Glue pouring equipment for LED (Light Emitting Diode) wafer

Abstract

The invention relates to the technical field of LED wafer glue filling, and provides LED wafer glue filling equipment which comprises a glue filling nozzle and a glue filling mechanical arm used for driving the glue filling nozzle to move at any position and further comprises a filling frame, two glue storage barrel sets, a mixing barrel, a hollow material mixing pipe and a material mixing rod. The two glue storage barrel sets are symmetrically arranged on the filling frame, a raw material mixing assembly is arranged in each glue storage barrel set and used for mixing glue raw materials, the mixing barrel is arranged on the filling frame and located between the two glue storage barrel sets, and the two sides of the lower portion of the mixing barrel communicate with the two glue storage barrel sets correspondingly, so that the glue materials flow in the mixing barrel from bottom to top. The hollow material mixing pipe penetrates through the mixing cylinder and is rotationally arranged in the mixing cylinder in a sealed mode, and by means of the technical scheme, the problem that in the prior art, when LED wafer glue filling equipment mixes glue, the glue is difficult to mix fully and evenly is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED wafer potting, and specifically, to an LED wafer potting device. Background Art

[0002] In the process of manufacturing LED wafers, the potting process plays a crucial role in protecting the wafers and improving their performance and stability. The potting quality directly affects important indicators such as the light-emitting effect and service life of LED wafers. With the rapid development of the LED industry, the performance requirements for LED wafer potting devices are also increasing day by day.

[0003] Currently, common LED wafer potting devices mainly consist of a glue storage device, a conveying pipeline, a mixing device, and a potting nozzle, etc. The glue storage device is usually divided into two independent containers, which are respectively used to store glue A and glue B. These two kinds of glue are conveyed to the mixing device under pressure through their respective conveying pipelines. The mixing device generally uses a static mixer, and a series of mixing elements are arranged inside it. When the glue flows through these elements, preliminary mixing is achieved through ways such as splitting and merging. Finally, the mixed glue is evenly applied on the LED wafer through the potting nozzle.

[0004] Although the existing LED wafer potting devices can complete the potting task to a certain extent, there are significant deficiencies in the mixing link of glue A and glue B. Due to the differences in the physical properties (such as viscosity, density, etc.) of glue A and glue B, it is difficult to achieve sufficient and uniform mixing in the existing static mixer. Some glue with relatively high viscosity is likely to adhere to the inner wall of the mixer when flowing through the mixing elements, resulting in insufficient mixing and local glue proportion imbalance. Summary of the Invention

[0005] The present invention proposes an LED wafer potting device to solve the problem in the background art that in the existing LED wafer potting device, it is difficult to achieve sufficient and uniform mixing when mixing the glue materials.

[0006] The technical solution of the present invention is as follows: An LED wafer potting device includes a potting nozzle and a potting robotic arm for driving the potting nozzle to move to any position, and also includes a filling rack, two glue storage cylinder groups, a mixing cylinder, a hollow mixing pipe, and a mixing rod;

[0007] The potting robotic arm is installed on the filling rack;

[0008] The two glue storage cylinder groups are symmetrically arranged on the filling rack, and a raw material mixing assembly is arranged in each glue storage cylinder group for mixing the glue raw materials;

[0009] The mixing cylinder is arranged on the filling rack and located between the two glue storage cylinder groups. Both sides of the lower part of the mixing cylinder are respectively communicated with the two glue storage cylinder groups, so that the glue material flows upward in the mixing cylinder;

[0010] The hollow mixing pipe penetrates and is rotatably arranged in the mixing cylinder in a sealed manner. A mixing power assembly is arranged between the hollow mixing pipe and the mixing cylinder. The mixing power assembly is meshed with the raw material mixing assembly. The hollow mixing pipe is provided with spiral mixing blades, and the spiral mixing blades are in contact with the inner wall of the mixing cylinder. A plurality of feed through holes are opened on the hollow mixing pipe, and the feed through holes are located in the upper part of the mixing cylinder for the entry of the glue material;

[0011] The mixing rod penetrates and is rotatably arranged in the hollow mixing pipe in a sealed manner. A reverse driving assembly is arranged between the mixing rod and the hollow mixing pipe. When the hollow mixing pipe rotates, the mixing rod is driven to rotate in the reverse direction. A plurality of stirring rods are arranged on the mixing rod, and the stirring rods are located in the hollow mixing pipe for secondary mixing of the glue material.

