Brush, system and method for dispensing multiple fluids during surface cleaning

Abstract

A disclosed example brush for dispensing a plurality of fluids during a surface cleaning process includes: an annular porous polymeric brush body configured to dispense a first fluid through the brush; and a first annular plate mechanically coupled to the brush body, where the plate comprises: a channel for directing a first fluid from an inlet of the channel to the brush body; and a plate annulus aligned with the brush annulus of the brush body such that the brush annulus and the plate annulus direct the second fluid from the inlet guide surface.

Description

Background Art

[0001] The present disclosure relates to substrate cleaning brushes, and more particularly, to brushes, systems, and methods for dispensing multiple fluids during a surface cleaning process.

[0002] In the semiconductor manufacturing industry and other industries, brushes are used to remove contaminants on surfaces, such as the surfaces of semiconductor wafers. Depending on the specific application, the cleaning of a substrate or surface may also include delivering one or more substances (e.g., chemicals, ultrapure water (UPW), deionized water (DIW), etc.) to the substrate or surface.

[0003] By comparing these conventional methods with certain aspects of the methods and systems of the present disclosure as illustrated in the accompanying drawings in the remainder of the disclosure, those skilled in the art will clearly recognize the limitations and disadvantages of the conventional methods of conditioning brushes. Summary of the Invention

[0004] The present disclosure describes brushes, systems, and methods for dispensing multiple fluids during a surface cleaning process, which are substantially as shown and described in at least one of the figures and more fully set forth in the claims. Brief Description of the Drawings

[0005] These and / or other aspects will become apparent and more readily appreciated by reference to the following description of exemplary embodiments in conjunction with the accompanying drawings.

[0006] Figure 1 is a schematic diagram of an exemplary substrate cleaning system for dispensing multiple fluids through a brush during a substrate cleaning process in accordance with aspects of the present disclosure.

[0007] Figure 2A and 2B is Figure 1 a top view of the brush and substrate during an exemplary cleaning process in

[0008] Figure 3 shows Figure 1 a top view of an exemplary brush in

[0009] Figure 4 shows Figure 1 and Figure 3 a bottom view of an exemplary brush in

[0010] Figure 5 shows Figures 1-4 an exemplary dispensing of multiple fluids during operation of an exemplary system and brush in

[0011] Figure 6 is a schematic diagram of another exemplary system including another exemplary brush for cleaning a surface during a cleaning process in accordance with aspects of the present disclosure.

[0012] Figure 7 shows Figure 6 a bottom view of an exemplary brush in

[0013] Figures 8A-8D Other exemplary brushes are shown that include protrusions having different shapes, sizes, and / or distributions on the bottom surface of the brush.

[0014] Figure 9 A flowchart of a representative exemplary method is shown that can be performed using Figures 1-7 an exemplary system and / or brush of Figure 1 and Figure 6 to clean a surface, such as a

[0015] Figure 10A , 10B and 10C are more detailed views of exemplary nodules that can be used to implement Figure 1 and / or Figure 6 a brush of

[0016] The figures are not necessarily drawn to scale. Where appropriate, like or identical reference numerals are used to refer to like or identical components. DETAILED DESCRIPTION

[0017] Various applications and processes may benefit from physical cleaning of a surface. For example, in semiconductor manufacturing, a semiconductor wafer may be cleaned during one or more stages of fabricating an electronic circuit on the wafer to remove contaminants that may cause damage. The cleaning may be provided, for example, by a brush that contacts the surface to be cleaned.

[0018] To effectively clean a substrate, the disclosed exemplary brushes contact the substrate to be cleaned in the presence of a cleaning chemical. Conventional brushes are either mounted or directly cast onto a rotatable hollow base or mandrel that has holes that allow water, chemicals, or both to flow through the base or mandrel, into and through the brush body, and then to the substrate or wafer to be cleaned.

