Optical module

Abstract

The optical module provided by the invention comprises an upper shell, a circuit board, a base, a light receiving part and a light emitting part. A base mounting part is formed on the surface of the circuit board, and the base is fixed on the surface of the circuit board through the base mounting part. A protruding part is formed on the upper surface of the base, protrudes towards the upper shell and is connected with the upper shell in a heat conduction mode, and therefore heat can be conducted out more effectively. The light emitting component is arranged on the lower surface of the base, so that the light emitting component has a good heat dissipation path. In order to respectively protect the light receiving component and the light emitting component, the upper surface of the base is covered with a first protective cover, and the lower surface of the base is covered with a second protective cover. The two sides of the lower surface of the base protrude downwards to form supporting parts respectively, the supporting parts on the two sides form embedding parts respectively, an inserting part is formed on the side wall of one end of the second protection cover, and the inserting part is connected with the embedding parts on the two sides in an inserting mode so that the second protection cover can be fixed to the lower surface of the base.

Description

Technical Field

[0001] The present disclosure relates to the field of optical communication technologies, and particularly to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the progress of optical communication technologies has become increasingly important. In optical communication technologies, an optical module, as one of the key components in optical communication devices, can achieve optoelectronic signal conversion; during the development of optical communication technologies, it is required that the data transmission rate of the optical module be continuously improved. Summary of the Invention

[0003] The present disclosure provides an optical module, which realizes optical emission and reception of multiple optical paths by arranging an optical emission component and an optical reception component on the same base.

[0004] The optical module provided by the present disclosure includes:

[0005] An upper housing;

[0006] A circuit board, on the surface of which a base mounting portion is formed, and an optical reception chip array is provided on the surface of the circuit board;

[0007] A base, fixed to the surface of the circuit board through the base mounting portion, a convex portion is formed on the upper surface of the base, the convex portion protrudes towards the upper housing, and the convex portion is thermally connected to the upper housing; optical reception components are respectively provided on both sides of the convex portion; an optical emission component is provided on the lower surface of the base; wherein, support portions are respectively formed by protruding downward on both sides of the lower surface of the base, and embedding portions are respectively formed on both sides of the support portions;

[0008] A first protective cover, covering the upper surface of the base, a first notch is formed on one side of the first protective cover facing the convex portion to avoid the convex portion; both sides of the first notch are respectively used to protect the optical reception components on both sides of the convex portion;

[0009] A second protective cover, covering the support portions on the lower surface of the base to protect the optical emission component; a plug-in portion is formed on the side wall at one end of the second protective cover, and the plug-in portion is respectively plugged and connected with the embedding portions on both sides to fix the second protective cover on the lower surface of the base; an avoidance portion is formed at the other end of the second protective cover to avoid the high-frequency signal line between the optical emission component and the circuit board.

[0010] In the optical module provided by the present disclosure, it includes an upper housing, a circuit board, a base, an optical receiving component, and an optical transmitting component. The present disclosure separately arranges the optical receiving component and the optical transmitting component on different surfaces of the same base to improve the integration of the optical module. The present disclosure forms a base mounting portion on the surface of the circuit board, and fixes the base to the surface of the circuit board through the base mounting portion. At the same time, in order to enhance the heat dissipation effect of the base, a convex portion is formed on the upper surface of the base, the convex portion protrudes towards the upper housing, and the convex portion is thermally connected to the upper housing. The convex portion serves as a heat dissipation protrusion to more effectively conduct heat out. In order to more effectively dissipate the heat generated by the optical transmitting component, the present disclosure arranges the optical transmitting component on the lower surface of the base, so that the optical transmitting component has a better heat dissipation path and improves the heat dissipation efficiency. Correspondingly, the optical receiving component is arranged on the upper surface of the base. Exemplarily, the optical receiving component is arranged on the side of the convex portion. In order to protect the optical receiving component and the optical transmitting component respectively, a first protective cover is irradiated on the upper surface of the base, and a second protective cover is irradiated on the lower surface of the base. In order to fix the first protective cover, the second protective cover and the base, support portions are respectively formed by protruding downward on both sides of the lower surface of the base, and embedding portions are respectively formed on the two support portions. A first notch is formed on one side of the first protective cover facing the convex portion to avoid the convex portion; both sides of the first notch are respectively used to protect the optical receiving components on both sides of the convex portion. The second protective cover is irradiated on the support portion of the lower surface of the base to protect the optical transmitting component. A plug-in portion is formed on the side wall at one end of the second protective cover, and the plug-in portion is respectively plugged and connected with the embedding portions on both sides to fix the second protective cover on the lower surface of the base; an avoidance portion is formed at the other end of the second protective cover to avoid the high-frequency signal line between the optical transmitting component and the circuit board. Description of the Drawings

[0011] In order to more clearly illustrate the technical solutions in the present disclosure, the drawings used in some embodiments of the present disclosure will be briefly introduced below. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limitations on the actual sizes of the products, the actual processes of the methods, the actual timings of the signals, etc. involved in the embodiments of the present disclosure.

[0012] Figure 1 It is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0013] Figure 2 It is a partial structure diagram of a host computer provided according to some embodiments of the present disclosure;

[0014] Figure 3 It is a structure diagram of an optical module provided according to some embodiments of the present disclosure;

[0015] Figure 4 Exploded view of an optical module provided according to some embodiments of the present disclosure;

[0016] Figure 5A Structure of the first base provided according to some embodiments of the present disclosure Figure 1 ;

[0017] Figure 5B Structure of the first base provided according to some embodiments of the present disclosure Figure 2 ;

[0018] Figure 5C Structural diagram of a circuit board provided according to some embodiments of the present disclosure;

[0019] Figure 5D Assembly schematic diagram of the first base and the circuit board provided according to some embodiments of the present disclosure;

[0020] Figure 6A Structure of the second base provided according to some embodiments of the present disclosure Figure 1 ;

[0021] Figure 6B Structure of the second base provided according to some embodiments of the present disclosure Figure 2 ;

[0022] Figure 6C Assembly schematic diagram of the second base and the circuit board provided according to some embodiments of the present disclosure;

[0023] Figure 7A Structure of the third base provided according to some embodiments of the present disclosure Figure 1 ;

[0024] Figure 7B Structure of the third base provided according to some embodiments of the present disclosure Figure 2 ;

[0025] Figure 7C Structural diagram of another circuit board provided according to some embodiments of the present disclosure;

[0026] Figure 7D Assembly diagram of the third base and the circuit board provided according to some embodiments of the present disclosure;

[0027] Figure 8 Structure diagram of the fourth base provided according to some embodiments of the present disclosure;

[0028] Figure 9 Structure diagram of the fifth base provided according to some embodiments of the present disclosure;

[0029] Figure 10An assembly structure diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0030] Figure 11 An exploded assembly diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0031] Figure 12 A cross-sectional structure diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0032] Figure 13 A schematic diagram of the electrical connection between an optical receiving chip and a transimpedance amplifier provided according to some embodiments of the present disclosure;

[0033] Figure 14 A structure diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0034] Figure 15 An exploded diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0035] Figure 16 A structure diagram of a lens assembly provided according to some embodiments of the present disclosure;

[0036] Figure 17 Another assembly schematic diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0037] Figure 18 Another structure schematic diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0038] Figure 19 Another exploded schematic diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0039] Figure 20 Another assembly structure diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0040] Figure 21 Another structure schematic diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0041] Figure 22 Another exploded schematic diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0042] Figure 23 Another top view structure diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0043] Figure 24 Another structure schematic diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0044] Figure 25 Another exploded view of an optical receiving component provided according to some embodiments of the present disclosure;

[0045] Figure 26 Another top view of an optical receiving component provided according to some embodiments of the present disclosure;

[0046] Figure 27 Another assembly diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0047] Figure 28 Another structural diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0048] Figure 29 Another assembly diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0049] Figure 30 Another structural diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0050] Figure 31 An assembly diagram of an optical transmitting component provided according to some embodiments of the present disclosure;

[0051] Figure 32 An assembly top view of an optical transmitting component provided according to some embodiments of the present disclosure;

[0052] Figure 33 An exploded assembly diagram of an optical transmitting component provided according to some embodiments of the present disclosure;

[0053] Figure 34 A structural diagram of the second protective cover in an optical transmitting component provided according to some embodiments of the present disclosure;

[0054] Figure 35 An assembly side view of an optical transmitting component provided according to some embodiments of the present disclosure;

[0055] Figure 36 An exploded assembly side view of an optical transmitting component provided according to some embodiments of the present disclosure;

[0056] Figure 37 A sectional structural diagram of an optical transmitting component provided according to some embodiments of the present disclosure;

[0057] Figure 38 An exploded structural diagram of an optical transmitting component provided according to some embodiments of the present disclosure;

[0058] Figure 39 Another assembly sectional view of an optical transmitting component provided according to some embodiments of the present disclosure;

[0059] Figure 40 Schematic assembly diagram of another optical emission component provided according to some embodiments of the present disclosure;

[0060] Figure 41 Schematic structural diagram of another optical emission component provided according to some embodiments of the present disclosure;

[0061] Figure 42 Cross-sectional structure diagram of another optical emission component provided according to some embodiments of the present disclosure;

[0062] Figure 43 Schematic partial cross-sectional structure of an optical module provided according to some embodiments of the present application Figure 1 ;

[0063] Figure 44 Schematic partial cross-sectional structure of an optical module provided according to some embodiments of the present application Figure 2 ;

[0064] Figure 45 Schematic assembly of yet another optical emission component provided according to some embodiments of the present disclosure Figure 1 ;

[0065] Figure 46 Schematic assembly of yet another optical emission component provided according to some embodiments of the present disclosure Figure 2 ;

[0066] Figure 47 Schematic structural diagram of yet another optical emission component provided according to some embodiments of the present disclosure;

[0067] Figure 48 Exploded schematic diagram of yet another optical emission component provided according to some embodiments of the present disclosure. Detailed implementation manners

[0068] Next, some embodiments of the present disclosure will be clearly and detailedly described in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided by the present disclosure fall within the scope of protection of the present disclosure.

[0069] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is to be construed in an open, inclusive sense, i.e., "including, but not limited to"; the terms "first" and "second" are not to be construed as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or integrated, can be directly connected, or can be indirectly connected through an intermediate medium; the use of the term "adapted to" or "configured to" implies open and inclusive language and does not exclude a device adapted to or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "identical", "consistent", "flush", etc. are not limited to absolute mathematical relationships, but also include an acceptable error range in practice, and also include differences formed due to manufacturing reasons based on the same design concept.

[0070] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. The light loaded with information is an optical signal. The optical signal propagates in the information transmission device, which can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. The information that information processing devices can process exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablet computers, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission devices.

[0071] The conversion between optical signals and electrical signals between information processing devices and information transmission devices is achieved through an optical module. For example, an optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be interconnected through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0072] Figure 1 It is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure. As Figure 1As shown in the figure, a part of the optical communication system includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0073] One end of the optical fiber 101 extends towards the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. Total internal reflection can occur in the optical fiber 101. The propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101, transmitting the optical signal from the direction of the remote information processing device 1000 into the optical module 200, or propagating the optical signal from the optical module 200 towards the remote information processing device 1000, achieving long-distance information transmission with low power loss.

[0074] The number of optical fibers 101 can be one or multiple (two or more); the optical fiber 101 and the optical module 200 can be connected in a pluggable and removable manner or in a fixed connection.

[0075] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor and control the working state of the optical module 200.

[0076] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104. The external electrical interface can access an electrical signal network. Exemplarily, the network cable interface 104 is configured to access the network cable 103, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the network cable 103.

[0077] An Optical Network Unit (ONU), an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), and a data center server are common host computers.

[0078] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100. The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

[0079] Exemplarily, the third electrical signal sent by the local information processing device 2000 is transmitted into the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted into the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101, and the second optical signal travels in the optical fiber 101 towards the remote information processing device 1000.

[0080] Exemplarily, the first optical signal from the direction of the remote information processing device 1000 propagates through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted into the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal into the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal. The host computer 100 transmits the fourth electrical signal into the local information processing device 2000.

[0081] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. In the above process of converting optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0082] Figure 2 It is a partial structure diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only the structure related to the host computer 100 and the optical module 200 is shown. As Figure 2 shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a radiator 107 disposed on the cage 106, and an electrical connector (not shown in the figure) disposed inside the cage 106. The radiator 107 has a convex structure for increasing the heat dissipation area, and the fin-like structure is a common convex structure.

[0083] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the radiator 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0084] Figure 3 It is a structure diagram of an optical module provided according to some embodiments of the present disclosure. Figure 4 It is an exploded view of an optical module provided according to some embodiments of the present disclosure. As Figure 3 and Figure 4As shown, the optical module 200 includes a shell, a circuit board 300 disposed within the shell, an optical transmitting component 400, and an optical receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the optical transmitting component 400 and the optical receiving component 500.

[0085] The shell includes an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202 to form the above-mentioned shell having two openings 204 and 205; the outer contour of the shell generally presents a rectangular body.

[0086] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011. The cover plate 2011 covers the two lower side plates of the lower shell 202 to form the above-mentioned shell.

[0087] In some embodiments, the lower shell 202 includes a bottom plate 2021, a first lower side plate 2022 and a second lower side plate 2023 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates are combined with the two lower side plates to realize the upper shell 201 covering the lower shell 202.

[0088] The direction in which the line connecting the two openings 204 and 205 is located may be consistent with the length direction of the optical module 200 or may not be consistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 right end), and the opening 205 is also located at the end of the optical module 200 ( Figure 3 left end). Or, the opening 204 is located at the end of the optical module 200, while the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold fingers of the circuit board 300 extend out from the electrical interface and are inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical transmitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0089] Adopting the assembly method of combining the upper shell 201 and the lower shell 202 facilitates the installation of components such as the circuit board 300, the optical transmitting component 400, and the optical receiving component 500 into the above-mentioned shell. The upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling components such as the circuit board 300, the optical transmitting component 400, and the optical receiving component 500, it is convenient for the deployment of the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0090] In some embodiments, the upper housing 201 and the lower housing 202 are made of a metal material, which is conducive to achieving electromagnetic shielding and heat dissipation.

[0091] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0092] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower housing 202 and includes an engaging component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging component of the unlocking component 600; when the unlocking component 600 is pulled, the engaging component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the engaging component and the host computer to release the snap-fit connection between the optical module 200 and the host computer, so that the optical module 200 can be withdrawn from the cage 106.

[0093] The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components can include, for example, capacitors, resistors, triodes, and metal-oxide-semiconductor field-effect transistors (MOSFETs). The chips can include, for example, a microcontroller unit (MCU), a laser driver chip, a transimpedance amplifier (TIA), a limiting amplifier, a clock and data recovery chip (CDR), a power management chip, and a digital signal processing (DSP) chip.

[0094] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also convenient for inserting into the electrical connector in the host computer cage.

[0095] The circuit board 300 further includes a gold finger formed on its end surface. The gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is electrically connected to the electrical connector in the cage 106. The gold finger can be provided only on the surface of one side of the circuit board 300 (for example Figure 4The upper surface shown) can also be provided on the upper and lower surfaces of the circuit board 300 to provide more pins. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0096] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.