[0012] On the basis of the foregoing solution, the glue storage cylinder group includes a glue storage tank, a glue conveying pipe, and a glue feeding pipe;

[0013] The glue storage tank is arranged on the filling rack;

[0014] The glue conveying pipe is connected and arranged between the glue storage tank and the mixing cylinder, and a glue conveying valve is installed on the glue conveying pipe;

[0015] The glue feeding pipe is connected and arranged on the glue storage tank, and a glue feeding valve is installed on the glue feeding pipe.

[0016] On the basis of the foregoing solution, the raw material mixing assembly includes a raw material mixing rack, a synchronous rotating rod, bevel gear one, bevel gear two, and bevel gear three;

[0017] The raw material mixing rack penetrates and is rotatably arranged on the glue storage tank;

[0018] The synchronous rotating rod is rotatably arranged on the glue storage tank;

[0019] The bevel gear one is arranged on the raw material mixing rack;

[0020] The bevel gear two is arranged on the synchronous rotating rod, and the bevel gear two is meshed with the bevel gear one;

[0021] The bevel gear three is arranged on the synchronous rotating rod.

[0022] As a preferred technical solution of the present invention, the mixing power assembly includes a mixing rack, a mixing motor, bevel gear four, and bevel gear five;

[0023] The mixing rack is arranged on the mixing cylinder;

[0024] The mixing motor is installed on one side of the mixing rack;

[0025] The fourth bevel gear is arranged on the hollow mixing pipe, and the fourth bevel gear meshes with the third bevel gear;

[0026] The fifth bevel gear is arranged on the output end of the mixing motor, and the fifth bevel gear meshes with the fourth bevel gear.

[0027] As a preferred technical solution of the present invention, the reverse driving assembly includes a driving main gear, a driving rod, a driving driven gear and a reverse turntable;

[0028] The driving main gear is arranged on the hollow mixing pipe;

[0029] The driving rod is arranged on the mixing cylinder and is located on one side of the hollow mixing pipe;

[0030] The driving driven gear is rotatably arranged on the driving rod, and the driving driven gear meshes with the driving main gear;

[0031] The reverse turntable is arranged on the mixing rod, and a driving internal tooth ring is arranged inside the reverse turntable, and the driving internal tooth ring meshes with the driving driven gear.

[0032] In order to facilitate the supply of rubber compound, an air supply assembly is further arranged on one side of the mixing cylinder. The air supply assembly is communicated with the two rubber storage tanks and is used to provide the pressure required for glue filling.

[0033] On the basis of the foregoing solution, the air supply assembly includes an air supply rack, an air supply pump, an air supply pipe and two air supply valves;

[0034] The air supply rack is arranged on one side of the mixing cylinder;

[0035] The air supply pump is installed on the air supply rack;

[0036] The air supply pipe is communicatively arranged between the two rubber storage tanks, and the air output end of the air supply pump is communicated with the air supply pipe;

[0037] The air supply valves are installed on the air supply pipe, and the air output end of the air supply pump is located between the two air supply valves and is used to regulate the gas entering the rubber storage tank.

[0038] On the basis of the foregoing solution, further, the bottom of the mixing cylinder is in a funnel shape, and one end of the hollow mixing pipe penetrates and is hermetically and rotationally communicated with the bottom of the mixing cylinder and is hermetically and rotationally communicated with the mixing cylinder.

