Flexible high-thermal-conductivity gasket as well as preparation method and application thereof

Abstract

The invention discloses a flexible high-thermal-conductivity gasket and a preparation method and application thereof.The preparation method includes the steps that a one-dimensional thermal-conductivity filler, a polymer matrix and a solvent are mixed and evenly stirred to obtain mixed slurry, the mass ratio of the polymer matrix to the solvent is 1: 2-1: 5, and the mass ratio of the polymer matrix to the one-dimensional thermal-conductivity filler is 4: 3-2: 3; transferring the mixed slurry in the step (1) into a magnetic field; and curing the mixed slurry obtained in the step (2) to obtain the flexible high-thermal-conductivity gasket. The method is simple and efficient, and the heat-conducting gasket which is high in orientation degree and has beneficial heat conductivity and mechanical property can be prepared.

Description

Technical Field

[0001] The present invention relates to the field of thermal conductive silicone pads, and particularly to a carbon fiber thermal conductive pad and its preparation method and application. Background Art

[0002] In order to obtain better performance while reducing the overall size, the power density of electronic devices has been continuously increasing. However, the accompanying increase in heat generation, combined with limited heat dissipation capacity, poses limitations to the performance and lifespan of the devices. Therefore, a thermal management system is integrated into electronic devices to facilitate heat transfer. As a key component of these systems, thermal interface materials are used to fill the gap between the metal plate heat sink and the heat generator. This helps to reduce the thermal contact resistance and solve the interface heat transfer problem.

[0003] An ideal thermal interface material is required to have good mechanical properties to match its inherent surface roughness and maintain good contact between the heater and the heat sink during thermal cycling, while also having excellent heat transfer performance. Polymer materials are widely used in thermal interface materials due to their excellent mechanical properties and processability.

[0004] However, the low thermal conductivity of polymer materials limits their applications. Generally, the thermal conductivity of polymer materials is enhanced by adding high thermal conductivity materials such as metals, ceramics, and carbon-based fillers. Carbon fiber has become a key material for research in recent years due to its high thermal conductivity and excellent corrosion resistance. However, due to the anisotropic thermal conductivity of carbon fiber, the arrangement orientation of carbon fiber has become a technical difficulty that needs to be urgently solved.

[0005] Chinese Patent No. CN 116769195A discloses a carbon fiber thermal conductive pad and its preparation method. The preparation method includes the following steps: (1) Immerse the carbon fibers arranged in the same direction into a polymer matrix and obtain a composite material through crosslinking and curing; (2) Cut the composite material obtained in step (1) along the axial direction perpendicular to the carbon fibers into thermal conductive pads. The present invention uses silicone rubber as the matrix and carbon fiber as the filler, and prepares a thermal conductive pad by controlling the vertical penetration orientation of the carbon fiber in the polymer matrix. The prepared thermal conductive pad not only has high thermal conductivity but also high flexibility, enabling it to be applied to the field of electronic packaging thermal management and showing excellent heat dissipation capacity under different packaging pressures. This patent application first vertically arranges high thermal conductivity carbon fiber long filaments to form its orientation structure, and after compounding with the polymer matrix, cuts along its orientation direction to obtain a thermal conductive pad with ultra-high normal thermal conductivity. However, the acquisition of the high thermal conductivity carbon fiber long filaments and the mechanical properties of the pads still cannot meet the requirements.

[0006] A Chinese patent with the patent number CN 118599318A, a carbon fiber thermal conductive gasket and its preparation method, first modifies carbon fiber short fibers with iron oxide, and then mixes them with a polymer matrix, and prepares a carbon fiber gasket with high orientation and good mechanical properties through magnetic field orientation. However, this preparation method is not only cumbersome, requires modification of carbon fibers, but also difficult to achieve a high filler content, so the thermal conductivity is still low.

[0007] Therefore, there is an urgent need to design a method that not only considers excellent thermal conductivity but also requires the gasket to have excellent mechanical properties for application in next-generation electronic products. Summary of the Invention

[0008] The present invention provides a method for preparing a flexible high thermal conductivity gasket, which is simple, efficient, and can prepare a thermal conductivity gasket with a high degree of orientation, beneficial thermal conductivity, and mechanical properties.

