Electronic device

Abstract

An electronic device includes a sensor layer and a sensor driver operating in a first mode for sensing a touch input or a second mode for sensing a pen input. The sensor layer includes a plurality of first electrodes, a plurality of second electrodes, a plurality of first traces connected to first end portions of the plurality of first electrodes, a plurality of second traces respectively connected to the plurality of second electrodes, and a plurality of third traces connected to second end portions of the plurality of first electrodes spaced apart from the first end portions in the second direction. The plurality of third traces are isolated from each other in the first mode, the second mode includes a charge driving mode, and at least some of the plurality of third traces are connected to each other in the charge driving mode.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2023 - 0191632, filed on December 26, 2023, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] Aspects of some embodiments of the present disclosure described herein relate to an electronic device for sensing input by a pen. Background Art

[0004] Multimedia electronic devices such as a television (TV), a cellular phone, a tablet computer, a laptop computer, a navigation device, or a gaming console include a display device for displaying images. In addition to conventional input methods such as buttons, keyboards, or mice, the electronic device may also include a sensor layer (or input sensor) that provides a touch - based input method to enable a user to input information or commands intuitively, conveniently, and easily. The sensor layer can sense a user's touch or pressure created by the user. At the same time, for users familiar with inputting information using a writing tool or for inputting fine touches through a specific application (e.g., sketching or drawing), the use of a stylus is increasingly required.

[0005] The above information disclosed in this background art section is only for enhancing the understanding of the background art, and thus the information discussed in this background art section does not necessarily constitute prior art. Summary of the Invention

[0006] Aspects of some embodiments of the present disclosure include an electronic device capable of sensing input by a pen.

[0007] According to some embodiments of the present disclosure, an electronic device may include: a display panel including a display layer and a sensor layer on the display layer; and a sensor driver for driving the sensor layer and selectively operating in a first mode for sensing a touch input or a second mode for sensing a pen input. According to some embodiments, the sensor layer may include: a plurality of first electrodes arranged in a first direction and extending in a second direction crossing the first direction; a plurality of second electrodes arranged in the second direction and extending in the first direction; a plurality of first traces electrically connected to first ends of the plurality of first electrodes; a plurality of second traces respectively electrically connected to the plurality of second electrodes; and a plurality of third traces electrically connected to second ends of the plurality of first electrodes spaced apart from the first ends in the second direction. According to some embodiments, the plurality of third traces may be electrically isolated from each other in the first mode, the second mode may include a charge drive mode, and at least some of the plurality of third traces may be electrically connected to each other in the charge drive mode.

[0008] According to some embodiments, in a charging drive mode, a sensor driver may apply a first signal to at least one of a plurality of first traces and apply a second signal to at least a different one of the plurality of first traces.

[0009] According to some embodiments, the second signal may have an inverted signal of the first signal.

[0010] According to some embodiments, the electronic device may further include a plurality of switching transistors, and each switching transistor may be electrically connected between two adjacent third traces among the plurality of third traces.

[0011] According to some embodiments, the number of the plurality of switching transistors may be less than the number of the plurality of third traces.

[0012] According to some embodiments, the plurality of switching transistors may be turned off in a first mode.

[0013] According to some embodiments, at least some of the plurality of switching transistors may be turned on in a charging drive mode.

[0014] According to some embodiments, the electronic device may further include a first circuit film electrically connected to one end of a display panel, a second circuit film electrically connected to the other end of the display panel, a first circuit board electrically connected to the display panel through the first circuit film, and a second circuit board electrically connected to the display panel through the second circuit film. The sensor driver may be mounted on the first circuit board, and the plurality of switching transistors may be included in the second circuit board.

[0015] According to some embodiments, the electronic device may further include a connection film connecting the first circuit board and the second circuit board, and the plurality of switching transistors may be operated by the sensor driver.

[0016] According to some embodiments, the electronic device may further include an additional sensor driver mounted on the second circuit board, and the operation of the plurality of switching transistors may be controlled by the additional sensor driver.

[0017] According to some embodiments, the plurality of switching transistors may be included in a display layer.

[0018] According to some embodiments, the second mode may further include a pen sensing drive mode, and the sensor driver may receive an induced current from a plurality of first electrodes and a plurality of second electrodes.

[0019] According to some embodiments of the present disclosure, an electronic device may include: a sensor layer; and a sensor driver for driving the sensor layer and selectively operating in a first mode for sensing a touch input or a second mode for sensing a pen input and including a charging driving mode and a pen sensing driving mode. According to some embodiments, the sensor layer may include: a plurality of first electrodes arranged in a first direction and extending in a second direction intersecting the first direction; a plurality of second electrodes arranged in the second direction and extending in the first direction; a plurality of first traces electrically connected to first ends of the plurality of first electrodes; a plurality of second traces respectively electrically connected to the plurality of second electrodes; and a plurality of switching transistors electrically connected to second ends of the plurality of first electrodes spaced apart from the first ends in the second direction, and the plurality of switching transistors may be turned off in the first mode, and at least some of the plurality of switching transistors may be turned on in the charging driving mode.

[0020] According to some embodiments, the electronic device may further include a display layer under the sensor layer, and the plurality of switching transistors may be included in the display layer.

[0021] According to some embodiments, the electronic device may further include a first circuit film electrically connected to one end of the sensor layer, a second circuit film electrically connected to the other end of the sensor layer, a first circuit board electrically connected to the sensor layer through the first circuit film, and a second circuit board electrically connected to the sensor layer through the second circuit film. According to some embodiments, the sensor driver may be mounted on the first circuit board, and the plurality of switching transistors may be included in the second circuit board.

[0022] According to some embodiments, the electronic device may further include a connection film connecting the first circuit board and the second circuit board, and the operation of the plurality of switching transistors may be controlled by the sensor driver.

[0023] According to some embodiments, the sensor layer may further include a plurality of third traces electrically connected to second ends of the plurality of first electrodes.

[0024] According to some embodiments, each of the plurality of switching transistors may be electrically connected between two adjacent third traces among the plurality of third traces.

[0025] According to some embodiments, the number of the plurality of switching transistors may be less than the number of the plurality of third traces.

[0026] According to some embodiments of the present disclosure, an electronic device may include: a sensor layer; and a sensor driver configured to drive the sensor layer and selectively operate in a first mode for sensing a touch input or a second mode for sensing a pen input and including a charging driving mode and a pen sensing driving mode. The sensor layer may include: a plurality of first electrodes arranged in a first direction and extending in a second direction intersecting the first direction; a plurality of second electrodes arranged in the second direction and extending in the first direction; a plurality of first traces electrically connected to first ends of the plurality of first electrodes; and a plurality of second traces respectively electrically connected to the plurality of second electrodes. Second ends of the plurality of first electrodes spaced apart from the first ends in the second direction may be floating in the first mode, at least some of the second ends of the plurality of first electrodes may be connected to each other in the charging driving mode to define a current path, and the current path may include one of the plurality of first traces, one of the plurality of first electrodes connected to the one first trace, another first electrode among the plurality of first electrodes, and another one of the plurality of first traces electrically connected to the another first electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Aspects of some embodiments of the present disclosure will become more apparent by describing them in more detail with reference to the accompanying drawings.

[0028] Figure 1 is a perspective view of an electronic device according to some embodiments of the present disclosure.

[0029] Figure 2 is a perspective view illustrating an electronic device according to some embodiments of the present disclosure.

[0030] Figure 3 is a view illustrating an operation of an electronic device according to some embodiments of the present disclosure.

[0031] Figure 4A is a cross-sectional view of a display panel according to some embodiments of the present disclosure.

[0032] Figure 4B is a cross-sectional view of a sensor layer according to some embodiments of the present disclosure.

[0033] Figure 5 is a plan view of some components of an electronic device according to some embodiments of the present disclosure.

[0034] Figure 6 is an enlarged plan view of a sensing unit according to some embodiments of the present disclosure.

[0035] Figure 7A is a plan view of a first conductive layer of a sensing unit according to some embodiments of the present disclosure.

[0036] Figure 7B It is a plan view of a second conductive layer of a sensing unit according to some embodiments of the present disclosure.

[0037] Figure 8 It is a sectional view of a sensor layer according to some embodiments of the present disclosure, respectively taken along Figure 7A and Figure 7B the line I-I' shown in the figure.

