Semiconductor refrigerator with variable-temperature freezing function

Abstract

The invention provides a semiconductor refrigerator with a variable-temperature freezing function. The semiconductor refrigerator comprises a refrigerator body, an air duct module, a refrigeration module and a semiconductor refrigeration module. A refrigerating chamber, a temperature changing chamber and a freezing chamber are arranged in the refrigerator body. A freezing evaporator is arranged in the refrigeration module; the freezing evaporator is arranged between the refrigerating chamber and the freezing chamber; the air duct module comprises a freezing fan, a variable-temperature air duct, a freezing air duct and an air return duct; the variable-temperature air duct is communicated with the variable-temperature chamber, the freezing air duct is communicated with the freezing chamber, the inlet end of the freezing evaporator is connected with the return air duct, and the freezing fan is located at the outlet end of the freezing evaporator and used for driving airflow circulation; the semiconductor refrigeration module comprises a refrigeration block, a semiconductor refrigeration sheet and a heat dissipation block; the semiconductor chilling plate is located between the variable-temperature air duct and the freezing air duct, the hot face of the semiconductor chilling plate is connected with the variable-temperature air duct through the heat dissipation block, the cold face of the semiconductor chilling plate is connected with the freezing air duct through the refrigeration block, and the problem that food is frozen to be damaged due to the fact that the temperature of the variable-temperature chamber is too low is solved.

Description

Technical Field

[0001] This application relates to the technical field of refrigerators, and particularly to a semiconductor refrigerator with variable-temperature freezing. Background Art

[0002] The variable-temperature compartment of a refrigerator meets the storage needs of different food ingredients through its temperature adjustment function, and the core lies in achieving a flexible switch between the refrigeration and freezing modes. With the increasing demand of users for the freshness precision of food ingredients, the variable-temperature compartment needs to have the ability to accurately control the temperature to adapt to diverse storage scenarios. To achieve this goal, the adoption of semiconductor refrigeration technology has become an important development direction, which has the characteristics of two-way regulation of refrigeration and heating, and theoretically can optimize the temperature zone control ability of the refrigerator.

[0003] Related technical solutions use semiconductor refrigeration components to construct a temperature adjustment system, which specifically includes an integrated module composed of a heat sink, a semiconductor refrigeration chip, and a refrigeration block. This component realizes the temperature difference between the cold and hot ends through direct current drive. Among them, the low temperature generated at the cold end directly contacts the freezing air duct through the refrigeration block to strengthen the refrigeration effect of the freezer compartment, and the heat generated at the hot end is forcibly dissipated through the heat sink and the fan assembly.

[0004] The above solutions have significant defects in practical applications: on the one hand, when the variable-temperature compartment and the freezer compartment share an evaporator, the low-temperature cooling of the refrigeration system causes the temperature of the variable-temperature compartment to be easily lower than the set threshold, resulting in freezing damage to non-frozen food ingredients; on the other hand, the hot end of the semiconductor refrigeration chip is only used as a passive heat dissipation processing unit, and its heating characteristics cannot be effectively utilized to achieve positive temperature control of the variable-temperature compartment. This one-way utilization mode not only causes energy waste, but also limits the potential value of semiconductor components in wide temperature range control. Summary of the Invention

[0005] This application provides a semiconductor refrigerator with variable-temperature freezing to solve the problem that the temperature of the variable-temperature compartment is too low, resulting in food spoilage.

[0006] This application provides a semiconductor refrigerator with variable-temperature freezing, including: a refrigerator body, an air duct module, a refrigeration module, and a semiconductor refrigeration module;

[0007] A refrigerator compartment, a variable-temperature compartment, and a freezer compartment are arranged in the refrigerator body;

[0008] A freezing evaporator is arranged in the refrigeration module; the freezing evaporator is arranged between the refrigerator compartment and the freezer compartment;

[0009] The air duct module includes a freezing fan, a variable-temperature air duct, a freezing air duct, and a return air duct; the variable-temperature air duct is communicated with the variable-temperature compartment, the freezing air duct is communicated with the freezer compartment, the inlet end of the freezing evaporator is connected to the return air duct, and the freezing fan is located at the outlet end of the freezing evaporator for driving air circulation;

[0010] The semiconductor refrigeration module includes a refrigeration block, a semiconductor refrigeration chip, and a heat dissipation block; the semiconductor refrigeration chip is located between the variable temperature air duct and the freezing air duct, the hot surface of the semiconductor refrigeration chip is connected to the variable temperature air duct through the heat dissipation block, and the cold surface of the semiconductor refrigeration chip is connected to the freezing air duct through the refrigeration block.

[0011] The semiconductor refrigerator provided by this application can utilize the bidirectional heat conduction characteristic of the semiconductor, connect the hot surface of the semiconductor refrigeration chip to the variable temperature air duct through the heat dissipation block to release the heat in the variable temperature compartment, and achieve a wide range of temperature changes in the variable temperature compartment; the cold surface of the semiconductor refrigeration chip is connected to the freezing air duct through the refrigeration block to strengthen the refrigeration effect in the freezer compartment, make up for the problem that food is frozen due to too low temperature in the variable temperature compartment, achieve temperature zone control of the variable temperature compartment and the freezer compartment, and solve the problem that food is frozen due to too low temperature in the variable temperature compartment.

[0012] Optionally, the semiconductor refrigeration module further includes: a foam cushion block;

[0013] The foam cushion block is arranged between the heat dissipation block and the refrigeration block, and the foam cushion block is used to isolate the heat transfer between the heat dissipation block and the refrigeration block.

