Microstrip antenna device, navigation equipment and manufacturing method

Abstract

The invention belongs to the field of navigation and positioning, and aims to solve the problems that the height of an antenna is increased due to the fact that the bandwidth is increased in an existing lamination-based method, and the gain of the antenna is rapidly reduced due to frequency deviation caused by the fact that gaps between lamination layers of the antenna are changed under the condition that high and low temperatures are changed violently. The invention provides a microstrip antenna device, navigation equipment and a manufacturing method. The microstrip antenna device comprises a base, a feed network and a radiation sheet, the feed network and the radiation sheet are stacked, the feed network is connected with the radiation sheet, and the radiation sheet is fixed on the base; the radiation sheet is provided with a first surface deviating from the feed network, the first surface is provided with a radiation layer, the radiation layer comprises a plurality of radiation sub-layers, and at least part of the radiation sub-layers are distributed around the center of the first surface at intervals; wherein at least one radiation sub-layer is electrically connected with the feed network. The bandwidth of the antenna can be ensured, the height of the antenna can be reduced, and the performance of the antenna is improved.

Description

Technical Field

[0001] This application belongs to the field of navigation and positioning, and particularly relates to a microstrip antenna device, a navigation device, and a manufacturing method thereof. Background Art

[0002] Current satellite navigation and positioning devices are increasingly widely used in fields such as positioning, measurement, time service, high-precision agriculture, and intelligent transportation. However, the bandwidth of a single conventional microstrip antenna is relatively narrow. To increase the bandwidth of the antenna, the lamination method is usually used to increase the bandwidth. However, lamination will increase the height of the antenna, resulting in a relatively large height of the antenna, which is not conducive to the light weight of the antenna. Moreover, when using the lamination method, in the case of drastic changes in high and low temperatures, the gap between the laminations of the antenna changes, resulting in frequency offset and rapid reduction of the antenna gain. Summary of the Invention

[0003] The purpose of the embodiments of this application is to provide a microstrip antenna device, a navigation device, and a manufacturing method thereof, which at least solve the problems that lamination will increase the height of the antenna, resulting in a relatively large height of the antenna, which is not conducive to the light weight of the antenna, and when using the lamination method, in the case of drastic changes in high and low temperatures, the gap between the laminations of the antenna changes, resulting in frequency offset and rapid reduction of the antenna gain.

[0004] In a first aspect, the embodiments of this application provide a microstrip antenna device, which includes: a base, a feeding network, and a radiation patch;

[0005] The feeding network and the radiation patch are stacked, and the feeding network is connected to the radiation patch. The radiation patch is fixed to the base;

[0006] The radiation patch has a first surface facing away from the feeding network, and a radiation layer is provided on the first surface. The radiation layer includes a plurality of radiation sub-layers, and at least some of the plurality of radiation sub-layers are spaced apart around the center of the first surface;

[0007] Wherein, at least one of the radiation sub-layers is electrically connected to the feeding network.

[0008] Optionally, a first radiation sub-layer among the plurality of radiation sub-layers is located in the middle of the first surface, and the center of the first radiation sub-layer is on the same straight line as the center of the first surface, and the remaining radiation sub-layers are spaced apart around the first radiation sub-layer.

[0009] Optionally, the shape of the projection of the first radiation sub-layer on the first surface is different from the shape of the projection of the remaining radiation sub-layers on the first surface.

[0010] Optionally, in the remaining radiation sub-layers, the area of the projection of each radiation sub-layer on the first surface is smaller than the area of the projection of the first radiation sub-layer on the first surface.

[0011] Optionally, the first radiation sub-layer is electrically connected to the feeding network.

[0012] Optionally, the microstrip antenna device further includes a feeding probe, and the feeding network includes a circuit board and a feeding line layer provided on the circuit board;

[0013] The circuit board and the radiation sheet are stacked, the feeding line layer is located on the surface of the circuit board facing away from the radiation sheet, the first end of the feeding probe is connected to the first radiation sub-layer, and the second end of the feeding probe is connected to the feeding line layer, so that the first radiation sub-layer is electrically connected to the feeding network.

[0014] Optionally, the remaining radiation sub-layers are centrosymmetric about the center of the first radiation sub-layer.

[0015] Optionally, the multiple radiation layers include a first radiation sub-layer, a second radiation sub-layer, a third radiation sub-layer, a fourth radiation sub-layer, and a fifth radiation sub-layer;

[0016] The first radiation sub-layer is square in shape, and notches are provided at each corner position of the first radiation sub-layer. At least part of the second radiation sub-layer, at least part of the third radiation sub-layer, at least part of the fourth radiation sub-layer, and at least part of the fifth radiation sub-layer are sequentially located in the four notches; an opening is provided in the middle of the first radiation sub-layer, and the center of the opening is on the same straight line as the center of the first surface.

[0017] Optionally, the shapes of the second radiation sub-layer, the third radiation sub-layer, the fourth radiation sub-layer, and the fifth radiation sub-layer are all the same.

[0018] Optionally, the notches are square in shape, and the second radiation sub-layer, the third radiation sub-layer, the fourth radiation sub-layer, and the fifth radiation sub-layer all include a first square frame layer, a second square frame layer, a first connecting arm layer, and a second connecting arm layer;

[0019] The first square frame layer is located inside the second square frame layer, and the diagonal of the first square frame layer intersects with the diagonal of the second square frame layer;

[0020] Part of the second square frame layer is located in the notch. The second square frame layer includes a first side, a second side, a third side, and a fourth side. The first side, the second side, the third side, and the fourth side are sequentially connected and enclose a square frame structure. Part of the first side and part of the second side are located in the notch. The third side and the fourth side are located outside the notch. The first side is connected with a first extension part, and the second side is connected with a second extension part. Both the first extension part and the second extension part are located outside the notch. The first end of the first connecting arm layer is connected to the first extension part, and the first end of the second connecting arm layer is connected to the second extension part. The second end of the first connecting arm layer is connected to the second end of the second connecting arm layer. There is a first gap between the first connecting arm layer and the third side, and there is a second gap between the second connecting arm layer and the fourth side.

