Positioning device and positioning method

Abstract

A positioning device (100) is provided with: a bonding head (2); a bonding stage (4); an optical module (3) that captures an image of at least one of the first member (P1) and the second member (P2); and a calculation device (6) that calculates the position correction amount of the first member (P1) and the second member (P2) on the basis of an image captured by the optical module (3).

Description

Technical Field

[0001] The present disclosure relates, for example, to a positioning device and a positioning method used when positioning electronic components and the like. Background Art

[0002] In the past, when manufacturing electronic components and the like, a camera has been used to grasp the positions of components such as a substrate and chip components, and to position each component. At this time, movement for correcting the position deviation of each component is performed based on the position deviation amount recognized by the camera.

[0003] For example, the device of Patent Document 1 includes: a mounting head having a component jig; a first drive system for moving a carrier; a second drive system for moving the mounting head back and forth between a nominal working position and a standby position; a rotation drive unit for rotating the component jig by rotating a drive unit or a substrate mounted on the mounting head about an axis; a substrate camera mounted on the carrier; and a component camera. The substrate includes a substrate mark. The component camera and the substrate camera detect the substrate mark.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: JP-A-2018-190958 Summary of the Invention

[0007] However, in Patent Document 1, in order to handle small workpieces, it is necessary to bring the imaging regions of the substrate cameras closer to each other, and to achieve this, it is necessary to make the shaft portion connecting the drive unit and the component jig thinner. For this reason, there is a possibility that the rigidity is reduced and the mounting accuracy deteriorates. In addition, between the recognition position and the lens, regarding the optically required space, the lens side is larger than the recognition position, and therefore, depending on the workpiece size, it is sometimes difficult to implement the structure of the shaft portion connecting the jig and the head.

[0008] Therefore, an object of the present disclosure is to provide a positioning device and a positioning method that can handle small workpieces.

[0009] In order to achieve the above object, a positioning device according to an embodiment of the present disclosure positions the first component when it is mounted on the second component. The positioning device includes: a bonding head that holds the first component; a bonding stage that mounts the second component; an optical assembly that images at least one of the first component and the second component; and an arithmetic device that calculates the position correction amounts of the first component and the second component based on the images imaged by the optical assembly. A vibration suppression member for suppressing vibration transmitted from the bonding head to the bonding head is disposed between the optical assembly and the bonding head, or the optical assembly and the bonding head are separately disposed. The optical assembly includes: a first camera for imaging the images; a lens disposed corresponding to the first camera; and an optical element for changing the optical axis direction of the first camera. The optical element includes: a reflecting mirror disposed corresponding to the first camera; and a reflecting prism having a reflecting surface. The bonding head includes: a first moving mechanism that is separated from the optical assembly and moves the bonding head in a first direction parallel to the mounting surface of the bonding stage; and a holding surface that holds the first component on the lower surface. The optical assembly includes: a second moving mechanism that moves the reflecting prism in a second direction perpendicular to the first direction, i.e., in the up and down direction, when the first camera images at least one of the first component and the second component.

[0010] According to the present disclosure, small workpieces can be handled. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1A are a front view and a side cross-sectional view of the positioning device according to the first embodiment.

[0012] Figure 1B is a bottom cross-sectional view of the positioning device according to the first embodiment.

[0013] Figure 2 is a diagram for explaining a method of focus adjustment in the camera according to the first embodiment.

[0014] Figure 3 is a side view for explaining the light condensing range of the camera according to the first embodiment.

[0015] Figure 4 is a flowchart showing the operation of the positioning device according to the first embodiment.

[0016] Figure 5A is a diagram for explaining the operation of the positioning device according to the first embodiment.

[0017] Figure 5B is a diagram for explaining the operation of the positioning device according to the first embodiment.

[0018] Figure 6 This is a diagram for explaining the positioning device according to the second embodiment.

[0019] Figure 7 This is a flowchart showing the operation of the positioning device according to the second embodiment.

[0020] Figure 8 These are the front view and the side sectional view of the positioning device according to the third embodiment.

[0021] Figure 9 This is a flowchart showing the operation of the positioning device according to the third embodiment.

[0022] Figure 10 This is a diagram showing an example of the captured image of the camera according to the third embodiment.

[0023] Figure 11 These are the side sectional views of the positioning device according to the fourth embodiment. Specific Embodiments

[0024] Hereinafter, embodiments of the present invention will be described in detail based on the drawings. The following description of the preferred embodiments is merely illustrative in nature, and the present invention is not intended to limit its application or use in any way.

[0025] (First Embodiment)

[0026] (Structure of the Positioning Device)

[0027] Figure 1A and Figure 1B This represents the positioning device according to the first embodiment. Specifically, Figure 1A (a) of this is the front view of the positioning device 100, Figure 1A (b) of this is the side sectional view of the positioning device 100, Figure 1B This is the bottom sectional view of the positioning device 100. In the following description, the left - right direction in the drawing of (a) in FIG. 1 is set as the X - direction (the first direction), the depth direction of the drawing (the optical axis direction of the camera 31) is set as the Y - direction (the third direction), and the up - down direction in the drawing (hereinafter sometimes simply referred to as the "up - down direction") is set as the Z - direction (the second direction).

