Electronic equipment

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a circuit board assembly. The cover body assembly and the circuit board assembly are arranged in a spaced mode, and a first containing cavity is defined by the cover body assembly and the circuit board assembly; the loudspeaker assembly is arranged in the first accommodating cavity and divides the first accommodating cavity into a first cavity located between the loudspeaker assembly and the cover body assembly and a sound outlet channel at least partially located between the loudspeaker assembly and the circuit board assembly; the sound outlet channel is communicated with the first cavity; and the fan assembly is arranged on the cover body assembly, the fan assembly is provided with an air channel, and the air channel is communicated with the first cavity and the sound outlet channel.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to an electronic device. Background Art

[0002] With the continuous development of electronic devices, the heat dissipation methods of electronic devices have received extensive attention. As the core heat-generating component of an electronic device, the heat dissipation effect of a circuit board assembly has a great impact on the performance of the electronic device.

[0003] In the related art, a first bracket and a second bracket are sequentially arranged on one side of the circuit board assembly, and an air duct is formed by enclosing the first bracket and the second bracket. One end of the air duct has an air inlet, and the other end has an air outlet. A fan is installed at the position of the air inlet.

[0004] However, for the above heat dissipation method, it is necessary to form a heat dissipation air duct through the first bracket and the second bracket, which occupies a relatively large internal space of the electronic device and is not conducive to improving the internal space utilization rate of the electronic device. Summary of the Invention

[0005] This application discloses an electronic device to solve the problem in the related art that the heat dissipation air duct occupies a relatively large internal space of the electronic device and is not conducive to improving the internal space utilization rate of the electronic device.

[0006] To solve the above technical problems, this application is implemented as follows:

[0007] This application discloses an electronic device, which includes a circuit board assembly; a cover body assembly, which is spaced from the circuit board assembly and encloses a first accommodation cavity with the circuit board assembly; a speaker assembly, which is arranged in the first accommodation cavity and divides the first accommodation cavity into a first chamber between the speaker assembly and the cover body assembly and a sound outlet channel at least partially between the speaker assembly and the circuit board assembly, and the sound outlet channel communicates with the first chamber; a fan assembly, which is arranged on the cover body assembly, and the fan assembly has an air duct, and the air duct communicates the first chamber and the sound outlet channel.

[0008] In this application, the circuit board assembly and the cover assembly are arranged at intervals, and a first accommodation cavity is formed by enclosing the circuit board assembly and the cover assembly. The speaker assembly is arranged in the first accommodation cavity. The speaker assembly can divide the first accommodation cavity into a first chamber located between the speaker assembly and the cover assembly and a sound outlet channel at least partially located between the speaker assembly and the circuit board assembly. The sound outlet channel communicates with the first chamber, and the sound emitted by the speaker assembly can be transmitted out of the electronic device through the first chamber and the sound outlet channel. The fan assembly is arranged on the cover assembly, and an air duct is arranged in the fan assembly. The air duct communicates the first chamber and the sound outlet channel. The airflow outside the electronic device can enter the first chamber or the sound outlet channel through the air duct and flow to the sound outlet channel between the speaker assembly and the circuit board assembly, taking away the heat dissipated by the circuit board assembly (various functional devices are arranged on the circuit board assembly) to cool the circuit board assembly. Through the above arrangement, the sound outlet channel can be used as an air duct to dissipate heat from the circuit board assembly, and there is no need to additionally arrange other channels for cooling the circuit board assembly inside the electronic device, which helps to improve the space utilization rate of the electronic device.

[0009] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, wherein:

[0011] Figure 1 shows an exploded view of the electronic device described in the embodiment of the present application;

[0012] Figure 2 shows a cross-sectional view of the electronic device described in the embodiment of the present application;

[0013] Figure 3 shows a schematic diagram of the sound direction of the electronic device described in the embodiment of the present application;

[0014] Figure 4 shows a schematic diagram of the airflow direction of the electronic device described in the embodiment of the present application;

[0015] Figure 5 shows a schematic diagram of the structure of the air inlet assembly described in the embodiment of the present application;

[0016] Figure 6 shows a schematic diagram of the structure of the fan body described in the embodiment of the present application;

[0017] Figure 7 shows a schematic diagram of the structure of the first accommodation cavity described in the embodiment of the present application;

[0018] Figure 8Schematic diagram showing the position of the sound outlet in the embodiments of the present application;

[0019] Figure 9 Indicates Figure 8 Partial enlarged view A of

[0020] Reference numerals:

[0021] 10: Circuit board assembly; 11: Circuit board; 12: Heat source chip;

[0022] 20: Cover assembly; 21: Decorative ring assembly; 22: Lens;

[0023] 30: Speaker assembly;

[0024] 40: Sound outlet channel; 41: First sub - sound outlet channel; 42: Second sub - sound outlet channel; 43: Third sub - sound outlet channel; 44: Fourth sub - sound outlet channel; 45: Sound outlet;

[0025] 50: Fan assembly; 51: Air duct; 52: Fan body; 521: Second sub - air duct; 522: Fan cavity; 523: First air inlet; 524: First air outlet; 525: Piezoelectric ceramic; 526: Housing; 527: Second air outlet; 528: Dust filter; 53: Air inlet assembly; 531: First sub - air duct;

[0026] 60: First accommodation cavity; 62: Second accommodation cavity;

[0027] 70: Main board bracket. Detailed implementation manners

[0028] Hereinafter, embodiments of the present invention will be described in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application.

