Storage device and storage method for keeping object to be stored in solid state

Abstract

The invention provides a solid-state storage device and a storage method for keeping a to-be-stored object in a solid state, the solid-state storage device is used for storing the to-be-stored object and keeping the to-be-stored object in the solid state, and the solid-state storage device comprises a shell and a cover body arranged at the top of the shell, the shell comprises an inner shell body, an inner heat insulation layer, an aerogel heat insulation layer and a protection layer, wherein the inner heat insulation layer, the aerogel heat insulation layer and the protection layer are sequentially formed on the outer side of the inner shell body from inside to outside. The inner shell body and the cover body movably define a protection cavity for containing a to-be-stored object and keeping the to-be-stored object in a solid state. Through the method and the device, when the current environment is higher than the melting point of the to-be-stored object, the to-be-stored object is stored, the to-be-stored object is kept in a solid state, the to-be-stored object can be prevented from being polluted, and the method and the device can be applied to the field of storage of metal gallium required for growing a gallium nitride substrate; moreover, the solid-state storage device is small in size and convenient to carry and transport, a special freezing transport vehicle is not needed, the transport cost can be saved, and the solid-state storage device can be recycled for multiple times.

Description

Technical Field

[0001] This application relates to the technical field of metal material storage, and particularly relates to a storage device and a storage method for keeping an object to be stored in a solid state. Background Art

[0002] Low-melting-point metals and their alloys are widely used in industries such as semiconductors, compound semiconductors, and cryogenic welding. Low-melting-point metals and their alloys are usually in a liquid or solid state at room temperature. During transportation, if the low-melting-point metals and their alloys are in a liquid state, due to the certain fluidity of the liquid surface, the area of contact between the liquid surface and the air will increase, resulting in an increase in the oxidized area and the possibility of oxidation of the low-melting-point metals and their alloys, and the liquid metals and their alloys are also not convenient for transportation. Therefore, the low-melting-point metals and their alloys are usually transported in a solid state. At the same time, due to the low-melting-point metals and their alloys usually having strong corrosiveness and toxicity, necessary protection devices must be provided for the transportation of the low-melting-point metals and their alloys.

[0003] Currently, for the transportation of low-melting-point metals and their alloys, a freezer truck used for food transportation is usually adopted for transportation. Its freezing temperature is relatively low, generally ranging from -10°C to -20°C. However, directly using a freezer truck to transport low-melting-point metals and their alloys incurs relatively high logistics service costs and imposes a large cost burden. In the prior art, there is also a transportation cabinet dedicated to transporting low-melting-point metals and their alloys. The transportation cabinet is provided with a heat-insulating layer. Multiple ice boxes and containers are placed inside the transportation cabinet. The low-melting-point metals and their alloys and ice boxes are placed inside the containers to further ensure that the low-melting-point metals and their alloys have a relatively low temperature during transportation and are transported in a solid state. However, due to the large volume of the transportation cabinet, transportation is relatively difficult. Moreover, there are both low-melting-point metals and their alloys (placed in a leak-proof bag) and ice boxes in the containers. Since the low-melting-point metals and their alloys are in a solid state, shaking and bumping during transportation may cause damage to the leak-proof bag, and the ice boxes are likely to condense water vapor in the air. Some low-melting-point metals and their alloys (such as gallium metal or gallium-indium-tin alloy) react when contacting water, which is likely to cause contamination of the low-melting-point metals and their alloys.

[0004] In view of this, it is necessary to improve the transportation cabinet for transporting low-melting-point metals and their alloys in the prior art to solve the above problems.

[0005] It should be noted that the above introduction of the background art is only for the convenience of clearly and completely explaining the technical solutions of this application and facilitating the understanding of those skilled in the art. It cannot be considered that the above technical solutions are well-known to those skilled in the art just because these solutions are described in the background art part of this application.

[0006] Application Content

[0007] The object of the present application is to solve the problems of difficult transportation and easy pollution existing in the transportation of low-melting metals and their alloys in the prior art.

[0008] To achieve the above object, the present application provides a solid-state storage device, which is used to store an object to be stored and keep the object to be stored in a solid state. The solid-state storage device includes: a housing and a cover disposed on the top of the housing;

[0009] The housing includes: an inner housing, an inner heat-insulating layer, an aerogel heat-insulating layer and a protective layer formed on the outer side of the inner housing in sequence from the inside to the outside. The inner housing and the cover are movably enclosed to form a protective chamber for accommodating the object to be stored and keeping the object to be stored in a solid state.

[0010] As a further improvement of the present application, when the current ambient temperature where the solid-state storage device is located is higher than the melting point of the object to be stored, the solid-state storage device further includes: a communication component penetrating the cover, and the protective chamber is filled with an inert protective gas or kept in a vacuum through the communication component.

[0011] As a further improvement of the present application, the communication component includes: a communication pipe penetrating the cover and a valve disposed on the outer side of the communication pipe. A channel communicating with the protective chamber is formed inside the communication pipe, and the valve movably closes the channel.

