Heat dissipation system

Abstract

A heat dissipation system comprises a cabinet body, a component to be cooled is placed in the cabinet body, the interior of the cabinet body is divided into a first area and a second area which are independent from each other, the component to be cooled is located in the second area, and the first area and the second area are communicated through at least one air vent. The refrigeration module is arranged in the first area, and the refrigeration module is used for cooling gas in the first area; and the air flow adjusting module is used for driving air to circularly flow between the first area and the second area through the at least one air vent. According to the technical scheme, the heat dissipation effect on the to-be-cooled part can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and particularly to a heat dissipation system. Background Art

[0002] In recent years, the Internet technology has developed rapidly, and cloud services, cloud computing, and AI technologies have emerged. Servers have become increasingly important. The improvement of their computing and storage capabilities has led to an increase in power consumption and heat generation, making the design of the heat dissipation system particularly crucial. The traditional server cooling solutions mainly include air cooling and liquid cooling. Air cooling dissipates heat by air flow. Although it has low cost, convenient maintenance, and mature technology, it has low heat dissipation efficiency, high noise, and high power consumption. It can also harm the human body due to noise and cause environmental complaints. Moreover, the open layout is likely to introduce dust and water vapor, affecting the lifespan of components.

[0003] Liquid cooling includes immersion cooling and cold plate cooling. It operates quietly, has high cooling efficiency, and low power consumption, but also has disadvantages. In immersion liquid cooling, the liquid medium will cause swelling and other effects on connectors, printed circuit boards, and components, resulting in component failure. It will also affect dielectric, electrical signal, and electrical performance, and the upfront construction and transformation costs are high. The cold plate liquid cooling has a complex structure, high design requirements, high cost, complex fluid pipelines, and there is a hidden danger of liquid leakage. Once there is a liquid leakage, it will be fatal to the server. In addition, when traditional air cooling and cold plate cooling systems operate in an air environment, if the surrounding environment has high humidity and the surface temperature of the equipment is lower than the dew point temperature, condensation is likely to form. To avoid the damage of condensation to the server, it is necessary to increase the temperature of cold air or cooling water, thus affecting the heat dissipation efficiency. Summary of the Invention

[0004] The technical problem solved by the present invention is to provide an improved heat dissipation system for a cabinet.

[0005] To solve the above technical problem, an embodiment of the present invention provides a heat dissipation system including: a cabinet in which components to be cooled are placed. The interior of the cabinet is divided into an independent first area and a second area. Among them, the components to be cooled are located in the second area, and the first area and the second area are connected through at least one ventilation opening; a refrigeration module disposed in the first area, and the refrigeration module is used to cool the gas in the first area; an air flow adjustment module for driving the gas to circulate between the first area and the second area through the at least one ventilation opening.

[0006] Optionally, the heat dissipation system further includes: a partition for dividing the interior of the cabinet into the first area and the second area, and the partition is suitable for forming at least part of the boundary of the ventilation opening.

[0007] Optionally, the ventilation opening is opened on the partition, or the ventilation opening is formed between the partition and the wall of the cabinet.

[0008] Optionally, the at least one partition includes a first partition. Along a first direction, opposite sides of the first partition are connected to opposite walls of the cabinet body. There is a non-zero gap between two sides of the first partition along a second direction and the walls of the cabinet body to form the ventilation opening, and the second direction is perpendicular to the first direction.

[0009] Optionally, along a third direction, the refrigeration module and the component to be cooled are arranged on the same side of the first partition, and the first direction, the second direction, and the third direction are perpendicular to each other in pairs.

[0010] Optionally, the refrigeration module includes multiple layers of refrigeration units arranged at intervals along the third direction. The gas in the first area enters the second area through the gap between adjacent two layers of the refrigeration units under the drive of the air flow regulation module.

[0011] Optionally, in the first area, the air flow regulation module is configured to drive the gas to pass through the refrigeration module along the second direction.

[0012] Optionally, along a third direction, the refrigeration module and the component to be cooled are arranged on opposite sides of the first partition, and the first direction, the second direction, and the third direction are perpendicular to each other in pairs.

[0013] Optionally, the refrigeration module includes multiple layers of refrigeration units arranged at intervals along the second direction. The gas in the first area passes through the gap between adjacent two layers of the refrigeration units under the drive of the air flow regulation module. The at least one partition further includes a second partition and a third partition arranged opposite to each other along the second direction. The first partition, the second partition, the third partition, and the walls of the cabinet body jointly enclose the first area, and both the second partition and the third partition are parallel to the plane defined by the first direction and the third direction.

[0014] Optionally, the ventilation opening includes an air inlet and an air outlet respectively located on two sides of the first partition along the second direction. The second partition is arranged on the side of the refrigeration module close to the air inlet, and the second partition is connected to the first partition to guide the gas entering the first area through the air inlet to enter the refrigeration unit from the side far from the first partition; the third partition is arranged on the side of the refrigeration module close to the air outlet of the first area, and the third partition is connected to the wall of the cabinet body in the opposite direction of the third direction to guide the gas to flow into the gap between adjacent two layers of the refrigeration units.

[0015] Optionally, each layer of the refrigeration unit is plate-shaped and is arranged parallel to the plane defined by the first direction and the third direction.

[0016] Optionally, the air vent includes an air outlet for gas to enter the second zone from the first zone, and the at least one partition also includes a fourth partition, and the fourth partition and the wall of the cabinet together enclose the second zone, and the fourth partition is arranged on the side of the component to be cooled close to the air outlet, the fourth partition is connected to the first partition, and the fourth partition is parallel to the plane defined by the first direction and the third direction, and the fourth partition is used to guide gas to enter the component to be cooled from the side of the component to be cooled away from the first zone.

[0017] Optionally, the refrigeration module includes multiple layers of refrigeration units spaced apart along the first direction, and the gas in the first zone passes through the gap between two adjacent layers of the refrigeration units under the drive of the airflow regulation module. Each layer of the refrigeration units is plate-shaped and is arranged parallel to the plane defined by the second direction and the third direction.

