Molding die, resin molding device, and method for manufacturing resin molded article

Abstract

The invention provides a forming die capable of realizing low cost. A molding die includes one of the dies, and another die having a cavity in which a release film is disposed, the other die including a main surface member and a side surface member, the side surface member including: a first suction portion formed on a first facing surface facing the one of the dies and configured to suck the release film, and a second suction portion formed on a second facing surface facing the one of the dies and configured to suck the release film; a second adsorption part which is formed on the first facing surface and is closer to the cavity side than the first adsorption part, and which adsorbs the release film; and a suction path for sucking air from the first adsorption unit and the second adsorption unit, the suction path being branched into a first branch path in which one end side in the air flow direction is connected to a suction device and the other end side is connected to the first adsorption unit, and a second branch path in which the other end side is connected to the second adsorption unit. The second branch path is connected to the second suction unit, and the minimum cross-sectional area of the cross-section of the second branch path is smaller than the minimum cross-sectional area of the cross-section of the first branch path.

Description

Technical Field

[0001] The present invention relates to a technology of a forming die, a resin molding apparatus, and a method for manufacturing a resin molded product. Background Art

[0002] In Patent Document 1, a forming die provided with a release film for easily taking out a resin molded product is disclosed. An outer peripheral adsorption groove, a main adsorption groove, and a through hole for adsorbing the release film are formed in the forming die described in Patent Document 1. Specifically, in the forming die described in Patent Document 1, an outer peripheral adsorption groove and a main adsorption groove capable of adsorbing and holding the release film are formed outside the mold cavity. Further, in the forming die described in Patent Document 1, a through hole capable of adsorbing and holding the release film is formed inside the mold cavity (between the circumferential member and the bottom member). A vacuum pump is connected to the outer peripheral adsorption groove, the main adsorption groove, and the through hole of the forming die via an on-off valve, respectively, and is configured to be capable of performing suction independently.

[0003] In the forming die configured as described above, first, the release film is adsorbed by the outer peripheral adsorption groove formed on the outermost side, and the release film is fixed to the surface of the forming die. Next, the release film is adsorbed by the main adsorption groove formed more inside than the outer peripheral adsorption groove, and tension is applied to the release film. After that, the release film is adsorbed by using the through hole formed inside the mold cavity, so that the release film is adsorbed along the shape of the mold cavity. By adsorbing the release film step by step in this way, wrinkles or slack of the release film can be prevented.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2017-35832 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] Here, in a forming die capable of adsorbing a release film step by step using a plurality of adsorption grooves or the like as described in Patent Document 1, a plurality of parts such as an on-off valve are required for performing suction step by step, and the cost increases.

[0009] The present invention has been made in view of the above situation, and the problem to be solved is to provide a forming die, a resin molding apparatus, and a method for manufacturing a resin molded product capable of achieving cost reduction.

[0010] Technical Means for Solving the Problems

[0011] The problem to be solved by the present invention is as described above. To solve the above problems, the forming die of the present invention includes one die, and another die disposed opposite to the one die and having a die cavity for disposing a release film. The another die includes a main surface member forming the main surface of the die cavity and a side surface member forming the side surface of the die cavity. The side surface member includes: a first adsorption portion formed on a first facing surface facing the one die for adsorbing the release film; a second adsorption portion formed on the first facing surface closer to the die cavity side than the first adsorption portion for adsorbing the release film; and a suction path for sucking air from the first adsorption portion and the second adsorption portion. The suction path is branched into a first branch path and a second branch path. One end side in the air flow direction of the first branch path is connected to a suction device, and the other end side in the air flow direction is connected to the first adsorption portion. The second branch path is connected to the second adsorption portion, and the minimum cross-sectional area of the cross-section orthogonal to the air flow direction in the second branch path is smaller than the minimum cross-sectional area of the cross-section orthogonal to the air flow direction in the first branch path.

[0012] In addition, the resin molding apparatus of the present invention includes the forming die.

[0013] In addition, the method for manufacturing a resin molded product of the present invention is a method for manufacturing a resin molded product using the resin molding apparatus. The method for manufacturing a resin molded product includes: a film disposing step of disposing the release film on the another die; and a resin molding step of performing resin molding using the another die on which the release film is disposed.

[0014] Effects of the Invention

[0015] By the present invention, cost reduction can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a plan view showing the overall structure of the resin molding apparatus according to the first embodiment.

[0017] Figure 2 is a side view showing the structure of the forming module.

[0018] Figure 3 is a plan view showing the lower die.

[0019] Figure 4 is a front sectional view showing the lower die.

[0020] Figure 5 is a bottom view showing the upper side surface member.

[0021] Figure 6 ​​​​​​It is a view obtained by magnifying a part of the front sectional view showing the lower mold.

[0022] Figure 7 It is a front sectional view showing the suction path of air.

[0023] Figure 8 (a) is a sectional view showing the case where the first adsorption part adsorbs the release film. (b) is a sectional view showing the case where the second adsorption part adsorbs the release film. (c) is a sectional view showing the case where the third adsorption part adsorbs the release film.

[0024] Figure 9 It is a front sectional view showing the lower mold of the second embodiment.

[0025] Figure 10 It is a plan view showing the lower mold of the third embodiment.

[0026] Figure 11 (a) is a front sectional view showing the lower mold of the fourth embodiment. (b) is a front sectional view showing the lower mold of the fifth embodiment. Detailed Embodiment

[0027] <Overall Structure of Resin Molding Apparatus 1>

[0028] First, Figure 1 the resin molding apparatus 1 of the first embodiment of the present invention will be described. In addition, in the description using Figure 1 , the directions are defined by the arrow X and arrow Y shown in the figure. The resin molding apparatus 1 resin-seals the pre-sealing substrate W1 and manufactures a resin molded product (sealed completed substrate W2). In addition, in the present embodiment, the substrate before resin sealing is referred to as the pre-sealing substrate W1, and the substrate after resin sealing is referred to as the sealed completed substrate W2. Further, in the present embodiment, a resin molding apparatus 1 that performs resin molding by a compression molding method is illustrated.

[0029] The resin molding apparatus 1 includes a substrate supply and storage module 10, a molding module 20, and a material supply module 30 as constituent components. Each constituent component is detachable and replaceable with respect to other constituent components.

[0030] The substrate supply and storage module 10 supplies the pre-sealing substrate W1 to the molding module 20 and stores the sealed completed substrate W2 received from the molding module 20. In addition, as the pre-sealing substrate W1, various other substrates (glass epoxy substrate, ceramic substrate, resin substrate, metal substrate) typified by a lead frame can be used. The substrate supply and storage module 10 mainly includes a pre-sealing substrate supply unit 11, a sealed completed substrate storage unit 12, a substrate placement unit 13, and a substrate transfer mechanism 14. ​​​​​

[0031] The substrate placement unit 13 appropriately transfers the pre-sealing substrate W1 and the sealed substrate W2 between the pre-sealing substrate supply unit 11, the sealed substrate storage unit 12, and the substrate transfer mechanism 14. The substrate placement unit 13 can move in the Y direction within the substrate supply and storage module 10. The pre-sealing substrate supply unit 11 can supply the pre-sealing substrate W1 to the substrate placement unit 13. The sealed substrate storage unit 12 can store the sealed substrate W2 received from the substrate placement unit 13. The substrate transfer mechanism 14 can move in the X direction and the Y direction within the substrate supply and storage module 10 and the molding module 20. The substrate transfer mechanism 14 can appropriately transfer the pre-sealing substrate W1 and the sealed substrate W2 throughout the substrate supply and storage module 10 and the molding module 20.

