

[0003] For the degradation and recycling of resin-based composite materials in electronic device coatings, chemical methods are mainly used: solvent immersion decomposes the polymer chains into small molecules. Technical research on decomposing resin materials, such as: the prior art discloses a method for decomposing thermosetting epoxy resin or its composite materials in an aqueous phase, which decomposes thermosetting epoxy resin composite materials through high temperature and high pressure in an aqueous system; the prior art discloses a curing epoxy resin solvent and an application method thereof, which dissolves the cured epoxy resin by cooperating with a variety of organic substances under high temperature and alkaline conditions; the prior art discloses a method for decomposing thermosetting epoxy resin and its composite materials, which uses tetralin or decalin as the main solvent to pyrolyze epoxy resin composite materials in a closed high-temperature and high-pressure reaction kettle. All these methods require heating treatment of the reaction system, consuming a large amount of electric energy and generating some toxic substances at the same time; the prior art discloses a method for dissolving epoxy resin, which dissolves the resin under the conditions of reflux stirring with aromatic hydrocarbons and propylene glycol ethers as solvents. The process is relatively complex and the conditions are strict, which is not conducive to industrial production applications.

[0004] Based on the defects existing in the decomposition of the resin coating on the surface of current electronic devices, it is necessary to improve this. Summary of the Invention

[0005] Aiming at the above-mentioned shortcomings of the prior art, the present invention provides a resin coating solvent, a preparation method and application thereof, and a method for removing a resin coating on the surface of an electrical device to solve or at least partially solve the shortcomings existing in the prior art.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides a resin coating solvent, comprising the following components in parts by weight: 10-20 parts of an alcohol substance, 40-60 parts of dichloromethane, 4-12 parts of a phenolic substance, 6-10 parts of an ether substance, and 10-15 parts of an acid substance.

[0008] Preferably, the alcohol substance includes at least one of ethylene glycol, isopropyl alcohol, n-butanol, 3-methyl-1-butanol, isobutanol, isoamyl alcohol, 1,2-propanediol, 2-hexanol, hydroxyethanol, cyclohexanol, 1,3-propanediol, triethylene glycol, tetraethylene glycol, 1-pentanol, 2-butanol, 2-methyl-2-propanol, 2-methyl-2-butanol, 2,3-butanediol, benzyl alcohol.

[0009] Preferably, the phenolic substance includes at least one of p-cresol, xylenol, 4-nonylphenol, phenol, 3-methylphenol, 2-methylphenol, catechol, hydroquinone, 3-tert-butylphenol, 2,6-dimethylphenol, 3,4-dimethylphenol, 2,5-dimethylphenol.

[0010] Preferably, the ether substance includes at least one of ethylene glycol dimethyl ether, 2-diethyl ether, triethyl ether, propylene glycol butyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, ethyl propyl ether, ethyl ether, triethylene glycol monoethyl ether, diethylene glycol propyl ether, ethylene glycol butyl ether, triethylene glycol methyl ether, triethylene glycol ethyl ether.

[0011] Preferably, the acid substance includes at least one of acetic acid, sulfuric acid, phosphoric acid, nitric acid, perchloric acid, boric acid, formic acid, oxalic acid, benzoic acid, phenylacetic acid, phthalic acid, terephthalic acid, valeric acid, propionic acid, butyric acid, salicylic acid, oxalic acid, benzenesulfonic acid, malonic acid.

[0012] Preferably, the acid substance includes a mixture of glacial acetic acid, sulfuric acid, and phosphoric acid;

[0013] The mass ratio of the glacial acetic acid, sulfuric acid, and phosphoric acid is (6-8):(2-4):(2-3);

[0014] The mass fraction of the glacial acetic acid is 90-99.5%;

[0015] The mass fraction of the sulfuric acid is 90-98%;

[0016] The mass fraction of the phosphoric acid is 80-85%.

[0017] In a second aspect, the present invention further provides a method for preparing the resin coating solvent as described above, comprising the following steps:

[0018] Mix and stir the alcohol substance, ether substance, and phenolic substance, and then add dichloromethane and acid substance, and continue to mix to obtain the resin coating solvent.

[0019] In a third aspect, the present invention also provides an application of the resin coating solvent or the resin coating solvent prepared by the preparation method in removing the resin coating on the surface of electrical equipment.

[0020] In a fourth aspect, the present invention also provides a method for removing the resin coating on the surface of electrical equipment, comprising the following steps:

[0021] Immerse the electrical equipment with a resin coating on its surface in the resin coating solvent or the resin coating solvent prepared by the preparation method, and react to dissolve the resin coating.

[0022] Preferably, the reaction temperature is 20 - 25 °C.

