Dynamic thermal protection device using pulsed jet cooling technology and control method

Abstract

The invention discloses a dynamic thermal protection device using a pulsed jet cooling technology and a control method.The dynamic thermal protection device comprises a pulsed jet cooling system, a liquid storage tank, a deflation valve, a mass flow controller and an electromagnetic valve pulsed jet excitation device, the liquid storage tank provides liquid nitrogen, and after being adjusted through the deflation valve and the mass flow controller, the liquid nitrogen flows into the electromagnetic valve pulsed jet excitation device; and finally, the water is sprayed to the surface of the photoelectric equipment chip for cooling. The device predicts the temperature change of the chip through a neural network algorithm, dynamically adjusts the frequency and intensity of the pulse jet flow, and achieves the precise cooling of the surface of the photoelectric equipment chip. The dynamic thermal protection device is compact in structure, easy to machine and assemble, convenient to use and low in cost, the space station optoelectronic equipment can achieve self-adaptive adjustment of the heat dissipation capacity according to the temperature of the space station optoelectronic equipment, and stable operation of the equipment is ensured.

Description

Technical Field

[0001] The present invention relates to the field of thermal protection for space optoelectronic device components, and particularly relates to a dynamic thermal protection device and control method using pulsed jet cooling technology Background Art

[0002] The on-orbit operation time of space station optoelectronic devices is continuously extended, and the task complexity is increasing day by day, which requires higher requirements for the thermal control system of the devices. When the space station optoelectronic devices are in on-orbit operation, they face a complex and changeable thermal environment. The combined action of external heat fluxes such as solar radiation and earth albedo and the heat generated by the devices themselves leads to intensified temperature fluctuations. Traditional passive thermal control technologies such as heat pipes and phase change materials have shown obvious deficiencies: the working medium distribution of heat pipes is uneven under microgravity, and the heat transfer efficiency is significantly reduced; the heat storage capacity of phase change materials is limited and cannot be dynamically adjusted, making it difficult to cope with transient high heat loads. These passive solutions can neither achieve precise temperature control nor adapt to the rapid changes in device power

[0003] Existing active cooling systems also have many defects. The fluid circulation system relies on mechanical pumps, which not only consume high power, but also the reliability of its moving parts is difficult to guarantee during long-term on-orbit operation. The flow characteristics of the cooling working medium in the microgravity environment are extremely complex, and gas-liquid separation often occurs, seriously affecting the heat dissipation efficiency. More critically, these systems mostly adopt control strategies with fixed thresholds and cannot be dynamically adjusted according to the actual working conditions of the devices, resulting in insufficient cooling or energy waste

[0004] Multi-source collaborative management is another problem faced by current technologies. With the improvement of the integration degree of optoelectronic devices, traditional heat dissipation solutions are difficult to meet the differentiated heat dissipation requirements of different parts. Frequent local overheating phenomena seriously affect the performance and lifespan of the devices. Although miniaturization technologies such as MEMS can reduce the system volume, they often do so at the cost of sacrificing heat dissipation ability and cannot fundamentally solve the problem

[0005] Existing thermal control technologies have obvious deficiencies in terms of adaptability, reliability, and energy efficiency. Passive solutions lack dynamic adjustment capabilities, while active systems are limited by power consumption, reliability, and control accuracy. As a new type of active thermal control means, pulsed jet cooling technology uses the impact heat transfer effect of high-speed gas jets. However, there are still many problems to be solved when applying pulsed jet cooling technology to the dynamic thermal protection of space station optoelectronic devices. First, the microgravity environment of the space station has a significant impact on the jet morphology and heat transfer characteristics, and it is necessary to deeply study the jet dynamics behavior under microgravity. Second, the limited resource conditions of the space station impose strict restrictions on the weight and power consumption of the cooling system, requiring highly optimized system design. Third, the long-term on-orbit operation of the space station has extremely high requirements for the reliability of the system, and it is necessary to solve the problem of long-life operation of the pulsed jet cooling system Summary of the Invention

[0006] Objective of the Invention: The present invention provides a dynamic thermal protection device and a control method using pulsed jet cooling technology. By dynamically adjusting the frequency and intensity of the pulsed jet through a neural network, precise cooling of the surface of the optoelectronic device chip is achieved, ensuring the temperature stability of the device under different working conditions.