[0021] Optionally, the shape of the notch is square. The second radiator layer, the third radiator layer, the fourth radiator layer, and the fifth radiator layer all include a first fan-shaped frame layer, a second fan-shaped frame layer, and an arc connecting arm layer;

[0022] The first fan-shaped frame layer is located inside the second fan-shaped frame layer;

[0023] Part of the second fan-shaped frame layer is located in the notch. The second fan-shaped frame layer includes a fifth side, a sixth side, and an arc side. The fifth side, the sixth side, and the arc side are sequentially connected and enclose a fan-shaped frame structure. Part of the fifth side and part of the sixth side are located in the notch. The arc side is located outside the notch. The fifth side is connected with a third extension part, and the sixth side is connected with a fourth extension part. Both the third extension part and the fourth extension part are located outside the notch. The first end of the arc connecting arm layer is connected to the third extension part, and the second end of the arc connecting arm layer is connected to the fourth extension part. There is a third gap between the arc connecting arm layer and the arc side.

[0024] Optionally, a plurality of strip holes are provided on the first radiator layer, and the plurality of strip holes are distributed at intervals around the center of the first radiator layer.

[0025] Optionally, a plurality of first metallization vias are provided on the first radiator layer. The plurality of first metallization vias are distributed at intervals along the circumferential direction of the first radiator layer. The first metallization vias are connected to the surface of the feeding network facing the radiator sheet.

[0026] Optionally, second metallization vias are provided on the radiator sheet;

[0027] In the remaining radiation sub - layers, the projection of each radiation sub - layer on the first surface encloses at least one of the second metallized vias.

[0028] Optionally, the microstrip antenna device further includes a metal connector;

[0029] The edge of the radiation patch is connected to the base through the metal connector.

[0030] Optionally, the microstrip antenna device further includes a non - metal connector;

[0031] The feed network is connected to the radiation patch through the non - metal connector.

[0032] Optionally, the base is of a frame - type structure, the feed network is embedded inside the base, and the radiation patch is detachably connected to the base.

[0033] Optionally, the microstrip antenna device further includes a connector;

[0034] The connector is connected to the base, and the connector is electrically connected to the feed network.

[0035] Optionally, the operating frequency band of the microstrip antenna device covers 1.1 GHz to 1.7 GHz.

[0036] In a second aspect, an embodiment of the present application provides a navigation device, which includes a navigation body and the microstrip antenna device according to any one of the first aspects above;

[0037] The microstrip antenna device is installed on the navigation body.

[0038] In a third aspect, an embodiment of the present application provides a manufacturing method for manufacturing the microstrip antenna device according to any one of the first aspects above. The plurality of radiation sub - layers include a first radiation sub - layer, on which a first metallized via is provided, a second metallized via is provided on the radiation patch, and the feed network includes a circuit board and a feed line layer provided on the circuit board;

[0039] The manufacturing method includes:

[0040] Based on the target resonance frequency band, determine the parameters of the radiation patch and the parameters of the radiation sub - layers;

[0041] Determine the positions of the first metallized vias on the first radiation sub - layer and the positions of the second metallized vias on the radiation patch;

[0042] Determine the line width and line length of each section of the microstrip line in the feed line layer on the circuit board to determine the size of the feed network;

[0043] Assemble the radiation sheet, the feeding network and the base to form the microstrip antenna device.

[0044] In the embodiment of the present application, since the feeding network and the radiation sheet are stacked, and the feeding network is connected to the radiation sheet, and the radiation sheet is fixed to the base, therefore, it is equivalent to only stacking the feeding network and the radiation sheet, and there are fewer stacked components in the antenna device, making the height of the antenna smaller, which is beneficial to the light weight of the antenna. In addition, a radiation layer is provided on the first surface of the radiation sheet, and the radiation layer includes a plurality of radiation sub-layers, and at least some of the plurality of radiation sub-layers are distributed at intervals around the center of the first surface. Therefore, it is equivalent to providing a radiation layer on the surface of the radiation sheet facing away from the feeding network, that is, equivalent to using the surface of the radiation sheet to provide a radiation layer, so that the antenna radiates signals through the radiation layer, avoiding the problem that the antenna has a large height due to the setting of multiple stacked layers. Furthermore, it can also avoid the problem that the gap between the stacked layers of the antenna changes under the condition of drastic temperature changes, resulting in frequency shift and rapid reduction of antenna gain. In addition, at least one radiation sub-layer is electrically connected to the feeding network, so that the feeding network can transmit signals to the radiation sub-layer, enabling the radiation sub-layer to radiate signals. That is, in the embodiment of the present application, by providing a radiation layer on the first surface of the radiation sheet, and at least some of the plurality of radiation sub-layers are distributed at intervals around the center of the first surface, the surface of the radiation sheet can be fully utilized, making the radiation layer as flat as possible on the surface of the radiation surface, ensuring that the bandwidth of the antenna meets the requirements, and avoiding the problem that the antenna has a large height due to the use of the stacked layer method for the antenna. Furthermore, it can avoid the problem that the gap between the multiple stacked layers changes, resulting in a rapid reduction of antenna gain. That is, in the embodiment of the present application, the bandwidth of the antenna can be ensured, and the height of the antenna can be reduced, improving the performance of the antenna. Description of the Drawings

[0045] Figure 1 An exploded view showing a microstrip antenna device provided by an embodiment of the present application;

[0046] Figure 2 A schematic diagram showing a microstrip antenna device provided by an embodiment of the present application;

[0047] Figure 3 One of the schematic diagrams showing the radiation sub-layers on a radiation sheet provided by an embodiment of the present application;

[0048] Figure 4 A schematic diagram showing a circuit board of a feeding network and a feeding line layer provided by an embodiment of the present application;

[0049] Figure 5 Another schematic diagram showing the radiation sub-layers on a radiation sheet provided by an embodiment of the present application;

[0050] Figure 6 Schematic diagram of a power feeding line layer provided by an embodiment of the present application;

[0051] Figure 7 Schematic diagram of a power feeding probe provided by an embodiment of the present application;

[0052] Figure 8 Flow chart of a manufacturing method provided by an embodiment of the present application.

[0053] Reference numerals:

[0054] 001: Metal connector; 002: Non-metal connector; 003: Connector; 10: Base; 20: Power feeding network; 21: Circuit board; 22: Power feeding line layer; 30: Radiation sheet; 301: First surface; 302: Second metallized via; 40: Radiation layer; 411: First radiation sub-layer; 412: Second radiation sub-layer; 413: Third radiation sub-layer; 414: Fourth radiation sub-layer; 415: Fifth radiation sub-layer; 4111: Notch; 4112: Opening; 4113: Strip hole; 4114: First metallized via; 4121: First direction frame layer; 4122: Second square frame layer; 4123: First connecting arm layer; 4124: Second connecting arm layer; 4131: First sector frame layer; 4132: Second sector frame layer; 4133: Arc connecting arm layer; 41221: First side; 41222: Second side; 41223: Third side; 41224: Fourth side; 41225: First extension; 41226: Second extension; 41321: Fifth side; 41322: Sixth side; 41323: Arc side; 41324: Third extension; 41325: Fourth extension; 50: Power feeding probe; 51: First cylinder; 52: Second cylinder. Detailed implementation manners

[0055] The features of the terms "first", "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / ", generally represents an "or" relationship between the associated objects before and after.