[0023] The resin coating solvent of the present invention, its preparation method and application, and the method for removing the resin coating on the surface of electrical equipment have the following beneficial effects compared with the prior art:

[0024] The resin coating solvent of the present invention includes alcohol substances, dichloromethane, phenol substances, ether substances, and acid substances; the resin coating solvent of the present invention can efficiently and inexpensively remove the resin coating on the surface of electrical equipment; specifically, the electrical equipment is immersed in the resin coating solvent for a dissolution reaction. The resin coating solvent mainly contains organic solvents and is combined with a certain amount of acidic reagents; at room temperature, the cured resin coating such as epoxy resin coating material is decomposed into small particles. On the one hand, the resin small particles can be recycled, and secondly, the metal materials can be recycled and reused without damaging the electrical components; especially for the resin coating in large electronic components, it has a good degradation effect. The rapid swelling effect of organic small molecules makes the cured epoxy resin coating decompose quickly, and the larger the size, the more significant the effect. At present, the vast majority of processes are implemented on small sizes (thickness below 2 mm), and the industrialization of large component degradation is still a long way off. This process can be carried out at room temperature (20 - 25 °C) without high temperature and high pressure conditions, and the operation process is simple and convenient for large-scale factory promotion and application. Most of the solvent raw materials involved in the present invention are common organic solvents, which are easy to purchase and inexpensive. In addition, the present invention has a good dissolving effect on different types of epoxy resin coatings and can be repeatedly decomposed. The solubility and recyclability of the solvent are high. The recycled resin coating solvent can be simply distilled and purified in sequence according to the different boiling points of the organic substances to obtain it again, and the consumption of organic substances can be reduced to the lowest, greatly saving the industrial cost. This process has low requirements for reaction equipment, does not require additional stirring and heating devices, has less corrosion, and can reduce the equipment maintenance cost. Description of the Drawings

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0026] Figure 1 It is a sample of a reactor equipment component containing epoxy resin 618 coating material;

[0027] Figure 2 It is a diagram showing the state of the sample of the reactor equipment component containing epoxy resin 618 coating material after being placed in the resin coating solvent in Example 1 and the state of the supernatant after dissolution;

[0028] Figure 3 It is a sample of a reactor equipment component containing epoxy resin 6101 coating material;

[0029] Figure 4 It is a diagram showing the state of the sample of the reactor equipment component containing epoxy resin 6101 coating material after being placed in the resin coating solvent in Example 1 and the state of the supernatant after dissolution. Detailed implementation manners

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in combination with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0031] In the description of the present invention, it should be understood that the relationship indicating the orientation or position, such as "upper", etc., is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship when the product of the invention is usually placed, or the orientation or position relationship commonly understood by those skilled in the art. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0032] The description order of the following embodiments does not limit the preferred order of the embodiments. Additionally, in the description of this application, the term "comprising" means "including but not limited to". The various embodiments of the present invention may exist in the form of a range; it should be understood that the description in the form of a range is only for convenience and brevity and should not be construed as a rigid limitation on the scope of the present invention; therefore, it should be considered that the described range description has specifically disclosed all possible sub-ranges and individual values within that range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub-ranges such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., and individual numbers within the range, such as 1, 2, 3, 4, 5, and 6, and this applies regardless of the range. Additionally, whenever a numerical range is indicated herein, it means including any cited number (fraction or integer) within the indicated range.

[0033] An embodiment of the present application provides a resin coating solvent, comprising the following components in parts by weight: 10 - 20 parts of an alcohol substance, 40 - 60 parts of dichloromethane, 4 - 12 parts of a phenolic substance, 6 - 10 parts of an ether substance, and 10 - 15 parts of an acid substance.

[0034] In some embodiments, the alcohol substance includes at least one of ethylene glycol, isopropyl alcohol, n-butanol, 3-methyl-1-butanol, isobutanol, isoamyl alcohol, 1,2-propanediol, 2-hexanol, hydroxyethanol, cyclohexanol, 1,3-propanediol, triethylene glycol, tetraethylene glycol, 1-pentanol, 2-butanol, 2-methyl-2-propanol, 2-methyl-2-butanol, 2,3-butanediol, and benzyl alcohol.

[0035] In some embodiments, the phenolic substance includes at least one of p-cresol, xylenol, 4-nonylphenol, phenol, 3-methylphenol, 2-methylphenol, catechol, hydroquinone, 3-tert-butylphenol, 2,6-dimethylphenol, 3,4-dimethylphenol, and 2,5-dimethylphenol.

[0036] In some embodiments, the ether substance includes at least one of ethylene glycol dimethyl ether, 2-diethyl ether, triethyl ether, propylene glycol butyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, ethyl propyl ether, ethyl ether, triethylene glycol monoethyl ether, diethylene glycol propyl ether, ethylene glycol butyl ether, triethylene glycol methyl ether, and triethylene glycol ethyl ether.

[0037] In some embodiments, the acid substance includes at least one of acetic acid, sulfuric acid, phosphoric acid, nitric acid, perchloric acid, boric acid, formic acid, oxalic acid, benzoic acid, phenylacetic acid, phthalic acid, terephthalic acid, valeric acid, propionic acid, butyric acid, salicylic acid, oxalic acid, benzenesulfonic acid, and malonic acid.