[0097] The optical transmitting component 400 and / or the optical receiving component 500 are located on the side of the circuit board 300 away from the gold fingers; in some embodiments, the optical transmitting component 400 and the optical receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors respectively; in some embodiments, the optical transmitting component and / or the optical receiving component can be directly provided on the circuit board 300, can be provided on the surface of the circuit board, or can be provided on the side of the circuit board. In some embodiments, the optical transmitting component 400 and the optical receiving component 500 are respectively located on the upper and lower surfaces of the circuit board.

[0098] To make full use of the limited space, the existing 800G QSFPDD 2xFR4 mainly uses hard connections, that is, the optical transmitting component 400 and the optical receiving component 500 are connected to the fiber optic adapter. In the OSFQ package, the optical transmitting component 400 and the optical receiving component 500 need to be first connected to the optical fiber, and the optical fiber is connected to the fiber optic adapter at the optical port position. The present application provides an optical module in which the optical transmitting component 400 and the optical receiving component 500 are provided on both sides of the base, the base is embedded in the circuit board, and a coupling connection with the optical fiber is achieved, and then a soft connection is made with the optical port of the optical module through the optical fiber. Through this design, the same optical and module structure design can be applied to both the QSFP-DD package method and the OSFP package method, and at the same time meet the requirements of FR4 and LR4 optical modules for loss and sensitivity. Since this structure realizes the optical design of the transmitting and receiving ends as much as possible and unifies different product packaging platforms (such as QSFP-DD and OSFP) and product standards (FR4 and LR4) in one optical and structure design, the assembly process is simplified, the material and component costs are reduced, and it is easier to achieve the goals of mass production and low cost. By reasonably arranging the optical components and optimizing the assembly process, the overall assembly of the module is greatly simplified, the production efficiency and maintenance efficiency are greatly improved, and it is more suitable for mass production.

[0099] In the present disclosure, the optical module includes a base. A base mounting portion is formed on the surface of the circuit board 300. Exemplarily, the structure of the base mounting portion can be an opening or other structures. The base is embedded in the base mounting portion, thereby fixing the base to the surface of the circuit board 300. In some embodiments, one surface of the base is used to carry the optical receiving component, and the other surface is used to carry the optical transmitting component, thereby arranging the optical receiving component and the optical transmitting component in a layered manner on the same structural member to achieve a reasonable layout of the optical components. In the present disclosure, the optical receiving component and the optical transmitting component are arranged on different surfaces of the same base, and moreover, multiple groups of optical receiving components or multiple groups of optical transmitting components are arranged on the same surface of the base, thereby realizing multi-channel reception and multi-channel transmission of the optical module, such as a 1.6T optical module, to improve the transmission rate of the optical module.

[0100] In the present disclosure, a heat dissipation air duct can be formed between the upper housing 201 of the optical module and the cage 106 of the host computer 100, so the upper housing 201 has a better heat dissipation effect relative to the lower housing 202. Since the heat generated by the optical transmitting component is relatively large, it is necessary to conduct the generated heat away to ensure the normal operation of the optical transmitting component. In some embodiments, when the optical transmitting component is disposed on the lower surface of the base, the heat generated by the optical transmitting component first transfers upward to the surface of the base, and then continues to transfer upward to the upper housing 201 through the heat conduction connection between the base and the upper housing 201, and then the heat is dissipated through the upper housing 201. In some embodiments, when the optical transmitting component is disposed on the upper surface of the base, the heat generated by the optical transmitting component first transfers downward to the surface of the base, and then continues to transfer upward to the upper housing 201 through the heat conduction connection between the base and the upper housing 201, and then the heat is dissipated through the upper housing 201. In comparison, the heat dissipation path when the optical transmitting component is disposed on the lower surface of the base is more unobstructed than the heat dissipation path when the optical transmitting component is disposed on the upper surface of the base. Therefore, in the present disclosure, the optical transmitting component is disposed on the lower surface of the base, and the optical receiving component is disposed on the upper surface of the base.

[0101] In the present disclosure, in order to achieve the heat conduction connection between the base and the upper housing 201, a raised portion is formed by protruding upward on the upper surface of the base, and the raised portion is a heat dissipation raised portion. The heat conduction connection between the raised portion and the upper housing 201 can be achieved through a heat conduction gel or a heat conduction pad, etc. At the same time, the spreading surface of the raised portion is relatively large, which can increase the heat conduction area between the base and the upper housing 201, thereby improving the heat dissipation effect. In some embodiments, the optical receiving component is located on the side of the raised portion. Exemplarily, optical receiving components are respectively disposed on both sides of the raised portion, and the surface where the raised portion is located protrudes relative to the surface for supporting the optical receiving component.

[0102] In the present disclosure, a base mounting portion is formed on the surface of the circuit board 300, and the base is fixed to the surface of the circuit board through the base mounting portion. Exemplarily, the structure of the base mounting portion can be an opening or other structures. The base is embedded in the base mounting portion, thereby fixing the base to the surface of the circuit board 300. In some embodiments, the size of the base in the width direction of the circuit board 300 is greater than the size of the base mounting portion, so that the surfaces on both sides of the base mounting portion can support the base, thereby fixing the base to the surface of the circuit board 300.

[0103] In the present disclosure, in order to achieve multi-channel optical signal transmission, the optical transmission component can emit multi-channel optical signals. In some embodiments, when emitting multi-channel optical signals, they can be emitted separately instead of being multiplexed into a single optical signal for emission. Exemplarily, multiple optical signals are separately emitted through an optical fiber array, and the laser has a corresponding optical fiber ribbon for optical signal transmission. In some embodiments, when emitting multi-channel optical signals, they can be multiplexed into a single optical signal for emission. Exemplarily, when multiplexing, multiplexing can be achieved through an optical multiplexing component. Exemplarily, when multiplexing, multiplexing can be achieved through the combination of different filter plates. Utilizing the transmission and reflection characteristics of the filter plates for specific wavelengths, multiplexing can be achieved by using a combination of multiple filter plates. Exemplarily, when multiplexing, multiplexing can also be achieved through the combination of different polarization state devices such as polarizing plates. Utilizing the different transmission characteristics of the polarization state devices for light with different polarization directions, multiplexing can be achieved by using a combination of multiple polarizing plates. Exemplarily, when multiplexing, multiplexing can also be achieved through the combination of a filter plate and a polarizing plate.

[0104] In the present disclosure, in order to achieve multi-channel optical signal reception, the optical receiving component may include a plurality of photodetectors to receive multi-channel optical signals. In some embodiments, multi-channel optical signals may be received through an optical fiber array, and then the optical path is turned by an optical path turning device, so as to separately transmit the multi-channel optical signals into a plurality of photodetectors. When turning the optical path, the end face of the optical fiber may also be ground to form a reflecting surface, thereby realizing the change of the optical path. Exemplarily, when the end face of the optical fiber is ground to form a reflecting surface, since the optical fiber is soft, the optical fiber may be clamped up and down. At this time, the optical fiber may or may not protrude. If the optical fiber protrudes, the end face of the optical fiber may be ground separately. If the optical fiber does not protrude, it may be ground together with the upper and lower clamping structures. In some embodiments, a received single-channel optical signal may be decomposed into multi-channel optical signals by an optical demultiplexing component, and then the optical path is turned by an optical path turning device, so as to separately transmit the multi-channel optical signals into a plurality of photodetectors. In some embodiments, a received single-channel optical signal may be decomposed into multi-channel optical signals by an Arrayed Waveguide Grating (AWG), and then the optical path is turned, so as to separately transmit the multi-channel optical signals into the photodetectors. Among them, after the multiplexed signal light of multiple wavelengths in the AWG is output through the central input channel waveguide, diffraction occurs in the input slab waveguide, reaches the input concave grating for power distribution, and is coupled into the array waveguide region. Since the end face of the array waveguide is located on the circumference of the grating circle, the diffracted light reaches the end face of the array waveguide with the same phase. After being transmitted through the array waveguide, since the adjacent array waveguides maintain the same length difference ΔL, the output light of a certain wavelength of the adjacent array waveguides on the output concave grating has the same phase difference. For lights of different wavelengths, this phase difference is different. Therefore, lights of different wavelengths are diffracted in the output slab waveguide and focused on different output channel waveguide positions. After being output through the output channel waveguide, the wavelength division, that is, the demultiplexing function, is completed.

[0105] In the present disclosure, when multiple optical signals are separately emitted through an optical fiber array, the laser has a corresponding optical fiber ribbon for optical signal transmission, and when receiving multi-channel optical signals through the optical fiber array, since the optical transmitting component is located on the lower surface of the base and the optical receiving component is located on the upper surface of the base, therefore, the optical fiber array for the optical transmitting component is located below, and the optical fiber array for the optical receiving component is located above.

[0106] In some embodiments of the present disclosure, bases with different structural forms are provided, and at the same time, optical components with different structural combinations are provided, thereby forming optical modules with different structures.

[0107] Figure 5A For the structure of the first base provided according to some embodiments of the present disclosure Figure 1 , Figure 5B For the structure of the first base provided according to some embodiments of the present disclosureFigure 2 As Figure 5A and Figure 5B shown, in some embodiments, the optical receiving component and the optical transmitting component are arranged on different surfaces of the same base, where the base may be base 900a.

[0108] Figure 5A shows the structure of one surface of base 900a. As Figure 5A shown, in some embodiments, the optical receiving component and the optical transmitting component are arranged on different surfaces of base 900a. The surface shown in Figure 5A is regarded as the upper surface of base 900a, and the opposite surface is regarded as the lower surface of base 900a. Exemplarily, the upper surface of base 900a is used to carry the optical receiving component, and the lower surface of base 900a is used to carry the optical transmitting component. Among them, the optical receiving component includes an optical receiving passive device, and the optical signal transmitted externally is received through the optical receiving passive device, so as to transmit the optical signal to the inside of the optical receiving component. Exemplarily, the optical receiving passive device may be an optical fiber array, or an optical demultiplexing component, or an AWG, etc. Figure 5A shows the structure of the upper surface of base 900a.

[0109] Since the optical transmitting component is located on the lower surface of base 900a and the optical transmitting component generates more heat, in order to realize the heat dissipation of the optical transmitting component, the surface of base 900a bulges upward to form a convex portion 910a. Exemplarily, the middle surface of base 900a bulges upward to form a convex portion 910a, and the surfaces on both sides do not bulge upward to respectively form a first bearing surface 911a and a second bearing surface 912a. Then the upper surface of base 900a is divided into a convex portion 910a and a first bearing surface 911a and a second bearing surface 912a located on both sides of the convex portion 910a respectively. The heat generated by the optical transmitting component is transferred to the outside of the optical module through the contact between the convex portion 910a and the upper housing, so as to realize better heat dissipation. In order to realize multi-channel reception, a first optical receiving passive device is arranged on the first bearing surface 911a, and a second optical receiving passive device is arranged on the second bearing surface 912a.

[0110] In some embodiments, the optical receiving component further includes an optical receiving chip, the optical receiving chip is arranged on the surface of the circuit board, the photosensitive surface of the optical receiving chip is perpendicular to the surface of the circuit board, and the transmission direction of the optical signal received by the optical receiving passive device is parallel to the surface of the circuit board. Therefore, an optical path turning device is arranged in the light output direction of the optical receiving passive device to turn the optical signal toward a direction perpendicular to the surface of the circuit board. Exemplarily, the optical path turning device may be a turning prism, and the optical signal is turned toward a direction perpendicular to the surface of the circuit board through the turning prism, so as to transmit the optical signal to the optical receiving chip.

[0111] The base 900a is further formed with an extension portion 913a which extends relative to the first bearing surface 911a and the second bearing surface 912a. The extension portion 913a is used to carry the optical path turning device. Exemplarily, the optical path turning device can be a turning prism. In order to avoid the electrical components on the circuit board surface and correspond to the optical receiving passive devices at the same time, the extension portion 913a includes a first extension portion 9131, a second extension portion 9133 and a notch 9132 located between the first extension portion 9131 and the second extension portion 9133. Among them, the notch 9132 is used to avoid the electrical components on the circuit board, such as resistors or capacitors, etc.; the first extension portion 9131 is located at the end of the first bearing surface 911a and is used to set the first optical path turning device corresponding to the first optical receiving passive device; the second extension portion 9133 is located at the end of the second bearing surface 912a and is used to set the second optical path turning device corresponding to the second optical receiving passive device. The first extension portion 9131 is arranged in the light output direction of the first optical receiving passive device and extends relative to the first bearing surface 911a; the second extension portion 9133 is arranged in the light output direction of the second optical receiving passive device and extends relative to the second bearing surface 912a. Since the optical receiving chip array is arranged on the circuit board surface and the light receiving surface of the optical receiving chip array is perpendicular to the circuit board surface, respectively, the first optical path turning device and the second optical path turning device are required to change the transmission directions of the multiple optical signals output by the first optical receiving passive device respectively to transmit the multiple optical signals to the optical receiving chip array, and to change the transmission directions of the multiple optical signals output by the second optical receiving passive device respectively to transmit the multiple optical signals to the optical receiving chip array. Exemplarily, the first optical receiving passive device and the second optical receiving passive device can be the first optical fiber array and the second optical fiber array respectively.

[0112] In order to achieve the matching of the optical path, the surfaces of the first extension portion 9131 and the second extension portion 9133 are respectively lower than the surfaces of the first bearing surface 911a and the second bearing surface 912a.

[0113] In some embodiments, in order to limit the optical receiving passive device, a limiting platform is formed between the corresponding extension part and the bearing surface. Exemplarily, a first limiting platform 914a is formed between the first extension part 9131 and the first bearing surface 911a, and a second limiting platform 915a is formed between the second extension part 9133 and the second bearing surface 912a. The surface of the first limiting platform 914a is higher than the surface of the first bearing surface 911a to limit the first optical receiving passive device in a first direction; the surface of the second limiting platform 915a is higher than the surface of the second bearing surface 912a to limit the second optical receiving passive device in the first direction. The width of the first limiting platform 914a is the same as the width of the first optical receiving passive device, and the width of the second limiting platform 915a is the same as the width of the second optical receiving passive device to respectively limit the first optical receiving passive device and the second optical receiving passive device in a second direction. Exemplarily, the first direction may be along the length direction of the protruding part 910a, and the second direction may be along the width direction of the protruding part 910a.

[0114] In some embodiments, since the surface of the first limiting platform 914a is higher than the surface of the first bearing surface 911a, and the surface of the second limiting platform 915a is higher than the surface of the second bearing surface 912a, when machining the base, a chamfer will be formed at the junction of the limiting platform and the corresponding bearing surface. The existence of the chamfer causes the end of the optical receiving passive device to be lifted at the chamfer position when mounting the optical receiving passive device, resulting in uneven mounting of the optical receiving passive device, thereby reducing the stability of the receiving optical path. To this end, a first sunken part 916a is formed at the junction of the first limiting platform 914a and the first bearing surface 911a, and a second sunken part 917a is formed at the junction of the second limiting platform 915a and the second bearing surface 912a. The setting of the first sunken part 916a enables the end of the first optical receiving passive device to be horizontally abutted against the wall surface of the first limiting platform 914a, thereby ensuring smooth mounting of the first optical receiving passive device. Similarly, the setting of the second sunken part 917a enables the end face of the second optical receiving passive device to be horizontally abutted against the wall surface of the second limiting platform 915a, thereby ensuring smooth mounting of the second optical receiving passive device. Exemplarily, the surface of the first sunken part 916a gradually inclines towards the wall surface of the first limiting platform 914a, and the surface of the second sunken part 917a gradually inclines towards the wall surface of the second limiting platform 915a, so that the surface of one end of the first sunken part 916a and the second sunken part 917a close to the corresponding limiting platform is sunken, avoiding interference with the optical receiving passive device, ensuring smooth mounting of the optical receiving passive device, and thus ensuring the stability of the receiving optical path.

