Composition for controlling warpage and warpage control film

Abstract

The invention provides a composition for warping regulation and control and a warping regulation and control film. The composition for warping regulation and control comprises a resin material and a hardener. The resin material comprises a copolymer synthesized from methyl methacrylate and 2, 3-epoxypropyl methacrylate, the copolymer has a structure represented by formula (I), each symbol in the formula (I) is as defined in the specification, and the hardener comprises at least one of 2-ethyl-4-methylimidazole and dicyandiamide. In terms of 100% of the total weight of the composition for controlling warpage, the copolymer accounts for less than or equal to 80% of the weight of the composition for controlling warpage, and the hardener accounts for 1-10% of the weight of the composition for controlling warpage. Therefore, the warping control film prepared from the composition for warping control has good anti-warping effect and light penetration rate. # imgabs0 #

Description

Technical Field

[0001] The present invention relates to a composition for warp control and a warp control film, and particularly to a composition for warp control that can prepare a warp control layer with high light transmittance. Background Art

[0002] In order to improve the performance and stability of semiconductor devices, the importance of advanced packaging technology in the semiconductor industry is increasing day by day, and the fan-out panel level packaging (FOPLP) process belongs to one of the main processes in advanced packaging technology. Through the fan-out panel level packaging process, the chip density can be increased, the size after packaging can be reduced, and at the same time, the heat dissipation effect of the packaging structure can be improved.

[0003] In the fan-out panel level packaging process, the packaging structure may be warped due to uneven stress distribution. At this time, a warp-resistant layer can be used to prevent the substrate from bending. Specifically, when packaging, a laser de-bonding film can be set on the top surface of the substrate, then a redistribution layer is made and the chip is installed, and a warp-resistant layer is set on the bottom surface of the substrate to reduce the warping condition.

[0004] However, the light transmittance of the conventional warp-resistant layer is relatively low. In the process that requires using light to promote the debonding of the substrate, setting the conventional warp-resistant layer will cause poor debonding conditions, and other process steps need to be added to smoothly debond the substrate, resulting in a more cumbersome process and an increase in manufacturing cost.

[0005] In view of this, how to reduce the influence of the warp-resistant layer on the light transmittance while maintaining sufficient warp-resistant effect is still the goal that relevant industries strive for. Summary of the Invention

[0006] An object of the present invention is to provide a composition for warp control, and the warp control film prepared therefrom can have good warp-resistant effect while ensuring that light can pass through, which is helpful for the debonding of the packaged substrate.

[0007] An embodiment of the present invention provides a composition for warp control, which includes a resin material and a hardener. The resin material includes a copolymer synthesized from methyl methacrylate and glycidyl methacrylate, and the copolymer has a structure as shown in formula (I):

[0008]

[0009] Among them, both m and n are positive numbers, and the ratio of m to n is from 0.2 to 2.0. The hardener contains at least one of 2-ethyl-4-methylimidazole and dicyandiamide. Based on the total weight of the composition for warp control being 100%, the weight ratio of the copolymer in the composition for warp control is less than or equal to 80%, and the weight ratio of the hardener in the composition for warp control is from 1% to 10%.

[0010] Accordingly, by selecting specific resin materials and hardeners, the composition for warp control of the present invention enables the subsequently prepared warp control film to have sufficient warp control ability, improves the short-wavelength light transmittance of the warp control layer, reduces the influence of the warp control layer on the peeling of the substrate, and thus simplifies the process and reduces the manufacturing cost.

[0011] According to the aforementioned composition for warp control, the epoxy equivalent of the copolymer can be 310 g / eq., m:n can be 1.0:0.6, and the hardener can be 2-ethyl-4-methylimidazole.

[0012] According to the aforementioned composition for warp control, the weight ratio of the copolymer in the composition for warp control can be from 25% to 70%, and the weight ratio of the hardener in the composition for warp control can be from 1% to 8%.

[0013] According to the aforementioned composition for warp control, the epoxy equivalent of the copolymer can be 170 g / eq., m:n can be 1.0:3.6, and the hardener can be 2-ethyl-4-methylimidazole or dicyandiamide.