[0038] Figure 9A It is a plan view of Figure 7A the enlarged area AA' shown in the figure.

[0039] Figure 9B It is Figure 7B a plan view of the enlarged area BB' shown in the figure.

[0040] Figure 10 It is a plan view of some components of an electronic device according to some embodiments of the present disclosure.

[0041] Figure 11 It is a view showing the operation of a sensor driver according to some embodiments of the present disclosure.

[0042] Figure 12 It is a view showing the operation of a sensor driver according to some embodiments of the present disclosure.

[0043] Figure 13A It is a view showing a first mode according to some embodiments of the present disclosure.

[0044] Figure 13B It is a view showing a first mode according to some embodiments of the present disclosure.

[0045] Figure 14 It is a view showing a second mode according to some embodiments of the present disclosure.

[0046] Figure 15A It is a graph showing the waveform of a first signal according to some embodiments of the present disclosure.

[0047] Figure 15B It is a graph showing the waveform of a first signal according to some embodiments of the present disclosure.

[0048] Figure 16 It is a table showing the signals provided to a sensor layer according to some embodiments of the present disclosure.

[0049] Figure 17A It is a view showing a second mode according to some embodiments of the present disclosure.

[0050] Figure 17BIt is a view of a sensing unit in a second mode according to some embodiments of the present disclosure.

[0051] Figure 18A It is a plan view of some components of an electronic device according to some embodiments of the present disclosure.

[0052] Figure 18B It is a plan view of some components of an electronic device according to some embodiments of the present disclosure.

[0053] Figure 19 It is a plan view of some components of an electronic device according to some embodiments of the present disclosure.

[0054] Figure 20 It is a plan view of some components of an electronic device according to some embodiments of the present disclosure. Detailed Description

[0055] In the specification, the expressions that a first component (or region, layer, part, portion, etc.) is "on", "connected to", or "coupled to" a second component mean that the first component is directly on the second component, directly connected to, or directly coupled to the second component, or mean that a third component is disposed between the first component and the second component.

[0056] The same reference numerals will be assigned to the same components. In addition, in the drawings, the thickness, ratio, and dimensions of the components may be exaggerated to effectively describe the technical features. The term "and / or" includes any combination and all combinations of one or more of the associated components.

[0057] Although terms such as "first", "second", etc. may be used to describe various components, the components should not be construed as being limited by the terms. The terms are only used to distinguish one component from another. For example, without departing from the scope and spirit of the present disclosure, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component. The singular form is intended to include the plural form unless the context clearly indicates otherwise.

[0058] In addition, the terms "beneath", "lower", "above", "upper" are used to describe the relationship between the components illustrated in the drawings. The terms are relative and are described with reference to the directions indicated in the drawings.

[0059] It will be further understood that the terms "comprises", "comprising", or "having" specify the presence of the stated features, numbers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, and / or combinations thereof.

[0060] Unless otherwise defined, all terms (including technical and scientific terms) used in the specification have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. In addition, terms such as those defined in commonly used dictionaries shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0061] The terms "part" and "unit" refer to software components or hardware components for performing specific functions. The hardware components may include field programmable gate arrays (FPGAs) or application specific integrated circuits (ASICs). The software components may indicate executable code and / or data used by the executable code in an addressable storage medium. Thus, the software components may be, for example, object-oriented software components, class components, and task components, and may include processes, functions, attributes, procedures, subroutines, program code segments, driver data, firmware, microcode, circuits, data, databases, data structures, tables, arrays, or variables.

[0062] Hereinafter, aspects of some embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings.

[0063] Figure 1 is a perspective view of an electronic device 1000 according to some embodiments of the present disclosure. Figure 2 is a perspective view illustrating further details of an electronic device 1000-1 according to some embodiments of the present disclosure.

[0064] Reference Figure 1 and Figure 2 , the electronic device 1000 or 1000-1 is a device activated in response to an electrical signal. For example, the electronic device 1000 or 1000-1 may be a cellular phone, a foldable phone, a laptop computer, a television, a tablet computer, a vehicle navigation system, a gaming console, or a wearable device, but is not limited thereto according to the embodiments of the present disclosure. Although Figure 1 the electronic device 1000 is illustrated as a tablet computer, Figure 2 illustrates the electronic device 1000-1 used as a laptop computer, but is not limited thereto according to the embodiments of the present disclosure. Although Figure 2 is a perspective view of the electronic device 1000-1, but the coordinate axes included in Figure 2 are based on the display panel DP displayed within the electronic device 1000-1.

[0065] The electronic device 1000 may include an active area 1000A and a peripheral area 1000NA that are included in (defined or formed in) the electronic device 1000. The electronic device 1000 may display an image through the active area 1000A. The active area 1000A may include a surface defined by a first direction DR1 and a second direction DR2. The peripheral area 1000NA may surround the active area 1000A. According to some embodiments of the present disclosure, the peripheral area 1000NA may be omitted.

[0066] The thickness direction of the electronic device 1000 may be parallel to a third direction DR3 that intersects the first direction DR1 and the second direction DR2. Accordingly, a front surface (or a top surface) and a rear surface (or a bottom surface) of a member constituting the electronic device 1000 may be defined based on the third direction DR3.

[0067] The electronic device 1000 may include a display panel DP. The display panel DP may display an image and may sense an input applied from the outside. The external input may be a user input. The input of the user may include any one or a combination of various external inputs such as a part of the user's body, a pen, light, heat, or pressure.

[0068] Although Figure 1 the bar type electronic device 1000 is illustrated, embodiments according to the present disclosure are not limited thereto. For example, the following description will be applied to various electronic devices such as a rollable type electronic device, a slidable type electronic device, and a stretchable type electronic device.

[0069] Figure 3 is a view illustrating an operation of the electronic device 1000 according to some embodiments of the present disclosure.

[0070] Reference Figure 3 , the electronic device 1000 may include a display layer 100, a sensor layer 200, a display driver 100C, a sensor driver 200C, a main driver 1000C, and a power circuit 1000P.

[0071] The sensor layer 200 may sense a first input 2000 or a second input 3000 applied from the outside to the sensor layer 200. Each of the first input 2000 and the second input 3000 may be an input unit for changing the capacitance of the sensor layer 200 or an input unit for inducing an induction current to the sensor layer 200. For example, the first input 2000 may be a passive type input unit such as a part of the user's body. The second input 3000 may be an input through a pen PN or an input through a radio frequency integrated circuit (RFIC) tag. For example, the pen PN may be a passive type pen or an active type pen.

[0072] According to some embodiments of the present disclosure, the pen PN can be a device for generating a magnetic field with a specific resonance frequency. The pen PN can be configured to transmit an output signal based on an electromagnetic resonance scheme. The pen PN can be referred to as an input device, an input pen, a magnetic pen, a stylus, or an electromagnetic resonance pen.

[0073] The pen PN can include an RLC resonance circuit, and the RLC resonance circuit can include an inductor L and a capacitor C. According to some embodiments of the present disclosure, the RLC resonance circuit can be a variable resonance circuit in which the resonance frequency can be changed. In this case, the inductor L can be a variable inductor and / or the capacitor C can be a variable capacitor, but is not specifically limited thereto according to the embodiments of the present disclosure.

[0074] The inductor L generates a current through a magnetic field formed in the electronic device 1000 (e.g., the sensor layer 200). However, it is not specifically limited thereto according to the embodiments of the present disclosure. For example, when the pen PN operates in an active type or active mode, the pen PN can generate a current even without an externally provided magnetic field. The generated current is transmitted to the capacitor C. The capacitor C is charged with the current received from the inductor L and discharges the charged current to the inductor L. Thereafter, the inductor L can release a magnetic field with a resonance frequency. The induced current can flow through the sensor layer 200 through the magnetic field released from the pen PN, and the induced current can be transmitted to the sensor driver 200C while serving as a received signal (or a sensed signal, a signal).

[0075] The main driver 1000C can control the overall operation of the electronic device 1000. For example, the main driver 1000C can control the operations of the display driver 100C and the sensor driver 200C. The main driver 1000C can include at least one microprocessor and can further include a graphics controller. The main driver 1000C can be referred to as an application processor, a central processing unit, or a main processor.

