Display device

Abstract

Embodiments of the present disclosure relate to a display device, and more particularly, to a display device. A display device capable of preventing or reducing non-uniformity defects by including a display panel, a functional member disposed on the display panel, and an adhesive layer disposed between the display panel and the functional member and adjusting modulus and creep of the adhesive layer may be provided.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a display device, and more particularly, for example but not limited to, a display device capable of preventing or reducing defects such as non-uniformity while using a low modulus optically transparent resin in an adhesive layer. Background Art

[0002] Recently, there has been an increasing demand for various types of display devices capable of more efficiently displaying images. Representative examples of such display devices include liquid crystal display devices (LCDs) and organic light emitting display devices (OLEDs).

[0003] Display devices having various forms and functions mainly include a display panel capable of displaying images and add functional layers to supplement various functions, such as preventing damage from external pressure and improving light extraction efficiency. The functional layer and the display panel can be joined together using an adhesive such as an optically transparent resin.

[0004] An adhesive layer formed using an optically transparent resin needs to enhance the optical characteristics of the display device, act as a buffer against external shocks, and enhance impact resistance. To enhance impact resistance, a resin having a low modulus can be used for the optically transparent resin.

[0005] The descriptions provided in the discussion of the related art section should not be considered prior art merely because they are mentioned in or related to that section. The discussion of the related art section only includes information that can be background information for the subject technology, and the descriptions in the related art section do not limit the present invention. Summary of the Invention

[0006] When an optically transparent resin having a low modulus is applied to the adhesive layer, the stress applied to the display panel can be reduced, but when high light resistance and high heat resistance are achieved, the hardness decreases and the adhesive strength decreases. In addition, the application of an optically transparent resin having a high modulus may cause defects such as non-uniformity (mura).

[0007] Accordingly, the inventors of the present disclosure have invented a display device capable of preventing or reducing defects such as non-uniformity while using a low modulus optically transparent resin in the adhesive layer.

[0008] Embodiments of the present disclosure may provide a display device that prevents or reduces non-uniformity defects by adjusting the modulus and creep of the adhesive layer.

[0009] Embodiments of the present disclosure may provide a display device having enhanced adhesive strength by adjusting the modulus and creep of the adhesive layer so as to relieve external stress even at high temperatures.

[0010] Embodiments of the present disclosure may provide a display device that prevents or reduces the display of non-uniform defects by adjusting the thicknesses of an adhesive layer and a layer adjacent to the adhesive layer.

[0011] The objectives according to the present disclosure are not limited to the above objectives. Other objectives and advantages not mentioned according to the present disclosure can be understood based on the following description, and can be more clearly understood based on embodiments according to the present disclosure. In addition, it will be readily understood that the objectives and advantages according to the present disclosure can be achieved by using the means shown in the claims or combinations thereof.

[0012] Embodiments of the present disclosure may provide a display device including a display panel that outputs an image, a functional member disposed on the display panel, and an adhesive layer disposed between the display panel and the functional member, wherein the adhesive layer has a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and has a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature higher than the first temperature.

[0013] According to an exemplary embodiment of the present disclosure, the first temperature may be 25 °C and the second temperature may be 105 °C.

[0014] According to an exemplary embodiment of the present disclosure, the adhesive layer may have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25 °C. According to an exemplary embodiment of the present disclosure, the adhesive layer may have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105 °C.

[0015] Embodiments of the present disclosure may provide a display device including a display panel that outputs an image, a first functional member disposed on the display panel, a second functional member disposed on the first functional member, and a first additional adhesive layer disposed between the first functional member and the second functional member, wherein the first additional adhesive layer has a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and has a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature higher than the first temperature.

[0016] According to an exemplary embodiment of the present disclosure, the first temperature may be 25 °C and the second temperature may be 105 °C.

[0017] According to an exemplary embodiment of the present disclosure, the first additional adhesive layer may have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25 °C.

[0018] According to an exemplary embodiment of the present disclosure, the first additional adhesive layer may have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105°C.

[0019] According to an exemplary embodiment of the present disclosure, the first additional adhesive layer may have a thickness of 150 μm or more and 500 μm or less.

[0020] According to an exemplary embodiment of the present disclosure, a display device for preventing or reducing non-uniform defects may be provided.

[0021] According to an exemplary embodiment of the present disclosure, a display device for preventing or reducing non-uniform defects by adjusting the modulus and creep of an adhesive layer may be provided.

[0022] According to an exemplary embodiment of the present disclosure, a display device having enhanced adhesive strength may be provided by adjusting the modulus and creep of an adhesive layer so as to relieve external stress even at high temperatures.

[0023] According to an exemplary embodiment of the present disclosure, a display device for preventing or reducing non-uniform defects by adjusting the thickness of an adhesive layer and a layer adjacent to the adhesive layer may be provided.

[0024] According to an exemplary embodiment of the present disclosure, a display device capable of enhancing lifespan by preventing or reducing non-uniform defects and thus capable of low power consumption may be provided.

[0025] It should be understood that both the foregoing general description and the following detailed description of the present disclosure are exemplary and explanatory and are intended to provide further explanation of the claimed present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other objects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which:

[0027] Figure 1 is a diagram showing a system configuration of a display device according to an exemplary embodiment of the present disclosure;

[0028] Figure 2 is a cross-sectional view schematically showing a structure of a display device according to an exemplary embodiment of the present disclosure;

[0029] Figure 3 is a cross-sectional view schematically showing a structure of a liquid crystal display device according to an exemplary embodiment of the present disclosure;

[0030] Figure 4 is a cross-sectional view schematically showing a structure of an organic electroluminescent display device according to an exemplary embodiment of the present disclosure; and

[0031] Figure 5 , Figure 6 , Figure 7 and Figure 8 is a cross-sectional view showing another example of a display device according to an exemplary embodiment of the present disclosure.

[0032] Throughout the drawings and the detailed description, unless otherwise specified, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustration, and convenience, the dimensions, lengths, and thicknesses of layers, regions, and elements, and their depictions may be exaggerated. Detailed Description

[0033] In the following description of examples or embodiments of the present disclosure, reference will be made to the accompanying drawings, in which specific examples or embodiments that can be implemented are shown by way of illustration, and in which the same reference numerals and symbols may be used to represent the same or similar components, even when they are shown in different drawings from each other. Additionally, in the following description of examples or embodiments of the present disclosure, when it is determined that a detailed description of well-known functions and components incorporated herein may render the subject matter in some embodiments of the present disclosure rather unclear, such a description will be omitted. Terms such as "comprising," "having," "containing," "constituting," "consisting of," and "formed of" as used herein are generally intended to allow the addition of one or more components, unless such terms are used together with the term "only." As used herein, the singular forms are intended to include the plural forms unless the context clearly indicates otherwise.

[0034] Terms such as "first," "second," "A," "B," "(A)," "(B)," "(a)," and "(b)" can be used herein to describe elements of the present disclosure. None of these terms is used to define the essence, order, sequence, or quantity, etc., of an element, but rather is only used to distinguish the corresponding element from other elements.

[0035] Terms such as "below," "lower," "above," "upper," etc., can be used herein to describe the relationship between elements shown in the figures. It will be understood that these terms are spatially relative and are based on the orientation depicted in the figures.

[0036] When referring to a first element being "connected or coupled to," "in contact with or overlapping," etc., a second element, it should be interpreted that not only can the first element be "directly connected or coupled to" or "directly in contact with or overlapping" the second element, but also a third element can be "interposed" between the first element and the second element, or the first element and the second element can be "connected or coupled," "in contact with or overlapping," etc., with each other via a fourth element. Here, the second element can be included in at least one of two or more elements that are "connected or coupled," "in contact with or overlapping," etc., with each other.

[0037] It should be understood that the term "at least one" includes all combinations related to any item. For example, "at least one of the first element, the second element, and the third element" may include all combinations of two or more elements selected from the first element, the second element, and the third element, as well as each individual element among the first element, the second element, and the third element.

[0038] When relative time terms such as "after", "subsequently", "next", "before", etc. are used to describe a process or operation of an element or configuration, or a process or step in an operation, a process, or a manufacturing method, these terms can be used to describe a non - continuous or non - sequential process or operation, unless the terms "directly" or "immediately" are used together.

