Automatic processing equipment for semiconductor element pins

Abstract

The application relates to the field of semiconductor processing equipment, and discloses a kind of automatic processing equipment of semiconductor component pin, including workbench, the front end rear side of the workbench is fixedly installed with backplate, the front end middle part of the backplate is fixedly installed with linear motion module, the driving end of the linear motion module is fixedly installed with movable table, the top middle part of the movable table is fixedly installed with hydraulic cylinder, the bottom end both sides of the pressing plate are fixedly installed with first pressing mould, the both sides of the first pressing mould are fixedly installed with inclined installation positioning plate, the inside of the inclined installation positioning plate is fixedly installed with electric heating element, the upper surface middle part of the workbench is fixedly installed with first mould, the upper surface both sides of the workbench are fixedly installed with second mould.The application realizes efficient, accurate, high-quality processing by automatic positioning adsorption, double-station circulation, multi-stage bending, heating assistance and reasonable structure design, and is easy to operate and convenient to maintain and manage.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing equipment, specifically to an automated semiconductor component pin processing device. Background Technology

[0002] In the modern semiconductor industry, semiconductor components are the core parts of various electronic products, and their quality and production efficiency directly affect the development of the entire electronics industry. The pins of semiconductor components, as the key parts connecting the components to external circuits, have extremely high requirements for processing precision, quality, and efficiency.

[0003] Traditional semiconductor component lead processing relies heavily on manual operation or semi-automated equipment. In manual operation, workers must manually place the semiconductor component on a processing table and use various tools to bend and process the leads. This method is not only inefficient and difficult to meet the demands of large-scale production, but also suffers from inconsistent lead processing accuracy due to variations in human operation, resulting in a high defect rate. For example, when bending leads, different workers may apply inconsistent force and angles, easily leading to excessive deviations in the bending angle and affecting the stability of the connection between the component and the circuit.

[0004] While semi-automated equipment improves processing efficiency to some extent, it still has many limitations. Some semi-automated equipment lacks precision in component positioning and adsorption, leading to component displacement during processing and affecting pin machining accuracy. Furthermore, for multi-stage pin machining, such as initial bending followed by a second bending to a predetermined angle, existing semi-automated equipment often struggles to achieve precise step-by-step control, failing to effectively prevent pin breakage due to excessive bending angles in a single operation. In addition, the lack of pin heating during machining to improve performance makes pins prone to cracking or breakage due to stress concentration during subsequent use, reducing product reliability and lifespan. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides an automated semiconductor component pin processing device that solves the problems of low processing efficiency and poor precision, easy pin breakage due to single bending, lack of heating methods to improve pin performance, and difficulty in achieving efficient dual-station processing, thereby comprehensively improving processing quality and efficiency.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an automatic semiconductor component pin processing device, comprising a worktable, a back plate fixedly mounted on the rear front end of the worktable, a linear motion module fixedly mounted on the middle front end of the back plate, a movable stage fixedly mounted on the drive end of the linear motion module, a hydraulic cylinder fixedly mounted on the middle top end of the movable stage, a pressure plate fixedly mounted on the drive end of the hydraulic cylinder extending below the movable stage, a first pressing mold fixedly mounted on both sides of the bottom end of the pressure plate, inclined positioning plates fixedly mounted on both sides of the first pressing mold, an electric heating element fixedly mounted inside each inclined positioning plate, a first mold fixedly mounted on the middle upper surface of the worktable, a second mold fixedly mounted on both sides of the upper surface of the worktable, a drive shaft movably mounted on the upper front end of the back plate, cams fixedly mounted on both ends of the drive shaft, connecting rods movably mounted on the outer ends of the cams, and the bottom ends of the connecting rods movably mounted on the middle top end of the second pressing mold.

[0007] Preferably, a first pneumatic suction nozzle is fixedly installed at the bottom center of the first mold, an installation rod is fixedly installed at the bottom center of the pressure plate, and a second pneumatic suction nozzle is fixedly installed at the bottom end of the installation rod.

[0008] Preferably, guide rods are fixedly installed on both sides of the top of the pressure plate, and the top of the guide rods extends to the top of the movable table. Material receiving grooves are fixedly installed on both sides of the top of the movable table.