[0014] According to the aforementioned composition for warp control, the weight ratio of the copolymer in the composition for warp control can be from 40% to 50%, and the weight ratio of the hardener in the composition for warp control can be from 3% to 10%.

[0015] According to the aforementioned composition for warp control, the resin material may further include triallyl isocyanurate, and the hardener may further include dicumyl peroxide.

[0016] According to the aforementioned composition for warp control, the weight ratio of triallyl isocyanurate in the composition for warp control is less than or equal to 50%, and the weight ratio of dicumyl peroxide in the composition for warp control is less than or equal to 5%.

[0017] According to the aforementioned composition for warp control, the resin material may further include at least one of hydrogenated bisphenol A epoxy resin, 3,4-epoxycyclohexyl methacrylate, and trimethylolpropane trimethacrylate.

[0018] According to the foregoing composition for warp control, it may further include a plurality of inorganic filler particles, and the weight ratio of the plurality of inorganic filler particles in the composition for warp control may be less than or equal to 60%.

[0019] According to the foregoing composition for warp control, each inorganic filler particle may be spherical, and an average particle size of each inorganic filler particle may be from 0.1 μm to 5.0 μm.

[0020] According to the foregoing composition for warp control, each inorganic filler particle may be irregular in shape, and an average particle size of each inorganic filler particle may be from 0.1 μm to 5.0 μm.

[0021] Another embodiment of the present invention provides a warp control film made of the foregoing composition for warp control.

[0022] Yet another embodiment of the present invention provides a warp control film including a warp control layer and a support release layer. The warp control layer is made of the foregoing composition for warp control, and the support release layer is disposed on a surface of the warp control layer.

[0023] According to the foregoing warp control film, a thickness of the support release layer may be from 20 μm to 125 μm.

[0024] According to the foregoing warp control film, a thickness of the warp control layer may be from 10 μm to 100 μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a cross-sectional schematic view of a warp control film according to an embodiment of the present invention; and

[0026] Figure 2A and Figure 2B and Figure 2C and Figure 2D and Figure 2E and Figure 2F and Figure 2G are respectively cross-sectional schematic views of each step in the application of a warp control film according to another embodiment of the present invention to a fan-out panel-level packaging process. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The following will discuss the embodiments of the present invention in more detail. However, these embodiments may be applications of various inventive concepts and may be specifically implemented within various different specific scopes. The specific embodiments are for illustrative purposes only and are not limited to the disclosed scope. In addition, for the purpose of simplifying the drawings, some conventional structures and components will be shown in a simple schematic manner in the drawings.

[0028] An embodiment of the present invention provides a composition for warp control, which comprises a resin material and a hardener. The resin material comprises a copolymer synthesized from methyl methacrylate (MMA) and 2,3-epoxypropyl methacrylate (GMA), and the hardener comprises at least one of 2-ethyl-4-methylimidazole (2E4MZ) and dicyandiamide.

[0029] Specifically, the copolymer has a structure shown in Formula (I):

[0030]

[0031] Wherein, both m and n are positive numbers, and the ratio of m to n is 0.2 to 2.0. Furthermore, based on the total weight of the composition for warp control being 100%, the weight ratio of the copolymer in the composition for warp control is less than or equal to 80%, and the weight ratio of the hardener in the composition for warp control is 1% to 10%. Thereby, the warp control effect and the stability of the control ability of the subsequently prepared warp control film can be improved, and at the same time, the short-wavelength light transmittance of the warp control layer can be increased. It should be particularly noted that as long as the ratio of m to n of the copolymer meets the above range, the objectives and technical effects of the present invention can be achieved, and thus the present invention does not limit the actual values of m and n.

[0032] For example, the epoxy equivalent of the copolymer can be 310 g / eq., m:n can be 1.0:0.6, and the hardener can be 2-ethyl-4-methylimidazole. At this time, the weight ratio of the copolymer in the composition for warp control can be 25% to 70%, and the weight ratio of the hardener in the composition for warp control can be 1% to 8%. Or, the epoxy equivalent of the copolymer can be 170 g / eq., m:n can be 1.0:3.6, and the hardener can be 2-ethyl-4-methylimidazole or dicyandiamide. At this time, the weight ratio of the copolymer in the composition for warp control can be 40% to 50%, and the weight ratio of the hardener in the composition for warp control can be 3% to 10%. Thereby, by controlling the composition of the copolymer, the type of the hardener, and the ratio of the copolymer to the hardener, the mechanical properties and optical properties of the warp control layer can be adjusted, and thus a balance can be achieved between the warp control ability and the light transmittance.

