Method for repairing deformation of long strip
By using ultraviolet viscosity reducing agent and ultrasonic oscillation treatment on the semiconductor elongated strips, the problem of elongated strip deformation is solved, and performance improvement and component protection is achieved.
Patent Information
- Application Number
- CN202311801587.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-26
- Publication Date
- 2025-06-27
AI Technical Summary
The semiconductor elongated strips are prone to deformation during processing, resulting in degradation of component performance. The existing grinding and heat treatment methods have problems such as thinning and incomplete improvement.
By clamping the elongated strips on the two butt glass substrates, bonding with ultraviolet adhesive, and performing the first ultraviolet light irradiation, ultrasonic oscillation treatment and the second ultraviolet light irradiation, the elongated strips are separated from the glass substrate, thereby releasing and absorbing its internal stress.
Effectively repair the deformation of the elongated strips, and improve the bending degree from the original 15μm to 1-2μm, meets production requirements, and protects the performance of the component without causing damage to the component.
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor processing technologies, and particularly to a method for repairing the deformation of a long strip Background Art
[0002] A semiconductor long strip is an aggregate of semiconductor components. During the processing, the semiconductor long strip is cut from a wafer and is usually deformed under the influence of external forces. And this deformation is likely to cause the performance of the long strip or independent semiconductor components. Therefore, how to improve this deformation is a current problem
[0003] The traditional methods for improving this deformation mainly include grinding and heat treatment. However, both of these methods have certain problems. For example, grinding will cause the thinning of the semiconductor material, resulting in unnecessary overprocessing; in heat treatment, although the deformation is alleviated to some extent, it still cannot be well improved
[0004] Therefore, there is an urgent need to provide a method for repairing the deformation of a long strip Summary of the Invention
[0005] The purpose of the present invention is to provide a method for repairing the deformation of a long strip. This method can release and absorb the stress of the long strip without mechanical physical pressure treatment, thereby repairing the deformation of the long strip and protecting the performance of the components on the long strip
[0006] To achieve the above purpose, the method for repairing the deformation of a long strip according to the present invention includes the following steps
[0007] The long strip is clamped by two butted glass substrates, and the long strip is bonded to the glass substrates through an ultraviolet adhesive remover
[0008] Perform a first ultraviolet light irradiation on the long strip and the glass substrates
[0009] Perform an ultrasonic oscillation treatment on the long strip and the glass substrates; and
[0010] Perform a second ultraviolet light irradiation on the long strip and the glass substrates to separate the long strip from the glass substrates
[0011] Compared with the prior art, in the method of the present invention, first, the long strip is sealed on two butt-jointed glass substrates, and the long strip is adhered to the glass substrate by an ultraviolet adhesion-reducing agent. Then, after the first ultraviolet light irradiation, the long strip and the glass substrate are firmly adhered. Next, through ultrasonic vibration treatment, the internal stress of the long strip is released and absorbed in the ultraviolet adhesion-reducing agent. Finally, through the second ultraviolet light irradiation, the long strip is separated from the glass substrate. Thus, for the long strip after detection, the degree of curvature is improved from the original 15 μm to 1 - 2 μm. Thus, the deformation of the long strip is effectively repaired to meet the production requirements, and moreover, such a repair method can protect the performance of the components on the long strip and will not cause damage to the components.
[0012] As an embodiment, the ultraviolet adhesion-reducing agent includes acrylic pressure-sensitive adhesive resin, photocurable resin, photocurable monomer, photoinitiator and curing agent.
[0013] As an embodiment, the light intensity of the first ultraviolet light irradiation is 1000 - 2500 mJ / cm 2 , and the irradiation time is 300 - 400 seconds.
[0014] Preferably, the first ultraviolet light irradiation fixes the long strip on the glass substrate.
[0015] As an embodiment, in the ultrasonic vibration treatment, the long strip and the glass substrate are placed in deionized water, the working voltage is controlled at 220 V, the working current is 4 - 6 A, and the ultrasonic frequency is 30 - 40 KHz.
[0016] Preferably, the time of the ultrasonic vibration treatment is 40 - 60 minutes.
[0017] Preferably, the light intensity of the second ultraviolet light irradiation is 1000 - 2500 mJ / cm 2 , and the irradiation time is 5 - 10 minutes.
[0018] As an embodiment, the coating thickness of the ultraviolet adhesion-reducing agent is 0.5 - 1.5 mm. Detailed implementation manners
[0019] To make the above objects, features, and advantages of the present application more obvious and understandable, the following describes the detailed implementation manners of the present application in combination with some embodiments. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0020] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.
[0021] In the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0022] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.
[0023] The method for repairing the deformation of a long strip of the present invention will be further described below in conjunction with embodiments, but the present invention is not limited thereby. The method of the present invention aims to provide a method for repairing the deformation of a long strip, which can release and absorb the stress of the long strip without mechanical physical pressure treatment, thereby repairing the deformation of the long strip and protecting the performance of the components on the long strip.
[0024] In an embodiment of the method for repairing the deformation of a long strip of the present invention, the following steps are included:
[0025] The long strip is clamped by two butted glass substrates, and the long strip is adhered to the glass substrates through an ultraviolet de-adhesive;
[0026] Perform a first ultraviolet light irradiation on the long strip and the glass substrates;
[0027] Perform an ultrasonic oscillation treatment on the long strip and the glass substrates; and
[0028] Perform a second ultraviolet light irradiation on the long strip and the glass substrates to separate the long strip from the glass substrates.
