Display panel, preparation method thereof and display device

Abstract

The display panel comprises a substrate, an isolation structure, a light-emitting device, a first encapsulation layer and a filling layer. The isolation structure encloses a plurality of isolation openings. The first encapsulation layer is located on a side of the isolation structure and the light-emitting device away from the substrate. The first encapsulation layer comprises a plurality of encapsulation units. The encapsulation units correspond to the isolation openings respectively to cover the light-emitting device limited by the corresponding isolation openings. Adjacent encapsulation units are arranged at intervals. The filling layer is located on a side of the isolation structure away from the substrate and between adjacent encapsulation units. The edges of the encapsulation units extend to the side of the isolation structure away from the substrate and are spaced apart from the isolation structure to form encapsulation gaps. The filling layer fills the gaps between adjacent encapsulation units and at least part of the encapsulation gaps. In the display panel, the filling layer is used to fill the encapsulation gaps and the gaps between adjacent encapsulation units, thereby improving the bending performance of the display panel.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, in particular, to a display panel, a preparation method thereof and a display device. BACKGROUND

[0002] An organic light-emitting diode (OLED) is an organic thin-film electroluminescent device, which has attracted great attention and been widely used in electronic display products due to its simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast, and flexible display.

[0003] In the preparation process of a conventional display panel, a fine metal mask (FMM) is usually used to realize the patterning of light-emitting pixels. The FMM technology is mature and has rich mass production experience. However, the FMM technology also has the problems of limited precision, high development cost, and long development cycle. The fine metal mask-free technology eliminates the limitations of the conventional OLED process on the size, resolution, and other performance of the display screen, and has the advantages of high performance, full-size, and agile delivery. The patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A disclose the related content of the fine metal mask-free technology, which are referred to for reference.

[0004] However, the packaging structure of the current display product affects the bending performance of the product. SUMMARY

[0005] The first aspect of the present disclosure provides a display panel, which comprises a substrate, an isolation structure, a light-emitting device, a first encapsulation layer, and a filling layer. The isolation structure is located on the substrate, and the isolation structure encloses to form a plurality of isolation openings. The light-emitting device is located on the substrate and corresponds to the isolation openings respectively. At least part of the light-emitting device is located in the corresponding isolation opening. The first encapsulation layer is located on the side of the isolation structure and the light-emitting device away from the substrate. The first encapsulation layer comprises a plurality of encapsulation units. The encapsulation units correspond to the isolation openings respectively to cover the light-emitting device limited by the corresponding isolation openings. The adjacent encapsulation units are arranged at intervals. The filling layer is located on the side of the isolation structure away from the substrate and between the adjacent encapsulation units. The edge of the encapsulation unit extends to the side of the isolation structure away from the substrate and is spaced apart from the isolation structure to form an encapsulation gap. The filling layer fills the gap between the adjacent encapsulation units and at least part of the encapsulation gap.

[0006] In the above scheme, the filling layer is used to fill the packaging gap between the packaging unit and the isolation structure and the gap between adjacent packaging units, which can improve the bending performance of the display panel.

[0007] In one specific implementation of the first aspect of the present disclosure, the distance from the surface of the filling layer to the substrate is greater than the distance from the edge of the packaging unit to the substrate, the orthogonal projection of the edge of the filling layer on the substrate is within the orthogonal projection of the isolation structure on the substrate, and the orthogonal projection of the surface of the filling layer on the substrate and the orthogonal projection of the surface of the filling layer on the substrate cover the orthogonal projection of the edge of the packaging unit on the substrate, respectively.

[0008] In the above scheme, the design of the filling layer increases the contact area between the filling layer and the packaging unit, thereby increasing the bonding strength between the film layers and improving the stability of the display panel.

[0009] In one specific implementation of the first aspect of the present disclosure, the filling layer is an optical adjustment layer or a light shielding layer.

[0010] In one specific implementation of the first aspect of the present disclosure, the packaging unit includes a wrapping part, the wrapping part includes a covering part, an extending part, and a connecting part, the covering part covers the side wall of the isolation structure, the extending part extends to the side of the isolation structure away from the substrate and is arranged spaced apart from the isolation structure, and the connecting part connects the covering part and the extending part, wherein the orthogonal projection of the extending part of adjacent packaging units on the substrate does not overlap each other, and the gap between the extending part and the surface of the isolation structure away from the substrate constitutes the packaging gap.

[0011] In one specific implementation of the first aspect of the present disclosure, the packaging unit further includes a packaging part, wherein the packaging part covers the light emitting device and is connected to the covering part of the wrapping part, and the orthogonal projection of the packaging part on the substrate falls within the orthogonal projection of the isolation opening on the substrate.

[0012] In one specific implementation of the first aspect of the present disclosure, the light emitting device includes a first electrode, a light emitting functional layer, and a second electrode which are sequentially stacked on the substrate, and at least part of the light emitting functional layer of the light emitting device is located in the corresponding isolation opening, wherein the height of the packaging gap in the direction perpendicular to the substrate is less than or equal to the sum of the thicknesses of the light emitting functional layer and the second electrode of the corresponding light emitting device, and the material of the light emitting functional layer and the second electrode is different from that of the filling layer.

[0013] In one specific implementation of the first aspect of the present disclosure, at least part of the light emitting devices include a first light emitting device and a second light emitting device emitting different color light, and the colors of the light emitted by the adjacent light emitting devices are different, the packaging units include at least a first packaging unit and a second packaging unit, the first packaging unit corresponds to the first light emitting device, and the second packaging unit corresponds to the second light emitting device, the packaging gap corresponding to the first packaging unit is different from the packaging gap corresponding to the second packaging unit in the height direction perpendicular to the substrate.

[0014] In one specific implementation of the first aspect of the present disclosure, the isolation structure includes a support portion and a crown portion, the support portion is located between the crown portion and the substrate, and the projection of the surface of the support portion away from the substrate on the substrate is located within the projection of the crown portion on the substrate.

[0015] In one specific implementation of the first aspect of the present disclosure, the isolation structure further includes a bottom portion, the bottom portion is located between the support portion and the substrate, and the projection of the support portion on the substrate is located within the projection of the bottom portion on the substrate.

[0016] In one specific implementation of the first aspect of the present disclosure, the display panel further includes a pixel definition layer located on the substrate, wherein the pixel definition layer includes a pixel opening corresponding to each isolation opening, and at least part of the light emitting device is located in the pixel opening.

[0017] In one specific implementation of the first aspect of the present disclosure, the display panel further includes a second packaging layer and a third packaging layer, wherein the second packaging layer is located on the side of the first packaging layer away from the substrate, the projection of the second packaging layer on the substrate covers the projections of the first packaging layer and the filling layer on the substrate, the third packaging layer is located on the side of the second packaging layer away from the substrate, and the projection of the third packaging layer on the substrate covers the projection of the second packaging layer on the substrate.

[0018] In one specific implementation of the first aspect of the present disclosure, the packaging gap is completely filled by the part of the filling layer.

[0019] The second aspect of the present disclosure provides a preparation method of a display panel, the preparation method includes: providing a substrate; forming an isolation structure on the substrate, wherein the isolation structure encloses to form a plurality of isolation openings; forming light emitting devices and packaging units on the substrate, wherein the light emitting devices correspond to the isolation openings respectively, and at least part of the light emitting devices is located in the corresponding isolation opening, the packaging units correspond to the isolation openings respectively to cover the light emitting devices limited by the corresponding isolation openings, the adjacent packaging units are arranged at intervals, the edges of the packaging units extend to the side of the isolation structure away from the substrate and are spaced apart from the isolation structure to form a packaging gap, and all the packaging units form a first packaging layer; and forming a filling layer based on the packaging units, wherein the filling layer fills at least part of the gap between the adjacent packaging units and the packaging gap formed between the corresponding packaging unit and the isolation structure.

[0020] In the above scheme, the display panel formed by the preparation method has the packaging gap between the packaging units and the isolation structure and the gap between the packaging units covered by the filling layer, so that the bending performance of the prepared display panel is improved.