[0009] The present invention provides a method for preparing a flexible high thermal conductivity gasket, including:

[0010] (1) Mix one-dimensional thermal conductive filler, polymer matrix, and solvent evenly by stirring to obtain a mixed slurry. The mass ratio of the polymer matrix to the solvent is 1:2 - 1:5, and the mass ratio of the polymer matrix to the one-dimensional thermal conductive filler is 4:3 - 2:3;

[0011] (2) Transfer the mixed slurry in step (1) to a magnetic field;

[0012] (3) Cure the mixed slurry obtained in step (2) to obtain a flexible high thermal conductivity gasket.

[0013] Preferably, the viscosity of the mixed slurry is 2 - 10 mPa·s.

[0014] Preferably, the intensity of the magnetic field is 0.1 - 0.4 T. Since the viscosity of the mixed slurry provided by the present invention is low, compared with the high magnetic field intensity provided by the prior art, the lower magnetic field intensity provided by the present invention can obtain highly oriented one-dimensional thermal conductive fillers.

[0015] Preferably, the mass ratio of the polymer matrix to the one-dimensional thermal conductive filler is 2:2 - 2:3. By further controlling the content of the one-dimensional thermal conductive filler, the present invention can not only completely wrap the one-dimensional thermal conductive filler but also add as many one-dimensional thermal conductive fillers as possible inside the polymer matrix, and at the same time obtain high orientation, so as to balance mechanical properties and thermal conductivity.

[0016] Preferably, the length of the one-dimensional thermal conductive filler is 250 - 500 μm, the diameter is 5 - 15 μm, and the aspect ratio is 25 - 50.

[0017] By controlling the length, diameter, and aspect ratio of the one-dimensional thermal conductive filler, the present invention enables the one-dimensional thermal conductive filler to have a suitable contact area, good thermal conductivity. At the same time, the appropriate aspect ratio makes the orientation of the one-dimensional thermal conductive filler easier. The selection of the aspect ratio can balance the interaction between carbon fibers and the efficiency of heat conduction, avoiding excessive contact or difficult orientation, thereby maintaining the excellent thermal conductivity of the composite material.

[0018] Preferably, the solvent is ethyl acetate, cyclohexane, toluene, dichloromethane, or chloroform, and the one-dimensional thermal conductive filler is pitch-based carbon fiber.

[0019] Preferably, the polymer matrix is silicone rubber, and the silicone rubber is polydimethylsiloxane added with a curing agent and a catalyst.

[0020] Preferably, the curing agent is hydrogen-containing silicone oil, and the catalyst is tetramethyldisiloxane platinum.

[0021] Preferably, the mass ratio of the curing agent, catalyst, and polydimethylsiloxane is 0.02 - 0.03:0.01:1. This ratio design is precisely optimized to ensure the synergistic effect of each component during the curing process, control the content of the curing agent and catalyst, avoid too fast curing reaction, resulting in incomplete reaction or uneven curing, and at the same time control the curing time to ensure the overall production efficiency.

[0022] Preferably, in step (1), the mixing time is 1 - 2 minutes, and the stirring speed is 3000 - 3500 rpm. The control of the mixing time and stirring speed is crucial for ensuring the uniform distribution of each component. By controlling the stirring speed and mixing time, each component is fully mixed to form a uniform slurry, which is beneficial to the curing reaction and thus obtains higher thermal conductivity.

[0023] Preferably, before curing the mixed slurry obtained in step (2), the mixed slurry obtained in step (2) is shaken.

[0024] Shaking in the present invention helps the close packing between carbon fibers, ensures the effective support between carbon fibers, and at the same time optimizes the orientation of carbon fibers, thereby improving the efficiency of the thermal conduction network. Shaking can also promote uniform distribution and avoid affecting the continuity of the heat conduction path due to uneven packing.

[0025] Preferably, the curing temperature is 40 - 80 °C. By controlling the curing temperature in the present invention, the rapid volatilization of ethyl acetate is avoided, which may cause pores to form during the curing process and affect the final thermal conductivity. At the same time, it can also avoid a slow curing process or even incomplete curing, which may affect the mechanical properties and thermal conductivity of the material.

[0026] Furthermore, in step (3), the platform during curing should be kept flat. Subtle inclination will cause uneven thickness of the sample during curing, thereby affecting the forming effect and its thermal conductivity. To ensure the quality of the sample, the curing platform must be kept horizontal.

[0027] On the other hand, the present invention also provides a flexible high thermal conductivity gasket, which is prepared by the preparation method of the flexible high thermal conductivity gasket.

