Aluminum profile electroplating control method, equipment and system

Abstract

The invention relates to the technical field of electroplating control, in particular to an aluminum profile electroplating control method, device and system. The method comprises the steps that a hyperspectral image of electroplating liquid in the aluminum profile electroplating process is obtained; acquiring the distribution balance degree of electroplating ions of each pixel in the hyperspectral image; dividing the hyperspectral image into to-be-analyzed areas, obtaining balance loss degrees of electroplating ions in the to-be-analyzed areas, obtaining convection retardation influence degrees of the electroplating ions in the electroplating pool based on the balance loss degrees, and obtaining an expected stirring speed of a stirrer in the electroplating pool at the current acquisition moment by combining an actual stirring speed of the stirrer in the electroplating pool; according to the expected stirring speed and the actual stirring speed of the stirrer, the stirring speed of the stirrer in the electroplating pool is regulated and controlled through a PID controller. The electroplating quality of the metal layer on the surface of the aluminum profile is improved.

Description

Technical Field

[0001] This application relates to the technical field of electroplating control, and specifically relates to a method, device, and system for electroplating control of aluminum profiles. Background Art

[0002] During the actual application of aluminum profiles, the surface is prone to corrosion and wear, which seriously affects the appearance and service life of aluminum profiles. Therefore, existing methods generally use electroplating technology to electroplate a protective metal layer on the surface of aluminum profiles, improving the corrosion resistance and service life of aluminum profiles, and at the same time enhancing the aesthetic degree of aluminum profiles. However, during the electroplating process of aluminum profiles, the distribution of electroplating ions greatly affects the uniformity of the metal layer on the surface of aluminum profiles, easily causing defects such as roughness on the metal layer surface of aluminum profiles, which will affect the wear resistance of the metal layer on the surface of aluminum profiles. Therefore, it is often necessary to control the electroplating process to improve the uniformity of the metal layer on the surface of aluminum profiles.

[0003] Chinese invention patent CN202210487980.7 proposes a method for detecting the concentration of electroplating solution based on spectral analysis and scattering correction. By collecting the hyperspectral images of the electroplating solution, the component concentration of the electroplating solution can be quickly detected online. However, this patent does not give how to analyze the convective mixing phenomenon of electroplating ions in the electroplating solution based on the hyperspectral images of the electroplating solution, nor does it give how to accurately control and adjust the stirring rate of the electroplating solution according to the online detection results of the concentration.

[0004] In the current electroplating control of aluminum profiles, existing technologies often only consider the uniformity characteristics of electroplating ions in the electroplating solution to control and adjust the stirring rate of the stirrer. However, due to the resistance of the convective mixing of electroplating ions in the electroplating solution, there will be certain changes, and the influence of this resistance on the stirring rate adjustment cannot be fully considered, making it impossible to accurately improve the uniformity of electroplating ions in the electroplating bath, which easily affects the wear resistance of the metal layer on the surface of aluminum profiles. Summary of the Invention

[0005] In order to solve the above technical problems, the purpose of this application is to provide a method, device, and system for electroplating control of aluminum profiles. The specific technical solutions adopted are as follows: In the first aspect, an embodiment of this application provides a method for electroplating control of aluminum profiles, including the following steps: Obtain the hyperspectral images of the electroplating solution at each acquisition moment during the electroplating process of the aluminum profile; Based on the average level of the similarity degree of the spectral reflectance between each pixel in the hyperspectral image and other pixels in the neighborhood, and the difference situation of the spectral reflectance similarity degree between each pixel and other pixels in the neighborhood, obtain the distribution balance degree of electroplating ions at each pixel position; Divide the hyperspectral image into regions to be analyzed. Based on the distribution balance degree of electroplating ions at each pixel position within the regions to be analyzed, divide the distribution balance degree into a low balance set and a high balance set. Based on the degree of difference in the distribution balance degree within the two sets and the proportion of the number of distribution balance degrees within the low balance set, obtain the balance loss degree of electroplating ions within each region to be analyzed. Based on the average level and the change of the balance loss degree of electroplating ions within all regions to be analyzed in the hyperspectral images at each acquisition moment, obtain the convective blockage influence degree of electroplating ions in the electroplating bath at each acquisition moment. According to the deviation of the convective blockage influence degree of electroplating ions at the current acquisition moment from that at the previous acquisition moment, combined with the actual stirring speed of the stirrer in the electroplating bath at the previous acquisition moment, obtain the desired stirring speed of the stirrer in the electroplating bath at the current acquisition moment. According to the desired stirring speed and the actual stirring speed of the stirrer, use a PID controller to regulate the stirring speed of the stirrer in the electroplating bath.