[0021] In one specific embodiment of the second aspect of the present disclosure, the forming of the light-emitting device and the packaging unit on the substrate comprises: forming a plurality of first electrodes spaced from each other on the substrate before forming the isolation structure on the substrate; depositing a light-emitting material film and a conductive material film, the light-emitting material film and the conductive material film covering the isolation structure and the isolation opening, wherein the portions of the light-emitting material film and the conductive material film in the isolation opening form the light-emitting functional layer and the second electrode, respectively; depositing a packaging material film layer to cover the light-emitting device; forming a first photoresist layer on the packaging material film layer and performing a patterning process on the first photoresist layer to form a first photoresist pattern, the first photoresist pattern covering part of the isolation opening; etching the packaging material film layer, the light-emitting material film and the conductive material film based on the first photoresist pattern, wherein the remaining part of the packaging material film layer forms an initial packaging unit, and the light-emitting functional layer and the second electrode not covered by the initial packaging unit are etched; repeating the above process to form the light-emitting device and the initial packaging unit at the isolation opening where the light-emitting device is not formed, and the adjacent initial packaging units partially overlap on the surface of the same isolation structure away from the substrate; removing at least the overlapping part of the adjacent initial packaging units to obtain a packaging unit, and the adjacent packaging units are arranged at intervals, and all the packaging units constitute a first packaging layer.

[0022] In the above scheme, in the step of preparing the light-emitting device and the packaging unit, the corresponding initial packaging units of the adjacent packaging units overlap each other on the isolation structure, so that the initially formed initial packaging unit protects the previously formed initial packaging unit, avoids the edge of the previously formed initial packaging unit from being affected by the etching process in the formation process of the corresponding light-emitting device of the initially formed initial packaging unit, and improves the packaging effect of the display panel.

[0023] In one specific implementation of the second aspect of the present disclosure, the etching the encapsulation material film layer, the luminescent material film and the conductive material film based on the first photoresist pattern comprises: dry etching the encapsulation material film layer outside the first photoresist pattern based on the first photoresist pattern, the remaining encapsulation material film layer covering part of the luminescent device to form an encapsulation part, the remaining encapsulation material film layer covering part of the side wall of the isolation opening to form a covering part, the covering part being connected to the encapsulation part, the remaining encapsulation material film layer extending on the side of the isolation structure away from the substrate and being spaced apart from the isolation structure to form an initial extension part, the encapsulation material film layer connecting the initial extension part and the covering part to form a connecting part, and the encapsulation part, the covering part, the connecting part and the initial extension part forming an initial encapsulation unit; and wet etching the luminescent material film and the conductive material film outside the initial encapsulation unit and at least part of the luminescent material film and the conductive material film between the initial extension part and the isolation structure based on the initial encapsulation unit to form an initial encapsulation gap between the initial extension part and the isolation structure.

[0024] In the above scheme, the part overlapping between the initial encapsulation units is removed after all the luminescent devices are formed, thereby avoiding the problem that the thickness of the isolation structure is increased by the encapsulation units, which affects the bending performance of the display panel.

[0025] In one specific implementation of the second aspect of the present disclosure, removing at least the overlapping part of the adjacent initial encapsulation units to obtain the encapsulation unit comprises: removing at least the overlapping part of the initial extension parts of the adjacent encapsulation units to form an extension part of the encapsulation unit, the spacing between the extension part and the isolation structure forming an encapsulation gap, the extension length of the orthographic projection of the encapsulation gap on the substrate in the first direction being less than the extension length of the orthographic projection of the initial encapsulation gap on the substrate in the first direction, and the first direction being the direction from the edge of the isolation structure to the center of the isolation structure.

[0026] In one specific implementation of the second aspect of the present disclosure, forming a filling layer based on the encapsulation unit comprises: under a preset condition, applying a filling material with fluidity on the substrate with the encapsulation unit to form a filling layer film, wherein the filling layer film fills at least part of the encapsulation gap and the spacing between the adjacent encapsulation units, and the filling layer film covers the surface of the first encapsulation layer away from the substrate; forming a second photoresist layer on the filling layer film and performing a patterning process on the second photoresist layer to form a second photoresist pattern, the second photoresist pattern covering the spacing between the adjacent encapsulation units and the part of the extension part of the corresponding encapsulation unit close to the spacing between the encapsulation units; and etching the filling layer film based on the second photoresist pattern, wherein the remaining part of the filling layer film is formed into a filling layer.

[0027] In the above scheme, the filling layer is formed in the gap between the packaging units and the packaging gap between the packaging units and the isolation structure, which can improve the bending performance of the display panel, and the filling layer can also be used for stress buffering, reducing the risk of edge cracking and peeling of the packaging unit, and improving the performance of the display panel.

[0028] In one specific embodiment of the second aspect of the present disclosure, the preset conditions include a protective gas environment, a preset pressure of 3000ppm-6000ppm, and ultraviolet light with a wavelength in the range of 315nm-400nm.

[0029] In one specific embodiment of the second aspect of the present disclosure, the preset conditions further include: irradiating the filling layer with ultraviolet light with a wavelength in the range of 230nm-250nm for a preset time, and the preset time is 0.01s-60s. In this way, by controlling the preset conditions in the preparation process of the filling layer, the formation of the filling layer can be controlled, so that the filling layer fills the gap between the packaging units, and at the same time, completely fills the packaging gap between the corresponding packaging unit and the isolation structure or partially fills the packaging gap, improving the applicability of the preparation method.

[0030] The third aspect of the present disclosure provides a display device, which comprises the display panel of any one of the first aspect or the display panel obtained by the preparation method of any one of the second aspect. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 A schematic diagram of a planar structure of a display panel according to an embodiment of the present disclosure is shown.

[0032] Figure 2 A schematic diagram of a planar structure of a display panel according to an embodiment of the present disclosure is shown. Figure 1 An enlarged view of a region S1 of the display panel shown in a design.

[0033] Figure 3 A schematic diagram of a planar structure of a display panel according to an embodiment of the present disclosure is shown. Figure 2 A cross-sectional view along M1-N1 of the display panel shown in a design.

[0034] Figure 4 A cross-sectional view along M1-N1 of the display panel shown in a design. Figure 3 An enlarged view of A of the display panel shown.

[0035] Figure 5 A cross-sectional view along M1-N1 of the display panel shown in another design. Figure 2 A cross-sectional view along M1-N1 of the display panel shown in another design.

[0036] Figure 6 A cross-sectional view along M1-N1 of the display panel shown in another design. Figure 2 A cross-sectional view along M1-N1 of the display panel shown in another design.

[0037] Figure 7A flow chart of a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0038] Figure 8 A flow chart of a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0039] Figure 9 An intermediate product of a display panel obtained by a part of steps of a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0040] Figure 10 An intermediate product of a display panel obtained by a part of steps of a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0041] Figure 11 A flow chart of a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0042] Figure 12 A flow chart of a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0043] Explanation of reference signs:

[0044] 10 - display panel; 11 - display area; 12 - non-display area; 100 - substrate; 200 - light emitting device; 210 - first electrode; 220 - light emitting functional layer; 221 - first functional layer; 222 - light emitting layer; 223 - second functional layer; 230 - second electrode; P1 - first light emitting device; P2 - second light emitting device; P3 - third light emitting device; 300 - isolation structure; 301 - isolation opening; 310 - support part; 320 - crown part; 330 - bottom part; 400 - encapsulation structure; 400a - encapsulation gap; 410 - first encapsulation layer; 411 - encapsulation unit; 411a - first encapsulation unit; 411b - second encapsulation unit; 411c - third encapsulation unit; 412 - edge covering part; 412a - covering part; 412b - extending part; 412c - connecting part; 413 - encapsulation part; 414 - initial encapsulation unit; 414a - initial extending part; 420 - second encapsulation layer; 430 - third encapsulation layer; 500 - filling layer; 600 - pixel defining layer; 601 - pixel opening. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the present specification will be described clearly and completely in combination with the drawings in the embodiments of the present specification. Obviously, the described embodiments are only part of the embodiments of the present specification, rather than all the embodiments. Based on the embodiments in the present specification, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present specification.

[0046] In the present disclosure, by arranging the isolation structure at the gap of the light emitting device, the functional film layer of the adjacent light emitting device is blocked, so that in the evaporation process of the functional film layer, only the full-area evaporation is needed on the display panel, and the functional film layer of each light emitting device does not need to be prepared separately by means of a mask plate. The process does not need to consider the alignment accuracy problem during evaporation, so that the gap of the light emitting device can be designed to be smaller in size, so as to increase the PPI.

