Photoelectric conversion single board and communication equipment

Abstract

The invention discloses a photoelectric conversion single board and communication equipment. The photoelectric conversion single board comprises a circuit board, an optical module and a radiator, the optical module is arranged on the first face of the circuit board and electrically connected with the circuit board, and a plurality of first radiating fins are arranged on the face, away from the circuit board, of the optical module. The radiator is arranged on one side, deviating from the circuit board, of the optical module; a plurality of second radiating fins are arranged on one side, deviating from the circuit board, of the radiator; the first radiating fins abut against the face, facing the circuit board, of the radiator. According to the scheme, the first heat dissipation fins abut against the radiator, the first heat dissipation fins and the radiator are in contact heat transfer, the first heat dissipation fins can take away part of heat of the optical module, the power density transmitted to the contact face of the radiator and the first heat dissipation fins is reduced, and temperature rise generated by contact between the first heat dissipation fins and the radiator is also reduced; the contact thermal resistance between the optical module and the radiator can be optimized, and the radiating efficiency of the optical module is improved.

Description

Technical Field

[0001] This application relates to the field of communications, and in particular to an optoelectronic conversion single board and a communication device. Background Art

[0002] The optical module is one of the core components of optical network technology, and its function is to convert optical signals and electrical signals into each other inside the module. In recent years, the performance of optical modules has become stronger and stronger, and the power consumption of optical modules has become larger and larger, making it more and more difficult for optical modules to dissipate heat, and the heat dissipation challenge is relatively large.

[0003] For ease of use and maintenance, the optical module has the characteristic of being pluggable. Therefore, heat-conducting materials cannot be used between the optical module and the radiator. The optical module and the radiator can only transfer heat through dry contact. However, the interface of the dry contact between the optical module and the radiator is not actually completely fitted microscopically, and the contact thermal resistance between the optical module and the radiator is relatively large, resulting in relatively difficult heat dissipation of the optical module and low heat dissipation efficiency. Summary of the Invention

[0004] This application provides an optoelectronic conversion single board and a communication device to improve the heat dissipation efficiency of the optical module.

[0005] In a first aspect, this application provides an optoelectronic conversion single board, which may include a circuit board, an optical module, and a radiator. The circuit board may include a first surface and a second surface opposite to each other. The optical module may be disposed on the first surface of the circuit board, the optical module is electrically connected to the circuit board, and a plurality of first heat dissipation fins may be disposed on a surface of the optical module facing away from the circuit board. The radiator may be disposed on one side of the first surface of the optical module facing away from the circuit board, and a plurality of second heat dissipation fins may be disposed on a surface of the radiator facing away from the circuit board; at least some of the plurality of first heat dissipation fins may be in contact with a surface of the radiator facing the circuit board.

[0006] In the technical solution provided by this application, the optical module is provided with first heat dissipation fins, which can improve the heat dissipation of the optical module and improve the heat dissipation efficiency of the optical module. Moreover, at least some of the first heat dissipation fins are in contact with the radiator, and heat is transferred through contact between the first heat dissipation fins and the radiator. The first heat dissipation fins and the radiator form a composite heat dissipation structure. In practical applications, the first heat dissipation fins can take away part of the heat of the optical module, so that the power density transferred to the contact surface between the radiator and the first heat dissipation fins can be reduced, and the temperature rise generated by the contact between the first heat dissipation fins and the radiator will also be reduced. The radiator and the second heat dissipation fins can continue to take away the heat of the optical module. Compared with the radiator directly transferring heat to the optical module in contact, the contact thermal resistance between the optical module and the radiator can be optimized, and the heat dissipation efficiency of the optical module can be improved.

[0007] In a specific possible implementation, a heat sink may be provided on one side of the optical module facing away from the circuit board, at least some of the first heat sinks among the plurality of first heat sinks may be located between the heat sink and the optical module, and the first heat sinks located between the heat sink and the optical module are fixedly connected to the heat sink; at least some of the side of the heat sink facing away from the optical module may abut against the side of the radiator facing the circuit board. The provision of the heat sink may increase the heat dissipation area of ​​the optical module and improve the heat dissipation efficiency of the optical module.

[0008] In a specific possible implementation, a heat-conducting layer is provided on a side of the heat sink facing away from the optical module, and in a direction perpendicular to the first side of the circuit board, the projection of the heat-conducting layer and the projection of the heat sink at least partially overlap, and the heat sink abuts against the heat-conducting layer. The provision of the heat-conducting layer can improve the contact temperature rise between the heat sink and the heat sink, thereby improving the contact temperature rise between the optical module and the heat sink, and improving the heat dissipation efficiency of the optical module.

