Method for manufacturing power storage module, and power storage module

Abstract

A method for manufacturing a power storage module includes: a first step of preparing a laminate; a second step in which a resin member having a hole through which a detection line is inserted is provided to the laminated body so as to face a lead-out portion of the detection line in a closed body, and a gap is formed between the lead-out portion and the resin member, and a portion of the detection line drawn out from the lead-out portion is inserted into the hole of the resin member; and a third step of forming a filling resin layer integrated with the closed body by filling a space between the lead-out portion and the resin member with a resin using a mold, thereby obtaining a power storage module including the laminate, the resin member, and the filling resin layer.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a power storage module and a power storage module. Background Art

[0002] A power storage device is described in Patent Document 1. The power storage device includes a unit stack formed of a plurality of stacked power storage cells. Each power storage cell includes a positive electrode, a negative electrode, a separator, a spacer, and a detection line. The positive electrode has a positive electrode current collector and a positive electrode active material layer, and the negative electrode has a negative electrode current collector and a negative electrode active material layer. The separator is sandwiched between the oppositely disposed positive electrode active material layer and negative electrode active material layer. The spacer is disposed between the outer peripheral edge of the positive electrode current collector and the outer peripheral edge of the negative electrode current collector, and is configured as a resin portion in a frame shape surrounding the positive electrode active material layer and the negative electrode active material layer. In this power storage device, the sealing of the power storage cell is maintained by spacers respectively welded to the positive electrode current collector and the negative electrode current collector. The detection line has a portion buried in the spacer and a portion located outside the power storage cell. The detection line is welded to the positive electrode current collector in the portion buried in the spacer.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2022-077252 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] However, in such a power storage device as described above, in order to improve the sealing of the space inside the power storage cell, it is conceivable to further form a resin layer outside the spacer as a closed body. In this case, the following situation can be considered: The resin layer is additionally formed on the outer side surface of the closed body including the lead-out portion of the detection line in the closed body by introducing resin into a mold using, for example, injection molding or potting, etc., so that the wall thickness of the resin portion as a whole increases. In this case, in order to bring the front end of the detection line to a state where it is led out to the outside of the resin layer, it is necessary to always hold the front end of the detection line during the filling of the resin. However, when the detection line is directly held by a mold, for example, the detection line may be damaged.

[0008] An object of the present disclosure is to provide a method for manufacturing a power storage module and a power storage module that can suppress damage to the detection line.

[0009] Solutions for Solving the Problems

[0010] The method for manufacturing an electricity storage module according to the present disclosure includes: a first step of preparing a laminate having: an electrode laminate formed by laminating a plurality of electrodes each having a current collector provided with an active material layer and a detection line provided on the current collector along a first direction; and an enclosure provided around the electrode laminate for leading each detection line of the plurality of electrodes to the outside and closing an internal space between current collectors adjacent in the first direction; a second step of, after the first step, arranging a resin member having a hole portion through which the detection line is inserted relative to the lead-out portion of the detection line in the enclosure and creating a gap between the resin member and the lead-out portion, and inserting a portion of the detection line led out from the lead-out portion into the hole portion of the resin member; and a third step of, after the second step, forming a filled resin layer integrated with the enclosure by filling resin between the lead-out portion and the resin member using a mold, thereby obtaining an electricity storage module including the laminate, the resin member, and the filled resin layer. In the third step, a space surrounded by the enclosure, the resin member, and the mold is formed by holding the enclosure and the resin member with the mold, and the filled resin layer is formed by filling resin into this space.

[0011] In this manufacturing method, first, a laminate is prepared. The laminate has: an electrode laminate including a plurality of electrodes and a detection line; and an enclosure that leads the detection line to the outside and is provided around the electrode laminate. Next, a resin member through which the detection line is inserted is arranged relative to the lead-out portion of the detection line in the enclosure and a gap is created between the resin member and the lead-out portion. Thus, in a subsequent step, by holding the enclosure and the resin member with a mold and filling resin between the lead-out portion and the resin member (i.e., the space surrounded by the enclosure, the resin member, and the mold) using the mold, a filled resin layer integrated with the enclosure can be formed. Thereby, when forming a filled resin layer on the lead-out portion of the detection line in the enclosure, it is not necessary to directly hold the detection line with the mold, and damage to the detection line caused by contact between the mold and the detection line can be suppressed. In addition, by additionally forming a filled resin layer on the lead-out portion of the detection line in the enclosure, the wall thickness of the resin portion in this portion can be increased.

[0012] In the method for manufacturing an electricity storage module according to the present disclosure, it may also be that the resin member includes a plurality of hole portions formed on a surface of the resin member opposite to the lead-out portion, and in the second step, the resin member is arranged on the laminate such that each detection line of the plurality of detection lines is inserted into each of the plurality of hole portions. In this case, since the plurality of detection lines are inserted into one resin member together, the number of components can be reduced.

[0013] In the method for manufacturing a power storage module according to the present disclosure, it is also possible that the opening portions on the lead-out portion side of the hole portions of the resin member are each formed in a conical shape that expands as it goes toward the lead-out portion side. In this case, when inserting the detection line into the hole portion of the resin member, the tip of the detection line can be guided by the conical opening portion of the hole portion.

[0014] In the method for manufacturing a power storage module according to the present disclosure, it is also possible that the resin member has a plurality of partition walls, the plurality of partition walls are erected on the surface of the resin member opposite to the surface facing the lead-out portion, and are arranged in a first direction. In the second step, the resin member is set on the laminate such that the partition walls are interposed between the tip portions of the detection lines inserted into each hole portion. In this case, by interposing the partition walls of the resin member between adjacent detection lines, short circuits between the detection lines are suppressed. As a result, the lead-out portions of the plurality of detection lines can be concentrated in a narrow range of the enclosure.

[0015] In the method for manufacturing a power storage module according to the present disclosure, it is also possible that a locking portion is formed in the resin member, the locking portion has an opening on the opposite surface facing the enclosure, and assists in the bonding of the filling resin layer and the resin member. In the third step, resin is filled in such a manner that the filling resin layer is formed from the opposite surface of the resin member through the opening into the inside of the locking portion. In this case, the fixing of the filling resin layer and the resin member becomes firm.

[0016] In the method for manufacturing a power storage module according to the present disclosure, it is also possible that the locking portion is a through-hole that opens on the opposite surface and penetrates from the opposite surface to the opposite side surface of the resin member opposite to the opposite surface. An enlarged portion that is wider than the opening of the through-hole in the opposite surface is formed in the through-hole. In the third step, resin is filled in such a manner that the filling resin layer enters the enlarged portion of the through-hole. In this case, the fixing of the filling resin layer and the resin member becomes firm.

[0017] In the method for manufacturing a power storage module according to the present disclosure, it is also possible that the locking portion is a cutout portion that opens on the opposite surface, and an enlarged portion that is wider than the opening of the cutout portion in the opposite surface is formed in the cutout portion. In the third step, resin is filled in such a manner that the filling resin layer enters the enlarged portion of the cutout portion. In this case, the fixing of the filling resin layer and the resin member becomes firm.

