A non-contact electrostatic sensor and a method for determining its installation location.

Abstract

This invention provides a non-contact electrostatic sensor and a method for determining its installation position. The sensor includes an electric field signal sensing component and a circuit board with a signal processing component embedded in it. The electric field signal sensing component includes a sensitive structure and a driving assembly. The sensitive structure includes at least a first sensing component and a second sensing component connected and arranged vertically. The first sensing component includes a first shielding leaf and a first sensing component, and the second sensing component includes a second shielding leaf and a second sensing component. Driven by a driving signal, the first and second shielding leaves rotate synchronously, generating a first current signal and a second current signal with a signal difference between them. The signal processing assembly calculates the installation distance value of the electrostatic sensor based on the first and second current signals to determine the installation position. This invention can accurately determine the installation position of the electrostatic sensor in the current electric field environment or relative to the measured object, avoiding measurement errors.

Description

Technical Field

[0001] This invention relates to an electrostatic sensor, and more particularly to a non-contact electrostatic sensor and a method for determining its installation location. Background Technology

[0002] Electrostatic sensors are devices for measuring electric field strength. They are widely used in many fields such as national defense, aerospace, meteorological detection, power, scientific research and industrial production, and play a very important role.

[0003] Currently, existing electrostatic sensors can measure the static voltage of the current electric field environment or the object being measured without contact. The main principle is to use a periodic vibration structure to modulate the sensing electrode to sense the charge on the current electric field environment or the object being measured, thereby generating an induced current proportional to the magnitude of the electric field to detect the electric field being measured. Then, by using the relationship between the measured electric field and the installation distance, the static voltage of the current electric field environment or the object being measured can be calculated.

[0004] Electrostatic sensors are manufactured with a calibration distance set according to their performance, and are typically installed according to this calibration distance. However, because the installation distance differs from the calibration distance, the measured electrostatic voltage value will be smaller when the installation distance is greater than the calibration distance, and larger when the installation distance is less than the calibration distance. This results in a significant measurement error for the electrostatic sensor, making it impossible to obtain the required electrostatic voltage value.

[0005] Therefore, how to provide an electrostatic sensor that avoids large errors during measurement and obtains the electrostatic voltage value at the desired location is an urgent problem to be solved. Summary of the Invention

[0006] To address the shortcomings mentioned above, this invention provides a non-contact electrostatic sensor and detection method that can accurately determine the installation position of the electrostatic sensor in the current electric field environment or relative to the object being measured, avoiding measurement errors, and obtaining the electrostatic voltage value at the desired position.

[0007] To achieve the above objectives, in a first aspect, the present invention provides a non-contact electrostatic sensor, comprising an electric field signal sensing part and a circuit board with a signal processing part connected together. The electric field signal sensing part includes a sensitive structure and a driving component. The sensitive structure includes at least a first sensing component and a second sensing component connected together and arranged vertically. The first sensing component includes a first shielding blade and a first sensing component that cooperate with each other. The second sensing component includes a second shielding blade and a second sensing component that cooperate with each other. Under the drive of a driving signal, the first shielding blade and the second shielding blade rotate synchronously along a first axis. The first sensing component and the second sensing component periodically sense the charge in the current electric field environment to generate a first current signal and a second current signal with a signal difference.

[0008] The signal processing section calculates the installation distance value of the electrostatic sensor based on the first current signal and the second current signal to determine the installation position.

[0009] In one embodiment, a first mounting hole is provided at the axial position of the first shielding blade;

[0010] The second shielding blade includes a sleeve, multiple second blades, a column, and an assembly part. The sleeve is a cylinder with an open bottom and a hollow interior. The multiple second blades are fixed at equal intervals around the first axis on the side wall of the sleeve. The assembly part and the column are fixed sequentially on the top end face of the sleeve.

[0011] In one embodiment, the first sensing component includes a first frame and a first sensing element, wherein:

[0012] The first frame includes a first hollow region;

[0013] The first sensing component includes a first plate, a first sensing electrode, a first through-hole region, and a second mounting hole formed on the first plate, wherein the first through-hole region surrounds the outside of the first sensing electrode and the second mounting hole in sequence.

[0014] The first frame is superimposed on the top end face of the first plate. The first sensing electrode, the first through hole area and the second mounting hole are located directly below the first hollow area. A part of the first shielding blade is placed inside the first hollow area and the other part is placed in the second mounting hole.

[0015] The second sensing component includes a second frame and a second sensing element, wherein:

[0016] The second frame includes a second hollow region;

[0017] The second sensing component includes a second plate, a third hollow region formed on the second plate, and a second sensing electrode. The second sensing electrode surrounds the outside of the third hollow region, and the diameter of the second sensing electrode is larger than the diameter of the first sensing electrode.

[0018] The second frame is superimposed on the top end face of the second plate. The second sensing component is located below the second hollow region. The second shielding blade, a part of the sleeve, and a part of the column are all located inside the second hollow region. Another part of the sleeve penetrates the third hollow region. Another part of the column is placed in the second mounting hole. The mounting part is placed in the first mounting hole. The second sensing electrode is located directly below the first through hole region. The driving component drives the first shielding blade and the second shielding blade to rotate synchronously along the first axis. The first sensing electrode and the second sensing electrode periodically sense the charge in the current electric field environment to generate a first current signal and a second current signal with signal difference.

[0019] In one embodiment, the first sensing electrode is fixed above the second sensing electrode, and the first axis passes through the axial position of the first sensing component and the axial position of the second sensing component in sequence.