[0009] Preferably, a first mold groove is provided at the center of the top of the first mold, and first pin grooves are provided on both sides of the top of the first mold. A first feeding platform is movably installed inside the first mold groove, and the bottom end of the first feeding platform is connected to the bottom wall of the first mold groove by a first return spring.

[0010] Preferably, a second mold groove is provided at the center of the top of the second mold, and a second pin groove is provided on both sides of the top of the second mold. A second feeding platform is movably installed inside the second mold groove, and the bottom of the second feeding platform is connected to the bottom wall of the corresponding side of the second mold groove by a second return spring.

[0011] Preferably, a worm gear reducer is fixedly installed on the outer diameter of the middle part of the transmission shaft, and a servo motor is fixedly installed on the middle of the top of the back plate, with the drive end of the servo motor fixedly installed on the input end of the worm gear reducer.

[0012] Preferably, a third pneumatic suction nozzle is fixedly installed at the bottom center of the second mold, and positioning guide rails are fixedly installed on both sides of the top of the worktable. Positioning sliders are fixedly installed on the outer ends of the second mold, and the ends of the positioning sliders are movably installed inside the corresponding positioning guide rails.

[0013] Preferably, a feeding conveyor belt is fixedly installed on both sides of the front side of the workbench, and a plurality of feeding troughs are fixedly provided on the surface of the feeding conveyor belt.

[0014] Preferably, support legs are fixedly installed at the four corners of the bottom of the workbench, and a control panel is fixedly installed at the center of the front end of the back plate.

[0015] This invention provides an automated semiconductor component pin processing device. It offers the following advantages:

[0016] 1. This invention achieves dual-station cyclic processing by using the reciprocating left-right movement of the movable table and the alternating up-down movement of the two second pressure molds, which greatly improves processing efficiency compared to single-station processing.

[0017] 2. The first die of the present invention performs a preliminary bending of the component pin, and at the same time, the oblique positioning plate restricts the bending angle to prevent the pin from breaking due to excessive bending angle in a single operation. Subsequently, the second die performs a second bending of the pin to a predetermined angle. The multi-stage bending effectively ensures the pin forming quality.

[0018] 3. The electric heating element inside the inclined positioning plate of the present invention heats the pins during bending, reducing the pin hardness, improving toughness and resistance to stress concentration, preventing pin cracks or breakage due to stress concentration during subsequent secondary bending, and improving the quality of the finished product. Attached Figure Description

[0019] Figure 1 This is a perspective view of the present invention;

[0020] Figure 2 This is a front view of the present invention;

[0021] Figure 3 This is a schematic diagram of the structure of the movable platform in this invention;

[0022] Figure 4 This is a schematic diagram of the internal structure of the first mold in this invention;

[0023] Figure 5 This is a schematic diagram of the internal structure of the second mold in this invention;

[0024] Figure 6 This is a schematic diagram of the structure of the second mold in this invention.

[0025] The components include: 1. Workbench; 2. Backplate; 3. Linear motion module; 4. Movable table; 5. Hydraulic cylinder; 6. Pressure plate; 7. First mold; 8. Inclined positioning plate; 9. Electric heating element; 10. First pneumatic suction nozzle; 11. Mounting rod; 12. Second pneumatic suction nozzle; 13. Guide rod; 14. Material receiving groove; 15. First mold; 16. First mold groove; 17. First pin groove; 18. First unloading platform; 19. First return spring. 20. Second mold; 21. Second mold groove; 22. Second pin groove; 23. Second feeding platform; 24. Second return spring; 25. Drive shaft; 26. Worm gear reducer; 27. Servo motor; 28. Cam; 29. ​​Connecting rod; 30. Second pressure mold; 31. Third pneumatic suction nozzle; 32. Positioning guide rail; 33. Positioning slider; 34. Feed conveyor belt; 35. Feeding groove; 36. Support leg; 37. Control panel. Detailed Implementation

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Example:

[0028] Please see the appendix Figure 1 - Appendix Figure 6 This invention provides an automated semiconductor component pin processing device, such as... Figure 1As shown, the equipment includes a workbench 1, which serves as the basic support platform for the entire device. A backplate 2 is firmly fixed to the front and rear sides of the workbench 1. The backplate 2 supports and mounts other key components. A linear motion module 3 is precisely installed in the center of the front end of the backplate 2. The linear motion module 3 can accurately control its drive end to move linearly. A movable table 4 is stably fixed to the drive end of the linear motion module 3. Driven by the linear motion module 3, the movable table 4 can achieve smooth and precise left and right reciprocating motion. A hydraulic cylinder 5 is installed in the center of the top of the movable table 4. The driving end of the hydraulic cylinder 5 can extend and retract vertically, reaching below the movable platform 4 and fixedly connected to the pressure plate 6. When the hydraulic cylinder 5 is activated, it drives the pressure plate 6 to move up and down. First pressing molds 7 are fixedly installed on both sides of the bottom of the pressure plate 6. During equipment operation, the first pressing molds 7, driven by the pressure plate 6, perform preliminary processing operations on the semiconductor component leads. Angled positioning plates 8 are fixedly installed on both sides of the first pressing molds 7. The angled positioning plates 8 play a crucial role in limiting the angle during lead bending. Electric... Heating element 9 is activated when the pins are attached to the bottom of the inclined positioning plate 8, heating the pins to effectively reduce their hardness and improve their toughness and resistance to stress concentration. A first mold 15 is fixedly installed in the center of the upper surface of the worktable 1, used to support and initially position the semiconductor components to be processed. Second molds 20 are fixedly installed on both sides of the upper surface of the worktable 1, which further process the initially processed semiconductor components in subsequent processes. The upper front end of the back plate 2 is connected to the back plate via bearings and other movable components. The device is equipped with a drive shaft 25, which can rotate under power. Both ends of the drive shaft 25 are fixedly mounted with cams 28, which rotate synchronously with the rotation of the drive shaft 25. The outer ends of the cams 28 are connected to connecting rods 29, which can move up and down under the drive of the cams 28. The bottom ends of the connecting rods 29 are movably mounted at the top center of the second mold 30, thereby converting the rotational motion of the cams 28 into the up and down motion of the second mold 30, realizing the secondary processing of the semiconductor component pins.

[0029] In this embodiment, a first pneumatic suction nozzle 10 is fixedly installed at the bottom center of the first mold 7. The first pneumatic suction nozzle 10 can adsorb and fix the semiconductor components during the lead processing to ensure the stability of the components during the processing. A mounting rod 11 is fixedly installed at the bottom center of the pressure plate 6. The mounting rod 11 plays the role of connection and positioning. A second pneumatic suction nozzle 12 is fixedly installed at its bottom. In the early stage of equipment operation, the second pneumatic suction nozzle 12 is responsible for adsorbing the semiconductor components to be processed from the feeding conveyor belt 34 and accurately placing them into the first mold 15.

[0030] Furthermore, guide rods 13 are fixedly installed on both sides of the top of the pressure plate 6, and the top of the guide rods 13 extends to the top of the movable table 4. The guide rods 13 can provide guidance for the up and down movement of the pressure plate 6, ensuring the stability and accuracy of the movement of the pressure plate 6. Material receiving grooves 14 are fixedly installed on both sides of the top of the movable table 4. The material receiving grooves 14 are used to collect the semiconductor components after complete processing, which is convenient for the staff to sort and collect them later.

[0031] Furthermore, a first mold groove 16 is provided at the center of the top of the first mold 15. The first mold groove 16 is used to accurately position and place the semiconductor component to be processed. First pin grooves 17 are provided on both sides of the top of the first mold 15. The first pin grooves 17 enable the pins of the semiconductor component to automatically engage and enter, providing a positioning basis for the initial processing of the pins. A first feeding platform 18 is movably installed inside the first mold groove 16. The first feeding platform 18 can move up and down within the first mold groove 16. The bottom end of the first feeding platform 18 is connected to the bottom wall of the first mold groove 16 through a first return spring 19. The first return spring 19 can restore the first feeding platform 18 to its initial position after it is pressed down by an external force, facilitating the next placement of components.