[0018] In the method for manufacturing a power storage module according to the present disclosure, it is also possible that the locking portion is a concave portion that opens on the opposite surface, and an enlarged portion that is wider than the opening of the concave portion in the opposite surface is formed in the concave portion. In the third step, resin is filled in such a manner that the filling resin layer enters the enlarged portion of the concave portion. In this case, the fixing of the filling resin layer and the resin member becomes firm.

[0019] In the method for manufacturing a power storage module according to the present disclosure, it is also possible that, in the third process, a resin that is the same as at least a part of the sealing body is filled. In this case, the sealing body and the resin filling layer can be firmly integrated through melting of the sealing body and the resin for filling the resin layer and the like.

[0020] The power storage module according to the present disclosure includes: a laminate including: an electrode laminate formed by laminating a plurality of electrodes each including a current collector provided with an active material layer and a detection line provided on the current collector along a first direction; and a sealing body provided around the electrode laminate to enclose an internal space of the electrode laminate and to lead out each of the detection lines included in the plurality of electrodes to the outside; a resin member disposed opposite to a lead-out portion of the detection line in the sealing body and having the detection line inserted therethrough; and a filled resin layer formed to fill a space between the lead-out portion and the resin member, and the lead-out portion and the resin member are fixed to each other by the filled resin layer. The power storage module can be manufactured by the above-described manufacturing method. Therefore, damage to the detection line can be suppressed.

[0021] Effects of the Invention

[0022] According to the present disclosure, it is possible to provide a method for manufacturing a power storage module and a power storage module that can suppress damage to a detection line. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a schematic cross-sectional view of the power storage module according to the present embodiment.

[0024] Figure 2 is Figure 1 a partially enlarged cross-sectional view of

[0025] Figure 3 is Figure 1 a schematic side view of the power storage module shown in

[0026] Figure 4 is a schematic cross-sectional view showing one process of the method for manufacturing the power storage module according to the present embodiment.

[0027] Figure 5 is a schematic cross-sectional view showing one process of the method for manufacturing the power storage module according to the present embodiment.

[0028] Figure 6 is a schematic cross-sectional view showing Figure 5 the process shown in (a) of

[0029] Figure 7 is a perspective view showing a resin member according to a modified example.

[0030] Figure 8 is a schematic cross-sectional view along line VIII-VIII of Figure 7 .

[0031] Figure 9 is a side view showing a resin component according to another modified example.

[0032] Figure 10 is a schematic cross-sectional view along line X-X of Figure 9 . DETAILED DESCRIPTION

[0033] Hereinafter, a power storage module according to one embodiment will be described with reference to the accompanying drawings. In the description of each drawing, the same or corresponding elements are denoted by the same reference numerals, and redundant description may be omitted. In addition, in each drawing, an orthogonal coordinate system constituted by a first axis defining a first direction D1, a second axis defining a second direction D2, and a third axis defining a third direction D3 may be shown.

[0034] Figure 1 is a schematic cross-sectional view of the power storage module according to the present embodiment. Figure 2 is Figure 1 a partially enlarged cross-sectional view of Figure 3 is Figure 1 a schematic side view of the power storage module shown in Figures 1 to 3 The power storage module 1 shown in is, for example, a power storage module used for batteries of various vehicles such as forklifts, hybrid vehicles, and electric vehicles. The power storage module 1 is, for example, a secondary battery such as a nickel-metal hydride secondary battery or a lithium-ion secondary battery. The power storage module 1 may also be an electric double layer capacitor or an all-solid-state battery. Here, the case where the power storage module 1 is a lithium-ion secondary battery is illustrated.

[0035] The power storage module 1 includes an electrode laminate 10 and a sealing body 20. The electrode laminate 10 includes a plurality of electrodes laminated along the first direction D1. The plurality of electrodes include a plurality of bipolar electrodes 11, a positive electrode terminal electrode 12, and a negative electrode terminal electrode 13. A separator 14 is interposed between adjacent electrodes.

[0036] The bipolar electrode 11 has a current collector 15, a positive electrode active material layer 16, and a negative electrode active material layer 17. The current collector 15 is, for example, in the shape of a rectangular sheet. The positive electrode active material layer 16 is provided on one surface 15a of the current collector 15. The negative electrode active material layer 17 is provided on the other surface 15b of the current collector 15. The plurality of bipolar electrodes 11 are laminated such that the positive electrode active material layer 16 of one bipolar electrode 11 faces the negative electrode active material layer 17 of another bipolar electrode 11. Here, one surface 15a of the current collector 15 is the surface facing one side in the first direction D1, and the other surface 15b of the current collector 15 is the surface facing the other side in the first direction D1.

[0037] When viewed from the first direction D1, the positive electrode active material layer 16 and the negative electrode active material layer 17 are rectangular. When viewed from the first direction D1, the negative electrode active material layer 17 is one size larger than the positive electrode active material layer 16. That is, when viewed from above in the first direction D1, the entire formation region of the positive electrode active material layer 16 is located within the formation region of the negative electrode active material layer 17.

[0038] The positive electrode terminal electrode 12 has a current collector 15 and a positive electrode active material layer 16 provided on one surface 15a of the current collector 15. The positive electrode terminal electrode 12 does not have a positive electrode active material layer 16 and a negative electrode active material layer 17 on the other surface 15b of the current collector 15. That is, no active material layer is provided on the other surface 15b of the current collector 15 of the positive electrode terminal electrode 12. The positive electrode terminal electrode 12 is laminated on the bipolar electrode 11 at one end in the first direction D1 of the electrode laminate 10. The positive electrode terminal electrode 12 is laminated on the bipolar electrode 11 such that its positive electrode active material layer 16 faces the negative electrode active material layer 17 of the bipolar electrode 11.

[0039] The negative electrode terminal electrode 13 has a current collector 15 and a negative electrode active material layer 17 provided on the other surface 15b of the current collector 15. The negative electrode terminal electrode 13 does not have a positive electrode active material layer 16 and a negative electrode active material layer 17 on one surface 15a of the current collector 15. That is, no active material layer is provided on one surface 15a of the current collector 15 of the negative electrode terminal electrode 13. The negative electrode terminal electrode 13 is laminated on the bipolar electrode 11 at the end on the side opposite to the positive electrode terminal electrode 12 in the first direction D1 of the electrode laminate 10. The negative electrode terminal electrode 13 is laminated on the bipolar electrode 11 such that its negative electrode active material layer 17 faces the positive electrode active material layer 16 of the bipolar electrode 11.

[0040] The separator 14 is disposed between adjacent bipolar electrodes 11, between the positive electrode terminal electrode 12 and the bipolar electrode 11, and between the negative electrode terminal electrode 13 and the bipolar electrode 11. The separator 14 is interposed between the positive electrode active material layer 16 and the negative electrode active material layer 17. The separator 14 is a member that allows charge carriers such as lithium ions to pass through, and prevents short circuits caused by contact between adjacent electrodes by separating the positive electrode active material layer 16 and the negative electrode active material layer 17.

