Current sensor assembly
By setting sensors with lower rated capacity and conductive tracks or bus bars on the printed circuit board and scaling the measured values with the processing unit, the problem that existing current sensors cannot measure currents beyond their capacity is solved, achieving accurate measurement of high current values and cost reduction.
Patent Information
- Application Number
- CN202411950575.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-12-29
- Filing Date
- 2024-12-27
- Publication Date
- 2025-07-01
AI Technical Summary
Existing current sensors have limited measurement capacity and cannot measure currents beyond their capacity. At the same time, as the current capacity increases, the cost and size of the sensor also increase, occupying more space.
The measurement of current exceeding the sensor capacity is achieved by setting a sensor with a lower rated capacity and a conductive track or bus bar on the printed circuit board and scaling the measured values using the processing unit.
It reduces the construction or production cost of materials, reduces the surface area occupied by the current sensor on the power system components, and achieves accurate measurement of high current values.
Smart Images
Figure CN120233135A_ABST
Abstract
Description
[0001] Cross - Reference to Related Applications
[0002] This U.S. non - provisional patent application claims the benefit of Indian Provisional Patent Application Serial No. 202321089862, filed on December 29, 2023, entitled "A Current Sensor Assembly", the entire disclosure of which is hereby incorporated by reference. Technical Field
[0003] The present disclosure relates to current sensors. Background Art
[0004] The background information below relates to the present disclosure but is not necessarily prior art.
[0005] Generally, power conversion systems use dedicated current sensors to measure the current flowing through the system. These dedicated sensors have a defined measurement capacity, which means that the sensor cannot measure a current beyond its capacity. For example, if a 50A current is to be measured flowing through the system, a current sensor with a 50A capacity must be used. Similarly, a 100A capacity current sensor is required to measure a 100A current.
[0006] However, as the current capacity of the sensor increases, the cost of the current sensor also increases, thereby increasing the production cost of the system. In addition, higher - capacity current sensors have larger sizes and thus tend to occupy more space on components of the power system, such as its PCB. Summary of the Invention
[0007] Aspects of the disclosed embodiments include a current sensor assembly. The current sensor assembly includes: at least a portion of a printed circuit board; at least one sensor disposed on the portion of the printed circuit board, the at least one sensor being configured to measure the current flowing through the portion of the printed circuit board; and a processing unit configured to: receive one or more current measurement values from the at least one sensor; and determine an actual current value associated with the current flowing through the portion of the printed circuit board by scaling the one or more current measurement values. Brief Description of the Drawings
[0008] The current sensor assembly of the present disclosure will now be described with the aid of the drawings, in which:
[0009] Figure 1 An isometric view of a component according to a first embodiment of the present disclosure is shown; and
[0010] Figure 2 and Figure 3 An isometric view of a component according to a second embodiment of the present disclosure is shown. Detailed Embodiments
[0011] Embodiments of the present disclosure will now be described with reference to the accompanying drawings.
[0012] Embodiments are provided to thoroughly and completely convey the scope of the present disclosure to those skilled in the art. Many details related to specific components and methods are set forth to provide a complete understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that the details provided in the embodiments should not be construed as limiting the scope of the present disclosure. In some embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.
[0013] The terms used in the present disclosure are for the purpose of explaining specific embodiments only, and such terms should not be regarded as limiting the scope of the present disclosure. As used in the present disclosure, the forms "a", "an", and "the" may also be intended to include the plural forms unless the context clearly indicates otherwise. The terms "comprises", "comprising", "including", and "having" are open transitional phrases and thus specify the presence of the stated features, elements, modules, units, and / or components, but do not preclude the presence or addition of one or more other features, elements, components, and / or groups thereof.
[0014] In some embodiments, the systems and methods described herein may be configured to address one or more problems of the prior art or at least provide a useful alternative. The systems and methods described herein may be configured to provide a current sensor assembly. The systems and methods described herein may be configured to provide a current sensor assembly that can be used to measure a current that exceeds the current sensor's capacity.
