Wafer clamping mechanism, wafer post-processing device and wafer post-processing method

Abstract

The invention discloses a wafer clamping mechanism, a wafer post-processing device and a wafer post-processing method. The wafer clamping mechanism comprises a rotating disc, a clamping mechanism and a clamping mechanism, the clamping jaw assembly is arranged in the circumferential direction of the rotating disc, the clamping jaw assembly comprises a fixing base and a pair of clamping jaws, and the pair of clamping jaws are arranged around the cylindrical part above the fixing base; magnetic blocks with the same magnetic poles are arranged on the opposite surfaces of the pair of clamping jaws, the clamping jaws are far away from each other around the cylindrical part due to the magnetic repulsive force of the two clamping jaws, and the contact columns of the clamping jaws move towards the inner side of the rotating disc to close the clamping jaws; the regulation and control assembly is arranged on the side of the fixing base, and the front end of the regulation and control assembly faces the gap between the clamping jaws; the front end of the regulation and control assembly can generate magnetic poles different from the magnetic blocks of the clamping jaws, the magnetic attraction force between the regulation and control assembly and the clamping jaws enables the clamping jaws to be close to each other around the cylindrical part, and the contact columns of the clamping jaws move towards the outer side of the rotary disc to open the clamping jaws.

Description

[0001] This application is a divisional application of the invention patent application with the application number 2024119183991 and filed on December 25, 2024. Technical Field

[0002] The present invention belongs to the technical field of wafer post-processing, and specifically relates to a wafer clamping mechanism, a wafer post-processing device, and a wafer post-processing method. Background Art

[0003] The integrated circuit industry is the core of the information technology industry and plays a key role in boosting the transformation and upgrading of the manufacturing industry to digital and intelligent. A chip is the carrier of an integrated circuit, and chip manufacturing involves integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, cutting and packaging, and testing and other process flows.

[0004] In the production and manufacturing of integrated circuits, wafers go through multiple process steps such as thin film deposition, etching, and polishing. During the wafer processing, a large number of particulate matters will come into contact with the wafer surface. In order to keep the wafer surface clean and eliminate the particulate matters remaining on the wafer surface during the process steps, it is necessary to clean the wafer after each process step.

[0005] Whether it is wafer cleaning or wafer drying, it is necessary to reliably clamp the wafer through a clamping mechanism. The existing clamping mechanisms mostly use energy storage devices such as springs to achieve wafer clamping and release.

[0006] The existing clamping mechanism has a relatively complex structure and requires a driving mechanism to drive the spring to expand and contract to achieve the opening and closing of the jaws. There are interactions between components in the existing structure, and component wear will affect the stability of the clamping force; at the same time, component wear will generate some particulate matters, which will increase the pollution sources in the cleaning environment and is not conducive to improving the wafer cleaning effect.

[0007] In addition, in order to monitor the position and posture of the wafer in the clamping mechanism and its state, it is necessary to additionally configure a wafer in-position detection module based on the principle of optoelectronics. However, the in-position detection module will undoubtedly occupy the space of the wafer processing chamber; at the same time, the optoelectronic sensors used for in-position detection are easily interfered by the humidity in the chamber, resulting in a decrease in the accuracy of wafer in-position detection, and even there are cases of detection errors and misjudgments, resulting in the inability to correctly feedback the state of the wafer and affecting the control of the wafer processing process. Summary of the Invention

[0008] Embodiments of the present invention provide a wafer clamping mechanism, a wafer post-processing device, and a wafer post-processing method, aiming to solve at least one of the technical problems existing in the prior art.

[0009] The first aspect of the embodiments of the present invention provides a wafer clamping mechanism, which includes:

[0010] Turntable;

[0011] A chuck assembly is arranged circumferentially along the turntable. The chuck assembly includes a fixed seat and a pair of chucks. The pair of chucks is arranged around a cylindrical member above the fixed seat. Opposite surfaces of the pair of chucks are configured with magnetic blocks having the same magnetic poles. The magnetic repulsion force between the two causes the chucks to move away from each other around the cylindrical member, and the contact posts of the chucks move towards the inner side of the turntable to close the chucks.

[0012] A regulation assembly is arranged on the side of the fixed seat and its front end faces the gap between the chucks. The front end of the regulation assembly can generate a magnetic pole different from that of the magnetic blocks of the chucks. The magnetic attraction force between the regulation assembly and the chucks causes the chucks to move closer to each other around the cylindrical member, and the contact posts of the chucks move towards the outer side of the turntable to open the chucks.

[0013] In some embodiments, the chuck includes a chuck body which is a partial circular ring structure and is rotatably connected to the outer peripheral side of the cylindrical member. A support member is arranged on the upper part of the chuck body, and a contact post for abutting against the edge of the wafer is arranged at the end of the support member.

[0014] In some embodiments, the fixed seat is detachably connected to the turntable, and a positioning member is arranged above it to define the circumferential position of the chuck relative to the cylindrical member.

[0015] In some embodiments, one end face of the chuck body is a bent surface which includes a first bent surface and a second bent surface, and a plurality of magnetic blocks are arranged thereon at intervals.

[0016] In some embodiments, when the chuck assembly is in a clamping state, the first bent surfaces of the two chucks are parallel to each other.

[0017] In some embodiments, the included angle between the first bent surface and the second bent surface is 110° - 135°.

[0018] In some embodiments, the width of the second bent surface is greater than the width of the first bent surface.

[0019] In some embodiments, the other end face of the chuck body is a plane or an arc surface.

[0020] In some embodiments, the chuck body is greater than or equal to 1 / 4 of the circular ring structure.

[0021] In some embodiments, the support member is offset and arranged on the upper part of the chuck body. The chuck body rotating around the cylindrical member can drive the support member to deflect so as to change the position of the contact post.

[0022] In some embodiments, the supports of the jaws are vertically staggered with the supports of another jaw, and the contact posts are located inside or outside the jaw bodies.

[0023] In some embodiments, the support is configured with a limiting groove, and the contact post of the jaw can be clamped in the limiting groove of another jaw to limit the deflection range of the support.

[0024] In some embodiments, the support extends towards the side where the center of the jaw body is located, and the contact post is arranged at one end of the support towards the center of the jaw body.

[0025] In some embodiments, the regulation assembly includes a regulation block, and a rod is arranged inside the regulation block; a coil is wound around the outer peripheral side of the rod, and the energized coil can form a magnetic field at the end of the rod.