[0020] There is a height difference between the first sensing electrode and the second sensing electrode, and the height difference is correlated with the signal difference.

[0021] In one embodiment, the sensitive structure further includes an upper cavity and a first PCB board fixed therein, wherein:

[0022] The upper cavity includes a hollow protrusion extending to the outside of the upper cavity, a portion of the drive assembly is sleeved on the outside of the protrusion, and the first PCB board surrounds the outside of the protrusion.

[0023] In one embodiment, the drive assembly includes a stator assembly and a rotary mechanism, wherein:

[0024] The stator assembly is sleeved on the outside of the protrusion and located inside the sleeve;

[0025] The rotating mechanism includes a rotating shaft and a first bearing and a second bearing respectively sleeved on the outside of the rotating shaft. The first end of the rotating shaft passes through the interior of the protrusion and is fixed inside the sleeve. The first bearing and the second bearing are arranged vertically, both located inside the protrusion.

[0026] After the stator assembly is connected to the first PCB board, it generates an electromagnetic effect under the control of the drive signal, which drives the rotating shaft to rotate and causes the first shielding blade and the second shielding component to rotate synchronously, so as to periodically block the first sensing component and the second sensing component respectively.

[0027] In one embodiment, the sensitive structure further includes a state blade and a phototube assembly, wherein:

[0028] The state blade is fixed to the second end of the rotating shaft and rotates synchronously with the first shielding blade and the second shielding component.

[0029] The phototube assembly includes a phototube and a second PCB board fixed to the bottom end face of the upper cavity. The detection end of the phototube faces the position of the state blade to obtain rotation speed signal and phase signal.

[0030] In one embodiment, the signal processing section includes a signal processing module and an MCU module, wherein:

[0031] The signal processing module converts the first current signal and the second current signal into a first electric field value and a second electric field value, respectively.

[0032] The MCU module determines the installation location by calculating the installation distance of the electrostatic sensor in the current electric field environment or relative to the object being measured based on the first current signal and the second current signal.

[0033] In one embodiment, the signal processing module includes a first IV conversion circuit, a second IV conversion circuit, a modulation circuit, and an ADC sampling circuit, wherein:

[0034] The first IV conversion circuit converts the first current signal into a first voltage signal;

[0035] The second IV conversion circuit converts the second current signal into a second voltage signal;

[0036] The modulation circuit modulates the first voltage signal and the phase signal, and the second voltage signal and the phase signal, to form a first electric field simulation value and a second electric field simulation value;

[0037] The ADC sampling circuit converts the first electric field simulation value and the second electric field simulation value into the first electric field value and the second electric field value, respectively.

[0038] In one embodiment, the MCU module includes a first computing unit and a second computing unit, wherein:

[0039] The first calculation unit is used to calculate the first induced charge value and the second induced charge value based on the first electric field value and the second electric field value, and to calculate the ratio coefficient of the induced charge value based on the first induced charge value and the second induced charge value.

[0040] The second calculation unit is used to calculate the installation distance value based on the ratio coefficient of the induced charge value and the height difference.

[0041] In one embodiment, the MCU module further includes a PID control unit and a speed analysis unit, wherein:

[0042] The PID control unit is used to input drive signals to the drive component;

[0043] The speed analysis unit is used to analyze the received speed signal and determine whether the speed signal is consistent with the drive signal.

[0044] Secondly, the present invention also provides a detection method applied to the above-mentioned non-contact electrostatic sensor, comprising the following steps:

[0045] In the current electric field environment, the first sensing component and the second sensing component, which are connected to each other and arranged vertically, generate a first current signal and a second current signal with a signal difference under the drive of the driving component.

[0046] The first current signal and the second current signal are respectively converted into a first electric field value and a second electric field value;

[0047] The signal processing section calculates the installation distance value of the electrostatic sensor based on the first current signal and the second current signal to determine the installation position.

[0048] In one embodiment, determining the installation location by deriving the installation distance value of the electrostatic sensor in the current electric field environment or relative to the object being measured based on the first current signal and the second current signal includes:

[0049] The first electric field value and the second electric field value are calculated respectively to obtain the first induced charge value and the second induced charge value;

[0050] Calculate the first induced charge value and the second induced charge value to obtain the proportionality coefficient of the induced charge value;

[0051] The installation distance of the electrostatic sensor is determined based on the proportionality coefficient of the induced charge value.

[0052] In one embodiment, it further includes:

[0053] Analyze the received rotation speed signal to determine whether the rotation speed signal is consistent with the drive signal.

[0054] Compared with the prior art, the present invention has one of the following advantages:

[0055] Since the first sensing electrode and the second sensing electrode are on different planes, the first current signal and the second current signal with signal difference can be sensed. The installation distance value can be obtained according to the proportional coefficient of the obtained induced charge value, thereby accurately determining the installation position of the electrostatic sensor in the current electric field environment or relative to the object being measured, avoiding measurement errors, and obtaining the electrostatic voltage value at the required position.