[0039] The beneficial effects of the present invention are as follows:

[0040] 1. In the present invention, by providing two glue storage cylinder groups and the raw material mixing components inside, the glue raw materials can be preliminarily mixed, improving the efficiency and uniformity of the glue mixing, making the glue entering the mixing cylinder more stable, and laying a foundation for subsequent fine mixing;

[0041] 2. In the present invention, the A and B glue materials entering the mixing cylinder through the two glue storage cylinder groups will flow from bottom to top, causing the two glue materials to spiral upward through the spiral mixing blades. During the upward movement of the glue materials, the spiral mixing blades can be driven to rotate by the mixing power component. By adjusting the rotation direction of the output end of the mixing motor, the spiral direction of the spiral mixing blades moves from top to bottom. Through the continuous upward injection of the glue materials and the continuous downward pressure of the spiral mixing blades, the two glue materials will surge rapidly between the spiral mixing blades, preliminarily mixing the glue materials;

[0042] 3. In the present invention, as the glue materials in the mixing cylinder rise, when the preliminarily mixed glue materials reach the feed through-hole, they will enter the hollow mixing pipe through the feed through-hole and flow from top to bottom inside the hollow mixing pipe. After the glue materials enter the hollow mixing pipe, the rotation of the hollow mixing pipe will drive the mixing rod to rotate in the reverse direction under the action of the reverse driving component. By driving the stirring rod to move through the mixing rod, secondary mixing of the glue materials can be realized. This multi-level mixing method can fully stir the glue materials, break up the lumps and non-uniformity in the glue materials, ensure the adequacy and uniformity of the glue material mixing, thereby improving the quality of LED chip potting and making the performance of the potted chips more stable;

[0043] 4. In the present invention, by providing a gas supply component to inject gas into the glue storage tank, the required pressure for potting can be provided, ensuring that the glue materials can be smoothly transported from the glue storage tank to the potting nozzle. And through the regulation of the gas supply valve, the amount of gas entering the glue storage tank can be accurately controlled according to different potting requirements, improving the accuracy and controllability of potting.

[0044] 5. In the present invention, by installing an electric heater group on each glue delivery pipe, the glue materials in the delivery pipe can be heated, which can adapt to glue materials with different temperature characteristics, prevent the glue materials from solidifying or increasing viscosity due to too low temperature during transportation, ensure the fluidity of the glue materials, and improve the efficiency and quality of potting. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.

[0046] Figure 1 It is a schematic structural diagram of the whole of the present invention;

[0047] Figure 2Schematic diagram of a partial cross-section showing the cooperation of the filling rack, mixing cylinder, hollow mixing pipe, spiral mixing blades, feed through holes, mixing rods, stirring rods, glue storage cylinder group, raw material mixing assembly, mixing power assembly, reverse drive assembly, and air supply assembly in the present invention;

[0048] Figure 3 For the present invention Figure 2 Schematic diagram of a partially enlarged structure at position A in the present invention;

[0049] Figure 4 Schematic diagram of a partial cross-section showing the cooperation of the mixing cylinder, hollow mixing pipe, spiral mixing blades, feed through holes, mixing rods, stirring rods, and reverse drive assembly in the present invention;

[0050] Figure 5 For the present invention Figure 4 Schematic diagram of a partially enlarged structure at position B in the present invention;

[0051] Figure 6 For the present invention Figure 4 Schematic diagram of a partially enlarged structure at position C in the present invention.

[0052] In the figure: 001, glue storage cylinder group; 002, raw material mixing assembly; 003, mixing power assembly; 004, reverse drive assembly; 005, air supply assembly;

[0053] 1, glue filling nozzle; 2, glue filling robotic arm; 3, filling rack; 4, mixing cylinder; 5, hollow mixing pipe; 6, spiral mixing blades; 7, feed through holes; 8, mixing rods; 9, stirring rods; 10, glue storage tank; 11, glue delivery pipe; 12, glue delivery valve; 13, glue feeding pipe; 14, glue feeding valve; 15, raw material mixing rack; 16, synchronous rotating rod; 17, bevel gear one; 18, bevel gear two; 19, bevel gear three; 20, mixing rack; 21, mixing motor; 22, bevel gear four; 23, bevel gear five; 24, driving main gear; 25, driving rod; 26, driving driven gear; 27, reverse turntable; 28, driving internal gear ring; 29, air supply rack; 30, air supply pump; 31, air supply pipe; 32, air supply valve; 33, glue delivery hose; 34, electric heater group. Detailed implementation manners

[0054] Next, in combination with the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present invention.