[0026] In some embodiments, the number of the rods is multiple, and their arranged positions correspond to the positions of the magnetic blocks on the jaws.

[0027] In some embodiments, the end of the regulation block is a V-shaped surface, which is arranged towards the gap between the jaws; at least part of the rod penetrates through the regulation block and extends to the V-shaped surface.

[0028] In some embodiments, the regulation block is arranged above the turntable, and moreover, the vertical height of the regulation block is less than the height of the jaws.

[0029] The second aspect of the embodiments of the present invention provides a wafer post-processing device, which includes:

[0030] A box body;

[0031] The above-mentioned wafer clamping mechanism, which is arranged inside the box body, and a driving mechanism is configured below it to drive the clamped wafer to rotate around an axis;

[0032] A post-processing module, which is arranged above the wafer clamping mechanism to perform a post-processing process on the rotating wafer.

[0033] The third aspect of the embodiments of the present invention provides a wafer post-processing method, which uses the above-mentioned wafer post-processing device to perform a post-processing process, including:

[0034] S1, the regulation assembly is powered on, and the jaws of the jaw assembly are in an open state;

[0035] S2, the manipulator places the wafer above the turntable, the regulation assembly is powered off, and the jaws of the jaw assembly close to clamp the wafer;

[0036] S3. The driving mechanism drives the clamped wafer to rotate around the axis, and the post-processing module sprays water and / or chemical liquid towards the wafer to process the wafer surface.

[0037] In some embodiments, during the wafer post-processing, if the wafer clamped by the chuck assembly is broken, the chucks move away from each other around the cylindrical member under the action of magnetic repulsion force, causing a change in the magnetic flux of the magnetic block. The regulation component can detect the change in the induced current and give an alarm.

[0038] A fourth aspect of the embodiments of the present invention provides a wafer clamping mechanism, which includes:

[0039] A turntable;

[0040] A chuck assembly, which is arranged along the circumferential direction of the turntable, and the chuck assembly clamps or releases the wafer by magnetic force;

[0041] A regulation component, which is located on the side of the chuck assembly, and the regulation component can change the magnetic force direction of the chuck assembly, thereby switching the working state of the chuck assembly.

[0042] In some embodiments, the chuck assembly includes a pair of chucks, on which contact posts are arranged, and the contact posts abut against the edge of the wafer.

[0043] In some embodiments, the chuck assembly further includes a fixed seat, on which a cylindrical member is arranged, and the pair of chucks are rotatably connected to the outer peripheral side of the cylindrical member.

[0044] In some embodiments, magnetic blocks are arranged on the opposite surfaces of the pair of chucks, and the opposite magnetic blocks form magnetic repulsion force or magnetic attraction force, so that the chucks rotate around the cylindrical member to change the position of the contact posts and realize the opening or closing of the chuck assembly.

[0045] In some embodiments, the regulation component includes a regulation block, and a rod is arranged inside the regulation block; a coil is wound around the outer peripheral side of the rod, and the energized coil can form a magnetic field at the end of the rod.

[0046] In some embodiments, the regulation block is arranged on the side of the fixed seat and its front end faces the gap between the chucks, and the magnetic poles of the magnetic field formed by the rod are the same as or different from the magnetic poles of the opposite surfaces of the magnetic blocks, so as to change the magnetic force direction between the chucks and the regulation component.

[0047] In some embodiments, the number of the rods is multiple, and their arrangement positions correspond to the positions of the magnetic blocks on the chucks.

[0048] In some embodiments, the chuck includes a chuck body, which is a partial circular ring structure and is rotatably connected to the outer peripheral side of the cylindrical member; a support member is offset at the upper part of the chuck body, and the chuck body rotating around the cylindrical member can drive the support member to deflect, so as to change the position of the contact post.

[0049] In some embodiments, the fixed seat is detachably connected to the turntable, and a positioning member is arranged above it to define the circumferential position of the chuck relative to the cylindrical member.

[0050] A fifth aspect of the embodiments of the present invention provides a wafer post-processing device, which includes:

[0051] A box body;

[0052] The above-mentioned wafer clamping mechanism is arranged inside the box body, and a driving mechanism is configured below it to drive the clamped wafer to rotate around the axis;

[0053] A post-processing module, which is arranged above the wafer clamping mechanism to perform a post-processing process on the rotating wafer.

[0054] The beneficial effects of the present invention include:

[0055] a. The chuck assembly is configured with a pair of chucks to form two contact posts above the chucks, thereby avoiding uneven clamping force caused by single-point contact;

[0056] b. The chuck assembly is provided with two contact posts for abutting against the wafer, so that the number of configurations of the chuck assembly can be reduced, the space occupation can be saved, and the wafer clamping under different working conditions can be adapted;

[0057] c. The support members of the chuck body are vertically staggered and face the center side of the chuck body to reduce the space occupation of the chuck assembly;

[0058] d. The support member is configured with a limiting groove, and the setting position of the limiting groove matches the setting position of the contact post on the first chuck to limit the deflection range of the support member;

[0059] e. A pair of chucks are arranged around the cylindrical member, and magnetic blocks are arranged on the bent surfaces of the chuck bodies. The chucks can move away from each other with the cylindrical member as the reference under the action of magnetic repulsion to adjust the pose of the support member and change the position of the contact post, so as to realize the closing of the chuck assembly;

[0060] f. The regulation component is arranged on the side of the fixed seat and its front end faces the gap between the chucks. The front end of the regulation component can generate a magnetic pole different from that of the magnetic block of the chuck, and the magnetic suction force between the regulation component and the chuck makes the chucks approach each other around the cylindrical member to adjust the position of the contact post and realize the opening of the chuck assembly;

[0061] g. The regulation component is in a magnetic field. Moving the magnetic block can cut the magnetic induction lines, causing an induced current to form in the regulation component, enabling the regulation component to detect the fragmentation of the wafer, and further monitoring the in-position state of the wafer in the wafer clamping mechanism;

[0062] h. The jaw body and the support are of a split structure. If the contact column is worn out and cannot be used, the support can be replaced to avoid overall replacement and reduce costs;

[0063] i. A plurality of magnetic blocks are arranged on the first bending surface and the second bending surface of the jaw body, and the included angle between the two is 110° - 135°, so that a magnetic repulsive force is also formed on the opposite second bending surface, that is, using the double magnetic repulsive force formed by the magnetic blocks on the jaws to control the rotation of the jaws with the cylindrical part as the reference;