[0033] The resin material may further contain triallyl isocyanurate (TAIC), and the hardener may further contain dicumyl peroxide (DCP). Among them, the weight ratio of triallyl isocyanurate in the composition for warpage control may be less than or equal to 50%, and the weight ratio of dicumyl peroxide in the composition for warpage control may be less than or equal to 5%. By using epoxy-based resin materials and vinyl-based resin materials simultaneously, the degree of bending reduction of the warpage control layer can be reduced, and the stability of its control ability can be further improved.

[0034] Furthermore, the resin material may further contain at least one of hydrogenated bisphenol A epoxy resin, 3,4-epoxycyclohexylmethyl acrylate (TTA16), and trimethylolpropane trimethacrylate (TMPTMA). Thereby, the mechanical properties and optical properties of the warpage control layer can be further adjusted by adding other resin materials.

[0035] The composition for warpage control of the present invention may further contain a plurality of inorganic filler particles, and the weight ratio of the plurality of inorganic filler particles in the composition for warpage control may be less than or equal to 60%. By adding inorganic filler particles, the mechanical properties of the warpage control layer can be strengthened, and thus the warpage control effect and the stability of the control ability of the warpage control layer can be improved.

[0036] Furthermore, each inorganic filler particle may be spherical. At this time, an average particle size of each inorganic filler particle may be from 0.1 μm to 5.0 μm. When the inorganic filler particles are spherical, a better warpage control effect can be achieved. Alternatively, each inorganic filler particle may be irregular. At this time, an average particle size of each inorganic filler particle may be from 0.1 μm to 5.0 μm. When the inorganic filler particles are irregular, the short-wavelength light transmittance of the warpage control layer can be increased. Each inorganic filler particle may contain at least one of silica, alumina, aluminum nitride, boron nitride, titanium oxide, zinc oxide, magnesium oxide, aluminum hydroxide, and magnesium hydroxide.

[0037] It should be specifically noted that the average particle size of the aforementioned inorganic filler particles is measured by the following method: First, measure the particle size distribution of all inorganic filler particles, and plot it into a graph based on the cumulative percentage of each particle size distribution to obtain a cumulative particle size distribution function. The average particle size of the inorganic filler particles of the present invention refers to the particle size corresponding to when the cumulative percentage of the particle size distribution reaches 50%, that is, the D50 particle size. In addition, irregular inorganic filler particles can also be measured and their D50 particle size calculated in the same way by a particle size analyzer.

[0038] The composition for warpage control of the present invention may further include at least one of acrylic block copolymer, epoxy and polyether modified silicone polymer, and 3-(3-(triethoxysilyl)propyl)dihydrofuran-2,5-dione, thereby further adjusting the mechanical properties and optical properties of the warpage control layer.

[0039] It should be specifically noted that although the above paragraphs describe different material formulations respectively, the composition for warpage control of the present invention can be arbitrarily blended according to the material types, proportions, and properties disclosed in the above paragraphs according to the actual situation (for example: the epoxy equivalent of a part of the copolymer can be 310 g / eq., and the epoxy equivalent of another part of the copolymer can be 170 g / eq., and 2-ethyl-4-methylimidazole and dicyandiamide are used as curing agents at the same time), thereby adjusting the mechanical properties and optical properties of the warpage control layer to meet the usage requirements. Therefore, any combination of the above material formulations falls within the protection scope of the present invention.

[0040] Another embodiment of the present invention provides a warpage control film, which is made of the composition for warpage control as described above.

[0041] Please refer to Figure 1 , Figure 1 which is a schematic cross-sectional view of the warpage control film 100 according to an embodiment of the present invention. Another embodiment of the present invention provides a warpage control film 100, which includes a warpage control layer 110 and a support release layer 120. The warpage control layer 110 is made of the composition for warpage control as described above, and the support release layer 120 is disposed on a surface of the warpage control layer 110. Among them, the thickness of the warpage control layer 110 can be 10 μm to 100 μm, thereby ensuring that the warpage control layer 110 has better warpage control ability and light transmittance.