[0018] Optionally, the cabinet body includes a first wall and a second wall arranged opposite to each other, and a third wall and a fourth wall connecting the first wall and the second wall and arranged opposite to each other, and the at least one partition includes: a fifth partition extending obliquely from the first wall toward the second wall and the fourth wall; a sixth partition connected to the side of the fifth partition away from the first wall and extending toward the fourth wall, and the first wall, the fifth partition, the sixth partition and the fourth wall together enclose the first area; wherein the vent includes a first vent formed between the sixth partition and the fourth wall, and a second vent opened on the fifth partition, and the gas enters the first area through the first vent and flows into the second area through the second vent.

[0019] Optionally, the airflow adjustment module is disposed at at least one of the first vent and the second vent.

[0020] Optionally, in the first zone, the refrigeration module is perpendicular to the gas flow direction.

[0021] Optionally, the cabinet includes a first split body and a second split body, wherein the first split body is used to define the first zone, the second split body is used to define the second zone, the first split body and the second split body are connected through a connecting channel, and the gas flows from the first zone through the connecting channel into the second zone to dissipate heat to the components to be dissipated.

[0022] Optionally, the heat dissipation system further includes: an air intake module, which is connected to the first zone, and the air intake module is used to input gas into the cabinet to maintain a positive pressure state inside the cabinet.

[0023] Optionally, the gas is helium, neon or hydrogen.

[0024] Optionally, the intake module includes a gas storage tank for storing and introducing the gas into the interior of the cabinet.

[0025] Optionally, the intake module includes: a compression module.

[0026] Optionally, the intake module includes: a drying module and / or a filtering module.

[0027] Optionally, an exhaust hole is further provided on the wall of the cabinet.

[0028] Optionally, a waterproof and breathable device is provided at the exhaust hole.

[0029] Optionally, the waterproof and breathable device is made of a waterproof and breathable material treated with a waterproof coating. The waterproof and breathable material includes sponge or wool felt, and the cabinet communicates with the outside through the waterproof and breathable device.

[0030] Optionally, the refrigeration module is a phase change heat exchanger or a liquid cooling heat exchanger.

[0031] Optionally, the refrigeration module includes two heat exchangers arranged in a V shape.

[0032] Compared with the prior art, the technical solution of the embodiment of the present invention has the following beneficial effects:

[0033] By adopting the technical solution of the present application, the cabinet is divided into an independent first area and a second area. The component to be cooled is located in the second area. The gas in the first area is cooled by the refrigeration module, and the gas is circulated between the two areas through the air flow regulation module. The entire heat dissipation system is in a relatively sealed state. This design avoids the problem that traditional air-cooled heat dissipation is likely to bring in dust and water vapor, which affects the service life of the device. And compared with the traditional liquid-cooled heat dissipation method, the heat dissipation system provided by this embodiment has a simpler structure, reduces the cost and the risk of liquid leakage, and realizes efficient heat dissipation through the gas circulation, reduces the noise and power consumption, and improves the heat dissipation efficiency. The refrigeration module is isolated from the component to be cooled. Even if there is a leakage problem in the refrigeration module pipeline, it will not affect the component to be cooled, and the component to be cooled can still operate normally, improving the safety and reliability of the component to be cooled, reducing the downtime caused by the heat dissipation system failure, and ensuring the continuous and stable operation of the component to be cooled.

[0034] Furthermore, the ventilation opening is provided on the partition or formed between the partition and the cabinet wall. This flexible ventilation opening setting method can be adjusted according to the actual layout of the cabinet and the heat dissipation requirements, ensuring the smooth flow of gas between the first area and the second area, being beneficial to the stable operation of the heat dissipation system, and improving the applicability and flexibility of the heat dissipation system.

[0035] Furthermore, the refrigeration module includes multiple layers of refrigeration units arranged at intervals in the third direction. The gas passes through the gap between adjacent two layers of refrigeration units under the agitation of the air flow regulation module and enters the second zone. The arrangement of such multiple layers of refrigeration units increases the contact area between the gas and the refrigeration units, improves the heat exchange efficiency, thus making the cooling effect of the gas better and further enhancing the heat dissipation performance of the heat dissipation system.

[0036] Furthermore, the heat dissipation system may further include a compression module to keep the interior of the cabinet in a positive pressure state. The entire heat dissipation system is in a relatively sealed state, effectively preventing external impurities such as moisture and dust from entering the cabinet and affecting the normal operation of the components to be cooled.

[0037] Furthermore, the heat dissipation system may further include a drying module. Compared with traditional air-cooled and cold plate cooling systems, the components to be cooled are in an air environment. When the heat dissipation system operates, if the surrounding environment humidity is high and the surface temperature of the components to be cooled is lower than the dew point temperature, condensation is likely to form on the surface of the components to be cooled. To avoid the damage caused by condensation to the components to be cooled, usually the temperature of the cold air or cooling water has to be higher than the dew point, which will affect the heat dissipation efficiency of the components to be cooled. In this application, dry gas is continuously fed into the interior of the cabinet, keeping the interior of the cabinet in a dry state all the time. Since the components to be cooled are always kept in a dry medium atmosphere and there is no condensation problem, the temperature of the cooling medium (cooling water and cooling air) can be set without restriction to achieve a higher heat transfer efficiency.

[0038] Furthermore, since the components to be cooled are immersed in a dry gas environment and the air circulates and returns, taking away the heat generated by the components to be cooled, the gas has almost no impact on the high-speed signal integrity, solving the problems of compatibility and signal integrity of the liquid medium in traditional immersion liquid cooling; in addition, the dry gas has better permeability than the liquid medium and can quickly enter the components to be cooled, especially the gaps of complex devices and components. Its excellent fluidity can quickly take away the heat; moreover, in traditional immersion liquid cooling, if the liquid keeps flowing at a high speed, the impact on the devices on the circuit board in the components to be cooled is large, affecting the operation stability of the devices. In this application, the gas medium is used for flow. Its density is small and it can maintain a relatively high flow rate, having little impact on the devices.

