Epoxy resin composition and application thereof

Abstract

The invention provides an epoxy resin composition and application thereof. The epoxy resin composition comprises the following components in parts by mass: 10-30 parts of epoxy resin, 12-50 parts of an anhydride curing agent, 30-100 parts of titanium dioxide, 8-25 parts of phosphate and 0.001-0.01 part of a curing accelerator, the epoxy resin is composed of alicyclic epoxy resin and optional bisphenol A epoxy resin, and the mass percentage of the alicyclic epoxy resin in the epoxy resin is greater than or equal to 30%. Through the screening design of specific types of epoxy resin, anhydride curing agent and phosphate and the synergistic compounding of the epoxy resin, anhydride curing agent and phosphate with titanium dioxide and curing accelerator, the flame-retardant coating has the advantages of excellent flame retardance, high whiteness and light reflectivity, good high-temperature aging resistance and ultraviolet aging resistance, excellent light resistance and yellowing resistance, and good weather resistance. And the metal foil-clad laminated board and the printed circuit board comprising the metal foil-clad laminated board are more suitable for being used as an LED packaging substrate material.

Description

Technical Field

[0001] The present invention belongs to the technical field of printed circuit boards, and particularly relates to an epoxy resin composition and its application. Background Art

[0002] In recent years, optoelectronic semiconductor devices represented by LEDs have been widely used in display devices, vehicle components, and mobile phone backlights. With the continuous increase in the power and brightness of LEDs, it is required that the laminates in printed circuit boards for LED installation have excellent light resistance, especially a high light reflectivity after ultraviolet light irradiation. In addition, with the increasing emphasis on the safety of electronic products, especially in vehicle-mounted LEDs used in vehicles such as motor vehicles, more stringent requirements are also put forward for the flame retardant performance of laminates.

[0003] At present, bisphenol A type epoxy resin and silicone are mainly used in LED packaging substrate materials. Due to the high cost of silicone and poor adhesion, bisphenol A type epoxy resin is still mainly used. However, bisphenol A type epoxy resin contains benzene rings and is prone to oxidative yellowing after absorbing ultraviolet light. In the molecular structure of alicyclic epoxy resin, the epoxy group is directly connected to the alicyclic ring. Because it does not contain benzene rings, it has a low ultraviolet absorption amount and strong weather resistance. Compared with bisphenol A type epoxy resin, alicyclic epoxy resin has the advantages of high light reflectivity, strong ultraviolet light resistance, and low hygroscopicity after curing, and is more suitable for LED packaging. Moreover, epoxy resin also has the disadvantage of poor flame retardant ability of general organic polymer materials, and the safety and reliability in long-term application in electronic devices are relatively low. Therefore, flame retardant treatment must be carried out.

[0004] CN113278257A discloses a glue solution for halogen-free environmentally friendly copper clad laminates, which comprises the following components in parts by weight: 30 - 70 parts of hydrogenated bisphenol A type epoxy resin, 30 - 70 parts of hydrogenated phthalic acid epoxy resin, 5 - 15 parts of isocyanuric acid triglycidyl ester, 40 - 50 parts of curing agent, 0.1 - 0.3 parts of accelerator, 8 - 12 parts of flame retardant, 140 - 160 parts of inorganic filler, 0.3 - 0.5 parts of interfacial binder, and 150 - 170 parts of organic solvent. Compared with the traditional bisphenol A type epoxy system, this glue solution uses hydrogenated bisphenol A type epoxy resin and hydrogenated phthalic acid epoxy resin to improve the yellowing problem of the benzene ring structure; however, the reflectivity of the copper clad laminate will decrease significantly after ultraviolet and high-temperature treatment, and it is difficult to meet the increasingly demanding requirements for light resistance and aging resistance.

[0005] CN116082793A discloses an epoxy resin composition for a yellowing-resistant white copper clad laminate, and its raw materials include the following components in parts by mass: 15-40 parts of polyester resin, 10-20 parts of alicyclic epoxy resin, 20-35 parts of other epoxy resins, 20-40 parts of curing agent, and 120-180 parts of inorganic filler. The copper clad laminate prepared from this epoxy resin composition has a relatively high initial whiteness and good heat resistance, but its yellowing resistance is still insufficient, and there are obvious problems of yellowing and a large attenuation of light reflectance after high-temperature treatment.

