A dry ice cleaning machine for semiconductor materials

Abstract

This invention discloses a dry ice cleaning machine for semiconductor materials, relating to the field of dry ice cleaning technology. It includes a support structure comprising a support rod; a power structure comprising a mounting base plate and a positioning plate fixed to the surface of the support rod, a servo motor fixed to the surface of the positioning plate, and a rotating shaft rotating on the top of the servo motor; and a clamping structure comprising a support base fixed to the top of the rotating shaft, a positioning groove formed on the surface of the support base, an electric push rod fixed to the side of the positioning groove, a clamping assembly fixed to the top of the electric push rod, a sensing assembly fixed to the clamping assembly, and a suspension assembly fixed to the side of the sensing assembly. This invention avoids the problem of excessively large clamping coverage area, reduces the possibility of uneven dry ice spray distribution, promotes uniform dry ice spray distribution, improves cleaning effect, and effectively avoids problems of uneven local dissolution and water vapor adhesion.

Description

Technical Field

[0001] This invention relates to the field of dry ice cleaning technology, specifically to a dry ice cleaning machine for semiconductor materials. Background Technology

[0002] Dry ice cleaning machines are non-abrasive and environmentally friendly cleaning devices that use dry ice particles to remove dirt through spraying.

[0003] A dry ice cleaning machine for semiconductor materials is a device that uses dry ice as a cleaning medium. By spraying dry ice particles at high speed onto the surface of semiconductor materials or related equipment, the low temperature and volume expansion effect generated by the sublimation of dry ice upon contact causes dirt and impurities to freeze and become brittle rapidly. At the same time, the impact force of the dry ice particles peels them off the surface.

[0004] However, during the cleaning process of semiconductor materials, some semiconductor materials require clamping. Existing clamping methods have mismatched control over the coverage area of ​​semiconductor materials, resulting in an excessively large coverage area. This weakens the ability of dry ice blasting to fully cover the material surface, creating large cleaning blind spots. Consequently, the cleaning dry ice cannot fully cover the semiconductor material surface, leading to incomplete cleaning and reduced cleaning effectiveness. Furthermore, it affects the sufficient contact and uniform distribution between the dry ice and the semiconductor material surface, causing uneven dissolution of the dry ice in localized areas. This results in water vapor formed by the dissolving dry ice easily adhering to the semiconductor material surface, severely impacting the performance of the semiconductor material. Summary of the Invention

[0005] The purpose of this invention is to provide a dry ice cleaning machine for semiconductor materials to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a dry ice cleaning machine for semiconductor materials, comprising,

[0007] Support structure, including support rods;

[0008] The power structure includes a mounting base plate and a positioning plate fixed to the surface of the support rod, a servo motor fixed to the surface of the positioning plate, and a rotating shaft rotating on the top of the servo motor.

[0009] The clamping structure includes a support base fixed to the top of the rotating shaft, a positioning groove formed on the surface of the support base, an electric push rod fixed to the side of the positioning groove, a clamping assembly fixed to the top of the electric push rod, a sensing assembly fixed to the clamping assembly, and a suspension assembly fixed to the side of the sensing assembly; and...

[0010] The auxiliary structure includes a push rod fixed to the clamping assembly, an air supply cylinder sliding on the surface of the push rod, and an auxiliary component fixed to the top of the push rod.

[0011] As a preferred embodiment of the dry ice cleaning machine for semiconductor materials described in this invention, the clamping assembly includes: a load-bearing block fixed to the top of the electric push rod; a vertical push rod slidably connected to the load-bearing block; a spring disposed on the surface of the vertical push rod; a sector plate fixed to the top of the vertical push rod; a groove formed on the sector plate; a fixing plate fixedly connected to the surface of the groove; and a mounting groove formed on the surface of the sector plate.

[0012] As a preferred embodiment of the dry ice cleaning machine for semiconductor materials described in this invention, the support base has sliding grooves on its surface and on the side of the positioning groove, the fan-shaped plate has a telescopic slider fixed on its surface, one end of the telescopic slider is fixedly connected to an anti-detachment plate, the fan-shaped plate has a second groove, and the load-bearing block has a third groove.