[0038] In some embodiments, the acid substance includes a mixture of glacial acetic acid, sulfuric acid, and phosphoric acid;

[0039] The mass ratio of glacial acetic acid, sulfuric acid, and phosphoric acid is (6 - 8):(2 - 4):(2 - 3);

[0040] In some embodiments, the mass fraction of glacial acetic acid is 90 - 99.5%;

[0041] In some embodiments, the mass fraction of sulfuric acid is 90 - 98%;

[0042] In some embodiments, the mass fraction of phosphoric acid is 80 - 85%.

[0043] Based on the same inventive concept, the present invention also provides a method for preparing the above resin coating dissolving agent, comprising the following steps:

[0044] Mix and stir an alcohol substance, an ether substance, and a phenol substance, and then add dichloromethane and an acid substance, and continue to mix to obtain a resin coating dissolving agent.

[0045] In the method for preparing the resin coating dissolving agent of the present invention, after mixing the alcohol substance and the ether substance, add the phenol substance, stir to dissolve the phenol substance, and then add dichloromethane and an acid substance to obtain a resin coating dissolving agent.

[0046] The resin coating dissolving agent of the present invention can efficiently and inexpensively remove the resin coating on the surface of electrical equipment; specifically, soak the electrical equipment in the resin coating dissolving agent for a dissolution reaction. The resin coating dissolving agent mainly contains organic solvents and is also mixed with a certain amount of acidic reagents; at room temperature, the cured resin coating such as an epoxy resin coating material is decomposed into small particles. On the one hand, the resin small particles can be recycled, and secondly, the metal materials can be recycled and reused without damaging the electrical components; especially for the resin coating in large electronic components, it has a good degradation effect. The rapid swelling effect of organic small molecules causes the cured epoxy resin coating to decompose quickly, and the larger the size, the more significant the effect. At present, the vast majority of processes are implemented on small sizes (thickness below 2 mm), and the industrialization of the degradation of large components is still far away. This process can be carried out at room temperature (20 - 25 °C) without high temperature and high pressure conditions, and the operation process is simple and convenient for large-scale factory promotion and application. Most of the solvent raw materials involved in the present invention are common organic solvents, which are easy to purchase and inexpensive. In addition, the present invention has a good dissolving effect on different types of epoxy resin coatings and can be repeatedly decomposed. The dissolving agent has high repeatability and recyclability. The recycled resin coating dissolving agent can be simply distilled and purified in sequence according to the different boiling points of the organic substances to obtain it again, and the consumption of organic substances can be reduced to the lowest, greatly saving the industrial cost. This process has low requirements for reaction equipment, does not require additional stirring and heating devices, has less corrosion, and can reduce the equipment maintenance cost.

[0047] Based on the same inventive concept, the present invention also provides an application of the above resin coating solvent or the resin coating solvent prepared by the above preparation method in removing the resin coating on the surface of electrical equipment.

[0048] Based on the same inventive concept, the present invention also provides a method for removing the resin coating on the surface of electrical equipment, comprising the following steps:

[0049] Immerse the electrical equipment with a resin coating on its surface in the above resin coating solvent or the resin coating solvent prepared by the above preparation method, and react to dissolve the resin coating.

[0050] In some embodiments, the reaction temperature is 20 - 25 °C.

[0051] The method for removing the resin coating on the surface of electrical equipment according to the present invention immerses the electrical equipment with a resin coating on its surface in the resin coating solvent, reacts for a period of time under room temperature (20 - 25 °C) conditions to dissolve the resin coating; after the reaction is completed, it is washed with acetone and water, filtered and dried, and the available metal materials are screened out.

[0052] The following further illustrates the resin coating solvent of the present application, its preparation method and application, and the method for removing the resin coating on the surface of electrical equipment with specific examples. This part further illustrates the content of the present invention in combination with specific examples, but should not be construed as a limitation to the present invention. Unless otherwise specified, the technical means adopted in the examples are conventional means well-known to those skilled in the art. Unless otherwise specified, the reagents, methods and equipment used in the present invention are conventional reagents, methods and equipment in the art.

[0053] Example 1

[0054] The present application example provides a resin coating solvent, comprising the following weight components: 18 g of ethylene glycol, 56 g of dichloromethane, 8 g of p-cresol, 6 g of ethylene glycol dimethyl ether, and 12 g of acid substances; the acid substances include a mixture of glacial acetic acid, sulfuric acid, and phosphoric acid, and the mass ratio of glacial acetic acid (mass concentration 99.5%), sulfuric acid (mass concentration 98%), and phosphoric acid (mass concentration 85%) is 7:3:2.

