Display panel and display device

Abstract

The invention discloses a display panel and a display device, and belongs to the technical field of display. The display panel comprises a substrate, a first driving layer, a second driving layer, an organic insulating layer, a third flat layer and a plurality of light emitting units. The inner wall of the through hole formed by the first via hole and the second via hole in the organic insulating layer has the step structure, so that the overall gradient of the inner wall of the through hole in the organic insulating layer is slow. Therefore, the thickness of the third flat layer near the outside of the through hole is large. Therefore, after the third flat layer is patterned, the part, near the through hole, in the third flat layer is not easy to etch and remove, and the second driving layer can be protected through the third flat layer, so that the second driving layer is prevented from being eroded by water and oxygen in the external environment, and the reliability of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display panel and a display device. Background Art

[0002] With the development of the display technology field, due to the advantages of a light-emitting diode (abbreviation: LED) display panel such as pure chromaticity, wide dynamic range, high brightness, high definition, low working voltage, low power consumption, long lifespan, impact resistance, large viewing angle, and stable and reliable operation, the LED display panel will become the most advantageous new generation of display media and has been widely used.

[0003] Currently, an LED display panel generally includes: a driving backplane, and a plurality of LEDs located on one side of the driving backplane. Among them, the driving backplane can send driving signals to each LED, enabling the LED to emit corresponding light, and further enabling the LED display panel to present a corresponding display image.

[0004] However, the driving backplane usually contains metal driving layers for signal transmission, and these metal driving layers are extremely vulnerable to corrosion by water and oxygen in the external environment, resulting in low reliability of the display panel integrated with such a driving backplane. Summary of the Invention

[0005] Embodiments of the present application provide a display panel and a display device. The problem of low reliability of the display panel can be solved, and the technical solutions are as follows:

[0006] On the one hand, a display panel is provided, including:

[0007] A substrate;

[0008] A first driving layer and a second driving layer located on one side of the substrate, the first driving layer is closer to the substrate than the second driving layer, the first driving layer includes: a first overlapping electrode, and the second driving layer includes: a second overlapping electrode;

[0009] An organic insulating layer located between the first driving layer and the second driving layer, the organic insulating layer has a first via hole and a second via hole that are connected, the first via hole is closer to the substrate than the second via hole, and a first orthographic projection of an opening of the first via hole facing away from the substrate on the substrate is located within a second orthographic projection of an opening of the second via hole close to the substrate on the substrate, and an outer boundary of the first orthographic projection does not coincide with an outer boundary of the second orthographic projection;

[0010] And a plurality of light-emitting units electrically connected to the second driving layer;

[0011] Among them, the second overlapping electrode is electrically connected to the first overlapping electrode through the second via hole and the first via hole in sequence.

[0012] Optionally, the second overlapping electrode includes: a first electrode portion and a second electrode portion;

[0013] The first electrode portion extends into the first via hole and overlaps with the first overlapping electrode; the second electrode portion is distributed around the first electrode portion and connected to the first electrode portion;

[0014] Among them, the orthographic projection of the second electrode portion on the substrate overlaps with the orthographic projection of the second via hole on the substrate.

[0015] Optionally, a part of the second electrode portion extends outside the second via hole.

[0016] Optionally, the orthographic projection of the second via hole on the substrate is located within the orthographic projection of the second overlapping electrode on the substrate.

[0017] Optionally, the orthographic projection of the second electrode portion on the substrate is entirely located within the orthographic projection of the second via hole on the substrate.

[0018] Optionally, the distance between the outer boundary of the first orthographic projection and the outer boundary of the second orthographic projection is: 30 micrometers to 70 micrometers.

[0019] Optionally, the organic insulating layer includes: a first flat layer and a second flat layer arranged in a stack, the first flat layer is closer to the substrate than the second flat layer, the first flat layer has the first via hole, and the second flat layer has the second via hole.

[0020] Optionally, the display panel further includes: a third flat layer located on the side of the second driving layer away from the substrate, and the minimum distance between the side of the third flat layer away from the substrate and the side of the second overlapping electrode away from the substrate is greater than or equal to 1 micrometer.

[0021] Optionally, the display panel further includes: a first inorganic protective layer located between the third flat layer and the second driving layer;

[0022] The display panel has a third via hole penetrating through the third flat layer and the first inorganic protective layer, and the orthographic projection of the third via hole on the substrate is located within the orthographic projection of the second driving layer on the substrate;

[0023] Among them, the light-emitting unit is electrically connected to the second driving layer through the third via hole.

[0024] Optionally, the display panel further includes: a second inorganic protection layer and a third inorganic protection layer. The second inorganic protection layer is located between the organic insulation layer and the first driving layer, and the third inorganic protection layer is located between the organic insulation layer and the second driving layer;

[0025] Wherein, the second inorganic protection layer has a fourth via hole communicating with the first via hole, and the third protection layer has a fifth via hole communicating with the fourth via hole.

[0026] Optionally, a part of the third inorganic protection layer extends into the first via hole, the second via hole and the fourth via hole, and covers the inner walls of the first via hole, the second via hole and the fourth via hole. The part of the second inorganic protection layer extending into the fourth via hole is connected to the fifth via hole.

[0027] Optionally, the display panel further includes: a fourth inorganic protection layer located between the substrate and the first driving layer.

[0028] Optionally, the first driving layer further includes: a plurality of first driving signal lines, and the second driving layer further includes: a plurality of second driving signal lines and a plurality of conductive pads. The extending direction of the first driving signal lines intersects with the extending direction of the second driving signal lines; Among the plurality of conductive pads, some conductive pads are electrically connected to the second driving signal lines, and some other conductive pads are electrically connected to the first driving signal lines through the second overlapping electrode and the first overlapping electrode;

[0029] The plurality of first driving signal lines include a plurality of groups of first driving signal lines corresponding to multiple columns of the light emitting units. One group of the first driving signal lines is electrically connected to each of the light emitting units in the corresponding column of light emitting units.

