Chip heat dissipation structure and terminal equipment

Abstract

The embodiment of the invention discloses a chip heat dissipation structure and terminal equipment. The chip heat dissipation structure comprises a circuit board, a chip set arranged on the circuit board, a cold plate arranged on the circuit board and a heat pipe, the chipset comprises a main chip and small chips arranged at the periphery of the main chip; one surface, facing the circuit board, of the cold plate is in contact with the main chip; and one end of the heat pipe is connected to one surface, deviating from the circuit board, of the cold plate, and the other end of the heat pipe is in contact with the small chip. In the chip heat dissipation structure provided by the embodiment of the invention, the heat pipe is respectively contacted with the cold plate and the small chip, so that the heat transfer path of the small chip can be effectively shortened, the thermal resistance of the chip set is reduced, and the heat dissipation effect of the chip heat dissipation structure is improved, thereby improving the computing power of the chip.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip manufacturing, and in particular relates to a chip heat dissipation structure and terminal equipment. Background Art

[0002] Chip heat dissipation is an important factor affecting chip computing power. Better chip heat dissipation will greatly improve the chip computing power. At present, a chip layout structure with a main chip and multiple small chips around it is more common. Generally, it is cooled by sharing a cold plate. The multiple small chips around it transfer heat to the heat dissipation bracket frame by contacting the heat dissipation bracket frame. A cold plate bracket frame will be set on the heat dissipation bracket frame. The cold plate in contact with the main chip is set on the cold plate bracket frame. Heat is transferred between the cold plate bracket frame and the heat dissipation bracket frame by setting a thermal pad, so as to achieve heat dissipation of the main chip and multiple small chips around it.

[0003] However, this chip heat dissipation structure has a long heat transfer path for the surrounding small chips, a large overall thermal resistance, and weak heat dissipation capacity, which will affect the overall heat dissipation effect; the cold plate bracket frame and the heat dissipation bracket frame are in hard contact through the thermal pad, and the tolerance and deformation of the thermal pad are likely to affect the contact between the cold plate and the main chip, affecting the heat dissipation of the main chip; in addition, the overall structure requires at least two installations of the heat dissipation bracket frame and the cold plate bracket frame, and the installation efficiency is low. Summary of the invention

[0004] In view of this, an embodiment of the present invention provides a chip heat dissipation structure and a terminal device, which are used to solve at least one technical problem existing in the current chip heat dissipation structure.

[0005] In a first aspect, an embodiment of the present invention provides a chip heat dissipation structure, which includes:

[0006] Circuit boards;

[0007] A chipset disposed on the circuit board, the chipset comprising a main chip and small chips disposed around the main chip;

[0008] A cold plate disposed on the circuit board, wherein a side of the cold plate facing the circuit board is in contact with the main chip;

[0009] A heat pipe, one end of which is connected to a side of the cold plate facing away from the circuit board, and the other end of which is in contact with the small chip.

[0010] Furthermore, it also includes a mounting bracket frame, the cold plate is arranged in the mounting bracket frame, and the mounting bracket frame is mounted on the circuit board by a first screw.

[0011] Furthermore, the cold plate is contact-connected with the main chip via a heat conducting sheet.

[0012] Furthermore, the heat pipe is contact-connected to the chiplet via a thermal pad.

[0013] Furthermore, a first spring is provided between the mounting bracket frame and the nail cap of the first screw, so that the distance between the mounting bracket frame and the circuit board can be adjusted.

[0014] Furthermore, the projection of the mounting bracket frame on the circuit board is between the main chip and the small chip.

[0015] Furthermore, it also includes a heat dissipation bracket frame, the heat dissipation bracket frame is connected to the circuit board through a second screw frame, and the mounting bracket frame is mounted on a side of the heat dissipation bracket frame away from the circuit board through the first screw;

[0016] One end of the heat pipe away from the cold plate contacts a side of the heat dissipation bracket frame away from the circuit board, the small chip contacts a side of the heat dissipation bracket frame facing the circuit board, and a side of the cold plate facing the circuit board passes through the heat dissipation bracket frame and contacts the main chip.