[0047] However, in the display panel, each light emitting device adopts a sub-pixel level package, which means that the packaging units of the first packaging layer corresponding to the light emitting devices of each light emitting color need to be etched and formed separately in a very small scale. In such a fine operation, the process control is difficult, and slight external interference or process parameter fluctuation can affect the film forming quality. In the preparation process of the display panel, the packaging units of the first light emitting color formed in the first forming process are prone to damage, and in the subsequent process steps, such as the formation process of the light emitting device of the second light emitting color, the packaging units corresponding to the light emitting device of the first light emitting color are exposed to various environments, which are easily affected by physical impact, chemical pollution and other factors, thereby causing the boundary of the packaging units corresponding to the light emitting device of the first light emitting color to peel off.

[0048] Therefore, in order to avoid damage to the packaging units of the light emitting device of the first light emitting color, the packaging units corresponding to the light emitting devices of different light emitting colors are overlapped with each other, so that two layers of packaging units are overlapped at the position of the same isolation structure. Because the packaging units corresponding to the light emitting device of the second light emitting color at least cover the edges of the packaging units corresponding to the light emitting device of the first light emitting color, the packaging units corresponding to the light emitting device of the first light emitting color are protected, thereby improving the problem of peeling off of the boundary of the packaging units corresponding to the light emitting device of the first light emitting color. This will inevitably increase the film thickness at the position of the isolation structure, and the mutual overlap between different packaging units needs a certain coverage area to ensure the effective protection of the packaging units corresponding to the light emitting device of the first light emitting color, which occupies the space between the adjacent packaging units that can be used to maintain a proper gap, and the gap between the adjacent packaging units naturally becomes narrower.

[0049] The increased film thickness at the isolation structure makes it difficult to deform evenly during bending, unlike a film of normal thickness. The thickened film is subjected to greater stress, making it more susceptible to cracking or even breakage at the bend, thus affecting the bending performance of the entire product. Furthermore, the narrowing of the gaps between adjacent packaging units limits the relative movement and deformation space of the film layers during bending. This prevents the film layers from freely adjusting their position during bending, generating significant internal stress and making it more susceptible to delamination and misalignment between the film layers. This further reduces the bending performance of the entire product, namely the display panel.

[0050] In view of this, at least one embodiment of the present disclosure provides a display panel and a method for preparing the same, and a display device to at least solve the above-mentioned technical problems. The display panel includes a substrate, an isolation structure, a light-emitting device, a first encapsulation layer, and a filling layer. The isolation structure is located on the substrate, the isolation structure encloses and forms a plurality of isolation openings, the light-emitting device is located on the substrate and corresponds to the isolation openings respectively, at least part of the light-emitting device is located in the corresponding isolation opening, the first encapsulation layer is located on the side of the isolation structure and the light-emitting device away from the substrate, the first encapsulation layer includes a plurality of encapsulation units, the encapsulation units correspond to the isolation openings respectively to cover the light-emitting devices limited by the corresponding isolation openings, adjacent encapsulation units are arranged at intervals, the filling layer is located on the side of the isolation structure away from the substrate and between adjacent encapsulation units, the edges of the encapsulation units extend to the side of the isolation structure away from the substrate and are spaced from the isolation structure to form an encapsulation gap, and the filling layer fills the gap between adjacent encapsulation units and at least part of the encapsulation gap.

[0051] In this way, the filling layer formed in the display panel fills part or all of the packaging gap between the packaging unit and the isolation structure and the gap between the packaging units, thereby improving the bending performance of the display panel and reducing the risk of stress concentration in the packaging gap between the packaging unit and the isolation structure when the display panel is bent, and the risk of film cracks or peeling affecting the packaging effect, thereby improving the product quality of the display panel.

[0052] The structure of the display panel according to at least one embodiment of the present disclosure is described in detail below with reference to the accompanying drawings. Furthermore, in these drawings, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationships of the relevant structures in the display panel. In this spatial rectangular coordinate system, the X-axis and Y-axis are parallel to the surface of the substrate, and the Z-axis is perpendicular to the surface of the substrate.

[0053] like Figure 1 、 Figure 2 、 Figure 3As shown, the planar region of the display panel 10 can be divided into a display area 11 and a non-display area 12 located at least one side of the display area 11, and the display area 11 can be arranged with sub-pixels (may be referred to as sub-pixels, etc.), such as P1, P2, P3 sub-pixels, the physical structure of the sub-pixel can be the light emitting device 200 in the following embodiments, and adjacent sub-pixels with different light emitting colors constitute a pixel (may be referred to as a pixel unit, a large pixel, etc.), and the arrangement density of the pixel in the display area 11 represents the pixel density PPI.

[0054] The physical structure of the display panel 10 includes a substrate 100, a light emitting device 200, an isolation structure 300, a first encapsulation layer 410, and a filling layer 500. The isolation structure 300 is located on the substrate 100, and at least part of the isolation structure 300 is located in the display area 11, and the isolation structure 300 encloses a plurality of isolation openings 301 in the display area 11, and the light emitting device 200 is located on the substrate 100 and corresponds to the isolation opening 301 respectively, and at least part of the light emitting device 200 is located in the corresponding isolation opening 301, and the first encapsulation layer 410 is located on the side of the isolation structure 300 and the light emitting device 200 away from the substrate 100, and the first encapsulation layer 410 includes a plurality of encapsulation units 411, and the encapsulation unit 411 corresponds to the isolation opening 301 respectively to cover the light emitting device 200 limited by the corresponding isolation opening 301, and the adjacent encapsulation units 411 are arranged with a spacing, and the filling layer 500 is located on the side of the isolation structure 300 away from the substrate 100 and between the adjacent encapsulation units 411, and the edge of the encapsulation unit 411 extends to the side of the isolation structure 300 away from the substrate 100 and is spaced from the isolation structure 300 to form an encapsulation gap 400a, and the filling layer 500 fills the gap between the adjacent encapsulation units 411 and at least part of the encapsulation gap 400a, such as all the encapsulation gap 400a.

[0055] In the display panel 10, the filling layer 500 fills the encapsulation gap 400a between the encapsulation unit 411 and the corresponding isolation structure 300 and the gap between the adjacent encapsulation units 411, so as to improve the problem of affecting the bending performance of the display panel 10 due to the encapsulation gap 400a and the gap between the encapsulation units 411. For example, in the case where the light emitting device 200 is divided into multiple types of light emitting devices 200 emitting different colors of light, the light emitting devices 200 emitting different colors of light are independently manufactured, but the film layer (evaporation film layer, such as light emitting functional layer 220, etc.) in each light emitting device 200 is evaporated on the display panel 10.

[0056] For example, the light emitting device 200 is classified into the light emitting device 200 of the first light emitting device P1, the second light emitting device P2 and the third light emitting device P3 emitting different color light, and in the manufacturing process, the light emitting device 200 is sequentially manufactured, in the manufacturing of the first light emitting device P1, the first light emitting device P1 is formed in each isolation opening 301, and the first encapsulation layer 410 is formed to cover all the isolation openings 301, then the second electrode 230 and the light emitting functional layer 220 of the first light emitting device P1 in part of the isolation openings 301 (used to form the second light emitting device P2 and the third light emitting device P3 in the final product) are removed, and the encapsulation structure 400 with an independent structure, i.e. the encapsulation unit 411 corresponding to the first light emitting device P1 is formed, and based on this mode, the second light emitting device P2 and the third light emitting device P3 are sequentially manufactured, and finally the first encapsulation layer 410 composed of all the encapsulation units 411 corresponding to the light emitting device 200 as shown in Figure 3

[0057] The process can refer to the related description in the related embodiments below, which will not be repeated here. In the above process, for example, the etching process is used in the formation process of the second light emitting device P2 and the third light emitting device P3, which will have an adverse effect on the encapsulation unit 411 corresponding to the first light emitting device P1, and peeling is prone to occur, while the edge of the encapsulation unit 411 corresponding to the second light emitting device P2 covers part of the encapsulation unit 411 corresponding to the first light emitting device P1, which is protected and can avoid the influence of the subsequent formation of the second light emitting device P2 and the third light emitting device P3 on the encapsulation unit 411 corresponding to the first light emitting device P1, and after the preparation of all the light emitting devices 200 is completed, the overlapping part between the adjacent encapsulation units 411 is removed, and the filling layer 500 is used to fill the encapsulation gap 400a between the encapsulation unit 411 and the isolation structure 300 and the gap between the encapsulation units 411, which can be specifically referred to the introduction of the preparation method below, so as to protect the encapsulation unit 411 while improving the bending performance of the display panel 10.