[0006] Preferably, the calculation method for the distribution balance degree of electroplating ions at each pixel position is as follows: ; In the formula, is the distribution balance degree of electroplating ions at the i-th pixel position, is the exponential normalization function, is the number of pixels within the neighborhood sliding window of the i-th pixel. The neighborhood window with a preset size centered on the i-th pixel is denoted as the neighborhood sliding window of the i-th pixel, is the average value of the cosine similarity between the reflectivity vector of the i-th pixel and the reflectivity vectors of each pixel within its neighborhood sliding window, and are the cosine similarities between the reflectivity vector of the i-th pixel and the reflectivity vectors of the j-th and (j - 1)-th pixels within its neighborhood sliding window respectively, is a constant to avoid the denominator being zero.

[0007] Preferably, the acquisition of the reflectivity vector further includes: arranging all spectral reflectivities of each pixel in the hyperspectral image in ascending order of wavelength to form the reflectivity vector of each pixel in the hyperspectral image.

[0008] Preferably, the method for obtaining the low balance set and the high balance set is as follows: For each region to be analyzed, perform threshold segmentation on the corresponding distribution balance degrees of all pixels within the region to be analyzed. The set composed of the distribution balance degrees less than the segmentation threshold within the region to be analyzed is used as the low balance set of the region to be analyzed, otherwise, it is used as the high balance set of the region to be analyzed.

[0009] Preferably, the calculation method for the balance loss degree of electroplating ions in each area to be analyzed is as follows: ; In the formula, is the balance loss degree of electroplating ions in the s-th area to be analyzed, is the number of elements in the low balance set of the s-th area to be analyzed, is the total number of elements in the low balance set and the high balance set of the s-th area to be analyzed, and are the average values of the elements in the low balance set and the high balance set of the s-th area to be analyzed, respectively.

[0010] Preferably, the calculation method for the convective blockage influence degree of electroplating ions in the electroplating bath at each acquisition moment is as follows: ; In the formula, is the convective blockage influence degree of electroplating ions in the electroplating bath at the t-th acquisition moment, is the average value of the balance loss degrees corresponding to all areas to be analyzed in the hyperspectral image at the t-th acquisition moment, is the average value of the elements in the first-order difference vector of the balance loss vector of the hyperspectral image at the t-th acquisition moment, is the exponential normalization function.

[0011] Preferably, the acquisition of the balance loss vector of the hyperspectral image at each acquisition moment further includes: arranging the balance loss degrees corresponding to all areas to be analyzed in the hyperspectral image at each acquisition moment in ascending order to form the balance loss vector of the hyperspectral image at each acquisition moment.

[0012] Preferably, the calculation method for the expected stirring speed of the stirrer in the electroplating bath at the current acquisition moment is as follows: ; In the formula, is the expected stirring speed of the stirrer in the electroplating bath at the current acquisition moment, is the actual stirring speed of the stirrer in the electroplating bath at the previous acquisition moment before the current acquisition moment, is the convective blockage influence degree corresponding to the current acquisition moment, is the convective blockage influence degree corresponding to the previous acquisition moment before the current acquisition moment.