[0056] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0057] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0058] As Figures 1 to 7 shown, the microstrip antenna device includes: a base 10, a feeding network 20, and a radiation patch 30.

[0059] The feeding network 20 and the radiation patch 30 are stacked, and the feeding network 20 is connected to the radiation patch 30. The radiation patch 30 is fixed to the base 10. The radiation patch 30 has a first surface 301 facing away from the feeding network 20. A radiation layer 40 is provided on the first surface 301. The radiation layer 40 includes a plurality of radiation sub-layers, and at least some of the plurality of radiation sub-layers are spaced apart and distributed around the center of the first surface 301. Among them, at least one radiation sub-layer is electrically connected to the feeding network 20.

[0060] In the embodiment of the present application, since the feeding network 20 and the radiation patch 30 are stacked, and the feeding network 20 is connected to the radiation patch 30, and the radiation patch 30 is fixed to the base 10, therefore, it is equivalent to only stacking the feeding network 20 and the radiation patch 30, and there are fewer stacked components in the antenna device, making the height of the antenna smaller, which is beneficial to the lightweight of the antenna. In addition, a radiation layer 40 is provided on the first surface 301 of the radiation patch 30. The radiation layer 40 includes a plurality of radiation sub-layers, and at least some of the plurality of radiation sub-layers are distributed at intervals around the center of the first surface 301. Therefore, it is equivalent to providing the radiation layer 40 on the surface of the radiation patch 30 facing away from the feeding network 20, that is, it is equivalent to using the surface of the radiation patch 30 to provide the radiation layer 40, so that the antenna radiates signals through the radiation layer 40, avoiding the problem that the antenna has a large height due to the setting of multiple stacked layers. Furthermore, it can also avoid the problem that the gap between the stacked layers of the antenna changes under the condition of drastic temperature changes, resulting in frequency offset and rapid reduction of antenna gain. In addition, at least one radiation sub-layer is electrically connected to the feeding network 20, so that the feeding network 20 can transmit signals to the radiation sub-layer, enabling the radiation sub-layer to radiate signals. That is, in the embodiment of the present application, by providing the radiation layer 40 on the first surface 301 of the radiation patch 30, and at least some of the plurality of radiation sub-layers are distributed at intervals around the center of the first surface 301, the surface of the radiation patch 30 can be fully utilized, making the surface of the radiation surface as flat as possible for the radiation layer 40, ensuring that the bandwidth of the antenna meets the requirements, and avoiding the problem that the antenna has a large height due to the use of the stacked layer method for the antenna. Furthermore, it can avoid the problem that the gap between the multiple stacked layers changes, resulting in a rapid reduction of antenna gain. That is, in the embodiment of the present application, the bandwidth of the antenna can be ensured, and the height of the antenna can be reduced, improving the performance of the antenna.

[0061] It should be noted that in the embodiment of the present application, the radiation patch 30 can be a printed circuit board (PCB), and a copper layer is provided on the first surface 301 of the radiation patch 30, and the copper layer forms the radiation layer 40, and the surface opposite to the first surface 301 is not provided with a copper layer covering the surface.

[0062] In addition, in the embodiment of the present application, the radiation layer 40 can be formed of copper. Of course, the radiation layer 40 can also be formed of other metals. For example, the radiation layer 40 is formed of silver. In this regard, the embodiment of the present application does not make any limitation here.

[0063] In addition, in the embodiment of the present application, the operating frequency band of the microstrip antenna device covers 1.1 GHz to 1.7 GHz. That is, the operating frequency band range of the microstrip antenna device provided by the embodiment of the present application is relatively large, so that it can meet more requirements, which is beneficial to expanding the use range of the microstrip antenna device.

[0064] In addition, in some embodiments, the first radiation sub-layer 411 among the multiple radiation sub-layers is located in the middle of the first surface 301, and the center of the first radiation sub-layer 411 is on the same straight line as the center of the first surface 301. The remaining radiation sub-layers are distributed at intervals around the first radiation sub-layer 411. Through such an arrangement, a gap can be formed between two adjacent radiation sub-layers, and a gap can also be formed between the remaining radiation sub-layers and the first radiation sub-layer 411. As a result, the remaining radiation sub-layers can be coupled with the first radiation sub-layer 411, enabling the multiple radiation sub-layers and the first radiation sub-layer 411 to radiate signals together, thereby improving the radiation efficiency. In addition, by setting the center of the first radiation sub-layer 411 to be on the same straight line as the center of the first surface 301 and distributing the remaining radiation sub-layers at intervals around the first radiation sub-layer 411, the utilization rate of the first surface 301 can also be increased, allowing more radiation sub-layers to be arranged on the first surface 301, which also helps to improve the radiation efficiency of the microstrip antenna device.

[0065] In addition, in some embodiments, the shape of the projection of the first radiation sub-layer 411 on the first surface 301 is different from the shape of the projection of the remaining radiation sub-layers on the first surface 301. Through such an arrangement, the shapes of the radiation sub-layers on the first surface 301 can be made different, which helps to improve the radiation efficiency of the microstrip antenna device.

[0066] It should be noted that the shapes of the remaining radiation sub-layers among the multiple radiation sub-layers except the first radiation sub-layer 411 may be the same, or of course, they may also be different. In this regard, the embodiments of the present application do not make any limitations here.

[0067] In addition, in some embodiments, among the remaining radiation sub-layers, the area of the projection of each radiation sub-layer on the first surface 301 is smaller than the area of the projection of the first radiation sub-layer 411 on the first surface 301. Through such an arrangement, it is equivalent to arranging a radiation sub-layer with a larger area in the middle of the first surface 301, and arranging radiation sub-layers with smaller areas around the radiation sub-layer with a larger area, thereby helping to improve the radiation efficiency of the multiple radiation sub-layers in radiating signals.

