Highly airtight SIP frequency conversion device suitable for RF microwave communications

Abstract

The present invention relates to the technical field of communication frequency conversion devices, and mainly relates to a high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication. The device comprises a processor body, pins are provided on both sides of the processor body, and a protective frame, wherein the processor body is placed in the protective frame, and abutment portions are provided on both sides of the protective frame, and the pins are limited by the abutment portions, as well as abutment columns fixed on both sides of the protective frame, and the abutment columns are fitted with the outer side of the processor body, and a snap-fit portion is provided, and the processor body is locked in the protective frame by the snap-fit portion. The present invention optimizes the SIP packaged processor and adds a protective frame. When the processor is not soldered, the processor body can be limited by the abutment portions and the snap-fit portion, and the pins are protected to avoid collision damage.

Description

Technical Field

[0001] The present invention relates to the technical field of communication frequency conversion devices, in particular to a high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication. Background Art

[0002] SIP (System in a Package) is an advanced electronic packaging technology that integrates multiple chips (such as processors, memory, sensors, etc.), passive components (resistors, capacitors, inductors) and interconnect structures in a single package to achieve complete system functions.

[0003] The pins of high-airtightness SIP inverter devices are prone to collision during transportation, resulting in deformation and fracture. After welding, they may also be damaged by thermal stress cracking. At the same time, high-airtightness SIP inverter devices achieve environmental isolation through ceramic / metal packaging. While ensuring excellent airtightness, this will lead to poor internal heat dissipation, affecting the performance of the device. Summary of the Invention

[0004] The object of the present invention is to provide a high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication, so as to solve the problems of fragile pins and poor heat dissipation of communication frequency conversion devices mentioned in the above background art.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication, comprising a processor body, pins are provided on both sides of the processor body, and a protective frame, wherein the processor body is placed in the protective frame, and abutment portions are provided on both sides of the protective frame, and the abutment portions are used to limit the pins, as well as abutment columns fixed on both sides of the protective frame, and the abutment columns are in contact with the outer side of the processor body, and a snap-fit portion is used to lock the processor body in the protective frame.

[0006] Preferably, the snap-fitting portion includes a snap-fitting plate, docking blocks are fixed at the four corners of the protective frame, plug-in columns that are plugged into the docking blocks are fixed at both ends of the snap-fitting plate, and abutment plates that are abutted against the outer side of the processor body are provided on the snap-fitting plate, and magnetic blocks that are magnetically attracted to the abutment columns are fixed on the snap-fitting plate.

[0007] Preferably, a protrusion is fixed on the magnetic block, and a recess is provided in the abutting column.

[0008] Preferably, the abutting columns are provided with chamfers for facilitating the placement of the processor body.

[0009] Preferably, the abutting portion includes an elastic arc plate fixed on the protective frame, and an abutting end is fixed to the bottom of the elastic arc plate, and the abutting end is used to abut and limit the pin.

[0010] Preferably, the distance between one of the docking blocks and its two adjacent docking blocks is consistent, and extension plates are fixed on both sides of the elastic arc plate.

[0011] Preferably, an opening is provided at the bottom of the protective frame, and a copper column adapted to the opening is fixed on the processor body.

[0012] Preferably, the inner side of the bottom of the protective frame is in contact with the outer side of the processor body, and a heat sink is fixed to the outer side of the protective frame.

[0013] Preferably, a plug hole is provided at the bottom of the protective frame, and a plug rod is inserted into the internal thread of the plug hole, and the elastic arc plate is pressed to fit with the pin through the plug rod.

[0014] Preferably, the width of the magnetic block is smaller than the spacing between adjacent pins.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The present invention optimizes the SIP package processor and adds a protective frame. When the processor is not soldered, it can limit the processor body by means of the abutting portion and the snap-fit portion, while protecting the pins to avoid collision damage.

[0017] After the processor is welded and installed, the protective frame is buckled on the outside of the processor, which can fit the processor and dissipate heat from its pins. At the same time, the heat dissipation effect is improved by means of copper columns and heat sinks. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the protective frame and the processor body of the present invention when they are placed;

[0019] Figure 2 This is a schematic diagram of the buckle portion and the protective frame docking of the present invention;

[0020] Figure 3 It is a partial cross-sectional side view of the protective frame of the present invention;

[0021] Figure 4 This is a schematic diagram of the protective frame of the present invention being buckled onto the processor body;

[0022] Figure 5 Schematic diagram of the positional relationship between the opening and the copper pillar of the present invention;

[0023] Figure 6 This is a schematic diagram of the connection between the heat sink and the protective frame of the present invention.

