Gas barrier film

Abstract

Provided is a gas barrier film having a certain level of gas barrier properties satisfying a high effect of preventing the permeation of gases such as oxygen and water vapor, having high light transmittance, and being capable of achieving a reduction in production cost, the gas barrier film having n (n is an integer of 2 or more) gas barrier layers formed from a composition containing a silicon compound, among the n gas barrier layers, n is an integer of 1 or more, and n is an integer of 1 or more. One or more layers and (n-1) or less layers have been modified.

Description

[0001] This application is a divisional application of the application with the filing date of February 26, 2019, application number 201980015294.6, and invention title "Gas Barrier Film". Technical Field

[0002] The present invention relates to a gas barrier film having a gas barrier property satisfying a certain level, high light transmittance, and capable of reducing manufacturing costs. Background Art

[0003] In recent years, organic EL elements have attracted attention as light-emitting elements capable of emitting high-brightness light using low-voltage DC drive. However, organic EL elements have problems in that light-emitting characteristics such as light-emitting brightness, light-emitting efficiency, and light-emitting uniformity are likely to deteriorate over time.

[0004] The problem of deterioration in time-dependent performance typified by organic EL elements basically exists in all electronic components and optical components that have attracted attention in recent years. As the cause, it is considered that oxygen, moisture, etc. enter the inside of the electronic components and optical components, causing performance deterioration.

[0005] Therefore, as a countermeasure against this cause, several methods have been proposed for sealing electronic components, optical components, etc. as objects to be sealed using a gas barrier sealing material having a layer structure.

[0006] For example, Patent Document 1 discloses a gas barrier laminate having at least two gas barrier inorganic layers, and at least one of them is a silicon oxynitride layer, and the silicon oxynitride layer has a gradient composition region in which the proportion of oxygen element decreases and the proportion of nitrogen element increases toward the substrate side in the thickness direction in the layer.

[0007] Prior Art Documents

[0008] Patent Documents

[0009] Patent Document 1: WO2014 / 157685 Summary of the Invention

[0010] Problems to be Solved by the Invention

[0011] In recent years, by laminating two or more gas barrier layers to manufacture a gas barrier film, the gas barrier property has been further improved. On the other hand, it has also been pointed out that the manufacturing cost increases with the increase in the number of processes. Therefore, a gas barrier film having a gas barrier property satisfying a certain level and capable of reducing manufacturing costs is required.

[0012] However, for the gas-barrier laminate disclosed in Patent Document 1, although extremely high water vapor barrier properties and excellent flex resistance are obtained by making one of at least two inorganic layers having gas-barrier properties a silicon oxynitride layer having a specific gradient composition region, there is still room for improvement in terms of achieving higher light transmittance and reducing manufacturing costs.

[0013] Therefore, the present invention has been completed in order to solve the above problems, and an object thereof is to provide a gas-barrier film having gas-barrier properties satisfying a certain level, high light transmittance, and capable of reducing manufacturing costs, where the certain level is a level with a relatively high effect of preventing the permeation of gases such as oxygen and water vapor.

[0014] Means for Solving the Problems

[0015] The present inventors conducted intensive studies in view of the above problems, and as a result, found that by making one or more and (n - 1) or less layers of the n layers (n is an integer of 2 or more) of gas-barrier layers be modified layers, a gas-barrier film having gas-barrier properties satisfying a certain level, high light transmittance, and capable of reducing manufacturing costs can be obtained, thereby completing the present invention.

[0016] That is, the present invention is as follows.

[0017] [1] A gas-barrier film having n layers (n is an integer of 2 or more) of gas-barrier layers formed from a composition containing a silicon compound,

[0018] wherein one or more and (n - 1) or less layers of the n layers of gas-barrier layers are modified layers.

[0019] [2] The gas-barrier film according to the above [1], wherein

[0020] one of the n layers of gas-barrier layers is a modified layer.

[0021] [3] The gas-barrier film according to the above [1] or [2], wherein

[0022] the outermost gas-barrier layer of the n layers of gas-barrier layers is a modified layer.

[0023] [4] The gas-barrier film according to any one of the above [1] to [3], which has a resin layer, and the n layers of gas-barrier layers are laminated on the resin layer,

[0024] and the gas-barrier layer closest to the resin layer is not a modified layer.

[0025] [5] The gas-barrier film according to any one of the above [1] to [4], wherein

[0026] All of the n gas barrier layers are layers formed from a composition containing the same type of silicon compound.

[0027] [6] The gas barrier film according to any one of [1] to [5] above, wherein,

[0028] All of the n gas barrier layers are layers formed from the same composition.

[0029] [7] The gas barrier film according to any one of [1] to [6] above, wherein,

[0030] The total light transmittance of the gas barrier film is 89% or more.

[0031] [8] The gas barrier film according to any one of [1] to [7] above, wherein,

[0032] The water vapor transmission rate of the gas barrier film is 5×10 -3 (g / m 2 / day) or less.

[0033] Effects of the Invention

[0034] According to the present invention, a gas barrier film can be provided which has a gas barrier property satisfying a certain level, high light transmittance, and can achieve a reduction in manufacturing cost, and the certain level is a level with a relatively high effect of preventing the permeation of gases such as oxygen and water vapor. Detailed Embodiments

[0035] [Gas Barrier Film]

[0036] The gas barrier film of the present invention has n gas barrier layers (n is an integer of 2 or more), and the gas barrier layers are formed from a composition containing a silicon compound. Among the n gas barrier layers, one or more and (n - 1) or less gas barrier layers are formed by being modified.

[0037] Here, "gas barrier property" refers to the property of preventing the permeation of gases such as oxygen and water vapor.

[0038] The gas barrier film of the present invention only needs to have n gas barrier layers (n is an integer of 2 or more) and the gas barrier layers formed by making one or more and (n - 1) or less of the n gas barrier layers be modified, and there is no particular limitation.

[0039] It should be noted that the n gas barrier layers can be directly laminated on a resin layer to form, or can be formed by sandwiching other layers (for example, a primer layer) between the resin layers.

[0040] In addition, the n gas barrier layers can be directly laminated on a release sheet to form, or can be formed by sandwiching a resin layer between the release sheets.

[0041] As the layer structure of the gas barrier film of the present invention, for example, the following forms can be cited.