[0017] Furthermore, a second spring is provided between the heat dissipation bracket frame and the nail cap of the second screw, so that the distance between the heat dissipation bracket frame and the circuit board can be adjusted.

[0018] Furthermore, the contact point between the chiplet and the heat dissipation support frame is directly opposite to the contact point between the heat pipe and the heat dissipation support frame.

[0019] Furthermore, the chiplet is contact-connected to the heat dissipation bracket via a thermal pad.

[0020] Furthermore, a heat conducting block is provided in the heat dissipation bracket frame above the small chip, and the heat pipe and the small chip are both in contact with the heat conducting block.

[0021] Furthermore, a liquid inlet and a liquid outlet facing different directions are provided on a side of the cold plate facing away from the circuit board.

[0022] Furthermore, the heat pipe is a convex structure protruding above the circuit board.

[0023] Furthermore, a self-circulating cooling medium is provided in the heat pipe.

[0024] In a second aspect, an embodiment of the present invention further provides a terminal device, comprising:

[0025] The chip heat dissipation structure according to any one of the first aspects above.

[0026] In the chip heat dissipation structure and the terminal device provided by the embodiments of the present invention, the chip set provided on the circuit board includes a main chip and small chips provided around the main chip. The surface of the cold plate provided on the circuit board facing the circuit board is in contact with the main chip; one end of the heat pipe is connected to the surface of the cold plate facing away from the circuit board, and the other end of the heat pipe is in contact with the small chips. By being in contact with the cold plate and the small chips respectively through the heat pipe, the heat transfer path of the small chips can be effectively shortened, the thermal resistance of the chip set can be reduced, the heat dissipation effect of the chip heat dissipation structure can be improved, and thus the computing power of the chips can be improved. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0028] The drawings described herein are used to provide a further understanding of the present invention, and constitute a part of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0029] Figure 1 is a three-dimensional structure schematic diagram of a chip heat dissipation structure provided by an embodiment of the present invention;

[0030] Figure 2 is a frame structure schematic diagram of a chip heat dissipation structure provided by an embodiment of the present invention;

[0031] Figure 3 is another three-dimensional structure schematic diagram of a chip heat dissipation structure provided by an embodiment of the present invention;

[0032] Figure 4 is another frame structure schematic diagram of a chip heat dissipation structure provided by an embodiment of the present invention;

[0033] Figure 5 is another three-dimensional structure schematic diagram of a chip heat dissipation structure provided by an embodiment of the present invention;

[0034] Figure 6 is another frame structure schematic diagram of a chip heat dissipation structure provided by an embodiment of the present invention. Detailed Embodiments

[0035] The following will be described in detail in conjunction with the drawings and embodiments to illustrate the embodiments of the present invention, so as to fully understand how the present invention uses technical means to solve technical problems and achieve the realization process of technical effects and implement accordingly.

[0036] For example, certain words are used in the specification and claims to refer to specific components. It should be understood by those skilled in the art that hardware manufacturers may use different terms to refer to the same component. This specification and claims do not use differences in names as a way to distinguish components, but use differences in the functions of components as the criteria for distinction. For example, "including" mentioned throughout the specification and claims is an open term, so it should be interpreted as "including but not limited to". "Substantially" means that within an acceptable error range, those skilled in the art can solve the technical problem within a certain error range and basically achieve the technical effect. In addition, the term "coupled" or "electrically connected" herein includes any direct and indirect electrical coupling means. Therefore, if the text describes a first device coupled to a second device, it means that the first device can be directly electrically coupled to the second device, or indirectly electrically coupled to the second device through other devices or coupling means. The subsequent description of the specification is a preferred embodiment of the present invention, but the description is for the purpose of illustrating the general principles of the present invention and is not used to limit the scope of the present invention. The scope of protection of the present invention shall be determined by the definition of the attached claims.