[0030] Optionally, the display panel further includes: a plurality of driving chips, and the driving chips are electrically connected to one or more of the light emitting units;

[0031] The plurality of conductive pads include: a first pad group for fixedly connecting with the light emitting units, and a second pad group for fixedly connecting with the driving chips.

[0032] On the other hand, a display device is provided, and the device includes: a driving component, and the display panel according to any one of the above.

[0033] The beneficial effects brought by the technical solutions provided by the embodiments of the present application at least include:

[0034] A display panel includes: a substrate, a first driving layer, a second driving layer, an organic insulating layer, a third planarization layer, and a plurality of light-emitting units. Since the opening of the first via hole facing away from the substrate is located within the second orthographic projection on the substrate of the opening of the second via hole close to the substrate, and the outer boundary of the first orthographic projection does not coincide with the outer boundary of the second orthographic projection. Therefore, the inner wall of the through hole formed by the first via hole and the second via hole in the organic insulating layer has a stepped structure, making the overall slope of the inner wall of the through hole in the organic insulating layer relatively gentle. For this reason, during the formation of the third planarization layer, organic solvents generally do not flow excessively into the through holes of the organic insulating layer, ensuring that a relatively large amount of organic solvents accumulates near the outside of the through holes. Subsequently, after curing the organic solvents to form the third planarization layer, the thickness of the third planarization layer near the outside of the through holes is relatively large. In this way, after patterning the third planarization layer, the portion of the third planarization layer near the outside of the through holes is not easily etched away, and the second overlapping electrode in the second driving layer can be protected by the third planarization layer to ensure that water and oxygen in the external environment do not erode the second overlapping electrode in the second driving layer, thereby improving the reliability of the display panel. Description of the Drawings

[0035] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0036] Figure 1 is a schematic diagram of the film layer structure of a driving backplane in a display panel provided by the related art;

[0037] Figure 2 is a top view of a display panel provided by an embodiment of the present application;

[0038] Figure 3 is Figure 2 a schematic diagram of the film layer structure of the display panel shown at A - A';

[0039] Figure 4 is a schematic diagram of the film layer structure of a driving backplane in a display panel provided by an embodiment of the present application;

[0040] Figure 5 is a schematic diagram of the film layer structure of a driving backplane in another display panel provided by an embodiment of the present application;

[0041] Figure 6 is a schematic diagram of the film layer structure of a driving backplane in yet another display panel provided by an embodiment of the present application;

[0042] Figure 7 It is a partial top view of a driving backplane in a display panel provided by an embodiment of the present application;

[0043] Figure 8 It is a partial top view of a display panel provided by an embodiment of the present application. Detailed implementation manners

[0044] To make the objectives, technical solutions and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail with reference to the accompanying drawings.

[0045] Please refer to Figure 1 , Figure 1 It is a schematic diagram of a film layer structure of a driving backplane in a display panel provided by the related art. The driving backplane 00 in the display panel may include: a substrate 01, a first metal driving layer 02, an organic insulating layer 03, a second metal driving layer 04, and a planarization layer 05.

[0046] The first metal driving layer 02 and the second metal driving layer 04 in the driving backplane 00 may be stacked on one side of the substrate 01, and the first metal driving layer 02 is closer to the substrate 01 than the second metal driving layer 04. The organic insulating layer 03 may be distributed between the first metal driving layer 02 and the second metal driving layer 04. The planarization layer 05 may be distributed on the side of the second metal driving layer 04 facing away from the substrate 01.

[0047] Here, some conductive structures in the first metal driving layer 02 need to be electrically connected to some conductive structures in the second metal driving layer 04. Therefore, the organic insulating layer 03 in the driving backplane 00 may have a via V0, so that some conductive structures in the second metal driving layer 04 can be electrically connected to some conductive structures in the first metal driving layer 02 through the via V0.

[0048] During the process of forming the planarization layer 05 in the driving backplane 00, the organic solvent needs to first fill the via V0, then be formed on the side of the second metal driving layer 04 facing away from the substrate 01, and finally, after the organic solvent is leveled and cured, the planarization layer 05 can be obtained.

[0049] However, the thickness of the organic insulating layer 03 in the driving backplane 00 is usually large, resulting in a relatively steep slope of the sidewall of the via V0 provided in the organic insulating layer 03. Therefore, during the formation of the planarization layer 05, the amount of organic solvent filled into the via V0 is large, and the amount of organic solvent accumulated near the outside of the via V0 is small, resulting in a relatively low thickness h0 of the subsequent formed planarization layer 05 near the outside of the via V0. In this way, after patterning the planarization layer 05, the portion of the planarization layer 05 near the outside of the via V0 is easily etched and removed, resulting in the possibility that some conductive structures in the second metal driving layer 02 cannot be protected by the planarization layer 05, and further resulting in the second metal driving layer 02 being easily corroded by water and oxygen in the external environment. Therefore, the reliability of the display panel integrated with such a driving backplane 00 is relatively low.

[0050] Please refer to Figure 2 , Figure 2 is a top view of a display panel provided by an embodiment of the present application. The display panel 000 may include: a driving backplane 001, and a light-emitting unit 500 located on one side of the driving backplane 001.