[0013] In a second aspect, an aluminum profile electroplating control device provided by an embodiment of the present application includes a memory, a processor, and a computer program stored in the memory and running on the processor. When the processor executes the computer program, the steps of any one of the above-mentioned aluminum profile electroplating control methods are implemented.

[0014] In a third aspect, an aluminum profile electroplating control system is further provided in an embodiment of the present application. A computer program is stored in the device, and when the computer program is executed by a processor, the aluminum profile electroplating control method described in any one of the above is implemented.

[0015] As can be seen from the above, an aluminum profile electroplating control method, device and system provided by the present application have at least the following beneficial effects: The present application measures the distribution balance of electroplating ions in a local area through the hyperspectral image of the electroplating solution, so as to accurately reflect the balance state of the distribution of electroplating ions in different local areas in the electroplating bath, which is beneficial to accurately controlling and adjusting the stirring rate of the stirrer subsequently, thereby effectively improving the electroplating uniformity of the aluminum profile; The present application evenly divides a plurality of regions to be analyzed through the hyperspectral image of the electroplating solution, and accurately measures the loss characteristics of the distribution balance of electroplating ions in the regions to be analyzed through the change of the distribution balance of electroplating ions in the regions to be analyzed, which is used to more accurately analyze the resistance effect of electroplating ion convection mixing subsequently, and then improve the accuracy of controlling and adjusting the stirring speed of the stirrer through the resistance effect of electroplating ion convection mixing; The present application accurately measures the influence of the resistance effect on the electroplating ion convection mixing in the electroplating bath through the loss characteristics of the distribution balance of electroplating ions in different regions to be analyzed, and accurately controls and adjusts the stirring speed of the stirrer in the electroplating bath according to the change of the influence of the resistance effect on the electroplating ion convection mixing, improves the uniformity of electroplating ion diffusion in the electroplating bath, and avoids the phenomenon of accelerating the oxidation of electroplating ions due to too fast stirring rate, thereby improving the electroplating uniformity and wear resistance of the metal layer on the surface of the aluminum profile. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions and advantages in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0017] Figure 1 It is a flowchart of the steps of an aluminum profile electroplating control method provided by the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] To further elaborate on the technical means and effects adopted by this application to achieve the intended invention purpose, the following will, in conjunction with the accompanying drawings and preferred embodiments, elaborate in detail on a method, equipment, and system for controlling aluminum profile electroplating proposed according to this application, including its specific implementation manner, structure, features, and effects. In the following description, different "one embodiment" or "another embodiment" do not necessarily refer to the same embodiment. In addition, the specific features, structures, or characteristics in one or more embodiments can be combined in any suitable form.

[0019] Unless otherwise specified and limited, terms such as "including", "comprising", or any other variant thereof are intended to cover non-exclusive inclusion, such that a circuit structure, article, or device including a series of elements not only includes those elements but also includes other elements not explicitly listed, or further includes elements inherent to such article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the article or device including the said element. Additionally, the term "and / or" used herein includes any and all combinations of one or more of the related listed items. All technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs.

[0020] The following will specifically describe the specific solutions of a method, equipment, and system for controlling aluminum profile electroplating provided by this application in conjunction with the accompanying drawings.

[0021] Please refer to Figure 1 , which shows a flowchart of the steps of a method for controlling aluminum profile electroplating provided by an embodiment of this application, including the following steps: Step 1: Obtain the hyperspectral images of the electroplating solution at each acquisition moment during the electroplating process of the aluminum profile.

[0022] The purpose of this embodiment is to accurately control and adjust the stirring rate of the stirrer by fully considering the resistance effect of electroplating ion convection mixing, avoiding the influence of too low a stirring rate on the uniformity of electroplating ions in the electroplating bath, and at the same time preventing the oxidation of electroplating ions from being accelerated due to too high a stirring rate, thereby improving the electroplating uniformity and wear resistance of the metal layer on the surface of the aluminum profile.