[0028] As shown in FIG. 1, the positioning device 100 according to the first embodiment includes an outer housing 1, a joint head 2, an optical assembly 3, a joint stage 4, a component supply unit 5, and an arithmetic device 6 (not shown). The arithmetic device 6 controls the operation of each part, analyzes the captured images of the cameras 31 (31a, 31b) described later, and so on.

[0029] The first component P1 is placed on the component supply unit 5. The second component P2 is placed on the bonding stage 4. The first component P1 is, for example, an IC, an optical element, a semiconductor package, etc. The second component P2 is, for example, a wafer, a silicon substrate, a printed circuit board, etc. In addition, in the following description, the first component P1 and the second component P2 are sometimes collectively referred to as "workpieces" (sometimes also referred to as "workpiece W").

[0030] The exterior unit 1 includes a base 11 and a frame 12 (vibration damping member). The base 11 and the frame 12 are made of members with high rigidity. The base 11 is formed in a substantially flat plate shape. The bonding stage 4 and the component supply unit 5 are arranged on the upper surface of the base 11. In addition, the frame 12 is formed to cover the optical module 3. The bonding head 2, the optical module 3, and the base 11 are connected to the frame 12. Since the frame 12 is made of a member with high rigidity, vibration caused by the driving of the head driving unit 21 of the bonding head 2 described later can be prevented from being transmitted to the optical module 3. In addition, a guide rail 211 extending in the X direction is formed in the frame 12.

[0031] The bonding head 2 includes a head driving unit 21 (first moving mechanism) and a workpiece holding unit 22.

[0032] The head driving unit 21 includes a driving unit (not shown in the figure) and is a component that drives the bonding head 2 itself including the workpiece holding unit 22. Specifically, the head driving unit 21 moves the bonding head 2 along the guide rail 211 in the X direction. The head driving unit 21 can at least move the workpiece holding unit 22 from above the component supply unit 5 to above the bonding stage 4. In addition, the head driving unit 21 can move the workpiece holding unit 22 in the Y direction and the Z direction. In addition, the head driving unit 21 can rotate the workpiece holding unit 22 around the Z direction. At this time, the head driving unit 21 rotates around the Z direction with the first component P1 held by the workpiece holding unit 22 as the center, but it is not necessarily limited to this.

[0033] The workpiece holding unit 22 has a surface for holding the first component P1 on its lower surface. In addition, the workpiece holding unit 22 is formed in a substantially "U" shape when viewed from the X direction (refer to (b) of Figure 1A . Thus, even when the bonding head 2 moves along the guide rail 211, the workpiece holding unit 22 and the optical module 3 do not interfere with each other. In addition, when the bonding head 2 moves along the guide rail 211, the workpiece holding unit 22 can have any shape as long as it does not interfere with the optical module 3. For example, the workpiece holding unit 22 can also be substantially L-shaped.

[0034] The optical component 3 includes a pair of cameras 31 (first cameras), a pair of lenses 32, one reflecting prism 33, and a pair of mirrors 34. The cameras 31 and the lenses 32 are held by a lens holding portion 321. The reflecting prism 33 is held by a prism holding portion 331. The mirrors 34 are held by a mirror holding portion 341. The lens holding portion 321, the prism holding portion 331, and the mirror holding portion 341 are mounted on a position detection component base 30.

[0035] As Figure 1B shown, a mirror 34 is disposed on the optical axes of the cameras 31 and the lenses 32. In addition, the reflecting prism 33 has two reflecting surfaces on its lower surface, and the light incident from below is reflected by the reflecting prism 33 to the mirror 34. With this configuration, the cameras 31 can image components (such as a first component P1 and a second component P2) disposed below the reflecting prism 33.

[0036] In addition, in the lens holding portion 321, a coaxial illumination 351 (first light source) for irradiating light coaxially with the optical axes of the cameras 31 and the lenses 32 is provided. In addition, an oblique light illumination 352 (second light source) for irradiating light at an oblique angle with respect to the optical axes of the cameras 31 and the lenses 32 is provided in the mirror holding portion 341. The coaxial illumination 351 and the oblique light illumination 352 are provided to make the images captured by the cameras 31 clear images. Figure 1A And Figure 1B This is just one example of the configuration of the coaxial illumination 351 and the oblique light illumination 352, and they can be arbitrarily configured as long as the images captured by the cameras 31 are clear images. In addition, if the images captured by the cameras 31 are clear, the coaxial illumination 351 and the oblique light illumination 352 may not be provided.