[0029] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects. The character " / " generally represents an "or" relationship between the associated objects before and after.

[0030] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] Reference Figure 1 , showing an exploded view of the electronic device described in the embodiment of the present application; referring to Figure 2 , showing a cross-sectional view of the electronic device described in the embodiment of the present application; referring to Figure 3 , which shows a schematic diagram of the sound direction of the electronic device described in the embodiment of the present application; referring to Figure 4 , which shows a schematic diagram of the airflow direction of the electronic device described in the embodiment of the present application; Figure 5 , showing a schematic diagram of the structure of the air inlet assembly described in the embodiment of the present application; referring to Figure 6 , showing a schematic structural diagram of the fan body described in the embodiment of the present application; referring to Figure 7 , showing a schematic diagram of the structure of the first accommodating cavity in an embodiment of the present application; referring to Figure 8 , showing a schematic diagram of the position of the sound outlet in the embodiment of the present application; referring to Figure 9 , showing Figure 8 A is a partial enlarged view of the

[0033] like Figures 1 to 9As shown in the figure, an embodiment of the present application discloses an electronic device, which includes a circuit board assembly 10; a cover assembly 20, the cover assembly 20 is disposed at an interval from the circuit board assembly 10, and encloses a first accommodation cavity 60 with the circuit board assembly 10; a speaker assembly 30, the speaker assembly 30 is disposed in the first accommodation cavity 60, and divides the first accommodation cavity 60 into a first chamber located between the speaker assembly 30 and the cover assembly 20 and a sound outlet channel 40 at least partially located between the speaker assembly 30 and the circuit board assembly 10; a fan assembly 50, the fan assembly 50 is disposed on the cover assembly 20, and the fan assembly 50 has an air duct 51, and the air duct 51 communicates the first chamber and the sound outlet channel 40.

[0034] An embodiment of the present application discloses an electronic device, which can be a mobile phone, a tablet computer, or a watch. In the embodiment of the present application, there are no excessive restrictions on the specific type of the electronic device. In actual applications, technicians can set it according to needs.

[0035] Hereinafter, taking the electronic device as a mobile phone as an example, relevant descriptions of the embodiments of the present application will be made.

[0036] As Figures 1 to 9 shown, the electronic device disclosed in the embodiment of the present application includes a circuit board assembly 10 and a cover assembly 20. The cover assembly 20 is disposed at an interval from the circuit board assembly 10, and the cover assembly 20 and the circuit board assembly 10 enclose a first accommodation cavity 60. Among them, the cover assembly 20 includes the rear cover of the mobile phone.

[0037] The circuit board assembly 10 in the embodiment of the present application is a heat-generating component of the electronic device. During the operation of the circuit board assembly 10, a large amount of heat is dissipated, and the circuit board assembly 10 needs to be heat-dissipated to ensure the reliability of the circuit board assembly 10. Exemplarily, the circuit board assembly 10 includes a circuit board 11 and a heat source chip 12 connected to the circuit board 11. During the operation of the heat source chip 12, a large amount of heat is dissipated, and it is the main heat-generating component of the electronic device, and it needs to be heat-dissipated.

[0038] As Figures 1 to 9As shown in the figure, the electronic device disclosed in the embodiment of the present application further includes a speaker assembly 30. The speaker assembly 30 is an electro-acoustic transducer that can convert an electrical audio signal into corresponding sound. The speaker assembly 30 is disposed in the first accommodation cavity 60. The first accommodation cavity 60 is divided by the speaker assembly 30 into a first chamber located between the speaker assembly 30 and the cover assembly 20 and a sound outlet channel 40 at least partially located between the speaker assembly 30 and the circuit board assembly 10. Exemplarily, the sound outlet channel 40 includes a second sub-sound outlet channel 42 located between the speaker assembly 30 and the circuit board assembly 10, a third sub-sound outlet channel 43 located on one side of the speaker assembly 30 and communicating between the second sub-sound outlet channel 42 and the first chamber, and a fourth sub-sound outlet channel 44 located on the other side of the speaker assembly 30 and communicating between the second sub-sound outlet channel 43 and the sound outlet 45. The sound emitted by the speaker assembly 30 can be transmitted to the outside of the electronic device through the first chamber, the third sub-sound outlet channel 43, the second sub-sound outlet channel 42, the fourth sub-sound outlet channel 44, and the sound outlet 45.

[0039] It should be noted that the first chamber in the embodiment of the present application is the front chamber of the speaker assembly 30. The rear chamber of the speaker assembly 30 is located between the speaker assembly 30 and the second sub-sound outlet channel 42 and needs to be set separately.