[0042] · Resin layer / n-layer gas barrier layer

[0043] · Resin layer / primer layer / n-layer gas barrier layer

[0044] · Resin layer / n-layer gas barrier layer / adhesive layer / first release sheet

[0045] · Second release sheet / n-layer gas barrier layer / adhesive layer / first release sheet

[0046] · Second release sheet / resin layer / n-layer gas barrier layer / adhesive layer / first release sheet

[0047] In the above forms of the layer structure, the first release sheet and the second release sheet may be the same or different, optionally.

[0048] The above forms of the layer structure represent the state before using the gas barrier film as a sealing material.

[0049] When using the gas barrier film as a sealing material, usually the first release sheet is peeled off, and the surface of the exposed adhesive layer is bonded to the surface of the object to be sealed to obtain a sealed body. In addition, after bonding the surface of the adhesive layer of the sealing material to the surface of the object to be sealed, usually the second release sheet can be peeled off to expose the n-layer gas barrier layer or the resin layer, thereby forming the following layer structure.

[0050] · n-layer gas barrier layer / adhesive layer

[0051] · Resin layer / n-layer gas barrier layer / adhesive layer

[0052] It should be noted that in the case where there is no resin layer or the resin layer does not have a sufficient function as a support for the gas barrier film, the second release sheet functions as a support for the gas barrier film until it is peeled off.

[0053] The water vapor transmission rate of the gas barrier film of the present invention is preferably 5×10 -1 (g / m 2 / day) or less, more preferably 5×10 -2 (g / m 2 / day) or less, and even more preferably 5×10 -3 (g / m 2 / day) or less.

[0054] In the present invention, by making the water vapor transmission rate within the above range, a gas barrier film having a certain level of gas barrier property with a high effect of preventing the permeation of gases such as oxygen and water vapor can be obtained.

[0055] Here, the "water vapor transmission rate" refers to the value measured using a water vapor transmission rate measuring device in a high-temperature and high-humidity environment of 40°C and a relative humidity of 90%. A more specific measuring method is based on the method of the following examples.

[0056] In addition, the total light transmittance of the gas barrier film of the present invention is preferably 89% or more, more preferably 89.5% or more, and further preferably 90% or more.

[0057] By making the total light transmittance of the above gas barrier film within the above range, a gas barrier film with excellent light transmittance can be obtained, and it can be particularly advantageously used in the application of a sealing material for sealing optical components such as organic EL elements.

[0058] Here, the "total light transmittance" refers to the ratio of the light that has passed through the gas barrier film among the light incident on the gas barrier film, and it refers to the value measured using a haze meter in accordance with JIS K7361-1. A more specific measuring method is based on the method of the following examples.

[0059] The higher the total light transmittance, the higher the light transmittance can be evaluated.

[0060] [Gas barrier layer]

[0061] In the present invention, the number of laminated gas barrier layers is set to n layers (n is an integer of 2 or more), that is, 2 layers or more.

[0062] When the number of laminated gas barrier layers is set to 2 layers or more, the layers that shield gases such as oxygen and water vapor simply increase, and a further improvement in the gas barrier property possessed by the gas barrier layer can be achieved.

[0063] Therefore, specifically, how many layers of the gas barrier layer are set to 2 layers or more can be determined according to the level required by the object to be sealed that is sealed using the gas barrier film as a sealing material.

[0064] For example, when the object to be sealed is an optical component such as an organic EL element, the number of laminated gas barrier layers is preferably 2 to 6 layers, more preferably 2 to 4 layers, and further preferably 2 to 3 layers.

[0065] By making the number of laminated gas barrier layers within the above range, a further improvement in the gas barrier property can be achieved, and it can be particularly advantageously used in the application of a sealing material for sealing optical components such as organic EL elements.

[0066] In the present invention, the number of gas barrier layers subjected to the modification treatment is set to 1 layer or more and (n - 1) layers or less among the n layers (n is an integer of 2 or more) of gas barrier layers.

[0067] Hitherto, for a gas barrier film formed by laminating n gas barrier layers, it has been basically common knowledge to improve the gas barrier property by modifying all of the n gas barrier layers. However, when all of the gas barrier layers have been modified, correspondingly, there is a tendency for the proportion of the light transmitted through the gas barrier film in the light incident on the gas barrier film to decrease, that is, there is a tendency for the total light transmittance to decrease and the light transmittance to deteriorate.

[0068] When the gas barrier layer is modified, generally, the surface layer portion on the modified side of the gas barrier layer is modified to become densified, and the inside of the gas barrier layer remains unmodified and retains the initial density. Therefore, even in the modified gas barrier layer, there are regions where densification occurs in the surface layer portion and regions where the initial density is retained in the inside.

[0069] Between these regions with different characteristics, the refractive indices are also different from each other, a difference in refractive index occurs, and light reflection occurs at the boundary between different regions. The frequency of light reflection increases as the number of modified gas barrier layers increases.

[0070] Therefore, when all of the gas barrier layers have been modified, a tendency for a high frequency of light reflection to occur, a decrease in the total light transmittance, and a deterioration in the light transmittance can be observed.

[0071] The inventors of the present invention have explored from various aspects such as attempts to increase the thickness of the gas barrier layer and attempts to increase the number of gas barrier layers in order to improve the gas barrier property.

[0072] Among them, when the total thickness of the gas barrier layer is made the same and a gas barrier layer formed of a single layer is compared with a gas barrier layer formed of multiple layers, the following insight has been obtained: Even if a part of the gas barrier layer formed of multiple layers is not modified, the gas barrier property increases.

[0073] The reason can be considered that defects such as damage and air holes inevitably generated on the surface of the gas barrier layer in the formation process of the gas barrier layer become the cause of the decrease in the gas barrier property.

[0074] In the present invention, by having two or more gas barrier layers, even when defects such as damage and air holes are generated on the surface of the gas barrier layer in the formation process of the gas barrier layer, the formation process of the gas barrier layer after the next layer also serves as a process for filling the defects, and as a result, a decrease in the gas barrier property can be prevented.

[0075] In addition, in the present invention, by having two or more gas barrier layers, even when defects such as damage and air holes are generated on the surface of the gas barrier layer in the formation process of the gas barrier layer of the next layer, the mere presence of at least one gas barrier layer in the inner layer also serves to fill the defects at the same time, and as a result, a decrease in the gas barrier property can be prevented.