[0023] Therefore, before electroplating the aluminum profile, it is first necessary to clean the surface of the aluminum profile to remove the impurity components on the surface of the aluminum profile, so as to reduce the generation of impurities during the electroplating of the aluminum profile. Then, place the aluminum profile with a cleaned surface in the electroplating bath, and turn on the electroplating equipment and the stirring equipment to electroplate the aluminum profile.

[0024] During the electroplating process of aluminum profiles, a hyperspectral camera is used to collect hyperspectral images of the electroplating solution in real time at an image acquisition interval of 10 s, and hyperspectral images at each acquisition moment during the electroplating process of aluminum profiles are obtained.

[0025] Step 2: Based on the average level of the similarity degree of spectral reflectance between each pixel in the hyperspectral image and other pixels in its neighborhood, and the difference situation of the similarity degree of spectral reflectance between each pixel and other pixels in its neighborhood, the distribution balance degree of electroplating ions at each pixel position is obtained.

[0026] During the electroplating process of aluminum profiles, the electroplating ions in the electroplating bath will be in a state of continuous consumption. If the stirring rate in the stirrer is not appropriate at this time, the electroplating ions in the electroplating bath will show a complex distribution state, affecting the uniformity of the distribution of electroplating ions. Therefore, it is necessary to more accurately control and adjust the stirring rate of the stirrer, so as to effectively improve the uniformity of the distribution of electroplating ions.

[0027] Furthermore, the vector composed of all spectral reflectances in each pixel of the hyperspectral image in ascending order of wavelength is denoted as the reflectance vector of each pixel in the hyperspectral image.

[0028] At the same time, in order to accurately analyze the distribution state of electroplating ions in the local area of different pixels in the hyperspectral image, so that the stirring rate of the stirrer can be more accurately controlled and adjusted subsequently, with each pixel in the hyperspectral image as the center, preferably, a 9×9 neighborhood window is set in this embodiment, denoted as the neighborhood sliding window of each pixel. The change of the reflectance characteristics of the pixels in the neighborhood sliding window can reflect the distribution state of electroplating ions in the local area of the electroplating bath, and the implementer can adaptively adjust the size of the window according to the actual situation.

[0029] Therefore, calculate the similarity degree between the reflectance vector of the i-th pixel in the hyperspectral image and the reflectance vector of the j-th pixel in its neighborhood sliding window. The measurement method of the similarity degree can be the Jaccard similarity coefficient or the cosine similarity. In this embodiment, the cosine similarity is used to measure the similarity degree. The greater the similarity degree, the more similar the reflectance vectors are. If the change of the similarity degree between the i-th pixel in the hyperspectral image and all pixels in its neighborhood sliding window is smaller, and the average level of the similarity degree is higher, it indicates that the balance state of the distribution of electroplating ions in the local area of this pixel is better. At this time, the difficulty of controlling and adjusting the stirring rate on the stirrer is lower, which is more conducive to maintaining the uniformity of the distribution of electroplating ions and improving the electroplating effect of aluminum profiles.

[0030] Through the above analysis, calculate the distribution balance degree of electroplating ions at each pixel position in the hyperspectral image: ; In the formula, is the distribution balance degree of electroplating ions at the i-th pixel position, is the exponential normalization function, is the number of pixels within the neighborhood sliding window of the i-th pixel, is the average of the cosine similarities between the reflectivity vector of the i-th pixel and the reflectivity vectors of each pixel within its neighborhood sliding window, and are the cosine similarities between the reflectivity vector of the i-th pixel and the reflectivity vectors of the j-th and (j - 1)-th pixels within its neighborhood sliding window respectively, is a constant to avoid a zero denominator, and its value is within the range of (0.001, 0.005), and its influence on the calculation result can be ignored. In this embodiment, the value is 0.002.

