Wafer repeated positive pressure cleaning equipment

Abstract

The invention belongs to the semiconductor 2.5 D / 3D advanced packaging cleaning technology, and particularly relates to wafer repeated positive pressure cleaning equipment which comprises a machine base with supporting legs, a hydraulic telescopic cylinder, a lifting block, a water spraying head positioning assembly, a pollutant flushing assembly, a wafer rotating assembly and a cleaning water tank. An annular base is fixedly mounted at the top of the machine base, and a rotating ring is rotationally mounted at the top of the annular base. According to the invention, a wafer in a hollow chamber is taken out and put into a storage groove of a storage disc, a driving motor works to drive a gear ring to rotate through a main gear, then a rotating ring drives the storage disc to rotate, and pollutants in the wafer are thrown out under the action of centrifugal force; the cleaning process comprises the steps of placing the wafer into the hollow cavity, adding nano water to fill the hollow cavity, applying positive pressure for a period of time, releasing the pressure to normal pressure, and centrifugally rotating the wafer, and the operation is repeated, and the wafer is continuously cleaned for several times until the wafer is clean.

Description

Technical Field

[0001] The present invention relates to a wafer rinsing device, and more particularly to a wafer repeated positive pressure cleaning device. Background Art

[0002] The process of fabricating semiconductor wafers generally includes steps such as crystal growth, cutting, polishing, and cleaning. Cleaning is a crucial step in the semiconductor wafer manufacturing process, and its purpose is to remove various contaminants on the wafer surface, such as organic substances, inorganic salts, oils and greases, and dust, etc., to ensure the cleanliness and smoothness of the wafer surface.

[0003] After retrieval, the utility model patent with the patent publication number CN208538807U discloses a semiconductor wafer cleaning device, which generally includes components such as a wafer carrying mechanism, a cleaning tank, and a lifting mechanism. When cleaning the wafer, the wafer is placed on the wafer carrying mechanism, and the liquid outlet end of the circulating rinsing mechanism is used to rinse the wafer. At the same time, the ultrasonic generating mechanism is started to provide ultrasonic waves to the deionized water in the cleaning tank. In this way, the wafer surface can be thoroughly cleaned, and at the same time, the residual deionized water can be prevented from damaging the structure of the wafer surface. However, during rinsing, due to partial occlusion by the wafer carrying mechanism, the entire surface of the wafer cannot be completely rinsed, which may lead to uneven texture or reflectivity on the wafer surface; and the cleaning effect of the workbench surface is not good, which is likely to cause secondary contamination. In view of this, the present invention designs a wafer repeated positive pressure cleaning device. Summary of the Invention

[0004] The main purpose of the present disclosure is to provide a wafer repeated positive pressure cleaning device to effectively solve the problems raised by the inventor in the above background art.

[0005] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0006] A wafer repeated positive pressure cleaning device, comprising a base with legs, a hydraulic telescopic cylinder, a lifting block, a water spray head positioning assembly, a pollutant flushing assembly, a wafer rotating assembly and a cleaning water tank. The wafer rotating assembly includes an annular base, a rotating ring and a placement plate. The annular base is fixedly installed at the top of the base, and the rotating ring is rotatably installed on the top of the annular base. The top of the rotating ring is fixedly connected with a placement plate. The top of the placement plate is provided with a placement groove, and a plurality of uniformly distributed first drain holes are provided on the side of the placement groove. A groove is provided at the center of the top of the base, and a hydraulic telescopic cylinder is fixedly installed at the bottom of the groove. The hydraulic telescopic cylinder passes through the annular base, the rotating ring and the placement plate, and the output end of the hydraulic telescopic cylinder is fixedly connected with a lifting block. A plurality of water spray head positioning assemblies distributed in an annular array are fixedly connected to the side of the lifting block. A support is fixedly installed at the top of the lifting block, and a cleaning water tank is fixedly installed at the top of the support. The wafer rotating assembly is used to drive the placement plate to rotate.

[0007] Preferably, the water spray head positioning assembly includes a guide rail beam, a moving positioning seat and a water spray joint. The guide rail beam is fixedly installed on the side of the lifting block, and the moving positioning seat is slidably installed on the guide rail beam. The water spray joint is embedded on the moving positioning seat, and a corrugated expansion pipe is fixedly connected to the moving water spray head. The other end of the corrugated expansion pipe is fixedly connected to the upper end of the side of the cleaning water tank, and a manual valve is installed on the corrugated expansion pipe.