[0055] The preparation method of the above resin coating solvent comprises the following steps:

[0056] Take a 100 ml beaker, add 8 g of p-cresol, 18 g of ethylene glycol, and 6 g of ethylene glycol dimethyl ether in sequence. After the p-cresol is completely dissolved under stirring, add 56 g of dichloromethane, and finally add 12 g of acid substances, and then stir for 30 min to obtain the resin coating solvent.

[0057] This example also provides a method for removing the resin coating on the surface of electrical equipment, comprising:

[0058] Immerse the sample of the reactor equipment component with a resin coating in the resin coating solvent of Example 1, react at room temperature, the resin coating on the surface of the reactor can be completely dissolved, after the reaction is completed, wash with acetone and water, filter and dry, and screen out the available metal materials; among them, the volume ratio of the resin coating in the sample of the reactor equipment component is about 60%, and other metal materials are mainly aluminum. The thickness of the sample of the reactor equipment component is 20 mm, the length is 50 mm, and the width is 20 mm; the resin coating is an epoxy resin 618 coating.

[0059] Example 2

[0060] The resin coating solvent provided by the embodiment of the present application includes the following weight components: 16 g of ethylene glycol, 56 g of dichloromethane, 8 g of p-cresol, 10 g of ethylene glycol dimethyl ether, and 10 g of acid substances; the acid substances include a mixture of glacial acetic acid, sulfuric acid, and phosphoric acid, and the mass ratio of glacial acetic acid (mass concentration 99.5%), sulfuric acid (mass concentration 98%), and phosphoric acid (mass concentration 85%) is 6:2:2.

[0061] The preparation method of the above resin coating solvent includes the following steps:

[0062] Take a 100 ml beaker, add 8 g of p-cresol, 16 g of ethylene glycol, and 10 g of ethylene glycol dimethyl ether in sequence. After the p-cresol is completely dissolved under stirring, add 56 g of dichloromethane, and finally add 10 g of acid substances, and then stir for 30 min to obtain the resin coating solvent.

[0063] This embodiment also provides a method for removing the resin coating on the surface of electrical equipment, including:

[0064] Immerse the sample of the reactor equipment component with a resin coating in the resin coating solvent of Example 2, react at room temperature, the resin coating on the surface of the reactor can be completely dissolved, after the reaction is completed, wash with acetone and water, filter and dry, and screen out the available metal materials; among them, the volume ratio of the resin coating in the sample of the reactor equipment component is about 60%, and other metal materials are mainly aluminum. The thickness of the sample of the reactor equipment component is 20 mm, the length is 50 mm, and the width is 20 mm; the resin coating is an epoxy resin 618 coating.

[0065] Example 3

[0066] The embodiment of the present application provides a resin coating solvent, which comprises the following components by weight: 16 g of ethylene glycol, 56 g of dichloromethane, 10 g of p-cresol, 6 g of ethylene glycol dimethyl ether, and 12 g of acid substances; the acid substances include a mixture of glacial acetic acid, sulfuric acid, and phosphoric acid, and the mass ratio of glacial acetic acid (mass concentration 99.5%), sulfuric acid (mass concentration 98%), and phosphoric acid (mass concentration 85%) is 7:3:2.

[0067] The preparation method of the above resin coating solvent comprises the following steps:

[0068] Take a 100 ml beaker, add 10 g of p-cresol, 16 g of ethylene glycol, and 6 g of ethylene glycol dimethyl ether in sequence. After the p-cresol is completely dissolved under stirring, add 56 g of dichloromethane, and finally add 12 g of acid substances, and then stir for 30 min to obtain the resin coating solvent.

[0069] This embodiment also provides a method for removing the resin coating on the surface of electrical equipment, which comprises:

[0070] Immerse the sample of the reactor equipment component with the resin coating in the resin coating solvent of Example 3 and react at room temperature. The resin coating on the surface of the reactor can be completely dissolved. After the reaction is completed, wash with acetone and clean water, filter and dry, and screen out the available metal materials; wherein, the volume ratio of the resin coating in the sample of the reactor equipment component is about 60%, and the other metal materials are mainly aluminum. The thickness of the sample of the reactor equipment component is 20 mm, the length is 50 mm, and the width is 20 mm; the resin coating is an epoxy resin 618 coating.

[0071] Example 4

[0072] The embodiment of the present application provides a resin coating solvent, which comprises the following components by weight: 13 g of ethylene glycol, 56 g of dichloromethane, 8 g of p-cresol, 8 g of ethylene glycol dimethyl ether, and 15 g of acid substances; the acid substances include a mixture of glacial acetic acid, sulfuric acid, and phosphoric acid, and the mass ratio of glacial acetic acid (mass concentration 99.5%), sulfuric acid (mass concentration 98%), and phosphoric acid (mass concentration 85%) is 8:4:3.

[0073] The preparation method of the above resin coating solvent comprises the following steps:

[0074] Take a 100 ml beaker, add 8 g of p-cresol, 13 g of ethylene glycol, and 8 g of ethylene glycol dimethyl ether in sequence. After the p-cresol is completely dissolved under stirring, add 56 g of dichloromethane, and finally add 15 g of acid substances, and then stir for 30 min to obtain the resin coating solvent.