[0007] Technical Solution: The present invention proposes a dynamic thermal protection device using pulsed jet cooling technology, which includes a main body, a frame located on the main body, a control chip, a mass flow manager, a liquid storage tank, and a solenoid valve pulsed jet excitation device located above the frame; the mass flow manager and the liquid storage tank are located at the bottom layer on the side of the frame, the liquid storage tank is connected to the mass flow manager, the solenoid valve pulsed jet excitation device is located in the middle of the side of the frame, the solenoid valve pulsed jet excitation device is connected to the mass flow manager, and the solenoid valve pulsed jet excitation device is externally connected to a pipeline to the lower surface of the control chip.

[0008] Preferably, a gas release valve is provided on the mass flow manager.

[0009] Preferably, the control chip includes an optoelectronic device chip and a feedback system, and the feedback system is connected to the optoelectronic device chip.

[0010] Preferably, the feedback system includes a temperature sensor, an electronic control device, and a neural network controller. The temperature sensor is located on the surface of the optoelectronic device chip, and after the temperature sensor and the electronic control device are connected, they are controlled by the neural network controller.

[0011] Preferably, the neural network controller adopts a BP neural network, an RBF neural network, or a deep neural network.

[0012] Preferably, the liquid in the liquid storage tank is liquid nitrogen, the maximum flow rate of the liquid storage tank is 2.6 m3 / min, and the pressure is 0.8 MPA.

[0013] Preferably, the rated voltage of the solenoid valve pulsed jet excitation device is 24V.

[0014] A control method for a dynamic thermal protection device using pulsed jet cooling technology includes the following steps: When the main body is working, the liquid storage tank provides liquid nitrogen, which is adjusted by the mass flow manager and then enters the solenoid valve pulsed jet excitation device, and finally sprays onto the surface of the control chip for cooling. The temperature sensor monitors the temperature change on the surface of the optoelectronic device chip in real time, the electronic control device dynamically adjusts the parameters according to the temperature sensor, and finally continuously monitors and adjusts.

[0015] Preferably, the temperature sensor monitors the temperature change on the surface of the optoelectronic device chip in real time, which specifically includes the following: when the temperature is higher than the threshold, the temperature sensor converts the temperature signal into an electrical signal and transmits it to the electronic control device, and the electronic control device adjusts the working state of the solenoid valve pulsed jet excitation device according to the temperature signal, increasing the frequency and intensity of the pulsed jet; when the body temperature is lower than the threshold, the electronic control device reduces the frequency and intensity of the pulsed jet of the solenoid valve pulsed jet excitation device. When the body temperature is stable, the current working state of the solenoid valve pulsed jet excitation device is maintained.

[0016] Beneficial effects: The device and control method for dynamically thermally protecting a space station optoelectronic device using pulsed jet cooling technology provided by the present invention adopt a solenoid valve pulsed jet excitation structure. By monitoring the temperature change in real time with a temperature sensor and adjusting the frequency and intensity of the pulsed jet through an electronic control device, the self-adaptive adjustment of the optoelectronic device temperature is realized. The neural network algorithm is also used to predict the chip temperature change and dynamically adjust the frequency and intensity of the pulsed jet to achieve precise cooling of the surface of the optoelectronic device chip. The present invention has the advantages of compact structure, simple processing and assembly, convenient use, and low cost. Brief Description of the Drawings

[0017] Figure 1 It is a schematic diagram of the overall structure of the dynamic thermal protection device of the present invention;

[0018] Figure 2 It is a working flow chart of the pulsed dynamic thermal protection device of the present invention;

[0019] Figure 3 It is a working flow chart of the temperature feedback system of the present invention;

[0020] Figure 4 It is a working flow chart of the mass flow control system of the present invention. Detailed Embodiment

[0021] As Figure 1 shown, the embodiment of the present invention provides a device for dynamically thermally protecting using pulsed jet cooling technology, including a main body 1, a liquid storage tank 3, a gas release valve 6, a mass flow controller 2, an electromagnetic pulsed jet excitation device 4, and a control chip 5. A frame 7 is provided on the main body 1, and a mass flow controller 2, a liquid storage tank 3, an electromagnetic pulsed jet excitation device 4, and a control chip 5 are respectively provided on the frame 7. The liquid storage tank 3 is connected to the mass flow manager 2 through a pipeline, and the solenoid valve pulsed jet excitation device 4 is connected to the mass flow manager 2 through a pipeline. The solenoid valve pulsed jet excitation device 4 is externally connected to a pipeline to the lower surface of the control chip 5. A gas release valve 6 is provided on the mass flow manager 2. The control chip 5 includes an optoelectronic device chip and a feedback system. The feedback system includes a temperature sensor, an electronic control device, and a neural network controller. The temperature sensor is located on the surface of the optoelectronic device chip. After the temperature sensor and the electronic control device are connected, they are controlled by the neural network controller.

