Polysulfone composition as well as preparation method and application thereof

By controlling the content of the by-products of the Chinese formula (V) structure of polysulfone resin, using negative pressure polymerization and organic solvent washing methods, the problems of unstable optical properties and poor heat resistance of polysulfone resin are solved, and the high light transmittance and heat resistance are improved, and the application range is expanded.

CN120248329APending Publication Date: 2025-07-04WANHUA CHEM GRP CO LTD
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Patent Information

Application Number
CN202410001197.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-01-02
Publication Date
2025-07-04

AI Technical Summary

Technical Problem

The existing polysulfone resins have problems of unstable optical performance and poor heat resistance during processing and use, which affects their application in high-end fields.

Method used

By controlling the content of specific polymerization by-products in the polysulfone resin, especially the structure by-products of formula (V), the negative pressure polymerization and a mixed solution washing method of organic solvents and deionized water is used to reduce the impurity content and improve the heat resistance and optical properties of the resin.

Benefits of technology

It effectively improves the light transmittance of polysulfone resin and reduces the yellowness index, broadens its application range in biomedicine and other fields, and reduces biotoxicity.

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Abstract

The invention relates to a polysulfone composition which comprises 1-300ppm by mass of a compound with a structure as shown in a formula (V) and # imgabs0 #. The content of by-products with the structure as shown in the formula (V) is regulated and controlled by controlling the vacuum degree of a polymerization system or the purification process of a polymerization product, the content of key impurities in a polymer is reduced, and the yield of the polysulfone composition is improved. The optical performance of a product is prevented from becoming poor when a sample is subjected to high-temperature extrusion and injection molding, so that the optimization of the optical and heat-resistant performance of the polysulfone resin is realized.
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Description

Technical Field

[0001] The present invention belongs to the technical field of polysulfone resins, and particularly relates to a polysulfone composition, a preparation method thereof, and an application thereof. Background Art

[0002] Polysulfone is a kind of special engineering plastic with excellent comprehensive properties and is widely used in the fields of electronics and electrical appliances, aerospace, automobiles, and medical treatment. In recent years, with the continuous growth of the market demand for polysulfone, some special or newly developed application fields have put forward higher requirements for the performance of polysulfone.

[0003] Polysulfone resins are thermoplastic polymers with a slightly amber color, low yellowness, and relatively high light transmittance. Therefore, they can be used as transparent injection-molded parts, such as baby bottles, medical trays, and plumbing fittings. However, during the processing and use of polysulfone, it is found that the yellowness and light transmittance of the products are unstable in batches, and the heat resistance is poor. Therefore, the improvement of the preparation method of polysulfone resins is beneficial to improving the use performance of the products and expanding their applications in high-end fields.

[0004] Chinese Patent CN115058007A points out that aprotic polar solvents used for synthesizing polysulfone are extremely prone to high-temperature hydrolysis to generate amine compounds, and the amine compounds further participate in the polymerization reaction, introducing aniline-like structures into the polysulfone, which affects the optical properties of the material during processes such as extrusion and injection molding. The author uses methyl-substituted dichlorodiphenyl sulfone to replace the raw material 4,4'-dichlorodiphenyl sulfone and adds an acyl chloride compound to remove the residual amino groups after the reaction. Although the amino content is reduced, the introduction of side methyl groups and acyl chloride compounds reduces the heat resistance of the polymer itself and brings new impurities.

[0005] How to develop a polysulfone composition with good optical properties and excellent heat resistance and its preparation method is of great significance. Summary of the Invention

[0006] To solve the problems existing in the prior art, the present invention provides a polysulfone composition, a preparation method thereof, and an application thereof. By controlling the content of specific polymerization by-products in the polysulfone resin, the comprehensive properties such as the heat resistance and optical properties of the polysulfone resin are improved, and its application fields are broadened.

[0007] To achieve the object of the present invention, the following technical solutions are adopted in the present invention:

[0008] A polysulfone composition comprising a compound having the structure shown in formula (V) in a mass content of 1-300 ppm,

[0009]

[0010] R1, R2, R3, and R4 are each independently selected from H, halogen, C1-C 10alkyl group having 1 to 6 carbon atoms, C5-C6 cycloalkyl group or C6-C 10 aryl group.