[0115] Figure 5B Shows the structure of another surface of the base 900a. Specifically Figure 5B Shows the structure of the lower surface of the base 900a. As Figure 5BAs shown, in some embodiments, a third bearing surface 921a, a fourth bearing surface 922a, and a fifth bearing surface 923a are respectively formed on the lower surface of the base 900a. Exemplarily, the third bearing surface 921a is used to arrange a laser group in the optical emission component. A TEC is provided below the laser group. The TEC and the laser group have a certain height when stacked together. The concave setting of the third bearing surface 921a causes the laser group to sink so as to sink to be flush with the surface of the circuit board 300, thereby ensuring that the wire bonding length between the laser group and the surface of the circuit board 300 is short. The fourth bearing surface 922a is used to carry optical emission passive devices. Exemplarily, the optical emission passive device can be an optical fiber array, or an optical multiplexing component, etc. When the optical emission passive device is an optical fiber array, the surface of the fifth bearing surface 923a is used to arrange pigtails.

[0116] In some embodiments, in order to protect the optical emission component, a protective cover can be irradiated on the lower surface of the base 900a. When the optical emission passive device is an optical fiber array, in order to prevent the protective cover from pressing against the surface of the optical fiber and causing interference to the optical fiber, first support portions 924a are formed on both side surfaces of the fifth bearing surface 923a. At the same time, second support portions 925a can also be formed on both side surfaces of the fourth bearing surface 922a to support the protective cover to a certain height, and a certain distance is maintained between the inner wall of the protective cover and the optical fiber. In the present disclosure, through the first support portion 924a and the second support portion 925a, the protective cover can be erected to a certain height, so that there is a certain gap between the protective cover and the optical fiber, thereby avoiding mutual interference between the two.

[0117] In order to fix the protective cover to the base 900a, embedding portions 9241 are formed on the surfaces of the first support portions 924a on both sides, and the protective cover is embedded in the embedding portions 9241, thereby fixing the protective cover to the base 900a. Of course, other structures can also be adopted to realize the fixation of the protective cover.

[0118] In some embodiments, an isolator is provided to prevent the optical signal emitted by the laser group from returning to the laser group again and affecting the optical signal quality. Exemplarily, the isolator is arranged between the optical emission passive device and the laser group. Correspondingly, in order to arrange the isolator, a fifth bearing surface 926a is formed between the fourth bearing surface 922a and the third bearing surface 921a. The fifth bearing surface 926a is used to arrange the isolator.

[0119] In some embodiments, in order to match the optical path, the surface of the fifth bearing surface 926a is higher than the fourth bearing surface 922a. Therefore, when processing the base, a chamfer is formed at the junction of the fifth bearing surface 926a and the fourth bearing surface 922a. The existence of the chamfer causes the end of the light-emitting passive component to be tilted when mounting the light-emitting passive component, thereby causing the light-emitting passive component to be mounted unevenly and reducing the stability of the emission optical path. To this end, a notch 9251 is formed at the end of the second support portion 925a close to the fifth bearing surface 926a. The setting of the notch 9251 allows the end of the light-emitting passive component to horizontally abut against the wall of the fifth bearing surface 926a, thereby ensuring that the light-emitting passive component is mounted flatly and the stability of the emission optical path is ensured.

[0120] In some embodiments, a light emitting passive component such as an optical fiber array can be mounted on the fourth bearing surface 922a by glue. When the stress generated by the glue bonding is too concentrated, the bottom surface of the light emitting passive component such as the optical fiber array will be broken. Therefore, in order to avoid stress concentration, protrusions 927a are formed at intervals on the surface of the fourth bearing surface 922a. The interval arrangement of the protrusions 927a can disperse the stress generated by the glue, thereby avoiding excessive concentration of the glue stress, so as to ensure that the light emitting passive component such as the optical fiber array is intact during mounting.

[0121] As mentioned above, for optical path matching, the surface of the fifth bearing surface 926a is higher than the fourth bearing surface 922a, which can also limit the light emitting passive device such as the optical fiber array in the first direction. In order to limit the light emitting passive device such as the optical fiber array in the second direction, the surfaces at both ends of the fifth bearing surface 926a can be recessed downward, so that the width of the protruding surface of the fifth bearing surface 926a is the same as the width of the light emitting passive device such as the optical fiber array, thereby limiting the light emitting passive device in the second direction. Exemplarily, the first direction can be the length direction of the protruding portion 910a, and the second direction can be the width direction of the protruding portion 910a.

[0122] The specific embodiments of setting a light receiving component or a light emitting component on the base 900a will be described in detail in the subsequent description.

[0123] Figure 5C FIG. 1 is a structural diagram of a circuit board provided according to some embodiments of the present disclosure. Figure 5C As shown, the circuit board 300 includes a base mounting portion 301 , and the base 900 a is embedded in the base mounting portion 301 , so that the base 900 a is fixed to the surface of the circuit board 300 .

[0124] In some embodiments, the circuit board 300 is designed to be compatible with different types of optical emission passive devices to match different types of optical emission passive devices. When the optical emission passive device is an optical multiplexing component, multiple optical signals emitted by the laser group are combined into one optical signal through the optical multiplexing component. This optical signal is transmitted into the fiber collimator after being converged by a lens. The fiber collimator is connected with a pigtail, and the optical signal is transmitted out through the pigtail. Since the pigtail has a certain rigidity, the pigtail exits the fiber collimator horizontally along the port of the fiber collimator, and the exit position is relatively close to the surface of the circuit board. However, under the action of the gravity of the pigtail, the pigtail will move downward close to the circuit board until it contacts the circuit board, resulting in interference between the pigtail and the circuit board. To avoid interference between the pigtail and the circuit board, the pigtail can be lifted upward to a certain height, so that there is a certain gap between the pigtail and the circuit board, avoiding mutual interference between the two. When lifting the pigtail upward, due to the interference between the pigtail and the surface of the circuit board, during the lifting process, the pigtail may be broken due to the lack of bending space. For this reason, when there are two optical multiplexing components, a first notch 302 and a second notch 303a are respectively formed on the end surface of the base mounting portion 301. Exemplarily, the first notch 302 and the second notch 303a are provided at the end of the base mounting portion 301 away from the optical receiving chip. Then, when lifting the pigtail upward, the settings of the first notch 302 and the second notch 303a provide a bending space for the pigtail, so that when the pigtail is lifted, the area of the pigtail that interferes with the surface of the circuit board can be bent downward into the first notch 302 and the second notch 303a, thus avoiding the pigtail from being broken. It can be understood that when the optical emission passive device is an optical fiber array, the exit position is far from the surface of the circuit board, and there is enough space for the pigtail to bend when reaching the surface of the circuit board. Therefore, at this time, two notches do not need to be formed on the end surface of the base mounting portion 301. In the present disclosure, by respectively forming a first notch 302 and a second notch 303a on the end surface of the base mounting portion 301, the circuit board 300 is made compatible with different types of optical emission passive devices.

[0125] Figure 5D FIG. 4 is a schematic assembly diagram of a first base and a circuit board according to some embodiments of the present disclosure. As Figure 5D shown, a base mounting portion 301 is formed on the surface of the circuit board 300, and first support portions 924a are respectively formed on both sides of the base 900a. In some embodiments, the first support portions 924a on both sides of the base 900a are embedded in the base mounting portion 301, and then the outer surfaces of the first support portions 924a are respectively mounted on the surface of the circuit board 300, thereby fixing the base 900a on the surface of the circuit board 300 and realizing the fixed connection between the base 900a and the circuit board 300.

[0126] Figure 6A FIG. 5 is a structure diagram of a second base according to some embodiments of the present disclosure. Figure 1, Figure 6B The structure of the second base provided according to some embodiments of the present disclosure Figure 2 . As Figure 6A and Figure 6B shown, in some embodiments, the optical receiving component and the optical transmitting component are arranged on different surfaces of the same base, where the base can be base 900b.

[0127] Figure 6A The structure of one surface of base 900b is shown. As Figure 6A shown, the optical receiving component and the optical transmitting component are respectively arranged on different surfaces of base 900b. Exemplarily, the upper surface of base 900b is used to carry the optical receiving component, and the lower surface is used to carry the optical transmitting component. Among them, Figure 6A if the surface shown in

[0128] is the upper surface of base 900b, then the opposite surface is the lower surface of base 900b. The upper surface of base 900b protrudes to form a protruding portion 914b. The function of the protruding portion 914b is the same as that of the above-mentioned protruding portion 910a, both of which play a role in heat dissipation by contacting the upper housing. Similarly, optical receiving passive devices are respectively arranged on both sides of the protruding portion 910a to achieve multi-channel reception. The optical receiving passive device can be an optical fiber array, an optical demultiplexing component, or an AWG, etc. In some embodiments, the optical receiving passive device further includes an optical fiber collimator, etc.

[0129] The upper surface of the protruding portion 914b protrudes upward relative to the upper surface of base 900b, and one end of the protruding portion 914b protrudes from the side wall of base 900b. The first optical receiving passive device is located on one side of the first side wall 9141 of the protruding portion 914b, and the second optical receiving passive device is located on one side of the second side wall 9142 of the protruding portion 914b. The second side wall 9142 is located on the opposite side of the first side wall 9141.

[0130] Base 900b is provided with a first notch 911b, and the edge of the first notch 911b defines the optical receiving passive device in the length direction. The specific function of the first notch 911b will be elaborated in the subsequent description.

[0131] Base 900b is provided with a second notch 912b, and the edge of the second notch 912b defines the optical receiving passive device in the length direction. The specific function of the second notch 912b will be elaborated in the subsequent description.

[0132] In some embodiments, base 900b is further provided with a third notch 913b, and the setting of the third notch 913b facilitates positioning and observation during the installation of base 900b and the circuit board 300.

[0133] Figure 6B The structure of the other surface of base 900b is shown. AsFigure 6B As shown, a first recess 915b is formed by the depression of the lower surface of the base 900b, and the lower surface of the base 900b is in contact connection with the upper surface of the circuit board. The bottom surface of the first recess 915b is recessed relative to the lower surface of the base 900b to minimize the electrical connection line between the optical emission component and the circuit board.

[0134] In some embodiments, the first recess 915b communicates with the third notch 913b, facilitating observation and positioning from the third notch 913b during installation.

[0135] Figure 6C It is a schematic diagram of the assembly of the second base and the circuit board provided according to some embodiments of the present disclosure. As Figure 6C shown, in some embodiments of the present disclosure, the base mounting portion 303 is a hollow structure of the circuit board 300. The base mounting portion 303 includes a first mounting portion 3031 and a second mounting portion 3032, and the width of the second mounting portion 3032 is greater than the width of the first mounting portion 3031. The first mounting portion 3031 is adjacent to the optical port position, and the second mounting portion 3032 is adjacent to the electrical port position. A DSP chip is provided on the upper surface of the circuit board 300. The optical receiving component is located on the upper surface of the base 900b, and the optical emission component is located on the lower surface of the base 900b.

[0136] The width of the base 900b is greater than the width of the second mounting portion 3032, and the base 900b is located on the upper surface of the circuit board 300. The base 900b covers the second mounting portion 3032.

[0137] The base 900b does not entirely cover the first mounting portion 3031, and there is a gap of a part of the first mounting portion 3031 between the circuit board and the base 900b to facilitate the clamping and installation of the optical fiber connector.

[0138] To shorten the connection line between the optical emission component and the circuit board, the pins of the optical emission component are flush with the lower surface of the circuit board. To achieve the avoidance installation of the optical emission component, the first recess 915b is located at the second mounting portion 3032.

[0139] Figure 7A It is the structure of the third base provided according to some embodiments of the present disclosure Figure 1 , Figure 7B It is the structure of the third base provided according to some embodiments of the present disclosure Figure 2 . As Figure 7A and Figure 7B shown, in some embodiments, the optical receiving component and the optical emission component are arranged on different surfaces of the same base, where the base can be the base 900c.

[0140] Figure 7A Shows the structure of one surface of the base 900c. As Figure 7AAs shown, the optical receiving component and the optical transmitting component are respectively disposed on different surfaces of the base 900c. Exemplarily, the upper surface of the base 900c is used to carry the optical receiving component, and the lower surface is used to carry the optical transmitting component. Among them, Figure 7A If the surface shown in Figure 7A is the upper surface of the base 900c, then the opposite surface is the lower surface of the base 900c.

[0141] Similar to the above base, a protruding portion 914c is formed by the surface of the base 900c protruding upward. Through the contact between the protruding portion 914c and the upper housing, heat dissipation of the optical transmitting component is achieved. The surface of the base 900c further includes a first bearing surface 911c, a second bearing surface 912c, and a third bearing surface 913c located on different sides of the protruding portion 914c. Exemplarily, the first bearing surface 911c and the second bearing surface 912c are respectively located on both sides in the length direction of the protruding portion 914c, and the third bearing surface 913c is located on one side in the width direction of the protruding portion 914c. The surfaces where the first bearing surface 911c, the second bearing surface 912c, and the third bearing surface 913c are located are all lower than the surface of the protruding portion 914c. The second bearing surface 912c and the first bearing surface 911c are on the opposite sides, and the third bearing surface 913c and the first bearing surface 911c are on the adjacent sides.

[0142] To achieve the reception of multiple optical signals, a first optical receiving component is provided on one side of the protruding portion 914c, and a second optical receiving component is provided on the other side. Among them, the optical receiving chip in the first optical receiving component is disposed on the surface of the circuit board, and the remaining optical devices are disposed on the surface on one side of the base 900c; similarly, the optical receiving chip in the second optical receiving component is disposed on the surface of the circuit board, and the remaining optical devices are disposed on the surface on the other side of the base 900c.

[0143] Taking the optical receiving passive devices in the first optical receiving component and the second optical receiving component as Arrayed Waveguide Gratings (AWGs) as an example, the first optical receiving passive device disposed on the surface of the first bearing surface 911c is the first AWG, and the second optical receiving passive device disposed on the surface of the second bearing surface 912c is the second AWG.

[0144] Exemplarily, the first AWG and the second AWG can be respectively vertically placed on the corresponding bearing surfaces, that is, the light output end faces stand upright on the surface of the circuit board, and the optical signals are arranged vertically, that is, the plane formed by the optical signals is perpendicular to the surface of the circuit board; Exemplarily, the first AWG and the second AWG can be respectively horizontally placed on the corresponding bearing surfaces, that is, the light output end faces are horizontally placed on the surface of the circuit board, and the optical signals are arranged in a tiled manner, that is, the plane formed by the optical signals is parallel to the surface of the circuit board.

[0145] Exemplarily, the light-emitting ends of the first AWG and the second AWG have reflective surfaces. Exemplarily, the light-emitting ends of the first AWG and the second AWG do not have reflective surfaces.