[0039] Furthermore, by regulating the flow field change of the gas medium inside the cabinet through the air flow regulation module, the optimal temperature control effect can be achieved. This application can, according to the heat generation situation of each area of the components to be cooled, optimize the design of the gas circuit and accurately control the gas flow field, so that more cooling gas flows through the heat concentration area, ensuring the temperature balance of the components to be cooled and comprehensively enhancing the operation stability and reliability of the components to be cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 is a schematic diagram of a heat dissipation system according to an embodiment of the present invention;

[0041] Figure 2 is a schematic diagram of another heat dissipation system according to an embodiment of the present invention;

[0042] Figure 3 is Figure 2 a schematic diagram of another perspective of the heat dissipation system shown;

[0043] Figure 4 is a schematic diagram of yet another heat dissipation system according to an embodiment of the present invention;

[0044] Figure 5 is Figure 4 a schematic diagram of another perspective of the heat dissipation system shown;

[0045] Figure 6 is a schematic diagram of still another heat dissipation system according to an embodiment of the present invention;

[0046] Figure 7 is a schematic diagram of yet another heat dissipation system according to an embodiment of the present invention;

[0047] Figure 8 is Figure 1 a schematic diagram of a variant of the embodiment shown. Detailed implementation manners

[0048] As mentioned in the background art, the existing heat dissipation system for the cabinet has a complex structure, and both the safety and heat dissipation efficiency are relatively low.

[0049] To solve the above technical problems, an embodiment of the present application provides a heat dissipation system including: a cabinet, in which components to be heat-dissipated are placed, the interior of the cabinet is divided into an independent first area and a second area, wherein the components to be heat-dissipated are located in the second area, and the first area and the second area are connected through at least one ventilation opening; a refrigeration module, disposed in the first area, the refrigeration module is used to cool the gas in the first area; an air flow regulation module, used to drive the gas to circulate between the first area and the second area through the at least one ventilation opening.

[0050] Adopting the technical solution of the present application, by dividing the cabinet body into an independent first area and a second area, with the component to be cooled located in the second area, using the refrigeration module to cool the gas in the first area, and enabling the gas to circulate between the two areas through the air flow regulation module, this partition design avoids the problem that traditional air-cooled heat dissipation is prone to bringing in dust and water vapor, which affects the service life of the device. Compared with the traditional liquid-cooled heat dissipation method, the air-cooled heat dissipation system provided by this implementation scheme has a simpler structure, reduces costs and the risk of liquid leakage, and realizes efficient heat dissipation through the circulation of gas, reduces noise and power consumption, and improves the heat dissipation efficiency. Separating the refrigeration module from the component to be cooled, even if there is a leakage problem in the refrigeration module pipeline, it will not affect the component to be cooled, and the component to be cooled can still operate normally, improving the safety and reliability of the component to be cooled, reducing the downtime caused by heat dissipation system failures, and ensuring the continuous and stable operation of the component to be cooled.

[0051] To make the above objects, features, and beneficial effects of the present invention more obvious and understandable, the following detailed description will be given to the specific embodiments of the present invention with reference to the accompanying drawings.

[0052] Figure 1 It is a schematic diagram of a heat dissipation system 10 according to an embodiment of the present invention.

[0053] Referring to Figure 1 , the heat dissipation system 10 may include a cabinet body 100, a component to be cooled 20 may be placed inside the cabinet body 100, the cabinet body 100 is divided into an independent first area 101 and a second area 102, wherein, the component to be cooled 20 is located in the second area 102, the first area 101 and the second area 102 are connected through at least one ventilation opening 103, and the partition 1 is used to form at least part of the boundary of the ventilation opening 103; a refrigeration module 2, arranged in the first area 101, the refrigeration module 2 is used to cool the gas in the first area 101; an air flow regulation module 3, used to drive the gas to circulate between the first area 101 and the second area 102 through the at least one ventilation opening 103.

[0054] Specifically, in some embodiments, the component to be cooled 20 may be a server or a key component in a server, such as a central processing unit (CPU), a graphics processing unit (GPU), a memory chip, etc. These components generate a large amount of heat during operation. If the heat cannot be dissipated in time, it will cause the temperature of the components to rise, which will further affect the performance and service life of the server, and may even cause equipment failures.

[0055] Furthermore, the interior of the cabinet body 100 is divided into an independent first area 101 and a second area 102. Thus, the internal environment of the cabinet body 100 can be partitioned and configured according to the heat dissipation requirements, optimizing the gas flow and heat dissipation effect.

[0056] It should be understood that the above-mentioned mutual independence refers to functional independence rather than absolute spatial independence.

[0057] Further, the component 20 to be cooled is located in the second zone 102. After the gas is cooled and temperature-reduced in the first zone 101, it enters the second zone 102 to cool the component 20 to be cooled.

[0058] Further, the first zone 101 and the second zone 102 are connected through at least one ventilation opening 103. The partition 1 is used to form at least part of the boundary of the ventilation opening 103. The ventilation opening 103 is the channel for the gas to circulate between the first zone 101 and the second zone 102. In practical applications, the structural design of the partition 1 determines the position, size and shape of the ventilation opening 103, thereby affecting the flow path and efficiency of the gas flow. Therefore, those skilled in the art can, according to the actual situation, ensure smooth gas flow and achieve efficient heat exchange through reasonable setting of the ventilation opening 103.

[0059] Further, the refrigeration module 2 is arranged in the first zone 101. The first zone 101 can be used as a gas cooling area, providing a suitable installation and operation space for the refrigeration module 2.

[0060] In some embodiments, the refrigeration module 2 is used to cool the gas in the first zone 101. When the air flow regulating module 3 drives the gas into the first zone 101, the refrigeration module 2 absorbs the heat of the gas through heat exchange with the gas, reducing the gas temperature. The cooled gas then enters the second zone 102 to absorb the heat generated by the component 20 to be cooled, thereby achieving the heat dissipation effect.

[0061] Further, the air flow regulating module 3 is used to drive the gas to circulate between the first zone 101 and the second zone 102 through at least one ventilation opening 103. The air flow regulating module 3 is the power source of the entire heat dissipation system 10. By generating an air flow, it pushes the gas to flow orderly between the first zone 101 and the second zone 102.

[0062] As described above, under the action of the air flow regulating module 3, the gas is inhaled from the second zone 102 (the area where the component 20 to be cooled is located) into the first zone 101, cooled by the refrigeration module 2, and then returns from the first zone 101 to the second zone 102, repeating this cycle. In this process, the gas continuously absorbs the heat of the component 20 to be cooled and releases the heat to the first zone 101, thereby achieving continuous heat dissipation of the component 20 to be cooled. This way of gas circulating flow is simpler in structure than traditional air-cooling and liquid-cooling heat dissipation methods, reducing the risk of liquid leakage, while reducing noise and power consumption and improving heat dissipation efficiency.