[0037] Here, a mark M1 (equivalent to a first mark, not shown in Figure 1A and Figure 1B ) for positioning a workpiece is attached to the upper surface of the first component P1, and a mark M2 (equivalent to a second mark, not shown in Figure 1A and Figure 1B(Omitted in the figure). When positioning the workpiece, after the first component P1 and the second component P2 are arranged below the reflecting prism 33, the marks M1 and M2 are photographed by the camera 31. At this time, in order to photograph the marks M1 and M2, it is necessary to make the light reflected on the surface of the first component P1 and the second component P2 form an image in the camera 31. At this time, if the depth of field of the optical system such as the camera 31 is large enough and the type of the workpiece does not change, the light reflected on the surface of the first component P1 and the second component P2 can be formed into an image (focused) in the camera 31. However, if the amount of equipment investment is considered to be suppressed, a positioning device that can cope with various workpieces is desired. For this purpose, in the present embodiment, there is a reflecting prism 33, a pair of reflecting mirrors 34, and a driving unit that drives the pair of cameras 31 and the pair of lenses 32.

[0038] Specifically, the reflecting prism 33 is driven in the Z direction by a driving unit (equivalent to the second moving mechanism) formed by the prism holding portion 331. The reflecting mirror 34 is driven in the Y direction by a driving unit (equivalent to the third moving mechanism) formed by the mirror holding portion 341. The camera 31 and the lens 32 are driven in the Y direction by a driving unit (equivalent to the fourth moving mechanism) formed by the lens holding portion 321. These driving units are driven to move the camera 31, the lens 32, the reflecting prism 33, and the reflecting mirror 34 so that the distance from the camera 31 to the optical axis of the workpiece is kept constant, thereby making it possible to image (focus) the light reflected on the surfaces of the first component P1 and the second component P2 in the camera 31 even if the type of the workpiece changes or the depth of field of the optical system is not high.

[0039] In addition, in this embodiment, when the optical axis from the lens 32 to the reflector 34 is set as the optical axis L3, the optical axis from the reflector 34 to the reflective prism 33 is set as the optical axis L2, and the optical axis from the reflective prism 33 to the workpiece is set as the optical axis L1, the optical axes L1 to L3 are respectively parallel to the Y direction, the X direction, and the Z direction. This makes the design easier. However, it is not necessary to make the optical axes L1 to L3 respectively parallel to the Y direction, the X direction, and the Z direction.

[0040] (How to adjust the camera's field of view and focus)

[0041] Below, reference Figure 2 The figures are used to illustrate the field of view position and focus adjustment method of the camera 31. Figure 2 (a) and (b) are a side view and a bottom view of the optical unit 3 when the pair of cameras both have the center position of the workpiece as their field of view. Figure 2 (c) and (d) are a side view and a bottom view of the optical unit 3 when a pair of cameras have positions separated in the X direction as their fields of view.Figure 2 Figures (e) and (f) are a side view and a bottom view of the optical unit 3 when a pair of cameras are positioned apart in the Y direction as the field of view. In the following description, the camera 31, lens 32, and mirror 34 arranged on the left side of the drawing in Figure 2 are described as camera 31a, lens 32a, and mirror 34a, and the camera 31, lens 32, and mirror 34 arranged on the right side of the drawing are described as camera 31b, lens 32b, and mirror 34b.

[0042] Here, when taking Figure 2 Figures (a) and (b) as the reference positions of cameras 31a, 31b, lenses 32a, 32b, reflection prism 33, and mirrors 34a, 34b, the amount of movement in the -Z direction from the reference position of the reflection prism 33 is designated as C1a, the amounts of movement in the +Y direction from the reference positions of the mirrors 34a, 34b are respectively designated as C2a, C2b, the amount of movement in the +Y direction from the reference positions of the camera 31a and lens 32a is designated as C3a, and the amount of movement in the +Y direction from the reference positions of the camera 31b and lens 32b is designated as C3b.

[0043] In Figure 2 Figures (a) and (b), C1a = C3a = C3b = 0. In this state, the foci of the cameras 31a, 31b are aligned with the position of the workpiece.

[0044] In Figure 2 Figures (c) and (d), compared with Figure 2 Figures (a) and (b), the position of the reflection prism 33 moves in the -Z direction. At this time, the cameras 31a, 31b are moved in the +Y direction so that C3a = C3b = C1a. In this way, since the optical axis distances from the cameras 31a, 31b to the workpiece are the same as those in Figure 2 Figures (a) and (b), it is possible to align the foci of the cameras 31a, 31b with the workpiece while arbitrarily setting the X-direction interval of the fields of view of the cameras 31a, 31b.

[0045] In Figure 2 Figures (e) and (f), it is from Figure 2Diagrams showing the case where the visual field positions are respectively moved in the Y direction as seen in (a) and (b) thereof. At this time, it is necessary to align the visual field positions and move C2a and C2b respectively in the Y direction. In addition, it is necessary to move C3a and C3b so that the distance of optical axis L1 + optical axis L2 + optical axis L3 does not change. Since in this case, it is in the state where C1a = 0 (the reflection prism 33 is not moved), by moving to C2a = C3a and C2b = C3b, while aligning the visual field position to a given Y position, the focus can be set to be aligned with the workpiece state.