[0032] The molding module 20 performs resin molding. In the present embodiment, a resin molding apparatus 1 provided with three molding modules 20 is illustrated as an example, but the number of molding modules 20 is not limited to three. The molding module 20 mainly includes a mold clamping mechanism 100 and a molding die 200.

[0033] The molding die 200 includes an upper die 200U (see Figure 2 etc.) and a lower die 200D that can move up and down relative to the upper die 200U. In addition, the upper die 200U and the lower die 200D are respectively one form of implementation of one die and the other die of the present application. A mold cavity C corresponding to the shape of the resin molded product is formed in the lower die 200D. The mold clamping mechanism 100 can perform mold clamping and mold opening of the molding die 200 by moving the lower die 200D up and down. In addition, the more specific structure of the molding module 20 will be described later.

[0034] The material supply module 30 supplies a release film F and a resin material to the molding module 20. The material supply module 30 mainly includes a material placement unit 31, a release film supply mechanism 32, a resin material storage unit 33, a resin material input mechanism 34, and a material transfer mechanism 35.

[0035] The material placement unit 31 can place the release film F and the resin material storage unit 33. The material placement unit 31 can move in the X direction and the Y direction within the material supply module 30. The release film supply mechanism 32 can supply the release film F to the material placement unit 31.

[0036] The resin material storage unit 33 has a substantially frame-like shape and can be integrated with the release film F supplied to the material placement unit 31 to store the resin material supplied from the resin material input mechanism 34. The material transfer mechanism 35 can move in the X direction and the Y direction within the material supply module 30 and the molding module 20. The material transfer mechanism 35 can transfer the integrated release film F, resin material storage unit 33, and resin material to the molding module 20.

[0037] <Method of resin molding using resin molding apparatus 1>

[0038] Hereinafter, an example of a resin molding method using the resin molding apparatus 1 configured as described above will be described.

[0039] The method for manufacturing a resin molded product according to the present embodiment mainly includes a substrate loading process, a film arrangement process, a mold clamping process, a resin molding process, a mold opening process, and an unloading process. Hereinafter, each process will be described in sequence.

[0040] First, in the substrate loading process, the unsealed substrate W1 is loaded into the molding die 200. Specifically, in the substrate loading process, the unsealed substrate W1 is supplied from the unsealed substrate supply unit 11 to the substrate placement unit 13. The substrate transfer mechanism 14 receives the unsealed substrate W1 placed on the substrate placement unit 13 and transfers it to the molding die 200 of the molding module 20.

[0041] Next, in the film arrangement process, the release film F and the resin material are arranged on the molding die 200 (lower molding die 200D). Specifically, in the film arrangement process, the release film F is supplied from the release film supply mechanism 32 to the material placement unit 31. At this time, in the material placement unit 31, the release film F can also be appropriately cut to a specified size. The release film F placed on the material placement unit 31 and the resin material housing unit 33 placed thereon are integrated to form a box shape capable of housing the resin material. The resin material is introduced from the resin material input mechanism 34 into the integrated release film F and resin material housing unit 33, and the release film F and resin material housing unit 33 containing the resin material are placed on the material placement unit 31. The material transfer mechanism 35 receives the release film F and resin material housing unit 33 containing the resin material and moves toward the molding module 20, and arranges the release film F and resin material housing unit 33 containing the resin material on the molding die 200 (lower molding die 200D). Then, as described later, the release film F is held on the lower molding die 200D, and the resin material is supplied to the cavity C of the lower molding die 200D. After the resin material is supplied to the cavity C, the resin material housing unit 33 is removed from the molding die 200 by the material transfer mechanism 35 and returned to the material supply module 30.

[0042] Next, in the mold clamping process, the forming mold 200 is clamped. Specifically, in the mold clamping process, the resin material accommodated in the mold cavity C is heated by a heating mechanism (not shown) provided in the lower mold 200D. Then, driven by the mold clamping mechanism 100, the lower mold 200D rises toward the upper mold 200U. When the lower mold 200D rises to a specified position, the upper surface of the lower mold 200D directly or indirectly contacts the lower surface of the upper mold 200U via the pre-sealing substrate W1, and the mold cavity C formed in the lower mold 200D is blocked from above by the upper mold 200U or the pre-sealing substrate W1. By further pushing up the lower mold 200D in the above state, the resin material accommodated in the lower mold 200D is pressurized.

[0043] Next, in the resin molding process, the resin material is hardened to perform resin molding. Specifically, in the resin molding process, it waits for a specified time in a state where the resin material is pressurized. Thereby, the resin material can be hardened, and the pre-sealing substrate W1 is resin-molded to obtain a resin-molded product (sealed completed substrate W2).

[0044] Next, in the mold opening process, the forming mold 200 is opened. Specifically, in the mold opening process, driven by the mold clamping mechanism 100, the lower mold 200D descends in a manner of separating from the upper mold 200U. Thereby, the forming mold 200 is opened, and it becomes a state where the sealed completed substrate W2 can be taken out.

[0045] Next, in the unloading process, the resin-molded product (sealed completed substrate W2) is unloaded from the forming mold 200. Specifically, in the unloading process, the substrate transfer mechanism 14 receives the sealed completed substrate W2 of the forming mold 200, and transfers the received sealed completed substrate W2 to the substrate placement portion 13 of the substrate supply and storage module 10. The sealed completed substrate storage portion 12 receives the sealed completed substrate W2 from the substrate placement portion 13 and stores the received sealed completed substrate W2.

[0046] In this way, in the resin molding apparatus 1, the pre-sealing substrate W1, the release film F, the resin material, etc. can be supplied to the molding module 20 to perform resin molding. In addition, resin molding can be performed in parallel using a plurality of molding modules 20, so that resin-molded products can be efficiently manufactured. Furthermore, the operations of the respective parts of the resin molding apparatus 1 can be appropriately controlled by a control device (not shown).

[0047] <Structure of the molding module 20>

[0048] Hereinafter, the specific structure of the molding module 20 will be described. As Figure 2 shown, the molding module 20 mainly includes a mold clamping mechanism 100, a forming mold 200, etc.

[0049] The mold clamping mechanism 100 raises and lowers the lower mold 200D to perform mold clamping, mold opening, and the like. The mold clamping mechanism 100 mainly includes a base 101, columns 102, a lower mold base member 103, an upper mold base member 104, a drive mechanism 105, and the like.

[0050] The base 101 supports the forming mold 200 and the like. A plurality of columns 102 are fixed to the base 101. The plurality of columns 102 are arranged to extend upward from the base 101. The lower mold base member 103 is arranged in a manner that can move up and down at the middle part of the columns 102 in the vertical direction. The upper mold base member 104 is fixed to the upper end of the columns 102. In addition, two plate-like members arranged opposite to each other can be provided instead of the columns 102.

[0051] The drive mechanism 105 is used to raise and lower the lower mold 200D. As the drive mechanism 105, a ball screw mechanism, a hydraulic cylinder, a toggle mechanism, etc. can be used. The drive mechanism 105 is arranged between the base 101 and the lower mold base member 103. By vertically expanding and contracting between the base 101 and the lower mold base member 103, the drive mechanism 105 can raise and lower the lower mold base member 103.

[0052] The forming mold 200 includes an upper mold 200U and a lower mold 200D.

[0053] The upper mold 200U has an appropriate thickness in the vertical direction. The lower surface of the upper mold 200U is formed into a flat surface without concavities and convexities. The upper mold 200U is fixed to the bottom surface of the upper mold base member 104. Adsorption holes (not shown) capable of adsorbing the substrate (substrate W1 before sealing and substrate W2 after sealing) are appropriately formed on the lower surface of the upper mold 200U.