[0031] The distribution balance degree reflects the balance state of the distribution of electroplating ions in the local area of the electroplating bath during the electroplating process of aluminum profiles. If the balance state of the distribution of electroplating ions in the local area of the electroplating bath is better, it indicates that the control and adjustment difficulty of the stirring rate on the stirrer is lower at this time, which is beneficial to accurately controlling and adjusting the stirring rate of the stirrer subsequently, thereby effectively improving the electroplating uniformity of aluminum profiles.

[0032] Step 3: Divide the hyperspectral image into each region to be analyzed. According to the distribution balance degree of electroplating ions at each pixel position within the region to be analyzed, divide the distribution balance degree into a low balance set and a high balance set, and based on the difference degree of the distribution balance degrees within the two sets and the proportion of the number of distribution balance degrees within the low balance set, obtain the balance loss degree of electroplating ions within each region to be analyzed.

[0033] During the electroplating process of aluminum profiles, if when extending from a local area of the hyperspectral image to a larger area, the distribution balance degree has been in a relatively high state and has a stable change, it indicates that the electroplating ions in a large range of the electroplating bath can maintain a better distribution state at this time, and the stirring rate of the stirrer in the electroplating bath is more appropriate and the control and adjustment difficulty of the stirring rate is lower. However, if when extending from a local area of the hyperspectral image to a larger area, the distribution balance degree of electroplating ions changes greatly, it indicates that the distribution balance of electroplating ions in the electroplating bath is lost, and it is more necessary to accurately control and adjust the stirring rate in a timely manner to ensure the uniformity of electroplating ions during the electroplating process.

[0034] Furthermore, in this embodiment, preferably divide the hyperspectral image evenly into M regions to be analyzed. The distribution balance degrees corresponding to all pixels within the region to be analyzed can reflect the distribution balance change of electroplating ions between different positions within the region to be analyzed. In this embodiment, the value of M is 20, and the implementer can adaptively take values according to the actual situation.

[0035] In order to reflect the loss characteristics of the distribution balance of electroplating ions in a larger area to be analyzed in the hyperspectral image, for each area to be analyzed, in this embodiment, the distribution balance degrees corresponding to all pixels in the area to be analyzed are input into the Otsu threshold algorithm, and the segmentation threshold of the area to be analyzed is obtained by using the Otsu threshold algorithm. The Otsu threshold algorithm is a well-known technology and will not be elaborated further.

[0036] Furthermore, for each area to be analyzed, the set composed of the distribution balance degrees less than the segmentation threshold in the area to be analyzed is denoted as the low balance set of the area to be analyzed, and the set composed of the distribution balance degrees greater than or equal to the segmentation threshold in the area to be analyzed is denoted as the high balance set corresponding to the area to be analyzed. The low balance set and the high balance set of the area to be analyzed respectively represent two distributions of the distribution balance degrees corresponding to all pixels in the area to be analyzed. If the proportion of the elements in the low balance set in the entire data set in the area to be analyzed is larger, it indicates that the distribution balance degree in the area to be analyzed is in a lower state. At the same time, if the difference between the elements in the low balance set and the high balance set is larger, it indicates that the abnormal change of the distribution balance degree in the area to be analyzed is more obvious. The two comprehensively reflect the loss characteristics of the distribution balance of electroplating ions in the area to be analyzed. At this time, the stirring rate on the stirrer is not suitable for the current electroplating process of the aluminum profile, and it is necessary to accurately control and adjust the stirring rate to improve the electroplating effect of the aluminum profile.

[0037] Through the above analysis, calculate the balance loss degree of electroplating ions in each area to be analyzed in the hyperspectral image: ; In the formula, is the balance loss degree of electroplating ions in the s-th area to be analyzed, is the number of elements in the low balance set of the s-th area to be analyzed, is the total number of elements in the low balance set and the high balance set of the s-th area to be analyzed, and are the element means in the low balance set and the high balance set of the s-th area to be analyzed respectively.