[0064] j. The second bending surface is inclined relative to the first bending surface, so that the adjacent jaws form a placement groove with a gradually changing opening, facilitating the installation and placement of the regulation component;

[0065] k. The width of the second bending surface is greater than the width of the first bending surface to expand the size of the placement groove and facilitate the installation of the regulation component;

[0066] l. The opening and closing of the jaw assembly are controlled by magnetism, avoiding the interaction of components, and effectively ensuring the reliability of wafer clamping. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] Through the following detailed description in conjunction with the attached drawings, the advantages of the present invention will become clearer and easier to understand. These drawings are only schematic and do not limit the protection scope of the present invention, where:

[0068] Figure 1 is a schematic diagram of a wafer clamping mechanism provided by an embodiment of the present invention;

[0069] Figure 2 is Figure 1 a top view of the wafer clamping mechanism shown;

[0070] Figure 3 is a schematic diagram of a jaw assembly provided by an embodiment of the present invention;

[0071] Figure 4 is a schematic diagram of a first jaw provided by an embodiment of the present invention;

[0072] Figure 5 is a schematic diagram of a second jaw provided by an embodiment of the present invention;

[0073] Figure 6 is a schematic diagram of the jaw assembly in a closed state provided by an embodiment of the present invention;

[0074] Figure 7It is a schematic diagram of a regulation component provided by an embodiment of the present invention;

[0075] Figure 8 It is a schematic diagram of the mutual repulsion between the first jaw and the second jaw provided by an embodiment of the present invention;

[0076] Figure 9 It is a schematic diagram of the mutual attraction between the first jaw and the second jaw provided by an embodiment of the present invention;

[0077] Figure 10 It is a schematic diagram of a wafer post-processing device provided by an embodiment of the present invention;

[0078] Figure 11 It is a flowchart of a wafer post-processing method provided by an embodiment of the present invention;

[0079] Figure 12 It is a schematic diagram of a wafer clamping mechanism provided by another embodiment of the present invention;

[0080] Figure 13 It is a schematic diagram of the mutual attraction between the jaws provided by another embodiment of the present invention;

[0081] Figure 14 A schematic diagram of the mutual repulsion between the jaws provided by another embodiment of the present invention. Detailed implementation manners

[0082] The following combines specific embodiments and their accompanying drawings to detail the technical solutions of the present invention. The embodiments recorded herein are specific specific implementation manners of the present invention and are used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary and should not be construed as limiting the implementation manners of the present invention and the protection scope of the present invention. Except for the embodiments recorded herein, those skilled in the art can also adopt other obvious technical solutions based on the content disclosed in the claims and the specification of the present application, and these technical solutions include technical solutions that make any obvious substitutions and modifications to the embodiments recorded herein.

[0083] The drawings in this specification are schematic diagrams to assist in illustrating the concept of the present invention and schematically show the shapes of various parts and their mutual relationships. It should be understood that in order to clearly show the structures of the components in the embodiments of the present invention, the drawings are not drawn in the same proportion, and the same reference numerals are used to represent the same parts in the drawings.

[0084] In the present invention, a wafer (Wafer, W) is also referred to as a substrate, and their meanings and actual functions are equivalent. The term "comprising" and its similar terms should be understood as open inclusion, that is, "including but not limited to". The term "based on" should be understood as "at least partially based on". The term "an embodiment" or "the embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc. can refer to different or the same objects, and are only used to distinguish the objects being referred to, without implying a specific spatial order, temporal order, order of importance, etc. of the objects being referred to. In some embodiments, values, processes, selected items, determined items, devices, apparatuses, means, components, assemblies, etc. are referred to as "optimal", "lowest", "highest", "minimum", "maximum", etc. It should be understood that such descriptions are intended to indicate that a selection can be made among many available functional options, and such a selection does not need to be better, lower, higher, smaller, larger or otherwise preferred in other aspects or all aspects than other options.

[0085] Figure 1 FIG. 4 is a schematic diagram of a wafer clamping mechanism 100 provided by an embodiment of the present invention. The wafer clamping mechanism 100 includes:

[0086] A turntable 10, below which a driving mechanism is configured to drive the turntable 10 to rotate around its central axis;

[0087] A jaw assembly 20, which is arranged along the circumferential direction of the turntable 10 to uniformly clamp the wafer W on the outer peripheral side of the wafer W, so that the clamping force in the circumferential direction of the wafer W is relatively uniform.

[0088] Figure 2 FIG. 5 is a top view of the wafer clamping mechanism 100. Among them, the number of jaw assemblies 20 is three, and they are roughly evenly distributed on the outer peripheral side of the turntable 10. It can be understood that the wafer clamping mechanism 100 can also be configured with four or five jaw assemblies 20 to adapt to wafer clamping under different working conditions.

[0089] Further, the jaw assembly 20 includes a fixed seat 21 and jaws 22. As shown in FIG. 6, the fixed seat 21 is detachably arranged on the turntable 10. A cylindrical member 23 is arranged above the fixed seat 21, and the jaws 22 are arranged around the outer peripheral side of the cylindrical member 23. That is, the jaws 22 are rotatably connected to the outer peripheral side of the fixed member 23, and they can rotate relative to the cylindrical member 23 as a reference. Figure 3 As shown in FIG. 7, in the present invention, the jaw assembly 20 includes two jaws 22, which are spaced apart and arranged on the outer peripheral side of the cylindrical member 23. Among them, magnetic blocks 24 are arranged on the opposite faces of the jaws 22, and the magnetic poles of the opposite faces of the magnetic blocks 24 are the same.

[0090] In the present invention, the jaw assembly 20 includes two jaws 22, which are spaced apart and arranged on the outer peripheral side of the cylindrical member 23. Among them, magnetic blocks 24 are arranged on the opposite faces of the jaws 22, and the magnetic poles of the opposite faces of the magnetic blocks 24 are the same, as shown in FIG. 7. Figure 3The outer side of the shown magnetic block 24 is the N pole. The magnetic repulsion force between the magnetic block 24 of one jaw 22 and the magnetic block 24 of the other jaw 22 can cause the jaws 22 to move away from each other around the cylindrical member 23. Furthermore, the contact posts 25 of the jaws 22 can move towards the inside of the turntable 10 to achieve the closing of the jaw assembly 20.

[0091] Furthermore, the wafer clamping mechanism 100 further includes a regulation component 30, as Figure 2 shown, the regulation component 30 is arranged on the turntable 10. At the same time, the regulation component 30 is located on the side of the fixed seat 21, and the front end of the regulation component 30 is arranged towards the gap between the jaws 22.