[0054] As shown in Figure 2 and Figure 3 shown, the lower mold 200D is arranged on the upper surface of the lower mold base member 103. The upper surface of the lower mold 200D is arranged in a manner that faces the lower surface of the upper mold 200U in the vertical direction. The lower mold 200D mainly includes a main surface member 210, a side surface member 220, and the like.

[0055] The main surface member 210 forms the main surface of the mold cavity C. In the present embodiment, since the main surface member 210 is the lower mold 200D, the main surface is equivalent to the bottom surface. The main surface member 210 is formed into a rectangular shape in a top view. The main surface member 210 is formed to have an appropriate thickness in the vertical direction. The main surface member 210 is arranged in a state of being placed on the upper surface of the lower mold base member 103.

[0056] The side surface member 220 forms the side surface of the mold cavity C and surrounds the main surface member 210 from the side. The side surface member 220 is formed to have an appropriate thickness in the vertical direction. The side surface member 220 mainly includes a hollow portion 221.

[0057] The hollow portion 221 is formed in such a manner as to penetrate vertically through the center of the side member 220. The hollow portion 221 is formed in a rectangular shape in plan view. The hollow portion 221 is formed in a shape that substantially coincides with the outer shape of the main surface member 210 in plan view.

[0058] In this way, the side member 220 is formed in a frame shape with a rectangular shape in plan view. The main surface member 210 is disposed in the hollow portion 221 of the side member 220. The side member 220 is disposed in a state of being placed on the upper surface of the lower mold base member 103 via the elastic member 220a. The elastic member 220a is formed of, for example, a compression coil spring that can expand and contract vertically. The upper surface of the side member 220 is located above the upper surface of the main surface member 210. The portion surrounded by the main surface member 210 and the side member 220 thus configured (above the main surface member 210 and inside the side member 220) forms a mold cavity C for resin molding.

[0059] In addition, as Figure 4 shown, in the present embodiment, the side member 220 is formed by being divided vertically. Specifically, the side member 220 is divided into an upper side member 222 that forms a surface (upper surface) facing the lower surface of the upper mold 200U, and a lower side member 223 disposed below the upper side member 222 (on the side opposite to the upper surface of the upper side member 222 with respect to the upper side member 222). The upper surface and the lower surface of the upper side member 222 are formed in a parallel manner. In addition, the upper side member 222 and the lower side member 223 are respectively one form of implementation of the first side member and the second side member of the present application. Further, the upper surface and the lower surface of the upper side member 222 are respectively one form of implementation of the first facing surface and the second facing surface of the present application. In addition, "parallel" includes not only a strict meaning but also a substantial meaning. Therefore, even when the angle formed by the upper surface and the lower surface is not 0 degrees, when the angle formed by the upper surface and the lower surface is within the range of error, the upper surface and the lower surface are parallel.

[0060] A release film F is disposed on the upper surface of the lower mold 200D thus configured, and a resin material is supplied to a portion corresponding to the mold cavity C above the disposed release film F. Thereafter, the resin material is supplied into the mold cavity C by the release film F being adsorbed to the lower mold 200D. In addition, the unsealed front substrate W1 is adsorbed and held by the upper mold 200U. In this state, the upper mold 200U and the lower mold 200D are clamped by the clamping mechanism 100, and the resin is compression-molded for the unsealed front substrate W1, thereby obtaining a sealed completed substrate W2.

[0061] <Structure of the lower mold 200D>

[0062] Here, it is appropriate to form suction holes and the like for adsorbing and holding the release film F in the lower mold 200D. Hereinafter, the structure of the lower mold 200D for adsorbing the release film F will be specifically described.

[0063] As Figures 3 to 6 shown, in the lower mold 200D, a first adsorption portion 232, an annular recessed portion 234, a second adsorption portion 236, a through hole 238, a connection portion 240, a suction pipe portion 242, a third adsorption portion 244, and a suction hole portion 246 for adsorbing the release film F are provided.

[0064] The first adsorption portion 232 is for adsorbing the release film F to the upper surface of the side member 220. The first adsorption portion 232 mainly includes a first adsorption hole portion 232a.

[0065] The first adsorption hole portion 232a is a through hole formed along the vertical direction in a manner of connecting the upper surface of the side member 220 (upper side member 222) and the annular recessed portion 234. The first adsorption hole portion 232a is formed in a circular shape in plan view. A plurality of first adsorption hole portions 232a are arranged to surround the periphery of the mold cavity C in plan view. The plurality of first adsorption hole portions 232a are formed in a rectangular shape arranged along the shape of the mold cavity C in plan view. The first adsorption hole portions 232a are arranged at substantially equal intervals.

[0066] In addition, the shape of the first adsorption hole portion 232a is not limited to a circular shape and can be formed into any shape. In addition, in the present embodiment, a plurality of first adsorption hole portions 232a are formed such that the intervals between adjacent first adsorption hole portions 232a are substantially constant, but the arrangement of the plurality of first adsorption hole portions 232a is not limited to an equally spaced arrangement. For example, a plurality of first adsorption portions 232 can also be formed at unequal intervals. In addition, for example, a concave portion (groove portion) can also be formed on the upper surface of the side member 220 (upper side member 222) in a manner of connecting the plurality of first adsorption hole portions 232a.

[0067] Figures 4 to 6 The annular recessed portion 234 shown connects the first adsorption hole portion 232a and the suction pipe portion 242. The annular recessed portion 234 is formed below the first adsorption hole portion 232a in the upper side member 222. The annular recessed portion 234 is formed from the middle portion in the vertical direction of the upper side member 222 to the bottom surface of the upper side member 222. The upper end portion of the annular recessed portion 234 is connected to the first adsorption hole portion 232a. The lower end portion of the annular recessed portion 234 is open on the bottom surface of the upper side member 222. Thus, the annular recessed portion 234 is formed in a concave shape having a predetermined depth upward from the bottom surface of the upper side member 222. In a bottom view, the width of the annular recessed portion 234 (the length in the direction perpendicular to the direction in which the annular recessed portion 234 extends) is formed larger than the diameter of the first adsorption hole portion 232a.

[0068] The annular recess 234 is formed in a manner that surrounds the hollow portion 221 (cavity C) without interruption. That is, the annular recess 234 is formed in an endless ring when viewed from above. The annular recess 234 is formed in a manner that extends along the first adsorption hole portion 232a when viewed from above. Thus, the annular recess 234 is formed in a generally rectangular shape when viewed from above. In addition, the annular recess 234 is one form of implementation of the annular portion of the present application.

[0069] Figure 3 , Figure 4 and Figure 6 The second adsorption portion 236 shown is used to adsorb the release film F to the upper surface of the side member 220. The second adsorption portion 236 mainly includes a concave portion 236a.

[0070] The concave portion 236a is a concave portion formed on the upper surface of the side member 220 and closer to the mold cavity C side than the first adsorption portion 232. A plurality of concave portions 236a are formed around the mold cavity C. In the present embodiment, four concave portions 236a are formed along the respective sides of the mold cavity C which is formed into a rectangular shape when viewed from above. The concave portions 236a are formed into a straight line parallel to the respective sides of the mold cavity C. In addition, as mentioned above, "parallel" not only includes a strict meaning but also a substantial meaning. The four concave portions 236a are formed at appropriate intervals so as not to be connected to each other. The concave portion 236a is formed into a V-shape that is inclined downward toward the center when viewed in cross section in the long side direction.