[0039] In addition, when referring to any dimension, relative size, etc., it should be considered that the numerical value of an element or feature or corresponding information (e.g., level, range, etc.) includes a tolerance or error range that may be caused by various factors (e.g., process factors, internal or external influences, noise, etc.), even when no relevant description is specified. In addition, the term "capable of" fully encompasses all meanings of the term "can".

[0040] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those of ordinary skill in the art to which the exemplary embodiments belong. It will also be understood that terms such as those defined in common dictionaries should be interpreted as having, for example, a meaning consistent with their meaning in the context of the relevant field, and should not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein. For example, the terms "part" or "unit" can apply to, for example, a separate circuit or structure, an integrated circuit, a computing block of a circuit device, or any structure configured to perform the described function, as should be understood by those of ordinary skill in the art.

[0041] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. All components of each display device according to all embodiments of the present disclosure are operably coupled and configured.

[0042] Figure 1 is a diagram showing the system configuration of a display device 100 according to an exemplary embodiment of the present disclosure.

[0043] Referring to Figure 1 , the display driving system of the display device 100 according to an exemplary embodiment of the present disclosure may include a display panel 110 and a display driving circuit for driving the display panel 110, etc.

[0044] The display panel 110 may include a display area DA for displaying an image and a non-display area NDA for not displaying an image. The non-display area NDA is configured to surround the display area DA. The display panel 110 may include a plurality of sub-pixels SP disposed on a substrate SUB for image display. In addition, the display panel 110 may further include a circuit portion configured to operate the plurality of pixels SP.

[0045] The display panel 110 may include a plurality of signal lines disposed on the substrate SUB. For example, the plurality of signal lines may include data lines DL, gate lines GL, driving voltage lines, and the like. However, the present disclosure is not limited thereto.

[0046] Each of the plurality of data lines DL is arranged to extend in a first direction (e.g., column direction or row direction), and each of the plurality of gate lines GL is arranged to extend in a second direction (e.g., row direction or column direction) intersecting the first direction.

[0047] The display driving circuit may be a circuit for driving the display panel and includes, but is not limited to, a data driving circuit 120 and a gate driving circuit 130, a controller 140 for controlling the data driving circuit 120 using a data driving control signal DCS and controlling the gate driving circuit 130 using a gate driving control signal GCS, and other circuit components. The controller 140 may supply image data DATA readable by the data driving circuit 120.

[0048] The data driving circuit 120 may output data signals (also referred to as data voltages) corresponding to the image signals to the plurality of data lines DL. The gate driving circuit 130 may generate a gate signal and output the gate signal to the plurality of gate lines GL. The controller 140 may convert the input image data input from an external host 150 to meet the data signal format used in the data driving circuit 120, and provide the converted image data to the data driving circuit 120.

[0049] The data driving circuit 120 may include one or more source driver integrated circuits. For example, each source driver integrated circuit may be connected to the display panel 110 by a tape automated bonding (TAB) method, or connected to a bonding pad of the display panel 110 by a chip on glass (COG) or chip on board (COP) method, or may be implemented by a chip on film (COF) method and connected to the display panel 110. However, the present disclosure is not limited thereto.

[0050] The gate driving circuit 130 may be connected to the display panel 110 by a tape automated bonding (TAB) method, connected to the bonding pads of the display panel 110 by a chip on glass (COG) or chip on plastic (COP) method, connected to the display panel 110 by a chip on film (COF) method, or may be formed in the non-display area (NDA) of the display panel 110 by an in-panel gate (GIP) method. However, the present disclosure is not limited thereto.

[0051] Referring Figure 1 , in the display device 100 according to an exemplary embodiment of the present disclosure, each sub-pixel SP may include a light-emitting element ED and a pixel driving circuit SPC for driving the light-emitting element ED. The pixel driving circuit SPC may include a driving transistor DRT, a scanning transistor SCT, and a storage capacitor Cst, but is not limited thereto. As an example, each sub-pixel SP may include a 7T1C structure provided with seven transistors and one capacitor, but embodiments of the present disclosure are not limited thereto. For example, 3T1C, 4T1C, 5T1C, 3T2C, 4T2C, 5T2C, 6T2C, 7T1C, 7T2C, 8T2C structures, etc. are also possible. And more or fewer transistors and capacitors may be included.

[0052] The driving transistor DRT may control the current flowing to the light-emitting element ED to drive the light-emitting element ED. The scanning transistor SCT may transmit a data voltage Vdata to a second node N2, which is the gate node of the driving transistor DRT. The storage capacitor Cst may be configured to maintain the voltage for a predetermined period of time.

[0053] The light-emitting element ED may include an anode electrode AE and a cathode electrode CE, and a light-emitting layer EL located between the anode electrode AE and the cathode electrode CE. For example, the light-emitting layer EL may include one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL), but the present disclosure is not limited thereto. The anode electrode AE may be a pixel electrode involved in forming the light-emitting element ED of each sub-pixel SP and may be electrically connected to a first node N1 of the driving transistor DRT. The cathode electrode CE may be a common electrode involved in forming the light-emitting element ED of all sub-pixels SP, and a ground voltage EVSS may be applied to the cathode electrode CE.

[0054] For example, the light-emitting element ED may be an organic light-emitting diode (OLED), an inorganic light-emitting diode (LED), or a quantum dot light-emitting element, which is a self-emitting semiconductor crystal, but is not limited thereto.

[0055] The driving transistor DRT is a transistor for driving a light-emitting element ED and may include a first node N1, a second node N2, and a third node N3. The first node N1 may be a source node or a drain node of the driving transistor DRT and may be electrically connected to the anode electrode AE of the light-emitting element ED. The second node N2 is a gate node of the driving transistor DRT and may be electrically connected to the source node or the drain node of the scanning transistor SCT. The third node N3 may be a drain node or a source node of the driving transistor DRT and may be electrically connected to a driving voltage line DVL that provides a driving voltage EVDD. For ease of description, in the examples described below, the first node N1 may be a source node, and the third node N3 may be a drain node. However, the present disclosure is not limited thereto.

[0056] The scanning transistor SCT may switch the connection between the data line DL and the second node N2 of the driving transistor DRT. In response to a scan signal SCAN provided from a scan line SCL that serves as a kind of gate line GL, the scanning transistor SCT may control the connection between the second node N2 of the driving transistor DRT and a corresponding data line DL among a plurality of data lines DL. When the scanning transistor SCT is turned on in response to the scan signal SCAN provided from the scan line SCL, a data voltage Vdata may be transmitted to the second node N2 of the driving transistor DRT.

[0057] A storage capacitor Cst may be configured between the first node N1 and the second node N2 of the driving transistor DRT.

[0058] Figure 1 The structure of the illustrated sub-pixel SP is merely an example for illustration and may further include one or more transistors or one or more storage capacitors. A plurality of sub-pixels SP may have the same structure, or some of the plurality of sub-pixels SP may have different structures. However, the present disclosure is not limited thereto. Each of the driving transistor DRT and the scanning transistor SCT may be an n-type transistor or a p-type transistor.

[0059] The display device 100 according to an exemplary embodiment of the present disclosure may have a top-emitting structure or a bottom-emitting structure, without being limited thereto. Hereinafter, a top-emitting structure will be described as an example. For example, in the top-emitting structure, the anode electrode AE may be a reflective metal, and the cathode electrode CE may be a transparent conductive film.

[0060] Figure 2 is a cross-sectional view schematically showing the structure of a display device according to an exemplary embodiment of the present disclosure. For example, Figure 2 is schematically showing along Figure 1 a cross-section taken along line I-I'. As referred to Figure 1Descriptions of the same or similar content are omitted from the following description or briefly described below.

[0061] Referring to Figure 2 , according to an exemplary embodiment of the present disclosure, the display device 100 may include a display panel 110, an adhesive layer 200, a functional member 300, etc. For example, the display device 100 may include a display panel 110 that outputs an image, a functional member 300 disposed on or above the display panel 110, and an adhesive layer 200 disposed between the display panel 110 and the functional member 300, but is not limited thereto.

[0062] The display panel 110 may include any display panel capable of outputting an image, such as a liquid crystal display panel including a liquid crystal layer, an organic light-emitting display panel including an organic electroluminescent element, a quantum dot display panel including a quantum dot light-emitting element, a micro LED display panel including a micro LED, and a mini LED display panel including a mini LED, but is not limited thereto.