[0146] Taking the example that the first AWG and the second AWG can be vertically placed on corresponding bearing surfaces respectively, and the light-emitting ends of the first AWG and the second AWG do not have reflective surfaces, at this time, the light-emitting end face of the first AWG stands upright on the surface of the first bearing surface 911c, and the light-emitting end of the first AWG does not have a reflective surface; the light-emitting end face of the second AWG stands upright on the surface of the second bearing surface 912c, and the light-emitting end of the second AWG does not have a reflective surface. The light-emitting directions of the first AWG and the second AWG are horizontal, that is, parallel to the surface of the circuit board, while the light-receiving direction of the light-receiving chip located on the surface of the circuit board is perpendicular to the surface of the circuit board. Therefore, the optical signals output by the first AWG and the second AWG need to pass through an optical path turning device such as a turning prism to turn the optical path and change the optical path transmission direction, such as turning the transmission direction of the optical signal from parallel to the surface of the circuit board to perpendicular to the surface of the circuit board. Based on this, a first reflective surface and a first optical path turning device can be respectively arranged on one side of the third bearing surface 913C close to the first AWG. The optical signal is output from the first AWG, transmitted to the first reflective surface, and when output from the first reflective surface, the optical path transmission direction has changed relative to the optical path transmission direction when output from the first AWG. Exemplarily, when output from the first reflective surface, the optical path transmission direction is perpendicular to the optical path transmission direction when output from the first AWG. After being reflected by the first reflective surface to the first optical path turning device, it is then turned downward by the first optical path turning device to the surface of the light-receiving chip array. Similarly, a second reflective surface and a second turning prism can be respectively arranged on one side close to the second AWG. The optical signal is output from the second AWG, transmitted to the second reflective surface, and when output from the second reflective surface, the optical path transmission direction has changed relative to the optical path transmission direction when output from the second AWG. Exemplarily, when output from the second reflective surface, the optical path transmission direction is perpendicular to the optical path transmission direction when output from the second AWG. After being reflected by the second reflective surface to the second optical path turning device, it is then turned downward by the second optical path turning device to the surface of the light-receiving chip array. Exemplarily, the first reflective surface and the second reflective surface can be a first reflecting mirror and a second reflecting mirror respectively.

[0147] Taking the example that the first AWG and the second AWG can be respectively placed vertically on corresponding bearing surfaces, and the light-emitting ends of the first AWG and the second AWG have reflecting surfaces. At this time, the light-emitting end face of the first AWG stands vertically on the surface of the first bearing surface 911c, and the light-emitting end of the first AWG has a reflecting surface; the light-emitting end face of the second AWG stands vertically on the surface of the second bearing surface 912c, and the light-emitting end of the second AWG has a reflecting surface. The light-emitting ends of the first AWG and the second AWG have inclined reflecting surfaces, which can respectively replace the functions of the above-mentioned first reflecting surface and second reflecting surface. Therefore, optical path turning devices such as a first turning prism and a second turning prism are respectively arranged in the light-emitting directions of the first AWG and the second AWG, and the optical signals output by the first AWG and the second AWG are turned towards the surface of the optical receiving chip through the first turning prism and the second turning prism.

[0148] In the present disclosure, the AWG is vertically arranged on the corresponding bearing surface, which can reduce its occupied area on the base, and further reduce the size of the base.

[0149] Taking the example that the first AWG and the second AWG can be respectively placed horizontally on corresponding bearing surfaces, and the light-emitting end faces of the first AWG and the second AWG are both horizontal end faces. Optical path turning devices such as a first turning prism and a second turning prism are respectively arranged in the light-emitting directions of the first AWG and the second AWG, and the transmission directions of the optical signals are changed through the first turning prism and the second turning prism, and the optical signals output by the first AWG and the second AWG are turned towards the surface of the optical receiving chip.

[0150] In some embodiments, the AWG includes an AWG chip and a capillary tube, and the AWG chip and the capillary tube are connected through a connecting component. Exemplarily, the connecting component can be glue. In order to avoid the glue, a first avoiding portion 9111 is formed on the surface of the first bearing surface 911c, and a second avoiding portion 9121 is formed on the surface of the second bearing surface 912c. In some embodiments, in order to limit each optical device on the third bearing surface 913c, a first limiting groove 9131c is formed on one side of the third bearing surface 913c close to the first AWG, and a second limiting groove 9132c is formed on one side close to the second AWG.

[0151] Figure 7B Show another surface structure of the base 900c. As Figure 7B shown, the other surface of the base 900c is the lower surface of the base 900c, which is used to arrange the light-emitting component. The lower surface of the base 900c is respectively formed with a fourth bearing surface 921c, a fifth bearing surface 922c and a sixth bearing surface 923c. The fifth bearing surface 922c is arranged between the fourth bearing surface 921c and the sixth bearing surface 923c.

[0152] In some embodiments, the fourth bearing surface 921c is used to arrange a laser group for emitting multiple optical signals; the fifth bearing surface 922c is used to arrange an optical multiplexing component for multiplexing the multiple optical signals; the sixth bearing surface 923c is used to arrange an optical fiber collimator for transmitting the multiplexed optical signals.

[0153] In order to limit and fix the optical multiplexing component, limiting parts 924c are respectively formed on both sides of the fifth bearing surface 922c. Exemplarily, the surface of the limiting part 924c protrudes relative to the surface of the fifth bearing surface 922c, and the structure of the limiting part 924c can be a limiting boss, so as to limit and fix the optical multiplexing component.

[0154] Figure 7C FIG. is a structural diagram of another circuit board provided according to some embodiments of the present disclosure. As Figure 7C shown, an optical receiving chip 515c and an optical receiving chip 525c are respectively provided on the surface of the circuit board 300. The optical receiving directions of the two optical receiving chips are perpendicular to the surface of the circuit board. Therefore, an optical path turning device, such as the above-mentioned first turning prism and second turning prism, is required to turn the optical path of the optical signal, so as to transmit the optical signal into the optical receiving chip.

[0155] In order to fix the base 900c on the surface of the circuit board 300, a base mounting part 301 is formed on the surface of the circuit board 300. Exemplarily, the base mounting part 301 can be a through-hole structure. The base 900c is embedded in the base mounting part 301, so as to realize the fixed connection between the base 900c and the circuit board 300.

[0156] Figure 7D FIG. is an assembly diagram of a third base and a circuit board provided according to some embodiments of the present disclosure. As Figure 7D shown, in some embodiments, a base mounting part 301 is formed on the surface of the circuit board 300. Exemplarily, the base mounting part 301 can be a through-hole structure. The limiting part 924c of the base 900c is embedded in the base mounting part 301, and the surface of the limiting part 924c facing outward is mounted on the surface of the circuit board 300, so as to realize the fixed connection between the base 900c and the circuit board 300.

[0157] Figure 8 FIG. is a structural diagram of a fourth base provided according to some embodiments of the present disclosure. As Figure 8 shown, in some embodiments, the optical receiving component and the optical transmitting component are arranged on different surfaces of the same base, where the base can be the base 900d. Figure 8 The upper surface structure of the base 900d is shown, and the lower surface structure of the base 900d can refer to the lower surface structure of the above-mentioned base 900c.

[0158] Similar to the above-mentioned bases, a convex portion 914d is formed by protruding upward from the upper surface of the base 900d. Heat dissipation of the light-emitting component is achieved through the contact between the convex portion 914d and the upper housing.

[0159] On one side of the convex portion 914d, a first bearing surface 911d and a second bearing surface 913d are respectively formed. The surface of the second bearing surface 913d is lower than the surface of the first bearing surface 911d to match the optical path between the optical components; on the other side, a third bearing surface 912d and a fourth bearing surface 915d are respectively formed. The surface of the fourth bearing surface 915d is lower than the surface of the third bearing surface 912d to match the optical path between the optical components.

[0160] In some embodiments, the AWG can be horizontally placed on the corresponding bearing surfaces. For example, the first AWG is horizontally placed on the first bearing surface 911d, and the second AWG is horizontally placed on the third bearing surface 912d. The first AWG is disposed on the surface of the first bearing surface 911d, and the light-emitting end face of the first AWG is horizontally placed on the surface of the first bearing surface 911d, and the light-emitting end face of the first AWG is set as a plane; the second AWG is disposed on the surface of the third bearing surface 912d, and the light-emitting end face of the second AWG is horizontally placed on the surface of the third bearing surface 912d, and the light-emitting end face of the second AWG is set as a plane.

[0161] Similarly, an optical path turning device such as a turning prism is required to turn the optical signal output by the AWG to transmit the optical signal to the surface of the optical receiving chip. Based on this, a first optical path turning device such as a first turning prism is disposed on the surface of the second bearing surface 913d to turn the optical signal output by the first AWG; a second optical path turning device such as a second turning prism is disposed on the surface of the fourth bearing surface 915d to turn the optical signal output by the second AWG. In order to achieve the matching of the optical path height, the surface of the second bearing surface 913d is lower than the surface of the first bearing surface 911d, and the surface of the fourth bearing surface 915d is lower than the surface of the third bearing surface 912d.

[0162] In order to transmit the optical signal output by the AWG to the surface of the optical receiving chip, a part of the surface of the first turning prism is mounted on the surface of the circuit board 300, and the other part of the surface is suspended to transmit the optical signal out of the first turning prism and transmit it to the surface of the optical receiving chip. The second turning prism is also arranged in the same way.

[0163] In some embodiments, in order to facilitate the limiting of the corresponding turning prism, the end faces of the convex portion 914d are flush with the end faces of the second bearing surface 913d and the fourth bearing surface 915d respectively.

[0164] In some embodiments, in order to avoid the connection component between the AWG chip and the capillary in the AWG, a first limiting portion 919d is formed on the surface of the first bearing surface 911d, and a second limiting portion 918d is formed on the surface of the third bearing surface 912d, so as to avoid the connection component respectively. Exemplarily, the connection component can be glue.

[0165] In some embodiments, in order to limit and fix the AWG, a blocking portion 917d is formed on the side of the first bearing surface 911d, and a blocking portion 916d is formed on the side of the third bearing surface 912d, so as to respectively block the first AWG and the second AWG at a certain height to limit and fix the AWG.

[0166] Figure 9 FIG. 1 is a structural diagram of a fifth base provided according to some embodiments of the present disclosure. Figure 9 As shown, in some embodiments, the light receiving component and the light emitting component are arranged on different surfaces of the same base, wherein the base may be base 900e. Figure 9 The upper surface structure of the base 900e is shown, and the lower surface structure of the base 900e can refer to the lower surface structure of the above-mentioned base 900c.

[0167] Like the above-mentioned bases, the upper surface of the base 900e protrudes upward to form a protrusion 914e. The contact between the protrusion 914d and the upper shell realizes heat dissipation of the light emitting component.

[0168] A first bearing surface 911e and a second bearing surface 912e are formed on one side of the protrusion 914e. For example, in order to facilitate the positioning of the optical device, the end surfaces of the first bearing surface 911e and the second bearing surface 912e can be flush with the end surface of the protrusion 914e. The surface of the protrusion 914e is relatively protruding from the first bearing surface 911e and the second bearing surface 912e.

[0169] In order to realize the reception of multiple optical signals, a first light receiving component is provided on the surface of the first bearing surface 911e, and a second light receiving component is provided on the surface of the second bearing surface 912e.

[0170] In some embodiments, the first light receiving component may include a first fiber collimator, a first optical demultiplexing component, and a first turning prism; the second light receiving component may include a second fiber collimator, a second optical demultiplexing component, and a second turning prism.

[0171] The first fiber collimator, the first optical demultiplexing component, and the first turning prism are separately disposed on the surface of the first bearing surface 911e; the second fiber collimator, the second optical demultiplexing component, and the second turning prism are separately disposed on the surface of the second bearing surface 912e.

[0172] The first turning prism is disposed on one side of the first bearing surface 911e close to the optical receiving chip to turn the optical paths of the multiple optical signals output by the first optical demultiplexing component to the surface of the optical receiving chip and transmit the optical signals to the surface of the optical receiving chip; the second turning prism is disposed on one side of the second bearing surface 912e close to the optical receiving chip to turn the optical paths of the multiple optical signals output by the second optical demultiplexing component to the surface of the optical receiving chip and transmit the optical signals to the surface of the optical receiving chip.

[0173] Figure 10 It is an assembly structure diagram of an optical receiving component provided according to some embodiments of the present disclosure; Figure 11 It is an exploded assembly diagram of an optical receiving component provided according to some embodiments of the present disclosure. As Figure 10 and Figure 11 shown, in some embodiments, taking the base 900a as an example, the base 900a is embedded in the surface of the circuit board 300. Different surfaces of the base 900a are used to arrange the optical receiving component and the optical transmitting component. Exemplarily, the upper surface of the base 900a is used to arrange the optical receiving component 500a, and the lower surface is used to arrange the optical transmitting component 400a. Among them, the "upper surface" refers to the Figure 10 displayed surface, and the "lower surface" is the surface opposite to the upper surface. The optical receiving component 500a of the present disclosure can also be arranged on the lower surface of the base 900a, and the optical transmitting component 400a can also be arranged on the upper surface of the base 900a.

[0174] In some embodiments, the surface of the base 900a is irradiated with a first protective cover 530a to protect the optical devices arranged on the surface of the base 900a in the optical receiving component 500a. Exemplarily, when some optical devices in the optical receiving component are arranged on the upper surface of the base 900a, the upper surface of the base 900a is irradiated with the first protective cover 530a.

[0175] Part of the surface of the base 900a protrudes upward to form a protruding portion 910a. In order to realize the reception of multiple optical signals, a first optical receiving component 510a is arranged on one side of the protruding portion 910a, and a second optical receiving component 520a is arranged on the other side of the protruding portion 910a.

[0176] In some embodiments, the first protective cover 530a respectively has a first notch 531a and a second notch 532a. The first notch 531a is used to avoid the protruding portion 910a, and the second notch 532a is used to avoid the electrical components on the surface of the circuit board 300, such as capacitors, resistors, etc. Exemplarily, the first notch 531a faces the protruding portion 910a and is connected to the end of the protruding portion 910a to avoid the protruding portion 910a; the second notch 532a faces the circuit board to avoid the electrical components on the surface of the circuit board 300.

[0177] Figure 12A cross-sectional structure diagram of an optical receiving component provided according to some embodiments of the present disclosure. As Figure 12 shown, as described above, in order to achieve multi-channel reception, a first optical receiving passive device is disposed on the first bearing surface 911a on one side of the convex portion 910a, and a second optical receiving passive device is disposed on the second bearing surface 912a on the other side of the convex portion 910a. A first extension portion 9131 is formed at the end of the first bearing surface 911a, and a second extension portion 9133 is formed at the end surface of the second bearing surface 912a.

[0178] In some embodiments, the first optical receiving passive device in the first optical receiving component 510a may be an optical fiber array or other forms of optical receiving passive devices. The optical fiber array in the first optical receiving component 510a is described as the first optical fiber array 511a, and the optical fiber array in the second optical receiving component 520a is described as the second optical fiber array 521a.

[0179] The first optical receiving component 510a further includes a first turning prism to adjust the transmission direction of the optical signal received by the first optical fiber array from parallel to the circuit board surface to perpendicular to the circuit board surface. Similarly, the second optical receiving component 520a also includes a second turning prism to adjust the transmission direction of the optical signal received by the second optical receiving array from parallel to the circuit board surface to perpendicular to the circuit board surface. In some embodiments, a lens, such as a converging lens, is provided in the incident light direction of the first turning prism or the second turning prism to improve the optical coupling efficiency. The structural member including the lens and the first turning prism or the second turning prism is described as a lens assembly. Then, a first lens assembly 512a is provided in the light output direction of the first optical fiber array, and a second lens assembly 522a is provided in the light output direction of the second optical fiber array.