[0075] This embodiment also provides a method for removing the resin coating on the surface of electrical equipment, which comprises:

[0076] The sample of the reactor equipment component with a resin coating is immersed in the resin coating solvent of Example 4 and reacts at room temperature. The resin coating on the surface of the reactor can be completely dissolved. After the reaction is completed, it is washed with acetone and water, filtered and dried to screen out the available metal materials. Among them, the volume ratio of the resin coating in the sample of the reactor equipment component is about 60%. The other metal materials are mainly aluminum. The thickness of the sample of the reactor equipment component is 20 mm, the length is 50 mm, and the width is 20 mm. The resin coating is an epoxy resin 618 coating.

[0077] Example 5

[0078] The resin coating solvent provided by the embodiment of the present application includes the following weight components: 20 g of ethylene glycol, 50 g of dichloromethane, 8 g of p-cresol, 10 g of ethylene glycol dimethyl ether, and 12 g of acid substances. The acid substances include a mixture of glacial acetic acid, sulfuric acid, and phosphoric acid. The mass ratio of glacial acetic acid (mass concentration 99.5%), sulfuric acid (mass concentration 98%), and phosphoric acid (mass concentration 85%) is 7:3:2.

[0079] The preparation method of the above resin coating solvent includes the following steps:

[0080] Take a 100 ml beaker and add 8 g of p-cresol, 20 g of ethylene glycol, and 10 g of ethylene glycol dimethyl ether in sequence. After the p-cresol is completely dissolved under stirring, add 50 g of dichloromethane, and finally add 12 g of acid substances, and then stir for 30 min to obtain the resin coating solvent.

[0081] This embodiment also provides a method for removing the resin coating on the surface of electrical equipment, including:

[0082] The sample of the reactor equipment component with a resin coating is immersed in the resin coating solvent of Example 5 and reacts at room temperature. The resin coating on the surface of the reactor can be completely dissolved. After the reaction is completed, it is washed with acetone and water, filtered and dried to screen out the available metal materials. Among them, the volume ratio of the resin coating in the sample of the reactor equipment component is about 60%. The other metal materials are mainly aluminum. The thickness of the sample of the reactor equipment component is 20 mm, the length is 50 mm, and the width is 20 mm. The resin coating is an epoxy resin 618 coating.

[0083] Example 6

[0084] The resin coating solvent provided by the embodiment of the present application includes the following weight components: 18 g of ethylene glycol, 50 g of dichloromethane, 12 g of p-cresol, 10 g of ethylene glycol dimethyl ether, and 10 g of acid substances. The acid substances include a mixture of glacial acetic acid, sulfuric acid, and phosphoric acid. The mass ratio of glacial acetic acid (mass concentration 99.5%), sulfuric acid (mass concentration 98%), and phosphoric acid (mass concentration 85%) is 6:2:2.

[0085] The preparation method of the above resin coating solvent comprises the following steps:

[0086] Take a 100 ml beaker, and sequentially add 12 g of p-cresol, 18 g of ethylene glycol, 10 g of ethylene glycol dimethyl ether. After the p-cresol is completely dissolved under stirring, add 50 g of dichloromethane, and finally add 10 g of an acid substance, and then stir for 30 min to obtain the resin coating solvent.

[0087] This embodiment also provides a method for removing the resin coating on the surface of an electrical device, including:

[0088] Immerse the reactor equipment component sample with a resin coating in the resin coating solvent of Example 6, react under room temperature conditions, the resin coating on the surface of the reactor can be completely dissolved, and after the reaction is completed, wash with acetone and water, filter and dry to screen out the available metal materials; wherein, the volume ratio of the resin coating in the reactor equipment component sample is about 60%, the other metal materials are mainly aluminum, the thickness of the reactor equipment component sample is 20 mm, the length is 50 mm, and the width is 20 mm; the resin coating is an epoxy resin 618 coating.

[0089] Example 7

[0090] The resin coating solvent provided by the embodiment of the present application includes the following weight components: 17 g of ethylene glycol, 50 g of dichloromethane, 10 g of p-cresol, 8 g of ethylene glycol dimethyl ether, 15 g of an acid substance; the acid substance includes a mixture of glacial acetic acid, sulfuric acid, and phosphoric acid, and the mass ratio of glacial acetic acid (mass concentration 99.5%), sulfuric acid (mass concentration 98%), and phosphoric acid (mass concentration 85%) is 8:4:3.

[0091] The preparation method of the above resin coating solvent comprises the following steps:

[0092] Take a 100 ml beaker, and sequentially add 10 g of p-cresol, 17 g of ethylene glycol, 8 g of ethylene glycol dimethyl ether. After the p-cresol is completely dissolved under stirring, add 50 g of dichloromethane, and finally add 15 g of an acid substance, and then stir for 30 min to obtain the resin coating solvent.