[0076] If only the improvement of gas barrier property is simply pursued, all n gas barrier layers can be modified. However, on the other hand, there is a tendency for the total light transmittance to decrease and the light transmittance to deteriorate.

[0077] Therefore, in the present invention, by setting the number of modified gas barrier layers to be 1 or more and (n - 1) or less, the number of modified gas barrier layers can be determined in consideration of the balance between gas barrier property and light transmittance.

[0078] For example, in the case where the object to be sealed is an optical member such as an organic EL element, the number of laminated gas barrier layers is preferably 2 to 6 layers, and the preferred ranges of the number of modified gas barrier layers relative thereto are as follows.

[0079] When the number of gas barrier layers is 2, the number of modified layers is preferably 1 layer.

[0080] When the number of gas barrier layers is 3, the number of modified layers is preferably 1 to 2 layers, more preferably 1 layer.

[0081] When the number of gas barrier layers is 4, the number of modified layers is preferably 1 to 3 layers, more preferably 1 to 2 layers, and further preferably 1 layer.

[0082] When the number of gas barrier layers is 5, the number of modified layers is preferably 1 to 4 layers, more preferably 1 to 3 layers, further preferably 1 to 2 layers, and even more preferably 1 layer.

[0083] When the number of gas barrier layers is 6, the number of modified layers is preferably 1 to 5 layers, more preferably 1 to 4 layers, more preferably 1 to 3 layers, further preferably 1 to 2 layers, and even more preferably 1 layer.

[0084] In the present invention, the number of modified gas barrier layers is 1 or more and (n - 1) or less in the gas barrier layers of n layers or more (n is an integer of 2 or more), and preferably 1 layer.

[0085] Thereby, the boundary between the modified region and the unmodified region in the gas barrier layer, which would cause a decrease in light transmittance, can be reduced to the minimum. In addition, from the viewpoint of excellent balance between gas barrier property and light transmittance, it can be particularly advantageously used in the application of a sealing material for sealing an optical member such as an organic EL element. Further, compared with the case where all n layers are modified, since the number of modification processes can be reduced, the manufacturing cost can also be reduced.

[0086] In the present invention, the position of the modified gas barrier layer is not particularly limited, and preferably the outermost gas barrier layer is modified.

[0087] Although the details of the mechanism for improving the gas barrier property brought about by the present invention are not clear, when defects such as damage and pores are generated on the surface of the outermost gas barrier layer, if the degree of the defect is deep, it will reach near the surface of the inner gas barrier layer, which usually causes a decrease in the gas barrier property.

[0088] However, by setting the position of the modified gas barrier layer as the outermost gas barrier layer, the process of modifying the outermost gas barrier layer also serves as a process of modifying the vicinity of the surface of the inner gas barrier layer through this defect. As a result, a decrease in the gas barrier property can be effectively prevented, and it can be considered that the gas barrier property can be improved thereby.

[0089] From such a viewpoint, the outermost gas barrier layer is preferably directly laminated on the inner gas barrier layer.

[0090] It should be noted that the so-called "outermost layer" here refers to the layer formed last among all the gas barrier layers, and does not mean that no layer is formed on the surface on the side farther from the inner gas barrier layer in the outermost gas barrier layer. For example, it can also be formed by laminating an adhesive layer described later on the surface of the outermost gas barrier layer.

[0091] On the other hand, in the present invention, the position of the unmodified gas barrier layer is not particularly limited. However, when the gas barrier film has a resin layer, it is preferable that the gas barrier layer closest to the resin layer is not modified.

[0092] That is, in the present invention, at least one of the two or more gas barrier layers is an unmodified gas barrier layer. As the position of the at least one unmodified gas barrier layer, it is preferably the gas barrier layer closest to the resin layer. Although the details of the mechanism for improving the gas barrier property brought about by the present invention are not clear, in the gas barrier layers after the next layer of the gas barrier layer closest to the resin layer, even when defects such as damage and pores are generated on the surface of the modified layer, the existence of at least one inner gas barrier layer itself also serves to fill this defect. Moreover, the process of modifying the gas barrier layers after the next layer also serves as a process of modifying the vicinity of the surface of the inner gas barrier layer through this defect. As a result, a decrease in the gas barrier property can be effectively prevented, and it can be considered that the gas barrier property will be improved thereby. From such a viewpoint, the modified gas barrier layer is preferably directly laminated on the inner gas barrier layer.

[0093] The n gas barrier layers can all have the same thickness or different thicknesses.

[0094] The thickness of one gas barrier layer is preferably 50 to 500 nm, more preferably 50 to 400 nm, and further preferably 50 to 300 nm.

[0095] By making the thickness of the above-mentioned single gas barrier layer within the above range, a gas barrier film having a certain level of gas barrier property with a high effect of preventing permeation of gases such as oxygen and water vapor can be obtained.

[0096] The total thickness of the laminate formed by laminating n gas barrier layers is preferably 50 to 2000 μm, more preferably 50 to 1000 μm, and further preferably 50 to 500 μm.

[0097] By making the total thickness of the laminate formed by laminating the above-mentioned n gas barrier layers within the above range, the gas barrier property can be suitably exhibited, and it can be particularly advantageously used in the application of a sealing material for sealing optical components such as organic EL elements from the viewpoint of excellent balance between gas barrier property and light transmittance.

[0098] (Composition for gas barrier layer)

[0099] Each of the n gas barrier layers in the present invention is a layer formed from a composition for gas barrier layer containing a silicon compound.

[0100] Thereby, a gas barrier film having a certain level of gas barrier property with a high effect of preventing permeation of gases such as oxygen and water vapor can be obtained.

[0101] In addition, each of the n gas barrier layers in the present invention is preferably a layer formed from all the same composition.

[0102] Thereby, the interlayer adhesion between the n gas barrier layers can be improved. Moreover, between each layer of the n gas barrier layers, the refractive index difference can be reduced, and the light transmittance of the gas barrier film can be further improved.

[0103] In the composition for gas barrier layer used in one embodiment of the gas barrier layer of the present invention, relative to the total amount (100% by mass) of the active ingredients of the above-mentioned composition for gas barrier layer, the content of the silicon compound is preferably 70 to 100%, more preferably 80 to 100% by mass, and further preferably 90 to 100% by mass.

[0104] It should be noted that the "active ingredient of the composition for gas barrier layer" here refers to the components other than the solvent contained in the composition for gas barrier layer.