[0028] Preferably, the thickness of the flexible high thermal conductivity gasket is 0.5 - 1 mm, so as to meet the specification requirements of different electronic device heat dissipation needs.

[0029] Preferably, the density of the flexible high thermal conductivity gasket is 1.31 - 1.44 g·cm-3. Compared with traditional thermal conductive materials, the carbon fiber thermal conductivity gasket of the present invention has a lower density, far lower than that of commonly used heat dissipation materials. The low density not only enables it to effectively reduce the overall weight, but also can reduce the overall material cost while ensuring good thermal conductivity.

[0030] Preferably, the thermal conductivity coefficient of the flexible high thermal conductivity gasket is 85.52 - 141.57 W m-1K-1. This thermal conductivity performance is optimized according to factors such as the aspect ratio, density, and orientation of carbon fibers. The high thermal conductivity coefficient ensures that the material can play an excellent role in the heat dissipation of electronic devices.

[0031] Preferably, the present invention also provides the application of the flexible high thermal conductivity gasket in the field of heat dissipation of electronic devices.

[0032] Due to its excellent thermal conductivity and mechanical properties, the carbon fiber thermal conductivity gasket can effectively improve the heat dissipation efficiency of electronic devices, extend the service life of the equipment, and provide a new heat dissipation material solution for the electronics industry.

[0033] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0034] The present invention controls the content of the solvent to obtain a mixed slurry with appropriate viscosity, thereby reducing the restraint of viscosity on the one-dimensional thermal conductive filler, enabling the one-dimensional thermal conductive filler to achieve high orientation under a lower magnetic field intensity by virtue of its diamagnetism. Since no other fillers are introduced, the thermal conductivity gasket obtained by the present invention has a relatively high thermal conductivity while having a low density.

[0035] Since the present invention adds a solvent to dilute the polymer matrix, it makes the one-dimensional thermal conductive filler easier to turn under the action of the magnetic field, enabling the content of the one-dimensional thermal conductive filler provided by the present invention to be at a relatively high level, improving the thermal conductivity. At the same time, the present invention provides an upper limit for the content of the one-dimensional thermal conductive filler to avoid incomplete wrapping of carbon fibers, thereby affecting the mechanical properties and heat conduction efficiency of the sample. Description of the Drawings

[0036] Figure 1 This is a SEM image of the high thermal conductivity gasket prepared in Example 1;

[0037] Figure 2 This is a SEM image of the high thermal conductivity gasket prepared in Example 3;

[0038] Figure 3 This is a SEM image of the high thermal conductivity gasket prepared in Comparative Example 1;

[0039] Figure 4 This is an optical image of the high thermal conductivity gasket prepared in Comparative Example 2. DETAILED DESCRIPTION

[0040] The present application is described in detail below with reference to embodiments.

[0041] Unless otherwise specified, the raw materials in the examples of this application were purchased through commercial channels.

[0042] The test method of thermal conductivity is: using a laser thermal conductivity meter to test in accordance with the standard ASTM E1461-2013.

[0043] Example 1

[0044] Raw materials: 0.8 g of carbon fiber with an aspect ratio of 25, 0.8 g of polydimethylsiloxane, 0.5 g of hydrogenated silicone oil, 0.2 g of platinum tetramethyldisiloxane, and 3.5 g of ethyl acetate.

[0045] First, place 0.8g of polydimethylsiloxane in a mixing cup, and then mix 3.5g of ethyl acetate in a mixer for 5 minutes at a speed of 2500-3000rpm to obtain a dilute polydimethylsiloxane solution with a solution viscosity of 2.3mPa·s. Finally, add 0.5g of hydrogenated silicone oil and 0.2g of platinum tetramethyldisiloxane and continue mixing for 5 minutes according to the above parameters. Then add 0.8g of carbon fiber to the dilute polydimethylsiloxane solution, mix thoroughly and evenly, and then transfer to a 0.3T magnetic field. After the carbon fiber precipitation in the solution is tightly stacked, it is transferred to a 55℃ environment for curing. The curing time is about 6-7h, and a high thermal conductivity carbon fiber gasket is obtained. The through-surface thermal conductivity of the gasket is 85.52W m-3 after being tested by a laser thermal conductivity meter. -1 K -1 .

[0046] The SEM image of the prepared low-content high-conductivity gasket is as follows Figure 1 As shown, the anisotropic one-dimensional thermal conductive filler is densely arranged in the vertical direction in the polymer matrix, but the surface of the sample is covered by silica gel due to the low filler content.

