Head-mounted display device
By installing an optical lens module on the bracket of the head-mounted display device and placing the camera in its projection, the problem of increasing the thickness of the device in traditional design is solved, and the lightweight design and efficient space utilization of the device are realized.
Patent Information
- Application Number
- CN202311809142.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-26
- Publication Date
- 2025-06-27
AI Technical Summary
When a traditional head-mounted display device is arranged in the camera, the thickness of the device increases, the internal space utilization rate is not high, making it difficult to achieve a thin and light design.
By installing an optical lens module on the bracket and placing the camera in the projection of the optical lens module, the camera is arranged using the space of the optical lens module to reduce the thickness of the equipment and improve the utilization of the internal space.
The lightweight design of the head-mounted display device is realized, reducing the housing size of the device, especially the thickness in the upper and lower directions, and improving the utilization rate of the internal space.
Smart Images

Figure CN120215113A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of intelligent devices, and particularly to a head-mounted display device. Background Art
[0002] For the sake of wearing comfort and portability, the design of head-mounted display devices is gradually developing towards being thinner and lighter.
[0003] In the conventional design of head-mounted display devices, the internal structure is usually arranged in a stacked manner. As shown in the attached drawings Figure 1 in the traditional head-mounted display device 100', the optical lens barrel 22', the screen 21', the bracket 1', the main board 3', the heat dissipation device 5', etc. are stacked in sequence, resulting in a relatively large size (thickness h1) of the device in the stacking direction. When the number of scene applications continues to increase and a camera 4' needs to be added to the device, according to the traditional design concept, the camera 4' will be stacked on the heat dissipation device 5', as Figure 2 shown, the size (thickness h2) of the device in this stacking direction is even larger.
[0004] When arranging the camera in the traditional head-mounted display device, not only is the device size large, but the internal space utilization rate of the device itself is insufficient, and it is also difficult to achieve the thin and light design of the product. Summary of the Invention
[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. For this purpose, the present invention provides a head-mounted display device, which is beneficial to reducing the thickness of the device, improving the internal space utilization rate, and facilitating the thin and light design of the device when setting the camera.
[0006] The head-mounted display device according to an embodiment of the present invention includes: a bracket, the bracket including a first support plate extending in a first direction; an optical lens module, the optical lens module being mounted on the bracket and located below the first support plate, the optical axis of the optical lens module being arranged in a second direction, the second direction being perpendicular to the first direction; a main board, the main board being horizontally arranged above the first support plate; a camera, the camera being located below the first support plate; wherein, the projection of the camera on a vertical reference plane is at least partially located within the projection of the optical lens module on the vertical reference plane, and the vertical reference plane is a plane passing through the optical axis of the optical lens module and perpendicular to the first direction.
[0007] The head-mounted display device according to an embodiment of the present invention can make full use of the internal space of the head-mounted display device, so that there is no need to leave too much space above and below the optical lens module to install the camera, and the size of the outer shell of the head-mounted display device can be reduced, which is beneficial to the thin and light design of the head-mounted display device.
[0008] In some embodiments, there are multiple cameras, and the projections of the multiple cameras on the vertical reference plane are all located within the projection of the optical lens module on the vertical reference plane.
[0009] In some embodiments, there are multiple cameras, and the multiple cameras are spaced apart and distributed around the optical lens module.
[0010] Specifically, there are two optical lens modules, and the two optical lens modules are spaced apart along the first direction. Some of the cameras are arranged between the two optical lens modules, and some of the cameras are arranged on one side of the two optical lens modules away from each other.
[0011] Optionally, the optical lens module and some of the cameras are both closely attached to the lower surface of the first support plate.
[0012] In some embodiments, the head-mounted display device further includes a heat dissipation device for dissipating heat from the main board, and the heat dissipation device is provided on the bracket.