[0008] Preferably, a positive pressure cleaning assembly is provided above the cleaning water tank. The positive pressure cleaning assembly includes a nano water tank, a pressure pipe and a pressure relief valve. The nano water tank is fixedly installed on the top of the cleaning water tank. The pressure pipe and the pressure relief valve are respectively fixedly installed on both sides of the nano water tank. The other end of the pressure pipe is used to connect an external pressure device, and the external pressure device adopts an intermittent or continuous pressure application method. Nano water for cleaning the wafer is injected into the nano water tank, that is, the nano water tank is connected to an external nano water ion generator. Specifically: the wafer to be cleaned is placed in the hollow chamber in the nano water tank, and nano water is generated by the nano water ion generator and the hollow chamber is filled. The external pressure device is used to intermittently or continuously pressurize the nano water tank through the pressure pipe for a period of time, so that the nano water continuously squeezes into the gaps to achieve positive pressure cleaning of the wafer. Then the pressure relief valve is opened to reduce the pressure in the nano water tank to normal pressure.

[0009] Preferably, the wafer rotating assembly includes a driving motor, a main gear and a gear ring. The driving motor is fixedly installed on the side of the annular base, and the output end of the driving motor is fixedly connected with the main gear. The side of the rotating ring is fixedly installed with a gear ring, and the gear ring is meshed with the main gear for transmission. A plurality of second drain holes are formed at the bottom of the groove, so that the placement tray is driven to rotate, and pollutants are thrown out by the action of centrifugal force. The specific cleaning process is as follows: start to add nano water to fill the hollow chamber - apply positive pressure for a period of time - release the pressure to normal pressure - the wafer rotates centrifugally. By repeating the above operations, the wafer can be continuously cleaned until it is clean.

[0010] Preferably, a rectangular sliding hole is formed in the guide rail beam, and the moving positioning seat is slidably installed in the rectangular sliding hole. One side of the moving positioning seat is fixedly connected with a straight rod. The straight rod is slidably observed and installed on the guide rail beam, and the end of the straight rod outside the guide rail beam is fixedly connected with a rope connecting head. A reset sleeve spring is fixedly connected between the moving positioning seat and the side wall of the rectangular sliding hole, and the straight rod penetrates through the reset sleeve spring.

[0011] Preferably, a vertical frame is fixedly connected to the top of the machine base, and a wheel frame is fixedly installed on the vertical frame. A guiding pulley is movably installed on the wheel frame. The rope connecting head is fixedly connected with an inelastic pulling rope. A rope mounting seat is fixedly installed on the vertical frame. The other end of the inelastic pulling rope bypasses the guiding pulley and is fixedly connected to the rope mounting seat.

[0012] Preferably, the pollutant flushing assembly includes a flushing pump, a pumping pipe, a movable hose and a water storage cavity. The water storage cavity is formed in the machine base. The flushing pump is fixedly installed on the machine base, and two pumping pipes are fixedly connected to the flushing pump. One pumping pipe is fixedly connected to the water storage cavity, and the other pumping pipe is fixedly connected to the movable hose. The other end of the movable hose is fixedly connected to the upper end of the side of the cleaning water tank. The cleaning of the residual pollutants is after the last centrifugal rotation of the wafer, and the flushing water takes the pollutants out from the first drain hole and the second drain hole to flush away the pollutants. A mixing shaft is rotatably installed in the water storage cavity, and mixing blades are fixedly installed on the mixing shaft. An adding pipe extending into the water storage cavity is inlaid on the top of the machine base.

[0013] Preferably, the top end of the mixing shaft extends outside the machine base and is provided with a cross groove. A bearing seat is fixedly installed on the side of the annular base, and a limiting rotating shaft is rotatably installed on the bearing seat. The bottom end of the limiting rotating shaft is fixedly connected with a cross inserting rod, and the cross inserting rod is inserted into the cross groove. The top end of the limiting rotating shaft is fixedly connected with an auxiliary gear, and the auxiliary gear is meshed with the gear ring for transmission.