[0015] The systems and methods described herein may be configured to provide a current sensor assembly that can reduce the construction or production cost of materials. The systems and methods described herein may be configured to provide a current sensor assembly that occupies a relatively small surface area on a power system component.
[0016] In some embodiments, the systems and methods described herein may be configured to provide a current sensor assembly that can be used to measure a current that exceeds its current capacity.
[0017] Now referring to Figures 1 to 3 the current sensor assemblies (100, 200) of the present disclosure will be described in detail. It should be understood that Figures 1 to 3 the description does not limit the scope and scope of the present disclosure.
[0018] The current sensor assemblies (100, 200) are configured to be used in a power system to measure the current flowing through the power system.
[0019] In some embodiments, the current sensor assemblies (100, 200) (hereinafter referred to as 'assemblies (100, 200)') include current sensors (105, 205) that are configured to be disposed on an element of the power system such as a printed circuit board (PCB) (1000).
[0020] Figure 1 An isometric view of the assembly (100) is shown. The assembly (100) may include a PCB (1000) on which a sensor (105) and conductive tracks (110) are configured.
[0021] In some embodiments, the current sensor (105) is a Hall effect sensor. In some embodiments, the current sensor (105) can have any current capacity and is not limited by the maximum value of the current flowing through the PCB (1000). In some embodiments, the current capacity of the sensor (105) is less than the estimated current that will flow through the PCB (1000).
[0022] In some embodiments, the impedance of the conductive tracks (110) matches the impedance of the sensor (105). In some embodiments, preferably, the impedance parameters of the conductive tracks (110) match the impedance parameters of the sensor (105) because impedance includes both resistance and reactance. Simulating the impedance of the tracks (110) is required during the PCB (1000) layout.
[0023] Figure 2 and Figure 3 An isometric view of a second embodiment of the present disclosure is shown, where the assembly (200) includes a PCB (1000) on which a sensor (205) and a bus bar (210) are disposed. In some embodiments, the PCB (1000) can include any suitable number of bus bars (210), including but not limited to at least one bus bar (210) or other suitable number of bus bars (210).
[0024] In some embodiments, the bus bar (210) is configured on the PCB (1000) parallel to the sensors (105, 205). The bus bar (210) is configured to receive power and conduct power therethrough. Additionally, referring to Figure 2 , for the bus bar (210), the impedances of the bus bar conductors (213, 216) used should be equal. This can be achieved by increasing the length of the bus bar conductor (213) to compensate for the distance between the conductors (224). Additionally, the positions of the conductors in the assemblies (100, 200) are required to be correctly placed for better accuracy.
[0025] In some embodiments, Figure 2 An embodiment of the provision of a bus bar (210) for sensing current is shown. The bus bar conductor positions are located closer to the current input point and the current output point.
[0026] In some embodiments, Figure 3 Another embodiment of the provision of a bus bar (210) for sensing current is shown. The bus bar conductors (213, 216) are placed equidistant from the current input point (218) and the current output point (220). In some embodiments, for the bus bar (210), the bus bar conductors (213, 216) used have equal length, width, diameter (if it is circular), and material (which can be copper or aluminum). The second embodiment provides relatively accurate current readings.
[0027] In some embodiments, components (100, 200) are used, where the typical value of the current flowing through the system has been identified in its specifications. Sensors (105, 205) are configured to measure the current value and are coupled to a processing unit to detect whether there are current fluctuations in the system. Conductive tracks (110) parallel to the current sensor (105) or bus bar conductors (216) parallel to the bus bar conductor (213) are configured to receive an equal amount of current flowing through the current sensors (105, 205).
[0028] Thus, the total current flowing through the system exceeds the rated capacity of the sensors (105, 205).
[0029] In the operating configuration of the components (100, 200), the sensors (105, 205) are connected to the processing unit to send the measured current value to the processing unit. The processing unit is configured to scale the received measured value to form the actual value of the current.
