Lower electrode arrangement and semiconductor process apparatus

Abstract

The application provides a lower electrode device and a semiconductor processing equipment. The device comprises: a chuck assembly for carrying a wafer; a radio frequency feeding component arranged at the center of the bottom of the chuck assembly, and provided with a hollow space and at least three openings, the at least three openings are uniformly distributed along the circumference of the radio frequency feeding component, and each opening penetrates from the outer circumferential surface of the radio frequency feeding component to the inner circumferential surface constituting the hollow space; a lifting driving component arranged in the hollow space and arranged at the same potential as the radio frequency feeding component; and at least three connecting components, each connected with the driving part of the lifting driving component for lifting under the driving of the lifting driving component; and each connecting component extends to the outside of the hollow space through each opening one by one for connecting with each needle device of the semiconductor processing equipment respectively.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more specifically, to a lower electrode device and semiconductor process equipment. Background Technology

[0002] With the rapid development of the semiconductor industry, the demand for etching equipment, as a key piece of equipment in the semiconductor manufacturing process, is constantly increasing. Within etching equipment, the lower electrode structure is one of the most important components affecting the etching effect.

[0003] The existing lower electrode structure mainly includes RF feed, helium back interface, cooling pipeline interface, and temperature measurement fiber optic interface. Among them, RF feed is the core part of the lower electrode structure. It feeds RF energy into the lower electrode and then transfers it to the electrostatic chuck, ensuring that the RF energy is evenly distributed around the circumference of the electrostatic chuck, thereby generating uniform plasma and meeting the high requirements of the etching process for plasma uniformity.

[0004] However, radio frequency (RF) feeds carry extremely high energy, which can easily break down the surrounding air and cause arcing with surrounding metal components, leading to device damage. To prevent RF from arcing with surrounding components, existing technologies typically employ two methods: one is to maintain a sufficient distance between the surrounding metal components and the RF feed device; the other is to add non-metallic components for isolation between them.

[0005] In existing technologies, the RF feed structure and three-pin lifting structure of the lower electrode have an RF column located at the center of the lower electrode, transferring RF energy to the electrostatic chuck via an interface plate. The cylinder of the three-pin lifting structure is offset at the edge of the lower electrode and connected to the interface plate via a resin cylinder fixing block. While this design reduces the risk of arcing to some extent, it also has some drawbacks. First, in high aspect ratio etching processes, higher RF energy is required, necessitating a greater arc-proof safety distance. However, the space at the lower electrode is limited, making the RF feed structure and the three-pin lifting structure prone to arcing. Second, increasing the distance between the RF feed and surrounding metal components to reduce the risk of arcing occupies space at the lower electrode, making the installation, disassembly, and maintenance of the three-pin mechanism difficult. Summary of the Invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a lower electrode device and semiconductor process equipment, which can eliminate the risk of arcing between the RF feed and the surrounding metal devices, while increasing the space for installation, disassembly and maintenance of the ejector pin device, and will not affect the uniformity of the RF circuit.

[0007] To achieve the objectives of this invention, a lower electrode device is provided, applicable to semiconductor process equipment, comprising:

[0008] Chuck assembly, used to carry wafers;

[0009] An RF feed component is disposed at the center of the bottom of the chuck assembly, and has a hollow space and at least three openings. The at least three openings are evenly distributed along the circumference of the RF feed component, and each opening extends from the outer peripheral surface of the RF feed component to the inner peripheral surface constituting the hollow space.

[0010] A lifting drive component is disposed in the hollow space and is equipotentially positioned with the radio frequency feed component; and

[0011] At least three connecting components are connected to the driving part of the lifting driving component for lifting and lowering under the drive of the lifting driving component; and each connecting component extends through each of the openings to the outside of the hollow space for connection with the ejector pin device of the semiconductor process equipment.

[0012] In some embodiments, the lifting drive component includes a first cylinder and a first cylinder rod, wherein the first cylinder is disposed in the hollow space and is fixedly connected to the radio frequency feed component;

[0013] One end of the first cylinder rod is located in the first cylinder body and divides the interior of the first cylinder body into two first spaces; the other end of the first cylinder rod serves as the driving part of the lifting drive component, extends vertically upward through the top of the first cylinder body and extends to the outside of the first cylinder body, and is fixedly connected to each of the connecting components.

[0014] The lifting and lowering of the first cylinder rod is controlled by selectively introducing fluid into one of the first spaces, thereby causing the connecting components to lift and lower synchronously.

[0015] In some embodiments, the lifting drive component further includes a second cylinder and a second cylinder rod. The second cylinder is located between the bottom surface of the first cylinder and the bottom surface constituting the hollow space. The second cylinder is fixedly connected to the first cylinder and the radio frequency feed component, respectively, and is electrically conductive.

[0016] One end of the second cylinder rod is located in the second cylinder body and is electrically connected to the second cylinder body, dividing the interior of the second cylinder body into two second spaces; the other end of the second cylinder rod extends vertically downward through the bottom of the hollow space and extends to the outside of the second cylinder body and the radio frequency feed component, for connection with a designated fixing component;

[0017] The lifting and lowering of the second cylinder is controlled by selectively introducing fluid into one of the second spaces, which in turn drives the radio frequency feed component to lift and lower synchronously.

