Display device

Abstract

An embodiment discloses a light emitting display device including: a first substrate including a display area and a non-display area, the non-display area including a bending area; a second substrate disposed on the display area of the first substrate and facing the first substrate with a specific gap; a dummy substrate disposed to face a lower portion of the first substrate with a bending region of a non-display region therebetween; an anti-etching member disposed on the first substrate and the dummy substrate to overlap the non-display area; and a link line unit formed on the anti-etching member.

Description

Technical Field

[0001] The present disclosure relates to a device, and more particularly to, for example but not limited to, a display device. Background Art

[0002] Generally, display devices have been widely used as display screens of various electronic devices, such as mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, ultra-mobile personal computers (UMPCs), mobile phones, tablet personal computers (PCs), watch phones, electronic tablets, wearable devices, portable information devices, vehicle control display devices, televisions, notebooks, monitors, and the like.

[0003] Recently, research and development have been conducted on display devices capable of achieving a maximum (or improved) screen size by reducing the border area that does not display an image with the same display panel size.

[0004] The descriptions provided in the discussion of the related art section should not be regarded as prior art merely because they are mentioned or associated with that section. The discussion of the related art section may include information describing one or more aspects of the subject technology, and the descriptions in this section do not limit the present disclosure. Summary of the Invention

[0005] The present disclosure aims to provide a display device that can apply a backlight unit as a two-dimensional (2D) micro light-emitting diode (LED), and bend a link line area by patterning and etching a glass substrate to reduce the border in the lower end portion and achieve a uniform border on all four sides.

[0006] The technical objectives of the present disclosure are not limited to the above technical problems, and other technical objectives not mentioned will be clearly understood by those skilled in the art according to the following description.

[0007] A display device according to an embodiment of the present disclosure may include: a first substrate including a display area and a non-display area, the non-display area including a bending area; a second substrate disposed on the display area of the first substrate and facing the first substrate with a specific gap; a dummy substrate disposed to face the lower portion of the first substrate, having a bending area of the non-display area between the dummy substrate and the first substrate; an anti-etching member disposed on the first substrate and the dummy substrate to overlap with the non-display area; and a link line unit formed on the anti-etching member.

[0008] A display device according to another embodiment of the present disclosure may include: a first glass substrate including a display area and a non-display area, the non-display area including a curved area; a second glass substrate disposed on the display area of the first glass substrate and facing the first glass substrate with a specific gap; a liquid crystal layer disposed on the rear surface of the first glass substrate; a dummy glass substrate disposed to face the lower portion of the first glass substrate, with the curved area of the non-display area between the dummy substrate and the first substrate; an anti-etching member disposed on the first glass substrate and the dummy glass substrate to overlap with the non-display area; a link line unit formed on the anti-etching member; and a curved portion formed on the rear surfaces of the first glass substrate and the dummy glass substrate under the anti-etching member.

[0009] A display device according to another embodiment of the present disclosure may include: a first glass substrate including a display area and a non-display area, the non-display area including a curved area; a second glass substrate disposed on the display area of the first glass substrate and facing the first glass substrate with a specific gap; a liquid crystal layer disposed on the lower side of the first glass substrate, with the curved area of the non-display area between the lower side of the first glass substrate and the liquid crystal layer; a dummy glass substrate disposed on the rear surface of the first glass substrate and the side surface of the dummy glass substrate; an anti-etching member disposed on the first glass substrate and the dummy glass substrate to overlap with the non-display area; a link line unit formed on the anti-etching member; and a curved portion formed on the rear surfaces of the first glass substrate and the dummy glass substrate under the anti-etching member.

[0010] A display device according to another embodiment of the present disclosure may include: a thin film transistor array substrate including a display area and a non-display area, the non-display area including a curved area; a color filter array substrate disposed on the display area of the thin film transistor array substrate and facing the thin film transistor array substrate with a specific gap; a liquid crystal layer disposed between the thin film transistor array substrate and the color filter array substrate; a dummy glass substrate bent from the thin film transistor array substrate across the curved area of the non-display area and disposed under the color filter array substrate; a light source unit disposed on the rear surfaces of the color filter array substrate and the dummy glass substrate to overlap with the non-display area; a link line unit disposed on the anti-etching member; and a curved portion formed on the rear surfaces of the thin film transistor array substrate and the dummy glass substrate under the anti-etching member.

[0011] It should be understood that the foregoing general description and the following detailed description are both exemplary and explanatory and are intended to provide further explanation of the claimed inventive concept. Description of the Drawings

[0012] By describing in detail exemplary embodiments of the present disclosure with reference to the accompanying drawings, the above and other objects, features, and advantages of the present disclosure will become more apparent to those of ordinary skill in the art, where:

[0013] Figure 1 is a schematic block diagram of a display device according to an embodiment of the present disclosure;

[0014] Figure 2 is a perspective view of a display device according to an embodiment of the present disclosure;

[0015] Figure 3 is along Figure 2 a cross-sectional view taken along line I-I' in

[0016] Figure 4 is along Figure 2 a cross-sectional view taken along line II-II' in

[0017] Figure 5 is a perspective view of a bent display device according to an embodiment of the present disclosure;

[0018] Figure 6 is along Figure 5 a cross-sectional view taken along line III-III' in

[0019] Figure 7 is a plan view of a display device according to an embodiment of the present disclosure;

[0020] Figure 8 is along Figure 7 a cross-sectional view taken along line IV-IV' in

[0021] Figure 9 is along Figure 7 a cross-sectional view taken along line V-V' in

[0022] Figure 10 is a plan view of a bent region of an example of a link line unit of a display device according to an embodiment of the present disclosure;

[0023] Figure 11 is Figure 10 an enlarged view of part A in

[0024] Figure 12 is a plan view of a bent region of another example of a link line unit of a display device according to an embodiment of the present disclosure;

[0025] Figure 13 is a plan view of a bent region of yet another example of a link line unit of a display device according to an embodiment of the present disclosure;

[0026] Figure 14Cross-sectional view of a bending region of a display device according to an embodiment of the present disclosure;

[0027] Figure 15 is Figure 14 an enlarged view of part B in

[0028] Figure 16 Cross-sectional view of a display device according to another embodiment of the present disclosure;

[0029] Figure 17 Cross-sectional view of a display device according to still another embodiment of the present disclosure; and

[0030] Figure 18 Cross-sectional view of a display device according to still another embodiment of the present disclosure.

[0031] Throughout the drawings and the detailed description, unless otherwise specified, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustration, and convenience, the relative dimensions and depictions of these elements may be exaggerated. Detailed Description of Embodiments

[0032] Advantages and features of the present disclosure and methods for achieving them will become apparent with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the embodiments to be described below and can be implemented in different forms. These embodiments are provided only to fully disclose the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art, and the present disclosure is defined by the disclosed claims.

[0033] Since the shapes, sizes, ratios, angles, quantities, etc. disclosed in the drawings for describing the embodiments of the present disclosure are merely exemplary, the present disclosure is not limited to the items shown. In addition, when describing the present disclosure, the detailed description of related known technologies will be omitted when it may unnecessarily obscure the gist of the present disclosure.

[0034] When using terms such as "including", "having", "consisting of", etc. mentioned in the present disclosure, other parts may be added unless "only" is used. The case of expressing components in the singular form includes the plural form unless otherwise clearly stated.

[0035] When interpreting components, it can be understood that an error range is included even without a separate explicit description.

[0036] When describing positional relationships, for example, when the positional relationship between two parts is described as "on", "upper", "lower", "adjacent to", etc., one or more other parts may be located between the two parts unless "immediately" or "directly" is used.

[0037] When an element or layer is described as being on another element or layer, it includes both the case where the element or layer is directly on the other element or layer and the case where yet another layer or element is interposed between the element and the other element.

[0038] In addition, although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Thus, the first component mentioned below may also be the second component within the technical concept of the present disclosure.

[0039] Throughout the specification, the same reference numerals denote the same components.

[0040] The dimensions and thicknesses of each component shown in the drawings are shown for convenience of description and do not necessarily limit the dimensions and thicknesses of the components shown in the present disclosure.

[0041] The features of the various embodiments of the present disclosure may be partially or entirely coupled or combined with each other, and technically, various linkages and operations are possible, and these embodiments may be implemented independently of each other or in a related relationship together.

[0042] Hereinafter, an organic light-emitting display device according to an embodiment of the present disclosure will be described with reference to the drawings.

[0043] In the following description, when it is determined that a detailed description of a well-known function or configuration may unnecessarily obscure the principles of the present disclosure, its detailed description will be omitted or briefly described.

[0044] Figure 1 is a schematic block diagram of a display device according to an embodiment of the present disclosure, Figure 2 is a perspective view of a display device according to an embodiment of the present disclosure, Figure 3 is along Figure 2 a cross-sectional view taken along line I-I' in Figure 4 is along Figure 2 a cross-sectional view taken along line II-II' in

[0045] A liquid crystal display device (LCD), a plasma display panel device (PDP), a field emission display device (FED), an electroluminescent display device (ELD), an organic light-emitting diode (OLED) display device, etc. may be used as the display device of the present disclosure, but in the present disclosure, a liquid crystal display device using a backlight unit or a micro light-emitting diode (LED) as a light source will be used as an example among these display devices. However, the present disclosure is not limited thereto.

[0046] The display device 10 according to the present disclosure includes a first glass substrate 110, a second glass substrate 210, and a light source unit 260. The first glass substrate 110 is an array substrate including thin film transistors, gate lines, data lines, and pixel electrodes. The second glass substrate 210 is a color filter substrate including a color filter layer (not shown, Figure 2 230 in it), and a liquid crystal layer 250 is filled between the two substrates 110 and 210. The light source unit 260 is disposed below the first glass substrate 110 to emit light upward to the upper part of the first glass substrate 110.