[0014] In view of this, compared with the prior art, the beneficial effects of the present invention are:

[0015] (i) In the present application, the wafer to be cleaned is placed in the hollow chamber of the nano water tank, nano water is generated by a nano water ion generator and filled into the hollow chamber, and an external pressurizing device is used to intermittently or continuously pressurize the inside of the nano water tank through a pressurizing tube for a period of time, so that the nano water is continuously squeezed into the gap to achieve positive pressure cleaning of the wafer, and then the pressure relief valve is opened to reduce the pressure in the nano water tank to normal pressure.

[0016] (ii) In the present application, the wafer in the hollow chamber is taken out and placed in the storage slot of the placement plate, and the driving motor is operated to drive the gear ring to rotate through the main gear, and then the rotating ring drives the placement plate to rotate, and the pollutants therein are thrown out by the action of centrifugal force. The cleaning process is as follows: start to add nano water to fill the hollow chamber - add positive pressure for a period of time - release the pressure to normal pressure - centrifugal rotation of the wafer, and repeat the above operation to continuously clean the wafer until it is clean.

[0017] (III) In the present application, when cleaning the residual contaminants (after the last centrifugal rotation of the wafer), the manual valve on the bellows is opened to allow the flushing water to be transported to the water spray joint through the bellows and finally to the placement tray (storage slot). The flushing water carries the contaminants out from the first drain hole and the second drain hole to flush away the contaminants.

[0018] (IV) In the present application, during flushing, the hydraulic telescopic cylinder works, which will drive the lifting block and the clean water tank to move up and down. When the lifting block moves up with the guide beam, the rope connector pulls the linear rod under the traction of the non-elastic pull rope, and then the linear rod drives the movable positioning seat to move, so that the position of the water spray joint changes, and the reset sleeve spring can restore the movable positioning seat to its original position, so that pollutants in all positions can be flushed away, and due to the different heights, the intensity and angle of flushing are also different, which can completely remove the residue to ensure the cleanliness of the work surface.

[0019] (V) In the present application, flushing water (cleaning liquid) is added into the water storage chamber, and the flushing pump works when flushing the countertop to transport the cleaning liquid in the water storage chamber to the movable hose through the pumping pipe, and finally into the clean water tank. Prior to this, when the ring gear rotates, the auxiliary gear engages with it, causing the auxiliary gear to drive the limiting shaft to rotate, and then the cross rod drives the mixing shaft to rotate, so that the mixing blades fully stir and mix the cleaning liquid in the water storage chamber to ensure the cleaning effect of the cleaning liquid, providing convenience for the subsequent cleaning of the work surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 The figure is a cross-sectional view of the structure of the wafer repeated positive pressure cleaning equipment provided by the present invention;

[0021] Figure 2 Shown Figure 1 The enlarged schematic diagram of point A in the middle;

[0022] Figure 3 Shown as Figure 1 The enlarged schematic view at position B in the figure;

[0023] Figure 4 Shown as the sectional view of the placement tray;

[0024] Figure 5 Shown as the three-dimensional view of the placement tray;

[0025] Figure 6 Shown as the connection top view of the gear ring with the main gear and the auxiliary gear;

[0026] Figure 7 Shown as the top view of the sprinkler head positioning assembly;

[0027] Figure 8 Shown as Figure 7 The partial structure schematic view in the figure;

[0028] Figure 9 Shown as the exploded view of the connection between the limit rotating shaft and the mixing shaft.

[0029] Icon:

[0030] 1 - Machine base; 101 - Second drain hole; 102 - Vertical frame; 103 - Guide pulley; 104 - Rope mounting seat; 105 - Inelastic pull rope;

[0031] 2 - Hydraulic telescopic cylinder;

[0032] 3 - Lifting block;

[0033] 4 - Sprinkler head positioning assembly; 401 - Guide rail beam; 402 - Moving positioning seat; 4021 - Sprinkler joint; 403 - Rectangular sliding hole; 404 - Straight rod; 405 - Rope connection head; 406 - Return spring sleeve;

[0034] 5 - Pollutant flushing assembly; 501 - Pumping pipe; 502 - Flexible hose; 503 - Water storage cavity; 504 - Mixing shaft; 5041 - Cross groove; 505 - Mixing blade;

[0035] 6 - Wafer rotating assembly; 601 - Ring base; 602 - Rotating ring; 603 - Placement tray; 6031 - Placement groove; 6032 - First drain hole; 604 - Driving motor; 605 - Main gear; 606 - Gear ring; 607 - Bearing seat; 608 - Limit rotating shaft; 6081 - Cross inserting rod; 609 - Auxiliary gear;