[0058] Based on the above embodiments, the specific design scheme of the filling layer 500 is introduced in the embodiments of the present disclosure, and the content is as follows.

[0059] In an embodiment of the present disclosure, as Figure 3 and Figure 4 ​As shown, the distance from the surface of the substrate 100 to the filling layer 500 is greater than the distance from the surface of the substrate 100 to the edge of the packaging unit 411, the orthographic projection of the edge of the filling layer 500 on the substrate 100 is within the orthographic projection of the isolation structure 300 on the substrate 100, and the orthographic projections of the surface of the filling layer 500 away from the substrate 100 and the surface of the filling layer 500 close to the substrate 100 on the substrate 100 cover the orthographic projection of the edge of the packaging unit 411 on the substrate 100, respectively. In this way, the structural design of the filling layer 500 not only increases the bonding strength between the filling layer 500 and the packaging unit 411, but also does not affect the packaging effect of the packaging unit 411, and at the same time, reduces the processing difficulty of the filling layer 500 and saves the production cost of the display panel 10.

[0060] For example, the upper edge of the surface of the filling layer 500 away from the isolation structure 300 covers at least part of the edge of the surface of the isolation structure 300, thereby increasing the contact area between the filling layer 500 and the packaging unit 411, improving the bonding strength therebetween, and improving the structural strength of the display panel 10. At the same time, the lower edge of the surface of the filling layer 500 close to the isolation structure 300 is filled in the packaging gap 400a between the packaging unit 411 and the isolation structure 300, and does not overflow onto the side wall of the isolation structure 300 and outside the edge of the packaging unit 411, so that the design of the filling layer 500 does not affect the packaging effect of the packaging unit 411 of the display panel 10, and improves the performance stability of the display panel 10.

[0061] In at least one embodiment of the present disclosure, the filling layer 500 is an organic filling layer 500. The organic filling layer 500 formed of an organic material generally has a certain flexibility and can adapt to the deformation of the display panel 10 to a certain extent during bending, folding, etc. It can also act as a buffer layer to absorb external impact and stress and reduce damage to the internal structure, thereby improving the reliability and durability of the display panel 10. At the same time, the process of preparing the organic filling layer 500 in the display panel 10 is relatively mature, thereby improving the production efficiency and product quality of the display panel 10.

[0062] In at least one embodiment of the present disclosure, the filling layer 500 is an optical adjustment layer. For example, the optical adjustment layer can have a microlens structure, or a scattering structure (e.g., particles or structures with scattering properties) or a sub-film layer structure including different refractive indexes, so that the organic filling layer 500 can be used to improve the light-emitting efficiency and contrast of the display panel 10 while playing a filling and supporting role without affecting the propagation of light emitted by the light-emitting layer of the display panel 10.

[0063] In at least one embodiment of the present disclosure, the filling layer 500 is a light shielding layer. In this way, the light shielding layer can effectively absorb and block ambient light from outside the display area, reduce reflection and scattering of ambient light inside the panel, and at the same time, in the case where the adjacent encapsulation units 411 correspond to light emitting devices 200 of different colors of outgoing light, the light shielding layer can also accurately define the boundaries of each sub-pixel, prevent light emitted by different color sub-pixels from interfering with each other, and avoid the occurrence of pixel color mixing phenomenon. Therefore, setting the organic filling layer 500 as a light shielding layer can also improve the display effect of the display panel 10.

[0064] It should be noted that the display panel 10 in the embodiments of the present disclosure is not limited to the above structure. For example, the non-display area 12 can be a frame of the display panel 10, but a bending area can be arranged in the non-display area 12, so that at least part of the non-display area 12 is bent to the back of the display panel 10, so that the display panel 10 presents a narrow frame or no frame when in use. For example, the surface of the filling layer 500 away from the isolation structure 300 can be on the same horizontal plane as the surface of the encapsulation unit 411 away from the isolation structure 300. The above can be designed according to actual needs, and will not be described here.

[0065] In addition to the design of the filling layer 500, the structure of the encapsulation unit 411 is also introduced in the embodiments of the present disclosure, as follows.

[0066] In one embodiment of the present disclosure, as shown in Figure 4 The encapsulation unit 411 includes a wrapping part 412, and the wrapping part 412 includes a covering part 412a, an extending part 412b, and a connecting part 412c. The covering part 412a covers the side wall of the isolation structure 300, the extending part 412b extends to the side of the isolation structure 300 away from the substrate 100 and is arranged spaced apart from the isolation structure 300, and the connecting part 412c connects the covering part 412a and the extending part 412b. The normal projections of the extending parts 412b of adjacent encapsulation units 411 on the substrate 100 do not overlap each other, and the gap between the extending part 412b and the surface of the isolation structure 300 away from the substrate 100 constitutes an encapsulation gap 400a, that is, the filling layer 500 fills the encapsulation gap 400a between the extending part 412b of the encapsulation unit 411 and the isolation structure 300 and the gap between the extending parts 412b of adjacent encapsulation units 411.

[0067] In at least one embodiment of the present disclosure, the gap between the extending parts 412b of adjacent encapsulation units 411 is greater than or equal to 4 μm and less than or equal to 18 μm.

[0068] For example, the gap between the extensions 412b of the adjacent packaging units 411 is any one of 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm.

[0069] In at least one embodiment of the present disclosure, the length of the orthogonal projection of the packaging gap 400a on the substrate 100 is greater than or equal to 1 μm and less than or equal to 2 μm, and the length of the orthogonal projection of the packaging gap 400a on the substrate 100 refers to the length in the direction from the edge of the isolation structure 300 to the center of the isolation structure 300.

[0070] For example, the length of the orthogonal projection of the packaging gap 400a on the substrate 100 is any one of 1 μm, 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, 1.6 μm, 1.7 μm, 1.8 μm, 1.9 μm, 2.0 μm.

[0071] The size of the gap between the adjacent packaging units 411 and the packaging gap 400a between the packaging unit 411 and the corresponding isolation structure 300 in the embodiments of the present disclosure is not limited to the above examples, and varies according to the parameters of the corresponding process in the preparation process of the display panel 10 (which can be specifically referred to in the following embodiments), and will not be described here.

[0072] In at least one embodiment of the present disclosure, as shown in Figure 4 The packaging unit 411 further includes a packaging portion 413, the packaging portion 413 covers the light emitting device 200 and is connected to the covering portion 412a of the edge covering portion 412, the packaging portion 413 and the edge covering portion 412 jointly constitute the packaging unit 411, and the orthogonal projection of the packaging portion 413 on the substrate 100 falls within the orthogonal projection of the isolation opening 301 on the substrate 100, that is, the packaging portion 413 completely covers the light emitting device 200 in the isolation opening 301.

[0073] In one embodiment of the present disclosure, as shown in Figure 3 The light emitting device 200 includes a first electrode 210, a light emitting functional layer 220 and a second electrode 230 which are sequentially stacked on the substrate 100, and at least part of the light emitting functional layer 220 of the light emitting device 200 is located in the corresponding isolation opening 301, and the height of the packaging gap 400a in the direction perpendicular to the substrate 100 is less than or equal to the sum of the thicknesses of the light emitting functional layer 220 and the second electrode 230 of the corresponding light emitting device 200. In the formation process of the light emitting device 200, the etching process parameters of the corresponding light emitting functional layer 220 are controlled, and part or all of the light emitting functional layer 220 and the second electrode 230 in the packaging gap 400a are removed, so as to form the height of the packaging gap 400a in the direction perpendicular to the substrate 100.