[0047] In addition, referring to Figures 1 to 4 , the display device 10 according to an embodiment of the present disclosure includes a display area DA and a non-display area NDA including a curved area BA, and includes a first glass substrate 110, a second glass substrate 210, and a dummy glass substrate 120. The first glass substrate 110 and the second glass substrate 210 are disposed to face each other vertically with a specific gap in the display area DA, and the dummy glass substrate 120 is disposed to face the lower surface of the first glass substrate 110, and there is a curved area BA between the dummy glass substrate 120 and the lower surface of the first glass substrate 110.

[0048] The first glass substrate 110, the second glass substrate 210, and the dummy glass substrate 120 may include a glass material. According to an example, the first glass substrate 110 and the dummy glass substrate 120 may have a thickness of 0.01 mm to 1.0 mm to maintain the flatness of the first flat surface 110a and the second flat surface 120a or to prevent moisture or oxygen from penetrating into the display device. However, the thickness of the first glass substrate 110 and the dummy glass substrate 120 is not limited thereto, and may be changed according to the design conditions of the display device.

[0049] The display area DA is an area for displaying an image and may include a plurality of pixels. The display area DA may be supported by the first flat surface 110a of the first glass substrate 110.

[0050] The display area DA may include a plurality of pixels. The plurality of pixels may be arranged in a matrix form, and each of the plurality of pixels may include sub-pixels. The display area DA may have a substantially rectangular shape. In addition, the embodiments of the present disclosure are not limited thereto, and the display area DA may have an arbitrary polygonal shape. Additionally, for example, according to the shape of the display device, the display area DA may have a triangular, pentagonal, or hexagonal shape. In the present disclosure, for ease of description, the display area DA having a rectangular shape will be described below according to the display device 10 having a rectangular shape.

[0051] The non-display area NDA is an area surrounding the display area DA, and elements and circuit lines for driving the display area DA may be disposed therein.

[0052] The bending region BA may be defined as a region where a part of the display device 10 is bent. Thus, the display device 10 according to an example of the present disclosure may be folded into a specific radius of curvature according to the bending of the bending region BA.

[0053] The display device 10 according to an example of the present disclosure may be defined as a flat region FA, a bending region BA, and a rear surface flat region RFA. Since the bending region BA is the same as described above, its description will be omitted.

[0054] The flat region FA may be defined as a region overlapping with the first flat surface 110a of the first glass substrate 110. In addition, the flat region FA may be a region overlapping with the display region DA and including a specific non-display region NDA surrounding the display region DA.

[0055] The rear surface flat region RFA may be defined as a region overlapping with the second flat surface 120a of the dummy glass substrate 120 and not overlapping with the bending region BA. The driving circuit unit 160 and the printed circuit board (PCB) 164 may be disposed in the rear surface flat region RFA.

[0056] The display device 10 according to an embodiment of the present disclosure includes a first glass substrate 110 disposed in the display region DA, a dummy glass substrate 120 disposed in the non-display region NDA, an anti-etching member 140 disposed to overlap with the bending region BA, and a link line unit 150 formed on the anti-etching member 140 to overlap with the non-display region NDA.

[0057] The first glass substrate 110 may include a first etched surface 110b disposed to overlap with the bending region BA. Here, the fact that the first etched surface 110b overlaps with the bending region BA may mean that the first etched surface 110b faces the rear surface of the anti-etching member 140 overlapping with the bending region BA. In addition, when the bending region BA of the display device does not include the first etched surface 110b, since the display device has a structure that may not be bent, the bending region BA of the display device may be defined as overlapping with the first etched surface 110b.

[0058] In addition, the first glass substrate 110 may include a first flat surface 110a and a first etched surface 110b disposed on one side of the first flat surface 110a, and further include a first rear surface 110c facing the first flat surface 110a.

[0059] In addition, in the first glass substrate 110, a first end E1 and a second end E2 can be defined. The first end E1 is the boundary between the first flat surface 110a and the first etched surface 110b, and the second end E2 is the boundary between the first etched surface 110b and the first rear surface 110c.

[0060] The slope of the first etched surface 110b can be defined by an inclined surface connecting the first end E1 and the second end E2. Refer to Figure 2 and Figure 3 , the first etched surface 110b is shown as having a convex curved surface, but embodiments of the present disclosure are not limited thereto.

[0061] The dummy glass substrate 120 can include a second etched surface 120b, which is arranged to overlap with the bending region BA. Here, the fact that the second etched surface 120b overlaps with the bending region BA can indicate that the second etched surface 120b faces the rear surface of the dummy glass substrate 120 that overlaps with the second etched surface 120b. In addition, when the bending region BA of the display device 10 does not include the second etched surface 120b, since the display device 10 has a structure that can be not bent, the bending region BA of the display device 10 can be defined as overlapping with the second etched surface 120b.

[0062] The dummy glass substrate 120 can include a second flat surface 120a and a second etched surface 120b provided on one side of the second flat surface 120a, and further includes a second rear surface 120c facing the second flat surface 120a.

[0063] When the first etched surface 110b of the first glass substrate 110 and the second etched surface 120b of the dummy glass substrate 120 are formed as shown in Figure 2 , it can be referred to as having an inverted conical shape or an undercut structure. Here, when assuming that the first end E1 and the third end E3 correspond to the opening pattern for etching, the inverted conical shape can mean that the interval between the second end E2 and the fourth end E4 is wider than the opening pattern.

[0064] The anti-etching member 140 can be arranged to overlap with the bending region BA. For example, the anti-etching member 140 can be arranged to overlap only with the bending region BA.

[0065] When performing the etching process required for preparing the first glass substrate 110 and the dummy glass substrate 120 according to an embodiment of the present disclosure, the anti-etching member 140 can be a structure for preventing or reducing damage caused by etching of the display device where the first etched surface 110b and the second etched surface 120b overlap. Therefore, the anti-etching member 140 can be arranged to overlap with the bending region BA of the display device.

[0066] In addition, the anti-etching member 140 may overlap with the bending region BA, overlap with the first flat surface 110a of the first glass substrate 110 extending to one side of the bending region BA, and overlap with the second flat surface 120a of the dummy glass substrate 120 extending to the other side of the bending region BA.

[0067] Here, the anti-etching member 140 may be made of an organic material, specifically, a material resistant to glass etchant. For example, an etchant including nitric acid (HNO3) or hydrofluoric acid (HF) can be used as the etchant for glass etching. The anti-etching member 140 may be made of a metal or an organic material.

[0068] The anti-etching member 140 may include at least one of silicone-based organic materials, urethane, polyimide, and photoacrylic. Alternatively, the anti-etching member 140 may include at least one of chromium (Cr), aluminum (Al), platinum (Pt), gold (Ag), and nickel (Ni).

[0069] The anti-etching member 140 is provided to protect the structure located on the anti-etching member 140 during the process of forming the first etched surface 110b of the first glass substrate 110 and the second etched surface 120b of the dummy glass substrate 120, and the anti-etching member 140 may have a size wider than the region where the first etched surface 110b of the first glass substrate 110 and the second etched surface 120b of the dummy glass substrate 120 overlap, or may have a size wider than the bending region BA.

[0070] The anti-etching member 140 according to an embodiment of the present disclosure can prevent or reduce damage to the display device by the etchant used in the glass etching process for forming the first etched surface 110b of the first glass substrate 110 and the second etched surface 120b of the dummy glass substrate 120. The anti-etching member 140 may be made of a material having corrosion resistance (or tolerance) to the etchant used in the glass etching process.

[0071] According to an embodiment of the present disclosure, the anti-etching member 140 can be prepared by mechanically spraying a material at a set position, such as by a slit coater, inkjet, or dispenser, or can be prepared by a patterning process using a photolithography mask.

[0072] Therefore, since the display device 10 according to an embodiment of the present disclosure includes the anti-etching member 140 disposed between the first etched surface 110b of the first glass substrate 110 and the second etched surface 120b of the dummy glass substrate 120 and overlapping with the bending region BA and the link line unit 150, damage to the display device 10 caused by the glass etching process for forming the first etched surface 110b of the first glass substrate 110 and the second etched surface 120b of the dummy glass substrate 120 can be prevented.

[0073] The anti-etching member 140 can be defined as an etch stop pattern, an etch barrier pattern, an etch mask pattern, etc.

[0074] In addition, considering the process margin generated due to etching in the process of forming the first etched surface 110b of the first glass substrate 110 and the second etched surface 120b of the dummy glass substrate 120, the anti-etching member 140 can be formed to overlap with the regions extending to one side and the other side of the bending region BA. Specifically, the anti-etching member 140 can be formed to overlap a specific area of the first flat surface 110a of the first glass substrate 110 and the second flat surface 120a of the dummy glass substrate 120. When the anti-etching member 140 is formed to extend to one side and the other side of the bending region BA, the stability of the etching process for forming the first etched surface 110b of the first glass substrate 110 and the second etched surface 120b of the dummy glass substrate 120 can be improved.

[0075] In addition, as another example of the anti-etching member 140 of the present disclosure, in order to enhance the adhesion to the glass substrate and supplement the thickness, an inorganic film or a stacked structure of an inorganic film and a metal film can be further formed between the lower part of the anti-etching member 140 in the bending region BA of the non-display area NDA of the first glass substrate 110 and the first glass substrate 110, and between the lower part of the anti-etching member 140 and the dummy glass substrate 120. In this case, when forming a thin film transistor, the gate insulating film or the interlayer insulating film can be used as the inorganic film. For example, the inorganic film can include SiO2, SiN x , a-Si, etc. In addition, the metal layer for forming the gate or the source / drain can be used as the metal film. For example, the metal film can include molybdenum (Mo), MoTi, ITO, etc.