[0056] By using a PID control unit and a speed analysis unit, the modulation frequency of the electrostatic sensor can be stabilized in real time, thus maintaining the performance of the electrostatic sensor. Attached Figure Description

[0057] Figure 1 This is a perspective view of the non-contact electrostatic sensor in this embodiment;

[0058] Figure 2 This is a block diagram illustrating the principle of the non-contact electrostatic sensor in this embodiment;

[0059] Figure 3 for Figure 1 First cross-sectional view of the electric field signal sensing section;

[0060] Figure 4 for Figure 1 Exploded view of the electric field signal induction section;

[0061] Figure 5 for Figure 3 A three-dimensional view of the first sensing component;

[0062] Figure 6 for Figure 5 Exploded view;

[0063] Figure 7 for Figure 3 A three-dimensional view of the second sensing component;

[0064] Figure 8 for Figure 7 Exploded view;

[0065] Figure 9 This is a flowchart of the detection method in this invention;

[0066] Figure 10 This is a flowchart of the detection method in this embodiment.

[0067] The main reference numerals are as follows:

[0068] 1-Sensitive structure; 100-First frame; 1000-First hollow region; 101-First shielding blade; 1010-First blade; 1011-First mounting hole; 102-First sensing component; 1020-First plate; 1021-First sensing electrode; 1022-First through-hole region; 1023-Second mounting hole; 103-Second frame; 1030-Second hollow region; 104-Second shielding component; 1040-Second shielding blade; 10400-Second blade; 1041-Sleeve; 1042-Column; 1043-Assembly section; 105-Upper cavity; 1050-First PCB board; 1051-Protruding column; 106-Stator assembly; 1060-Stator; 1061-Rotating shaft; 1062-First bearing; 1063-Second bearing; 107-State blade; 108-Second PCB board; 109-Phototube; 110-Second sensing component; 1100-Second plate; 1101-Second sensing electrode; 1102-Third hollow region;

[0069] 2-Signal Processing Section. Detailed Implementation

[0070] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0071] In the description of this invention, it should be understood that the terms "upper," "lower," "top surface," "bottom surface," and "inner," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0072] This invention provides a non-contact electrostatic sensor, comprising an electric field signal sensing part and a circuit board with a signal processing part connected to each other. The electric field signal sensing part includes a sensitive structure and a driving component. The sensitive structure includes at least a first sensing component and a second sensing component connected to each other and arranged vertically. The first sensing component includes a first shielding leaf and a first sensing component that cooperate with each other. The second sensing component includes a second shielding leaf and a second sensing component that cooperate with each other. Under the drive of a driving signal, the first shielding leaf and the second shielding leaf rotate synchronously along a first axis. The first sensing component and the second sensing component periodically sense the charge in the current electric field environment to generate a first current signal and a second current signal with a signal difference.

[0073] The signal processing section calculates the installation distance value of the electrostatic sensor based on the first current signal and the second current signal to determine the installation position.

[0074] In this invention, since the first sensing electrode and the second sensing electrode are on different planes, a first current signal and a second current signal with a signal difference can be sensed. The installation distance value is obtained according to the proportional coefficient of the obtained induced charge value, thereby accurately determining the installation position of the electrostatic sensor in the current electric field environment or relative to the object being measured, avoiding measurement errors, and obtaining the electrostatic voltage value at the required position.

[0075] Example 1

[0076] like Figures 1 to 8 As shown, this embodiment provides a non-contact electrostatic sensor, which is a field-grinding electrostatic sensor, including an electric field signal sensing part and a signal processing part 2 connected together.

[0077] The electric field signal sensing part includes a housing, a sensitive structure 1 and a driving assembly enclosed inside the housing, wherein the housing has an opening corresponding to the sensing end of the sensitive structure 1.

[0078] Specifically, the sensitive structure 1 includes a first sensing component and a second sensing component that are connected to each other and arranged vertically.

[0079] The first sensing component is positioned above the second sensing component, and the first axis AA passes through the axis of the first sensing component and the axis of the second sensing component in sequence, so that there is a height difference (i.e., d0) between the first sensing component and the second sensing component.

[0080] Furthermore, the first sensing component includes a first frame 100, a first shielding blade 101, and a first sensing element 102.

[0081] The first shielding blade 101 is made of magnetic shielding material and includes three first blades 1010 distributed around the axial center position, and a first mounting hole 1011 is opened at the axial center position of the first shielding blade 101.

[0082] The first frame 100 includes a first hollow region 1000, wherein the first hollow region 1000 is a circular structure and its inner diameter is larger than the diameter of the first shielding blade 101.

[0083] The first sensing component 102 includes a first plate 1020, a first sensing electrode 1021 formed on the first plate 1020, a first through-hole region 1022, and a second mounting hole 1023. The second mounting hole 1023 is formed at the axial position of the first plate 1020, the first through-hole region 1022 surrounds the outside of the second mounting hole 1023, and a first electrode positioning region is formed between the first through-hole region 1022 and the second mounting hole 1023.

[0084] Preferably, the first plate 1020 is a PCB board, and its shape and size are the same as those of the first frame 100. The first through hole area 1022 is composed of six first through holes spaced around the outside of the second mounting hole 1023. The first electrode positioning area includes six first electrode fixing positions around the second mounting hole 1023. The first sensing electrode 1021 includes six electrode pieces a, which are the same number as the number of first electrode fixing positions. Each electrode piece a is fixed on the corresponding first electrode fixing position.

[0085] When the first frame 100 is superimposed on the top end face of the first plate 1020, the first sensing electrode 1021, the first through-hole area 1022, and the second mounting hole 1023 are located directly below the first hollow area 1000. The first part of the first shielding blade 101 is placed inside the first hollow area 1000, and the second part of the first shielding blade 101 is placed in the second mounting hole 1023. When the first blade 1010 rotates in the first hollow area 1000, it periodically blocks the six electrode pieces a to generate a first current signal.

