Photocurable resin composition

Abstract

The purpose of the present invention is to provide a photocurable resin composition having excellent adhesion to a plastic member with respect to a photocurable resin composition containing a colorant. The present invention provides a photocurable resin composition containing the following components (A) to (E): component (A): an organic polymer having two or more alkoxysilyl groups per molecule; component (B): talcum powder and / or calcium carbonate powder; component (C): a pigment; component (D): a photoacid generator; component (E): a compound having an isocyanuric acid ring and an alkoxysilyl group in one molecule.

Description

Technical Field

[0001] The present invention relates to a photocurable resin composition having excellent adhesive strength. Background Art

[0002] Conventionally, curable resin compositions that can be cured using moisture in the air without heating components have been known, and are often used as adhesives, sealants, coating agents, etc. However, in the curing using moisture in the air, unwanted reactions occur during storage and operation. When such curable resin compositions are used as adhesives, sealants, coating agents, etc., there is a problem that productivity is difficult. On the other hand, Japanese Patent Application Laid-Open No. 2008-274119 discloses a curable resin composition containing a vinyl polymer having an average of at least 1 crosslinkable silyl group at the terminal and a compound that generates an acid or a base by light irradiation. It is disclosed that this curable resin composition is cured by irradiation with active energy rays such as ultraviolet rays, and thus has excellent storage stability and can ensure an operation time. Summary of the Invention

[0003] However, when the curable resin composition is colored for the purpose of shielding component wiring or the like, the colorant hinders the active energy rays from reaching the inside of the curable resin composition, and thus the deep curing of the curable resin composition is suppressed. As a result, there is a problem that the adhesive strength to plastic members becomes weak, in particular. On the other hand, curable resin compositions that can be cured by heating by adding a thermal acid generator are known, but there is a problem that they cannot be used for members such as plastic members that cannot be heated.

[0004] Therefore, an object of the present invention is to provide a photocurable resin composition having excellent adhesive strength to plastic members for a photocurable resin composition containing a colorant.

[0005] The present inventors conducted intensive studies to achieve the above object, and as a result, found that the above problems can be solved by forming a photocurable resin composition containing specific components (A) to (E), and thus completed the present invention.

[0006] Hereinafter, the gist of the present invention will be described.

[0007] [1] A photocurable resin composition containing the following components (A) to (E):

[0008] Component (A): An organic polymer having 2 or more alkoxysilyl groups in 1 molecule;

[0009] Component (B): Talc powder and / or calcium carbonate powder;

[0010] Component (C): A pigment;

[0011] (D) Component: photoacid generator;

[0012] (E) Component: a compound having an isocyanuric ring and an alkoxysilyl group in one molecule.

[0013] [2] The photocurable resin composition according to [1], wherein the above-mentioned (A) component contains: (A-1) component: an organic polymer having two or more alkoxysilyl groups and a polyether skeleton in one molecule; and (A-2) component: an organic polymer having two or more alkoxysilyl groups and a vinyl-based polymer skeleton in one molecule.

[0014] [3] The photocurable resin composition according to [1] or [2], wherein at least one of the alkoxysilyl groups of the above-mentioned (A) component is a trialkoxysilyl group.

[0015] [4] The photocurable resin composition according to any one of [1] to [3], wherein the above-mentioned (B) component is talc.

[0016] [5] The photocurable resin composition according to any one of [1] to [4], wherein the above-mentioned (C) component is carbon black.

[0017] [6] The photocurable resin composition according to any one of [1] to [5], wherein the above-mentioned (D) component is an onium salt compound.

[0018] [7] The photocurable resin composition according to [6], wherein the above-mentioned (D) component is a sulfonium salt compound.

[0019] [8] The photocurable resin composition according to any one of [1] to [7], which further contains an organic polymer having only one alkoxysilyl group in one molecule.

[0020] [9] A cured product obtained by curing the photocurable resin composition according to any one of [1] to [8]. Detailed implementation mode

[0021] Next, the details of the present invention will be described. It should be noted that the present invention is not limited to the following embodiments. In addition, unless otherwise specified, the terms used in this specification should be understood to be used in the meanings commonly used in the art. Therefore, unless otherwise defined, all technical terms and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art to which the present invention pertains. In case of contradiction, this specification (including definitions) shall prevail. The present invention is not limited to the following embodiments and can be variously modified within the scope of the claims. It should be noted that in this specification, "X to Y" is used in the meaning of including the values (X and Y) described before and after it as the lower limit value and the upper limit value, which means "X or more and Y or less". In addition, unless otherwise specified, the concentration "%" represents the mass concentration "mass %", and unless otherwise specified, the ratio is set as the mass ratio. In addition, unless otherwise specified, the measurements of operations and physical properties are carried out under the conditions of room temperature (20°C to 25°C) / relative humidity 40%RH to 50%RH. In addition, in this specification, (meth)acrylic refers to both acrylic and methacrylic.

[0022] <Photocurable resin composition>

[0023] One embodiment of the present invention is a photocurable resin composition containing the following components (A) to (E):

[0024] (A) Component: An organic polymer having two or more alkoxysilyl groups in one molecule;

[0025] (B) Component: Talc powder and / or calcium carbonate powder;

[0026] (C) Component: Pigment;

[0027] (D) Component: Photoacid generator;

[0028] (E) Component: A compound having an isocyanuric acid ring and an alkoxysilyl group in one molecule.

[0029] According to the present invention, a photocurable resin composition can be provided, in which, for a photocurable resin composition containing a colorant, the adhesion to a plastic member is excellent.