[0076] Figure 5 is a perspective view of the bending of a display device according to an embodiment of the present disclosure, Figure 6 is along Figure 5 The cross-sectional view taken along line III-III' in

[0077] Referring to Figure 5 , in the display device 10 according to an embodiment of the present disclosure, the light source unit 260 is disposed on the rear surface of the first glass substrate 110 located in the display area DA. A two-dimensional (2D) micro LED (μ-LED) can be used as the light source unit 260. In the present embodiment, the case where the 2D micro LED is used as the light source will be described as an example. However, the present disclosure is not limited thereto, and other light sources can also be applied.

[0078] Here, the front surface of the light source unit 260 can be arranged to be in contact with the rear surface 110c of the first glass substrate 110.

[0079] In addition, the rear surface of the light source unit 260 may be disposed in contact with the rear surface 120c of the curved dummy glass substrate 120.

[0080] In addition, in the display device 10 according to an embodiment of the present disclosure, since the bending region BA is bent, the first rear surface 110c of the first glass substrate 110, the front surface of the light source unit 260, and the second rear surface 120c of the dummy glass substrate 120 are arranged to face each other.

[0081] The contact portion of the first rear surface 110c of the first glass substrate 110 with the front surface of the light source unit 260 and the second rear surface 120c of the dummy glass substrate 120 may further include an adhesive member (not shown) for fixing the light source unit 260 and the dummy glass substrate 120 to the first glass substrate 110.

[0082] The adhesive member (not shown) may be an optically clear adhesive (OCA), an optically clear resin (OCR), a pressure sensitive adhesive (PSA), or a double-sided tape, but is not limited thereto.

[0083] The display area DA of the first glass substrate 110 may include a first flat surface 110a and a first etched surface 110b formed on one side of the first flat surface 110a, and further includes a first rear surface 110c facing the first flat surface 110a.

[0084] The first flat surface 110a of the first glass substrate 110 may overlap with the display area DA and the flat area FA of the display device 10.

[0085] The first etched surface 110b of the first glass substrate 110 may be formed to overlap with the anti-etching member 140.

[0086] The first etched surface 110b may be formed in the remaining portion of the upper surface of the first glass substrate 110 except for the first flat surface 110a that overlaps with the bending region BA of the display area DA and the non-display area NDA. According to the present disclosure, by performing an etching process on the first glass substrate 110 having a flat plate shape and removing (or etching) a part of the first flat surface 110a, the first etched surface 110b can be formed into a streamlined and convex cross-sectional shape while having a non-flat structure. In addition, the first etched surface 110b may be provided with a surface continuous with the first flat surface 110a.

[0087] The first etched surface 110b of the first glass substrate 110 and the second etched surface 120b of the second glass substrate 210 may have an inverted conical shape and a curved surface.

[0088] Hereinafter, reference will be made toFigures 7 to 9 Describe the detailed structure of the bent etching portion formed in the bent region BA of the non-display region NDA of the first glass substrate 110.

[0089] Meanwhile, a description of a display device according to an embodiment of the present disclosure is as follows. The display device according to the present embodiment will be described focusing on a liquid crystal display device.

[0090] Refer to Figure 5 and Figure 6 As shown in FIGS. and, a display device 10 according to an embodiment of the present disclosure includes: a first glass substrate 110 including a display region DA and a non-display region NDA including a bent region BA; a second glass substrate 210 disposed in the first glass substrate 110 in the display region DA to face the first glass substrate 110 with a specific cell gap; a liquid crystal layer 250 disposed between the first glass substrate 110 and the second glass substrate 210; a dummy glass substrate 120 bent and disposed below the first glass substrate 110 and having a bent region BA between the first glass substrate 110 and the second glass substrate 210; and a light source unit 260 disposed between the first glass substrate 110 and the dummy glass substrate 120.

[0091] Although not shown in the figures, a thin film transistor (TFT) 130 including a gate, an ohmic contact layer, a source, and a drain is formed on the first flat surface 110a of the first glass substrate 110 constituting the display region DA of the display device 10 according to the present embodiment.

[0092] An interlayer insulating film or a planarization layer 132 is formed on the front surface of the first flat surface 110a including the thin film transistor 130, and a pixel electrode 134 electrically connected to the thin film transistor 130 through a drain contact hole (not shown) is formed on the planarization layer 132.

[0093] A first alignment film 136 may be formed on the pixel electrode 134 to promote the alignment of liquid crystals.

[0094] In addition, a black matrix 220 is formed on the second glass substrate 210 at a specific interval, and the second glass substrate 210 is disposed to correspond to the first glass substrate 110 in the display region DA with a specific cell gap.

[0095] The black matrix 220 may have a closed-loop shape surrounding the display region DA to block light leakage. In addition, the black matrix 220 may also correspond to regions corresponding to the thin film transistor 130, a gate line (not shown), and a data line of the first glass substrate 110 to block light leakage. Additionally, the black matrix 220 is disposed between the color filter layers 230 to prevent or reduce color mixing between the color filter layers 230.

[0096] A red (R), green (G), and blue (B) color filter layer 230 that can provide light filtering only within a specific wavelength range can be provided between the black matrix 220. The color filter layer 230 may include an acrylic resin and a pigment. The color filter layer 230 can be divided into red (R), green (G), and blue (B) according to the type of pigment that realizes the color.

[0097] In addition, an overcoat layer (not shown) can be further formed on the black matrix 220 and the color filter layer 230. The overcoat layer (not shown) can be provided to protect the color filter layer 230, flatten the surface, and improve adhesion to the common electrode 240, and the overcoat layer can be composed of an acrylic resin.

[0098] The common electrode 240 can be provided on the overcoat layer (not shown). The common electrode 240 can be formed of a transparent conductive material. For example, the common electrode 240 can be composed of indium tin oxide (ITO) or indium zinc oxide (IZO).

[0099] The second alignment layer 242 can be formed on the common electrode 240 to promote the alignment of liquid crystals.

[0100] In addition, although not shown in the drawings, spacers (not shown) for maintaining a specific cell gap can be additionally formed between the first glass substrate 110 and the second glass substrate 210.

[0101] In addition, since the sealant line 270 is provided in the non-display area NDA of the first glass substrate 110 and the second glass substrate 210, the first glass substrate 110 and the second glass substrate 210 are joined by the sealant line 270.

[0102] The sealant line 270 can be provided on the planarization layer 132 to be spaced apart from the first alignment layer 136, and can be provided to face the planarization layer 132 and the black matrix 220. The sealant line 270 can be composed of a sealant. For example, the sealant can be a photo-curable epoxy resin or a thermo-curable epoxy resin. The sealant line 270 forms a gap for liquid crystal injection and is used to prevent or reduce leakage of the injected liquid crystal. The sealant line 270 is formed by forming a thermo-curable resin in a specific pattern on the first glass substrate 110, then setting the second glass substrate 210 on the first glass substrate 110 and pressing and curing the first glass substrate 110 and the second glass substrate 210 to join the two substrates 110 and 210.

[0103] The liquid crystal layer 250 can be provided in the region between the first glass substrate 110 and the second glass substrate 210 that forms a specific cell gap. The liquid crystal layer 250 can include liquid crystals having optical anisotropic properties.

[0104] Although not shown in the drawings, in the display device 10 according to an embodiment of the present disclosure, a voltage is applied to the pixel electrode 134 through the drain, and a voltage is applied to the common electrode 240 by driving the liquid crystal cell to display an image.

[0105] Figure 7 is a plan view of a display device according to an embodiment of the present disclosure, Figure 8 is along Figure 7 a cross-sectional view taken along line IV-IV' in Figure 9 is along Figure 7 a cross-sectional view taken along line V-V' in

[0106] Referring to Figures 7 to 9 , the non-display areas NDA of the first glass substrate 110 and the dummy glass substrate 120 include a bending area BA and a driving circuit area DCA. The bending area BA is provided at the first glass substrate 110 and the dummy glass substrate 120. In addition, a plurality of link line units 150 forming unit blocks are located in the bending area BA at regular intervals.

[0107] The driving circuit area DCA is located at the dummy glass substrate 120. In the driving circuit area DCA, a driving circuit unit 160 connected to a plurality of link line units 150 forming unit blocks and a plurality of flexible printed circuits (FPCs) 162 connected to the driving circuit unit 160 are arranged. The plurality of link line units 150 are respectively connected to an external printed circuit board (PCB) 164 through a plurality of FPCs 162 serving as flexible films.

[0108] The PCB 164 is formed with a plurality of components (such as integrated circuits provided on the first glass substrate 110), and generates various control signals, data signals, etc. for driving the display device 10.

[0109] The bending area BA of the non-display areas NDA of the first glass substrate 110 and the dummy glass substrate 120 is positioned to overlap with the link line units 150. A bending etching portion 125 is formed on the lower surfaces of the first glass substrate 110 and the dummy glass substrate 120, and its position overlaps with the bending area BA. The bending etching portion 125 includes a first bending etching portion 123 and a second bending etching portion 124. The bending etching portion 125 is also referred to as a bending portion.

[0110] The first bending etching portion 123 is formed longitudinally in the bending area BA of the non-display areas NDA of the first glass substrate 110 and the dummy glass substrate 120. The first bending etching portion 123 includes a first etching surface 110b formed on the lower surface of the first glass substrate 110 and a second etching surface 120b formed on the lower surface of the dummy glass substrate 120.