[0042] Furthermore, a thickness of the support release layer 120 may be from 20 μm to 125 μm. By providing the support release layer 120, the mechanical properties of the warpage control film 100 can be further enhanced to reduce the degree of bending reduction of the warpage control film 100, thereby enhancing the warpage control effect of the warpage control film 100 without overly affecting the light transmittance.

[0043] Please refer to Figure 2A 、 Figure 2B 、 Figure 2C 、 Figure 2D 、 Figure 2E 、 Figure 2E and Figure 2G , Figures 2A to 2G respectively are cross-sectional schematic views of each step in the application of the warpage control film 220 of another embodiment of the present invention to a fan-out panel-level packaging process. In the fan-out panel-level packaging process, first, as shown in Figure 2A , a laser de-bonding film 210 is provided on a surface of a transparent substrate 200, and then, as shown in Figure 2B , a plurality of redistribution layers (RDL) 300 are provided on the laser de-bonding film 210, and the warpage control film 220 of the present invention is provided on another surface of the transparent substrate 200. The warpage control film 220 includes a warpage control layer 221 and a support release layer 222, and the support release layer 222 is provided on a surface of the warpage control layer 221.

[0044] Next, as shown in Figure 2C and Figure 2D , a plurality of dies 400 are provided on the redistribution layer 300, and an encapsulation material 500 is used to encapsulate the dies 400 and the joints between the dies 400 and the redistribution layer 300. Since the warpage control film 220 is provided on the transparent substrate 200, the warpage phenomenon caused by the stress difference during the provision of the redistribution layer 300, the dies 400, and the encapsulation material 500 can be reduced, so that the transparent substrate 200, the redistribution layer 300, and the overall packaging structure can all maintain flatness.

[0045] Please also refer to Figure 2E , first tear off the support release layer 222 of the warpage control film 220. When a laser L irradiates the transparent substrate 200, the laser L can pass through the warpage control layer 221, enter the transparent substrate 200 and reach the laser de-bonding film 210. After the laser de-bonding film 210 is affected by the laser L, it can be peeled off to separate the transparent substrate 200 from the redistribution layer 300. Since the warpage control layer 221 has good light transmittance, providing the warpage control layer 221 does not affect the peeling of the laser de-bonding film 210.

[0046] Next, as shown inFigure 2E As shown in Figure 2G Figure 2G , a plurality of solder balls 600 are implanted on a surface of the redistribution layer 300 away from the encapsulation material 500, and a printed circuit board 700 is connected to the redistribution layer 300 through the solder balls 600. Since the warpage control film 220 can reduce the occurrence of warpage problems during the encapsulation process, the redistribution layer 300 and the overall encapsulation structure can maintain flatness, and it is not easy to generate gaps with the printed circuit board 700, thereby improving the yield of the combination of the encapsulation structure and the printed circuit board 700.

[0047] The present invention will be further demonstrated by the following specific embodiments, which are beneficial to those of ordinary skill in the technical field to which the present invention belongs, and can be fully utilized and practiced without excessive interpretation, and these embodiments should not be regarded as limiting the scope of the present invention, but are used to illustrate the materials and methods for implementing the present invention.

[0048] <Warpage Control Ability and Light Transmittance Test>

[0049] The warpage control ability and light transmittance of the warpage control film or warpage control layer of the first to seventeenth embodiments and the first comparative example will be measured and evaluated below. Specifically, the warpage control ability includes measuring the bending amount, the bending amount after one day, and the degree of bending reduction of the warpage control film or warpage control layer, and the light transmittance includes measuring the transmittance of laser light with wavelengths of 355 nm, 532 nm, and 1064 nm passing through the warpage control layer. Among them, the calculation method of the aforementioned degree of bending reduction is as follows:

[0050] Degree of bending reduction =

[0051] (Bending amount - Bending amount after one day) / Bending amount × 100%.

[0052] The material formulas of the embodiments and comparative examples tested in this experiment are listed in Table 1 below.