[0047] Example 2

[0048] Raw materials: 1 g of carbon fiber with an aspect ratio of 25, 0.8 g of polydimethylsiloxane, 0.5 g of hydrogen-containing silicone oil, 0.2 g of tetramethyldisiloxane platinum, and 3.5 g of ethyl acetate.

[0049] First, place 0.8 g of polydimethylsiloxane in a mixing cup, then mix 3.5 g of ethyl acetate in a mixer for 5 min at a rotational speed of 2500 - 3000 rpm to obtain a dilute solution of polydimethylsiloxane. Finally, add 0.5 g of hydrogen-containing silicone oil and 0.2 g of tetramethyldisiloxane platinum and continue mixing for 5 min according to the above parameters. Then add 1 g of carbon fiber to the dilute solution of polydimethylsiloxane, mix well, and transfer it to a magnetic field of 0.3 T. After the carbon fibers in the solution are tightly packed by precipitation, transfer it to an environment at 55 °C for curing. The curing time is about 6 - 7 h to obtain a high thermal conductivity carbon fiber gasket. After testing with a laser thermal conductivity meter, the through-plane thermal conductivity of the gasket is 116.95 W m -1 K -1 。

[0050] Example 3

[0051] Raw materials: 1.2 g of carbon fiber with an aspect ratio of 25, 0.8 g of polydimethylsiloxane, 0.5 g of hydrogen-containing silicone oil, 0.2 g of tetramethyldisiloxane platinum, and 3.5 g of ethyl acetate.

[0052] First, place 0.8 g of polydimethylsiloxane in a mixing cup, then mix 3.5 g of ethyl acetate in a mixer for 5 min at a rotational speed of 2500 - 3000 rpm to obtain a dilute solution of polydimethylsiloxane with a solution viscosity of 2.3 mPa·s. Finally, add 0.5 g of hydrogen-containing silicone oil and 0.2 g of tetramethyldisiloxane platinum and continue mixing for 5 min according to the above parameters. Then add 1.2 g of carbon fiber to the dilute solution of polydimethylsiloxane, mix well, and transfer it to a magnetic field of 0.3 T. After the carbon fibers in the solution are tightly packed by precipitation, transfer it to an environment at 55 °C for curing. The curing time is about 6 - 7 h to obtain a high thermal conductivity carbon fiber gasket. After testing with a laser thermal conductivity meter, the through-plane thermal conductivity of the gasket is 141.47 W m -1 K -1 。

[0053] The SEM image of the prepared high thermal conductivity gasket is as Figure 2 shown, and the anisotropic one-dimensional thermal conductive fillers are densely arranged in the vertical direction in the polymer matrix.

[0054] Example 4

[0055] Raw materials: 0.8 g of carbon fiber with an aspect ratio of 25, 0.8 g of polydimethylsiloxane, 0.5 g of hydrogen-containing silicone oil, 0.2 g of tetramethyldisiloxane platinum, and 2.5 g of ethyl acetate.

[0056] First, place 0.8 g of polydimethylsiloxane in a mixing cup, then mix 2.5 g of ethyl acetate in a mixer for 5 min at a rotation speed of 2500 - 3000 rpm to obtain a dilute polydimethylsiloxane solution with a solution viscosity of 4.1 mPa·s. Finally, add 0.5 g of hydrogen-containing silicone oil and 0.2 g of platinum tetramethyldisiloxane and continue to mix for 5 min according to the above parameters. Then add 0.8 g of carbon fiber to the dilute polydimethylsiloxane solution, transfer it to a 0.3 T magnetic field after mixing evenly. After the carbon fiber in the solution precipitates and tightly accumulates, transfer it to an environment at 55 °C for curing, and the curing time is about 6 - 7 h, then a high thermal conductivity carbon fiber gasket is obtained. After testing with a laser thermal conductivity meter, the through-plane thermal conductivity of the gasket is 65.23 W m -1 K -1 。

[0057] Example 5

[0058] Raw materials: 0.8 g of carbon fiber with an aspect ratio of 25, 0.8 g of polydimethylsiloxane, 0.5 g of hydrogen-containing silicone oil, 0.2 g of platinum tetramethyldisiloxane, 1.6 g of ethyl acetate.