[0111] In addition, the second bent etching portion 124 is positioned to overlap with the driving circuit area DCA located at the dummy glass substrate 120, and is formed on the lower surface of the dummy glass substrate 120 between the link line units 150 forming the unit blocks. The second bent etching portion 124 is formed perpendicular to the first bent etching portion 123 to have a surface continuous with the first bent etching portion 123. In addition, the second bent etching portion 124 is formed in each area between the link line units 150 forming the unit blocks.

[0112] The second bent etching portion 124 includes a third etching surface 120d and a fourth etching surface 120e formed on the lower surface of the dummy glass substrate 120. The second bent etching portion 124 is located in the driving circuit area DCA between the plurality of FPCs 162, and thus does not overlap with the link line units 150 forming the unit blocks.

[0113] In addition, the first bent etching portion 123 and the second bent etching portion 124 are integrally formed to have a continuous surface and are connected to each other.

[0114] The anti-etching member 140 is formed on at least the bent area BA and the driving circuit area DCA that overlap with the first bent etching portion 123 and the second bent etching portion 124. A plurality of link line units 150 are formed on the anti-etching member 140. In addition, a part of the planarization layer 132 formed on the display area DA is formed to extend from above the plurality of link line units 150.

[0115] In addition, the first outer coating layer 172 is formed below the anti-etching member 140 and overlaps with the first bent etching portion 123 and the second bent etching portion 124.

[0116] In addition, the second outer coating layer 174 is formed on the planarization layer 132, and the planarization layer 132 is formed on the anti-etching member 140 and overlaps with the first bent etching portion 123 and the second bent etching portion 124. The second outer coating layer 174 can be formed to cover the sealing line (not shown, Figure 6 in 270) or surround the side surface.

[0117] The first outer coating layer (microcoating) 172 and the second outer coating layer (microcoating) 174 can be formed on the first glass substrate 110, the dummy glass substrate 120, the link line units 150, and the anti-etching member 140 in the bent area BA and the rear surface flat area RFA.

[0118] When the first glass substrate 110 and the dummy glass substrate 120 are bent, since cracks may be generated due to the tensile force acting on the link line unit 150 provided on the anti-etching member 140, the first outer layer 172 and the second outer layer 174 can be used to protect the line by forming a resin with a thin thickness at the bending position. The first outer layer 172 and the second outer layer 174 can be made of an acrylic material such as an acrylate polymer.

[0119] The first outer layer 172 and the second outer layer 174 can adjust the neutral plane of the bending region BA. When the structure is bent, the neutral plane can refer to a virtual surface that does not receive stress because the compressive force and the tensile force applied to the structure cancel each other out. When two or more structures are stacked, a virtual neutral plane can be formed between the structures.

[0120] When the structure is completely bent in one direction, with respect to the neutral plane, the structure provided in the bending direction is bent and compressed and thus receives a compressive force. On the other hand, the structure provided in the direction opposite to the bending direction with respect to the neutral plane elongates by bending, thereby receiving a tensile force. In addition, since the structure is more likely to be damaged when receiving a tensile force among the same compressive force and tensile force, the possibility of cracks occurring when receiving a tensile force is higher.

[0121] The anti-etching member 140 provided below the neutral plane is compressed, so that it can receive a compressive force. The link line unit 150 provided above can receive a tensile force, and cracks may occur due to this tensile force. Therefore, in order to reduce or minimize the tensile force on the line, the line can be located on the neutral plane.

[0122] When the first outer layer 172 and the second outer layer 174 are provided on the bending region BA and the driving circuit region DCA, the neutral plane can rise. Since the line is formed at the same position as the neutral plane or at a position higher than the neutral plane, and thus does not receive stress or receives a compressive force during bending, the occurrence of cracks can be suppressed.

[0123] In addition, the driving circuit unit (D-IC) 160 is electrically connected to a plurality of link line units 150. The driving circuit unit 160 is connected in a one-to-one contact manner with the plurality of link line units 150 through a plurality of link line contact holes 132a formed in the planarization layer 132.

[0124] Figure 10 is a plan view of a bending region that is an example of a link line unit of a display device according to an embodiment of the present disclosure, and Figure 11 is Figure 10 an enlarged view of part A in

[0125] Refer to Figure 10 and Figure 11, in the display device 10 according to an embodiment of the present disclosure, the non-display area NDA of the first glass substrate 110 and the dummy glass substrate 120 includes a bending area BA and a driving circuit area DCA. The bending area BA overlaps with the first glass substrate 110 and the dummy glass substrate 120. In addition, the driving circuit area DCA overlaps with the dummy glass substrate 120 and partially overlaps with the driving circuit unit 160 and the FPC 162.

[0126] A plurality of link line units 150 arranged in the non-display area NDA form a plurality of blocks in one block unit, and these blocks are arranged at regular intervals.

[0127] In addition, the plurality of blocks are respectively connected to the plurality of driving circuit units 160, and the plurality of driving circuit units 160 are respectively connected to the plurality of FPCs 162.

[0128] The plurality of link line units 150 connected to the plurality of driving circuit units (D-IC) 160 are respectively connected to an external printed circuit board (PCB) 164 through a flexible printed circuit (FPC) 162.

[0129] The bending etching portion 125 includes a first bending etching portion 123 and a second bending etching portion 124. The first bending etching portion 123 is formed on the lower surfaces of the first glass substrate 110 and the dummy glass substrate 120 and overlaps with the bending area BA. The second bending etching portion 124 is formed on the lower surface of the dummy glass substrate 120. Here, the bending etching portion 125 is also referred to as a bending portion.

[0130] The first bending etching portion 123 overlaps with the plurality of link line units 150, while the second bending etching portion 124 does not overlap with the plurality of link line units 150.

[0131] In addition, the second bending etching portion 124 is formed on the lower surface of the dummy glass substrate 120 in a region located between the plurality of link line units 150 forming each unit block.

[0132] Figure 12 It is a plan view of a bending area which is another example of a link line unit of a display device according to an embodiment of the present disclosure.

[0133] Refer to Figure 12 , in another example of the non-display area NDA of the display device 10 according to the present disclosure, the non-display area NDA of the first glass substrate 110 and the dummy glass substrate 120 includes a bending area BA and a driving circuit area DCA. The bending area BA overlaps with the first glass substrate 110 and the dummy glass substrate 120. In addition, the driving circuit area DCA overlaps with the dummy glass substrate 120 and partially overlaps with the driving circuit unit 160 and the FPC162.

[0134] Two driving circuit units 160 connected to a plurality of link line units 150 disposed in a non-display area NDA are defined as one unit block. The driving circuit units 160 of the two blocks are disposed at a specific interval.

[0135] In addition, the plurality of driving circuit units 160 are respectively connected to a plurality of FPC units 162.

[0136] The plurality of link line units 150 connected to the plurality of driving circuit units (D-IC) 160 are respectively connected to an external printed circuit board (PCB) 164 through flexible printed circuits (FPC) 162.

[0137] The bent etching portion 125 includes a first bent etching portion 123 and a second bent etching portion 124. The first bent etching portion 123 is formed on the lower surfaces of the first glass substrate 110 and the dummy glass substrate 120 and overlaps with the bending region BA. The second bent etching portion 124 is formed on the lower surface of the dummy glass substrate 120.

[0138] The first bent etching portion 123 overlaps with the plurality of link line units 150, while the second bent etching portion 124 does not overlap with the plurality of link line units 150.

[0139] In addition, the second bent etching portion 124 is formed on the lower surface of the dummy glass substrate 120 in a region located between the two driving circuit units 160 forming each unit block.

[0140] Specifically, one end of the link line unit 150 extending from the display area DA to the non-display area NDA can be set asymmetrically, and the other end of the link line unit 150 connected to the driving circuit unit 160 can be set symmetrically. That is, the line length of the outermost link line unit 150 extending from the display area DA to the non-display area NDA can be set to be longer than the line lengths of other adjacent link line units 150.

[0141] Therefore, in another example of the present disclosure, when two driving circuit units 160 are designed as one block and the second bent etching portion is formed in the region between these blocks, since the etching area is further ensured compared with the case where one driving circuit unit 160 is designed as a unit block, the etching margin can be correspondingly guaranteed when forming the bent etching portion.

[0142] Figure 13 It is a plan view of a bending region which is another example of a link line unit of a display device according to an embodiment of the present disclosure.

[0143] Refer to Figure 13, in yet another example of the non-display area NDA of the display device 10 according to the present disclosure, one end of the link line unit 150 extending from the display area DA to the non-display area NDA may be asymmetrically arranged, and the other end of the link line unit 150 connected to the driving circuit unit 160 may also be asymmetrically arranged. That is, the line length of the outermost link line unit 150a extending from the display area DA to the non-display area NDA may be set to be longer than the line lengths of other adjacent link line units 150b. In addition, the line lengths of the link line units 150b adjacent to each other in the block connected to the driving circuit unit 160 may be set to be longer than the line length of the outermost link line unit 150a of the block connected to the driving circuit unit 160.

[0144] Therefore, in order to ensure the etching margin between the FPCs 162, since the link line unit 150 is asymmetrically designed and arranged, the line resistance can be compensated, and the coupling interval between the driving circuit unit 160 and the FPC 162 can be surely maintained.

[0145] In addition, by adjusting the widths and lengths of the link lines on the bending area BA (i.e., the link lines close to the display area DA) and the link lines under the bending area BA (i.e., the link lines close to the driving circuit unit 160), the line resistance can be surely adjusted.

[0146] Therefore, since the line length of the link line adjacent to the second bending etching part 124 is shorter than the line length of the link line arranged away from the second bending etching part 124, the line resistance can be reduced.