[0041] The current collector 15 is a chemically inert electrical conductor that allows current to continuously flow through the positive electrode active material layer 16 and the negative electrode active material layer 17 during discharge or charging of the lithium-ion secondary battery. Examples of the material of the current collector 15 include a metal material, a conductive resin material, a conductive inorganic material, etc. As the conductive resin material, for example, a conductive polymer material or a resin obtained by adding a conductive filler to a non-conductive polymer material as needed can be cited. The current collector 15 may also have multiple layers. In this case, each layer of the current collector 15 may also contain the above-mentioned metal material and / or conductive resin material.

[0042] A coating layer may also be formed on the surface of the current collector 15. The coating layer can be formed by a known method such as plating treatment or spraying. The current collector 15 may, for example, be in the form of a plate, a foil (such as a metal foil), a film, or a net. As the metal foil, for example, aluminum foil, copper foil, nickel foil, titanium foil, or stainless steel foil can be cited. The current collector 15 may also be an alloy foil of the above-mentioned metals or a foil formed by integrating multiple metal foils. When the current collector 15 is in the form of a foil, the thickness of the current collector 15 may, for example, be 1 μm to 200 μm. In the present embodiment, the current collector 15 is a foil formed by integrating an aluminum foil and a copper foil, or an aluminum foil.

[0043] The positive electrode active material layer 16 contains a positive electrode active material that can absorb and release charge carriers such as lithium ions. As the positive electrode active material, for example, a lithium composite metal oxide having a layered rock salt structure, a metal oxide having a spinel structure, a polyanion-based compound, etc. can be cited. The positive electrode active material only needs to be a positive electrode active material that can be used in a lithium-ion secondary battery. The positive electrode active material layer 16 may also contain multiple positive electrode active materials. In the present embodiment, the positive electrode active material layer 16 contains olivine-type lithium iron phosphate (LiFePO4) as a composite oxide.

[0044] The negative electrode active material layer 17 contains a negative electrode active material that can absorb and release charge carriers such as lithium ions. The negative electrode active material can be any one of a simple substance, an alloy, or a compound. As the negative electrode active material, for example, lithium (Li), carbon, a metal compound, etc. can be cited. The negative electrode active material may also be an element or its compound that can alloy with lithium. As carbon, for example, natural graphite, artificial graphite, hard carbon (difficult-to-graphitize carbon), or soft carbon (easy-to-graphitize carbon) can be cited. As artificial graphite, for example, highly oriented graphite, mesocarbon microbeads, etc. can be cited. As an element that can alloy with lithium, silicon or tin can be cited. In the present embodiment, the negative electrode active material layer 17 contains graphite as a carbon-based material.

[0045] The positive electrode active material layer 16 and the negative electrode active material layer 17 (hereinafter, sometimes simply referred to as "active material layers") can each optionally contain a conductive additive for improving electrical conductivity, a binder, an electrolyte (polymer matrix, ion-conductive polymer, electrolyte solution, etc.), an electrolyte supporting salt (lithium salt) for improving ion conductivity, and the like. The conductive additive is added to improve the conductivity of each electrode (bipolar electrode 11, positive electrode terminal electrode 12, negative electrode terminal electrode 13). Examples of the conductive additive include acetylene black, carbon black, or graphite.

[0046] Examples of the binder include fluorine-containing resins such as polyvinylidene fluoride, polytetrafluoroethylene, and fluororubber, thermoplastic resins such as polypropylene and polyethylene, imide-based resins such as polyimide and polyamideimide, resins containing alkoxysilyl groups, acrylic resins such as acrylic acid or methacrylic acid, styrene-butadiene rubber (SBR), carboxymethyl cellulose, alginate salts such as sodium alginate and ammonium alginate, water-soluble cellulose ester crosslinking products, and starch-acrylic acid graft polymers. These binders can be used alone or in combination. As the solvent for the binder, water, N-methyl-2-pyrrolidone (NMP), etc. are used, for example.

[0047] The separator 14 can be, for example, a porous sheet or non-woven fabric containing a polymer that absorbs and retains an electrolyte. Examples of the material for the separator 14 include polypropylene, polyethylene, polyolefin, polyester, etc. The separator 14 can have a single-layer structure or a multi-layer structure. The multi-layer structure can have, for example, an adhesive layer or a ceramic layer as a heat-resistant layer. In the separator 14, an electrolyte can also be impregnated. The electrolyte impregnated into the separator 14 is a liquid electrolyte (electrolyte solution) containing a non-aqueous solvent and an electrolyte salt dissolved in the non-aqueous solvent.

[0048] As the electrolyte salt of the electrolyte solution, known lithium salts such as LiClO4, LiAsF6, LiPF6, LiBF4, LiCF3SO3, LiN(FSO2)2, and LiN(CF3SO2)2 can be used. In addition, as the non-aqueous solvent, known solvents such as cyclic carbonates, cyclic esters, linear carbonates, linear esters, and ethers can be used. In addition, two or more of these known solvent materials can be used in combination.

[0049] Here, a detection line 30 is provided on the current collector 15. The detection line 30 is disposed on the other surface 15b of the current collector 15 here and is connected (e.g., by ultrasonic welding) to the current collector 15. As an example, one detection line 30 is provided on each current collector 15 of all the electrodes. Thus, in the power storage module 1, the battery state (e.g., voltage) of the unit composed of adjacent electrodes can be detected by an external device using a pair of detection lines 30 adjacent along the first direction D1. As an example, the detection line 30 is a voltage detection line.

[0050] The detection line 30 is in the form of a long strip of foil, for example made of metal. More specifically, the current collector 15 and the detection line 30 may be made of different metals. In this case, the thermal conductivity of the metal forming the detection line 30 may be lower than that of the metal forming the current collector 15. In the present embodiment, the detection line 30 is a stainless steel foil.

[0051] When viewed from the first direction D1, the enclosure 20 is formed in a frame shape around the electrode laminate 10 at the peripheral portion of the electrode laminate 10. The enclosure 20 can be joined (welded) to each of one surface 15a and the other surface 15b of the current collector 15 at the peripheral portion 15c of each current collector 15. The enclosure 20 is used to form an internal space S between the current collectors 15 adjacent in the first direction D1 and to enclose each of the internal spaces S. An electrolyte (such as an electrolytic solution) is stored in each internal space S. The enclosure 20 can prevent the electrolytic solution from permeating to the outside.

[0052] In addition, the enclosure 20 can inhibit the intrusion of moisture and the like from the outside of the electrode laminate 10 into the internal space S. An extraction portion 20p for leading the detection line 30 to the outside is formed in the enclosure 20.

[0053] That is, in the power storage module 1, a laminate 100 is formed, and the laminate 100 has: an electrode laminate 10, which is composed of a plurality of electrodes (a plurality of bipolar electrodes 11, a positive terminal electrode 12, and a negative terminal electrode 13) including a current collector 15 provided with an active material layer (a positive electrode active material layer 16 and a negative electrode active material layer 17) and a detection line 30 provided on the current collector 15, laminated along the first direction D1; and an enclosure 20, which is provided around the electrode laminate 10 to lead each detection line 30 among the detection lines 30 included in the above-mentioned plurality of electrodes to the outside and to enclose the internal space S between the current collectors 15 adjacent in the first direction D1. When viewed from the first direction D1, the enclosure 20 is formed in a rectangular frame shape, and the extraction portion 20p is provided at a portion corresponding to one of the four sides of the enclosure 20 when viewed from the first direction D1.