[0092] When it is necessary to control the opening of the jaw assembly 20, the regulation component 30 is powered on to generate a magnetic pole different from that of the magnetic block 24 of the jaw 22 at the front end of the regulation component 30. A magnetic attraction force is formed between the regulation component 30 and the jaw 22, causing the jaws 22 to approach each other around the cylindrical member 23, and the contact posts 25 of the jaws 22 move towards the outside of the turntable 10 to achieve the opening of the jaw assembly 20.

[0093] Figure 3 In the shown embodiment, the jaw assembly 20 includes a first jaw 20A and a second jaw 20B, which are arranged around the outer peripheral side of the cylindrical member 23. Among them, the cylindrical member 23 can be a ceramic bearing to provide a reference for the rotation of the first jaw 20A and the second jaw 20B.

[0094] Since the structures of the first jaw 20A and the second jaw 20B are similar, the following takes the first jaw 20A as an example to briefly describe the specific structure of the jaw 22.

[0095] The first jaw 20A includes a jaw body 22a, as Figure 4 shown, the jaw body 22a is a partial ring structure, which is rotatably connected to the outer peripheral side of the cylindrical member 23. Specifically, the inner side wall of the jaw body 22a abuts against the outer peripheral wall of the cylindrical member 23, and the jaw body 22a can rotate around the axis of the cylindrical member 23 to change the position of the jaw body 22a on the corresponding circumference of the cylindrical member 23.

[0096] The bottom of the jaw body 22a is generally flat to facilitate controlling the overall size of the jaw assembly 20 and reducing the space occupied by the jaw assembly 20.

[0097] Furthermore, a support member 22b is arranged on the upper part of the jaw body 22a, and a contact post 25 is arranged at the end of the support member 22b. The contact post 25 can abut against the edge of the wafer to fix and clamp the wafer. Figure 3In the illustrated embodiment, the contact post 25 is disposed at the end of the support member 22b. It can be understood that the contact post 25 can also be disposed at other positions of the support member 22b, such as the midpoint or the 1 / 4 point of the support member 22b, etc., to be applicable to wafer clamping of different sizes.

[0098] Further, one end face of the jaw body 22a is a bent surface, and the bent surface includes a first bent surface 22a-1 and a second bent surface 22a-2, as Figure 4 shown, magnetic blocks 24 are disposed on the first bent surface 22a-1 and the second bent surface 22a-2.

[0099] In the present invention, the number of the magnetic blocks 24 is multiple, and they are spaced apart and disposed on the first bent surface 22a-1 and the second bent surface 22a-2. Figure 4 In the illustrated embodiment, three magnetic blocks 24 are disposed on both the first bent surface 22a-1 and the second bent surface 22a-2, and the magnetic blocks 24 are spaced apart in the vertical direction. It should be noted that the number of the magnetic blocks 24 on the first bent surface 22a-1 and the second bent surface 22a-2 is not exactly the same, as long as the opposite surfaces of the opposite jaws 22 are configured with the same number of magnetic blocks 24. For example, the number of the magnetic blocks 24 on the first bent surface 22a-1 of the first jaw 20A is equal to the number of the magnetic blocks 24 on the first bent surface 22a-1 of the second jaw 20B.

[0100] In some embodiments, when the jaw assembly 20 is in a clamping state (the jaws 22 of the jaw assembly 20 are closed), the first bent surfaces 22a-1 of the two jaws 22 are parallel to each other. It can be understood that the parallelism of the first bent surfaces 22a-1 means that the two bent surfaces are substantially parallel. Specifically, the included angle between the opposite first bent surfaces 22a-1 is about ±5°, so as to utilize the principle that like magnetic poles repel each other to push the jaw 22 to rotate around the cylindrical member 23.

[0101] Further, the included angle between the first bent surface 22a-1 and the second bent surface 22a-2 is 110°-135°, so that the opposite second bent surfaces 22a-2 also form a magnetic repulsive force, that is, a double magnetic repulsive force formed by the magnetic blocks 24 on the jaws 22 is utilized to control the rotation of the jaws 22 with the cylindrical member 23 as a reference.

[0102] Meanwhile, the second bent surface 22a-2 is inclined relative to the first bent surface 22a-1, so that the adjacent jaws 22 form a placement groove with a gradually changing opening, as Figure 6 shown, for facilitating the installation and placement of the regulation assembly 30. The opening of the placement groove gradually becomes larger from the inside to the outside. Here, the inside and the outside are relative to the cylindrical member 23. The side close to the center of the cylindrical member 23 is the inside, and the side far from the center of the cylindrical member 23 is the outside.

[0103] Figure 4In the illustrated embodiment, the width of the second bending surface 22a-2 is greater than the width of the first bending surface 22a-1 to enlarge the size of the placement groove, facilitating the installation of the control component 30. Preferably, the width of the second bending surface 22a-2 is at least 1.5 to 2 times the width of the first bending surface 22a-1. It should be noted that the width of the bending surface refers to the length of the edge corresponding to the cross-section of the chuck body 22a in the transverse direction, where the position of the transverse section is located in the arc-shaped section of the chuck body 22a.

[0104] Furthermore, the support member 22b is offset and disposed on the upper part of the chuck body 22a. The chuck body 22a that rotates around the cylindrical member 23 can drive the support member 22b to deflect, so as to change the position of the contact post 25 and achieve the clamping and fixing of the wafer.

[0105] Figure 3 In the illustrated embodiment, the support members 22b of the chucks 22 are vertically staggered with the support members 22b of the other chuck 22 to prevent interference between the support members 22b of the chucks 22 from affecting the opening and closing of the chuck assembly 20. That is, the two chucks 22 of the chuck assembly 20 are respectively provided with contact posts 25 to form two contact points for clamping the wafer, thereby ensuring the reliability of wafer clamping.

[0106] Furthermore, the vertically staggered contact posts 25 are located on the same side of the chuck body 22a, that is, the vertically staggered contact posts 25 are located inside or outside the chuck body 22a, so that the contact points between the chuck assembly 20 and the wafer are located on the same side, thereby facilitating the control of wafer clamping. The inside and outside of the chuck body 22a are relative to the annular chuck body 22a. The side where the center of the chuck body 22a is located is the inside, and on the contrary, the side opposite to the center of the chuck body 22a is the outside.