[0032] Furthermore, a second mold groove 21 is provided at the center of the top of the second mold 20. The second mold groove 21 is used to receive the semiconductor components after preliminary processing for subsequent secondary processing operations. A second pin groove 22 is provided on both sides of the top of the second mold 20. The second pin groove 22 provides positioning and constraint for the bending and forming of the pins during secondary processing. A second feeding platform 23 is movably installed inside the second mold groove 21. The second feeding platform 23 can also move up and down within the second mold groove 21. The bottom of the second feeding platform 23 is connected to the bottom wall of the corresponding side of the second mold groove 21 through a second return spring 24. The function of the second return spring 24 is similar to that of the first return spring 19, ensuring the position adjustment and reset of the second feeding platform 23 during processing.

[0033] Furthermore, a worm gear reducer 26 is fixedly installed on the outer diameter of the middle part of the drive shaft 25. The worm gear reducer 26 can reduce the power output by the servo motor 27 and amplify the torque. The servo motor 27 is fixedly installed on the top center of the back plate 2, and the drive end of the servo motor 27 is fixedly installed on the input end of the worm gear reducer 26. The servo motor 27 serves as the power source of the entire transmission system. Through the worm gear reducer 26, the rotation speed and angle of the drive shaft 25 are precisely controlled, thereby precisely controlling the movement of the cam 28, and finally achieving precise control of the movement of the second die 30.

[0034] Furthermore, a third pneumatic suction nozzle 31 is fixedly installed at the bottom center of the second mold 30. After the pin is bent twice, the third pneumatic suction nozzle 31 can adsorb the processed semiconductor components and wait for subsequent unloading operations. Positioning guide rails 32 are fixedly installed on both sides of the top of the worktable 1. The positioning guide rails 32 provide a precise guiding path for the movement of the second mold 30. Positioning sliders 33 are fixedly installed on the outer ends of the second mold 30, and the ends of the positioning sliders 33 are movably installed inside the corresponding side positioning guide rails 32. The positioning sliders 33 and the positioning guide rails 32 cooperate with each other to ensure the stability and accuracy of the second mold 30 during the up and down movement, so that it can accurately process the workpieces in the second unloading table 23.

[0035] Furthermore, both sides of the front of the workbench 1 are fixedly equipped with feeding conveyor belts 34. The feeding conveyor belts 34 are responsible for transporting the semiconductor components to be processed to the designated position inside the equipment. Several feeding troughs 35 are fixedly provided on the surface of the feeding conveyor belts 34. The feeding troughs 35 can position and align the semiconductor components, ensuring that each component is in the correct position and posture when entering the processing stage, providing a good foundation for subsequent automatic adsorption and processing operations.

[0036] Furthermore, support legs 36 are fixedly installed at the four corners of the bottom of the workbench 1. The support legs 36 can stably support the entire equipment and ensure the stability of the equipment during operation. A control panel 37 is fixedly installed at the front center of the back plate 2. The operator can operate and control various components of the equipment through the control panel 37, such as starting or stopping the linear motion module 3, hydraulic cylinder 5, servo motor 27, etc., and adjusting parameters such as the speed of the feeding conveyor belt 34, so as to realize the automated operation and precise control of the equipment.