[0054] The edge portion of the separator 14 is joined to the enclosure 20. The enclosure 20 includes an insulating material. As the material of the enclosure 20, for example, various resin materials such as polypropylene, polyethylene, polystyrene, ABS resin, acid-modified polypropylene, acid-modified polyethylene, and acrylonitrile styrene resin can be cited.

[0055] The closed body 20 includes a plurality of resin-made seals 21 and a plurality of resin-made spacers 22. The seals 21 are provided on each current collector 15. Thus, the seals 21 are stacked on one another along the first direction D1. When viewed from the first direction D1, the seals 21 are in a frame shape (here, a rectangular frame shape) and are provided at the peripheral portion 15c of the current collector 15. The seals 21 are provided so as to pass from one surface 15a of the current collector 15 through the end surface to the other surface 15b, covering the peripheral portion 15c. The seals 21 can be welded to one surface 15a and the other surface 15b of the current collector 15. Here, the seals 21 are welded to the current collector 15 and are joined to the detection line 30 joined to the current collector 15.

[0056] The spacers 22 are arranged so as to be interposed between the adjacent seals 21 in the first direction D1. Thus, the spacers 22 maintain the space between the adjacent seals 21, that is, between the adjacent current collectors 15, and together with the seals 21, form an internal space S. When viewed from the first direction D1, the spacers 22 are in a frame shape (here, a rectangular frame shape) and are arranged on the peripheral portion 15c of the current collector 15 when viewed from the first direction D1. Here, the end portion of the separator 14 is sandwiched between the seal 21 and the spacer 22 and is held between the two. The separator 14 can be welded to at least one of the seal 21 and the spacer 22.

[0057] The closed body 20 further includes a welded end portion 23 formed by welding and integrating the end portions on the side opposite to the internal space S of the plurality of seals 21 and the plurality of spacers 22 with each other. When viewed from the first direction D1, the welded end portion 23 is in a frame shape so as to surround the electrode laminate 10 and constitutes the outer peripheral portion of the closed body 20. Thus, the closed body 20 has an outer side surface 20s (the outer side surface of the welded end portion 23) formed by the end surface on the side opposite to the internal space S of the seal 21 and the end surface on the side opposite to the internal space S of the spacer 22 due to the mutual welding of the seal 21 and the spacer 22.

[0058] The detection line 30 extends from the current collector 15 and is led out from the outer side surface 20s along a second direction D2 intersecting (orthogonal to) the first direction D1. Here, the outer side surface 20s is in a rectangular tube shape according to the outer shape of the closed body 20 and has four surfaces. The lead-out portion 20p of the detection line 30 from the outer side surface 20s is concentrated on one of the four surfaces constituting the outer side surface 20s.

[0059] On the other hand, in the lead-out portion 20p, the lead-out positions of the detection lines 30 adjacent in the first direction D1 are set at mutually different positions in a third direction D3 intersecting (orthogonal to) the first direction D1 and the second direction D2 (see Figure 3) That is, the lead-out positions of the detection lines 30 are neatly arranged at a plurality of (here, 3) positions in the third direction D3. Thus, at least two (2 or 3 in the illustrated example) of the plurality of detection lines 30 are configured to overlap each other when viewed from the first direction D1. In the present embodiment, the lead-out positions of the detection lines 30 are concentrated on one of the four surfaces constituting the outer side surface 20s as described above, and are concentrated in a partial area within that one surface. In the illustrated example, the lead-out position (i.e., the lead-out portion 20p) of the detection line 30 is formed at a position on one surface constituting the outer side surface 20s that is closer to one side than the center of the third direction D3. Thus, in at least the other side of that one surface than the center of the third direction D3, a region 20r where the lead-out portion 20p of the detection line 30 is not formed is formed. In addition, in Figure 3 the Figure 1 illustrated filling resin layer 40 and resin member 50 are omitted.

[0060] In addition, the portion of the detection line 30 closer to the electrode laminate 10 than the outer side surface 20s is buried in the seal 21 in the portion where the seal 21 and the spacer 22 overlap along the first direction D1. Here, the detection line 30 terminates inside the seal 21, and the entire portion of the detection line 30 closer to the electrode laminate 10 than the outer side surface 20s is buried in the seal 21 and covered by the seal 21. Thus, the detection line 30 does not come into contact with the spacer 22.

[0061] In addition, the material of the seal 21 can be appropriately selected from the materials of the above-described enclosure 20. As an example, it is a resin modified by an acid. Thus, when the current collector 15 and the detection line 30 are made of metal, the bonding strength between the seal 21 and the current collector 15 and the detection line 30 can be ensured. On the other hand, regarding the material of the spacer 22, it can also be appropriately selected from the materials of the above-described enclosure 20, but it may not be a resin modified by an acid.

[0062] The surface of the outer side surface of the enclosure 20 where the lead-out portion 20p is provided includes a protruding portion 21k that protrudes in the second direction D2 (the lead-out direction of the detection line 30) toward the side opposite to the electrode laminate 10. The protruding portion 21k can be formed, for example, by previously making the end surface of the seal 21 protrude in the second direction D2 more than the spacer 22 before forming the welding end portion 23. As described above, the lead-out portion 20p of the detection line 30 is concentrated on one of the four surfaces constituting the outer side surface 20s.

[0063] Therefore, the protrusion 21k is also formed only on one of the four surfaces constituting the outer side surface 20s. Additionally, the protrusion 21k is formed in the third direction D3 across the entire width of the lead-out portion 20p. Here, when viewed from the first direction D1, one protrusion 21k is provided across the entire lead-out portion 20p.

[0064] The protrusions 21k are separated from each other in the first direction D1. Thus, in the outer side surface 20s of the enclosure 20, in a region between adjacent protrusions 21k (for example, a region corresponding to the end face of the spacer 22), a recess 22k that is recessed toward the electrode laminate 10 along the second direction D2 is formed. When forming the welded end 23, since the melted sealant 21 and the spacer 22 are melted together, the melted resin flows from the protrusion 21k to the recess 22k, ensuring a sufficient amount of resin between the sealant 21 and the spacer 22. Additionally, the protrusion 21k and the recess 22k are smoothly connected.

[0065] Furthermore, a conductive member 60 that functions as a terminal for extracting current from the power storage module 1 is disposed and electrically connected to a portion of the current collector 15 of the positive terminal electrode 12 that is exposed from the enclosure 20 and a portion of the current collector 15 of the negative terminal electrode 13 that is exposed from the enclosure 20. The conductive member 60 can be used to electrically connect multiple power storage modules 1. Additionally, in order to apply a constraint load to the electrode laminate 10, the conductive member 60 can also be used as a constraint member. Moreover, a cooling flow path can be formed in the conductive member 60. By circulating a cooling medium through the cooling flow path formed in the conductive member 60, the electrode laminate 10 can be cooled.