[0046] In addition, although the description is omitted, it can be achieved by combining Figure 2 the actions of (c) and (d) and diagrams (e) and (f) thereof to move the visual fields of cameras 31a and 31b in the X direction and the Y direction, whereby the visual field positions can be set at any two points of the workpiece.

[0047] Figure 3 is a side view showing the light condensing range of the cameras for explaining the case where the two visual fields of cameras 31a and 31b according to the first embodiment are to photograph substantially the same position (the same configuration as Figure 2 (c) and (d) thereof).

[0048] In Figure 3 it, the optical axes from cameras 31a and 31b to the workpiece are indicated by dashed-dotted lines, and the center positions of the light condensing ranges of cameras 31a and 31b are indicated by dotted lines. The angle formed by this dotted line and the dashed-dotted line corresponds to the NA of lenses 32a and 32b. In this case, camera 31a can obtain an image on the -X direction side from the lower side edge line position of the reflection prism 33 of workpiece W, and camera 31b can obtain an image on the +X direction side from the lower side edge line position of the reflection prism 33 of workpiece W. By adopting such a structure, it is possible to perform photographing of substantially the entire area up to the middle part of the two visual fields without affecting the equipment rigidity, etc., and different from Patent Document 1, it is also easy to deal with small workpieces.

[0049] (Operation of the positioning device)

[0050] As described above, a mark M1 for positioning the workpiece is attached to the upper surface of the first component P1, and a mark M2 for positioning the workpiece is attached to the upper surface of the second component P2. In this embodiment, by photographing marks M1 and M2 without changing the focus position of camera 31, the mounting accuracy is improved. In addition, although it is also possible to photograph marks M1 and M2 while changing the focus position of camera 31, when the influence of the error caused by out-of-focus is small, if photographing is performed without changing the focus position of camera 31, errors caused by the movement of each part of the optical component 3 will not occur, so the mounting accuracy becomes high.

[0051] In this embodiment, an example will be described where two marks M1 are attached to the upper surface of the first component P1 and two marks M2 are attached to the upper surface of the second component P2. In the following description, the mark M1 is illustrated as a circular shape and the mark M2 is illustrated as a square shape. Here, since methods such as calculating a reference point from a plurality of feature points using pattern matching or the like can also be used, the marks M1 and M2 are not limited to actual marks, and can also be defined as position reference points for the first component and the second component respectively within each field of view.

[0052] Figure 4 It is a flowchart showing the operation of the positioning device according to the first embodiment. In addition, the operations of each part of the positioning device 100 are controlled by the arithmetic unit 6.

[0053] First, the first component P1 is supplied (placed) to the component supply unit 5, and the second component P2 is supplied (placed) to the bonding stage 4 (step S1). At this time, the first component P1 and the second component P2 are placed on the component supply unit 5 and the bonding stage 4 by a known method. In addition, as a holding method for the first component P1 and the second component P2, suction holding is performed, but it is not limited thereto. For example, the holding method for the first component P1 and the second component P2 can also be an adhesive sheet such as suction or gel packaging, and in the case of avoiding contact between the components on the back surface, it can also be a non-contact method such as a Bernoulli chuck.

[0054] The bonding head 2 is moved upward (+Z direction) above the component supply unit 5 (step S2).

[0055] The first component P1 is transferred from the component supply unit 5 to the bonding head 2 (step S3). Specifically, the bonding head 2 descends, or the component supply unit 5 ascends, so that the first component P1 is held on the lower surface of the workpiece holding part 22 of the bonding head 2. And the first component P1 is separated from the component supply unit 5. In addition, if the first component P1 can be directly transferred to the bonding head 2 from other components (not shown) within the device, step S1 is omitted. At this time, the shape of the component and the component supply method can be arbitrary.

[0056] An identification operation of the second component P2 is performed (step S4). Specifically, the second component P2 placed on the bonding stage 4 is moved downward (-Z direction) below the optical unit 3, and the second component P2 is imaged by the camera 31.

[0057] Figure 5A (a) shows a side view of the positional relationship between the optical unit 3 and the second component P2 in step S4. Figure 5AFigure (b) is a diagram showing an example of the captured image of the camera 31 in step S4. Since the optical unit 3 includes two cameras 31, there are two imaging regions (regions where the focus of the camera 31 is aligned) A1 and A2 in the captured image (refer to Figure 5A Figure (b)). In step S4, each part of the optical unit 3 is moved so that the images of the two marks M2 attached to the second component P2 are respectively captured in the imaging regions A1 and A2. Additionally, when the size of the workpiece is small, the two marks M2 may be captured in any one of the imaging regions A1 and A2. Further, step S4 can be performed at any timing as long as it is after step S1 and before step S5.