[0180] The first optical fiber array 511a is disposed on the surface of the first bearing surface 911a, and the first lens assembly 512a is disposed on the surface of the first extension portion 9131; the second optical fiber array 521a is disposed on the surface of the second bearing surface 912a, and the second lens assembly 522a is disposed on the surface of the second extension portion 9133.

[0181] In some embodiments, the first optical receiving component 510a further includes an optical receiving chipset and a transimpedance amplifier disposed on the surface of the circuit board. Exemplarily, the optical receiving chipset includes a plurality of optical receiving chips 513a, and the optical receiving chips 513a are configured to convert optical signals into electrical signals; the optical receiving chips 513a are electrically connected to the transimpedance amplifier 514a to amplify the electrical signals through the transimpedance amplifier. Exemplarily, the optical receiving chips 513a and the transimpedance amplifier 514a can be wire-bonded to achieve electrical connection therebetween. The surface of the optical receiving chip 513a has a first connection pad, and the surface also has a photosensitive surface. Generally, the first connection pad and the photosensitive surface of the optical receiving chip are on the same surface; the surface of the transimpedance amplifier has a second connection pad, and the first connection pad and the second connection pad are wire-bonded to achieve electrical connection therebetween. At this time, the photosensitive surface and the first connection pad of the optical receiving chip 513a both face upward, and the photosensitive surface is exposed to the air. In order to reduce the reflection of optical signals into the air and enable more optical signals to be absorbed into the photosensitive surface, an antireflection film is plated on the surface of the photosensitive surface. The refractive index of the antireflection film is greater than that of the air, so that more optical signals are transmitted into the photosensitive surface, ensuring the optical receiving power.

[0182] Figure 13 Schematic diagram of electrical connection between an optical receiving chip and a transimpedance amplifier provided according to some embodiments of the present disclosure. Figure 13 Shows another way of electrical connection between the optical receiving chip and the transimpedance amplifier. As Figure 13 shown, in some embodiments, the transimpedance amplifier 514a is disposed on the surface of the circuit board 300, and the first connection pad on the surface of the optical receiving chip 513a is soldered to the second connection pad on the surface of the transimpedance amplifier 514a, thereby achieving electrical connection between the optical receiving chip 513a and the transimpedance amplifier 514a. That is, the optical receiving chip 513a is flip-chip bonded to the surface of the transimpedance amplifier 514a, and the photosensitive surface of the optical receiving chip 513a is disposed downward. In order to transmit the optical signal to the photosensitive surface, a lens is provided on the surface of the optical receiving chip 513a exposed to the air, and an optical through-hole can be formed between the lens and the photosensitive surface, and the optical signal is transmitted to the photosensitive surface through the optical through-hole, thereby achieving the reception of the optical signal. By flip-chip bonding the optical receiving chip 513a to the transimpedance amplifier 514a, the parasitic effects generated during wire bonding can be avoided, and the signal transmission performance can be improved; at the same time, since the photosensitive surface of the optical receiving chip 513a is not exposed to the air, the reflection of optical signals into the air is reduced, ensuring the optical receiving power.

[0183] In some embodiments, the surface of the transimpedance amplifier 514a is provided with a second connection pad. The photosensitive surface of the optical receiving chip 513a is disposed upward, and then it is adhesively bonded to the surface of the second connection pad through glue, and the electrical connection between the first connection pad and the second connection pad is achieved through a metal via, thereby achieving the electrical connection between the optical receiving chip 513a and the transimpedance amplifier 514a.

[0184] Figure 14 A structural diagram of an optical receiving component provided according to some embodiments of the present disclosure; Figure 15 An exploded view of an optical receiving component provided according to some embodiments of the present disclosure; Figure 16 A structural diagram of a lens assembly provided according to some embodiments of the present disclosure. As Figures 14 - 16 shown, a middle surface of the base 900a protrudes upward to form a protruding portion 910a, and surfaces on both sides respectively form a first bearing surface 911a and a second bearing surface 912a. One end of the first bearing surface 911a extends to form a first extension portion 9131, and one end of the second bearing surface 912a extends to form a second extension portion 9133. One side of the protruding portion 910a is used to dispose a first optical receiving component, and the other side is used to dispose a second optical receiving component to achieve reception of multiple optical signals.

[0185] The first bearing surface 911a and the first extension portion 9131 are respectively used to bear a first optical fiber array 511a and a first lens assembly 512a. The first lens assembly 512a is used to turn the optical signal received by the first optical fiber array 511a toward the surface of the circuit board 300, so as to transmit the optical signal to the surface of the optical receiving chip; the second bearing surface 912a and the second extension portion 9133 are respectively used to bear a second optical fiber array 521a and a second lens assembly 522a, and the second lens assembly 522a is used to turn the optical signal received by the second optical fiber array 521a toward the surface of the circuit board 300, so as to transmit the optical signal to the surface of the optical receiving chip.

[0186] In some embodiments, in order to limit the first optical fiber array 511a and the second optical fiber array 521a respectively, a first limiting platform 914a is formed between the first extension portion 9131 and the first bearing surface 911a, and a second limiting platform 915a is formed between the second extension portion 9133 and the second bearing surface 912a. The surface of the first limiting platform 914a is higher than the surface of the first bearing surface 911a to limit the first optical fiber array 511a in a first direction; the surface of the second limiting platform 915a is higher than the surface of the second bearing surface 912a to limit the second optical fiber array 521a in the first direction. Exemplarily, the first direction may be along the length direction of the protruding portion 910a. The widths of the two limiting platforms are the same as the widths of the corresponding optical fiber arrays to limit the first optical fiber array 511a and the second optical fiber array 521a in a second direction. Exemplarily, the second direction may be along the width direction of the protruding portion 910a.

[0187] In some embodiments, since the surface of the first limit platform 914a is higher than the surface of the first bearing surface 911a, and the surface of the second limit platform 915a is higher than the surface of the second bearing surface 912a, a chamfer is formed at the junction of the limit platform and the corresponding bearing surface when processing the base. The existence of the chamfer causes the end of the light receiving passive component to be tilted at the chamfer position when mounting the light receiving passive component, resulting in uneven mounting of the light receiving passive component, thereby reducing the stability of the receiving optical path. To this end, a first depression 916a is formed at the junction of the first limit platform 914a and the first bearing surface 911a, and a second depression 917a is formed at the junction of the second limit platform 915a and the second bearing surface 912a. The setting of the first depression 916a makes the end of the first light receiving passive component horizontally abut against the wall surface of the first limit platform 914a, thereby ensuring that the first light receiving passive component is mounted flat. Similarly, the second recessed portion 917a is provided so that the end face of the second light receiving passive component is horizontally abutted against the wall surface of the second limiting platform 915a, thereby ensuring that the second light receiving passive component is mounted flat. Exemplarily, the surface of the first recessed portion 916a gradually tilts toward the wall surface of the first limiting platform 914a, and the surface of the second recessed portion 917a gradually tilts toward the wall surface of the second limiting platform 915a, so that the first recessed portion 916a and the second recessed portion 917a are concave at one end surface close to the corresponding limiting platform, avoiding interference with the light receiving passive component, ensuring that the light receiving passive component is mounted flat, and thus ensuring the stability of the receiving optical path.

[0188] like Figure 15 As shown, the first lens assembly 512a is disposed on the surface of the first extension portion 9131, and the second lens assembly 522a is disposed on the surface of the second extension portion 9133. In order to make the optical paths of the first lens assembly 512a and the first optical fiber array 511a at the same height, the surface of the first extension portion 9131 is lower than the surface of the first bearing surface 911a; similarly, the surface of the second extension portion 9133 is lower than the surface of the second bearing surface 912a.

[0189] In the present disclosure, in order to facilitate mounting the optical receiving chip array on the surface of the circuit board 300, the extension lengths of the first extension portion 9131 and the second extension portion 9133 allow the optical receiving chip array to be exposed. The first optical path turning device is disposed on the surface of the first extension portion 9131 through the first substrate; the extension length of the first substrate is longer than the extension length of the first extension portion 9131, so as to extend the first optical path turning device to the surface of the optical receiving chip array. Similarly, the second optical path turning device is disposed on the surface of the second extension portion 9133 through the second substrate; the extension length of the second substrate is longer than the extension length of the second extension portion, so as to extend the second optical path turning device to the surface of the optical receiving chip array.

[0190] like Figure 15 and Figure 16As shown, the first lens assembly 512a includes a substrate 5121, a backing plate 5122, a converging lens 5123, and a turning prism 5124 respectively. Correspondingly, the second lens assembly 522a also includes the same optical devices as above. The substrate 5121 is the aforementioned first substrate.

[0191] In the present disclosure, a surface-mounted optical receiving chip and a TIA are provided on the surface of the circuit board 300 below the first extension portion 9131 and the second extension portion 9133. In order to facilitate the mounting of the optical receiving chip and the TIA, the lengths of the first extension portion 9131 and the second extension portion 9133 extending out should not be too long, otherwise it will increase the mounting difficulty of the optical receiving chip and the TIA. Exemplarily, the lengths of the first extension portion 9131 and the second extension portion 9133 extending out expose the optical receiving chip and the TIA, so as to facilitate the mounting of the optical receiving chip and the TIA.

[0192] One end of the substrate 5121 is used to carry the backing plate 5122, and the backing plate 5122 is used to carry the converging lens 5123; the other end of the substrate 5121 is used to carry the turning prism 5124. At the same time, the length of the substrate 5121 is longer than the lengths of the first extension portion 9131 and the second extension portion, so as to extend the turning prism 5124 above the optical receiving chip and the TIA.

[0193] In order to enable the light output by the turning prism 5124 to be transmitted to the surface of the optical receiving chip, the supporting surface of the substrate 5121 for carrying the turning prism 5124 has a light-transmitting opening, so that the light output by the turning prism 5124 can pass through the light-transmitting opening to reach the surface of the optical receiving chip. Exemplarily, the supporting surface of the substrate 5121 for carrying the turning prism 5124 is arranged in a U shape. The arms on both sides of the U-shaped supporting surface are used to support the turning prism 5124, and the opening in the middle of the U-shaped supporting surface is the light-transmitting opening, so that the light output by the turning prism 5124 can pass through the light-transmitting opening to reach the surface of the optical receiving chip.

[0194] In some embodiments, the turning prism 5124 is extended above the optical receiving chip and the TIA by carrying the turning prism 5124 on the substrate 5121; the converging lens 5123 is carried by the backing plate 5122, so that the optical path of the converging lens 5123 matches the optical path of the turning prism 5124.

[0195] The end face of the backing plate 5122 facing the turning prism 5124 is in contact connection with the turning prism 5124, and the end face of the backing plate 5122 facing the turning prism 5124 can be used to limit and fix the turning prism 5124.

[0196] Figure 17 It is an assembly schematic diagram of another optical receiving component provided according to some embodiments of the present disclosure; Figure 18 It is a structural schematic diagram of another optical receiving component provided according to some embodiments of the present disclosure; Figure 19Another exploded view of an optical receiving component provided according to some embodiments of the present disclosure. As Figures 17 - 19 shown, in some embodiments, taking the base 900b as an example, the circuit board 300 is provided with a base mounting portion 303, and the base 900b is located above the base mounting portion 303. The optical receiving component is located above the base 900b, and the optical transmitting component is located below the base 900b.

[0197] To achieve the reception of multiple optical signals, a first optical receiving component 510b is provided on one side of the protruding portion, and a second optical receiving component 520b is provided on the other side. The first optical receiving component 510b and the second optical receiving component 520b are provided on the same surface of the base. Exemplarily, the first optical receiving component 510b and the second optical receiving component 520b are provided on the upper surface of the base.

[0198] Exemplarily, a protruding portion 914b is formed by protruding upward from the upper surface of the base 900b. The first optical receiving component 510b and the second optical receiving component 520b are respectively provided on both sides of the protruding portion 914b.

[0199] In some embodiments, the first optical receiving component 510b includes: a first optical collimator 511b, a first demultiplexer 512b, a first lens assembly 513b, a first optical chip group 514b, and a first transimpedance amplifier 515b. Among them, the first optical collimator 511b and the first demultiplexer 512b are located on the upper surface of the base 900b and on the side of the first side wall 9141 of the protruding portion 914b. The first lens assembly 513b, the first optical chip group 514b, and the first transimpedance amplifier 515b are located on the upper surface of the circuit board 300.

[0200] For convenient assembly, the first side wall 9141 positions the first optical collimator 511b and the first demultiplexer 512b, and the first optical collimator 511b and the first demultiplexer 512b are connected to the upper surface of the base 900b. The first lens assembly 513b respectively includes: a first coupling substrate, a first converging lens group, and a first reflecting prism. The first coupling substrate is located on the upper surface of the circuit board, providing a suitable mounting height for the first converging lens group and the first reflecting prism, so that the height of the central axes of the first converging lens group and the first reflecting prism is consistent with the height of the first optical collimator 511b and the first demultiplexer 512b, realizing optical path coupling.

[0201] The first optical collimator 511b is connected to the fiber optic adapter through an optical fiber, receives the signal light from the outside, and collimates the signal light. The first demultiplexer 512b demultiplexes the signal light from the first optical collimator 511b to form signal lights with different wavelengths. The first converging lens group converges the demultiplexed signal lights, and the first reflecting prism reflects the converged light to the first optical chip group 514b. The first optical chip group 514b converts the optical signal into an electrical signal and transmits it to the first transimpedance amplifier 515b.

[0202] In some embodiments, the second optical receiving component 520b includes: a second optical collimator 521b, a second demultiplexer 522b, a second lens assembly 523b, a second optical chip group 524b, and a second transimpedance amplifier 525b. Among them, the second optical collimator 521b and the second demultiplexer 522b are located on the upper surface of the base 900b and on one side of the second side wall 9142 of the convex portion 914b. The second lens assembly 523b, the second optical chip group 524b, and the second transimpedance amplifier 525b are located on the upper surface of the circuit board 300.

[0203] For convenient assembly, the second side wall 9142 positions the second demultiplexer 522b, and the second optical collimator 521b and the second demultiplexer 522b are connected to the upper surface of the base 900b. To achieve the unification of the optical central axes of the second optical collimator 521b, the second demultiplexer 522b, and the second lens assembly, the second lens assembly 523b includes: a second coupling substrate, a second converging lens group, and a second reflecting prism. The second coupling substrate is located on the upper surface of the circuit board, providing an installation platform for the second converging lens group and the second reflecting prism, so that the heights of the central axes of the second converging lens group and the second reflecting prism are the same as those of the second optical collimator 521b and the second demultiplexer 522b, realizing optical path coupling.

[0204] The second optical collimator 521b is connected to the fiber optic adapter through an optical fiber, receives the signal light from the outside, and collimates the signal light. The second demultiplexer 522b demultiplexes the signal light from the second optical collimator 521b to form signal lights with different wavelengths. The second converging lens group converges the demultiplexed signal lights, and the second reflecting prism reflects the converged light to the second optical chip group 524b. The second optical chip group 524b converts the optical signal into an electrical signal and transmits it to the second transimpedance amplifier 525b.