[0147] Figure 14 is a cross-sectional view of a bending area of a display device according to an embodiment of the present disclosure, Figure 15 is Figure 14 an enlarged view of part B in

[0148] Referring to Figure 14 and Figure 15 , the first overcoat layer 172 is formed on the first bending etching part 123 and the second bending etching part 124. The first bending etching part 123 is formed in the bending area BA located at the lower surfaces of the first glass substrate 110 and the dummy glass substrate 120. The first glass substrate 110 and the dummy glass substrate 120 are overlapped in the non-display area NDA. The second bending etching part 124 is formed in the driving circuit area DCA of the dummy glass substrate 120.

[0149] In addition, a second overcoat layer 174 surrounding or covering the sealing line 270 may be formed on the non-display area NDA. The anti-etching member 140, the link line unit 150, and the planarization layer 132 may be formed under the second overcoat layer 174. The anti-etching member 140 may be composed of a transparent organic film. In addition, the transparent organic film used as the organic film may also be used as the alignment film.

[0150] In addition, since the first overcoat layer and the second overcoat layer are respectively formed under and above the non-display area of the first glass substrate that overlaps with the upper and lower portions of the bending etching part, the lines can be protected when the display device is bent.

[0151] Next, reference will be made to Figure 16 describe a display device according to another embodiment of the present disclosure.

[0152] Figure 16 is a cross-sectional view of a display device according to another embodiment of the present disclosure.

[0153] In another embodiment of the present disclosure, the case of using a 2D micro-LED as a light source will be described as an example. However, the present disclosure is not limited thereto, and other light sources may also be applied. The display device according to another embodiment of the present disclosure will be described focusing on a liquid crystal display device.

[0154] Refer to Figure 16 , a display device 20 according to another embodiment of the present disclosure includes a first glass substrate 310 and a second glass substrate 410. The first glass substrate 310 includes a display area DA and a non-display area NDA. The non-display area NDA includes a bending area BA. The second glass substrate 410 is disposed on the first glass substrate 310 in the display area DA and faces the first glass substrate 310 with a specific cell gap.

[0155] The dummy glass substrate 320 is bent from the first glass substrate 310 and is located on the lower side of the first glass substrate 310, and there is a bending area BA of the non-display area NDA between the dummy glass substrate 320 and the first glass substrate 310.

[0156] An anti-etching member 340 is formed on the first glass substrate 310 and the dummy glass substrate 320 to overlap with the bending area BA. A link line unit 350 overlapping with the bending area BA is disposed on the anti-etching member 340.

[0157] The front surface 460a of the light source unit 460 is arranged to be in contact with the rear surface 310c of the first glass substrate 310 located in the display area DA. A 2D micro-LED (μ-LED) can be applied as the light source unit 460. The present disclosure is not limited thereto, and other light sources may also be applied.

[0158] The rear surface 320c of the curved dummy glass substrate 320 is disposed in contact with the side surface 460b of the light source unit 460.

[0159] The contact portions of the rear surface 310c of the first glass substrate 310 with the side surface 460b of the light source unit 460 and the second rear surface 320c of the dummy glass substrate 320 may further include an adhesive member (not shown) for fixing the light source unit 460 and the dummy glass substrate 320 to the first glass substrate 310.

[0160] The adhesive member (not shown) may be an optically clear adhesive (OCA), an optically clear resin (OCR), a pressure sensitive adhesive (PSA), or a double-sided tape, but is not limited thereto.

[0161] The first glass substrate 310 may include a first flat surface 310a and a first etched surface 310b formed on one side of the first flat surface 310a, and further includes a first rear surface 310c facing the first flat surface 310a.

[0162] The first flat surface 310a of the first glass substrate 310 may overlap with the flat area FA of the display device 20.

[0163] A first curved etched portion 324 is formed on the rear surfaces of the first glass substrate 310 and the dummy glass substrate 320 located in the curved area BA overlapping with the anti-etching member 340. The first curved etched portion 324 includes a first etched surface 310b formed on the rear surface of the first glass substrate 310 and a second etched surface 320b formed on the rear surface of the dummy glass substrate 320.

[0164] The first etched surface 310b may be formed in the remaining portion of the upper surface of the first glass substrate 310 overlapping with the display area DA and the curved area BA except for the first flat surface 310a.

[0165] By performing an etching process on the first glass substrate 310 having a flat plate shape and removing (or etching) a part of the first flat surface 310a, the first etched surface 310b can be formed into a streamline and convex cross-sectional shape while having a non-flat structure. In addition, the first etched surface 310b may be provided with a surface continuous with the first flat surface 310a.

[0166] The first etched surface 310b of the first glass substrate 310 and the second etched surface 320b of the dummy glass substrate 320 may have an inverted conical shape and a curved surface.

[0167] In addition, although not shown in the figure, a second curved etched portion (not shown, Figure 9124) in the driving circuit region (not shown, which overlaps with the anti-etching member 340), it can be formed on the rear surface of the dummy glass substrate 320 in the DCA. In this case, the second curved etching portion can be formed to have a surface continuous with the first curved etching portion. Figure 7 In the driving circuit region DCA, a driving circuit 360 connected to a plurality of link line units 350 and a plurality of flexible printed circuits (FPCs) 362 connected to the driving circuit 360 are arranged. The plurality of link line units 350 are respectively connected to an external printed circuit board (PCB) 364 through the plurality of FPCs 362 that are flexible films. Although not shown in the figure, thin film transistors 330 including gates, ohmic contact layers, sources, and drains are formed on the first flat surface 310a of the first glass substrate 310 in the display region DA.

[0168] On the front surface of the first flat surface 310a including the thin film transistors 330, a planarization layer 332 is formed, and a pixel electrode 334 electrically connected to the thin film transistors 330 is formed on the planarization layer 332.

[0169] A first alignment film 336 can be formed on the pixel electrode 334 to promote the alignment of liquid crystals.

[0170] In addition, a black matrix 420 is formed on the second glass substrate 410 at specific intervals, and the second glass substrate 410 is arranged to correspond to the first glass substrate 310 in the display region DA at a specific cell gap.

[0171] The black matrix 420 can have a closed-loop shape surrounding the display region DA to block light leakage. In addition, the black matrix 420 can also correspond to the regions corresponding to the thin film transistors (TFTs, not shown), gate lines (not shown), and data lines of the first glass substrate 310 to block light leakage. Additionally, the black matrix 420 is disposed between the color filter layers 430 to prevent color mixing between the color filter layers 430.

[0172] Red (R), green (G), and blue (B) color filter layers 430 that only filter light within a specific wavelength range can be provided between the black matrices 420. The color filter layers 430 can include an acrylic resin and pigments. The color filter layers 430 can be classified into red (R), green (G), and blue (B) according to the type of pigments that achieve the colors.

[0173] In addition, an overcoat layer (not shown) can be further formed on the black matrix 420 and the color filter layers 430. The overcoat layer (not shown) can be provided to protect the color filter layers 430, flatten the surface, and improve the adhesion to the common electrode, and the overcoat layer can be composed of an acrylic-based resin.

[0174]

[0175] ​A common electrode 440 may be provided on the outer cladding layer. The common electrode 440 may be formed of a transparent conductive material. For example, the common electrode 440 may be composed of indium tin oxide (ITO) or indium zinc oxide (IZO).

[0176] A second alignment film 442 is formed on the common electrode 440 to promote the alignment of liquid crystals.

[0177] In addition, although not shown in the drawings, spacers (not shown) for maintaining a specific cell gap may be additionally formed between the first glass substrate 310 and the second glass substrate 410.

[0178] In addition, since the sealing line 470 is provided in the non-display area NDA of the first glass substrate 310 and the second glass substrate 410, the first glass substrate 310 and the second glass substrate 410 are joined.

[0179] The sealing line 470 may be provided on the planarization layer 332 to be spaced apart from the first alignment film 336, and may be provided to face the planarization layer 332 and the black matrix 420. The sealing line 470 may be composed of a sealant. For example, the sealant may be a photo-curable epoxy resin or a thermo-curable epoxy resin. The sealing line 470 forms a gap for liquid crystal injection and is used to prevent the injected liquid crystal from leaking. The sealing line 470 is formed by forming a thermo-curable resin in a specific pattern on the first glass substrate 310, and then setting the second glass substrate 410 on the first glass substrate 310 and pressing and curing the first glass substrate 310 and the second glass substrate 410 to join the two substrates 310 and 410.

[0180] A liquid crystal layer 450 may be provided in a region where a specific cell gap is formed between the first glass substrate 310 and the second glass substrate 410. The liquid crystal layer may include liquid crystals having optical anisotropy characteristics.

[0181] In the display device 20 according to another embodiment of the present disclosure, a voltage is applied to the pixel electrode 334 through the drain, and a voltage is applied to the common electrode 440 by driving the liquid crystal cell to display an image.

[0182] At the same time, the following will be referred to Figure 17 to describe a display device according to still another embodiment of the present disclosure.

[0183] Figure 17 is a cross-sectional view of a display device according to still another embodiment of the present disclosure.

[0184] Except that a dummy glass substrate 520 is provided on the lower surface of the first glass substrate 510 and a light source unit 660 is provided on the side surface of the first glass substrate 510, the display device 30 according to still another embodiment of the present disclosure has the same configuration as that according to Figure 5the same configuration as that of the display device 10 according to one embodiment of the present disclosure.

[0185] Referring to Figure 17 , according to another embodiment of the present disclosure, the display device 30 includes a first glass substrate 510 and a second glass substrate 610. The first glass substrate 510 includes a display area DA and a non-display area NDA. The non-display area NDA includes a bending area BA. The second glass substrate 610 is disposed on the first glass substrate 510 in the display area DA and faces the first glass substrate 510 with a specific cell gap.

