Data center machine room server chip cooling method

Abstract

The invention discloses a data center machine room server chip cooling method, which is characterized in that a chip device which is integrally of a plate-shaped structure is horizontally arranged, cooling liquid is sprayed above the chip device, and cooling is realized by combining air flow along the horizontal direction, and the chip device is divided into different areas along the horizontal direction; the temperature of each area is detected, and the corresponding spraying liquid outlet amount above is controlled to be increased or decreased along with the rising and falling of the temperature of the area. According to the scheme, local targeted heat dissipation and cooling treatment on the chip device in space and time can be achieved, and the overall working efficiency and safety of the chip are greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of server cooling in data center computer rooms, and particularly relates to a method for cooling server chips in a data center computer room. Background Art

[0002] With the rapid development of cloud computing and big data technologies, the performance of IT devices has been continuously enhanced, resulting in a significant increase in the energy consumption of servers. In particular, as the core component of a server, the power consumption of the central processing unit increases sharply with the improvement of performance, leading to more serious heat generation of the processor. The operating temperature of electronic components directly affects their durability and reliability. To maintain the temperature of each component within an appropriate range, in addition to ensuring a suitable ambient temperature for the device, effective thermal management measures need to be implemented.

[0003] Traditional computer room cooling mainly relies on air cooling technology to reduce the temperature of servers, and it has gradually become difficult to meet the needs of high-power density devices. With the continuous progress of the enhanced heat transfer technology between the chip cold plate and the coolant, liquid cooling technology has become a new focus of the industry.

[0004] Currently, the liquid cooling technology in data centers is mainly divided into two modes: direct liquid cooling and indirect liquid cooling. A typical example of indirect liquid cooling is liquid-cooled plate cooling, which is characterized in that the heat-generating element does not directly contact the coolant. By directly contacting the element with the liquid-cooled plate filled with coolant, heat is transferred to the liquid-cooled plate, and then the heat is carried away through the circulation of the coolant inside the cold plate. The typical method of direct liquid cooling is immersion cooling, that is, the element is directly immersed in an insulating and chemically inert coolant, and the heat generated by the element is removed through the circulating coolant. In contrast, in liquid-cooled plate cooling, only the bottom surface of the element contacts the liquid-cooled plate, and the heat needs to be transferred to the coolant through the liquid-cooled plate, with a long heat transfer path and low heat dissipation efficiency. In addition, liquid-cooled plate cooling requires a high-cost liquid-cooled plate, the entire system needs to operate under high pressure, has strict requirements for the sealing design, and has a large design difficulty. While in immersion cooling, since the element is directly immersed in the coolant, compared with liquid-cooled plate cooling, immersion cooling has the advantages of rapid temperature reduction and uniform temperature distribution, but it has a complex structure, high design difficulty, cumbersome maintenance, and a large amount of coolant consumption and high cost.

[0005] Compared with traditional air cooling technology, spray liquid cooling technology can effectively reduce the refrigeration energy consumption of IT devices and improve the heat dissipation efficiency. This technology has a low engineering implementation difficulty, does not require large-scale renovation of the computer room infrastructure, and only requires a small amount of adjustment to the server to achieve good cooling effects.

[0006] Currently, most common spray liquid cooling solutions use fixed nozzles, and there are many restrictions on the position and direction of the nozzles. However, the heat generated by chip components is often unevenly distributed in space and time. The heat is usually concentrated in high-performance components and varies periodically with the operating conditions. According to the principle of the shortest plank in a barrel, the heat dissipation effect of such high-heat-generating components is poor, which will greatly affect the overall operating effect of the chip system. For example, in an extreme case, when a certain computing program suddenly falls into a logic calculation loop defect, it may cause a sudden sharp temperature rise at a local position of a chip. If targeted timely cooling cannot be obtained, it may even cause component burnout and system paralysis.

[0007] Therefore, how to design a cooling and heat dissipation method that can better improve the cooling effect, can achieve targeted heat dissipation for high-performance components in space and time, and can better improve the overall working efficiency of the chip has become an urgent problem to be considered and solved by those skilled in the art. Summary of the Invention

[0008] Aiming at the deficiencies of the above-mentioned prior art, the technical problem to be solved by the present invention is: how to provide a data center computer room server chip cooling method that can better improve the cooling effect, achieve targeted heat dissipation and temperature reduction for high-performance components in space and time, and can better improve the overall working efficiency and safety of the chip.