[0053]

[0054]

[0055]

[0056] In Table 1 above, "-" represents the materials not used in the corresponding embodiments or comparative examples, and "2PHZ-PW" in Table 1 refers to (2-phenyl-1H-imidazole-4,5-diyl)dimethanol.

[0057] It should be noted that for the warpage control films of the foregoing embodiments and comparative examples, the materials listed in Table 1 above are first added to one or several solvents, and the solvents can be ethyl acetate (EAC), butyl acetate (BAC), or methyl ethyl ketone (MEK). After the foregoing materials are completely dissolved to form a glue, it is then coated on a support release layer and dried at 100°C to 120°C for 10 minutes to 20 minutes to remove the solvent. Then, the composition for warpage control on the support release layer is thermally bonded to a circular FR-5 substrate with a diameter of 12 cm at 80°C to 100°C, and after tearing off the support release layer, it is cured at 180°C for 2 hours to form a warpage control layer and conduct tests. Among them, for the 12th to 14th embodiments, curing is carried out without tearing off the support release layer to obtain a warpage control film with a support release layer.

[0058] <Examples 1 to 4 and Comparative Example 1>

[0059] The thickness, bending amount, bending amount the next day, bending reduction degree, and transmittance of laser light with different wavelengths of the warpage control layers of Examples 1 to 4 and Comparative Example 1 are listed in Table 2 below.

[0060]

[0061] The "-" in Table 2 above represents that the measurement was not carried out. From the results of Table 2 above, it can be seen that compared with Comparative Example 1, the transmittance of laser light in Example 1 has been improved, especially the improvement degree of the transmittance of 355 nm laser light is the most obvious. Furthermore, among Examples 1 to 4, when the thickness of the warpage control layer is smaller, the transmittance of laser light is higher. Furthermore, compared with Example 1, the warpage control layers of Examples 2 and 3 have added inorganic filler particles, resulting in an increase in the bending amount and bending amount the next day of the warpage control layer, and a decrease in the bending reduction degree. Furthermore, compared with Example 1, the warpage control layer of Example 4 has added a vinyl resin material, resulting in a decrease in the bending reduction degree of the warpage control layer.

[0062] <Examples 5 to 11>

[0063] The thickness, bending amount, bending amount the next day, bending reduction degree, and transmittance of laser light with different wavelengths of the warpage control layers of Examples 5 to 11 are listed in Table 3 below.

[0064]

[0065] As can be seen from the results in Table 3 above, in the 5th to 7th embodiments and the 10th to 11th embodiments, the higher the addition ratio of the inorganic filler particles, the greater the bending amount and the bending amount after one day of the warpage control layer. Furthermore, in the 7th to 9th embodiments, when the same ratio of inorganic filler particles is added, the larger the average particle size of the inorganic filler particles, the greater the bending amount, the bending amount after one day, and the laser light transmittance of the warpage control layer. Furthermore, by comparing the 8th embodiment with the 10th embodiment, adding irregular inorganic filler particles can improve the laser light transmittance.

[0066] <The 1st embodiment and the 12th to 15th embodiments>

[0067] The thickness, bending amount, bending amount after one day, degree of bending reduction, and transmittance of laser light with different wavelengths of the warpage control layer in the 1st embodiment and the 12th to 15th embodiments are listed in Table 4 below.

[0068]

[0069] As can be seen from the results in Table 4 above, by comparing the 1st embodiment with the 12th embodiment, when the warpage control film has a support release layer, the bending amount and the bending amount after one day of the warpage control film can be improved. Furthermore, in the 1st embodiment, the 12th embodiment, the 14th embodiment, and the 15th embodiment, when the warpage control film is added with a vinyl resin material and has a support release layer, the bending amount and the bending amount after one day of the warpage control film increase, the degree of bending reduction decreases, and a good laser light transmittance can be maintained.

[0070] <The 1st embodiment and the 16th to 17th embodiments>

[0071] The thickness, bending amount, bending amount after one day, degree of bending reduction, and transmittance of laser light with different wavelengths of the warpage control layer in the 1st embodiment and the 16th to 17th embodiments are listed in Table 5 below.