[0051] To more clearly see the film layer structure of the driving backplane 001 in the display panel 000, as Figure 3 shown, Figure 3 is Figure 2 a schematic diagram of the film layer structure of the display panel shown at A-A'. The display panel 000 may further include: a substrate 100, a first driving layer 200, a second driving layer 300, and an organic insulating layer 400. It should be noted that the driving backplane 001 in the display panel 000 refers to the part of the display panel 000 when the light-emitting unit 500 is not included. Therefore, the driving backplane 001 may include: a substrate 100, a first driving layer 200, a second driving layer 300, and an organic insulating layer 400.

[0052] The first driving layer 200 and the second driving layer 300 in the display panel 000 may be located on one side of the substrate 100, and the first driving layer 200 may be closer to the substrate 100 than the second driving layer 300. Here, the first driving layer 200 may include: a first overlapping electrode 201, and the second driving layer 300 may include: a second overlapping electrode 301. Here, the first overlapping electrode 201 and the second overlapping electrode 301 may be electrically connected, so that electrical connection can be made between the first driving layer 200 and the second driving layer 300.

[0053] The organic insulating layer 400 in the display panel 000 can be located between the first driving layer 200 and the second driving layer 300. Since the organic insulating layer 400 has good flatness, the flatness of the side of the organic insulating layer 400 facing away from the substrate 100 is good, which can ensure that the second driving layer 300 located on the side of the organic insulating layer 400 facing away from the substrate 100 is stably disposed on the organic insulating layer 400. At the same time, the first driving layer 200 and the second driving layer 300 can be insulated by the organic insulating layer 400 to ensure that the position where the first driving layer 200 overlaps with the second driving layer 300 does not short-circuit.

[0054] A plurality of light-emitting units 500 in the display panel 000 can be electrically connected to the second driving layer 300. Conductive pads are usually provided in the second driving layer 300. The light-emitting units 500 in the display panel 000 can be welded and fixed on the driving backplane 001 through the conductive pads and are electrically connected to the second driving layer 300. Here, the first driving layer 200 and the second driving layer 300 can be electrically connected through the first overlapping electrode 201 and the second overlapping electrode 301, so that under the combined action of the first driving layer 200 and the second driving layer 300, the light emission of the light-emitting unit 500 is driven.

[0055] In the present application, the organic insulating layer 400 can have a first via V1 and a second via V2 that are connected and communicated, and the first via V1 is closer to the substrate 100 than the second via V2. In this way, the second overlapping electrode 301 can be electrically connected to the first overlapping electrode 201 through the first via V1 and the second via V2 in sequence. That is, a through hole V10 composed of the first via V1 and the second via V2 can be formed in the organic insulating layer 400, and the second overlapping electrode 301 can be electrically connected to the first overlapping electrode 201 through the through hole V10.

[0056] Here, the first orthographic projection of the opening of the first via V1 facing away from the substrate 100 on the substrate 100 can be located within the second orthographic projection of the opening of the second via V2 close to the substrate 100 on the substrate 100, and the outer boundary of the first orthographic projection does not coincide with the outer boundary of the second orthographic projection.

[0057] In the present application, the display panel 000 can further include: a third flat layer 600 located on the side of the second driving layer 300 facing away from the substrate 100. Here, since the third flat layer 600 has good flatness, the flatness of the side of the third flat layer 600 facing away from the substrate 100 can be ensured to be good. And in this case, the side of the third flat layer 600 facing away from the substrate 100 is the outermost side of the driving backplane 001. Therefore, when forming a plurality of light-emitting units 500 on the driving backplane 001 subsequently, it can be ensured that the surfaces of each light-emitting unit 500 facing away from the substrate 100 are all flush, so as to ensure good display effect of the display panel 000.

[0058] It should be noted that in the process of forming the third planar layer 600 in the display panel 000, the organic solvent needs to first fill the first via V1 and the second via V2, and then be formed on the side of the second driving layer 300 away from the substrate 100. Finally, after the organic solvent is leveled and cured, the third planar layer 600 can be obtained.

[0059] Here, since the first orthographic projection on the substrate 100 of the opening of the first via V1 away from the substrate 100 is located within the second orthographic projection on the substrate 100 of the opening of the second via V2 close to the substrate 100, and the outer boundary of the first orthographic projection does not coincide with the outer boundary of the second orthographic projection. Therefore, the inner wall of the through hole V10 composed of the first via V1 and the second via V2 in the organic insulating layer 400 has a stepped structure, making the overall slope of the inner wall of the through hole V10 in the organic insulating layer 400 relatively gentle. For this reason, in the process of forming the third planar layer 600, the organic solvent generally does not flow too much into the through hole V10 of the organic insulating layer 400, so as to ensure that a relatively large amount of the organic solvent accumulates near the outside of the through hole V10. Subsequently, after the organic solvent is cured to form the third planar layer 600, the thickness h1 of the third planar layer 600 near the outside of the through hole V10 is relatively large. In this way, after the third planar layer 600 is patterned, the part of the third planar layer 600 near the outside of the through hole V10 is not easily etched away, and the second overlapping electrode 301 in the second driving layer 300 can be protected by the third planar layer 600, so as to ensure that the water and oxygen in the external environment do not erode the second overlapping electrode 301 in the second driving layer 300, thereby improving the reliability of the display panel 000.

[0060] In summary, the display panel provided by the embodiment of the present application includes: a substrate, a first driving layer, a second driving layer, an organic insulating layer, a third planarizing layer, and a plurality of light-emitting units. Since the opening of the first via hole facing away from the substrate is located within the second orthographic projection on the substrate of the opening of the second via hole close to the substrate, and the outer boundary of the first orthographic projection does not coincide with the outer boundary of the second orthographic projection. Therefore, the inner wall of the through hole formed by the first via hole and the second via hole in the organic insulating layer has a stepped structure, making the overall slope of the inner wall of the through hole in the organic insulating layer relatively gentle. For this reason, during the formation of the third planarizing layer, organic solvents generally do not flow excessively into the through holes of the organic insulating layer, ensuring that a relatively large amount of organic solvents accumulates near the outside of the through holes. Subsequently, after curing the organic solvents to form the third planarizing layer, the thickness of the third planarizing layer near the outside of the through holes is relatively large. In this way, after patterning the third planarizing layer, the portion of the third planarizing layer near the outside of the through holes is not easily etched away, and the second overlapping electrode in the second driving layer can be protected by the third planarizing layer to ensure that water and oxygen in the external environment do not erode the second overlapping electrode in the second driving layer, thereby improving the reliability of the display panel.