[0009] To solve the above technical problems, the present invention adopts the following technical solutions: A data center computer room server chip cooling method, in which a chip device with an overall plate-shaped structure is horizontally arranged, and coolant is sprayed above it and combined with a horizontal air flow to achieve cooling and temperature reduction. It is characterized in that the chip device is divided into different regions in the horizontal direction, the temperature of each region is detected, and the corresponding spray liquid output above is controlled to increase or decrease with the rise and fall of the temperature of the region.

[0010] In this way, in this method, a method of spraying coolant in cooperation with air cooling is adopted, and the air flow is used to increase the evaporation amount of the coolant to improve the heat dissipation and temperature reduction effect on the chip device. More importantly, this method conducts zonal management and control on the chip device, and adjusts the amount of sprayed coolant corresponding to the heat generation amount of each zone, realizing targeted heat dissipation for chip components in space and time, and avoiding the reduction of the overall operating effect and operating safety of the chip system caused by untimely temperature reduction of some high-heat-generating components.

[0011] Furthermore, the method is implemented through a server chip cooling system, which includes a plurality of nozzle devices correspondingly arranged above a chip device of a horizontally arranged plate-like structure, and the spraying areas of each nozzle device are connected and arranged on the chip device. It also includes a wind device installed on the side of the chip device, and a temperature detection mechanism is also arranged in the spraying area of ​​each nozzle device, and the temperature detection mechanism is connected to the flow switch in the corresponding nozzle device.

[0012] In this way, during the operation of the server, different components in the chip device generate different amounts of heat, which results in different amounts of heat in each spray area. When the temperature detection mechanism detects the temperature of the spray area, it automatically adjusts the flow switch of the corresponding nozzle device to follow the linkage and increase the amount of spray liquid when the temperature rises. This can achieve targeted cooling and heat dissipation, and avoid the situation where the high-heat generating components in the local area reduce the operating efficiency of the entire chip system due to untimely cooling.

[0013] Furthermore, the nozzle device includes a horizontally arranged rectangular liquid outlet box, the lower surface of which is evenly arrayed with liquid outlet holes, the upper portion of which is connected to a liquid inlet pipe and the flow switch is installed, and the liquid outlet boxes of each nozzle device are adjacently spaced and arranged above the chip device.

[0014] In this way, each nozzle device can respectively implement zoned control over the chip device.

[0015] Furthermore, the temperature detection mechanism includes a memory alloy element installed in the spray area, one end of the memory alloy element is a fixed end, and the other end is a force-applying end connected to a pull wire. The memory alloy element can adjust and increase the pulling distance of the pull wire as the temperature rises, and the other end of the pull wire is connected to the flow switch.

[0016] In this way, the automatic adjustment of the flow switch is controlled by pulling the pull wire due to the automatic deformation of the memory alloy element following the temperature. The automatic adjustment control process can be realized without relying on electrical components. It has the advantages of simple structure, convenient, stable and reliable control, etc.

[0017] Furthermore, a vertical steering wheel is arranged in the spray area directly opposite to the flow switch below, and the pull wire passes around the steering wheel and then turns upward to connect with the flow switch.

[0018] In this way, it is more convenient to guide the pull wire and ensure the smoothness of pulling the pull wire.

[0019] As an option, the memory alloy element is a horizontally arranged spiral spring structure, and is composed of multiple sections of memory alloys with different memory temperatures spliced ​​along the length direction.

[0020] When the shape memory alloy of different segments reaches its deformation temperature, the shape memory alloy of that segment shrinks and pulls the wire. As the temperature rises, the number of deformed shape memory alloy segments increases, and the distance the wire is pulled gradually accumulates and increases with the increase in temperature, achieving automatic adjustment. It has the characteristics of simple structure and convenient setting, but there are defects such as the relatively high production cost of the shape memory alloy component, and the single-sided heating of the helical shape memory alloy component, resulting in relatively low sensitivity.

[0021] As another option, the shape memory alloy component includes a plurality of shape memory alloy components in a rod shape. The wire is horizontally arranged within the spraying area, and a plurality of equally spaced limiting columns are arranged on one side of the wire within the spraying area. A connecting wire extends outward from the middle of the wire between each adjacent pair of limiting columns towards the side where the limiting columns are located. The outer ends of the respective connecting wires are connected to the force - applying ends of the respective shape memory alloy components. The deformation directions of the force - applying ends of the respective shape memory alloy components are the same as the extending directions of the outer ends of the connecting wires and the deformation amounts are the same, but the memory deformation temperatures are set to gradually increase.