[0037] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or system. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, commodity or system including the element. Specific embodiments

[0039] Please refer to Figure 1 , which is a three-dimensional structural schematic diagram of a chip heat dissipation structure provided in an embodiment of the present invention, wherein the chip heat dissipation structure includes a circuit board 10, a chipset 20 arranged on the circuit board 10, a cold plate 30 arranged on the circuit board 10, and a heat pipe 40.

[0040] Among them, the chipset 20 includes a main chip 210 and a small chip 220 arranged around the main chip 210; the cold plate 30 contacts the main chip 210 on a side facing the circuit board 10; one end of the heat pipe 40 is connected to a side of the cold plate 30 away from the circuit board 10, and the other end of the heat pipe 40 contacts the small chip 220.

[0041] Specifically, please combine Figure 2, which is a schematic diagram of a one-frame structure of a chip heat dissipation structure provided by an embodiment of the present invention. The circuit board 10 is a printed circuit board (PCB), which is a carrier for electronic components and their heat dissipation structures. The chip group 20, the cold plate 30, and the heat pipe 40 are all located on the circuit board 10. The main chip 210 and the small chips 220 are both arranged on the circuit board 10 to form the chip group 20. Generally, it is a combination of one main chip 210 and multiple small chips 220. Here, the number of small chips 220 is not limited. As shown in the figure, one small chip 220 is arranged on each side of the main chip 210. This is only an example. In actual applications, it can be freely configured according to different product forms and specific computing power requirements. The small chips 220 are arranged around the main chip 210 to provide auxiliary computing power for the main chip 210. The size of the cold plate 30 is generally slightly larger than the size of the main chip 210. It is located directly above the main chip 210. The outer edge of the cold plate 30 is directly connected to the circuit board 10 or connected above the circuit board 10 through structures such as brackets. When the cold plate 30 is connected to the circuit board 10, the side of the cold plate 30 facing the circuit board 10 just contacts the side of the main chip 210 facing away from the circuit board 10, so that the heat generated by the main chip 210 during operation can be quickly transferred to the cold plate 30. The cold plate 30 includes but is not limited to a water-cooling structure with a circulating cooling working medium inside. The cold plate 30 can quickly transfer the heat generated by the main chip 210 during operation, thereby playing a role in dissipating heat from the main chip 210. The heat pipe 40 is connected between the cold plate 30 and the small chips 220. The first end 410 of the heat pipe 40 contacts the side of the cold plate 30 facing away from the circuit board 10, and the second end 420 of the heat pipe 40 contacts the side of the small chips 220 facing away from the circuit board 10. The heat generated by the small chips 210 during operation can be quickly transferred to the heat pipe 40, and then the heat is transferred to the cold plate 30 through the heat pipe 40, thereby playing a role in dissipating heat from the small chips 220.

[0042] In the embodiment of the present invention, since there is only one heat pipe 40 for transferring heat between the small chips 220 and the cold plate 30, it can effectively shorten the heat transfer path for the small chips 220 to transfer heat to the cold plate 30, reduce the thermal resistance of the chip group 20, improve the heat dissipation effect of the chip heat dissipation structure, and thus improve the computing power of the chip.

[0043] Further, please combine Figures 3 - 4, in other preferred embodiments of the present invention, the chip heat dissipation structure further includes a mounting bracket frame 50, the cold plate 30 is disposed within the mounting bracket frame 50, and the mounting bracket frame 50 is mounted on the circuit board 10 by a first screw 510.

[0044] Here, the mounting bracket frame 50 can be regarded as a bracket for the cold plate 30. Its shape is similar to that of the cold plate 30, and its size is slightly larger than that of the cold plate 30. Its interior is a hollow structure. The cold plate 30 is connected within the mounting bracket frame 50. The specific connection methods include but are not limited to screw connection or snap connection, etc. A plurality of the first screw mounts 510 are provided along the edge of the mounting bracket frame 50 for one week, so as to connect the mounting bracket frame 50 to the circuit board 10. When the mounting bracket frame 50 is connected to the circuit board 10, the surface of the cold plate 30 facing the circuit board 10 just contacts the surface of the main chip 210 facing away from the circuit board 10.