[0038] The balance loss degree reflects the loss characteristics of the distribution balance of electroplating ions when extending from a local area of the hyperspectral image to a larger area. If the loss characteristics of the distribution balance of electroplating ions are larger, it indicates that the stirring rate on the stirrer at the current moment is more unsuitable for the current electroplating process of the aluminum profile, and it is more necessary to timely and accurately control and adjust the stirring rate to ensure the uniformity of electroplating ions during the electroplating process.

[0039] Step 4: According to the average level and the change of the balance loss degree of the electroplating ions in all regions to be analyzed in the hyperspectral images at each acquisition moment, obtain the convective blockage influence degree of the electroplating ions in the electroplating bath at each acquisition moment. According to the deviation of the convective blockage influence degree of the electroplating ions between the current acquisition moment and the previous acquisition moment, and combining with the actual stirring speed of the stirrer in the electroplating bath at the previous acquisition moment, obtain the desired stirring speed of the stirrer in the electroplating bath at the current acquisition moment.

[0040] If the difference between the balance loss characteristics in different regions to be analyzed in the hyperspectral image at this time is greater, and the average level of the balance loss characteristics in different regions to be analyzed in the hyperspectral image at this time is higher, it can better illustrate that the resistance to the convection of the electroplating ions in the electroplating bath is greater at this time. At this time, the stirring rate should be controlled and adjusted in a timely manner to improve the convection effect of the electroplating ions in the electroplating bath and ensure the uniformity of the distribution of the electroplating ions.

[0041] Furthermore, during the electroplating process of aluminum profiles, the vector composed of the balance loss degrees corresponding to all regions to be analyzed in the hyperspectral images at each acquisition moment in ascending order is denoted as the balance loss vector of the hyperspectral images at each acquisition moment. The balance loss vector reflects the loss change of the distribution balance of the electroplating ions in the electroplating bath at each acquisition moment.

[0042] Through the above analysis, calculate the convective blockage influence degree of the electroplating ions in the electroplating bath at each acquisition moment: ; In the formula, is the convective blockage influence degree of the electroplating ions in the electroplating bath at the t-th acquisition moment, is the mean value of the balance loss degrees corresponding to all regions to be analyzed in the hyperspectral image at the t-th acquisition moment, is the mean value of the elements in the first-order difference vector of the balance loss vector of the hyperspectral image at the t-th acquisition moment, is the exponential normalization function. The specific normalization calculation process of the exponential normalization is a well-known technology and will not be elaborated in this embodiment.

[0043] The influence degree of convection blockage reflects the degree of influence of the resistance on the convective mixing of electroplating ions in the electroplating bath during the electroplating process. If the influence of the resistance on the convective mixing of electroplating ions continues to deepen, it indicates that the effect of convective mixing of electroplating ions in the electroplating bath is poor at this time. At this time, the stirring speed of the stirrer should be increased to improve the effect of convective mixing of electroplating ions; on the contrary, if the influence of the resistance on the convective mixing of electroplating ions continues to weaken, it means that the effect of convective mixing of electroplating ions in the electroplating bath is relatively good at this time. In order to prevent the oxidation of electroplating ions from accelerating due to too fast stirring rate, the stirring speed of the stirrer should be reduced at this time to improve the electroplating uniformity and wear resistance of the metal layer on the surface of the aluminum profile.

[0044] Therefore, the stirring speed of the stirrer in the electroplating bath is collected in real time by the rotational speed sensor, and the expected stirring speed of the stirrer in the electroplating bath at the current acquisition moment is calculated based on the change of the influence degree of convection blockage during the electroplating process: ; In the formula, is the expected stirring speed of the stirrer in the electroplating bath at the current acquisition moment, is the actual stirring speed of the stirrer in the electroplating bath at the previous acquisition moment before the current acquisition moment, is the influence degree of convection blockage corresponding to the current acquisition moment, is the influence degree of convection blockage corresponding to the previous acquisition moment before the current acquisition moment.