[0076] The display driver 100C can control the display layer 100. The display driver 100C can receive image data and control signals from the main driver 1000C. The control signals can include various signals. For example, the control signals can include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock, and a data enable signal.

[0077] The sensor driver 200C can control the sensor layer 200. The sensor driver 200C can receive control signals from the main driver 1000C. The control signals can include a clock signal for the sensor driver 200C. In addition, the control signals can further include a mode determination signal for determining the driving mode of the sensor driver 200C and the sensor layer 200.

[0078] The sensor driver 200C may be implemented in the form of an integrated circuit (IC) and may be electrically connected to the sensor layer 200. For example, the sensor driver 200C may be directly mounted on a specific area of the display panel or mounted on a separate printed circuit board through a chip on film (COF) scheme, such that the sensor driver 200C can be electrically connected to the sensor layer 200.

[0079] The sensor driver 200C and the sensor layer 200 may optionally operate in a first mode or a second mode. For example, the first mode may be a mode for sensing a touch input (e.g., the first input 2000). The second mode may be a mode for sensing an input of the pen PN (e.g., the second input 3000). The first mode may be referred to as a touch sensing mode, and the second mode may be referred to as a pen sensing mode.

[0080] The switching between the first mode and the second mode may be performed in various switching manners. For example, the sensor driver 200C and the sensor layer 200 may be divided into the first mode and the second mode by time to sense the first input 2000 and the second input 3000. Alternatively, the switching between the first mode and the second mode may be performed by a user's selection or a user's specific action (or input). Alternatively, by an activated or deactivated specific application, any one of the first mode and the second mode may be activated or deactivated or switched to the remaining mode among the first mode and the second mode. Alternatively, when the sensor driver 200C and the sensor layer 200 alternately operate in the first mode and the second mode, the sensor driver 200C and the sensor layer 200 may remain in the first mode when sensing the first input 2000 or remain in the second mode when sensing the second input 3000.

[0081] The sensor driver 200C may calculate coordinate information of an input based on a signal received from the sensor layer 200, and may provide a coordinate signal having the coordinate information to the main driver 1000C. The main driver 1000C performs an operation corresponding to the user input in response to the coordinate signal. For example, the main driver 1000C may operate the display driver 100C such that a new application image is displayed on the display layer 100.

[0082] The power circuit 1000P may include a power management integrated circuit (PMIC). The power circuit 1000P may generate a plurality of driving voltages to drive the display layer 100, the sensor layer 200, the display driver 100C, and the sensor driver 200C. For example, the plurality of driving voltages may include a gate high voltage, a gate low voltage, a first driving voltage, a second driving voltage, or an initialization voltage.

[0083] Figure 4AA cross-sectional view of a display panel DP according to some embodiments of the present disclosure.

[0084] Referring Figure 4A , the display panel DP may include a display layer 100 and a sensor layer 200.

[0085] The display layer 100 may be a component that generates or displays an image. The display layer 100 may be an emissive display layer. For example, the display layer 100 may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic display layer, a quantum dot display layer, a micro LED display layer, or a nano LED display layer. The display layer 100 may include a base layer 110, a circuit layer 120, a light-emitting element layer 130, and a encapsulation layer 140.

[0086] The base layer 110 may be a component that provides a base surface for disposing the circuit layer 120. The base layer 110 may have a multi-layer structure or a single-layer structure. The base layer 110 may be a glass substrate, a metal substrate, a silicon substrate, or a polymer substrate, and is not limited thereto according to embodiments of the present disclosure. The circuit layer 120 may be located on the base layer 110. The circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, and signal lines. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 110 by a coating process or a deposition process. Thereafter, the insulating layer, the semiconductor layer, and the conductive layer may be subsequently selectively patterned by a plurality of photolithography processes.

[0087] The light-emitting element layer 130 may be located on the circuit layer 120. The light-emitting element layer 130 may include light-emitting elements. For example, the light-emitting element layer 130 may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, quantum dots, quantum rods, micro LEDs, or nano LEDs. The encapsulation layer 140 may be located on the light-emitting element layer 130. The encapsulation layer 140 may protect the light-emitting element layer 130 from foreign substances such as moisture, oxygen, and dust particles.

[0088] At least one buffer layer BFL is formed on the top surface of the base layer 110. The buffer layer BFL may relatively improve the bonding force between the base layer 110 and the semiconductor pattern. The buffer layer BFL may be formed in multiple layers. Alternatively, the display layer 100 may further include a barrier layer. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may include a structure in which a silicon oxide layer and a silicon nitride layer are alternately stacked.

[0089] The semiconductor patterns SC, AL, DR, and SCL may be located on the buffer layer BFL. The semiconductor patterns SC, AL, DR, and SCL may include polysilicon. However, it is not limited thereto according to embodiments of the present disclosure, and the semiconductor patterns SC, AL, DR, and SCL may include amorphous silicon, low-temperature polysilicon, or an oxide semiconductor.

[0090] Figure 4A Only some of the semiconductor patterns SC, AL, DR, and SCL are illustrated, and the semiconductor patterns are further arranged in other regions. The semiconductor patterns SC, AL, DR, and SCL may be arranged across pixels according to a specific rule. Depending on the doping state, the semiconductor patterns SC, AL, DR, and SCL may have different electrical properties. The semiconductor patterns SC, AL, DR, and SCL may include a first region SC, DR, and SCL having a higher conductivity and a second region AL having a lower conductivity. The first region SC, DR, and SCL may be doped with an N-type dopant or a P-type dopant. The P-type transistor may include a doped region doped with a P-type dopant, and the N-type transistor may include a doped region doped with an N-type dopant. The second region AL may be an undoped region or a region doped with a lower doping concentration compared to the first region SC, DR, and SCL.

[0091] The first region SC, DR, and SCL may have a higher conductivity than the conductivity of the second region AL and may substantially serve as an electrode or a signal line. The second region AL may substantially correspond to the active region AL (or channel) of the transistor 100PC. In other words, a first portion (see reference numeral AL) among the semiconductor patterns SC, AL, DR, and SCL may be the active region AL of the transistor 100PC, and a second portion (see reference numerals SC and DR) among the semiconductor patterns SC, AL, DR, and SCL may be the source region SC or the drain region DR of the transistor 100PC. A third portion (see reference numeral SCL) among the semiconductor patterns SC, AL, DR, and SCL may be a connection electrode or a connection signal line SCL.

[0092] Each of the pixels may have an equivalent circuit including a plurality of transistors, at least one capacitor, and at least one light-emitting element, and the equivalent circuit of the pixel may be modified in various forms. Figure 4A By way of example, a pixel is illustrated including one transistor 100PC and one light-emitting element 100PE.

[0093] The source region SC, the active region AL, and the drain region DR of the transistor 100PC may be formed of the semiconductor patterns SC, AL, DR, and SCL. When viewed in a cross-sectional view, the source region SC and the drain region DR may extend from the active region AL in opposite directions from each other. Figure 4A A portion of the connection signal line SCL formed from the semiconductor patterns SC, AL, DR, and SCL is illustrated. According to some embodiments, when viewed in a plan view, the connection signal line SCL may be connected to the drain region DR of the transistor 100PC.

[0094] The first insulating layer 10 may be located on the buffer layer BFL. The first insulating layer 10 may commonly overlap with a plurality of pixels and cover the semiconductor patterns SC, AL, DR, and SCL. The first insulating layer 10 may be an inorganic layer and / or an organic layer and may have a single-layer structure or a multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. According to some embodiments, the first insulating layer 10 may be a single-layer silicon oxide layer. In addition to the first insulating layer 10, the insulating layers of the circuit layer 120 to be described below may be an inorganic layer and / or an organic layer and may have a single-layer structure or a multi-layer structure. The inorganic layer may include, but is not limited to, at least one of the materials described above.

[0095] The gate GT of the transistor 100PC is located on the first insulating layer 10. The gate GT may be part of a metal pattern. The gate GT may overlap with the active region AL. In a process for doping or reducing the semiconductor patterns SC, AL, DR, and SCL, the gate GT may be used as a mask.