[0058] Move the bonding head 2 upward (+Z direction) above the bonding stage 4 (step S5). At this time, bring the positions of the first component P1 and the second component P2 close to the vicinity of the mounting position (i.e., close in the Z direction).

[0059] Perform the identification operation of the first component P1 (step S6). Specifically, capture an image of the first component P1 held by the bonding head 2 using the camera 31. Additionally, regarding the focusing of the camera 31, if necessary depending on the situation, but if the depth of field permits, the mark M1 may also be captured without changing the focus position.

[0060] Figure 5B Figure (a) is a side view showing the positional relationship among the bonding head 2, the optical unit 3, the first component P1, and the second component P2 in step S6. Figure 5B Figure (a) is a diagram showing an example of the captured image of the camera 31 in step S6. In step S6, when capturing an image of the mark M1, since the first component P1 is held on the lower surface of the workpiece holding portion 22 of the bonding head 2, it is necessary that the workpiece holding portion 22 does not block the optical axis from the camera 31 to the first component P1. For this reason, in the first embodiment, a through portion 221 is formed in the workpiece holding portion 22. The through portion 221 is, for example, a hole that penetrates the workpiece holding portion 22 in the Z direction, a light-transmitting member such as glass embedded in the hole. Additionally, if the workpiece holding portion 22 itself is composed of a light-transmitting member, the through portion 221 is not required.

[0061] Further, in step S6, when identifying a very small workpiece, if images are captured simultaneously with two cameras, the light from the illumination may sometimes interfere with each other. For example, when the workpiece is small, since the optical unit 3 is configured close to Figure 2 the configurations of Figures (a) and (b), a part of the light irradiated from one coaxial illumination 351 passes under the prism 33 and enters the other camera 31 that is not corresponding. In this case, the two cameras 31 may be sequentially captured one by one.

[0062] The arithmetic unit 6 calculates a position correction amount from the image obtained by photographing the mark M1 ( Figure 5A the image of (b)) and the image obtained by photographing the mark M2 ( Figure 5B the image of (d)) (step S7). The position correction amount is calculated based on, for example, the relative positions of the marks M1 and M2 when comparing the image obtained by photographing the mark M1 and the image obtained by photographing the mark M2.

[0063] The arithmetic unit 6 determines whether the position correction amount is within an allowable range (step S8).

[0064] When the arithmetic unit 6 determines that the position correction amount is not within the allowable range (step S8 "No"), it performs a correction operation (step S9). Specifically, the arithmetic unit 6 moves the bonding head 2 in the X direction and the Y direction based on the position correction amount, or rotates the bonding head 2 about the Z direction. After step S9, it returns to step S6.

[0065] When the arithmetic unit 6 determines that the position correction amount is within the allowable range (step S8 "Yes"), it performs a mounting operation (step S10). Specifically, it lowers the bonding head 2 (moves in the -Z direction), places the first component P1 on the second component P2, and raises the bonding head 2 (moves in the +Z direction).

[0066] As described above, the positioning device according to the present embodiment includes: a bonding head 2 that holds the first component P1; a bonding stage 4 that mounts the second component P2; an optical unit 3 that photographs at least one of the first component P1 and the second component P2; and an arithmetic unit 6 that calculates a position correction amount of the first component P1 and the second component P2 based on the image photographed by the optical unit 3. A frame 12 (vibration suppression member) for suppressing vibration transmitted from the bonding head 2 to the optical unit 3 is disposed between the optical unit 3 and the bonding head 2. With this configuration, since the vibration caused by the movement of the bonding head 2 can be suppressed from being transmitted to the camera 31 of the optical unit 3 by the frame 12, a decrease in positioning accuracy can be suppressed. On the other hand, in Patent Document 1, a camera is mounted on the bonding head, and the vibration of the correction movement of the bonding head easily affects the camera, and there is a concern that the positioning accuracy deteriorates.

[0067] In addition, in Patent Document 1, in order to handle small workpieces, it is necessary to bring the imaging regions of the substrate cameras closer to each other. To achieve this, the shaft portion connecting the drive unit and the component fixture needs to be made thinner. For this reason, there is a possibility that the rigidity is reduced and the mounting accuracy deteriorates. In addition, between the recognition position and the lens, the optically required space is larger on the lens side compared to the recognition position. Therefore, depending on the workpiece size, it is sometimes difficult to implement the structure of the shaft portion connecting the fixture and the head. In contrast, in the present embodiment, by the moving mechanism of the cameras 31a, 31b, lenses 32a, 32b, reflecting prisms 33, and reflecting mirrors 34a, 34b of the optical unit 3, it is possible to freely cope with the pitch between the marks of the workpiece, and it is possible to cope with any workpiece size without reducing the equipment performance such as the rigidity of the equipment.

[0068] (Second Embodiment)

[0069] Figure 6 FIG. (a) is a side cross-sectional view of the positioning device according to the second embodiment. In the second embodiment, different from the first embodiment, it is possible to image the mark M1 of the first component P1 and the mark M2 of the second component P2 simultaneously in one imaging of the camera 31.