[0063] In some embodiments, the heat dissipation system 10 may further include a partition 1 for partitioning the interior of the cabinet 10 into the first area 101 and the second area 102, and the partition 1 is adapted to form at least part of the boundary of the ventilation opening 103.

[0064] In some embodiments, the ventilation opening 103 may be formed in the partition 1 (as shown in the embodiments such as Figure 2 and Figure 4 ).

[0065] In some embodiments, the ventilation opening 103 may be formed between the partition 1 and the wall of the cabinet 100.

[0066] In some embodiments, with continued reference to Figure 1 , the at least one partition 1 includes a first partition 11. Along the first direction D1, opposite sides of the first partition 11 are connected to opposite walls of the cabinet 100, and there is a non-zero gap between the two sides of the first partition 11 along the second direction D2 and the walls of the cabinet 100 to form the ventilation opening 103, and the second direction D2 is perpendicular to the first direction D1.

[0067] Further, the gas flow direction and trajectory between the first area 101 and the second area 102 may refer to the arrow direction in Figure 1 .

[0068] Further, along the third direction D3, the refrigeration module 2 and the component to be heat-dissipated 20 are arranged on the same side of the first partition 11, and the first direction D1, the second direction D2, and the third direction D3 are perpendicular to each other in pairs.

[0069] In the Figure 1 shown embodiment, part of the boundary between the first area 101 and the second area 102 may be non-solid. For example, part of the boundary between the first area 101 and the second area 102 may be formed between the refrigeration module 2 and the component to be heat-dissipated 20.

[0070] In a typical application scenario, the (relatively) high-temperature gas in the area where the component to be heat-dissipated 20 is located (the second area 102) is driven by the air flow regulation module 3 and enters the first area 101 through the ventilation opening 103, and then can reach the refrigeration module 2 for cooling. After being cooled, the gas directly enters the second area 102 again under the action of the air flow regulation module 3 to dissipate heat from the component to be heat-dissipated 20. This layout avoids unnecessary bends in the gas flow path within the cabinet 100, thereby reducing the path length and resistance of the gas flow and improving the efficiency of gas circulation.

[0071] In some embodiments, the refrigeration module 2 includes multiple layers of refrigeration units 21 spaced apart along the third direction D3, and the gas in the first region 101 enters the second region 102 through the gap between two adjacent layers of the refrigeration units 21 under the drive of the air flow regulation module 3.

[0072] Specifically, referring to Figure 1 , the gap between two adjacent layers of refrigeration units 21 provides a channel for gas flow, enabling the gas to smoothly pass through the multiple layers of refrigeration units 21 and ensuring sufficient contact between the gas and the refrigeration units 21. On the other hand, the arrangement of the multiple layers of refrigeration units 21 greatly increases the contact area between the gas and the refrigeration module 2. During the process of the gas passing through the gaps of each layer, sufficient heat exchange is carried out with each layer of refrigeration unit 21. Further, when the gas cooled by multiple layers enters the second region 102, it can quickly absorb the heat dissipated by the component 20 to be cooled, thereby significantly improving the refrigeration effect of the heat dissipation system 10, ensuring that the component 20 to be cooled can operate in a lower temperature environment, extending its service life, and improving the stability of equipment operation.

[0073] Further, in the first region 101, the air flow regulation module 3 is configured to drive the gas to pass through the refrigeration module 2 along the second direction D2.

[0074] Figure 2 FIG. is a schematic diagram of another heat dissipation system 10 according to an embodiment of the present invention. Figure 3 is Figure 2 a schematic diagram of another perspective of the heat dissipation system 10 shown.

[0075] In some embodiments, in combination with Figure 2 and Figure 3 , along the third direction D3, the refrigeration module 2 and the component 20 to be cooled are disposed on opposite sides of the first partition 11, and the first direction D1, the second direction D2, and the third direction D3 are perpendicular to each other in pairs.

[0076] Specifically, in the embodiments shown in Figure 2 and Figure 3 , within the cabinet 100, in the three-dimensional space constructed based on the first direction D1, the second direction D2, and the third direction D3, the first partition 11 physically divides the space. The refrigeration module 2 and the component 20 to be cooled are respectively located on opposite sides of the first partition 11 in the third direction D3, forming two relatively independent and interrelated regions. The first region 101 (the side where the refrigeration module 2 is located) mainly undertakes the function of gas cooling, and the second region 102 (the side where the component 20 to be cooled is located) is the region where heat is generated and initially absorbed. This layout clearly divides different stages of the heat dissipation process.

[0077] Furthermore, the layout of the opposite sides makes the first area 101 and the second area 102 relatively independent in space, and the functional division of the two areas is more distinct. This independence helps to reduce the mutual interference between different areas. For example, the influence of vibrations, noises, or condensed water generated during the operation of the refrigeration module 2 on the components to be cooled 20 can be minimized. At the same time, it is also convenient for separate maintenance and management of different areas. For example, when repairing the refrigeration module 2, it will not affect the normal operation of the components to be cooled 20.

[0078] Furthermore, the refrigeration module 2 may also include multiple refrigeration units 21 arranged at intervals along the second direction D2. The gas in the first area 101 passes through the gap between adjacent two layers of the refrigeration units 21 under the drive of the air flow adjustment module 3. The at least one partition 1 further includes a second partition 12 and a third partition 13 arranged oppositely along the second direction D2. The first partition 11, the second partition 12, the third partition 13, and the wall of the cabinet 100 together enclose the first area 101. Both the second partition 12 and the third partition 13 are parallel to the plane defined by the first direction D1 and the third direction D3. Thus, under the guidance of the second partition 12 and the third partition 13, the gas entering the first area 101 can follow a predetermined flow trajectory, pass through the gaps between adjacent two layers of the refrigeration units 21 and then converge, and then flow into the second area 102.

[0079] In some embodiments, the ventilation opening 103 includes an air inlet and an air outlet respectively located on both sides of the first partition 11 along the second direction D2. The second partition 12 is arranged on the side of the refrigeration module 2 close to the air inlet. The second partition 12 is connected to the first partition 11 to guide the gas entering the first area 101 through the air inlet to enter the refrigeration unit 21 from the side away from the first partition 11. The third partition 13 is arranged on the side of the refrigeration module 2 close to the air outlet of the first area 101. The third partition 13 is connected to the wall of the cabinet 100 along one side of the third direction D3 to guide the gas to flow into the gap between adjacent two layers of the refrigeration units 21.