[0014] By arranging the foam cushion block between the heat dissipation block and the refrigeration block, using its light weight and heat insulation characteristics to inhibit the heat conduction between the heat dissipation block and the refrigeration block, and reducing the ineffective heat exchange between the hot and cold ends of the semiconductor refrigeration chip; the cushioning performance of the foam cushion block reduces the risk of mechanical damage to the semiconductor refrigeration module caused by vibration or assembly stress, and ensures the stability of the heat conduction interface; by blocking the direct heat transfer path between the hot and cold ends, the heat transfer efficiency of the semiconductor refrigeration chip is concentrated on the functional requirements of heating the variable temperature compartment and refrigerating the freezer compartment, reducing the overall energy consumption of the system, and at the same time extending the working life of the semiconductor refrigeration module.

[0015] Optionally, the semiconductor refrigeration module further includes: thermal conductive silicone grease;

[0016] The thermal conductive silicone grease is arranged between the semiconductor refrigeration chip and the heat dissipation block, and is used to fill the gap between the semiconductor refrigeration chip and the heat dissipation block to reduce the thermal resistance caused by the air gap.

[0017] By providing thermal conductive silicone grease between the semiconductor refrigeration sheet and the heat sink, the microscopic gaps at the contact interface between the two are filled, thereby reducing the contact thermal resistance caused by the air gap; by enhancing the heat conduction efficiency from the hot end to the heat sink, the heat on the hot surface of the semiconductor refrigeration sheet can be quickly diffused to the variable temperature air duct, thereby improving the response speed of the temperature regulation of the variable temperature chamber; at the same time, the performance degradation of the semiconductor refrigeration module caused by local temperature accumulation is reduced, and the stability of the cold surface refrigeration capacity is maintained; by optimizing the continuity of the heat conduction path, the overall operating energy consumption of the semiconductor refrigeration module is reduced, and the working life of the semiconductor device is extended.

[0018] Optionally, the refrigeration module further includes a return air pipe, a compressor, a condenser, a filter and a capillary tube;

[0019] The outlet end of the refrigeration evaporator is connected to the return air pipe, the compressor, the condenser, the filter and the inlet end of the capillary tube in sequence; the outlet end of the capillary tube is connected to the inlet end of the refrigeration evaporator.

[0020] The low-temperature steam is transported from the refrigeration evaporator to the compressor through the return air pipe, and after being compressed to form high-temperature and high-pressure gas, it enters the condenser to dissipate heat and liquefy, and then the impurities and moisture in the refrigerant are removed by the filter, and then the capillary throttling and pressure reduction are used to form a low-temperature and low-pressure liquid that flows back to the evaporator; the various components work together to form a closed-loop refrigeration cycle, and the heat exchange efficiency of the refrigeration module is improved by segmented processing of the gas-liquid phase change process of the refrigerant; the setting of the filter reduces the influence of impurities on the capillary throttling accuracy and reduces the risk of system blockage; the cooperation of the compressor and the condenser realizes the continuous discharge of refrigerant heat and maintains the stability of the evaporator's heat absorption capacity, thereby optimizing the refrigeration effect of the freezer and extending the service life of the refrigeration module.

[0021] Optionally, the air duct module further includes an air outlet and an air return outlet;

[0022] The air outlet is arranged at the ends of the temperature-changing air duct and the freezing air duct; the return air outlet connects the temperature-changing room and the freezing room with the return air duct.

[0023] By arranging air outlets at the ends of the variable temperature air duct and the freezing air duct, the regulated airflow is directionally transported to the variable temperature room and the freezing room, thereby improving the uniformity of temperature distribution inside each compartment; the return air outlet connects the variable temperature room, the freezing room and the return air duct, so that the high-temperature return air in the compartment is concentrated and returned to the evaporator area for heat exchange, thereby improving the efficiency of cold capacity recycling; by optimizing the separation design of the air outlet and return air paths, the airflow crosstalk between the variable temperature room and the freezing room is reduced, and the temperature fluctuation caused by the mixing of cold and hot is reduced; at the same time, by shortening the length of the return air path, the cooling processing speed of the evaporator on the return air is accelerated, and the stability of the continuous operation of the refrigeration module is maintained, thereby reducing the overall energy consumption of the system.

[0024] Optionally, the thermoelectric cooler includes alternately arranged P-type semiconductor particles and N-type semiconductor particles, and the particles form a thermocouple array through current-carrying bars and a ceramic substrate.

[0025] The thermocouple array is formed by alternately arranging P-type and N-type semiconductor particles. Combining the packaging structure of the current-carrying bars and the ceramic substrate enables the thermoelectric cooler to generate directional heat transfer when powered on. The parallel superposition effect of multiple thermocouples improves the heat conduction efficiency per unit area. The insulation and heat conduction characteristics of the ceramic substrate reduce the risk of leakage between particles and maintain the structural stability of the thermocouple array. The current-carrying bars reduce the contact resistance at the particle connection points, allowing the current to be evenly distributed to each thermocouple unit. This structural design enhances the ability of the thermoelectric cooler to maintain the temperature difference between the hot and cold sides, reduces performance degradation caused by local heat accumulation, and thus improves the working stability and service life of the cooler.

[0026] Optionally, the heat dissipation block is located inside the variable-temperature air duct, and the heat dissipation block is fixed to the side wall of the variable-temperature air duct through a first fixing connector; the refrigeration block is located inside the freezing air duct, and the refrigeration block is fixed to the side wall of the freezing air duct through a second fixing connector.