[0009] In a specific possible implementation, the heat sink may include a substrate, the substrate is arranged on a side of the optical module away from the circuit board, the plurality of second heat sinks may be arranged on a side of the substrate away from the circuit board; at least some of the plurality of first heat sinks may abut against a side of the substrate facing the circuit board. The arrangement of the substrate facilitates more complete contact between the heat sink and the optical module, improves the heat conduction effect between the heat sink and the optical module, and improves the heat dissipation efficiency of the optical module.

[0010] In a specific possible implementation, a heat sink may be provided on the side of the optical module facing away from the circuit board, at least some of the first heat sinks among the plurality of first heat sinks may be located between the heat sink and the optical module, and the first heat sinks located between the heat sink and the optical module are fixedly connected to the heat sink; at least some of the side of the heat sink facing away from the optical module may abut against the side of the substrate facing the circuit board. The contact area between the heat sink and the substrate may be relatively large, which may enhance the heat conduction effect between the optical module and the radiator and improve the heat dissipation efficiency of the optical module.

[0011] In a specific possible implementation scheme, the multiple first heat dissipation fins can be arranged in a first direction, there are gaps between adjacent first heat dissipation fins, and the first direction is parallel to the first surface of the circuit board; each of the first heat dissipation fins can include multiple heat dissipation units, the multiple heat dissipation units can be arranged in a second direction, there are gaps between adjacent heat dissipation units, the second direction is parallel to the first surface of the circuit board, and the second direction is at an angle to the first direction; the multiple heat dissipation units respectively included in each of the first heat dissipation fins can correspond one to one in the first direction. A first air duct can be formed between adjacent first heat dissipation fins, and a second air duct can be formed between adjacent heat dissipation units in the corresponding multiple heat dissipation units of the multiple first heat dissipation fins, so that the multiple first heat dissipation fins including the multiple heat dissipation units can form multiple first air ducts and multiple second air ducts, which can speed up the air flow between the multiple first heat dissipation fins and improve the heat dissipation efficiency of the optical module.

[0012] In a specific implementation scheme, the heat dissipation unit may be a rectangular sheet structure, a square sheet structure or a columnar structure. The air flow between the plurality of first heat dissipation fins is faster, which can further improve the heat dissipation efficiency of the optical module.

[0013] In a specific possible implementation, when the heat dissipation unit is a columnar structure, the heat dissipation unit includes a first end and a second end opposite to each other, and the first end of the heat dissipation unit is connected to a side of the optical module away from the circuit board; along the direction from the second end of the heat dissipation unit to the first end of the heat dissipation unit, the radial dimension of the heat dissipation unit can gradually increase. The width of the second air duct can be wider, and the air flow in the second air duct can be faster, which can improve the heat dissipation efficiency of the optical module.

[0014] In a specific possible implementation, a heat conducting layer may be provided on one side of the heat sink facing the circuit board, and in a third direction, the projection of the heat conducting layer at least partially overlaps with the projection of the optical module, and the third direction is perpendicular to the first side of the circuit board; the optical module abuts against the heat conducting layer. The provision of the heat conducting layer can improve the contact temperature rise between the optical module and the heat sink, and improve the heat dissipation efficiency of the optical module.

[0015] In a specific possible implementation, the first surface of the circuit board may be provided with a positioning structure, the positioning structure may have an opening, in a first direction, the projection shape of the opening corresponds to the projection shape of the optical module, the projection area of ​​the opening may be greater than or equal to the projection area of ​​the optical module, the first direction is parallel to the first surface of the circuit board; the optical module may be plugged into the opening, so as to facilitate the connection and removal of the optical module from the circuit board.

[0016] In a specific implementation scheme, the heat sink can be connected to the positioning structure, or the heat sink can be connected to the positioning structure and the circuit board respectively, so that the heat sink and the optical module can be easily abutted, and the heat sink can be easily connected to and removed from the circuit board.

[0017] In a second aspect, the present application further provides a communication device, which may include a body, and a photoelectric conversion board as in any one of the embodiments of the first aspect. The circuit board of the photoelectric conversion board may be fixedly connected to the inside of the body, the optical module of the photoelectric conversion board may be connected to an optical fiber, the optical module may convert the electrical signal of the circuit board into an optical signal and transmit it through the optical fiber, and the optical module may also convert the optical signal received from the optical fiber into an electrical signal and provide it to the circuit board.