[0061] In the embodiment of the present application, as Figure 4 shown, Figure 4 is a schematic diagram of the film layer structure of a driving backplane in a display panel provided by an embodiment of the present application. The organic insulating layer 400 in the display panel 000 may include: a first planarizing layer 401 and a second planarizing layer 402 arranged in a stacked manner, and the first planarizing layer 401 may be closer to the substrate 100 than the second planarizing layer 402. Here, the first planarizing layer 401 may have a first via hole V1, and the second planarizing layer 402 may have a second via hole V2.

[0062] In the present application, since the first via hole V1 in the first planarizing layer 401 and the second via hole V2 in the second planarizing layer 402 are formed by two different patterning processes respectively, it is possible to form a first via hole V1 with a smaller size in the first planarizing layer 401, and a second via hole V2 with a larger size and communicating with the first via hole V1 in the second planarizing layer 402, so that the inner wall of the through hole V10 formed by the first via hole V1 and the second via hole V2 can have a stepped structure. Exemplarily, within the through hole V10, the portion where the first planarizing layer 401 protrudes relative to the second planarizing layer 402 is the stepped structure. In this way, by setting the organic insulating layer 400 as the stacked first planarizing layer 401 and second planarizing layer 402, it is easier to obtain a through hole V10 with a stepped structure when opening holes in the organic insulating layer 400, ensuring that the overall slope of the inner wall of the through hole V10 is relatively gentle.

[0063] In addition, since the thickness of the organic insulating layer 400 is usually relatively thick, if the organic insulating layer 400 is patterned through a single patterning process, the slope of the organic insulating layer 400 at the display edge is relatively steep, resulting in the formation of metal residues at the climbing position of the organic insulating layer 400 at the display edge easily after the subsequent formation of the second driving layer 300. Therefore, by setting the organic insulating layer 400 as the first flat layer 401 and the second flat layer 402 arranged in a stacked manner, and respectively patterning the first flat layer 401 and the second flat layer 402 through two different patterning processes, it can also ensure that the slope of the organic insulating layer 400 at the display edge is relatively gentle, so that after the subsequent formation of the second driving layer 300, the probability of forming metal residues at the climbing position of the organic insulating layer 400 at the display edge is relatively low, and thus the reliability of the display panel 000 can be further improved.

[0064] Optionally, as Figure 4 shown, the second overlapping electrode 301 in the display panel 000 may include: a first electrode portion 3011 and a second electrode portion 3012.

[0065] Here, the first electrode portion 3011 in the second overlapping electrode 301 may extend into the first via V1 and may overlap with the first overlapping electrode 201, and the portion of the first electrode portion 3011 extending into the first via V1 may cover at least a part of the inner wall of the first via V1. The second electrode portion 3012 in the second overlapping electrode 301 may be distributed around the first electrode portion 3011 and connected to the first electrode portion 3011. The second electrode portion 3012 may be entirely located outside the first via V1, that is, the orthographic projection of the second electrode portion 3012 on the substrate 100 does not coincide with the orthographic projection of the first via V1 on the substrate 100.

[0066] Among them, the orthographic projection of the second electrode portion 3012 on the substrate 100 may intersect with the orthographic projection of the second via V2 on the substrate 100. In the embodiment of the present application, the second overlapping electrode 301 may be entirely located within the second via V2, and a part of the second overlapping electrode 301 may also extend outside the second via V2. Therefore, the embodiment of the present application is schematically described by taking the following two optional implementation manners as examples:

[0067] The first optional implementation manner, as Figure 4 shown, a part of the second electrode portion 3012 in the second overlapping electrode 301 may extend outside the second via V2.

[0068] Exemplarily, the orthographic projection of the second viaduct V2 on the substrate 100 may be located within the orthographic projection of the second overlapping electrode 301 on the substrate. That is to say, the area of the orthographic projection of the second overlapping electrode 301 on the substrate may be greater than or equal to the area of the orthographic projection of the second viaduct V2 on the substrate 100. In this way, the portions at various positions on the side of the second electrode portion 3012 of the second overlapping electrode 301 away from the first electrode portion 3011 can all extend outside the second viaduct V2, so that the second overlapping electrode 301 can completely cover the second viaduct V2.

[0069] In this case, since the thickness of the first flat layer 401 in the organic insulating layer 400 is relatively small, the slope of the first viaduct V1 provided in the first flat layer 401 is small. Therefore, in the process of forming the third flat layer 600, it can be ensured that a relatively large amount of organic solvent accumulates near the outside of the first viaduct V1, so that the thickness h2 near the outside of the first viaduct V1 in the subsequently obtained third flat layer 600 is relatively large, and further, the third flat layer 600 can effectively protect the first electrode portion 3011 in the second overlapping electrode 301. Similarly, since the thickness of the second flat layer 402 in the organic insulating layer 400 is relatively small, the slope of the second viaduct V2 provided in the second flat layer 402 is small. Therefore, in the process of forming the third flat layer 600, it can be ensured that a relatively large amount of organic solvent accumulates near the outside of the second viaduct V2, so that the thickness h1 near the outside of the second viaduct V2 in the subsequently obtained third flat layer 600 is relatively large, and further, the third flat layer 600 can effectively protect the second electrode portion 3012 in the second overlapping electrode 301.