[0205] In some embodiments, the first converging lens group and the second converging lens group can be arranged on the base or on the circuit board.

[0206] In some embodiments, the surface of the base 900b can also be irradiated with a first protective cover to protect the optical receiving components disposed on the surface of the base 900a. Exemplarily, when some optical devices in the optical receiving components are disposed on the upper surface of the base 900b, the upper surface of the base 900b is irradiated with a first protective cover to protect the optical devices.

[0207] Figure 20 Another assembly structure diagram of an optical receiving component provided according to some embodiments of the present disclosure; Figure 21 Another schematic structural diagram of an optical receiving component provided according to some embodiments of the present disclosure; Figure 22 Another exploded schematic diagram of an optical receiving component provided according to some embodiments of the present disclosure; As Figures 20 - 22 shown, in some embodiments, taking the base as the base 900c as an example, the optical receiving component 500c and the optical transmitting component 400c are respectively located on different surfaces of the base 900c. Exemplarily, the optical receiving component 500c is located on the upper surface of the base 900c, and the optical transmitting component 400c is located on the lower surface of the base 900c. The circuit board 300 is provided with a base mounting portion 303, and the base 900c is located above the base mounting portion 303.

[0208] In some embodiments, the optical receiving component 500c and the optical transmitting component 400c are respectively located on different surfaces of the base 900c. A convex portion 914c is formed by protruding upward on the upper surface of the base 900c. Heat dissipation of the optical transmitting component is achieved through the contact between the convex portion 914c and the upper housing. The upper surface of the base 900c further includes a first bearing surface 911c, a second bearing surface 912c, and a third bearing surface 913c located on different sides of the convex portion 914c. Exemplarily, the first bearing surface 911c and the second bearing surface 912c are respectively located on both sides in the length direction of the convex portion 914c, and the third bearing surface 913c is located on one side in the width direction of the convex portion 914c. The surfaces where the first bearing surface 911c, the second bearing surface 912c, and the third bearing surface 913c are located are all lower than the surface of the convex portion 914c.

[0209] In order to achieve multi-channel reception, a first optical receiving component is provided on one side of the convex portion 914c, and a second optical receiving component is provided on the other side of the convex portion 914c. Taking the optical receiving passive devices in the first optical receiving component and the second optical receiving component as AWGs as an example, a first optical receiving passive device such as a first AWG is disposed on the surface of the first bearing surface 911c, and a second optical receiving passive device such as a second AWG is disposed on the surface of the second bearing surface 912c. As Figure 21 and Figure 22As shown, taking the example where the first AWG and the second AWG can be respectively placed vertically on corresponding bearing surfaces, and the light-emitting end faces of the first AWG and the second AWG do not have reflecting surfaces, the first light-receiving component is located on one side of the convex portion 914c, and the second light-receiving component is located on the other side of the convex portion 914c to achieve the reception of multiple optical signals.

[0210] In some embodiments, the first light-receiving component respectively includes a first AWG 511c, a first reflecting surface 513c, a first turning prism 514c, and a light-receiving chip disposed on the surface of the circuit board. Among them, the first turning prism 514c is a first optical path turning device. Exemplarily, in order to improve the optical coupling efficiency, a first lens 512c is further provided between the light-emitting end face of the first AWG 511c and the first reflecting surface 513c. Among them, each optical signal demultiplexed by the first AWG 511c is converged by the first lens 512c and then reflected by the first reflecting surface 513c into the first turning prism 514c. The first reflecting surface 513c reflects the optical signal towards the light-incident end face of the first turning prism 514c. The first turning prism 514c turns the optical path of the received optical signal perpendicular to the surface of the circuit board to transmit each optical signal into the light-receiving chip on the surface of the circuit board 300. Among them, the light-incident end face and the light-emitting end face of the first turning prism 514c are located on adjacent sides. A first reflecting surface 513c is provided at the light-incident end face of the first turning prism 514c, and a light-receiving chip is provided below the light-emitting end face. In some embodiments, the second light-receiving component respectively includes a second AWG 521c, a second reflecting surface 523c, a second turning prism 524c, and a light-receiving chip disposed on the surface of the circuit board. Among them, the second turning prism 524c is a second optical path turning device. Exemplarily, in order to improve the optical coupling efficiency, a second lens 522c is further provided between the light-emitting end face of the second AWG 521c and the second reflecting surface 523c. The optical path principle of the second light-receiving component can refer to the optical path principle of the first light-receiving component.

[0211] In the present disclosure, the first lens 512c is disposed between the light-emitting optical path of the first light-receiving passive device and the first reflecting surface 513c. One end of the first lens 512c is disposed at one end of the third bearing surface, and the other end of the first lens 512c is used to carry the first reflecting surface 513c. The second lens 522c is disposed between the light-emitting optical path of the second light-receiving passive device and the second reflecting surface 523c. One end of the second lens 522c is disposed at the other end of the third bearing surface, and the other end of the second lens 522c is used to carry the second reflecting surface 523c.

[0212] One end of the first optical path turning device is connected to the side wall of the convex portion, and the other end is disposed in a suspended manner; one end of the second optical path turning device is connected to the side wall of the convex portion, and the other end is disposed in a suspended manner. The light incident end of the first turning prism faces the light exiting end face of the first reflecting surface, and the light exiting end faces the optical receiving chip array; the light incident end of the second turning prism faces the light exiting end face of the second emitting surface, and the light exiting end faces the optical receiving chip array.

[0213] In some embodiments, the first lens 512c, the first reflecting surface 513c, and the first turning prism 514c are respectively disposed on one side of the third bearing surface 913c; the second lens 522c, the second reflecting surface 523c, and the second turning prism 524c are respectively disposed on the other side of the third bearing surface 913c. Among them, the first lens 512c and the first reflecting surface 513c are fixed by bonding with optical glue. Similarly, the second lens 522c and the second reflecting surface 523c are fixed by bonding with optical glue.

[0214] In some embodiments, the AWG includes an AWG chip and a capillary tube, and the AWG chip and the capillary tube are connected through a connecting component. Exemplarily, the connecting component can be glue. In order to avoid the glue, a first avoiding portion 9111 is formed on the surface of the first bearing surface 911c, and a second avoiding portion 9121 is formed on the surface of the second bearing surface 912c. Since the connecting component has a certain thickness, in order to further avoid the connecting component, the width of one end of the convex portion 910a close to the third bearing surface 913c is greater than that of the other end, so as to further avoid the connecting component and provide sufficient space for the pigtails of the first AWG 511c and the second AWG 521c, and avoid the pigtails from being bent.

[0215] In some embodiments, in order to limit the optical elements on the third bearing surface 913c, a first limiting groove 9131c is formed on the third bearing surface 913c close to the first AWG, and a second limiting groove 9132c is formed on the side close to the second AWG. Exemplarily, the first lens 512c is disposed in the first limiting groove 9131c, and then the first reflecting surface 513c is fixed on the light exiting end face of the first lens 512c; the second lens 522c is disposed in the second limiting groove 9132c, and then the second reflecting surface 523c is fixed on the light exiting end face of the second lens 522c.

[0216] Figure 23 It is a top view structure diagram of another optical receiving component provided according to some embodiments of the present disclosure. As Figure 23As shown, the first AWG 511c and the second AWG 521c are respectively arranged on both sides of the convex portion 914c. The first lens 512c is arranged on the first limiting groove 9131c, and then the first reflecting surface 513c is fixed on the light-emitting end surface of the first lens 512c; the second lens 522c is arranged on the second limiting groove 9132c, and then the second reflecting surface 523c is fixed on the light-emitting end surface of the second lens 522c. The first turning prism 514c and the second turning prism 524c are respectively fixed on the end surface of the convex portion 914c facing the third bearing surface 913c, and the end surface of the convex portion 914c facing the third bearing surface 913c plays a role of limiting and fixing the first turning prism 514c and the second turning prism 524c.

[0217] In some embodiments, one end of the first turning prism 514c and the second turning prism 524c is arranged on the surface of the third bearing surface 913c, and the other end is suspended to output the turned optical signal.

[0218] Figure 24 It is a schematic structural diagram of another optical receiving component provided according to some embodiments of the present disclosure; Figure 25 It is an exploded schematic diagram of another optical receiving component provided according to some embodiments of the present disclosure; Figure 26 It is a top view schematic diagram of another optical receiving component provided according to some embodiments of the present disclosure. As Figures 24 - 26As shown, taking the example where the first AWG and the second AWG can be vertically placed on the corresponding bearing surfaces respectively and the light-emitting ends of the first AWG and the second AWG have reflecting surfaces, the light-receiving component at this time is defined as the light-receiving component 500d. In order to receive multiple optical signals, the light-receiving component 500d includes a first light-receiving component and a second light-receiving component. In the first light-receiving component, the first light-receiving component includes a first AWG 511d. The light-emitting end face of the first AWG 511d has a reflecting surface. Through this reflecting surface, the optical signal can be reflected towards the light-incident end face of the first turning prism 513d. A light-receiving chip is provided below the light-emitting end face of the first turning prism 513d. Thus, after the optical signal is reflected by the light-emitting end face of the first AWG 511d, it is incident on the first turning prism 513d, and then the first turning prism 513d turns the optical signal downward, so as to transmit the optical signal to the surface of the light-receiving chip. In order to improve the optical coupling efficiency, a first converging lens 512d is fixedly connected to the light-emitting end face of the first AWG 511d, thereby improving the optical coupling efficiency. In the second light-receiving component, the second light-receiving component includes a second AWG 521d. The light-emitting end face of the second AWG 521d also has a reflecting surface. Through this reflecting surface, the optical signal is reflected towards the light-incident end face of the second turning prism 523d. A light-receiving chip is provided below the light-emitting end face of the second turning prism 523d. The second turning prism 523d is used to turn the optical signal towards the surface of the light-receiving chip below, so as to transmit the optical signal to the surface of the light-receiving chip. Similarly, in order to improve the optical coupling efficiency, a second converging lens 522d is fixedly connected to the light-emitting end face of the second AWG 521d, thereby improving the optical coupling efficiency.

[0219] Figure 27 FIG. is an assembly schematic diagram of another light-receiving component provided according to some embodiments of the present disclosure; Figure 28 FIG. is a structural schematic diagram of another light-receiving component provided according to some embodiments of the present disclosure. As Figure 27 and Figure 28 shown, in some embodiments, taking the base as the base 900d as an example, the light-receiving component 500e and the light-emitting component are located on different surfaces of the base 900d respectively. Exemplarily, the light-receiving component 500e is located on the upper surface of the base 900d, and the light-emitting component is located on the lower surface of the base 900d.

[0220] A convex portion 914d is formed by protruding upward from the upper surface of the base 900d. Through the contact between the convex portion 914d and the upper housing, heat dissipation of the light-emitting component is achieved.

[0221] On one side of the convex portion 914d, a first bearing surface 911d and a second bearing surface 913d are respectively formed; on the other side of the convex portion 914d, a third bearing surface 912d and a fourth bearing surface 915d are respectively formed.

[0222] In some embodiments, the AWG can be horizontally placed on the corresponding bearing surfaces. For example, the first AWG 511e is horizontally placed on the first bearing surface 911d, and the second AWG 521e is horizontally placed on the third bearing surface 912d.

[0223] Since the first AWG 511e and the second AWG 521e emit light horizontally, an optical path turning device such as a turning prism is required to turn the optical signals output by the AWG so as to transmit the optical signals to the surface of the optical receiving chip. Based on this, a first turning prism 512e is provided on the surface of the second bearing surface 913d to turn the optical signals output by the first AWG 511e; a second turning prism 522e is provided on the surface of the fourth bearing surface 915d to turn the optical signals output by the second AWG 521e. To achieve the matching of the optical path height, the surface of the second bearing surface 913d is lower than the surface of the first bearing surface 911d, and the surface of the fourth bearing surface 915d is lower than the surface of the third bearing surface 912d.

[0224] To transmit the optical signals output by the AWG to the surface of the optical receiving chip, a part of the surface of the first turning prism 512e is mounted on the surface of the circuit board 300, and the other part of the surface is suspended, so as to let the optical signals pass through the first turning prism 512e and transmit them to the surface of the optical receiving chip. The second turning prism 522e is also arranged in the same way.

[0225] In some embodiments, in order to facilitate the limiting of the first turning prism 512e and the second turning prism 522e respectively, the end faces of the convex portions 914d are flush with the end faces of the second bearing surface 913d and the fourth bearing surface 915d respectively.

[0226] In some embodiments, in order to avoid the connecting components between the AWG chip and the capillary in the AWG, a first limiting portion 919d is formed on the surface of the first bearing surface 911d, and a second limiting portion 918d is formed on the surface of the third bearing surface 912d to avoid the connecting components respectively. Exemplarily, the connecting component can be glue.

[0227] In some embodiments, in order to limit and fix the AWG, a surrounding portion 917d is formed on the side surface of the first bearing surface 911d, and a surrounding portion 916d is formed on the side surface of the third bearing surface 912d to respectively surround the first AWG 511e and the second AWG 521e at a certain height, so as to limit and fix the AWG.

[0228] Figure 29 FIG. is an assembly schematic diagram of another optical receiving component according to some embodiments of the present disclosure; Figure 30 FIG. is a structural schematic diagram of another optical receiving component according to some embodiments of the present disclosure. Such as Figure 29 and Figure 30As shown, in some embodiments, taking the base 900e as an example, the base 900e is dot-connected to the circuit board 300, and a light receiving component 500f is provided on the surface of the base 900e.

[0229] As described above, a protruding portion 914e is formed by protruding upward on the upper surface of the base 900e. Heat dissipation of the light emitting component is achieved through the contact between the protruding portion 914d and the upper housing. A first bearing surface 911e and a second bearing surface 912e are respectively formed on one side of the protruding portion 914e. Exemplarily, in order to facilitate the positioning of the optical device, the end faces of the first bearing surface 911e and the second bearing surface 912e may be flush with the end face of the protruding portion 914e. The surface of the protruding portion 914e protrudes relatively from the first bearing surface 911e and the second bearing surface 912e.

[0230] In order to receive the optical path optical signal, part of the optical devices of the first light receiving component are provided on the surface of the first bearing surface 911e, and part of the optical devices of the second light receiving component are provided on the surface of the second bearing surface 912e. In some embodiments, the part of the optical devices of the first light receiving component respectively include a first fiber collimator 511f, a first converging lens 512f, a first optical demultiplexing component 513f, a first collimating lens 514f, and a first turning prism 515f. In addition to the above optical devices, the first light receiving component further includes a light receiving chip provided on the surface of the circuit board 300. Exemplarily, the light receiving chips are provided on the surface of the circuit board 300 in an array form. Among them, the external optical signal is transmitted to the inside of the first light receiving component through the first fiber collimator 511f. After being converged by the first converging lens 512f, the optical signal is transmitted to the first optical demultiplexing component 513f. After the demultiplexing process of the first optical demultiplexing component 513f, the optical signal is divided into multiple optical signals. After being collimated by the first collimating lens 514f, the multiple optical signals are transmitted to the first turning prism 515f. The first turning prism 515f is used to adjust the optical path of each optical signal from being parallel to the surface of the circuit board 300 to being perpendicular to the surface of the circuit board 300, so as to transmit each optical signal into the light receiving chip on the surface of the circuit board. Similarly, the part of the optical devices of the second light receiving component respectively include a second fiber collimator 521f, a second converging lens 522f, a second optical demultiplexing component 523f, a second collimating lens 524f, and a second turning prism 525f. In addition to the above optical devices, the second light receiving component further includes a light receiving chip provided on the surface of the circuit board 300. Exemplarily, the light receiving chips are also provided on the surface of the circuit board 300 in an array form. The optical path principle in the second light receiving component is the same as that in the first light receiving component, so it will not be elaborated further.