[0011] Preferably, R1, R2, R3, and R4 are all H.

[0012] Preferably, in the composition, the mass content of the compound having the structure of formula (V) is 1-150 ppm.

[0013] The applicant found that 4,4'-dichlorodiphenyl sulfone also undergoes hydrolysis under high temperature conditions, and after the hydrolysis product reacts with the amine compound generated by the high temperature hydrolysis of the aprotic polar solvent, a by-product having the structure of formula (V) is formed. At the same time, in the analysis of the entire preparation process and the structure-activity relationship of polysulfone, it was found that the regulation of the content of the by-product having the structure of formula (V) in the preparation process is a key factor, which plays a crucial role in improving the comprehensive performance of polysulfone, especially optical and heat resistance properties.

[0014] Preferably, in the composition, the mass content of polysulfone is greater than 95%.

[0015] Preferably, the polysulfone is a polysulfone prepared by a nucleophilic substitution reaction of a para-dihalodiphenyl sulfone compound having the structure of formula (II), a bisphenol A compound having the structure of formula (III), or a 4,4'-biphenol type compound having the structure of formula (IV).

[0016]

[0017] Among them, R1, R2, R3, R4, R5, R6, R7, R8, R9, R 10 , R 11 , R 12 are each independently selected from any one of H, halogen, C1-C 10 alkyl group, C5-C6 cycloalkyl group or C6-C 10 aryl group; X1 and X2 are each independently selected from halogen.

[0018] In a preferred embodiment, the para-dihalodiphenyl sulfone compound of the general formula (II) is:

[0019]

[0020] The bisphenol A compound having the structure of formula (III) is:

[0021] And the structural formula of the 4,4'-biphenol type compound having the structure of formula (IV) is:

[0022]

[0023] In the present invention, the content of the compound represented by formula (V) can be controlled by controlling the reaction conditions of polysulfone. Alternatively, after preparing polysulfone by the prior art, methods such as washing and purifying the polysulfone can be used to make the content of the compound represented by formula (V) within the scope of the present invention.

[0024] The present invention also provides a method for preparing the polysulfone composition, comprising the following steps: using a para-dihalogenated diphenyl sulfone compound of formula (II) and a bisphenol A compound of formula (III) or a 4,4'-biphenol compound of formula (IV) as raw materials to carry out a polymerization reaction to obtain a polysulfone resin;

[0025] In some preferred embodiments of the present invention, the reaction is carried out under negative pressure conditions. Preferably, the vacuum degree is -10 to -60 kPa, more preferably -20 to -50 kPa, and even more preferably -30 to -40 kPa.

[0026] In some preferred embodiments of the present invention, the reaction is first carried out under negative pressure conditions, and then carried out under normal pressure after the water content in the reaction system is lower than 1000 ppm.

[0027] In some preferred embodiments of the present invention, after the feeding is completed, the system pressure is adjusted to negative pressure by a vacuum pump, and then the system is heated to boiling to discharge the solvent and the water generated by the reaction in the form of an azeotrope until the water content in the system is lower than 1000 ppm, and then the vacuum pump is turned off. During this water removal stage, by controlling the system vacuum degree to be negative pressure and reducing the reaction temperature in the early stage, low-temperature water removal is achieved, hydrolysis of the para-dihalogenated diphenyl sulfone compound and the aprotic polar solvent is inhibited, and further generation of side reaction products of the structure of formula (V) is reduced, which is beneficial to controlling the compound of formula (V) within the scope described in the present invention.

[0028] In a preferred embodiment, the polysulfone is a homopolymer of 4,4'-dichlorodiphenyl sulfone of formula (VI) and a bisphenol A compound of formula (VII) or 4,4'-biphenol of formula (VIII), wherein the molar ratio of the 4,4'-dichlorodiphenyl sulfone to the bisphenol A compound or 4,4'-biphenol is 1:(0.95 - 1.05), preferably 1:(0.97 - 1.03), and more preferably 1:(0.98 - 1.02).