[0096] The second insulating layer 20 may be located on the first insulating layer 10 to cover the gate GT. The second insulating layer 20 may commonly overlap with the pixels. The second insulating layer 20 may be an inorganic layer and / or an organic layer and may have a single-layer structure or a multi-layer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. According to some embodiments, the second insulating layer 20 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0097] The third insulating layer 30 may be located on the second insulating layer 20. The third insulating layer 30 may have a single-layer structure or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0098] The first connection electrode CNE1 may be located on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL through a contact hole CNT-1 formed by passing through the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30.

[0099] The fourth insulating layer 40 may be located on the third insulating layer 30. According to some embodiments, the fourth insulating layer 40 may be a single-layer silicon oxide layer. The fifth insulating layer 50 may be located on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0100] The second connection electrode CNE2 may be located on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a contact hole CNT-2 formed by passing through the fourth insulating layer 40 and the fifth insulating layer 50.

[0101] The sixth insulating layer 60 may be located on the fifth insulating layer 50 and may cover the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0102] The light-emitting element layer 130 may be located on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, the light-emitting element layer 130 may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, quantum dots, quantum rods, micro LEDs, or nano LEDs. The following description will be made by way of example with respect to the light-emitting element 100PE that is an organic light-emitting element, but is not particularly limited thereto according to embodiments of the present disclosure.

[0103] The light-emitting element 100PE may include a first electrode AE, a light-emitting layer EL, and a second electrode CE.

[0104] The first electrode AE may be located on the sixth insulating layer 60. The first electrode AE may be connected to the second connection electrode CNE2 through a contact hole CNT-3 formed through the sixth insulating layer 60.

[0105] The pixel defining layer 70 may be located on the sixth insulating layer 60 and may cover a part of the first electrode AE. An opening 70-OP is defined in the pixel defining layer 70. The opening 70-OP of the pixel defining layer 70 exposes at least a part of the first electrode AE.

[0106] The active region 1000A (see Figure 1 ) may include a light-emitting region PXA and a non-light-emitting region NPXA adjacent to the light-emitting region PXA. The non-light-emitting region NPXA may surround the light-emitting region PXA. According to some embodiments, the light-emitting region PXA is defined to correspond to the part of the first electrode AE exposed by the opening 70-OP.

[0107] The light-emitting layer EL may be located on the first electrode AE. The light-emitting layer EL may be located in a region corresponding to the opening 70-OP. Although Figure 4A the light-emitting layer EL is shown located in the opening 70-OP, it is not limited thereto according to embodiments of the present disclosure. For example, the light-emitting layer EL may extend to cover the side surface of the pixel defining layer 70 defining the opening 70-OP and a part of the top surface of the pixel defining layer 70.

[0108] According to some embodiments of the present disclosure, the light-emitting layer EL may be separately formed in each of the pixels. When the light-emitting layer EL is separately formed in each pixel, each of the light-emitting layers EL may emit light of at least one of blue, red, and green. However, it is not limited thereto according to embodiments of the present disclosure, and the light-emitting layer EL may be connected across pixels and commonly provided in the pixels. In this case, the light-emitting layer EL may provide blue light or white light.

[0109] The second electrode CE may be located on the light-emitting layer EL. The second electrode CE may have an integral form and may be commonly disposed in a plurality of pixels.

[0110] According to some embodiments of the present disclosure, the hole control layer may be located in the first electrode AE and the light-emitting layer EL. The hole control layer may be commonly located in the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may include a hole transport layer and may further include a hole injection layer. The electron control layer may be disposed between the light-emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may further include an electron injection layer. The hole control layer and the electron control layer may be commonly formed in a plurality of pixels by using an open mask or an inkjet process.

[0111] The encapsulation layer 140 may be located on the light-emitting element layer 130. The encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer stacked in sequence, and the layers constituting the encapsulation layer 140 are not limited thereto. The inorganic layer may protect the light-emitting element layer 130 from moisture and oxygen, and the organic layer may protect the light-emitting element layer 130 from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic organic layer, but is not limited thereto according to the embodiments of the present disclosure.

[0112] The sensor layer 200 may include a base layer 201, a first conductive layer 202, an intermediate insulating layer 203, a second conductive layer 204, and a covering insulating layer 205.

[0113] The base layer 201 may be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the base layer 201 may be an organic layer including an epoxy resin, an acrylic resin, or an imide resin. The base layer 201 may have a single-layer structure or a multi-layer structure including layers stacked in the third direction DR3. According to some embodiments of the present disclosure, the sensor layer 200 may not include the base layer 201.

[0114] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or a multi-layer structure including layers stacked in the third direction DR3.

[0115] Each of the first conductive layer 202 and the second conductive layer 204 having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, or graphene.

[0116] Each of the first conductive layer 202 and the second conductive layer 204 having a multi-layer structure may include a metal layer. The metal layer may have a three-layer structure such as titanium / aluminum / titanium, for example. The conductive layers 202 and 204 having a multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0117] According to some embodiments of the present disclosure, the thickness of the first conductive layer 202 may be greater than or equal to the thickness of the second conductive layer 204. When the thickness of the first conductive layer 202 is greater than the thickness of the second conductive layer 204, the resistance of components (e.g., electrodes, sensing patterns, or bridge patterns) included in the first conductive layer 202 may be relatively reduced. In addition, since the first conductive layer 202 is located under the second conductive layer 204, even if the thickness of the first conductive layer 202 increases, the probability of viewing components included in the first conductive layer 202 by external light reflection may be lower than the probability of viewing components included in the second conductive layer 204 by external light reflection.

[0118] At least one of the intermediate insulating layer 203 and the covering insulating layer 205 may include an inorganic film. The inorganic film may include at least one of alumina, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0119] At least one of the intermediate insulating layer 203 and the covering insulating layer 205 may include an organic film. The organic film may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, silicone resin, polyimide resin, polyamide resin, and perylene resin.

[0120] Although the above description is made with respect to providing a total of two conductive layers of the first conductive layer 202 and the second conductive layer 204, embodiments according to the present disclosure are not limited thereto. For example, the sensor layer 200 may include at least three conductive layers.

[0121] Figure 4B is a cross-sectional view illustrating a sensor layer 200 according to some embodiments of the present disclosure.

[0122] Reference Figure 4A and Figure 4B , the second width 204wt of the second grid line MS2 included in the second conductive layer 204 may be equal to or greater than the first width 202wt of the first grid line MS1 included in the first conductive layer 202. When the user USR views the first grid line MS1 and the second grid line MS2 from the side, since the first grid line MS1 has a smaller width than the second grid line MS2, the probability that the user USR views the first grid line MS1 may be relatively reduced.

[0123] Each of the first grid line MS1 and the second grid line MS2 may include a first metal layer M1 and a second metal layer M2 disposed between the first metal layers M1. For example, the first metal layer M1 may include titanium (Ti), and the second metal layer M2 may include aluminum (Al). However, embodiments according to the present disclosure are not particularly limited thereto.

[0124] According to some embodiments of the present disclosure, a first thickness TK1 of the second metal layer M2 of the first grid line MS1 may be equal to (or substantially equal to) a second thickness TK2 of the second metal layer M2 of the second grid line MS2, but embodiments according to the present disclosure are not particularly limited thereto. For example, the first thickness TK1 may be thicker than the second thickness TK2. Alternatively, the second thickness TK2 may be thicker than the first thickness TK1. According to some embodiments of the present disclosure, each of the first thickness TK1 and the second thickness TK2 may be 1000 angstroms or more, for example, 6000 angstroms.

[0125] Figure 5 is a plan view of some components of an electronic device 1000 according to some embodiments of the present disclosure. The electronic device 1000 may include a display panel DP, a first circuit film COF1, a second circuit film COF2, a first circuit board PCB1, and a second circuit board PCB2.

[0126] The first circuit film COF1 may be connected to a first end of the display panel DP. The second circuit film COF2 may be connected to a second end of the display panel DP. The display panel DP may include a first edge DPe1 and a second edge DPe2. Each of the first edge DPe1 and the second edge DPe2 may extend in a first direction DR1, and the first edge DPe1 and the second edge DPe2 may be spaced apart in a second direction DR2. For example, the first circuit film COF1 may overlap with the second edge DPe2 of the display panel DP and be connected to the display panel DP. The second circuit film COF2 may overlap with the first edge DPe1 of the display panel DP and be connected to the display panel DP.