[0013] As a preferred embodiment of the dry ice cleaning machine for semiconductor materials described in this invention, the sensing component includes: a plurality of extrusion rods slidably connected to the fixed plate; an extrusion cylinder fixedly connected to the extrusion rods and installed in the mounting groove; a lever fixed to the extrusion cylinder; and a second spring disposed on the extrusion cylinder.

[0014] A contact ball is fixed to one end of the extrusion cylinder, a pressure sensor is fixed to the surface of the groove, and a protective shell is fixed inside the support base.

[0015] As a preferred embodiment of the dry ice cleaning machine for semiconductor materials described in this invention, the suspension assembly includes: an airbag fixed inside the protective shell, a protective cylinder fixed to the surface of the protective shell, a convex groove formed on the surface of the protective cylinder, a convex block slidably connected to the surface of the convex groove, and a pressing column fixedly connected to the convex block, the pressing column being slidably connected to the interior of the protective cylinder.

[0016] In a preferred embodiment of the dry ice cleaning machine for semiconductor materials described in this invention, a pressing plate is fixed to one end of the pressing column, a top block is fixed to the other end of the pressing column, and a spring is provided on the surface of the pressing column.

[0017] A flow guide tube is fixed to one surface of the airbag, a throat tube is fixed inside the flow guide tube, and a jet nozzle is fixed to one end of the flow guide tube.

[0018] As a preferred embodiment of the dry ice cleaning machine for semiconductor materials described in this invention, the auxiliary components include: a soft pad fixed to the top of the push rod; an air supply base fixed to the top of the air supply cylinder; the air supply base being fixed to the surface of the positioning groove; and an air supply pipe fixed to the surface of the air supply base, one end of which is fixed to the air bag.

[0019] In a preferred embodiment of the dry ice cleaning machine for semiconductor materials described in this invention, an air supply pipe II is fixed to the surface of the air supply base, an air valve is fixed to the surface of the air supply pipe II, a valve stem is rotated at the top of the air valve, an air bag II is fixed to the top of the air supply pipe II, and the air bag II is fixed in the groove III.

[0020] As a preferred embodiment of the dry ice cleaning machine for semiconductor materials described in this invention, it further includes:

[0021] The scanning structure includes two fixed bases fixed to the mounting base plate, a laser rangefinder fixed to the fixed bases, and a camera fixed to the fixed bases and located below the laser rangefinder; and...

[0022] The cabinet structure includes an upper chassis fixed to the support rod, a lower chassis fixed below the upper chassis, and a data server fixed to the upper chassis.

[0023] In a preferred embodiment of the dry ice cleaning machine for semiconductor materials described in this invention, a longitudinal rail is fixed to the surface of the support rod, a transverse rail slides on the longitudinal rail, a controller is installed on the transverse rail, a fixing component is fixed to the controller, and a dry ice nozzle is installed on the fixing component.

[0024] The beneficial effects of this invention are as follows: By coordinating the power structure and the clamping structure, the problem of excessive clamping coverage area is avoided, reducing the possibility of uneven dry ice spray distribution. Through the synergistic effect of the suspension component and the airflow auxiliary component, the uniform distribution of dry ice spray is promoted, improving the cleaning effect and effectively avoiding the problems of uneven local dissolution and water vapor adhesion. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the support structure of the dry ice cleaning machine for semiconductor materials according to the present invention.

[0027] Figure 2 This is a schematic diagram of the mounting base structure of the dry ice cleaning machine for semiconductor materials according to the present invention.

[0028] Figure 3 This is a schematic plan view of the power structure of the dry ice cleaning machine for semiconductor materials according to the present invention.

[0029] Figure 4 This is a schematic diagram of the support base structure of the dry ice cleaning machine for semiconductor materials according to the present invention.

[0030] Figure 5 for Figure 4 Enlarged diagram of point A in the middle.

[0031] Figure 6 This is a schematic diagram of the auxiliary structure of the dry ice cleaning machine for semiconductor materials according to the present invention.

[0032] Figure 7 This is a cross-sectional schematic diagram of the pad of the dry ice cleaning machine for semiconductor materials according to the present invention.

[0033] Figure 8 This is a cross-sectional schematic diagram of the load-bearing block of the dry ice cleaning machine for semiconductor materials according to the present invention.

[0034] Figure 9 This is a schematic cross-sectional view of the sector plate of the dry ice cleaning machine for semiconductor materials according to the present invention.