[0029] In a preferred embodiment, the reaction is carried out under alkaline conditions, and the alkaline conditions are achieved by adding an alkali, and the alkali is one or more of potassium carbonate, sodium carbonate, sodium hydroxide, and potassium hydroxide.

[0030] In a preferred embodiment, the reaction is carried out in an organic solvent; the organic solvent is one or more of dimethyl sulfoxide, N-methylpyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, and sulfolane.

[0031] In a preferred embodiment, the polymerization temperature is 160 - 250 °C, preferably 165 - 210 °C.

[0032] In a preferred embodiment, the weight-average molecular weight of the polysulfone is 50,000 - 200,000, preferably 80,000 - 170,000, more preferably 100,000 - 150,000.

[0033] In a preferred embodiment, the polysulfone formed by the reaction is washed with deionized water to remove the residual organic solvent in the product, and the purified polysulfone resin powder is dried and then melt-extruded and granulated to obtain polysulfone resin particles with improved properties.

[0034] In a preferred embodiment, the polysulfone prepared by the reaction is washed with a mixed solution of an organic solvent and deionized water to remove the side reaction product of the formula (V) structure, and then washed with deionized water to remove the residual organic solvent. The purified polysulfone resin powder is dried and then melt-extruded and granulated to obtain polysulfone resin particles with improved properties.

[0035] In a preferred embodiment, the organic solvent in the washing solution is one or more of tetrahydrofuran, acetone, dimethyl sulfoxide, N-methylpyrrolidone, N,N-dimethylformamide, and N,N-dimethylacetamide.

[0036] In a preferred embodiment, the mass fraction of the organic solvent in the washing solution is 30% - 80%, preferably 40% - 75%, more preferably 50% - 70%.

[0037] In a preferred embodiment, the washing temperature is 60 °C - 140 °C, preferably 80 °C - 120 °C, more preferably 100 °C - 110 °C.

[0038] In the present invention, the content of the by-product of the formula (V) structure in the polysulfone can be reduced by carrying out the polymerization reaction under vacuum negative pressure or by washing the polymer obtained by the reaction with a mixed solution of an organic solvent and water or other feasible technical means, which is not particularly limited herein.

[0039] In a specific embodiment, the light transmittance of the bisphenol A type polysulfone resin is 80 - 90%, the yellowness index is 3 - 10%, the light transmittance of the polyphenylsulfone resin is 80 - 90%, and the yellowness index is 8 - 15%.

[0040] Another aspect of the present invention provides the application of the polysulfone composition in the fields of baby bottles, mouse cages, flow meters, and medical disinfection equipment.

[0041] Compared with the prior art, the present invention has the following beneficial effects:

[0042] The polysulfone resin with improved performance of the present invention can effectively reduce the impurity content in the polysulfone resin, improve the heat resistance of the resin, and avoid the deterioration of the optical properties of the product when the sample is extruded and injection-molded at high temperature, such as the reduction of light transmittance, the increase of haze and yellowness index, etc., by controlling the content of the polymerization by-products of the formula (V) structure, especially the by-products of the formula (I) structure, to be controlled within 1-300 ppm. At the same time, it also reduces the biological toxicity caused by the micro-release of amine monomers in the product and broadens the application scope of polysulfone in the biomedical field.

[0043] Formula (I)

[0044] The present invention can reduce the generation of side reaction products of the formula (V) structure by controlling the vacuum degree of the polymerization system to be negative pressure and reducing the pre-reaction temperature to achieve low-temperature water removal and inhibit the hydrolysis of para-dihalodiphenyl sulfone compounds and aprotic polar solvents; the by-products can also be removed by washing with a mixed solution of an organic solvent and deionized water. The process flows of both methods are simple and easy to implement, do not change the polymer body structure and properties, and do not introduce new impurities, and can effectively control the content of the compounds of the formula (V) structure. Brief Description of the Drawings

[0045] Figure 1 It is the liquid chromatogram of the reaction by-products of the formula (V) structure of the present invention, and in the formula (V), R1, R2, R3, and R4 are all H. Detailed Description of the Invention

[0046] To better understand the technical solution of the present invention, the following examples will further illustrate the method provided by the present invention, but the present invention is not limited to the listed examples, and should also include any other known changes within the scope of the claims of the present invention.