[0045] Furthermore, a first spring 520 is provided between the mounting bracket frame 50 and the cap 5101 of the first screw 510, so that the distance between the mounting bracket frame 50 and the circuit board 10 can be adjusted.

[0046] Here, the distance between the mounting bracket frame 50 and the circuit board 10 is not fixed, but can be adjusted by a certain value. The purpose is to avoid the influence of device tolerances, thermal and cold deformations, etc. on the contact between the cold plate 30 and the main chip 210, and between the heat pipe 40 and the small chip 220, so that the cold plate 30 and the main chip 210, and between the cold plate heat pipe 40 and the small chip 220 are in close contact to ensure the necessary pressure and improve the heat transfer efficiency of the chip set 20. The specific method is to add the first spring 520 below the cap 5101 of the first screw 510. The bottom of the first spring 520 contacts the surface of the mounting bracket frame 50 facing away from the circuit board 10, so as to form a soft connection with a certain elastic redundant space between the mounting bracket frame 50 and the circuit board 10.

[0047] In addition, in other preferred embodiments of the present invention, the cold plate 30 and the main chip 210 are in contact connection through a heat conducting sheet 230.

[0048] Specifically, the heat-conducting sheet 230 is made of, including but not limited to, a thermal interface material (TIM, Thermal Interface Material, commonly known as thermal grease), which is disposed between the cold plate 30 and the main chip 210, has good heat-conducting performance, and can quickly and thoroughly transfer the heat generated by the main chip 210 during operation to the cold plate 30, so as to improve the heat dissipation efficiency of the main chip 210.

[0049] In addition, in other preferred embodiments of the present invention, the heat pipe 40 is in contact connection with the small chip 220 through a heat-conducting pad 240.

[0050] Specifically, the heat-conducting pad 240 is made of a heat-conducting material with good heat conductivity, has a certain thickness, and has elasticity and can be compressed. It is disposed between one end of the heat pipe 40 far from the cold plate 30 and the side of the small chip 220 facing away from the circuit board 10. On the one hand, it has a certain redundancy for devices with different tolerances around the small chip 220 to avoid device damage. On the other hand, it can quickly and thoroughly transfer the heat generated by the small chip 220 during operation to the heat pipe 40, and then transfer it to the cold plate 30, so as to improve the heat dissipation efficiency of the small chip 220.

[0051] In addition, in other embodiments of the present invention, the heat-conducting pad 240 can also be replaced by a heat-conducting gel, which can also achieve the above effects.

[0052] Further, the projection of the mounting bracket frame 50 on the circuit board 10 is between the main chip 210 and the small chip 220.

[0053] Specifically, the main chip 210 and the small chip 220 are usually arranged on the circuit board 10 with a certain spacing, and the mounting bracket frame 50 is arranged along this spacing, that is, the projection of the mounting bracket frame 50 on the circuit board 10 just falls within the spacing between the main chip 210 and the small chip 220; such a design is to ensure that the heat pipe 40 connecting the small chip 220 and the cold plate 30 has the minimum length, shorten the heat transfer path for the small chip 220 to transfer heat to the cold plate 30, so as to improve the heat dissipation efficiency of the small chip 220.

[0054] In addition, please refer to Figures 5 - 6 , in other preferred embodiments of the present invention, the chip heat dissipation structure further includes a heat dissipation bracket frame 60, the heat dissipation bracket frame 60 is connected to the circuit board 10 through a second screw 610, and the mounting bracket frame 50 is erected on the side of the heat dissipation bracket frame 60 facing away from the circuit board 10 through the first screw 510;

[0055] One end of the heat pipe 40 away from the cold plate 30 contacts a surface of the heat dissipation support frame 60 facing away from the circuit board 10. The small chip 220 contacts a surface of the heat dissipation support frame 60 facing the circuit board 10. A surface of the cold plate 30 facing the circuit board 10 passes through the heat dissipation support frame 60 and contacts the main chip 210.