[0037] Working principle: First, the operator places the semiconductor components to be processed into the feeding troughs 35 on the two feeding conveyor belts 34. The unique structural design of the feeding troughs 35 can accurately position and align the semiconductor components using mechanical limits and geometric shapes, ensuring that the components are in the optimal state for processing. Then, the feeding conveyor belts 34 are started. Driven by motors and other drive devices, the feeding conveyor belts 34 transport the workpiece to the worktable 1 at a stable speed. Next, the linear motion module 3 is started. The motors, lead screws, and other transmission components inside the linear motion module 3 work together to control the left and right movement of the movable table 4. When the second pneumatic suction nozzle 12 at the bottom center of the pressure plate 6 moves to its position under the combined control of the linear motion module 3 and the hydraulic cylinder 5, When the workpiece is directly above the feed conveyor belt 34, the hydraulic cylinder 5 starts working, its drive end extends, and controls the pressure plate 6 to descend, causing the second pneumatic suction nozzle 12 to gradually approach and contact the workpiece. The second pneumatic suction nozzle 12 quickly completes the automatic adsorption of the workpiece through its internal vacuum adsorption device. Subsequently, the drive end of the hydraulic cylinder 5 retracts, controlling the pressure plate 6 to rise and reset. At this time, the linear motion module 3 starts again, controlling the movable table 4 holding the workpiece to move to above the first mold 15. After reaching the designated position, the hydraulic cylinder 5 controls the pressure plate 6 to descend again, the second pneumatic suction nozzle 12 closes its adsorption function, and accurately places the workpiece in the first mold groove 16 of the first mold 15, where it is received by the first unloading table 18. During the placement process, due to the first mold groove 16 and the first... The precise positioning design of the pin slot 17 allows the workpiece pins to automatically engage with the first pin slot 17. After placement, the pressure plate 6 continues to rise and reset, and the linear motion module 3 controls the movable table 4 to move again, causing the second suction nozzle 12 to move above the feeding conveyor belt 34 on the other side. At the same time, the first pressing mold 7 moves above the first mold 15. At this time, the hydraulic cylinder 5 controls the pressure plate 6 to descend again, and the second suction nozzle 12 will pick up new workpieces as before. As the pressure plate 6 descends, the first pressing mold 7 also descends, pressing down on the semiconductor components inside the first mold 15. During the descent, the unique shape and structural design of the first pressing mold 7 allows the pins on both sides of the workpiece to bend and curl up. The inclined positioning plates 8 on both sides of the first pressing mold 7 play an important role at this time. The function of the pressure plate 6 is to limit the bending angle by utilizing its tilt angle and physical obstruction, thus preventing the pin from breaking due to excessive bending angle in a single operation. Simultaneously, the first pneumatic suction nozzle 10 at the bottom center of the first pressure mold 7 adsorbs the workpiece, further ensuring its stability during processing. At this point, the electric heating element 9 inside the inclined positioning plate 8 is activated. The electric heating element 9 heats the pin attached to the bottom of the inclined positioning plate 8 through internal heating devices such as resistance wires. This heating method effectively reduces the hardness of the pin, improves its toughness and resistance to stress concentration, thereby effectively preventing pin cracks or breakage caused by stress concentration during subsequent secondary bending, significantly improving the quality of the finished product. After completing this stage of processing, the pressure plate 6 rises and resets.The linear motion module 3 controls the movable table 4, which is holding a new workpiece, to move to the second mold 20 on one side and lowers to place the workpiece into the second unloading table 23 in the second mold groove 21. After placement, the movable table 4 resets. During this process, the new workpiece held by the second suction nozzle 12 is put back into the first mold groove 16. At this time, the servo motor 27 is started. After receiving the command from the control panel 37, the servo motor 27 starts to run. Through the servo motor 27 and the worm gear reducer 26, the worm gear reducer 26 reduces the high-speed rotation output of the servo motor 27 and amplifies the torque, driving the transmission shaft 25 to rotate. The rotational motion of the transmission shaft 25 is transmitted to the cams 28 at both ends. Since the ends of the cams 28 on both sides are staggered, the rotating cams 28 will drive the connecting rod 29 to follow the movement. Using the limiting effect of the positioning guide rail 32 and the positioning slider 33, the positioning slider... The 33 slides within the positioning guide rail 32, thereby driving the second pressing molds 30 on both sides to perform alternating up-and-down reciprocating movements. When the second pressing mold 30 descends, its unique shape and size design can press the workpiece in the second unloading table 23 down a second time, thereby bending the workpiece pins a second time to a predetermined angle. At the same time, the third pneumatic suction nozzle 31 at the bottom center of the second pressing mold 30 opens. The third pneumatic suction nozzle 31 uses the vacuum suction principle to suction the workpiece after the pins are bent. When the movable table 4 returns to above the second mold 20, the third pneumatic suction nozzle 31 closes its suction function, allowing the workpiece to fall into the receiving groove 14 under gravity. Finally, the operator can remove the processed workpiece from the receiving groove 14. Through the reciprocating left-and-right movement of the movable table 4 and the alternating up-and-down movement of the two second pressing molds 30, a dual-station cyclical alternating processing mode is formed, greatly improving processing efficiency.

