High heat dissipation structure of power device

Abstract

The invention relates to the technical field of heat dissipation of power devices, and discloses a high heat dissipation structure of a power device, which comprises a heat dissipation plate and a PCB, a movable column is connected to the middle end of the top surface of a sliding piston, a plurality of shifting pieces capable of disturbing a cold source are connected to the outer end of the movable column at equal intervals, and an adjusting block for performing steering adjustment on the movable column is connected to the middle end of the top surface of the movable column. The outer end faces of the partition plates are connected with limiting columns corresponding to the adjusting blocks. According to the high-heat-dissipation structure of the power device, when the PCB works, generated heat is conducted to the thermosensitive gas of the cavity in one step, so that the thermosensitive gas expands, the sliding piston is pushed to move upwards, the movable column and the adjusting block are driven to move upwards synchronously, and the heat dissipation efficiency of the power device is improved. At the moment, a limiting column is inserted into a spiral arc-shaped groove formed in the outer end face of an adjusting block, when an upward force is applied, the limiting column is jacked upwards, a movable column is driven to rotate, water liquid located on the bottom face of a flowing cavity channel is drawn upwards through a shifting piece, and then the PCB is fully cooled through the water liquid.

Description

Technical Field

[0001] The present invention relates to the technical field of power device heat dissipation, and specifically provides a high heat dissipation structure for power devices. Background Art

[0002] With the upgrading of switch devices, the demand for high-speed communication optical modules in switches is increasing day by day. Currently, 400G high-power optical modules have been widely used. Since the power consumption of a single 400G high-power optical module exceeds 10W, its heat dissipation has gradually become the bottleneck of the overall heat dissipation of the switch. For the heat dissipation of high-power optical modules, the common measures are to increase the size of the radiator and the rotation speed of the fan, and solve the heat dissipation problem by increasing the heat dissipation area and the wind speed. However, for some application scenarios of switches with space limitations and noise requirements, it is impossible to solve the heat dissipation problem by increasing the size of the radiator and the rotation speed of the fan.

[0003] Currently, when solving the heat dissipation of the PCB board, in order to avoid the generation of noise, water cooling is usually used for cooling. However, since the inlets and outlets of the inlet pipe and the outlet pipe of the conventional water cooling plate are relatively close, some water liquid is discharged from the outlet of the outlet pipe without receiving the heat transferred from the PCB board, and thus the sufficiency of cooling cannot be guaranteed. Summary of the Invention

[0004] (I) Technical Problems to be Solved

[0005] In view of the deficiencies of the prior art, the present invention provides a high heat dissipation structure for power devices, which has the advantages of fully dissipating heat from the power device and solves the above technical problems.

[0006] (II) Technical Solutions

[0007] To achieve the above object, the present invention provides the following technical solution: A high heat dissipation structure for power devices, including a heat dissipation plate and a PCB board. The heat dissipation plate is connected to the PCB board through a heat dissipation layer connected to its bottom surface. An inlet pipe and an outlet pipe are connected to the top surface of the heat dissipation plate. A plurality of partition plates are connected to the inner wall of the heat dissipation plate. The partition plates divide the inside of the heat dissipation plate into a meandering flow channel. The flow channel is connected to the inlet pipe and the outlet pipe. The flow channel is used to provide a cold source for the PCB board. A plurality of round grooves are penetrated through the top surface of the flow channel, and a slidable piston that can move up and down is connected in the grooves. The middle end of the top surface of the slidable piston is connected to a movable column. A plurality of vanes that can disturb the cold source are equidistantly connected to the outer end of the movable column. The middle end of the top surface of the movable column is connected to an adjustment block for adjusting the turning direction of the movable column. A limiting column corresponding to the adjustment block is connected to the outer end surface of the partition plate. The limiting column and the adjustment block cooperate to adjust the turning direction of the movable column at the same time.

[0008] As a preferred technical solution of the present invention, the plurality of partition plates are closely connected to each other, and a "U"-shaped arc surface is formed at the connection of the plurality of partition plates, and the partition plates are fixedly connected to the inner wall of the heat sink.