[0022] In this way, as the temperature rises, each time a shape memory alloy component deforms, it can pull the wire by the same distance. The distance the wire is pulled gradually accumulates and increases with the increase in temperature, achieving automatic adjustment. Although this method is relatively more complex in structure compared to the multi - segment shape memory alloy helical spring method, the cost of the straight rod - shaped components is lower and it is more suitable for the chip device, with higher heat sensitivity and more sensitive and reliable reaction.

[0023] Furthermore, a horizontally arranged heat - conducting plate is adhesively disposed on the upper surface of the chip device, and the temperature detection mechanism is installed on the upper surface of the heat - conducting plate.

[0024] In this way, it is more convenient for the installation and control of the temperature detection mechanism, and reduces the interference degree of the deformation process of the shape memory alloy component on the chip device.

[0025] Furthermore, liquid leakage holes are evenly arranged on the heat - conducting plate.

[0026] In this way, after the coolant is air - cooled, it passes downward through the liquid leakage holes and directly contacts the chip components on the chip device, which can better take away the heat. At the same time, after the coolant passes through the liquid leakage holes, it fills the space between the heat - conducting plate and the chip components, so that the heat of the chip can be better transferred upward to the heat - conducting plate for heat dissipation.

[0027] Furthermore, a liquid receiving tray is also arranged below the chip device.

[0028] In this way, it is convenient for part of the leaked coolant to be caught by the liquid receiving tray and recycled.

[0029] Further, the flow switch includes a piston cylinder vertically arranged upward above the middle of the liquid outlet box. The upper end of the piston cylinder is connected to the main liquid inlet pipe, the lower end of the piston cylinder is hermetically arranged with the liquid outlet box, a piston that can slide up and down is arranged inside the piston cylinder, liquid inlet branch pipes are connected outward on both sides of the piston cylinder where the piston is located, each liquid inlet branch pipe communicates outward and is connected to the liquid outlet box, the end of the pull wire can slide upward through the liquid outlet box and enter the piston cylinder to be connected to the piston, and a piston return spring is also installed between the piston and the lower end of the piston cylinder.

[0030] In this way, when the piston is pulled downward by the pull wire, the gradually increasing communication area of the ports of the liquid inlet branch pipes on both sides is driven, achieving the effect of flow switch adjustment, with a simple structure and reliable adjustment.

[0031] Further, both the piston cylinder and the liquid inlet branch pipes are rectangular pipes. In this way, when the pull wire pulls the piston downward by the same distance, the increased communication area of the liquid inlet branch pipes changes equally, better ensuring the uniformity of adjustment.

[0032] Further, the wind power device includes an air outlet channel vertically installed outside one side of the chip device, an air outlet is arranged on the air outlet channel facing the chip device, and a return air channel vertically installed outside the other side of the chip device, a return air port is arranged on the return air channel facing the chip device.

[0033] In this way, the chip device and the corresponding cooling structure in this application can be arranged in several layers in the height direction, better meeting the centralized requirements of the computer room.

[0034] Therefore, in the solution of this application, by combining liquid cooling and air cooling, the disadvantages of high air cooling noise and low heat dissipation efficiency are overcome, that is, only a small air volume is required to achieve the heat dissipation effect. And through the uniform distribution of the coolant droplets by the spray disc, the small area of the chip device can be cooled evenly. By using the shape memory alloy element to control the opening and closing size of the piston valve according to the temperature change, automatic heat dissipation is realized throughout the process without power supply, saving electric power resources. And this precise control also avoids the waste of the insulating coolant, saving costs. And it will not cause great harm to the chip components like immersion liquid cooling. By arranging multiple small areas on the chip device, the problem of uneven distribution of the heat generation area of the chip device can be solved. And the setting of the shape memory alloy element in each small area to sense the current area temperature and then open and close the valve can solve the problem of periodic or sudden heat generation in the local area of the chip device.

[0035] In summary, the solution of this application can perform local targeted heat dissipation and temperature reduction processing on the chip device in space and time, greatly improving the overall working efficiency and safety of the chip. Description of the Drawings

[0036] Figure 1Schematic three-dimensional structure diagram of the server chip cooling system adopted in the present invention.

[0037] Figure 2 is Figure 1 front view of.

[0038] Figure 3 is Figure 2 cross-sectional view of a single nozzle device.

[0039] Figure 4 is Figure 2 top view of the separate temperature detection mechanism in.