[0074] In at least one embodiment of the present disclosure, either of the light-emitting functional layer 220 and the second electrode 230 is different from the material of the filling layer 500, that is, none of the film layers included by either of the light-emitting functional layer 220 and the second electrode 230 is the same layer and the same material as the filling layer 500.

[0075] For example, as shown in FIG. 2, the light-emitting functional layer 220 can further include a first functional layer 221, a light-emitting layer 222, and a second functional layer 223, which are sequentially stacked on the first electrode 210. The first functional layer 221 can include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second functional layer 223 can include an electron injection layer, an electron transport layer, a hole blocking layer, etc. It should be noted that, since the carriers (holes, electrons) mainly pass through the first functional layer 221 to cause crosstalk between adjacent light-emitting devices 200, the isolation structure 300 needs to be arranged such that the first functional layers 221 of the respective light-emitting devices 200 are electrically disconnected from each other. Figure 3

[0076] In at least one embodiment of the present disclosure, the second electrode 230 is electrically connected to the isolation structure 300, that is, the second electrodes 230 of the plurality of light-emitting devices 200 are connected to each other through the isolation structure 300 to serve as a common electrode, thereby alleviating the problem of voltage drop generated when driving the second electrode 230.

[0077] In one embodiment of the present disclosure, as shown in FIG. 4, at least part of the light-emitting devices 200 include a first light-emitting device P1 and a second light-emitting device P2 emitting different colors of light, and adjacent light-emitting devices 200 emit light of different colors, and the packaging unit 411 includes at least a first packaging unit 411a and a second packaging unit 411b, the first packaging unit 411a corresponds to the first light-emitting device P1, the second packaging unit 411b corresponds to the second light-emitting device P2, and the packaging gap 400a corresponding to the first packaging unit 411a is different in height from the packaging gap 400a corresponding to the second packaging unit 411b in a direction perpendicular to the substrate 100. Figure 5

[0078] ​​For example, the first packaging unit 411a and the second packaging unit 411b adjacent to each other are located at different sides of the same isolation structure 300, on the surface of the isolation structure 300 away from the substrate 100, the extension part 412b of the first packaging unit 411a and the extension part 412b of the second packaging unit 411b adjacent to each other are arranged at intervals, and the gap between the extension part 412b of the first packaging unit 411a and the isolation structure 300 constitutes the packaging gap 400a corresponding to the first packaging unit 411a, the height of the packaging gap 400a corresponding to the first packaging unit 411a is less than or equal to the thickness of the light-emitting functional layer 220 and the second electrode 230 of the first light-emitting device P1 corresponding to the first packaging unit 411a, and the gap between the extension part 412b of the second packaging unit 411b and the isolation structure 300 constitutes the packaging gap 400a corresponding to the second packaging unit 411b, the height of the packaging gap 400a corresponding to the second packaging unit 411b is less than or equal to the thickness of the light-emitting functional layer 220 and the second electrode 230 of the second light-emitting device P2 corresponding to the second packaging unit 411b, and in order to achieve better display effect in the display panel 10, the light-emitting functional layer 220 corresponding to the light-emitting devices 200 of different light-emitting colors, such as the first light-emitting device P1 and the second light-emitting device P2, has different thicknesses to improve the performance of the corresponding light-emitting devices 200, such as light-emitting efficiency, brightness, etc., and therefore, the packaging gap 400a corresponding to the first packaging unit 411a and the packaging gap 400a corresponding to the second packaging unit 411b are different in height perpendicular to the substrate 100.

[0079] The thickness of the light-emitting functional layer 220 corresponding to the first light-emitting device P1 and the second light-emitting device P2 of different light-emitting colors is not specifically limited in the embodiments of the present disclosure, which can be specifically designed according to product requirements, and will not be described here.

[0080] In at least one embodiment of the present disclosure, as Figure 5As shown, the light emitting device 200 is classified into a first light emitting device P1, a second light emitting device P2 and a third light emitting device P3 emitting different color lights, and the light emitting colors of the first light emitting device P1, the second light emitting device P2 and the third light emitting device P3 are different. The first packaging unit 411a corresponding to the first light emitting device P1 is arranged apart from the second packaging unit 411b corresponding to the second light emitting device P2 with respect to one isolation structure 300, and the second packaging unit 411b corresponding to the second light emitting device P2 is arranged apart from the third packaging unit 411c corresponding to the third light emitting device P3 with respect to another isolation structure 300, and the one isolation structure 300 and the another isolation structure 300 in the above jointly limit one isolation opening 301. The filling layer 500 corresponding between the adjacent first packaging unit 411a and the second packaging unit 411b not only fills the gap between the first packaging unit 411a and the second packaging unit 411b, but also fills different packaging gaps 400a formed between the first packaging unit 411a and the second packaging unit 411b and the corresponding isolation structure 300, and the filling layer 500 corresponding between the adjacent second packaging unit 411b and the third packaging unit 411c not only fills the gap between the second packaging unit 411b and the third packaging unit 411c, but also fills different packaging gaps 400a formed between the second packaging unit 411b and the third packaging unit 411c and the corresponding isolation structure 300. In addition, the filling layers 500 corresponding to different adjacent packaging units 411 are prepared by the same process.

[0081] In at least one embodiment of the present disclosure, the light emitting device 200 includes a red light emitting device, a blue light emitting device and a green light emitting device. For example, the first light emitting device P1 is a red light emitting device, the second light emitting device P2 is a blue light emitting device, and the third light emitting device P3 is a green light emitting device.

[0082] In one embodiment of the present disclosure, as shown in Figure 3 and Figure 5 As shown, the isolation structure 300 includes a support part 310 and a crown part 320, the support part 310 is located between the crown part 320 and the substrate 100, and the surface of the support part 310 away from the substrate 100 is projected onto the substrate 100 within the projection of the crown part 320 on the substrate 100. In this way, the width of the crown part 320 is greater than the width of the support part 310, thereby improving the isolation effect of the isolation structure 300.

[0083] In at least one embodiment of the present disclosure, the support portion 310 is a conductive structure, and the second electrode 230 is connected with the side surface of the support portion 310. The support portion 310 is arranged without considering light transmission, so that the support portion 310 can have a larger design thickness (greater than the second electrode 230), that is, the sheet resistance of the support portion 310 is less than the sheet resistance of the second electrode 230. In this scheme, the support portion 310 and the second electrode 230 of the light emitting device 200 can be connected to each other to be at the same potential, so as to reduce the voltage drop generated on the second electrode 230.

[0084] In at least one embodiment of the present disclosure, as shown in Figure 6 , the isolation structure 300 further includes a bottom portion 330, the bottom portion 330 is located between the support portion 310 and the substrate 100, and the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the bottom portion 330 on the substrate 100.

[0085] In at least one embodiment of the present disclosure, the bottom portion 330 is a conductive structure, and the second electrode 230 is electrically connected with the part of the surface of the bottom portion 330 away from the substrate 100 and not covered by the support portion 310. Compared with the sidewall of the support portion 310, the second electrode 230 is more likely to be deposited on the surface of the bottom portion 330 away from the substrate 100, so as to reduce the impedance at the connection between the second electrode 230 and the isolation structure 300.

[0086] In at least one embodiment of the present disclosure, the orthographic projection of the bottom portion 330 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100.

[0087] In at least one embodiment of the present disclosure, as shown in Figure 3 , Figure 5 and Figure 6 , the display panel 10 further includes a pixel definition layer 600 located on the substrate 100, the pixel definition layer 600 includes pixel openings 601 corresponding to the isolation openings 301 one by one, and at least part of the light emitting device 200 is located in the pixel openings 601.

[0088] In at least one embodiment of the present disclosure, the pixel definition layer 600 is an inorganic film layer. In the process of preparing the light emitting device 200 based on the isolation structure 300, the pixel definition layer 600 does not need to have a high thickness to accommodate the light emitting device 200, thereby facilitating the lightweight design of the display panel 10; in addition, as the inorganic film layer, the pixel definition layer 600 can have a high bonding strength with the isolation structure 300 and the first electrode 210, so as to reduce the risk of the isolation structure 300 and the first electrode 210 falling off; in addition, the inorganic film layer has high density and good barrier effect to water and gas, so as to encapsulate and protect the first lap joint portion of the lap joint terminal.