[0027] By respectively installing the heat dissipation block and the refrigeration block on the side walls of the variable-temperature air duct and the freezing air duct using fixing connectors, the positioning stability of the thermoelectric cooling module and the air duct structure is ensured, and the displacement risk caused by vibration or air flow impact is reduced. By directly fixing the heat dissipation block to the inner wall of the variable-temperature air duct, the heat transfer path from the hot end to the variable-temperature chamber is shortened, and the response efficiency of the temperature adjustment in the variable-temperature chamber is improved. The fixed connection between the refrigeration block and the side wall of the freezing air duct maintains the continuous contact between the cold end and the freezing air flow, enhancing the uniformity of cold quantity transfer. The split-type fixing design reduces the mechanical stress interference between the heat dissipation block and the refrigeration block, reduces the temperature difference loss between the hot and cold sides of the thermoelectric cooling module caused by deformation, and thus improves the refrigeration efficiency and extends the structural reliability of the thermoelectric cooling module.

[0028] Optionally, a refrigerating evaporator is provided in the refrigeration module; the refrigerating evaporator is arranged between the refrigerating chamber and the freezing chamber;

[0029] The outlet end of the refrigerating evaporator is sequentially connected to the suction pipe, the compressor, the condenser, the filter, and the inlet end of the capillary tube; the outlet end of the capillary tube is connected to the inlet end of the refrigerating evaporator.

[0030] By arranging a refrigerating evaporator between the refrigerating chamber and the freezing chamber, and forming an independent closed-loop refrigeration circuit with a suction pipe, a compressor, a condenser, a filter and a capillary tube, the cold quantity requirements of the refrigerating chamber and the freezing chamber are supplied through separate paths; the refrigerating evaporator optimizes the evaporation heat absorption process according to the temperature characteristics of the refrigerating chamber, and directly exchanges heat between the low-temperature refrigerant throttled by the capillary tube and the return air of the refrigerating chamber, improving the temperature control accuracy of the refrigerating area; the setting of the filter reduces the influence of impurities in the refrigerant circulation process on the pipeline in the refrigerating evaporator and reduces the risk of system blockage; the split evaporator design alleviates the mutual interference between the refrigerating and freezing refrigeration loads, improves the energy efficiency utilization rate through an independent circulation path, and at the same time extends the operation stability of the compressor and the condenser.

[0031] Optionally, the air duct module further includes a refrigerating fan;

[0032] The refrigerating fan is located at the outlet end of the refrigerating evaporator and is used to drive the air flow to circulate.

[0033] By arranging a refrigerating fan at the outlet end of the refrigerating evaporator, driving the air flow cooled by the evaporator to be directionally transported to the inside of the refrigerating chamber, enhancing the air flow circulation intensity in the refrigerating area; improving the uniformity of the temperature distribution inside the refrigerating chamber through forced convection and reducing the difference in the food preservation effect caused by local temperature difference; the refrigerating fan accelerates the flow efficiency of the cold air from the evaporator to the refrigerating chamber and reduces the ineffective retention of the cold quantity near the evaporator; through the active air flow circulation design, the continuous heat absorption capacity of the refrigerating evaporator is maintained, and the frosting on the surface of the evaporator or the attenuation of the refrigeration efficiency caused by air flow stagnation is alleviated, thereby reducing the overall operation energy consumption of the system and extending the working stability of the refrigeration module.

[0034] Optionally, the air duct module further includes a refrigerating air duct, a refrigerating air damper and a variable temperature air damper;

[0035] The refrigerating air duct is communicated with the refrigerating chamber; the refrigerating air damper is arranged in the refrigerating air duct and is used to control the refrigerating air supply volume; the variable temperature air damper is arranged in the variable temperature air duct and is used to adjust the temperature of the variable temperature chamber.

[0036] By arranging a refrigerating air damper in the refrigerating air duct, independently adjusting the air supply volume of the refrigerating chamber, decoupling the temperature control of the refrigerating area from the air flow requirements of the variable temperature chamber and the freezing chamber, and reducing the temperature fluctuation caused by uneven cold quantity distribution among multiple chambers; the variable temperature air damper dynamically adjusts the air flow in the variable temperature air duct and adjusts the heat transfer efficiency of the semiconductor hot end according to the temperature requirement of the variable temperature chamber, improving the flexibility of the variable temperature range; the split design of the refrigerating air duct and the variable temperature air duct reduces the air flow crosstalk between the refrigerating chamber and the variable temperature chamber and alleviates the energy loss caused by the mixing of hot and cold; by accurately controlling the air damper, optimizing the air supply efficiency of each air duct, reducing the redundant operation load of the refrigeration module and the semiconductor refrigeration module, thereby improving the overall energy efficiency of the system and extending the service life of key components.

[0037] As can be seen from the above technical solutions, the present application provides a semiconductor refrigerator with variable-temperature refrigeration, including: a refrigerator body, an air duct module, a refrigeration module, and a semiconductor refrigeration module; a refrigerating chamber, a variable-temperature chamber, and a freezing chamber are arranged in the refrigerator body; a freezing evaporator is arranged in the refrigeration module; the freezing evaporator is arranged between the refrigerating chamber and the freezing chamber; the air duct module includes a freezing fan, a variable-temperature air duct, a freezing air duct, and a return air duct; the variable-temperature air duct is communicated with the variable-temperature chamber, the freezing air duct is communicated with the freezing chamber, the inlet end of the freezing evaporator is connected with the return air duct, and the freezing fan is located at the outlet end of the freezing evaporator for driving air circulation; the semiconductor refrigeration module includes a refrigeration block, a semiconductor refrigeration sheet, and a heat dissipation block; the semiconductor refrigeration sheet is located between the variable-temperature air duct and the freezing air duct, the hot surface of the semiconductor refrigeration sheet is connected with the variable-temperature air duct through the heat dissipation block, and the cold surface of the semiconductor refrigeration sheet is connected with the freezing air duct through the refrigeration block to solve the problem that foods are frozen due to the too low temperature of the variable-temperature chamber. Description of the Drawings