[0009] As a preferred technical solution of the present invention, the flow cavity is formed by splicing a plurality of inverted "S" shapes, and the head end and the tail end of the flow cavity are respectively connected to the water inlet pipe and the water outlet pipe.

[0010] As a preferred technical solution of the present invention, the sliding piston can slide on the circular groove wall on the top surface of the flow cavity, and the cross-section of the sliding piston is in the shape of an "I".

[0011] As a preferred technical solution of the present invention, a chamber is provided on the bottom surface of the circular groove of the flow cavity, and a thermosensitive gas is filled between the bottom surface of the sliding piston and the chamber. The filling amount of the thermosensitive gas should ensure that the "working" bottom surface of the sliding piston cross-section fits with the top surface of the flow cavity at room temperature. The diameter of the chamber is the same as the diameter of the bottom surface of the sliding piston. The sliding piston needs to ensure the sealing of the chamber. The top surface of the sliding piston is made of rust-resistant metal, and the part inserted into the circular groove wall and the chamber is made of rubber.

[0012] As a preferred technical solution of the present invention, the movable column is rotatably connected to the middle end of the top surface of the sliding piston, and a plurality of paddles are fixedly mounted on the outer end of the movable column.

[0013] As a preferred technical solution of the present invention, the end of the paddle is inclined toward the top surface of the sliding piston, and the bottom surface of the paddle is inclined, and the angle formed by the inclined surface of the paddle and the tangent direction of the rotation direction is an acute angle.

[0014] As a preferred technical solution of the present invention, the adjustment block is fixedly installed on the top of the movable column, and the outer end surface of the adjustment block is provided with a spirally ascending arc-shaped groove corresponding to the rotation direction. A limit column corresponding to the arc-shaped groove of the adjustment block is fixedly installed at the connection of the partition plate, and the end of the limit column is inserted into the groove and can slide between the arc-shaped groove.

[0015] As a preferred technical solution of the present invention, the circular groove of the flow channel is opened in the middle of the "U"-shaped bending area formed between every two partition plates.

[0016] As a preferred technical solution of the present invention, the distance between the top surface of the regulating block and the top surface of the heat dissipation plate is smaller than the distance of the sliding piston inserted into the bottom chamber of the circular groove of the flow channel.

[0017] Compared with the prior art, the present invention provides a high heat dissipation structure for power devices, which has the following beneficial effects:

[0018] 1. When the present invention is working on the PCB board, the generated heat is first conducted to the thermosensitive gas in the chamber, which causes the thermosensitive gas to expand, and then drives the sliding piston to move upward, driving the movable column and the adjusting block to move upward synchronously. At this time, the limiting column is inserted into the spiral arc groove opened on the outer end face of the adjusting block. When receiving an upward force, it will push the limiting column upward, driving the movable column to rotate, and the water liquid at the bottom of the flow channel is pumped upward through the dial, so that the water liquid fully cools the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a combined three-dimensional schematic diagram of multiple heat dissipation plates of the structure of the present invention;

[0020] Figure 2 It is a three-dimensional schematic diagram of a single heat dissipation plate of the structure of the present invention;

[0021] Figure 3 It is a top view sectional schematic diagram of the heat dissipation plate of the structure of the present invention;

[0022] Figure 4 It is a full sectional schematic diagram of the structure of the present invention;

[0023] Figure 5 It is a three-dimensional schematic diagram of the sliding piston of the structure of the present invention.