[0059] First, place 0.8 g of polydimethylsiloxane in a mixing cup, then mix 1.5 g of ethyl acetate in a mixer for 5 min at a rotation speed of 2500 - 3000 rpm to obtain a dilute polydimethylsiloxane solution with a solution viscosity of 8.2 mPa·s. Finally, add 0.5 g of hydrogen-containing silicone oil and 0.2 g of platinum tetramethyldisiloxane and continue to mix for 5 min according to the above parameters. Then add 0.8 g of carbon fiber to the dilute polydimethylsiloxane solution, transfer it to a 0.3 T magnetic field after mixing evenly. After the carbon fiber in the solution precipitates and tightly accumulates, transfer it to an environment at 55 °C for curing, and the curing time is about 6 - 7 h, then a high thermal conductivity carbon fiber gasket is obtained. After testing with a laser thermal conductivity meter, the through-plane thermal conductivity of the gasket is 55.25 W m -1 K -1 。

[0060] Comparative Example 1

[0061] Raw materials: 1.2 g of carbon fiber with an aspect ratio of 100, 0.8 g of polydimethylsiloxane, 0.5 g of hydrogen-containing silicone oil, 0.2 g of platinum tetramethyldisiloxane, 3.5 g of ethyl acetate.

[0062] First, place 0.8 g of polydimethylsiloxane in a mixing cup, then mix 3.5 g of ethyl acetate in a mixer for 5 min at a rotation speed of 2500 - 3000 rpm to obtain a dilute polydimethylsiloxane solution. Finally, add 0.5 g of hydrogen-containing silicone oil and 0.2 of tetramethyldisiloxane platinum, and continue mixing for 5 min according to the above parameters. Then add 1.2 g of carbon fiber to the dilute polydimethylsiloxane solution, transfer it to a magnetic field of 0.3 T after mixing evenly. After the carbon fibers in the solution are tightly packed and precipitated, transfer it to an environment at 55 °C for curing, and the curing time is about 6 - 7 h, thus obtaining a high thermal conductivity carbon fiber gasket. After testing with a laser thermal conductivity meter, the through-plane thermal conductivity of the gasket is 50.51 W m -1 K -1 。

[0063] The SEM image of the prepared high thermal conductivity gasket is as Figure 3 shown. The anisotropic one-dimensional thermal conductive filler has a certain orientation in the polymer matrix. However, the carbon fiber, which is an anisotropic one-dimensional thermal conductive filler, has a low degree of regularity in the vertical direction and has more voids. Compared with Example 3, the continuous and dense lap joint of the anisotropic one-dimensional thermal conductive filler is not achieved, so the thermal conductivity is also significantly lower than that of Example 3.

[0064] Comparative Example 2

[0065] Raw materials: 1.2 g of carbon fiber with an aspect ratio of 300, 0.8 g of polydimethylsiloxane, 0.5 g of hydrogen-containing silicone oil, 0.2 g of tetramethyldisiloxane platinum, and 3.5 g of ethyl acetate.

[0066] First, place 0.8 g of polydimethylsiloxane in a mixing cup, then mix 3.5 g of ethyl acetate in a mixer for 5 min at a rotation speed of 2500 - 3000 rpm to obtain a dilute polydimethylsiloxane solution. Finally, add 0.5 g of hydrogen-containing silicone oil and 0.2 of tetramethyldisiloxane platinum, and continue mixing for 5 min according to the above parameters. Then add 1.2 g of carbon fiber to the dilute polydimethylsiloxane solution, transfer it to a magnetic field of 0.3 T after mixing evenly. After the carbon fibers in the solution are tightly packed and precipitated, transfer it to an environment at 55 °C for curing, and the curing time is about 6 - 7 h.

[0067] The optical image of the prepared high thermal conductivity gasket is as Figure 4 shown. The anisotropic one-dimensional thermal conductive filler carbon fiber is too long and difficult to be impregnated by the solution, so the sample cannot be formed.

[0068] Comparative Example 3

[0069] Raw materials: 0.8 g of carbon fiber with an aspect ratio of 25, 0.8 g of polydimethylsiloxane, 0.5 g of hydrogen-containing silicone oil, 0.2 g of tetramethyldisiloxane platinum, and 0.5 g of ethyl acetate.