[0040] Exemplarily, the electronic device may include a main board bracket 70. A part of the main board bracket 70 extends into the first accommodation cavity 60. The speaker assembly 30 is connected to the main board bracket 70, and a rear chamber of the speaker assembly 30 is formed by enclosing with the main board bracket 70. The speaker assembly 30 is fixed by the main board bracket 70 so that the speaker assembly 30 can be disposed in the first accommodation cavity 60 and there is a gap between the speaker assembly 30 and the inner wall of the first accommodation cavity 60 to form a first chamber, that is, the front chamber of the speaker assembly 30, located between the speaker assembly 30 and the cover assembly 20. The third sub-sound outlet channel 43 located on one side of the speaker assembly 30, the second sub-sound outlet channel 42 located between the speaker assembly 30 and the circuit board assembly 10, and the fourth sub-sound outlet channel 44 located on the other side of the speaker assembly 30. The third sub-sound outlet channel 43 communicates the first chamber and the second sub-sound outlet channel 42, and the second sub-sound outlet channel 42 communicates the third sub-sound outlet channel 43 and the fourth sub-sound outlet channel 44. The sound emitted by the speaker assembly 30 can be transmitted to the outside of the electronic device through the first chamber, the third sub-sound outlet channel 43, the second sub-sound outlet channel 42, and the fourth sub-sound outlet channel 44.

[0041] The electronic device disclosed in the embodiments of the present application further includes a fan assembly 50, and the fan assembly 50 is disposed on the cover assembly 20. The fan assembly 50 has an air duct 51, and the air duct 51 communicates with the first chamber and the sound outlet passage 40. The air flow outside the electronic device can enter the first chamber or the sound outlet passage 40 through the air duct 51, and flow to the sound outlet passage 40 between the speaker assembly 30 and the circuit board assembly 10, taking away the heat dissipated from the circuit board assembly 10 and cooling the circuit board assembly 10. Through the above settings, the sound outlet passage 40 can be used as an air duct to dissipate heat from the circuit board assembly 10, and there is no need to additionally provide other channels for cooling the circuit board assembly 10 in the electronic device, which helps to improve the space utilization rate of the electronic device.

[0042] In the embodiments of the present application, the circuit board assembly 10 and the cover assembly 20 are spaced apart, and a first accommodation cavity 60 is formed by enclosing the circuit board assembly 10 and the cover assembly 20. The speaker assembly 30 is disposed in the first accommodation cavity 60. The speaker assembly 30 can divide the first accommodation cavity 60 into a first chamber between the speaker assembly 30 and the cover assembly 20 and a sound outlet passage 40 at least partially between the speaker assembly 30 and the circuit board assembly 10. The sound outlet passage 40 communicates with the first chamber, and the sound emitted by the speaker assembly 30 can be transmitted out of the electronic device from the first chamber and the sound outlet passage 40. The fan assembly 50 is disposed on the cover assembly 20, and an air duct 51 is provided in the fan assembly 50. The air duct 51 communicates with the first chamber and the sound outlet passage 40. The air flow outside the electronic device can enter the first chamber or the sound outlet passage 40 through the air duct 51, and flow to the sound outlet passage 40 between the speaker assembly 30 and the circuit board assembly 10, taking away the heat dissipated from the circuit board assembly 10 and cooling the circuit board assembly 10. Through the above settings, the sound outlet passage 40 can be used as an air duct to dissipate heat from the circuit board assembly 10, and there is no need to additionally provide other channels for cooling the circuit board assembly 10 in the electronic device, which helps to improve the space utilization rate of the electronic device.

[0043] As an optional implementation manner, as Figure 3 , Figure 4 , Figure 8 and Figure 9 shown, the cover assembly 20 in the embodiments of the present application includes a decorative ring assembly 21 and a lens 22. The decorative ring assembly 21 and the lens 22 are spaced apart to form a sound outlet 45; the sound outlet passage 40 further includes a fourth sub-sound outlet passage 44. The fourth sub-sound outlet passage 44 is located on one side of the speaker assembly 30, and the fourth sub-sound outlet passage 44 communicates between the first chamber and the sound outlet 45.

[0044] As Figure 3 , Figure 4 , Figure 8 and Figure 9As shown, in the embodiment of the present application, the decorative ring assembly 21 and the lens 22 are both embedded in the cover assembly 20, and the decorative ring assembly 21 and the lens 22 are arranged at intervals. The gap between the decorative ring assembly 21 and the lens 22 serves as the sound outlet 45. The sound outlet 45 communicates between the outside of the electronic device and the fourth sub-sound outlet channel 44 to transmit the sound waves and air flow in the fourth sub-sound outlet channel 44 to the outside of the electronic device.

[0045] It should be noted that the fourth sub-sound outlet channel 44 in the embodiment of the present application is arranged on the side away from the speaker assembly 30. It can be understood that the four sides of the speaker assembly 30 respectively have a first sub-sound outlet channel 41, a third sub-sound outlet channel 43, a second sub-sound outlet channel 42, and a fourth sub-sound outlet channel 44. Among them, the first sub-sound outlet channel 41 is the first chamber, the second sub-sound outlet channel 42 is located between the speaker assembly 30 and the circuit board assembly 10, the third sub-sound outlet channel 43 is located on the other side of the speaker assembly 30 away from the fourth sub-sound outlet channel 44, and the third sub-sound outlet channel 43 communicates with the first chamber and the second sub-sound outlet channel 42, and the fourth sub-sound outlet channel 44 communicates with the second sub-sound outlet channel 42 and the sound outlet 45.