[0038] In order to more clearly illustrate the technical solutions of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0039] Figure 1 It is a front structural schematic diagram of the semiconductor refrigerator with variable-temperature refrigeration according to the embodiment of the present application;

[0040] Figure 2 It is a side cross-sectional view of the semiconductor refrigerator with variable-temperature refrigeration according to the embodiment of the present application;

[0041] Figure 3 It is a rear cross-sectional view of the semiconductor refrigerator with variable-temperature refrigeration according to the embodiment of the present application;

[0042] Figure 4 It is a side view of the semiconductor refrigeration module in the semiconductor refrigerator with variable-temperature refrigeration according to the embodiment of the present application;

[0043] Figure 5 It is a top view of the semiconductor refrigeration module in the semiconductor refrigerator with variable-temperature refrigeration according to the embodiment of the present application.

[0044] Illustration:

[0045] Among them, 1 - refrigerating chamber, 2 - variable temperature chamber, 3 - freezing chamber, 4 - refrigerating evaporator, 5 - refrigerating fan, 6 - freezing evaporator, 7 - freezing fan, 8 - refrigerating air duct, 9 - variable temperature air duct, 10 - freezing air duct, 11 - return air duct, 12 - air outlet, 13 - air return opening, 14 - thermoelectric refrigeration module, 15 - heat sink, 16 - foam spacer, 17 - thermoelectric cooler, 18 - refrigerating block. Detailed implementation manners

[0046] The embodiments will be described in detail below, and the examples are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following embodiments do not represent all implementation manners consistent with the present application. They are only examples of systems and methods consistent with some aspects of the present application.

[0047] It should be noted that the brief description of the terms in the present application is only for facilitating the understanding of the following described implementation manners, rather than intending to limit the implementation manners of the present application. Unless otherwise specified, these terms should be understood in their ordinary and common meanings.

[0048] The terms "comprising" and "having" and any variations thereof are intended to cover but not exclude inclusion. For example, a product or device comprising a series of components does not necessarily have to be limited to all the clearly listed components, but may include other components not clearly listed or inherent to these products or devices.

[0049] The variable temperature chamber of the refrigerator is a multi-functional design, mainly used for flexibly adjusting the temperature to meet the storage requirements of different foods. It has the functions of temperature adjustment (switching between refrigeration and freezing), freshness preservation effect (precise temperature control), and space optimization (increasing the flexibility of storage space).

[0050] The thermoelectric refrigeration component is also called a thermoelectric refrigeration module. In related embodiments, a thermoelectric refrigeration component can be used to construct a temperature adjustment system, specifically including an integrated module composed of a heat sink, a thermoelectric cooler, and a refrigerating block. This component realizes the temperature difference between the cold end and the hot end through direct current drive. The low temperature generated at the cold end directly contacts the freezing air duct through the refrigerating block to enhance the refrigeration effect of the freezing chamber, and the heat generated at the hot end is forcibly dissipated through the heat sink and the fan assembly.

[0051] The above solution has significant defects in practical applications: on the one hand, when the variable temperature compartment and the freezer share the evaporator, the low-temperature cooling of the refrigeration system causes the temperature of the variable temperature compartment to be easily lower than the set threshold, resulting in freezing damage to non-freezing food ingredients; on the other hand, the hot end of the thermoelectric cooler is only used as a passive heat dissipation treatment unit, and its heating characteristics cannot be effectively utilized to achieve positive temperature control of the variable temperature compartment. This one-way utilization mode not only causes energy waste, but also limits the potential value of semiconductor components in wide temperature range control.

[0052] To solve the problem of food spoilage caused by the too low temperature of the variable temperature compartment, refer to Figures 1 - 5 , an embodiment of the present application provides a semiconductor refrigerator with variable temperature freezing, including: a refrigerator body, an air duct module, a refrigeration module, and a thermoelectric refrigeration module 14; a refrigerating compartment 1, a variable temperature compartment 2, and a freezer 3 are arranged in the refrigerator body.

[0053] Specifically, taking a four-door refrigerator as an example, the refrigerating compartment 1 is located in the upper part of the refrigerator body, and the variable temperature compartment 2 and the freezer 3 are located in the lower part of the refrigerator body.

[0054] A freezing evaporator 6 is arranged in the refrigeration module; the freezing evaporator 6 is arranged between the refrigerating compartment 1 and the freezer 3.

[0055] The air duct module includes a freezing fan 7, a variable temperature air duct 9, a freezing air duct 10, and a return air duct 11; the variable temperature air duct 9 is communicated with the variable temperature compartment 2, the freezing air duct 10 is communicated with the freezer 3, the inlet end of the freezing evaporator 6 is connected to the return air duct 11, and the freezing fan 7 is located at the outlet end of the freezing evaporator 6 for driving air circulation.

[0056] The thermoelectric refrigeration module 14 includes a refrigeration block 18, a thermoelectric cooler 17, and a heat dissipation block 15; the thermoelectric cooler 17 is located between the variable temperature air duct 9 and the freezing air duct 10, the hot surface of the thermoelectric cooler 17 is connected to the variable temperature air duct 9 through the heat dissipation block 15, and the cold surface of the thermoelectric cooler 17 is connected to the freezing air duct 10 through the refrigeration block 18.