[0127] A chip for driving the display layer 100 (see Figure 3 ) may be mounted on each of the first circuit film COF1 and the second circuit film COF2. Accordingly, the first circuit film COF1 and the second circuit film COF2 may be respectively referred to as a first chip-on-film (COF) and a second COF.

[0128] Although Figure 5 multiple first circuit films COF1 and multiple second circuit films COF2 are illustrated by way of example, embodiments according to the present disclosure are not limited thereto. Each of the first circuit film COF1 and the second circuit film COF2 may be provided in a single form, or may be provided in a number different from the number illustrated in the drawings.

[0129] The first circuit board PCB1 can be electrically connected to the display panel DP through the first circuit film COF1, and the second circuit board PCB2 can be electrically connected to the display panel DP through the second circuit film COF2. The first circuit board PCB1 and the second circuit board PCB2 may be referred to as the first printed circuit board and the second printed circuit board.

[0130] According to some embodiments of the present disclosure, the sensor driver 200C may be integrated in the form of an integrated circuit (IC) and may be electrically connected to the sensor layer 200. For example, the sensor driver 200C may be mounted on the first circuit board PCB1.

[0131] Figure 5 is a plan view of the display panel DP, the first circuit film COF1, the second circuit film COF2, the first circuit board PCB1, and the second circuit board PCB2 in an unfolded state before being assembled with other components (i.e., before being adjusted with other components). For example, when each of the first circuit film COF1 and the second circuit film COF2 is bent, the first circuit board PCB1 and the second circuit board PCB2 may be located under the display panel DP.

[0132] Figure 5 More specifically, the components in the display panel DP, specifically the components in the sensor layer 200, are illustrated. The sensor layer 200 may include a sensing region 200A defined (provided) in the sensor layer 200 and a peripheral region 200NA adjacent to the sensing region 200A.

[0133] The sensor layer 200 may include a plurality of first electrodes 210 and a plurality of second electrodes 220 located in the sensing region 200A.

[0134] The first electrodes 210 may cross the second electrodes 220 respectively. The first electrodes 210 may extend in the second direction DR2 and may be arranged to be spaced apart from each other in the first direction DR1. The second electrodes 220 may extend in the first direction DR1, and the second electrodes 220 may be arranged to be spaced apart from each other in the second direction DR2. The sensing unit SU of the sensor layer 200 (see Figure 6 ) may be a region where one of the first electrodes 210 and one of the second electrodes 220 cross each other.

[0135] Figure 5 Illustrates 11 first electrodes 210, 7 second electrodes 220, and 77 sensing units SU, but the number of the first electrodes 210 and the number of the second electrodes 220 are not limited thereto.

[0136] The sensor layer 200 may further include a plurality of first traces 210t, a plurality of second traces 220t, and a plurality of third traces 230t located in the peripheral region 200NA. Each of the first traces 210t may be electrically connected to each of the first electrodes 210 in a one-to-one correspondence. Each of the second traces 220t may be electrically connected to each of the second electrodes 220 in a one-to-one correspondence. Each of the third traces 230t may be electrically connected to each of the first electrodes 210 in a one-to-one correspondence.

[0137] According to some embodiments of the present disclosure, each of the first electrodes 210 may include a first end 210e1 and a second end 210e2. The first end 210e1 and the second end 210e2 may be spaced apart from each other in the second direction DR2. The first ends 210e1 of the first electrodes 210 may be spaced apart from each other in the first direction DR1, and the second ends 210e2 of the first electrodes 210 may be spaced apart from each other in the first direction DR1. The first trace 210t may be connected to the first end 210e1, and the third trace 230t may be connected to the second end 210e2.

[0138] Figure 6 is an enlarged plan view of a sensing unit SU according to some embodiments of the present disclosure. Figure 7A is a plan view of the first conductive layer 202SU of the sensing unit SU according to some embodiments of the present disclosure. Figure 7B is a plan view of the second conductive layer 204SU of the sensing unit SU according to some embodiments of the present disclosure. Figure 8 is of the sensor layer 200 according to some embodiments of the present disclosure along Figure 7A and Figure 7B cross-sectional views taken along the line I-I' shown in.

[0139] Reference Figure 5 and Figure 6 , each of the first electrodes 210 may include first split electrodes 210dv1 and 210dv2. The first split electrodes 210dv1 and 210dv2 may extend in the second direction DR2 and may be spaced apart from each other in the first direction DR1. The first split electrodes 210dv1 and 210dv2 may have a linearly symmetric shape with respect to a line extending in the second direction DR2.

[0140] Each of the second electrodes 220 may include second split electrodes 220dv1 and 220dv2. The second split electrodes 220dv1 and 220dv2 may extend in the first direction DR1 and may be spaced apart from each other in the second direction DR2. The second split electrodes 220dv1 and 220dv2 may have a linearly symmetric shape with respect to a line extending in the first direction DR1.

[0141] Reference Figure 6 、 Figure 7A 、 Figure 7B and Figure 8 ,each of the second split electrodes 220dv1 and 220dv2 may include a sensing pattern 221 and a bridge pattern 222. The sensing pattern 221 and the bridge pattern 222 are located in different layers and may be electrically connected to each other through a contact CN. For example, the bridge pattern 222 may be included in the first conductive layer 202SU, and the sensing pattern 221 and the first split electrodes 210dv1 and 210dv2 may be included in the second conductive layer 204SU. The first conductive layer 202SU may be included in the first conductive layer 202 of Figure 4A , and the second conductive layer 204SU may be included in the second conductive layer 204 of Figure 4A .

[0142] According to some embodiments of the present disclosure, the sensor layer 200 may further include a dummy pattern DMP located in a region where the first electrode 210 and the second electrode 220 are not provided. The dummy pattern DMP may be electrically floating or electrically grounded. According to some embodiments of the present disclosure, the dummy pattern DMP may be omitted. Since the dummy pattern DMP is located in the blank space, the probability that a specific pattern is viewed through external light reflection can be relatively reduced. In other words, the electronic device 1000 (see Figure 1 ) may have relatively improved visibility through external light reflection.

[0143] Figure 9A is an enlarged plan view of the region AA' illustrated in Figure 7A . Figure 9B is Figure 7B an enlarged plan view of the region BB' illustrated in

[0144] Reference Figure 7A 、 Figure 7B 、 Figure 9A and Figure 9B , each of the first electrode 210, the second electrode 220, and the dummy pattern DMP may have a grid structure. Each of the grid structures may include a plurality of grid lines. Each of the plurality of grid lines has a straight shape extending in a specific direction and may be connected to each other. An opening in which no grid structure is located may be defined (provided or formed) in the first electrode 210, the second electrode 220, and the dummy pattern DMP.

[0145] In Figure 9A and Figure 9BIn [the figure], the grid structure includes grid lines extending in a first cross direction CDR1 that intersects a first direction DR1 and a second direction DR2, and grid lines extending in a second cross direction CDR2 that intersects the first cross direction CDR1. However, the extending directions of the grid lines constituting the grid structure are not particularly limited to Figure 9A and Figure 9B illustrations. For example, the grid structure may include only grid lines extending in the first direction DR1 and the second direction DR2, or may include grid lines extending in the first direction DR1, the second direction DR2, the first cross direction CDR1, and the second cross direction CDR2. In other words, the grid structure can be changed in various forms.

[0146] Figure 10 is a plan view showing some components of an electronic device 1000 according to some embodiments of the present disclosure.

[0147] Figure 5 and Figure 10 illustrate four sensing units SU. Figure 5 and Figure 10 illustrate portions of four first electrodes 210-1, 210-2, 210-3, and 210-4 corresponding to the four sensing units SU. First ends 210e1 of the first electrodes 210-1, 210-2, 210-3, and 210-4 may be electrically connected to first traces 210t1, 210t2, 210t3, and 210t4, respectively, and second ends 210e2 of the first electrodes 210-1, 210-2, 210-3, and 210-4 may be electrically connected to third traces 230t1, 230t2, 230t3, and 230t4, respectively.