[0105] Hereinafter, each component contained in the composition for gas barrier layer suitable as a forming material for the gas barrier layer will be described.

[0106] (Silicon compound)

[0107] By making the composition for gas barrier layer contain a silicon compound, a certain level of gas barrier property with a high effect of preventing permeation of gases such as oxygen and water vapor can be exhibited.

[0108] Here, the "silicon compound" may be any compound containing silicon atoms, without particular limitation. It can be either an organic compound or an inorganic compound, either a high-molecular compound or a low-molecular compound.

[0109] Examples of the silicon compound include: high-molecular silicon compounds such as polyorganosiloxane compounds, polysilazane compounds, polysilane compounds, and polycarbosilane compounds; particles such as silicon oxide, silicon nitride, and silicon oxynitride; and so on.

[0110] Among them, high-molecular silicon compounds such as polysilazane compounds, polysilane compounds, and polycarbosilane compounds are preferred, and among them, polysilazane compounds are preferred.

[0111] From the viewpoint of reducing the refractive index difference between the layers of the n-layer gas barrier layer and further improving the light transmittance of the gas barrier film, it is preferred that the compositions of the respective layers forming the n-layer gas barrier layer in the present invention all contain the same type of silicon compound.

[0112] For example, when one layer of the n-layer gas barrier layer is a layer formed of a composition containing a polysilazane compound, it is preferred that all the other layers are also formed of a composition containing a polysilazane compound.

[0113] Here, the "polysilazane compound" refers to a polymer having a repeating unit containing a -Si-N- bond (silazane bond) in the molecule. Specifically, it refers to a polymer having a repeating unit represented by the following formula 1. It should be noted that the polysilazane compound represented by formula 1 may also be a polysilazane modifier.

[0114] [Chemical formula 1]

[0115] Formula 1:

[0116]

[0117] In formula 1, n represents the repeating unit and represents an integer of 1 or more. In addition, Rx, Ry, and Rz each independently represent a hydrogen atom, an unsubstituted or substituted alkyl group, an unsubstituted or substituted cycloalkyl group, an unsubstituted or substituted alkenyl group, an unsubstituted or substituted aryl group, or an unsubstituted or substituted alkylsilyl group.

[0118] Examples of the polysilazane compound represented by formula 1 include: an organic polysilazane compound in which at least one of the groups Rx, Ry, and Rz has a carbon atom-containing group other than a hydrogen atom, and an inorganic polysilazane compound in which Rx, Ry, and Rz are all hydrogen atoms.

[0119] Among them, from the viewpoint of achieving a high effect of satisfying a certain level of gas barrier performance, an inorganic polysilazane compound is preferred, and specifically, perhydropolysilazane is preferred.

[0120] (Solvent)

[0121] From the viewpoint of easily adjusting the composition for the gas barrier layer to a property suitable for coating when forming the gas barrier layer by coating, it is preferable to add a solvent to make the composition for the gas barrier layer into a solution form.

[0122] As the solvent, as long as it can dissolve or disperse the above-mentioned silicon compound, there is no particular limitation, and examples thereof include: aliphatic hydrocarbon solvents such as n-hexane and n-heptane; aromatic hydrocarbon solvents such as toluene and xylene; halogenated hydrocarbon solvents such as dichloromethane, dichloroethane, chloroform, carbon tetrachloride, 1,2-dichloroethane, and chlorobenzene; alcohol solvents such as methanol, ethanol, propanol, butanol, and propylene glycol monomethyl ether; ketone solvents such as acetone, methyl ethyl ketone, 2-pentanone, isophorone, and cyclohexanone; ester solvents such as ethyl acetate and butyl acetate; cellosolve solvents such as ethyl cellosolve; ether solvents such as 1,3-dioxolane; and the like.

[0123] Among them, as the solvent, aromatic hydrocarbon solvents and alcohol solvents are preferable.

[0124] The amount of the solvent used in the preparation of the composition for the gas barrier layer only needs to make the concentration of the active ingredient of the composition for the gas barrier layer reach preferably 5 to 50% by mass, more preferably 5 to 40% by mass, and further preferably 10 to 30% by mass.

[0125] It should be noted that the "active ingredient of the composition for the gas barrier layer" here refers to the components other than the solvent contained in the composition for the gas barrier layer.

[0126] (Other components)

[0127] Within the range not impairing the effects of the present invention, in addition to the silicon compound and the solvent, the composition for the gas barrier layer may further contain other components. As the other components, examples thereof include: UV curable resins, curing agents, anti-aging agents, light stabilizers, flame retardants, and the like.

[0128] As a method for modifying the gas barrier layer, examples thereof include: ion implantation treatment for modifying by implanting ions; plasma treatment for modifying by exposing to plasma; ultraviolet irradiation treatment for modifying by irradiating ultraviolet rays; and the like.

[0129] Among them, from the viewpoint of not making the surface of the gas barrier layer rough and being able to efficiently modify it to the inside to form a gas barrier layer with excellent gas barrier properties, as the modification treatment of the gas barrier layer, ion implantation treatment is preferable.

[0130] As the ions used in the ion implantation treatment, ions of rare gases such as argon, helium, neon, krypton, and xenon are preferable, and among them, argon is preferable.

[0131] As a method for implanting ions, there is no particular limitation. From the viewpoint of being able to easily perform ion implantation treatment, a method of implanting ions in a plasma (ions of a gas that generates a plasma) is preferred.

[0132] It should be noted that, as a method for modifying the gas barrier layer, an ultraviolet irradiation treatment for modification by irradiating ultraviolet rays can also be used. As the ultraviolet rays used in the ultraviolet irradiation treatment, for example, vacuum ultraviolet light can be cited.

[0133] As the ultraviolet irradiation treatment for modification by irradiating vacuum ultraviolet light, for example, the method described in Japanese Patent Application Laid-Open No. 2017-095758 can be adopted.

[0134] [Resin layer]

[0135] In the case where the gas barrier film of the present invention has a resin layer, it has n gas barrier layers (n is an integer of 2 or more). The n gas barrier layers can be directly laminated on the resin layer to form, or can be formed by interposing other layers (for example, a primer layer) on the resin layer. The resin layer can be a layer (substrate film) having a function as a support for supporting the gas barrier layer in the gas barrier film, or can be a layer that does not exhibit the function as a support.