[0093] This embodiment also provides a method for removing the resin coating on the surface of an electrical device, including:

[0094] Soak the sample of the reactor equipment component with a resin coating in the resin coating solvent of Example 7 and react at room temperature. The resin coating on the surface of the reactor can be completely dissolved. After the reaction is completed, wash it with acetone and water, filter and dry it to screen out the available metal materials. Among them, the volume ratio of the resin coating in the sample of the reactor equipment component is about 60%. The other metal materials are mainly aluminum. The thickness of the sample of the reactor equipment component is 20 mm, the length is 50 mm, and the width is 20 mm. The resin coating is an epoxy resin 618 coating.

[0095] Example 8

[0096] The resin coating solvent provided by the embodiment of the present application includes the following weight components: 19 g of ethylene glycol, 50 g of dichloromethane, 10 g of p-cresol, 6 g of ethylene glycol dimethyl ether, and 15 g of acid substances; the acid substances include a mixture of glacial acetic acid, sulfuric acid, and phosphoric acid. The mass ratio of glacial acetic acid (mass concentration 99.5%), sulfuric acid (mass concentration 98%), and phosphoric acid (mass concentration 85%) is 8:4:3.

[0097] The preparation method of the above resin coating solvent includes the following steps:

[0098] Take a 100 ml beaker and add 10 g of p-cresol, 19 g of ethylene glycol, and 6 g of ethylene glycol dimethyl ether in sequence. After the p-cresol is completely dissolved under stirring, add 50 g of dichloromethane, and finally add 15 g of acid substances, and then stir for 30 min to obtain the resin coating solvent.

[0099] This embodiment also provides a method for removing the resin coating on the surface of electrical equipment, including:

[0100] Soak the sample of the reactor equipment component with a resin coating in the resin coating solvent of Example 8 and react at room temperature. The resin coating on the surface of the reactor can be completely dissolved. After the reaction is completed, wash it with acetone and water, filter and dry it to screen out the available metal materials. Among them, the volume ratio of the resin coating in the sample of the reactor equipment component is about 60%. The other metal materials are mainly aluminum. The thickness of the sample of the reactor equipment component is 20 mm, the length is 50 mm, and the width is 20 mm. The resin coating is an epoxy resin 618 coating.

[0101] Example 9

[0102] The resin coating solvent provided by the embodiment of the present application includes the following weight components: 12 g of ethylene glycol, 60 g of dichloromethane, 8 g of p-cresol, 10 g of ethylene glycol dimethyl ether, and 10 g of acid substances; the acid substances include a mixture of glacial acetic acid, sulfuric acid, and phosphoric acid. The mass ratio of glacial acetic acid (mass concentration 99.5%), sulfuric acid (mass concentration 98%), and phosphoric acid (mass concentration 85%) is 6:2:2.

[0103] The preparation method of the above resin coating solvent comprises the following steps:

[0104] Take a 100 ml beaker, add 8 g of p-cresol, 12 g of ethylene glycol, and 10 g of ethylene glycol dimethyl ether in sequence. After the p-cresol is completely dissolved under stirring, add 60 g of dichloromethane, and finally add 10 g of an acid substance, then stir for 30 min to obtain the resin coating solvent.

[0105] This embodiment also provides a method for removing the resin coating on the surface of an electrical device, including:

[0106] Immerse the reactor equipment component sample with a resin coating in the resin coating solvent of Example 9 and react at room temperature. The resin coating on the surface of the reactor can be completely dissolved. After the reaction is completed, wash with acetone and water, filter and dry, and screen out the available metal materials. Among them, the volume ratio of the resin coating in the reactor equipment component sample is about 60%. The other metal materials are mainly aluminum. The thickness of the reactor equipment component sample is 20 mm, the length is 50 mm, and the width is 20 mm. The resin coating is an epoxy resin 618 coating.

[0107] Example 10

[0108] The resin coating solvent provided by the embodiment of the present application includes the following weight components: 14 g of ethylene glycol, 60 g of dichloromethane, 10 g of p-cresol, 6 g of ethylene glycol dimethyl ether, and 10 g of an acid substance. The acid substance includes a mixture of glacial acetic acid, sulfuric acid, and phosphoric acid. The mass ratio of glacial acetic acid (mass concentration 99.5%), sulfuric acid (mass concentration 98%), and phosphoric acid (mass concentration 85%) is 6:2:2.

[0109] The preparation method of the above resin coating solvent comprises the following steps:

[0110] Take a 100 ml beaker, add 10 g of p-cresol, 14 g of ethylene glycol, and 6 g of ethylene glycol dimethyl ether in sequence. After the p-cresol is completely dissolved under stirring, add 60 g of dichloromethane, and finally add 10 g of an acid substance, then stir for 30 min to obtain the resin coating solvent.