[0186] The dummy glass substrate 520 is bent from the first glass substrate 510 and is located on the lower side of the first glass substrate 510. There is a bending area BA of the non-display area NDA between the dummy glass substrate 520 and the first glass substrate 510.

[0187] The anti-etching member 540 is formed on the first glass substrate 510 and the dummy glass substrate 520 to overlap with the bending area BA. A link line unit 550 overlapping with the bending area BA is disposed on the anti-etching member 540.

[0188] A first overcoat layer 572 is formed under the anti-etching member 540. In addition, a second overcoat layer 574 is formed on the planarization layer 532 formed on the anti-etching member 540.

[0189] The rear surface 520c of the bent dummy glass substrate 520 is set to be in contact with the rear surface 510c of the first glass substrate 510 located in the display area DA. In addition, the side surface 660b of the light source unit 660 is set to be in contact with the side surface 520d of the dummy glass substrate 520. 2D micro light-emitting diodes (μ-LEDs) can be applied as the light source unit 660. The present disclosure is not limited thereto, and other light sources can also be applied.

[0190] In addition, the front surface 660a of the light source unit 660 is set to be in contact with the rear surface 510c of the first glass substrate 510.

[0191] The contact portion between the first rear surface 510c of the first glass substrate 510 and the front surface 660a of the light source unit 660, and the contact portion between the side surface 520d of the dummy glass substrate 520 and the side surface 660b of the light source unit 660 may further include an adhesive member (not shown) for fixing the light source unit 660 and the dummy glass substrate 520 to the first glass substrate 510.

[0192] The adhesive member (not shown) can be an optically clear adhesive (OCA), an optically clear resin (OCR), a pressure-sensitive adhesive (PSA), or a double-sided tape, but is not limited thereto.

[0193] The first glass substrate 510 may include a first flat surface 510a and a first etched surface 510b formed on one side of the first flat surface 510a, and further include a first rear surface 510c facing the first flat surface 510a.

[0194] The first flat surface 510a of the first glass substrate 510 may overlap with the flat area FA of the display device 30.

[0195] A first curved etched portion 524 is formed on the rear surfaces of the first glass substrate 510 and the dummy glass substrate 520 located in the curved area BA, overlapping with the anti-etching member 540. The first curved etched portion 524 includes a first etched surface 510b formed on the rear surface of the first glass substrate 510 and a second etched surface 520b formed on the rear surface of the dummy glass substrate 520.

[0196] The first etched surface 510b may be formed in the remaining portion of the upper surface of the first glass substrate 510 overlapping with the display area DA and the curved area BA, excluding the first flat surface 510a.

[0197] By performing an etching process on the first glass substrate 510 having a flat plate shape and removing (or etching) a part of the first flat surface 510a, the first etched surface 510b can be formed into a streamlined and convex cross-sectional shape while having a non-flat structure. In addition, the first etched surface 510b may be arranged to have a surface continuous with the first flat surface 510a.

[0198] The first etched surface 510b of the first glass substrate 510 and the second etched surface 520b of the dummy glass substrate 520 may have an inverted conical shape and a curved surface.

[0199] In addition, although not shown in the drawings, a second curved etched portion (not shown, Figure 9 124 in) may be formed at the rear surface of the dummy glass substrate 520 located in the driving circuit area (not shown, Figure 7 DCA in) overlapping with the anti-etching member 540. The second curved etched portion may be formed to have a surface continuous with the first curved etched portion 524.

[0200] Although not shown in the figure, a thin film transistor 530 including a gate, an ohmic contact layer, a source, and a drain is formed on the first flat surface 510a of the first glass substrate 510 in the display area DA.

[0201] A planarization layer 532 is formed on the front surface of the first flat surface 510a including the thin film transistor 530, and a pixel electrode 534 electrically connected to the thin film transistor 530 is formed on the planarization layer 532.

[0202] A first alignment film 536 may be formed on the pixel electrode 534 to promote the alignment of liquid crystals.

[0203] In addition, a black matrix 620 is formed on the second glass substrate 610 at specific intervals, and the second glass substrate 610 is arranged to correspond to the first glass substrate 510 of the display area DA with a specific cell gap.

[0204] The black matrix 620 may have a closed-loop shape surrounding the display area DA to block light leakage. In addition, the black matrix 620 may also correspond to areas corresponding to thin film transistors (TFTs, not shown), gate lines (not shown), and data lines of the first glass substrate 510 to block light leakage. Additionally, the black matrix 620 is disposed between the color filter layers 630 to prevent color mixing between the color filter layers 630.

[0205] Red (R), green (G), and blue (B) color filter layers 630 that only filter light within a specific wavelength range may be provided between the black matrices 620. The color filter layers 630 may include an acrylic resin and pigments. The color filter layers 630 may be classified into red (R), green (G), and blue (B) according to the type of pigments for realizing colors.

[0206] In addition, an overcoat layer (not shown) may be further formed on the black matrix 620 and the color filter layers 630. The overcoat layer (not shown) may be provided to protect the color filter layers 630, flatten the surface, and improve the adhesion to the common electrode, and the overcoat layer may be composed of an acrylic resin.

[0207] A common electrode 640 may be provided on the overcoat layer. The common electrode 640 may be formed of a transparent conductive material. For example, the common electrode 640 may be composed of indium tin oxide (ITO) or indium zinc oxide (IZO).

[0208] A second alignment film 642 is formed on the common electrode 640 to promote the alignment of liquid crystals.

[0209] Meanwhile, although not shown in the drawings, spacers (not shown) for maintaining a specific cell gap may be additionally formed between the first glass substrate 510 and the second glass substrate 610.

[0210] In addition, since the sealing line 670 is provided in the non-display area NDA of the first glass substrate 510 and the second glass substrate 610, the first glass substrate 510 and the second glass substrate 610 are joined.

[0211] A sealing line 670 may be disposed on the planarization layer 532 to be spaced apart from the first alignment film 536, and may be disposed to face the planarization layer 532 and the black matrix 620. The sealing line 670 may be formed of a sealant. For example, the sealant may be a photo-curable epoxy resin or a thermo-curable epoxy resin. The sealing line 670 forms a gap for liquid crystal injection and is used to prevent the injected liquid crystal from leaking. The sealing line 670 is formed by forming a thermo-curable resin with a specific pattern on the first glass substrate 510, and then disposing the second glass substrate 610 on the first glass substrate 510, squeezing and curing the first glass substrate 510 and the second glass substrate 610 to bond the two substrates 510 and 610.

[0212] A liquid crystal layer 650 may be disposed in a region where a specific cell gap may be formed between the first glass substrate 510 and the second glass substrate 610. The liquid crystal layer may include a liquid crystal having optical anisotropic properties.

[0213] In a display device 30 according to still another embodiment of the present disclosure, a voltage is applied to the pixel electrode 534 through a drain, and a voltage is applied to the common electrode 640 by driving a liquid crystal cell to display an image.

[0214] Meanwhile, the following will be referred to Figure 18 to describe a display device according to still another embodiment of the present disclosure.

[0215] Figure 18 is a cross-sectional view of a display device according to still another embodiment of the present disclosure.

[0216] Except that a first glass substrate 710 (which is a thin film transistor array substrate) is disposed on a second glass substrate 810 (which is a color filter array substrate), and a dummy glass substrate 720 etched and bent from the first glass substrate 710 is disposed in contact with the lower surface of the light source unit 860, a display device 40 according to still another embodiment of the present disclosure has the same configuration as a display device 10 according to Figure 5 one embodiment of the present disclosure in

[0217] Referring to Figure 18 , a display device 40 according to still another embodiment of the present disclosure includes a first glass substrate 710 and a second glass substrate 810. The first glass substrate 710 includes a display area DA and a non-display area NDA. The non-display area NDA includes a bending area BA. The second glass substrate 810 is disposed below the first glass substrate 710 in the display area DA to face the first glass substrate 710 with a specific cell gap.

[0218] The dummy glass substrate 720 is bent from the first glass substrate 710 and is located on the lower side of the second glass substrate 810. A bending region BA where the dummy glass substrate 720 and the second glass substrate 810 have a non-display area NDA is provided.

[0219] An anti-etching member 740 is formed on the first glass substrate 710 and the dummy glass substrate 720 to overlap with the bending region BA. A link line unit 750 that overlaps with the bending region BA is provided on the anti-etching member 740.

[0220] A first overcoat layer 772 is formed under the anti-etching member 740. In addition, a second overcoat layer 774 is formed on the planarization layer 732 formed on the anti-etching member 740. The front surface 860a of the light source unit 860 is arranged to be in contact with the rear surface 810c of the second glass substrate 810 located in the display area DA. In addition, the rear surface 720c of the dummy glass substrate 720 is arranged to be in contact with the rear surface 860c of the light source unit 860. 2D micro LEDs (μ-LEDs) can be applied as the light source unit 860. The light source unit 860 is not limited thereto, and other light sources can also be applied.

[0221] The contact portion between the rear surface 810c of the second glass substrate 810 and the front surface 860a of the light source unit 860, and the contact portion between the rear surface 720c of the dummy glass substrate 720 and the rear surface 860c of the light source unit 860 may further include an adhesive member (not shown) for fixing the light source unit 860 and the dummy glass substrate 720 to the second glass substrate 810.

[0222] The adhesive member (not shown) can be an optically clear adhesive (OCA), an optically clear resin (OCR), a pressure-sensitive adhesive (PSA), or a double-sided tape, but is not limited thereto.