[0107] Figure 4 In [the text], the support member 22b is offset and disposed on the upper part of the chuck body 22a. Specifically, the support member 22b extends toward the side where the center of the chuck body 22a is located, and the contact post 25 is disposed at one end of the support member 22b facing the center of the chuck body 22a. With such a setting, the movement range of the contact post 25 on the support member 22b can be reduced, and thus the overall size of the chuck assembly 20 can be controlled.

[0108] Figure 5FIG. 0 is a schematic diagram of the second jaw 20B provided by an embodiment of the present invention. Among them, a limiting groove 22c is arranged on the support member 22b, and the arrangement position of the limiting groove 22c matches the arrangement position of the contact post 25 on the first jaw 20A to limit the deflection range of the support member 22b. Specifically, when the first jaw 20A and the second jaw 20B rotate towards each other around the cylindrical member 23, the support member 22b on the upper part of the jaw body 22a moves upward (away from the inner side of the turntable 10), and the arranged limiting groove 22c can prevent the support member 22b from deflecting upward and moving excessively, so that the contact post 25 moves too far away from the center of the turntable 10. That is, the opening degree of the jaw assembly 20 is too large to complete the pre-positioning of the wafer, which is not conducive to the accurate clamping of the wafer.

[0109] Furthermore, the shape and size of the limiting groove 22c match the shape and size of the contact post 25, so that the contact post 25 can be engaged in the limiting groove 22c, and then the first jaw 20A and the second jaw 20B are locked. With such an arrangement, it can be avoided that the contact post 25 abuts against the side surface of the support member 22b and slips with each other, resulting in the inability to accurately limit the rotation of the jaw 22.

[0110] Since the contact post 25 frequently contacts the edge of the wafer, the contact post 25 is the most severely worn. If the jaw assembly 20 is replaced as a whole due to the severe wear of the contact post 25, the use cost of the wafer clamping mechanism 100 will be increased.

[0111] To solve the above problems, the jaw body 22a and the support member 22b are of a split structure, that is, the support member 22b is detachably connected above the jaw body 22a. With such an arrangement, if the contact post 25 is worn and cannot be used, the support member 22b can be replaced to avoid replacing the whole and reducing the cost.

[0112] In some embodiments, the contact post 25 can also be set as a split structure, such as the contact post 25 is detachably connected to the support member 22b above the jaw body 22a to replace the worn contact post 25 as needed. In some embodiments, the contact post 25 is made of a wear-resistant non-metallic material, such as polyether ether ketone, polyphenylene sulfide, etc., to enhance the wear resistance of the contact post 25 and extend the service life of the jaw assembly 20.

[0113] As an aspect of this embodiment, a long hole is arranged on the support member 22b, and the contact post 25 is detachably installed in the long hole to adaptively adjust the installation position of the contact post 25 on the support member 22b and adjust the clamping force of the contact post 25 on the wafer.

[0114] Furthermore, the jaw assembly 20 further includes a positioning member 26, such as Figure 6As shown, the positioning member 26 is vertically arranged above the turntable 10. The main function of the positioning member 26 is to limit the circumferential position of the rotation of the first jaw 20A and the second jaw 20B, that is, to limit the circumferential position of the jaw 22 relative to the cylindrical member 23, and further control the position of the contact post 25 on the support member 22b, preventing the clamping force exerted by the jaw 22 on the wafer from being too large and crushing the wafer.

[0115] In the present invention, the end face of the jaw body 22a opposite to the positioning member 26 is a flat surface or an arc surface, so that the end face of the jaw body 22a abuts against the positioning member 26 to realize the limitation of the circumferential position of the jaw 22. In some embodiments, when the end face of the jaw body 22a is an arc surface, in order to increase the friction between the positioning member 26 and the end face and prevent the jaw 22 from slipping, an uneven structure can be provided on the arc surface to increase the friction coefficient between the two.

[0116] As an embodiment of the present invention, the jaw body 22a should be greater than or equal to 1 / 4 of the ring structure, so that the adjustment component 30 of the jaw assembly 20 can be placed in the gap between the opposite faces of the jaw 22, while ensuring that the jaw 22 has a certain range of movement.

[0117] Figure 7 FIG. 10 is a schematic diagram of the adjustment component 30 provided by an embodiment of the present invention. The adjustment component 30 includes an adjustment block 31, and the adjustment block 31 is a block structure with a rod 32 arranged inside.

[0118] A coil 33 is wound around the outer peripheral side of the rod 32, and the energized coil 33 can form a magnetic field at the end of the rod 32.

[0119] Furthermore, the number of the rods 32 is multiple, and they are arranged parallel to each other inside the adjustment block 31. Among them, the arrangement position of the rods 32 corresponds to the position of the magnetic blocks 24 on the jaw 22, so as to facilitate the formation of opposite magnetic poles to the magnetic blocks 24 at the ends of the rods 32, and then use the magnetic attraction between the two to control the rotation of the jaw 22 relative to the cylindrical member 23, and further control the position of the contact post 25 relative to the center of the turntable 10. The magnetic field at the end of the rod 32 attracts the magnetic block 24 on the jaw 22, causing the support member 22b to swing upward, and the contact post 25 moves away from the center of the turntable 10. That is, the contact post 25 changes from abutting against the edge of the wafer to moving away from the edge of the wafer, thus completing the opening action of the jaw assembly 20.

[0120] Figure 7 In FIG. 20, the end of the adjustment block 31 is a V-shaped surface 31a, which is arranged facing the gap between the jaws 22, so that the distance between the magnetic field formed at the end of the rod 32 and the magnetic block 24 on the jaw 22 is relatively close. It can be understood that the end face of the adjustment block 31 is not a strictly defined V-shaped surface, but an end face with the tip of the V-shaped surface removed to reduce the overall size of the adjustment component 30.

[0121] Furthermore, the rod 32 at least partially penetrates the control block 31 and extends to the V-shaped surface 31a. A coil 33 is wound around the rod 32 located outside the control block 31. When the coil 33 is energized, a magnetic field is formed at the end of the rod 32 (near the V-shaped surface 31a).

[0122] In some embodiments, increasing the current magnitude of the coil 33 can change the magnitude of the magnetic field formed at the end of the rod 32, and further change the magnetic attraction force between the magnetic field formed by the rod 32 and the magnetic block 24, so as to adjust the opening amplitude of the claw 22.