[0047] The polysulfone resin of the present invention can be used to prepare any type of molded parts through molding processes such as injection molding, extrusion, casting, and blow molding.

[0048]

[0049] The preferred applications of the polysulfone resin of the present invention are transparent / translucent or colored injection molded parts, extruded products such as sheets, film laminates, profiles, semi-finished products, and cast films or hollow fiber membranes made of high molecular weight bisphenol A type polysulfone or polyphenylsulfone.

[0050] The sources of the raw materials used in the following examples and comparative examples are as follows:

[0051] Bisphenol A, Aladdin Reagent Co., Ltd., purity > 99%;

[0052] 4,4'-Dichlorodiphenyl sulfone, Aladdin Reagent Co., Ltd., purity > 98%;

[0053] Biphenol, Aladdin Reagent Co., Ltd., purity > 99%;

[0054] N,N-Dimethylacetamide, Aladdin Reagent Co., Ltd., purity > 99%;

[0055] Potassium carbonate, Aladdin Reagent Co., Ltd., purity > 99%.

[0056] The prepared polysulfone resin was tested for performance by the following method:

[0057] The yellowness index was measured according to ASTM E313, and the sample thickness was 2 mm;

[0058] The haze and light transmittance were measured according to ASTM D1003, and the sample thickness was 2 mm;

[0059] The weight-average molecular weight was determined by gel permeation chromatography (GPC);

[0060] The content of the structural reaction by-product of formula (V) was determined by the liquid chromatography method known to those skilled in the art. The test instrument model was WATERS e2695, the chromatographic column: ZORBAX SB-PHENYL, the detection wavelength was 250 nm, the mobile phase was tetrahydrofuran, and the liquid chromatography peak position was shown in the attached figure. Among them, the substituents R1, R2, R3, and R4 were all H.

[0061] Example 1:

[0062] 45.66 g (0.2 mol) of bisphenol A, 57.43 g (0.2 mol) of 4,4'-dichlorodiphenyl sulfone, 33.17 g (0.24 mol) of potassium carbonate, and 265.5 g of DMAC were successively added to a 500 mL three-necked flask continuously filled with nitrogen. After addition, the nitrogen was stopped and the system was sealed. The system pressure was adjusted to -20 kPa by a vacuum pump, and then the system was heated to boiling to discharge DMAC and the water generated by the reaction in the form of an azeotrope until the water content in the system was lower than 1000 ppm. Then the vacuum pump was closed, and nitrogen was introduced to restore the system to normal pressure. Then the temperature of the reaction solution was raised to 165 - 170 °C and reacted for 3 h. After the solution viscosity increased, it was poured into deionized water for precipitation. The precipitated polymer was pulverized, washed, and dried to obtain bisphenol A type polysulfone powder, denoted as PSU-1.

[0063] Example 2:

[0064] Except that the polymerization system pressure was changed to -30 kPa, the rest of the preparation process was referred to Example 1, and the obtained bisphenol A type polysulfone resin was named PSU-2.

[0065] Example 3:

[0066] Except for changing the pressure of the polymerization system to -40 kPa, the remaining preparation process was referred to Example 1, and the obtained bisphenol A polysulfone resin was named PSU-3.

[0067] Example 4:

[0068] Except for changing the pressure of the polymerization system to -50 kPa, the remaining preparation process was referred to Example 1, and the obtained bisphenol A polysulfone resin was named PSU-4.

[0069] Comparative Example 1:

[0070] 45.66 g (0.2 mol) of bisphenol A, 57.43 g (0.2 mol) of 4,4'-dichlorodiphenyl sulfone, 33.17 g (0.24 mol) of potassium carbonate, and 265.5 g of DMAC were successively added to a 500 mL three-necked flask continuously filled with nitrogen. The mixed solution was heated to boiling under a nitrogen atmosphere to discharge DMAC and the water generated by the reaction in the form of an azeotrope until the water content in the system was lower than 1000 ppm, and then the water separation was stopped. The reaction was continued at 165 - 170 °C for 3 h. After the solution viscosity increased, it was poured into deionized water for precipitation. The precipitated polymer was crushed, washed, and dried to obtain bisphenol A polysulfone powder, denoted as PSU-5.