[0231] It can be understood that the technical features between the light receiving components disclosed in the above respective embodiments can be mutually borrowed, and for the unmentioned parts, reference can be made to the content related to other light receiving components.

[0232] Figure 31 An assembly schematic diagram of an optical emission component provided according to some embodiments of the present disclosure; Figure 32 A top view of the assembly of an optical emission component provided according to some embodiments of the present disclosure. As Figure 31 and Figure 32 shown, in some embodiments, taking the base 900a as an example, the optical receiving component 500a is disposed on one surface of the base 900a, and the optical emission component 400a is disposed on the other surface of the base 900a. Exemplarily, the optical receiving component 500a and the optical emission component 400a are distributed vertically. In some embodiments, the upper surface of the base 900a is covered with a first protective cover, and the lower surface is covered with a second protective cover. Exemplarily, the surface of the optical receiving component 500a is covered with a first protective cover 530a to protect the optical devices in the optical receiving component 500a; the surface of the optical emission component 400a is covered with a second protective cover 420a to protect the optical devices in the optical emission component 400a.

[0233] Viewed from a top-down perspective, the second protective cover 420a is divided into a first partition and a second partition. The first partition is the area A shown as Figure 32 shown, and the second partition is the area B shown as Figure 32 shown. Among them, the width of the circuit board corresponding to the area A is smaller, so the width of the area A is less than the width of the area B to ensure the relative distance between the area A and the circuit board, thereby ensuring the amount of glue pasted by the second protective cover 420a in the area A and increasing the firmness of the second protective cover 420a.

[0234] Figure 33 An exploded view of the assembly of an optical emission component provided according to some embodiments of the present disclosure; Figure 34 A structural diagram of a second protective cover in an optical emission component provided according to some embodiments of the present disclosure. As Figure 33 and Figure 34As shown, in some embodiments, a third bearing surface 921a, a fourth bearing surface 922a, and a fifth bearing surface 923a are respectively formed on the lower surface of the base 900a. Exemplarily, the third bearing surface 921a is used to dispose the laser group 412a in the optical emission component. A TEC 411a is disposed below the laser group 412a. The TEC 411a and the laser group 412a are stacked together with a certain height. The setting of the third bearing surface 921a causes the laser group 412a to sink so as to sink to be flush with the surface of the circuit board 300, thereby ensuring that the wire bonding length between the laser group 412a and the surface of the circuit board 300 is short. The fourth bearing surface 922a is used to carry the optical emission passive device. Exemplarily, the optical emission passive device can be an optical fiber array, or an optical multiplexing component, or an AWG, etc. When the optical emission passive device is an optical fiber array, the surface of the fifth bearing surface 923a is used to dispose the pigtail. Taking the optical fiber array 415a carried on the surface of the fourth bearing surface 922a as an example, the pigtail is carried on the surface of the fifth bearing surface 923a.

[0235] In some embodiments, in order to improve the optical coupling efficiency, a lens group 413a is disposed between the optical fiber array 415a and the laser group 412a to converge the optical signals emitted by each laser and then emit them, thereby improving the optical coupling efficiency.

[0236] In some embodiments, in order to prevent the second protective cover 420a from coming into contact with the optical emission component, especially from coming into contact with the pigtail and causing interference, first support portions 924a are formed on both side surfaces of the fifth bearing surface 923a. At the same time, second support portions 925a can also be formed on both side surfaces of the fourth bearing surface 922a. Through the first support portions 924a and the second support portions 925a, the protective cover can be erected to a certain height, so that there is a certain gap between the protective cover and the optical emission component, thereby avoiding mutual interference between the two.

[0237] One end of the second protective cover 420a forms a plug-in portion 421a, the other end forms an avoidance portion 424a, and a side wall 423a is further formed in the middle of the second protective cover 420a. A notch 422a is formed between the plug-in portion 421a and the side wall 423a.

[0238] In order to realize the fixed connection between the protective cover and the base 900a, an embedding portion 9241 is formed on the surface of the first support portion 924a, and the protective cover is disposed in the embedding portion 9241, thereby fixing the protective cover on the base 900a. Of course, other structures can also be adopted to realize the fixation of the protective cover. Exemplarily, the second protective cover 420a forms a plug-in portion 421a, and the plug-in portion 421a is plugged into the embedding portion 9241, thereby fixing the protective cover on the base 900a.

[0239] The side walls 423a on both sides of the second protective cover 420a wrap the first support portion 924a and the second support portion 925a respectively, so as to cover the second protective cover 420a on the base 900a.

[0240] It can be seen from Figure 34 that the dimension of the insertion portion 421a in the width direction of the second protective cover 420a is smaller than the dimension of the side wall 423a in the width direction of the second protective cover 420a. Therefore, during machining, an inner chamfer is likely to be formed at the intersection of the insertion portion 421a and the side wall 423a, and the inner chamfer interferes with the base 900a. Therefore, a notch 422a is formed between the insertion portion 421a and the side wall 423a to remove the inner chamfer formed by machining, so as to avoid interference between the second protective cover 420a and the base 900a.

[0241] There is a high-frequency signal line between the laser group 412a and the DSP chip arranged on the surface of the circuit board 300 to transmit the electrical signal from the DSP chip to the inside of the laser group 412a. The dielectric constant of the second protective cover 420a is different from that of air, and the dielectric constant of the second protective cover 420a is greater than that of air. If the surface of the high-frequency signal line contacts the second protective cover 420a, then based on the fact that the impedance is negatively correlated with the dielectric constant, the impedance of the high-frequency signal line at the position where it intersects with the second protective cover 420a will decrease, reducing the high-frequency signal transmission performance. Therefore, an avoidance portion 424a is formed at the other end of the second protective cover 420a to make the second protective cover 420a as far away from the high-frequency signal line as possible, thereby reducing the influence on the impedance of the high-frequency signal line.

[0242] In some embodiments, an isolator is provided to prevent the optical signal emitted by the laser group 412a from returning to the inside of the laser group 412a again, which affects the optical signal quality. Exemplarily, the isolator 414a is arranged between the fiber array 415a and the laser group 412a. Correspondingly, in order to arrange the isolator, a fifth bearing surface 926a is formed between the fourth bearing surface 922a and the third bearing surface 921a. The fifth bearing surface 926a is used to arrange the isolator 414a.

[0243] As described above, for optical path matching, the surface of the fifth bearing surface 926a is higher than the fourth bearing surface 922a, which can also play a role in limiting the fiber array 415a in the first direction. Exemplarily, the first direction can be the length direction of the convex portion 910a. In order to limit the fiber array 415a in the second direction, the surfaces at both ends of the fifth bearing surface 926a can be recessed downward so that the width of the protruding surface of the fifth bearing surface 926a is the same as the width of the fiber array 415a, thereby limiting the fiber array 415a in the second direction. Exemplarily, the second direction can be the width direction of the convex portion 910a.

[0244] Figure 35 An assembled side view of an optical emission component provided according to some embodiments of the present disclosure; Figure 36 An exploded assembled side view of an optical emission component provided according to some embodiments of the present disclosure. As Figure 35 and Figure 36 shown, in some embodiments, a plug-in portion 421a is formed at one end of the second protective cover 420a, and an embedding portion 9241 is formed on the base 900a. The plug-in portion 421a is plugged into the embedding portion 9241, thereby fixing the protective cover to the base 900a.

[0245] An avoidance portion 424a is formed at the other end of the second protective cover 420a, so that the second protective cover 420a is as far away from the high-frequency signal line as possible, thereby reducing the influence on the impedance of the high-frequency signal line and ensuring the high-frequency signal transmission performance.

[0246] Figure 37 A sectional structure diagram of an optical emission component provided according to some embodiments of the present disclosure; Figure 38 An exploded structure diagram of an optical emission component provided according to some embodiments of the present disclosure. As Figure 37 and Figure 38 shown, in some embodiments, a third bearing surface 921a, a fourth bearing surface 922a, and a fifth bearing surface 923a are respectively formed on the lower surface of the base 900a. Exemplarily, the third bearing surface 921a is used to arrange the TEC 411a in the optical emission component, the laser group 412a and the lens group 413a respectively located on the surface of the TEC 411a. The third bearing surface 921a causes the laser group to sink, so that the surfaces of the lasers are flush with the surface of the circuit board 300, thereby ensuring that the wire bonding length between the surfaces of the lasers and the circuit board 300 is short and improving the high-frequency performance transmission performance. Taking the optical fiber array 415a being carried on the surface of the fourth bearing surface 922a as an example, the pigtail is carried on the surface of the fifth bearing surface 923a.

[0247] In some embodiments, the fifth bearing surface 923a, the fourth bearing surface 922a, and the third bearing surface 921a are arranged in a stepped manner, and the surface heights of the three decrease in sequence, thereby achieving matching in the optical path height.

[0248] In some embodiments, an optical emission passive device such as an optical fiber array can be mounted on the fourth bearing surface 922a by glue. When the stress generated during glue bonding is too concentrated, the bottom surface of the optical fiber array 415a will break. Therefore, in order to avoid stress concentration, protruding portions 927a are formed at intervals on the surface of the fourth bearing surface 922a. The spaced arrangement of the protruding portions 927a can disperse the stress generated by the glue, thereby avoiding excessive glue stress concentration to ensure that the optical fiber array 415a is not damaged during mounting.

[0249] Figure 39Another assembly sectional view of an optical emission component provided according to some embodiments of the present disclosure. As Figure 39 shown, in some embodiments, taking the base 900b as an example, the circuit board 300 is provided with a base mounting portion 303, and the base 900b is located above the base mounting portion 303. The optical receiving component 500b is located above the base 900b, and the optical emission component 400b is located below the base 900b.

[0250] Figure 40 Another assembly schematic diagram of an optical emission component provided according to some embodiments of the present disclosure; Figure 41 Another structural schematic diagram of an optical emission component provided according to some embodiments of the present disclosure; Figure 42 Another sectional structure diagram of an optical emission component provided according to some embodiments of the present disclosure. As Figures 40 - 42 shown, in order to achieve the emission of multiple optical signals, the optical emission component 400b includes a first optical emission component 410b and a second optical emission component 420b. The first optical emission component 410b includes: a first optical fiber connector 411b, a first converging lens 412b, a first multiplexer 413b, and a first optical emission assembly 414b. The first optical fiber connector 411b, the first converging lens 412b, and the first multiplexer 413b are located on the lower surface of the base 900b. The first optical emission assembly 414b is located in the first recess 915b, and a semiconductor cooler 417 is further provided above the first optical emission assembly 414b. The first recess 915b makes the lower surface of the first optical emission assembly 414b flush with the lower surface of the circuit board 300, shortening the wire bonding distance between the first optical emission assembly 414b and the circuit board 300.

[0251] The first optical emission assembly 414b is electrically connected to the circuit board 300. The first optical emission assembly 414b converts multiple electrical signals into multiple optical signals and forms collimated light. The first multiplexer 413b multiplexes the multiple optical signals into a beam of multi-wavelength signal light. The multi-wavelength signal light is converged by the first converging lens 412b to the first optical fiber connector 411b and then enters the optical fiber, realizing the soft connection between the optical emission component and the fiber optic adapter of the module optical port. An optical isolator is provided inside the first optical fiber connector 411b, simplifying the assembly process and also reducing costs.

[0252] In some embodiments, the laser in the first optical emission assembly 414b of the first optical emission component emits scattered light of 4 different wavelengths. After being collimated by a collimating lens, 4 parallel light beams are formed. After being combined into a beam of collimated light by the first wavelength division multiplexer, it enters the first converging lens 412b to form a beam of converging light and enters the first optical fiber connector 411b. The distance between the first converging lens and the first optical fiber connector conforms to the focal length of the converging lens.

[0253] In the optical receiving component, the light emitted from the first collimator is a collimated light beam. This beam is decomposed into 4 beams by the first demultiplexer and forms 4 convergent light beams through the first lens assembly, converting the circuit direction towards the surface of the circuit board. Therefore, the optical path length of the first optical transmitting component from the laser to the first optical fiber connector is greater than the optical path length of the optical receiving chip to the first optical collimator in the first optical receiving component.

[0254] In some embodiments of the present application, the region between the first notch 911b and the second notch 912b of the carrier plate 916b protrudes towards the optical port relative to the side wall of the base 900b. The carrier plate 916b is used to carry the optical fiber connector. The first optical fiber connector is connected to the carrier plate 916b.

[0255] The second optical transmitting component 420b includes: a second optical fiber connector 421b, a second converging lens 422b, a second multiplexer 423b, and a second optical transmitting assembly 424b. The second optical fiber connector 421b, the second converging lens 422b, and the second multiplexer 423b are located on the lower surface of the base 900b. The second optical transmitting assembly 424b is located in the first recess 915b. A semiconductor cooler 417 is further provided above the second optical transmitting assembly 424b. The first recess 915b makes the lower surface of the second optical transmitting assembly 424b flush with the lower surface of the circuit board 300, shortening the wire bonding distance between the second optical transmitting assembly 424b and the circuit board 300. The second optical fiber connector is connected to the carrier plate 916b.

[0256] In some embodiments of the present application, the convex portion 914b is thermally connected to the upper housing. The first optical transmitting assembly and the second optical transmitting assembly are the main heat sources of the optical module, and the heat they emit is transferred to the upper housing through the convex portion 914b, improving the heat dissipation effect of the optical module.

[0257] In some embodiments, the first optical fiber adapter is connected to the first optical fiber connector, and the second optical fiber adapter is connected to the second optical fiber connector. The third optical fiber adapter is connected to the first optical collimator, and the fourth optical fiber adapter is connected to the second optical collimator.

[0258] The first optical transmitting component includes 4 lasers, and the second optical transmitting component includes 4 lasers. The first wavelength division multiplexer combines the light emitted by the 4 lasers in the first optical transmitting component into one beam and sends it out through the first optical fiber adapter. The second wavelength division multiplexer combines the light emitted by the 4 lasers in the second optical transmitting component into one beam and sends it out through the second optical fiber adapter.

[0259] The beam carried in the third optical fiber adapter is divided into 4 beams by the first demultiplexer and received by 4 optical receiving chips. The beam carried in the fourth optical fiber adapter is divided into 4 beams by the second demultiplexer and received by 4 optical receiving chips.

[0260] In some embodiments, the first optical fiber adapter, the third optical fiber adapter, the second optical fiber adapter, and the fourth optical fiber adapter may be arranged in sequence at the same height, or may be presented in two columns. For example, the first optical fiber adapter and the third optical fiber adapter are respectively located above the second optical fiber adapter and the fourth optical fiber adapter.

[0261] The base mounting portion 303 provides space for the installation of the optical transmitting component.