[0045] If the influence of the resistance on the convective mixing of electroplating ions in the electroplating bath at the current acquisition moment is deeper than that at the previous acquisition moment, at this time, according to the degree of deepening of the influence of the resistance on the convective mixing, the stirring speed of the stirrer is adjusted upward to improve the effect of convective mixing of electroplating ions; on the contrary, at this time, according to the degree of weakening of the influence of the resistance on the convective mixing, the stirring speed of the stirrer is adjusted downward to improve the electroplating uniformity and wear resistance of the metal layer on the surface of the aluminum profile.

[0046] Step 5: According to the expected stirring speed and the actual stirring speed of the stirrer, use the PID controller to control the stirring speed of the stirrer in the electroplating bath.

[0047] Furthermore, in order to accurately control and adjust the stirring speed of the stirrer in the electroplating bath, the expected stirring speed and the actual stirring speed of the stirrer in the electroplating bath at the current acquisition moment are input into the PID controller. The PID controller calculates the error between the expected stirring speed and the actual stirring speed, and the PID controller outputs a control signal according to the magnitude of the error. The control signal is transmitted to the stirrer to control the actual stirring speed in the stirrer to approach the expected stirring speed, improve the convective mixing effect of electroplating ions in the electroplating bath, and avoid having an adverse impact on the electroplating uniformity and wear resistance of the metal layer on the surface of the aluminum profile.

[0048] Based on the same inventive concept as the above method, an embodiment of the present application further provides an aluminum profile electroplating control device, including a memory, a processor, and a computer program stored in the memory and running on the processor. When the processor executes the computer program, the steps of any one of the above methods for controlling aluminum profile electroplating are implemented.

[0049] Meanwhile, an embodiment of the present application further provides an aluminum profile electroplating control system. A computer program is stored in the device, and when the computer program is executed by a processor, any one of the above methods for controlling aluminum profile electroplating is implemented.

[0050] It can be understood that the above sequence of embodiments of the present application is only for description and does not represent the superiority or inferiority of the embodiments. And the above specific embodiments of this specification have been described. Additionally, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0051] Each embodiment in this specification is described in a progressive manner. For the same or similar parts among the embodiments, reference can be made to each other. The key point of each embodiment is to illustrate the differences from other embodiments.

[0052] The above content is only the implementation manner of the present application and is not used to limit the scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied to other related technical fields, shall be equally included in the protection scope of the present application.

Claims

1. An aluminum profile electroplating control method, characterized in that, Including the following steps: Obtain the hyperspectral images of the plating solution at each acquisition moment during the aluminum profile electroplating process; Based on the average level of the similarity degree of the spectral reflectance between each pixel in the hyperspectral image and other pixels in the neighborhood, and the difference situation of the similarity degree of the spectral reflectance between each pixel and other pixels in the neighborhood, obtain the distribution balance degree of the plating ions at each pixel position; Divide the hyperspectral image into each region to be analyzed. According to the distribution balance degree of the plating ions at each pixel position in the region to be analyzed, divide the distribution balance degree into a low balance set and a high balance set. Based on the difference degree of the distribution balance degree in the two sets and the proportion of the number of the distribution balance degree in the low balance set, obtain the balance loss degree of the plating ions in each region to be analyzed; According to the average level and the change situation of the balance loss degree of the plating ions in all regions to be analyzed in the hyperspectral image at each acquisition moment, obtain the convective blockage influence degree of the plating ions in the electroplating bath at each acquisition moment. According to the deviation of the convective blockage influence degree of the plating ions between the current acquisition moment and the previous acquisition moment, and combining with the actual stirring speed of the stirrer in the electroplating bath at the previous acquisition moment, obtain the desired stirring speed of the stirrer in the electroplating bath at the current acquisition moment; According to the desired stirring speed and the actual stirring speed of the stirrer, use a PID controller to regulate the stirring speed of the stirrer in the electroplating bath.