[0024] In the figure: 1. Processor body; 2. Pin; 3. Protective frame; 4. Abutment part; 5. Abutment column; 6. Snap-fit part; 7. Snap-fit plate; 8. Docking block; 9. Plug column; 10. Abutment plate; 11. Magnetic block; 12. Protrusion; 13. Recess; 14. Chamfer; 15. Elastic arc plate; 16. Abutment end; 17. Extension plate; 18. Opening; 19. Copper column; 20. Heat sink; 21. Socket; 22. Insert rod. DETAILED DESCRIPTION

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] Example 1: Please refer to Figure 1 - Figure 3 The illustrated high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication includes a processor body 1, with pins 2 provided on both sides of the processor body 1, a protective frame 3, the processor body 1 is placed in the protective frame 3, and abutment portions 4 are provided on both sides of the protective frame 3, which are used to limit the pins 2, as well as abutment columns 5 fixed on both sides of the protective frame 3, which are in contact with the outer side of the processor body 1, and a buckle portion 6, which locks the processor body 1 in the protective frame 3.

[0027] In this solution, the unmounted processor body 1 is placed in the protective frame 3, and the abutting portion 4 and the snap-fitting portion 6 are used to position the processor body 1 and protect the pins 2. After the processor body 1 is welded and installed, the protective frame 3 is buckled onto the outside of the processor body 1. In addition to protecting the pins 2 after welding, it can also fit together with the outside of the processor body 1 to help dissipate heat.

[0028] For further information, see Figure 1 - Figure 4 The fastening portion 6 includes a fastening plate 7, docking blocks 8 are fixed at the four corners of the protective frame 3, and pins 9 are fixed at both ends of the fastening plate 7 to be plugged into the docking blocks 8. The fastening plate 7 is provided with a plate 10 that abuts against the outer side of the processor body 1, and a magnetic block 11 that is magnetically attracted to the abutting column 5 is fixed on the fastening plate 7;

[0029] In order to facilitate the docking of the magnetic block 11 and the abutting column 5, a protrusion 12 is fixed on the magnetic block 11, and a notch 13 is opened in the abutting column 5;

[0030] In this solution, after the processor body 1 is placed in the protective frame 3, the personnel connect the plug posts 9 at both ends of the snap-fit plate 7 with the two docking blocks 8, and then after the magnetic block 11 is fitted with the opposing posts 5, the processor body 1 is ensured to be limited.

[0031] It should also be noted that, in order to make the processor body 1 more smoothly placed in the protective frame 3 , a chamfer 14 is provided on the abutting column 5 to facilitate the placement of the processor body 1 .

[0032] For further information, see 2- Figure 4 The abutting portion 4 includes an elastic arc plate 15 fixed on the protective frame 3, and an abutting end 16 is fixed to the bottom of the elastic arc plate 15, and the pin 2 is limited by the abutting end 16;

[0033] In this solution, the elastic arc plate 15 is elastic. When placing the processor body 1 in the protective frame 3, a person can first press the elastic arc plate 15. After the processor body 1 is placed in the protective frame 3, the elastic arc plate 15 itself will expand outward, so that the abutting end 16 abuts against the pin 2. Similarly, when the processor body 1 needs to be removed, it is only necessary to press the elastic arc plate 15 so that the elastic arc plate 15 no longer abuts against the pin 2.

[0034] It should also be noted that in order to prevent damage due to rigid contact when abutting against the pin 2, the abutting end 16 is designed to be made of a flexible material.

[0035] For further information, see Figure 5 , an opening 18 is provided at the bottom of the protective frame 3 , and a copper column 19 adapted to the opening 18 is fixed on the processor body 1 ;

[0036] Also, see Figure 6 In another embodiment of the protective frame 3, a heat sink 20 may be fixed on the outside of the protective frame 3 to assist in heat dissipation;

[0037] In this solution, the principle of heat dissipation for the SIP packaged communication processor body 1 is as follows:

[0038] First, after the processor body 1 is welded and installed, the personnel then buckle the protective frame 3 on the outside of the processor body 1, and plug it into the opening 18 through the copper column 19, and then tighten it with the help of a threaded cap to lock the protective frame 3 in place. After buckling the protective frame 3, the protective frame 3 fits the outside of the processor body 1, and conducts heat through the copper column 19 and the heat sink 20 to achieve a heat dissipation effect.