[0148] According to some embodiments of the present disclosure, the electronic device 1000 may further include each of a plurality of switching transistors ST1, ST2, and ST3 disposed between and electrically connected to two adjacent third traces among the third traces 230t1, 230t2, 230t3, and 230t4. The first switching transistor ST1 may be disposed between the 3-1 trace 230t1 and the 3-2 trace 230t2 and connected to the 3-1 trace 230t1 and the 3-2 trace 230t2, the second switching transistor ST2 may be disposed between the 3-2 trace 230t2 and the 3-3 trace 230t3 and connected to the 3-2 trace 230t2 and the 3-3 trace 230t3, and the third switching transistor ST3 may be disposed between the 3-3 trace 230t3 and the 3-4 trace 230t4 and connected to the 3-3 trace 230t3 and the 3-4 trace 230t4. Accordingly, the number of the switching transistors ST1, ST2, and ST3 may be one less than the number of the third traces 230t1, 230t2, 230t3, and 230t4.

[0149] The first switching transistor ST1 can be turned on or off in response to the first control signal CS1, the second switching transistor ST2 can be turned on or off in response to the second control signal CS2, and the third switching transistor ST3 can be turned on or off in response to the third control signal CS3.

[0150] Figure 11 is a view illustrating the operation of the sensor driver 200C according to some embodiments of the present disclosure.

[0151] Reference Figure 3 、 Figure 5 and Figure 11 , the sensor driver 200C can be configured to selectively operate in one of a first operation mode DMD1, a second operation mode DMD2, and a third operation mode DMD3.

[0152] The first operation mode DMD1 can be referred to as a touch and pen standby mode, the second operation mode DMD2 can be referred to as a touch activation and pen standby mode, and the third operation mode DMD3 can be referred to as a pen activation mode. The first operation mode DMD1 can be a mode for waiting for the first input 2000 and the second input 3000.

[0153] The second operation mode DMD2 can be a mode for sensing the first input 2000 and waiting for the second input 3000.

[0154] The third operation mode DMD3 can be a mode for sensing the second input 3000.

[0155] According to some embodiments of the present disclosure, the sensor driver 200C can first operate in the first operation mode DMD1. When the first input 2000 is sensed in the first operation mode DMD1, the sensor driver 200C can switch (or change) to the second operation mode DMD2. Alternatively, when the second input 3000 is sensed in the first operation mode DMD1, the sensor driver 200C can switch (or change) to the third operation mode DMD3.

[0156] Alternatively, when the second input 3000 is sensed in the second operation mode DMD2, the sensor driver 200C can switch (or change) to the third operation mode DMD3. Alternatively, when the first input 2000 is released (not sensed) in the second operation mode DMD2, the sensor driver 200C can switch (or change) to the first operation mode DMD1. Alternatively, when the second input 3000 is released in the third operation mode DMD3, the sensor driver 200C can switch (or change) to the first operation mode DMD1.

[0157] Figure 12 is a view illustrating the operation of the sensor driver 200C according to some embodiments of the present disclosure.

[0158] Refer to Figure 3 、 Figure 5 、 Figure 11 and Figure 12 and, in order of time t, illustrate the operations in the first to third operation modes DMD1, DMD2, and DMD3.

[0159] In the first operation mode DMD1, the sensor driver 200C can alternately and repeatedly be in the second mode MD2-d and the first mode MD1-d. During the second mode MD2-d, the sensor layer 200 can be scanned and driven to detect the second input 3000. During the first mode MD1-d, the sensor layer 200 can be scanned and driven to detect the first input 2000. Figure 12 Illustrates the sensor driver 200C operating in the first mode MD1-d after the second mode MD2-d, but is not limited thereto according to the embodiments of the present disclosure.

[0160] In the second operation mode DMD2, the sensor driver 200C can alternately and repeatedly be in the second mode MD2-d and the first mode MD1. During the second mode MD2-d, the sensor layer 200 can be scanned and driven to detect the second input 3000. During the first mode MD1, the sensor layer 200 can be scanned and driven to detect the coordinates from the first input 2000.

[0161] In the third operation mode DMD3, the sensor driver 200C can operate in the second mode MD2. During the second mode MD2, the sensor layer 200 can be scanned and driven to detect the coordinates from the second input 3000. In the third operation mode DMD3, the sensor driver 200C can not operate in the first mode MD1-d or MD1 until the second input 3000 is released (or not detected).

[0162] Figure 13A is a view illustrating the first modes MD1-d and MD1 according to some embodiments of the present disclosure.

[0163] Refer to Figure 3 、 Figure 12 and Figure 13A , the first mode MD1-d of the first operation mode DMD1 and the first mode MD1 of the second operation mode DMD2 can include a mutual capacitance detection mode. Figure 13AIt is a view of a mode for detecting mutual capacitance in the first mode MD1-d of the first operation mode DMD1 and the first mode MD1 of the second operation mode DMD2.

[0164] In the mutual capacitance detection mode, the sensor driver 200C can sequentially provide the transmission signal TX to the first electrode 210, and detect the coordinates of the first input 2000 by using the received signal RX detected via the second electrode 220. For example, the sensor driver 200C can be configured to calculate the input coordinates by sensing the change in the mutual capacitance between the first electrode 210 and the second electrode 220.

[0165] Figure 13A The figure shows that the transmission signal TX is provided to one first electrode 210, and the received signal RX is output from the second electrode 220. For the sake of clearly showing the signals, as Figure 13A shown in the figure, one first electrode 210 that receives the transmission signal TX is represented by a thick line. The sensor driver 200C can detect the input coordinates of the first input 2000 by sensing the change in the capacitance between the first electrode 210 and the second electrode 220.

[0166] According to some embodiments of the present disclosure, at least one of the first mode MD1-d of the first operation mode DMD1 and the first mode MD1 of the second operation mode DMD2 may further include a mode for detecting self-capacitance. In the mode for detecting self-capacitance, the sensor driver 200C can be configured to output a driving signal to the first electrode 210 and the second electrode 220, and calculate the input coordinates by sensing the change in the capacitance of each of the first electrode 210 and the second electrode 220.

[0167] Referring to Figure 10 and Figure 13A , in the first modes MD1-d and MD1, the third traces 230t can be electrically isolated from each other. For example, in the first modes MD1-d and MD1, the transistors ST1, ST2, and ST3 can be configured to be cutoff. Therefore, in the first modes MD1-d and MD1, the second end 210e2 of the first electrode 210 can be floating.

[0168] Figure 13B It is a view showing the first modes MD1-d and MD1 according to some embodiments of the present disclosure. In the description made below with reference to Figure 13B the components that are the same as those in Figure 13A will be assigned the same reference numerals, and their descriptions will be omitted to avoid redundancy.

[0169] In the mutual capacitance detection mode, the sensor driver 200C can simultaneously (or concurrently) provide the transmission signal TX-m to at least some of the first electrodes 210, and detect the coordinates of the first input 2000 by using the received signal RX detected via the second electrode 220. Some of the transmission signals TX-m may have waveforms, amplitudes, or phases different from those of the remaining signals. The described example is an example, but is not limited to embodiments according to the present disclosure.

[0170] According to some embodiments of the present disclosure, the sensor driver 200C can simultaneously (or concurrently) provide the transmission signal TX-m to the first electrode 210. However, this is provided for illustrative purposes only. The sensor driver 200C can simultaneously (or concurrently) provide the transmission signal TX-m to some of the first electrodes 210 among the first electrodes 210.

[0171] Figure 14 is a view illustrating a second mode MD2 according to some embodiments of the present disclosure. Figure 15A is a graph illustrating the waveform of a first signal SG1 according to some embodiments of the present disclosure. Figure 15B is a graph illustrating the waveform of a first signal SG1 according to some embodiments of the present disclosure.

[0172] Reference Figure 3 、 Figure 14 、 Figure 15A and Figure 15B , the second mode MD2 may include a charge drive mode. The charge drive mode may include a search charge drive mode and a tracking charge drive mode.

[0173] The search charge drive mode may be a drive mode before the position of the sensing pen. Therefore, the first signal SG1 or the second signal SG2 may be sequentially provided to all channels included in the sensor layer 200. In other words, in the search charge drive mode, the entire area of the sensor layer 200 may be scanned. In the search charge drive mode, when the pen PN (see Figure 3 ) is sensed, the sensor layer 200 may be driven in the tracking charge drive mode. For example, in the tracking charge drive mode, the sensor driver 200C may sequentially output the first signal SG1 and the second signal SG2 to the area overlapping with the point where the pen PN is sensed, rather than the entire area of the sensor layer 200.