[0013] Specifically, the heat dissipation device includes at least one of the following structures:
[0014] A heat pipe, the heat pipe is located between the main board and the first support plate, and the heat pipe extends along the first direction;
[0015] A heat dissipation plate, the heat dissipation plate extends along the first direction, and the heat dissipation plate is located above the main board;
[0016] A heat dissipation fan, the heat dissipation fan is installed on the bracket and is used to drive air flow towards the main board.
[0017] In some specific embodiments, the heat dissipation device includes two heat dissipation fans, and the two heat dissipation fans are vertically arranged at both ends of the first support plate.
[0018] Specifically, the bracket includes two side blocks located at both ends of the main board; the heat dissipation device further includes heat dissipation fins connected to the side blocks.
[0019] In some specific embodiments, the head-mounted display device further includes: a central processing unit connected above or below the main board, and the central processing unit is connected to the heat dissipation device through a heat conduction layer.
[0020] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. Description of the Drawings
[0021] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the following description of embodiments in conjunction with the accompanying drawings, wherein:
[0022] Figure 1 is a stacked layout diagram of the internal structure in a conventional head-mounted display device;
[0023] Figure 2 is Figure 1 The head-mounted display device shown is a stacked layout diagram when a camera is added;
[0024] Figure 3 is a diagram showing the positional relationship between the optical lens module and the camera relative to the human eye in the top view direction of a head-mounted display device according to an embodiment of the present invention;
[0025] Figure 4 is a diagram showing the relative positional relationship between the internal structure and the human eye in the side view direction of a head-mounted display device according to an embodiment of the present invention;
[0026] Figure 5 is a diagram showing the relative positional relationship between the internal structure and the human eye in the side view direction of a head-mounted display device according to another embodiment of the present invention;
[0027] Figure 6 is a diagram showing the positional relationship of the internal structure layout in the front view direction of a head-mounted display device according to an embodiment of the present invention;
[0028] Figure 7 is a diagram showing the positional relationship of the internal structure layout in the front view direction of a head-mounted display device according to another embodiment of the present invention;
[0029] Figure 8 is a diagram showing the positional relationship of the internal structure layout in the front view direction of a head-mounted display device according to yet another embodiment of the present invention;
[0030] Figure 9 is a diagram showing the positional relationship of the internal structure layout in the front view direction of a head-mounted display device according to still another embodiment of the present invention.
[0031] Reference numerals:
[0032] Figure 1 and Figure 2 in: Head-mounted display device 100’, optical lens barrel 22’, screen 21’, bracket 1’, main board 3’, heat dissipation device 5’, camera 4’;
[0033] Structures of embodiments of the present invention in the remaining figures: Head-mounted display device 100, bracket 1, first support plate 11, second support plate 12, side block 13, optical lens module 2, screen 21, lens barrel assembly 22, optical axis L, vertical reference plane S, main board 3, central processing unit 32, camera 4, heat dissipation device 5, heat pipe 51, heat dissipation plate 52, heat dissipation fan 53, heat dissipation fins 54, heat conduction layer 61. Detailed implementation manners
[0034] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0035] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "vertical", "horizontal", "upper", "lower", "front", "rear", "left", "right", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.
[0036] In the description of the present invention, it should be noted that, unless otherwise clearly specified and defined, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0037] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0038] Reference will be made below Figures 1-9 to describe the head-mounted display device 100 according to an embodiment of the present invention.
[0039] In the solution of the embodiment of the present invention, the type of the head-mounted display device 100 is not limited, and it can be an AR glasses (AR: Augmented Reality, augmented reality) or VR glasses (VR: Virtual Reality, virtual reality), MR glasses (MR: Mixed Reality, mixed reality), VR all-in-one machine and other extended reality devices. These devices are intelligent link devices between the virtual world and the real world, capable of seeing the real world and virtual content, and can perform information interaction such as vision and hearing.
[0040] The design of the head-mounted display device 100 in the embodiment of the present invention is in response to the increasing number of application scenarios that require the use of the camera 4 in the display device. If the camera 4 is only arranged in a stacked manner, the thickness of the head-mounted display device 100 will be too large. Moreover, some head-mounted display devices 100 are shaped like glasses. When the user wears them, the device only covers the eyes and exposes the forehead and face. If the camera 4 is stacked on the top, the head-mounted display device 100 needs to be widened at the forehead part, and the overall appearance is heavy, affecting the wearing experience.