[0018] The communication equipment provided in the present application has a high heat dissipation efficiency of the optical module, a relatively stable performance of the optoelectronic conversion board, and a high reliability of the communication equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of a portion of the structure of the photoelectric conversion board provided in this application;

[0020] Figure 2 A schematic diagram of the structure of the optical module of the optoelectronic conversion board provided in this application;

[0021] Figure 3 A schematic diagram of the three-dimensional structure of the optical module of the optoelectronic conversion board provided in this application;

[0022] Figure 4 A schematic diagram of the structure of the photoelectric conversion board provided in this application;

[0023] Figure 5 A schematic diagram of the structure of the positioning structure of the photoelectric conversion board provided in this application;

[0024] Figure 6 A schematic diagram of the top view of the optical module of the optoelectronic conversion board provided in this application;

[0025] Figure 7 This is a schematic diagram of the structure of the photoelectric conversion board provided in this application.

[0026] Reference numerals:

[0027] 100-circuit board; 200-optical module; 300-heat sink; 400-positioning structure;

[0028] 201-first heat sink; 2011-heat sink unit; 202-heat sink plate; 203-first air duct;

[0029] 204-second air duct; 301-second heat dissipation fin; 302-base plate; 303-heat conducting layer;

[0030] 401-Opening. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. However, the example implementation can be implemented in various forms and should not be construed as being limited to the implementations set forth herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all described with reference to the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings of the embodiments of the present application are only used to illustrate the relative position relationship and do not represent the true proportion.

[0032] The following description sets forth specific details to facilitate understanding of the present application, but the embodiments of the present application can be implemented in a variety of other ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the embodiments of the present application. Therefore, the present application is not limited to the specific implementation methods disclosed below.

[0033] For ease of understanding, the application scenario of the optoelectronic conversion board involved in the present application is first described. The optoelectronic conversion board provided in the embodiment of the present application can be adapted to communication equipment, such as optical communication equipment. Exemplarily, the communication equipment may include an optoelectronic conversion board and a body, and the optoelectronic conversion board is fixedly connected to the inside of the body. The optoelectronic conversion board may include a circuit board and an optical module, wherein the optical module is generally composed of an optoelectronic device, a functional circuit and an optical interface, and the optical module is mainly used to realize optoelectronic conversion, the optical module is plugged with an optical fiber, and the optical module is electrically connected to the circuit board. In actual application, the transmitting end of the optical module converts the electrical signal of the circuit board into an optical signal and transmits it through the optical fiber, and the receiving end of the optical module converts the optical signal received from the optical fiber into an electrical signal and provides it to the circuit board.

[0034] In order to facilitate use and maintenance, the optical module has the feature of being pluggable, so thermal conductive materials cannot be used between the optical module and the heat sink. The optical module and the heat sink can only transfer heat through dry contact. However, the interface of the optical module and the heat sink in dry contact is not completely fitted at the microscopic level. The contact thermal resistance between the optical module and the heat sink is large, which makes it difficult for the optical module to dissipate heat and the heat dissipation efficiency is low. Based on this, the embodiment of the present application provides a photoelectric conversion single board to improve the heat dissipation efficiency of the optical module.

[0035] First refer to Figure 1 , Figure 1The schematic diagram of the partial structure of the photoelectric conversion board provided by the present application is shown. In the coordinate directions of the following figures, the direction shown on the x-axis represents the first direction, the direction shown on the y-axis represents the second direction, and the direction shown on the z-axis represents the third direction. Figure 1 As shown, the optoelectronic conversion board provided in the embodiment of the present application may include a circuit board 100 and an optical module 200. The circuit board 100 may include a first surface and a second surface relative to each other. For example, the first surface and the second surface may be the front and back surfaces of the circuit board 100, respectively. Specifically, the first direction may be parallel to the first surface of the circuit board 100, the second direction may be parallel to the first surface of the circuit board 100, and the second direction may be at an angle to the first direction, for example, the second direction may be perpendicular to the first direction; the third direction may be perpendicular to the first surface of the circuit board 100. More specifically, the first direction may be the length direction of the circuit board 100, the second direction may be the width direction of the circuit board 100, or the first direction may be the width direction of the circuit board 100, the second direction may be the length direction of the circuit board 100; the third direction may be the thickness direction of the circuit board 100. In a specific implementation, the optical module 200 can be set on the first surface of the circuit board 100, the optical module 200 is electrically connected to the circuit board 100, the optical module 200 can convert the received optical signal into an electrical signal, the circuit board 100 can receive the electrical signal converted by the optical module 200, and the optical module 200 can receive the electrical signal of the circuit board 100 and convert it into an optical signal.