[0071] Example 5:

[0072] 37.24 g (0.2 mol) of 4,4'-biphenol, 57.43 g (0.2 mol) of 4,4'-dichlorodiphenyl sulfone, 33.17 g (0.24 mol) of potassium carbonate, and 240 g of DMAC were successively added to a 500 mL three-necked flask continuously filled with nitrogen. After adding, the nitrogen supply was stopped and the system was sealed. The system pressure was adjusted to -20 kPa by a vacuum pump, and then the system was heated to boiling to discharge DMAC and the water generated by the reaction in the form of an azeotrope until the water content in the system was lower than 1000 ppm. Then the vacuum pump was closed, and nitrogen was introduced to return the system to normal pressure. Then the temperature of the reaction solution was raised to 165 - 170 °C and reacted for 2 h. After the solution viscosity increased, it was poured into deionized water for precipitation. The precipitated polymer was crushed, washed, and dried to obtain bisphenol A polysulfone powder, denoted as PPSU-1.

[0073] Example 6:

[0074] Except for changing the pressure of the polymerization system to -30 kPa, the remaining preparation process was referred to Example 4, and the obtained polyphenylsulfone resin was named PPSU-2.

[0075] Example 7:

[0076] Except for changing the pressure of the polymerization system to -40 kPa, the remaining preparation process was referred to Example 4, and the obtained polyphenylsulfone resin was named PPSU-3.

[0077] Example 8:

[0078] Except for changing the pressure of the polymerization system to -50 kPa, the remaining preparation process was referred to Example 4, and the obtained polyphenylsulfone resin was named PPSU-4.

[0079] Comparative Example 2:

[0080] 37.24 g (0.2 mol) of 4,4'-biphenol, 57.43 g (0.2 mol) of 4,4'-dichlorodiphenyl sulfone, 33.17 g (0.24 mol) of potassium carbonate, and 240 g of DMAC were successively added to a 500 mL three-necked flask continuously filled with nitrogen. The mixed solution was heated to boiling under a nitrogen atmosphere to discharge DMAC and the water generated by the reaction in the form of an azeotrope until the water content in the system was lower than 1000 ppm, and then the water separation was stopped. The reaction was continued at 165 - 170 °C for 2 h. After the solution viscosity increased, it was poured into deionized water for precipitation. The precipitated polymer was crushed, washed, and dried to obtain polyphenylsulfone powder, denoted as PPSU-5.

[0081] The composition and performance test results of the bisphenol A polysulfone resin or polyphenylsulfone resin prepared in the above examples are shown in the following table:

[0082]

[0083] It can be seen from the data in the table that by controlling the vacuum degree of the system in the early stage of polymerization, reducing the reaction temperature in the early stage, realizing water removal at low temperature, and inhibiting the hydrolysis of p-dihalodiphenyl sulfone compounds and aprotic polar solvents, the content of by-products with the structure of formula (V) in the polymer can be reduced to less than 300 ppm, thereby improving the light transmittance of polysulfone resins and reducing their yellowness index.

[0084] In the following examples, the polysulfone resin powder was further purified by a mixed solvent of DMAC and deionized water to further explain the second method for controlling the content of by-products with the structure of formula (V) in the present invention.

[0085] Example 9:

[0086] 20 g of the bisphenol A polysulfone resin powder obtained in Comparative Example 1 was added to a three-necked flask, and then 100 g of a mixed solution of DMAC and deionized water (the mass fraction of DMAC was 50%) was added. Then it was washed at 80 °C for two hours and filtered, and then washed 4 times with deionized water and dried. The purified bisphenol A polysulfone resin obtained was named PSU-5-1.

[0087] Example 10:

[0088] Except for changing the mass fraction of DMAC in the washing solution to 60%, the rest of the preparation process refers to Example 9, and the purified bisphenol A polysulfone resin obtained is named PSU-5-2.

[0089] Example 11:

[0090] Except for changing the mass fraction of DMAC in the washing solution to 70%, the rest of the preparation process refers to Example 9, and the purified bisphenol A polysulfone resin obtained is named PSU-5-3.