[0041] To solve this problem, as Figure 3 shown, in the embodiment of the present invention, the camera 4 is arranged according to the position of the optical lens module 2.
[0042] Specifically, the component that occupies a large space on the head-mounted display device 100 is mainly the optical lens module 2. The optical lens module 2 not only has a large size in the thickness direction of the head-mounted display device 100 (such as Figure 4 the up and down direction in Figure 3 ), but also has a large size in the axial direction of the optical lens module 2 (such as Figure 3 the second direction in
[0043] ). Therefore, the camera 4 is arranged in cooperation with the layout of the optical lens module 2, so that the above two sizes can be prevented from increasing too much.
[0043] According to the head-mounted display device 100 of the embodiment of the present invention, as Figure 4 and Figure 5 shown, it includes: a bracket 1, an optical lens module 2, a main board 3, and a camera 4. The bracket 1 includes a first support plate 11 extending along a first direction. The optical lens module 2 is mounted on the bracket 1 and is located below the first support plate 11. The optical axis L of the optical lens module 2 is arranged along a second direction, and the second direction is perpendicular to the first direction. The main board 3 is horizontally arranged above the first support plate 11, and the camera 4 is located below the first support plate 11.
[0044] Among them, the projection of the camera 4 on the vertical reference plane S is at least partially located within the projection of the optical lens module 2 on the vertical reference plane S. The vertical reference plane S is a plane passing through the optical axis L of the optical lens module 2 and perpendicular to the first direction.
[0045] That is to say, on the head-mounted display device 100, the first support plate 11 and the main board 3 are horizontally arranged and stacked above the optical lens module 2. The first support plate 11 and the main board 3 are relatively thin compared to the optical lens module 2, and they are also stacked, so that the accommodation space required above the optical lens module 2 of the head-mounted display device 100 does not need to be too large. Moreover, usually, the optical lens module 2 has relatively large dimensions in the first direction and the second direction. The main board 3 is horizontally arranged above the optical lens module 2, so that the dimensions of the optical lens module 2 in the first direction and the second direction can be utilized. The main board 3 can have a sufficient large area for design. In addition, since the head-mounted display device 100 also needs to avoid the user's nose during arrangement, the first support plate 11 and the main board 3 are horizontally arranged and stacked above the optical lens module 2, which can just avoid the nose and does not affect the area of the first support plate 11 and the main board 3.
[0046] The camera 4 can be arranged in the horizontal space where the optical lens module 2 is located. After the camera 4 is arranged, the head-mounted display device 100 does not need to occupy too much space above and below the optical lens module 2. Also, since the optical lens module 2 has a large size, there are many void areas around the optical lens module 2. Especially when the head-mounted display device 100 is worn on the user's face, the head-mounted display device 100 has a relatively large size in the first direction, and there are many choices for layout. The size of the camera 4 itself is not large, and it is not easy to obstruct the user's nose.
[0047] Such an arrangement is beneficial to making full use of the internal space of the head-mounted display device 100, so that too much space does not need to be vacated above and below the optical lens module 2 to install the camera 4. The outer shell size of the head-mounted display device 100 can be reduced, especially the size of the head-mounted display device 100 in the up and down direction (i.e., the thickness size mentioned above) does not need to be too large, which is beneficial to the thin and light design of the head-mounted display device 100.
[0048] To increase the application scenarios and improve the application ability, some head-mounted display devices 100 have two or more cameras 4. At this time, the camera 4 can also follow the above scheme, and the projections of at least some cameras 4 and the optical lens module 2 on the vertical reference plane S are set to coincide, so that this part of the camera 4 can utilize the horizontal space occupied by the optical lens module 2.