[0080] Specifically, refer to Figure 2, the air inlet of the first zone 101 is located above the air outlet of the first zone 101. The second partition 12 is disposed near the air inlet of the first zone 101, and the second partition 12 closes the opening of the gap between the refrigeration unit 2 and the first partition toward the second direction D2. Thus, the gas entering the first zone 101 from the air inlet will flow in the direction opposite to the third direction D3 under the guidance of the second partition 12. Further, when the gas flows to the wall on the side of the cabinet 100 facing the direction opposite to the third direction D3, it will flow in the direction opposite to the second direction D2 along the gap between the refrigeration module 2 and the wall of the cabinet 100 under the guidance of the wall.

[0081] Further, the third partition 13 is disposed on the side of the refrigeration module 2 facing the direction opposite to the second direction D2. The third partition 13 closes the gap between the refrigeration module 2 and the wall on the side of the cabinet 100 facing the direction opposite to the third direction D3. Under the guidance of the third partition 13, the gas can pass through the gap between adjacent two layers of refrigeration units 21 along the third direction D3. Thus, through the setting and layout of the second partition 12 and the third partition 13, the gas can be guided to pass through the gap between adjacent two layers of refrigeration units 21 along the third direction D3 for heat exchange, with a simple structure and low cost.

[0082] In some embodiments, each layer of the refrigeration unit 21 is plate-shaped and is disposed parallel to the plane defined by the first direction D1 and the third direction D3.

[0083] In some embodiments, the ventilation opening 103 includes an air outlet for the gas to enter the second zone 102 from the first zone 101. The at least one partition 1 further includes a fourth partition 14. The fourth partition 14 and the wall of the cabinet 100 jointly enclose the second zone 102. The fourth partition 14 is disposed on the side of the component to be cooled 20 near the air outlet. The fourth partition 14 is connected to the first partition 11. The fourth partition 14 is parallel to the plane defined by the first direction D1 and the third direction D3. The fourth partition 14 is used to guide the gas to enter the component to be cooled 20 from the side of the component to be cooled 20 away from the first zone 101.

[0084] Specifically, the fourth partition 14 closes the opening of the gap between the component to be cooled 20 and the first partition 11 toward the direction opposite to the second direction D2, so that the gas entering the second zone 102 flows along the third direction D3 under the guidance of the fourth partition 14. Then, under the combined action of the wall of the cabinet 100 facing the third direction D3, the gas is guided to blow over the component to be cooled 20 along the direction opposite to the third direction D3.

[0085] In some embodiments, a plurality of components 20 to be cooled can be placed in the second zone 102. The plurality of components 20 to be cooled can be spaced apart along the second direction D2, and the gas can pass through the gap between two adjacent components 20 to be cooled along the opposite direction of the third direction D3 to fully cool the components 20 to be cooled, thereby improving the cooling efficiency.

[0086] Figure 4 is a schematic diagram of another heat dissipation system 10 according to an embodiment of the present invention. Figure 5 yes Figure 4 A schematic diagram of the heat dissipation system 10 from another perspective is shown.

[0087] In some embodiments, in combination Figure 4 and Figure 5 The refrigeration module 2 includes multiple layers of refrigeration units 21 spaced apart along the first direction D1. The gas in the first zone 101 passes through the gap between two adjacent layers of the refrigeration units 21 driven by the airflow regulation module 3. Each layer of the refrigeration units 21 is plate-shaped and is arranged parallel to the plane defined by the second direction D2 and the third direction D3.

[0088] about Figure 4 and Figure 5 For other structures of the embodiment shown, reference can be made to the foregoing description of Figures 1 to 3 The relevant description of the illustrated embodiment is not repeated here.

[0089] In some embodiments, reference Figure 6 The cabinet 100 includes a first wall 104 and a second wall 105 which are arranged opposite to each other, and a third wall 106 and a fourth wall 107 which are connected to the first wall 104 and the second wall 105 and are arranged opposite to each other. The at least one partition 1 includes: a fifth partition 15 which extends obliquely from the first wall 104 toward the second wall 105 and the fourth wall 107; a sixth partition 16 which is connected to the side of the fifth partition 15 which is away from the first wall 104 and extends toward the fourth wall 107. The first wall 104, the fifth partition 15, the sixth partition 16 and the fourth wall 107 jointly enclose the first area 101. The vent 103 includes a first vent 1031 formed between the sixth partition 16 and the fourth wall 107, and a second vent 1032 which is opened on the fifth partition. The gas enters the first area 101 through the first vent 1031 and flows into the second area 102 through the second vent 1032.

[0090] Furthermore, the fifth partition 15 and the sixth partition 16 are spliced ​​into a V-shaped partition, thereby making the space allocation inside the cabinet 100 more reasonable and making the gas circulate more smoothly between the first zone 101 and the second zone 102 .

[0091] In some embodiments, the airflow adjustment module 3 may be disposed in at least one of the first ventilation opening 1031 and the second ventilation opening 1032. For example, in the Figure 6 embodiment shown, the airflow adjustment module 3 may be disposed in the second ventilation opening 1032.

[0092] In a preferred embodiment, within the first zone 101, the refrigeration module 2 is perpendicular to the gas flow direction.

[0093] It should be understood that the "perpendicular" described in the above embodiments refers to perpendicular within the allowable error range, rather than absolute perpendicular.

[0094] In some embodiments, referring to Figure 7 , the cabinet 100 includes a first split body 1001 and a second split body 1002. Among them, the first split body 1001 is used to define the first zone 101, the second split body 1002 is used to define the second zone 102, the first split body 1001 and the second split body 1002 are communicated through a connection channel 1003, and the gas flows from the first zone 101 through the connection channel 1003 into the second zone 102 to dissipate heat from the component to be cooled 20. Thus, the first split body 1001 and the second split body 1002 can further increase the independence of the first zone 101 and the second zone 102, ensuring that the cooled gas after being cooled in the first zone 101 dissipates heat from the component to be cooled 20 within the second zone 102.