[0111] This embodiment also provides a method for removing the resin coating on the surface of an electrical device, including:

[0112] The sample of the reactor equipment component with a resin coating was immersed in the resin coating solvent of Example 10 and reacted at room temperature. The resin coating on the surface of the reactor could be completely dissolved. After the reaction was completed, it was washed with acetone and water, filtered and dried to screen out the available metal materials. Among them, the volume ratio of the resin coating in the sample of the reactor equipment component was about 60%. The other metal materials were mainly aluminum. The thickness of the sample of the reactor equipment component was 20 mm, the length was 50 mm, and the width was 20 mm. The resin coating was an epoxy resin 618 coating.

[0113] Example 11

[0114] The resin coating solvent provided in the embodiment of the present application includes the following weight components: 10 g of ethylene glycol, 60 g of dichloromethane, 10 g of p-cresol, 8 g of ethylene glycol dimethyl ether, and 12 g of acid substances. The acid substances include a mixture of glacial acetic acid, sulfuric acid, and phosphoric acid. The mass ratio of glacial acetic acid (mass concentration 99.5%), sulfuric acid (mass concentration 98%), and phosphoric acid (mass concentration 85%) is 7:3:2.

[0115] The preparation method of the above resin coating solvent includes the following steps:

[0116] Take a 100 ml beaker and add 10 g of p-cresol, 10 g of ethylene glycol, and 8 g of ethylene glycol dimethyl ether in sequence. After the p-cresol is completely dissolved under stirring, add 60 g of dichloromethane, and finally add 12 g of acid substances, and then stir for 30 min to obtain the resin coating solvent.

[0117] This embodiment also provides a method for removing the resin coating on the surface of electrical equipment, including:

[0118] The sample of the reactor equipment component with a resin coating was immersed in the resin coating solvent of Example 11 and reacted at room temperature. The resin coating on the surface of the reactor could be completely dissolved. After the reaction was completed, it was washed with acetone and water, filtered and dried to screen out the available metal materials. Among them, the volume ratio of the resin coating in the sample of the reactor equipment component was about 60%. The other metal materials were mainly aluminum. The thickness of the sample of the reactor equipment component was 20 mm, the length was 50 mm, and the width was 20 mm. The resin coating was an epoxy resin 618 coating.

[0119] Performance test

[0120] According to the method for removing the resin coating on the surface of electrical equipment in Examples 1 to 11, the solubility of different resin coating solvents in Examples 1 to 11 in the resin coating, the dissolution time, whether they are corrosive to metals (aluminum), and the number of reusable times were tested. The results are shown in Table 1 below. The number of reusable times refers to: soaking the sample of the reactor equipment component with the resin coating in the resin coating solvent. After the soaking treatment is completed, the supernatant is taken, and the same dissolution test is carried out again. After repeating the cycle many times, the number of reusable times is counted. The solubility refers to the degree of dissolution of the resin coating solvent in the resin coating when it is used for the first time.

[0121] Table 1 - Dissolution performance of resin coating solvents in Examples 1 to 11

[0122] Example Solubility Dissolution time (h) Corrosivity to metal Number of reusable times Example 1 Completely 3 No corrosion 4 Example 2 Completely 4 No corrosion 4 Example 3 Partially 4.2 No corrosion 3 Example 4 Completely 3.5 Corrosion 4 Example 5 Incompletely 7.2 No corrosion 1 Example 6 Incompletely 8 Corrosion 1 Example 7 Partially 5.5 Corrosion 2 Example 8 Incompletely 6 No corrosion 1 Example 9 Incompletely 6.4 No corrosion 1 Example 10 Incompletely 7 No corrosion 1 Example 11 Completely 5.5 No corrosion 2

[0123] (Note: In Table 1, "complete" means that the resin coating material is completely dissolved without particles; "partial" means that the resin coating material can be dissolved and there are still particles, and the metal material in the structure can be peeled off; "incomplete" means that the resin coating material cannot be peeled off from the metal material)

[0124] It can be seen from Table 1 that the resin coating solvent in Example 1 can completely dissolve the resin coating, and the dissolution time is at least 3h at the lowest, and it is not corrosive to metals, and the number of reusable times can reach up to 4 times at the highest; the resin coating solvent in Example 1 has the highest dissolution performance.

[0125] Furthermore, different block epoxy resin coating materials were respectively soaked in the resin coating solvent in Example 1 and reacted at room temperature, and the time required for decomposition was observed. The results are shown in Table 2 below. Among them, the epoxy resin coating materials used are epoxy resin 618 coating material, epoxy resin 6101 coating material, epoxy resin 638 coating material, epoxy resin 601 coating material, epoxy resin 604 coating material, and epoxy resin 665 coating material. The length, width, and height of the epoxy resin coating material are all 10mm.