[0049] In some embodiments, as Figure 3 shown, there are multiple cameras 4, and the projections of the multiple cameras 4 on the vertical reference plane S are all located within the projection of the optical lens module 2 on the vertical reference plane S. In this way, all the cameras 4 can be arranged in the horizontal space occupied by the optical lens module 2, making full use of the remaining space inside the head-mounted display device 100 as much as possible, improving the internal space utilization rate, and making the size of the head-mounted display device 100 in the up and down direction (i.e., the thickness size mentioned above) not too large.
[0050] When arranging the camera 4, the camera 4 can be arranged adjacent to the optical lens module 2, or the optical lens module 2 and the camera 4 can be separated by a certain distance in the horizontal direction, and can be flexibly adjusted according to needs. Preferably, there are multiple cameras 4, and the multiple cameras 4 are spaced apart and distributed around the optical lens module 2. In this way, the camera 4 can not only occupy the space around the optical lens module 2, but also the shooting angle of the camera 4 is adjacent to the optical lens module 2, and the optical lens module 2 usually faces the user's eyes. Therefore, the shooting view direction of the camera 4 is close to the eye view angle direction.
[0051] For example Figures 6-9 In the illustrated embodiment, there are two optical lens modules 2, and the two optical lens modules 2 are spaced apart along the first direction. Some cameras 4 are arranged between the two optical lens modules 2, and some cameras 4 are arranged on the sides of the two optical lens modules 2 away from each other, that is, some cameras 4 can be arranged on the left and right sides of the two optical lens modules 2. In the above structure, after arranging the camera 4, the distance between the two optical lens modules 2 can also be adjusted, so as to actually adjust the interpupillary distance.
[0052] Among them, the camera 4 arranged between the two optical lens modules 2 can be arranged higher to avoid interfering with the user's nose. Since there is more space on the left and right sides of the two optical lens modules 2, cameras 4 with larger volume or more quantity can be arranged.
[0053] Optionally, both the optical lens module 2 and at least some of the cameras 4 are closely attached to the lower surface of the first support plate 11. As Figures 6-9 shown, there are multiple cameras 4, and multiple cameras 4 are evenly distributed on both sides of the two optical lens modules 2, and the highest camera 4 is arranged closely attached to the lower surface of the first support plate 11. Especially when the lower surface of the first support plate 11 is a plane, the top of the optical lens module 2 is flush with the top of the highest camera 4, so that the horizontal space occupied by the optical lens module 2 can be utilized to the maximum extent.
[0054] Specifically, as Figure 3 shown, the optical lens module 2 includes a screen 21 and a lens barrel assembly 22. The screen 21 and the lens barrel assembly 22 are fixed to each other, and the screen 21 is located at one end of the lens barrel assembly 22 along the second direction. Optionally, the lens barrel assembly 22 is movable along the first direction on the bracket 1, so that the interpupillary distance can be adjusted.
[0055] In the embodiment of the present invention, the type of the camera 4 is not limited, and the number of the cameras 4 can be adjusted according to needs. Optionally, the camera 4 can be an RGB camera, or a TOF depth camera, etc.
[0056] Further, the main board 3 is horizontally disposed above the optical lens module 2, and the size of the main board 3 in the second direction is less than or equal to the total track length (TTL) of the optical lens of the optical lens module 2. Setting the shape parameters of other structures under the limitation of the structural parameters of the optical lens module 2 is more conducive to the thin and light design of the head-mounted display device 100.
[0057] In some embodiments, the head-mounted display device 100 further includes a heat dissipation device 5 for dissipating heat from the main board 3, and the heat dissipation device 5 is disposed on the bracket 1. After the heat dissipation device 5 is installed and fixed by using the bracket 1, it can dissipate heat and protect the main board 3, improving the operating safety of the main board 3.