[0123] In the present invention, the control block 31 is arranged above the turntable 10, and the vertical height of the control block 31 is less than the height of the claw 22, ensuring that the magnetic field formed by the control block 31 is opposite to the position of the magnetic block 24 on the claw body 22a, so as to form a magnetic attraction force through opposite magnetic poles.

[0124] The following combines Figure 8 and Figure 9 to briefly illustrate the working principle of the claw assembly 20.

[0125] Figure 8 FIG. is a relative position relationship diagram of the first claw 20A and the second claw 20B corresponding to the closed state of the claw assembly 20. Among them, the coil 33 in the control assembly 30 is not energized, and no magnetic field is formed at the end of the rod 32. The opposite surfaces of the magnetic blocks 24 of the first claw 20A and the second claw 20B are N poles. Then, under the action of magnetic repulsion, the first claw 20A and the second claw 20B move away from each other, so that the contact post 25 on the support member 22b moves toward the inner side of the turntable 10 to clamp the wafer.

[0126] Figure 9 FIG. is a relative position relationship diagram of the first claw 20A and the second claw 20B corresponding to the open state. Among them, the coil 33 in the control assembly 30 is energized, a magnetic field is formed at the end of the rod 32, and the magnetic pole on the outer end surface of the rod 32 is an S pole. A magnetic attraction force is formed between the magnetic field of the rod 32 and the magnetic block 24. Then, under the action of the magnetic attraction force, the first claw 20A and the second claw 20B move closer to each other, so that the contact post 25 on the support member 22b moves away from the center of the turntable 10 to release the wafer.

[0127] It should be noted that when the claw assembly 20 clamps the wafer, Figure 8 the magnetic repulsion force of pushes the contact post 25 to abut against the edge of the wafer to achieve the clamping of the wafer. If the clamped wafer is broken, the contact post 25 abutting against the edge of the wafer will lose balance, causing the claw 22 to rotate. During this process, the moving magnetic block 24 cuts the magnetic induction lines at the front end of the rod 32, causing the rod 32 to generate an induced current. Therefore, the induced current of the control assembly 30 can be used to monitor whether the wafer clamped by the wafer clamping mechanism 100 is broken.

[0128] Therefore, in the present invention, there is no need to additionally configure a detection module for the wafer clamping mechanism 100. Instead, by regulating the change in the induced current of the regulating component 30, it is possible to detect whether the wafer is in place in the wafer clamping mechanism 100, effectively saving space occupancy and reducing the manufacturing cost of the wafer clamping mechanism 100.

[0129] Meanwhile, the regulating component 30 configured in the present invention is applicable to the detection environment with high humidity in the wafer post - processing chamber, avoiding the influence of the operating environment on the detection accuracy, reducing the requirements for the detection environment, and improving the accuracy of wafer in - place detection. It should be noted that the magnitude of the induced current formed by the movement of the magnetic block 24 cutting the magnetic induction line is small, and a signal amplifier needs to be configured for the regulating component 30 to accurately detect the change in the induced current and then accurately detect the state of the wafer.

[0130] Figure 10 FIG. 9 is a schematic diagram of a wafer post - processing device 1000 provided by an embodiment of the present invention. The wafer post - processing device 1000 includes:

[0131] A box body 200, which provides a relatively enclosed space for wafer post - processing; the box body 200 is configured with a switchable door to facilitate the placement of the wafer to be processed into the box body 200 by a manipulator via the switchable door;

[0132] Figure 1 The illustrated wafer clamping mechanism 100, which is disposed inside the box body 200 and is provided with a driving mechanism below it to drive the clamped wafer to rotate around an axis;

[0133] A post - processing module 300, which is disposed above the wafer clamping mechanism 100 to perform post - processing operations on the rotating wafer.

[0134] A protective cover 400 is further disposed inside the wafer post - processing device 1000. The protective cover 400 is disposed around the outside of the wafer clamping mechanism 100 and can move in the vertical direction to prevent the liquid on the wafer surface from being thrown towards the inner side wall of the box body 200 under the action of centrifugal force during wafer post - processing, thereby contaminating the wafer post - processing environment.

[0135] Meanwhile, a fan filter unit (FFU) is configured at the top of the box body 200 to supply clean air into the box body 200, thereby improving the wafer post - processing effect.

[0136] Meanwhile, the present invention also provides a wafer post - processing method, which uses Figure 10 the illustrated wafer post - processing device 1000 to perform post - processing operations, Figure 11 FIG. 32 is a flowchart of the wafer post - processing method. The wafer post - processing method includes:

[0137] S1. The regulating component 30 is powered on, and the jaws 22 of the jaw assembly 20 are in the open state;

[0138] Specifically, the jaw assembly 20 is in a default closed state, that is, the end of the rod 32 of the regulating component 30 does not form a magnetic field; at this time, under the action of the magnetic repulsion force between the magnetic blocks 24 of the first jaw 20A and the second jaw 20B, the jaws 22 move away from each other, causing the contact posts 25 to move towards the inner side of the turntable 10.

[0139] To open the jaw assembly 20, the regulating component 30 is powered on, that is, the coil 33 wound around the outer peripheral side of the rod 32 is powered on, so that a magnetic field is formed at the end of the rod 32 close to the bent surface of the jaw 22, and the magnetic pole of this magnetic field is different from that of the opposite surface of the magnetic block 24. Then, under the action of the magnetic attraction force between the two, the first jaw 20A and the second jaw 20B approach each other, causing the contact posts 25 to move towards the outer side of the turntable 10.

[0140] S2. The manipulator places the wafer above the turntable 10, the regulating component 30 is powered off, and the jaws 22 of the jaw assembly 20 are closed to clamp the wafer;

[0141] The manipulator is used to place the wafer above the turntable 10. According to the method described in step S1, the regulating component 30 is powered off, so that the jaw assembly 20 is in the closed state to clamp the wafer; then, the manipulator leaves the box body 200;

[0142] S3. The driving mechanism drives the clamped wafer to rotate around the axis, and the post-processing module 300 sprays water and / or chemical liquid towards the wafer to process the surface of the wafer.

[0143] During the post-processing of the wafer, if the wafer W clamped by the jaw assembly 20 is broken, the jaws 22 move away from each other around the cylindrical part 23 under the action of the magnetic repulsion force, causing the magnetic flux of the magnetic block 24 to change. The regulating component 30 can detect the change in the induced current and give an alarm. Therefore, the regulating component 30 can monitor the running state of the wafer during the post-processing of the wafer and give an early warning of abnormal situations such as wafer fragments in a timely manner.