[0012] As a further improvement of the present application, the communication pipe at least includes a first communication pipe and a second communication pipe, and the valve at least includes a first valve and a second valve. The first valve movably closes the first communication pipe, and the second valve movably closes the second communication pipe.

[0013] As a further improvement of the present application, the inner heat-insulating layer includes: a first metal layer and a second metal layer formed in sequence from the inside to the outside. The side part of the inner housing is formed on the inner surface of the first metal layer. The aerogel heat-insulating layer is in contact with the second metal layer. A gap is formed between the first metal layer and the second metal layer, and the gap is filled with an inert protective gas or kept in a vacuum.

[0014] As a further improvement of the present application, the housing forms a first thread, the cover forms a second thread adapted to the first thread, the housing and the cover are screwed together through the first thread and the second thread, and the cover and the housing form a mating surface, and a seal is disposed on the mating surface;

[0015] Wherein, the first thread is formed on the outer side of the housing, and the second thread is formed on the inner side of the cover; or, the first thread is formed on the inner side of the housing, and the second thread is formed on the outer side of the cover.

[0016] As a further improvement of the present application, the solid-state storage device further includes: a sensor disposed on the inner side of the inner housing, a display disposed on the outer side of the protective layer, a power supply component disposed at the bottom of the housing, and an alarm device disposed on the outer side of the housing;

[0017] The power supply component includes: a protective housing and a battery pack disposed inside the protective housing. The battery pack is electrically connected to the sensor, the display, and the alarm device respectively. The sensor is used to detect the current environmental information of the protection chamber, the display is used to display the current environmental information, and the current environmental information includes one or any combination of temperature, humidity, and pressure;

[0018] Wherein, the alarm device is in a working state after the temperature in the current environmental information exceeds a preset temperature threshold, and / or the alarm device is in a working state after the pressure in the current environmental information exceeds a preset pressure threshold;

[0019] And / or, the aerogel thermal insulation layer is a silica aerogel layer or a polymer aerogel layer;

[0020] And / or, the aerogel thermal insulation layer contains titanium dioxide particles;

[0021] And / or, the material of the inner housing is an organic material;

[0022] And / or, the thickness of the inner housing is 0.05 mm - 1.5 mm; for example: the thickness of the inner housing is 0.05 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, or 1.5 mm;

[0023] And / or, the material of the protective layer is rubber;

[0024] And / or, the object to be stored is a low melting point metal material, and the low melting point metal material includes: low melting point metals and low melting point alloys.

[0025] As a further improvement of the present application, the display is electrically connected to the sensor and the alarm device respectively; or, the solid-state storage device further includes a controller, the controller is disposed inside the protective housing, and the controller is electrically connected to the battery pack, the sensor, the display, and the alarm device respectively;

[0026] And / or, the solid-state storage device further includes a charging port and a charging circuit. The charging port is disposed on the protective housing, and the charging circuit is disposed inside the protective housing. The charging port is electrically connected to the battery pack through the charging circuit.

[0027] Based on the same inventive concept, the present application also discloses a storage method for keeping an object to be stored in a solid state, using the solid-state storage device according to any one of the above-mentioned inventions. The method includes:

[0028] Step S1: Separate the cover body and the housing, and place the object to be stored in the protection chamber;

[0029] Step S2: Seal the cover body and the housing.

[0030] As a further improvement of the present application, the solid-state storage device further includes: a communication component penetrating the cover body; after sealing the cover body and the housing, the method further includes:

[0031] Evacuate the protection chamber through the communication component; after transporting the solid-state storage device to the destination, fill the protection chamber with an inert protective gas through the communication component so that the air pressure in the protection chamber is the same as the current ambient air pressure, to separate the cover body and the housing; take out the object to be stored from the protection chamber;

[0032] Or, fill the protection chamber with an inert protective gas through the communication component so that the air pressure in the protection chamber is higher than the current ambient air pressure; after transporting the solid-state storage device to the destination, make the air pressure in the protection chamber the same as the current ambient air pressure through the communication component, to separate the cover body and the housing; take out the object to be stored from the protection chamber;

[0033] Wherein, the current ambient air pressure is the current air pressure of the environment where the solid-state storage device is located.

[0034] Compared with the prior art, the beneficial effects of the present application are as follows: The solid-state storage device includes: a housing and a cover disposed on the top of the housing; the housing includes: an inner housing, an inner heat insulation layer, an aerogel heat insulation layer, and a protective layer formed on the outside of the inner housing in sequence from the inside out. The inner housing and the cover are movably enclosed to form a protective chamber for accommodating the object to be stored and maintaining the object to be stored in a solid state. The four-layer structure (i.e., the inner housing, the inner heat insulation layer, the aerogel heat insulation layer, and the protective layer) serves to isolate the internal environmental temperature of the housing (i.e., the current environmental temperature of the protective chamber) and the external environmental temperature (i.e., the current environmental temperature where the solid-state storage device is located). The object to be stored in a solid state is stored in the protective chamber, and the double-layer heat insulation (i.e., the inner heat insulation layer and the aerogel heat insulation layer) plays a role in keeping the object to be stored warm, better preventing heat exchange, so that the object to be stored remains in a solid state in the protective chamber, thereby facilitating the transportation of the object to be stored with a relatively low melting point (i.e., the environmental temperature where the solid-state storage device is located is higher than the melting point of the object to be stored), and preventing the object to be stored from being contaminated; in addition, the solid-state storage device is small in volume, easy to carry and transport, does not require the use of a dedicated refrigerated transport vehicle, can save transportation costs, and can be recycled and used multiple times. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a schematic structural diagram of the solid-state storage device shown in the present application;