[0006] Since existing white copper clad laminates generally have problems of insufficient light resistance and flame retardancy, developing white copper clad laminate materials with excellent flame retardancy, light resistance, and aging resistance is an urgent problem to be solved in this field. Summary of the Invention

[0007] Aiming at the deficiencies of the prior art, the purpose of the present invention is to provide an epoxy resin composition and its application. Through the screening of specific types of epoxy resins, acid anhydride curing agents, phosphates and their compounding synergies with components such as titanium dioxide and curing accelerators, the epoxy resin composition has excellent flame retardancy, high light reflectance, good high-temperature aging resistance and ultraviolet aging resistance, making the metal-clad laminate and printed circuit board containing it more suitable for use as LED packaging substrate materials.

[0008] To achieve this purpose, the present invention adopts the following technical solutions:

[0009] In the first aspect, the present invention provides an epoxy resin composition, which includes the following components in parts by mass:

[0010]

[0011]

[0012] The epoxy resin is composed of alicyclic epoxy resin and optionally bisphenol A epoxy resin, and the mass percentage content of alicyclic epoxy resin in the epoxy resin ≥ 30%.

[0013] In the present invention, epoxy resin is used as the matrix resin, which is composed of alicyclic epoxy resin and optionally bisphenol A epoxy resin, and the mass percentage content of alicyclic epoxy resin ≥ 30%. From the perspective of the matrix resin, oxidation yellowing is inhibited; at the same time, a phosphate with high flame retardancy efficiency is used as the flame retardant. Through the screening design of specific types of epoxy resins, acid anhydride curing agents, phosphates and their synergistic compounding with titanium dioxide and curing accelerators, the epoxy resin composition has excellent flame retardancy, high whiteness and light reflectance, good high-temperature aging resistance and ultraviolet aging resistance, improves the flame retardancy ability of the epoxy resin system, and makes the metal-clad laminate and printed circuit board containing it more suitable for use as LED packaging substrate materials.

[0014] The following are the preferred technical solutions of the present invention, but do not limit the technical solutions provided by the present invention. Through the following preferred technical solutions, the objectives and beneficial effects of the present invention can be better achieved and realized.

[0015] In the epoxy resin composition of the present invention, the mass parts of the epoxy resin are 10 - 30 parts. For example, it can be 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts or 28 parts, as well as the specific point values between the above point values. Due to space limitations and for the sake of simplicity, the present invention does not exhaustively list the specific point values included in the above range.

[0016] The mass parts of the acid anhydride curing agent are 12 - 50 parts. For example, it can be 13 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts, 40 parts, 42 parts, 45 parts or 48 parts, as well as the specific point values between the above point values. Due to space limitations and for the sake of simplicity, the present invention does not exhaustively list the specific point values included in the above range.

[0017] The mass parts of the titanium dioxide are 30 - 100 parts. For example, it can be 35 parts, 40 parts, 45 parts, 50 parts, 55 parts, 60 parts, 65 parts, 70 parts, 75 parts, 80 parts, 85 parts, 90 parts or 95 parts, as well as the specific point values between the above point values. Due to space limitations and for the sake of simplicity, the present invention does not exhaustively list the specific point values included in the above range.

[0018] The mass parts of the phosphate are 8 - 25 parts. For example, it can be 9 parts, 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts or 24 parts, as well as the specific point values between the above point values. Due to space limitations and for the sake of simplicity, the present invention does not exhaustively list the specific point values included in the above range.

[0019] The mass parts of the curing accelerator are 0.001 - 0.01 parts. For example, it can be 0.0015 parts, 0.002 parts, 0.0025 parts, 0.003 parts, 0.0035 parts, 0.004 parts, 0.0045 parts, 0.005 parts, 0.0055 parts, 0.006 parts, 0.0065 parts, 0.007 parts, 0.0075 parts, 0.008 parts or 0.009 parts, as well as the specific point values between the above point values. Due to space limitations and for the sake of simplicity, the present invention does not exhaustively list the specific point values included in the above range.