[0057] It should be understood that the semiconductor refrigeration sheet 17 does not need to use a refrigerant, can operate continuously, has no pollution source, no rotating parts, so it will not produce a gyroscopic effect, nor does it have sliding parts, and belongs to a solid sheet component. During its operation, there is no vibration, no noise, it has a long service life, and is easy to install. It can not only refrigerate but also heat, and the heating efficiency is very high. In addition, the thermal inertia of the semiconductor refrigeration sheet 17 is very small, and the refrigeration and heating times are very fast. Under the condition of good heat dissipation at the hot end and no load at the cold end, the refrigeration sheet can reach the maximum temperature difference in less than one minute after being powered on, and can realize wide-range temperature change in the variable temperature chamber 2 and the freezer 3, meeting the different temperature requirements of different food ingredients, and improving the practicability, stability and refrigeration efficiency of the refrigerator.

[0058] The semiconductor refrigerator provided by the present application can utilize the bidirectional heat conduction characteristic of the semiconductor to connect the hot surface of the semiconductor refrigeration sheet 17 to the variable temperature air duct 9 through the heat dissipation block 15, so as to release the heat in the variable temperature chamber 2 and realize wide-range temperature change in the variable temperature chamber 2; the cold surface of the semiconductor refrigeration sheet 17 is connected to the freezer air duct 10 through the refrigeration block 18 to strengthen the refrigeration effect in the freezer 3, make up for the problem that food is frozen due to too low temperature in the variable temperature chamber, realize temperature zone control of the variable temperature chamber 2 and the freezer 3, and solve the problem that food is frozen due to too low temperature in the variable temperature chamber.

[0059] In addition, through the cooperation of the return air duct 11 and the freezer evaporator 6, the hot and cold exchange path between the variable temperature chamber 2 and the freezer 3 is optimized, and the accuracy of temperature zone control is improved; the integrated design of the semiconductor refrigeration sheet 17 and the air duct structure reduces the dependence of the refrigeration system on a single cold source, improves the energy efficiency utilization rate through synergistic effects, and at the same time reduces the energy loss caused by temperature fluctuations.

[0060] In some embodiments, the semiconductor refrigeration module 14 further includes: a foam spacer 16; the foam spacer 16 is disposed between the heat dissipation block 15 and the refrigeration block 18, and the foam spacer 16 is used to isolate the heat transfer between the heat dissipation block 15 and the refrigeration block 18.

[0061] It should be understood that the foam spacer 16 can be specifically disposed between the heat dissipation block 15 and the semiconductor refrigeration sheet 17, or between the refrigeration block 18 and the semiconductor refrigeration sheet 17.

[0062] By arranging the foam cushion block 16 between the heat dissipation block 15 and the refrigeration block 18, its light weight and heat insulation characteristics are used to suppress the heat conduction between the heat dissipation block 15 and the refrigeration block 18, reducing the ineffective heat exchange between the hot and cold ends of the semiconductor refrigeration sheet 17; the buffering performance of the foam cushion block 16 reduces the risk of mechanical damage to the semiconductor refrigeration module 14 caused by vibration or assembly stress, ensuring the stability of the heat conduction interface; by blocking the direct heat transfer path between the hot and cold ends, the heat transfer efficiency of the semiconductor refrigeration sheet 17 is concentrated on the functional requirements of heating the variable temperature chamber 2 and refrigerating the freezer 3, reducing the overall energy consumption of the system, and at the same time extending the working life of the semiconductor refrigeration module 14.

[0063] In some embodiments, the semiconductor refrigeration module 14 further includes: thermal conductive grease; the thermal conductive grease is arranged between the semiconductor refrigeration sheet 17 and the heat dissipation block 15, and is used to fill the gap between the semiconductor refrigeration sheet 17 and the heat dissipation block 15 to reduce the thermal resistance caused by the air gap.

[0064] By arranging thermal conductive grease between the semiconductor refrigeration sheet 17 and the heat dissipation block 15, filling the microscopic gaps at the contact interface between the two, reducing the contact thermal resistance caused by the air gap; by enhancing the heat conduction efficiency from the hot end to the heat dissipation block 15, the heat on the hot surface of the semiconductor refrigeration sheet 17 can be quickly diffused to the variable temperature air duct 9, improving the response speed of the temperature adjustment of the variable temperature chamber; at the same time, reducing the performance attenuation of the semiconductor refrigeration module 14 caused by local temperature aggregation, maintaining the stability of the refrigeration capacity of the cold surface; by optimizing the continuity of the heat conduction path, reducing the overall operating energy consumption of the semiconductor refrigeration module 14, and extending the working life of the semiconductor device.

[0065] In some other embodiments, the thermal conductive grease can also be arranged between the heat dissipation block 15 and the semiconductor refrigeration sheet 17.

[0066] By arranging thermal conductive grease between the heat dissipation block 15 and the semiconductor refrigeration sheet 17, filling the gap at the assembly interface between the two, reducing the contact thermal resistance caused by air retention; by optimizing the heat conduction path between the heat dissipation block 15 and the hot surface of the semiconductor refrigeration sheet 17, the heat generated at the semiconductor hot end can be efficiently transferred to the surface of the heat dissipation block 15, improving the heat absorption efficiency of the variable temperature air duct 9; by reducing the local temperature rise caused by the interface thermal resistance, maintaining the stability of the refrigeration capacity of the cold end of the semiconductor refrigeration sheet 17; at the same time, by reducing the energy loss during the heat conduction process, reducing the overall power consumption during the operation of the semiconductor refrigeration module 14, and extending the cooperation reliability between the heat dissipation block 15 and the semiconductor refrigeration sheet 17.

[0067] In some embodiments, the refrigeration module further includes a suction pipe, a compressor, a condenser, a filter, and a capillary tube; the outlet end of the freezing evaporator 6 is sequentially connected to the suction pipe, the compressor, the condenser, the filter, and the inlet end of the capillary tube; the outlet end of the capillary tube is connected to the inlet end of the freezing evaporator 6.