[0024] Wherein: 1. Heat dissipation plate; 2. Water inlet pipe; 3. Heat dissipation layer; 4. PCB board; 5. Water outlet pipe; 6. Partition board; 7. Flow channel; 8. Sliding piston; 9. Movable column; 10. Dial; 11. Adjusting block; 12. Limiting column. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The following further describes in detail the embodiments of the present invention in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0026] In the description of the present invention, unless otherwise specified, "a plurality of" means two or more; the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0027] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] Please refer to Figures 1-5 , a high heat dissipation structure for a power device, comprising a heat dissipation plate 1 and a PCB board 4. The heat dissipation plate 1 is connected to the PCB board 4 through a heat dissipation layer 3 connected to its bottom surface. The heat dissipation layer 3 is composed of heat dissipation silicone grease for quickly conducting the heat on the PCB board 4 to the surface of the heat dissipation plate 1 and filling the gap between the PCB board 4 and the heat dissipation plate 1. The heat dissipation plate 1 has good thermal conductivity as a whole. An inlet pipe 2 and an outlet pipe 5 are connected to the top surface of the heat dissipation plate 1. A plurality of partition plates 6 are connected to the inner wall of the heat dissipation plate 1. The partition plates 6 divide the interior of the heat dissipation plate 1 into a meandering flow channel 7. The flow channel 7 is communicated with the inlet pipe 2 and the outlet pipe 5. The flow channel 7 is used to provide a cold source for the PCB board 4. A plurality of circular grooves penetrate through the top surface of the flow channel 7, and a slidable piston 8 that can move up and down is connected in the grooves. The middle end of the top surface of the slidable piston 8 is connected to a movable column 9. A plurality of vanes 10 that can disturb the cold source are equidistantly connected to the outer end of the movable column 9. The middle end of the top surface of the movable column 9 is connected to an adjustment block 11 for adjusting the rotation direction of the movable column 9. A limiting column 12 corresponding to the adjustment block 11 is connected to the outer end face of the partition plate 6. The limiting column 12 cooperates with the adjustment block 11 to adjust the rotation direction of the movable column 9 at the same time.

[0029] Furthermore, a plurality of partition plates 6 are closely connected to each other, and a "U"-shaped arc surface is formed at the connection of the plurality of partition plates 6, so that the flow channel 7 is formed by splicing a plurality of inverted "S" shapes, separating the passages of the inlet pipe 2 and the outlet pipe 5. After the water liquid enters the flow channel 7 from the inlet pipe 2, it will flow along the "S"-shaped meandering part and then be discharged outwards from the outlet pipe 5. At the same time, the flow channel 7 is in the shape of a plurality of inverted "S" shapes, which can ensure that the water liquid is in full contact with the surface of the flow channel 7, and thus heat transfer can be carried out on the heat of the entire surface of the PCB board 4. The partition plates 6 are all fixedly connected to the inner wall of the heat dissipation plate 1, thus ensuring the stability between the partition plates 6 and the heat dissipation plate 1 and preventing leakage from occurring due to long-term use.

[0030] Furthermore, the sliding piston 8 can slide on the circular groove wall on the top surface of the flow cavity 7. A chamber is provided on the bottom surface of the circular groove of the flow cavity 7, and a thermosensitive gas is filled between the bottom surface of the sliding piston 8 and the chamber. The filling amount of the thermosensitive gas should ensure that at room temperature, the "working" bottom surface of the cross section of the sliding piston 8 fits with the top surface of the flow cavity 7. When the heat sink 1 receives the temperature transmitted by the heat sink layer 3, the heat will be conducted to the thermosensitive gas in the chamber first, thereby causing the thermosensitive gas to expand, thereby pushing the sliding piston 8 to move upward. When the temperature of the chamber drops, the thermosensitive gas contracts. , thereby driving the sliding piston 8 to move downward, wherein the top surface of the sliding piston 8 is connected to the movable column 9 and is made of rust-resistant metal material. The top surface of the sliding piston 8 needs to always be in contact with water. At the same time, the sliding piston 8 is inserted into the circular groove wall and the chamber part is made of rubber material, which can prevent water from entering the chamber and the area between the sliding piston 8 and the top surface of the chamber inner wall, thereby affecting the lifting and lowering of the sliding piston 8. The chamber diameter is the same as the bottom diameter of the sliding piston 8. When the heat-sensitive gas expands or shrinks, the outer end surface of the sliding piston 8 slides against the chamber inner wall, thereby ensuring the sealing of the internal chamber.