[0068] In addition, in some embodiments, the first radiation sub-layer 411 is electrically connected to the feeding network 20. Through such an arrangement, once the feeding network 20 transmits a signal to the first radiation sub-layer 411, the first radiation sub-layer 411 can be coupled with the remaining radiation sub-layers, enabling the remaining radiation sub-layers to also radiate signals, thereby improving the radiation efficiency of the microstrip antenna device.

[0069] In addition, in some embodiments, such as Figure 1As shown, the microstrip antenna device may further include a feeding probe 50. The feeding network 20 includes a circuit board 21 and a feeding line layer 22 provided on the circuit board 21. The circuit board 21 and the radiation patch 30 are stacked. The feeding line layer 22 is located on the surface of the circuit board 21 facing away from the radiation patch 30. The first end of the feeding probe 50 is connected to the first radiation sub-layer 411, and the second end of the feeding probe 50 is connected to the feeding line layer 22, so that the first radiation sub-layer 411 is electrically connected to the feeding network 20.

[0070] Since the circuit board 21 and the radiation patch 30 are stacked, the feeding line layer 22 can be provided on the surface of the circuit board 21 facing away from the radiation patch 30, and the first radiation sub-layer 411 can be provided on the surface of the radiation patch 30 facing away from the circuit board 21. Thus, through holes can be provided on the circuit board 21 and through holes can be provided on the feeding patch, so that the feeding probe 50 passes through the through holes on the circuit board 21 and the through holes on the radiation patch 30 respectively. The first end of the feeding probe 50 is electrically connected to the first radiation sub-layer 411, and the second end of the feeding probe 50 is electrically connected to the feeding line layer 22, realizing the electrical connection between the first radiation sub-layer 411 and the feeding network 20. That is, by providing the feeding probe 50, it is convenient to realize the electrical connection between the first radiation sub-layer 411 and the feeding network 20, so that the microstrip antenna device can radiate circularly polarized signals.

[0071] It should be noted that in the embodiment of the present application, as Figure 7 shown, the feeding probe 50 may include a first cylinder 51 and a second cylinder 52. One end of the first cylinder 51 is connected to one end of the second cylinder 52, and the diameter of the first cylinder 51 is greater than the diameter of the second cylinder 52. A first through hole is provided on the radiation patch 30, and the first through hole penetrates the radiation patch 30. The first cylinder 51 passes through the first through hole and is electrically connected to the first radiation sub-layer 411. A second through hole is provided on the circuit board 21 of the feeding network 20, and the second cylinder 52 passes through the second through hole, and the second cylinder 52 is electrically connected to the feeding line layer 22, so that the first radiation sub-layer 411 is electrically connected to the feeding network 20. Among them, the first cylinder 51 and the first radiation sub-layer 411 can be connected by welding, and the second cylinder 52 and the feeding line layer 22 can be connected by welding.

[0072] Of course, in the embodiments of the present application, the feeding probe 50 may also have other structures. For example, the feeding probe 50 may only include a cylinder. In this case, the cylinder passes through the first through hole on the radiation sheet 30 and is electrically connected to the first radiation sub-layer 411, and the main body passes through the second through hole on the circuit board 21 and is electrically connected to the feeding circuit layer 22. For another example, the feeding probe 50 may further include a first cylinder 51, a second cylinder 52, and a third cylinder. The first cylinder 51, the second cylinder 52, and the third cylinder are connected in sequence. The first cylinder 51 is electrically connected to the first radiation sub-layer 411, the third cylinder is electrically connected to the feeding circuit layer 22, and the diameters of the first cylinder 51, the second cylinder 52, and the third cylinder are different from each other. The specific structure of the feeding probe 50 is not limited in the embodiments of the present application.

[0073] In addition, in the embodiments of the present application, the number of the feeding probes 50 can be set according to actual needs. For example, the number of the feeding probes 50 is 2, or for another example, the number of the feeding probes 50 is 4. This is not limited in the embodiments of the present application. Among them, the number of the feeding probes 50 can be determined according to the number of output ends of the feeding circuit layer 22, that is, the number of the feeding probes 50 is the same as the number of output ends of the feeding circuit layer 22. For example, when the number of output ends of the feeding circuit layer 22 is 4, the number of the feeding probes 50 is 4, and one end of a feeding probe 50 is electrically connected to an output end of a feeding circuit layer 22.

[0074] In addition, in the embodiments of the present application, the feeding circuit layer 22 may be formed of copper. Of course, the feeding circuit layer 22 may also be formed of other metals. For example, the feeding circuit layer 22 is formed of silver. This is not limited in the embodiments of the present application.

[0075] In addition, in the embodiments of the present application, the specific form of the feeding circuit layer 22 can be set according to actual needs, and the traces in the feeding circuit layer 22 can be provided with 4 output ends and 1 input end. An output end is electrically connected to the first radiation sub-layer 411 through a feeding probe 50, so that the feeding circuit layer 22 is electrically connected to the first radiation sub-layer 411. For example, as Figure 4 shown, the form of the feeding circuit layer 22 can be as Figure 4 shown, and the circuit corresponding to the feeding circuit layer 22 can be as Figure 6 shown.

[0076] In addition, when the feeding circuit layer 22 has 4 output ends, the phase differences of the 4 output ends can be 0°, 90°, 180°, and 270° respectively.

[0077] In addition, in some embodiments, the remaining radiation sub-layers are centrosymmetric with respect to the center of the first radiation sub-layer 411. With such an arrangement, the remaining radiation sub-layers among the plurality of radiation sub-layers are coupled to the first radiation sub-layer 411, and the remaining radiation sub-layers are centrosymmetric with respect to the center of the first radiation sub-layer 411, which helps the plurality of radiation sub-layers to radiate signals, and thus is conducive to improving the radiation efficiency of the microstrip antenna device.

[0078] In addition, in some embodiments, as Figure 3 shown, the plurality of radiation layers 40 may include a first radiation sub-layer 411, a second radiation sub-layer 412, a third radiation sub-layer 413, a fourth radiation sub-layer 414, and a fifth radiation sub-layer 415; the shape of the first radiation sub-layer 411 is square, and notches 4111 are provided at each corner position of the first radiation sub-layer 411, and at least part of the second radiation sub-layer 412, at least part of the third radiation sub-layer 413, at least part of the fourth radiation sub-layer 414, and at least part of the fifth radiation sub-layer 415 are sequentially located in the four notches 4111; an opening 4112 is provided in the middle of the first radiation sub-layer 411, and the center of the opening 4112 is on the same straight line as the center of the first surface 301.