[0019] Due to the construction of traditional disk brushes and roller brushes, conventional brushes cannot deliver multiple chemicals or chemicals and water to the substrate / wafersurface without allowing the chemicals and / or water to pass through the brush material itself. While it may be beneficial to pass water (e.g., DIW, UPW) through the brush body material in order to hydraulically remove process debris from the brush surface, it is generally not desirable to have chemicals pass through the brush body material. Chemicals can react with the brush body material, which can lead to changes in the physical properties of the brush body material and ultimately result in undesirable contact cleaning issues. Polyvinyl acetal (PVA) is a highly water-absorbent porous polymer that can be used as the brush body material. Due to the water-absorbency and porosity of PVA, it is difficult to remove and / or displace chemicals (e.g., by rinsing) from the PVA material after the application of chemicals. Additionally, the integrity of the (ultra-pure) water delivery system is also compromised whenever chemicals are dispensed from the same hollow base / spindle flow cavity and / or through the same flow path. For these reasons, traditional brush systems apply process chemicals, particularly those associated with post-chemical mechanical polishing (post-CMP) cleaning applications, directly to the substrate or wafer surface to be cleaned, while the hollow base / spindle flow channels are typically reserved for water delivery.

[0020] However, in traditional systems, the direct and fixed application of chemicals to the substrate or wafer surface does not allow for the direct dispensing of chemicals to the center of the wafer or substrate because the brush blocks the delivery of chemicals towards the center of the substrate / wafer. In many cleaning applications, including post-CMP cleaning, the substrate / wafer also rotates during the process to maximize the exposure of the PVA brush and chemicals to the cleaning surface. Centrifugal force naturally pushes the applied chemicals away from the center of the substrate / wafer, resulting in a shortage of chemicals at the center of the substrate / wafer.

[0021] The disclosed brushes, cleaning systems, and methods overcome the disadvantages of traditional cleaning systems by allowing for the simultaneous delivery of multiple chemicals or chemicals and water to the substrate surface. Exemplary disk brushes include a porous polymer brush body and one or more support plates. In some of the disclosed examples, a first process chemical is delivered through the annular space between the brush and the support plate, and a second process chemical is delivered through the brush body. These plates provide structural support for the polymer brush body and connect the brush to a support arm to enable movement and / or rotation of the brush. By dispensing multiple chemicals in this manner during the brush cleaning process, the distribution of chemicals on the substrate / wafer is more uniform.

[0022] Exemplary brushes can be configured with different geometries, including shaped nodules extending from the brush body to contact the surface. In some examples, the contact surface is configured with micro-textures to achieve one or more tribological effects.

[0023] In this document, a chemical or process chemical can refer to any substance that can be applied by the disclosed brush, including water, such as deionized water (DIW) and / or ultrapure water (UPW).

[0024] Exemplary brushes disclosed for dispensing multiple fluids during a surface cleaning process include: an annular porous polymer brush body configured to dispense a first fluid through the brush; and a first annular plate mechanically coupled to the brush body, where the plate includes: a channel for directing the first fluid from an inlet of the channel to the brush body; and a plate annular space aligned with a brush annular space of the brush body such that the brush annular space and the plate annular space direct a second fluid from the inlet to the surface. In some examples, the brush is constructed by at least one of: molding, machining, or additive manufacturing.

[0025] In some exemplary brushes, the brush body is constructed by at least one of: molding, machining, or additive manufacturing. In some exemplary brushes, the brush body includes a plurality of protrusions extending from the brush body in a direction away from the first plate. In some exemplary brushes, the protrusions include at least one of nodules or spokes. Some exemplary brushes further include a second annular plate coupled to the brush body opposite the first plate.

[0026] In some exemplary brushes, at least one of the first plate or the second plate is constructed by at least one of: molding, machining, or additive manufacturing. In some exemplary brushes, the first plate and the second plate are mechanically coupled. In some exemplary brushes, the second plate has a plurality of holes through which the protrusions on the brush body extend toward the surface.

[0027] In some exemplary brushes, the first plate is at least one of a polymer material or a ceramic material. In some exemplary brushes, the brush body is configured to dispense the first fluid from a channel passing through the brush body. In some exemplary brushes, the brush body comprises polyvinyl acetal (PVA).