[0036] Figure 2 is Figure 1 a cross-sectional view taken along the line A-A in

[0037] Figure 3 is a schematic diagram of the steps of the storage method for maintaining the object to be stored in a solid state shown in the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0038] The present application will be described in detail below with reference to the embodiments shown in the drawings. However, it should be noted that these embodiments are not intended to limit the present application. Any equivalent transformation or substitution in terms of function, method, or structure made by those of ordinary skill in the art based on these embodiments shall fall within the protection scope of the present application.

[0039] Please refer to Figure 1 and Figure 2 shown. The present application provides a specific embodiment of a solid-state storage device 10. The solid-state storage device 10 is used to store an object to be stored and maintain the object to be stored (not shown) in a solid state, and the current environmental temperature where the solid-state storage device 10 is located is higher than the melting point of the object to be stored.

[0040] By storing the object to be stored inside the solid-state storage device 10, the current ambient temperature inside the solid-state storage device 10 is made lower than the melting point of the object to be stored, thereby keeping the object to be stored in a solid state inside the solid-state storage device 10, and thus facilitating the transportation of the object to be stored whose melting point is lower than the current ambient temperature.

[0041] Specifically, referring Figure 1 As shown, the solid-state storage device 10 includes: a housing 11 and a cover 12 provided on the top of the housing 11; the housing 11 includes: an inner housing 111, an inner heat-insulating layer 112, an aerogel heat-insulating layer 113, and a protective layer 114 formed on the outside of the inner housing 111 in sequence from the inside to the outside. The inner housing 111 and the cover 12 are movably enclosed to form a protective chamber 20 for accommodating the object to be stored and keeping the object to be stored in a solid state.

[0042] The four-layer structure (i.e., the inner housing 111, the inner heat-insulating layer 112, the aerogel heat-insulating layer 113, and the protective layer 114) functions to isolate the internal ambient temperature of the housing 11 (i.e., the current ambient temperature of the protective chamber 20) and the external ambient temperature (i.e., the current ambient temperature where the solid-state storage device 10 is located). The object to be stored in a solid state is stored in the protective chamber 20, and the double-layer heat insulation (i.e., the inner heat-insulating layer 112 and the aerogel heat-insulating layer 113) functions to keep the temperature of the object to be stored, better preventing heat exchange, so that the object to be stored remains in a solid state in the protective chamber 20 and does not melt into a liquid state, thereby facilitating the transportation of the object to be stored with a lower melting point (i.e., the ambient temperature where the solid-state storage device 10 is located is higher than the melting point of the object to be stored).

[0043] In one embodiment, referring Figure 1 As shown, the housing 11 forms a first thread, and the cover 12 forms a second thread adapted to the first thread. The housing 11 and the cover 12 are screwed together through the first thread and the second thread, and the cover 12 and the housing 11 form a mating surface 30, and a seal 40 is provided on the mating surface 30.

[0044] Further, the first thread is formed on the outside of the housing 11, and the second thread is formed on the inside of the cover 12; or, the first thread is formed on the inside of the housing 11, and the second thread is formed on the outside of the cover 12.

[0045] The detachable assembly of the housing 11 and the cover 12 is realized by screwing the first thread and the second thread together, thereby separating or sealing the cover 12 and the housing 11 and achieving the purpose of opening or sealing the protective chamber 20 formed inside the housing 11. In addition, a seal 40 is provided on the mating surface 30 formed by the cover 12 and the housing 11 to better seal the protective chamber 20 formed inside the housing 11.

[0046] In one embodiment, referring Figure 1As shown, the solid-state storage device 10 further includes a communication component 13 passing through the cover 12, through which the protection chamber 20 is filled with an inert protection gas or maintained in a vacuum.

[0047] Since some special objects to be stored need to be transported in a special environment, for example, transported under inert protection gas conditions or vacuum conditions, the protection chamber 20 is filled with an inert protection gas or maintained in a vacuum through the communication component 13, thereby achieving the purpose of transporting the object to be stored under inert protection gas conditions or vacuum conditions, and further playing a role in protecting the object to be stored during transportation, ensuring that the object to be stored will not be oxidized by oxygen or contaminated by water vapor during transportation. The inert protection gas can be, for example, a mixed gas of argon (Ar), nitrogen (N2), and hydrogen, and the present embodiment does not make specific limitations on this.