[0070] Specifically, when observing the first component P1 and the second component P2 from a top view, in the case where the mark M2 is located below the first component P1 (refer to Figure 6 FIG. (b) for an example of the imaging image of the camera 31), even when the mark M2 is located below the first component P1 and it is possible to image the mark M2 through the first component P1 (refer to Figure 6 FIG. (c) for an example of the imaging image of the camera 31), etc., it is possible to image the mark M1 of the first component P1 and the mark M2 of the second component P2 simultaneously. In addition, in principle, the mark M1 of the first component P1 is located above the first component P1, but in the latter case, if it is possible to image the mark M1 through the first component P1, the mark M1 of the first component P1 may also be located below the first component P1.

[0071] For example, when imaging the marks M1 and M2 through the first component P1, it is necessary to make the light irradiated by the coaxial illumination 351 and the oblique light illumination 352 the light that passes through the first component P1. For example, if the workpiece is a silicon-based workpiece such as a semiconductor, if the light irradiated by the coaxial illumination 351 and the oblique light illumination 352 is infrared light, this infrared light will pass through the first component P1 and the second component P2, and thus, it is possible to image the marks M1 and M2. In contrast, in the case where the light irradiated by the coaxial illumination 351 and the oblique light illumination 352 cannot sufficiently pass through the first component P1 and the second component P2 and it is not possible to clearly image the marks M1 and M2, use Figure 6 the positioning device shown in FIG. (a).

[0072] As shown in (a) of Figure 6 below, a stage illumination 41 (second light source) and a transmissive portion 42 are provided below the bonding stage 4. The stage illumination 41 irradiates illumination light upward from below, and the light is set to be in a wavelength band that transmits both the first component P1 and the second component P2. The transmissive portion 42 is a light-transmissive member such as glass embedded in the bonding stage 4, for example. The second component P2 is placed on the upper side of the transmissive portion 42, and the illumination light irradiated from the stage illumination 41 irradiates the workpieces (the first component P1 and the second component P2). With such a configuration, for example, when the first component P1 and the second component P2 are components based on silicon or the like and the stage illumination 41 is infrared light, both the first component P1 and the second component P2 can be transmitted, and thus the marks can be clearly imaged by the camera 31.

[0073] Figure 7 It is a flowchart showing the operation of the positioning device according to the second embodiment. Figure 7 Different from Figure 4 above, step S4 is omitted, and step S11 is executed instead of step S6.

[0074] In step S11, identification operations of the first component P1 and the second component P2 are performed. Specifically, the camera 31 images the first component P1 held by the bonding head 2 and the second component P2 placed on the bonding stage 4. In addition, with regard to the focusing of the camera 31, it may be necessary depending on the situation, but as long as the depth of field allows, the marks M1 and M2 can be imaged without changing the focus position.

[0075] Then, in step S7, the arithmetic unit 6 calculates the position correction amount from the images ( Figure 7 such as the images (b), (c), etc. in

[0076] obtained by imaging the marks M1 and M2).

[0077] (Third Embodiment)

[0078] Figure 8 It shows the positioning device according to the third embodiment. Specifically, Figure 8 (a) is a front view of the positioning device 100, Figure 8 and (b) is a side cross-sectional view of the positioning device 100. The third embodiment is a form for dealing with the case where alignment marks M1 are attached to the lower surface of the first component P1.

[0079] Specifically, different from the first embodiment, a transmissive portion 223 and a camera 7 (second camera) are provided. Further, a transmissive portion 223 is formed in the workpiece holding portion 22 of the bonding head 2. The transmissive portion 223 is, for example, a light transmissive member such as glass embedded in a hole that penetrates the workpiece holding portion 22 in the Z direction. A mark M3 (third mark) is attached to the lower surface of the transmissive portion 223. The mark M3 is attached such that when the workpiece holding portion 22 is viewed from the lower side (-Z direction), it is at a position that does not overlap with the first component P1 held on the lower surface of the workpiece holding portion 22 and is within the imaging field of view of the mark M1. In addition, in the present embodiment, the number of cameras 31 and the number of marks M1 and M3 are the same (two).

[0080] During the period when the bonding head 2 moves from above the component supply unit 5 to above the bonding stage 4 (after step S3 and before step S5), the camera 7 images the lower surface of the workpiece holding portion 22 of the bonding head 2 and the lower surface of the first component P1. In the third embodiment, a mark M1 is attached to the lower surface of the first component P1. That is, during the period when the bonding head 2 moves from above the component supply unit 5 to above the bonding stage 4, the camera 7 images both sets of marks M1 and M3. Two cameras 7 may be arranged to image the marks M1 and M3 simultaneously. Alternatively, the camera 7 may be provided as only one, and at least one of the head or the camera may be moved in the horizontal direction to perform imaging twice.