[0223] The first glass substrate 710 may include a first flat surface 710a and a first etched surface 710b formed on one side of the first flat surface 710a, and also includes a first rear surface 710c facing the first flat surface 710a.

[0224] The first flat surface 710a of the first glass substrate 710 may overlap with the flat area FA of the display device 40.

[0225] The first etched surface 710b is formed on the rear surface of the first glass substrate 710 located in the bending region BA that overlaps with the anti-etching member 740, and a second etched surface 720b is formed on the rear surface of the dummy glass substrate 720.

[0226] The first etched surface 710b may be formed in the remaining portion of the upper surface of the first glass substrate 710 that overlaps with the display area DA and the bending area BA, excluding the first flat surface 710a.

[0227] By performing an etching process on the first glass substrate 710 having a flat plate shape and removing (or etching) a part of the first flat surface 710a, the first etched surface 710b can be formed into a streamlined and convex cross-sectional shape while having a non-flat structure. In addition, the first etched surface 710b can be set to have a surface continuous with the first flat surface 710a.

[0228] The first etched surface 710b of the first glass substrate 710 and the second etched surface 720b of the dummy glass substrate 720 may have an inverted conical shape and a curved surface.

[0229] In addition, although not shown in the drawings, a bending etched portion (not shown, Figure 9 124 in Figure 7 may be formed at the rear surface of the dummy glass substrate 720 located in the driving circuit area (not shown,

[0230] DCA in

[0231] that overlaps with the anti-etching member 740). The bending etched portion may be formed to have a surface continuous with the second etched surface 720b of the dummy glass substrate 720.

[0232] A thin film transistor 730 including a gate, an ohmic contact layer, a source, and a drain may be formed on the first flat surface 710a of the first glass substrate 710 in the display area DA, although not shown in the drawings.

[0233] A planarization layer 732 is formed on the front surface of the first flat surface 710a including the thin film transistor 730, and a pixel electrode 734 electrically connected to the thin film transistor 730 is formed on the planarization layer 732.

[0234] A first alignment film 736 may be formed on the pixel electrode 734 to promote the alignment of liquid crystals.

[0235] Red (R), green (G), and blue (B) color filter layers 830 that filter only light within a specific wavelength range can be provided between the black matrix 820. The color filter layers 830 may include an acrylic resin and a pigment. The color filter layers 830 can be divided into red (R), green (G), and blue (B) according to the type of pigment that realizes the color.

[0236] In addition, an overcoat layer (not shown) can be further formed on the black matrix 820 and the color filter layers 830. The overcoat layer (not shown) can be provided to protect the color filter layers 830, flatten the surface, and improve the adhesion to the common electrode, and the overcoat layer can be composed of an acrylic resin.

[0237] A common electrode 840 can be provided on the overcoat layer. The common electrode 840 can be formed of a transparent conductive material. For example, the common electrode 840 can be composed of indium tin oxide (ITO) or indium zinc oxide (IZO).

[0238] A second alignment layer 842 is formed on the common electrode 840 to promote the alignment of liquid crystals.

[0239] Meanwhile, although not shown in the drawings, spacers (not shown) for maintaining a specific cell gap can be additionally formed between the first glass substrate 710 and the second glass substrate 810.

[0240] In addition, since the sealing line 870 is provided in the non-display area NDA of the first glass substrate 710 and the second glass substrate 810, the first glass substrate 710 and the second glass substrate 810 are joined.

[0241] The sealing line 870 can be provided on the planarization layer 732 to be spaced apart from the first alignment layer 736, and can be provided to face the planarization layer 732 and the black matrix 820. The sealing line 870 can be composed of a sealant. For example, the sealant can be a photo-curable epoxy resin or a thermo-curable epoxy resin. The sealing line 870 forms a gap for liquid crystal injection and is used to prevent the injected liquid crystal from leaking. The sealing line 870 is formed by forming a thermo-curable resin in a specific pattern on the first glass substrate 710, then setting the second glass substrate 810 on the first glass substrate 710, and pressing and curing the first glass substrate 710 and the second glass substrate 810 to join the two substrates 710 and 810.

[0242] A liquid crystal layer 850 can be provided in a region where a specific cell gap is formed between the first glass substrate 710 and the second glass substrate 810. The liquid crystal layer can include liquid crystals having optical anisotropy characteristics.

[0243] In the display device 40 according to another embodiment of the present disclosure, a voltage is applied to the pixel electrode 734 through the drain, and a voltage is applied to the common electrode 840 by driving the liquid crystal cell to display an image.

[0244] The display device according to an embodiment of the present disclosure can be applied to mobile devices, video phones, smart watches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, curved devices, sliding devices, variable devices, electronic notebooks, e-books, portable multimedia players (PMPs), personal digital assistants (PDAs), MP3 players, mobile medical devices, desktop personal computers (PCs), laptop PCs, netbook computers, workstations, navigation devices, vehicle display devices, theater display devices, televisions, wallpaper devices, signage devices, gaming devices, laptop PCs, monitors, cameras, camcorders, household appliances, etc.

[0245] According to the present disclosure, when a two-dimensional (2D) micro light-emitting diode (LED) is applied as a backlight unit and the curved area overlapping with the link line unit is bent by patterning and etching of the glass substrate, the border in the lower end portion can be reduced to achieve a uniform border on all four sides.

[0246] According to the present disclosure, when the glass substrate located in the curved area is etched and an anti-etching member located below the link line unit is applied, border bending can be achieved, and thus the border width can be reduced to the same size as the link line area and the driving circuit area through border bending.

[0247] According to the present disclosure, since the driving circuit area and the flexible printed circuit board (FPC) area of the dummy glass substrate are divided into multiple blocks to bend the dummy glass substrate, and the driving circuit area between the blocks is additionally etched using the curved area of the non-display area of the glass substrate, the size of the dummy glass is reduced, thereby increasing rigidity.

[0248] The display device according to various embodiments of the present disclosure is described as follows.

[0249] The display device according to an embodiment of the present disclosure may include: a first substrate including a display area and a non-display area, the non-display area including a curved area; a second substrate disposed on the display area of the first substrate and facing the first substrate with a specific gap; a dummy substrate disposed to face the lower portion of the first substrate, having a curved area of the non-display area between the dummy substrate and the first substrate; an anti-etching member disposed on the first substrate and the dummy substrate to overlap with the non-display area; and a link line unit formed on the anti-etching member.

[0250] The display device according to one or more embodiments of the present disclosure may further include a curved portion formed on the rear surfaces of the first substrate and the dummy substrate below the anti-etching member.

[0251] A display device according to one or more embodiments of the present disclosure, the bent portion may include a first etched surface provided on the rear surface of the first substrate and a second etched surface provided on the rear surface of the dummy substrate to overlap with the bent region.

[0252] A display device according to one or more embodiments of the present disclosure, the bent portion may further include a third etched surface and a fourth etched surface, the third etched surface and the fourth etched surface are formed on the rear surface of the dummy substrate to have a continuous surface perpendicular to the second etched surface, and the link line unit is interposed between the third etched surface and the fourth etched surface.

[0253] A display device according to one or more embodiments of the present disclosure, the anti-etching member may be composed of one of a metal and an organic material.

[0254] A display device according to one or more embodiments of the present disclosure, the anti-etching member may include at least one of a silicone-based organic material, urethane, polyimide, and photoacrylic as the organic material, or include at least one of chromium (Cr), aluminum (Al), platinum (Pt), and nickel (Ni) as the metal.

[0255] A display device according to one or more embodiments of the present disclosure, an inorganic film or a metal film and an inorganic film may be further formed between the anti-etching member and the first substrate and the dummy substrate.

[0256] A display device according to one or more embodiments of the present disclosure, the inorganic film may include SiO2, SiN x or a-Si; the metal film may include molybdenum (Mo), MoTi, or ITO.

[0257] A display device according to one or more embodiments of the present disclosure may further include a first overcoat layer disposed between the first substrate and the dummy substrate under the anti-etching member; and a planarization layer and a second overcoat layer disposed on the link line unit.

[0258] A display device according to one or more embodiments of the present disclosure may further include a liquid crystal layer disposed between the first substrate and the second substrate.

[0259] A display device according to one or more embodiments of the present disclosure may further include a light source unit disposed under the first substrate.

[0260] A display device according to one or more embodiments of the present disclosure, the light source unit may be disposed between the first substrate and the dummy substrate, or disposed in contact with the rear surface of the first substrate and the side surface of the dummy substrate.

[0261] A display device according to one or more embodiments of the present disclosure, the light source unit may include two-dimensional (2D) micro light-emitting diodes (μ-LEDs).

[0262] A display device according to another embodiment of the present disclosure may include: a first glass substrate including a display area and a non-display area including a bent area; a second glass substrate disposed on the display area of the first glass substrate to face the first glass substrate with a specific gap; a liquid crystal layer disposed between the first glass substrate and the second glass substrate; a light source unit disposed on the rear surface of the first glass substrate; a dummy glass substrate disposed to face the lower part of the first glass substrate, with the bent area of the non-display area located between the dummy glass substrate and the first glass substrate; an anti-etching member disposed on the first glass substrate and the dummy glass substrate to overlap with the non-display area; a link line unit formed on the anti-etching member; and a bent portion formed on the rear surfaces of the first glass substrate and the dummy glass substrate below the anti-etching member.

[0263] A display device according to one or more embodiments of the present disclosure, the bent portion may include a first etched surface, a second etched surface, a third etched surface, and a fourth etched surface. The first etched surface is disposed on the rear surface of the first glass substrate, the second etched surface is disposed on the rear surface of the dummy glass substrate to overlap with the bent area, the third etched surface and the fourth etched surface are formed on the rear surface of the dummy glass substrate to have a continuous surface perpendicular to the second etched surface, and the link line unit is inserted between the third etched surface and the fourth etched surface.