[0079] Since notches 4111 are provided at each corner position of the first radiation sub-layer 411, it is possible to make at least part of the second radiation sub-layer 412, at least part of the third radiation sub-layer 413, at least part of the fourth radiation sub-layer 414, and at least part of the fifth radiation sub-layer 415 be sequentially located in the four notches 4111, so that the distance between the second radiation sub-layer 412 and the first radiation sub-layer 411 is relatively close, and it is equivalent to making the overlapping part between the first radiation sub-layer 411 and the second radiation sub-layer 412 relatively large, so that the first radiation sub-layer 411 is coupled to the second radiation sub-layer 412. Similarly, the first radiation sub-layer 411 is also coupled to the third radiation sub-layer 413, the fourth radiation sub-layer 414, and the fifth radiation sub-layer 415 respectively. Thus, when the first radiation sub-layer 411 receives a signal for radiation, it is convenient for the second radiation sub-layer 412, the third radiation sub-layer 413, the fourth radiation sub-layer 414, and the fifth radiation sub-layer 415 to radiate signals.

[0080] It should be noted that there is a gap between the second radiation sub-layer 412 and the first radiation sub-layer 411, there is a gap between the third radiation sub-layer 413 and the first radiation sub-layer 411, there is a gap between the fourth radiation sub-layer 414 and the first radiation sub-layer 411, and there is a gap between the fifth radiation sub-layer 415 and the first radiation sub-layer 411.

[0081] In addition, in some embodiments, the shapes of the second radiation sub-layer 412, the third radiation sub-layer 413, the fourth radiation sub-layer 414, and the fifth radiation sub-layer 415 are all the same. With such an arrangement, when the second radiation sub-layer 412, the third radiation sub-layer 413, the fourth radiation sub-layer 414, and the fifth radiation sub-layer 415 radiate signals after being coupled with the first radiation sub-layer 411, the signals are radiated through the same structure, which can improve the beam rotation symmetry of the microstrip antenna device.

[0082] In addition, in some embodiments, as Figure 3 shown, the shape of the notch 4111 is square, and the second radiation sub-layer 412, the third radiation sub-layer 413, the fourth radiation sub-layer 414, and the fifth radiation sub-layer 415 each include a first square frame layer, a second square frame layer 4122, a first connecting arm layer 4123, and a second connecting arm layer 4124; the first square frame layer is located inside the second square frame layer 4122, and the diagonal of the first square frame layer intersects with the diagonal of the second square frame layer 4122; a part of the second square frame layer 4122 is located in the notch 4111, and the second square frame layer 4122 includes a first side 41221, a second side 41222, a third side 41223, and a fourth side 41224. The first side 41221, the second side 41222, the third side 41223, and the fourth side 41224 are connected in sequence to enclose a square frame structure. A part of the first side 41221 and a part of the second side 41222 are located in the notch 4111, and the third side 41223 and the fourth side 41224 are located outside the notch 4111. The first side 41221 is connected with a first extension 41225, and the second side 41222 is connected with a second extension 41226. Both the first extension 41225 and the second extension 41226 are located outside the notch 4111. The first end of the first connecting arm layer 4123 is connected to the first extension 41225, and the first end of the second connecting arm layer 4124 is connected to the second extension 41226. The second end of the first connecting arm layer 4123 is connected to the second end of the second connecting arm layer 4124. There is a first gap between the first connecting arm layer 4123 and the third side 41223, and there is a second gap between the second connecting arm layer 4124 and the fourth side 41224. With such an arrangement, the radiation efficiency of the microstrip antenna device for radiating signals can be improved.

[0083] It should be noted that there is a gap between the first side 41221 and the first radiation sub-layer 411, and there is a gap between the second side 41222 and the second radiation sub-layer 412.

[0084] In addition, in some embodiments, as Figure 5As shown, the shape of the notch 4111 is square. The second radiation sub-layer 412, the third radiation sub-layer 413, the fourth radiation sub-layer 414, and the fifth radiation sub-layer 415 all include a first sector frame layer 4131, a second sector frame layer 4132, and an arc connecting arm layer 4133. The first sector frame layer 4131 is located inside the second sector frame layer 4132. Part of the second sector frame layer 4132 is located in the notch 4111. The second sector frame layer 4132 includes a fifth side 41321, a sixth side 41322, and an arc side 41323. The fifth side 41321, the sixth side 41322, and the arc side 41323 are connected in sequence and enclose a sector frame structure. Part of the fifth side 41321 and part of the sixth side 41322 are located in the notch 4111, and the arc side 41323 is located outside the notch 4111. The fifth side 41321 is connected with a third extension 41324, and the sixth side 41322 is connected with a fourth extension 41325. Both the third extension 41324 and the fourth extension 41325 are located outside the notch 4111. The first end of the arc connecting arm layer 4133 is connected to the third extension 41324, and the second end of the arc connecting arm layer 4133 is connected to the fourth extension 41325. There is a third gap between the arc connecting arm layer 4133 and the arc side 41323. Through such a setting, the radiation efficiency of the radiation signal of the microstrip antenna device can be improved.

[0085] It should be noted that there is a gap between the fifth side 41321 and the first radiation sub-layer 411, and there is a gap between the sixth side 41322 and the first radiation sub-layer 411.

[0086] In addition, in some embodiments, a plurality of strip holes 4113 are provided on the first radiation sub-layer 411, and the plurality of strip holes 4113 are distributed at intervals around the center of the first radiation sub-layer 411.

[0087] It should be noted that the plurality of strip holes 4113 can be distributed at equal intervals around the center of the first radiation sub-layer 411. In addition, the number of strip holes 4113 can be set according to actual needs. For example, the number of strip holes 4113 is 4; for another example, the number of strip holes 4113 is 8. The specific number of strip holes 4113 is not limited in the embodiments of the present application. In addition, when the first radiation sub-layer 411 is square and the number of strip holes 4113 is 4, one side of the first radiation sub-layer 411 corresponds to one strip hole 4113.

[0088] In addition, in some embodiments, such as Figure 3 or Figure 5As shown, a plurality of first metallized vias 4114 may be provided on the first radiation sub-layer 411. The plurality of first metallized vias 4114 are spaced apart along the circumferential direction of the first radiation sub-layer 411, and the first metallized vias 4114 are connected to the surface of the feeding network 20 facing the radiation sheet 30. By providing the first metallized vias 4114, the first radiation sub-layer 411 can be connected to the surface of the feeding network 20 facing the radiation sheet 30.