[0028] An exemplary system disclosed for dispensing multiple fluids during a surface cleaning process includes: a brush for dispensing multiple fluids during a surface cleaning process, the brush including: an annular brush body configured to dispense a first fluid through the brush; and a first annular plate mechanically coupled to the brush body, where the plate includes: a channel for directing the first fluid from an inlet of the channel to the brush body; and a plate annular space aligned with a brush annular space of the brush body such that the brush annular space and the plate annular space direct a second fluid from the inlet to the surface; a support arm coupled to the first annular plate and configured to support and rotate the brush; a first fluid source configured to dispense the first fluid to the channel inlet; and a second fluid source configured to dispense the second fluid through the plate annular space and the brush annular space.

[0029] In some exemplary systems, the brush body is constructed by at least one of the following: molding, machining, or additive manufacturing. In some exemplary systems, the brush body includes a plurality of protrusions extending from the brush body in a direction away from the first plate. In some exemplary systems, these protrusions include at least one of nodules or spokes. Some exemplary systems further include a second annular plate coupled to the brush body opposite the first plate.

[0030] In some exemplary systems, at least one of the first plate or the second plate is constructed by at least one of the following: molding, machining, or additive manufacturing. In some exemplary systems, the first plate and the second plate are mechanically coupled. In some exemplary systems, the second plate has a plurality of holes through which the protrusions on the brush body extend toward the surface.

[0031] An exemplary method of cleaning a surface includes: positioning an annular brush in contact with the surface to be cleaned; rotating the brush; during rotation, distributing a first fluid to the surface by distributing the first fluid to a first side of the brush to pass through the brush; and distributing a second fluid to the surface through an annular space of the brush.

[0032] Figure 1 is a schematic diagram of an exemplary system 100 for cleaning a substrate 102, which involves distributing multiple fluids through a brush 104 during the process of cleaning the substrate 102. The exemplary system 100 includes a support arm 106 coupled to the brush 104. The support arm 106 positions the brush 104 relative to the substrate 102 and couples the brush 104 to one or more actuators 108. The actuator 108 moves the brush 104 and / or rotates the brush 104 relative to the substrate 102 through the support arm 106.

[0033] The system 100 and the brush 104 are capable of simultaneously delivering multiple fluids to the brush 104 and / or the substrate 102 during the cleaning process. As described in more detail below, a first chemical 110 can be distributed to the substrate 102 through a spindle 112 that couples the brush 104 to the support arm 106 (e.g., provides rotational torque to the brush 104 from the actuator 108). A second chemical 114 can be simultaneously dispersed to the substrate 102 through the body of the brush 104, e.g., by distributing the second chemical 114 through the brush 104.

[0034] Exemplary system 100 includes a first reservoir 116 that stores a first chemical 110 and is in fluid communication with a spindle 112 for dispensing the first chemical 110. The system 100 also includes a second reservoir 118 that stores a second chemical 114 and is in fluid communication with a dispenser 120 (e.g., a nozzle, a conduit, etc.). The first and second reservoirs 116, 118 may have the same or different capacities. The first and second reservoirs 116, 118 may be located locally or near the system 100, and / or may be facility-based sources of pressurized chemicals 110, 116 that are in fluid communication with a support arm 106.

[0035] System 100 includes a control circuit 122 configured to control valves 124, 126. The valves 124, 126 can be controlled to set the dispensing rates of the chemicals 110, 114 from the reservoirs 116, 118. Exemplary valves 124, 126 are low-power electronically controlled solenoid valves. However, any other type of electronically controlled valve can be employed, given the required flow rates, power consumption, and / or response times.

[0036] Exemplary brush 104 includes an annular plate 128 and an annular brush body 130. The annular plate 128 is connected or bonded to the annular brush body 130 and provides mechanical support and coupling between the brush body 130 and the spindle 112. The brush body 130 contacts the substrate 102 to clean and / or polish the substrate 102.