[0086] Furthermore, the second sensing component includes a second frame 103, a second shielding component 104, and a second sensing component 110.

[0087] The second frame 103 includes a second hollow region 1030, wherein the second hollow region 1030 is a circular structure and its inner diameter is larger than the diameter of the top end face of the second shielding component 104.

[0088] Because the height of the second shielding component 104 is greater than the height of the first shielding blade 101, the thickness of the second frame 103 is greater than the thickness of the first frame 100.

[0089] The second shielding component 104 is made of magnetic shielding material and includes a second shielding blade 1040, a sleeve 1041, a column 1042, and an assembly part 1043. The bottom end face of the sleeve 1041 is open, and the interior is hollow. The second shielding blade 1040 includes three second blades 10400 evenly spaced around an axial center. The ends of each second blade 10400 are fixed to the outer wall of the sleeve 1041. The top end faces of the three second blades 10400 and the top end face of the sleeve 1041 are on the same plane, forming the top end face of the second shielding component 104. The column 1042 is fixed at the axial center of the top end face of the sleeve 1041, and the assembly part 1043 is located at the axial center of the top end face of the column 1042.

[0090] The second sensing component 110 includes a second plate 1100, a second sensing electrode 1101 formed on the second plate 1100, and a third hollow region 1102. A second electrode positioning region is formed on the second plate 1100, and the second sensing electrode 1101 is fixed to the top end face of the second electrode positioning region and surrounds the outside of the third hollow region 1102.

[0091] Preferably, the second plate 1100 is a PCB board, and its shape and size are the same as those of the second frame 103. The second electrode positioning area consists of six second electrode fixing positions surrounding the second mounting hole 1023. The second sensing electrode 1101 includes six electrode pieces b, which are the same number as the number of second electrode fixing positions. Each electrode piece b is fixed on the corresponding second electrode fixing position.

[0092] The second frame 103 is superimposed on the top end face of the second plate 1100. The second sensing component 110 is located below the second hollow region 1030. The top end face and the first part of the side wall of the second shielding blade 1040, the sleeve 1041, and the first part of the column 1042 are all located inside the second hollow region 1030. The second part of the side wall of the sleeve 1041 penetrates the third hollow region 1102 and extends to the area below the second plate 1100.

[0093] When the second plate 1100 is fixed to the top end face of the second frame 103, the second part of the column 1042 is placed in the second mounting hole 1023, and the mounting part 1043 is located in the first hollow region 1000 and fixed inside the first mounting hole 1011. At this time, the first shielding blade 101 is located in the region above the first sensing electrode 1021, with a reserved gap between them, and the second shielding blade 1040 is located in the region above the second sensing electrode 1101, with a reserved gap between them. The first shielding blade 101 is fixed to the column 1042 directly above the second shielding blade 1040 through the mounting part 1043. When the driving assembly drives the second shielding blade 1040 to rotate along the first axis AA, it simultaneously drives the first shielding blade 101 to rotate synchronously along the first axis AA. The first shielding blade 101 periodically blocks the first sensing electrode 1021 to generate a first current signal, and the second shielding blade 1040 periodically blocks the second sensing electrode 1101 to generate a second current signal. Because there is a height difference (i.e., d0) between the first sensing electrode 1021 and the second sensing electrode 1101, there is a signal difference between the first current signal and the second current signal.

[0094] The height difference (i.e., d0) between the first sensing electrode 1021 and the second sensing electrode 1101 is correlated with the signal difference between the first current signal and the second current signal.

[0095] Furthermore, the height difference (i.e., d0) is proportional to the signal difference (i.e., the larger the height difference, the larger the signal difference, and the smaller the height difference, the smaller the signal difference).

[0096] Specifically, the sensitive structure 1 also includes an upper cavity 105 and a first PCB board 1050 fixed inside it, wherein:

[0097] The upper cavity 105 includes a hollow protrusion 1051 extending above the upper cavity 105. When the upper cavity 105 is fixed to the bottom of the second plate 1100, the second part of the side wall of the sleeve 1041 is located inside the upper cavity 105 and covers the outside of the first part of the protrusion 1051.

[0098] Specifically, the drive assembly includes a stator assembly 106 and a rotation mechanism, wherein:

[0099] The stator assembly 106 is sleeved on the outside of the first portion of the protrusion 1051, such that the stator assembly 106 is located inside the sleeve 1041. The stator assembly 106 includes a stator 1060 and an electromagnetic coil wound thereon.

[0100] The rotating mechanism includes a rotating shaft 1061 and a first bearing 1062 and a second bearing 1063 respectively sleeved on the outside of the rotating shaft 1061. The first end of the rotating shaft 1061 passes through the interior of the protrusion 1051 and is fixed inside the sleeve 1041. The first bearing 1062 and the second bearing 1063 are arranged vertically and are both placed inside the protrusion 1051. The protrusion 1051 has a fixing position for the first bearing 1062 and a fixing position for the second bearing 1063. When the first bearing 1062 is placed in the fixing position, the top end face of the first bearing 1062 and the top end face of the protrusion 1051 are approximately on the same plane. At this time, the first bearing 1062 is located inside the stator assembly 106. The sleeve 1041 surrounds the stator assembly 106, the first bearing 1062 and the rotating shaft 1061 in sequence. When the second bearing 1063 is placed in the fixed position, the bottom end face of the second bearing 1063 and the bottom end face of the protrusion 1051 are approximately on the same plane.