[0071] In addition, the shape of the concave portion 236a is not limited to the V-shape in cross-section, and can be formed into any shape. In addition, in the present embodiment, an example is shown in which four concave portions 236a are formed along each side of the cavity C, but any number of concave portions 236a can be formed at any position.

[0072] Figures 3 to 6 The through hole 238 shown connects the concave portion 236a and the connecting portion 240. The through hole 238 is formed along the up-down direction. The through hole 238 is formed in a circular shape when viewed from above. The through hole 238 is formed on the inner side of the concave portion 236a when viewed from above. A plurality of through holes 238 are formed in each concave portion 236a. The upper end of the through hole 238 is connected to the concave portion 236a. The lower end of the through hole 238 is open on the bottom surface of the upper side member 222. In addition, the through hole 238 is a form of implementation of the second path of the present application.

[0073] Figures 4 to 6The connecting portion 240 shown connects the annular recess 234 and the through hole 238. The connecting portion 240 is formed in a concave shape on the bottom surface of the upper side member 222. The connecting portion 240 is formed in a manner extending from each through hole 238 toward the outside (the side opposite to the cavity C). Thus, one end of the connecting portion 240 is connected to the lower end of the through hole 238. In addition, the other end of the connecting portion 240 is connected to the lower end of the annular recess 234. In other words, the connecting portion 240 is formed in a manner extending from the annular recess 234 toward the inside (the main surface member 210 side). The connecting portion 240 is formed in a substantially rectangular shape when viewed in a cross section along the long side direction (the direction in which the connecting portion 240 extends). The connecting portion 240 is formed in a manner in which the cross-sectional area on the plane perpendicular to the air flow path becomes relatively small to restrict the air flow path. Specifically, the cross-sectional area of ​​the connection portion 240 is formed smaller than the cross-sectional area of ​​the through hole 238. In addition, the cross-sectional area of ​​the connection portion 240 is formed smaller than the cross-sectional area of ​​the first adsorption hole portion 232a. In addition, the connection portion 240 is one form of implementation of the first path of the present application.

[0074] The suction pipe portion 242 is used to suck air from the first adsorption portion 232 and the second adsorption portion 236. The suction pipe portion 242 is formed into a substantially circular tubular shape. The suction pipe portion 242 is arranged so as to penetrate the lower side member 223 in an up-and-down direction with the long side direction oriented in the up-and-down direction. The upper end surface of the suction pipe portion 242 is arranged so as to be in the same position (coplanar) as the upper surface of the lower side member 223. A plurality of suction pipe portions 242 are arranged below the annular recess 234. In this embodiment, as shown in FIG. Figure 5 , an example is shown in which four suction pipes 242 are arranged corresponding to the sides of the substantially rectangular annular recess 234. By arranging the suction pipes 242 in this way, the upper end of the suction pipes 242 is connected to the lower end of the annular recess 234.

[0075] In the present embodiment, the air suction path is formed by providing the suction pipe portion 242 on the lower side member 223 . However, for example, the air suction path may be formed by forming a through hole in the lower side member 223 instead of the suction pipe portion 242 .

[0076] Figure 3 , Figure 4 and Figure 6 The third adsorption portion 244 shown is used to adsorb the release film F to the cavity C. The third adsorption portion 244 is formed by the gap between the outer side surface of the main surface member 210 and the inner side surface (hollow portion 221) of the side member 220. Between the main surface member 210 and the side member 220, a gap is formed in a manner that covers the entire circumference of the main surface member 210 when viewed from above. Thus, the third adsorption portion 244 is formed in an endless ring shape as if surrounding the cavity C when viewed from above.

[0077] Figure 4 and Figure 6 The suction hole portion 246 shown is used to suck air from the third adsorption portion 244. The suction hole portion 246 is formed in the main surface member 210. One end portion of the suction hole portion 246 is open on the outer side surface of the main surface member 210. The other end portion of the suction hole portion 246 is open on the bottom surface of the main surface member 210. A plurality of suction hole portions 246 are formed in the main surface member 210.

[0078] As Figure 6 shown, in the suction pipe portion 242 and the suction hole portion 246, a suction device 250 such as a vacuum pump is connected via a suitably formed air flow path. A first on-off valve 252 capable of switching the air flowability is provided between the suction device 250 and the suction pipe portion 242. In addition, a second on-off valve 254 capable of switching the air flowability is provided between the suction device 250 and the suction hole portion 246. In a state where the suction device 250 is operated to suck air, the first on-off valve 252 and the second on-off valve 254 are respectively opened and closed, whereby air can be arbitrarily sucked from the first adsorption portion 232, the second adsorption portion 236, and the third adsorption portion 244, and the release film F can be adsorbed.

[0079] <Structure of the suction path>

[0080] Thus, in the present embodiment, by sucking air via the suction pipe portion 242, air can be sucked from the first adsorption portion 232 and the second adsorption portion 236 to adsorb the release film F. Hereinafter, the air suction path via the suction pipe portion 242 will be described.

[0081] As Figure 6 and Figure 7 shown, when the first on-off valve 252 is opened and air is sucked via the suction pipe portion 242, air is sucked via the annular concave portion 234 and the first adsorption portion 232 (the first adsorption hole portion 232a), so that the release film F can be adsorbed to the upper surface of the side member 220. In addition, when air is sucked via the suction pipe portion 242, air is sucked via the connecting portion 240 connected to the lower end portion of the annular concave portion 234 and the through hole 238, so that the release film F can be adsorbed to the upper surface of the second adsorption portion 236 (the concave portion 236a).

[0082] Hereinafter, for the purpose of explanation, as Figure 7As shown, the portion where the air sucked through the annular recess 234 merges with the air sucked through the connecting portion 240 (in other words, the portion where the suction path of the air from the suction pipe portion 242 branches into the annular recess 234 and the connecting portion 240) is called the branch point P. In the present embodiment, since the connecting portion 240 is connected to the lower end portion of the annular recess 234, the lower end portion of the annular recess 234 (the upper end portion of the suction pipe portion 242) corresponds to the branch point P.

[0083] In addition, the air suction path from the suction device 250 to the branch point P is called the main path L. In addition, the air suction path from the branch point P to the upper end portion of the first adsorption portion 232 (the first adsorption hole portion 232a) is called the first branch path L1. In addition, the air suction path from the branch point P to the upper end portion of the through hole 238 is called the second branch path L2.

[0084] Here, hereinafter, the smallest cross-sectional area among the cross-sectional areas of the cross-sections orthogonal to the air flow direction in the first branch path L1 is called the minimum cross-sectional area A1. In the present embodiment, the first branch path L1 includes the annular recess 234 and a plurality of first adsorption hole portions 232a connected to the annular recess 234 (see Figure 5 etc.). That is, the first branch path L1 further branches from the annular recess 234 into a plurality of first adsorption hole portions 232a. When the first branch path L1 branches in this way, the sum of the cross-sectional areas of the branched paths is set as the cross-sectional area of the first branch path L1. In the present embodiment, the cross-sectional area of the first adsorption hole portion 232a in the cross-sectional area of the first branch path L1 (the sum of the cross-sectional areas of the plurality of first adsorption hole portions 232a) is the minimum cross-sectional area A1. That is, in the present embodiment, "minimum cross-sectional area A1 = cross-sectional area of the first adsorption hole portion 232a × number of the first adsorption hole portions 232a" holds. In addition, in Figure 7 , for the sake of easy explanation, the minimum cross-sectional area A1 is shown using one first adsorption hole portion 232a, but actually the sum of the cross-sectional areas of all the first adsorption hole portions 232a is the minimum cross-sectional area A1.