[0046] In the embodiment of the present application, the arrangement of the fourth sub-sound outlet channel 44 and the sound outlet 45 enables the sound waves emitted by the speaker assembly 30 to flow through the first chamber, the third sub-sound outlet channel 43, the second sub-sound outlet channel 42, the fourth sub-sound outlet channel 44, and the sound outlet 45 to reach the outside of the electronic device. Moreover, the air flow entering from the air duct 51 of the fan assembly 50 can enter the third sub-sound outlet channel 43, the second sub-sound outlet channel 42, the fourth sub-sound outlet channel 44, and the sound outlet 45 from the air duct 51 and flow to the outside of the electronic device. During the flow of the air flow, it can take away the heat generated by the circuit board assembly 10 and cool the circuit board assembly 10. That is to say, the sound waves and the air flow share the sound outlet channel 40, which helps to improve the space utilization rate of the electronic device.

[0047] As an optional implementation manner, as Figure 3 and Figure 4 shown, the sound outlet channel 40 in the embodiment of the present application further includes a first sub-sound outlet channel 41, a second sub-sound outlet channel 42, and a third sub-sound outlet channel 43. Among them, the first sub-sound outlet channel 41 is the first chamber, the second sub-sound outlet channel 42 is located between the speaker assembly 30 and the circuit board assembly 10, and the third sub-sound outlet channel 43 is located on the other side of the speaker assembly 30 away from the fourth sub-sound outlet channel 44; the third sub-sound outlet channel 43 communicates with the first sub-sound outlet channel 41 and the second sub-sound outlet channel 42, and the fourth sub-sound outlet channel 44 communicates with the second sub-sound outlet channel 42 and the sound outlet 45.

[0048] In the embodiment of the present application, the speaker assembly 30 is disposed in the first accommodation cavity 60, and the speaker assembly 30 is spaced apart from both the cover body assembly 20 and the circuit board assembly 10. It can be understood that the speaker assembly 30 is not connected to the inner wall of the first accommodation cavity 60, and there are gaps between each side surface of the speaker assembly 30 and the inner wall of the first accommodation cavity 60. The speaker assembly 30 can divide the first accommodation cavity 60 into a first chamber between the speaker assembly 30 and the cover body assembly 20, which is the first sub-sound outlet channel 41, a third sub-sound outlet channel 43 on one side of the speaker assembly 30, a second sub-sound outlet channel 42 between the speaker assembly 30 and the circuit board assembly 10, and a fourth sub-sound outlet channel 44 on the side of the speaker assembly 30 away from the third sub-sound outlet channel 43. The third sub-sound outlet channel 43 communicates with the first sub-sound outlet channel 41 and the second sub-sound outlet channel 42, and the second sub-sound outlet channel 42 communicates with the third sub-sound outlet channel 43 and the fourth sub-sound outlet channel 44.

[0049] As Figure 3 and Figure 4 shown, the sound outlet channel 40 in the embodiment of the present application includes a first sub-sound outlet channel 41 between the speaker assembly 30 and the cover body assembly 20, a second sub-sound outlet channel 42 between the speaker assembly 30 and the circuit board assembly 10, a third sub-sound outlet channel 43 on one side of the speaker assembly 30 and connected between the first sub-sound outlet channel 41 and the second sub-sound outlet channel 42, and a fourth sub-sound outlet channel 44 on the other side of the speaker assembly 30 and connected between the second sub-sound outlet channel 42 and the sound outlet 45. The sound outlet 45 communicates between the fourth sub-sound outlet channel 44 and the outside of the electronic device.

[0050] In the embodiment of the present application, the propagation route of the sound wave emitted by the speaker assembly 30 is that the sound wave is emitted from the speaker assembly 30, propagates to the first sub-sound outlet channel 41, propagates from the first sub-sound outlet channel 41 to the third sub-sound outlet channel 43, propagates from the third sub-sound outlet channel 43 to the second sub-sound outlet channel 42, then propagates from the second sub-sound outlet channel 42 to the fourth sub-sound outlet channel 44, and finally propagates from the fourth sub-sound outlet channel 44 through the sound outlet 45 to the outside of the electronic device.

[0051] In the embodiment of the present application, the fan assembly 50 has an air duct 51, which communicates between the outside of the electronic device and the third sub-sound outlet channel 43. The airflow outside the electronic device can enter the third sub-sound outlet channel 43 through the air duct 51, and then flow through the second sub-sound outlet channel 42 and the fourth sub-sound outlet channel 44 from the third sub-sound outlet channel 43, and flow out from the sound outlet 45. During the process of the airflow flowing, the heat dissipated by the circuit board assembly 10 can be taken away to dissipate heat from the circuit board assembly 10. That is to say, the third sub-sound outlet channel 43, the second sub-sound outlet channel 42, and the fourth sub-sound outlet channel 44 can be used as air ducts to dissipate heat from the circuit board assembly 10, without additionally arranging an air duct for cooling the circuit board assembly 10 inside the electronic device, which helps to improve the space utilization rate of the electronic device.

[0052] Furthermore, in the embodiment of the present application, dissipating heat from the electronic device through the fan assembly 50 helps to improve the heat dissipation effect of the electronic device. The airflow delivered by the fan assembly 50 flows through the second sub-sound outlet channel 42 on one side of the circuit board assembly 10, which can effectively dissipate heat from the circuit board assembly 10 actively. Moreover, the heat transfer path between the circuit board assembly 10 and the second sub-sound outlet channel 42 is short, which helps to improve the heat dissipation efficiency of the circuit board assembly 10. In addition, the second sub-sound outlet channel 42 is disposed opposite to the circuit board assembly 10, and the airflow flowing through the second sub-sound outlet channel 42 can dissipate heat from the heat sources at different positions of the circuit board assembly 10, which helps to further improve the heat dissipation efficiency of the circuit board assembly 10.