[0036] 7 - Cleaning water tank; 701 - Nano water tank; 702 - Pressurizing pipe; 703 - Pressure relief valve; 704 - Corrugated expansion pipe; 705 - Manual valve. Specific implementation manners

[0037] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0038] Please refer to Figures 1-9 , the present invention provides the following embodiments:

[0039] A wafer repeated positive pressure cleaning device includes a machine base 1 with legs, a hydraulic telescopic cylinder 2, a lifting block 3, a water spray head positioning assembly 4, a pollutant flushing assembly 5, a wafer rotating assembly 6 and a cleaning water tank 7. The wafer rotating assembly 6 includes an annular base 601, a rotating ring 602 and a placement plate 603. The annular base 601 is fixedly installed on the top of the machine base 1, and the rotating ring 602 is rotatably installed on the top of the annular base 601. The top of the rotating ring 62 is fixedly connected to the placement plate 63. A placement groove 6031 is formed on the top of the placement plate 603, and a number of uniformly distributed first drain holes 6032 are formed on the side of the placement groove 6031. A groove is formed at the center of the top of the machine base 1, and the hydraulic telescopic cylinder 2 is fixedly installed at the bottom of the groove. The hydraulic telescopic cylinder 2 passes through the annular base 601, the rotating ring 602 and the placement plate 603, and the output end of the hydraulic telescopic cylinder 2 is fixedly connected to the lifting block 3. A number of water spray head positioning assemblies 4 distributed in an annular array are fixedly connected to the side of the lifting block 3. A bracket is fixedly installed on the top of the lifting block 3, and the cleaning water tank 7 is fixedly installed at the top of the bracket. The wafer rotating assembly 6 is used to drive the placement plate 603 to rotate.

[0040] Specifically, the water spray head positioning assembly 4 includes a guide rail beam 401, a moving positioning seat 402 and a water spray joint 403. The guide rail beam 401 is fixedly installed on the side of the lifting block 3, and the moving positioning seat 402 is slidably installed on the guide rail beam 401. The water spray joint 403 is embedded in the moving positioning seat 402, and a corrugated expansion pipe 704 is fixedly connected to the moving water spray head 402. The other end of the corrugated expansion pipe 704 is fixedly connected to the upper end of the side of the cleaning water tank 7, and a manual valve 705 is installed on the corrugated expansion pipe 704.

[0041] Specifically, a positive-pressure cleaning assembly is provided above the cleaning water tank 7. The positive-pressure cleaning assembly includes a nano water tank 701, a pressure pipe 702, and a pressure relief valve 703. The nano water tank 701 is fixedly installed on the top of the cleaning water tank 7. The pressure pipe 702 and the pressure relief valve 703 are respectively fixedly installed on both sides of the nano water tank 701. The other end of the pressure pipe 702 is used to connect an external pressurizing device, and the external pressurizing device adopts an intermittent or continuous pressurizing method. Nano water for cleaning the wafer is injected into the nano water tank 701, that is, the nano water tank 701 is connected to an external nano water ion generator. Specifically: Place the wafer to be cleaned in the hollow chamber in the nano water tank 701, generate nano water through the nano water ion generator and fill the hollow chamber, use the external pressurizing device to intermittently or continuously pressurize the nano water tank 701 through the pressure pipe 702 for a period of time, so that the nano water continuously squeezes into the gaps to achieve positive-pressure cleaning of the wafer. Then open the pressure relief valve 703 to reduce the pressure in the nano water tank 701 to atmospheric pressure.

[0042] Specifically, the wafer rotation assembly 6 includes a drive motor 604, a main gear 605, and a gear ring 606. The drive motor 604 is fixedly installed on the side of the annular base 601, and the output end of the drive motor 604 is fixedly connected to the main gear 605. A gear ring 606 is fixedly installed on the side of the rotating ring 602, and the gear ring 606 is meshed and driven with the main gear 604. A number of second drain holes 101 are opened at the bottom of the groove, so that the placement plate 603 is driven to rotate, and pollutants are thrown out by the action of centrifugal force. The specific cleaning process is as follows: Start by adding nano water to fill the hollow chamber - apply positive pressure for a period of time - relieve pressure to atmospheric pressure - rotate the wafer centrifugally. Repeat the above operations to continuously clean the wafer until it is clean.