[0089] In at least one embodiment of the present disclosure, the isolation structure 300 is located on the side of the pixel definition layer 600 away from the substrate 100.

[0090] In one embodiment of the present disclosure, as shown in Figure 5 , the display panel 10 further comprises a second encapsulation layer 420, the second encapsulation layer 420 is located on the side of the first encapsulation layer 410 away from the substrate 100, and the orthographic projection of the second encapsulation layer 420 on the substrate 100 covers the first encapsulation layer 410 and the organic filling layer 500.

[0091] In at least one embodiment of the present disclosure, the second encapsulation layer 420 is an organic film layer.

[0092] In one embodiment of the present disclosure, the display panel 10 further comprises a third encapsulation layer 430, the third encapsulation layer 430 is located on the side of the second encapsulation layer 420 away from the substrate 100, and the orthographic projection of the third encapsulation layer 430 on the substrate 100 covers the orthographic projection of the second encapsulation layer 420 on the substrate 100. Figure 5

[0093] In at least one embodiment of the present disclosure, the third encapsulation layer 430 is an inorganic film layer.

[0094] In one embodiment of the present disclosure, as shown in Figure 3 , as shown in 4, Figure 5 and Figure 6 , the encapsulation gap 400a is completely filled by the part of the filling layer 500.

[0095] The present disclosure does not introduce the scheme that the part of the encapsulation gap 400a is filled by the part of the filling layer 500. According to the actual production conditions and product requirements, the forming process of the filling layer 500 can be controlled to make the part of the filling layer 500 not completely fill the encapsulation gap 400a between the encapsulation unit 411 and the isolation structure 300. This can be designed according to actual requirements, and will not be repeated here.

[0096] ​The display panel manufacturing method comprises the following steps: providing a substrate; forming an isolation structure on the substrate, wherein the isolation structure encloses a plurality of isolation openings; forming light emitting devices and encapsulation units on the substrate, wherein the light emitting devices correspond to the isolation openings respectively, at least part of the light emitting devices are located in the corresponding isolation openings, the encapsulation units correspond to the isolation openings respectively to cover the light emitting devices limited by the corresponding isolation openings, the adjacent encapsulation units are arranged at intervals, edges of the encapsulation units extend to a side of the isolation structure away from the substrate and are spaced apart from the isolation structure to form encapsulation gaps, and all the encapsulation units form a first encapsulation layer; and forming a filling layer based on the encapsulation units, wherein the filling layer fills the gaps between the adjacent encapsulation units and at least part of the encapsulation gaps formed between the corresponding encapsulation units and the isolation structure. In this way, in the manufacturing method, the filling layer is formed between the adjacent encapsulation units during the manufacturing process, the filling layer not only fills the encapsulation gaps between the encapsulation units and the isolation structure, but also fills the gaps between the encapsulation units, thereby improving the bending performance of the display panel.

[0097] At least one embodiment of the present disclosure provides a display panel manufacturing method as described above, which can comprise steps S100 to S400 as shown in Figure 7 The steps S100 to S400 are specifically as follows.

[0098] S100, providing a substrate.

[0099] S200, forming an isolation structure on the substrate, wherein the isolation structure encloses a plurality of isolation openings.

[0100] S300, forming light emitting devices and encapsulation units on the substrate, wherein the light emitting devices correspond to the isolation openings respectively, at least part of the light emitting devices are located in the corresponding isolation openings, the encapsulation units correspond to the isolation openings respectively to cover the light emitting devices limited by the corresponding isolation openings, the adjacent encapsulation units are arranged at intervals, edges of the encapsulation units extend to a side of the isolation structure away from the substrate and are spaced apart from the isolation structure to form encapsulation gaps, and all the encapsulation units form a first encapsulation layer.

[0101] S400, forming a filling layer based on the encapsulation units, wherein the filling layer fills the gaps between the adjacent encapsulation units and at least part of the encapsulation gaps formed between the corresponding encapsulation units and the isolation structure.

[0102] The display panel in the above steps S100 to S400 about the substrate and the isolation structure can refer to the above embodiments, which will not be repeated here.

[0103] In at least one embodiment of the present disclosure, step S300 of forming light emitting devices and encapsulation units on the substrate comprises steps S310 to S370 as shown in Figure 8 The steps S310 to S370 are specifically as follows.

[0104] S310 , before forming an isolation structure on a substrate, forming a plurality of first electrodes spaced apart from each other on the substrate.

[0105] S320, depositing a light-emitting material film and a conductive material film, the light-emitting material film and the conductive material film cover the isolation structure and the isolation opening, wherein the portions of the light-emitting material film and the conductive material film located in the isolation opening form a light-emitting functional layer and a second electrode, respectively.

[0106] S330, depositing a film layer of packaging material to cover the light-emitting device.

[0107] S340 , forming a first photoresist layer on the packaging material film layer, and performing a patterning process on the first photoresist layer to form a first photoresist pattern, wherein the first photoresist pattern covers a portion of the isolation opening.

[0108] S350, etching the packaging material film layer, the light-emitting material film and the conductive material film based on the first photoresist pattern, wherein the remaining portion of the packaging material film layer forms an initial packaging unit, and the light-emitting functional layer and the second electrode not covered by the initial packaging unit are etched.

[0109] S360, repeating the above process to form light-emitting devices and initial packaging units at the isolation openings where no light-emitting devices are formed, and adjacent initial packaging units partially overlap on the surface of the same isolation structure away from the substrate.

[0110] For example, Figure 5 and Figure 9 As shown, taking the display panel 10 as an example in which the first light-emitting device P1, the first packaging unit 411a corresponding to the first light-emitting device P1, the second light-emitting device P2, the second packaging unit 411b corresponding to the second light-emitting device P2, and the third light-emitting device P3, the third packaging unit 411c corresponding to the third light-emitting device P3 are sequentially formed, the structure of the intermediate product of the display panel 10 obtained according to the above steps S310 to S360 is as follows: Figure 9As shown, the initial extension 414a of the corresponding initial packaging unit 414 of the adjacent first packaging unit 411a and the second packaging unit 411b partially overlaps on the surface of the substrate 100 away from the surface of the substrate 100 in this step, so that the initial packaging unit 414 corresponding to the first light emitting device P1 formed first is protected by the initial packaging unit 414 corresponding to the second light emitting device P2 formed later, so that the edge of the initial packaging unit 414 corresponding to the first light emitting device P1 is protected during the etching process of the second light emitting device P2, thereby improving the packaging effect of the packaging unit 411 of the display panel 10. Similarly, the initial packaging unit 414 corresponding to the third light emitting device P3 protects the initial packaging unit 414 corresponding to the second light emitting device P2. Specifically, the initial extension 414a of the initial packaging unit 414 corresponding to the third light emitting device P3 covers part of the initial extension 414a of the initial packaging unit 414 corresponding to the second light emitting device P2, thereby avoiding the etching process in the preparation process of the third light emitting device P3 from adversely affecting the edge of the initial extension 414a of the initial packaging unit 414 corresponding to the second light emitting device P2. At the same time, the initial extension 414a corresponding to different initial packaging units 414 and the corresponding isolation structure 300 form a packaging gap 400a, which is formed during the etching process of forming the corresponding light emitting device 200.

[0111] S370, at least remove the overlapping part of the adjacent initial packaging unit to obtain a packaging unit, the adjacent packaging units are arranged at intervals, and all the packaging units constitute a first packaging layer.

[0112] For example, as Figure 10 As shown in the intermediate product of the display panel 10 shown in Figure 9 After removing the overlapping parts of the initial packaging unit 414 of the first light emitting device P1 and the initial packaging unit 414 of the second light emitting device P2, and the overlapping parts of the initial packaging unit 414 of the second light emitting device P2 and the initial packaging unit 414 of the third light emitting device P3, i.e. the part of the initial extension 414a of the corresponding initial packaging unit 414, the first packaging unit 411a, the second packaging unit 411b and the third packaging unit 411c are obtained, and the extension 412b of the first packaging unit 411a and the extension 412b of the adjacent second packaging unit 411b are arranged at intervals, the extension 412b of the second packaging unit 411b and the extension 412b of the adjacent third packaging unit 411c are arranged at intervals. The above extension 412b is the part remaining after the removal of the initial extension 414a, and the extension 412b and the corresponding isolation structure 300 form different packaging gaps 400a.