[0030] <(A) Component>

[0031] The component (A) used in the present invention is an organic polymer having two or more alkoxysilyl groups in one molecule (wherein, the component (E) described later is not included. The component (E) described later is not included in the component (A)). The number of alkoxysilyl groups contained in one molecule may be two or more, for example, 2 to 10, preferably 2 to 5, more preferably 2 to 3, and particularly preferably 2. The alkoxysilyl group may be bonded to the terminal or side chain of the organic polymer, and is preferably bonded to the terminal from the viewpoint of excellent curability of the photocurable resin composition. It is preferred that the component (A) contains an organic polymer having alkoxysilyl groups at both terminals. In one embodiment, the component (A) contains an organic polymer having two or more alkoxysilyl groups other than the terminals. In one embodiment, the component (A) contains an organic polymer having a total of two or more alkoxysilyl groups at both the terminals and other than the terminals. From the viewpoint of handling, the component (A) is preferably liquid at 25°C. The viscosity (25°C) of the component (A) is not particularly limited, and is preferably 0.1 to 1000 Pa·s, more preferably 0.3 to 500 Pa·s, further preferably 0.5 to 200 Pa·s, and even more preferably 1 to 100 Pa·s. If the viscosity of the component (A) is 0.1 Pa·s or more, the deep curability is excellent. In addition, if the viscosity of the component (A) is 1000 Pa·s or less, the viscosity of the composition will not become too high, and thus the workability is excellent. When two or more organic polymers having two or more alkoxysilyl groups in one molecule are used as the component (A), it is preferred that the viscosity of at least one of the organic polymers is in the above range, and it is preferred that the viscosities of all the organic polymers are in the above range. In the present specification, the viscosity of each component is a value measured using a B-type viscometer at 25°C.

[0032] The alkoxysilyl group means a group in which 1 to 3 alkoxy groups are bonded to a silicon atom, and examples thereof include a monoalkoxysilyl group, a dialkoxysilyl group, and a trialkoxysilyl group. Examples of the alkoxy group include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, etc., and a methoxy group is preferred. From the viewpoint of excellent deep curability, a trialkoxysilyl group in which 3 alkoxy groups are bonded to a silicon atom is preferred, and the alkoxy group is preferably a methoxy group. That is, trimethoxysilyl group is most preferred.

[0033] In a preferred embodiment, at least one of the alkoxysilyl groups of the component (A) is a trialkoxysilyl group. In a preferred embodiment, all of the alkoxysilyl groups of the component (A) are trialkoxysilyl groups. Thereby, the deep curability is more excellent. Therefore, the adhesiveness can be further improved.

[0034] The organic polymer having two or more alkoxysilyl groups in one molecule as the component (A) is not particularly limited, and examples thereof include organic polymers having a polyether skeleton, a polyester skeleton, a polycarbonate skeleton, a polyolefin skeleton, a polyurethane skeleton, a polyamide skeleton, a polyurea skeleton, a polyimide skeleton, and a vinyl-based polymer skeleton. As the organic polymer having a vinyl-based polymer skeleton, an organic polymer having an acrylic-based polymer skeleton can be mentioned. Among them, from the viewpoints of excellent deep curability and peel adhesion strength, an organic polymer having a polyether skeleton and / or a vinyl-based polymer skeleton is preferred. The organic polymer having two or more alkoxysilyl groups in one molecule of the component (A) can be used alone or in combination of two or more, but it is more preferably used in combination of an organic polymer having a polyether skeleton and an organic polymer having a vinyl-based polymer skeleton. That is, the component (A) preferably contains the component (A-1): an organic polymer having two or more alkoxysilyl groups in one molecule and having a polyether skeleton; and the component (A-2): an organic polymer having two or more alkoxysilyl groups in one molecule and having a vinyl-based polymer skeleton. When the component (A-1) and the component (A-2) are used in combination as the component (A), the ratio of their contents is not particularly limited. Assuming the total amount of the component (A) is 100% by mass, the content of the component (A-1) is, for example, 1% by mass to 99% by mass, and the content of the component (A-2) is, for example, 1% by mass to 99% by mass.

[0035] As commercially available products of the organic polymer having two or more alkoxysilyl groups in one molecule, as the organic polymer having two or more alkoxysilyl groups in one molecule and having a polyether skeleton, Silyl (registered trademark) series SAT200, SAT350, SAT400, SAX720, SAX750, SAX510, SAX530, SAX575 (manufactured by Kaneka Corporation) etc. can be mentioned. As the organic polymer having two or more alkoxysilyl groups in one molecule and having a vinyl-based polymer skeleton, EPION (registered trademark) series EP100S, EP103S, EP303S, EP505S (manufactured by Kaneka Corporation) etc., KANEKAXMAP (registered trademark) series SA100S, SA110S, SA120S, OR100S, OR110S (manufactured by Kaneka Corporation) etc. can be mentioned. As a mixture of the organic polymer having two or more alkoxysilyl groups in one molecule and having a polyether skeleton and the organic polymer having two or more alkoxysilyl groups in one molecule and having a vinyl-based polymer skeleton, MA410, MA440, MA451, MA480 (manufactured by Kaneka Corporation) etc. can be mentioned. They can be used alone or in combination of two or more.

[0036] <Component (B)>

[0037] The (B) component used in the present invention is talc powder and / or calcium carbonate powder. If the (B) component is talc powder and / or calcium carbonate powder, it is excellent in bonding plastics and can suppress peeling at the interface. Among them, from the aspect that the adhesive force between plastics is also excellent, talc powder is preferred. Talc refers to an inorganic powder obtained by finely pulverizing an ore called talc, and is usually a material called steatite. Chemically, it corresponds to hydrous magnesium silicate [Mg3Si4O 10 (OH)2, with SiO2 at about 60% by mass, MgO at about 30% by mass, and crystal water at 4.8% by mass as the main components. From the viewpoint of improving dispersibility in the (A) component and peel adhesion strength, a pulverized talc powder of natural talc is preferred. In addition, the surface of the powder of the (B) component can also be surface-treated. Examples of the surface treatment include surface treatment using fatty acids such as stearic acid; resin acids; coupling agents such as silicon-based, titanium-based, or aluminum-based coupling agents. From the viewpoint of improving peel adhesion strength, the average particle size of the (B) component is preferably 0.1 μm to 50 μm, more preferably 0.2 μm to 30 μm, still more preferably 0.5 to 20 μm, still more preferably 0.5 to 10 μm, and most preferably 1 to 5 μm. Here, the average particle size of the (B) component is the particle size (D50) at which the cumulative volume ratio in the particle size distribution determined by the laser diffraction scattering method is 50%. The (B) component can be used alone as 1 type, or 2 or more types can be used in combination.

[0038] In the photocurable resin composition of the present invention, by using talc powder and / or calcium carbonate powder as the (B) component, the peel adhesion strength is excellent and the initial peel state becomes cohesive failure. The talc powder and / or calcium carbonate powder as the (B) component is a material softer (higher toughness) compared to inorganic filler materials other than the (B) component such as fumed silica and glass. Therefore, it is considered that by using talc powder and / or calcium carbonate powder as the (B) component, in addition to the general effect of inorganic filler materials such as improving the resin strength of the cured product, toughness can be maintained, and thus the adhesiveness to the substrate can be further improved.