[0095] In some embodiments, the first split body 1001 and the second split body 1002 are respectively provided with openings communicating with the external environment. External gas enters the first zone 101 through the opening of the first split body 1001, is cooled by the refrigeration module 2, and then enters the second zone 102 through the connection channel 1003 to dissipate heat from the component to be cooled 20. Further, the gas after absorbing the heat of the component to be cooled 20 is discharged through the opening of the second split body 1002.

[0096] In some embodiments, the heat dissipation system 10 may further include an air intake module 4, which is communicated with the first zone 101. The air intake module 4 is used to input gas into the cabinet 100 to keep the inside of the cabinet 100 in a positive pressure state. Thus, it is possible to prevent the gas outside the cabinet 100 from entering the internal space of the cabinet 100, ensuring the dryness and cleanliness of the gas inside the cabinet 100.

[0097] In some embodiments, the air intake module 4 may include a drying module 41. The drying module 41 can perform drying treatment on the gas entering the inside of the cabinet 100 to prevent the gas with too high humidity from affecting the normal operation of the component to be cooled 20.

[0098] For example, in Figure 7 and Figure 8 In the illustrated embodiment, the drying module 41 is disposed at the gas inlet of the first zone 101 for drying the gas entering the first zone 101.

[0099] In some embodiments, the air intake module 4 may include a filtering module 42. The filtering module 42 is used to filter impurities such as dust in the gas.

[0100] In some embodiments, the air intake module 4 may further include a compression module 43 for compressing the gas entering the cabinet 100, thereby realizing a positive pressure environment inside the cabinet 100. The compression amount (or power) of the compression module 43 may be adapted to the exhaust efficiency of the exhaust port 5, so that the pressure inside the cabinet 100 is always maintained within a stable positive pressure range.

[0101] In practical applications, the compression module 43 may select an air compressor to provide stable compressed gas (with a certain pressure and flow rate). After being dried by the drying module 41 and filtered by the filtering module 42 to remove impurities and moisture, clean, dry and appropriately pressurized compressed gas (with a humidity less than 1 - 3%) is obtained. The pressure is adjusted by a pressure regulating valve, and the dried compressed gas is input into the cabinet 100. The compressed gas flows inside the cabinet 100 to dissipate heat from the components 20 to be cooled, taking away heat to maintain the normal operating temperature.

[0102] In some embodiments, the filtering module 42 may select a gas - liquid separator for compressed gas. The gas - liquid separator for compressed gas mainly uses principles such as gravity, centrifugal force, and filtration to separate impurities such as oil droplets and water droplets in the compressed gas, purify the compressed gas, provide a clean and dry gas source for downstream equipment, protect the normal operation of the equipment, and improve production quality.

[0103] In some embodiments, the drying module 41 may select a refrigerated dryer, an adsorption dryer, etc. to dry the compressed gas and remove moisture in the compressed gas. The refrigerated dryer uses a refrigeration system to cool the compressed gas below the dew point temperature, causing the water vapor in it to condense into liquid water and be discharged, thereby achieving the purpose of drying the compressed gas, reducing its water content, and meeting the requirements of industrial production for the dryness of compressed gas. The adsorption dryer mainly uses the adsorption characteristics of adsorbents to dry the compressed gas.

[0104] In some embodiments, the refrigerated dryer and the adsorption dryer may also be used in series. The refrigerated dryer can be used for preliminary drying to remove most of the moisture and reduce the dew point temperature of the compressed gas, and then the adsorption dryer is used for further drying to obtain compressed gas with a lower dew point and higher dryness, meeting the process requirements with higher requirements for gas dryness.

[0105] In some embodiments, with continued reference to Figure 6 , the intake module 4 includes a gas storage tank 44 for storing and introducing the gas into the interior of the cabinet 100.

[0106] In some embodiments, the gas may be helium, neon or hydrogen. Alternatively, the gas may also be a gas with a high thermal conductivity similar to helium, neon or hydrogen.

[0107] In some embodiments, as Figure 6 , the cabinet 100 may be in a fully enclosed state, and the gas circulates between the first zone 101 and the second zone 102 under the drive of the air flow regulation module 3.

[0108] In some embodiments, an exhaust hole 5 is further formed in the wall of the cabinet 100.

[0109] In some embodiments, a waterproof and breathable device is provided at the exhaust hole 5. Thus, water vapor can be prevented from entering the interior of the cabinet 100 and affecting the normal operation of the component 20 to be cooled.

[0110] In some embodiments, the waterproof and breathable device may be made of a waterproof and breathable material treated with a waterproof coating. The waterproof and breathable material includes sponge or wool felt, and the cabinet 100 can communicate with the outside through the waterproof and breathable device. Thus, water vapor or impurities in the outside can be effectively prevented from entering the cabinet 100 and affecting the normal operation of the component 20 to be cooled. In addition, the above materials themselves have a sound insulation function, which can further improve the sound insulation effect of the cooling system 10.

[0111] In some embodiments, with reference to Figure 3 and Figure 5 , the refrigeration module 2 may further include a water inlet 22 and a water outlet 23. Thus, cooling water can flow through the refrigeration module 2 through the water inlet 22 and the water outlet 23, quickly taking away heat, and thereby improving the refrigeration efficiency.

[0112] In some embodiments, the refrigeration module 2 may be a phase change heat exchanger, and the refrigerant medium therein may be, for example, halogenated hydrocarbons, alkanes, etc.

[0113] In other embodiments, the refrigeration module 2 may also be a liquid cooling heat exchanger (such as Figure 3 and Figure 5 ), and the refrigerant medium therein may be water, alcohol, etc.

[0114] In some embodiments, the refrigeration module 2 may be a finned tube heat exchanger, a plate heat exchanger, a shell and tube heat exchanger, a spiral plate heat exchanger, etc.

[0115] In some embodiments, with reference to Figure 7 and Figure 8, the refrigeration module includes two heat exchangers arranged in a V shape. Thus, the space utilization rate and cooling effect inside the cabinet 100 can be improved.