[0068] The low-temperature steam is transported from the freezing evaporator 6 to the compressor through the suction pipe, compressed into high-temperature and high-pressure gas, and then enters the condenser for heat dissipation and liquefaction. Subsequently, the filter removes impurities and moisture in the refrigerant, and then the capillary tube throttles and depressurizes to form low-temperature and low-pressure liquid and returns to the evaporator; each component cooperates to form a closed-loop refrigeration cycle, and by segmentally processing the gas-liquid phase change process of the refrigerant, the heat exchange efficiency of the refrigeration module is improved; the setting of the filter reduces the influence of impurities on the throttling accuracy of the capillary tube and reduces the risk of system blockage; the cooperation of the compressor and the condenser realizes the continuous external discharge of the heat of the refrigerant and maintains the stability of the heat absorption capacity of the evaporator, thereby optimizing the refrigeration effect of the freezer 3 and extending the service life of the refrigeration module.

[0069] In some embodiments, the air duct module further includes an air outlet 12 and an air return opening 13; the air outlet 12 is arranged at the ends of the variable-temperature air duct 9 and the freezing air duct 10; the air return opening 13 communicates the variable-temperature chamber 2 and the freezer 3 with the air return air duct 11.

[0070] By arranging the air outlet 12 at the ends of the variable-temperature air duct 9 and the freezing air duct 10, the adjusted air flow is directionally transported to the interiors of the variable-temperature chamber 2 and the freezer 3, improving the uniformity of the internal temperature distribution of each compartment; the air return opening 13 communicates the variable-temperature chamber 2, the freezer 3 with the air return air duct 11, promoting the centralized return of the high-temperature return air in the compartment to the evaporator area for heat exchange and improving the utilization efficiency of the cold quantity circulation; by optimizing the separation design of the air outlet and air return paths, the air flow crosstalk between the variable-temperature chamber 2 and the freezer 3 is reduced, and the temperature fluctuation caused by the cold and heat mixing is reduced; at the same time, by shortening the length of the air return path, the cooling speed of the evaporator for the return air is accelerated, maintaining the stability of the continuous operation of the refrigeration module, thereby reducing the overall energy consumption of the system.

[0071] In some embodiments, the thermoelectric cooler 17 includes alternately arranged P-type semiconductor particles and N-type semiconductor particles, and the particles form a thermocouple array through a current-carrying strip and a ceramic substrate.

[0072] It should be understood that the ceramic substrate is used to encapsulate the thermocouple array; under the drive of direct current, the thermocouple array transfers heat from the cold surface to the hot surface.

[0073] A thermocouple array is formed by alternately arranging P-type and N-type semiconductor particles, combined with the packaging structure of the current-carrying bar and the ceramic substrate, enabling the semiconductor refrigeration sheet 17 to generate directional heat transfer when powered on, and enhancing the heat conduction efficiency per unit area through the parallel superposition effect of multiple thermocouples; the insulation and heat conduction characteristics of the ceramic substrate reduce the risk of leakage between particles and maintain the structural stability of the thermocouple array, and the current-carrying bar reduces the contact resistance at the particle joints, enabling the current to be evenly distributed to each thermocouple unit; this structural design enhances the ability of the semiconductor refrigeration sheet 17 to maintain the temperature difference between the hot and cold sides, reduces the performance degradation caused by local heat accumulation, thereby improving the working stability and service life of the refrigeration sheet.

[0074] In some embodiments, the heat dissipation block 15 is located inside the variable-temperature air duct 9, and the heat dissipation block 15 is fixed to the side wall of the variable-temperature air duct 9 through a first fixing connector; the refrigeration block 18 is located inside the freezing air duct 10, and the refrigeration block 18 is fixed to the side wall of the freezing air duct 10 through a second fixing connector.

[0075] It should be understood that the first fixing connector and the second fixing connector can be screws or buckles, which are used to firmly install the heat dissipation block 15 and the refrigeration block 18 on the side wall of the air duct, ensuring their stability and reliability during operation.

[0076] By respectively installing the heat dissipation block 15 and the refrigeration block 18 on the side walls of the variable-temperature air duct 9 and the freezing air duct 10 through fixing connectors, the positioning stability of the semiconductor refrigeration module 14 and the air duct structure is ensured, and the displacement risk caused by vibration or air flow impact is reduced; by directly fixing the heat dissipation block 15 to the inner wall of the variable-temperature air duct 9, the heat transfer path from the hot end to the variable-temperature chamber 2 is shortened, and the response efficiency of the temperature adjustment of the variable-temperature chamber 2 is improved; the fixed connection between the refrigeration block 18 and the side wall of the freezing air duct 10 maintains the continuous contact between the cold end and the freezing air flow, enhancing the uniformity of cold quantity transfer; the split-type fixing design reduces the mechanical stress interference between the heat dissipation block 15 and the refrigeration block 18, and reduces the temperature difference loss between the hot and cold surfaces of the semiconductor refrigeration module 14 caused by deformation, thereby improving the refrigeration efficiency and extending the structural reliability of the semiconductor refrigeration module 14.

[0077] In some embodiments, a refrigerated evaporator 4 is provided in the refrigeration module; the refrigerated evaporator 4 is arranged between the refrigerating chamber 1 and the freezing chamber 3; the outlet end of the refrigerated evaporator 4 is sequentially connected to the suction pipe, the compressor, the condenser, the filter, and the inlet end of the capillary tube; the outlet end of the capillary tube is connected to the inlet end of the refrigerated evaporator 4.