[0089] It should be noted that when the feeding network 20 includes a circuit board 21 and a feeding line layer 22, the first metallized vias 4114 are connected to the surface of the circuit board 21 facing the radiation sheet 30. Among them, the circuit board 21 has two opposite surfaces. The feeding line layer 22 is provided on one surface, and a copper layer is arranged on the other surface, covering the other surface. And the feeding line layer 22 is provided on the surface of the circuit board 21 facing away from the radiation sheet 30, and a copper layer is arranged on the surface of the circuit board 21 facing the radiation sheet 30.

[0090] In addition, in the embodiments of the present application, the number of the first metallized vias 4114 can be set according to actual needs. For example, the number of the first metallized vias 4114 is 4, and for another example, the number of the first metallized vias 4114 is 6. In this regard, the embodiments of the present application do not make any limitations here.

[0091] In addition, in some embodiments, as Figure 3 shown, second metallized vias 302 may be provided on the radiation sheet 30; among the remaining radiation sub-layers, the projection of each radiation sub-layer on the first surface 301 surrounds at least one second metallized via 302.

[0092] It should be noted that the second metallized vias 302 can be connected to the surface of the feeding network 20 facing the radiation sheet 30. In addition, the number of the second metallized vias 302 is equal to the number of the remaining radiation sub-layers except the first radiation sub-layer 411 among the plurality of radiation sub-layers. Of course, the number of the second metallized vias 302 can also be greater than the number of the remaining radiation sub-layers except the first radiation sub-layer 411 among the plurality of radiation sub-layers. In this regard, the embodiments of the present application do not make any limitations here.

[0093] In addition, in some embodiments, the base 10 is of a frame structure, the feeding network 20 is embedded inside the base 10, and the radiation sheet 30 is detachably connected to the base 10.

[0094] Since the base 10 has a frame structure, the base 10 has an accommodation space. Thus, when assembling the microstrip antenna device, the feeding network 20 can be embedded inside the base 10, that is, the feeding network 20 is located in the accommodation space of the base 10, and then the radiation patch 30 is connected to the base 10. In addition, the radiation patch 30 is detachably connected to the base 10, so that the radiation patch 30 can be easily disassembled or replaced.

[0095] It should be noted that there may be a gap between the feeding network 20 and the base 10. Of course, the feeding network 20 can also be in contact with the base 10. In this regard, the embodiments of the present application do not make any limitations here.

[0096] In addition, in some embodiments, as Figure 1 shown, the microstrip antenna device may further include a metal connector 001; the edge of the radiation patch 30 is connected to the base 10 through the metal connector 001. Through such a setting, the radiation patch 30 can be firmly connected to the base 10.

[0097] It should be noted that the metal connector 001 can be a metal bolt. Of course, the metal connector 001 can also be a metal pin. For the specific type of the metal connector 001, the embodiments of the present application do not make any limitations here.

[0098] In addition, connection holes can be provided at the edge of the radiation patch 30, and corresponding threaded holes or through holes are provided on the base 10, so that the metal connector 001 can pass through the connection holes and be embedded in the threaded holes or through holes to realize the connection between the radiation patch 30 and the base 10.

[0099] In addition, the number of the metal connectors 001 can be set according to actual needs. For example, the number of the metal connectors 001 is 8, and for another example, the number of the metal connectors 001 is 6. In this regard, the embodiments of the present application do not make any limitations here.

[0100] In addition, in the embodiments of the present application, the base 10 can be formed of metal, that is, the base 10 is a metal base 10.

[0101] In addition, in some embodiments, as Figure 1 shown, the microstrip antenna device may further include a non-metal connector 002; the feeding network 20 is connected to the radiation patch 30 through the non-metal connector 002. By providing the non-metal connector 002, the feeding network 20 can be firmly connected to the radiation patch 30, avoiding the problem that the feeding network 20 and the radiation patch 30 may be separated.

[0102] It should be noted that the non-metal connector 002 can include but is not limited to bolts, pins, etc.

[0103] In addition, in some embodiments, as Figure 1As shown, the microstrip antenna device may further include a connector 003; the connector 003 is connected to the base 10, and the connector 003 is electrically connected to the feeding network 20. Through such a setting, the connector 003 can be connected to the component to be connected, so that the signal can be transmitted to the feeding network 20 through the connector 003, and then the feeding network 20 transmits the signal to the radiation patch 30 and the radiation layer 40, so that the radiation layer 40 radiates the signal.

[0104] It should be noted that the feeding network 20 may have an input end, and the connector 003 is electrically connected to the input end of the feeding network 20.

[0105] An embodiment of the present application provides a navigation device, which includes a navigation body and the microstrip antenna device according to any one of the above first aspects; the microstrip antenna device is installed on the navigation body.

[0106] An embodiment of the present application provides a manufacturing method for manufacturing the microstrip antenna device in any one of the above embodiments. The plurality of radiation sub-layers include a first radiation sub-layer, and a first metallized via is provided on the first radiation sub-layer, and a second metallized via is provided on the radiation patch. The feeding network includes a circuit board and a feeding line layer provided on the circuit board; as Figure 8 shown, the manufacturing method includes:

[0107] Step 801: Based on the target resonant frequency band, determine the parameters of the radiation patch and the parameters of the radiation sub-layers.

[0108] Among them, the height of the radiation patch and the size of the radiation sub-layer on the radiation patch have a greater impact on the resonant frequency of the antenna, and other components have a smaller impact on the resonant frequency of the antenna. Therefore, it is necessary to determine the parameters of the radiation patch and the parameters of the radiation sub-layers based on the target resonant frequency band.

[0109] The parameters of the radiation patch can be the height of the radiation patch, and the parameters of the radiation sub-layer can be the size of the radiation sub-layer, that is, the area, shape, etc. of the radiation sub-layer.

[0110] In addition, when determining the parameters of the radiation patch and the parameters of the radiation sub-layers, a simulation test software can be used for determination. Specifically, after the target resonant frequency band is determined, the parameters of the radiation patch and the parameters of the radiation sub-layers can be determined by using the simulation test software.

[0111] For example, the target resonant frequency band is a band covering 1.1 GHz to 1.7 GHz. Therefore, according to the target frequency band, the height of the radiation patch, the area, shape, etc. of the radiation sub-layer can be determined by using the simulation test software.