[0056] Specifically, the heat dissipation support frame 60 is disposed between the mounting support frame 50 and the circuit board 10. The heat dissipation support frame 60 and the mounting support frame 50 are both structures with a hollow center, and the shape of the heat dissipation support frame 60 is similar to that of the mounting support frame 50, but the size of the heat dissipation support frame 60 is slightly larger than that of the mounting support frame 50. A plurality of the second screws 610 are provided on an outer edge of the heat dissipation support frame 60 for one week. Through the second screws 610, the heat dissipation support frame 60 can be connected to the circuit board 10, and then the mounting support frame 50 is erected on a surface of the heat dissipation support frame 60 facing away from the circuit board 10 through the first screws 510. At the same time, one end of the heat pipe 40 away from the cold plate 30 contacts a surface of the heat dissipation support frame 60 facing away from the circuit board 10, and the small chip 220 contacts a surface of the heat dissipation support frame 60 facing the circuit board 10. Thus, the heat generated by the small chip 220 can be transferred to the heat pipe 40 through the heat dissipation support frame 60 and then transferred to the cold plate 30. In addition, a surface of the cold plate 30 facing the circuit board 10 passes through the heat dissipation support frame 60 and contacts the main chip 210 to ensure that the heat generated by the main chip 210 can be directly transferred to the cold plate 30. In this embodiment, by mounting devices such as the mounting support frame 50, the heat pipe 40, and the cold plate 30 on the heat dissipation support frame 60 to form an integral body, and then mounting this integral body on the circuit board 10, the installation efficiency of the chip heat dissipation structure can be improved.

[0057] Further, a second spring 620 is provided between the heat dissipation support frame 60 and the cap 6101 of the second screw 610 to enable adjustment of the distance between the heat dissipation support frame 60 and the circuit board 10.

[0058] Here, the distance between the heat dissipation support frame 60 and the circuit board 10 is not fixed, but can be adjusted by a certain value. The purpose is to avoid the influence of device tolerances, thermal and cold deformations, etc. on the contact between the cold plate 30 and the main chip 210, and between the cold plate heat pipe 40 and the small chip 220, so that the cold plate 30 and the main chip 210, and the heat dissipation support frame 60 and the small chip 220 are in close contact to ensure the necessary pressure, and improve the heat transfer efficiency of the chipset 20. The specific method is to add the second spring 620 under the cap 6101 of the second screw 610. The bottom of the second spring 620 contacts the side of the heat dissipation support frame 60 facing away from the circuit board 10, so as to form a soft connection with a certain elastic redundant space between the heat dissipation support frame 60 and the circuit board 10.

[0059] In addition, on the heat dissipation support frame 60, the mounting support frame 50 is also soft-connected to the heat dissipation support frame 60 through the first screw 510 and the first spring 520, which can further avoid the influence of device tolerances, thermal and cold deformations, etc. on the contact between the cold plate 30 and the main chip 210, and between the heat dissipation support frame 60 and the small chip 220, so that the cold plate 30 and the main chip 210, and the heat dissipation support frame 60 and the small chip 220 are in close contact to ensure the necessary pressure, thereby further improving the heat transfer efficiency of the chipset 20.

[0060] Furthermore, the contact point between the small chip 220 and the heat dissipation support frame 60 is directly opposite to the contact point between the heat pipe 40 and the heat dissipation support frame 60.

[0061] Specifically, the contact point between the heat pipe 40 and the heat dissipation support frame 60 is directly above the contact point between the small chip 220 and the heat dissipation support frame 60. Such a design can make the heat generated by the small chip 220 transfer to the heat pipe 40 at the shortest distance, thereby further shortening the heat transfer path of the small chip 220 to the cold plate 30 and further improving the heat dissipation efficiency of the small chip 220.