[0035] Figure 10 This is a schematic diagram of the suspension component structure of the dry ice cleaning machine for semiconductor materials of the present invention.

[0036] Figure 11 This is a schematic diagram of the upper chassis structure of the dry ice cleaning machine for semiconductor materials according to the present invention.

[0037] Figure 12 This is a schematic diagram of the overall structure of the dry ice cleaning machine for semiconductor materials according to the present invention. Detailed Implementation

[0038] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0039] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0040] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it an embodiment that is mutually exclusive, either alone or selectively, with other embodiments.

[0041] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0042] Example 1, referring to Figure 1 - Figure 7 The first embodiment of the present invention provides a dry ice cleaning machine for semiconductor materials, the device comprising:

[0043] The support structure 100 includes a support rod 101; the support rod 101 provides stable support for the power structure 200 and the clamping structure 300, ensuring that the power structure 200 and the clamping structure 300 will not shift due to vibration during operation.

[0044] The power structure 200 includes a mounting base plate 201 and a positioning plate 202 fixed to the surface of the support rod 101, a servo motor 203 fixed to the surface of the positioning plate 202, and a rotating shaft 204 rotating on the top of the servo motor 203. The positioning plate 202 is used to fix the servo motor 203. The servo motor 203 drives the rotation of the entire clamping structure 300 through the rotating shaft 204, ensuring stable power transmission. The movement of the clamping structure 300 enables dynamic rotational cleaning, allowing the dry ice spray from the dry ice nozzle 106 to cover all corners of the semiconductor material surface, reducing cleaning blind spots caused by fixed clamping, thereby improving the comprehensiveness of cleaning.

[0045] The clamping structure 300 includes a support base 301 fixed to the top of the rotating shaft 204, a positioning groove 302 formed on the surface of the support base 301, an electric push rod 304 fixed to the side of the positioning groove 302, a clamping assembly 305 fixed to the top of the electric push rod 304, a sensing assembly 306 fixed to the clamping assembly 305, and a suspension assembly 308 fixed to the side of the sensing assembly 306. The clamping assembly 305 and the sensing assembly 306 are used to control the clamping force on the edge of the semiconductor material, which can reduce the coverage area of ​​the clamping structure 300 on the edge of the material, ensure that dry ice blasting can fully cover the surface of the material, and improve the comprehensiveness and uniformity of cleaning.

[0046] The suspension component 308 contacts the material surface and blows air onto the semiconductor surface, reducing the direct contact and coverage area of ​​the clamping component 305 on the material cleaning surface. This ensures that dry ice blasting can fully cover the material surface, improving the comprehensiveness and uniformity of cleaning and reducing dry ice residue on the semiconductor material surface.

[0047] The auxiliary structure 400 includes a push rod 401 fixed to the clamping assembly 305, a gas delivery cylinder 402 sliding on the surface of the push rod 401, and an auxiliary component 403 fixed to the top of the push rod 401. The push rod 401 sliding within the gas delivery cylinder 402 transmits the generated gas to the clamping assembly 305 and the suspension assembly 308, lifting the clamping assembly 305 upwards and filling the suspension assembly 308 with gas, enabling the suspension assembly 308 to more thoroughly remove dry ice residue from the surface of the semiconductor material.

[0048] The clamping assembly 305 includes a load-bearing block 305k fixed to the top of the electric push rod 304, a vertical push rod 305i slidably connected to the load-bearing block 305k, a spring 305j disposed on the surface of the vertical push rod 305i, a sector plate 305a fixed to the top of the vertical push rod 305i, a groove 305b formed in the sector plate 305a, a fixing plate 305d fixedly connected to the surface of the groove 305b, and a mounting groove 305c formed in the surface of the sector plate 305a. The load-bearing block connects the electric push rod 304 and the sector plate 305a. The groove 305b and the mounting groove 305c provide working space for the sensing assembly 306, and the fixing plate 305d limits the sliding of the pressing rod 306a.

[0049] The support base 301 has sliding grooves 303 on its surface and on the side of the positioning groove 302. A telescopic slider 305e is fixed to the surface of the sector plate 305a, and an anti-detachment plate 305f is fixedly connected to one end of the telescopic slider 305e. A second groove 305g is formed on the surface of the sector plate 305a, and a third groove 305l is formed on the surface of the load-bearing block 305k. The slider, in conjunction with the anti-detachment plate 305f, slides in the sliding grooves 303 to prevent the sector plate 305a from shifting when pushed by the electric push rod 304 on the surface of the support base 301. The third groove 305l provides working space for the second airbag 403g.