[0037] Exemplary plate 128 includes an annular space 132. The spindle 112 extends through the annular space 132 to convey the first chemical 110 through the brush 104 to the substrate 102. The brush body 130 also includes an annular space 134 that is aligned (e.g., overlaps, is concentric, etc.) with the annular space of the plate 128. The annular spaces 132, 134 are large enough to allow the first chemical 110 to be conveyed to the substrate 102. In some examples, the annular space 134 of the brush body 130 is large enough to reduce or eliminate chemical reactions between the first chemical 110 and the second chemical 114 inside the body of the brush body 130 before the chemicals 110, 114 reach the substrate 102. The annular space 134 of the brush body 130 can also be small enough to increase (e.g., maximize) the contact area between the brush body 130 and the substrate 102.

[0038] Exemplary brush body 130 is a porous polymer foam that can be molded, machined, constructed using additive manufacturing techniques, and / or otherwise formed into an annular shape. Exemplary polymer foams that can be used to implement the brush body 130 include polyvinyl acetal foams, polyurethane foams, polyolefin foams, porous fluoropolymers, and / or silicone foams.

[0039] The plate 128 further includes one or more channels 136 that extend from a channel inlet 138 on the top side of the plate 128 to the interface between the plate 128 and the brush body 130. The channels 136 provide fluid conveyance from the nozzle 120 to the brush body 130. The nozzle 120 is aligned with the channels 136 to convey the second chemical 114 into the channels 136. The channels 136 can serve as a secondary reservoir to directly supply the second chemical 114 to the brush body 130.

[0040] Since the exemplary brush body 130 is porous, the second chemical 114 is dispensed through the brush body 130 toward the substrate 102 and ultimately reaches the interface between the brush body 130 and the substrate 102 for cleaning. In some examples, the channels 136 are configured to provide substantially uniform dispensing of the second chemical 114 within the brush body 130, such that different concentrations of the second chemical 114 are provided at different locations within the brush body 130 or at different locations on the surface of the brush body 130, or the dispensing of the second chemical 114 is concentrated at one or more locations on the surface of the brush body 130.

[0041] The substrate 102 can be supported on a platform 140 or other support surface. In some examples, during the cleaning process, the platform 140 rotates the substrate 102 in the same or a different rotational direction as the brush 104. In other examples, the substrate 102 can be conveyed in a linear direction, and the substrate 102 can be rotated or not rotated.

[0042] The exemplary control circuit 122 includes at least one controller or processor that controls the operation of the system 100. The control circuit 122 receives and processes a plurality of inputs related to the performance and requirements of the system 100. The control circuit 122 can include one or more microprocessors, such as one or more “general-purpose” microprocessors, one or more dedicated microprocessors, and / or ASICs, and / or any other type of processing device. For example, the control circuit 122 can include one or more digital signal processors (DSPs). The exemplary control circuit 122 can also include one or more storage devices (e.g., ROM, flash memory, hard disk drive, and / or any other suitable optical, magnetic, and / or solid-state storage medium and / or combinations thereof) and one or more memory devices (e.g., volatile and / or non-volatile memory).

[0043] Figure 2A and 2B is Figure 1 A top view of the brush 104 and the substrate 102 at different radial and / or angular positions on the surface of the substrate 102 during an exemplary cleaning process. The exemplary brush 104 is supported, positioned, and rotated by a support arm 106. The support arm 106 also conveys the chemicals 110, 114 to the brush 104 (e.g., to the annular spaces 132, 134 of the brush 104 and the inlet 138 of the channels 136).

[0044] The exemplary substrate 102 can rotate in any direction or remain stationary, while the support arm 106 moves the brush 104 above the surface of the substrate 102 and brings it into contact with the substrate 102. The support arm 106 also controls the rotation of the brush 104 via the main shaft 112. The radial position of the brush 104 on the substrate 102 is controlled by moving the support arm 106 relative to the substrate 102, while the angular position of the brush 104 relative to the surface of the substrate 102 is controlled by rotating the substrate 102. However, in other examples, the support arm 106 may be capable of positioning the brush 104 at any angular and / or radial position on the substrate 102. The support arm 106 can also control the distance between the brush 104 and the substrate 102, and / or the pressure applied by the brush 104 to the substrate 102.