[0112] Step 802: Determine the gap between the radiation sub-layers, the position of the first metallized via on the first radiation sub-layer, and the position of the second metallized via on the radiation patch.

[0113] Among them, the first metallized vias and the second metallized vias have an impact on the resonance intensity of the antenna, and the resonance intensity of the antenna is mainly determined by the gap between the radiator layers, the positions of the first metallized vias, and the positions of the second metallized vias. Therefore, the gap between the radiator layers, the positions of the first metallized vias on the first radiator layer, and the positions of the second metallized vias on the radiation patch can be determined so that the efficiency of the antenna within the target resonance frequency band is greater than the target threshold.

[0114] Specifically, after determining the target resonance frequency band, once the parameters of the radiation patch and the radiator layers are determined, the resonance frequency of the antenna can be simulated through simulation tests, and the gap between the radiator layers, the positions of the first metallized vias on the first radiator layer, and the positions of the second metallized vias on the radiation patch can be adjusted in real time until the efficiency of the resonance frequency of the antenna within the target resonance frequency band is greater than the target threshold. At this time, the gap between the radiator layers, the positions of the first metallized vias on the first radiator layer, and the positions of the second metallized vias on the radiation patch can be determined.

[0115] It should be noted that the target threshold can be set according to actual needs. For example, the target threshold is 85%, and for another example, the target threshold is 90%.

[0116] Step 803: Determine the line width and line length of each section of microstrip line in the feed line layer on the circuit board to determine the size of the feed network.

[0117] Among them, the center frequency of the feed network can be determined based on the target resonance frequency band, and then the thickness and dielectric constant of the circuit board are determined. The feed line layer has an input end and an output end, and both the input end and the output end are matched with a 50Ω impedance. Then, the initial values of the line width and the line length of each section of microstrip line can be determined, and then the actual line width and line length of each section of microstrip line can be determined according to the simulation test software.

[0118] For example, assume that the center frequency of the feed network is set at 1.4 GHz, the thickness of the circuit board of the feed network is 0.762 mm, the frequency sweep range is: 1.1 GHz to 1.7 GHz, combined with Figure 4 the schematic diagram of the feed network structure shown in Figure 6 and the schematic diagram of the feed network impedance shown in

[0119] The input signal of Port 1 is divided into four paths by a Wilkinson power divider. The resistor R is an absorption resistor, which increases the isolation of the port and reduces the cross polarization of the antenna. The two signals output by the Wilkinson power divider generate a 180° phase difference through a 180° phase shifter. The two signals then pass through another Wilkinson power divider and are divided into four signals with phase differences of 180° and 360°. After passing through 90° phase shifters respectively, four signals with phase differences of 0°, 90°, 180°, and 270° can be generated.

[0120] The initial values of the impedance values, line widths, and line lengths of each part of the feeding network are as follows:

[0121] λg = 126.74 mm;

[0122] Z1 = 70.71 Ω, and the line width of the microstrip line is 0.86 mm;

[0123] Z2 = 63 Ω, and the line width of the microstrip line is 1.08 mm;

[0124] Z3 = 81 Ω, and the line width of the microstrip line is 0.63 mm;

[0125] Z0 = Z4 = 50 Ω, and the line width of the microstrip line is 1.63 mm.

[0126] After optimization by the simulation test software, the actual line widths and line lengths of each section of the microstrip line are obtained.

[0127] Step 804: Assemble the radiation patch, the feeding network, and the base to form a microstrip antenna device.

[0128] Among them, after the parameters of the radiation patch and the dimensions of the feeding network are determined, the radiation patch and the feeding network can be stacked, and the radiation patch is connected to the feeding network and then connected to the base to form a microstrip antenna device.

[0129] In addition, when the feeding probe includes a first cylinder and a second cylinder, the diameter of the second cylinder can be adjusted so that the antenna resonance is within the target frequency band.

[0130] In the description of this specification, the description with reference to the terms "an embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0131] Although embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. A microstrip antenna device, characterized in that: The microstrip antenna device comprises: a base (10), a feeding network (20) and a radiation sheet (30); The feed network (20) and the radiation sheet (30) are stacked and connected to each other, and the radiation sheet (30) is fixed to the base (10); The radiation sheet (30) has a first surface (301) facing away from the feed network (20), a radiation layer (40) is arranged on the first surface (301), the radiation layer (40) includes a plurality of radiation sublayers, at least some of the radiation sublayers are distributed around the center of the first surface (301) at intervals; Wherein, at least one of the radiation sublayers is electrically connected to the feeding network (20).

2. The microstrip antenna device according to claim 1, characterized in that: A first radiation sublayer (411) among the plurality of radiation sublayers is located in the middle of the first surface (301), and the center of the first radiation sublayer (411) is on the same straight line as the center of the first surface (301), and the remaining radiation sublayers are distributed at intervals around the first radiation sublayer (411).

3. The microstrip antenna device according to claim 2, characterized in that: The shape of the projection of the first radiation sublayer (411) on the first surface (301) is different from the shapes of the projections of the remaining radiation sublayers on the first surface (301).

4. The microstrip antenna device according to claim 2, characterized in that: In the remaining radiation sub-layers, the projection area of ​​each radiation sub-layer on the first surface (301) is smaller than the projection area of ​​the first radiation sub-layer (411) on the first surface (301).

5. The microstrip antenna device according to claim 4, characterized in that: The first radiation sublayer (411) is electrically connected to the feeding network (20).

6. The microstrip antenna device according to claim 5, characterized in that: The microstrip antenna device further comprises a feeding probe (50), and the feeding network (20) comprises a circuit board (21) and a feeding circuit layer (22) arranged on the circuit board (21); The circuit board (21) and the radiation sheet (30) are stacked, the feed line layer (22) is located on the surface of the circuit board (21) away from the radiation sheet (30), the first end of the feed probe (50) is connected to the first radiation sublayer (411), and the second end of the feed probe (50) is connected to the feed line layer (22), so that the first radiation sublayer (411) is electrically connected to the feed network (20).

7. The microstrip antenna device according to claim 2, characterized in that: The remaining radiation sub-layers are symmetrical about the center of the first radiation sub-layer (411).