[0136] The thickness of the resin layer is not particularly limited and can be appropriately determined according to the use purpose of the gas barrier film. The thickness of the resin layer is preferably 0.5 to 500 μm, more preferably 1 to 100 μm, and further preferably 20 to 80 μm.

[0137] In other embodiments of the present invention, the thickness of the resin layer is preferably 1 to 40 μm, more preferably 2 to 30 μm, further preferably 3 to 20 μm, and still further preferably 3 to 15 μm.

[0138] Thereby, it can be used with a thickness thinner than the substrate film usually used in the gas barrier film. As a result, the total thickness of the gas barrier film as a whole can be reduced.

[0139] Therefore, the gas barrier film of the present invention can also be suitably used for the use as a sealing material for sealing an object to be sealed (for example, a display element, etc.) that requires a thin member.

[0140] For such a resin layer with a thin thickness, compared with a normal substrate film, the function as a support of the gas barrier film is low. However, by the presence of the resin layer, damage and deterioration of the gas barrier layer that is usually formed as an extremely thin film can be appropriately suppressed, and the operation of the gas barrier film can be made easier compared with the state of a single gas barrier layer.

[0141] In addition, by the presence of the resin layer, in the case of the layer structure having the second release sheet as described above, the second release sheet can be appropriately peeled off and removed efficiently.

[0142] Examples of the material constituting the resin layer include: resins such as polyimide, polyamide, polyamideimide, polyphenylene ether, polyether ketone, polyether ether ketone, polyolefin, polyester, polycarbonate, polysulfone, polyethersulfone, polyphenylene sulfide, acrylic resin, cycloolefin polymer, and aromatic polymer; papers such as cellophane, coated paper, and high-grade paper; laminated papers obtained by laminating the above resins on these papers; and the like.

[0143] Among them, from the viewpoint of excellent transparency, polyester, polyamide, polysulfone, polyethersulfone, polyphenylene sulfide, and cycloolefin polymer are preferred, and polyester is particularly preferred.

[0144] Examples of the polyester include: polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyarylate, and the like.

[0145] The resin layer may also be formed of a composition in which a curable component and a polymerization initiator sometimes used for the bottom coating described later are added to the above resin.

[0146] [Bottom coating]

[0147] By providing the gas barrier film of the present invention with a bottom coating, the interlayer adhesion between the resin layer, particularly the base film, and the n-layer gas barrier layer can be improved.

[0148] The thickness of the bottom coating is preferably 0.01 to 50 μm, more preferably 0.1 to 30 μm, still more preferably 0.3 to 20 μm, and even more preferably 0.5 to 10 μm.

[0149] By making the thickness of the above bottom coating within the above range, the interlayer adhesion between the resin layer, particularly the base film, and the n-layer gas barrier layer can be appropriately improved easily.

[0150] The bottom coating is preferably formed, for example, from a bottom coating composition containing a curable component (A) and a filler (B).

[0151] Hereinafter, each component contained in the bottom coating composition suitable as a material for forming the bottom coating will be described.

[0152] <Curable component (A)>

[0153] By making the bottom coating composition contain the curable component (A), a bottom coating excellent in solvent resistance can be formed.

[0154] Here, the "curable component (A)" refers to: (i) a component that can undergo a controllable curing reaction, such as a component that cures by heating, like an epoxy resin; (ii) a component having a polymerizable unsaturated bond and forming a cured product through a polymerization reaction; or (iii) a component forming a cured product through a crosslinking reaction between polymers generated by a polymerization reaction; and so on.

[0155] Among the above (i) to (iii), as the component having a polymerizable unsaturated bond and forming a cured product through a polymerization reaction (hereinafter, also referred to as "polymerizable component (B1)"), examples include: a monofunctional monomer or polymer having 1 polymerizable unsaturated bond, a polyfunctional monomer or polymer having 2 or more polymerizable unsaturated bonds with 2 or more functional groups.

[0156] It should be noted that examples of the polymer having a polymerizable unsaturated bond include: a urethane (meth)acrylate oligomer, a polymer having a (meth)acryloyl group in the side chain of an acrylic polymer as the main chain.

[0157] As the polymerizable component (B1), a polyfunctional monomer or polymer having 2 or more functional groups is preferred, and among them, a polyfunctional monomer having 2 or more functional groups is preferred.

[0158] Hereinafter, taking a polyfunctional monomer having 2 or more functional groups as an example, the polymerizable component (B1) will be described in detail.

[0159] Examples of the polyfunctional monomer having 2 or more functional groups include 2 - 6 functional (meth)acrylic acid derivatives. As the 2 - functional (meth)acrylic acid derivative, the compound shown in the following formula 2 can be cited.

[0160] [Chemical formula 2]

[0161] Formula 2:

[0162]

[0163] In formula 2, R 1 represents a hydrogen atom or an alkyl group having 1 - 6 carbon atoms, and R 2 represents a divalent organic group.

[0164] As the divalent organic group represented by R 2 the group shown in the following formula 3 can be cited.

[0165] [Chemical formula 3]

[0166] Formula 3:

[0167] -O―(CH2) s -O-

[0168] -O(CH2CH2O) t -

[0169]

[0170] In Formula 3, s represents an integer from 1 to 20, t represents an integer from 1 to 30, u and v each independently represent an integer from 1 to 30, and the "-" at both ends represents the bonding position.

[0171] Specific examples of the bifunctional (meth)acrylate derivatives represented by Formula 2 and Formula 3 include, for example: tricyclodecane dimethanol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propoxylated ethoxylated bisphenol A di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, 1,10-decanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene, etc.

[0172] Examples of the trifunctional (meth)acrylic derivatives include: trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, propionic acid-modified dipentaerythritol tri(meth)acrylate, propylene oxide-modified trimethylolpropane tri(meth)acrylate, tris(acryloyloxyethyl) isocyanurate, etc.

[0173] Examples of the tetrafunctional (meth)acrylic derivatives include pentaerythritol tetra(meth)acrylate, etc.

[0174] Examples of the pentafunctional (meth)acrylic derivatives include propionic acid-modified dipentaerythritol penta(meth)acrylate, etc.

[0175] Examples of the hexafunctional (meth)acrylic derivatives include dipentaerythritol hexa(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, etc.