[0038] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automated semiconductor component pin processing device, comprising a worktable (1), characterized in that, A back plate (2) is fixedly installed on the rear side of the front end of the workbench (1). A linear motion module (3) is fixedly installed in the middle of the front end of the back plate (2). A movable table (4) is fixedly installed at the drive end of the linear motion module (3). A hydraulic cylinder (5) is fixedly installed in the middle of the top end of the movable table (4). The drive end of the hydraulic cylinder (5) extends to the bottom of the movable table (4) and a pressure plate (6) is fixedly installed thereon. A first pressure mold (7) is fixedly installed on both sides of the bottom end of the pressure plate (6). An inclined positioning plate (8) is fixedly installed on both sides of the first pressure mold (7). The inclined positioning plate (8) is equipped with an electric heating element (9) inside. The first mold (15) is fixedly installed in the middle of the upper surface of the workbench (1). The second mold (20) is fixedly installed on both sides of the upper surface of the workbench (1). The transmission shaft (25) is movably installed on the upper front side of the back plate (2). The two ends of the transmission shaft (25) are fixedly installed with cams (28). The outer ends of the cams (28) are movably installed with connecting rods (29). The bottom ends of the connecting rods (29) are movably installed in the middle of the top of the second pressure mold (30).

2. The semiconductor component pin automatic processing equipment according to claim 1, characterized in that, The first pneumatic suction nozzle (10) is fixedly installed at the bottom center of the first mold (7), the mounting rod (11) is fixedly installed at the bottom center of the pressure plate (6), and the second pneumatic suction nozzle (12) is fixedly installed at the bottom of the mounting rod (11).

3. The semiconductor component pin automatic processing equipment according to claim 1, characterized in that, Guide rods (13) are fixedly installed on both sides of the top of the pressure plate (6), and the top of the guide rods (13) extends to the top of the movable table (4). Material receiving grooves (14) are fixedly installed on both sides of the top of the movable table (4).

4. The semiconductor component pin automatic processing equipment according to claim 1, characterized in that, The first mold (15) has a first mold groove (16) in the middle of its top end, and first pin grooves (17) are provided on both sides of the top end of the first mold (15). A first feeding platform (18) is movably installed inside the first mold groove (16), and the bottom end of the first feeding platform (18) is connected to the bottom wall of the first mold groove (16) by a first reset spring (19).

5. The semiconductor component pin automatic processing equipment according to claim 1, characterized in that, The top center of the second mold (20) is provided with a second mold groove (21), and the top sides of the second mold (20) are provided with second pin grooves (22). The interior of the second mold groove (21) is provided with a second feeding platform (23). The bottom of the second feeding platform (23) is connected to the bottom wall of the corresponding side of the second mold groove (21) by a second reset spring (24).

6. The semiconductor component pin automatic processing equipment according to claim 1, characterized in that, A worm gear reducer (26) is fixedly installed on the outer diameter of the middle part of the transmission shaft (25), and a servo motor (27) is fixedly installed at the middle of the top of the back plate (2), with the drive end of the servo motor (27) fixedly installed at the input end of the worm gear reducer (26).

7. The semiconductor component pin automatic processing equipment according to claim 1, characterized in that, The bottom center of the second mold (30) is fixedly installed with a third pneumatic suction nozzle (31), and the top two sides of the worktable (1) are fixedly installed with positioning guide rails (32). The outer ends of the second mold (30) are fixedly installed with positioning sliders (33), and the ends of the positioning sliders (33) are movably installed inside the corresponding side positioning guide rails (32).

8. The semiconductor component pin automatic processing equipment according to claim 1, characterized in that, The front two sides of the workbench (1) are fixedly installed with feeding conveyor belts (34), and the surface of the feeding conveyor belts (34) is fixedly provided with several feeding troughs (35).

9. The semiconductor component pin automatic processing equipment according to claim 1, characterized in that, The workbench (1) is fixedly equipped with support legs (36) at the four corners of its bottom end, and the back plate (2) is fixedly equipped with a control panel (37) at the center of its front end.

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