[0045] Figure 3 is shown Figure 1 a top view of the exemplary brush 104 in. The brush 104 includes a top plate 128 that mechanically couples the brush 104 to the main shaft 112. A first channel 136 is located inside the top plate 128, and an inlet 138 extends along the periphery of the top plate 128.

[0046] The top plate 128 can bridge the channel 136 or the inlet 138 at certain positions to couple the inner and outer radial portions of the top plate 128. The channel 136 can take any desired shape, including the shape, number, and / or size of the inlet 138, as well as the shape, number, and / or size of the interface with the brush body 130, to achieve the desired distribution of the second chemical 114 from the channel 136 through the brush body 130 to the substrate 102.

[0047] Figure 4 is shown Figure 1 and Figure 3 a bottom view of the exemplary brush 104 in. As Figure 4 shown, the brush body 130 includes an annular space 134 that is concentric with the annular space 132 of the top plate 128 and / or concentric with the main shaft 112. The brush body 130 is mechanically attached to the top plate 128 by fasteners, chemical bonding, adhesion, overmolding, and / or any other connection technique. The top plate 128 and the brush body 130 can be manufactured by at least one of the following methods: molding, machining, additive manufacturing (e.g., 3D printing), and / or any other manufacturing technique, either alone or in combination. An exemplary top plate 128 is a polymer material, such as polyethylene terephthalate (PET), polyetheretherketone (PEEK), perfluoroalkoxy alkane (PFA), polytetrafluoroethylene (PTFE), and / or any other material compatible with the chemicals in the use environment, such as ceramic materials.

[0048] Figure 5 is shownFigures 1-4 Exemplary distribution of various fluids (e.g., chemicals 110, 114) during operation of exemplary system 100 and brush 104. As Figure 5 shown, a second chemical 114 is dispensed from nozzle 120 to an inlet 138 of channel 136. Channel 136 directs the second chemical 114 towards brush body 130. Due to the porosity of exemplary brush body 130, the second chemical 114 diffuses through brush body 130 and is ultimately dispensed towards substrate 102. The dispensing rate of the second chemical 114 may depend on the flow rate controlled by control circuit 122 via valve 126, the rotational speed of brush 104, the pressure between brush body 130 and substrate 102, and / or other factors. Rotation of substrate 102 may cause the first chemical 110 and / or the second chemical 114 to be radially pushed outwards relative to substrate 102 after being deposited on the surface of substrate 102.

[0049] Figure 6 is a top view of another exemplary system 600 for cleaning substrate 102 during a cleaning process, including another exemplary brush 604. Exemplary system 600 includes support arm 106, actuator 108, spindle 112, reservoirs 116, 118, nozzle 120, control circuit 122, valves 124, 126, and platform 140 described above in connection with Figures 1-5 description.

[0050] Figure 6 The exemplary brush 604 of Figures 1-5 includes a brush body 606, a top plate 608, and a bottom plate 610. The top plate 608 may be similar or identical to Figure 6 the top plate 128 of

[0051] Figure 7 shown. Figure 6 In an example of Figure 6 the top plate 608 and the bottom plate 610 are connected together to provide top and bottom support for brush body 606. In other examples, the top plate 608 and the bottom plate 610 may be separately connected to brush body 606 to provide rigidity and / or control the dispensing of chemicals from brush body 606.

[0052] Figure 7 shows Figures 8A-8DIllustrates other exemplary brushes 802, 804, 806, 808, including protrusions 612 having different shapes, sizes, and / or distributions on the bottom surface of the brush. Although exemplary brushes 604, 802 - 808 include respective bottom plates 610, in other examples, the brush may include protrusions or nodules while omitting the bottom plate 610.