[0036] Figure 2 The schematic diagram of the structure of the optical module of the photoelectric conversion board provided by the present application is shown. Figure 3 The three-dimensional structure diagram of the optical module of the photoelectric conversion board provided by the present application is shown. Figure 1 , Figure 2 and Figure 3 As shown, a side of the optical module 200 facing away from the circuit board 100 may be provided with a plurality of first heat dissipation fins 201, the first heat dissipation fins 201 may be a planar plate-shaped structure, the first heat dissipation fins 201 may be integrally formed with the housing of the optical module 200, and the plurality of first heat dissipation fins 201 may be arranged in an array. The plurality of first heat dissipation fins 201 may cover the entire side of the optical module 200 facing away from the circuit board 100, or the plurality of first heat dissipation fins 201 may occupy a portion of the side of the optical module 200 facing away from the circuit board 100.

[0037] Figure 4 The schematic diagram of the structure of the photoelectric conversion board provided by the present application is shown. Figure 4As shown, the photoelectric conversion board may also include a heat sink 300, which is arranged on the side of the first surface of the optical module 200 away from the circuit board 100, and the side of the heat sink 300 away from the circuit board 100 may be provided with a plurality of second heat dissipation fins 301, the second heat dissipation fins 301 may be a planar plate-like structure, the second heat dissipation fins 301 may be integrally formed with the heat sink 300, and the plurality of second heat dissipation fins 301 may be arranged in an array. Specifically, at least part of the plurality of first heat dissipation fins 201 abut against the side of the heat sink 300 facing the circuit board 100, for example, all of the plurality of first heat dissipation fins 201 abut against the side of the heat sink 300 facing the circuit board 100, or a part of the plurality of first heat dissipation fins 201 abut against the side of the heat sink 300 facing the circuit board 100. It can be understood that when the side of the heat sink 300 facing the circuit board 100 has an idle layout space, the side of the heat sink 300 facing the circuit board 100 may also be provided with a plurality of second heat dissipation fins 301.

[0038] In the optoelectronic conversion board provided in the embodiment of the present application, the optical module 200 is provided with a first heat dissipation fin 201 , and there is no contact thermal resistance between the first heat dissipation fin 201 and the optical module 200 , which can improve the heat dissipation of the optical module 200 and improve the heat dissipation efficiency of the optical module 200 . In addition, the heat sink 300 can be arranged in the heat dissipation space of the circuit board 100, at least part of the first heat dissipation fin 201 is in contact with the heat sink 300, and the first heat dissipation fin 201 and the heat sink 300 are in contact and heat transfer, so that the first heat dissipation fin 201 and the heat sink 300 form a composite heat dissipation structure. In actual application, the first heat dissipation fin 201 can first take away part of the heat of the optical module 200, so that the power density transferred to the contact surface between the heat sink 300 and the first heat dissipation fin 201 can be reduced, and the temperature rise generated by the contact between the first heat dissipation fin 201 and the heat sink 300 will also be reduced. The heat sink 300 and the second heat dissipation fin 301 can continue to take away the heat of the optical module 200. Compared with the heat sink 300 directly contacting and transferring heat with the optical module 200, the contact thermal resistance between the optical module 200 and the heat sink 300 can be optimized, and the contact temperature rise between the optical module 200 and the heat sink 300 can be improved, thereby improving the heat dissipation efficiency of the optical module 200.

[0039] Figure 5 The schematic diagram of the structure of the positioning structure of the photoelectric conversion board provided by the present application is shown. Figure 4 and Figure 5As shown, the first surface of the circuit board 100 may be provided with a positioning structure 400, and the positioning structure 400 has an opening 401. In the first direction, the projection shape of the opening 401 may correspond to the projection shape of the optical module 200. For example, when the projection shape of the optical module 200 in the first direction is a rectangle, the projection shape of the opening 401 in the first direction is also a rectangle. Specifically, the opening 401 may be U-shaped. After the positioning structure 400 is installed on the circuit board 100, the circuit board 100 closes the opening 401, that is, the positioning structure 400 and the circuit board 100 jointly form a rectangular accommodation space, or the opening 401 is a rectangle, and the opening 401 itself forms a rectangular accommodation space. In the first direction, the projection area of ​​the opening 401 is greater than or equal to the projection area of ​​the optical module 200, and the optical module 200 can be plugged into the opening 401 to achieve the fixation of the optical module 200 on the circuit board 100. The accommodation space formed by the positioning structure 400 and the circuit board 100 or the accommodation space formed by the positioning structure 400 itself can be called the installation slot of the optical film block.