[0055] Such as Figures 1 to 6As shown in the figure, this embodiment proposes an LED wafer encapsulation device, which includes an encapsulation nozzle 1 and an encapsulation robotic arm 2 for driving the encapsulation nozzle 1 to move to any position. It also includes a filling rack 3, two glue storage cylinder groups 001, a mixing cylinder 4, a hollow mixing pipe 5 and a mixing rod 8.

[0056] Among them, the encapsulation nozzle 1 is a commonly known device in the art for automatically controlling the quantitative perfusion of glue. Its specific structure is not the main innovation point of this application and will not be elaborated here.

[0057] Among them, the encapsulation robotic arm 2 is installed on the filling rack 3. The encapsulation robotic arm 2 is an existing device for driving the encapsulation nozzle 1 to move freely. Its specific structure is not the main innovation point of this application. Specifically, in actual use, a multi-axis positioning mechanism can also be used for replacement as long as it can drive the encapsulation nozzle 1 to move to any position to complete the precise encapsulation of the LDE wafer.

[0058] As mentioned above, the two glue storage cylinder groups 001 are symmetrically arranged on the filling rack 3. Each glue storage cylinder group 001 is provided with a raw material mixing component 002 for mixing the glue raw materials.

[0059] Among them, the glue storage cylinder group 001 includes a glue storage tank 10, a glue delivery pipe 11 and a glue feeding pipe 13. The glue storage tank 10 is arranged on the filling rack 3. The glue delivery pipe 11 is connected between the glue storage tank 10 and the mixing cylinder 4. A glue delivery valve 12 is installed on the glue delivery pipe 11. The glue feeding pipe 13 is connected to the glue storage tank 10. A glue feeding valve 14 is installed on the glue feeding pipe 13.

[0060] Among them, the raw material mixing component 002 includes a raw material mixing rack 15, a synchronous rotating rod 16, a bevel gear one 17, a bevel gear two 18 and a bevel gear three 19. The raw material mixing rack 15 penetrates and rotates on the glue storage tank 10. The synchronous rotating rod 16 rotates on the glue storage tank 10. The bevel gear one 17 is arranged on the raw material mixing rack 15. The bevel gear two 18 is arranged on the synchronous rotating rod 16. The bevel gear two 18 meshes with the bevel gear one 17. The bevel gear three 19 is arranged on the synchronous rotating rod 16.

[0061] Specifically, the two glue storage tanks 10 can be used to store A and B glue materials respectively. If it is necessary to mix multiple glue materials in special cases, the corresponding number of glue storage cylinder groups 001 can be set according to the types of glue materials. When feeding the glue materials, by opening the feeding valve, the corresponding glue material can be transported to the glue storage tank 10 through the glue feeding pipe 13. And by opening the glue delivery valve 12, the glue material in the glue storage tank 10 can be transported to the mixing cylinder 4, and the glue delivery amount can be adjusted by the opening and closing size of the glue delivery valve 12.

[0062] After the rubber compound enters the rubber storage tank 10, the rotation of the third bevel gear 19 can drive the synchronous rotating rod 16 to rotate. The rotation of the synchronous rotating rod 16 can drive the second bevel gear 18 to rotate. The rotation of the second bevel gear 18 drives the first bevel gear 17 to rotate. Through the rotation of the first bevel gear 17, the raw material mixing frame 15 can be driven to rotate, and the raw materials in the rubber storage tank 10 are mixed.

[0063] The above-mentioned mixing cylinder 4 is arranged on the filling frame 3 and is located between the two rubber storage cylinder groups 001. The two sides of the lower part of the mixing cylinder 4 are respectively communicated with the two rubber storage cylinder groups 001, so that the rubber compound flows upward in the mixing cylinder 4.