[0126] Table 2 - Dissolution time of resin coating solvent for different epoxy resin coating materials

[0127] Dissolution time (h) Solubility Epoxy resin 618 coating material 1 Completely Epoxy resin 6101 coating material 2 Completely Epoxy resin 638 coating material 2 Completely Epoxy resin 601 coating material 6 Completely Epoxy resin 604 coating material 8 Completely Epoxy resin 665 coating material 4 Completely

[0128] It can be seen from Table 2 that the resin coating solvent in Example 1 has the best dissolution effect on the epoxy resin 618 coating material.

[0129] Figure 1 is the sample of the reactor equipment component containing the epoxy resin 618 coating material; Figure 2It is a diagram showing the state of a sample of a reactor equipment component containing an epoxy resin 618 coating material after being placed in the resin coating solvent in Example 1 and the state of the supernatant after dissolution.

[0130] As can be seen from Figure 2 , after the sample is dissolved by the resin coating solvent, some cellulose materials and metal (aluminum) remain. The metal (aluminum) is not corroded, and the supernatant of the resin coating solvent after dissolution is light red.

[0131] Figure 3 It is a sample of a reactor equipment component containing an epoxy resin 6101 coating material; Figure 4 It is a diagram showing the state of a sample of a reactor equipment component containing an epoxy resin 6101 coating material after being placed in the resin coating solvent in Example 1 and the state of the supernatant after dissolution.

[0132] As can be seen from Figure 4 , after the sample is dissolved by the resin coating solvent, what remains is cellulose-coated material and metal (aluminum). The metal (aluminum) is not corroded, and the supernatant of the resin coating solvent after dissolution is yellow.

[0133] The above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A resin coating dissolving agent, characterized in that: The invention comprises the following components in parts by weight: 10 to 20 parts of alcohol substances, 40 to 60 parts of dichloromethane, 4 to 12 parts of phenol substances, 6 to 10 parts of ether substances and 10 to 15 parts of acid substances.

2. The resin coating dissolving agent according to claim 1, characterized in that The alcohol substance includes at least one of ethylene glycol, isopropanol, n-butanol, 3-methyl-1-butanol, isobutanol, isopentanol, 1,2-propylene glycol, 2-hexanol, hydroxyethanol, cyclohexanol, 1,3-propylene glycol, triethylene glycol, tetraethylene glycol, 1-pentanol, 2-butanol, 2-methyl-2-propanol, 2-methyl-2-butanol, 2,3-butanediol, and benzyl alcohol.

3. The resin coating dissolving agent according to claim 1, characterized in that The phenolic substances include at least one of p-cresol, xylenol, 4-nonylphenol, phenol, 3-methylphenol, 2-methylphenol, catechol, hydroquinone, 3-tert-butylphenol, 2,6-dimethylphenol, 3,4-dimethylphenol and 2,5-dimethylphenol.

4. The resin coating dissolving agent according to claim 1, characterized in that The ether substance includes at least one of ethylene glycol dimethyl ether, 2-diethyl ether, triethyl ether, propylene glycol butyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, ethyl propyl ether, ethyl ether, triethylene glycol monoethyl ether, diethylene glycol propyl ether, ethylene glycol butyl ether, triethylene glycol methyl ether, and triethylene glycol ethyl ether.

5. The resin coating dissolving agent according to claim 1, characterized in that The acid substance includes at least one of acetic acid, sulfuric acid, phosphoric acid, nitric acid, perchloric acid, boric acid, formic acid, oxalic acid, benzoic acid, phenylacetic acid, phthalic acid, terephthalic acid, valeric acid, propionic acid, butyric acid, salicylic acid, oxalic acid, benzoic acid, and malonic acid.

6. The resin coating dissolving agent according to claim 5, characterized in that The acid substance includes a mixture of glacial acetic acid, sulfuric acid and phosphoric acid; The mass ratio of glacial acetic acid, sulfuric acid and phosphoric acid is (6-8):(2-4):(2-3); The mass fraction of the glacial acetic acid is 90-99.5%; The mass fraction of the sulfuric acid is 90-98%; The mass fraction of the phosphoric acid is 80-85%.

7. A method for preparing a resin coating dissolving agent as claimed in any one of claims 1 to 6, characterized in that: The following steps are involved: Alcohol, ether and phenol are mixed and stirred, and then dichloromethane and acid are added and the mixture is continued to be mixed to obtain a resin coating dissolving agent.

8. Use of the resin coating dissolving agent according to any one of claims 1 to 6 or the resin coating dissolving agent prepared by the preparation method according to claim 7 in removing resin coating from the surface of electrical equipment.

9. A method for removing resin coating on the surface of electrical equipment, characterized in that: The following steps are involved: The electrical equipment having a resin coating on its surface is immersed in the resin coating dissolving agent described in any one of claims 1 to 6 or the resin coating dissolving agent prepared by the preparation method described in claim 7 to react so as to dissolve the resin coating.

10. The method for removing resin coating on the surface of electrical equipment according to claim 9, characterized in that: Reaction temperature is 20~25℃ 。

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