[0176] Among the above-mentioned bifunctional to hexafunctional (meth)acrylic derivatives, hexafunctional (meth)acrylic derivatives are preferred, among which dipentaerythritol hexa(meth)acrylate is preferred, and dipentaerythritol hexaacrylate is particularly preferred.

[0177] The molecular weight of the curable component (A) is usually 3000 or less, preferably 200 to 2000, and more preferably 200 to 1000.

[0178] <Filler (B)>

[0179] By making the undercoat composition contain the filler (B), the interlayer adhesion between the resin layer and the n-layer gas barrier layer can be improved.

[0180] As the "filler (B)", any filler such as an inorganic filler or an organic filler can be used, and from the viewpoint of high interlayer adhesion effect, an inorganic filler is preferred.

[0181] Examples of the inorganic filler include: silicates such as clay, talc, mica, kaolin, zeolite, calcium silicate, montmorillonite, bentonite, etc.; oxides such as silica, diatomaceous earth, barium ferrite, barium oxide, pumice, etc.; hydroxides such as aluminum hydroxide, magnesium hydroxide, basic magnesium carbonate, etc.; carbonates such as calcium carbonate, magnesium carbonate, dolomite, dawsonite, etc.; sulfates or sulfites such as calcium sulfate, barium sulfate, calcium sulfite, etc.; and the like.

[0182] Among them, oxides are preferred, and silica is more preferred.

[0183] The particle size of the filler (B) is preferably 3 to 100 nm, more preferably 3 to 60 nm, and further preferably 5 to 30 nm.

[0184] By making the particle size of the above-mentioned undercoat layer within the above range, the interlayer adhesion between the resin layer and the n-layer gas barrier layer can be improved.

[0185] As the inorganic filler, a dry powder filler can be used, and from the viewpoint of dispersion stability, a filler dispersed in an organic solvent to form a colloidal solution is preferably used.

[0186] (Solvent)

[0187] Examples of the organic solvent (dispersion medium) for dispersing the filler (B) include: aromatic hydrocarbon solvents such as toluene and xylene; alcohol solvents such as methanol, ethanol, propanol, butanol, and propylene glycol monomethyl ether; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, 2-pentanone, isophorone, and cyclohexanone; ester solvents such as ethyl acetate and butyl acetate; ether solvents such as 1,3-dioxolane; and the like.

[0188] Among them, ketone solvents are preferred, and methyl ethyl ketone and methyl isobutyl ketone are more preferred.

[0189] Regarding the amount of the organic solvent (dispersion medium) for dispersing the filler (B), it is sufficient to make the solid content concentration of the filler (B) reach preferably 5 to 80% by mass, more preferably 10 to 70% by mass, and further preferably 20 to 60% by mass.

[0190] (Polymerization initiator)

[0191] When the undercoat layer composition contains the polymerizable component (B1), it is preferred that the undercoat layer composition contains a polymerization initiator.

[0192] Examples of the polymerization initiator include: thermal polymerization initiators and photo polymerization initiators.

[0193] Among them, as the polymerization initiator, a photoinitiator is preferably used. Specifically, an alkylbenzophenone photoinitiator, a phosphorus photoinitiator, an oxime ester photoinitiator, a benzophenone photoinitiator, a thioxanthone photoinitiator, or an aromatic ketone photoinitiator is preferably used. Among them, an aromatic ketone photoinitiator is more preferably used.

[0194] Examples of the aromatic ketone photoinitiator include 1-hydroxycyclohexyl phenyl ketone.

[0195] The content of the polymerization initiator contained in the primer coat composition is preferably 0.2 to 6.2 parts by mass, more preferably 0.2 to 5.2 parts by mass, and further preferably 0.2 to 4.2 parts by mass with respect to 100 parts by mass of the curable component (A).

[0196] (Other components)

[0197] Within the range not impairing the effects of the present invention, other components may be contained in the primer coat composition in addition to the curable component (A), the filler (B), the polymerization initiator, and the solvent. Examples of the other components include plasticizers, antioxidants, ultraviolet absorbers, and the like.

[0198] [Adhesive layer]

[0199] The gas barrier film of the present invention may be constituted as long as one or more and less than or equal to (n - 1) layers of the modified layers in the n-layer (n is an integer of 2 or more) gas barrier layers are provided, and is not particularly limited. The adhesive layer may also be laminated on the surface of the outermost gas barrier layer or on the surface of the resin layer on the opposite side of the side in contact with the gas barrier layer.

[0200] By providing the gas barrier film of the present invention with an adhesive layer, the surface of the adhesive layer can be adhered to the surface of the object to be sealed to obtain a sealed body.

[0201] The adhesive layer provided in the gas barrier film of the present invention is not particularly limited, and an existing publicly known adhesive layer can be used within the range not impairing the effects of the present invention.

[0202] Examples of the material for forming the adhesive layer include an adhesive layer composition containing a polyolefin resin and a thermosetting resin.

[0203] The thickness of the adhesive layer is preferably 0.5 to 100 μm, more preferably 1 to 60 μm, and further preferably 3 to 40 μm.

[0204] By making the thickness of the above-mentioned adhesive layer within the above range, it can be suitably used when the gas barrier film of the present invention is used as a sealing material.

[0205] [Release sheet]

[0206] As the release sheets, the first release sheet, and the second release sheet that can be used for the gas barrier film and the sealant of the present invention, a release sheet subjected to double-sided release treatment, a release sheet subjected to single-sided release treatment, etc. can be used, and examples thereof include a release sheet obtained by coating a release agent on a substrate for a release sheet.

[0207] Examples of the substrate for the release sheet include: papers such as high-grade paper, cellophane, kraft paper, etc.; plastic films such as polyester resin films such as polyethylene terephthalate resin, polybutylene terephthalate resin, polyethylene naphthalate resin, etc., olefin resin films such as polypropylene resin, polyethylene resin, etc.; and the like.

[0208] Examples of the release agent include: silicone resins, olefin resins, rubber-like elastomers such as isoprene resins, butadiene resins, etc., long-chain alkyl resins, alkyd resins, fluororesins, etc.

[0209] The thickness of the release sheet is not particularly limited, preferably 10 to 200 μm, more preferably 25 to 170 μm, and further preferably 35 to 80 μm.

[0210] (Method for manufacturing a gas barrier film)

[0211] The method for manufacturing the gas barrier film in the present invention is not particularly limited, and examples thereof include the methods shown below.