[0081] Figure 9 It is a flowchart showing the operation of the positioning device according to the third embodiment. Figure 9 Different from Figure 4 After step S3, steps S21 and S22 are executed, and step S23 is executed instead of step S6.

[0082] In step S21, the bonding head 2 is moved above the camera 7 (+Z direction).

[0083] In step S22, identification operations of the first component P1 and the mark M3 are performed. Specifically, the first component P1 held by the bonding head 2 and the lower surface of the workpiece holding portion 22 are imaged by the camera 7. At this time, the marks M1 and M3 are included in the image imaged by the camera 7 (refer to the imaging image of the camera 7 in (a) of Figure 10 . Additionally, depending on the situation, images obtained by focusing on the marks M1 and M3 separately may be required, but as long as the depth of field allows, the marks M1 and M3 may also be imaged in one image without changing the focus position. Then, the arithmetic unit 6 calculates the relative positions of the marks M1 and M3 from this image.

[0084] In step S23, an identification operation of the mark M3 is performed. Specifically, the mark M3 is imaged by the camera 31 (refer toFigure 10 (b) of the imaging image of the camera 31).

[0085] Then, in step S7, the arithmetic device 6 is based on the image captured in step S22 ( Figure 10 image of (a)), the image captured in step S4 (refer to (b) of FIG. 5), and the image captured in step S23 ( Figure 10 image of (b)) to calculate the position correction amount.

[0086] According to the third embodiment, while achieving the same effects as the first embodiment, it is also possible to handle the case where the mark M1 is attached to the lower surface of the first component P1.

[0087] (Fourth Embodiment)

[0088] Figure 11 FIG. shows a side cross-sectional view of the positioning device according to the fourth embodiment. In the fourth embodiment, different from the first embodiment, the bonding head 2 is mounted on a frame 12a different from the frame 12. In addition, the workpiece holding portion 22 of the bonding head 2 is formed in a substantially L shape.

[0089] On the frame 12a, there are provided: a guide rail 211 extending in the X direction; and a rotating shaft 213 that moves on the guide rail 211 and rotates the head driving portion 21 and the workpiece holding portion 22 about the Z direction.

[0090] In the fourth embodiment, the bonding head 2 is disposed on the frame 12a, and the optical component 3 is disposed on the frame 2. That is, the optical component 3 and the bonding head 2 are separately disposed. Thus, similar to the first embodiment, it is possible to suppress the vibration caused by the movement of the bonding head 2 from being transmitted to the camera 31 of the optical component 3, and therefore, it is possible to suppress the reduction of the positioning accuracy. In addition, according to the above structure, the load applied to the frame 12 can be dispersed.

[0091] In addition, in the fourth embodiment, it is possible to correspond to the first to third embodiments and change the form of the workpiece, the structure of the bonding head 2, etc.

[0092] In the embodiment, it is described that when mounting a chip as the first component on a substrate as the second component, but it is not limited thereto, and it can also be used when positioning an imprint mold as the first member with respect to a substrate coated with a resist as the second member, positioning the processing point of a laser as the first member and a bonding member as the second member, positioning a probe as the first member and a measurement point to be measured as the second member, etc.

[0093] In addition, in the case of measurement and processing, the second component is not limited to the lower surface, and it can also be held and disposed on a specific reference surface such as the side surface or the upper surface of the head.

[0094] Industrial Applicability

[0095] The positioning device of the present disclosure can be used during the installation of electronic components, etc., for positioning during manufacturing such as aligning the head with components, processing points, and measurement points arranged on the stage.

[0096] Explanation of Reference Numerals

[0097] 100 Positioning device

[0098] 1 Exterior part

[0099] 12 Frame (vibration damping member)

[0100] 2 Bonding head

[0101] 21 Head drive unit (first moving mechanism)

[0102] 213 Rotation shaft

[0103] 22 Workpiece holding part (holding surface)

[0104] 221, 223 Transmission part

[0105] 3 Optical unit

[0106] 31 (31a, 31b) Camera (first camera)

[0107] 32 (32a, 32b) Lens

[0108] 33 Reflective prism

[0109] 34 (34a, 34b) Mirror

[0110] 351 Coaxial illumination (first light source)

[0111] 352 Oblique light illumination (first light source)

[0112] 4 Bonding stage

[0113] 41 Stage illumination (second light source)

[0114] 5 Component supply unit

[0115] 6 Arithmetic unit

[0116] 7 Camera (second camera)

[0117] A1, A2 Imaging area

[0118] M1 to M3 Marks (first to third marks)

[0119] P1 First component

[0120] P2 Second component.