[0174] In the charge drive mode, the sensor driver 200C may apply the first signal SG1 to the first pad and apply the second signal SG2 to the second pad. The second signal SG2 may be a signal opposite to the first signal SG1. For example, the first signal SG1 may be a sine signal.

[0175] Since the first signal SG1 and the second signal SG2 are applied to at least two pads, a current path for the current RFS can be provided from the first pad to the second pad. In the charge driving mode, at least some of the second ends 210e2 of the first electrodes 210 are connected to each other to define the current path. The current path may include a first trace 210t1 among the first traces 210t, a first electrode 210-1 among the first electrodes 210 connected to the first trace 210t1, another first electrode 210-3 among the first electrodes 210, and another first trace 210t3 among the first traces 210t electrically connected to the other first electrode 210-3.

[0176] According to some embodiments of the present disclosure, in order to provide a current path, at least some of the third traces 230t may be electrically connected to each other. Refer to Figure 10 , in the charge driving mode, at least some of the switching transistors ST1, ST2, and ST3, such as the switching transistors ST1 and ST2, may be configured to be turned on.

[0177] Since the first signal SG1 and the second signal SG2 are sinusoidal signals having an anti-correlated relationship with each other, the direction of the current RFS can be periodically changed. According to some embodiments of the present disclosure, the first signal SG1 and the second signal SG2 may be square wave signals having an anti-correlated relationship with each other.

[0178] When the first signal SG1 and the second signal SG2 have an anti-correlated relationship with each other, the noise caused by the first signal SG1 in the display layer 100 (see Figure 3 ) can be canceled from the noise caused by the second signal SG2. Therefore, the flicker phenomenon may not occur in the display layer 100, and the display quality of the display layer 100 can be relatively improved.

[0179] According to some embodiments of the present disclosure, the first signal SG1 may be a sinusoidal signal. However, the embodiments of the present disclosure are not limited thereto, and the first signal SG1 may be a square wave signal. In addition, the second signal SG2 may have a specific constant voltage. For example, the second signal SG2 may be a ground voltage. In other words, the pad receiving the second signal SG2 may be grounded. Even in this case, the current RFS can flow from the first pad to the second pad. In addition, even if the second pad is grounded, since the first signal SG1 is a sinusoidal signal or a square wave signal, the direction of the current RFS can also be periodically changed.

[0180] According to some embodiments of the present disclosure, since the switching transistors ST1, ST2, and ST3 electrically connected to the first electrode 210 are controlled to be turned on or off, the first electrode 210 can be utilized in a first mode for sensing a touch input and also in a charging driving mode for charging a pen. Therefore, a separate design for a pattern of a charging path can be omitted, thereby relatively increasing the degree of freedom in design.

[0181] In addition, the resistance of a current path formed using the first electrode 210 can be lower than that of a current path formed using a dummy pattern. Therefore, a charging current can be sufficiently ensured during charging driving. Specifically, when the current path is implemented by utilizing the first electrode 210 having a lower resistance, the sensor layer 200 for sensing both a touch input and a pen input can be widely applied to medium and large-sized electronic devices such as a large tablet computer or a large display, and small-sized electronic devices such as a cellular phone.

[0182] Figure 16 is a table showing signals provided to the sensor layer 200 according to some embodiments of the present disclosure.

[0183] Reference Figure 14 、 Figure 15A 、 Figure 15B and Figure 16 , Figure 16 The tables shown in and illustrate signals or states provided to the first traces 210t1, 210t2, 210t3, 210t4, 210t5, 210t6, 210t7, 210t8, 210t9, 210t10, and 210t11 during the first to ninth time periods t1, t2, t3, t4, t5, t6, t7, t8, and t9. The first traces 210t1, 210t2, 210t3, 210t4, 210t5, 210t6, 210t7, 210t8, 210t9, 210t10, and 210t11 can be sequentially connected to the first electrode 210 arranged in the first direction DR1 one by one.

[0184] Figure 16 The signals described in the tables shown in can be signals provided to the sensor layer 200 in a search charging driving mode. Therefore, since the position of the pen PN is not sensed, the first signal SG1 or the second signal SG2 can be sequentially provided to all channels included in the sensor layer 200. In other words, in the search charging driving mode, the entire area of the sensor layer 200 can be scanned.

[0185] In the second mode, the charging driving mode and the pen sensing driving mode can alternate repeatedly. For example, during the first time period t1, the sensor layer 200 can operate in the pen sensing driving mode after being charged and driven. When the pen is not sensed, the sensor layer 200 can be charged and driven during the second time period t2. Alternatively, when the pen is sensed, the sensor layer 200 can operate in the tracking charging driving mode. In the search charging driving mode, when the pen PN is sensed, the sensor layer 200 can operate in the tracking charging driving mode. For example, in the tracking charging driving mode, the sensor driver 200C can sequentially output the first signal SG1 and the second signal SG2 to the area overlapping the point where the pen PN is sensed, rather than the entire area of the sensor layer 200.

[0186] The first signal SG1 can be provided to the 1-1 trace 210t1 during the first time period t1, and the second signal SG2 can be provided to the 1-3 trace 210t3. The pads connected to the remaining first traces 210t2, 210t4, 210t5, 210t6, 210t7, 210t8, 210t9, 210t10, and 210t11 to which the first signal SG1 and the second signal SG2 are not provided can all be floating FL. Shifting is performed in one channel unit, and the first signal SG1 and the second signal SG2 can be provided during the second to ninth time periods t2 to t9.

[0187] Figure 16 The figure shows that each of the first signal SG1 and the second signal SG2 is provided to a relevant one of the first traces, but this is not limited to the embodiments of the present disclosure. For example, the same signal can be provided to multiple channels. For example, during the first time period t1, the first signal SG1 can be provided to the 1-1 trace 210t1 and the 1-2 trace 210t2, and the second signal SG2 can be provided to the 1-4 trace 210t4 and the 1-5 trace 210t5. When the same signal is provided to multiple channels, the effect of reducing resistance can be obtained. Therefore, as the resistance is reduced, the power consumption in the sensor layer 200 can be relatively reduced.

[0188] In addition, Figure 16 The figure shows a floating channel (hereinafter referred to as a "gap channel") between the channel for providing the first signal SG1 and the channel for providing the second signal SG2. As the number of gap channels increases, the intensity of the magnetic field formed by the current RFS can increase. Therefore, the number of gap channels can be changed according to the usage conditions of the electronic device 1000 (see Figure 1 ).

[0189] Refer to together Figure 14 , Figure 14Schematically illustrate the state of the sensor layer 200 during the first period t1. For example, the first end 210e1 of the first electrode 210 connected to the first trace 210t1 and the second end 210e2 of the first electrode 210 connected to the first trace 210t3 may be electrically connected to each other. Thus, a current path may be defined by the first trace 210t1, the first electrode 210 connected to the first trace 210t1, the first electrode 210 connected to the first trace 210t3, and the first trace 210t3. The current RFS may flow through this current path. This current path may have a coil shape. Thus, in the charging drive mode of the second mode, the resonant circuit of the pen PN may be charged through the magnetic field formed by this current path.

[0190] According to the present disclosure, the current path of the toroidal coil pattern may be implemented by components included in the sensor layer 200. Thus, the electronic device 1000 (refer to Figure 1 ) may charge the pen PN by using the sensor layer 200. Thus, since there is no need to separately add a component having a coil for charging the pen PN, an increase in the thickness, an increase in the weight, and a decrease in the flexibility of the electronic device 1000 may not occur.

[0191] In the charging drive mode, the second electrode 220 and the dummy pattern DMP may be grounded, may be applied with a constant voltage, or may be electrically floating. Specifically, the second electrode 220 and the dummy pattern DMP may be floating. In this case, the current RFS may not flow to the second electrode 220 and the dummy pattern DMP.

[0192] Figure 17A is a view illustrating a second mode according to some embodiments of the present disclosure. Figure 17B is a view illustrating a sensing unit in the second mode according to some embodiments of the present disclosure.

[0193] Refer to Figure 17A and Figure 17B , the second mode may include a charging drive mode and a pen sensing drive mode. Figure 17A and Figure 17B are views illustrating the pen sensing drive mode.