[0116] By adopting the technical solution of the present application, the cabinet 100 is divided into an independent first area 101 and a second area 102. The component to be cooled 20 is located in the second area 102. The refrigeration module 2 is used to cool the gas in the first area 101, and the air flow regulation module 3 is used to make the gas circulate between the two areas. The entire heat dissipation system 10 is in a relatively sealed state. This design avoids the problem that traditional air-cooled heat dissipation is likely to bring in dust and water vapor, which affects the service life of the device. Compared with the traditional liquid-cooled heat dissipation method, the air-cooled heat dissipation system 10 provided by this embodiment has a simpler structure, reduces costs and the risk of liquid leakage, and realizes efficient heat dissipation through the circulation of gas, reduces noise and power consumption, and improves the heat dissipation efficiency. The refrigeration module 2 is isolated from the component to be cooled 20. Even if there is a leakage problem in the pipeline of the refrigeration module 2, it will not affect the component to be cooled 20, and the component to be cooled 20 can still operate normally, improving the safety and reliability of the component to be cooled 20, reducing the downtime caused by the failure of the heat dissipation system 10, and ensuring the continuous and stable operation of the component to be cooled 20.

[0117] Furthermore, the ventilation port 103 is opened on the partition 1 or formed between the partition 1 and the wall of the cabinet 100. This flexible setting method of the ventilation port 103 can be adjusted according to the actual layout of the cabinet 100 and the heat dissipation requirements, ensuring the smooth circulation of gas between the first area 101 and the second area 102, which is beneficial to the stable operation of the heat dissipation system 10 and improves the applicability and flexibility of the heat dissipation system 10.

[0118] Furthermore, the refrigeration module 2 includes multiple layers of refrigeration units 21 arranged at intervals along the third direction D3. The gas passes through the gap between adjacent two layers of refrigeration units 21 under the agitation of the air flow regulation module 3 and enters the second area 102. The setting of such multiple layers of refrigeration units 21 increases the contact area between the gas and the refrigeration units 21, improves the heat exchange efficiency, so that the cooling effect of the gas is better, and further improves the heat dissipation performance of the heat dissipation system 10.

[0119] Furthermore, the heat dissipation system 10 may further include a compression module 43 to make the inside of the cabinet 100 in a positive pressure state. The entire heat dissipation system 10 is in a relatively sealed state, effectively avoiding the entry of external impurities such as moisture and dust into the cabinet 100 and affecting the normal operation of the component to be cooled 20.

[0120] Furthermore, the heat dissipation system 10 may further include a drying module 41. Compared with traditional air-cooled and cold plate cooling systems, the component 20 to be cooled is in an air environment. When the heat dissipation system 10 operates, if the surrounding environmental humidity is high and the surface temperature of the component 20 to be cooled is lower than the dew point temperature, condensation is likely to form on the surface of the component 20 to be cooled. To avoid the damage of condensation to the component 20 to be cooled, usually the temperature of the cold air or cooling water is higher than the dew point, which will affect the heat dissipation efficiency of the component 20 to be cooled. In this application, dry gas is continuously fed into the cabinet 100, so that the inside of the cabinet 100 is always in a dry state. Since the component 20 to be cooled is always kept in a dry medium atmosphere without condensation problems, the temperature of the cooling medium (cooling water and cooling air) can be set without limitation to achieve a higher heat transfer efficiency.

[0121] Furthermore, since the component 20 to be cooled is immersed in a dry gas environment and the air circulates and flows back to take away the heat generated by the component 20 to be cooled, the gas has little impact on the high-speed signal integrity, solving the compatibility and signal integrity problems of the liquid medium in traditional immersion liquid cooling; in addition, the dry gas has better permeability than the liquid medium and can quickly enter the component 20 to be cooled, especially the gaps of complex devices and components. Its excellent fluidity can quickly take away the heat; moreover, in traditional immersion liquid cooling, if the liquid keeps flowing at a high speed, the impact force on the devices on the circuit board in the component 20 to be cooled is large, affecting the operation stability of the devices. In this application, the gas medium flows, its density is small, it can maintain a high flow rate, and the impact on the devices is small.

[0122] Furthermore, by adjusting the flow field change of the gas medium inside the cabinet 100 through the air flow adjustment module 3, the optimal temperature control effect can be achieved. This application can optimize the design of the gas circuit according to the heat generation conditions of each area of the component 20 to be cooled, accurately control the gas flow field, so that more cooling gas flows through the heat concentration area, ensure the temperature balance of the component 20 to be cooled, and comprehensively improve the operation stability and reliability of the component 20 to be cooled.

[0123] Furthermore, a waterproof and breathable device is provided at the exhaust hole 5, which can effectively prevent external water vapor or impurities from entering the cabinet 100 while allowing air to pass through, affecting the normal operation of the component 20 to be cooled.

[0124] Furthermore, the whole cabinet 100 is in a relatively airtight state, so it can effectively reduce the noise transmitted outward when the heat dissipation system 10 works. And the waterproof and breathable device itself can also be made of sound insulation materials, which can further reduce the noise transmitted outward when the heat dissipation system 10 works.

[0125] It should be understood that the term "and / or" in this text is merely a description of the association relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, the character " / " in this text indicates that the associated objects before and after are in an "or" relationship. As used herein, unless otherwise clearly stated, the term "or" encompasses all possible combinations, unless infeasible. For example, if it is stated that a component can include A or B, then unless otherwise clearly stated or infeasible, the component can include A, or B, or A and B. As a second example, if it is stated that a component can include A, B, or C, then unless otherwise clearly stated or infeasible, the component can include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C.

[0126] In the embodiments of this application, "a plurality of" means two or more.

[0127] In the embodiments of this application, relational terms such as first, second, etc. are used only to distinguish an entity or operation from another entity or operation, and do not require or imply any actual relationship or order between these entities or operations. In addition, words such as "comprising", "having", and "including" and other similar forms are intended to be equivalent in meaning and are open-ended. One or more items following any of these words do not mean an exhaustive list of such one or more items, or are limited to the listed one or more items. In the drawings and the specification, exemplary embodiments have been disclosed. However, many variations and modifications can be made to these embodiments. Therefore, although specific terms are used, they are only for general and descriptive purposes and not for the purpose of limitation.

[0128] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be subject to the scope defined by the claims.

Claims

1. A heat dissipation system, characterized in that, Comprising: A cabinet body, in which components to be cooled are placed. The interior of the cabinet body is divided into an independent first area and a second area. Among them, the components to be cooled are located in the second area, and the first area and the second area are connected through at least one ventilation opening; A refrigeration module, arranged in the first area, and the refrigeration module is used to cool the gas in the first area; An air flow adjustment module, used to drive the gas to circulate between the first area and the second area through the at least one ventilation opening.