[0070] First, place 0.8 g of polydimethylsiloxane in a mixing cup, then mix 0.5 g of ethyl acetate in a mixer for 5 min at a rotation speed of 2500 - 3000 rpm to obtain a dilute polydimethylsiloxane solution with a solution viscosity of 55.37 mPa·s. Finally, add 0.5 g of hydrogen-containing silicone oil and 0.2 g of platinum tetramethyldisiloxane and continue mixing for 5 min according to the above parameters. Then add 0.8 g of carbon fiber to the dilute polydimethylsiloxane solution, transfer it to a 0.3 T magnetic field after mixing evenly. After the carbon fiber in the solution precipitates and accumulates tightly, transfer it to an environment at 55 °C for curing, and the curing time is about 6 - 7 h to obtain a high thermal conductivity carbon fiber gasket. After testing with a laser thermal conductivity meter, the through-plane thermal conductivity of the gasket is 15.52 W m -1 K -1 。

[0071] Comparative Example 4

[0072] Raw materials: 2 g of carbon fiber with an aspect ratio of 25, 0.8 g of polydimethylsiloxane, 0.5 g of hydrogen-containing silicone oil, 0.2 g of platinum tetramethyldisiloxane, and 3.5 g of ethyl acetate.

[0073] First, place 0.8 g of polydimethylsiloxane in a mixing cup, then mix 3.5 g of ethyl acetate in a mixer for 5 min at a rotation speed of 2500 - 3000 rpm to obtain a dilute polydimethylsiloxane solution with a solution viscosity of 2.3 mPa·s. Finally, add 0.5 g of hydrogen-containing silicone oil and 0.2 g of platinum tetramethyldisiloxane and continue mixing for 5 min according to the above parameters. Then add 22 g of carbon fiber to the dilute polydimethylsiloxane solution, transfer it to a 0.3 T magnetic field after mixing evenly. After the carbon fiber in the solution precipitates and accumulates tightly, transfer it to an environment at 55 °C for curing, and the curing time is about 6 - 7 h to obtain a high thermal conductivity carbon fiber gasket. After testing with a laser thermal conductivity meter, the through-plane thermal conductivity of the gasket is 13.52 W m -1 K -1 。

[0074] The above are only several embodiments of the present application, and do not impose any form of limitation on the present application. Although the present application is disclosed above with preferred embodiments, it is not intended to limit the present application. Any person skilled in the art, without departing from the scope of the technical solution of the present application, making some changes or modifications using the technical content disclosed above is equivalent to equivalent implementation cases and all belong to the scope of the technical solution.

Claims

1. A preparation method of a flexible high thermal conductivity gasket, characterized in that, Comprising: (1) Mixing a one-dimensional thermal conductive filler, a polymer matrix and a solvent, and stirring evenly to obtain a mixed slurry, where the mass ratio of the polymer matrix to the solvent is 1:2 - 1:5, and the mass ratio of the polymer matrix to the one-dimensional thermal conductive filler is 4:3 - 2:3; (2) Transferring the mixed slurry obtained in step (1) to a magnetic field; (3) Curing the mixed slurry obtained in step (2) to obtain a flexible high thermal conductive gasket.

2. The preparation method of the flexible high thermal conductive gasket according to claim 1, characterized in that the viscosity of the mixed slurry is 2 - 10 mPa·s.

3. The preparation method of the flexible high thermal conductivity gasket according to claim 1, wherein, The intensity of the magnetic field is 0.1 - 0.4 T.

4. The preparation method of the flexible high thermal conductivity gasket according to claim 1, wherein The mass ratio of the polymer matrix to the one-dimensional thermal conductive filler is 2:2 - 2:

3.

5. The preparation method of the flexible high thermal conductivity gasket according to claim 1 is characterized in that, The length of the one-dimensional thermal conductive filler is 250 - 500 μm, the diameter is 5 - 15 μm, and the aspect ratio is 25 - 50.

6. The preparation method of the flexible high thermal conductivity gasket according to claim 1, wherein, The solvent is ethyl acetate, cyclohexane, toluene, dichloromethane or chloroform; The one-dimensional thermal conductive filler is pitch-based carbon fiber.

7. The preparation method of the flexible high thermal conductivity gasket according to claim 1, characterized in that, Before curing the mixed slurry obtained in step (2), the mixed slurry obtained in step (2) is shaken.

8. The preparation method of the flexible high thermal conductivity gasket according to claim 1, characterized in that, The temperature of the curing is 40 - 80 °C.

9. A flexible high thermal conductivity gasket, characterized in that Prepared by the preparation method of the flexible high thermal conductive gasket according to any one of claims 1 - 8.

10. An application of the flexible high thermal conductive gasket according to claim 9 in the field of heat dissipation of electronic devices.

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