[0020] In the present invention, the mass percentage content of alicyclic epoxy resin in the epoxy resin is ≥ 30%, for example, it can be 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95% or 100%, and the specific point values between the above point values. Due to space limitations and for the sake of simplicity, the present invention does not exhaustively list the specific point values included in the above range. Further preferably, it is ≥ 50%.

[0021] Preferably, the epoxy equivalent of the alicyclic epoxy resin is 100 - 400 g / eq, for example, it can be 120 g / eq, 150 g / eq, 180 g / eq, 200 g / eq, 220 g / eq, 250 g / eq, 280 g / eq, 300 g / eq, 320 g / eq, 350 g / eq or 380 g / eq, and the specific point values between the above point values. Due to space limitations and for the sake of simplicity, the present invention does not exhaustively list the specific point values included in the above range.

[0022] Preferably, the alicyclic epoxy resin includes any one or a combination of at least two of the following compounds:

[0023]

[0024] Preferably, the mass percentage content of alicyclic epoxy resin in the epoxy resin is ≥ 50%.

[0025] Preferably, the epoxy equivalent of the bisphenol A epoxy resin is 120 - 280 g / eq, for example, it can be 130 g / eq, 150 g / eq, 160 g / eq, 170 g / eq, 180 g / eq, 190 g / eq, 200 g / eq, 220 g / eq, 250 g / eq or 270 g / eq, and the specific point values between the above point values. Due to space limitations and for the sake of simplicity, the present invention does not exhaustively list the specific point values included in the above range.

[0026] Preferably, the anhydride curing agent includes any one or a combination of at least two of phthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, and styrene - maleic anhydride copolymer. Further preferably, it is phthalic anhydride and / or styrene - maleic anhydride copolymer.

[0027] Preferably, the number-average molecular weight of the styrene-maleic anhydride copolymer is 1,000-50,000, and can be, for example, 2,000, 3,000, 4,000, 5,000, 6,000, 7,000, 8,000, 9,000, 10,000, 15,000, 20,000, 25,000, 30,000, 35,000, 40,000 or 45,000, as well as specific point values between the above point values. Due to space limitations and for the sake of brevity, the present invention does not exhaustively list the specific point values included in the above range. More preferably, it is 1,500-10,000.

[0028] Preferably, the titanium dioxide includes rutile titanium dioxide.

[0029] Preferably, the average particle size of the titanium dioxide ≤ 0.6 μm, and can be, for example, 0.01 μm, 0.05 μm, 0.8 μm, 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, 0.45 μm, 0.5 μm or 0.55 μm, as well as specific point values between the above point values. Due to space limitations and for the sake of brevity, the present invention does not exhaustively list the specific point values included in the above range.

[0030] In the present invention, the data related to the particle size (average particle size D 50 ) is obtained by testing with an MS3000 Malvern laser particle size analyzer.

[0031] Preferably, the phosphate includes organic hypophosphite.

[0032] Preferably, the organic hypophosphite has a structure shown in Formula I:

[0033]

[0034] Among them, R1 and R2 are each independently selected from any one of C1-C6 (such as C1, C2, C3, C4, C5, C6) straight-chain or branched-chain alkyl groups and C3-C6 (such as C3, C4, C5, C6) cycloalkyl groups.

[0035] M n+ represents an +n-valent metal ion, and n is 2 or 3.

[0036] Preferably, R1 and R2 are each independently selected from any one of C1-C4 straight-chain or branched-chain alkyl groups, and more preferably ethyl.

[0037] Preferably, the M n+ is selected from Al 3+ or Zn 2+ .

[0038] Preferably, the organic hypophosphite flame retardant includes aluminum diethylphosphinate.

[0039] Preferably, the curing accelerator includes any one or a combination of at least two of tertiary amines, quaternary ammonium salts, imidazole compounds, organometallic complexes, and tertiary phosphines.

[0040] Preferably, the curing accelerator includes an imidazole-based curing accelerator.

[0041] Preferably, the imidazole compound includes any one or a combination of at least two of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-isopropylimidazole, 2-undecylimidazole, 2-dodecylimidazole, 2-heptadecylimidazole, 1-benzyl-2-methylimidazole, 2-phenyl-4-methylimidazole, and 1-cyanoethyl-2-methylimidazole.