[0078] It should be understood that the refrigerating evaporator 6 and the refrigerating evaporator 4 are heat-absorbing components, which evaporate the low-temperature and low-pressure liquid from the capillary tube into low-temperature and low-pressure gas through heat exchange with the external environment; the return air pipe transports the refrigerant from the evaporator to the compressor; the compressor is a key device and power component of the refrigeration system, which compresses the low-temperature steam from the refrigerating evaporator 6 and the refrigerating evaporator 4 into high-temperature and high-pressure gas and drives the continuous flow of the refrigerant liquid and steam; the condenser is a heat-dissipating component, which cools the high-temperature and high-pressure gas from the compressor into high-temperature and high-pressure liquid through heat exchange with the external environment; the filter is an auxiliary component, which absorbs and adsorbs the moisture, impurities, etc. in the refrigerant and the system pipeline to keep the system dry and clean; the capillary tube is a resistance component, which turns the high-temperature and high-pressure liquid into low-temperature and low-pressure liquid through resistance throttling.

[0079] By arranging the refrigerating evaporator 4 between the refrigerating chamber 1 and the freezing chamber 3 and forming an independent closed-loop refrigeration circuit with the return air pipe, the compressor, the condenser, the filter and the capillary tube, the cooling capacity requirements of the refrigerating chamber 1 and the freezing chamber 3 are supplied in separate paths; the refrigerating evaporator 4 optimizes the evaporation heat absorption process according to the temperature characteristics of the refrigerating chamber, and directly exchanges heat with the return air of the refrigerating chamber 1 after the low-temperature refrigerant throttled by the capillary tube, so as to improve the temperature control accuracy of the refrigerating area; the setting of the filter reduces the influence of impurities in the refrigerant circulation process on the pipeline in the refrigerating evaporator 4 and reduces the risk of system blockage; the split evaporator design alleviates the mutual interference between the refrigerating and freezing refrigeration loads, improves the energy efficiency utilization rate through an independent circulation path, and at the same time prolongs the operation stability of the compressor and the condenser.

[0080] In some embodiments, the air duct module further includes a refrigerating fan 5; the refrigerating fan 5 is located at the outlet end of the refrigerating evaporator 4 and is used to drive the air flow circulation.

[0081] By arranging the refrigerating fan 5 at the outlet end of the refrigerating evaporator 4, the air flow cooled by the evaporator is driven to be directionally transported into the refrigerating chamber 1, so as to enhance the air flow circulation intensity in the refrigerating area; the temperature distribution uniformity in the refrigerating chamber 1 is improved through forced convection, and the difference in the food preservation effect caused by local temperature difference is reduced; the refrigerating fan 5 accelerates the flow efficiency of the cold air from the evaporator to the refrigerating chamber 1 and reduces the ineffective retention of the cooling capacity near the evaporator; through the active air flow circulation design, the continuous heat absorption capacity of the refrigerating evaporator 4 is maintained, and the frosting on the evaporator surface or the attenuation of the refrigeration efficiency caused by air flow stagnation is alleviated, thereby reducing the overall operation energy consumption of the system and prolonging the working stability of the refrigeration module.

[0082] In some embodiments, the air duct module further includes a refrigerating air duct 8, a refrigerating air damper, and a variable-temperature air damper; the refrigerating air duct 8 communicates with the refrigerating chamber 1; the refrigerating air damper is disposed in the refrigerating air duct 8 for controlling the refrigerating air supply volume; the variable-temperature air damper is disposed in the variable-temperature air duct 9 for adjusting the temperature of the variable-temperature chamber 2.

[0083] By providing a refrigerating air damper in the refrigerating air duct 8 to independently adjust the air supply volume of the refrigerating chamber 1, the temperature control of the refrigerating area is decoupled from the air flow requirements of the variable-temperature chamber 2 and the freezing chamber 3, reducing the temperature fluctuations caused by uneven cold quantity distribution among multiple chambers; the variable-temperature air damper dynamically adjusts the air flow in the variable-temperature air duct 9 and adjusts the heat transfer efficiency of the hot end of the semiconductor according to the temperature requirements of the variable-temperature chamber, improving the flexibility of the variable-temperature range; the separate design of the refrigerating air duct 8 and the variable-temperature air duct 9 reduces the air flow crosstalk between the refrigerating chamber 1 and the variable-temperature chamber 2, alleviating the energy loss caused by cold and heat mixing; the accurate control of the air damper optimizes the air supply efficiency of each air duct, reducing the redundant operation load of the refrigeration module and the semiconductor refrigeration module 14, thereby improving the overall energy efficiency of the system and extending the service life of key components.

[0084] As can be seen from the above technical solutions, the embodiments of the present application provide a semiconductor refrigerator with variable-temperature freezing, including: a refrigerator cabinet, an air duct module, a refrigeration module, and a semiconductor refrigeration module 14; a refrigerating chamber 1, a variable-temperature chamber 2, and a freezing chamber 3 are provided in the refrigerator cabinet; a freezing evaporator 6 is provided in the refrigeration module; the freezing evaporator 6 is disposed between the refrigerating chamber 1 and the freezing chamber 3; the air duct module includes a freezing fan 7, a variable-temperature air duct 9, a freezing air duct 10, and a return air duct 11; the variable-temperature air duct 9 communicates with the variable-temperature chamber 2, the freezing air duct 10 communicates with the freezing chamber 3, the inlet end of the freezing evaporator 6 is connected to the return air duct 11, and the freezing fan 7 is located at the outlet end of the freezing evaporator 6 for driving the air flow to circulate; the semiconductor refrigeration module 14 includes a refrigerating block 18, a semiconductor refrigerating sheet 17, and a heat dissipation block 15; the semiconductor refrigerating sheet 17 is located between the variable-temperature air duct 9 and the freezing air duct 10, the hot surface of the semiconductor refrigerating sheet 17 is connected to the variable-temperature air duct 9 through the heat dissipation block 15, and the cold surface of the semiconductor refrigerating sheet 17 is connected to the freezing air duct 10 through the refrigerating block 18 to solve the problem that food is frozen due to too low temperature in the variable-temperature chamber.