[0144] In addition, an embodiment of the present invention further provides a wafer clamping mechanism 100, as Figure 12 shown, the wafer clamping mechanism 100 includes:

[0145] A turntable 10, with a driving mechanism arranged below it to drive the turntable 10 to rotate around its central axis;

[0146] A jaw assembly 20, which is arranged along the circumference of the turntable 10. Among them, the jaw assembly 20 clamps or releases the wafer by magnetic force;

[0147] The regulation component 30 is located on the side of the chuck component 20. The regulation component 30 can change the magnetic force direction of the chuck component 20, thereby switching the working state of the chuck component 20 to clamp or release the wafer. For example, the regulation component 30 can switch the chuck component 20 from the open state to the closed state, or the regulation component 30 can switch the chuck component 20 from the closed state to the open state.

[0148] It can be understood that the magnetic force formed by the chuck component 20 can be a magnetic repulsion force or a magnetic attraction force, so as to form a clamping force acting on the edge of the wafer to clamp the wafer, or form a pushing force away from the edge of the wafer to release the wafer.

[0149] Figure 12 In the embodiment, the structure of the chuck component 20 is the same as Figure 1 the structure of the chuck component 20 in the embodiment. Here, only the composition and connection relationship of the chuck component 20 will be briefly described.

[0150] The chuck component 20 includes a pair of chucks 22. As Figure 3 shown, contact posts 25 are arranged on the chucks 22. The contact posts 25 are used to abut against the edge of the wafer to achieve the clamping of the wafer. That is, the pair of chucks 22 are the first chuck 20A and the second chuck 20B. The contact posts 25 on the first chuck 20A and the second chuck 20B abut against the wafer surface to clamp the wafer.

[0151] Furthermore, the chuck component 20 further includes a fixed seat 21. A cylindrical member 23 is arranged on the fixed seat 21. The cylindrical member 23 can be a bearing. The pair of chucks 22 are rotatably connected to the outer peripheral side of the cylindrical member 23. That is, the chucks 22 can rotate based on the cylindrical member 23 to change the position of the contact posts 25, thereby switching the working state of the chuck component 20.

[0152] In the present invention, magnetic blocks 24 are arranged on the opposite surfaces of the pair of chucks 22. The opposite magnetic blocks 24 form a magnetic repulsion force or a magnetic attraction force, so that the chucks 22 rotate around the cylindrical member 23 to change the position of the contact posts 25 to achieve the opening or closing of the chuck component 20.

[0153] Furthermore, the chuck 22 includes a chuck body 22a. The chuck body 22a is a partial ring structure and is rotatably connected to the outer peripheral side of the cylindrical member 23. A support member 22b is offset and arranged on the upper part of the chuck body 22a. The chuck body 22a rotating around the cylindrical member 23 can drive the support member 22b to deflect to change the position of the contact posts 25.

[0154] Figure 4 In the shown embodiment, the support member 22b of the first chuck 20A extends toward the side where the center of the chuck body 22a is located to reduce the volume of the chuck component 20.

[0155] Meanwhile,Figure 4 The claws 22 shown are arranged in a vertically staggered manner, and particles formed by post-processing of the wafer may be retained between the claws 22. Therefore, in some embodiments, the support member 22b of the first claw 20A may also extend away from the side where the center of the claw body 22a is located to avoid the first claw 20A and the second claw 20B overlapping in the horizontal direction. At the same time, the distance between the contact pillars 25 of the support member 22b is relatively large, so that a set of claw assemblies 20 can form two clamping points with a long distance, and then two sets of claw assemblies 20 can be used to achieve reliable clamping of the wafer.

[0156] In some embodiments, the fixing seat 21 is detachably connected to the turntable 10 , and a positioning member 26 is disposed above the fixing seat 21 to limit the circumferential position of the claw 22 relative to the cylindrical member 23 .

[0157] Figure 3 In the illustrated embodiment, three magnetic blocks 24 are disposed on the opposite sides of the claw 22 , wherein the magnetic poles of the magnetic blocks 24 of the first claw 20A and the magnetic blocks 24 of the second claw 20B are N poles, and the magnetic repulsion formed by the two can change the position of the contact column 25 .

[0158] It is understandable that the magnetic poles of the opposite surfaces of the magnetic block 24 of the first claw 20A and the magnetic block 24 of the second claw 20B may also be different, such as Figure 13 As shown, a magnetic attraction is formed between the two; Figure 13 In the embodiment shown, the magnetic pole on the outer side of the magnetic block 24 set on the first claw 20A is the N pole, and the magnetic pole on the outer side of the magnetic block 24 set on the second claw 20B is the S pole. The magnetic attraction formed by the two enables the claws 22 to move toward each other with the cylindrical member 23 as a reference to change the position of the contact column 25.

[0159] Figure 13 In the embodiment shown, the structure of the claw 22 is as follows: Figure 3 As shown, the magnetic attraction force formed by the magnetic block 24 on the claw 22 makes the contact pillar 25 move away from the edge of the wafer. At this time, the claw assembly 20 is in an open state.

[0160] Figure 12 In the embodiment shown, the control component 30 includes a control block 31, see Figure 7 A rod 32 is disposed inside the regulating block 31 ; a coil 33 is wound around the outer circumference of the rod 32 , and the energized coil 33 can form a magnetic field at the end of the rod 32 .

[0161] Furthermore, there are multiple rods 32 , and the positions of the rods 32 correspond to the positions of the magnetic blocks 24 on the claws 22 , so that the two can form a greater magnetic repulsion or magnetic attraction.

[0162] The regulation block 31 is arranged on the side of the fixed seat 21, and its front end is arranged facing the gap of the claw 22. The magnetic pole of the magnetic field formed by the rod 32 is the same as or different from the magnetic pole of the opposite surface of the magnetic block 24, so as to change the magnetic force direction between the claw 22 and the regulation assembly 30.

[0163] In Figure 8 the illustrated embodiment, when the regulation assembly 30 is not turned on, the magnetic poles of the opposite surfaces of the magnetic blocks 24 on the claws 22 are the same, and a magnetic repulsion force is formed between the pair of claws 22 to drive the contact post 25 to move towards the inside of the turntable 10, and the claw assembly 20 is closed; after the regulation assembly 30 is turned on, the magnetic pole of the magnetic field formed by the rod 32 of the regulation assembly 30 is different from the magnetic pole of the opposite surface of the magnetic block 24. As Figure 9 shown, the magnetic attraction force formed between the two drives the contact post 25 to move away from the center of the turntable 10, and the claw assembly 20 is opened. That is, in this embodiment, the magnetic pole of the magnetic field formed by the rod 32 is different from the magnetic pole of the opposite surface of the magnetic block 24.