[0039] The content of the above-mentioned (B) component is preferably 0.5 to 100 parts by mass, more preferably 1 to 50 parts by mass, still more preferably 10 to 40 parts by mass, and still more preferably 20 to 30 parts by mass with respect to 100 parts by mass of the (A) component. If the content of the (B) component is 0.5 parts by mass or more with respect to 100 parts by mass of the (A) component, the adhesive force to plastics and cohesive failure at the time of peeling are excellent, and if it is 100 parts by mass or less, the deep part curability is excellent.

[0040] The photocurable resin composition of this method is not particularly limited, and it is preferably free of inorganic filler materials other than the component (B). Examples of inorganic filler materials other than the component (B) include glass, silica, fumed silica, mica, ceramics, silicone rubber powder, kaolin, dried clay minerals, dried diatomaceous earth, metallic powders (powders such as gold, silver, copper, alumina, aluminum nitride, etc.). The content of these inorganic filler materials other than the component (B) is, for example, 1% by mass or less, preferably 0.1% by mass or less, and most preferably 0% by mass, relative to the total amount of the photocurable resin composition. It should be noted that the inorganic filler materials other than the component (B) do not include the component (C) described later.

[0041] In addition, the photocurable resin composition of this method is not particularly limited, and it is preferably free of filler materials of organic powders. Examples of filler materials of organic powders include powders of polyethylene, polypropylene, nylon, crosslinked acrylics, crosslinked polystyrene, polyester, polyvinyl alcohol, polyvinyl butyral, polycarbonate, etc. The content of the filler materials of organic powders is, for example, 1% by mass or less, preferably 0.1% by mass or less, and most preferably 0% by mass, relative to the total amount of the photocurable resin composition.

[0042] <(Component C)>

[0043] The component (C) used in the present invention is a pigment. The pigment can be used as a colorant. Among the pigments, black pigments are preferred from the viewpoint of excellent shielding properties. Examples of black pigments include carbon black, black titanium oxide, copper chromite black, cyanine black, and aniline black. Among them, carbon black is preferred from the viewpoints of shielding properties and dispersibility with respect to the component (A) of the present invention. They can be used alone or in combination of two or more. In addition, from the viewpoint of dispersibility, the above-mentioned component (C) is preferably a substance pre-dispersed in a reactive resin or a plasticizer. The component (C) can also be a commercially available product in a form dispersed in a reactive resin or a plasticizer. However, the above-mentioned component (B) is not treated as the component (C).

[0044] The reactive resin capable of dispersing the component (C) is not particularly limited, and examples thereof include the above-mentioned component (A), an organic polymer having only one alkoxysilyl group in one molecule as an arbitrary component described later, a silane coupling agent, etc.

[0045] The plasticizer capable of dispersing the component (C) is not particularly limited, and examples thereof include the plasticizers described in the arbitrary components described later.

[0046] The content of the above component (C) is not particularly limited, and relative to 100 parts by mass of component (A), it is preferably 0.1 to 50 parts by mass, more preferably 0.3 to 30 parts by mass, still more preferably 0.5 to 20 parts by mass, still more preferably 1 to 10 parts by mass, and most preferably 1 to 5 parts by mass. If the content of component (C) is 0.1 part by mass or more relative to 100 parts by mass of component (A), the cured product can be more easily imparted with shielding properties, and if it is 50 parts by mass or less, the adhesive strength is more excellent.

[0047] <Component (D)>

[0048] The component (D) used in the present invention is a photoacid generator. A photoacid generator refers to a compound that can release an acidic substance capable of crosslinking component (A) by irradiation with active energy rays. As the photoacid generator, for example, onium salt compounds and sulfonate compounds can be mentioned, but from the viewpoint of excellent curability, onium salt compounds are preferred. Among the onium salt compounds, iodonium salt compounds or sulfonium salt compounds are preferred, and sulfonium salt compounds are particularly preferred. They can be used alone or in combination of two or more. In addition, from the viewpoint of compatibility, the above component (D) can be a substance previously dissolved in a solvent such as an organic solvent. As the solvent for dissolving component (D), there is no particular limitation, and the solvents described in any of the components described later can be mentioned. Component (D) can also be a commercially available product in a form dissolved in a solvent.

[0049] As the onium salt compound that can be used in the present invention, there is no particular limitation, and for example, those having hexafluoroantimonate (SbF6 - ), tetrafluoroborate (BF4 - ), hexafluorophosphate (PF6 - ), hexafluoroarsenate (AsF6 - ), hexa-chloroantimonate (SbCl6 - ), trifluoromethanesulfonate (CF3SO3 - ), fluorosulfonate (FSO3 - ), PF3(C2F5)3 and other anions of iodonium salts or sulfonium salts can be mentioned. Specifically, diphenyl(4-phenylthio)phenylsulfonium hexafluorophosphate, diphenyl[4-(phenylthio)phenyl]sulfonium·hexafluoroantimonate(V), diphenyl[4-(phenylthio)phenyl]sulfonium = trifluorotris(pentafluoroethyl)-λ 5 -phosphate (diphenyl[4-(phenylsulfanyl)phenyl]sulfonium trifluorotris(pentafluoroethyl)-λ 5-phosphanuide), [4-(1-methylethyl)phenyl](4-methylphenyl)iodonium, trifluorotris(1,1,2,2,2-pentafluoroethyl)phosphate, etc. From the viewpoint of reactivity, diphenyl[4-(phenylthio)phenyl]sulfonium = trifluorotris(pentafluoroethyl)-λ 5 -phosphate.

[0050] As the sulfonium salt compound that can be used in the present invention, for example, the compound represented by the following formula 1 can be cited.

[0051] [Chemical formula 1]

[0052]

[0053] In the above formula 1, R - is an anion. Specifically, hexafluoroantimonate (SbF6 - ), tetrafluoroborate (BF4 - ), hexafluorophosphate (PF6 - ), hexafluoroarsenate (AsF6 - ), hexa-chloroantimonate (SbCl6 - ), trifluoromethanesulfonate (CF3SO3 - ), fluorosulfonate (FSO3 - ), PF3(C2F5)3 - etc., but not limited to these.