[0040] Figure 5 is Figure 4 schematic diagram after the partial shape memory alloy elements in generate temperature rise and deformation. Arrows in each figure indicate the flow direction of the air current. Detailed implementation manners

[0041] The present invention will be further described in detail below with reference to the accompanying drawings and specific implementation manners.

[0042] Implementation manner: A method for cooling a server chip in a data center computer room, horizontally arranging a chip device with an overall plate-shaped structure, spraying a coolant above it and combining with an air current in the horizontal direction to achieve cooling and temperature reduction. It is characterized in that the chip device is divided into different regions in the horizontal direction, the temperature of each region is detected, and the corresponding liquid discharge amount of the spray above is controlled to increase or decrease with the rise and fall of the temperature of this region.

[0043] In this way, in this method, a method of spraying coolant in cooperation with air cooling is adopted, and the way of using the air current to increase the evaporation amount of the coolant is used to improve the heat dissipation and temperature reduction effect on the chip device. More importantly, this method conducts zoning control on the chip device, correspondingly adjusts the amount of the sprayed coolant according to the heat generation amount of each zone, realizes targeted heat dissipation for the chip components in space and time, and avoids the overall operation effect and operation safety of the chip system being reduced due to the untimely temperature reduction of some components with high heat generation.

[0044] In this implementation manner, this method is realized through a server chip cooling system. Refer to Figures 1-5 shown, the server chip cooling system includes a plurality of nozzle devices correspondingly arranged above a horizontally arranged plate-shaped chip device 1, the spraying areas of each nozzle device are connected and arranged on the chip device 1, and further includes a wind power device installed on the side of the chip device. A temperature detection mechanism is respectively arranged in the spraying area of each nozzle device, and the temperature detection mechanism is connected to a flow switch in the corresponding nozzle device.

[0045] In this way, during the operation of the server, different components in the chip device generate different amounts of heat, which results in different amounts of heat in each spray area. When the temperature detection mechanism detects the temperature of the spray area, it automatically adjusts the flow switch of the corresponding nozzle device to follow the linkage and increase the amount of spray liquid when the temperature rises. This can achieve targeted cooling and heat dissipation, and avoid the situation where the high-heat generating components in the local area reduce the operating efficiency of the entire chip system due to untimely cooling.

[0046] Among them, the nozzle device includes a horizontally arranged rectangular structure liquid outlet box 2, the lower surface of the liquid outlet box 2 is evenly arrayed with liquid outlet holes 3, the upper part of the liquid outlet box 2 is connected with a liquid inlet pipe and the flow switch is installed, and the liquid outlet boxes 2 of each nozzle device are adjacently arranged above the chip device 1.

[0047] In this way, each nozzle device can respectively implement zoned control over the chip device.

[0048] Among them, the temperature detection mechanism includes a memory alloy element 4 installed in the spray area, one end of the memory alloy element 4 is a fixed end, and the other end is a force-applying end connected to a pull wire 5. The memory alloy element 4 can adjust and increase the pulling distance of the pull wire as the temperature rises, and the other end of the pull wire 5 is connected to the flow switch.

[0049] In this way, the automatic adjustment of the flow switch is controlled by pulling the pull wire due to the automatic deformation of the memory alloy element following the temperature. The automatic adjustment control process can be realized without relying on electrical components. It has the advantages of simple structure, convenient, stable and reliable control, etc.

[0050] A vertical steering wheel 6 is arranged in the spraying area directly opposite to the flow switch below, and the pull wire 5 passes around the steering wheel 6 and then turns upward to connect with the flow switch.

[0051] In this way, it is more convenient to guide the pull wire and ensure the smoothness of pulling the pull wire.

[0052] In this embodiment, the memory alloy element includes a plurality of rod-shaped memory alloy elements, the pull wire 5 is horizontally arranged in the spray area, and a plurality of equidistantly arranged limit columns 7 are arranged on one side of the pull wire in the spray area, and a connecting wire 8 is extended outward from the middle of the pull wire between each adjacent limit column 7 toward the side where the limit column is located, and the outer end of each connecting wire 8 is connected to the force-applying end of each memory alloy element 4, and the deformation direction of the force-applying end of each memory alloy element is consistent with the extension direction of the outer end of the connecting wire and the deformation amount is the same, but the memory deformation temperature is set to gradually increase.

[0053] In this way, as the temperature rises, each time a shape memory alloy element deforms, it can pull the wire by the same distance. The distance that the wire is pulled gradually accumulates and increases with the increase of temperature, realizing automatic adjustment. Although this method has a relatively more complex structure than the multi-segment shape memory alloy helical spring method, the cost of the straight rod-shaped component is lower and it is more suitable for the chip device, with higher thermal sensitivity and more sensitive and reliable response.