[0048] In one embodiment, referring to Figure 1 As shown, the communication component 13 includes a communication pipe 131 passing through the cover 12 and a valve 132 provided outside the communication pipe 131. A channel 130 communicating with the protection chamber 20 is formed inside the communication pipe 131, and the valve 132 movably closes the channel 130.

[0049] When filling the protection chamber 20 with an inert protection gas, the channel 130 is opened through the valve 132, and the inert protection gas is transported to the protection chamber 20 through the channel 130 formed by the communication pipe 131. When the protection chamber 20 reaches the inert protection gas condition (that is, the concentration of the inert protection gas in the protection chamber 20 reaches the preset range), the channel 130 is closed through the valve 132, thereby filling the protection chamber 20 with the inert protection gas and realizing the transportation of the object to be stored in the protection chamber 20 under the inert protection gas condition. Similarly, when maintaining the protection chamber 20 in a vacuum, the channel 130 is opened through the valve 132, and the protection chamber 20 is evacuated through the channel 130 formed by the communication pipe 131. When the protection chamber 20 reaches the vacuum condition, the channel 130 is closed through the valve 132, thereby maintaining the protection chamber 20 in a vacuum and realizing the transportation of the object to be stored in the protection chamber 20 under the vacuum condition.

[0050] More specifically, in one embodiment, referring to Figure 1 As shown, the communication pipe 131 at least includes a first communication pipe 1311 and a second communication pipe 1312, and the valve 132 at least includes a first valve 1321 and a second valve 1322. The first valve 1321 movably closes the first communication pipe 1311, and the second valve 1322 movably closes the second communication pipe 1312.

[0051] When filling the protection chamber 20 with an inert protection gas, the first communication pipe 1311 is opened through the first valve 1321, and the second communication pipe 1312 is opened through the second valve 1322. The inert protection gas is transported to the protection chamber 20 through the first communication pipe 1311, and the original gas in the protection chamber 20 is discharged through the second communication pipe 1312. Until the protection chamber 20 reaches the inert protection gas condition (or, when the discharge amount of the original gas in the protection chamber 20 reaches a preset threshold), the second communication pipe 1312 is closed, and the inert protection gas is continuously transported to the protection chamber 20 through the first communication pipe 1311. When the inert protection gas in the protection chamber 20 reaches 2-3 atmospheres, the first communication pipe 1311 is closed; after the solid-state storage device 10 is transported to the destination, the second communication pipe 1312 is opened, and after the air pressure in the protection chamber 20 is the same as the current ambient air pressure, the cover 12 and the housing 11 are separated, and the object to be stored is taken out from the protection chamber 20. When keeping the protection chamber 20 in a vacuum state, the first communication pipe 1311 is opened through the first valve 1321, and the protection chamber 20 is evacuated through the first communication pipe 1311. When the protection chamber 20 reaches the vacuum condition, the first communication pipe 1311 is closed; after the solid-state storage device 10 is transported to the destination, the second communication pipe 1312 is opened through the second valve 1322, and the inert protection gas is transported to the protection chamber 20 through the second communication pipe 1312. After the air pressure in the protection chamber 20 is the same as the current ambient air pressure, the cover 12 and the housing 11 are separated, and the object to be stored is taken out from the protection chamber 20.

[0052] Alternatively, when filling the protection chamber 20 with an inert protection gas, open the first communication pipe 1311 through the first valve 1321, and open the second communication pipe 1312 through the second valve 1322. Deliver the inert protection gas to the protection chamber 20 through the second communication pipe 1312, and discharge the original gas in the protection chamber 20 through the first communication pipe 1311. Until the protection chamber 20 reaches the inert protection gas condition (or when the discharge amount of the original gas in the protection chamber 20 reaches a preset threshold), close the first communication pipe 1311, and continue to deliver the inert protection gas to the protection chamber 20 through the second communication pipe 1312. When the inert protection gas in the protection chamber 20 reaches 2-3 atmospheres, close the second communication pipe 1312; after the solid-state storage device 10 is transported to the destination, open the first communication pipe 1311. After the air pressure in the protection chamber 20 is consistent with the current ambient air pressure, separate the cover body 12 and the housing 11, and take out the object to be stored from the protection chamber 20. When keeping the protection chamber 20 in a vacuum state, open the second communication pipe 1312 through the second valve 1322, and evacuate the protection chamber 20 through the second communication pipe 1312. When the protection chamber 20 reaches the vacuum condition, close the second communication pipe 1312; after the solid-state storage device 10 is transported to the destination, open the first communication pipe 1311 through the first valve 1321, and deliver the inert protection gas to the protection chamber 20 through the first communication pipe 1311. After the air pressure in the protection chamber 20 is consistent with the current ambient air pressure, separate the cover body 12 and the housing 11, and take out the object to be stored from the protection chamber 20.