[0212] First, a composition for a primer coat is coated on the surface of a substrate film (resin layer) to form a coating film, and the coating film is dried under given conditions to form a primer coat on the surface of the substrate film. A composition for a gas barrier layer is coated on the primer coat to form a coating film, and the coating film is dried under given conditions to form a first gas barrier layer on the primer coat.

[0213] Then, a composition for a gas barrier layer is coated on the first gas barrier layer to form a coating film, and the coating film is dried under given conditions to form a second gas barrier layer on the first gas barrier layer. The surface of the second gas barrier layer is subjected to a modification treatment based on plasma ion implantation, and a gas barrier film having a layer structure of substrate film / primer coat / first gas barrier layer (unmodified) / second gas barrier layer (modified) can be manufactured.

[0214] As the coating method for each of the above compositions, a solution method can be cited, and examples thereof include: die coating method, spin coating method, bar coating method, dip coating method, roll coating method, gravure coating method, knife coating method, air knife coating method, roll knife coating method, screen printing method, spraying method, gravure offset printing method, blade coating method, etc.

[0215] [Sealant]

[0216] The sealing body of the present invention is formed by sealing an object to be sealed with the gas barrier film of the present invention as a sealing material. According to the present invention, a gas barrier film having a gas barrier property satisfying a certain level, high light transmittance, and capable of reducing manufacturing costs can be obtained. The certain level is a level with a high effect of preventing the permeation of gases such as oxygen and water vapor.

[0217] Examples of the object to be sealed include at least one selected from an organic EL element, an organic EL display element, an inorganic EL element, an inorganic EL display element, an electronic paper element, a liquid crystal display element, and a solar cell element.

[0218] (Method for manufacturing a sealing body)

[0219] The method for manufacturing the sealing body of the present invention is not particularly limited. For example, when the gas barrier film of the present invention as a sealing material is in the form shown below, first, the release sheet is peeled off, and the surface of the exposed adhesive layer is bonded to the surface of the object to be sealed, and they are bonded under desired conditions to obtain a sealing body.

[0220] · Substrate film / Base coat / First gas barrier layer / Second gas barrier layer / Adhesive layer / Release sheet

[0221] In addition, when the gas barrier film of the present invention as a sealing material is in the form shown below, first, the second release sheet is peeled off, and the surface of the exposed adhesive layer is bonded to the surface of the object to be sealed, and they are bonded under desired conditions to obtain a sealing body.

[0222] · Second release sheet / Resin layer / First gas barrier layer / Second gas barrier layer / Adhesive layer / First release sheet Usually, the second release sheet is peeled off after the adhesive layer surface and the object to be sealed are formed.

[0223] According to such a method for manufacturing a sealing body, even when the resin layer is not sufficient to function as a support for the gas barrier film, that is, when the thickness of the resin layer is very thin, the second release sheet functions as a support for the gas barrier film until the second release sheet is peeled off. Therefore, breakage and deformation of the resin layer can be prevented, and the operability is excellent.

[0224] Examples

[0225] Hereinafter, examples are given to explain the present invention in more detail. However, the present invention is not limited by any of the following examples. It should be noted that unless otherwise specified, "parts" and "%" described below are based on "mass".

[0226] (Example 1)

[0227] [Manufacture of gas barrier film]

[0228] (1) Formation process of the bottom coating

[0229] Dipentaerythritol hexaacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., "A-DPH") as the curing component (A) and silicone sol (manufactured by Nissan Chemical Industries, Ltd., "MIBK-AC-2140Z") as the colloidal solution containing the filler (B) were mixed at a volume ratio (amount including the solvent) of 45:55. 1 part by mass (relative to 100 parts by mass of the curable component (A)) of 1-hydroxycyclohexyl phenyl ketone (manufactured by BASF Corporation, "Irgacure 184") as a photopolymerization initiator was added and mixed to prepare a composition for the bottom coating.

[0230] Here, the above-mentioned "MIBK-AC-2140Z" is a colloidal solution obtained by adjusting the concentration of acryloyl-modified silica with a particle size of 10 - 15 nm to 40% solution with methyl isobutyl ketone.

[0231] The above-prepared composition for the bottom coating was applied onto the surface of a polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., "PET50A-4300", thickness 50 μm) as a substrate film by the bar coating method to form a coating film.

[0232] After heating and drying the coating film at 70°C for 1 minute, UV light irradiation was performed using UV light irradiation rays (high-pressure mercury lamp, linear velocity: 20 m / min, cumulative light amount: 100 mJ / cm 2 , peak intensity: 1.466 W, number of passes: 2 times), and a bottom coating with a thickness of 1 μm was formed on the above-mentioned substrate film.

[0233] (2) Formation process of the gas barrier layer

[0234] <First layer>

[0235] Next, an inorganic polysilazane-based coating agent as a composition for the gas barrier layer was applied onto the above-formed bottom coating by the spin coating method as a solution method to form a coating film.

[0236] Here, the above-mentioned "inorganic polysilazane-based coating agent" is a solution obtained by adjusting the concentration of "AQUAMICA NL110-20 (main component: perhydropolysilazane)" manufactured by Merck Performance Materials to 20% by mass with xylene.

[0237] Then, the obtained coating film was heated at 120°C for 2 minutes to dry the coating film, and a first-layer gas barrier layer containing an inorganic polysilazane compound with a thickness of 200 nm was formed on the above-mentioned bottom coating.

[0238] <Second layer>

[0239] Next, through the same operations as in the formation process of the above-mentioned first gas barrier layer, a second gas barrier layer with a thickness of 200 nm containing an inorganic polysilazane compound was formed on the formed first gas barrier layer.

[0240] Furthermore, using a plasma ion implantation device (RF power supply: "RF56000" manufactured by JEOL Ltd., high-voltage pulse power supply: "PV-3-HSHV-0835" manufactured by Kurita Water Industries Ltd.), the surface of the formed second gas barrier layer was subjected to a modification treatment based on plasma ion implantation under the conditions shown below, and a gas barrier film of Example 1 having a layer structure of substrate film / undercoat layer / first gas barrier layer (unmodified) / second gas barrier layer (modified) was fabricated.