[0085] In addition, in the present embodiment, it is assumed that the cross-sectional area of the first adsorption hole portion 232a in the cross-sectional area of the first branch path L1 becomes the minimum cross-sectional area A1, but the minimum cross-sectional area A1 of the present invention is not limited to the cross-sectional area of the first adsorption hole portion 232a. For example, when the sum of the cross-sectional areas of the first adsorption hole portions 232a is larger than the cross-sectional area of the annular recess 234, the cross-sectional area of the annular recess 234 becomes the minimum cross-sectional area A1. That is, the portion with the smallest cross-sectional area is determined according to the shape of the first branch path L1 and is not particularly limited.

[0086] In addition, hereinafter, the smallest cross-sectional area among the cross-sectional areas of the cross-sections orthogonal to the air flow direction in the second branch path L2 is referred to as the minimum cross-sectional area A2. In the present embodiment, the second branch path L2 includes the connecting portion 240 and the through hole 238. The connecting portion 240 and the through hole 238 are formed in such a manner that a plurality of them branch from the annular recess 234 (refer to Figure 5 etc.), so a plurality of second branch paths L2 are formed. In the case where a plurality of second branch paths L2 are formed in this way, the sum of the cross-sectional areas of the plurality of second branch paths L2 is defined as the cross-sectional area of the second branch path L2. In the present embodiment, the cross-sectional area of the connecting portion 240 (the sum of the cross-sectional areas of the plurality of connecting portions 240) in the cross-sectional area of the second branch path L2 is the minimum cross-sectional area A2. That is, in the present embodiment, "minimum cross-sectional area A2 = cross-sectional area of the connecting portion 240 × number of the connecting portions 240" holds. In addition, in Figure 7 , for the sake of easy explanation, the minimum cross-sectional area A2 is shown using one connecting portion 240, but actually the sum of the cross-sectional areas of all the connecting portions 240 is the minimum cross-sectional area A2.

[0087] In addition, in the present embodiment, it is assumed that the cross-sectional area of the connecting portion 240 in the cross-sectional area of the second branch path L2 becomes the minimum cross-sectional area A2, but the minimum cross-sectional area A2 of the present invention is not limited to the cross-sectional area of the connecting portion 240 in the cross-sectional area of the second branch path L2. That is, similar to the minimum cross-sectional area A1 of the first branch path L1, the portion with the smallest cross-sectional area is determined according to the shape of the second branch path L2 and is not particularly limited.

[0088] In the present embodiment, it is configured such that the minimum cross-sectional area A2 of the second branch path L2 is smaller than the minimum cross-sectional area A1 of the first branch path L1. That is, in the present embodiment, the minimum cross-sectional area A1 etc. are set in such a manner that "minimum cross-sectional area A2 < minimum cross-sectional area A1" is satisfied. By configuring in this way, the flow resistance of the air flowing in the second branch path L2 is greater than the flow resistance of the air flowing in the first branch path L1. When sucking air through the suction pipe portion 242, air is preferentially sucked from the first branch path L1 rather than the second branch path L2. Thus, in the present embodiment, the release film F can be adsorbed to the side member 220 step by step.

[0089] <Adsorption of the release film F>

[0090] Hereinafter, Figure 8 etc. are used to describe the situation where the release film F is adsorbed to the lower mold 200D configured as described above in the film placement process. In addition, in the present embodiment, actually, as described above, a resin material is mounted on the release film F, but the resin material is omitted in the following figures and descriptions.

[0091] First, as shown in Figure 8 (a), when the release film F is disposed on the lower mold 200D, the suction device 250 (refer to Figure 6 ) operates, and the second on-off valve 254 remains closed while only the first on-off valve 252 is open. Thus, air is sucked through the suction pipe portion 242 (main path L).

[0092] When sucking air through the suction pipe portion 242, air is preferentially sucked from the first branch path L1 having a larger minimum cross-sectional area among the first branch path L1 and the second branch path L2. Particularly in the present embodiment, the first branch path L1 is formed on the extension line of the suction path of the air sucked through the suction pipe portion 242 (main path L) (vertically above the suction pipe portion 242). Therefore, compared with the second branch path L2, it is easier to preferentially suck air from the first branch path L1. Thus, air is sucked through the first adsorption hole portion 232a, and the release film F is adsorbed to the upper surface of the side member 220.

[0093] When further continuing to suck air through the suction pipe portion 242 (main path L) in the above state, as shown in Figure 8 (b), air is also sucked from the second branch path L2 having a smaller minimum cross-sectional area among the first branch path L1 and the second branch path L2. Particularly after the release film F is adsorbed by the first adsorption hole portion 232a, the first adsorption hole portion 232a is blocked by the release film F, and thus the suction force (negative pressure) applied to the second branch path L2 becomes higher. Thus, air is sucked through the through hole 238, and the release film F is adsorbed to the concave portion 236a. In this way, in the present embodiment, the timing of sucking air through the first branch path L1 and the timing of sucking air through the second branch path L2 can be staggered. By pulling the release film F into the concave portion 236a, the release film F can be stretched, and tension is imparted to the release film F.

[0094] Next, as shown in Figure 8 (c), in the state where the first adsorption portion 232 and the second adsorption portion 236 suck air, the second on-off valve 254 (refer to Figure 6 ) is opened. Thus, air is sucked through the suction hole portion 246. When sucking air through the suction hole portion 246, air is sucked from the third adsorption portion 244. Thus, the release film F is adsorbed along the inner surface of the mold cavity C. By pulling the release film F in this way, the release film F can be further stretched, and tension is imparted to the release film F. In addition, actually, at this time, a resin material (not shown) is supplied into the mold cavity C together with the release film F.

[0095] Thus, in the present embodiment, after the release film F is adsorbed by the first adsorption portion 232, the adsorption by the second adsorption portion 236 and the third adsorption portion 244 is performed, thereby applying tension to the release film F. Here, in the present embodiment, air is sucked through the common main path L, whereby air can be sucked through the first branch path L1 and the second branch path L2. By making the air suction paths common in this way, space saving of the suction paths can be achieved. By achieving space saving of the suction paths, for example, it becomes easy to form the first adsorption portion 232 and the second adsorption portion 236 close to the mold cavity C side. Along with this, miniaturization of the size of the release film F is achieved, whereby the usage amount of the release film F can be reduced, and thus reduction of the manufacturing cost of the resin molded product can be realized. In addition, by miniaturization of the size of the release film F and space saving of the suction paths, the outer contour (size) of the molding die 200 observed from above can be reduced, and thus reduction of the material cost can be realized.

[0096] In addition, by making the air suction paths common and reducing the size of the molding die, the volume of the space to be sucked (formed into a vacuum) becomes smaller, so the time until a preset vacuum degree is reached becomes shorter, and the amount of gas discharged from the space until the mold closing is completed becomes larger, so improvement of the molding quality can be realized.

[0097] In addition, in the present embodiment, by setting a difference in the minimum area between the first branch path L1 and the second branch path L2, the adsorption timing of the release film F via the first branch path L1 and the second branch path L2 is made different. Thereby, there is no need to separately provide a mechanism for controlling the air suction for the first branch path L1 and the second branch path L2 (for example, processing of the suction pipe or adsorption piping, on-off valve, etc.), so cost reduction of the resin molding apparatus 1 can be achieved.

[0098] As described above, the first embodiment of the present invention has been described, but the present invention is not limited to the above-described embodiment, and can be appropriately changed within the scope of the technical idea of the invention described in the claims.

[0099] For example, the structure (shape, arrangement, number, etc.) of each part of the resin molding apparatus 1 described in the present embodiment is not particularly limited, and can be arbitrarily changed.