[0053] It should be noted that since the reaction rate of the object to be stored (taking low-melting-point metal materials as an example) with oxygen or water vapor is relatively slow, it is not necessary to achieve an ultra-high vacuum or an ultra-high atmospheric pressure of inert protection gas to protect the low-melting-point metal materials, nor will it increase excessive costs, and there will be no extremely high requirements for the sealing performance, hardness, and supportability of the solid-state storage device 10. Therefore, the foregoing example of the protection chamber 20 reaching 2-3 atmospheres when storing the object to be stored is used for illustrative purposes.

[0054] In one embodiment, as shown in Figure 2 the inner heat insulation layer 112 includes a first metal layer 1121 and a second metal layer 1122 formed in sequence from the inside out. The side portion of the inner housing 111 is formed on the inner surface of the first metal layer 1121. The aerogel heat insulation layer 113 is in contact with the second metal layer 1122. A gap 1123 is formed between the first metal layer 1121 and the second metal layer 1122, and the gap 1123 is filled with an inert protection gas or kept in a vacuum.

[0055] Specifically, the materials of the first metal layer 1121 and the second metal layer 1122 can both be stainless steel, for example.

[0056] The side part of the inner housing 111 is formed on the inner surface of the first metal layer 1121. Since the first metal layer 1121 has a certain strength, it will not be deformed during use or damaged due to bumps, which may affect the size and heat insulation effect of the protection chamber 20. The second metal layer 1122 is in contact with the aerogel heat insulation layer 113. The second metal layer 1122 plays a supporting role for the aerogel heat insulation layer 113, and can further protect the inner heat insulation layer 112, preventing the current environment where the solid-state storage device 10 is located from damaging the first metal layer 1121 and the gap 1123. And the second metal layer 1122 also requires good strength and weather resistance. The gap 1123 is filled with an inert protective gas or kept vacuum through a special process, and this embodiment does not make specific limitations on this. By filling the gap 1123 with an inert protective gas or keeping it vacuum, the medium for heat transfer is further reduced, thereby effectively hindering the transfer of heat.

[0057] It should be noted that in the prior art, the device for storing the object to be stored usually uses a device made of plastic material, such as one of PVC, PE, PP, ABS or nylon. Although this kind of material has the advantages of corrosion resistance and low cost, the plastic material has poor heat insulation performance and poor hardness, and cannot directly form a sandwich structure similar to the inner heat insulation layer 112 disclosed in this application. In this application, a sandwich structure of a double-layer metal layer is adopted, which can solve the problem that if a plastic material sandwich structure is used in the prior art, large deformation will occur due to pressure difference.

[0058] In one embodiment, the aerogel heat insulation layer 113 is a silica aerogel layer or a polymer aerogel layer; and / or, the aerogel heat insulation layer 113 contains titanium dioxide particles; and / or, the material of the inner housing 111 is an organic material; and / or, the thickness of the inner housing 111 is 0.05 mm - 1.5 mm; and / or, the material of the protective layer 114 is rubber; and / or, the object to be stored is a low melting point metal material, and the low melting point metal material includes: low melting point metals (such as: gallium, rubidium or cesium, etc.) and low melting point alloys (such as: gallium-indium eutectic alloy, gallium-tin alloy, gallium-bismuth alloy or gallium-zinc alloy, etc.). For example: the thickness of the inner housing is 0.05 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm or 1.5 mm.

[0059] Specifically, the material of the protective layer 114 is rubber, which can play a buffering role. During the transportation of the solid-state storage device 10, bumps may occur, and the rubber can relieve the impact brought by the bumps to the object to be stored in the protection chamber 20.

[0060] The aerogel thermal insulation layer 113 is located inside the protective layer 114 and can be a silica aerogel layer or a polymer aerogel layer; aerogel is a nano-porous material with extremely low thermal conductivity. Due to the nano-scale pore structure of aerogel, the movement of air molecules is greatly restricted, reducing heat conduction, and the pore size of aerogel is smaller than the mean free path of air molecules, which can inhibit convective heat transfer; preferably, the aerogel thermal insulation layer 113 contains titanium dioxide particles, and titanium dioxide has a reflection effect and can reflect thermal radiation, further improving the heat insulation and warming effects.

[0061] Furthermore, the aerogel thermal insulation layer 113 is formed into a porous material by the sol-gel method or a composite aerogel material is made by mixing aerogel powder and an adhesive, and the aerogel thermal insulation layer 113 is formed by an interlayer filling process or a spraying process. Since aerogel has an extremely low thermal conductivity (about 0.013 - 0.016 W / m·K), as a thermal insulation material layer and on the outer side of the inner thermal insulation layer 112, it can prevent heat exchange between the current environment where the solid-state storage device 10 is located and the current environment of the protection chamber 20. And because aerogel has low mechanical strength, it can also play a buffering role together with the protective layer 114.