[0050] The sensing component 306 includes several extrusion rods 306a slidably connected to the fixed plate 305d, an extrusion cylinder 306b fixedly connected to the extrusion rods 306a and installed in the mounting groove 305c, a lever 305h fixed to the extrusion cylinder 306b, and a spring 306c disposed on the extrusion cylinder 306b. A contact ball 306d is fixed to one end of the extrusion cylinder 306b, a pressure sensor 306e is fixed to the surface of the groove 305b, and a protective shell 307 is fixed inside the support base 301. It can monitor and adjust the clamping force on the edge of the semiconductor material in real time, ensuring uniform and appropriate clamping force, reducing damage to the material surface, and absorbing vibrations generated during the cleaning process to ensure the stability of the cleaning process. The edge of the fan-shaped plate 305a is designed with a spherical shape, which makes the pressure evenly distributed when the contact ball 306d comes into contact with the material surface. This avoids material deformation or damage caused by excessive local pressure, reduces the direct contact area between the clamping structure 300 and the material surface, and ensures that the dry ice spray can fully cover the material surface, thereby improving the cleaning effect and quality.

[0051] During use, when the servo motor 203 starts, it transmits power to the clamping structure 300 via the rotating shaft 204, realizing a dynamic rotation cleaning mode. This dynamic rotation cleaning mode enables dry ice spray to fully cover every corner of the semiconductor material surface, effectively reducing cleaning blind spots and improving the comprehensiveness and uniformity of cleaning. When the data server 603 controls the electric push rod 304 to push the sector plate 305a to move, the contact ball 306d on the surface of the sector plate 305a touches the edge of the semiconductor material. At this time, the edge of the semiconductor material will exert a squeezing force on the contact ball 306d. Under the action of the squeezing force, the contact ball 306d is displaced in the mounting groove 305c, thereby driving the squeezing rod 306a and the squeezing cylinder 306b accordingly. As the extrusion rod 306a moves, it compresses the pressure sensor 306e. The pressure sensor 306e transmits the sensed pressure data to the data server 603 wirelessly. After receiving this data, the data server 603 makes a judgment based on the preset clamping force threshold. This technology is prior art and can be clearly understood by those skilled in the art, so it will not be described in detail here. When the appropriate clamping force is reached, the data server 603 controls the electric push rod 304 to stop running, thereby achieving clamping of the edge of the semiconductor material. This avoids damage to the semiconductor material caused by excessive or insufficient clamping force, while improving the stability and reliability of clamping and ensuring the fixation effect of the material during the cleaning process.

[0052] Example 2, refer to Figure 1 - Figure 9This is the second embodiment of the present invention, which differs from the first embodiment in that the auxiliary component 403 includes a soft pad 403a fixed to the top of the push rod 401, an air supply base 403b fixed to the top of the air supply cylinder 402, the air supply base 403b being fixed to the surface of the positioning groove 302, and an air supply pipe 403c fixed to the surface of the air supply base 403b, one end of the air supply pipe 403c being fixed to the airbag 308a. The length design of the air supply cylinder 402 will not affect the clamping of the semiconductor material by the fan-shaped plate 305a. Moreover, the air supply pipes 403c and 403d are made of soft material, which will not affect the movement of the electric push rod 304.

[0053] The edge of the soft pad 403a is made of a soft material, while the middle part of the soft pad 403a is made of a relatively hard material. When the push rod 401 moves the soft pad 403a to slide in the air cylinder 402, and when the soft pad 403a moves towards the air base 403b, with the direction closer to the air base 403b as inward and the direction farther from the air base 403b as outward, the inward opening angle of the edge of the soft pad 403a is greater than the outward opening angle, and the edge of the soft pad 403a is tightly attached to the air cylinder 402. When the soft pad 403a moves away from the edge of the gas cylinder 402, the pressure inside the gas cylinder 402 will be greater than the external pressure, generating gas. The generated gas will be transported along the gas pipe 403c and the gas pipe 403d. When the soft pad 403a moves away from the gas base 403b, the inward opening angle of the edge of the soft pad 403a is smaller than the outward opening angle. The edge of the soft pad 403a will detach from the edge of the gas cylinder 402, which will make the pressure inside the gas cylinder 402 less than the external pressure, and gas will be transported from the outside into the gas cylinder 402.