[0058] In a specific embodiment of the present invention, the structural form of the heat dissipation device 5 can be very diverse to provide a richer choice of structural combinations. For example Figure 4 and Figure 5 as shown, the heat dissipation device 5 can be disposed above the main board 3, below the main board 3, or on the left and right sides of the main board 3. The heat dissipation device 5 can be an independent part or integrated with the bracket 1. For example, the bracket 1 can be made of a heat-conducting member, and the heat dissipation device 5 includes heat dissipation fins 54 formed on the bracket 1. The main body part of the bracket 1 is used to support most parts, and the heat dissipation fins 54 dissipate heat by exchanging heat with the flowing air.
[0059] Specifically, the heat dissipation device 5 can include at least one of the following structures:
[0060] A heat pipe 51, the heat pipe 51 is located between the main board 3 and the first support plate 11, and the heat pipe 51 extends along the first direction;
[0061] A heat dissipation plate 52, the heat dissipation plate 52 extends along the first direction, and the heat dissipation plate 52 is located above the main board 3;
[0062] A heat dissipation fan 53, the heat dissipation fan 53 is installed on the bracket 1 and is used to drive the air flow to flow towards the main board 3.
[0063] That is to say, the heat dissipation device 5 can be of a single structural form or a combination of multiple structural forms. Even, the heat dissipation device 5 can include any one of the heat pipe 51, the heat dissipation plate 52 and the heat dissipation fan 53, or can be other structures.
[0064] In Figure 6 the illustrated example, the head-mounted display device 100 includes two optical lens modules 2 spaced apart along the first direction. Cameras 4 are evenly distributed between and on both sides of the two optical lens modules 2, and the projections of the multiple cameras 4 on the vertical reference plane S are all located within the projection of the optical lens module 2 on the vertical reference plane S.
[0065] The head-mounted display device 100 includes a bracket 1, the bracket 1 is a metal part, and both the optical lens module 2 and the camera 4 are mounted on the bracket 1. The bracket 1 is hollowed out at the positions where the optical lens module 2 and the camera 4 are located to accommodate the optical lens module 2 and the camera 4.
[0066] The bracket 1 includes a first support plate 11 horizontally arranged in a first direction. The optical lens module 2 and the camera 4 are located below the first support plate 11, and the main board 3 is horizontally arranged above the first support plate 11. The bracket 1 includes two side blocks 13, and the two side blocks 13 are located at both ends of the main board 3. The bracket 1 includes a second support plate 12 horizontally arranged in the first direction, and the second support plate 12 is located above the main board 3. In this way, the main board 3 is surrounded by the bracket 1 on all sides, top, bottom, left, and right, forming a protection. Specifically, the bracket 1 is an integrated middle frame bracket with stable and reliable structure.
[0067] The heat dissipation device 5 includes a heat pipe 51 horizontally arranged in the first direction, and the heat pipe 51 is located between the main board 3 and the first support plate 11. Specifically, the heat pipe 51 is filled with a cooling working medium. The cooling working medium can be pure water, methanol, propanol or other phase change working media. Through the flow of the cooling working medium, the cooling working medium absorbs heat and vaporizes at the high-temperature part of the main board 3, and then flows to the low-temperature part to release heat and condense. Thus, heat transfer and dissipation can be carried out.
[0068] The heat dissipation device 5 includes heat dissipation fins 54 connected to the side blocks 13, and heat dissipation fins 54 are connected to the side blocks 13 on both sides in Figure 6 . Further, both ends of the heat pipe 51 are connected to the side blocks 13 on both sides, so that the heat pipe 51 quickly dissipates heat from both ends.
[0069] Further, the head-mounted display device 100 further includes: a central processing unit 32 connected below the main board 3, and the central processing unit 32 is connected to the heat dissipation device 5 through a heat conduction layer 61. The central processing unit 32 is integrally installed with the main board 3, and the central processing unit 32 can use the heat pipe 51 for heat dissipation to achieve heat dissipation protection for the central processing unit 32. Optionally, the heat conduction layer 61 includes a heat conduction gel layer, or the heat conduction layer 61 further includes a copper foil layer or a graphite layer, etc.