[0062] The side of the inner housing 111 is attached to the inner surface of the first metal layer 1121, and the inner housing 111 includes a side and a bottom. The material of the inner housing 111 can be selected from organic materials such as PVC, PE, PP, and ABS, thereby preventing the problem of contamination of the object to be stored caused by direct contact between the first metal layer 1121 and the object to be stored. In particular, if the object to be stored is a low-melting-point metal material, and most low-melting-point metal materials can corrode various metals including stainless steel and form alloys with others. At the same time, the cost of organic materials is low, which plays a role in reducing costs, and the inner housing 111 can be formed by a variety of processes. For example, processes such as fluidized spraying, powder electrostatic spraying, hot melt coating, and suspension coating are used to form the side of the inner housing 111 on the inner surface of the first metal layer 1121. Therefore, the inner housing 111 can prevent the first metal layer 1121 from contaminating the object to be stored and will not cause an excessive increase in cost. The thickness of the inner housing 111 is 0.05 mm - 1.5 mm, which will neither affect the capacity of the protection chamber 20 nor cause problems such as damage or scratching of the inner housing 111 when storing the object to be stored due to the thinness of the inner housing 111. At the same time, after the solid-state storage device 10 disclosed in the present application transports the object to be stored to the destination and takes out the object to be stored, the solid-state storage device 10 can be recycled for continued use next time, that is, the solid-state storage device 10 can be reused, and multiple uses will not cause an increase in cost.

[0063] It should be noted that in this application, double-layer heat insulation is adopted (i.e., the inner heat insulation layer 112 and the aerogel heat insulation layer 113). The inner heat insulation layer 112 is a double-layer metal hollow heat insulation layer. The aerogel heat insulation layer 113 has a low thermal conductivity, and the aerogel heat insulation layer 113 contains titanium dioxide particles, which can better prevent heat radiation. Moreover, the inner heat insulation layer 112 also has a low thermal conductivity and can further prevent heat exchange. The outer aerogel heat insulation layer 113 has low strength and can play a buffering role; the inner heat insulation layer 112 has high strength and can play a supporting role without deformation, thus protecting the object to be stored and facilitating the attachment of the side of the inner housing 111 to the inner surface of the inner heat insulation layer 112. If the aerogel heat insulation layer 113 is close to the inner housing 111, it is not easy for the inner housing 111 to adhere to the inner surface of the aerogel heat insulation layer 113. The pores of the aerogel are prone to deformation under the extrusion of the metal, and it is not easy to recover after deformation. Under the extrusion of the metal, the aerogel will become dense and the pores will be reduced, thus reducing the heat insulation effect of the aerogel; in this application, the aerogel heat insulation layer 113 is arranged on the outside, and the inner heat insulation layer 112 supports the aerogel heat insulation layer 113. Although the aerogel heat insulation layer 113 is occasionally affected by external forces, after the external forces are removed, the pores will recover, thus not affecting the heat insulation effect of the aerogel heat insulation layer 113.

[0064] In one embodiment, referring Figure 1 as shown, the solid-state storage device 10 further includes: a sensor 116 disposed inside the inner housing 111, a display 117 disposed outside the protective layer 114, a power supply component 14 disposed at the bottom of the housing 11, and an alarm device (not shown) disposed outside the housing 11.

[0065] The power supply component 14 includes: a protective housing 141 and a battery pack 142 disposed inside the protective housing 141. The battery pack 142 is electrically connected to the sensor 116, the display 117, and the alarm device respectively; the sensor 116 is used to detect the current environmental information of the protection chamber 20, and the display 117 is used to display the current environmental information, and the current environmental information includes one or any combination of temperature, humidity, and pressure. Among them, the alarm device is in a working state after the temperature in the current environmental information exceeds the preset temperature threshold, and / or the alarm device is in a working state after the pressure in the current environmental information exceeds the preset pressure threshold.

[0066] Specifically, the sensor 116 is disposed on the upper side inside the inner housing 111, so that when the object to be stored is stored in the protection chamber 20, it will not affect the object to be stored. The alarm device can be, for example, a buzzer, and this embodiment does not make specific limitations on this.

[0067] When the object to be stored is stored in the solid-state storage device 10, the current environmental information in the protection chamber 20 is detected in real time by the sensor 116, and the current environmental information is displayed in real time by the display 117. Thus, it is convenient for the operator to check the internal situation of the protection chamber 20 at any time. Without the operator separating the housing 11 and the cover 12, the internal situation of the protection chamber 20 can be checked, so as to reduce the inspection steps of the operator and shorten the inspection time of the operator. For example, the operator can judge whether the solid-state storage device 10 leaks air or has a large heat exchange so that the object to be stored melts according to the current environmental information displayed on the display 117, without separating the housing 11 and the cover 12, so as to shorten the inspection time. When the temperature and / or humidity in the current environmental information is abnormal (that is, the temperature exceeds the preset temperature threshold or the humidity exceeds the preset pressure threshold), the alarm device is in a working state (that is, the alarm device gives an alarm) to warn the operator.

[0068] In one embodiment, the display 117 is electrically connected to the sensor 116 and the alarm device respectively. Thus, the current environmental information detected by the sensor 116 can be directly sent to the display 117 by the sensor 116, the current environmental information is displayed by the display 117, and the sensor 116 detects whether the current environmental information it detects is abnormal. When it is abnormal, the alarm device is controlled to be in a working state.