[0029] In the method of the present invention, first, the long strip is sealed on two butt-jointed glass substrates, and the long strip is adhered to the glass substrate through an ultraviolet tackifier. Then, after the first ultraviolet light irradiation, the long strip and the glass substrate are firmly adhered. Next, through ultrasonic vibration treatment, the internal stress of the long strip is released and absorbed in the ultraviolet tackifier. Finally, through the second ultraviolet light irradiation, the long strip is separated from the glass substrate. Thus, for the long strip after detection, the degree of curvature is improved from the original 15 μm to 1-2 μm. Thus, the deformation of the long strip is effectively repaired to meet the production requirements, and this repair method can protect the performance of the components on the long strip and will not cause damage to the components.
[0030] Specifically, first, the long strip is sealed between two opposite glass substrates, and the long strip is adhered to the glass substrate through an ultraviolet tackifier. The coating thickness of the ultraviolet tackifier is 0.5-1.5 mm. The ultraviolet tackifier is a glue that has a tack-reducing function with ultraviolet light irradiation. Specifically, the ultraviolet tackifier includes an acrylic pressure-sensitive adhesive resin, a photocurable resin, a photocurable monomer, a photoinitiator, and a curing agent. For example, it includes 60-80 parts of acrylic pressure-sensitive adhesive resin, 3-10 parts of photocurable resin, 1.5-7 parts of photocurable monomer, 0.5-2.5 parts of photoinitiator, and 2-5 parts of curing agent.
[0031] Next, the first ultraviolet light irradiation is carried out. Specifically, the light intensity of the first ultraviolet light irradiation is 1000-2500 mJ / cm 2 , and the irradiation time is 300-400 seconds. The purpose of this irradiation is to firmly adhere the long strip on the surface of the glass substrate, and the viscosity at this time is about 12-13 (N / in).
[0032] The periphery of the glass substrate can be sealed with a sealant, and the sealed glass substrate is placed in deionized water for ultrasonic vibration treatment. Specifically, in this ultrasonic vibration treatment, the working voltage is controlled at 220 V, the working current is 4-6 A, and the ultrasonic frequency is 30-40 KHz. The function of the ultrasonic vibration treatment is to release and absorb the internal stress of the long strip under the ultraviolet tackifier. After completion, the long strip and the glass substrate are taken out and dried. Then, the second ultraviolet light irradiation is carried out, and the purpose is to separate the long strip from the glass substrate. Specifically, the light intensity of the second ultraviolet light irradiation is 1000-2500 mJ / cm 2 , and the irradiation time is 5-10 minutes. After this treatment, the viscosity between the long strip and the glass substrate reaches 0.05-0.06 (N / in), which means that the ultraviolet tackifier completely loses its viscosity, thereby separating the semiconductor, the ultraviolet tackifier, and the glass substrate.
[0033] In this embodiment, the glass substrate has good light transmittance, making the ultraviolet light irradiation more sufficient.
[0034] In summary, in the present invention, first, the long strip is sealed on two butted glass substrates, and the long strip is adhered to the glass substrate through an ultraviolet de-bonding agent. Then, after the first ultraviolet light irradiation, the long strip and the glass substrate are firmly adhered. Next, through ultrasonic vibration treatment, the internal stress of the long strip is released and absorbed in the ultraviolet de-bonding agent. Finally, through the second ultraviolet light irradiation, the long strip is separated from the glass substrate. Thus, for the long strip after detection, the degree of curvature is improved from the original 15 μm to 1-2 μm. Thus, the deformation of the long strip is effectively repaired to meet the production requirements. Moreover, this repair method can repair the deformation of the long strip without mechanical physical pressure treatment, which can protect the performance of the components on the long strip and will not cause damage to the components.
[0035] The above-disclosed are only the preferred embodiments of the present invention, and of course, the scope of rights of the present invention cannot be limited thereby. Therefore, equivalent changes made according to the scope of the patent application of the present invention still fall within the scope covered by the present invention.
Claims
1. A method for repairing elongated bar deformation, characterized in that, It includes the following steps: The long strip is clamped and sealed by two butt-jointed glass substrates, and the long strip is adhered to the glass substrate by an ultraviolet de-adhesive; Perform the first ultraviolet light irradiation on the long strip and the glass substrate; Perform ultrasonic oscillation treatment on the long strip and the glass substrate; And Perform the second ultraviolet light irradiation on the long strip and the glass substrate to separate the long strip from the glass substrate.
2. The method for repairing the elongated strip deformation according to claim 1, wherein, The ultraviolet de-adhesive includes acrylic pressure-sensitive adhesive resin, photocurable resin, photocurable monomer, photoinitiator and curing agent.
3. The method for repairing an elongated strip deformation according to claim 1, wherein The light intensity of the first ultraviolet light irradiation is 1000 - 2500 mJ / cm 2 , and the irradiation time is 300 - 400 seconds.
4. The method for repairing an elongated strip deformation according to claim 1, wherein, The first ultraviolet light irradiation fixes the long strip to the glass substrate.
5. The method for repairing the elongated strip deformation according to claim 1, wherein, During the ultrasonic oscillation treatment, place the long strip and the glass substrate in deionized water, control the working voltage to be 220V, the working current to be 4-6A, and the ultrasonic frequency to be 30-40KHz.
6. The method for repairing the elongated strip deformation according to claim 5, wherein, The time of the ultrasonic oscillation treatment is 40-60 minutes.
7. The method for repairing an elongated strip deformation according to claim 1, characterized in that, The light intensity of the second ultraviolet light irradiation is 1000 - 2500 mJ / cm 2 , and the irradiation time is 5 - 10 minutes.
8. The method for repairing elongated bar deformation according to claim 1, wherein The coating thickness of the ultraviolet de-adhesive is 0.5-1.5mm.