[0063] The adhesive layer 200 may be disposed between the display panel 110 and the functional member 300. Specifically, the adhesive layer 200 may be disposed on the display panel 110, and the functional member 300 may be disposed on the adhesive layer 200. The adhesive layer 200 may bond the display panel 110 and the functional member 300. For example, the adhesive layer 200 may bond the display panel 110 and the functional member 300 using an optically transparent resin or the like, but is not limited thereto.

[0064] As an example, the adhesive layer 200 may be formed of an optically transparent resin to enhance the optical properties of the display device 100 and act as a buffer against external shocks, thereby enhancing the impact resistance.

[0065] When the adhesive layer 200 has a low modulus, the stress applied to the display panel can be reduced or minimized to enhance the impact resistance, but the hardness may be reduced and the bonding strength may be decreased. Further, when the modulus of the adhesive layer 200 is too low, it is difficult to control the process due to the pushing of the adhesive during the bonding process and defects caused by foreign substances may occur, and the quality may deteriorate.

[0066] In addition, when the adhesive layer 200 has a high modulus, the hardness is ensured and the adhesive force can be maintained, but defects such as unevenness may occur.

[0067] Therefore, an additional physical property factor is obtained to allow the adhesive layer 200 to have sufficient hardness so as to maintain the bonding strength while having a low modulus to alleviate defects such as unevenness.

[0068] Creep is a physical property indicating the degree of deformation over time when a constant stress is applied. It has been recognized that even when the adhesive layer 200 has a low modulus, the adhesive strength is maintained as creep increases, and non-uniformity is effectively reduced.

[0069] The display device 100 according to an exemplary embodiment of the present disclosure can prevent or reduce non-uniformity defects by adjusting the modulus and creep of the adhesive layer 200. In addition, the display device 100 according to an exemplary embodiment of the present disclosure can have enhanced adhesive strength by adjusting the modulus and creep of the adhesive layer 200 so as to release stress to the outside even at high temperatures.

[0070] The adhesive layer 200 can have a low modulus and high creep to prevent or reduce non-uniformity defects, and can have enhanced adhesive strength by releasing external stress even at high temperatures.

[0071] As an example, the adhesive layer 200 can have a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature higher than the first temperature, but is not limited thereto.

[0072] Specifically, the adhesive layer 200 can have a creep value of 100% or more and a storage modulus value of 55 KPa or less at a temperature of 25°C, and a creep value of 130% or more and a storage modulus value of 20 KPa or less at a temperature of 105°C, but is not limited thereto.

[0073] The adhesive layer 200 can have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25°C, but is not limited thereto.

[0074] The adhesive layer 200 can have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105°C, but is not limited thereto.

[0075] For example, the adhesive layer 200 can have a creep value of 100% or more and 250% or less and a storage modulus value of 34 KPa or more and 55 KPa or less at a first temperature such as 25°C, but is not limited thereto.

[0076] For example, the adhesive layer 200 can have a creep value of 130% or more and 350% or less and a storage modulus value of 4 KPa or more and 20 KPa or less at a second temperature such as 105°C, but is not limited thereto.

[0077] In addition, in an exemplary embodiment of the present disclosure, when a force of 10,000 Pa is applied to the adhesive layer sample at 25°C and 105°C, the creep deformation is measured. Specifically, after forming a circular adhesive layer sample with a diameter of 8 mm and a thickness of 1 mm, a force of 10,000 Pa is applied at 25°C and 105°C for 10 minutes using ARES-G2 of TA Instruments to measure the creep deformation of the adhesive layer. After the creep measurement, a force is applied at 0 Pa for 10 minutes to measure the recovery, which is the recovery rate with respect to the change.

[0078] When the creep value and the storage modulus value satisfy the above ranges at the temperatures of 25°C and 105°C, the adhesive layer 200 can prevent or reduce non-uniform defects and can have enhanced adhesive strength by releasing stress to the outside even at high temperatures.

[0079] As an example, the adhesive layer 200 may also have a thickness of 150 μm or more and 750 μm or less, a thickness of 200 μm or more and 400 μm or less, and a thickness of 250 μm or more and 350 μm or less, but is not limited thereto. In addition, other appropriate thicknesses of the adhesive layer 200 are possible as long as the display panel can reduce the stress received from the outside to prevent or reduce non-uniform defects and can have enhanced adhesive strength by releasing stress to the outside even at high temperatures.

[0080] When the thickness of the adhesive layer 200 satisfies the above range, the display panel can reduce the stress received from the outside to prevent or reduce non-uniform defects and can have enhanced adhesive strength by releasing stress to the outside even at high temperatures.

[0081] The functional member 300 can be attached to the adhesive layer 200. Specifically, the functional member 300 can be attached to one side of the adhesive layer 200. The display panel 110 can be attached to the other side of the adhesive layer 200.

[0082] As an example, the functional member 300 can include various substrates or panels, but is not limited thereto.

[0083] For example, the functional member 300 can be a cover window for protecting the display device, or can be a functional panel such as a touch panel or a 3D barrier panel. The functional member 300 can be a light control film for adjusting the viewing angle area of the display device. In an exemplary embodiment of the present disclosure, the functional member is not limited to the above substrates or panels.

[0084] As an example, a single functional member 300 can be provided on or above the display panel 110. In addition, two or more functional members 300 can be provided on the display panel 110 to overlap each other.

[0085] When two or more functional components 300 are disposed on the display panel 110 so as to overlap each other, the adhesive layer 200 may be disposed between the functional components 300 such that the functional components 300 can be joined together. In addition, the adhesive layer 200 may be disposed between the display panel 110 and the functional component 300 to join the display panel 110 and the functional component 300.

[0086] As an example, the functional component 300 may include a base substrate.

[0087] The base substrate may have a thickness of 0.5T or more and 1.0T or less. When the thickness of the base substrate satisfies the above range, stress can be released, thereby preventing delamination between layers. In various embodiments of the present disclosure, the unit of the thickness T is 1.0 mm.

[0088] Figure 3 is a cross-sectional view schematically showing the structure of a liquid crystal display device according to an exemplary embodiment of the present disclosure. For example, Figure 3 is schematically showing a cross-section taken along the Figure 1 line I-I'. The following may be omitted or briefly described for those that are the same or similar to those described in connection with Figure 1 and Figure 2 described.

[0089] Referring to Figure 3 , a display device 100 according to an exemplary embodiment of the present disclosure may include a display panel 110, an adhesive layer 200, a functional component 300, etc. The adhesive layer 200 may be disposed between the display panel 110 and the functional component 300, but is not limited thereto. The display panel 110 may be a liquid crystal display panel including a liquid crystal layer 431, but is not limited thereto.

[0090] As an example, the display panel 110 may include at least one thin film transistor disposed on a lower display substrate 401 and a liquid crystal display layer 431 disposed on the thin film transistor, but is not limited thereto.

[0091] The display panel 110 may further include an upper display substrate 441. As an example, the liquid crystal display layer 431 may be disposed between the lower display substrate 401 and the upper display substrate 441.

[0092] As an example, at least one of the lower display substrate 401 or the upper display substrate 441 may have a thickness of 0.5T or more and 1.0T or less, but is not limited thereto.

[0093] For example, the lower display substrate 401 may have a thickness of 0.5T or more and 1.0T or less. When the thickness of the lower display substrate 401 satisfies the above range, stress can be released, thereby preventing delamination between layers.

[0094] As an example, the upper display substrate 441 may have a thickness of 0.5T or greater and 1.0T or less. When the thickness of the upper display substrate 441 satisfies the above range, stress can be released, thereby preventing delamination between layers.

[0095] The thin film transistors disposed on the lower display substrate 401 may include a gate 411 formed on the lower display substrate 401, a gate insulating layer 421 formed on the gate 411, an active layer 412 formed on the gate insulating layer 421, and a source 413 and a drain 414 formed on the active layer 412. A protective layer 423 may be formed on the thin film transistors. Specifically, the protective layer 423 may be disposed on the thin film transistors and the lower display substrate 401.

[0096] The black matrix 443 and the color filter layer 445 may be disposed on the upper display substrate 441. The black matrix 443 may be disposed between the upper display substrate 441 and the color filter layer 445. The black matrix 443 is used to prevent light from leaking into areas where no actual image is realized, such as areas where gate lines, data lines, and thin film transistors are formed, to prevent deterioration of image quality, and may block light from being transmitted to these areas.