[0069] In another embodiment, the solid-state storage device 10 further includes a controller (not shown). The controller is disposed inside the protection housing 141, and the controller is electrically connected to the battery pack 142, the sensor 116, the display 117 and the alarm device respectively. Thus, the current environmental information detected by the sensor 116 is sent to the display 117 through the controller, the display 117 is controlled to display the current environmental information, and the controller detects whether the current environmental information detected by the sensor 116 is abnormal. When it is abnormal, the alarm device is controlled to be in a working state.

[0070] In other embodiments, the solid-state storage device 10 further includes a charging port (not shown) and a charging circuit (not shown). The charging port is disposed on the protection housing 141, the charging circuit is disposed inside the protection housing 141, and the charging port is electrically connected to the battery pack 142 through the charging circuit. Thus, the battery pack 142 can be charged through the charging port and the charging circuit.

[0071] In summary, a solid-state storage device 10 disclosed in the present application is used to store an object to be stored (taking a low-melting-point metal material as an example) and keep the object to be stored in a solid state, and the current ambient temperature where the solid-state storage device 10 is located is higher than the melting point of the object to be stored, which can prevent the low-melting-point metal material from being oxidized by oxygen and polluted by water vapor. At the same time, the overall volume of the solid-state storage device 10 is small, which is convenient for carrying and transportation. Compared with the prior art, there is no need to use a special refrigerated transport vehicle for transportation, which can not only save transportation costs, but also be recycled and used multiple times, and can save the costs of low-melting-point metal material manufacturers.

[0072] Based on this, the present application also provides a specific implementation manner of a storage method for keeping an object to be stored in a solid state, using the solid-state storage device 10 disclosed above.

[0073] Specifically, as Figure 3 shown, this method includes:

[0074] Step S1: Separate the cover body and the housing, and place the object to be stored in the protection chamber.

[0075] During the process of placing the object to be stored in the protection chamber 20, attention needs to be paid to the contact between the object to be stored and the inner housing 111. Although the object to be stored (taking a low-melting-point metal material as an example) has a lower hardness than ordinary metal materials, it is also necessary to prevent the protrusions or tips of the low-melting-point metal material from damaging the inner housing 111.

[0076] Step S2: Seal the cover body and the housing.

[0077] Since the current ambient temperature where the solid-state storage device 10 is located is higher than the melting point of the object to be stored, the object to be stored is usually stored in a cold storage. Before transporting the object to be stored to the destination, separate the cover body 12 and the housing 11, take out the object to be stored from the cold storage and quickly place it in the protection chamber 20, and seal the cover body 12 and the housing 11; after transporting the object to be stored to the destination, separate the cover body 12 and the housing 11, take out the object to be stored from the protection chamber 20 and quickly place it in the set storage position, and seal the cover body 12 and the housing 11.

[0078] It should be noted that although the current ambient temperature where the solid-state storage device 10 is located is higher than the melting point of the object to be stored, since the temperature of the object to be stored taken out of the cold storage is relatively low, the object to be stored will not have a large heat exchange in a short time after being taken out of the cold storage. That is to say, the object to be stored will not immediately change from solid state to liquid state. Therefore, it is necessary to quickly place the object to be stored in the protection chamber 20, and after placing it in the protection chamber 20, it is also necessary to quickly seal the cover body 12 and the housing 11, thereby reducing heat exchange and the exposure time of the object to be stored in the current environment where the solid-state storage device 10 is located. Similarly, when taking out the object to be stored from the protection chamber 20, it is also necessary to quickly place the object to be stored at the set storage position.

[0079] In one embodiment, the solid-state storage device 10 further includes: a communication component 13 penetrating the cover body 12. The above method further includes: evacuating the protection chamber 20 through the communication component 13, for example: below 100 Pa; after the solid-state storage device 10 is transported to the destination, filling the protection chamber 20 with an inert protective gas through the communication component 13 so that the air pressure in the protection chamber 20 is the same as the current ambient air pressure to separate the cover body 12 and the housing 11; taking out the object to be stored from the protection chamber 20. Or, filling the protection chamber 20 with an inert protective gas through the communication component 13 so that the air pressure in the protection chamber 20 is higher than the current ambient air pressure, for example: maintained at 2-3 atmospheres; after the solid-state storage device 10 is transported to the destination, making the air pressure in the protection chamber 20 the same as the current ambient air pressure through the communication component 13 to separate the cover body 12 and the housing 11; taking out the object to be stored from the protection chamber 20. Wherein, the current ambient air pressure is the current air pressure of the environment where the solid-state storage device 10 is located.

[0080] The series of detailed descriptions listed above are only specific descriptions of the feasible embodiments of the present application, and they are not intended to limit the protection scope of the present application. Any equivalent embodiments or changes made without departing from the technical spirit of the present application should be included in the protection scope of the present application.