[0100] In addition, in the present embodiment, the substrate (unsealed substrate W1, etc.) is adsorbed and held by the upper mold 200U, but the present invention is not limited to this. For example, it can also be configured to hold the substrate by the lower mold 200D. In such a case, the resin material can be directly supplied to the substrate.

[0101] In addition, the cross-sectional shape of the adsorption holes (such as the first adsorption hole portion 232a, etc.) for adsorbing the demolding film F or the air suction path is not particularly limited, and can be formed into any shape such as a circular shape, a rectangular shape, a polygonal shape, etc. For example, similar to the annular recess 234, a plurality of through holes 238 can also be connected using a recess that surrounds the mold cavity C. In addition, an annular recess (groove portion) that surrounds the mold cavity C can also be formed instead of the plurality of through holes 238.

[0102] In addition, in the present embodiment, an example is shown in which the first adsorption portion 232 and the second adsorption portion 236 are formed in a rectangular shape arranged along the shape of the mold cavity C in a top view, but the present invention is not limited to this, and they can be arranged in any shape.

[0103] In addition, in the present embodiment, an example is shown in which the suction pipe portion 242 is disposed below the annular recess 234 in such a manner that the first branch path L1 and the main path L overlap vertically in a top view (see Figure 7 ), but the present invention is not limited to this. That is, as long as the minimum cross-sectional area A2 of the second branch path L2 is formed to be smaller than the minimum cross-sectional area A1 of the first branch path L1, the shapes or positional relationships of the main path L, the first branch path L1, and the second branch path L2 are not particularly limited.

[0104] In addition, in the present embodiment, an example is shown in which the first branch path L1 and the second branch path L2 are formed on the upper side member 222, but the present invention is not limited to this, and a part of the first branch path L1 and the second branch path L2 can also be formed on the lower side member 223.

[0105] In addition, in the present embodiment, an example is shown in which the side member 220 is divided into two upper and lower parts (the upper side member 222 and the lower side member 223), but the present invention is not limited to this. For example, the side member 220 can also be divided into three or more parts, or can be formed as an integral member without division.

[0106] In addition, in the present embodiment, the forming die 200 having a rectangular shape in a top view is taken as an example for description, but the shape of the forming die 200 is not limited to this. For example, a forming die 200 having any shape such as a circular shape in a top view can be used.

[0107] In addition, the shape of the demolding film F used in the present embodiment is not particularly limited. As the demolding film F, for example, a demolding film F having a rectangular shape, a circular shape, etc. can be used. In addition, the shape of the demolding film F can also be appropriately selected according to the shapes of the forming die 200, the mold cavity C, etc.

[0108] In addition, the material of the release film F used in the present embodiment is not particularly limited. As the release film F, for example, a resin film, a metal foil, a rubber sheet, etc., or a composite thereof can be used.

[0109] In addition, in the present embodiment, an example in which the resin material and the release film F are transported to the lower mold 200D together has been described, but the present invention is not limited thereto, and the release film F and the resin material can be transported to the lower mold 200D separately.

[0110] In addition, in the present embodiment, an example in which the release film F is adsorbed and held on the lower mold 200D has been described, but the present invention is not limited thereto, and the release film F can be adsorbed and held on the upper mold 200U.

[0111] <Second Embodiment>

[0112] Hereinafter, Figure 9 the lower mold 200D of the second embodiment will be described.

[0113] The difference between the lower mold 200D of the second embodiment and that of the first embodiment is that a connection part 240 is formed at a position different from that of the lower mold 200D of the first embodiment (refer to Figure 7 ). Therefore, the following mainly describes the differences, and the same reference numerals are given to the same structures as those of the first embodiment and the description thereof is omitted.

[0114] As Figure 9 shown, the connection part 240 of the second embodiment is formed at the middle part between the upper and lower sides of the upper side member 222 instead of the bottom surface of the upper side member 222. For example, a hole is formed in such a way as to pass through the annular concave part 234 from the outer side surface of the upper side member 222 and reach the through hole 238, whereby the connection part 240 can be formed at such a position. In this case, by blocking the opening formed on the outer side surface of the upper side member 222 with a suitable blocking member 241, airtightness can be ensured. In addition, in the second embodiment, the lower end of the through hole 238 does not need to be formed to the bottom surface of the upper side member 222, and it is sufficient to form from the concave part 236a to the middle part between the upper and lower sides of the upper side member 222 (the position connected to the connection part 240).

[0115] In the second embodiment, the middle part in the vertical direction of the annular concave portion 234 (the portion having the same height as the connecting portion 240) becomes the branch point P. Therefore, in the second embodiment, the air suction path from the suction device 250 to the middle part in the vertical direction of the annular concave portion 234 (branch point P) becomes the main path L. In addition, the air suction path from the middle part in the vertical direction of the annular concave portion 234 (branch point P) to the upper end of the first adsorption portion 232 (first adsorption hole portion 232a) becomes the first branch path L1. In addition, the air suction path from the middle part in the vertical direction of the annular concave portion 234 (branch point P) to the upper end of the through hole 238 becomes the second branch path L2.

[0116] Even in such a case, it is configured such that the minimum cross-sectional area A2 of the second branch path L2 is smaller than the minimum cross-sectional area A1 of the first branch path L1. That is, the minimum cross-sectional area A1, etc. are set in such a way that "minimum cross-sectional area A2 < minimum cross-sectional area A1" is satisfied. By configuring in this way, the flow resistance of the air flowing in the second branch path L2 is greater than the flow resistance of the air flowing in the first branch path L1. When sucking air through the suction pipe portion 242, air is preferentially sucked from the first branch path L1 rather than the second branch path L2. Thus, in this embodiment, the release film F can be adsorbed to the side member 220 step by step.

[0117] <Third Embodiment>

[0118] Hereinafter, Figure 10 the lower mold 200D of the third embodiment will be described.

[0119] The shape of the first adsorption portion 232 of the lower mold 200D in the third embodiment is different from that in the first embodiment (refer to Figure 3 ). Therefore, the following will mainly describe the differences, and the same reference numerals will be given to the other structures that are the same as those in the first embodiment and the description will be omitted.

[0120] As Figure 10As shown, the first adsorption part 232 of the third embodiment includes not only the first adsorption hole part 232a, but also the second adsorption hole part 232b. Similar to the first adsorption part 232, the second adsorption hole part 232b is a through hole formed in the vertical direction so as to connect the upper surface of the side member 220 and the annular concave part 234. The second adsorption hole part 232b is formed so as to extend from one first adsorption hole part 232a to another first adsorption hole part 232a adjacent to the first adsorption hole part 232a in a plan view. In this way, the second adsorption hole part 232b is formed so as to connect adjacent first adsorption hole parts 232a to each other. The width of the second adsorption hole part 232b in a plan view (the length in the direction perpendicular to the direction in which the second adsorption hole part 232b extends to connect adjacent first adsorption hole parts 232a to each other, that is, the width) is formed to be substantially constant. The width of the second adsorption hole part 232b is formed, for example, to be four times or less the thickness of the release film F.

[0121] The width of the second adsorption hole part 232b is formed to be smaller than the width of the first adsorption hole part 232a (the maximum length of the first adsorption hole part 232a in the direction perpendicular to the direction in which the second adsorption hole part 232b extends to connect adjacent first adsorption hole parts 232a to each other; in this embodiment, it is the diameter of the first adsorption hole part 232a). Thus, the first adsorption hole part 232a is formed so as to protrude from the second adsorption hole part 232b to both sides in the width direction of the second adsorption hole part 232b respectively. That is, the first adsorption hole part 232a is formed so as to protrude from the second adsorption hole part 232b to the inner side (the mold cavity C side) and the outer side (the side opposite to the mold cavity C) of the lower mold 200D.