[0053] The top plate 608 includes a channel 614 with an inlet 616. The channel 614 and the inlet 616 may be similar or identical to the exemplary channel 136 and inlet 138 of Figures 1-5 brush 104. However, as described above, the channel 614 and / or the inlet 616 may have any desired shape, size, and / or number to receive, disperse, and distribute the second chemical 114 to the substrate 102. As Figure 7 shown, the annular space 618 of the top plate 608 is concentric with the annular space 620 of the bottom plate 610 and the annular space 622 of the brush body 606 and allows the first chemical 110 to be delivered to the substrate 102 through the spindle 112.

[0054] Although the above examples include one or more plates outside the porous polymer brush body, in some other examples, the brush body is overmolded or printed on an internal plate or other structure. In some such examples, the internal plate or other structure implements channels, inlets, and / or interfaces with the brush body to disperse the second chemical 114 from the nozzle 120. The internal plate or other structure may include the spindle 112 and / or be configured to connect to the spindle 112 to drive the brush and distribute the first chemical 110 through the annular space in the porous polymer brush body.

[0055] Figure 9 Illustrates a flowchart of a representative exemplary method 900 that may be performed using Figures 1-7 exemplary systems 100, 600, and / or brushes 104, 604 to clean a surface (e.g., substrate 102).

[0056] In block 902, the brushes 104, 604 are coupled to a support arm, such as Figures 1-7 exemplary support arm 106. For example, the top plates 128, 608 and / or the bottom plate 610 of the brushes 104, 604 may be connected to the spindle 112 to support, move, and / or rotate the brushes 104, 604 relative to the substrate 102.

[0057] In block 904, the support arm 106 moves the brushes 104, 604 into contact with the surface of the substrate 102. The support arm 106 can determine the pressure when the brush 104 contacts the substrate 102. In block 906, the support arm 106 rotates the brush in contact with the substrate 102, and / or the substrate 102 is rotated (e.g., by the platform 140). In block 908, the support arm 106 moves the brushes 104, 604 above the surface of the substrate 102, and / or the substrate 102 is moved (e.g., by a conveyor belt, a workbench, or other planar motion system). Through blocks 906 and 908, the brush body 130 and / or the brush bumps 612 scrub, polish, and / or otherwise clean the substrate 102. In addition to controlling the valves 124, 126, the control circuit 122 can also control the actuator 108 to control the support arm 106.

[0058] In block 910, the control circuit 122 determines whether to dispense the first chemical 110 (e.g., dispensed through a nozzle in the spindle 112 from the first reservoir 116). For example, the control circuit 122 can determine whether the recipe or other cleaning procedure specifies the time, frequency, and / or amount of the first chemical 110 to be delivered during the cleaning process. If the control circuit 122 determines to dispense the first chemical 110 (block 910), then in block 912, the control circuit 122 controls the first valve 124 to dispense the first chemical 110 through the annular space of the brush body 130 onto the substrate 102. For example, the control circuit 122 can control the first valve 124 to dispense a specified amount, and / or receive feedback from one or more flow sensors to measure the dispensed amount.

[0059] In block 914, the control circuit 122 determines whether to dispense the second chemical 114 (e.g., dispensed through the nozzle 120 from the second reservoir 118). For example, the control circuit 122 can determine whether the recipe or other cleaning procedure specifies the time, frequency, and / or amount of the second chemical 114 to be delivered during the cleaning process. If the control circuit 122 determines to dispense the second chemical 114 (block 914), then in block 916, the control circuit 122 controls the second valve 126 to dispense the first chemical 114 through the channel 136 and the brush body 130, 606, and / or the bumps 612 onto the substrate 102. For example, the control circuit 122 can control the second valve 126 to dispense a specified amount, and / or receive feedback from one or more flow sensors to measure the dispensed amount. The first and second chemicals 110, 114 can be dispensed sequentially and / or simultaneously according to a specific cleaning procedure.

[0060] In block 918, the control circuit 122 determines whether the cleaning process is complete. If the cleaning process is not complete (block 918), then the control returns to block 906 to continue rotating and / or moving the brushes, and / or dispensing the first and second chemicals 110, 114.

[0061] When the cleaning process is complete (block 918), at block 920, the control circuit 122 controls the support arm 106 to move the brushes 104, 604 so as not to contact the surface of the substrate 102. Then, the exemplary method 900 ends.