[0030] According to some embodiments, a current of 100 A is passed through a PCB (1000). 50 A sensors (105, 205) are mounted on the PCB (1000). In this case, the sensors (105, 205) cannot measure a current exceeding their 50 A rated capacity. Thus, conductive tracks parallel to the sensors (105, 205) are configured to receive the extra 50 A of current therein. The value of 50 A measured by the sensors (105, 205) is received by the processing unit, which scales it up by a factor of 2 (the scaling factor is calculated from the specification details of the PCB (1000)) to calculate the actual current value, which is 100 A in this case.
[0031] According to some embodiments, a current of 150 A is passed through a printed circuit board (1000). Sensors (105, 205) rated at 50 A are mounted on the printed circuit board (1000). In this case, the sensors (105, 205) cannot measure currents exceeding their 50 A rated capacity. Accordingly, a pair of conductive tracks are configured in parallel with the sensors (105, 205) to receive the extra 100 A of current therein. The 50 A value measured by the sensors (105, 205) is received by a processing unit, which scales it up by a factor of 3 to calculate the actual current value, which is 150 A in this case.
[0032] The number of tracks (n) thus depends on the scaling factor (n + 1).
[0033] Accordingly, the sensor assemblies (100, 200) of the present disclosure utilize the lower rated capacity of the sensors (105, 205) to measure higher current values, thereby reducing the BOM cost. Additionally, the lower rated capacity sensors (105, 205) occupy a relatively small surface area of the printed circuit board (1000).
[0034] In some embodiments, a current sensor assembly includes: at least a portion of a printed circuit board; at least one sensor disposed on the portion of the printed circuit board, the at least one sensor being configured to measure a current flowing through the portion of the printed circuit board; and a processing unit configured to: receive one or more current measurements from the at least one sensor; and determine an actual current value associated with the current flowing through the portion of the printed circuit board by scaling the one or more current measurements.
[0035] In some embodiments, the printed circuit board includes one or more conductive traces. In some embodiments, one or more conductive traces are disposed on the printed circuit board parallel to at least one sensor. In some embodiments, the processing unit is further configured to scale one or more current measurements based on the number of conductive traces of the one or more conductive traces. In some embodiments, the processing unit is further configured to scale one or more current measurements by multiplying the one or more current measurements by the number of conductive traces of the one or more conductive traces. In some embodiments, the impedance of the one or more conductive traces matches the impedance of at least one sensor. In some embodiments, the one or more conductive traces are configured to receive a current amount equal to the current amount flowing through at least one sensor. In some embodiments, at least one sensor includes a Hall effect sensor. In some embodiments, at least one sensor has a current capacity less than the estimated current of the printed circuit board. In some embodiments, the printed circuit board includes at least one bus bar. In some embodiments, at least one bus bar is disposed parallel to at least one sensor. In some embodiments, at least one bus bar includes at least two conductors. In some embodiments, the at least two conductors have equal impedance. In some embodiments, the at least two conductors have equal length. In some embodiments, the at least two conductors have equal width. In some embodiments, the at least two conductors have equal diameter. In some embodiments, at least one bus bar is disposed on the printed circuit board equidistantly between the current input portion and the current output portion. In some embodiments, at least one bus bar is configured to receive a current amount equal to the current amount flowing through at least one sensor. In some embodiments, the processing unit is configured to detect fluctuations in the current flowing through the printed circuit board. In some embodiments, the printed circuit board is associated with an electrical power system.
[0036] The foregoing description of the embodiments has been provided for purposes of illustration, and the foregoing description of the embodiments is not intended to limit the scope of the present disclosure. The various components of a particular embodiment are generally not limited to that particular embodiment and are instead interchangeable. Such variations should not be regarded as departing from the present disclosure, and all such modifications are considered to be within the scope of the present disclosure.
[0037] In the following description, embodiments herein and their various features and advantageous details are illustrated with reference to non-limiting embodiments. Descriptions of well-known components and processing techniques are omitted so as not to unnecessarily obscure the embodiments herein. The examples used herein are only intended to facilitate an understanding of the manner in which the embodiments herein can be practiced and also to enable those of ordinary skill in the art to practice the embodiments herein. Accordingly, these examples should not be construed as limiting the scope of the embodiments herein.