[0064] The above-mentioned hollow mixing pipe 5 penetrates and is rotatably and sealed in the mixing cylinder 4. The bottom of the mixing cylinder 4 is in a funnel shape. One end of the hollow mixing pipe 5 penetrates and is rotatably and sealed and communicated with the bottom of the mixing cylinder 4, and is rotationally and sealed and communicated with the mixing cylinder 4. A rubber conveying hose 33 is communicated between the glue inlet end of the glue filling nozzle 1 and the bottom of the mixing cylinder 4. A mixing power assembly 003 is arranged between the hollow mixing pipe 5 and the mixing cylinder 4. The mixing power assembly 003 is engaged with the raw material mixing assembly 002. A spiral mixing blade 6 is arranged on the hollow mixing pipe 5. The spiral mixing blade 6 is in contact with the inner wall of the mixing cylinder 4. A plurality of feed through holes 7 are formed in the hollow mixing pipe 5. The feed through holes 7 are located in the upper part of the mixing cylinder 4 and are used for the rubber compound to enter.

[0065] Among them, the mixing power assembly 003 includes a mixing frame 20, a mixing motor 21, a fourth bevel gear 22 and a fifth bevel gear 23. The mixing frame 20 is arranged on the mixing cylinder 4. The mixing motor 21 is installed on one side of the mixing frame 20. The fourth bevel gear 22 is arranged on the hollow mixing pipe 5. The fourth bevel gear 22 is engaged with the third bevel gear 19. The fifth bevel gear 23 is arranged on the output end of the mixing motor 21. The fifth bevel gear 23 is engaged with the fourth bevel gear 22.

[0066] Specifically, start the mixing motor 21. The output end of the mixing motor 21 drives the fifth bevel gear 23 to rotate. The rotation of the fifth bevel gear 23 drives the fourth bevel gear 22 to rotate. Through the rotation of the fourth bevel gear 22, the hollow mixing pipe 5 and the third bevel gear 19 are driven to rotate. Through the rotation of the hollow mixing pipe 5, the spiral mixing blade 6 is driven to rotate. When the A and B rubber compounds in the two rubber storage cylinder groups 001 enter the mixing cylinder 4, they will flow upward. The two rubber compounds will spiral upward through the spiral mixing blade 6. During the rising process of the rubber compound, through the rotation of the spiral mixing blade 6, the spiral direction of the spiral mixing blade 6 moves from top to bottom. Through the continuous upward injection of the rubber compound and the continuous downward pressure of the spiral mixing blade 6, the two rubber compounds will surge rapidly between the spiral mixing blades 6, and the rubber compounds are preliminarily mixed.

[0067] As described above, the mixing rod 8 is rotatably and sealingly arranged through the hollow mixing tube 5. A reverse driving assembly 004 is arranged between the mixing rod 8 and the hollow mixing tube 5. When the hollow mixing tube 5 rotates, the mixing rod 8 is driven to rotate in the opposite direction. A plurality of stirring rods 9 are arranged on the mixing rod 8. The stirring rods 9 are located inside the hollow mixing tube 5 and are used for secondary mixing of the rubber compound.

[0068] Among them, the reverse driving assembly 004 includes a driving main gear 24, a driving rod 25, a driving driven gear 26 and a reverse turntable 27. The driving main gear 24 is arranged on the hollow mixing tube 5. The driving rod 25 is arranged on the mixing cylinder 4 and is located on one side of the hollow mixing tube 5. The driving driven gear 26 is rotatably arranged on the driving rod 25. The driving driven gear 26 meshes with the driving main gear 24. The reverse turntable 27 is arranged on the mixing rod 8. A driving internal tooth ring 28 is arranged inside the reverse turntable 27. The driving internal tooth ring 28 meshes with the driving driven gear 26.

[0069] Specifically, when the hollow mixing tube 5 rotates, the hollow mixing tube 5 drives the driving main gear 24 to rotate. The rotation of the driving main gear 24 drives the driving driven gear 26 to rotate. The rotation of the driving driven gear 26 drives the driving internal tooth ring 28 to rotate. The rotation of the driving internal tooth ring 28 drives the reverse turntable 27 to rotate. The rotation of the reverse turntable 27 drives the mixing rod 8 to rotate, so that the mixing rod 8 and the hollow mixing tube 5 rotate in the opposite direction.