[0070] In Figure 7 the shown example, the structure of the head-mounted display device 100 is basically the same as that of the Figure 6 shown example structure, and the same parts will not be described in detail. The difference is that the heat dissipation device 5 includes two heat dissipation fans 53, and the two heat dissipation fans 53 are vertically arranged at both ends of the first support plate 11 to improve the heat dissipation effect on the main board 3 by driving air flow.
[0071] In Figure 8 the shown example, the structure of the head-mounted display device 100 is the same as that of the Figure 6The example structures shown are basically the same, and the same parts will not be described again. The difference is that the heat dissipation device 5 includes a heat dissipation plate 52 horizontally arranged along the first direction, and the heat dissipation plate 52 is located above the main board 3. The central processing unit 32 is connected above the main board 3, and the central processing unit 32 is connected to the heat dissipation plate 52 through a heat conduction layer 61.
[0072] In Figure 9 the example shown, the structure of the head-mounted display device 100 is the same as Figure 8 the example structure shown. The same parts will not be described again. The difference is that the heat dissipation device 5 includes two heat dissipation fans 53, and the two heat dissipation fans 53 are vertically arranged at both ends of the first support plate 11 to improve the heat dissipation effect on the main board 3 by driving air flow.
[0073] Other components of the head-mounted display device 100 according to the embodiments of the present invention, such as batteries and controllers, and operations are known to those of ordinary skill in the art and will not be described in detail here.
[0074] In the description of this specification, the descriptions with reference to the terms "embodiment", "example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.
[0075] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and purposes of the present invention, and the scope of the present invention is defined by the claims and their equivalents.
Claims
1. A head-mounted display device, characterized in that, Comprising: A bracket, the bracket includes a first support plate extending in a first direction; An optical lens module, the optical lens module is mounted on the bracket and located below the first support plate, the optical axis of the optical lens module is arranged in a second direction, and the second direction is perpendicular to the first direction; A main board, the main board is horizontally arranged above the first support plate; A camera, the camera is located below the first support plate; Wherein, the projection of the camera on a vertical reference plane is at least partially located within the projection of the optical lens module on the vertical reference plane, and the vertical reference plane is a plane passing through the optical axis of the optical lens module and perpendicular to the first direction.
2. The head-mounted display device according to claim 1, wherein There are multiple cameras, and the projections of the multiple cameras on the vertical reference plane are all located within the projection of the optical lens module on the vertical reference plane.
3. The head-mounted display device according to claim 1, wherein, There are multiple cameras, the multiple cameras are spaced apart and distributed around the optical lens module.
4. The head-mounted display device according to claim 2, wherein There are two optical lens modules, the two optical lens modules are spaced apart along the first direction, some of the cameras are arranged between the two optical lens modules, and some of the cameras are arranged on the sides of the two optical lens modules away from each other.
5. The head-mounted display device according to claim 1, wherein The optical lens module and at least some of the cameras are both closely attached to the lower surface of the first support plate.
6. The head-mounted display device according to any one of claims 1-5, characterized in that, It further includes a heat dissipation device for dissipating heat from the main board, and the heat dissipation device is arranged on the bracket.
7. The head-mounted display device according to claim 6, wherein The heat dissipation device includes at least one of the following structures: A heat pipe, the heat pipe is located between the main board and the first support plate, and the heat pipe extends along the first direction; A heat dissipation plate, the heat dissipation plate extends along the first direction, and the heat dissipation plate is located above the main board; A heat dissipation fan, the heat dissipation fan is mounted on the bracket and used to drive air flow towards the main board.
8. The head-mounted display device according to claim 6, wherein, The heat dissipation device includes two heat dissipation fans, and the two heat dissipation fans are vertically arranged at both ends of the first support plate.
9. The head-mounted display device according to claim 6, wherein The bracket includes two side blocks, and the two side blocks are located at both ends of the main board; the heat dissipation device further includes heat dissipation fins connected to the side blocks.
10. The head-mounted display device according to claim 6, wherein It further includes: A central processing unit connected above or below the main board, and the central processing unit is connected to the heat dissipation device through a heat conduction layer.
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