[0070] The second alternative implementation manner is as Figure 5 shown Figure 5 is a schematic diagram of the film layer structure of the driving backplane in another display panel provided by the embodiment of the present application. The orthographic projection of the second electrode portion 3012 of the second overlapping electrode 301 on the substrate 100 is entirely located within the orthographic projection of the second viaduct V2 on the substrate 100. That is to say, there is no portion of the second electrode portion 3012 that extends outside the second viaduct V2. In this way, the orthographic projection of the second overlapping electrode 301 on the substrate 100 can be entirely located within the orthographic projection of the second viaduct V2 on the substrate 100.

[0071] In this case, since the thickness of the first flat layer 401 in the organic insulating layer 400 is relatively small, the slope of the first via V1 provided in the first flat layer 401 is small. Therefore, during the formation of the third flat layer 600, it can be ensured that a relatively large amount of organic solvent accumulates near the outside of the first via V1, so that the thickness h2 near the outside of the first via V1 in the subsequently obtained third flat layer 600 is large, and further the third flat layer 600 can effectively protect both the first electrode portion 3011 and the second electrode portion 3012 in the second overlapping electrode 301.

[0072] In the embodiment of the present application, as Figure 4 and Figure 5 shown, the range of the distance d1 between the outer boundary of the first orthographic projection on the substrate 100 of the opening of the first via V1 facing away from the substrate 100 and the outer boundary of the second orthographic projection on the substrate 100 of the opening of the second via V2 close to the substrate 100 can be: 30 microns to 70 microns. That is, the width range of the stepped structure formed in the through hole V10 in the organic insulating layer 300 is 30 microns to 70 microns. In this way, it can be ensured that the overall slope of the inner wall of the through hole V10 is gentle.

[0073] In the present application, the minimum distance between the side of the third flat layer 600 facing away from the substrate 100 in the display panel 000 and the side of the second overlapping electrode 301 facing away from the substrate 100 can be greater than or equal to 1 micron. In this way, after the third flat layer 600 is patterned, the third flat layer 600 distributed on the side of the second overlapping electrode 301 facing away from the substrate 100 will not be easily etched away. Therefore, the second driving layer 300 in the display panel 000 can be protected by the third flat layer 600 to ensure that water and oxygen in the external environment do not erode the second driving layer 300 in the display panel 000.

[0074] In the embodiment of the present application, please refer to Figure 6 , Figure 6 which is a schematic diagram of the film layer structure of the driving backplane in another display panel provided by the embodiment of the present application. The display panel 000 may further include: a first inorganic protection layer 700 located between the third flat layer 600 and the second driving layer 300. Here, through the first inorganic protection layer 700, it can be ensured that water and oxygen in the external environment do not erode the second driving layer 300 from the side of the second driving layer 300 facing away from the substrate 100, and further the probability of the second driving layer 300 being oxidized and corroded can be reduced.

[0075] Optionally, the display panel 000 may have a third via V3 passing through the third flat layer 600 and the first inorganic protection layer 700, and the orthographic projection of the third via V3 on the substrate 100 may be located within the orthographic projection of the second driving layer 300 on the substrate 100. Among them, the second driving layer 300 may have a conductive pad S, and the orthographic projection of the third via V3 on the substrate 100 may be located within the orthographic projection of the conductive pad S on the substrate 100. The light-emitting unit 500 in the display panel 000 may be welded to the conductive pad S in the second driving layer 300 through the third via V3.

[0076] In the embodiment of the present application, the display panel 000 may further include: a second inorganic protection layer 800 and a third inorganic protection layer 900.

[0077] Optionally, the second inorganic protection layer 800 may be located between the organic insulating layer 400 and the first driving layer 200, the second inorganic protection layer 800 may cover the first driving layer 200, and the second inorganic protection layer 800 may have a fourth via V4 communicating with the first via V1.

[0078] The third inorganic protection layer 900 in the display panel 000 may be located between the organic insulating layer 400 and the second driving layer 300, and the third inorganic protection layer 900 may have a fifth via V5 communicating with the fourth via V4. In this way, some structures in the second driving layer 200 may be electrically connected to some structures in the first driving layer 200 through the fifth via V5. Here, some parts of the third inorganic protection layer 900 may extend into the first via V1, the second via V2, and the fourth via V4, and can cover the inner walls of the first via V1, the inner walls of the second via V2, and the inner walls of the fourth via V4, as well as the part of the second inorganic protection layer 800 extending into the fourth via V4 and the fifth via V5.

[0079] It should be noted that for the second inorganic protection layer 800, the second inorganic protection layer 800 can isolate water and oxygen in the external environment, so that water and oxygen in the external environment will not erode the first driving layer 200 from the side of the first driving layer 200 facing away from the substrate 100, and thus the probability of the first driving layer 200 being oxidized and corroded can be effectively reduced.

[0080] For the third inorganic protection layer 900, and since the subsequent second driving layer 200 needs to be disposed on the side of the third inorganic protection layer 900 facing away from the substrate 100, therefore, the third inorganic protection layer 900 can ensure that water and oxygen in the external environment will not erode the second driving layer 200 from the side of the second driving layer 200 close to the substrate 100, and thus the probability of the second driving layer 200 being oxidized and corroded can be effectively reduced.

[0081] In the present application, as Figure 6As shown, the display panel 000 may further include a fourth inorganic protection layer 1000 located between the substrate 100 and the first driving layer 200. Here, through the fourth inorganic protection layer 1000, it can be ensured that water and oxygen in the external environment do not erode the first driving layer 200 from the side of the first driving layer 200 close to the substrate 100, and thus the probability of the first driving layer 200 being oxidized and corroded can be further reduced.