[0097] The color filter layer 445 may include a plurality of color filters, such as R, G, and B color filters, without being limited thereto, and may realize an image by implementing a color corresponding to the light passing through it. In this case, in the color filter layer 445, color filters of the same color may be arranged in stripes. In addition, an overcoat layer 447 may be formed on the color filter layer 445 to flatten the upper display substrate 441 and protect the color filter layer 445.

[0098] The columnar spacers 433 may be formed between the lower display substrate 401 and the upper display substrate 441. In other words, the columnar spacers 433 may be formed on the lower display substrate 401 or the upper display substrate 441. For example, the columnar spacers 433 may be disposed on the overcoat layer 447 formed on the upper display substrate 441. In other words, the columnar spacers 433 may be formed between the lower display substrate 401 and the overcoat layer 447.

[0099] The columnar spacers 433 may maintain the gap between the lower display substrate 401 and the upper display substrate 441. The thickness of the liquid crystal display layer 431 may be kept constant by the columnar spacers 433. For example, the columnar spacers 433 may be disposed between the liquid crystal display layers 431. However, the present disclosure is not limited thereto.

[0100] As an example, the columnar spacers 433 may be distributed at an arrangement density of 100 ppm or greater and 750 ppm or less, without being limited thereto.

[0101] When the arrangement density of the columnar spacers 433 satisfies the above range, even when the display panel 110 and the functional member 300 are joined through the adhesive layer 200, the cell gap can be kept constant, thereby preventing or reducing non-uniform defects.

[0102] The columnar spacers 433 may contact the protective layer of the lower display substrate 401 to keep the cell gap of the display panel 110 constant.

[0103] The adhesive layer 200 and the functional member 300 may be disposed on the upper display substrate 441 of the display panel 110, and the display panel 110 and the functional member 300 may be joined through the adhesive layer 200. When two or more functional members 300 are disposed to overlap each other on the display panel 110, the above adhesive layer 200 may be disposed between the functional members 300 so that the functional members 300 can be joined together.

[0104] The backlight unit may be disposed below the display panel 110. The display panel 110 may use the light provided from the backlight unit to generate an image to be provided to a user.

[0105] Figure 4 is a cross-sectional view schematically showing the structure of an organic light-emitting display device according to an exemplary embodiment of the present disclosure. For example, Figure 4 is a view schematically showing a cross-section taken along line I-I’ of Figure 1 The content that is the same as or similar to that described with reference to Figures 1 to 3 is omitted from the following description or briefly described below.

[0106] Referring to Figure 4 , the display device 100 according to an exemplary embodiment of the present disclosure may include a display panel 110, an adhesive layer 200, a functional member 300, etc. The display panel 110 may include an organic light-emitting display panel including an organic light-emitting element 510, but is not limited thereto.

[0107] As an example, the display panel 110 may include at least one thin film transistor disposed on a display substrate 501 and an organic light-emitting element 510 disposed on the thin film transistor, but is not limited thereto.

[0108] The thin film transistor may include an active layer 503, a gate 505, a source 507, and a drain 508. A planarization layer 509 may be disposed on the thin film transistor.

[0109] The organic electroluminescent element 510 may include a first electrode 511, a light-emitting layer 512, and a second electrode 513. For example, the light-emitting layer 512 may include one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL), but the present disclosure is not limited thereto.

[0110] Specifically, the display substrate 501 may have a thickness of 0.5T or more and 1.0T or less, but is not limited thereto. When the thickness of the display substrate 501 satisfies the above range, stress can be released, thereby preventing interlayer delamination.

[0111] The buffer layer 502 may be provided on the display substrate 501. The active layer 503 may be provided on the buffer layer 502.

[0112] The buffer layer 502 may include an inorganic insulating material, such as silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON), but the present disclosure is not limited thereto.

[0113] In Figure 4 , the buffer layer 502 has a single-layer structure, but the buffer layer 502 of the present disclosure may have a multi-layer structure. The buffer layer 502 is used to prevent moisture from penetrating from the outside.

[0114] If the buffer layer 502 has a multi-layer structure, layers including at least three inorganic insulating materials among inorganic materials such as silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON) may be alternately provided, but the present disclosure is not limited thereto.

[0115] In the following description, for convenience, a structure in which the buffer layer 502 is a single layer is described.

[0116] The active layer 503 of the thin film transistor may be provided on the buffer layer 502.

[0117] The active layer 503 may be various types of semiconductor layers. For example, the active layer 503 may be one selected from an oxide semiconductor, an amorphous silicon semiconductor, and a polycrystalline silicon semiconductor, but the present disclosure is not limited thereto.

[0118] The gate insulating film 504 may be provided on the active layer 503, and the gate 505 may be provided on the gate insulating film 504, but the present disclosure is not limited thereto. Specifically, the gate insulating film 504 may be provided on a part of the upper surface of the active layer 503. The gate insulating film 504 is an insulating layer for insulating the active layer 503 and the gate 505 from each other.

[0119] The gate insulating film 504 may include an inorganic insulating material such as silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON), but the present disclosure is not limited thereto.

[0120] Although Figure 4 a structure in which the gate insulating film 504 is disposed on a part of the upper surface of the active layer 503 is shown, the present disclosure is not limited thereto, and the gate insulating film 504 is disposed to cover the active layer 503.

[0121] The gate 505 of the thin film transistor may be disposed on the gate insulating film 504. Specifically, the gate insulating film 504 may be disposed between the active layer 503 and the gate 505 of the thin film transistor.

[0122] The gate 505 may include any one of metals such as aluminum (Al), gold (Au), silver (Ag), copper (Cu), tungsten (W), molybdenum (Mo), chromium (Cr), tantalum (Ta), and titanium (Ti) or an alloy thereof, but the present disclosure is not limited thereto.

[0123] The interlayer insulating layer 506 may be disposed on the gate 505. Specifically, the interlayer insulating layer 506 may be disposed on the buffer layer 502 and the gate 505.

[0124] The interlayer insulating layer 506 may include an inorganic insulating material such as silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON), but embodiments of the present disclosure are not limited thereto.

[0125] The source 507 and the drain 508 of the thin film transistor may be disposed on the interlayer insulating layer 506 and may be spaced apart from each other.

[0126] In an exemplary embodiment of the present disclosure, 507 may be the drain and 508 may be the source, but the present disclosure is not limited thereto. In addition, 507 may be the source and 508 may be the drain.

[0127] The source 507 and the drain 508 may include any one of metals such as aluminum (Al), gold (Au), silver (Ag), copper (Cu), tungsten (W), molybdenum (Mo), chromium (Cr), tantalum (Ta), and titanium (Ti) or an alloy thereof, but the present disclosure is not limited thereto.

[0128] Each of the source 507 and the drain 508 may be connected to a part of the upper surface of the active layer 503 through a contact hole provided in the interlayer insulating layer 506.

[0129] A planarization layer 509 may be provided on a display substrate 501 on which a source electrode 507 and a drain electrode 508 are provided. The planarization layer 509 may be provided to cover the interlayer insulating layer 506, the source electrode 507, and the drain electrode 508.

[0130] A protective film including an inorganic insulating material may also be provided under the planarization layer 509, but the present disclosure is not limited thereto.

[0131] The first electrode 511 of the organic electroluminescent element 510 may be provided on a part of the upper surface of the planarization layer 509.

[0132] The first electrode 511 may be electrically connected to the drain electrode 508 of the thin film transistor through a contact hole provided in the planarization layer 509. Although Figure 4 a structure in which the first electrode 511 is connected to the drain electrode 508 of the thin film transistor is shown, the present disclosure is not limited thereto, and the first electrode 511 may be connected to the source electrode 507 of the thin film transistor.

[0133] Although Figure 4 a structure in which the first electrode 511 is a single layer is shown, the present disclosure is not limited thereto. For example, the first electrode 511 may have a multi-layer structure of two or more layers.

[0134] The first electrode 511 may include a reflective electrode. For example, the first electrode 511 may include a metal material such as Au, W, Pt, Si, Ir, Ag, Cu, Ni, Ti, or Cr and alloys thereof, and the present disclosure is not limited thereto.

[0135] Specifically, if the first electrode 511 has a single layer structure, the first electrode 511 may be a reflective electrode including a reflective conductive material.