[0038] The foregoing description of the specific embodiments has so fully revealed the general nature of the embodiments herein that others can, without departing from the general concept, readily modify and / or adapt such specific embodiments to various applications by applying current knowledge. Therefore, such adaptations and modifications should and are intended to be understood within the meaning and range of equivalents of the disclosed embodiments. It should be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Thus, although the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that modifications may be made to practice the embodiments herein within the spirit and scope of the embodiments as described herein.
[0039] Throughout the specification, the word "comprises" or variations such as "comprises" or "comprising" will be understood to imply the inclusion of the stated element or group of elements but not the exclusion of any other element or group of elements.
[0040] Although considerable emphasis has been placed herein on the components and component parts of the preferred embodiments, it will be understood that many embodiments can be made without departing from the principles of the disclosure, and many changes can be made in the preferred embodiments. These and other changes in the preferred embodiments and other embodiments of the disclosure will be apparent to those skilled in the art from the disclosure herein, whereby it can be clearly understood that the foregoing descriptive matter is to be interpreted as illustrative of the disclosure and not as limiting.
Claims
1. A current sensor assembly, comprising: at least a portion of a printed circuit board; at least one sensor disposed on the portion of the printed circuit board, the at least one sensor configured to measure current flowing through the portion of the printed circuit board; as well as A processing unit, the processing unit being configured to: receiving one or more current measurements from the at least one sensor; as well as An actual current value associated with the current flowing through the portion of the printed circuit board is determined by scaling the one or more current measurements.
2. The current sensor assembly according to claim 1, wherein: The printed circuit board comprises one or more conductive tracks.
3. The current sensor assembly according to claim 2, wherein: The one or more conductive tracks are arranged on the printed circuit board parallel to the at least one sensor.
4. The current sensor assembly according to claim 2, wherein: The processing unit is further configured to scale the one or more current measurements based on a number of conductive tracks of the one or more conductive tracks.
5. The current sensor assembly according to claim 4, wherein: The processing unit is further configured to scale the one or more current measurements by multiplying the one or more current measurements by a number of conductive tracks of the one or more conductive tracks.
6. The current sensor assembly according to claim 2, wherein: The impedance of the one or more conductive tracks is matched to the impedance of the at least one sensor.
7. The current sensor assembly according to claim 2, wherein: The one or more conductive tracks are configured to receive an amount of current equal to an amount of current flowing through the at least one sensor.
8. The current sensor assembly according to claim 1, wherein: The at least one sensor comprises a Hall Effect sensor.
9. The current sensor assembly according to claim 1, wherein: The at least one sensor has a current capacity that is less than an estimated current of the printed circuit board.
10. The current sensor assembly according to claim 1, wherein: The printed circuit board includes at least one bus bar.
11. The current sensor assembly according to claim 10, wherein: The at least one bus bar is disposed parallel to the at least one sensor.
12. The current sensor assembly according to claim 10, wherein: The at least one bus bar includes at least two conductors.
13. The current sensor assembly according to claim 12, wherein: The at least two conductors have equal impedance.
14. The current sensor assembly according to claim 12, wherein: The at least two conductors have equal lengths.
15. The current sensor assembly according to claim 12, wherein: The at least two conductors have equal widths.
16. The current sensor assembly according to claim 12, wherein: The at least two conductors have equal diameters.
17. The current sensor assembly according to claim 10, wherein: The at least one bus bar is disposed on the printed circuit board at an equal distance between the current input portion and the current output portion.
18. The current sensor assembly according to claim 10, wherein: The at least one bus bar is configured to receive an amount of current equal to an amount of current flowing through the at least one sensor.
19. The current sensor assembly of claim 1, wherein: The processing unit is configured to detect fluctuations in current flowing through the printed circuit board.
20. The current sensor assembly of claim 1, wherein: The printed circuit board is associated with an electrical power system.