[0070] As the rubber compound in the mixing cylinder 4 rises, when the preliminarily mixed rubber compound reaches the feed through hole 7, it will enter the hollow mixing tube 5 through the feed through hole 7 and flow from top to bottom inside the hollow mixing tube 5. After the rubber compound enters the hollow mixing tube 5, the rotation of the hollow mixing tube 5 will drive the mixing rod 8 to rotate in the opposite direction under the action of the reverse driving assembly 004. The movement of the mixing rod 8 drives the stirring rods 9, and the secondary mixing of the rubber compound can be realized. This multi-level mixing method can fully stir the rubber compound, break the lumps and unevenness in the rubber compound, ensure the sufficiency and uniformity of the rubber compound mixing, thereby improving the quality of LED chip encapsulation and making the performance of the encapsulated chip more stable.

[0071] It should be added that, for the convenience of rubber compound supply, an air supply assembly 005 is also arranged on one side of the mixing cylinder 4. The air supply assembly 005 is communicated with two rubber storage tanks 10 and is used to provide the pressure required for encapsulation. The air supply assembly 005 includes an air supply frame 29, an air supply pump 30, an air supply pipe 31 and two air supply valves 32. The air supply frame 29 is arranged on one side of the mixing cylinder 4. The air supply pump 30 is installed on the air supply frame 29. The air supply pipe 31 is communicatively arranged between the two rubber storage tanks 10. The air output end of the air supply pump 30 is communicated with the air supply pipe 31. The air supply valves 32 are installed on the air supply pipe 31. The air output end of the air supply pump 30 is located between the two air supply valves 32 and is used to regulate the gas entering the rubber storage tank 10.

[0072] Specifically, by starting the air supply pump 30 and the corresponding air supply valve 32, external gas can be injected into the glue storage tank 10 through the air supply pipe 31. In actual use, in order to prevent external gas from contaminating the glue, it is optimal to connect inert gas to the intake end of the air supply pump 30. By injecting gas into the glue storage tank 10, the required pressure for glue filling can be provided, ensuring that the glue can be smoothly transported from the glue storage tank 10 to the glue filling nozzle 1. Moreover, through the regulation of the air supply valve 32, the amount of gas entering the glue storage tank 10 can be precisely controlled according to different glue filling requirements, improving the accuracy and controllability of glue filling.

[0073] Further supplementally explained is that an electric heater group 34 is installed on each glue delivery pipe 11 for heating the glue in the material delivery pipe. By installing the electric heater group 34 on each glue delivery pipe 11, the glue in the material delivery pipe can be heated, enabling adaptation to glue with different temperature characteristics, preventing the glue from solidifying or increasing in viscosity due to too low temperature during transportation, ensuring the fluidity of the glue, and improving the efficiency and quality of glue filling.

[0074] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An LED chip glue filling device, comprising a glue filling nozzle (1) and a glue filling robot arm (2) for driving the glue filling nozzle (1) to move to any position, characterized in that: Also includes: A filling rack (3), the glue-filling robot arm (2) being mounted on the filling rack (3); Two rubber storage cylinder groups (001) are symmetrically arranged on the filling rack (3), and each of the rubber storage cylinder groups (001) is provided with a raw material mixing assembly (002) for mixing the rubber raw materials; A mixing cylinder (4) is arranged on the filling frame (3) and is located between the two rubber storage cylinder groups (001). The two sides of the lower part of the mixing cylinder (4) are respectively connected to the two rubber storage cylinder groups (001), so that the rubber material flows from bottom to top in the mixing cylinder (4); A hollow mixing tube (5) is inserted through and is rotatably and sealed inside the mixing cylinder (4); A mixing rod (8) penetrates through the hollow mixing tube (5) and is rotatably arranged in a sealed manner.

2. The LED wafer glue filling equipment according to claim 1, characterized in that: A mixing power assembly (003) is arranged between the hollow mixing tube (5) and the mixing barrel (4), and the mixing power assembly (003) is meshed with the raw material mixing assembly (002). The hollow mixing tube (5) is provided with a spiral mixing blade (6), and the spiral mixing blade (6) is in contact with the inner wall of the mixing barrel (4). The hollow mixing tube (5) is provided with a plurality of feed holes (7), and the feed holes (7) are located at the upper part of the mixing barrel (4) for the entry of rubber.