[0054] As commercially available products of the onium salt compound, CPI-100P, CPI-101P, CPI-200K, CPI-210S, IK-1 (manufactured by San-Apro Ltd.), WPI-113, WPI-116, WPI-169, WPI-170, WPAG-336, WPAG-367, WPAG-370, WPAG-469, WPAG-638 (manufactured by Fujifilm Wako Pure Chemical Corporation), Adeka Optomer SP-150, SP-151, SP-170, SP-171, SP-172 (manufactured by ADEKA Corporation), Omnicat (registered trademark) 250 (manufactured by IGM Resins B.V.), CD-1010, CD-1011, CD-1012 (manufactured by Sartomer Company), San-Aid SI-60, SI-80, SI-100, SI-60L, SI-80L, SI-100L, SIL145, SI-L150, SI-L160, SI-L110, SI-L147 (manufactured by Sanshin Chemical Industry Co., Ltd.) etc. can be cited.

[0055] The sulfonate compound that can be used in the present invention is not particularly limited. For example, trifluoromethanesulfonic acid-1,8-naphthalimide, nonafluorobutanesulfonic acid-1,8-naphthalimide, perfluorooctanesulfonic acid-1,8-naphthalimide, pentafluorobenzenesulfonic acid-1,8-naphthalimide, nonafluorobutanesulfonic acid 1,3,6-trioxo-3,6-dihydro-1H-11-thia-azacyclopentyl anthracen-2-yl ester, nonafluorobutanesulfonic acid 8-isopropyl-1,3,6-trioxo-3,6-dihydro-1H-11-thia-2-azacyclopentyl anthracen-2-yl ester, 1,2-naphthoquinone-2-diazido-5-sulfonyl chloride, 1,2-naphthoquinone-2-diazido-4-sulfonyl chloride, 1,2-benzoquinone-2-diazido-4-sulfonyl chloride, 1,2-naphthoquinone-2-diazido-5-sodium sulfonate, 1,2-naphthoquinone-2-diazido-4-sodium sulfonate, 1,2-benzoquinone-2-diazido-4-sodium sulfonate, 1,2-naphthoquinone-2-diazido-5-potassium sulfonate, 1,2-naphthoquinone-2-diazido-4-potassium sulfonate, 1,2-benzoquinone-2-diazido-4-potassium sulfonate, 1,2-naphthoquinone-2-diazido-5-methyl sulfonate, 1,2-benzoquinone-2-diazido-4-methyl sulfonate, etc. can be cited.

[0056] Examples of commercially available products of the sulfonate compound include SIN-11 (manufactured by Sambo Chemical Laboratories, Inc.) and NT-1TF (manufactured by San-Apro Ltd.).

[0057] The content of the above-mentioned component (D) is not particularly limited. Relative to 100 parts by mass of component (A), it is preferably 0.1 to 20 parts by mass, more preferably 0.5 to 10 parts by mass, and most preferably 1 to 5 parts by mass. By being 0.1 part by mass or more, the curability of the photocurable resin composition can be maintained, and by being 20 parts by mass or less, the storage stability will not be affected.

[0058] <Component (E)>

[0059] The photocurable resin composition of the present invention contains a compound having an isocyanuric acid ring and an alkoxysilyl group in one molecule as component (E). Although the reason is not clear, by adding component (E), a photocurable resin composition excellent in deep curability, peel adhesion strength, and cohesive failure at the time of peeling can be obtained. The specific form of the alkoxysilyl group is the same as that of the alkoxysilyl group in the above component (A). The number of alkoxysilyl groups contained in one molecule is not particularly limited, for example, it is 1 to 3. As component (E), there is no particular limitation, and examples thereof include tris(3-trimethoxysilylmethyl)isocyanurate, tris(3-trimethoxysilylpropyl)isocyanurate, tris(3-triethoxysilylmethyl)isocyanurate, tris(3-triethoxysilylpropyl)isocyanurate, 1-(3-(trimethoxysilyl)propyl)-3,5-di-2-propenyl-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, and the like. They can be used alone or in combination of two or more. As component (E), tris(3-trimethoxysilylpropyl)isocyanurate and 1-(3-(trimethoxysilyl)propyl)-3,5-di-2-propenyl-1,3,5-triazine-2,4,6(1H,3H,5H)-trione are preferred from the viewpoints of excellent deep curability, peel adhesion strength, and cohesive failure at the time of peeling, and tris(3-trimethoxysilylpropyl)isocyanurate is most preferred.

[0060] Examples of commercially available products of component (E) include KBM-9659, X-12-1290 (manufactured by Shin-Etsu Chemical Co., Ltd.), etc., but are not limited thereto.

[0061] The content of the above component (E) is not particularly limited, and relative to 100 parts by mass of component (A), it is preferably 1 to 50 parts by mass, more preferably 3 to 30 parts by mass, still more preferably 5 to 20 parts by mass, and particularly preferably 10 to 15 parts by mass. By being 1 part by mass or more, deep curability, peel adhesion strength, and cohesive failure at the time of peeling are excellent, and by being 50 parts by mass or less, a photocurable resin composition excellent in storage stability can be obtained.

[0062] <Any component>

[0063] Furthermore, in the photocurable resin composition of the present invention, various additives can be added as optional components within the range that does not impair the characteristics of the present invention. Examples of the additives include organic polymers having only one alkoxysilyl group in one molecule, photo radical polymerization initiators, sensitizers, solvents, plasticizers, curing catalysts, thermal acid generators, silane coupling agents, storage stabilizers, antioxidants, ultraviolet absorbers, surfactants, dispersants, defoaming agents, thickeners, dyes, flame retardants, lubricants, foaming agents, rust preventives, and filler materials other than the above components (B) and (C).

[0064] The above-mentioned organic polymer having only one alkoxysilyl group in one molecule is not particularly limited as long as it is a polymer having one alkoxysilyl group. The organic polymer is not particularly limited, and examples thereof include organic polymers having a polyether skeleton, a polyester skeleton, a polycarbonate skeleton, a polyolefin skeleton, a polyurethane skeleton, a polyamide skeleton, a polyurea skeleton, a polyimide skeleton, and a vinyl-based polymer skeleton. They can be used alone or in combination of two or more. Among them, from the viewpoint of improving workability, an organic polymer having a polyether skeleton and having an alkoxysilyl group at one end is preferably contained. In addition, the alkoxysilyl group is not particularly limited, and from the viewpoint of excellent cohesive failure during peeling, a dialkoxysilyl group having two alkoxy groups bonded to a silicon atom is preferably used, and in this case, the alkoxy group is preferably a methoxy group. That is, dimethoxysilyl is most preferred. Among them, the component (A), the component (E), and the silane coupling agent described later are not included in the organic polymer having only one alkoxysilyl group in one molecule.