Claims

1. A positioning device for positioning when mounting a first component on a second component, The positioning device includes: A bonding head for holding the first component; A bonding stage for placing the second component; An optical assembly for imaging at least one of the first component and the second component; and An arithmetic unit for calculating the position correction amounts of the first component and the second component based on the images captured by the optical assembly, A vibration suppression member for suppressing vibration transmitted from the bonding head to the bonding head is disposed between the optical assembly and the bonding head, or the optical assembly and the bonding head are separately disposed, The optical assembly includes: A first camera for imaging the images; A lens disposed corresponding to the first camera; and An optical element for changing the optical axis direction of the first camera, The optical element includes: A reflecting mirror disposed corresponding to the first camera; and A reflecting prism having a reflecting surface, The bonding head includes: A first moving mechanism for separating from the optical assembly and moving the bonding head in a first direction parallel to the placement surface of the bonding stage; and A holding surface for holding the first component on the lower surface, The optical assembly includes: A second moving mechanism for moving the reflecting prism in a second direction perpendicular to the first direction, i.e., the up and down direction.

2. The positioning device according to claim 1, wherein A first mark used for the positioning is attached to the first component, A second mark used for the positioning is attached to the second component, When performing the positioning, The first component and the second component are arranged to overlap in a top view, The reflecting prism is disposed above the first component, The first camera images the first mark and the second mark.

3. The positioning device according to claim 1, wherein The optical assembly includes: A third moving mechanism for moving the reflecting mirror in a third direction perpendicular to the first direction and the second direction; and A fourth moving mechanism for moving the first camera and the lens in the third direction.

4. The positioning device according to claim 1, wherein The positioning device further includes: A first light source for irradiating light on at least one of the first component and the second component at an angle coaxial or oblique to the optical axis of the first camera.

5. The positioning device according to claim 1, wherein The bonding head includes: A transmissive portion for transmitting visible light or infrared light, The first camera images the first component through the transmissive portion.

6. The positioning device according to claim 1, wherein At least one of the first component and the second component is made of a member that transmits visible light or infrared light, The first camera images the first component and the second component simultaneously.

7. The positioning device according to claim 1, wherein The bonding stage includes: A second light source for irradiating visible light or infrared light on at least one of the first component and the second component through the bonding stage.

8. The positioning device according to claim 1, wherein, a third mark capable of imaging from below and above the joining head is attached to the joining head, the positioning device further includes: a second camera that images the third mark and the first component from below the joining head.

9. A positioning method using the positioning device according to any one of claims 1 to 8, comprising: a first step of moving the joining head above a component supply unit that supplies the first component; a second step of the joining head holding the first component; a third step of the optical assembly imaging the second component placed on the joining stage; a fourth step of the joining head moving above the joining stage; a fifth step of the optical assembly imaging the first component held by the joining head; and a sixth step of the arithmetic unit calculating the position correction amount based on the image imaged by the optical assembly.

10. The positioning method according to claim 9, wherein, the positioning method further includes: a seventh step of the arithmetic unit determining whether the position correction amount is within an allowable range, in the seventh step, when the arithmetic unit determines that the position correction amount is not within the allowable range, the relative position of the first component and the second component is corrected. On the other hand, when the arithmetic unit determines that the position correction amount is within the allowable range, the first component and the second component are joined.

11. The positioning method according to claim 9, wherein, a first mark used for the positioning is attached to the first component, in the fifth step, the optical assembly images the first mark through or avoiding the joining head.

12. The positioning method according to claim 11, wherein, a second mark used for the positioning is attached to the second component, after the fourth step, the third step and the fifth step are performed, or the ninth step is performed. In the ninth step, the second component placed on the joining stage and the first component held by the joining head are imaged simultaneously, in the third step or the ninth step, the optical assembly images the second mark through or avoiding the joining head.

13. The component positioning method according to claim 9, wherein, a first mark used for the positioning is attached to the first component, a third mark capable of imaging from below and above the joining head is attached to the joining head, the positioning device further includes: a second camera that images the third mark and the first component from below the joining head, the positioning method further includes: an eighth step of, after the second step, the second camera imaging the first mark and the third mark.

14. The positioning method according to claim 13, wherein, when the second camera images the first mark and the third mark, the second camera performs imaging without moving the horizontal positions of the second camera and the joining head.

15. A positioning device that positions a first member to a second member. The positioning device includes: a head that holds the first member; a stage on which the second member is placed; an optical assembly that images at least one of the first member and the second member; and an arithmetic unit that calculates position correction amounts of the first member and the second member based on an image imaged by the optical assembly. A vibration suppression member for suppressing vibration transmitted from the head to the head is disposed between the optical assembly and the head, or the optical assembly and the head are separately disposed. The optical assembly includes: a first camera for imaging the image; a lens disposed corresponding to the first camera; and an optical element that changes an optical axis direction of the first camera. The optical element includes: a mirror disposed corresponding to the first camera; and a reflecting prism having a reflecting surface. The head includes: a first moving mechanism that is separated from the optical assembly and moves the head in a first direction, which is a direction parallel to the placement surface of the stage; and a holding surface that holds the first member on a reference surface. The optical assembly includes: a second moving mechanism that moves the reflecting prism in a second direction, which is a vertical direction perpendicular to the first direction.

Images