[0113] Therefore, in the preparation method of the display panel including the above steps S310 to S370, the light emitting devices and the packaging units are prepared according to the above steps, and the packaging units formed later in the process of forming the light emitting devices protect the initial packaging units formed earlier, for example, the initial packaging unit corresponding to the second light emitting device covers the edge of the initial packaging unit corresponding to the first light emitting device to protect the initial packaging unit corresponding to the first light emitting device, and the initial packaging unit corresponding to the third light emitting device covers the edge of the initial packaging unit corresponding to the second light emitting device to protect the initial packaging unit corresponding to the second light emitting device, so that the effectiveness of the packaging units is improved, and the packaging units are prevented from being affected by the subsequent etching process. Then, in step S370, the overlapping parts of the initial packaging units are removed, so that gaps are formed between the adjacent packaging units and packaging gaps are formed between the packaging units and the corresponding isolation structures, so that the packaging units, especially the first formed packaging unit, are protected, and the problem of increasing the thickness of the isolation structure due to the overlapping between the packaging units, affecting the bending ability, is reduced.

[0114] In at least one embodiment of the present disclosure, step S350 etches the packaging material film layer, the luminescent material film and the conductive material film based on the first photoresist pattern, including steps S351 to S352 as shown in the figure, specifically as follows. Figure 11

[0115] S351, based on the first photoresist pattern, dry etching is performed to remove the packaging material film layer outside the first photoresist pattern, the remaining packaging material film layer covers part of the light emitting device to form a packaging part, the remaining packaging material film layer covers part of the side wall of the isolation opening to form a covering part, and the covering part is connected with the packaging part, the remaining packaging material film layer extending on the side of the isolation structure away from the substrate and spaced apart from the isolation structure forms an initial extension part, and the part of the packaging material film layer connecting the initial extension part and the covering part forms a connecting part, and the packaging part, the covering part, the connecting part and the initial extension part form an initial packaging unit.

[0116] S352, based on the initial packaging unit, wet etching is performed to remove the luminescent material film and the conductive material film outside the initial packaging unit, and at least part of the luminescent material film and the conductive material film between the initial extension part and the isolation structure, to form an initial packaging gap between the initial extension part and the isolation structure.

[0117] ​In at least one embodiment of the present disclosure, step S370 removes at least the overlapping portions of adjacent initial packaging units to obtain a packaging unit, including: removing at least the overlapping portions of the initial extension portions of adjacent packaging units to form an extension portion of the packaging unit, the interval between the extension portion and the isolation structure constitutes a packaging gap, the extension length of the orthographic projection of the packaging gap on the substrate in the first direction is less than the extension length of the orthographic projection of the initial packaging gap on the substrate in the first direction, and the first direction is the direction from the edge of the isolation structure to the center of the isolation structure.

[0118] In at least one embodiment of the present disclosure, step S400 forms a filling layer based on the packaging unit, including: Figure 12 Steps S410 to S430 are specifically as follows.

[0119] S410, under preset conditions, coating a filling material with fluidity on a substrate having packaging units formed thereon to form a filling layer film, wherein the filling layer film fills at least a portion of the packaging gap and the gaps between adjacent packaging units, and the filling layer film covers the surface of the first packaging layer away from the substrate.

[0120] S420, forming a second photoresist layer on the filling layer, and patterning the second photoresist layer to form a second photoresist pattern, wherein the second photoresist pattern covers the gaps between adjacent packaging units and portions of the extensions of the corresponding packaging units close to the gaps between the packaging units.

[0121] S430 , etching the filling layer based on the second photoresist pattern, wherein the remaining portion of the filling layer forms a filling layer.

[0122] For example, the specific structure of the filling layer obtained in step S430 can be referred to the above embodiments and will not be described in detail here.

[0123] In at least one embodiment of the present disclosure, the preset conditions include a protective gas environment, a preset pressure of 3000 ppm to 6000 ppm, and ultraviolet rays with a wavelength in the range of 315 nm to 400 nm.

[0124] In at least one embodiment of the present disclosure, the preset conditions further include: irradiating with ultraviolet light having a wavelength in the range of 230 nm to 250 nm for a preset time.

[0125] In at least one embodiment of the present disclosure, the preset time is 0.01s to 60s.

[0126] For example, according to the filling condition of the filling layer, under the condition of a protective gas environment, a preset pressure of 3000 ppm to 6000 ppm, and ultraviolet rays with a wavelength in the range of 315 nm to 400 nm, ultraviolet rays with a wavelength in the range of 230 nm to 250 nm continue to be irradiated to a preset time. In addition, regarding the specific selection of ultraviolet wavelength and irradiation time, the specific pressure parameters and other conditions can be designed according to actual needs, and will not be repeated here.

[0127] In at least one embodiment of the present disclosure, the protective gas environment is a pure protective gas environment, for example, the protective gas environment can be a nitrogen environment, an argon environment, a carbon dioxide environment, etc.

[0128] In at least one embodiment of the present disclosure, the filling layer is an organic filling layer. In at least one embodiment of the present disclosure, the filling layer is an optical adjustment layer. In at least one embodiment of the present disclosure, the filling layer is a light shielding layer. The introduction of the filling layer can refer to the above embodiments, and will not be repeated here.

[0129] In at least one embodiment of the present disclosure, the preparation method further comprises: before forming the isolation structure, and after forming the first electrode, depositing a pixel defining material film layer; and performing a patterning process on the pixel defining material film layer to form a pixel defining layer, wherein a pixel opening is formed in the pixel defining layer, and the pixel opening corresponds to the isolation opening one by one to expose at least part of the first electrode.

[0130] In at least one embodiment of the present disclosure, the preparation method further comprises: forming an organic encapsulating material on the side of the first encapsulating layer away from the substrate to form a second encapsulating layer, wherein the second encapsulating layer covers the first encapsulating layer and the filling layer. The specific structure of the display panel prepared by the method can refer to the related description in the foregoing embodiments, and will not be repeated here.

[0131] In at least one embodiment of the present disclosure, the second encapsulating layer is an organic film layer. The specific structure of the display panel prepared in the method can refer to the related description in the foregoing embodiments, and will not be repeated here.

[0132] In at least one embodiment of the present disclosure, the forming method of the second encapsulating layer comprises inkjet printing. For example, the second encapsulating layer is an organic film layer, and in the process of using inkjet printing, the material flow is flat, so that the second encapsulating layer has a flattening effect, thereby improving the quality of the third encapsulating layer and other structures formed subsequently. The specific arrangement of the second encapsulating layer prepared in the method in the display panel can refer to the related description in the foregoing embodiments, and will not be repeated here.

[0133] The display device can include the display panel in the above embodiments or the display panel obtained by the preparation method in the above embodiments. For example, the display device can include a touch structure, an optical film (e.g., a microlens, a polarizer), a cover plate, and the like disposed on the light exit side of the display panel.

[0134] For example, the display device can be any product or component having a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, and the like.

[0135] It should be understood that the various forms of flow shown above can be used to reorder, add, or delete steps. For example, the steps described in the present application can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions of the present application can be achieved, and the present application is not limited herein.

[0136] The specific embodiments described above do not constitute a limitation of the protection scope of the present application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized by, The application relates to a light emitting device, comprising: a substrate; an isolation structure on the substrate, the isolation structure enclosing a plurality of isolation openings; a light emitting device on the substrate and corresponding to the isolation openings respectively, at least part of the light emitting device being located in the corresponding isolation opening; a first encapsulation layer on the side of the isolation structure and the light emitting device away from the substrate, wherein the first encapsulation layer comprises a plurality of encapsulation units corresponding to the isolation openings respectively to cover the light emitting device located in the corresponding isolation opening, and adjacent encapsulation units are spaced apart; and a filling layer on the side of the isolation structure away from the substrate and between adjacent encapsulation units. An edge of the encapsulation unit extends to the side of the isolation structure away from the substrate and is spaced apart from the isolation structure to form an encapsulation gap, the filling layer fills the gap between adjacent encapsulation units and at least part of the encapsulation gap, the distance from the surface of the filling layer away from the substrate to the substrate is greater than the distance from the surface of the edge of the encapsulation unit away from the substrate to the substrate, the orthographic projection of the edge of the filling layer on the substrate is located in the orthographic projection of the isolation structure on the substrate, and the orthographic projection of the surface of the filling layer away from the substrate and the surface of the filling layer close to the substrate on the substrate covers the orthographic projection of the edge of the encapsulation unit on the substrate respectively.