[0066] Here, the power storage module 1 further includes a filling resin layer 40 and a resin member 50. The resin member 50 is disposed in the form of the lead-out portion 20p of the enclosure 20, and the main portion of the filling resin layer 40 is provided to fill the space between the lead-out portion 20p and the resin member 50. Thus, the filling resin layer 40 is in contact with both the enclosure 20 (lead-out portion 20p) and the resin member 50. In the present embodiment, the resin member 50 is separated from the lead-out portion 20p (it may also include a portion in contact with the lead-out portion 20p). In particular, the filling resin layer 40 is made of the same resin material as at least a part of the enclosure 20 (such as the sealant 21 or the spacer 22) and is melted and integrated with the enclosure 20.

[0067] The filling resin layer 40 includes: a main body portion 41 interposed between the enclosure 20 (lead-out portion 20p) and the resin member 50; and a pair of extending portions 42 extending from the main body portion 41 in a direction intersecting the first direction D1 (plane direction including the second direction D2 and the third direction D3) and located on one end face 20a and the other end face 20b of the enclosure 20 in the first direction D1. The detection lines 30 penetrate through the main body portion 41. In other words, the main body portion 41 wraps each detection line 30. The pair of extending portions 42 respectively extend to positions overlapping with the current collector 15 when viewed from the first direction D1. In addition, one end face 20a of the enclosure 20 includes the outer surface of the seal 21 provided on the positive terminal electrode 12. Further, the other end face 20b of the enclosure 20 includes the outer surface of the seal 21 provided on the negative terminal electrode 13.

[0068] The resin member 50 holds each detection line 30. More specifically, the resin member 50 has a plurality of partition walls 51 arranged along the first direction D1, and accommodation spaces 52 are formed between the adjacent partition walls 51. The front end portions of the detection lines 30 are accommodated inside the accommodation spaces 52. Thus, when viewed from the third direction D3, the partition walls 51 are interposed between the front end portions of the adjacent detection lines 30. The accommodation spaces 52 open to the side opposite to the face 50a of the resin member 50 opposite to the enclosure 20.

[0069] In addition, a plurality of communication holes (hole portions) 53 are formed in the resin member 50, which penetrate through the face of the resin member 50 on the enclosure 20 side (opposite face 50b opposite to the enclosure 20) and communicate with the respective accommodation spaces 52. Each detection line 30 led out from the lead-out portion 20p of the enclosure 20 is inserted through the communication hole 53 and reaches the inside of each accommodation space 52. In this way, the resin member 50 includes a plurality of communication holes 53 formed in the opposite face 50b of the resin member 50 opposite to the lead-out portion 20p, and the detection lines 30 are inserted into the communication holes 53. In addition, the resin member 50 has a plurality of partition walls 51, and the plurality of partition walls 51 are erected on the face 50a of the resin member 50 opposite to the opposite face 50b opposite to the lead-out portion 20p and are arranged in the first direction D1. The opening portion 53a on the lead-out portion 20p side of the communication hole 53 is formed in a conical shape that expands as it goes toward the lead-out portion 20p side. Thus, when the detection line 30 is inserted into the communication hole 53, the front end of the detection line 30 is guided to the communication hole 53 by the conical surface of the opening portion 53a. In this way, in the present embodiment, the plurality of detection lines 30 are held together by a single resin member 50. In addition, the partition walls 51 are formed to be longer than the front end portions of the detection lines 30 accommodated in the accommodation spaces 52, and the detection lines 30 terminate inside the accommodation spaces 52. And by connecting wiring or the like from the outside to the inside of the accommodation spaces 52, electrical connection of the detection lines 30 can be performed.

[0070] A recess (locking portion) 54 is formed in a facing surface 50b of the resin member 50 that faces the lead-out portion 20p. The recess 54 has an opening 54a in the facing surface 50b, and includes a widened portion 54b widened inward (toward the surface 50a side) from the opening 54a. That is, the width of the widened portion 54b of the recess 54 in the direction intersecting the second direction D2 ( Figure 2 in the example is the first direction D1) is larger than the width of the opening 54a in the direction intersecting the second direction D2. Thus, a locking surface 54s that intersects the second direction D2 and faces the side opposite to the enclosure 20 is formed in the resin member 50. The locking surface 54s is a surface having an opposite orientation to the facing surface 50b of the resin member 50 that faces the enclosure 20. In addition, the locking surface 54s is the inner surface of the recess 54 and is a stepped surface between the opening 54a and the widened portion 54b of the recess 54. The filling resin layer 40 is also filled in the recess 54. More specifically, the filling resin layer 40 is filled in the recess 54 so as to be formed at least from the facing surface 50b to the locking surface 54s. Thus, the filling resin layer 40 formed in the recess 54 is locked to the locking surface 54s when the resin member 50 attempts to separate from the enclosure 20 and functions as an anti-disengagement member. That is, the resin member 50 and the filling resin layer 40 can be firmly fixed to each other by the anchoring effect brought about by the portion of the recess 54 filled with the filling resin layer 40. Therefore, when fixing the resin member 50 and the filling resin layer 40, the material of the resin member 50 is not limited. In this way, the recess 54 is a locking portion that has an opening in the facing surface 50b and assists in the bonding of the filling resin layer 40 and the resin member 50. In addition, in the illustrated example, one recess 54 is shown, but a plurality of recesses 54 may be formed in the resin member 50. In this case, the plurality of recesses 54 can be arranged at positions symmetric with respect to the center line in the first direction D1 of the resin member 50.

[0071] Next, a method for manufacturing the above-described power storage module 1 will be described. Figure 4 And Figure 5 is a schematic cross-sectional view showing one step of the method for manufacturing the power storage module according to the present embodiment. In Figure 4 and Figure 5 only a part (the central portion in the stacking direction) of each laminate produced in each step is shown. As Figure 4As shown in (a) thereof, in this manufacturing method, first, while interposing the spacer 22 between the electrodes (bipolar electrode 11, positive terminal electrode 12, and negative terminal electrode 13) provided with the seal 21, the electrodes are laminated (step S101, first step). Further, as described above, when laminating the seal 21 and the spacer 22, the seal 21 corresponding to the facing portion of the outer side surface 20s that includes the lead-out portion 20p of the detection line 30 is provided so as to protrude with respect to the spacer 22. For example, the seal 21 can be provided to protrude from the spacer 22 by previously cutting a part of the outer peripheral portion of the spacer 22 that overlaps with the seal 21 to be protruded.

[0072] Next, as Figure 4 shown in (b) thereof, the end surfaces of the seal 21 and the spacer 22 are heated by the heater H to be melted to form a welded end portion 23 (step S101, first step). Thereby, the laminate 100 is obtained. That is, in step S101, the laminate 100 is prepared, and the laminate 100 includes: an electrode laminate 10 formed by laminating a plurality of electrodes including a current collector 15 provided with an active material layer and a detection line 30 provided on the current collector 15 along the first direction D1; and an enclosure 20 provided around the electrode laminate 10 to lead each detection line 30 of the plurality of electrodes to the outside and to seal the internal space S between the current collectors 15 adjacent in the first direction D1. At this time, in the surface of the outer side surface 20s that includes the lead-out portion 20p of the detection line 30, the seal 21 protruding with respect to the spacer 22 forms a welded end portion 23, thereby forming a protruding portion 21k and a recessed portion 22k. Further, in the portion of the seal 21 in which the detection line 30 is buried, since heat is transferred to the detection line 30, the amount of melting becomes less than that of the other portions of the seal 21. Thus, as Figure 4 shown in (b) thereof, the melting margin in the second direction D2 of the portion of the seal 21 in which the detection line 30 is buried can be made smaller.