[0062] Even further, the small chip 220 and the heat dissipation support 60 are in contact connection through a thermal conductive pad 240.

[0063] Specifically, the heat-conducting pad 240 is made of a heat-conducting material with good heat conductivity, has a certain thickness, and is elastic and compressible. It is arranged between the side of the heat-dissipating bracket 60 facing the circuit board 10 and the side of the small chip 220 facing away from the circuit board 10. On the one hand, it has a certain redundancy for devices with different tolerances around the small chip 220 to avoid device damage. On the other hand, it can quickly and thoroughly transfer the heat generated by the small chip 220 during operation to the heat pipe 40, and then to the cold plate 30, so as to improve the heat dissipation efficiency of the small chip 220.

[0064] Similarly, in other embodiments of the present invention, the heat-conducting pad 240 here can also be replaced by a heat-conducting gel, which can also achieve the above effects.

[0065] In addition, a heat-conducting block 630 is provided in the heat-dissipating bracket frame 60 above the small chip 220, and both the heat pipe 40 and the small chip 220 are in contact with the heat-conducting block 630.

[0066] Here, the manufacturing material of the heat-conducting block 630 includes but is not limited to metal or VC (Vinylene Carbonate). In a preferred embodiment, copper is selected because copper has good heat conduction performance. Of course, the heat-conducting block 630 can also be a part of the heat pipe 40, that is, both are made of the same material. In this embodiment, the heat-conducting block 630 is embedded in the heat-dissipating bracket frame 60 above the small chip 220, so that both the heat pipe 40 and the small chip 220 are in contact with the heat-conducting block 630. The heat-dissipating bracket frame 60 in other places can be made of materials such as PC and plastic, which can effectively reduce the usage amount of copper in the heat-dissipating bracket frame 60. On the basis of ensuring good heat dissipation efficiency for the small chip 220, the product cost and weight can also be reduced.

[0067] Furthermore, in other preferred embodiments of the present invention, the side of the cold plate 30 facing away from the circuit board 10 is provided with a liquid inlet 310 and a liquid outlet 320 facing different directions.

[0068] Specifically, the cold plate 30 contains a liquid working medium for heat exchange to transfer the heat on the cold plate 30. Both the liquid inlet 310 and the liquid outlet 320 are provided on the side of the cold plate 30 facing away from the circuit board 10, and they face different directions. In a preferred embodiment, the liquid inlet 310 and the liquid outlet 320 face opposite directions. Through the liquid inlet 310 and the liquid outlet 320, the liquid working medium in the cold plate 30 can circulate. Additionally, by setting the liquid inlet 310 and the liquid outlet 320 to face different directions, the hot and cold parts can be separated, avoiding hot and cold mixing and further improving the heat dissipation efficiency of the chipset 20.

[0069] Further, in other preferred embodiments of the present invention, the heat pipe 40 is a convex structure protruding upward above the circuit board 10.

[0070] Here, the heat pipe 40 is not a straight tubular structure but has a protrusion, specifically a protrusion upward above the circuit board 10. Since the cold plate 30 does not have a fixed height and can float up and down, and when the other end of the heat pipe 40 is connected to the heat dissipation support frame 60, the heat dissipation support frame 60 can also float up and down, that is, the two ends of the heat pipe 40 are not completely fixed. By setting the heat pipe 40 into a convex structure, it can absorb a certain amount of deformation, thereby realizing the floating adjustment of the above structure.

[0071] In addition, the material of the heat pipe 40 is copper metal and it is a solid structure, so as to ensure that the heat generated by the small chip 220 can be quickly transferred to the cold plate 30, thereby improving the heat dissipation efficiency of the chipset.

[0072] Further, in other preferred embodiments of the present invention, the heat pipe 40 is provided with a self-circulating cooling working medium.

[0073] Specifically, in this embodiment, the heat pipe 40 is not a solid structure, and a self-circulating cooling working medium is provided inside it. The cooling working medium includes but is not limited to water or other coolants. Such a design can effectively reduce the usage amount of copper on the basis of ensuring good heat dissipation efficiency for the small chip 220, reducing the product cost and product weight.