[0043] Specifically, a rectangular sliding hole 403 is opened on the guide rail beam 401, and the moving positioning seat 402 is slidably installed in the rectangular sliding hole 403. One side of the moving positioning seat 402 is fixedly connected to a straight rod 404. The straight rod 404 is slidably observed and installed on the guide rail beam 401, and the end of the straight rod 404 outside the guide rail beam 401 is fixedly connected to a rope connection head 405. A return spring 406 is fixedly connected between the moving positioning seat 402 and the side wall of the rectangular sliding hole 403, and the straight rod 404 passes through the return spring 406.

[0044] Specifically, a vertical frame 102 is fixedly connected to the top of the machine base 1, and a wheel frame is fixedly installed on the vertical frame 102. A guide pulley 103 is movably installed on the wheel frame. An inelastic pull rope 105 is fixedly connected to the rope connection head 405. A rope mounting seat 104 is fixedly installed on the vertical frame, and the other end of the inelastic pull rope 105 bypasses the guide pulley 103 and is fixedly connected to the rope mounting seat 104.

[0045] Specifically, the pollutant flushing component 5 includes a flushing pump, a pumping pipe 501, a movable hose 502 and a water storage chamber 503. The water storage chamber 503 is opened in the machine base 1. The flushing pump is fixedly installed on the machine base 1, and two pumping pipes 501 are fixedly connected to the flushing pump, one pumping pipe 501 is fixedly connected in the water storage chamber 503, and the other pumping pipe 501 is fixedly connected to the movable hose 502, and the other end of the movable hose 502 is fixedly connected to the upper end of the side of the clean water tank 7. The residual pollutants are cleaned after the last centrifugal rotation of the wafer, and the flushing water brings the pollutants out from the first drain hole 6032 and the second drain hole 101 to flush away the pollutants. A mixing shaft 504 is rotatably installed in the water storage chamber 503, and a mixing blade 505 is fixedly installed on the mixing shaft 504. The top of the machine base 1 is inlaid with an addition pipe extending into the water storage chamber 503.

[0046] Specifically, the top of the mixing shaft 504 extends to the outside of the machine base 1 and is provided with a cross groove 5041. A bearing seat 607 is fixedly installed on the side of the annular base 601, and a limiting rotating shaft 608 is rotatably installed on the bearing seat 607. The bottom end of the limiting rotating shaft 608 is fixedly connected with a cross rod 6081, and the cross rod 6081 is inserted into the cross groove 5041. The top of the limiting rotating shaft 608 is fixedly connected with an auxiliary gear 609, and the auxiliary gear 609 is meshed with the ring gear 606 for transmission.

[0047] The specific implementation method of this embodiment is as follows: placing the wafer to be cleaned in the hollow chamber of the nano water tank 701, generating nano water through the nano water ion generator and filling the hollow chamber, using an external pressurizing device to intermittently or continuously pressurize the inside through the pressurizing pipe 702 for a period of time, so that the nano water is continuously squeezed into the gap to achieve positive pressure cleaning of the wafer, and then opening the pressure relief valve 703 to reduce the pressure in the nano water tank 701 to normal pressure;

[0048] The wafer in the hollow chamber is taken out and placed in the storage slot 6031 of the placement plate 603. The driving motor 604 is operated to drive the gear ring 606 to rotate through the main gear 605, and then the rotating ring 602 drives the placement plate 603 to rotate, and the pollutants therein are thrown out by the action of centrifugal force. The cleaning process is as follows: start to add nano water to fill the hollow chamber - add positive pressure for a period of time - release pressure to normal pressure - centrifugal rotation of the wafer, and repeat the above operation to continuously clean the wafer until it is clean;

[0049] When the remaining contaminants are cleaned up (after the last centrifugal rotation of the wafer), the manual valve 705 on the bellows telescopic water pipe 704 is opened, so that the flushing water is transported to the water spray joint 4021 through the bellows telescopic water pipe 8, and finally flushed to the placement plate 603 (placement tank 6031), and the flushing water carries the contaminants out from the first drainage hole 6032 and the second drainage hole 101 to flush away the contaminants;