[0042] Preferably, the epoxy resin composition further includes 0.01 - 0.1 part of a dispersant by mass. For example, the dispersant can be 0.02 part, 0.03 part, 0.04 part, 0.05 part, 0.06 part, 0.07 part, 0.08 part, or 0.09 part, as well as specific point values between the above point values. Due to space limitations and for the sake of simplicity, the present invention does not exhaustively list the specific point values included in the range.

[0043] Preferably, the dispersant is a polysiloxane-based dispersant.

[0044] A solvent can also be added to the epoxy resin composition. The addition amount of the solvent is selected by those skilled in the art according to experience and process requirements to make the epoxy resin composition reach a suitable viscosity for facilitating the coating of the epoxy resin composition and the preparation of resin films, copper foils coated with resin, prepregs, etc. Subsequently, in the drying (baking) process, the solvent in the epoxy resin composition will partially or completely volatilize.

[0045] There is no particular limitation on the solvent of the present invention. Generally, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene and xylene, esters such as ethyl acetate and butyl acetate, alcohols such as methanol, ethanol, or butanol, alcohols such as ethyl cellosolve, butyl cellosolve, ethylene glycol monomethyl ether, carbitol, or butyl carbitol, and nitrogen-containing compounds such as N,N-dimethylformamide, N,N-dimethylacetamide, or N-methyl-2-pyrrolidone can be selected; the solvent can be used alone or in combination of two or more. Preferably, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, and aromatic hydrocarbons such as toluene and xylene are used.

[0046] The epoxy resin composition provided by the present invention is prepared by the following method. The preparation method includes: mixing and dispersing the components in the epoxy resin composition evenly to obtain the epoxy resin composition.

[0047] Second aspect, the present invention provides a resin film, and the material of the resin film comprises the epoxy resin composition as described in the first aspect.

[0048] Preferably, the resin film is prepared by coating the epoxy resin composition on a release material and drying and / or semi-curing.

[0049] Preferably, the drying temperature is 90 - 160 °C, for example, it can be 90 °C, 100 °C, 110 °C, 120 °C, 130 °C, 140 °C, 150 °C or 160 °C, as well as specific point values between the above point values. Due to space limitations and for the sake of brevity, the present invention does not exhaustively list the specific point values included in the range.

[0050] Preferably, the drying time is 1 - 20 min, for example, it can be 1 min, 3 min, 5 min, 7 min, 9 min, 10 min, 11 min, 13 min, 15 min, 17 min, 19 min or 20 min, as well as specific point values between the above point values. Due to space limitations and for the sake of brevity, the present invention does not exhaustively list the specific point values included in the range.

[0051] Third aspect, the present invention provides a resin-coated copper foil, and the resin-coated copper foil comprises a copper foil layer and a resin layer, and the material of the resin layer comprises the epoxy resin composition as described in the first aspect.

[0052] Preferably, the resin-coated copper foil is prepared by coating the epoxy resin composition on a copper foil and drying and / or semi-curing.

[0053] Fourth aspect, the present invention provides a prepreg, and the prepreg comprises a reinforcing material and the epoxy resin composition as described in the first aspect attached to the reinforcing material.

[0054] Preferably, the epoxy resin composition in the prepreg is attached to the reinforcing material after impregnation, drying and / or semi-curing.

[0055] Preferably, the reinforcing material includes glass fiber cloth, quartz fiber cloth, quartz glass fiber blended cloth or non-woven fabric, etc.

[0056] Preferably, the drying temperature is 90 - 160 °C, for example, it can be 90 °C, 100 °C, 110 °C, 120 °C, 130 °C, 140 °C, 150 °C or 160 °C, as well as specific point values between the above point values. Due to space limitations and for the sake of brevity, the present invention does not exhaustively list the specific point values included in the range.

[0057] Preferably, the drying time is 2 - 20 min, for example, it can be 2 min, 3 min, 5 min, 7 min, 9 min, 10 min, 11 min, 13 min, 15 min, 17 min, 19 min or 20 min, as well as the specific point values between the above point values. Due to space limitations and for the sake of simplicity, the present invention does not exhaustively list the specific point values included in the scope.