[0122] The first adsorption hole part 232a and the second adsorption hole part 232b are formed so as to be alternately connected in a plan view. In addition, the first adsorption hole part 232a and the second adsorption hole part 232b are formed so as to surround the periphery of the mold cavity C. In this embodiment, the first adsorption hole part 232a and the second adsorption hole part 232b are formed so as to surround the mold cavity C without interruption. That is, the first adsorption hole part 232a and the second adsorption hole part 232b are formed to be an endless ring shape in a plan view, and the first adsorption hole part 232a and the second adsorption hole part 232b are continuously connected and surround the entire periphery of the mold cavity C. In this way, the first adsorption hole part 232a and the second adsorption hole part 232b opened on the upper surface of the side member 220 form adsorption holes for adsorbing the release film F.

[0123] In addition, as described above, the first adsorption hole part 232a, the second adsorption hole part 232b, and the annular concave part 234 (refer to Figure 5)It is formed in such a way that it continuously connects and surrounds the periphery of the cavity C without interruption. Therefore, the upper side member 222 is separated by the first adsorption hole portion 232a etc. into a portion (outer side member 222a) that is more outside and a portion (inner side member 222b) that is more inside when viewed from above with respect to the first adsorption hole portion 232a etc.

[0124] By connecting the first adsorption hole portion 232a using the second adsorption hole portion 232b as in the third embodiment, a wide area of the adsorption holes for adsorbing the release film F can be ensured. Thereby, the minimum cross-sectional area A1 in the first branch path L1 can be enlarged (refer to Figure 7 ). By enlarging the minimum cross-sectional area A1 in the first branch path L1, the difference from the minimum cross-sectional area A2 in the second branch path L2 can be increased. Therefore, the timing of the suction of the air via the first branch path L1 and the suction of the air via the second branch path L2 can be more clearly staggered.

[0125] In addition, by ensuring a wide area of the adsorption holes for adsorbing the release film F as in the third embodiment, the release film F can be firmly held. Thereby, when the release film F is adsorbed using the second adsorption portion 236 or the third adsorption portion 244, the occurrence of poor adsorption (such as wrinkles or sliding) of the release film F can be prevented, and thus the occurrence of poor molding or poor demolding of the resin molded product due to the poor adsorption of the release film F can be prevented. In addition, by connecting the first adsorption hole portion 232a using the second adsorption hole portion 232b with a relatively narrow width, even when the release film F is adsorbed with a relatively large adsorption force, the release film F can be prevented from being pulled into the first adsorption hole portion 232a.

[0126] <Fourth Embodiment, Fifth Embodiment>

[0127] Hereinafter, Figure 11 the lower mold 200D of the fourth embodiment and the fifth embodiment will be described.

[0128] The shape and positional relationship of the main path L, the first branch path L1, and the second branch path L2 of the lower mold 200D of the fourth embodiment and the fifth embodiment are different from those in the first embodiment (refer to Figure 7 ). Therefore, the following mainly describes the differences, and the same reference numerals are given to the other structures that are the same as those in the first embodiment and the description thereof is omitted.

[0129] Figure 11 (a) shows the lower mold 200D of the fourth embodiment. As Figure 11As shown in (a), the suction pipe portion 242 of the fourth embodiment is disposed below the through hole 238 instead of below the annular recess 234. That is, the upper end portion of the suction pipe portion 242 is connected to the lower end portion of the through hole 238. In addition, the lower end portion of the through hole 238 is connected to the lower end portion of the annular recess 234 via the connecting portion 240. Thus, in the fourth embodiment, the lower end portion of the through hole 238 becomes the branch point P.

[0130] In addition, in the fourth embodiment, compared with the first embodiment (refer to Figure 7 ), the sectional area of the connecting portion 240 is formed larger, and the minimum sectional area A2 of the second branch path L2 is formed to be smaller than the minimum sectional area A1 of the first branch path L1. By configuring in this way, when sucking air from the suction pipe portion 242, the first adsorption portion 232 and the second adsorption portion 236 can be used to adsorb the release film F step by step.

[0131] Figure 11 (b) shows the lower mold 200D of the fifth embodiment. As Figure 11 (b) shows, the suction pipe portion 242 of the fifth embodiment is disposed at a position deviated from the annular recess 234 and the through hole 238. The upper end portion of the suction pipe portion 242 is connected to the lower end portion of the annular recess 234 via a recess 248 formed on the bottom surface of the upper side member 222. Further, the lower end portion of the annular recess 234 is connected to the lower end portion of the through hole 238 via the connecting portion 240 in the same manner as in the first embodiment. Thus, in the fifth embodiment, the lower end portion of the annular recess 234 becomes the branch point P.

[0132] In the fifth embodiment, in the same manner as in the first embodiment (refer to Figure 7 ), the minimum sectional area A2 of the second branch path L2 is formed to be smaller than the minimum sectional area A1 of the first branch path L1. By configuring in this way, when sucking air from the suction pipe portion 242, the first adsorption portion 232 and the second adsorption portion 236 can be used to adsorb the release film F step by step.

[0133] <Supplementary Note>

[0134] The molding die 200 according to the first aspect of the present disclosure includes:

[0135] an upper mold 200U (one of the molds), and a lower mold 200D (the other mold) disposed opposite to the upper mold 200U and having a mold cavity C for disposing the release film F. In the molding die 200,

[0136] the lower mold 200D includes a main surface member 210 forming the main surface of the mold cavity C and a side surface member 220 forming the side surface of the mold cavity C.

[0137] The side surface member 220 includes:

[0138] The first adsorption part 232 is formed on a first facing surface facing the upper mold 200U to adsorb the release film F.

[0139] The second adsorption part 236 is formed on the first facing surface closer to the mold cavity C side than the first adsorption part 232 to adsorb the release film F; and

[0140] A suction path (main path L, first branch path L1 and second branch path L2) is used to suck air from the first adsorption part 232 and the second adsorption part 236.

[0141] The suction path is branched into a first branch path L1 and a second branch path L2.

[0142] One end side in the air flow direction of the first branch path L1 is connected to the suction device 250, and the other end side in the air flow direction is connected to the first adsorption part 232. The second branch path L2 is connected to the second adsorption part 236.

[0143] The minimum cross-sectional area A2 of the cross-section orthogonal to the air flow direction in the second branch path L2 is smaller than the minimum cross-sectional area A1 of the cross-section orthogonal to the air flow direction in the first branch path L1.

[0144] With the molding die 200 according to the first aspect of the present disclosure, cost reduction can be achieved. That is, by making the suction paths for sucking air from the first adsorption part 232 and the second adsorption part 236 common, space saving of the suction paths can be achieved. By achieving space saving of the suction paths, the first adsorption part 232 and the second adsorption part 236 can be arranged closer to the mold cavity C side. Along with this, miniaturization of the size of the release film F can be achieved, and thus reduction of the manufacturing cost of the resin molded product can be achieved. In addition, due to the difference in the minimum cross-sectional areas between the first branch path L1 and the second branch path L2, the timing of adsorbing the release film F by the first adsorption part 232 and the second adsorption part 236 can be different. Therefore, there is no need to provide a mechanism (such as processing of the suction pipe or adsorption piping, on-off valve, etc.) for making the adsorption timing different, so cost reduction of the resin molding apparatus 1 can be achieved.