[0065] The viscosity (25 °C) of the above-mentioned organic polymer having only one alkoxysilyl group in one molecule is not particularly limited, and from the aspect of improving workability, it is preferably 0.01 to 10 Pa·s, more preferably 0.1 to 10 Pa·s, further preferably 0.3 to 5 Pa·s, and particularly preferably 0.4 to 2 Pa·s.

[0066] The content of the above-mentioned organic polymer having only one alkoxysilyl group in one molecule is not particularly limited, and relative to 100 parts by mass of the component (A), it is preferably 1 to 50 parts by mass, more preferably 5 to 40 parts by mass, and most preferably 10 to 30 parts by mass. By being 1 part by mass or more, the workability is excellent, and by being 50 parts by mass or less, a photocurable resin composition having excellent curability can be obtained.

[0067] Examples of commercially available products of the organic polymer having only one alkoxysilyl group in one molecule include Silyl (registered trademark) series SAT115, SAT145 (manufactured by Kaneka Corporation), etc.

[0068] The photo-radical polymerization initiator can improve the curability of the photocurable resin composition by being used in combination with the component (D) of the present invention. Specific examples of the photo-radical polymerization initiator include acetophenone derivatives such as diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzil dimethyl ketal, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl)ketone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-2-morpholinyl(4-thiomethylphenyl)propan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone, 2-hydroxy-2-methyl-1-[4-(1-methylethenyl)phenyl]acetone oligomer; benzoin derivatives such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether; benzophenone derivatives such as benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyl-diphenyl sulfide, 3,3',4,4'-tetra(tert-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, 4-benzoyl-N,N-dimethyl-N-[2-(1-oxo-2-propenyloxy)ethyl]benzyl ammonium bromide, (4-benzoylbenzyl)trimethyl ammonium chloride; thioxanthone derivatives such as 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone, 2-(3-dimethylamino-2-hydroxy)-3,4-dimethyl-9H-thioxanthon-9-one mesochloride; and acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyl diphenylphosphine oxide. Among them, acetophenone derivatives and acylphosphine oxide compounds are preferred. They can be used alone or in combination of two or more. The compounding amount when adding the photo-radical polymerization initiator is not particularly limited, and is preferably 0.1 to 20 parts by mass relative to 100 parts by mass of the component (A) of the present invention.

[0069] As the sensitizer, for example, anthracene compounds, pyrene compounds, anthraquinone compounds, thioxanthone compounds, fluorenone compounds, pigments, etc. can be cited. They can be used alone or in combination of two or more. The compounding amount when adding the sensitizer is not particularly limited, and is, for example, 0.1 to 50 parts by mass, preferably 0.3 to 20 parts by mass, and more preferably 0.5 to 10 parts by mass relative to 100 parts by mass of the component (A) of the present invention.

[0070] As the solvent, examples thereof include aliphatic hydrocarbon solvents, aromatic hydrocarbon solvents, alicyclic hydrocarbon solvents, alcohol solvents, aldehyde solvents, ketone solvents, ester solvents, ether solvents, carbonate solvents, petroleum solvents, and the like. Among them, from the viewpoint of excellent solubility in the component (D), carbonate solvents are preferred, and propylene carbonate is more preferred. They can be used alone or in combination of two or more. The blending amount when adding the solvent is not particularly limited, and is, for example, 25 to 200 parts by mass, preferably 50 to 150 parts by mass, and more preferably 75 to 125 parts by mass, relative to 100 parts by mass of the component (D) of the present invention. In addition, the above-mentioned component (D) can be pre-dissolved in them.

[0071] As the plasticizer, examples thereof include processing oils, liquid hydrocarbon compounds such as poly-α-olefins, phosphate compounds, sulfonate compounds, phthalate compounds, polyether compounds, and the like. They can be used alone or in combination of two or more. From the viewpoint of not affecting the storage stability of the photocurable resin composition, phenyl sulfonate and polyether compounds are preferred, and polyoxyalkylene alkyl ethers are more preferred. The blending amount when adding the plasticizer is not particularly limited, and is, for example, 50 to 500 parts by mass, preferably 100 to 400 parts by mass, and more preferably 200 to 350 parts by mass, relative to 100 parts by mass of the component (C) of the present invention. In addition, the above-mentioned component (C) can be pre-dispersed in them.

[0072] The curing catalyst is not particularly limited as long as it is a catalyst that crosslinks the component (A). Specifically, examples thereof include tin compounds such as dibutyltin dilaurate, dibutyltin oxide, dibutyltin diacetate, dibutyltin distearate, dibutyltin laurate oxide, dibutyltin diacetylacetonate, dibutyltin dioleylmalate, dibutyltin octanoate, dioctyltin oxide, and dioctyltin dilaurate; titanate compounds such as tetra-n-butyl titanate and tetra-isopropyl titanate as metal complexes; metal carboxylates such as lead octoate, lead naphthenate, nickel naphthenate, cobalt naphthenate, zinc octoate, zinc naphthenate, iron octoate, iron naphthenate, bismuth octoate, and bismuth naphthenate; acetylacetone metal complexes such as aluminum acetylacetone complex and vanadium acetylacetone complex. In addition, amine salts such as dibutylamine-2-ethylhexanoate, organic phosphoric acid compounds such as monomethyl phosphoric acid and di-n-butyl phosphoric acid, and other acidic catalysts and basic catalysts can also be used. They can be used alone or in combination of two or more. However, from the concern of slow reaction and viscosity increase during storage, the photocurable resin composition of this embodiment preferably does not contain a curing catalyst.

[0073] The thermal acid generator promotes curing by applying heat. However, in the case of components that do not apply heat, curing is not promoted and impurities are formed. Therefore, the photocurable resin composition of this method preferably does not contain a thermal acid generator.