[0054] Compared to the previous embodiment, further, a second air supply pipe 403d is fixed to the surface of the air supply base 403b, and an air valve 403e is fixed to the surface of the second air supply pipe 403d. A valve stem 403f is rotated at the top of the air valve 403e, and an air bladder 403g is fixed to the top of the second air supply pipe 403d. The air bladder 403g is fixed in the third groove 305l. Gas from the first air supply pipe 403c enters the first air bladder 308a, and gas from the second air supply pipe 403d enters the second air bladder 403g.

[0055] During use, after the electric push rod 304 moves the sector plate 305a, the contact ball 306d touches the edge of the semiconductor material. At this time, the edge of the semiconductor material exerts a squeezing force on the contact ball 306d, indicating that the sector plate 305a has finished clamping the edge of the semiconductor material. Under the action of the squeezing force, the contact ball 306d is displaced in the mounting groove 305c, which in turn drives the squeezing rod 306a and the squeezing cylinder 306b to move accordingly. Since the lever 305h and the valve stem 403f are fixed together... As the extrusion rod 306a moves, it drives the lever 305h to actuate the valve rod 403f, causing the gas in the second gas pipe 403d to enter the second airbag 403g. The second airbag 403g expands, causing the vertical push rod 305i to rise. The fan-shaped plate 305a will drive the semiconductor material to rise, enabling the gas in the first airbag 308a to be pressurized again in the guide pipe 309a, blowing air onto the surface of the semiconductor material, reducing the residual moisture on the surface of the semiconductor material after dry ice cleaning, and enhancing the stability of the semiconductor material during use.

[0056] The remaining structure is the same as that in Example 1.

[0057] Example 3, referring to Figure 1 - Figure 12 This is the third embodiment of the present invention, which differs from the second embodiment in that the suspension component 308 includes an airbag 308a fixed inside the protective shell 307, a protective cylinder 308b fixed to the surface of the protective shell 307, a convex groove 308c formed on the surface of the protective cylinder 308b, a convex block 308d slidably connected to the surface of the convex groove 308c, and a pressing post 308f fixedly connected to the convex block 308d. The pressing post 308f is slidably connected to the inside of the protective cylinder 308b. The convex block 308d slides in the convex groove 308c, mainly defining the position of the pressing post 308f. Both the pressing post 308f and the guide tube 309a are mounted on the surface of the support base 301.

[0058] Compared to the previous embodiment, a pressing plate 308e is fixed to one end of the pressing column 308f, and a top block 308h is fixed to the other end of the pressing column 308f. A spring 308g is provided on the surface of the pressing column 308f. The surface of the top block 308h has friction. On the one hand, when the semiconductor material is placed on the suspension component 308, the semiconductor material can be pre-positioned. On the other hand, when the fan-shaped plate 305a holds the semiconductor material and rises a certain distance, the pressing column 308f rises under the action of the spring 308g and acts on the surface of the semiconductor material again, so as to prevent the semiconductor material from tilting and falling after the fan-shaped plate 305a is released.

[0059] A flow guide tube 309a is fixed to the surface of the airbag 308a. A throat tube 309b is fixed inside the flow guide tube 309a. An air nozzle 309c is fixed to one end of the flow guide tube 309a. The throat tube 309b adopts a design that is narrow in the middle and wide at both ends, which allows the gas in the airbag 308a to be pressurized in the flow guide tube 309a and then released.

[0060] The first pressurization occurs when the sector plate 305a is not in contact with the edge of the semiconductor material. Gas generated by the auxiliary component 403 flows along the gas supply pipe 403c into the airbag 308a. Pressing the pressing plate 308e causes the gas in the airbag 308a to be pressurized through the guide pipe 309a and throat 309b, before being released along the jet nozzle 309c, removing impurities from the semiconductor material surface. The second pressurization occurs when the sector plate 305a contacts the edge of the semiconductor material. The airbag 403g expands, causing the vertical push rod 305i to rise. The sector plate 305a then moves the semiconductor material... As the material rises, the dry ice nozzle 106 cleans the surface of the semiconductor material. The pressing column 308f rises under the action of the spring 308g. The gas generated by the auxiliary component 403 flows along the gas supply pipe 403c into the airbag 308a, filling the airbag 308a. After the dry ice cleaning is completed, the fan-shaped plate 305a is released, and the semiconductor drives the pressing plate 308e to press, causing the gas in the airbag 308a to be pressurized again in the guide pipe 309a and the throat pipe 309b, and then released along the nozzle 309c to remove dry ice residue from the surface of the semiconductor material.