[0081] For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present application is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0082] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A solid-state storage device, characterized in that: The solid-state storage device is used to store objects to be stored and keep the objects to be stored in a solid state, and the solid-state storage device includes: a housing and a cover body arranged on the top of the housing; The shell comprises: an inner shell, an inner insulation layer, an aerogel insulation layer and a protective layer which are sequentially formed on the outer side of the inner shell from the inside to the outside. The inner shell and the cover body are movably enclosed to form a protective chamber for accommodating the object to be stored and keeping the object to be stored in a solid state.

2. The solid-state storage device according to claim 1, characterized in that: The current ambient temperature of the solid-state storage device is higher than the melting point of the object to be stored; And / or, the solid-state storage device further comprises: a connecting component penetrating the cover body, through which the protection chamber is filled with an inert protective gas or maintained in a vacuum.

3. The solid-state storage device according to claim 2, characterized in that: The communication component includes: a communication pipe penetrating the cover body and a valve arranged outside the communication pipe, a channel connected to the protection chamber is formed inside the communication pipe, and the valve movably closes the channel.

4. The solid-state storage device according to claim 3, characterized in that: The connecting pipe at least includes a first connecting pipe and a second connecting pipe, and the valve at least includes a first valve and a second valve, the first valve movably closes the first connecting pipe, and the second valve movably closes the second connecting pipe.

5. The solid-state storage device according to claim 1, wherein: The inner insulation layer includes: a first metal layer and a second metal layer formed in sequence from the inside to the outside, the side of the inner shell is formed on the inner surface of the first metal layer, the aerogel insulation layer and the second metal layer are in contact, and a gap is formed between the first metal layer and the second metal layer, and the gap is filled with an inert protective gas or maintained in a vacuum.

6. The solid-state storage device according to claim 1, wherein: The shell forms a first thread, the cover forms a second thread that matches the first thread, the shell and the cover are screwed together via the first thread and the second thread, and the cover and the shell form a matching surface, and a sealing member is provided on the matching surface; The first thread is formed on the outer side of the shell, and the second thread is formed on the inner side of the cover; or the first thread is formed on the inner side of the shell, and the second thread is formed on the outer side of the cover.

7. The solid-state storage device according to claim 1, wherein: The solid-state storage device further comprises: a sensor disposed on the inner side of the inner shell, a display disposed on the outer side of the protective layer, a power supply component disposed on the bottom of the shell, and an alarm device disposed on the outer side of the shell; The power supply assembly includes: a protective shell and a battery pack disposed inside the protective shell, the battery pack is electrically connected to the sensor, the display and the alarm device respectively, the sensor is used to detect the current environmental information of the protective chamber, the display is used to display the current environmental information, and the current environmental information includes one or any combination of temperature, humidity and pressure; Wherein, the alarm device is in working state after the temperature in the current environmental information exceeds a preset temperature threshold, and / or the alarm device is in working state after the pressure in the current environmental information exceeds a preset pressure threshold; And / or, the aerogel thermal insulation layer is a silica aerogel layer or a polymer aerogel layer; and / or, the aerogel insulation layer comprises titanium dioxide particles; And / or, the material of the inner shell is an organic material; And / or, the thickness of the inner shell is 0.05mm-1.5mm; And / or, the material of the protective layer is rubber; And / or, the object to be stored is a low-melting-point metal material, and the low-melting-point metal material includes: a low-melting-point metal and a low-melting-point alloy.

8. The solid-state storage device according to claim 7, characterized in that: The display is electrically connected to the sensor and the alarm device respectively; or, the solid-state storage device further includes a controller, the controller is disposed inside the protective housing, and the controller is electrically connected to the battery pack, the sensor, the display and the alarm device respectively; And / or, the solid-state storage device also includes a charging port and a charging circuit, the charging port is arranged on the protective shell, the charging circuit is arranged inside the protective shell, and the charging port is electrically connected to the battery pack through the charging circuit.

9. A storage method for keeping an object to be stored in a solid state, using the solid state storage device according to any one of claims 1 to 8, characterized in that: The method comprises: Step S1, separating the cover body and the shell body, and placing the object to be stored in the protection chamber; Step S2: sealing the cover and the shell.

10. The storage method according to claim 9, characterized in that: The solid-state storage device further comprises: a communication component penetrating the cover body; after sealing the cover body and the housing, the method further comprises: The protective chamber is evacuated through the connecting component; after the solid-state storage device is transported to the destination, the protective chamber is filled with inert protective gas through the connecting component so that the air pressure in the protective chamber is consistent with the current ambient air pressure, so as to separate the cover body and the shell; and the object to be stored is taken out from the protective chamber; Alternatively, the protective chamber is filled with an inert protective gas through the connecting component so that the air pressure in the protective chamber is higher than the current ambient air pressure; after the solid-state storage device is transported to a destination, the air pressure in the protective chamber is made consistent with the current ambient air pressure through the connecting component to separate the cover body and the shell; and the object to be stored is taken out of the protective chamber; The current ambient air pressure is the current air pressure of the environment where the solid-state storage device is located.

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