[0040] In practical applications, when the height of the installation slot is relatively low, the positioning structure 400 can avoid the first heat dissipation fin 201, and the portion of the optical module 200 provided with the first heat dissipation fin 201 can be exposed in the opening 401, which is beneficial to the heat dissipation of the optical module 200. When the height of the installation slot is relatively high, the optical module 200 and part of the first heat dissipation fin 201 can be located in the opening 401 at the same time, so that the installation space of the optical module 200 can be fully utilized for heat dissipation, and the heat dissipation efficiency of the optical module 200 can be improved. At this time, the first heat dissipation fin 201 can be fully distributed on the side of the optical module 200 away from the circuit board 100, which can increase the heat dissipation area of ​​the optical module 200 and further improve the heat dissipation efficiency of the optical module 200.

[0041] In specific implementation, the heat sink 300 can be connected to the positioning structure 400 to achieve that the heat sink 300 is fixed to the first surface of the optical module 200 away from the circuit board 100; or, the heat sink 300 can be connected to the positioning structure 400 and the circuit board 100 respectively, that is, the heat sink 300 is connected to the circuit board 100 and is also connected to the positioning structure 400, so that the heat sink 300 is fixed to the first surface of the optical module 200 away from the circuit board 100 and fixed to the first surface of the circuit board 100. Specifically, the heat sink 300 can be fixed to the circuit board 100 by a spring screw; the heat sink 300 can be fixed to the positioning structure 400 by a spring sheet.

[0042] As a possible implementation, Figure 4As shown, a heat sink 202 may be provided on one side of the optical module 200 away from the circuit board 100. The heat sink 202 may be a planar plate-shaped structure. At least part of the first heat sink fins 201 among the plurality of first heat sink fins 201 are located between the heat sink 202 and the optical module 200. For example, all of the first heat sink fins 201 are located between the heat sink 202 and the optical module 200, or part of the first heat sink fins 201 are located between the heat sink 202 and the optical module 200. The provision of the heat sink 202 may increase the heat dissipation area of ​​the optical module 200 and improve the heat dissipation efficiency of the optical module 200. The first heat sink fins 201 located between the heat sink 202 and the optical module 200 are fixedly connected to the heat sink 202. The first heat sink fins 201 and the heat sink 202 may be integrally formed. There is no contact thermal resistance between the first heat sink fins 201 and the heat sink 202, which may improve the heat dissipation of the optical module 200 and improve the heat dissipation efficiency of the optical module 200. Specifically, the flatness and roughness of the heat sink 202 meet the requirements of the multi-source agreement (MSA) of the optical module. The MSA agreement defines the size, optoelectronic performance, electrical interface, etc. of the optical module. The purpose of the MSA agreement is to promote good interoperability of optical modules produced by different manufacturers and ensure the interchangeability of optical modules.

[0043] During specific implementation, a side of the heat sink 202 facing away from the optical module 200 is at least partially in contact with a side of the heat sink 300 facing the circuit board 100. For example, a side of the heat sink 202 facing away from the optical module 200 is completely in contact with a side of the heat sink 300 facing the circuit board 100. The contact area between the heat sink 202 and the heat sink 300 is large, which can improve the heat dissipation effect of the heat sink 300 on the optical module 200. Alternatively, a portion of the side of the heat sink 202 facing away from the optical module 200 is in contact with a side of the heat sink 300 facing the circuit board 100.

[0044] As a possible implementation, the heat sink 300 may include a substrate 302, which may be a planar plate-shaped structure. There is a gap between the substrate 302 and the first surface of the circuit board 100. In the third direction, the optical module 200 is located between the substrate 302 and the first surface of the circuit board 100. It can be understood that the substrate 302 is arranged on the side of the optical module 200 away from the circuit board 100. A plurality of second heat dissipation fins 301 are arranged on the side of the substrate 302 away from the circuit board 100. The second heat dissipation fins 301 may be integrally formed with the substrate 302. One end of each second heat dissipation fin 301 in the third direction is connected to the substrate 302, and the other end of each second heat dissipation fin 301 in the third direction may be away from the substrate 302. At least part of the plurality of first heat dissipation fins 201 abuts against the side of the substrate 302 facing the circuit board 100. For example, all of the plurality of first heat dissipation fins 201 abut against the side of the substrate 302 facing the circuit board 100, or part of the plurality of first heat dissipation fins 201 abut against the side of the substrate 302 facing the circuit board 100. The provision of the substrate 302 facilitates more complete contact between the heat sink 300 and the optical module 200 , thereby improving the heat conduction effect and the heat dissipation efficiency of the optical module 200 .