[0136] If the first electrode 511 has a multi-layer structure, at least one layer may be a reflective electrode including a reflective conductive material. Other layers than the reflective electrode may be layers formed of a transparent conductive material such as ITO indium tin oxide or IZO indium zinc oxide.

[0137] A bank 520 may be provided on the planarization layer 509. The bank 520 may include an insulating material. As an example, the bank 520 may include an organic insulating material such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and / or polyimide resin, etc. Alternatively, the bank 520 may include an inorganic insulating material such as silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide, etc. In addition, the bank 520 may include a black dye to absorb light incident from the outside.

[0138] The bank portion 520 may have a matrix grid structure throughout the display substrate 501. The bank portion 520 surrounds the edge of the first electrode 511 and exposes a part of the first electrode 511. The bank portion 520 may include an opening that exposes a part of the first electrode 511 to define a light-emitting region EA.

[0139] The bank portion 520 may define a light-emitting region EA and a non-light-emitting region NEA in the display region DA of the display device 100. For example, the region where the bank portion 520 is disposed in the display region DA may be the non-light-emitting region NEA, and the region where the bank portion 520 is not disposed in the display region DA may be the light-emitting region EA.

[0140] The light-emitting layer 512 of the organic electroluminescent element 510 may be disposed on the first electrode 511.

[0141] The light-emitting layer 512 may be disposed on the part of the upper surface of the first electrode 511 exposed by the bank portion 520.

[0142] Although Figure 4 it is shown that the light-emitting layer 512 has a single-layer structure, the present disclosure is not limited thereto. The light-emitting layer 512 may be formed of multiple organic layers.

[0143] The light-emitting layer 512 may emit light of at least one of red (R), green (G), and blue (B). However, the present disclosure is not limited thereto, and the light-emitting layer 512 may emit light of other colors, such as white (W). In addition, the light-emitting layer 512 may emit light such as cyan, magenta, or yellow, and the present disclosure is not limited thereto.

[0144] In the display device 100 according to an exemplary embodiment of the present disclosure, the light-emitting element has been described as the organic electroluminescent element 510, but the light-emitting element may include any one of an organic electroluminescent element, a quantum dot light-emitting element, a micro LED, or a mini LED, and the present disclosure is not limited thereto.

[0145] The second electrode 513 of the organic electroluminescent element 510 may be disposed on the display substrate 501 on which the light-emitting layer 512 is disposed.

[0146] The second electrode 513 may include a transparent conductive material or a semi-transmissive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), and the present disclosure is not limited thereto.

[0147] Although Figure 4 it is shown that the second electrode 513 has a single-layer structure, the present disclosure is not limited thereto, and the second electrode 213 may have a multi-layer structure of two or more layers.

[0148] The encapsulation layer 530 may be disposed on the second electrode 513.

[0149] Specifically, the encapsulation layer 530 may include a first encapsulation layer 531 disposed on the second electrode 513, a second encapsulation layer 532 disposed on the first encapsulation layer 531, and a third encapsulation layer 533 disposed on the second encapsulation layer 532. The first encapsulation layer 531 and the third encapsulation layer 533 may include an inorganic insulating material, and the second encapsulation layer 532 may include an organic insulating material. The first encapsulation layer 531 and the third encapsulation layer 533 may be made of an inorganic insulating material such as silicon oxide SiOx, silicon nitride SiNx, silicon nitride oxide SiNxOy, or aluminum oxide AlyOz. However, the present disclosure is not limited thereto. The second encapsulation layer 532 may be made of an organic insulating material, for example, silicon carbide SiOxCz or an acrylic or epoxy resin. However, the present disclosure is not limited thereto.

[0150] The first encapsulation layer 531 and the third encapsulation layer 533 including an inorganic insulating material may serve to prevent penetration of moisture and oxygen, and the second encapsulation layer 532 including an organic insulating material may serve to delay movement of a small amount of moisture and oxygen penetrated through the third encapsulation layer 533 .

[0151] The adhesive layer 200 and the functional member 300 may be disposed on the third encapsulation layer 533 of the display panel 110 , and the display panel 110 and the functional member 300 may be bonded by the adhesive layer 200 .

[0152] Figure 5 , Figure 6 , Figure 7 and Figure 8 is a cross-sectional view showing another example of a display device according to an exemplary embodiment of the present disclosure. For example, Figures 5 to 8 Each is schematically shown along Figure 1 FIG. 1 is a cross-sectional view of the line II' of FIG. Figures 1 to 4 The contents that describe the same or similar contents are omitted from the following description or described briefly.

[0153] Figure 5 600 is a diagram showing an example in which the functional component is a cover window 600 .

[0154] Reference Figure 5 , the display device 100 according to an exemplary embodiment of the present disclosure may include a display panel 110, an adhesive layer 200, and a cover window 600. The adhesive layer 200 may be disposed between the display panel 110 and the cover window 600.

[0155] The cover window 600 may include a glass substrate 610 . Further, the cover window 600 may further include a protective layer 620 disposed on the glass substrate 610 .

[0156] The glass substrate 610 may be tempered glass. However, the present disclosure is not limited thereto. The protective layer 620 may be disposed on the front surface of the display device 100. The protective layer 620 may transmit the image provided from the display panel 110 as it is, and may protect the glass substrate 610 from external impacts.

[0157] As an example, the glass substrate 610 may have a thickness of 0.5T or more and 1.0T or less. When the thickness of the glass substrate 610 satisfies the above range, stress can be released to prevent delamination.

[0158] The glass substrate 610 of the adhesive layer 200 and the cover window 600 may be disposed on the display panel 110, and the display panel 110 and the cover window 600 may be joined through the adhesive layer 200.

[0159] Figure 6 It is a diagram showing an example in which the functional member is the barrier panel 700.

[0160] Refer to Figure 6 , the display device 100 according to an exemplary embodiment of the present disclosure may include a display panel 110, an adhesive layer 200, a barrier panel 700, etc. The adhesive layer 200 may be disposed between the display panel 110 and the barrier panel 700.

[0161] The barrier panel 700 may include a lower base substrate 710, an upper base substrate 720, and a barrier liquid crystal layer 730 disposed between the lower base substrate 710 and the upper base substrate 720.

[0162] The base substrate may include a lower base substrate 710 and an upper base substrate 720 facing each other.

[0163] As an example, at least one of the lower base substrate 710 or the upper base substrate 720 may have a thickness of 0.5T or more and 1.0T or less, without being limited thereto.

[0164] For example, the lower base substrate 710 may have a thickness of 0.5T or more and 1.0T or less. When the thickness of the lower base substrate 710 satisfies the above range, stress can be released to prevent delamination.

[0165] For example, the upper base substrate 720 may have a thickness of 0.5T or more and 1.0T or less. When the thickness of the upper base substrate 720 satisfies the above range, stress can be released to prevent delamination.

[0166] The light-transmitting regions formed in the barrier panel 700 by an electric signal may each have a bar shape. The display panel 110 may use the light separated by the barrier panel 700 to generate a left-eye image provided to the user's left eye and a right-eye image provided to the user's right eye.

[0167] The barrier panel 700 can be controlled to selectively provide 2D images and 3D images to the user, without limitation thereto.

[0168] In addition, the barrier panel 700 can include channel electrodes 740 disposed side by side between a lower substrate 710 and a barrier liquid crystal layer 730, and a common electrode layer 750 disposed between the barrier liquid crystal layer 730 and an upper substrate 720.

[0169] The channel electrodes 740 can include a first channel electrode 741 and a second channel electrode 742 insulated by a channel insulating film 714. The channel insulating film 714 can be disposed on the first channel electrode 741 and the barrier insulating film 712. The positions of the light-shielding regions and the light-transmitting regions formed by the voltages applied to each channel electrode 740 in the barrier panel 700 can be precisely controlled.

[0170] The barrier insulating film 712 can be disposed between the lower substrate 710 and the channel electrodes 740. The barrier insulating film 712 can be disposed on the lower substrate 710. The barrier insulating film 712 can prevent damage to the lower substrate 710 caused by the process of forming the channel electrodes 740. The barrier insulating film 712 can include an insulating material.