[0262] Figure 43 Schematic diagram of a partial cross-sectional structure of an optical module provided according to some embodiments of the present application Figure 1 ; Figure 44 Schematic diagram of a partial cross-sectional structure of an optical module provided according to some embodiments of the present application Figure 2 . As Figure 43 and Figure 44 shown, in some embodiments of the present application, the hot surface of the thermoelectric cooler 417 is connected with positive and negative power supply wires, and is led out from the third notch 913b; conductive pins are provided on the upper surface of the circuit board, and the positive and negative power supply wires are wire-connected to the conductive pins. In some embodiments, the conductive pins are located at the third notch 913b, and the conductive pins are located above the power supply wires.

[0263] In the present application, the hot surface of the thermoelectric cooler is the side adjacent to the optical transmitting chip.

[0264] A substrate 418 is provided between the thermoelectric cooler 417 and the first recess 915b. The substrate is provided with a circuit and is electrically connected to other parts of the thermoelectric cooler 417. One end of the substrate 418 extends into the third notch and is located below the circuit board 300. The hot surface of the thermoelectric cooler is connected with a positive power supply wire and a negative power supply wire. Positive and negative pins are provided on the upper surface of the circuit board. The third notch 913b enables the positive power supply wire 4181 and the negative power supply wire 4182 to be led out from below the circuit board. The positive pin is electrically connected to the positive power supply wire, and the negative pin is conductively connected to the negative power supply wire.

[0265] The present application provides an optical module, the circuit board of which is provided with a base mounting portion, and the base covers a part of the base mounting portion. The base is disposed on the lower surface of the circuit board. A convex portion 914b is formed by convexity on the upper surface of the base 900b, and the first optical receiving component and the second optical receiving component are respectively located on both sides of the convex portion 914. A first recess 915b is formed by concavity on the lower surface of the base 900b, and the lower surface of the base 900b is in contact connection with the upper surface of the circuit board. The bottom surface of the first recess 915b is recessed relative to the lower surface of the base 900b, so that the electrical connection line between the optical transmitting component and the circuit board is the shortest. The base 900b is further provided with a third notch 913b, and the first recess 915b communicates with the third notch 913b, which is convenient for observing and positioning from the third notch 913b during the installation process.

[0266] In the present application, the positions of the first optical chipset 514b, the first transimpedance amplifier 515b, the second optical chipset 524b, and the second transimpedance amplifier 525b on the circuit board are fixed. During the installation process, the base, the first optical transmitting component, and the second optical transmitting component can be connected first, and then the first optical collimator, the first demultiplexer, the second optical collimator, and the second demultiplexer are connected to the base to form a transceiver component. The base provides an installation platform for the first optical transmitting component, the second optical transmitting component, the first optical collimator, the first demultiplexer, the second optical collimator, and the second demultiplexer. Then, the transceiver component is positioned and connected to the circuit board, and the first lens assembly and the second lens assembly are installed according to the positional relationship between the base and the circuit board.

[0267] Connect the base, the first optical transmitting component, and the second optical transmitting component, and then connect the first optical collimator, the first demultiplexer, the second optical collimator, and the second demultiplexer to the base to form a transceiver component. As an integral component, the transceiver component is convenient to install and can be applied to various optical modules.

[0268] The optical transmitting component is designed in a reverse assembly manner, such that the wire bonding surface height of the optical transmitting component is the same as the lower surface of the circuit board during assembly, so that the connection wire bonding between the two is the shortest, ensuring excellent high-frequency transmission performance. The optical transmitting component is designed in a reverse assembly manner, and the base, as the heat sink of the laser and the semiconductor refrigerator, is directly in contact with the upper cover plate of the optical module, forming a more direct and efficient heat transfer channel.

[0269] Figure 45 Schematic diagram of the assembly of another optical transmitting component provided according to some embodiments of the present disclosure Figure 1 ; Figure 46 Schematic diagram of the assembly of another optical transmitting component provided according to some embodiments of the present disclosure Figure 2 . As Figure 45 and Figure 46 shown, in some embodiments, taking the base 900c as an example, the optical receiving component 500c is disposed on one surface of the base 900c, and the optical transmitting component 400c is disposed on the other surface of the base 900c.

[0270] In some embodiments, the surface of the optical transmitting component 400c is irradiated with a second protective cover 420c to protect the optical devices in the optical transmitting component 400c. The second protective cover 420c sequentially includes a first overlapping portion 421c, a first avoidance notch 422c, a second avoidance notch 423c, and a second overlapping portion 424c. Among them, the first overlapping portion 421c and the second overlapping portion 424c are respectively overlapped on the surface of the circuit board, thereby fixing the second protective cover 420c on the surface of the circuit board 300.

[0271] In some embodiments, the optical emission component 400c includes a laser group, an optical emission passive device for multiplexing, and an optical emission passive device for transmission, respectively. Exemplarily, the optical emission passive device for multiplexing may be an optical multiplexing component, etc.; the optical emission passive device for transmission may be an optical fiber collimator, etc.

[0272] In some embodiments, the optical emission component 400c includes a laser group 411c, an optical multiplexing component 412c, and an optical fiber collimator 413c, respectively. The laser group 411c includes a plurality of lasers. The multiplexed optical signals generated by the laser group 411c are transmitted into the optical multiplexing component 412c. After the optical multiplexing component 412c performs beam combining processing, the signals are emitted through the optical fiber collimator 413c. Exemplarily, the laser group 411c corresponds to two optical multiplexing components 412c respectively, and one optical multiplexing component 412c corresponds to one optical fiber collimator 413c. The multiple optical signals emitted by the laser group 411c are respectively combined into two optical signals by two optical multiplexing components 412c, and then are respectively emitted through two optical fiber collimators 413c.

[0273] In some embodiments, the surfaces of the lasers in the laser group 411c are flush with the surface of the circuit board to shorten the wire bonding length therebetween, thereby improving the high-frequency signal transmission performance.

[0274] Figure 47 FIG. is a schematic structural diagram of another optical emission component provided according to some embodiments of the present disclosure; Figure 48 FIG. is an exploded schematic diagram of another optical emission component provided according to some embodiments of the present disclosure. As Figure 47 and Figure 48 shown, in some embodiments, one surface of the base 900c is used to carry the optical reception component, and the other surface is used to carry the optical emission component. Exemplarily, the lower surface of the base 900c is used to arrange the optical emission component. The lower surface of the base 900c is respectively formed with a fourth bearing surface 921c, a fifth bearing surface 922c, and a sixth bearing surface 923c. The fifth bearing surface 922c is disposed between the fourth bearing surface 921c and the sixth bearing surface 923c.

[0275] In some embodiments, the fourth bearing surface 921c is used to arrange the laser group 411c for emitting multiplexed optical signals; the fifth bearing surface 922c is used to arrange the optical multiplexing component 412c for multiplexing the multiplexed optical signals; the sixth bearing surface 923c is used to arrange the optical fiber collimator 413c for transmitting the multiplexed optical signals.

[0276] To limit and fix the optical multiplexing component 412c, limiting portions 924c are respectively formed on both sides of the fifth bearing surface 922c. Exemplarily, the surface of the limiting portion 924c protrudes relative to the surface of the fifth bearing surface 922c, and the structure of the limiting portion 924c can be a limiting boss, so as to limit and fix the optical multiplexing component 412c.

[0277] In some embodiments, the circuit board 300 is embedded in the surface of the base 900a to be relatively closer to the laser group 411c. The surface of the fourth bearing surface 921c is recessed relative to the surface of the fifth bearing surface 922c, so that the laser group 411c is set to sink, so that the surface of the laser group 411c is flush with the surface of the circuit board 300, thereby shortening the wire bonding length between the two and improving the high-frequency performance transmission performance. In some embodiments, the height difference between the fifth bearing surface 922c and the sixth bearing surface 923c satisfies that the optical path height of the optical multiplexing component 412c and the fiber collimator 413c is matched.

[0278] It can be understood that the optical receiving component matched with the optical transmitting component 400c can be the above-mentioned optical receiving component 500c, or the optical receiving component 500d, or the optical receiving component 500e, or the optical receiving component 500f.

[0279] Those skilled in the art will readily conceive of other embodiments of the present application after considering the specification and practicing the disclosure of the present application. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include known common knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the content of the claims.

[0280] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. An optical module, characterized in that, Comprising: Upper housing; Circuit board, on the surface of which a base mounting part is formed, and an optical receiving chip array is provided on the surface of the circuit board; Base, fixed to the surface of the circuit board through the base mounting part, a convex part is formed on the upper surface of the base, the convex part protrudes towards the upper housing, and the convex part is in heat conduction connection with the upper housing; optical receiving components are respectively provided on both sides of the convex part; an optical transmitting component is provided on the lower surface of the base; wherein, support parts are respectively formed by protruding downward on both sides of the lower surface of the base, and embedding parts are respectively formed on both sides of the support parts; First protective cover, covering the upper surface of the base, a first notch is formed on the side of the first protective cover facing the convex part to avoid the convex part; both sides of the first notch are respectively used to protect the optical receiving components on both sides of the convex part; Second protective cover, covering the support parts on the lower surface of the base to protect the optical transmitting component; a plug-in part is formed on the side wall of one end of the second protective cover, and the plug-in parts are respectively plugged and connected with the embedding parts on both sides to fix the second protective cover on the lower surface of the base; an avoidance part is formed at the other end of the second protective cover to avoid the high-frequency signal line between the optical transmitting component and the circuit board.

2. The optical module according to claim 1, wherein The second protective cover includes a first partition and a second partition, and the width of the first partition is smaller than the width of the second partition; The plug-in part is formed at the end of the first partition, and the avoidance part is formed at the end of the second partition; A notch is formed between the plug-in part and the side wall of the first partition.

3. The optical module according to claim 1, wherein One end of the convex part is embedded in the first notch; A second notch is formed on the side of the first protective cover facing the circuit board to avoid electrical components on the circuit board.

4. The optical module according to claim 1, wherein A first bearing surface and a first extension part located at the end of the first bearing surface are respectively formed on one side of the convex part, and a second bearing surface and a second extension part located at the end of the second bearing surface are respectively formed on the other side of the convex part; a third bearing surface and a fourth bearing surface are respectively formed on the lower surface of the base; First optical receiving passive device, located on the surface of the first bearing surface, for receiving multiple optical signals; Second optical receiving passive device, located on the surface of the second bearing surface, for receiving multiple optical signals; First optical path turning device, located on the surface of the first extension part, for changing the transmission direction of multiple optical signals output by the first optical receiving passive device to transmit multiple optical signals to the optical receiving chip array; Second optical path turning device, located on the surface of the second extension part, for changing the transmission direction of multiple optical signals output by the second optical receiving passive device to transmit multiple optical signals to the optical receiving chip array; Laser group, located on the surface of the third bearing surface, for emitting multiple optical signals; Optical transmitting passive device, located on the surface of the fourth bearing surface, for transmitting multiple optical signals emitted by the laser group.

5. The optical module according to claim 4, wherein The extending lengths of the first extension part and the second extension part expose the optical receiving chip array; The first optical path turning device is disposed on the surface of the first extension portion through a first substrate; the extension length of the first substrate is longer than that of the first extension portion, so as to extend the first optical path turning device to the surface of the optical receiving chip array; The second optical path turning device is disposed on the surface of the second extension portion through a second substrate; the extension length of the second substrate is longer than that of the second extension portion, so as to extend the second optical path turning device to the surface of the optical receiving chip array.

6. An optical module, characterized in that, Comprising: An upper housing; A circuit board, on which a base mounting portion is formed on the surface, and an optical receiving chip array is disposed on the surface of the circuit board; A base, which is fixed to the surface of the circuit board through the base mounting portion, a convex portion is formed on the upper surface of the base, the convex portion protrudes towards the upper housing, and the convex portion is in heat conduction connection with the upper housing; optical receiving components are respectively disposed on both sides of the convex portion; an optical transmitting component is disposed on the lower surface of the base; wherein, support portions are respectively formed by protruding downward on both sides of the lower surface of the base, and embedding portions are respectively formed on both sides; a first bearing surface and a first extension portion located at the end of the first bearing surface are respectively formed on one side of the convex portion, and a second bearing surface and a second extension portion located at the end of the second bearing surface are respectively formed on the other side of the convex portion; a third bearing surface and a fourth bearing surface are respectively formed on the lower surface of the base; A first protective cover, which covers the upper surface of the base, a first notch is formed on the side of the first protective cover facing the convex portion to avoid the convex portion; both sides of the first notch are respectively used to protect the optical receiving components on both sides of the convex portion; A second protective cover, which covers the support portions on the lower surface of the base to protect the optical transmitting component; a plugging portion is formed on the side wall at one end of the second protective cover, and the plugging portion is respectively plugged and connected with the embedding portions on both sides to fix the second protective cover on the lower surface of the base; an avoidance portion is formed at the other end of the second protective cover to avoid the high-frequency signal line between the optical transmitting component and the circuit board; A first optical receiving passive device, which is located on the surface of the first bearing surface and is covered by the first protective cover, and is used for receiving multiple optical signals; A second optical receiving passive device, which is located on the surface of the second bearing surface and is covered by the first protective cover, and is used for receiving multiple optical signals; A first optical path turning device, which is located on the surface of the first extension portion and is covered by the first protective cover, and is used for changing the transmission direction of the multiple optical signals output by the first optical receiving passive device so as to transmit the multiple optical signals to the optical receiving chip array; A second optical path turning device, which is located on the surface of the second extension portion and is covered by the first protective cover, and is used for changing the transmission direction of the multiple optical signals output by the second optical receiving passive device so as to transmit the multiple optical signals to the optical receiving chip array; A laser group, which is located on the surface of the third bearing surface and is covered by the second protective cover, and is used for emitting multiple optical signals; The optical emission passive device is located on the surface of the fourth bearing surface, and the surface is irradiated by the second protective cover, and is used for transmitting multiple optical signals emitted by the laser group.

7. The optical module according to claim 6, wherein The extension lengths of the first extension part and the second extension part expose the optical receiving chip array; The first optical path turning device is arranged on the surface of the first extension part through the first substrate; the extension length of the first substrate is longer than the extension length of the first extension part, so as to extend the first optical path turning device to the surface of the optical receiving chip array; The second optical path turning device is arranged on the surface of the second extension part through the second substrate; the extension length of the second substrate is longer than the extension length of the second extension part, so as to extend the second optical path turning device to the surface of the optical receiving chip array.

8. The optical module according to claim 6, wherein A first limiting platform is formed between the first bearing surface and the first extension part, and the surface of the first limiting platform is higher than the surface of the first bearing surface to limit the first optical receiving passive device; a second limiting platform is formed between the second bearing surface and the second extension part, and the surface of the second limiting platform is higher than the surface of the second bearing surface to limit the second optical receiving passive device.

9. The optical module according to claim 6, wherein, A transimpedance amplifier is arranged on the surface of the circuit board, and a second connection pad is formed on the surface of the transimpedance amplifier; A photosensitive surface and a first connection pad are formed on one surface of the optical receiving chip, and the first connection pad is welded to the second connection pad; a lens is arranged on the other surface of the optical receiving chip, and an optical through hole is formed between the two surfaces of the optical receiving chip, so that the optical signal reaches the photosensitive surface through the lens and the optical through hole.

10. The optical module according to claim 6, wherein A first sunken part is formed at one end of the first bearing surface facing the first extension part; a second sunken part is formed at one end of the second bearing surface facing the second extension part; The surface of the first extension part is lower than the surface of the first bearing surface, the surface of the second extension part is lower than the surface of the second bearing surface, and a notch is formed between the first extension part and the second extension part.

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