[0022] The liquid storage tank 3 serves as the power source of the system, providing liquid nitrogen with a maximum flow rate of 2.6 m 3 / min and a pressure of 0.8 MPa. After being regulated by the mass flow controller and the bleed valve, the liquid nitrogen in the liquid storage tank 3 enters the solenoid valve pulsed jet excitation device 4 and is finally sprayed onto the surface of the optoelectronic device chip through the pipeline nozzle for cooling. The rated voltage of the solenoid valve pulsed jet excitation device 4 is 24V, and it can adjust the frequency and intensity of the pulsed jet in real time according to the feedback signal of the control chip 5, so as to realize the dynamic cooling of the surface of the optoelectronic device chip.

[0023] As Figure 2 and Figure 4 shown, the working process of the dynamic thermal protection device of the present invention is as follows: When the main body 1 is working, the liquid storage tank 3 provides liquid nitrogen, which enters the solenoid valve pulsed jet excitation device 4 after being regulated by the mass flow manager 2, and is finally sprayed onto the surface of the control chip 5 for cooling. The temperature sensor monitors the temperature change on the surface of the optoelectronic device chip in real time, and the electronic control device dynamically adjusts the parameters according to the temperature sensor. Finally, when the optoelectronic device on the space station is working, the temperature sensor monitors the temperature change on the surface of the device chip in real time.

[0024] As Figure 3 shown, when the temperature rises, the temperature sensor converts the temperature signal into an electrical signal and transmits it to the electronic control device. The electronic control device adjusts the working state of the solenoid valve pulsed jet excitation device 4 according to the temperature signal, increases the frequency and intensity of the pulsed jet, and speeds up the heat dissipation rate; when the device stops working or the temperature drops, the electronic control device reduces the frequency and intensity of the pulsed jet, reduces the heat dissipation rate, and when the temperature is stable, maintains the current working state of the solenoid valve pulsed jet excitation device 4; thus realizing the adaptive adjustment of the heat dissipation capacity. Through this closed-loop control mechanism, the device can effectively cope with the heat load changes of the optoelectronic device under different working conditions and ensure the temperature stability of the device.

[0025] The temperature sensor is installed on the surface of the optoelectronic device chip, monitors the chip temperature in real time, and transmits the temperature signal to the electronic control device. The electronic control device dynamically adjusts the working state of the solenoid valve according to the temperature signal and the preset control algorithm to ensure that the frequency and intensity of the pulsed jet match the heat dissipation requirements of the device. The solenoid valve pulsed jet excitation device 4 can realize the precise cooling of the surface of the optoelectronic device chip by adjusting the frequency and intensity of the pulsed jet. The cooling medium of the pulsed jet is liquid nitrogen, and its temperature and pressure can be dynamically adjusted according to the heat dissipation requirements of the optoelectronic device to further optimize the cooling effect.

[0026] The feedback system is used to monitor the temperature change of the optoelectronic device in real time and automatically adjust the frequency and intensity of the pulsed jet according to the temperature change. The feedback control system dynamically controls the temperature and pressure of liquid nitrogen through a neural network controller to ensure optimal cooling effects under different working conditions. The neural network controller adopts a BP neural network, an RBF neural network or a deep neural network. Based on historical temperature data and real-time monitoring data, the neural network controller predicts the future heat load distribution and adjusts the jet parameters in advance to achieve precise thermal protection. This intelligent control method not only improves the response speed of the system, but also significantly reduces energy consumption, meeting the energy-saving requirements for the long-term in-orbit operation of the space station.

[0027] In practical applications, the solenoid valve pulsed jet excitation device 4 is externally connected to multiple pipelines. The pipeline layout can be optimized according to the actual structure of the optoelectronic device to ensure that the cooling medium evenly covers the surface of the optoelectronic device chip. By reasonably arranging the pipelines, the device can effectively avoid problems such as local overheating or uneven cooling, further improving the thermal protection effect. In addition, the liquid storage tank 3, the gas release valve 6 and the mass flow controller 2 form a mass flow regulation and measurement system, which can precisely control the liquid nitrogen flow rate entering the solenoid valve pulsed jet excitation device to ensure the stable operation of the system.