[0171] Barrier spacers 733 can be formed between the lower substrate 710 and the upper substrate 720. The barrier spacers 733 can maintain the gap between the lower substrate 710 and the upper substrate 720. The thickness of the barrier liquid crystal layer 730 can be kept constant by the barrier spacers 733. For example, the barrier spacers 733 can be disposed between the barrier liquid crystal layers 730. The barrier spacers 733 can be disposed to cover the second channel electrode 742 and the channel insulating film 714.

[0172] As an example, the barrier spacers 733 can be distributed with an arrangement density of 100 ppm or more and 750 ppm or less, without limitation thereto.

[0173] When the arrangement density of the barrier spacers 733 satisfies the above range, even if the display panel 110 and the barrier panel 700 are joined to each other through an adhesive layer 200, the cell gap can be kept constant, thereby preventing or reducing non-uniform defects.

[0174] The adhesive layer 200 and the barrier panel 700 as a functional member 300 can be disposed on the upper display substrate 441 of the display panel 110, and the display panel 110 and the barrier panel 700 as a functional member 300 can be joined through the adhesive layer 200.

[0175] The adhesive layer 200 and the lower base substrate 710 of the barrier panel 700 may be disposed on the display panel 110, and the display panel 110 and the barrier panel 700 may be joined by the adhesive layer 200.

[0176] Figure 7 and Figure 8 is a diagram showing an example including a plurality of functional members.

[0177] Referring Figure 7 to, the display device 100 according to an exemplary embodiment of the present disclosure may include a display panel 110, an adhesive layer 200, and a plurality of functional members 800. The adhesive layer 200 may be disposed between the display panel 110 and the plurality of functional members 800. The display panel 110 and the plurality of functional members 800 are joined by the adhesive layer 200.

[0178] The plurality of functional members 800 may include a first functional member 810, a first additional adhesive layer 815, and a second functional member 820. The first additional adhesive layer 815 may be disposed between the first functional member 810 and the second functional member 820. The first functional member 810 and the second functional member 820 are joined by the first additional adhesive layer 815.

[0179] The first functional member 810 may be a functional panel such as a touch panel or a 3D barrier panel, but is not limited thereto. The first functional member 810 may be a light control film for adjusting the viewing angle area of the display device. In an exemplary embodiment of the present disclosure, the first functional member 810 is not limited to the above substrate or panel.

[0180] As an example, the first functional member 810 may include a base substrate.

[0181] The base substrate may have a thickness of 0.5T or more and 1.0T or less. When the thickness of the base substrate satisfies the above range, stress can be released, thereby preventing delamination.

[0182] The second functional member 820 may be a cover window for protecting the display device, or may be a functional panel such as a touch panel or a 3D barrier panel, but is not limited thereto. The second functional member 820 may be a light control film for adjusting the viewing angle area of the display device. In an exemplary embodiment of the present disclosure, the functional member is not limited to the above substrate or panel.

[0183] As an example, the second functional member 820 may include a base substrate.

[0184] The base substrate may have a thickness of 0.5T or more and 1.0T or less. When the thickness of the base substrate satisfies the above range, stress can be released, thereby preventing delamination.

[0185] The first functional component 810 and the second functional component 820 may be different substrates or panels among the above-mentioned substrates or panels.

[0186] The first additional adhesive layer 815 disposed between the first functional component 810 and the second functional component 820 may have a low modulus and high creep, prevent or reduce non-uniform defects, and relieve stress on the outside even at high temperatures, thereby providing enhanced adhesive strength.

[0187] As an example, the first additional adhesive layer 815 may have a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and may have a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature higher than the first temperature, but is not limited thereto.

[0188] Specifically, the first additional adhesive layer 815 may have a creep value of 100% or more and a storage modulus value of 55 KPa or less at a temperature of 25 °C, and may have a creep value of 130% or more and a storage modulus value of 20 KPa or less at a temperature of 105 °C, but is not limited thereto.

[0189] The first additional adhesive layer 815 may have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25 °C, but is not limited thereto.

[0190] The first additional adhesive layer 815 may have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105 °C, but is not limited thereto.

[0191] The first additional adhesive layer 815 may have a creep value of 100% or more and 250% or less, and a storage modulus value of 34 KPa or more and 55 KPa or less at a temperature of 25 °C, but is not limited thereto.

[0192] The first additional adhesive layer 815 may have a creep value of 130% or more and 350% or less, and a storage modulus value of 4 KPa or more and 20 KPa or less at a temperature of 105 °C, but is not limited thereto.

[0193] When the creep value and the storage modulus value satisfy the above ranges at the temperatures of 25 °C and 105 °C, the first additional adhesive layer 815 can prevent or reduce non-uniform defects, and can have enhanced adhesive strength by releasing stress to the outside even at high temperatures.

[0194] As an example, the first additional adhesive layer 815 may also have a thickness of 150 μm or greater and 750 μm or less, a thickness of 200 μm or greater and 400 μm or less, and a thickness of 250 μm or greater and 350 μm or less, but is not limited thereto. In addition, other suitable thicknesses of the first additional adhesive layer 815 are possible as long as the display panel can reduce the stress received from the outside to prevent or reduce non-uniform defects, and can have enhanced adhesive strength by releasing the stress to the outside even at high temperatures.

[0195] When the thickness of the first additional adhesive layer 815 satisfies the above range, the display panel can reduce the stress received from the outside to prevent or reduce non-uniform defects, and can have enhanced adhesive strength by releasing the stress to the outside even at high temperatures.

[0196] Referring to Figure 8 , the display device 100 according to an exemplary embodiment of the present disclosure may include a display panel 110, an adhesive layer 200, and a plurality of functional members 900. The adhesive layer 200 may be disposed between the display panel 110 and the plurality of functional members 900. The display panel 110 and the plurality of functional members 900 are joined by the adhesive layer 200.

[0197] The plurality of functional members 900 may include a first functional member 910, a first additional adhesive layer 915, a second functional member 920, a second additional adhesive layer 925, and a third functional member 930. The first additional adhesive layer 915 may be disposed between the first functional member 910 and the second functional member 920. The second additional adhesive layer 925 may be disposed between the third functional member 930 and the second functional member 920.

[0198] The first functional member 910 may be a functional panel such as a touch panel or a 3D barrier panel, but is not limited thereto. The first functional member 910 may be a light control film for adjusting the viewing angle region of the display device. In an exemplary embodiment of the present disclosure, the first functional member 910 is not limited to the above substrate or panel.

[0199] As an example, the first functional member 910 may include a base substrate.

[0200] The base substrate may have a thickness of 0.5T or greater and 1.0T or less. When the thickness of the base substrate satisfies the above range, stress can be released, thereby preventing delamination between layers.

[0201] The second functional member 920 may be a cover window for protecting the display device, or may be a functional panel such as a touch panel or a 3D barrier panel, but is not limited thereto. The second functional member 920 may be a light control film for adjusting the viewing angle area of the display device. In an exemplary embodiment of the present disclosure, the functional member is not limited to the above substrate or panel.

[0202] As an example, the second functional member 920 may include a base substrate.

[0203] The base substrate may have a thickness of 0.5T or more and 1.0T or less. When the thickness of the base substrate satisfies the above range, stress can be released, thereby preventing delamination.

[0204] The third functional member 930 may be a cover window for protecting the display device, or may be a functional panel such as a touch panel or a 3D barrier panel. The third functional member 930 may be a light control film for adjusting the viewing angle area of the display device. In an exemplary embodiment of the present disclosure, the functional member is not limited to the above substrate or panel.

[0205] The third functional member 930 may include a base substrate.

[0206] The base substrate may have a thickness of 0.5T or more and 1.0T or less. When the thickness of the base substrate satisfies the above range, stress can be released, thereby preventing delamination.

[0207] The first functional member 910, the second functional member 920, and the third functional member 930 may be different substrates or panels among the above substrates or panels.

[0208] The first additional adhesive layer 915 may be disposed between the first functional member 910 and the second functional member 920. The second additional adhesive layer 925 may be disposed between the second functional member 920 and the third functional member 930. The first additional adhesive layer 915 and the second additional adhesive layer 925 may each independently have a low modulus and high creep, thereby preventing or reducing non-uniform defects and even reducing stress on the outside at high temperatures, thereby providing enhanced adhesive strength.