[0082] In the embodiments of the present application, please refer to Figure 7 and Figure 8 , Figure 7 is a partial top view of a driving backplane in a display panel provided by an embodiment of the present application, Figure 8 is a partial top view of a display panel provided by an embodiment of the present application. The first driving layer 200 in the display panel 000 may include: a plurality of first driving signal lines 2011. The second driving layer 300 may include: second driving signal lines 3021 and a plurality of conductive pads S. Here, the extending direction of the first driving signal lines 2011 may intersect with the extending direction of the second driving signal lines 3021. For example, the extending direction of the first driving signal lines 2011 is perpendicular to the extending direction of the second driving signal lines 3021.

[0083] Among them, among the plurality of conductive pads S in the second driving layer 300, a part of the conductive pads S need to be electrically connected to the second driving signal lines, and another part of the conductive pads S need to be electrically connected to the first driving signal lines through the second overlapping electrode 302 and the first overlapping electrode 301.

[0084] The light-emitting units 500 in the display panel 000 may be arranged in multiple rows and multiple columns in an array. The plurality of first driving signal lines 2011 in the first driving layer 200 may include multiple groups of first driving signal lines 2011 corresponding to multiple columns of light-emitting units 500, and each group of first driving signal lines 2011 may be electrically connected to a corresponding column of light-emitting units 500. The plurality of second driving signal lines 3021 in the second driving layer 300 may correspond to multiple rows of light-emitting units 500, and each second driving signal line 3021 may be electrically connected to a corresponding row of light-emitting units 500. Among them, the orthographic projection of a column of light-emitting units 500 on the substrate 100 may intersect with the orthographic projection of the corresponding group of first driving signal lines 2011 on the substrate 100, and a row of light-emitting units 500 may be distributed between two adjacent second driving signal lines 3021.

[0085] For example, a group of first driving signal lines 2011 corresponding to a column of light-emitting units 500 in the display panel 000 may include: an anode driving signal line L1, a data signal line L2, and a ground line L3, and a second driving signal line 3021 corresponding to a row of light-emitting units 500 may be a power supply signal line.

[0086] The light-emitting units 500 in the display panel 000 may include: a driving chip 502 and at least one LED 501. In this case, the plurality of conductive pads S distributed in the second driving layer 300 in the display panel 000 may include: a first pad group S10 for fixedly connecting to the LED 501 in the light-emitting unit 500, and a second pad group S20 for fixedly connecting to the driving chip 502 in the light-emitting unit 500. Optionally, the orthographic projection of the first pad group S10 on the substrate 100 may be located within the orthographic projection of the anode driving signal line L1 on the substrate 100; the orthographic projection of the second pad group S20 on the substrate 100 may be located within the orthographic projection of the ground line L3 on the substrate 100.

[0087] Here, the first pad group S10 may include: a first conductive pad S1 and a second conductive pad S2. The second pad group S20 may include: a third conductive pad S3, a fourth conductive pad S4, and a fifth conductive pad S5.

[0088] Among them, a part of the first driving signal lines 2011 in a group of first driving signal lines 2011 electrically connected to the light-emitting unit 500 is used to be electrically connected to the first conductive pad S1 in the first pad group S10. For example, the second driving layer 300 may further include: a first transfer electrode 3022. The anode driving signal line L1 in this group of first driving signal lines 2011 may be electrically connected to the first conductive pad S1 through the first transfer electrode 3022.

[0089] The second conductive pad S2 in the first pad group S10 is electrically connected to the third conductive pad S3 in the second pad group S20. For example, the second driving layer 300 may further include: a second transfer electrode 3023. The first conductive pad S1 may be electrically connected to the third conductive pad S3 through the second transfer electrode 3023.

[0090] Another part of the first driving signal lines 2011 in a group of first driving signal lines 2011 electrically connected to the light-emitting unit 500 is used to be electrically connected to the fourth conductive pad S4 in the second pad group S20. For example, the second driving layer 300 may further include: a third transfer electrode 3024. The data signal line L2 in this group of first driving signal lines 2011 may be electrically connected to one fourth conductive pad S4 through one third transfer electrode 3024; the ground line L3 in this group of first driving signal lines 2011 may be electrically connected to another fourth conductive pad S4 through another third transfer electrode 3024.

[0091] The second driving signal line 3021 electrically connected to the light-emitting unit 500 is used to be electrically connected to the fifth conductive pad S5 in the second pad group S20. For example, the second driving layer 300 may further include: a fourth transfer electrode 3025.

[0092] The second driving signal line 3021 can be electrically connected to the fifth conductive pad S5 through the fourth transfer electrode 3025.

[0093] Exemplarily, the number of LEDs 501 in the light-emitting unit 500 can be three, and these three LEDs 501 can be distributed as: a red LED 501a for emitting red light, a green LED 501b for emitting green light, and a blue LED 501c for emitting blue light. In this case, the number of the first pad groups S10 is also three, and these three first pad groups S10 can be electrically connected to the red LED 501a, the green LED 501b, and the blue LED 501c respectively.

[0094] Here, the red LED 501a, the green LED 501b, and the blue LED 501c in the light-emitting unit 500 each have two leads, and these two leads are respectively: a positive lead and a negative lead.

[0095] Among them, the positive lead of the red LED 501a can be connected to the first conductive pad S1 in the corresponding first pad group S10, so that the positive lead of the red LED 501a can be connected to the corresponding anode driving signal line L1 through this first conductive pad S1. The negative lead of the red LED 501a can be soldered to the second conductive pad S2 in the corresponding first pad group S10.