[0058] In a fifth aspect, the present invention provides a metal foil clad laminate, which includes at least one of the resin film as described in the second aspect, the resin-coated copper foil as described in the third aspect, and the prepreg as described in the fourth aspect.

[0059] Preferably, the metal foil in the metal foil clad laminate is copper foil, and the metal foil clad laminate is a copper clad laminate.

[0060] Preferably, the number of prepregs in the metal foil clad laminate is 1 - 20, for example, it can be 2, 3, 5, 6, 8, 10, 12, 15 or 18, etc.

[0061] Exemplarily, the preparation method of the metal foil clad laminate includes: covering a metal foil on one side or both sides of the prepreg, and laminating to obtain the metal foil clad laminate; or, stacking at least two prepregs to form a stacked structure, covering a metal foil on one side or both sides of the stacked structure, and laminating to obtain the metal foil clad laminate.

[0062] Preferably, the temperature of the lamination is 160 - 280 °C, such as 160 °C, 165 °C, 170 °C, 175 °C, 180 °C, 185 °C, 190 °C, 200 °C, 220 °C, 250 °C or 270 °C, as well as the specific point values between the above point values. Due to space limitations and for the sake of simplicity, the present invention does not exhaustively list the specific point values included in the scope.

[0063] Preferably, the pressure of the lamination is 1 - 8 MPa, for example, it can be 1.5 MPa, 2 MPa, 2.5 MPa, 3 MPa, 3.5 MPa, 4 MPa, 4.5 MPa, 5 MPa, 5.5 MPa, 6 MPa, 6.5 MPa, 7 MPa or 7.5 MPa, as well as the specific point values between the above point values. Due to space limitations and for the sake of simplicity, the present invention does not exhaustively list the specific point values included in the scope.

[0064] Preferably, the lamination time is 100 - 300 min, for example, it can be 100 min, 120 min, 140 min, 150 min, 160 min, 180 min, 200 min, 220 min, 240 min, 260 min or 280 min, as well as the specific point values between the above point values. Due to space limitations and for the sake of brevity, the specific point values included in the scope of the present invention are not exhaustively listed herein.

[0065] In a sixth aspect, the present invention provides a printed circuit board, which includes at least one of the resin film as described in the second aspect, the resin-coated copper foil as described in the third aspect, the prepreg as described in the fourth aspect, and the metal-clad laminate as described in the fifth aspect.

[0066] Compared with the prior art, the present invention has the following beneficial effects:

[0067] (1) In the epoxy resin composition provided by the present invention, through the screening and design of specific types of epoxy resins, anhydride curing agents, phosphates and their synergistic compounding with titanium dioxide and curing accelerators, it has excellent flame retardancy, high whiteness and light reflectivity, good high-temperature aging resistance and ultraviolet aging resistance, excellent light resistance and yellowing resistance, making the metal-clad laminate and printed circuit board containing it more suitable for use as LED packaging substrate materials.

[0068] (2) Through the component design and optimization of the epoxy resin composition, the copper-clad laminate containing the epoxy resin composition achieves V-0 level flame retardancy, the initial reflectivity ≥ 87.6%, the reflectivity after 24 h of ultraviolet light irradiation ≥ 86.0%, and the reflectivity after treatment at 200 °C for 1 h ≥ 76.9%. It maintains a high reflectivity after ultraviolet light irradiation and high-temperature treatment, has excellent high-temperature aging resistance and ultraviolet aging resistance, and fully meets the performance requirements of circuit board backlight applications such as LEDs and MiniLED circuit boards. Detailed Embodiments

[0069] The technical solutions of the present invention will be further described below through specific embodiments. Those skilled in the art should understand that the embodiments are only for helping to understand the present invention and should not be construed as specific limitations on the present invention.

[0070] In the following specific embodiments of the present invention, the material information involved is as follows:

[0071] (1) Epoxy resin

[0072] Alicyclic epoxy resin, S-06E, purchased from Donghua, and its structural formula is as follows:

[0073]

[0074] Alicyclic epoxy resin, S-28, purchased from Donghua, has the following structural formula:

[0075]

[0076] Bisphenol A epoxy resin, GELR128E, was purchased from Hongchang.