3. The LED wafer glue filling equipment according to claim 2, characterized in that: A reverse driving assembly (004) is arranged between the mixing rod (8) and the hollow mixing tube (5), and when the hollow mixing tube (5) rotates, the mixing rod (8) is driven to rotate in the reverse direction. A plurality of stirring rods (9) are arranged on the mixing rod (8), and the stirring rods (9) are located in the hollow mixing tube (5) and are used for secondary mixing of the rubber material.

4. The LED wafer glue filling equipment according to claim 3, characterized in that: The rubber storage cylinder group (001) comprises: A glue storage box (10) is arranged on the filling rack (3); A rubber delivery pipe (11) is arranged to communicate between the rubber storage box (10) and the mixing cylinder (4), and a rubber delivery valve (12) is installed on the rubber delivery pipe (11); A glue delivery pipe (13) is arranged in communication with the glue storage box (10), and a glue delivery valve (14) is installed on the glue delivery pipe (13).

5. The LED wafer glue filling equipment according to claim 4, characterized in that: The raw material mixing assembly (002) comprises: A raw material mixing frame (15) is penetrated and rotatably arranged on the glue storage box (10); A synchronous rotating rod (16) rotatably arranged on the glue storage box (10); Bevel gear 1 (17), arranged on the raw material mixing frame (15); Bevel gear 2 (18) is arranged on the synchronous rotating rod (16), and the bevel gear 2 (18) is meshed with the bevel gear 1 (17); Bevel gear three (19) is arranged on the synchronous rotating rod (16).

6. The LED wafer glue filling equipment according to claim 5, characterized in that: The mixing power assembly (003) comprises: A mixing rack (20), arranged on the mixing cylinder (4); A mixing motor (21) installed on one side of the mixing frame (20); Bevel gear four (22), arranged on the hollow mixing tube (5), the bevel gear four (22) meshing with the bevel gear three (19); Bevel gear five (23) is arranged on the output end of the mixing motor (21), and the bevel gear five (23) is meshed with the bevel gear four (22).

7. The LED wafer glue filling equipment according to claim 6, characterized in that: The reverse drive assembly (004) comprises: A driving main gear (24) is arranged on the hollow mixing tube (5); A driving rod (25) is arranged on the mixing cylinder (4) and is located on one side of the hollow mixing tube (5); A driving slave gear (26) is rotatably disposed on the driving rod (25), and the driving slave gear (26) is meshed with the driving master gear (24); A reverse rotating disk (27) is arranged on the mixing rod (8), and a driving internal gear ring (28) is arranged inside the reverse rotating disk (27), and the driving internal gear ring (28) is meshed with the driving slave gear (26).

8. The LED wafer glue filling equipment according to claim 7, characterized in that: An air supply component (005) is also provided on one side of the mixing cylinder (4), and the air supply component (005) is connected to the two glue storage boxes (10) and is used to provide the pressure required for glue injection.

9. The LED wafer glue filling equipment according to claim 8, characterized in that: The air supply assembly (005) comprises: An air supply rack (29) is arranged on one side of the mixing cylinder (4); An air supply pump (30) is installed on the air supply frame (29); An air supply pipe (31) is arranged in communication between the two glue storage boxes (10), and an air delivery end of the air supply pump (30) is connected to the air supply pipe (31); Two air supply valves (32), the air supply valves (32) are installed on the air supply pipe (31), and the air delivery end of the air supply pump (30) is located between the two air supply valves (32) and is used to regulate the gas entering the glue storage box (10).

10. The LED wafer glue filling equipment according to claim 9, characterized in that: The bottom of the mixing cylinder (4) is bucket-shaped, and one end of the hollow mixing tube (5) penetrates through and is in sealed and rotatable communication with the bottom of the mixing cylinder (4), and is in sealed and rotatable communication with the mixing cylinder (4).

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