[0194] Refer to Figure 17A , in the pen sensing drive mode, the first received signal PRX1 may be output from the first electrode 210 and the second received signal PRX2 may be output from the second electrode 220. Figure 17B Illustrate a sensing unit SU through which the first induced current Ia and the second induced current Ib generated by the pen PN (see Figure 3 ) flow.

[0195] The RLC resonance circuit of pen PN can release a magnetic field with a resonance frequency while releasing charge from the RLC resonance circuit. The first induced current Ia can be generated from the first electrode 210 by the magnetic field provided by pen PN, and the second induced current Ib can be generated from the second electrode 220.

[0196] The sensor driver 200C can receive a first received signal PRX1a based on the first induced current Ia from the first electrode 210, and receive a second received signal PRX2a based on the second induced current Ib from the second electrode 220. The sensor driver 200C can detect the input coordinates of pen PN based on the first received signal PRX1a and the second received signal PRX2a.

[0197] When the sensor driver 200C receives the first received signal PRX1a from the first electrode 210 and the second received signal PRX2a from the second electrode 220, the second end 210e2 of the first electrode 210 (e.g., the third trace 230t) can be floated.

[0198] Figure 18A is a plan view showing some components of an electronic device 1000 according to some embodiments of the present disclosure. Figure 18B is a plan view showing some components of an electronic device 1000 according to some embodiments of the present disclosure.

[0199] Figure 18A is a plan view showing a display panel DP, a first circuit film COF1, a second circuit film COF2, a first circuit board PCB1, and a second circuit board PCB2 in an unfolded state before being assembled with other components (i.e., before being adjusted with other components). Figure 18B is a view showing a state in which each of the first circuit film COF1 and the second circuit film COF2 is bent to be assembled with other components, such that the first circuit board PCB1 and the second circuit board PCB2 are located under the display panel DP, and the connection film FFC is connected to the first circuit board PCB1 and the second circuit board PCB2.

[0200] Reference Figure 10 、 Figure 18A and Figure 18B and

[0201] According to some embodiments of the present disclosure, the operation of the switching transistor ST may be controlled by the sensor driver 200C. In other words, a control signal CS for controlling the switching transistor ST may be provided from the sensor driver 200C. Accordingly, the electronic device 1000 may further include a flexible flat cable FFC connected to the first printed circuit board PCB1 and the second printed circuit board PCB2.

[0202] Figure 19 is a plan view of some components of an electronic device 1000-a according to some embodiments of the present disclosure. In the description made below with reference to Figure 19 components identical to those of Figure 18A will be assigned the same reference numerals, and their descriptions will be omitted to avoid redundancy.

[0203] Referring to Figure 10 and Figure 19 , the electronic device 1000-a may further include an additional sensor driver 200C-ad mounted on the second printed circuit board PCB2. According to some embodiments of the present disclosure, the operation of the switching transistor ST may be controlled by the additional sensor driver 200C-ad. In other words, a control signal CSa for controlling the switching transistor ST may be provided from the additional sensor driver 200C-ad.

[0204] Figure 20 is a plan view of some components of an electronic device 1000-b according to some embodiments of the present disclosure.

[0205] Referring to Figure 20 , the electronic device 1000-b may include a display panel DP-1, a first circuit on film COF1, and a first printed circuit board PCB1.

[0206] According to some embodiments of the present disclosure, a switching transistor ST-1 for controlling the connection of the second end portion 210e2 of the first electrode 210 may be provided in the display panel DP-1. For example, the switching transistor ST-1 may be provided in the display layer 100, specifically in the circuit layer 120 illustrated in Figure 4A . The switching transistor ST-1 may be formed simultaneously (or concurrently) by the same process as that of the transistor 100PC (see Figure 4A ).

[0207] According to reference Figure 18A , Figure 19 and Figure 20In the described embodiment, since the switching transistors ST or ST-1 electrically connected to the first electrode 210 are controlled to be turned on or off, the first electrode 210 can be utilized not only in the first mode for sensing touch input but also in the charging drive mode for charging the pen. Therefore, a separate design for the pattern of the charging path can be omitted, thereby relatively increasing the design freedom of the sensor layer 200. Specifically, when the current path is realized by utilizing the first electrode 210 having a lower resistance, the sensor layer 200 for sensing both touch input and pen input can be widely applied to medium and large-sized electronic devices such as large tablet computers or large displays, as well as small electronic devices such as cellular phones.

[0208] As described above, the switching transistor electrically connected to the first electrode can be controlled to be turned on or off such that the first electrode can be utilized not only in the first mode for sensing touch input but also in the charging drive mode for charging the pen. Therefore, a separate design for the pattern of the charging path can be omitted, thereby relatively increasing the design freedom of the sensor layer. In addition, the resistance of the current path formed by utilizing the first electrode can be lower than the resistance of the current path formed by using dummy patterns. Therefore, a charging current can be sufficiently ensured during charging drive. Specifically, when the current path is realized by utilizing the first electrode having a lower resistance, the sensor layer for sensing both touch input and pen input can be widely applied to medium and large-sized electronic devices such as large tablet computers or large displays, as well as small electronic devices such as cellular phones.

[0209] Although aspects of some embodiments of the present disclosure have been described for illustrative purposes, those skilled in the art will understand that various modifications and substitutions are possible without departing from the scope and spirit of the present disclosure disclosed in the claims. Therefore, the technical scope of the embodiments according to the present disclosure is not limited to the detailed description of this specification, but should be defined by the claims and their equivalents.

[0210] Although aspects of some embodiments of the present disclosure have been described with reference to the embodiments of the present disclosure, those of ordinary skill in the art will understand that various changes and modifications can be made to the present disclosure without departing from the spirit and scope of the present disclosure set forth in the claims and their equivalents.

Claims

1. An electronic device, comprising: A display panel comprising a display layer and a sensor layer on the display layer; as well as a sensor driver configured to drive the sensor layer and configured to selectively operate in a first mode for sensing a touch input or a second mode for sensing a pen input, Wherein, the sensor layer comprises: a plurality of first electrodes arranged in a first direction and extending in a second direction intersecting the first direction; a plurality of second electrodes arranged in the second direction and extending in the first direction; a plurality of first traces electrically connected to first ends of the plurality of first electrodes; a plurality of second traces electrically connected to the plurality of second electrodes, respectively; and a plurality of third traces electrically connected to second ends of the plurality of first electrodes spaced apart from the first ends in the second direction, wherein the plurality of third traces are configured to be electrically isolated from each other in the first mode, and The second mode includes a charging driving mode, and at least some of the plurality of third traces are configured to be electrically connected to each other in the charging driving mode.

2. The electronic device according to claim 1, wherein: In the charge driving mode, the sensor driver is configured to apply a first signal to at least one of the plurality of first traces and to apply a second signal to at least one different one of the plurality of first traces.

3. The electronic device according to claim 2, wherein: The second signal has an inverted signal of the first signal.

4. The electronic device according to claim 1, further comprising: A plurality of switch transistors, wherein each switch transistor is electrically connected between two third traces adjacent to each other among the plurality of third traces.

5. The electronic device according to claim 4, wherein: The number of the plurality of switch transistors is smaller than the number of the plurality of third traces.

6. The electronic device according to claim 4, wherein: The plurality of switch transistors are configured to be turned off in the first mode.

7. The electronic device according to claim 4, wherein: At least some of the plurality of switch transistors are configured to be turned on in the charge driving mode.

8. The electronic device according to claim 4, further comprising: a first circuit film electrically connected to one end of the display panel; a second circuit film electrically connected to the other end of the display panel; a first circuit board, electrically connected to the display panel through the first circuit film; and a second circuit board, electrically connected to the display panel through the second circuit film, wherein the sensor driver is mounted on the first circuit board, and wherein the plurality of switching transistors are included in the second circuit board.

9. The electronic device according to claim 8, further comprising: a connecting film connected to the first circuit board and the second circuit board, Wherein, the plurality of switching transistors are configured to be operated by the sensor driver.

10. The electronic device according to claim 8, further comprising: an additional sensor driver mounted on the second circuit board, The additional sensor driver is configured to control the operation of the plurality of switch transistors.

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