[0085] For the similar parts between the embodiments provided in the present application, reference can be made to each other. The specific embodiments provided above are only several examples under the general concept of the present application and do not constitute a limitation on the protection scope of the present application. For those skilled in the art, any other embodiments extended based on the solutions of the present application without creative efforts fall within the protection scope of the present application.

Claims

1. A semiconductor refrigerator with variable temperature freezing, characterized in that: include: Refrigerator box, air duct module, refrigeration module and semiconductor refrigeration module (14); The refrigerator body is provided with a refrigerating chamber (1), a temperature-changing chamber (2) and a freezing chamber (3); A freezing evaporator (6) is provided in the refrigeration module; the freezing evaporator (6) is arranged between the refrigerating chamber (1) and the freezing chamber (3); The air duct module comprises a refrigeration fan (7), a variable temperature air duct (9), a refrigeration air duct (10) and a return air duct (11); the variable temperature air duct (9) is connected to the variable temperature chamber (2), the refrigeration air duct (10) is connected to the freezing chamber (3), the inlet end of the refrigeration evaporator (6) is connected to the return air duct (11), and the refrigeration fan (7) is located at the outlet end of the refrigeration evaporator (6) for driving air circulation; The semiconductor refrigeration module (14) comprises a refrigeration block (18), a semiconductor refrigeration sheet (17) and a heat dissipation block (15); the semiconductor refrigeration sheet (17) is located between the variable temperature air duct (9) and the freezing air duct (10); the hot surface of the semiconductor refrigeration sheet (17) is connected to the variable temperature air duct (9) via the heat dissipation block (15); and the cold surface of the semiconductor refrigeration sheet (17) is connected to the freezing air duct (10) via the refrigeration block (18).

2. The semiconductor refrigerator with variable temperature freezing according to claim 1, characterized in that: The semiconductor refrigeration module (14) further comprises: a foam pad (16); The foam pad (16) is arranged between the heat dissipation block (15) and the refrigeration block (18), and the foam pad (16) is used to isolate the heat transfer between the heat dissipation block (15) and the refrigeration block (18).

3. The semiconductor refrigerator with variable temperature freezing according to claim 1, characterized in that: The semiconductor refrigeration module (14) further comprises: thermally conductive silicone grease; The thermally conductive silicone grease is arranged between the semiconductor refrigeration sheet (17) and the heat dissipation block (15) and is used to fill the gap between the semiconductor refrigeration sheet (17) and the heat dissipation block (15) to reduce the thermal resistance caused by the air gap.

4. The semiconductor refrigerator with variable temperature freezing according to claim 1, characterized in that: The refrigeration module also includes a return air pipe, a compressor, a condenser, a filter and a capillary tube; The outlet end of the refrigeration evaporator (6) is connected to the return air pipe, the compressor, the condenser, the filter and the inlet end of the capillary tube in sequence; the outlet end of the capillary tube is connected to the inlet end of the refrigeration evaporator (6).

5. The semiconductor refrigerator with variable temperature freezing according to claim 1, characterized in that: The air duct module also includes an air outlet (12) and an air return outlet (13); The air outlet (12) is arranged at the ends of the temperature-changing air duct (9) and the freezing air duct (10); the return air outlet (13) connects the temperature-changing chamber (2) and the freezing chamber (3) with the return air duct (11).

6. The semiconductor refrigerator with variable temperature freezing according to claim 1, characterized in that: The semiconductor refrigeration sheet (17) comprises P-type semiconductor particles and N-type semiconductor particles arranged alternately, and the particles form a thermocouple array through a guide bar and a ceramic substrate.

7. The semiconductor refrigerator with variable temperature freezing according to claim 1, characterized in that: The heat dissipation block (15) is located inside the variable temperature air duct (9), and the heat dissipation block (15) is fixed to the side wall of the variable temperature air duct (9) via a first fixed connection member; the refrigeration block (18) is located inside the freezing air duct (10), and the refrigeration block (18) is fixed to the side wall of the freezing air duct (10) via a second fixed connection member.

8. The semiconductor refrigerator with variable temperature freezing according to claim 4, characterized in that: A refrigeration evaporator (4) is provided in the refrigeration module; the refrigeration evaporator (4) is arranged between the refrigeration chamber (1) and the freezing chamber (3); The outlet end of the refrigeration evaporator (4) is sequentially connected to the return air pipe, the compressor, the condenser, the filter and the inlet end of the capillary tube; the outlet end of the capillary tube is connected to the inlet end of the refrigeration evaporator (4).

9. The semiconductor refrigerator with variable temperature freezing according to claim 8, characterized in that: The air duct module also includes a refrigeration fan (5); The refrigeration fan (5) is located at the outlet end of the refrigeration evaporator (4) and is used to drive air circulation.

10. The semiconductor refrigerator with variable temperature freezing according to claim 1, characterized in that: The air duct module also includes a refrigeration air duct (8), a refrigeration air door and a variable temperature air door; The refrigeration air duct (8) is in communication with the refrigeration chamber (1); the refrigeration air door is arranged in the refrigeration air duct (8) for controlling the refrigeration air supply volume; the variable temperature air door is arranged in the variable temperature air duct (9) for adjusting the temperature of the variable temperature chamber (2).

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