[0045] It can be understood that when a heat sink 202 is provided on the side of the optical module 200 facing away from the circuit board 100, the side of the heat sink 202 facing away from the optical module 200 is at least partially in contact with the side of the substrate 302 facing the circuit board 100. For example, the side of the heat sink 202 facing away from the optical module 200 is completely in contact with the side of the substrate 302 facing the circuit board 100. At this time, the contact area between the heat sink 202 and the substrate 302 is large, which can enhance the heat conduction effect and improve the heat dissipation efficiency of the optical module 200. Alternatively, a part of the side of the heat sink 202 facing away from the optical module 200 is in contact with the side of the substrate 302 facing the circuit board 100. The setting of the radiator 300 is relatively flexible, and the layout space on the circuit board 100 can be flexibly used. When the side of the optical module 200 facing away from the circuit board 100 is not provided with a heat sink 202, at least some of the multiple first heat dissipating fins 201 abut against the side of the substrate 302 facing the circuit board 100, for example, all of the multiple first heat dissipating fins 201 abut against the side of the substrate 302 facing the circuit board 100, or some of the multiple first heat dissipating fins 201 abut against the side of the substrate 302 facing the circuit board 100.

[0046] Figure 6 The top view of the optical module of the optoelectronic conversion board provided by the present application is shown. Figure 3 and Figure 6As shown, a plurality of first heat dissipation fins 201 are arranged in the first direction, and each first heat dissipation fin 201 can extend in the second direction, so that the plurality of first heat dissipation fins 201 can be parallel to each other. There are intervals between adjacent first heat dissipation fins 201, and a first air duct 203 is formed between adjacent first heat dissipation fins 201, and the first air duct 203 extends in the second direction. The plurality of first heat dissipation fins 201 form a plurality of first air ducts 203, for example, n first heat dissipation fins 201 form n-1 first air ducts 203.

[0047] In a specific implementation, each first heat dissipation fin 201 may include a plurality of heat dissipation units 2011, and the plurality of heat dissipation units 2011 are arranged in the second direction, and there are gaps between adjacent heat dissipation units 2011. The plurality of heat dissipation units 2011 respectively included in each first heat dissipation fin 201 may correspond one to one in the first direction. In the plurality of heat dissipation units 2011 corresponding to the plurality of first heat dissipation fins 201, a second air duct 204 is formed between adjacent heat dissipation units 2011, and the second air duct 204 extends along the first direction. The plurality of heat dissipation units 2011 corresponding to the plurality of first heat dissipation fins 201 form a plurality of second air ducts 204. For example, the m heat dissipation units 2011 corresponding to the plurality of first heat dissipation fins 201 form m-1 second air ducts 204. Thus, multiple first heat dissipation fins 201 including multiple heat dissipation units 2011 can form multiple first air ducts 203 and multiple second air ducts 204. For example, there are n first heat dissipation fins 201, and each first heat dissipation fin 201 includes m heat dissipation units 2011, then a total of n-1 first air ducts 203 and m-1 second air ducts 204 can be formed, that is, a total of (n-1)x(m-1) air ducts can be formed, which can speed up the air flow between the multiple first heat dissipation fins 201 and improve the heat dissipation efficiency of the optical module 200.

[0048] In a possible specific implementation, the heat dissipation unit 2011 can be a rectangular or square sheet structure, and each sheet structure is connected to the shell of the optical module 200 at one end in the third direction, and each sheet structure is connected to the heat dissipation plate 202 at the other end in the third direction. At this time, the first heat dissipation fin 201 is easier to form, and multiple first heat dissipation fins 201 are convenient for array arrangement.