[0096] The positive lead of the green LED 501b can be soldered to the first conductive pad S1 in the corresponding first pad group S10, so that the positive lead of the green LED 501b can be connected to the corresponding anode driving signal line L1 through this first conductive pad S1. The negative lead of the green LED 501b can be soldered to the second conductive pad S2 in the corresponding first pad group S10.

[0097] The positive lead of the blue LED 501c can be soldered to the first conductive pad S1 in the corresponding first pad group S10, so that the positive lead of the blue LED 501c can be connected to the corresponding anode driving signal line L1 through this first conductive pad S1. The negative lead of the blue LED 501c can be soldered to the second conductive pad S2 in the corresponding first pad group S10.

[0098] The driving chip 502 in the light-emitting unit 500 has six leads, and these six leads are respectively: a power signal input lead, a data signal input lead, a ground lead, and three signal output leads corresponding to the three LEDs.

[0099] Among them, the three signal output solder pads of the driving chip 502 can be respectively welded to the three third conductive solder pads S3 in the second solder pad group S20. Since the three third conductive solder pads S3 are electrically connected to the three second conductive solder pads S2 in the three first solder pad groups S10. Therefore, the three signal output solder pads of the driving chip 502 can be respectively electrically connected to the three LED cathode solder pads.

[0100] The power signal input solder pad of the driving chip 502 can be welded to a fifth conductive solder pad S5 in the second solder pad group S20, so that the power signal input solder pad can be connected to the power signal line (i.e., the second driving signal line 3021) through this fifth conductive solder pad S5.

[0101] The data signal input solder pad of the driving chip 502 can be welded to a fourth conductive solder pad S4 in the second solder pad group S20, so that the data signal input solder pad can be connected to the data signal line L2 through this fourth conductive solder pad S4.

[0102] The ground solder pad of the driving chip 502 can be welded to another fourth conductive solder pad S4 in the second solder pad group S20, so that the ground solder pad can be connected to the ground wire L3 through this fourth conductive solder pad S4.

[0103] In this case, when the display panel 000 needs to control the light-emitting unit 500 to emit light, a power driving signal can be applied to the power signal line electrically connected to this light-emitting unit 500 in the display panel 000, and a data driving signal can be applied to the data signal line L2 electrically connected to this light-emitting unit 500. In this way, after the driving chip 502 in the light-emitting unit 500 receives the power driving signal through the power signal input solder pad, the driving chip 502 can be in a working state. And after the driving chip 502 receives the data signal through the data signal input solder pad, the driving chip 502 can generate three cathode signals corresponding to the three LEDs based on this data signal. The three cathode signals can be respectively transmitted to the three LED cathode solder pads through the three signal output solder pads. Since the anode signal applied to the anode driving signal line L1 is always connected to the positive electrode welding of the LED. Therefore, after the LED receives the anode signal and the cathode signal respectively, this LED can emit light of corresponding intensity.

[0104] It should be noted that, in order to simplify the wiring structure within the display panel 000, at least two of the positive electrode leads of the red LED 501a, the positive electrode leads of the green LED 501b, and the positive electrode leads of the blue LED 501c can be connected to the same anode driving signal line L1. Due to the fact that the light-emitting characteristics of the red LED 501a differ significantly from those of the green LED 501b and also differ significantly from those of the blue LED 501c, while the light-emitting characteristics of the green LED 501b and the blue LED 501c differ less from each other. Therefore, the positive electrode leads of the green LED 501b and the blue LED 501c can be connected to the same anode driving signal line L1, and the positive electrode lead of the red LED 501a can be connected to a different anode driving signal line L1. In this case, the first conductive pad S1 welded to the positive electrode lead of the green LED 501b and the first conductive pad S1 welded to the positive electrode lead of the blue LED 501c can be an integral structure. That is to say, the positive electrode lead of the green LED 501b and the positive electrode lead of the blue LED 501c can be welded to the same first conductive pad S1, and the positive electrode lead of the red LED 501a can be welded to another first conductive pad S1.

[0105] It should also be noted that when an electrical connection is required between the conductive structures in the first driving layer 200 and the conductive structures in the second driving layer 300, it can be achieved through the first overlapping electrode 201 and the second overlapping electrode 301 in the above embodiments. Taking the electrical connection between the first transfer electrode 3022 in the second driving layer 300 and the anode driving signal line L1 in the first driving layer 200 as an example, a part of the first transfer electrode 3022 can be the second overlapping electrode 301 in the above embodiments, and a part of the anode driving signal line L1 can be the first overlapping electrode 201 in the above embodiments. For this reason, a part of the first transfer electrode 3022 can be electrically connected to a part of the anode driving signal line L1 through the through-hole V10.

[0106] In summary, the display panel provided by the embodiment of the present application includes: a substrate, a first driving layer, a second driving layer, an organic insulating layer, a third planarizing layer, and a plurality of light-emitting units. Since the first orthographic projection of the opening of the first via away from the substrate on the substrate is located within the second orthographic projection of the opening of the second via close to the substrate on the substrate, and the outer boundary of the first orthographic projection does not coincide with the outer boundary of the second orthographic projection. Therefore, the inner wall of the through hole formed by the first via and the second via in the organic insulating layer has a stepped structure, making the overall slope of the inner wall of the through hole in the organic insulating layer relatively gentle. For this reason, during the formation of the third planarizing layer, organic solvents generally do not flow into the through holes of the organic insulating layer too much, ensuring that a relatively large amount of organic solvents accumulates near the outside of the through holes. Subsequently, after the organic solvents are cured to form the third planarizing layer, the thickness of the third planarizing layer near the outside of the through holes is relatively large. In this way, after the third planarizing layer is patterned, the portion of the third planarizing layer near the outside of the through holes is not easily etched away, and the second overlapping electrode in the second driving layer can be protected by the third planarizing layer, ensuring that water and oxygen in the external environment do not erode the second overlapping electrode in the second driving layer, thereby improving the reliability of the display panel.