[0074] It should be noted that, in the case where the structures do not conflict with each other, the structures of each part mentioned in the above embodiments can be combined with each other. To avoid repetition, the technical solutions obtained after combination are not described herein again, but the technical solutions obtained after combination should also fall within the protection scope of the present invention.

[0075] In addition, an embodiment of the present invention further provides a terminal device, which includes any one of the chip heat dissipation structures described in the above embodiments. The chip heat dissipation structure is used to carry a chipset and dissipate heat from the chipset, which can improve the chip heat dissipation effect and thus improve the computing power of the chip. For specific details, please refer to the description of the above embodiments and will not be elaborated here.

[0076] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments or equivalently replace some of the technical features. However, such modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip heat dissipation structure, characterized in that, include: Circuit boards; A chipset disposed on the circuit board, the chipset comprising a main chip and small chips disposed around the main chip; A cold plate disposed on the circuit board, wherein a side of the cold plate facing the circuit board is in contact with the main chip; A heat pipe, one end of which is connected to a side of the cold plate facing away from the circuit board, and the other end of which is in contact with the small chip.

2. The chip heat dissipation structure according to claim 1, characterized in that, It also includes a mounting bracket frame, the cold plate is arranged in the mounting bracket frame, and the mounting bracket frame is mounted on the circuit board by a first screw.

3. The chip heat dissipation structure according to claim 1, characterized in that, The cold plate is in contact with the main chip via a heat conducting sheet.

4. The chip heat dissipation structure according to claim 1, characterized in that, The heat pipe is contact-connected with the chiplet via a thermal pad.

5. The chip heat dissipation structure according to claim 2, characterized in that, A first spring is provided between the mounting bracket frame and the nail cap of the first screw, so that the distance between the mounting bracket frame and the circuit board can be adjusted.

6. The chip heat dissipation structure according to claim 2, characterized in that, The projection of the mounting bracket frame on the circuit board is between the main chip and the small chip.

7. The chip heat dissipation structure according to any one of claims 1-6, characterized in that, It also includes a heat dissipation bracket frame, the heat dissipation bracket frame is connected to the circuit board through a second screw frame, and the mounting bracket frame is mounted on a side of the heat dissipation bracket frame away from the circuit board through the first screw; One end of the heat pipe away from the cold plate contacts a side of the heat dissipation bracket frame away from the circuit board, the small chip contacts a side of the heat dissipation bracket frame facing the circuit board, and a side of the cold plate facing the circuit board passes through the heat dissipation bracket frame and contacts the main chip.

8. The chip heat dissipation structure according to claim 7, wherein, A second spring is provided between the heat dissipation bracket frame and the nail cap of the second screw, so that the distance between the heat dissipation bracket frame and the circuit board can be adjusted.

9. The chip heat dissipation structure according to claim 7, characterized in that, The contact point between the chiplet and the heat dissipation support frame is directly opposite to the contact point between the heat pipe and the heat dissipation support frame.

10. The chip heat dissipation structure according to claim 7, characterized in that, The small chip is contact-connected to the heat dissipation bracket via a thermal pad.

11. The chip heat dissipation structure according to claim 7, wherein, A heat conduction block is arranged in the heat dissipation bracket frame above the small chip, and both the heat pipe and the small chip are in contact with the heat conduction block.

12. The chip heat dissipation structure according to any one of claims 1-6, characterized in that, A liquid inlet and a liquid outlet facing different directions are arranged on a side of the cold plate facing away from the circuit board.

13. The chip heat dissipation structure according to any one of claims 1-6, characterized in that, The heat pipe is a convex structure protruding above the circuit board.

14. The chip heat dissipation structure according to any one of claims 1-6, characterized in that, A self-circulating cooling medium is arranged in the heat pipe.

15. A terminal device, characterized in that, It comprises a chip heat dissipation structure according to any one of claims 1-14.

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