[0061] During the initial pressurization, before the sector plate 305a contacts the semiconductor material, airflow is released through the jet nozzle 309c, which effectively removes dust and impurities from the material surface, creating a cleaner initial environment for subsequent dry ice cleaning.

[0062] During the second pressurization, after the dry ice cleaning is completed, the airflow is released again through the jet head 309c to remove dry ice residue, ensuring that there are no residues on the material surface and further improving the cleaning effect.

[0063] After being squeezed by the pressing plate 308e, the airbag 308a pressurizes the gas along the guide tube 309a and the throat tube 309b and delivers it to the jet head 309c to perform airflow-assisted cleaning of the surface of the semiconductor material. Before the dry ice nozzle 106 is working, the jet head 309c blows away dry ice residue and dust to ensure that the material surface is clean and free of residue after cleaning, thus improving the cleaning effect. When the dry ice nozzle 106 is working, the gas sprayed by the jet head 309c can remove dry ice residue from the semiconductor surface, avoiding damage or corrosion to the material surface caused by dry ice residue.

[0064] Furthermore, it also includes,

[0065] The scanning structure 500 includes two mounting bases 501 fixed to a mounting base 201, a laser rangefinder 502 fixed to the mounting bases 501, and a camera 503 fixed to the mounting bases 501 and located below the laser rangefinder 502; and...

[0066] The rack structure 600 includes an upper chassis 601 fixed to a support rod 101, a lower chassis 602 fixed below the upper chassis 601, and a data server 603 fixed to the upper chassis 601.

[0067] Data collected by the laser rangefinder 502 and camera 503 is transmitted via data cable to the data server 603 for processing and analysis. The server controls the spraying area of ​​the dry ice nozzle 106 based on the size and shape data. The data server 603 controls the entire cleaning process, including the rotation speed of the servo motor 203, the extension and retraction of the electric push rod 304, and the spraying of the dry ice nozzle 106, according to the preset cleaning program and real-time monitoring data. This technology is prior art and will be clearly understood by those skilled in the art; therefore, it will not be described in detail here.

[0068] Furthermore, a longitudinal rail 102 is fixed to the surface of the support rod 101, a transverse rail 103 slides on the longitudinal rail 102, a controller 104 is mounted on the transverse rail 103, a fixing member 105 is fixed to the controller 104, and a dry ice nozzle 106 is mounted on the fixing member 105. The dry ice nozzle 106 is positioned by the fixing member 105 of the controller 104. The transverse rail 103 and the longitudinal rail 102 cooperate to achieve the positioning of the controller 104. The controller 104 adjusts the force and direction of the dry ice nozzle 106 according to the instructions of the data server 603. This technology belongs to the prior art and can be clearly understood by those skilled in the art, so it will not be described in detail here.

[0069] The remaining structure is the same as that in Example 2.

[0070] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A dry ice cleaning machine for semiconductor materials, characterized in that: include, The support structure (100) includes a support rod (101). The power structure (200) includes a mounting base plate (201) and a positioning plate (202) fixed to the surface of the support rod (101), a servo motor (203) fixed to the surface of the positioning plate (202), and a rotating shaft (204) rotating on the top of the servo motor (203). The clamping structure (300) includes a support base (301) fixed to the top of the rotating shaft (204), a positioning groove (302) formed on the surface of the support base (301), an electric push rod (304) fixed to the side of the positioning groove (302), a clamping assembly (305) fixed to the top of the electric push rod (304), a sensing assembly (306) fixed to the clamping assembly (305), and a suspension assembly (308) fixed to the side of the sensing assembly (306); and, The auxiliary structure (400) includes a push rod (401) fixed to the clamping assembly (305), an air delivery cylinder (402) sliding on the surface of the push rod (401), and an auxiliary assembly (403) fixed to the top of the push rod (401). The protective shell (307) is fixed inside the support base (301); The suspension component (308) includes an airbag (308a) fixed inside the protective shell (307), a protective cylinder (308b) fixed to the surface of the protective shell (307), a convex groove (308c) formed on the surface of the protective cylinder (308b), a convex block (308d) slidably connected to the surface of the convex groove (308c), and a pressing post (308f) fixedly connected to the convex block (308d), the pressing post (308f) being slidably connected to the inside of the protective cylinder (308b); One end of the pressing column (308f) is fixed with a pressing plate (308e), and the other end of the pressing column (308f) is fixed with a top block (308h). A spring (308g) is provided on the surface of the pressing column (308f). A flow guide tube (309a) is fixed on the surface of the airbag (308a), a throat tube (309b) is fixed inside the flow guide tube (309a), and a jet nozzle (309c) is fixed at one end of the flow guide tube (309a).