[0091] Example 12:

[0092] Except for changing DMAC in the washing solution to tetrahydrofuran, the rest of the preparation process refers to Example 9, and the purified bisphenol A polysulfone resin obtained is named PSU-5-4.

[0093] Example 13:

[0094] Except for changing the washing temperature during washing to 100 °C, the rest of the preparation process refers to Example 9, and the purified bisphenol A polysulfone resin obtained is named PSU-5-5.

[0095] Example 14:

[0096] Except for changing the washing temperature during washing to 120 °C, the rest of the preparation process refers to Example 9, and the purified bisphenol A polysulfone resin obtained is named PSU-5-6.

[0097] Example 15:

[0098] Add 20 g of the polyphenylsulfone resin powder obtained in Comparative Example 2 to a three-necked flask, then add 100 g of a mixed solution of DMAC and deionized water (the mass fraction of DMAC is 50%), then wash at 80 °C for two hours and then filter, and then wash 4 times with deionized water and dry. The purified polyphenylsulfone resin obtained is named PPSU-5-1.

[0099] Example 16:

[0100] Except for changing DMAC in the washing solution to DMF, the rest of the preparation process refers to Example 15, and the purified polyphenylsulfone resin obtained is named PPSU-5-2.

[0101] Example 17:

[0102] Except for changing the washing temperature during washing to 100 °C, the rest of the preparation process refers to Example 9, and the purified polyphenylsulfone resin obtained is named PPSU-5-3.

[0103] Example 18:

[0104] Except that the washing temperature during the washing process was changed to 120 °C, the remaining preparation process was referred to Example 9, and the purified polyphenylsulfone resin obtained was named PPSU-5-4.

[0105] Examples 19 - 20, Comparative Example 3

[0106] 20 g of the polysulfone resin powder prepared in Example 3 was added, and then 100 g of a mixed solution of DMAC and deionized water (the mass fraction of DMAC was 70%) was added. Then, it was washed at 100 °C for two hours and filtered, and then washed 4 times with deionized water and dried. The purified bisphenol A polysulfone resin obtained was named PSU-6. PSU-6 was washed once according to the above method, and the polysulfone resin obtained was named PSU-6-1. And so on, continuing to increase the washing times, the polysulfone resin obtained was named PSU-6-2.

[0107] The composition and performance test results of the bisphenol A polysulfone resin or polyphenylsulfone resin prepared in the above examples are shown in the following table:

[0108] Example Number Polysulfone Resin Name Content of By-Product with Structure of Formula (V) / ppm Light Transmittance / % Yellowness Index Example 9 PSU-5-1 256 86.3 7.2 Example 10 PSU-5-2 135 88.7 6.0 Example 11 PSU-5-3 64 89.8 5.1 Example 12 PSU-5-4 266 86.6 7.2 Example 13 PSU-5-5 188 87.6 6.3 Example 14 PSU-5-6 175 87.7 6.5 Example 15 PPSU-5-1 271 86.5 10.5 Example 16 PPSU-5-2 248 86.1 10.1 Example 17 PPSU-5-3 189 88.7 9.7 Example 18 PPSU-5-4 162 88.5 9.4 Example 19 PSU-6 25 89.8 5.2 Example 20 PSU-6-1 9 89.6 5.0 Comparative Example 3 PSU-6-2 0 89.9 5.1

[0109] It can be seen from the data in the table that by washing and purifying with a mixed solution of an organic solvent and deionized water, the content of the by-product of the structure of formula (V) in the polymer can also be effectively reduced, which is conducive to improving the light transmittance of the polysulfone resin and reducing its yellowness index. When the content of the by-product in the polymer is reduced to 0 ppm, the performance is not significantly improved, and the cost of the post-treatment process increases. While controlling the content above 1 ppm can reduce the post-treatment cost while ensuring that the performance of the polymer does not decrease. Therefore, the present invention preferably controls the content of the by-product of the structure of formula (V) in the polymer to be 1 - 300 ppm.