[0053] As an optional implementation manner, as Figures 1 to 9 shown, the cover assembly 20 in the embodiment of the present application includes a decorative ring assembly 21, and the fan assembly 50 is embedded in the decorative ring assembly 21; the fan assembly 50 includes a fan body 52 and an air inlet assembly 53 connected to the fan body 52. At least a part of the fan body 52 extends into the third sub-sound outlet channel 43, and the air inlet assembly 53 is disposed on the side of the fan body 52 away from the third sub-sound outlet channel 43.

[0054] As Figures 1 to 9 shown, the cover assembly 20 in the embodiment of the present application can be the back cover of a mobile phone. The cover assembly 20 includes a decorative ring assembly 21, and the decorative ring assembly 21 can be the decorative ring of the rear camera of the mobile phone. The rear camera of the mobile phone is decorated through the decorative ring assembly 21 to improve the appearance of the electronic device.

[0055] In the embodiment of the present application, the fan assembly 50 is embedded in the decorative ring assembly 21, and the fan assembly 50 is fixed by the decorative ring assembly 21. Among them, the fan assembly 50 is a micro fan, which is a device used for heat dissipation inside an electronic device. The micro fan is usually a DC fan. The micro fan generates an air flow by rotating, thereby reducing the temperature inside the electronic device and preventing the instability of the electronic device or hardware damage caused by overheating.

[0056] The fan assembly 50 in the embodiment of the present application includes a fan body 52 and an air inlet assembly 53, and the air inlet assembly 53 is connected to the fan body 52. As Figure 6 shown, the air inlet assembly 53 can be snap-fitted to the outer periphery of the fan body 52. The air inlet assembly 53 can also be detachably connected to the fan body 52 by bolts. In the embodiment of the present application, there are no excessive restrictions on the specific connection method between the air inlet assembly 53 and the fan body 52. In actual applications, technicians can set it according to needs.

[0057] Among them, at least part of the fan body 52 extends into the third sub-sound outlet channel 43, and the air inlet assembly 53 is arranged on the side of the fan body 52 away from the third sub-sound outlet channel 43. It can be understood that at least part of the fan body 52 extends into the third sub-sound outlet channel 43, and the air inlet assembly 53 is arranged on the side of the fan body 52 away from the third sub-sound outlet channel 43. Through the above settings, the air flow outside the electronic device can enter the fan body 52 through the air inlet assembly 53, and the fan body 52 rotates to transmit the air flow into the third sub-sound outlet channel 43. The air flow entering the third sub-sound outlet channel 43 flows through the second sub-sound outlet channel 42 to dissipate heat from the circuit board assembly 10.

[0058] Furthermore, the settings of the fan body 52 and the air inlet assembly 53 in the embodiment of the present application enable the air flow outside the electronic device to flow into the electronic device faster, which helps to further improve the heat dissipation efficiency of the electronic device.

[0059] As an optional implementation manner, as Figure 6 shown, a first sub-air duct 531 is provided on the air inlet assembly 53 in the embodiment of the present application, and the first sub-air duct 531 communicates with the outside of the electronic device; a second sub-air duct 521 is provided on the fan body 52, and the second sub-air duct 521 communicates between the first sub-air duct 531 and the third sub-sound outlet channel 43.

[0060] As Figure 6 shown, in the embodiment of the present application, a first sub-air duct 531 is provided on the air inlet assembly 53, and a second sub-air duct 521 is provided on the fan body 52. The first sub-air duct 531 communicates between the outside of the electronic device and the second sub-air duct 521, and the second sub-air duct 521 communicates between the first sub-air duct 531 and the third sub-sound outlet channel 43.

[0061] The airflow outside the electronic device flows through the first sub-air duct 531 into the second sub-air duct 521, and then flows from the second sub-air duct 521 into the third sub-sound output channel 43. The airflow entering the third sub-sound output channel 43 flows through the second sub-sound output channel 42, takes away the heat dissipated by the circuit board assembly 10, and flows through the fourth sub-sound output channel 44 and flows out through the sound output port 45 to dissipate heat from the electronic device.

[0062] In the embodiment of the present application, the settings of the first sub-air duct 531 and the second sub-air duct 521 enable the airflow outside the electronic device to quickly enter the electronic device to dissipate heat from the circuit board assembly 10, thereby improving the heat dissipation efficiency of the electronic device.

[0063] As an alternative embodiment, as Figure 6 shown, the fan body 52 in the embodiment of the present application includes a fan cavity 522. The fan cavity 522 is spaced apart from the air inlet assembly 53. The fan cavity 522 has a first air inlet 523 and a first air outlet 524. The first air inlet 523 communicates with the first sub-air duct 531, and the first air outlet 524 communicates with the third sub-sound output channel 43; a piezoelectric ceramic 525, the piezoelectric ceramic 525 is connected to the fan cavity 522, and the piezoelectric ceramic 525 is used to suck the airflow entering from the first sub-air duct 531 into the first air inlet 523 and discharge it from the first air outlet 524.