[0049] In another possible specific implementation, the heat dissipation unit 2011 may be a columnar structure or a needle-shaped structure, in which case the air between the plurality of first heat dissipation fins 201 flows faster, and the heat dissipation efficiency of the optical module 200 can be further improved. The heat dissipation unit 2011 includes a first end and a second end opposite to each other in the third direction, and the first end of the heat dissipation unit 2011 is connected to a side of the optical module 200 away from the circuit board 100. Specifically, the first end of the heat dissipation unit 2011 is connected to the housing of the optical module 200, and the second end of the heat dissipation unit 2011 is connected to the heat dissipation plate 202. In a specific implementation, the radial dimension of the second end of the heat dissipation unit 2011 may be less than or equal to the radial dimension of the first end of the heat dissipation unit 2011. For example, along the direction from the second end of the heat dissipation unit 2011 to the first end of the heat dissipation unit 2011, the radial dimension of the heat dissipation unit 2011 may gradually increase, and the distance between adjacent heat dissipation units 2011 may gradually increase, so that the width of the second air duct 204 may be wider, the air flow in the second air duct 204 may be faster, and the heat dissipation efficiency of the optical module 200 may be improved.

[0050] Figure 7 The schematic diagram of the structure of the photoelectric conversion board provided by the present application is shown. Figure 4 and Figure 7 As shown, in a possible implementation, a heat conducting layer 303 may be provided on one side of the heat sink 300 facing the circuit board 100. Specifically, a heat conducting layer 303 may be provided on one side of the substrate 302 facing the circuit board 100. In actual configuration, the optical module 200 abuts against the heat conducting layer 303. When a heat sink 202 is provided on one side of the optical module 200 facing away from the circuit board 100, the heat sink 202 abuts against the heat conducting layer 303, so that the heat sink 202 abuts against the substrate 302, thereby abutting against the first heat dissipating fin 201 and the substrate 302, and then abutting against the first heat dissipating fin 201 and the heat sink 300, that is, abutting against the optical module 200 and the heat sink 300. The configuration of the heat conducting layer 303 can improve the contact temperature rise between the heat sink 202 and the substrate 302, thereby improving the contact temperature rise between the optical module 200 and the heat sink 300, and improving the heat dissipation efficiency of the optical module 200.

[0051] In a specific implementation, in the third direction, the projection of the thermal conductive layer 303 at least partially overlaps with the projection of the optical module 200. For example, in the third direction, when the projection area of ​​the heat sink 202 is equal to the projection area of ​​the optical module 200, the projection area of ​​the thermal conductive layer 303 may be greater than or equal to the projection area of ​​the heat sink 202, and the projection of the thermal conductive layer 303 may cover the projection of the heat sink 202, thereby ensuring that the heat sink 202 as a whole can be in contact with the substrate 302 through the thermal conductive layer 303, and the role of the thermal conductive layer 303 in improving the contact temperature rise can be exerted to a greater extent; alternatively, the projection area of ​​the thermal conductive layer 303 may also be smaller than the projection area of ​​the heat sink 202.

[0052] In another possible implementation, the heat-conducting layer 303 may be disposed on a side of the heat sink 202 facing away from the optical module 200, and in a direction perpendicular to the first side of the circuit board 100, that is, in a third direction, the projection of the heat-conducting layer 303 at least partially overlaps with the projection of the heat sink 300; the heat sink 300 abuts against the heat-conducting layer 303. Specifically, the projection of the heat-conducting layer 303 at least partially overlaps with the projection of the substrate 302, and the substrate 302 abuts against the heat-conducting layer 303. The projection area of ​​the heat-conducting layer 303 may be less than or equal to the projection area of ​​the heat sink 202.

[0053] Specifically, the heat-conducting layer 303 may be a film-like structure made of phase change material (PCM) or other heat-conducting materials that are resistant to plugging and unplugging. The heat-conducting layer 303 may be bonded to the substrate 302 or the heat sink 202 by a heat-conducting adhesive.

[0054] In the present application, "at least one" means one or more, and "more than one" means two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B may be singular or plural. In the text description of the present application, the character " / " generally indicates that the previous and next associated objects are in an "or" relationship; in the formula of the present application, the character " / " indicates that the previous and next associated objects are in a "division" relationship. "Including at least one of A, B and C" may mean: including A; including B; including C; including A and B; including A and C; including B and C; including A, B and C.

[0055] It is understood that the various numbers involved in the embodiments of the present application are only for the convenience of description and are not used to limit the scope of the embodiments of the present application. The size of the sequence number of the above-mentioned processes does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic.

[0056] The above are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by any technician familiar with the technical field within the technical scope disclosed in the present application should be covered within the protection scope of the present application.