[0054] As another implementable option, the shape memory alloy element is a horizontally arranged helical spring structure, and is composed of multiple segments of shape memory alloys with different memory temperatures spliced along the length direction.

[0055] In this way, when the deformation temperature of different segments of the shape memory alloy is reached, the shape memory alloy of this segment shrinks and pulls the wire. As the temperature rises, the number of deformed shape memory alloy segments increases, and the distance that the wire is pulled gradually accumulates and increases with the increase of temperature, realizing automatic adjustment. It has the characteristics of simple structure and convenient setting, but there are defects such as relatively high production cost of the shape memory alloy element and relatively low sensitivity due to unilateral heating of the helical shape memory alloy element.

[0056] In this embodiment, a horizontally arranged heat conducting plate 9 is attached to the upper surface of the chip device 1, and the temperature detection mechanism is integrally installed on the upper surface of the heat conducting plate 9.

[0057] In this way, it is more convenient to install and control the temperature detection mechanism, and the interference degree of the deformation process of the shape memory alloy component on the chip device is reduced.

[0058] Among them, liquid leakage holes are uniformly arranged on the heat conducting plate 9.

[0059] In this way, the coolant can directly contact the chip elements on the chip device by passing downward through the liquid leakage holes after being air-cooled, which can better take away heat. At the same time, after passing through the liquid leakage holes, the coolant fills the space between the heat conducting plate and the chip elements, so that the heat of the chip can be better transferred upward to the heat conducting plate for heat dissipation. During implementation, the coolant uses an inert liquid that does not react with the chip elements.

[0060] Among them, a liquid receiving tray 10 is further arranged below the chip device 1.

[0061] In this way, it is convenient for part of the leaked coolant to be received by the liquid receiving tray and recycled.

[0062] Among them, the flow switch includes a piston cylinder 11 vertically arranged upward above the middle of the liquid outlet box. The upper end of the piston cylinder 11 is connected to the liquid inlet main pipe 12, and the lower end of the piston cylinder 11 is hermetically arranged with the liquid outlet box 2. A piston 13 that can slide up and down is arranged in the piston cylinder 11. Liquid inlet branch pipes 14 are connected outward on both sides of the piston cylinder where the piston is located. Each liquid inlet branch pipe 14 communicates outward and is connected to the liquid outlet box 2. The end of the pull wire 5 can slide upward through the liquid outlet box and enter the piston cylinder to be connected to the piston. A piston return spring 15 is also installed between the piston and the lower end of the piston cylinder.

[0063] In this way, when the piston is pulled downward by the pull wire, the gradually increasing communication area of the exposed ports of the liquid inlet branch pipes on both sides is driven (the overall length range of the pulled pull wire is consistent with the distance range of the piston moving from the upper side to the lower side of the liquid inlet branch pipe port), achieving the effect of flow switch adjustment, and having a simple structure and reliable adjustment.

[0064] Among them, both the piston cylinder 11 and the liquid inlet branch pipes 14 are rectangular pipes. In this way, when the pull wire pulls the piston downward by the same distance, the increased communication area of the liquid inlet branch pipes changes equally, better ensuring the uniformity of adjustment.

[0065] Among them, the wind power device includes an air outlet channel 16 vertically installed outside one side of the chip device. The air outlet of the air outlet channel is arranged facing the chip device, and further includes a return air channel 18 vertically installed outside the other side of the chip device. The air return port of the return air channel is arranged facing the chip device.

[0066] In this way, the chip device and the corresponding cooling structure in this application can be arranged in several layers in the height direction, better meeting the centralized requirements of the computer room. During implementation, a fan is installed in the air outlet channel and / or the return air channel to supply air.

[0067] The solution of this application has the following two operating modes during operation. The first operating mode: When some small areas of the chip device do not have a very high heating temperature, or those small areas are not in a working operation state during this time period, only the low-speed flow of air can take away the heat, and thus no coolant is required. The second operating mode: When some other small areas of the chip device have a very high heating temperature and air cooling no longer meets the heat dissipation requirements, the shape memory alloy element will deform and pull the piston, thereby increasing the liquid output, allowing the coolant to flow out evenly through the spray box for heat dissipation. During implementation, the liquid cooling method can adopt two-phase liquid cooling, that is, when the liquid droplets of the coolant drop on the small area, they will absorb heat and evaporate into gas. In the case of air circulation, this will accelerate heat dissipation and more efficiently reduce the heating temperature of the electronic components. The liquid droplets that have not evaporated in time will also flow to the surrounding or bottom of the heating chip device for evaporation and heat absorption.