[0050] During rinsing, the hydraulic telescopic cylinder 2 operates, which drives the lifting block 3 and the cleaning water tank 7 to reciprocate up and down. When the lifting block 3 drives the guide rail beam 401 to move upward, under the traction of the inelastic pull rope 105, the rope connection head 405 pulls the straight rod 404, and then the straight rod 404 drives the moving positioning seat 402 to move, changing the position of the water spraying joint 4021. The reset sleeve spring 406 can make the moving positioning seat 402 return to its original position, so that pollutants at all positions can be washed away. Due to the different heights, the rinsing intensity and angle are also different, and the residues can be completely removed to ensure the cleanliness of the workbench surface;

[0051] Rinsing water (cleaning liquid) is added into the water storage cavity 503. When rinsing the workbench surface, the rinsing pump operates to pump the cleaning liquid in the water storage cavity 503 through the pumping pipe 501 into the movable hose 502 and finally into the cleaning water tank 7. Before that, when the gear ring 606 rotates, since the auxiliary gear 609 meshes with it, the auxiliary gear 609 drives the limit rotating shaft 608 to rotate, and then the cross inserting rod 6081 drives the mixing shaft 504 to rotate, so that the mixing blades 505 fully stir and mix the cleaning liquid in the water storage cavity 503 to ensure the cleaning effect of the cleaning liquid and facilitate the subsequent cleaning of the workbench surface.

[0052] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0053] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not elaborate on all details and do not limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principle and practical application of the present invention, so that those skilled in the relevant technical field can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A wafer repeated positive pressure cleaning device, characterized in that: It includes a base (1) with legs, a hydraulic telescopic cylinder (2), a lifting block (3), a water spray head positioning assembly (4), a pollutant flushing assembly (5), a wafer rotating assembly (6) and a cleaning water tank (7). The wafer rotating assembly (6) includes an annular base (601), a rotating ring (602) and a placement plate (603). The annular base (601) is fixedly installed at the top of the base (1), and the rotating ring (602) is rotatably installed at the top of the annular base (601). The top of the rotating ring (62) is fixedly connected to the placement plate (63). A placement groove (6031) is formed at the top of the placement plate (63), and a number of uniformly distributed first drainage holes (6032) are formed on the side of the placement groove (6031). A groove is formed at the center of the top of the base (1), and the hydraulic telescopic cylinder (2) is fixedly installed at the bottom of the groove. The hydraulic telescopic cylinder (2) passes through the annular base (601), the rotating ring (602) and the placement plate (603), and the output end of the hydraulic telescopic cylinder (2) is fixedly connected to the lifting block (3). A number of water spray head positioning assemblies (4) are fixedly connected to the side of the lifting block (3) in an annular array. A bracket is fixedly installed at the top of the lifting block (3), and the cleaning water tank (7) is fixedly installed at the top of the bracket. The wafer rotating assembly (6) is used to drive the placement plate (603) to rotate.

2. The wafer repeated positive pressure cleaning device according to claim 1, wherein: The water spray head positioning assembly (4) includes a guide rail beam (401), a moving positioning seat (402) and a water spray joint (403). The guide rail beam (401) is fixedly installed on the side of the lifting block (3), and the moving positioning seat (402) is slidably installed on the guide rail beam (401). The water spray joint (403) is embedded in the moving positioning seat (402), and a corrugated expansion pipe (704) is fixedly connected to the moving water spray head (402). The other end of the corrugated expansion pipe (704) is fixedly connected to the upper end of the side of the cleaning water tank (7), and a manual valve (705) is installed on the corrugated expansion pipe (704).

3. The wafer repeated positive pressure cleaning device according to claim 2, characterized in that: Above the cleaning water tank (7), there is a positive-pressure cleaning component, and the positive-pressure cleaning component includes a nano water tank (701), a pressure pipe (702), and a pressure relief valve (703). The nano water tank (701) is fixedly installed on the top of the cleaning water tank (7). The pressure pipe (702) and the pressure relief valve (703) are respectively fixedly installed on both sides of the nano water tank (701). The other end of the pressure pipe (702) is used to connect to an external pressure device, and the external pressure device adopts an intermittent or continuous pressure application method. Nano water for cleaning wafers is injected into the nano water tank (701), that is, the nano water tank (701) is connected to an external nano water ion generator. Specifically: Place the wafer to be cleaned in the hollow chamber in the nano water tank (701), generate nano water through the nano water ion generator and fill the hollow chamber. Use the external pressure device to apply intermittent or continuous pressure to the nano water tank (701) through the pressure pipe (702) for a period of time, so that the nano water continuously squeezes into the gaps to achieve positive-pressure cleaning of the wafer. Then open the pressure relief valve (703) to reduce the pressure in the nano water tank (701) to normal pressure.