[0073] Next, as Figure 4 shown in (c) thereof, a resin member 50 having communication holes 53 through which each of the plurality of detection lines 30 is inserted is provided so as to face the lead-out portion 20p of the detection line 30 in the enclosure 20 and to form a gap therebetween (step S102, second step). In this step S102, each detection line 30 is inserted through each communication hole 53 of the resin member 50, so that each detection line 30 is held by the resin member 50. That is, in step S102, one resin member 50 is provided to the laminate 100 so that the plurality of detection lines 30 are inserted therethrough together.

[0074] Next, in step S102, the resin member 50 is set on the laminate 100 in the following manner: the partition wall 51 is interposed between the front ends of the plurality of detection lines 30, and each of the plurality of detection lines 30 is held in a separately surrounded manner.

[0075] Next, as Figure 5 , Figure 6 shown, a resin is filled between the lead-out portion 20p and the resin member 50 by using a mold (die) MD to form a filled resin layer 40 integrated with the enclosure 20, and a power storage module 1 including the laminate 100, the resin member 50, and the filled resin layer 40 is obtained (step S103, third step). More specifically, in this step S104, first, as Figure 5 in (a) of Figure 6 shown, the mold MD is set on the laminate 100.

[0076] The mold MD includes: a main body portion MD1 that faces the surface 50a of the resin member 50 and contacts the front end surface of the partition wall 51; a pair of extending portions MD2 that extend from each of the both end portions of the main body portion MD1 in the first direction D1 in a direction crossing the first direction D1 (a plane direction including the second direction D2 and the third direction D3); and a pair of holding portions MD3 that are provided at the ends of the extending portions MD2 on the side opposite to the main body portion MD1. The holding portions MD3 hold the laminate 100 along the first direction D1. In particular, the holding portions MD3 hold the laminate 100 in the region where the current collector 15, the seal 21, and the spacer 22 overlap.

[0077] At this time, a gap G41 for the main body portion 41 of the filled resin layer 40 is maintained between the resin member 50 and the enclosure 20, and a gap G42 for the extending portion 42 is formed between the mold MD (the extending portion MD2 and the holding portion MD3) and the enclosure 20. That is, in step S103, the enclosure 20 and the resin member 50 are held by the mold MD to form a space (gap G41 and gap G42) surrounded by the enclosure 20, the resin member 50, and the mold MD. In addition, the mold MD includes side wall portions (not shown) provided at both ends in the third direction D3 of the mold MD for closing the space. After that, as Figure 4As shown in FIG. (b), a filled resin layer 40 is formed by introducing a resin into the mold MD to fill the gaps G41 and G42 (i.e., the space surrounded by the enclosure 20, the resin member 50, and the mold MD). The main body 41 of the filled resin layer 40 is formed by the resin filled into the gap G41 and cured, and the extension 42 of the filled resin layer 40 is formed by the resin filled into the gap G42 and cured. In addition, a part of the resin filled into the gap G41 is also filled into the gap between the communication hole 53 of the resin member 50 and the detection line 30 and cured. Further, in step S103, the resin is filled in such a manner that the filled resin layer 40 enters the recess 54 from the opposite surface 50b of the resin member 50 through the opening (opening portion 54a) of the recess 54 serving as a locking portion. More specifically, in step S103, the filled resin layer 40 is formed in such a manner that it is formed at least from the opposite surface 50b of the resin member 50 facing the enclosure 20 to the locking surface 54s (i.e., in such a manner that it enters the widened portion 54b of the recess 54) (in the present embodiment, in such a manner that the filled resin layer 40 is formed in the entire recess 54).

[0078] After that, the power storage module 1 is taken out by demolding the mold MD. In addition, the resin filling in step S103 may be injection molding using the mold MD or other filling methods such as potting. Thus, in step S103, while the enclosure 20 and the resin member 50 are held by the mold MD, that is, without directly holding the detection line 30 by the mold MD, the resin is filled between the lead-out portion 20p and the resin member 50.

[0079] As described above, in the method for manufacturing a power storage module according to the present embodiment, first, the laminate 100 is prepared. The laminate 100 includes: an electrode laminate 10 including a plurality of electrodes and a detection line 30; and an enclosure 20 that leads the detection line 30 to the outside and is disposed so as to surround the electrode laminate 10. Then, a resin member 50 having a communication hole 53 through which the detection line 30 is inserted is disposed opposite to the lead-out portion 20p of the detection line 30 in the enclosure 20 and with a gap formed therebetween.

[0080] Therefore, in subsequent processes, by holding the enclosure 20 and the resin member 50 with the metal mold MD and filling the resin between the lead-out portion 20p and the resin member 50 (i.e., the space surrounded by the enclosure 20, the resin member 50, and the metal mold MD) using the metal mold MD, the filled resin layer 40 integrated with the enclosure 20 can be formed. Thus, when forming the filled resin layer 40 on the lead-out portion 20p of the detection line 30 in the enclosure 20, there is no need to directly hold the detection line 30 with the metal mold MD, and damage to the detection line 30 caused by contact between the metal mold MD and the detection line 30 can be suppressed.

[0081] In addition, by additionally forming the filled resin layer 40 on the lead-out portion 20p of the detection line 30 in the enclosure 20, the wall thickness of the resin portion in this part can be increased. As a result, suppression of permeation of moisture and the like and improvement of the pressure resistance can be achieved. Moreover, when demolding the metal mold MD, since the detection line 30 is held in a manner surrounded by the resin member 50, deformation of the detection line 30 and the like can be suppressed. In addition, when filling the resin, if the resin member 50 is not used and an attempt is made to directly hold the detection line 30 with the metal mold MD, it is necessary to form a gap in the metal mold MD considering the error in the position of the detection line 30 in the stacking direction (the first direction D1), so burrs may be generated around the detection line 30, which has an adverse effect on the electrical connection to the outside.

[0082] In addition, in the manufacturing method of the power storage module according to the present embodiment, the resin member 50 includes a plurality of communication holes 53 formed in the opposite surface 50b of the resin member 50 opposite to the lead-out portion 20p. In the process S102, the resin member 50 is arranged on the stacked body 100 in such a manner that each of the plurality of detection lines 30 is inserted into each of the plurality of communication holes 53. Thus, since the plurality of detection lines 30 are inserted into one resin member 50 together, the number of components can be reduced.

[0083] In addition, in the manufacturing method of the power storage module according to the present embodiment, the opening portions on the lead-out portion 20p side of the respective communication holes 53 of the resin member 50 are formed in a conical shape that expands toward the lead-out portion 20p side. Therefore, when inserting the detection line 30 into the communication hole 53 of the resin member 50, the front end of the detection line 30 can be guided by the conical opening portion of the communication hole 53.