[0209] Specifically, the first additional adhesive layer 915 and the second additional adhesive layer 925 may each independently have a creep value of 100% or more and a storage modulus value of 55 KPa or less at a temperature of 25°C, and a creep value of 130% or more and a storage modulus value of 20 KPa or less at a temperature of 105°C, but is not limited thereto.

[0210] The first additional adhesive layer 915 and the second additional adhesive layer 925 may each independently have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25°C, but are not limited thereto.

[0211] The first additional adhesive layer 915 and the second additional adhesive layer 925 may each independently have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105°C, but are not limited thereto.

[0212] The first additional adhesive layer 915 and the second additional adhesive layer 925 may each independently have a creep value of 100% or more and 250% or less, and a storage modulus value of 34 KPa or more and 55 KPa or less at a temperature of 25°C, but are not limited thereto.

[0213] The first additional adhesive layer 915 and the second additional adhesive layer 925 may each independently have a creep value of 130% or more and 350% or less, and a storage modulus value of 4 KPa or more and 20 KPa or less at a temperature of 105°C, but are not limited thereto.

[0214] When the creep value and the storage modulus value satisfy the above ranges at the temperatures of 25°C and 105°C, the first additional adhesive layer 915 and the second additional adhesive layer 925 can prevent or reduce non-uniform defects, and can have enhanced adhesive strength by releasing stress to the outside even at high temperatures.

[0215] As an example, the first additional adhesive layer 915 and the second additional adhesive layer 925 may each independently also have a thickness of 150 μm or more and 750 μm or less, a thickness of 200 μm or more and 400 μm or less, and a thickness of 250 μm or more and 350 μm or less, but are not limited thereto. Additionally, other suitable thicknesses of the first additional adhesive layer 915 and the second additional adhesive layer 925 are possible as long as the display panel can reduce the stress received from the outside to prevent or reduce non-uniform defects, and can have enhanced adhesive strength by releasing stress to the outside even at high temperatures.

[0216] When the thicknesses of the first additional adhesive layer 915 and the second additional adhesive layer 92 satisfy the above ranges, the display panel can reduce the stress received from the outside to prevent or reduce non-uniform defects, and can have enhanced adhesive strength by releasing stress to the outside even at high temperatures.

[0217] The display device according to the exemplary embodiments of the present disclosure will be described in detail below in conjunction with the embodiments, but the embodiments of the present disclosure are not limited to the following embodiments.

[0218] [Experimental Example]

[0219] Use the adhesive materials of Embodiments 1 to 4 and Comparative Examples 1 to 4 having the physical properties shown in Table 1 below to form an adhesive layer between the display panel and the cover window.

[0220] [Table 1]

[0221]

[0222] Table 2 below shows the physical property results related to 500 - hour operation, storage evaluation, and reliability.

[0223] [Table 2]

[0224]

[0225] Referring to Table 2, it can be confirmed that in Embodiments 1 to 4 including the adhesive materials according to the exemplary embodiments of the present disclosure, no or no obvious gridding, banding, and four - side yellowing occurred during the operation and storage evaluations. In addition, it can be recognized that all of Embodiments 1 to 4 including the adhesive materials according to the exemplary embodiments of the present disclosure satisfy the reliability evaluation.

[0226] In contrast, it can be confirmed that in Comparative Examples 1 to 4, gridding, banding, and four - side yellowing occurred during the operation and storage evaluations. It can also be confirmed that none of Comparative Examples 1 to 4 can satisfy the reliability evaluation.

[0227] Table 3 below shows various ratios of creep and modulus of the adhesive materials of Embodiments 1 to 4 and Comparative Examples 1 to 4 having the physical properties shown in Table 1.

[0228] [Table 3]

[0229]

[0230] Referring to Table 3, it can be confirmed that for Embodiments 1 to 4, the modulus ratio MR of the modulus at two temperatures (105 °C / 25 °C) can range from about 0.117 to about 0.370, while for Comparative Examples 1 to 4, the modulus ratio MR of the modulus at two temperatures (105 °C / 25 °C) can range from about 0.500 to about 0.567. Therefore, for Embodiments 1 to 4, the modulus ratio MR of the modulus at two temperatures (105 °C / 25 °C) can be less than about 0.500. However, the embodiments of the present disclosure are not limited thereto.

[0231]

[222] In addition, it can be confirmed that, for Embodiments 1 to 4, the range of the creep ratio CR of creep at two temperatures (105 °C / 25 °C) can be from about 0.975 to about 1.513, while for Comparative Examples 1 to 4, the range of the creep ratio CR of creep at two temperatures (105 °C / 25 °C) can be from about 0.541 to about 1.090. Therefore, for Embodiments 1 to 4, the creep ratio CR of creep at two temperatures (105 °C / 25 °C) can be greater than about 0.975, for example, greater than about 1.090. However, the embodiments of the present disclosure are not limited thereto.

[0232]

[223] Furthermore, for Embodiments 1 to 4, the range of the ratio of MR to CR (MR / CR) can be from about 0.120 to about 0.290, while for Comparative Examples 1 to 4, the range of the ratio of MR to CR (MR / CR) can be from about 0.467 to about 0.953. Therefore, the ratio of MR to CR (MR / CR) can be less than about 0.467. However, the embodiments of the present disclosure are not limited thereto.

[0233] The above embodiments of the present disclosure will be briefly described below.

[0234] According to an exemplary embodiment of the present disclosure, a display device can be provided, the display device including a display panel that outputs an image, a functional member disposed on the display panel, and an adhesive layer disposed between the display panel and the functional member, wherein the adhesive layer has a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and has a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature higher than the first temperature.

[0235] In the display device according to an exemplary embodiment of the present disclosure, the first temperature can be 25 °C and the second temperature can be 105 °C.

[0236] In the display device according to an exemplary embodiment of the present disclosure, the adhesive layer can have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25 °C.

[0237] In the display device according to an exemplary embodiment of the present disclosure, the adhesive layer can have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105 °C.

[0238] In the display device according to an exemplary embodiment of the present disclosure, the adhesive layer can have a thickness of 150 μm or more and 500 μm or less.

[0239] In the display device according to an exemplary embodiment of the present disclosure, the functional member includes a base substrate, and the base substrate can have a thickness of 0.5T or more and 1.0T or less.

[0240] In a display device according to an exemplary embodiment of the present disclosure, a base substrate includes an upper base substrate and a lower base substrate facing each other, and at least one of the upper base substrate and the lower base substrate may have a thickness of 0.5T or more and 1.0T or less.

[0241] In a display device according to an exemplary embodiment of the present disclosure, a display panel includes a display substrate, and the display substrate may have a thickness of 0.5T or more and 1.0T or less.

[0242] In a display device according to an exemplary embodiment of the present disclosure, the display panel may include: a display substrate including an upper display substrate and a lower display substrate; columnar spacers disposed on the upper display substrate or the lower display substrate; and a display liquid crystal layer disposed between the upper display substrate and the lower display substrate. The columnar spacers may be distributed at an arrangement density of 100 ppm or more and 750 ppm or less.

[0243] In a display device according to an exemplary embodiment of the present disclosure, the display panel may include a light-emitting element including a first electrode disposed on a display substrate, a light-emitting layer disposed on the first electrode, and a second electrode disposed on the light-emitting layer. The light-emitting element may be any one of an organic electroluminescent element, a quantum dot light-emitting element, a micro light-emitting diode (LED), and a mini LED, and the present disclosure is not limited thereto.

[0244] In a display device according to an exemplary embodiment of the present disclosure, the functional member may be any one of a cover window, a touch panel, a barrier panel, and a light control film.

[0245] In a display device according to an exemplary embodiment of the present disclosure, a modulus ratio (MR) of the adhesive layer at a second temperature to that at a first temperature may be in a range from about 0.117 to about 0.370.

[0246] In a display device according to an exemplary embodiment of the present disclosure, a creep ratio (CR) of the adhesive layer at a second temperature to that at a first temperature may be in a range from about 0.975 to about 1.513.

[0247] In a display device according to an exemplary embodiment of the present disclosure, a ratio (MR / CR) of MR to CR of the adhesive layer may be in a range from about 0.120 to about 0.290.

[0248] According to an exemplary embodiment of the present disclosure, a display device may be provided, the display device including a display panel that outputs an image, a first functional member disposed on the display panel, a second functional member disposed on the first functional member, and a first additional adhesive layer disposed between the first functional member and the second functional member, wherein the first additional adhesive layer has a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and has a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature higher than the first temperature.