8. The microstrip antenna device according to claim 2, characterized in that: The plurality of radiation layers (40) include a first radiation sublayer (411), a second radiation sublayer (412), a third radiation sublayer (413), a fourth radiation sublayer (414) and a fifth radiation sublayer (415); The first radiation sublayer (411) is in a square shape, and each corner of the first radiation sublayer (411) is provided with a notch (4111), and at least part of the second radiation sublayer (412), at least part of the third radiation sublayer (413), at least part of the fourth radiation sublayer (414), and at least part of the fifth radiation sublayer (415) are sequentially located in the four notches (4111); an opening (4112) is provided in the middle of the first radiation sublayer (411), and the center of the opening (4112) is in the same straight line as the center of the first surface (301).

9. The microstrip antenna device according to claim 8, characterized in that: The shape of the second radiation sublayer (412), the shape of the third radiation sublayer (413), the shape of the fourth radiation sublayer (414), and the shape of the fifth radiation sublayer (415) are all the same.

10. The microstrip antenna device according to claim 9, characterized in that: The shape of the notch (4111) is square, and the second radiation sublayer (412), the third radiation sublayer (413), the fourth radiation sublayer (414) and the fifth radiation sublayer (415) all include a first square frame layer, a second square frame layer (4122), a first connecting arm layer (4123) and a second connecting arm layer (4124); The first square frame layer is located inside the second square frame layer (4122), and the diagonal line of the first square frame layer intersects with the diagonal line of the second square frame layer (4122); Part of the second square frame layer (4122) is located in the notch (4111), the second square frame layer (4122) includes a first side (41221), a second side (41222), a third side (41223) and a fourth side (41224), the first side (41221), the second side (41222), the third side (41223) and the fourth side (41224) are sequentially connected and enclosed to form a square frame structure, part of the first side (41221) and part of the second side (41222) are located in the notch (4111), the third side (41223) and the fourth side (41224) are located outside the notch (4111), the first side (41221) is connected to the second side (41223), and the fourth side (41224) is connected to the first side (41221). An extension portion (41225), the second side (41222) is connected to the second extension portion (41226), the first extension portion (41225) and the second extension portion (41226) are both located outside the notch (4111), the first end of the first connecting arm layer (4123) is connected to the first extension portion (41225), the first end of the second connecting arm layer (4124) is connected to the second extension portion (41226), the second end of the first connecting arm layer (4123) is connected to the second end of the second connecting arm layer (4124), a first gap is provided between the first connecting arm layer (4123) and the third side (41223), and a second gap is provided between the second connecting arm layer (4124) and the fourth side (41224).

11. The microstrip antenna device according to claim 9, characterized in that: The shape of the notch (4111) is square, and the second radiation sublayer (412), the third radiation sublayer (413), the fourth radiation sublayer (414) and the fifth radiation sublayer (415) all include a first fan-shaped frame layer (4131), a second fan-shaped frame layer (4132) and an arc-shaped connecting arm layer (4133); The first fan-shaped frame layer (4131) is located inside the second fan-shaped frame layer (4132); Part of the second fan-shaped frame layer (4132) is located in the notch (4111), the second fan-shaped frame layer (4132) includes a fifth side (41321), a sixth side (41322), and an arc-shaped side (41323), the fifth side (41321), the sixth side (41322) and the arc-shaped side (41323) are sequentially connected and enclosed to form a fan-shaped frame structure, part of the fifth side (41321) and part of the sixth side (41322) are located in the notch (4111), and the arc-shaped side (41323) is located outside the notch (4111) The fifth side (41321) is connected to the third extension portion (41324), the sixth side (41322) is connected to the fourth extension portion (41325), the third extension portion (41324) and the fourth extension portion (41325) are both located outside the notch (4111), the first end of the arc-shaped connecting arm layer (4133) is connected to the third extension portion (41324), the second end of the arc-shaped connecting arm layer (4133) is connected to the fourth extension portion (41325), and a third gap is provided between the arc-shaped connecting arm layer (4133) and the arc-shaped side (41323).

12. The microstrip antenna device according to claim 8, characterized in that: A plurality of strip-shaped holes (4113) are provided on the first radiation sublayer (411), and the plurality of strip-shaped holes (4113) are distributed at intervals around the center of the first radiation sublayer (411).

13. The microstrip antenna device according to claim 2, characterized in that: A plurality of first metallized vias (4114) are provided on the first radiation sublayer (411), and the plurality of first metallized vias (4114) are spaced apart along the circumferential direction of the first radiation sublayer (411), and the first metallized vias (4114) are connected to the surface of the feeding network (20) facing the radiation plate (30).

14. The microstrip antenna device according to claim 2, characterized in that: The radiation sheet (30) is provided with a second metallized via hole (302); In the remaining radiation sub-layers, a projection of each radiation sub-layer on the first surface (301) surrounds at least one second metallized via (302).

15. The microstrip antenna device according to claim 1, characterized in that: The microstrip antenna device also includes a metal connecting piece (001); The edge of the radiation sheet (30) is connected to the base (10) via the metal connector (001).

16. The microstrip antenna device according to claim 1, characterized in that: The microstrip antenna device also includes a non-metallic connecting member (002); The feeding network (20) and the radiation sheet (30) are connected via the non-metallic connecting member (002).

17. The microstrip antenna device according to claim 1, characterized in that: The base (10) is a frame-type structure, the feed network (20) is embedded in the base (10), and the radiation sheet (30) is detachably connected to the base (10).

18. The microstrip antenna device according to claim 17, characterized in that: The microstrip antenna device also includes a connector (003); The connector (003) is connected to the base (10), and the connector (003) is electrically connected to the feed network (20).

19. The microstrip antenna device according to any one of claims 1 to 18, characterized in that: The operating frequency band of the microstrip antenna device covers 1.1 GHz to 1.7 GHz.

20. A navigation device, characterized in that: The navigation device comprises a navigation body and a microstrip antenna device as described in any one of claims 1 to 19; The microstrip antenna device is installed on the navigation body.

21. A production method, characterized in that: Used to manufacture the microstrip antenna device according to any one of claims 1 to 19, the plurality of radiation sublayers include a first radiation sublayer, the first radiation sublayer is provided with a first metallized via, the radiation sheet is provided with a second metallized via, and the feeding network includes a circuit board and a feeding circuit layer provided on the circuit board; The production method comprises: Based on the target resonant frequency band, determining the parameters of the radiation sheet and the parameters of the radiation sublayer; Determine a position of a first metallized via hole on the first radiation sublayer and a position of a second metallized via hole on the radiation sheet; Determine the line width and line length of each microstrip line in the feed line layer on the circuit board to determine the size of the feed network; The radiation plate, the feeding network and the base are assembled to form the microstrip antenna device.

Images