Claims

1. A method for cooling server chips in a data center computer room, which horizontally arranges a chip device with an overall plate-like structure, sprays a coolant above it, and combines with an air flow in the horizontal direction to achieve cooling and temperature reduction, characterized in that, The chip device is horizontally divided into different regions, the temperature of each region is detected, and the corresponding spraying liquid output above is controlled to increase or decrease with the rise and fall of the temperature of the region.

2. The method for cooling a server chip in a data center computer room according to claim 1, wherein This method is implemented through a server chip cooling system. The server chip cooling system includes a plurality of nozzle devices correspondingly arranged above a horizontally arranged plate-shaped chip device. The spraying regions of each nozzle device are connected on the chip device. It further includes a wind power device installed on the side of the chip device. A temperature detection mechanism is also respectively arranged in the spraying region of each nozzle device, and the temperature detection mechanism is connected to a flow switch in the corresponding nozzle device.

3. The method for cooling a server chip in a data center computer room according to claim 2, wherein, The nozzle device includes a liquid outlet box with a horizontally arranged rectangular structure. The lower surface of the liquid outlet box is evenly and arrayedly provided with liquid outlet holes. An inlet pipe is connected upward to the liquid outlet box and the flow switch is installed thereon. The liquid outlet boxes of each nozzle device are arranged adjacent to each other at intervals above the chip device.

4. The method for cooling a server chip in a data center computer room according to claim 3, wherein The temperature detection mechanism includes a shape memory alloy element installed in the spraying region. One end of the shape memory alloy element is a fixed end, and the other end is a force application end connected to a pull wire. The shape memory alloy element can adjust and increase the pulling distance of the pull wire as the temperature rises. The other end of the pull wire is connected to the flow switch.

5. The method for cooling a server chip in a data center computer room according to claim 4, wherein, A vertical turning wheel is arranged in the spraying region directly opposite below the flow switch. The pull wire bypasses the turning wheel and turns upward to be connected to the flow switch.

6. The method for cooling a server chip in a data center computer room according to claim 4, wherein, The shape memory alloy element is a horizontally arranged spiral spring structure and is composed of a plurality of shape memory alloys with different memory temperatures spliced along the length direction.

7. The method for cooling a server chip in a data center computer room according to claim 4, wherein The shape memory alloy element includes a plurality of rod-shaped shape memory alloy elements. The pull wire is horizontally arranged in the spraying region, and a plurality of equally spaced limit posts are arranged on one side of the pull wire in the spraying region. A connecting wire extends outward from the middle of the pull wire between each adjacent pair of limit posts to the side where the limit post is located. The outer ends of each connecting wire are connected to the force application ends of each shape memory alloy element. The deformation directions of the force application ends of each shape memory alloy element are the same as the extending directions of the outer ends of the connecting wires and the deformation amounts are the same, but the memory deformation temperatures are gradually increased.

8. The method for cooling a server chip in a data center computer room according to claim 4, characterized in that, A horizontally arranged heat conducting plate is attached to the upper surface of the chip device, and the temperature detection mechanism is installed on the upper surface of the heat conducting plate; Leakage holes are evenly arranged on the heat conducting plate; A liquid receiving tray is further arranged below the chip device.

9. The method for cooling a server chip in a data center computer room according to claim 3, wherein The flow switch includes a piston cylinder vertically arranged upward above the middle of the liquid outlet box. The upper end of the piston cylinder is connected to the total inlet pipe, the lower end of the piston cylinder is hermetically arranged with the liquid outlet box, a piston that can slide up and down is arranged in the piston cylinder, and liquid inlet branch pipes are connected outward on both sides of the piston cylinder where the piston is located. Each liquid inlet branch pipe is connected outward and communicated to the liquid outlet box. The end of the pull wire can slide upward through the liquid outlet box and enter the piston cylinder to be connected to the piston. A piston return spring is also installed between the piston and the lower end of the piston cylinder; Both the piston cylinder and the liquid inlet branch pipes are rectangular pipes.

10. The method for cooling a server chip in a data center computer room according to claim 2, wherein, The wind power device includes an air outlet channel vertically installed outside one end side of the chip device. The air outlet channel is provided with an air outlet facing the chip device. It further includes a return air channel vertically installed outside the other end side of the chip device. The return air channel is provided with a return air port facing the chip device.

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