[0101] After the stator assembly 106 is connected to the first PCB board 1050, the first PCB board 1050 generates a drive signal. Under the control of the drive signal, an electromagnetic effect is generated, which drives the rotating shaft 1061 to rotate and drives the first shielding blade 101 and the second shielding blade 1040 to rotate synchronously, so as to periodically block the first sensing component 102 and the second sensing component 110 respectively, generating a first current signal and a second current signal with signal difference.

[0102] Since the sleeve 1041 is installed on the outside of the stator assembly 106, the sleeve 1041 and the upper cavity 105 form a shell that encloses the stator assembly 106. Compared with the drive assembly in the existing field-milled electrostatic sensor, the internal structure of the field-milled electrostatic sensor is more compact, and the height of the field-milled electrostatic sensor is reduced.

[0103] Specifically, the sensitive structure 1 also includes a state blade 107 and a phototube assembly, wherein:

[0104] The second end of the rotating shaft 1061 is located below the upper cavity 105. The state blade 107 is fixed to the second end of the rotating shaft 1061, and the bottom end face of the state blade 107 is approximately on the same plane as the bottom end face of the second end of the rotating shaft 1061. When the rotating shaft 1061 rotates along the first axis AA under the action of the electromagnetic effect generated by the stator assembly 106, it drives the state blade 107 to rotate synchronously with the first shielding blade 101 and the second shielding component 104.

[0105] The phototube assembly includes a phototube 109 and a second PCB board 108 fixed on the bottom end face of the upper cavity 105. The phototube 109 is fixed on the second PCB board 108, and its detection end faces the position of the state blade 107 to obtain rotation speed signal and phase signal.

[0106] Since the state blade 107 rotates synchronously with the first shielding blade 101 and the second shielding component 104, the rotational speed signal obtained by the phototube 109 can be the rotational speed signal of the state blade 107, the rotational speed signal of the first shielding blade 101, or the rotational speed signal of the second shielding component 104.

[0107] Specifically, the signal processing section 2 is fixed on the circuit board and includes a signal processing module and an MCU module, wherein:

[0108] The signal processing module converts the first current signal and the second current signal into a first electric field value and a second electric field value, respectively.

[0109] The MCU module calculates the first induced charge value, the second induced charge value, and the installation distance coefficient based on the first electric field value and the second electric field value, and obtains the static voltage value based on the first induced charge value and the installation distance coefficient, or the second induced charge value and the installation distance coefficient.

[0110] Furthermore, the signal processing module includes a first IV-to-IV conversion circuit, a second IV-to-IV conversion circuit, a modulation circuit, and an ADC sampling circuit, wherein:

[0111] The first IV conversion circuit is connected to the first sensing component and converts the first current signal input by the first sensing component into a first voltage signal.

[0112] The second IV conversion circuit is connected to the second sensing component and converts the second current signal input by the second sensing component into a second voltage signal.

[0113] The modulation circuit is connected to the first IV conversion circuit, the second IV conversion circuit, and the second PCB board respectively, and modulates the input first voltage signal and phase signal, as well as the input second voltage signal and phase signal, to form the first electric field analog value and the second electric field analog value.

[0114] The ADC sampling circuit converts the first and second electric field analog values ​​into first and second electric field values, respectively.

[0115] Furthermore, the MCU module includes a first computing unit and a second computing unit, wherein:

[0116] The first calculation unit is used to calculate the first induced charge value and the second induced charge value based on the first electric field value and the second electric field value, and to calculate the proportionality coefficient (i.e., k0) of the induced charge value based on the first induced charge value and the second induced charge value.

[0117] The second calculation unit is used to derive the installation distance value (i.e., d0) based on the proportionality coefficient (i.e., k0) of the induced charge value and the height difference (i.e., d0).A ).

[0118] Furthermore, in the first calculation unit, after obtaining the first induced charge value and the second induced charge value, the proportionality coefficient of the induced charge value is obtained using the following formula:

[0119]

[0120] Where k0 is the proportionality coefficient of the induced charge value, Q A Q is the value of the first induced charge. B This is the value of the second induced charge.

[0121] Furthermore, in the second calculation unit, based on the proportionality coefficient (i.e., k0) of the induced charge value and the height difference (i.e., d0), the installation distance value (i.e., d) is obtained using the following formula. A ):

[0122]

[0123] Where k0 is the proportionality coefficient of the induced charge value, d A d0 is the proportionality coefficient of the induced charge value, and d0 is the height difference.

[0124] In the above formula, k0 is obtained by calculation by the first calculation unit, and d0 is a known value. Therefore, the installation distance value d can be obtained. A .

[0125] After obtaining the corresponding installation distance value (i.e., d) A After that, based on the installation distance value (i.e., d) A Find and obtain the corresponding installation distance coefficient (i.e., k). A ).

[0126] Alternatively, in another possible embodiment, the second calculation unit in the MCU module can be replaced with a matching module, wherein the matching unit is used to determine the installation distance value (i.e., d) based on a scaling factor of the induced charge value. A ), and based on the installation distance value (i.e., d) A Determine the installation distance coefficient (i.e., k) A ).

[0127] First, based on the proportionality coefficient (i.e., k0) of the induced charge value, find and obtain the corresponding installation distance value (i.e., d). A Then, based on the installation distance value (i.e., d) A Find and obtain the corresponding installation distance coefficient (i.e., k). A ).