[0110] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A polysulfone composition, characterized in that, Comprising a compound having a structure shown in formula (V) with a mass content of 1 - 300 ppm, R1, R2, R3, and R4 are each independently selected from H, halogen, an alkyl group having 1 to C 10 carbon atoms, a cycloalkyl group having 5 to 6 carbon atoms, or an aryl group having 6 to C 10 carbon atoms; Preferably, R1, R2, R3, and R4 are all H; Preferably, in the composition, the mass content of the compound having the structure shown in formula (V) is 1 - 150 ppm.

2. The composition according to claim 1, wherein The mass content of polysulfone in the composition is greater than 95%; Preferably, the polysulfone is a polysulfone prepared by a nucleophilic substitution reaction of a para - dihalodiphenyl sulfone compound having a structure shown in formula (II) and a bisphenol A - type compound having a structure shown in formula (III) or a 4,4'-biphenol - type compound having a structure shown in formula (IV); Among them, R1, R2, R3, R4, R5, R6, R7, R8, R9, R 10 , R 11 , R 12 are each independently selected from any one of H, halogen, an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 5 to 6 carbon atoms, or an aryl group having 6 to 10 carbon atoms; X1 and X2 are each independently selected from halogen.

3. The composition according to claim 2, characterized in that, The para - dihalodiphenyl sulfone compound of the general formula (II) is: The bisphenol A type compound of the structure of formula (III) is: The structural formula of the 4,4'-biphenol - type compound having a structure shown in formula (IV) is:

4. The composition according to any one of claims 1 to 3, characterized in that, The weight - average molecular weight of the polysulfone is 50,000 - 200,000, preferably 80,000 - 170,000, more preferably 100,000 - 150,000.

5. The preparation method of the polysulfone composition according to any one of claims 1-4, characterized in that, Comprising the following steps: Using a para - dihalodiphenyl sulfone compound having a structure shown in formula (II) and a bisphenol A - type compound having a structure shown in formula (III) or a 4,4'-biphenol - type compound having a structure shown in formula (IV) as raw materials, and carrying out a polymerization reaction to prepare a polysulfone resin.

6. The preparation method according to claim 5, characterized in that, The reaction is carried out under negative pressure conditions. Preferably, the vacuum degree is - 10 to - 60 kPa, preferably - 20 to - 50 kPa, more preferably - 30 to - 40 kPa; Preferably, the molar ratio of 4,4'-dichlorodiphenyl sulfone to the bisphenol A - type compound or 4,4'-biphenol is 1:(0.95 - 1.05), preferably 1:(0.97 - 1.03), more preferably 1:(0.98 - 1.02); Preferably, the reaction is carried out under alkaline conditions, and the alkaline conditions are achieved by adding an alkali, and the alkali is one or more of potassium carbonate, sodium carbonate, sodium hydroxide, and potassium hydroxide; Preferably, the reaction is carried out in an organic solvent; the organic solvent is one or more of dimethyl sulfoxide, N - methylpyrrolidone, N,N - dimethylformamide, N,N - dimethylacetamide, and sulfolane; Preferably, the polymerization temperature is 160 - 250 °C, preferably 165 - 210 °C; Preferably, the polysulfone generated by the reaction is washed with deionized water.

7. The preparation method according to claim 5, characterized in that, The polysulfone prepared by the reaction is washed with a mixed solution of an organic solvent and deionized water; Preferably, the organic solvent in the washing solution is one or more of tetrahydrofuran, acetone, dimethyl sulfoxide, N - methylpyrrolidone, N,N - dimethylformamide, and N,N - dimethylacetamide; Preferably, the mass fraction of the organic solvent in the washing solution is 30% - 80%, preferably 40% - 75%, more preferably 50% - 70%; Preferably, the washing temperature is 60 °C - 140 °C, preferably 80 °C - 120 °C, more preferably 100 °C - 110 °C.

8. Use of the polysulfone composition according to any one of claims 1 - 4 or the polysulfone composition prepared by the preparation method according to any one of claims 5 - 7 in the fields of baby bottles, squirrel cages, flow meters, and medical disinfection equipment.

Citation Information

Patent Citations

  • Preparation method of polysulfone with low amino content

    CN115058007A