[0062] Figure 10A 、 10B and 10C show in more detail Figure 1 and / or Figure 6 Exemplary surfaces 1002, 1004, 1006 of the brush bodies 130, 606 of the brushes 104, 604. The exemplary surfaces 1002, 1004, 1006 have a microtexture that can be applied to the surfaces of the brush bodies 130, 606 (e.g., to the surface of the bump 612) to affect the cleaning action of the brushes 104, 604 on the substrate 102. The microtexture of the brush bodies 130, 606 can be formed during the molding process of the brush bodies 130, 606, by machining the brush bodies 130, 606 and / or using any other construction or modification method.

[0063] Figure 10A shows Figure 6 Top and bottom views of the exemplary surface 1002 of one of the bumps 612 of. The exemplary surface 1002 has a microtexture including rounded surfaces or microstructures that repeat in a substantially constant pattern. Figure 10B shows Figure 6 Top and bottom views of the exemplary surface 1004 of one of the bumps 612 of. The exemplary surface 1004 has a microtexture including sharp surfaces or microstructures distributed in a substantially constant pattern. Figure 10C shows Figure 6 Top and bottom views of the exemplary surface 1006 of one of the bumps 612 of. The exemplary surface 1006 has a microtexture including flat, stepped surfaces or microstructures distributed in a substantially constant pattern.

[0064] Although Figures 10A-10C shows exemplary microtextures and patterns, the shape of the microstructures, the concentration or density of the features, the size of the microstructures, the depth of the microstructures, and / or any other geometric aspect of the microstructures can be modified to obtain a desired cleaning effect, a unique tribological function (e.g., enhanced lubrication, increased friction, improved cleaning efficiency), and / or a different dispensing effect of the second chemical 114. Different parts of the brush bodies 130, 606 and / or different bumps 612 can have different microtexture features or characteristics. The same or different microtextures can be associated with Figures 8A-8DUsed in conjunction with protrusions of different shapes. The characteristics and / or properties of the microtexture can be selected based on the type of the first and / or second chemical agents 110, 114 used during the cleaning process, for example, to facilitate or mitigate the mixing of the first and / or second chemical agents 110, 114 on the surface of the substrate 102.

[0065] The method and system can be implemented by hardware, software, and / or a combination of hardware and software. For example, the method and / or system can implement the control circuit 122 in a centralized manner by at least one computing system, or in a distributed manner, where different elements are distributed in several interconnected computing systems. Any type of computing system or other device suitable for executing the methods described herein is appropriate. A typical combination of hardware and software can include a general-purpose computing system that has a program or other code that, when loaded and executed, controls the computing system to execute the methods described herein. Another typical implementation can include one or more application-specific integrated circuits or chips. Some implementations can include a non-transitory machine-readable (e.g., computer-readable) medium (e.g., flash memory, optical disk, disk memory, or the like) having stored thereon one or more lines of code executable by a machine to cause the machine to perform the processes described herein. In this document, the term "non-transitory machine-readable medium" is defined to include all types of machine-readable storage media and to exclude propagated signals.

[0066] As used herein, the terms "circuit" and "circuitry" refer to physical electronic components (i.e., hardware) and any software and / or firmware ("code") that may configure the hardware, be executed by the hardware, and / or otherwise be associated with the hardware. For example, as used herein, when a particular processor and memory execute a first one or more lines of code, a first "circuit" may be formed, and when a second one or more lines of code are executed, a second "circuit" may be formed. As used herein, "and / or" refers to any one or more of the items in a list connected by "and / or". For example, "x and / or y" refers to any element in the three-element set {(x), (y), (x, y)}. In other words, "x and / or y" means "one or both of x and y". As another example, "x, y, and / or z" refers to any element in the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, "x, y, and / or z" means "one or more of x, y, and z". As used herein, the term "exemplary" means serving as a non-limiting example, instance, or illustration. As used herein, the terms "for example" and "such as" introduce one or more lists of non-limiting examples, instances, or illustrations. As used herein, whenever a circuitry includes the necessary hardware and code (if any code is required) for performing the function, the circuitry is "operable" to perform the function regardless of whether the performance of the function is disabled or not enabled (e.g., by user-configurable settings, factory tuning, etc.).