[0074] As the storage stabilizer, there is no particular limitation as long as it is a substance that absorbs the moisture of the photocurable resin composition or reacts with moisture (wherein, it does not include the component (A), an organic polymer having only one alkoxysilyl group in one molecule, and the silane coupling agent described later). As the storage stabilizer, for example, 4-functional alkoxysilanes such as tetramethoxysilane and tetraethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyl silicate, ethyl silicate, propyl silicate, butyl silicate and other silicate compounds can be cited. They can be used alone or in combination of two or more.

[0075] As the silane coupling agent, for example, glycidyl group-containing silane coupling agents such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane; vinyl group-containing silane coupling agents such as vinyltris(β-methoxyethoxy)silane, vinyltriethoxysilane, vinyltrimethoxysilane; (meth)acryloyl group-containing silane coupling agents such as γ-methacryloyloxypropyltrimethoxysilane; amino group-containing silane coupling agents such as N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane; γ-mercaptopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, styryl silane, ureido silane, thioether silane, isocyanate silane, etc. (wherein, it does not include the component (A), the component (E), and an organic polymer having only one alkoxysilyl group in one molecule). They can be used alone or in combination of two or more. It should be noted that the compounding amount when adding the silane coupling agent is preferably 0.1 to 20 parts by mass relative to 100 parts by mass of the component (A) of the present invention.

[0076] <Curing of the photocurable resin composition>

[0077] As the active energy ray for curing the photocurable resin composition of the present invention, for example, ultraviolet rays, visible light, etc. can be cited. The cumulative light amount of the active energy ray is, for example, 1 to 100 kJ / m 2 , preferably 5 to 70 kJ / m 2 , most preferably 10 to 50 kJ / m 2 . In addition, as the irradiation source of the active energy ray, for example, high-pressure mercury lamps, LEDs, electrodeless lamps, xenon lamps, metal halide lamps, sunlight, lasers, etc. can be cited.

[0078] Although there is no particular limitation on the photocurable resin composition of the present invention, it is preferably cured for 30 minutes to 14 days in an environment of room temperature (20°C to 25°C) and relative humidity of 40% RH to 50% RH after irradiation with active energy rays. Since the photocurable resin composition irradiated with active energy rays is cured by moisture after irradiation with active energy rays, by curing for 30 minutes or more, a tough cured product can be obtained. As the curing time, it is further preferably 1 day to 10 days, and most preferably 5 days to 8 days.

[0079] <Use>

[0080] The cured product obtained by curing the photocurable resin composition of the present invention has excellent adhesion to plastic members and can be used for various purposes such as bonding, sealing, casting, coating, coating agent, and forming of optical components. As specific uses, in the automotive and transportation fields, it can be used for bonding, sealing, casting, forming, coating agent, etc. of automotive switches, headlights, engine internal parts, electrical components, drive engines, brake fuel tanks, etc. In addition, for flat panel displays, it can be used for bonding, sealing, casting, forming, coating agent, etc. of liquid crystal displays, organic electroluminescent displays, light-emitting diode display devices, and field emission displays. In the recording field, it can be used for bonding, sealing, casting, forming, coating agent, etc. of optical discs, CDs, DVDs, MDs, pickup lenses, hard disk peripherals (components for spindle motors, components for head actuators, etc.), Blu-ray discs, etc. In the field of electronic materials, examples include sealing materials for electronic components, circuits, electrical contacts, or semiconductor elements, chip bonding agents, conductive bonding agents, anisotropic conductive bonding agents, interlayer bonding agents for multilayer substrates including laminated substrates, solder resistants, etc. In the battery field, it can be used for bonding, sealing, casting, forming, coating agent, etc. of lithium batteries, manganese batteries, alkaline batteries, nickel-based batteries, fuel cells, silicon-based solar cells, dye-sensitized solar cells, organic solar cells, etc. In the field of optical components, it can be used for bonding, sealing, casting, forming, coating agent, etc. of the periphery of optical switches, optical fibers for the periphery of optical connectors, optical passive components, optical circuit components, and the periphery of optoelectronic integrated circuits in optical communication systems. In the field of optical equipment, it can be used for bonding, sealing, casting, forming, coating, etc. of lens materials for still cameras, viewfinder prisms, target prisms, viewfinder covers, light-receiving sensor parts, photographic lenses, projection lenses for projection TVs, etc. In addition, the cured product obtained by curing the photocurable resin composition of the present invention has excellent shielding properties based on colorants, and thus can also be used for potting of electronic components and wirings.

[0081] The photocurable resin composition of the present invention has excellent adhesiveness to plastic members, and thus is suitable for use in bonding plastic members to each other or bonding plastic members to metal members. Examples of plastics include polystyrene, polyethylene, polycarbonate, polyacetal, polypropylene, polyamide, polyimide, PET (polyethylene terephthalate), PBT (polybutylene terephthalate), ABS (acrylonitrile-butadiene-styrene copolymer), FRP (fiber reinforced plastic), PMMA (acrylic resin), PPS (polyphenylene sulfide), PEN (polyethylene naphthalate), etc., and it is particularly suitable for use with polyimide and PET. Examples of metals include iron, stainless steel, copper, nickel, zinc, aluminum, magnesium, gold, silver, etc. The photocurable resin composition of this embodiment can be particularly suitable for bonding PET to nickel and bonding PET to polyimide.

[0082] Examples

[0083] Next, the present invention will be described in more detail by way of examples, but the present invention is not limited to these examples. In addition, unless otherwise specified, the tests are carried out in an environment of 25°C and 55% RH.

[0084] [Examples 1, 2 and Comparative Examples 1 to 5]

[0085] In order to prepare the photocurable resin composition, the following components were prepared. Hereinafter, the photocurable resin composition will also be simply referred to as the composition.

[0086] (A) Component: An organic polymer having two or more alkoxysilyl groups in one molecule

[0087] · A mixture of an organic polymer having a polyether backbone and containing trimethoxysilyl groups at both ends and an organic polymer having an acrylic polymer backbone and containing trimethoxysilyl groups (MA451, viscosity at 25°C: 90 Pa·s, manufactured by Kaneka Corporation)

[0088] · An organic polymer having a polyether backbone and containing trimethoxysilyl groups at both ends (SAX530, viscosity at 25°C: 7 Pa·s, manufactured by Kaneka Corporation)

[0089] (B) Component: Talc powder or calcium carbonate powder

[0090] · Talc powder (SG-95, crushed product, no surface treatment, average particle size: 2 μm, manufactured by Nippon Talc Co., Ltd.)