2. The display panel of claim 1, wherein, The filling layer is an optical adjustment layer or a light shielding layer.

3. The display panel of claim 1, wherein, The encapsulation unit comprises a bordering part, the bordering part comprises a covering part, an extending part and a connecting part, the covering part covers the side wall of the isolation structure, the extending part extends to the side of the isolation structure away from the substrate and is spaced apart from the isolation structure, and the connecting part connects the covering part and the extending part, wherein the orthographic projection of the extending part of adjacent encapsulation units on the substrate does not overlap each other, and the gap between the extending part and the surface of the isolation structure away from the substrate forms the encapsulation gap.

4. The display panel of claim 3, wherein, The encapsulation unit further comprises an encapsulation part, wherein the encapsulation part covers the light emitting device and is connected with the covering part of the bordering part, and the orthographic projection of the encapsulation part on the substrate falls in the orthographic projection of the isolation opening on the substrate.

5. The display panel of claim 4, wherein, The light emitting device comprises a first electrode, a light emitting functional layer and a second electrode which are sequentially stacked on the substrate, and at least part of the light emitting functional layer of the light emitting device is located in the corresponding isolation opening, wherein the height of the encapsulation gap in the direction perpendicular to the substrate is less than or equal to the sum of the thicknesses of the light emitting functional layer and the second electrode of the corresponding light emitting device, and the material of any one of the light emitting functional layer and the second electrode is different from that of the filling layer.

6. The display panel of claim 4, wherein, At least part of the light emitting devices comprises a first light emitting device and a second light emitting device emitting different color light, and adjacent light emitting devices emit light of different colors, the packaging units at least comprise a first packaging unit and a second packaging unit, the first packaging unit corresponds to the first light emitting device, the second packaging unit corresponds to the second light emitting device, and the packaging gap corresponding to the first packaging unit and the packaging gap corresponding to the second packaging unit are different in height perpendicular to the substrate.

7. The display panel of claim 4, wherein, The isolation structure comprises a support portion and a crown portion, the support portion is located between the crown portion and the substrate, and the orthogonal projection of the surface of the support portion away from the substrate on the substrate is located within the orthogonal projection of the crown portion on the substrate.

8. The display panel of claim 7, wherein, The isolation structure further comprises a bottom portion, the bottom portion is located between the support portion and the substrate, and the orthogonal projection of the support portion on the substrate is located within the orthogonal projection of the bottom portion on the substrate.

9. The display panel of claim 8, wherein, Further comprising a pixel defining layer on the substrate, wherein the pixel defining layer comprises a pixel opening corresponding to each isolation opening, and at least part of the light emitting device is located in the pixel opening.

10. The display panel of claim 9, wherein, Further comprising a second packaging layer and a third packaging layer, wherein the second packaging layer is located on the side of the first packaging layer away from the substrate, the orthogonal projection of the second packaging layer on the substrate covers the orthogonal projection of the first packaging layer and the filling layer on the substrate, the third packaging layer is located on the side of the second packaging layer away from the substrate, and the orthogonal projection of the third packaging layer on the substrate covers the orthogonal projection of the second packaging layer on the substrate.

11. The display panel of any of claims 1-10, wherein, The packaging gap is completely filled by part of the filling layer.

12. A method for manufacturing a display panel, characterized by, Comprise: a substrate is provided; a plurality of first electrodes spaced from each other are formed on the substrate; an isolation structure is formed on the substrate, wherein the isolation structure encloses a plurality of isolation openings; a thin film of light emitting material and a thin film of conductive material are deposited, covering the isolation structure and the isolation openings, wherein the part of the thin film of light emitting material and the thin film of conductive material located in the isolation openings form a light emitting functional layer and a second electrode respectively, which together with the corresponding first electrode constitute a light emitting device; a packaging material film layer is deposited to cover the light emitting device; a first photoresist layer is formed on the packaging material film layer, and a patterning process is performed on the first photoresist layer to form a first photoresist pattern covering part of the isolation openings; the packaging material film layer, the thin film of light emitting material and the thin film of conductive material are etched based on the first photoresist pattern, wherein the remaining part of the packaging material film layer forms an initial packaging unit, and the light emitting functional layer and the second electrode not covered by the initial packaging unit are etched; the above process is repeated to form the light emitting device and the initial packaging unit at the isolation opening where the light emitting device is not formed, and adjacent initial packaging units partially overlap on the surface of the same isolation structure away from the substrate; remove at least overlapping parts of adjacent initial encapsulation units to obtain encapsulation units, the adjacent encapsulation units are arranged with a spacing, edges of the encapsulation units extend to a side of the isolation structure away from the substrate and are spaced from the isolation structure to form encapsulation gaps, and all the encapsulation units form a first encapsulation layer; form a filling layer based on the encapsulation units, wherein the filling layer fills the gaps between adjacent encapsulation units and at least part of the encapsulation gaps formed between the corresponding encapsulation units and the isolation structure.

13. The method of claim 12, wherein, The etching the encapsulation material film layer, the luminescent material thin film and the conductive material thin film based on the first photoresist pattern comprises: Based on the first photoresist pattern, dry etching is performed to remove the encapsulation material film layer outside the first photoresist pattern, and the remaining encapsulation material film layer covers part of the luminescent device to form an encapsulation part, covers part of the side wall of the isolation opening to form a covering part, and the covering part is connected to the encapsulation part, the remaining encapsulation material film layer extends to a side of the isolation structure away from the substrate and is arranged with a spacing from the isolation structure to form an initial extension part, and the encapsulation material film layer connecting the initial extension part and the covering part forms a connecting part, the encapsulation part, the covering part, the connecting part and the initial extension part form an initial encapsulation unit; Based on the initial encapsulation unit, wet etching is performed to remove the luminescent material thin film and the conductive material thin film outside the initial encapsulation unit, and at least part of the luminescent material thin film and the conductive material thin film between the initial extension part and the isolation structure, to form an initial encapsulation gap between the initial extension part and the isolation structure.

14. The method of claim 13, wherein, The removing at least overlapping parts of adjacent initial encapsulation units to obtain encapsulation units comprises: remove at least overlapping parts of the initial extension parts of adjacent encapsulation units to form extension parts of the encapsulation units, the spacing between the extension parts and the isolation structure forms the encapsulation gaps, and the extension length of the orthographic projection of the encapsulation gaps on the substrate in a first direction is less than the extension length of the orthographic projection of the initial encapsulation gaps on the substrate in the first direction, and the first direction is a direction from an edge of the isolation structure to a center of the isolation structure.

15. The method of claim 14, wherein, The forming a filling layer based on the encapsulation units comprises: coating a filling material with fluidity on the substrate on which the encapsulation units are formed to form a filling layer film under a preset condition, wherein the filling layer film fills at least part of the encapsulation gaps and the gaps between adjacent encapsulation units, and the filling layer film covers a surface of the first encapsulation layer away from the substrate; forming a second photoresist layer on the filling layer film, and performing a patterning process on the second photoresist layer to form a second photoresist pattern, and the second photoresist pattern covers the gaps between adjacent encapsulation units and part of the extension parts of the corresponding encapsulation units close to the gaps between the encapsulation units; etching the filling layer film layer based on the second photoresist pattern, wherein a remaining part of the filling layer film layer is formed as the filling layer.

16. The method of claim 15, wherein, The preset conditions include a protective gas environment, a preset pressure of 3000ppm-6000ppm, and ultraviolet light with a wavelength in a range of 315nm-400nm.

17. The preparation method according to claim 16, characterized in that The preset conditions further include irradiation of ultraviolet light with a wavelength in a range of 230nm-250nm for a preset time, and the preset time is 0.01s-60s.

18. A display device comprising: A display panel comprising the display panel of any one of claims 1 to 11 or obtained by the manufacturing method of any one of claims 12 to 17.

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