[0039] Example 2: Please refer to Figure 5 and Figure 6 This embodiment further explains the first embodiment, and the difference lies in optimizing the adjustment method of the elastic arc plate 15.

[0040] Specifically, the spacing between one docking block 8 and its two adjacent docking blocks 8 is consistent, and extension plates 17 are fixed on both sides of the elastic arc plate 15. At the same time, to facilitate the passage of the magnetic block 11, the width of the magnetic block 11 is designed to be smaller than the spacing between adjacent pins 2.

[0041] At the same time, a plug hole 21 is opened at the bottom of the protection frame 3, and an insert rod 22 is inserted into the inner thread of the plug hole 21. The elastic arc plate 15 is pressed to fit with the pin 2 through the insert rod 22.

[0042] It should be noted that, since the spacing between one docking block 8 and its two adjacent docking blocks 8 is consistent, when pressing the elastic arc plate 15, the personnel only need to insert the plug 9 into the docking block 8 and then press down. The elastic arc plate 15 can be pressed by squeezing the extension plate 17, thereby achieving the detachment of the pin 2, making it easier for the personnel to remove the processor body 1;

[0043] After the protective frame 3 is outside the processor body 1, personnel can insert the rod 22 and use the rod 22 to press against the inner side of the elastic arc plate 15, so that the elastic arc plate 15 fits with the pin 2, which can conduct the heat on the pin 2 and achieve a heat dissipation effect, while also protecting the pin 2.

[0044] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0045] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. Highly airtight SIP frequency conversion devices suitable for RF microwave communications, including: A processor body (1), with pins (2) provided on both sides of the processor body (1); It is characterized by further comprising: A protective frame (3), wherein both sides of the protective frame (3) are provided with abutment portions (4), and the abutment portions (4) are used to achieve abutment limiting of the pins (2), and; Abutment columns (5) fixed on both sides of the protective frame (3), the abutment columns (5) being in contact with the outer side of the processor body (1), and; A snap-fit portion (6), the snap-fit portion (6) includes a snap-fit plate (7), docking blocks (8) are fixed at the four corners of the protective frame (3), plug posts (9) plugged into the docking blocks (8) are fixed at both ends of the snap-fit plate (7), and abutment plates (10) abutting against the outer side of the processor body (1) are provided on the snap-fit plate (7), a magnetic block (11) magnetically attracted to the abutment posts (5) is fixed on the snap-fit plate (7), and the abutment portion (4) includes an elastic arc plate (15) fixed on the protective frame (3), and an abutment end (16) is fixed to the bottom of the elastic arc plate (15); When the processor body (1) is not welded, the unmounted processor body (1) is placed in the protective frame (3), and the processor body (1) is locked in the protective frame (3) by means of the abutting portion (4) and the snap-fit portion (6), thereby achieving positioning of the processor body (1) and protection of the pins, and limiting the pins (2) by the abutting end (16); After the processor body (1) is welded and installed, the protective frame (3) is buckled onto the outside of the processor body (1) and can fit closely with the processor body (1) to dissipate heat from its pins.

2. The high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication according to claim 1, characterized in that: A protrusion (12) is fixed on the magnetic block (11), and a recess (13) is provided in the abutting column (5).

3. The high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication according to claim 1, characterized in that: The abutting columns (5) are provided with chamfers (14) for facilitating the placement of the processor body (1).

4. The high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication according to claim 1, characterized in that: The spacing between one of the docking blocks (8) and its two adjacent docking blocks (8) is consistent, and extension plates (17) are fixed on both sides of the elastic arc plate (15).

5. The high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication according to claim 1, characterized in that: An opening (18) is provided at the bottom of the protective frame (3), and a copper column (19) adapted to the opening (18) is fixed on the processor body (1).

6. The high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication according to claim 1, characterized in that: After the processor body (1) is welded and installed, the inner side of the bottom of the protective frame (3) fits the outer side of the processor body (1), and a heat sink (20) is fixed to the outer side of the protective frame (3).

7. The high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication according to claim 1, characterized in that: The bottom of the protective frame (3) is provided with a socket (21), and a plug rod (22) is inserted into the inner thread of the socket (21). When the processor body (1) is not welded, the plug rod (22) squeezes the elastic arc plate (15) to fit with the pin (2).

8. The high-airtightness SIP frequency conversion device suitable for radio frequency microwave communication according to claim 1, characterized in that: The width of the magnetic block (11) is smaller than the spacing between adjacent pins (2).

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