[0091] · Calcium carbonate powder (Softon1800, no surface treatment, average particle size: 1.25 μm, manufactured by Bibai Powder Co., Ltd.)

[0092] (Component (B’)): Inorganic filler other than component (B)

[0093] · Fumed silica (AEROSIL 200, average particle size: 12 nm, manufactured by NIPPON AEROSIL CO., LTD.)

[0094] · Fumed silica (CAB-O-SIL TS720, average particle size: 16 nm, manufactured by Cabot Corp)

[0095] · Glass beads (EGB731B, average particle size: 32 μm, manufactured by Potters·Ballotini Co., Ltd.)

[0096] (Component (C)): Pigment

[0097] · Carbon black (ZABlack 3026 (containing carbon black at a content of 25% by mass), manufactured by Mikuni Pigment Co., Ltd.)

[0098] (Component (D)): Photoacid generator

[0099] · Diphenyl [4-(phenylthio)phenyl]sulfonium = trifluorotris(pentafluoroethyl)-λ 5 -phosphate (CPI-200K (containing diphenyl [4-(phenylthio)phenyl]sulfonium = trifluorotris(pentafluoroethyl)-λ 5 -phosphate at a content of 50% by mass), manufactured by San-Apro Ltd.)

[0100] (Component (E)): Compound having an isocyanuric acid ring and an alkoxysilyl group in one molecule

[0101] · Tris(3-trimethoxysilylpropyl)isocyanurate (KBM-9659, manufactured by Shin-Etsu Chemical Co., Ltd.)

[0102] Optional component

[0103] · Organic polymer having a polyether backbone and containing dimethoxysilyl at one terminal (SAT115, viscosity: 500 mPa·s, manufactured by Kaneka Corporation)

[0104] · Polyoxyalkylene alkyl ether (ZABlack 3026 (containing polyoxyalkylene alkyl ether as a plasticizer at a content of 75% by mass), manufactured by Mikuni Pigment Co., Ltd.)

[0105] · Propylene carbonate (CPI-200K (containing propylene carbonate as a solvent at a content of 50% by mass), manufactured by San-Apro Ltd.).

[0106] Here, ZA Black 3026 (manufactured by Mikuni Shikiso Co., Ltd.) contains carbon black (25% by mass) and polyoxyalkylene alkyl ether (75% by mass). In each of the examples and comparative examples, the carbon black contained in this ZA Black 3026 (manufactured by Mikuni Shikiso Co., Ltd.) was used as the component (C): pigment, and the polyoxyalkylene alkyl ether contained in this ZA Black 3026 (manufactured by Mikuni Shikiso Co., Ltd.) was used as a plasticizer (optional component).

[0107] In addition, CPI-200K (manufactured by San-Apro Ltd.) contains diphenyl[4-(phenylthio)phenyl]sulfonium = trifluorotris(pentafluoroethyl)-λ 5 -phosphate (50% by mass) and propylene carbonate (50% by mass). In each of the examples and comparative examples, diphenyl[4-(phenylthio)phenyl]sulfonium = trifluorotris(pentafluoroethyl)-λ 5 -phosphate contained in this CPI-200K (manufactured by San-Apro Ltd.) was used as the component (D): photoacid generator, and propylene carbonate contained in this CPI-200K (manufactured by San-Apro Ltd.) was used as a solvent (optional component).

[0108] The manufacturing methods of the compositions described in Example 1, Example 2, and Comparative Examples 1 to 5 are as follows. Under light shielding and at room temperature, the components (A) to (E) and optional components were weighed, and stirred for 30 minutes using a planetary mixer. While further performing vacuum degassing for 30 minutes using the planetary mixer, stirring was carried out to obtain a photocurable resin composition. The obtained photocurable resin compositions were all in a liquid state at 25°C. Table 1 shows the commercially available products used for the components (A) to (E) and optional components, and the content (parts by mass) of each component in the photocurable resin composition. It should be noted that in Table 1, ZA Black 3026 (pigment) and ZA Black 3026 (plasticizer) respectively refer to the pigment and plasticizer contained in ZA Black 3026 as a commercially available product. Similarly, CPI-200K (photoacid generator) and CPI-200K (solvent) respectively refer to the photoacid generator and solvent contained in CPI-200K as a commercially available product.

[0109] <Preparation of test pieces>

[0110] · Nickel plate / transparent PET film test piece

[0111] Using a glass rod, coat the compositions of each example and each comparative example on a nickel plate (thickness 1.6 mm × width 25 mm × length 100 mm) to a thickness of 30 μm. Then, attach a 10 mm × 100 mm transparent PET film (thickness 50 μm, COSMOSHINE (registered trademark) A4300 manufactured by Toyobo Film Solutions Ltd.) to the coated surface, and then irradiate ultraviolet light with an accumulated light amount of 30 kJ / m 2 from the transparent PET film side. As the light source, a conveyor belt type UV-LED irradiation device is used. Then, cure it by aging for 1 week in an environment of 23°C and 50% RH to prepare test pieces.

[0112] <Nickel plate / transparent PET film peel adhesion strength test>

[0113] Using the nickel plate / transparent PET film test pieces prepared above, according to JIS K6854-2 (1999) (Adhesives - Peel adhesion strength test method - Part 2: 180-degree peel method), use a universal tensile testing machine to measure the peel adhesion strength "N / m" at a test speed of 50 mm / min. The peel adhesion strength of the nickel plate / transparent PET film is preferably 100 N / m or more, more preferably 300 N / m or more. The upper limit of the peel adhesion strength of the nickel plate / transparent PET film is not particularly limited, and is preferably 500 N / m or less. In addition, after the above-mentioned measurement of the peel adhesion strength of the nickel plate / transparent PET film, visually observe the failure state of the test piece after the test, and evaluate it according to the following evaluation criteria as the "initial peel state". From the viewpoint of the adhesion to the adherend, the initial peel state is preferably ○. The results are shown in Table 1.