[0031] Furthermore, the movable column 9 is rotatably connected to the middle end of the top surface of the sliding piston 8, and the adjusting block 11 is fixedly installed on the top of the movable column 9. When the adjusting block 11 rotates, the movable column 9 can be driven to rotate. The outer end surface of the adjusting block 11 is provided with a spirally ascending arc groove corresponding to the rotation direction. A limiting column 12 corresponding to the arc groove of the adjusting block 11 is fixedly installed at the connection of the partition plate 6. The end of the limiting column 12 is inserted into the groove and can slide between the arc groove. When the sliding piston 8 moves upward, the movable column 9 and the adjusting block 11 will be driven to move upward synchronously. At this time, the limiting column 12 is inserted into the spiral arc groove provided on the outer end surface of the adjusting block 11. When subjected to an upward force, the limiting column 12 will be pushed upward. Since the limiting column 12 and the adjusting block 11 are both rigid parts, the adjusting block 11 will rotate along the spiral groove on its outer end surface when subjected to force, thereby driving the movable column 9 to rotate.

[0032] Furthermore, when the movable column 9 rotates, the paddle 10 will be driven to rotate. Since the end of the paddle 10 is inclined toward the top surface of the sliding piston 8, and the angle formed by the inclined surface of the paddle 10 and the tangent direction of the rotation direction is an acute angle, the water at the bottom of the flow cavity 7 can be drawn upward, thereby allowing the water to fully cool the PCB board 4.

[0033] Furthermore, the circular groove of the flow channel 7 is opened in the middle of the "U"-shaped bending area formed between every two partition plates 6. When the water flows through the bending part of the flow channel 7, the flow velocity will inevitably decrease. At this time, the heated water at the bottom cannot quickly slip away, and the water itself will form an inclined heat exchange layer. The colder water at the top cannot quickly settle to the bottom. The hot water at the bottom can be drawn upward by rotating the paddle 10, thereby completing the rapid heat exchange of the water.

[0034] Furthermore, the distance between the top surface of the adjusting block 11 and the top surface of the heat sink 1 is smaller than the distance of the sliding piston 8 inserted into the bottom chamber of the circular groove of the flow channel 7, which can well ensure that the spiral groove on the top of the adjusting block 11 will not be separated from the limiting column 12.

[0035] Furthermore, multiple heat sinks 1 may be connected in parallel, and the water outlet pipe 5 of the previous heat sink is connected to the water inlet pipe 2 of the next heat sink 1 , thereby achieving heat dissipation for different PCB boards 4 .

[0036] When in use, the heat sink 1 is connected to the PCB board 4 through the heat dissipation layer 3 connected to its bottom surface, and then water is introduced into the water inlet pipe 2. After the water enters the flow cavity 7 from the water inlet pipe 2, it will flow along the "S"-shaped winding part, and then be discharged outward from the water outlet pipe 5. At the same time, the flow cavity 7 presents multiple inverted "S" shapes, which can ensure that the water is in full contact with the surface of the flow cavity 7, and then the heat of the entire surface of the PCB board 4 can be transferred. When the PCB board 4 is working, the generated heat is first conducted to the thermosensitive gas in the chamber, thereby causing the thermosensitive gas to expand, and then pushing the sliding piston 8 to move upward. When the temperature of the chamber drops, the thermosensitive gas contracts, thereby driving the sliding piston 8 to move downward. When the movable piston 8 moves upward, it will drive the movable column 9 and the adjusting block 11 to move upward synchronously. At this time, the limit column 12 is inserted into the spiral arc groove provided on the outer end surface of the adjusting block 11. When subjected to an upward force, the limit column 12 will be pushed upward. Since the limit column 12 and the adjusting block 11 are both rigid parts, the adjusting block 11 will rotate along the spiral groove on its outer end surface when subjected to force, thereby driving the movable column 9 to rotate. When the movable column 9 rotates, it will drive the paddle 10 to rotate. Since the end of the paddle 10 is inclined toward the top surface of the sliding piston 8, and the angle formed by the inclined surface of the paddle 10 and the tangent direction of the rotation direction is an acute angle, the water at the bottom surface of the flow cavity 7 can be drawn upward, thereby allowing the water to fully cool the PCB board 4.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high heat dissipation structure for a power device, comprising a heat dissipation plate (1) and a PCB board (4). The heat dissipation plate (1) is connected to the PCB board (4) through a heat dissipation layer (3) connected to its bottom surface. A water inlet pipe (2) and a water outlet pipe (5) are connected to the top surface of the heat dissipation plate (1), and it is characterized in that: A plurality of partition plates (6) are connected to the inner wall of the heat dissipation plate (1). The partition plates (6) divide the interior of the heat dissipation plate (1) into a meandering flow channel (7). The flow channel (7) is connected to the water inlet pipe (2) and the water outlet pipe (5). The flow channel (7) is used to provide a cold source for the PCB board (4). A plurality of round grooves penetrate through the top surface of the flow channel (7), and a slidable piston (8) that can move up and down is connected in the grooves. The middle end of the top surface of the slidable piston (8) is connected to a movable column (9). A plurality of vanes (10) that can disturb the cold source are equidistantly connected to the outer end of the movable column (9). The middle end of the top surface of the movable column (9) is connected to an adjustment block (11) for adjusting the turning direction of the movable column (9). A limiting column (12) corresponding to the adjustment block (11) is connected to the outer end surface of the partition plate (6). The limiting column (12) cooperates with the adjustment block (11) to adjust the turning direction of the movable column (9) at the same time.