[0064] As Figure 6 shown, the fan body 52 disclosed in the embodiment of the present application includes a fan cavity 522 and a piezoelectric ceramic 525. Among them, the fan cavity 522 is spaced apart from the air inlet assembly 53. A cavity is provided inside the fan cavity 522. The fan cavity 522 has a first air inlet 523 and a first air outlet 524. The first air inlet 523 is located on the side of the fan cavity 522 close to the air inlet assembly 53, and the first air outlet 524 is located on the side of the fan cavity 522 far from the air inlet assembly 53. The first sub-air duct 531 communicates between the outside of the electronic device and the first air inlet 523, and the first air outlet 524 communicates between the first air inlet 523 and the third sub-sound output channel 43.

[0065] The piezoelectric ceramic 525 in the embodiment of the present application is connected to the fan cavity 522 and is located on the side of the fan cavity 522 close to the air inlet assembly 53. The airflow enters the air inlet assembly 53 through the first sub-air duct 531. Under the high-frequency vibration of the piezoelectric ceramic 525, the airflow then enters the fan cavity 522 from the first air inlet 523 and flows out from the first air outlet 524 and enters the third sub-sound output channel 43 and reaches the inside of the electronic device to dissipate heat from the circuit board assembly 10.

[0066] It should be noted that the piezoelectric ceramic 525 in the embodiments of the present application is a functional ceramic material capable of converting mechanical energy and electrical energy into each other. The working principle of the piezoelectric ceramic 525 is based on the piezoelectric effect. When an electric field or mechanical stress is applied to the piezoelectric ceramic 525, its lattice structure will undergo a slight deformation, thereby causing an uneven charge distribution. This uneven charge distribution forms an internal electric field, which in turn causes the piezoelectric ceramic 525 to undergo mechanical displacement or acoustic vibration.

[0067] In the embodiments of the present application, the piezoelectric ceramic 525 is connected to the fan cavity 522. The airflow entering through the air inlet assembly 53 is sucked into the fan cavity 522 by the piezoelectric ceramic 525 and discharged from the fan cavity 522 into the third sub-sound outlet channel 43. This is to increase the circulation speed of the airflow, thereby improving the heat dissipation efficiency of the electronic device.

[0068] As an alternative implementation, as Figure 6 shown, the fan body 52 in the embodiments of the present application further includes a housing 526. The housing 526 is spaced apart from the air inlet assembly 53, and the housing 526 and the air inlet assembly 53 enclose a second accommodation cavity 62. The fan cavity 522 and the piezoelectric ceramic 525 are disposed in the second accommodation cavity 62. The fan cavity 522 is connected to the side wall of the second accommodation cavity 62, and the piezoelectric ceramic 525 is connected to the side of the fan cavity 522 close to the air inlet assembly 53. A second air outlet 527 is provided on the housing 526, and the second air outlet 527 communicates between the first air outlet 524 and the third sub-sound outlet channel 43.

[0069] As Figure 6 shown, the housing 526 and the air inlet assembly 53 in the embodiments of the present application are spaced apart, and the second accommodation cavity 62 is formed by enclosing the housing 526 and the air inlet assembly 53. The fan cavity 522 and the piezoelectric ceramic 525 are disposed in the second accommodation cavity 62 and are connected to the inner wall of the second accommodation cavity 62. The piezoelectric ceramic 525 is connected to the side of the fan cavity 522 close to the air inlet assembly 53. Exemplarily, a boss is provided on the inner wall of the housing 526, the fan cavity 522 is connected to the boss, and the piezoelectric ceramic 525 is connected to the side of the fan cavity 522 close to the air inlet assembly 53.

[0070] In the embodiments of the present application, the housing 526 and the air inlet assembly 53 are spaced apart to form a second accommodation cavity 62 by enclosing the housing 526 and the air inlet assembly 53. The airflow entering the air inlet assembly 53 can enter the second accommodation cavity 62. The fan cavity 522 and the piezoelectric ceramic 525 are disposed in the second accommodation cavity 62, and the fan cavity 522 is connected to the inner wall of the second accommodation cavity 62. The piezoelectric ceramic 525 can suck the airflow in the second accommodation cavity 62 into the fan cavity 522 through the first air inlet 523 and discharge it from the first air outlet 524. A second air outlet 527 is provided on the housing 526, and the airflow discharged from the first air outlet 524 can enter the third sub-sound outlet channel 43 from the second air outlet 527. Through the above arrangement, the circulation speed of the airflow can be increased, which helps to improve the heat dissipation efficiency of the electronic device.

[0071] As an alternative embodiment, as Figure 6 shown, the fan body 52 in the embodiments of the present application further includes a dust-proof net 528. The dust-proof net 528 is disposed between the air inlet assembly 53 and the housing 526, and the dust-proof net 528 and the housing 526 enclose the second accommodation cavity 62.

[0072] The dust-proof net 528 in the embodiments of the present application is connected to the housing 526. The dust-proof net 528 and the housing 526 enclose the second accommodation cavity 62. The fan cavity 522 and the piezoelectric ceramic 525 are disposed in the second accommodation cavity 62, and the fan cavity 522 is connected to the inner wall of the second accommodation cavity 62. The air inlet assembly 53 is disposed on the side of the dust-proof net 528 away from the housing 526. The airflow entering the air inlet assembly 53 passes through the dust-proof net 528 and enters the second accommodation cavity 62. The piezoelectric ceramic 525 can suck the airflow in the second accommodation cavity 62 into the fan cavity 522 through the first air inlet 523 and discharge it from the first air outlet 524. A second air outlet 527 is provided on the housing 526, and the airflow discharged from the first air outlet 524 can enter the third sub-sound outlet channel 43 from the second air outlet 527.