[0084] In addition, in the method for manufacturing the power storage module according to the present embodiment, the resin member 50 has a plurality of partition walls 51 which are erected on the surface 50a of the resin member 50 on the opposite side of the opposite surface 50b thereof facing the lead-out portion 20p and are arranged in the first direction D1. And, in the process S102, the resin member 50 is set to the laminate 100 in such a manner that the partition walls 51 are interposed between the front end portions of the plurality of detection lines 30 inserted through the communication holes 53. Therefore, the partition walls 51 of the resin member 50 are interposed between the adjacent detection lines 30, thereby suppressing a short circuit between the detection lines 30.

[0085] As a result, the lead-out portions of the plurality of detection lines 30 can be concentratedly provided within a narrow range of the enclosure 20. That is, the region of the outer side surface 20s of the enclosure 20 where the lead-out portion 20p is provided can be narrowed. As a result, operations such as pasting a laminated film including a metal layer can be performed in a wider region (for example, Figure 3 the region 20r shown) of the outer side surface 20s.

[0086] In addition, in the method for manufacturing the power storage module according to the present embodiment, a locking portion is formed in the resin member 50. The locking portion has an opening on the opposite surface 50b facing the enclosure 20 and assists in the bonding of the filling resin layer 40 and the resin member 50. In the process S103, the resin is filled in such a manner that the filling resin layer 40 is formed from the opposite surface 50b of the resin member 50 through the opening into the inside of the locking portion. Therefore, the fixing of the filling resin layer 40 and the resin member 50 becomes firm.

[0087] In addition, in the method for manufacturing the power storage module according to the present embodiment, a recess 54 (that is, the locking portion is the recess 54) is formed which opens on the surface (the opposite surface 50b facing the enclosure 20) of the resin member 50 facing the lead-out portion 20p. A widened portion 54b which is wider than the opening of the recess 54 is formed in the recess 54. A locking surface 54s is formed in the widened portion 54b. And, in the process S103, the resin is filled in such a manner that the filling resin layer 40 enters the widened portion 54b of the recess 54 (in such a manner that the filling resin layer 40 is formed at least from the opposite surface 50b to the locking surface 54s). Therefore, the fixing of the filling resin layer 40 and the resin member 50 becomes firm.

[0088] In addition, in the method for manufacturing the power storage module according to the present embodiment, in the process S103, the resin which is the same as at least a part of the enclosure 20 is filled. Therefore, the enclosure 20 and the filling resin layer 40 can be firmly integrated by the melting together of the enclosure 20 and the resin for the filling resin layer 40 and the like.

[0089] Moreover, in the present embodiment, the power storage module 1 can be manufactured by the above-described method for manufacturing a power storage module. Thus, damage to the detection line 30 can be suppressed.

[0090] The above embodiment illustrates one aspect of the present invention. Thus, the present invention is not limited to the above one aspect, and can be set to an aspect obtained by arbitrarily deforming the above one aspect.

[0091] For example, as an example, the material of the resin member 50 can be made of a material different from that of the enclosure 20 or the filling resin layer 40 (such as acrylic) or the like. In addition, the resin member 50 and the filling resin layer 40 can be fused by setting the material of the resin member 50 to the same material as that of the filling resin layer 40.

[0092] In addition, in the above embodiment, a scheme of forming the protrusion 21k and the recess 22k on the surface of the outer side of the enclosure 20 where the lead-out portion 20p is provided has been described. However, the outer side of the enclosure, including the surface where the lead-out portion 20p is formed, may be flat without forming the protrusion 21k and the recess 22k.

[0093] Moreover, the thermal conductivity of the detection line 30 can be equal to or higher than the thermal conductivity of the current collector 15, and the current collector 15 and the detection line 30 can also be made of the same material.

[0094] In addition, in the above embodiment, a case where the detection line 30 is a voltage detection line has been illustrated. However, the detection line 30 can also be a temperature detection line connected to a temperature sensor provided in the electrode laminate 10. In addition, in the above embodiment, an example of inserting a plurality of detection lines 30 into one resin member 50 together has been described, but the plurality of detection lines 30 can also be inserted into a plurality of resin members 50 separately.

[0095] In addition, it is not limited to the case where a plurality of communication holes 53 are formed in the resin member 50. One communication hole 53 can also be formed in the resin member 50, and the plurality of detection lines 30 can be inserted into the one communication hole 53 together. In addition, in the resin member 50, the opening on the lead-out portion 20p side of the communication hole 53 may not be conical. Moreover, the resin member 50 may not have the partition wall 51. In this case, by fixing each of the plurality of detection lines 30 with the filling resin layer 40, insulation between the detection lines 30 can also be ensured.

[0096] Moreover, the recess 54 may not be formed in the resin member 50, and even when the recess 54 is formed, the recess 54 may not have the widened portion 54b. Even in these cases, by fusing the resin for the filling resin layer 40 to the resin member 50 or the enclosure 20, these members can be fixed.

[0097] Here, Figure 7 FIG. is a perspective view showing a resin component according to a modified example, Figure 8 is along Figure 7 VIII-VIII line of the schematic cross-sectional view. As Figure 7 , Figure 8 shown, the resin component 50 can have: a main body portion 58 including a plurality of storage spaces 52 for storing the front end portion of the detection line 30; and a pair of flange portions 59 protruding from both ends of the main body portion 58 on the side of the enclosure 20 in a direction (here, the third direction D3) intersecting the second direction D2. A plurality (here, three) of through holes 64 arranged along the first direction D1 are formed in each of the pair of flange portions 59.

[0098] The through holes 64 extend along the second direction D2 and open at the opposite surface 50b of the resin component 50 and the opposite surface 50r of the resin component 50 on the side opposite to the opposite surface 50b. That is, the through holes 64 penetrate from the opposite surface 50b to the opposite surface 50r. A widened portion 64b wider than the opening of the through hole 64 in the opposite surface 50b is formed in the through hole 64. Thus, a locking surface 64s facing the side opposite to the enclosure 20 is formed on the resin component 50, and the locking surface 64s is the inner surface of the through hole 64 and is the stepped surface between the opening portion 64a on the opposite surface 50b side of the through hole 64 and the widened portion 64b. The locking surface 64s is a surface intersecting the second direction D2 and is a surface having an opposite orientation to the opposite surface 50b.

[0099] The filling resin layer 40 is also filled in these through holes 64. More specifically, the filling resin layer 40 is filled in the through holes 64 so as to be formed at least from the opposite surface 50b to the locking surface 64s (in this example, filled in the whole of the through holes 64). That is, in the process S103, the filling resin layer 40 is formed in such a manner that it is formed at least from the opposite surface 50b of the resin component 50 facing the enclosure 20 to the locking surface 64s (that is, in such a manner that it enters the widened portion 64b of the through hole 64) (in this example, in such a manner that the filling resin layer 40 is formed in the whole of the through holes 64).

[0100] Thus, the filling resin layer 40 formed in the through holes 64 is locked to the locking surface 64s when the resin component 50 attempts to separate from the enclosure 20 and functions as an anti-disengagement member. That is, the resin component 50 and the filling resin layer 40 can be firmly fixed to each other by the anchoring effect brought about by the portion of the filling resin layer 40 filled in the through holes 64. In this way, the through holes 64 are locking portions having openings on the opposite surface 50b and assisting the bonding between the filling resin layer 40 and the resin component 50.