[0077] (2) Anhydride curing agent

[0078] Styrene-maleic anhydride copolymer, SMAEF40, number average molecular weight 4500, purchased from Cray Valley Company.

[0079] (3) Titanium dioxide

[0080] Titanium dioxide, R-960, purchased from Chemours Chemical Company, USA, particle size D 50 =0.4μm;

[0081] Titanium dioxide, R-900, purchased from Chemours Chemical Company, USA, particle size D 50 =0.5μm.

[0082] (4) Phosphate

[0083] Diethyl phosphate, OP935, was purchased from Clariant.

[0084] (5) Curing accelerator

[0085] 2-MI, 2-methylimidazole.

[0086] (6) Dispersant

[0087] W9010, purchased from Bic.

[0088] (7) Other flame retardants

[0089] Phosphazene, SPB-100, was purchased from Otsuka Chemical;

[0090] Phosphate ester, PX-200, was purchased from Zhejiang Wansheng.

[0091] Example 1

[0092] An epoxy resin composition comprises the following components in parts by mass:

[0093]

[0094]

[0095] A prepreg and a metal foil-clad laminate (copper-clad laminate) comprising the epoxy resin composition, the preparation method of which is as follows:

[0096] (1) According to the aforementioned formulation amounts, add each component together with the solvent methyl ethyl ketone into a container and stir to mix them evenly to obtain a resin glue solution with a solid content of 65%; arrange 1080 electronic-grade glass fibers in the resin glue solution for impregnation, and then bake and dry at 150 °C in an oven for 2 min to obtain a prepreg;

[0097] (2) Take 2 prepregs obtained in step (1), cover both sides with 70-μm-thick electrolytic copper foil, and perform vacuum lamination on a hot press, and cure at 190 °C and 3 MPa for 120 min to obtain a copper-clad laminate.

[0098] Examples 2-6, Comparative Examples 1-3

[0099] An epoxy resin composition, a prepreg containing the same, and a copper-clad laminate, the difference from Example 1 is only that the types and / or amounts of components of the epoxy resin composition are different, and the specific formulation is shown in Table 1; the unit of the amount of each component in Table 1 is "parts"; the preparation methods of the prepreg and the copper-clad laminate are the same as those in Example 1.

[0100] Table 1

[0101]

[0102]

[0103] Perform the following performance tests on the copper-clad laminates provided in Examples 1-6 and Comparative Examples 1-3:

[0104] (1) Reflectivity: After etching the substrate, use a spectrocolorimeter to measure the whiteness / light reflectivity of the substrate;

[0105] (2) Reflectivity after ultraviolet light irradiation: Etch the substrate, and after treating it under ultraviolet light for 24 h, use a spectrocolorimeter to measure the whiteness / light reflectivity of the substrate in state A;

[0106] (3) Reflectivity after high temperature: Etch the substrate, and after heating it in an oven at 200 °C for 1 h, use a spectrocolorimeter to measure the whiteness / light reflectivity of the substrate in state A;

[0107] (4) Flame retardancy: Test according to the combustion method specified in UL94; Fail represents the failure of flame retardancy;

[0108] The test results are shown in Table 2:

[0109] Table 2

[0110]

[0111] According to the performance data in Table 2, in the epoxy resin composition provided by the present invention, through the screening and design of specific types of epoxy resins, anhydride curing agents, and phosphates, as well as their synergistic compounding with titanium dioxide and curing accelerators, the epoxy resin composition has excellent flame retardancy, high light reflectivity, excellent high-temperature aging resistance, and ultraviolet aging resistance. The initial reflectivity of the copper clad laminate containing it is 87.6 - 90.5%, the reflectivity after 24 hours of ultraviolet light irradiation is 86.0 - 89.7%, and the reflectivity after treatment at 200°C for 1 hour is 76.9 - 80.1%. It not only has a high initial reflectivity, but also has less yellowing after ultraviolet light irradiation and high-temperature treatment, and at the same time has V-0 flame retardancy, which can meet the applications of circuit board backlights such as LEDs.