2. The aluminum profile electroplating control method according to claim 1, characterized in that, The calculation method of the distribution balance degree of the plating ions at each pixel position is: ； In the formula, is the distribution balance degree of electroplating ions at the i-th pixel position, is the exponential normalization function, is the number of pixels within the neighborhood sliding window of the i-th pixel. The neighborhood window with a preset size centered on the i-th pixel is denoted as the neighborhood sliding window of the i-th pixel, is the average value of the cosine similarity between the reflectivity vector of the i-th pixel and the reflectivity vectors of each pixel within its neighborhood sliding window, and are the cosine similarities between the reflectivity vector of the i-th pixel and the reflectivity vectors of the j-th and (j - 1)-th pixels within its neighborhood sliding window, respectively, is a constant to avoid a zero denominator.

3. The aluminum profile electroplating control method according to claim 2, characterized in that, The further acquisition of the reflectance vector includes: arranging all the spectral reflectances of each pixel in the hyperspectral image in ascending order of wavelength to form the reflectance vector of each pixel in the hyperspectral image.

4. The aluminum profile electroplating control method according to claim 1, characterized in that, The acquisition method of the low balance set and the high balance set is: For each region to be analyzed, perform threshold segmentation on the corresponding distribution balance degrees of all pixels in the region to be analyzed. The set composed of the distribution balance degrees less than the segmentation threshold in the region to be analyzed is used as the low balance set of the region to be analyzed, otherwise, it is used as the high balance set of the region to be analyzed.

5. The aluminum profile electroplating control method according to claim 1, wherein, The calculation method of the balance loss degree of the plating ions in each region to be analyzed is: ； In the formula, is the balance loss degree of electroplating ions in the s-th area to be analyzed, is the number of elements in the low balance set of the s-th area to be analyzed, is the total number of elements in the low balance set and the high balance set of the s-th area to be analyzed, and are the element means in the low balance set and the high balance set of the s-th area to be analyzed, respectively.

6. The aluminum profile electroplating control method according to claim 1, characterized in that, The calculation method of the convective blockage influence degree of the plating ions in the electroplating bath at each acquisition moment is: ； In the formula, is the convective retardation influence degree of electroplating ions in the electroplating bath at the t-th acquisition moment, is the mean value of the balance loss degrees corresponding to all regions to be analyzed in the hyperspectral image at the t-th acquisition moment, is the element mean value in the first-order difference vector of the balance loss vector of the hyperspectral image at the t-th acquisition moment, is the exponential normalization function.

7. The aluminum profile electroplating control method according to claim 6, wherein The further acquisition of the balance loss vector of the hyperspectral image at each acquisition moment includes: arranging the balance loss degrees corresponding to all regions to be analyzed in the hyperspectral image at each acquisition moment in ascending order to form the balance loss vector of the hyperspectral image at each acquisition moment.

8. The aluminum profile electroplating control method according to claim 1, characterized in that, The calculation method of the desired stirring speed of the stirrer in the electroplating bath at the current acquisition moment is: ； Wherein, is the desired stirring speed of the stirrer in the electroplating bath at the current acquisition moment, is the actual stirring speed of the stirrer in the electroplating bath at the previous acquisition moment of the current acquisition moment, is the convective blockage influence degree corresponding to the current acquisition moment, is the convective blockage influence degree corresponding to the previous acquisition moment of the current acquisition moment.

9. An aluminum profile electroplating control device, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that, When the processor executes the computer program, it implements the steps of an aluminum profile electroplating control method as described in any one of claims 1-8.

10. An aluminum profile electroplating control system, in which a computer program is stored in the device, characterized in that, When the computer program is executed by the processor, it implements an aluminum profile electroplating control method as described in any one of claims 1-8.

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