4. A wafer repeated positive pressure cleaning device according to claim 3, characterized in that: The wafer rotating component (6) includes a driving motor (604), a main gear (605), and a gear ring (606). The driving motor (604) is fixedly installed on the side of the annular base (601), and the output end of the driving motor (604) is fixedly connected to the main gear (605). The gear ring (606) is fixedly installed on the side of the rotating ring (602), and the gear ring (606) meshes with the main gear (604) for transmission. A number of second drain holes (101) are opened at the bottom of the groove, so that the placement plate (603) is driven to rotate, and pollutants are thrown out by the action of centrifugal force. The specific cleaning process is: Place the wafer into the chamber - add nano water to fill the chamber - apply continuous positive pressure or intermittent positive pressure for a period of time - relieve pressure to normal pressure - centrifuge the wafer to rotate. Repeat the above operations several times to clean the wafer until it is clean.

5. The wafer repeated positive pressure cleaning equipment according to claim 4, characterized in that: A rectangular sliding hole (403) is opened on the guide rail beam (401), and the moving positioning seat (402) is slidably installed in the rectangular sliding hole (403). One side of the moving positioning seat (402) is fixedly connected to a straight rod (404). The straight rod (404) is slidably observed and installed on the guide rail beam (401), and the end of the straight rod (404) outside the guide rail beam (401) is fixedly connected to a rope connection head (405). A return sleeve spring (406) is fixedly connected between the moving positioning seat (402) and the side wall of the rectangular sliding hole (403), and the straight rod (404) passes through the return sleeve spring (406).

6. The wafer repeated positive pressure cleaning device according to claim 5, characterized in that: A vertical frame (102) is fixedly connected to the top of the base (1), and a wheel frame is fixedly installed on the vertical frame (102). A guiding pulley (103) is movably installed on the wheel frame. An inelastic pull rope (105) is fixedly connected to the rope connection head (405). A rope mounting seat (104) is fixedly installed on the vertical frame. The other end of the inelastic pull rope (105) bypasses the guiding pulley (103) and is fixedly connected to the rope mounting seat (104).

7. The wafer repeated positive pressure cleaning device according to claim 6, wherein: The pollutant flushing assembly (5) includes a flushing pump, a pumping pipe (501), a movable hose (502), and a water storage chamber (503). The water storage chamber (503) is formed inside the base (1). The flushing pump is fixedly installed on the base (1), and two pumping pipes (501) are fixedly connected to the flushing pump. One pumping pipe (501) is fixedly connected inside the water storage chamber (503), and the other pumping pipe (501) is fixedly connected to the movable hose (502). The other end of the movable hose (502) is fixedly connected to the upper end of the side of the cleaning water tank (7). The cleaning of the residual pollutants is carried out after the last centrifugal rotation of the wafer, and the flushing water takes the pollutants out from the first drain hole (6032) and the second drain hole (101) to wash away the pollutants.

8. A wafer repeated positive pressure cleaning device according to claim 7, characterized in that: A mixing shaft (504) is rotatably installed inside the water storage chamber (503), and mixing blades (505) are fixedly installed on the mixing shaft (504). An adding pipe extending into the water storage chamber (503) is inlaid on the top of the base (1).

9. A wafer repeated positive pressure cleaning device according to claim 8, characterized in that: The top end of the mixing shaft (504) extends outside the base (1) and is provided with a cross groove (5041). A bearing seat (607) is fixedly installed on the side of the annular base (601), and a limiting rotating shaft (608) is rotatably installed on the bearing seat (607). The bottom end of the limiting rotating shaft (608) is fixedly connected with a cross inserting rod (6081), and the cross inserting rod (6081) is inserted into the cross groove (5041). The top end of the limiting rotating shaft (608) is fixedly connected with an auxiliary gear (609), and the auxiliary gear (609) is in meshing transmission with the toothed ring (606).

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