[0249] In the display device according to an exemplary embodiment of the present disclosure, the first temperature may be 25 °C and the second temperature may be 105 °C.

[0250] In the display device according to an exemplary embodiment of the present disclosure, the first additional adhesive layer may have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25 °C.

[0251] In the display device according to an exemplary embodiment of the present disclosure, the first additional adhesive layer may have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105 °C.

[0252] In the display device according to an exemplary embodiment of the present disclosure, the first additional adhesive layer may have a thickness of 150 μm or more and 500 μm or less.

[0253] The display device according to an exemplary embodiment of the present disclosure may further include an adhesive layer disposed between the display panel and the first functional member, wherein the adhesive layer may have a creep value of 100% or more and a storage modulus value of 55 KPa or less at a temperature of 25 °C, and may have a creep value of 130% or more and a storage modulus value of 20 KPa or less at a temperature of 105 °C.

[0254] In the display device according to an exemplary embodiment of the present disclosure, the adhesive layer may have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25 °C.

[0255] In the display device according to an exemplary embodiment of the present disclosure, the adhesive layer may have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105 °C.

[0256] In the display device according to an exemplary embodiment of the present disclosure, the adhesive layer may have a thickness of 150 μm or more and 500 μm or less.

[0257] The display device according to an exemplary embodiment of the present disclosure may further include a first substrate included in the first functional member and a second substrate included in the second functional member. At least one of the first substrate and the second substrate may have a thickness of 0.5T or more and 1.0T or less.

[0258] The display device according to an exemplary embodiment of the present disclosure may further include a third functional member disposed on the second functional member and a second additional adhesive layer disposed between the second functional member and the third functional member. The second additional adhesive layer may have a creep value of 100% or more and a storage modulus value of 55 KPa or less at a temperature of 25 °C, and may have a creep value of 130% or more and a storage modulus value of 20 KPa or less at a temperature of 105 °C.

[0259] In the display device according to an exemplary embodiment of the present disclosure, the second additional adhesive layer may have a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25 °C.

[0260] In the display device according to an exemplary embodiment of the present disclosure, the second additional adhesive layer may have a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105 °C.

[0261] In the display device according to an exemplary embodiment of the present disclosure, the second additional adhesive layer may have a thickness of 150 μm or more and 500 μm or less.

[0262] In the display device according to an exemplary embodiment of the present disclosure, the display panel may be any one of a liquid crystal display panel, an organic electroluminescent display panel, a quantum dot display panel, a micro LED display panel, and a mini LED display panel.

[0263] According to an exemplary embodiment of the present disclosure, a display device may be provided, the display device including a display panel configured to output an image, a functional member disposed on the display panel, and an adhesive layer disposed between the display panel and the functional member. The adhesive layer may have a creep value of about 100% or more at a first temperature, and may have a creep value of about 130% or more at a second temperature higher than the first temperature.

[0264] In the display device according to an exemplary embodiment of the present disclosure, the adhesive layer may have a storage modulus value of about 55 KPa or less at the first temperature, and may have a storage modulus value of about 20 KPa or less at the second temperature.

[0265] The foregoing description has been presented to enable a person skilled in the art to make and use the inventive concept of the present disclosure and has been provided in the context of a particular application and its requirements. Various modifications, additions, and substitutions to the described embodiments will be apparent to a person skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present disclosure. The foregoing description and the drawings have provided examples of the inventive concept of the present disclosure for illustrative purposes only. For example, the disclosed embodiments are intended to illustrate the scope of the inventive concept of the present disclosure.

[0266] Cross - Reference to Related Applications

[0267] This application claims the priority and benefit of Korean Patent Application No. 10 - 2023 - 0197851, filed on December 29, 2023, which is incorporated herein by reference for all purposes as if fully set forth herein.

Claims

1. A display device, comprising: a display panel configured to output an image; a functional component, wherein the functional component is disposed on the display panel; as well as an adhesive layer disposed between the display panel and the functional member, The adhesive layer has a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and has a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature higher than the first temperature.

2. The display device according to claim 1, wherein: The first temperature is 25°C, and the second temperature is 105°C.

3. The display device according to claim 2, wherein: The adhesive layer has the creep value of 250% or less and the storage modulus value of 34 KPa or more at the temperature of 25°C.

4. The display device according to claim 2, wherein: The adhesive layer has the creep value of 350% or less and the storage modulus value of 4 KPa or more at the temperature of 105°C.

5. The display device according to claim 1, wherein: The adhesive layer has a thickness of 150 μm or more and 500 μm or less.

6. The display device according to claim 1, wherein: The functional component includes a base substrate, and Wherein, the base substrate has a thickness of 0.5T or more and 1.0T or less.

7. The display device according to claim 6, wherein: The base substrate includes an upper base substrate and a lower base substrate facing each other, and Wherein, at least one of the upper base substrate and the lower base substrate has the thickness of 0.5T or more and 1.0T or less.

8. The display device according to claim 1, wherein: The display panel includes a display substrate, and Wherein, the display substrate has a thickness of 0.5T or more and 1.0T or less.

9. The display device according to claim 8, wherein: The display panel comprises: The display substrate comprises an upper display substrate and a lower display substrate; a columnar spacer disposed on the upper display substrate or the lower display substrate; and a display liquid crystal layer, the display liquid crystal layer being located between the upper display substrate and the lower display substrate, and The columnar spacers are distributed at an arrangement density of 100 ppm or more and 750 ppm or less.

10. The display device according to claim 8, wherein: The display panel includes a light emitting element, and the light emitting element includes: a first electrode, wherein the first electrode is disposed on the display substrate; a light-emitting layer, the light-emitting layer being disposed on the first electrode; and a second electrode disposed on the light-emitting layer, and Wherein, the light-emitting element is any one of an organic electroluminescent element, a quantum dot light-emitting element, a micro light-emitting diode LED and a mini LED.

11. The display device according to claim 1, wherein: The functional component is any one of a cover window, a touch panel, a barrier panel, and a light control film.

12. The display device according to claim 1, wherein: The modulus ratio MR of the adhesive layer at the second temperature to the first temperature is in the range of from 0.117 to 0.370, or The creep ratio CR of the adhesive layer at the second temperature to the first temperature is in the range of from 0.975 to 1.513, or A ratio MR / CR of the MR to the CR of the adhesive layer ranges from 0.120 to 0.

290.

13. A display device, comprising: a display panel configured to output an image; a first functional component, the first functional component being disposed on the display panel; a second functional component, the second functional component being disposed on the first functional component; as well as a first additional adhesive layer, the first additional adhesive layer being arranged between the first functional component and the second functional component, The first additional adhesive layer has a creep value of 100% or more and a storage modulus value of 55 KPa or less at a first temperature, and has a creep value of 130% or more and a storage modulus value of 20 KPa or less at a second temperature.

14. The display device according to claim 13, wherein: The first additional adhesive layer has a creep value of 250% or less and a storage modulus value of 34 KPa or more at a temperature of 25°C.

15. The display device according to claim 13, wherein: The first additional adhesive layer has a creep value of 350% or less and a storage modulus value of 4 KPa or more at a temperature of 105°C.

16. The display device according to claim 13, wherein: The first additional adhesive layer has a thickness of 150 μm or more and 500 μm or less.

17. The display device according to claim 13, further comprising: a third functional component, the third functional component being disposed on the second functional component; as well as a second additional adhesive layer, the second additional adhesive layer being arranged between the second functional component and the third functional component, The second additional adhesive layer has a creep value of 100% or more and a storage modulus value of 55 KPa or less at the first temperature, and has a creep value of 130% or more and a storage modulus value of 20 KPa or less at the second temperature.

18. The display device according to claim 17, wherein: The second additional adhesive layer has a thickness of 150 μm or more and 500 μm or less.

19. A display device, comprising: a display panel configured to output an image; a functional component, wherein the functional component is disposed on the display panel; as well as an adhesive layer provided between the display panel and the functional member, The adhesive layer has a creep value of 100% or more at a first temperature, and has a creep value of 130% or more at a second temperature higher than the first temperature.

20. The display device according to claim 19, wherein: The adhesive layer has a storage modulus value of 55 KPa or less at the first temperature, and has a storage modulus value of 20 KPa or less at the second temperature.

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