[0264] A display device according to one or more embodiments of the present disclosure may further include a first overcoat layer disposed between the first glass substrate and the dummy glass substrate below the anti-etching member; and a planarization layer and a second overcoat layer disposed on the link line unit.

[0265] A display device according to another embodiment of the present disclosure may include: a first glass substrate including a display area and a non-display area including a curved area; a second glass substrate disposed on the display area of the first glass substrate to face the first glass substrate with a specific gap; a liquid crystal layer disposed between the first glass substrate and the second glass substrate; a dummy glass substrate disposed on the lower side of the first glass substrate, with the curved area of the non-display area located between the dummy glass substrate and the first glass substrate; a light source unit disposed on the rear surface of the first glass substrate and the side surface of the dummy glass substrate; an anti-etching member disposed on the first glass substrate and the dummy glass substrate to overlap with the non-display area; a link line unit formed on the anti-etching member; and a curved portion formed on the rear surfaces of the first glass substrate and the dummy glass substrate below the anti-etching member.

[0266] In a display device according to one or more embodiments of the present disclosure, the curved portion may include a first etched surface, a second etched surface, a third etched surface, and a fourth etched surface. The first etched surface is disposed on the rear surface of the first glass substrate, the second etched surface is disposed on the rear surface of the dummy glass substrate to overlap with the curved area, the third etched surface and the fourth etched surface are formed on the rear surface of the dummy glass substrate to have a continuous surface perpendicular to the second etched surface, and the link line unit is inserted between the third etched surface and the fourth etched surface.

[0267] A display device according to one or more embodiments of the present disclosure may further include a first overcoat layer disposed between the first glass substrate and the dummy glass substrate below the anti-etching member; and a planarization layer and a second overcoat layer disposed on the link line unit.

[0268] In a display device according to one or more embodiments of the present disclosure, the light source unit includes 2D micro light emitting diodes (μ-LEDs).

[0269] A display device according to another embodiment of the present disclosure may include: a thin film transistor array substrate including a display area and a non-display area, the non-display area including a bending area; a color filter array substrate disposed on the display area of the thin film transistor array substrate and facing the thin film transistor array substrate with a specific gap; a liquid crystal layer disposed between the thin film transistor array substrate and the color filter array substrate; a dummy glass substrate bent from the thin film transistor array substrate across the bending area of the non-display area and disposed below the color filter array substrate; a light source unit disposed on the rear surfaces of the color filter array substrate and the dummy glass substrate to overlap with the non-display area; a link line unit disposed on an anti-etching member; and a bending portion formed on the rear surfaces of the thin film transistor array substrate and the dummy glass substrate below the anti-etching member.

[0270] In a display device according to one or more embodiments of the present disclosure, the bending portion may include a first etched surface disposed on the rear surface of the thin film transistor substrate and a second etched surface disposed on the rear surface of the dummy glass substrate to overlap with the bending area, and may further include a third etched surface and a fourth etched surface formed to have a continuous surface perpendicular to the second etched surface, wherein the link line unit is located on the rear surface of the dummy glass substrate.

[0271] Since the content of the present disclosure described in the problems to be solved, the means for solving the problems, and the above effects do not prescribe the essential features of the claims, the scope of the claims is not limited by the items described in the content of the present disclosure.

[0272] Although the embodiments have been described in more detail with reference to the drawings, the present disclosure is not necessarily limited to these embodiments, and various modifications can be made without departing from the technical spirit of the present disclosure. Therefore, the embodiments disclosed in the present disclosure are not intended to limit the technical spirit of the present disclosure, but to describe the technical spirit of the present disclosure, and the scope of the technical spirit of the present disclosure is not limited by these embodiments. Therefore, the above embodiments should be understood as illustrative rather than restrictive in all respects.

[0273] Cross-reference to related applications

[0274] This application claims the priority and benefit of Korean Patent Application No. 10-2023-0196923, filed in Korea on December 29, 2023, the disclosure of which is incorporated herein by reference in its entirety.

Claims

1. A display device, comprising: a first substrate including a display area and a non-display area including a bending area; a second substrate disposed on the display area of ​​the first substrate to face the first substrate with a specific gap; a dummy substrate, the dummy substrate being arranged to face a lower portion of the first substrate, the curved area of ​​the non-display area being located between the dummy substrate and the first substrate; an anti-etching member disposed on the first substrate and the dummy substrate to overlap the non-display area; as well as A link line unit is formed on the etching prevention member. 2 . The display device of claim 1 , further comprising a bent portion formed on a rear surface of the first substrate and a rear surface of the dummy substrate under the etching prevention member.

3. The display device according to claim 2, wherein: The bent portion includes a first etched surface disposed on a rear surface of the first substrate and a second etched surface disposed on a rear surface of the dummy substrate to overlap the bent region.

4. The display device according to claim 3, wherein: The bent portion further includes a third etching surface and a fourth etching surface formed on the rear surface of the dummy substrate to have a continuous surface perpendicular to the second etching surface, and the link line unit is interposed between the third etching surface and the fourth etching surface.

5. The display device according to claim 1, wherein: The etching prevention member is composed of one of a metal and an organic material.

6. The display device according to claim 5, wherein: The etching prevention member includes at least one of a silicone-based organic material, urethane, polyimide, and photo acrylic as the organic material, or includes at least one of chromium Cr, aluminum Al, platinum Pt, and nickel Ni as the metal.

7. The display device according to claim 1, wherein: An inorganic film is further formed between the etching anti-member and the first substrate and between the etching anti-member and the dummy substrate, or a metal film and an inorganic film are further formed.

8. The display device according to claim 7, wherein: The inorganic film includes SiO2, SiN x or a-Si; and The metal film includes molybdenum (Mo), MoTi or ITO.

9. The display device according to claim 1, further comprising: a first outer coating layer disposed between the first substrate and the dummy substrate below the anti-etching member; as well as A planarization layer and a second overcoat layer are provided on the link line unit. 10 . The display device according to claim 1 , further comprising a liquid crystal layer disposed between the first substrate and the second substrate. 11 . The display device according to claim 1 , further comprising a light source unit disposed under the first substrate.

12. The display device according to claim 11, wherein: The light source unit is disposed between the first substrate and the dummy substrate, or is disposed to be in contact with a rear surface of the first substrate and a side surface of the dummy substrate.

13. The display device according to claim 11, wherein: The light source unit includes a two-dimensional 2D micro light emitting diode (LED) (μ-LED).

14. A display device, comprising: a first glass substrate, the first glass substrate comprising a display area and a non-display area including a curved area; a second glass substrate disposed on the display area of ​​the first glass substrate to face the first glass substrate at a specific gap; a liquid crystal layer disposed between the first glass substrate and the second glass substrate; a light source unit disposed on a rear surface of the first glass substrate; a dummy glass substrate, the dummy glass substrate being arranged to face a lower portion of the first glass substrate, the curved area of ​​the non-display area being located between the dummy glass substrate and the first glass substrate; an anti-etching member disposed on the first glass substrate and the dummy glass substrate to overlap a non-display area; a link line unit formed on the anti-etching member; as well as A bent portion is formed on a rear surface of the first glass substrate and a rear surface of the dummy glass substrate under the etching prevention member.

15. The display device according to claim 14, wherein: The bent portion includes a first etched surface, a second etched surface, a third etched surface, and a fourth etched surface, the first etched surface being disposed on the rear surface of the first glass substrate, the second etched surface being disposed on the rear surface of the dummy glass substrate to overlap the bent region, the third etched surface and the fourth etched surface being formed on the rear surface of the dummy glass substrate to have a continuous surface perpendicular to the second etched surface, and the link line unit being interposed between the third etched surface and the fourth etched surface.

16. The display device according to claim 14, further comprising: a first overcoat layer disposed between the first glass substrate and the dummy glass substrate below the anti-etching member; as well as A planarization layer and a second overcoat layer are provided on the link line unit.

17. A display device, comprising: a first glass substrate, the first glass substrate comprising a display area and a non-display area including a curved area; a second glass substrate disposed on the display area of ​​the first glass substrate to face the first glass substrate at a specific gap; a liquid crystal layer disposed between the first glass substrate and the second glass substrate; a dummy glass substrate, wherein the dummy glass substrate is disposed on the lower side of the first glass substrate, and the curved area of ​​the non-display area is located between the dummy glass substrate and the first glass substrate; a light source unit disposed on a rear surface of the first glass substrate and a side surface of the dummy glass substrate; an anti-etching member disposed on the first glass substrate and the dummy glass substrate to overlap the non-display area; a link line unit formed on the anti-etching member; as well as A bent portion is formed on a rear surface of the first glass substrate and a rear surface of the dummy glass substrate under the etching prevention member.

18. The display device according to claim 17, wherein: The bent portion includes a first etched surface, a second etched surface, a third etched surface, and a fourth etched surface, the first etched surface being disposed on the rear surface of the first glass substrate, the second etched surface being disposed on the rear surface of the dummy glass substrate to overlap the bent region, the third etched surface and the fourth etched surface being formed on the rear surface of the dummy glass substrate to have a continuous surface perpendicular to the second etched surface, and the link line unit being interposed between the third etched surface and the fourth etched surface.

19. The display device according to claim 17, further comprising: a first overcoat layer disposed between the first glass substrate and the dummy glass substrate below the anti-etching member; as well as A planarization layer and a second overcoat layer are provided on the link line unit.

20. The display device according to claim 17, wherein: The light source unit includes a 2D micro LED (μ-LED).

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