2. The heat dissipation system according to claim 1, wherein Further comprising: A partition board, used to divide the interior of the cabinet body into the first area and the second area, and the partition board is suitable for forming at least part of the boundary of the ventilation opening.

3. The heat dissipation system according to claim 2, wherein The ventilation opening is opened on the partition board, or the ventilation opening is formed between the partition board and the wall of the cabinet body.

4. The heat dissipation system according to claim 2, wherein The at least one partition board includes a first partition board. Along a first direction, opposite sides of the first partition board are connected to opposite two walls of the cabinet body, and there is a non-zero gap between two sides of the first partition board along a second direction and the wall of the cabinet body to form the ventilation opening, and the second direction is perpendicular to the first direction.

5. The heat dissipation system according to claim 4, wherein Along a third direction, the refrigeration module and the components to be cooled are arranged on the same side of the first partition board, and the first direction, the second direction, and the third direction are perpendicular to each other in pairs.

6. The heat dissipation system according to claim 5, characterized in that, The refrigeration module includes multiple layers of refrigeration units arranged at intervals along the third direction, and the gas in the first area enters the second area through the gap between adjacent two layers of the refrigeration units under the drive of the air flow adjustment module.

7. The heat dissipation system according to claim 4, characterized in that, In the first area, the air flow adjustment module is used to drive the gas along the second direction through the refrigeration module.

8. The heat dissipation system according to claim 4, wherein Along a third direction, the refrigeration module and the components to be cooled are arranged on opposite sides of the first partition board, and the first direction, the second direction, and the third direction are perpendicular to each other in pairs.

9. The heat dissipation system according to claim 8, characterized in that, The refrigeration module includes multiple layers of refrigeration units arranged at intervals along the second direction. The gas in the first area passes through the gap between adjacent two layers of the refrigeration units under the drive of the air flow adjustment module. The at least one partition board further includes a second partition board and a third partition board arranged opposite to each other along the second direction. The first partition board, the second partition board, the third partition board, and the wall of the cabinet body jointly enclose the first area, and both the second partition board and the third partition board are parallel to the plane defined by the first direction and the third direction.

10. The heat dissipation system according to claim 9, wherein, The ventilation opening includes an air inlet and an air outlet respectively located on two sides of the first partition board along the second direction. The second partition board is arranged on the side of the refrigeration module close to the air inlet, and the second partition board is connected to the first partition board to guide the gas entering the first area through the air inlet to enter the refrigeration unit from the side far from the first partition board; the third partition board is arranged on the side of the refrigeration module close to the air outlet of the first area, and the third partition board is connected to the wall of the cabinet body in the opposite direction of the third direction to guide the gas to flow into the gap between adjacent two layers of the refrigeration units.

11. The heat dissipation system according to claim 9, wherein, Each layer of the refrigeration unit is plate-shaped and is arranged parallel to the plane defined by the first direction and the third direction.

12. The heat dissipation system according to claim 8, wherein The air vent includes an air outlet for gas to enter the second zone from the first zone, and the at least one partition also includes a fourth partition. The fourth partition and the wall of the cabinet together enclose the second zone. The fourth partition is arranged on a side of the component to be cooled that is close to the air outlet. The fourth partition is connected to the first partition. The fourth partition is parallel to the plane defined by the first direction and the third direction. The fourth partition is used to guide gas to enter the component to be cooled from a side of the component to be cooled that is away from the first zone.

13. The heat dissipation system according to claim 8, characterized in that, The refrigeration module includes multiple layers of refrigeration units spaced apart along the first direction. The gas in the first zone passes through the gap between two adjacent layers of the refrigeration units under the drive of the airflow regulation module. Each layer of the refrigeration units is plate-shaped and is arranged parallel to the plane defined by the second direction and the third direction.

14. The heat dissipation system according to claim 2, wherein The cabinet includes a first wall and a second wall that are oppositely disposed, and a third wall and a fourth wall that are oppositely disposed and connect the first wall and the second wall, and the at least one partition includes: a fifth partition extending obliquely from the first wall toward the second wall and the fourth wall; The sixth partition is connected to the side of the fifth partition away from the first wall and extends toward the fourth wall. The first wall, the fifth partition, the sixth partition and the fourth wall together enclose the first area; wherein, The vents include a first vent formed between the sixth partition plate and the fourth wall, and a second vent opened on the fifth partition plate, and the gas enters the first zone through the first vent and flows into the second zone through the second vent.

15. The heat dissipation system according to claim 14, characterized in that, The airflow regulating module is disposed at at least one of the first vent and the second vent; and / or within the first zone, the refrigeration module is perpendicular to the gas flow direction.

16. The heat dissipation system according to claim 1, wherein The cabinet includes a first split body and a second split body, wherein the first split body is used to define the first area, and the second split body is used to define the second area. The first split body and the second split body are connected through a connecting channel, and the gas flows from the first area through the connecting channel into the second area to dissipate heat for the components to be dissipated.

17. The heat dissipation system according to claim 1, wherein Also includes: An air intake module is communicated with the first zone, and is used for inputting gas into the cabinet to maintain a positive pressure state inside the cabinet.

18. The heat dissipation system according to claim 17, wherein, The gas is helium, neon or hydrogen, and / or The air intake module includes a gas storage tank for storing and introducing the gas into the cabinet.

19. The heat dissipation system according to claim 17, wherein, The air intake module includes: a compression module.

20. The heat dissipation system according to claim 17, characterized in that, The air intake module comprises: Drying module and / or filtration module.

21. The heat dissipation system according to claim 1, characterized in that, An exhaust hole is also provided on the wall of the cabinet.

22. The heat dissipation system according to claim 21, wherein, The exhaust hole is provided with a waterproof and breathable device.

23. The heat dissipation system according to claim 22, wherein, The waterproof breathable device is made of a waterproof breathable material that has been treated with a waterproof coating, and the waterproof breathable material includes sponge or wool felt. The cabinet is connected to the outside world through the waterproof breathable device.

24. The heat dissipation system according to claim 1, wherein, The refrigeration module is a phase-change heat exchanger or a liquid-cooled heat exchanger; and / or the refrigeration module includes two heat exchangers arranged in a V shape.

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