[0145] In the molding die 200 according to the second aspect based on the first aspect,

[0146] The second branch path L2 includes:

[0147] A first path (connection part 240), extending from the branch point P of the first branch path L1 toward the main surface member 210 side; and

[0148] A second path (through-hole 238) extends from the first path toward the first facing surface.

[0149] With the forming die 200 according to the second aspect of the present disclosure, the second branch path L2 can be formed in a bent manner, thereby increasing the flow resistance of the air flowing through the second branch path L2. Thus, it is possible to easily make the timing of adsorbing the release film F using the first adsorption portion 232 and the second adsorption portion 236 different.

[0150] In the forming die 200 according to the third aspect based on the second aspect,

[0151] The side member 220 includes: an upper side member 222 (first side member) having the first facing surface formed thereon; and a lower side member 223 (second side member) disposed on the side opposite to the first facing surface with respect to the upper side member 222.

[0152] The first path (connection portion 240) is formed on the second facing surface of the upper side member 222 that faces the lower side member 223.

[0153] With the forming die 200 according to the third aspect of the present disclosure, the first path (connection portion 240) can be easily formed, and cost reduction of the forming die 200 can be achieved.

[0154] In the forming die 200 according to the fourth aspect based on the first aspect to the third aspect,

[0155] The first branch path L1 includes an annular recess 234 (annular portion) formed in such a manner as to connect and surround the periphery of the mold cavity C when viewed in a direction perpendicular to the first facing surface.

[0156] With the forming die 200 according to the fourth aspect of the present disclosure, the flow resistance of the air flowing through the first branch path L1 can be reduced. Thus, it is possible to easily make the timing of adsorbing the release film F using the first adsorption portion 232 and the second adsorption portion 236 different.

[0157] In the forming die 200 according to the fifth aspect based on the fourth aspect,

[0158] A plurality of the second branch paths L2 are formed.

[0159] The plurality of second branch paths L2 are respectively connected to the annular recess 234.

[0160] With the molding die 200 according to the fifth aspect of the present disclosure, the release film F can be adsorbed more reliably. That is, compared with the minimum cross-sectional area A1 of the first branch path L1, the minimum cross-sectional area A2 of the second branch path L2 is smaller. Therefore, there is a concern that the second branch path L2 may be blocked by dust or the like. However, by forming a plurality of second branch paths L2, even if any one of the second branch paths L2 is blocked by dust or the like, the release film F can be adsorbed through the other second branch paths L2.

[0161] In the molding die 200 according to the sixth aspect based on the first aspect to the fifth aspect,

[0162] The first adsorption portion 232 includes a plurality of first adsorption hole portions 232a and second adsorption hole portions 232b that connect adjacent first adsorption hole portions 232a to each other.

[0163] On the first facing surface, with respect to the length in the direction perpendicular to the direction in which the second adsorption hole portion 232b extends to connect adjacent first adsorption hole portions 232a to each other, the first adsorption hole portion 232a is larger than the second adsorption hole portion 232b.

[0164] With the molding die 200 according to the sixth aspect of the present disclosure, it is easy to ensure a large cross-sectional area of the first adsorption portion 232. Therefore, it is possible to easily make the timing of adsorbing the release film F by the first adsorption portion 232 and the second adsorption portion 236 different. In addition, the release film F can be prevented from being pulled into the first adsorption hole portion 232a by the second adsorption hole portion 232b.

[0165] In the molding die 200 according to the seventh aspect based on the sixth aspect,

[0166] The first adsorption portion 232 is formed so as to connect and surround the periphery of the mold cavity C.

[0167] With the molding die 200 according to the seventh aspect of the present disclosure, the release film F can be firmly held over the entire circumference of the mold cavity C. Thereby, it is possible to effectively prevent poor adsorption of the release film F.

[0168] The resin molding apparatus 1 according to the eighth aspect of the present disclosure includes:

[0169] The molding die 200 according to any one of the first aspect to the seventh aspect.

[0170] With the resin molding apparatus 1 according to the eighth aspect of the present disclosure, cost reduction can be achieved.

[0171] The method for manufacturing a resin molded product according to the ninth aspect of the present disclosure

[0172] is a method for manufacturing a resin molded product using the resin molding apparatus 1 according to the eighth aspect,

[0173] The manufacturing method of the resin molded product includes:

[0174] A film arranging step of arranging the release film F on the lower mold 200D; and

[0175] A resin molding step of performing resin molding using the lower mold 200D on which the release film F is arranged.

[0176] By the manufacturing method of the resin molded product according to the ninth aspect of the present disclosure, cost reduction can be achieved.

[0177] Explanation of reference numerals

[0178] 1: Resin molding device

[0179] 200: Molding die

[0180] 200D: Lower mold

[0181] 200U: Upper mold

[0182] 210: Main surface member

[0183] 220: Side member

[0184] 222: Upper side member

[0185] 223: Lower side member

[0186] 232: First adsorption part

[0187] 232a: First adsorption hole part

[0188] 232b: Second adsorption hole part

[0189] 234: Annular recess

[0190] 236: Second adsorption part

[0191] 238: Through hole

[0192] 240: Connecting part

[0193] 250: Suction device

Claims

1. A forming die includes one die and another die disposed opposite to the one die and having a die cavity for disposing a demolding film. In the forming die, the other die includes a main surface member forming a main surface of the die cavity and a side surface member forming a side surface of the die cavity. The side surface member includes: a first adsorption portion formed on a first facing surface facing the one die to adsorb the demolding film; a second adsorption portion formed on the first facing surface closer to the die cavity side than the first adsorption portion to adsorb the demolding film; and a suction path for sucking air from the first adsorption portion and the second adsorption portion. The suction path is branched into a first branch path and a second branch path. One end side in the air flow direction of the first branch path is connected to a suction device, and the other end side in the air flow direction is connected to the first adsorption portion. The second branch path is connected to the second adsorption portion. The minimum cross-sectional area of a cross-section orthogonal to the air flow direction in the second branch path is smaller than the minimum cross-sectional area of a cross-section orthogonal to the air flow direction in the first branch path.

2. The forming die according to claim 1, wherein the second branch path includes: a first path extending from a branch point with the first branch path toward the main surface member side; and a second path extending from the first path toward the first facing surface.

3. The forming die according to claim 2, wherein the side surface member includes a first side surface member having the first facing surface and a second side surface member disposed on the side opposite to the first facing surface with respect to the first side surface member. The first path is formed on a second facing surface of the first side surface member facing the second side surface member.

4. The forming die according to any one of claims 1 to 3, wherein the first branch path includes an annular portion formed to connect and surround the periphery of the die cavity when viewed in a direction perpendicular to the first facing surface.

5. The forming die according to claim 4, wherein a plurality of the second branch paths are formed. The plurality of second branch paths are respectively connected to the annular portion.

6. The forming die according to any one of claims 1 to 5, wherein the first adsorption portion includes a plurality of first adsorption hole portions and second adsorption hole portions connecting adjacent first adsorption hole portions to each other. On the first facing surface, in terms of the length in a direction perpendicular to the direction in which the second adsorption hole portions extend to connect adjacent first adsorption hole portions to each other, the first adsorption hole portions are larger than the second adsorption hole portions.

7. The forming die according to claim 6, wherein the first adsorption portion is formed to connect and surround the periphery of the die cavity.

8. A resin forming device includes the forming die according to any one of claims 1 to 7.

9. A method for manufacturing a resin formed product is a method for manufacturing a resin formed product using the resin forming device according to claim 8. The method for manufacturing the resin formed product includes: A film placement step of placing the release film on the other mold; and A resin molding step of performing resin molding using the other mold on which the release film is placed.

Images