2. The high heat dissipation structure of a power device according to claim 1, characterized in that: A plurality of the partition plates (6) are closely connected to each other, and a "U"-shaped arc surface is formed at the connection of the plurality of partition plates (6). The partition plates (6) are all fixedly connected to the inner wall of the heat dissipation plate (1).

3. A high heat dissipation structure for a power device according to claim 1, characterized in that: The flow channel (7) is formed by splicing a plurality of inverted "S" shapes. The head end and the tail end of the flow channel (7) are respectively connected to the water inlet pipe (2) and the water outlet pipe (5).

4. A high heat dissipation structure for a power device according to claim 1, characterized in that: The slidable piston (8) can slide on the wall of the round groove on the top surface of the flow channel (7). The cross section of the slidable piston (8) is in the shape of a "work".

5. A high heat dissipation structure for a power device according to claim 4, characterized in that: A chamber is opened at the bottom surface of the round groove of the flow channel (7), and a thermosensitive gas is filled between the bottom surface of the slidable piston (8) and the chamber. The filling amount of the thermosensitive gas should ensure that the "work" bottom surface of the cross section of the slidable piston (8) fits the top surface of the flow channel (7) at normal temperature. The diameter of the chamber is the same as the diameter of the bottom surface of the slidable piston (8). The slidable piston (8) needs to ensure the sealing of the chamber. The top surface of the slidable piston (8) is made of rust-resistant metal material, and the part inserted into the round groove wall and the chamber is made of rubber material.

6. The high heat dissipation structure of a power device according to claim 1, characterized in that: The movable column (9) is rotatably connected to the middle end of the top surface of the slidable piston (8). A plurality of vanes (10) are fixedly installed at the outer end of the movable column (9).

7. The high heat dissipation structure of a power device according to claim 6, characterized in that: The end of the vane (10) inclines towards the top surface of the slidable piston (8), and the bottom surface of the vane (10) is inclined. The angle formed by the inclined surface of the vane (10) and the tangent direction of the turning direction is an acute angle.

8. A high heat dissipation structure for a power device according to claim 1, characterized in that: The adjustment block (11) is fixedly installed at the top end of the movable column (9). An arc-shaped notch that spirally rises corresponding to the turning direction is opened on the outer end surface of the adjustment block (11). A limiting column (12) corresponding to the arc-shaped notch of the adjustment block (11) is fixedly installed at the connection of the partition plates (6). The end of the limiting column (12) is inserted into the notch, and sliding can occur between the limiting column (12) and the arc-shaped notch.

9. A high heat dissipation structure for a power device according to claim 1, characterized in that: The round groove of the flow channel (7) is opened at the middle end of the "U"-shaped bending area formed between every two partition plates (6).

10. A high heat dissipation structure for a power device according to claim 1, characterized in that: The distance between the top surface of the adjustment block (11) and the top surface of the heat dissipation plate (1) is less than the distance from the slidable piston (8) inserted into the bottom chamber of the round groove of the flow channel (7).

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