[0107] The embodiment of the present application also provides a display device. The display device can be: a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or any other product or component with a display function. The display device can include: a driving component and the display panel in the above embodiment. The driving component can be electrically connected to the driving layer in the display panel, and the driving component is used to provide a driving signal to the light-emitting units through the driving layer.

[0108] It should be noted that in the drawings, the dimensions of layers and regions may be exaggerated for clarity of illustration. Moreover, it can be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be an intermediate layer. Additionally, it can be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element, or there may be more than one intermediate layer or element. Additionally, it can also be understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Like reference numerals throughout indicate like elements.

[0109] In the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. The term "plurality" refers to two or more, unless otherwise clearly defined.

[0110] The above are only optional embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included within the protection scope of the present application.

Claims

1. A display panel, characterized in that, Comprising: A substrate; A first driving layer and a second driving layer located on one side of the substrate, the first driving layer being closer to the substrate than the second driving layer, the first driving layer including: a first overlapping electrode, and the second driving layer including: a second overlapping electrode; An organic insulating layer located between the first driving layer and the second driving layer, the organic insulating layer having a first via hole and a second via hole that are connected to each other, the first via hole being closer to the substrate than the second via hole, and a first orthographic projection of an opening of the first via hole facing away from the substrate on the substrate being located within a second orthographic projection of an opening of the second via hole close to the substrate on the substrate, and an outer boundary of the first orthographic projection not coinciding with an outer boundary of the second orthographic projection; And a plurality of light-emitting units electrically connected to the second driving layer; Wherein, the second overlapping electrode is electrically connected to the first overlapping electrode through the second via hole and the first via hole in sequence.

2. The display panel according to claim 1, wherein The second overlapping electrode includes: a first electrode portion and a second electrode portion; The first electrode portion extends into the first via hole and overlaps with the first overlapping electrode; the second electrode portion is distributed around the first electrode portion and is connected to the first electrode portion; Wherein, a positive projection of the second electrode portion on the substrate intersects with a positive projection of the second via hole on the substrate.

3. The display panel according to claim 2, wherein A part of the second electrode portion extends outside the second via hole.

4. The display panel according to claim 3, wherein A positive projection of the second via hole on the substrate is located within a positive projection of the second overlapping electrode on the substrate.

5. The display panel according to claim 2, characterized in that, A positive projection of the second electrode portion on the substrate is entirely located within a positive projection of the second via hole on the substrate.

6. The display panel according to any one of claims 1 to 5, characterized in that A distance between the outer boundary of the first orthographic projection and the outer boundary of the second orthographic projection is: 30 micrometers to 70 micrometers.

7. The display panel according to any one of claims 1 to 5, characterized in that, The organic insulating layer includes: a first flat layer and a second flat layer arranged in a stacked manner, the first flat layer being closer to the substrate than the second flat layer, the first flat layer having the first via hole, and the second flat layer having the second via hole.

8. The display panel according to any one of claims 1 to 5, characterized in that, The display panel further includes: a third flat layer located on a side of the second driving layer facing away from the substrate, and a minimum distance between a side of the third flat layer facing away from the substrate and a side of the second overlapping electrode facing away from the substrate is greater than or equal to 1 micrometer.

9. The display panel according to claim 8, wherein The display panel further includes: a first inorganic protection layer located between the third flat layer and the second driving layer; The display panel has a third via hole penetrating through the third flat layer and the first inorganic protection layer, and a positive projection of the third via hole on the substrate is located within a positive projection of the second driving layer on the substrate; Wherein, the light-emitting unit is electrically connected to the second driving layer through the third via hole.

10. The display panel according to claim 9, characterized in that, The display panel further includes: a second inorganic protection layer and a third inorganic protection layer, the second inorganic protection layer being located between the organic insulating layer and the first driving layer, and the third inorganic protection layer being located between the organic insulating layer and the second driving layer; Wherein, the second inorganic protection layer has a fourth via hole communicating with the first via hole, and the third protection layer has a fifth via hole communicating with the fourth via hole.

11. The display panel according to claim 10, wherein, A part of the third inorganic protection layer extends into the first via hole, the second via hole and the fourth via hole, and covers the inner walls of the first via hole, the second via hole and the fourth via hole. The part of the second inorganic protection layer extending into the fourth via hole and the fifth via hole.

12. The display panel according to claim 10, wherein The display panel further includes: a fourth inorganic protection layer located between the substrate and the first driving layer.

13. The display panel according to any one of claims 1-5, 9-12, characterized in that, The first driving layer further includes: a plurality of first driving signal lines, the second driving layer further includes: a plurality of second driving signal lines and a plurality of conductive pads. The extending direction of the first driving signal lines intersects with the extending direction of the second driving signal lines; among the plurality of conductive pads, a part of the conductive pads are electrically connected to the second driving signal lines, and another part of the conductive pads are electrically connected to the first driving signal lines through the second overlapping electrode and the first overlapping electrode; The plurality of first driving signal lines include a plurality of groups of first driving signal lines corresponding to multiple columns of the light emitting units, and one group of the first driving signal lines is electrically connected to each of the light emitting units in the corresponding column of light emitting units.

14. The display panel according to claim 13, characterized in that, The display panel further includes: a plurality of driving chips, and the driving chips are electrically connected to one or more of the light emitting units; The plurality of conductive pads include: a first pad group for fixedly connecting with the light emitting units, and a second pad group for fixedly connecting with the driving chips.

15. A display device, characterized in that, Including: A driving component, and the display panel according to any one of claims 1 to 14.

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