[0114] It should be noted that cohesive failure is a state in which the cured product of the photocurable resin composition itself is damaged after the peel adhesion strength test. Interfacial failure is a state in which peeling occurs at the interface between the nickel plate and the cured product or at the interface between the cured product and the transparent PET film. Generally, the higher the adhesion of the cured product of the photocurable resin composition, the more cohesive failure occurs, and the lower the adhesion of the cured product of the photocurable resin composition, the more interfacial failure occurs. In addition, when interfacial failure occurs in the cured product of the photocurable resin composition, its adhesion is affected by the surface state of the adherend. In contrast, when cohesive failure occurs in the cured product of the photocurable resin composition, a stable adhesion can be obtained and it does not depend greatly on the surface state of the adherend. Therefore, the photocurable resin composition preferably has a cohesive failure as the initial peel state of the cured product. Especially when used in sealing and potting applications, if interfacial failure occurs, liquid components may sometimes penetrate, so cohesive failure of the cured product is preferred.

[0115] [Evaluation criteria for initial peel state]

[0116] ○: Cohesive failure of the entire surface

[0117] ×: Partial interface failure or interface failure of the entire surface

[0118] <Measurement of total light transmittance>

[0119] Using a spectrophotometric haze meter SH7000 manufactured by Nippon Denshoku Industries Co., Ltd., the total light transmittance was measured. Specifically, on a non-alkali glass plate with a thickness of 0.7 mm × width of 50 mm × length of 50 mm, the compositions prepared in each example and each comparative example were coated over the entire surface to a thickness of 30 μm, and ultraviolet rays with a cumulative light amount of 30 kJ / m 2 were irradiated from the coated surface side using a conveyor belt type UV-LED irradiation device. Then, they were cured by aging for 1 week in an environment of 23°C and 50% RH to produce test pieces. Using the obtained test pieces, the light transmittance was measured at wavelengths in the range of 780 nm to 380 nm, the number of tests was n = 3, and the average value was calculated as the total light transmittance. It was evaluated according to the following evaluation criteria. For details, refer to JIS K7361-1:1997. From the viewpoint of shielding property, an evaluation of ○ is preferred.

[0120] [Evaluation criteria]

[0121] ○: Total light transmittance is 0.1% or less

[0122] ×: Total light transmittance exceeds 0.1%.

[0123] [Table 1]

[0124]

[0125] Examples 1 and 2 are compositions containing components (A) to (E). It was confirmed that the adhesive strength between PET and nickel is excellent, and cohesive failure occurs over the entire surface even in the initial peeling state, and the adhesive strength to the adherend is strong. On the other hand, Comparative Example 1 is a composition without component (B), but it was confirmed that the adhesive strength between PET and nickel is poor, and partial or entire surface interface failure occurs even in the initial peeling state. In addition, Comparative Examples 2 to 4 are compositions containing inorganic fillers other than component (B), but it was confirmed that partial or entire surface interface failure occurs in all initial peeling states. Comparative Example 5 is a composition without component (E), but it was confirmed that partial or entire surface interface failure occurs in the initial peeling state.

[0126] In addition, regarding Example 1 and Comparative Example 1, a peel adhesion strength test between plastic members was conducted. The test conditions are as described below. The results are shown in Table 2 below.

[0127] <Preparation of test pieces>

[0128] · Transparent PET sheet / polyimide film test piece

[0129] Using a glass rod, coat the compositions of Example 1 and Comparative Example 1 on a transparent PET sheet (thickness 1.5 mm × width 25 mm × length 100 mm) to a thickness of 30 μm. Then, attach a 10 mm × 100 mm polyimide film (untreated, thickness 25 μm) to the coated surface, and then irradiate ultraviolet light with an accumulated light amount of 30 kJ / m 2 from the transparent PET sheet side. As the light source, a conveyor belt type UV-LED irradiation device is used. Then, cure for 1 week in an environment of 23°C and 50% RH to obtain a transparent PET sheet / polyimide film test piece.

[0130] <Transparent PET sheet / polyimide film peel adhesion strength test>

[0131] Using the transparent PET sheet / polyimide film test piece prepared above, conduct a transparent PET sheet / polyimide film peel adhesion strength test under the same conditions as the nickel plate / transparent PET film peel adhesion strength test. The peel adhesion strength of the transparent PET sheet / polyimide film is preferably 30 N / m or more, more preferably 40 N / m or more. In addition, there is no upper limit, but it is preferably 200 N / m or less.

[0132] [Table 2]

[0133] Table 2

[0134]

[0135] It can be seen that for Example 1 which is a composition containing components (A) to (E), the peel adhesion strength between the plastic members of the transparent PET sheet / polyimide film is also excellent. On the other hand, it was confirmed that for Comparative Example 1 which is a composition without component (B), the peel adhesion strength between the plastic members is poor.

[0136] Industrial applicability

[0137] In recent years, plastics are mostly used as components in electrical / electronic components. Plastics have poor heat resistance compared to metals, etc., so it is desirable to apply heat as little as possible. The present invention is a photocurable resin composition that does not require heat application during curing, and furthermore has excellent adhesion to plastic components. From these characteristics, the photocurable resin composition of the present invention can be used for the assembly and potting of various electrical / electronic components, etc., and has the potential to be developed in a wide range of applications.

[0138] This application is based on Japanese Patent Application No. 2022-191234 filed on November 30, 2022, the disclosure of which is incorporated herein by reference in its entirety.

Claims

1. A photocurable resin composition comprising the following components (A) to (E): (A) component: an organic polymer having two or more alkoxysilyl groups in one molecule; (B) component: talc powder and / or calcium carbonate powder; (C) component: a pigment; (D) component: a photoacid generator; (E) component: a compound having an isocyanuric acid ring and an alkoxysilyl group in one molecule.

2. The photocurable resin composition according to claim 1, wherein, The (A) component contains: (A-1) component: an organic polymer having two or more alkoxysilyl groups and a polyether backbone in one molecule; and (A-2) component: an organic polymer having two or more alkoxysilyl groups and a vinyl-based polymer backbone in one molecule.

3. The photocurable resin composition according to claim 1, wherein, At least one of the alkoxysilyl groups in the (A) component is a trialkoxysilyl group.

4. The photocurable resin composition according to claim 1, wherein, The (B) component is talc powder.

5. The photocurable resin composition according to claim 1, wherein, The (C) component is carbon black.

6. The photocurable resin composition according to claim 1, wherein, The (D) component is an onium salt compound.

7. The photocurable resin composition according to claim 6, wherein, The (D) component is a sulfonium salt compound.

8. The photocurable resin composition according to claim 1, further comprising an organic polymer having only one alkoxysilyl group in one molecule.

9. A cured product obtained by curing the photocurable resin composition according to claim 1.

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