[0072]

[0073] As can be seen from the results in Table 5 above, by comparing the 1st embodiment with the 16th embodiment, when the epoxy equivalent of the copolymer is lower, the bending amount and the bending amount after one day of the warpage control layer increase, and the degree of bending reduction decreases. Furthermore, by comparing the 16th embodiment with the 17th embodiment, if dicyandiamide is selected as the curing agent, the bending amount of the warpage control layer can be improved.

[0074] In summary, by selecting specific resin materials and hardeners, the composition for warp control of the present invention enables the subsequently prepared warp control film to have sufficient warp control ability, improves the short-wavelength light transmittance of the warp control layer, reduces the influence of the warp control layer on the peeling of the substrate, thereby simplifying the process and reducing the manufacturing cost.

[0075] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Any person skilled in this art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the appended claims.

[0076] Symbol Description

[0077] 100, 220: Warp control film

[0078] 110, 221: Warp control layer

[0079] 120, 222: Support release layer

[0080] 200: Transparent substrate

[0081] 210: Laser de-bonding film

[0082] 300: Circuit redistribution layer

[0083] 400: Chip

[0084] 500: Encapsulation material

[0085] 600: Solder ball

[0086] 700: Printed circuit board

[0087] L: Laser

Claims

1. A composition for warpage control, characterized in that, Comprising: A resin material comprising a copolymer synthesized from methyl methacrylate and glycidyl methacrylate, the copolymer having a structure as shown in formula (I): Wherein, both m and n are positive numbers, and a ratio of m to n is 0.2 to 2.0; and A hardener comprising at least one of 2-ethyl-4-methylimidazole and dicyandiamide; Wherein, based on 100% of the total weight of the composition for warp control, the weight ratio of the copolymer in the composition for warp control is less than or equal to 80%, and the weight ratio of the hardener in the composition for warp control is 1% to 10%.

2. The composition for warpage control according to claim 1, wherein An epoxy equivalent of the copolymer is 310 g / eq., m:n is 1.0:0.6, and the hardener is the 2-ethyl-4-methylimidazole.

3. The composition for warpage control according to claim 2, wherein The weight ratio of the copolymer in the composition for warp control is 25% to 70%, and the weight ratio of the hardener in the composition for warp control is 1% to 8%.

4. The composition for warpage control according to claim 1, wherein An epoxy equivalent of the copolymer is 170 g / eq., m:n is 1.0:3.6, and the hardener is the 2-ethyl-4-methylimidazole or the dicyandiamide.

5. The composition for warpage control according to claim 4, wherein The weight ratio of the copolymer in the composition for warp control is 40% to 50%, and the weight ratio of the hardener in the composition for warp control is 3% to 10%.

6. The composition for warpage control according to claim 1, wherein The resin material further comprises triallyl isocyanurate, and the hardener further comprises dicumyl peroxide.

7. The composition for warpage control according to claim 6, wherein The weight ratio of the triallyl isocyanurate in the composition for warp control is less than or equal to 50%, and the weight ratio of the dicumyl peroxide in the composition for warp control is less than or equal to 5%.

8. The composition for warpage control according to claim 1, wherein The resin material further comprises at least one of hydrogenated bisphenol A epoxy resin, 3,4-epoxycyclohexyl methacrylate and trimethylolpropane trimethacrylate.

9. The composition for warpage control according to claim 1, wherein Further comprising a plurality of inorganic filler particles, and the weight ratio of the plurality of inorganic filler particles in the composition for warp control is less than or equal to 60%.

10. The composition for warpage control according to claim 9, wherein Each of the inorganic filler particles is spherical, and an average particle diameter of each of the inorganic filler particles is 0.1 μm to 5.0 μm.

11. The composition for warpage control according to claim 9, wherein Each of the inorganic filler particles is irregular, and an average particle diameter of each of the inorganic filler particles is 0.1 μm to 5.0 μm.

12. A warpage control film, characterized in that, It is made of the composition for warp control according to any one of claims 1 to 11.

13. A warpage control film, characterized in that, Comprising: A warp control layer made of the composition for warp control according to any one of claims 1 to 11; and A support release layer provided on a surface of the warp control layer.

14. The warpage control film according to claim 13, wherein A thickness of the support release layer is 20 μm to 125 μm.

15. The warpage control film according to claim 13, characterized in that, A thickness of the warp control layer is 10 μm to 100 μm.

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