[0028] The dynamic thermal protection device of the present invention has the advantages of compact structure, simple processing and assembly, convenient use, low cost, etc. By adjusting the frequency and intensity of the pulsed jet, the device can achieve adaptive adjustment of the temperature of the optoelectronic device to ensure the temperature stability of the device under different working conditions. In addition, the feedback control system and neural network algorithm adopted by the device further improve the intelligent level and control accuracy of the system, and can effectively cope with the complex and changeable thermal environment of the space station.

Claims

1. A dynamic thermal protection device using pulse jet cooling technology, characterized in that: The invention comprises a main body (1), a frame (7) located on the main body (1), a control chip (5) located above the frame (7), a mass flow manager (2), a liquid storage tank (3) and an electromagnetic valve pulse jet excitation device (4); the mass flow manager (2) and the liquid storage tank (3) are located at the bottom layer of the side of the frame (7), the liquid storage tank (3) is connected to the mass flow manager (2), the electromagnetic valve pulse jet excitation device (4) is located in the middle of the side of the frame (7), the electromagnetic valve pulse jet excitation device (4) is connected to the mass flow manager (2), and the electromagnetic valve pulse jet excitation device (4) is connected to the lower surface of the control chip (5) by an external pipeline.

2. The dynamic thermal protection device using pulse jet cooling technology according to claim 1 is characterized in that: The mass flow manager (2) is provided with a vent valve (6).

3. The dynamic thermal protection device using pulse jet cooling technology according to claim 1 is characterized in that: The control chip (5) comprises an optoelectronic device chip and a feedback system, and the feedback system (5) is connected to the optoelectronic device chip.

4. The dynamic thermal protection device using pulse jet cooling technology according to claim 3 is characterized in that: The feedback system includes a temperature sensor, an electric control device and a neural network controller. The temperature sensor is located on the surface of the optoelectronic device chip. After the temperature sensor and the electric control device are connected, they are controlled by the neural network controller.

5. The dynamic thermal protection device using pulse jet cooling technology according to claim 4 is characterized in that: The neural network controller adopts BP neural network, RBF neural network or deep neural network.

6. The dynamic thermal protection device using pulse jet cooling technology according to claim 1, characterized in that: The liquid storage tank (3) contains liquid nitrogen, and the maximum flow rate of the liquid storage tank (3) is 2.6 m3 / min, and the pressure is 0.8 MPa.

7. The dynamic thermal protection device using pulse jet cooling technology according to claim 1, characterized in that: The rated voltage of the solenoid valve pulse jet excitation device (4) is 24V.

8. A control method for a dynamic thermal protection device using pulse jet cooling technology according to any one of claims 1 to 7, characterized in that: The method comprises the following steps: when the main body (1) is working, the liquid nitrogen provided by the liquid storage tank (3) enters the electromagnetic valve pulse jet excitation device (4) after being adjusted by the mass flow manager (2), and finally sprayed onto the surface of the control chip (5) for cooling; the temperature sensor monitors the temperature change of the surface of the photoelectric device chip in real time; the electronic control device dynamically adjusts the parameters according to the temperature sensor, and finally continuously monitors and adjusts.

9. The control method of a dynamic thermal protection device using pulse jet cooling technology according to claim 8, characterized in that: The temperature sensor monitors the temperature change on the surface of the optoelectronic device chip in real time, specifically including the following contents: when the temperature is higher than a threshold value, the temperature sensor converts the temperature signal into an electrical signal and transmits it to the electronic control device, and the electronic control device adjusts the working state of the solenoid valve pulse jet excitation device (4) according to the temperature signal, and increases the frequency and intensity of the pulse jet; when the temperature of the main body (1) is lower than the threshold value, the electronic control device reduces the frequency and intensity of the pulse jet of the solenoid valve pulse jet excitation device (4); when the temperature of the main body (1) is stable, the current working state of the solenoid valve pulse jet excitation device (4) is maintained.

10. An application of a dynamic thermal protection device using pulse jet cooling technology according to any one of claims 1 to 7 in heat dissipation of optoelectronic equipment in a space station.

Images