[0241] <Plasma ion implantation conditions>

[0242] · Gas for generating plasma: Argon

[0243] · Gas flow rate: 100 sccm

[0244] · Duty ratio: 0.5%

[0245] · Applied voltage: -6 kV

[0246] · RF power supply: Frequency 13.56 MHz, applied power 1000 W

[0247] · Chamber pressure: 0.2 Pa

[0248] · Pulse width: 5 microseconds

[0249] · Processing time (ion implantation time): 200 seconds

[0250] (Comparative Example 1)

[0251] In the formation process of the gas barrier layer of Example 1, a first gas barrier layer with a thickness of 200 nm was formed on the undercoat layer, and the surface of the first gas barrier layer was subjected to a modification treatment based on plasma ion implantation through the same operations as in Example 1. The second gas barrier layer was not formed. Except for this, a gas barrier film of Comparative Example 1 was fabricated in the same manner as in Example 1.

[0252] (Comparative Example 2)

[0253] In the formation process of the gas barrier layer of Example 1, a first gas barrier layer with a thickness of 400 nm was formed on the undercoat layer, and the surface of the first gas barrier layer was subjected to a modification treatment based on plasma ion implantation through the same operations as in Example 1. The second gas barrier layer was not formed. Except for this, a gas barrier film of Comparative Example 2 was fabricated in the same manner as in Example 1.

[0254] (Comparative Example 3)

[0255] In the step of forming the gas barrier layer of Example 1, the surface of the first gas barrier layer was subjected to a modification treatment based on plasma ion implantation by the same operation as in Example 1. Except for this, the gas barrier film of Comparative Example 3 was produced in the same manner as in Example 1.

[0256] For the gas barrier films produced in the above-mentioned Example 1 and Comparative Examples 1 to 3, the following methods were used to evaluate (1) gas barrier properties and (2) light transmittance, and the results are summarized in Table 1.

[0257] [Evaluation Method]

[0258] (1) Evaluation of gas barrier properties

[0259] Each of the gas barrier films produced in the above-mentioned Example 1 and Comparative Examples 1 to 3 was used as a specimen for measuring the water vapor transmission rate.

[0260] Using a water vapor transmission rate measuring device (manufactured by MOCON, "AQUATRAN"), the water vapor transmission rate (g / m 2 / day) of the specimen for measurement was measured in a high-temperature and high-humidity environment at 40°C and a relative humidity of 90%. It should be noted that the detection lower limit value of the water vapor transmission rate measuring device is 5×10 -4 (g / m 2 / day).

[0261] Based on the results of the water vapor transmission rate (g / m 2 / day) measured in this way, the gas barrier properties were evaluated according to the following criteria.

[0262] A: The water vapor transmission rate is 5×10 -3 (g / m 2 / day) or less

[0263] B: The water vapor transmission rate is greater than 5×10 -3 (g / m 2 / day)

[0264] (2) Evaluation of light transmittance

[0265] Each of the gas barrier films produced in the above-mentioned Example 1 and Comparative Examples 1 to 3 was used as a specimen for measuring the total light transmittance.

[0266] According to JIS K7361-1, the total light transmittance (%) was measured using a haze meter (manufactured by Nippon Denshoku Industries Co., Ltd., "HAZE METER NDH5000").

[0267] [Table 1]

[0268]

[0269] (Summary of results)

[0270] Based on the evaluation results shown in Table 1, the following conclusions can be obtained.

[0271] It can be seen that in the production of the gas barrier film of Comparative Example 1, since the second gas barrier layer was not formed, although the gas barrier film of Comparative Example 1 obtained the same level of light transmittance as that of Example 1, its gas barrier property was worse than that of Example 1.

[0272] It can be seen that in the production of the gas barrier film of Comparative Example 2, although the total thickness of the gas barrier layer was set to be the same as that of Example 1, since the second gas barrier layer was not formed, although the gas barrier film of Comparative Example 2 obtained light transmittance, its gas barrier property was worse than that of Example 1.

[0273] It can be seen that in the production of the gas barrier film of Comparative Example 3, since both the first layer and the second layer passed through the modified treatment layer, although the gas barrier film of Comparative Example 3 obtained a gas barrier property that met a certain level, its light transmittance was worse than that of Example 1.

[0274] In contrast, it can be seen that in the production of the gas barrier film of Example 1, since the number of stacked gas barrier layers was set to be two or more, and the number of gas barrier layers subjected to the modified treatment was set to be one or more and (n - 1) layers or less, the gas barrier film of Example 1 had a gas barrier property that met a certain level, high light transmittance, excellent balance between gas barrier property and light transmittance. Compared with Comparative Example 1 in which both the first layer and the second layer were set as the modified treatment layer, the number of processes for the modified treatment can be reduced, and thus the manufacturing cost can also be reduced.

[0275] Industrial applicability

[0276] The gas barrier film of the present invention has a gas barrier property that meets a certain level with a high effect of preventing the permeation of gases such as oxygen and water vapor, and high light transmittance, and can reduce the manufacturing cost. Therefore, it can be suitably used in a wide range of fields such as various electronic devices, electronic components, and optical components. For example, it can be used for organic EL elements, organic EL display elements, inorganic EL elements, inorganic EL display elements, electronic paper elements, liquid crystal display elements, and solar cell elements, etc.

Claims

1. A gas barrier film, which has a resin layer and has n gas barrier layers on the resin layer, the gas barrier layers being formed of a composition containing a silicon compound, n being an integer of 2 or more, in the n gas barrier layers, 1 or more and (n - 1) or less layers have been subjected to a modification treatment, the gas barrier layer closest to the resin layer has not been subjected to a modification treatment, the modification treatment is an ion implantation treatment using a noble gas.

2. The gas barrier film according to claim 1, wherein in the n gas barrier layers, 1 gas barrier layer has been subjected to a modification treatment.

3. The gas barrier film according to claim 1 or 2, wherein in the n gas barrier layers, the outermost gas barrier layer has been subjected to a modification treatment.

4. The gas barrier film according to claim 1 or 2, wherein the n gas barrier layers are all layers formed of a composition containing the same type of silicon compound.

5. The gas barrier film according to claim 1 or 2, wherein the n gas barrier layers are all layers formed of the same composition.

6. The gas barrier film according to claim 1 or 2, wherein the total light transmittance of the gas barrier film is 89% or more.

7. The gas barrier film according to claim 1 or 2, wherein The water vapor transmission rate of the gas barrier film is 5×10 -3 (g / m 2 / day) or less.

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