[0112] Compared with Examples 1 - 4, in Comparative Example 1, alicyclic epoxy resin was not used, and the initial reflectivity of the prepared copper clad laminate was slightly lower, and the ultraviolet yellowing resistance and high-temperature yellowing resistance were relatively poor, and yellowing was likely to occur when used as an LED circuit board.

[0113] Compared with Example 2, in Comparative Examples 2 - 3, diethyl phosphate was not used as the flame retardant, and phosphazene or phosphate ester with the same flame retardant effect was used. Although the prepared copper clad laminate has V-0 flame retardancy, the reflectivity is relatively low, especially the reflectivity has a significant attenuation after high-temperature treatment, and it is difficult to be applied to MiniLED circuit boards and circuit board backlights such as LEDs.

[0114] The applicant declares that the present invention uses the above examples to illustrate the epoxy resin composition and its application of the present invention, but the present invention is not limited to the above examples, that is, it does not mean that the present invention must rely on the above examples to be implemented. Those skilled in the art should understand that any improvement of the present invention, the equivalent substitution of each raw material of the products of the present invention, the addition of auxiliary components, and the selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. An epoxy resin composition, characterized in that, The epoxy resin composition comprises the following components by mass parts: The epoxy resin consists of an alicyclic epoxy resin and optionally a bisphenol A epoxy resin, and the mass percentage content of the alicyclic epoxy resin in the epoxy resin is ≥ 30%.

2. The epoxy resin composition according to claim 1, wherein The epoxy equivalent of the alicyclic epoxy resin is 100 - 400 g / eq; Preferably, the alicyclic epoxy resin comprises any one or a combination of at least two of the following compounds: Preferably, the mass percentage content of the alicyclic epoxy resin in the epoxy resin is ≥ 50%.

3. The epoxy resin composition according to claim 1 or 2, characterized in that The anhydride curing agent comprises any one or a combination of at least two of phthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, and styrene-maleic anhydride copolymer, preferably phthalic anhydride and / or styrene-maleic anhydride copolymer; Preferably, the number-average molecular weight of the styrene-maleic anhydride copolymer is 1000 - 50000.

4. The epoxy resin composition according to any one of claims 1-3, characterized in that, The titanium dioxide comprises rutile titanium dioxide; Preferably, the average particle size of the titanium dioxide is ≤ 0.6 μm; Preferably, the phosphate comprises an organic hypophosphite; Preferably, the organic hypophosphite has a structure shown in Formula I: Wherein, R1 and R2 are each independently selected from any one of C1-C6 straight-chain or branched-chain alkyl groups and C3-C6 cycloalkyl groups; M n+ represents an +n-valent metal ion, where n is 2 or 3; Preferably, R1 and R2 are each independently selected from any one of C1-C4 straight-chain or branched-chain alkyl groups; Preferably, the M n+ is selected from Al 3+ or Zn 2+ ; Preferably, the organic phosphite flame retardant comprises aluminum diethyl phosphite.

5. The epoxy resin composition according to any one of claims 1 to 4, characterized in that The curing accelerator comprises an imidazole-based curing accelerator; Preferably, the epoxy resin composition further comprises 0.01 - 0.1 part of a dispersant by mass parts; Preferably, the dispersant is a polysiloxane-based dispersant.

6. A resin film, characterized in that, The material of the resin film comprises the epoxy resin composition according to any one of claims 1 - 5.

7. A resin-coated copper foil, characterized in that, The resin-coated copper foil comprises a copper foil layer and a resin layer, and the material of the resin layer comprises the epoxy resin composition according to any one of claims 1 - 5.

8. A prepreg, characterized in that The prepreg comprises a reinforcing material and the epoxy resin composition according to any one of claims 1 - 5 attached to the reinforcing material.

9. A metal-clad laminate, characterized in that, The metal foil-clad laminate comprises at least one of the resin film according to claim 6, the resin-coated copper foil according to claim 7, and the prepreg according to claim 8.

10. A printed circuit board, characterized in that, The printed circuit board comprises at least one of the resin film according to claim 6, the resin-coated copper foil according to claim 7, the prepreg according to claim 8, and the metal foil-clad laminate according to claim 9.

Images