[0128] For example, the storage list stores a number of proportional coefficients, installation distance values, and installation distance coefficients that have corresponding relationships. When the proportional coefficient of the induced charge value is determined to be 0.8, the corresponding installation distance value is 5.5cm and the installation distance coefficient is 1.2, based on the corresponding relationship.

[0129] The MCU module also includes a PID control unit and a speed analysis unit, wherein:

[0130] The PID control unit is used to input drive signals to the drive assembly. The PID control unit is connected to the first PCB board to input control commands to the first PCB board. The first PCB board generates drive signals based on the control commands. Under the control of the drive signals, the stator assembly generates electromagnetic effects, which drives the rotating shaft to rotate and drives the first shielding blade and the second shielding blade to rotate synchronously, so as to periodically block the first sensing component and the second sensing component respectively, generating a first current signal and a second current signal with signal difference.

[0131] The speed analysis unit receives and analyzes the speed signal to determine whether it matches the drive signal. Specifically, the speed analysis unit compares the speed signal with the drive signal corresponding to the control command generated by the PID control unit. Based on the comparison result, it determines whether the speed signal of the state blade, the speed signal of the first shielded blade, or the speed signal of the second shielded component matches the drive signal, thus forming a speed closed loop. If the speed signal and drive signal are determined to be inconsistent, they can be adjusted to match based on the determination result. When the speed signal and drive signal match, it indicates that the sensitivity and signal frequency of the first and second sensing electrodes are both in a stable state.

[0132] For example, when the corresponding value of the drive signal is 80 rpm, the corresponding value of the obtained speed signal of the state blade is 75 rpm. After comparison, it is found that the speed signal of the state blade is less than the drive signal. The MCU module inputs a boost command to the PID control unit, and the PID control unit boosts the drive signal to 90 rpm according to the boost command. By analyzing the speed signal of the state blade, it is found that the speed signal of the state blade is 80 rpm. After comparison, it is found that the speed signal of the state blade is equal to the drive signal. At this time, the sensitivity and signal frequency of the sensing electrode are adjusted to a stable state.

[0133] Furthermore, when the corresponding value of the drive signal is 80 rpm, the corresponding value of the speed signal of the state blade is 85 rpm. Comparison shows that the speed signal of the state blade is greater than the drive signal. The MCU module inputs a step-down command to the PID control unit, which then boosts the drive signal to 70 rpm according to the command. Analysis of the speed signal of the state blade reveals it to be 80 rpm. Comparison shows that the speed signal of the state blade is equal to the drive signal. At this point, the sensitivity and signal frequency of the sensing electrode are adjusted to a stable state.

[0134] In Embodiment 1, both the shape of the assembly part and the shape of the first assembly hole are non-circular structures. When the assembly part and the first assembly hole are connected by screws, the transmission performance of the first shielding blade can be improved.

[0135] In Embodiment 1, the diameter of the first shielding blade is smaller than the diameter of the second shielding component, and the diameter of the first sensing electrode is smaller than the diameter of the second sensing electrode. Therefore, in the orthographic projection view, the second sensing electrode surrounds the outside of the first sensing electrode and is located below the first through-hole region. In the current electric field environment, the driving component drives the first shielding blade and the second shielding component to rotate synchronously. The first sensing electrode periodically senses the charge in the current electric field environment, and through the first through-hole region, the second sensing electrode periodically senses the charge in the current electric field environment to generate a first current signal and a second current signal with a signal difference.

[0136] Example 2

[0137] like Figure 9 As shown, the present invention provides a detection method applied to a non-contact electrostatic sensor, comprising the following steps:

[0138] In the current electric field environment, the first sensing component and the second sensing component, which are connected to each other and arranged vertically, generate a first current signal and a second current signal with a signal difference under the drive of the driving component.

[0139] The first current signal and the second current signal are converted into the first electric field value and the second electric field value, respectively.

[0140] The installation distance value of the electrostatic sensor is obtained based on the first current signal and the second current signal to determine the installation location.

[0141] Example 3

[0142] like Figure 10 As shown, this embodiment provides a detection method, which is a specific implementation step of the detection method in Embodiment 2, including:

[0143] S201, a first current signal and a second current signal with a signal difference are sensed.

[0144] Specifically, driven by the drive signal, the drive assembly simultaneously rotates the first shielding blade synchronously along the first axis AA. The first shielding blade periodically blocks the first sensing electrode to generate a first current signal, and the second shielding blade periodically blocks the second sensing electrode to generate a second current signal. Due to the height difference (i.e., d0) between the vertically positioned first and second sensing electrodes, there is a signal difference between the first and second current signals.

[0145] Furthermore, the height difference (i.e., d0) is proportional to the signal difference (i.e., the larger the height difference, the larger the signal difference, and the smaller the height difference, the smaller the signal difference).

[0146] S202, Obtain the first voltage signal and the second voltage signal.

[0147] Specifically, the first sensing electrode is connected to the first IV conversion circuit, and the second sensing electrode is connected to the second IV conversion circuit. A first current signal is input into the first IV conversion circuit, which converts the first current signal into a first voltage signal. A second current signal is input into the second IV conversion circuit, which converts the second current signal into a second voltage signal.

[0148] Furthermore, there is a difference between the first voltage signal and the second voltage signal.

[0149] S203. Obtain the first and second simulated electric field values.

[0150] Specifically, the modulation circuit is connected to the first IV conversion circuit, the second IV conversion circuit, and the second PCB board respectively, and modulates the input first voltage signal and phase signal, as well as the input second voltage signal and phase signal, to form the first electric field simulation value and the second electric field simulation value.