[0073] The air inlet assembly 53 in the embodiments of the present application is disposed on the side of the dust-proof net 528 away from the housing 526. The airflow entering the air inlet assembly 53 is filtered by the dust-proof net 528 to prevent large dust from entering the interior of the electronic device and causing damage to the electronic device.

[0074] As an alternative embodiment, as Figure 5 shown, the present application embodiments include multiple first sub-air ducts 531, and the multiple first sub-air ducts 531 are spaced apart on the air inlet assembly 53.

[0075] As Figure 5As shown in the figure, in the embodiment of the present application, a plurality of first sub-air ducts 531 are provided on the air inlet assembly 53, and the plurality of first sub-air ducts 531 are arranged at intervals. The air flow outside the electronic device can enter the interior of the electronic device through the plurality of first sub-air ducts 531, which helps to increase the circulation speed of the air flow and improve the heat dissipation effect of the electronic device.

[0076] Exemplarily, the first sub-air ducts 531 include multiple groups, and the multiple groups of first sub-air ducts 531 are arranged at intervals along the radial direction of the air inlet assembly 53. Each group of first sub-air ducts 531 includes a plurality of first sub-air ducts 531, and the plurality of first sub-air ducts 531 are arranged at intervals along the circumferential direction of the air inlet assembly 53. Through the above settings, the air flow entering the interior of the electronic device is more uniform and gentle.

[0077] Of course, the above are only individual examples of the specific setting methods of the first sub-air ducts 531 and do not limit the present application. In actual applications, those skilled in the art can also set the specific arrangement methods of the multiple first sub-air ducts 531 according to needs.

[0078] As an alternative embodiment, as Figures 2 to 4 shown, the circuit board assembly 10 in the embodiment of the present application includes a circuit board 11 and a heat source chip 12. The circuit board 11 is arranged at intervals from the cover body assembly 20 and encloses a first accommodation cavity 60 with the cover body assembly 20; the heat source chip 12 is connected to the side of the circuit board 11 away from the cover body assembly 20.

[0079] As Figures 2 to 4 shown, the circuit board assembly 10 in the embodiment of the present application includes a circuit board 11 and a heat source chip 12. The circuit board 11 and the cover body assembly 20 are arranged at intervals to enclose a first accommodation cavity 60 through the circuit board 11 and the cover body assembly 20. The heat source chip 12 is connected to the side of the circuit board 11 away from the cover body assembly 20. The heat dissipated by the heat source chip 12 can be transferred to the first accommodation cavity 60 through the circuit board 11.

[0080] The speaker assembly 30 in the embodiment of the present application is arranged in the first accommodation cavity 60 to divide the first accommodation cavity 60 into a first chamber located between the speaker assembly 30 and the cover body assembly 20 and an out-sound channel 40 at least partially located between the speaker assembly 30 and the circuit board assembly 10. The out-sound channel 40 communicates with the first chamber, and the sound waves emitted by the speaker assembly 30 can be transmitted to the outside of the electronic device through the first chamber and the out-sound channel 40. The out-sound channel 40 also communicates with the air duct 51 of the fan assembly 50. The air flow enters the interior of the electronic device through the air duct 51 and flows through the out-sound channel 40 to take away the heat dissipated by the heat source chip 12, reduce the temperature of the heat source chip 12, and improve the stability of the heat source chip 12.

[0081] Furthermore, the heat transfer path between the heat source chip 12 and the sound outlet channel 40 is short, which helps to improve the heat dissipation efficiency of the circuit board assembly 10. Moreover, the sound outlet channel 40 is disposed opposite to the circuit board 11, and the airflow flowing through the sound outlet channel 40 can directly dissipate heat from the heat source chips 12 disposed at different positions on the circuit board 11, thereby further helping to improve the heat dissipation efficiency of the circuit board assembly 10.

[0082] An embodiment of the present application discloses an electronic device, which includes a circuit board assembly; a cover body assembly spaced apart from the circuit board assembly and enclosing a first accommodation cavity with the circuit board assembly; a speaker assembly disposed in the first accommodation cavity and dividing the first accommodation cavity into a first chamber between the speaker assembly and the cover body assembly and a sound outlet channel at least partially between the speaker assembly and the circuit board assembly, the sound outlet channel communicating with the first chamber; and a fan assembly disposed on the cover body assembly, the fan assembly having an air duct communicating the first chamber and the sound outlet channel.

[0083] In the embodiment of the present application, the circuit board assembly and the cover body assembly are spaced apart, and the first accommodation cavity is formed by enclosing the circuit board assembly and the cover body assembly. The speaker assembly is disposed in the first accommodation cavity. The speaker assembly can divide the first accommodation cavity into a first chamber between the speaker assembly and the cover body assembly and a sound outlet channel at least partially between the speaker assembly and the circuit board assembly. The sound outlet channel communicates with the first chamber, and the sound emitted by the speaker assembly can be transmitted out of the electronic device through the first chamber and the sound outlet channel. The fan assembly is disposed on the cover body assembly, and an air duct is provided in the fan assembly. The air duct communicates the first chamber and the sound outlet channel. The airflow outside the electronic device can enter the first chamber or the sound outlet channel through the air duct and flow to the sound outlet channel between the speaker assembly and the circuit board assembly to take away the heat dissipated from the circuit board assembly and cool the circuit board assembly. Through the above arrangement, the sound outlet channel can be used as an air duct to dissipate heat from the circuit board assembly, and there is no need to additionally provide other channels for cooling the circuit board assembly in the electronic device, thereby helping to improve the space utilization rate of the electronic device.