2. The dry ice cleaning machine for semiconductor materials according to claim 1, characterized in that: The clamping assembly (305) includes a load-bearing block (305k) fixed to the top of the electric push rod (304), a vertical push rod (305i) slidably connected to the load-bearing block (305k), a spring (305j) disposed on the surface of the vertical push rod (305i), a fan-shaped plate (305a) fixed to the top of the vertical push rod (305i), a groove (305b) formed on the fan-shaped plate (305a), a fixing plate (305d) fixedly connected to the surface of the groove (305b), and a mounting groove (305c) formed on the surface of the fan-shaped plate (305a).

3. The dry ice cleaning machine for semiconductor materials according to claim 2, characterized in that: The support base (301) has a sliding groove (303) on its surface and on the side of the positioning groove (302). The fan-shaped plate (305a) has a telescopic slider (305e) fixed on its surface. One end of the telescopic slider (305e) is fixedly connected to an anti-detachment plate (305f). The fan-shaped plate (305a) has a second groove (305g) on ​​its surface. The load-bearing block (305k) has a third groove (305l) on its surface.

4. The dry ice cleaning machine for semiconductor materials according to claim 3, characterized in that: The sensing component (306) includes a plurality of extrusion rods (306a) slidably connected to the fixed plate (305d), an extrusion cylinder (306b) fixedly connected to the extrusion rods (306a) and installed in the mounting groove (305c), a lever (305h) fixed to the extrusion cylinder (306b), and a second spring (306c) disposed on the extrusion cylinder (306b). A contact ball (306d) is fixed to one end of the extrusion cylinder (306b), and a pressure sensor (306e) is fixed to the surface of the groove (305b).

5. The dry ice cleaning machine for semiconductor materials according to claim 4, characterized in that: The auxiliary component (403) includes a soft pad (403a) fixed to the top of the push rod (401), an air supply base (403b) fixed to the top of the air supply cylinder (402), the air supply base (403b) fixed to the surface of the positioning groove (302), and an air supply pipe (403c) fixed to the surface of the air supply base (403b), one end of the air supply pipe (403c) being fixed to the airbag (308a).

6. The dry ice cleaning machine for semiconductor materials according to claim 5, characterized in that: The surface of the gas supply base (403b) is fixed with a second gas supply pipe (403d), the surface of the second gas supply pipe (403d) is fixed with a gas valve (403e), the top of the gas valve (403e) rotates the valve stem (403f), the top of the second gas supply pipe (403d) is fixed with a second airbag (403g), and the second airbag (403g) is fixed in the third groove (305l).

7. The dry ice cleaning machine for semiconductor materials according to claim 6, characterized in that: It also includes, The scanning structure (500) includes two fixed bases (501) fixed to the mounting base (201), a laser rangefinder (502) fixed to the fixed bases (501), and a camera (503) fixed to the fixed bases (501) and located below the laser rangefinder (502); and, The cabinet structure (600) includes an upper chassis (601) fixed to the support rod (101), a lower chassis (602) fixed below the upper chassis (601), and a data server (603) fixed to the upper chassis (601).

8. The dry ice cleaning machine for semiconductor materials according to claim 7, characterized in that: The support rod (101) has a longitudinal rail (102) fixed on its surface. A transverse rail (103) slides on the longitudinal rail (102). A controller (104) is installed on the transverse rail (103). A fastener (105) is fixed on the controller (104). A dry ice nozzle (106) is installed on the fastener (105).

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