[0101] In addition, as Figure 9As shown, the through-hole 64 can also be deformed into a cutout portion 74 that opens at the outer edge of the flange portion 59 in the second direction D2. That is, in Figure 9 In the example shown, a plurality (three in this case) of cutout portions 74 arranged along the first direction D1 are formed in the flange portion 59. In addition, Figure 9 FIG. is a side view of a resin component according to another modification, Figure 10 is along Figure 9 A schematic cross-sectional view taken along the X-X line.

[0102] As Figure 9 , Figure 10 shown, the cutout portion 74 extends along the second direction D2 and opens at the opposite surface 50b of the resin component 50 and at the opposite surface 50r of the resin component 50 on the side opposite to the opposite surface 50b. Moreover, since the cutout portion 74 is formed at the outer edge of the flange portion 59 (i.e., the resin component 50) in the third direction D3, it also opens at the outer side surface of the flange portion 59 (i.e., the resin component 50) in the third direction D3.

[0103] A widened portion 74b that is wider than the opening of the cutout portion 74 in the opposite surface 50b is formed in the cutout portion 74. As a result, a locking surface 74s facing the side opposite to the closure body 20 is formed in the resin component 50. The locking surface 74s is the inner surface of the cutout portion 74 and is a stepped surface between the opening portion 74a on the opposite surface 50b side of the cutout portion 74 and the widened portion 74b. The locking surface 74s is a surface that intersects the second direction D2 and is a surface with an opposite orientation to the opposite surface 50b.

[0104] The filling resin layer 40 is also filled in these cutout portions 74. More specifically, the filling resin layer 40 is filled in the cutout portion 74 so as to be formed at least from the opposite surface 50b to the locking surface 74s (in this example, filled in the whole of the cutout portion 74). That is, in the process S103, the filling resin layer 40 is formed in such a manner that it is formed at least from the opposite surface 50b of the resin component 50 facing the closure body 20 to the locking surface 74s (i.e., in a manner of entering the widened portion 74b of the cutout portion 74) (in this example, in a manner of forming the filling resin layer 40 in the whole of the cutout portion 74).

[0105] As a result, the filling resin layer 40 formed in the cutout portion 74 will be locked to the locking surface 74s when the resin component 50 attempts to separate from the closure body 20 and functions as an anti-separation member. That is, the resin component 50 and the filling resin layer 40 can be firmly fixed to each other by the anchoring effect brought about by the portion of the filling resin layer 40 filled in the cutout portion 74. In this way, the cutout portion 74 is a locking portion that has an opening in the opposite surface 50b and assists in the bonding of the filling resin layer 40 and the resin component 50.

[0106] Explanation of Reference Numerals

[0107] 1…Electric storage module, 10…Electrode laminate, 11…Bipolar electrode (electrode), 12…Positive terminal electrode (electrode), 13…Negative terminal electrode (electrode), 20…Enclosure, 20p…Lead-out portion, 30…Detection line, 40…Filling resin layer, 50…Resin component, 51…Partition wall, 53…Communication hole (portion), 54…Recess (locking portion), 64…Through hole (locking portion), 74…Notch portion (locking portion), S…Internal space, MD…Metal mold (mold).

Claims

1. A method for manufacturing a power storage module, characterized in that, Comprising: A first step of preparing a laminate having: an electrode laminate formed by laminating a plurality of electrodes each including a current collector provided with an active material layer and a detection line provided on the current collector along a first direction; and a sealing body provided around the electrode laminate for leading each of the detection lines of the plurality of electrodes to the outside and sealing an internal space between the current collectors adjacent to each other in the first direction; A second step, after the first step, of disposing a resin member having a hole portion through which the detection line is inserted, relative to the lead-out portion of the detection line in the sealing body and with a gap formed therebetween, and inserting a portion of the detection line led out from the lead-out portion into the hole portion of the resin member; And A third step, after the second step, of forming a filled resin layer integrated with the sealing body by filling resin between the lead-out portion and the resin member using a mold, to obtain a power storage module including the laminate, the resin member, and the filled resin layer, In the third step, a space surrounded by the sealing body, the resin member, and the mold is formed by holding the sealing body and the resin member with the mold, and the filled resin layer is formed by filling resin into this space.

2. The method for manufacturing a power storage module according to claim 1, wherein The resin member includes a plurality of hole portions formed on a surface of the resin member opposite to the lead-out portion, In the second step, the resin member is disposed on the laminate such that each of the plurality of detection lines is inserted into each of the plurality of hole portions together.

3. The method for manufacturing a power storage module according to claim 2, wherein The opening portion on the lead-out portion side of each of the hole portions of the resin member is formed in a conical shape that expands as it goes toward the lead-out portion side.

4. The method for manufacturing a power storage module according to claim 2, wherein The resin member has a plurality of partition walls, the plurality of partition walls are erected on a surface opposite to the surface of the resin member opposite to the lead-out portion, that is, the opposite surface, and are arranged in the first direction, In the second step, the resin member is disposed on the laminate such that the partition walls are interposed between the front end portions of the detection lines inserted into each of the hole portions.

5. The method for manufacturing a power storage module according to any one of claims 1 to 4, wherein A locking portion is formed on the resin member, the locking portion has an opening on a surface opposite to the sealing body, and assists in the bonding between the filled resin layer and the resin member, In the third step, resin is filled such that the filled resin layer is formed from the opposite surface of the resin member through the opening to the inside of the locking portion.

6. The method for manufacturing a power storage module according to claim 5, wherein The locking portion is a through-hole that opens on the opposite surface and penetrates from the opposite surface to the opposite side of the resin member that is opposite to the opposite surface. An enlarged portion that is wider than the opening of the through-hole in the opposite surface is formed in the through-hole. In the third process, resin is filled in such a manner that the filled resin layer enters the enlarged portion of the through-hole.

7. The method for manufacturing a power storage module according to claim 5, wherein The locking portion is a cutout portion that opens on the opposite surface. An enlarged portion that is wider than the opening of the cutout portion in the opposite surface is formed in the cutout portion. In the third process, resin is filled in such a manner that the filled resin layer enters the enlarged portion of the cutout portion.

8. The method for manufacturing a power storage module according to claim 5, wherein The locking portion is a concave portion that opens on the opposite surface. An enlarged portion that is wider than the opening of the concave portion in the opposite surface is formed in the concave portion. In the third process, resin is filled in such a manner that the filled resin layer enters the enlarged portion of the concave portion.

9. The method for manufacturing a power storage module according to any one of claims 1 to 8, wherein In the third process, resin that is the same as at least a part of the sealing body is filled.

10. A power storage module, characterized in that, Comprising: A laminate having: an electrode laminate formed by laminating a plurality of electrodes each having a current collector provided with an active material layer and a detection line provided on the current collector along a first direction; and a sealing body provided around the electrode laminate to enclose the internal space of the electrode laminate and to lead each detection line of the plurality of electrodes having the detection lines to the outside. A resin member disposed opposite to the lead-out portion of the detection line in the sealing body, through which the detection line is inserted; and A filled resin layer formed to fill the space between the lead-out portion and the resin member. The lead-out portion and the resin member are fixed to each other by the filled resin layer.

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