[0067] Although the method and / or system have been described with reference to certain implementations, those skilled in the art will understand that various changes can be made and equivalents can be substituted without departing from the scope of the method and / or system. In addition, many modifications can be made to adapt a particular situation or material to the teachings of the disclosure without departing from its scope. Therefore, the method and / or system is not limited to the particular implementations disclosed. Instead, the method and / or system will include all implementations that fall within the scope of the appended claims, whether literally or under the doctrine of equivalents.

Claims

1. A brush for dispensing multiple fluids during a surface cleaning process, the brush comprising: An annular porous polymer brush body configured to dispense a first fluid through the brush; And A first annular plate mechanically coupled to the brush body, wherein the plate comprises: A channel for guiding the first fluid from an inlet of the channel to the brush body; And A plate annular space aligned with a brush annular space of the brush body such that the brush annular space and the plate annular space direct a second fluid from an inlet to the surface.

2. The brush according to claim 1, wherein the brush body is constructed by at least one of: molding, machining, or additive manufacturing.

3. The brush according to claim 1, wherein the brush body includes a plurality of protrusions extending from the brush body in a direction away from the first plate.

4. The brush according to claim 3, wherein the protrusions include at least one of nodules or spokes.

5. The brush according to claim 3, further comprising a second annular plate coupled to the brush body opposite to the first plate.

6. The brush according to claim 5, wherein at least one of the first plate or the second plate is constructed by at least one of: molding, machining, or additive manufacturing.

7. The brush according to claim 5, wherein the first plate and the second plate are mechanically coupled.

8. The brush according to claim 5, wherein the second plate includes a plurality of holes through which the protrusions on the brush body extend towards the surface.

9. The brush according to claim 1, wherein the first plate includes at least one of a polymer material or a ceramic material.

10. The brush according to claim 1, wherein the brush body is configured to dispense the first fluid from the channel through the brush body.

11. The brush according to claim 1, wherein the brush body includes polyvinyl acetal (PVA).

12. A system for dispensing multiple fluids during a surface cleaning process, the system comprising: A brush for dispensing multiple fluids during a surface cleaning process, the brush comprising: An annular brush body configured to dispense a first fluid through the brush; and A first annular plate mechanically coupled to the brush body, wherein the plate comprises: A channel for guiding the first fluid from an inlet of the channel to the brush body; and A plate annular space aligned with a brush annular space of the brush body such that the brush annular space and the plate annular space direct a second fluid from an inlet to the surface; A support arm coupled to the first annular plate and configured to support and rotate the brush; A first fluid source configured to dispense the first fluid to the channel inlet; and A second fluid source configured to dispense the second fluid through the plate annular space and the brush annular space.

13. The system according to claim 12, wherein the brush body is constructed by at least one of: molding, machining, or additive manufacturing.

14. The system according to claim 12, wherein the brush body includes a plurality of protrusions extending from the brush body in a direction away from the first plate.

15. The system according to claim 14, wherein the protrusion includes at least one of a knob or a spoke.

16. The system according to claim 14, further comprising a second annular plate coupled to the brush body opposite to the first plate.

17. The system according to claim 16, wherein at least one of the first plate or the second plate is constructed by at least one of: molding, machining, or additive manufacturing.

18. The system according to claim 15, wherein the first plate and the second plate are mechanically coupled.

19. The system according to claim 15, wherein the second plate includes a plurality of holes, and the protrusions on the brush body extend through the holes toward the surface.

20. A method of cleaning a surface, the method comprising: positioning an annular brush in contact with the surface to be cleaned; rotating the brush; during rotation, dispensing a first fluid onto the surface by dispensing the first fluid to a first side of the brush to cause it to be dispensed through the brush; and dispensing a second fluid onto the surface through an annular space of the brush.

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