[0151] Furthermore, there is a difference between the simulated values ​​of the first electric field and the simulated values ​​of the second electric field.

[0152] S204. Obtain the digitized first electric field value and the digitized second electric field value.

[0153] Specifically, the modulation circuit is connected to the ADC sampling circuit, and the first and second analog electric field values ​​are input to the ADC sampling circuit. The ADC sampling circuit converts the first and second analog electric field values ​​into digitized first and second electric field values, respectively.

[0154] Furthermore, there is a difference between the first electric field value and the second electric field value.

[0155] S205, obtain the first induced charge value, the second induced charge value, and the ratio coefficient of the induced charge value between the first induced charge value and the second induced charge value.

[0156] Specifically, the first calculation unit derives the first induced charge value and the second induced charge value based on the first electric field value and the second electric field value, respectively, and uses the following formula to derive the proportionality coefficient of the induced charge value:

[0157]

[0158] Where k0 is the proportionality coefficient of the induced charge value, Q A Q is the value of the first induced charge. B This is the value of the second induced charge.

[0159] S206. Obtain the installation distance value based on the proportionality coefficient of the induced charge value.

[0160] Specifically, the second calculation unit calculates the installation distance value (i.e., d0) based on the proportionality coefficient (i.e., k0) of the induced charge value and the height difference (i.e., d0), using the following formula. A ):

[0161]

[0162] Where k0 is the proportionality coefficient of the induced charge value, d A d0 is the proportionality coefficient of the induced charge value, and d0 is the height difference.

[0163] In another possible embodiment, in S206 above, the corresponding installation distance value (i.e., d) can be found and obtained based on the proportionality coefficient (i.e., k0) of the induced charge value. A Then, based on the installation distance value (i.e., d) A Find and obtain the corresponding installation distance coefficient (i.e., k). A ).

[0164] For example, a storage list is set up to store a number of proportional coefficients, installation distance values ​​and installation distance coefficients with corresponding relationships. After determining the proportional coefficients of the induced charge values, the installation distance values ​​and installation distance coefficients can be obtained sequentially according to the corresponding relationships.

[0165] It also includes the step of analyzing the received speed signal and determining whether the speed signal is consistent with the drive signal.

[0166] Specifically, the PID control unit inputs a drive signal to the drive assembly. The PID control unit is connected to the first PCB board to input control commands to the first PCB board. The first PCB board generates a drive signal based on the control commands. Under the control of the drive signal, the stator assembly generates an electromagnetic effect, driving the rotating shaft to rotate and causing the first shielding blade and the second shielding blade to rotate synchronously, so as to periodically block the first sensing component and the second sensing component respectively, generating a first current signal and a second current signal with a signal difference.

[0167] The speed analysis unit analyzes the received speed signal to determine whether it matches the drive signal. Specifically, the speed analysis unit compares the speed signal with the drive signal corresponding to the control command generated by the PID control unit. Based on the comparison result, it determines whether the speed signal of the state blade, the speed signal of the first shielded blade, or the speed signal of the second shielded component matches the drive signal, thus forming a speed closed loop. If the speed signal and drive signal are determined to be inconsistent, they can be adjusted to match based on the determination result. When the speed signal and drive signal match, it indicates that the sensitivity and signal frequency of the first and second sensing electrodes are both in a stable state.

[0168] The above description is merely a preferred embodiment of the present invention and is illustrative rather than restrictive. Those skilled in the art will understand that many changes, modifications, and even equivalents can be made within the spirit and scope defined by the claims of the present invention, all of which will fall within the protection scope of the present invention.

Claims

1. A non-contact electrostatic sensor, comprising an electric field signal sensing part and a circuit board with a signal processing part connected together, wherein the electric field signal sensing part includes a sensitive structure and a driving component, characterized in that, The sensitive structure includes at least a first sensing component and a second sensing component that are connected to each other and arranged vertically. The first sensing component includes a first frame, a first shielding blade and a first sensing element that cooperate with each other. The first sensing element includes a first plate and a first sensing electrode, a first through hole area and a second mounting hole formed on the first plate. The second sensing component includes a second frame, a second shielding component, and a second sensing component. The second shielding component includes a second shielding blade, a sleeve, a column, and an assembly part. The second sensing component includes a second plate, a third hollow region formed on the second plate, and a second sensing electrode. The second sensing electrode is located directly below the first through-hole region. Under the drive signal, the drive component drives the first shielding blade and the second shielding blade to rotate synchronously along the first axis. The first sensing component and the second sensing component periodically sense the charge in the current electric field environment to generate a first current signal and a second current signal with signal difference. The signal processing section calculates the installation distance value of the electrostatic sensor based on the first current signal and the second current signal to determine the installation position.

2. The non-contact electrostatic sensor according to claim 1, characterized in that, A first mounting hole is provided at the axial position of the first shielding blade; The second shielding blade includes three second blades that are evenly spaced around the axis. The sleeve is a cylindrical body with an open bottom and a hollow interior. Multiple second blades are fixed at equal intervals around the first axis on the side wall of the sleeve. The assembly part and the column are fixed sequentially on the top end face of the sleeve. The diameter of the first shielding blade is smaller than the diameter of the second shielding blade.