Claims

1. A photoelectric conversion single board, characterized in that, It includes a circuit board, an optical module and a heat sink; The circuit board includes a first side; The optical module is disposed on the first side of the circuit board, the optical module is electrically connected to the circuit board, and a plurality of first heat dissipation fins are disposed on a side of the optical module facing away from the circuit board; The heat sink is disposed on a side of the optical module facing away from the circuit board, and a plurality of second heat dissipation fins are disposed on a side of the heat sink facing away from the circuit board; at least some of the plurality of first heat dissipation fins are in contact with a side of the heat sink facing the circuit board.

2. The optoelectronic conversion single board according to claim 1, characterized in that A heat dissipation plate is disposed on a side of the optical module facing away from the circuit board, and at least some of the plurality of first heat dissipation fins are located between the heat dissipation plate and the optical module, and the first heat dissipation fins located between the heat dissipation plate and the optical module are fixedly connected to the heat dissipation plate; At least a part of a side of the heat dissipation plate facing away from the optical module is in contact with a side of the heat sink facing the circuit board.

3. The optoelectronic conversion single board according to claim 2, characterized in that A heat conduction layer is disposed on a side of the heat dissipation plate facing away from the optical module, and in a direction perpendicular to the first side of the circuit board, a projection of the heat conduction layer at least partially overlaps with a projection of the heat sink, and the heat sink is in contact with the heat conduction layer.

4. The optoelectronic conversion single board according to any one of claims 1 to 3, characterized in that The heat sink includes a substrate, the substrate is disposed on a side of the optical module facing away from the circuit board, and the plurality of second heat dissipation fins are disposed on a side of the substrate facing away from the circuit board; at least some of the plurality of first heat dissipation fins are in contact with a side of the substrate facing the circuit board.

5. The optoelectronic conversion single board according to claim 4, characterized in that A heat dissipation plate is disposed on a side of the optical module facing away from the circuit board, and at least some of the plurality of first heat dissipation fins are located between the heat dissipation plate and the optical module, and the first heat dissipation fins located between the heat dissipation plate and the optical module are fixedly connected to the heat dissipation plate; At least a part of a side of the heat dissipation plate facing away from the optical module is in contact with a side of the substrate facing the circuit board.

6. The optoelectronic conversion single board according to any one of claims 1 to 5, characterized in that The plurality of first heat dissipation fins are arranged in a first direction, and there is a gap between adjacent first heat dissipation fins, and the first direction is parallel to the first side of the circuit board; Each of the first heat dissipation fins includes a plurality of heat dissipation units, the plurality of heat dissipation units are arranged in a second direction, and there is a gap between adjacent heat dissipation units, and the second direction is parallel to the first side of the circuit board, and the second direction forms an angle with the first direction; The plurality of heat dissipation units included in each of the first heat dissipation fins correspond to each other one by one in the first direction.

7. The optoelectronic conversion single board according to claim 6, characterized in that, The heat dissipation unit is a rectangular, square sheet-like structure or a columnar structure.

8. The optoelectronic conversion single board according to claim 7, wherein When the heat dissipation unit is a columnar structure, the heat dissipation unit includes an opposite first end and a second end, and the first end of the heat dissipation unit is connected to a side of the optical module facing away from the circuit board; Along a direction from the second end of the heat dissipation unit to the first end of the heat dissipation unit, a radial dimension of the heat dissipation unit gradually increases.

9. The optoelectronic conversion single board according to any one of claims 1 to 8, characterized in that, A heat conduction layer is disposed on a side of the heat sink facing the circuit board, and in a third direction, a projection of the heat conduction layer at least partially overlaps with a projection of the optical module, and the third direction is perpendicular to the first side of the circuit board; the optical module is in contact with the heat conduction layer.

10. The optoelectronic conversion single board according to any one of claims 1 to 9, characterized in that, A positioning structure is provided on the first surface of the circuit board. The positioning structure has an opening, and the optical module is inserted into the opening. In a first direction, the projected shape of the opening corresponds to the projected shape of the optical module, and the projected area of the opening is greater than or equal to the projected area of the optical module. The first direction is parallel to the first surface of the circuit board.

11. The optoelectronic conversion single board according to claim 10, characterized in that, The heat sink is connected to the positioning structure, or the heat sink is respectively connected to the positioning structure and the circuit board.

12. A communication device, characterized in that, It includes a machine body and the optoelectronic conversion single board according to any one of claims 1 to 11. The circuit board of the optoelectronic conversion single board is fixedly connected inside the machine body. The optical module of the optoelectronic conversion single board is connected with an optical fiber. The optical module is used for converting the electrical signal of the circuit board into an optical signal and transmitting it through the optical fiber, and for converting the optical signal received from the optical fiber into an electrical signal and providing it to the circuit board.

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