[0164] In Figure 13 the illustrated embodiment, when the regulation assembly 30 is not turned on, the magnetic poles of the opposite surfaces of the magnetic blocks 24 on the claws 22 are different, and a magnetic attraction force is formed between the pair of claws 22 to drive the contact post 25 to move away from the center of the turntable 10, and the claw assembly 20 is opened; after the regulation assembly 30 is turned on, the magnetic pole of the magnetic field formed by the rod 32 of the regulation assembly 30 is the same as the magnetic pole of the opposite surface of the magnetic block 24. As Figure 14 shown, the magnetic repulsion force formed between the two drives the contact post 25 to move towards the inside of the turntable 10, and the claw assembly 20 is closed. That is, in this embodiment, the magnetic pole of the magnetic field formed by the rod 32 is the same as the magnetic pole of the opposite surface of the magnetic block 24.

[0165] It should be noted that Figure 13 and Figure 14 in the illustrated embodiments, the regulation assembly 30 includes a pair of sub-regulation assemblies (divided by a dotted line) so as to form a magnetic field with corresponding magnetic poles at the end of the rod 32 as required.

[0166] At the same time, the present invention also provides a wafer post-processing device 1000, and its schematic diagram is as Figure 10 shown. The wafer post-processing device 1000 includes:

[0167] A box body 200;

[0168] Figure 12 The wafer clamping mechanism 100 shown in the embodiment, the wafer clamping mechanism 100 is arranged inside the box body 200, and a driving mechanism is arranged below it to drive the clamped wafer to rotate around the axis;

[0169] A post-processing module 300, which is arranged above the wafer clamping mechanism 100 to perform post-processing on the rotating wafer.

[0170] In this embodiment, the opening and closing of the regulation component 30 can change the working state of the chuck component 20 to control the clamping force of the chuck 22 on the wafer, avoiding the wafer fragmentation caused by unstable spring clamping in the prior art. At the same time, the movement of the chuck 22 in the chuck component 20 causes a change in the magnetic flux of the magnet 24, and the regulation component 30 can detect the change in the induced current and give an alarm. That is, the regulation component 30 can monitor the running state of the wafer during the post-processing of the wafer to give an early warning of abnormal situations such as wafer fragmentation in a timely manner.

[0171] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A wafer clamping mechanism, characterized in that: include: Turntable; A claw assembly is arranged along the circumference of the turntable, the claw assembly includes a fixed seat and a pair of claws, the pair of claws are arranged around the cylindrical member above the fixed seat; the opposite surfaces of the pair of claws are provided with magnetic blocks with the same magnetic poles, the magnetic repulsion of the two causes the claws to move away from each other around the cylindrical member, and the contact column of the claw moves toward the inner side of the turntable to close the claws to clamp the wafer; A regulating component is arranged on the side of the fixing seat and its front end is arranged toward the gap between the claws; the front end of the regulating component can generate a magnetic pole different from the magnetic block of the claws, and the magnetic attraction between the regulating component and the claws makes the claws approach each other around the cylindrical member, and the contact column of the claws moves toward the outside of the turntable to open the claws to release the wafer; The clamping claw includes a clamping claw body, which is a partial circular ring structure and is rotatably connected to the outer peripheral side of the cylindrical member; a support member is arranged on the upper part of the clamping claw body, and the support member is arranged with a contact column abutting the edge of the wafer, and the contact column is located at the midpoint or 1 / 4 of the support member.

2. The wafer clamping mechanism according to claim 1, characterized in that: The fixing seat is detachably connected to the rotating disk, and a vertical positioning piece is arranged above the fixing seat to limit the circumferential position of the clamping claw relative to the cylindrical piece.

3. The wafer clamping mechanism according to claim 1, characterized in that: One end face of the clamp body is a bending surface, which includes a first bending surface and a second bending surface, on which a plurality of magnetic blocks are arranged at intervals; adjacent clamps form a placement groove with an opening gradually increasing from the inside to the outside to install and place the regulating component.

4. The wafer clamping mechanism according to claim 3, characterized in that: When the clamping jaw assembly is in a clamping state, the angle between the first bending surfaces of the two clamping jaws is ±5°.

5. The wafer clamping mechanism according to claim 4, characterized in that: The width of the second bending surface is at least 1.5 to 2 times the width of the first bending surface.

6. The wafer clamping mechanism according to claim 1, characterized in that: The contact column is a split structure, which is detachably connected to the support member.

7. The wafer clamping mechanism according to claim 6, characterized in that: The contact column is made of wear-resistant non-metallic material.

8. The wafer clamping mechanism according to claim 2, characterized in that: The end surface of the positioning piece opposite to the claw body is an arc surface, and a concave-convex structure is arranged on the arc surface to increase the friction coefficient between the two.

9. The wafer clamping mechanism according to claim 1, wherein: The support member is detachably and offsetly arranged on the upper part of the claw body. The claw body rotating around the cylindrical member can drive the support member to deflect so as to change the position of the contact column.

10. The wafer clamping mechanism according to claim 1, wherein: The regulating component includes a regulating block, and a plurality of rods are arranged inside the regulating block; a coil is wound around the outer circumference of the rod, and the energized coil can form a magnetic field at the end of the rod; the current of the energized coil is adjusted to change the magnetic attraction between the magnetic field formed by the rod and the magnetic block, thereby adjusting the opening extent of the claw.

11. A wafer post-processing device, characterized in that: include: Box; The wafer clamping mechanism according to any one of claims 1 to 10 is arranged inside the box, and a driving mechanism is arranged below the box to drive the clamped wafer to rotate around the axis; The post-processing module is arranged above the wafer clamping mechanism to perform a post-processing process on the rotating wafer.

12. A wafer post-processing method, characterized in that: The post-processing process is performed using the wafer post-processing device according to claim 11, comprising: S1, the regulating component is powered on, and the claw of the claw assembly is in the open state; S2, the robot places the wafer on the turntable, the control component is powered off, and the claws of the claw assembly are closed to clamp the wafer; S3, the driving mechanism drives the clamped wafer to rotate around the axis, and the post-processing module sprays water and / or chemical liquid toward the wafer to process the wafer surface.

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