3. A non-contact electrostatic sensor according to claim 2, characterized in that, The first frame includes a first hollow region; The first through-hole region surrounds the outside of the first sensing electrode and the second mounting hole in sequence; The first frame is superimposed on the top end face of the first plate. The first sensing electrode, the first through hole area and the second mounting hole are located directly below the first hollow area. A part of the first shielding blade is placed inside the first hollow area and the other part is placed in the second mounting hole. The second frame includes a second hollow region; The second sensing electrode surrounds the outside of the third hollow region, and the diameter of the second sensing electrode is larger than the diameter of the first sensing electrode. The second frame is superimposed on the top end face of the second plate. The second sensing component is located below the second hollow region. The second shielding blade, a part of the sleeve, and a part of the column are all located inside the second hollow region. Another part of the sleeve penetrates the third hollow region. Another part of the column is placed in the second mounting hole. The mounting part is placed in the first mounting hole.

4. A non-contact electrostatic sensor according to claim 3, characterized in that, The first sensing electrode is fixed above the second sensing electrode, and the first axis passes through the axis of the first sensing component and the axis of the second sensing component in sequence. There is a height difference between the first sensing electrode and the second sensing electrode, and the height difference is correlated with the signal difference.

5. A non-contact electrostatic sensor according to claim 4, characterized in that, The sensitive structure also includes an upper cavity and a first PCB board fixed therein, wherein: The upper cavity includes a hollow protrusion extending to the outside of the upper cavity, a portion of the drive assembly is sleeved on the outside of the protrusion, and the first PCB board surrounds the outside of the protrusion.

6. A non-contact electrostatic sensor according to claim 5, characterized in that, The drive assembly includes a stator assembly and a rotating mechanism, wherein: The stator assembly is sleeved on the outside of the protrusion and located inside the sleeve; The rotating mechanism includes a rotating shaft and a first bearing and a second bearing respectively sleeved on the outside of the rotating shaft. The first end of the rotating shaft passes through the interior of the protrusion and is fixed inside the sleeve. The first bearing and the second bearing are arranged vertically, both located inside the protrusion. After the stator assembly is connected to the first PCB board, it generates an electromagnetic effect under the control of the drive signal, which drives the rotating shaft to rotate and causes the first shielding blade and the second shielding blade to rotate synchronously, so as to periodically block the first sensing component and the second sensing component respectively.

7. A non-contact electrostatic sensor according to claim 6, characterized in that, The sensitive structure also includes a state blade and a phototube assembly, wherein: The state blade is fixed to the second end of the rotating shaft and rotates synchronously with the first shielding blade and the second shielding component. The phototube assembly includes a phototube and a second PCB board fixed to the bottom end face of the upper cavity. The detection end of the phototube faces the position of the state blade to obtain rotation speed signal and phase signal.

8. A non-contact electrostatic sensor according to claim 7, characterized in that, The signal processing section includes a signal processing module and an MCU module, wherein: The signal processing module converts the first current signal and the second current signal into a first electric field value and a second electric field value, respectively. The MCU module determines the installation location by calculating the installation distance of the electrostatic sensor in the current electric field environment or relative to the object being measured based on the first current signal and the second current signal.

9. A non-contact electrostatic sensor according to claim 8, characterized in that, The signal processing module includes a first IV conversion circuit, a second IV conversion circuit, a modulation circuit, and an ADC sampling circuit, wherein: The first IV conversion circuit converts the first current signal into a first voltage signal; The second IV conversion circuit converts the second current signal into a second voltage signal; The modulation circuit modulates the first voltage signal and the phase signal, and the second voltage signal and the phase signal, to form a first electric field simulation value and a second electric field simulation value; The ADC sampling circuit converts the first electric field simulation value and the second electric field simulation value into the first electric field value and the second electric field value, respectively.

10. A non-contact electrostatic sensor according to claim 9, characterized in that, The MCU module includes a first computing unit and a second computing unit, wherein: The first calculation unit is used to calculate the first induced charge value and the second induced charge value based on the first electric field value and the second electric field value, and to calculate the ratio coefficient of the induced charge value based on the first induced charge value and the second induced charge value. The second calculation unit is used to calculate the installation distance value based on the ratio coefficient of the induced charge value and the height difference.

11. A non-contact electrostatic sensor according to claim 10, characterized in that, The MCU module also includes a PID control unit and a speed analysis unit, wherein: The PID control unit is used to input drive signals to the drive component; The speed analysis unit is used to analyze the received speed signal and determine whether the speed signal is consistent with the drive signal.

12. A detection method, applied to a non-contact electrostatic sensor according to any one of claims 1-11, characterized in that, Includes the following steps: In the current electric field environment, the first sensing component and the second sensing component, which are connected to each other and arranged vertically, generate a first current signal and a second current signal with a signal difference under the drive of the driving component. The first current signal and the second current signal are respectively converted into a first electric field value and a second electric field value; The signal processing section calculates the installation distance value of the electrostatic sensor based on the first current signal and the second current signal to determine the installation position.

13. The detection method according to claim 12, characterized in that, The step of determining the installation position by deriving the installation distance value of the electrostatic sensor in the current electric field environment or relative to the object being measured based on the first current signal and the second current signal includes: The first electric field value and the second electric field value are calculated respectively to obtain the first induced charge value and the second induced charge value; Calculate the first induced charge value and the second induced charge value to obtain the proportionality coefficient of the induced charge value; The installation distance of the electrostatic sensor is determined based on the proportionality coefficient of the induced charge value.

14. The detection method according to claim 13, characterized in that, Also includes: Analyze the received speed signal to determine whether the speed signal is consistent with the drive signal.

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