[0084] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0085] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: Circuit board assembly (10); a cover assembly (20), the cover assembly (20) being spaced apart from the circuit board assembly (10) and enclosing the cover assembly (20) and the circuit board assembly (10) to form a first accommodating cavity (60); A speaker assembly (30), wherein the speaker assembly (30) is disposed in the first accommodating cavity (60), and the first accommodating cavity (60) is divided into a first chamber located between the speaker assembly (30) and the cover assembly (20) and a sound outlet channel (40) at least partially located between the speaker assembly (30) and the circuit board assembly (10), and the sound outlet channel (40) is connected to the first chamber; A fan assembly (50), wherein the fan assembly (50) is arranged on the cover assembly (20), and the fan assembly (50) has an air duct (51), wherein the air duct (51) communicates with the first chamber and the sound outlet channel (40).

2. The electronic device according to claim 1, characterized in that: The cover assembly (20) comprises a decorative ring assembly (21) and a lens (22), wherein the decorative ring assembly (21) and the lens (22) are arranged at an interval to form a sound outlet (45); The sound output channel (40) further comprises a fourth sub-sound output channel (44), wherein the fourth sub-sound output channel (44) is located on one side of the speaker assembly (30), and the fourth sub-sound output channel (44) is connected between the first chamber and the sound outlet (45).

3. The electronic device according to claim 2, characterized in that: The sound output channel (40) further comprises a first sub-sound output channel (41), a second sub-sound output channel (42) and a third sub-sound output channel (43), wherein: The first sub-sound output channel (41) is the first chamber, the second sub-sound output channel (42) is located between the speaker assembly (30) and the circuit board assembly (10), and the third sub-sound output channel (43) is located on the other side of the speaker assembly (30) away from the fourth sub-sound output channel (44); The third sub-sound output channel (43) is connected to the first sub-sound output channel (41) and the second sub-sound output channel (42), and the fourth sub-sound output channel (44) is connected to the second sub-sound output channel (42) and the sound outlet (45).

4. The electronic device according to claim 3, characterized in that: The cover assembly (20) comprises a decorative ring assembly (21), and the fan assembly (50) is embedded in the decorative ring assembly (21); The fan assembly (50) comprises a fan body (52) and an air inlet assembly (53) connected to the fan body (52); the fan body (52) at least partially extends into the third sub-sound outlet channel (43); and the air inlet assembly (53) is arranged on a side of the fan body (52) away from the third sub-sound outlet channel (43).

5. The electronic device according to claim 4, characterized in that: The air inlet assembly (53) is provided with a first sub-air duct (531), and the first sub-air duct (531) is connected to the outside of the electronic device; The fan body (52) is provided with a second sub-air duct (521), and the second sub-air duct (521) is connected between the first sub-air duct (531) and the third sub-sound outlet channel (43).

6. The electronic device according to claim 5, characterized in that: The fan body (52) comprises a fan cavity (522), the fan cavity (522) is spaced apart from the air inlet assembly (53), the fan cavity (522) has a first air inlet (523) and a first air outlet (524), the first air inlet (523) is connected to the first sub-air duct (531), and the first air outlet (524) is connected to the third sub-sound outlet channel (43); A piezoelectric ceramic (525), wherein the piezoelectric ceramic (525) is connected to the fan cavity (522), and the piezoelectric ceramic (525) is used to suck the airflow entering the first sub-air duct (531) into the first air inlet (523) and discharge it from the first air outlet (524).

7. The electronic device according to claim 6, characterized in that: The fan body (52) further comprises a shell (526), ​​wherein the shell (526) and the air inlet assembly (53) are spaced apart from each other, and the shell (526) and the air inlet assembly (53) are enclosed to form a second accommodating chamber (62); The fan cavity (522) and the piezoelectric ceramic (525) are arranged in the second accommodating cavity (62), the fan cavity (522) is connected to the side wall of the second accommodating cavity (62), and the piezoelectric ceramic (525) is connected to a side of the fan cavity (522) close to the air inlet component (53); The shell (526) is provided with a second air outlet (527), and the second air outlet (527) is connected between the first air outlet (524) and the third sub-sound outlet channel (43).

8. The electronic device according to claim 7, characterized in that: The fan body (52) further comprises a dustproof net (528), wherein the dustproof net (528) is arranged between the air inlet assembly (53) and the shell (526), ​​and the dustproof net (528) and the shell (526) are combined to form the second accommodating cavity (62).

9. The electronic device according to claim 5, characterized in that: The first sub-air duct (531) comprises a plurality of first sub-air ducts (531), and the plurality of first sub-air ducts (531) are arranged at intervals on the air inlet assembly (53).

10. The electronic device according to claim 1, characterized in that: The circuit board assembly (10) comprises a circuit board (11) and a heat source chip (12); the circuit board (11) is spaced apart from the cover assembly (20) and encloses the cover assembly (20) to form a first accommodating cavity (60); The heat source chip (12) is connected to a side of the circuit board (11) away from the cover assembly (20).

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