[0018] In some embodiments, each of the connecting components is a connecting rod, and at least three of the connecting rods are evenly distributed around the circumference of the RF feed component, and one end of each of the at least three connecting rods is fixedly connected to the other end of the first cylinder rod through a central connecting portion; the other ends of the at least three connecting rods pass through each of the openings one by one and extend out of the hollow space along different radial directions of the RF feed component.

[0019] The central connecting portion is electrically connected to each of the connecting rods and the first cylinder rod.

[0020] In some embodiments, the lower electrode device further includes at least three height adjustment structures, each of which is used to connect each of the connecting components to the corresponding ejector pin device in a one-to-one correspondence, and is capable of adjusting the height of the corresponding ejector pin device.

[0021] In some embodiments, each height adjustment structure includes a mounting component, a first adjusting member, and a second adjusting member. The mounting component is located below the corresponding connecting component and is fixedly connected to the corresponding ejector pin device. The first adjusting member supports the mounting component, extends vertically through the mounting component, and is threadedly connected to the connecting component, for rotating to raise or lower the mounting component relative to the connecting component. The second adjusting member extends vertically through the mounting component and is threadedly connected to the connecting component. The second adjusting member is configured to adjust the distance between the mounting component and the connecting component to raise or lower the mounting component relative to the connecting component.

[0022] In some embodiments, the second adjusting member includes an adjusting screw and an adjusting nut. The stud of the adjusting screw passes through the mounting component in a vertical direction and is fixedly connected to the connecting component. The adjusting nut is sleeved on the stud and head of the adjusting screw and is located below the mounting component. The adjusting nut is threadedly connected to the stud and supports the mounting component.

[0023] In some embodiments, the radio frequency feed component includes a cylinder coaxially disposed with the chuck assembly for feeding radio frequency power to the chuck assembly; the interior of the cylinder forms the hollow space; the opening extends radially through the circumferential wall of the cylinder.

[0024] In some embodiments, the chuck assembly includes a chuck body and an interface disk disposed below the chuck body;

[0025] The cylinder is fixedly connected to the center of the bottom of the interface plate.

[0026] As another technical solution, the present invention also provides a semiconductor process apparatus, comprising:

[0027] The lower electrode device provided by the present invention;

[0028] At least three ejector pin devices are evenly distributed around the circumference of the chuck assembly in the lower electrode device, and rise above the bearing surface of the chuck assembly or descend below the bearing surface under the drive of each of the connecting components.

[0029] The present invention has the following beneficial effects:

[0030] The lower electrode device provided by this invention features a hollow structure for the RF feed component, comprising a hollow space and at least three openings. The lifting drive component is housed within this hollow space, and is positioned at the same potential as the RF feed component. This eliminates the risk of discharge arcing due to potential differences, thereby improving the safety and reliability of the device. Furthermore, by placing the lifting drive component within the hollow space and connecting its drive mechanism to each ejector pin via connecting components, the space occupied by the lifting drive component is reduced while still achieving the lifting of the ejector pins. Compared to existing technologies, additional space is no longer needed to maintain a safe distance between the RF feed component and the ejector pins, thus providing more space for the maintenance of the entire lower electrode device and facilitating its installation, disassembly, and maintenance. Furthermore, since the RF feed component is located at the center of the bottom of the chuck assembly, and the lifting drive component is integrated equipotentially into the hollow space of the RF feed component, a uniform RF circuit can be formed to generate uniform plasma. This eliminates the risk of arcing and increases maintenance space without negatively impacting the high requirements for plasma uniformity in the etching process, thus ensuring the high performance and high precision of the etching equipment.

[0031] The semiconductor process equipment provided by the present invention can completely eliminate the risk of discharge arcing caused by potential difference by adopting the lower electrode device provided by the present invention, thereby improving the safety and reliability of the equipment. At the same time, it increases the space for installation, disassembly and maintenance of the ejector pin device, and does not affect the uniformity of the radio frequency circuit. Attached Figure Description

[0032] Figure 1 A structural diagram of the lower electrode device provided for related technologies;

[0033] Figure 2 A partially enlarged view of the lower electrode device provided for related technologies;

[0034] Figure 3 This is a structural diagram of the lower electrode device provided in an embodiment of the present invention;

[0035] Figure 4A cross-sectional view of the lower electrode device provided in an embodiment of the present invention;

[0036] Figure 5 This is a structural diagram of the interface disk and its underlying components in an embodiment of the present invention;

[0037] Figure 6 This is a top view of the interface disk in an embodiment of the present invention;

[0038] Figure 7 This is a structural diagram of the radio frequency feed component in an embodiment of the present invention;

[0039] Figure 8 This is a cross-sectional view of the lifting drive component in an embodiment of the present invention;

[0040] Figure 9 This is a structural diagram of the connecting component installed on the radio frequency feed component in an embodiment of the present invention;

[0041] Figure 10 This is a partial enlarged view of the connection between the connecting component and the lifting drive component in an embodiment of the present invention;

[0042] Figure 11 This is a schematic diagram of the radio frequency circuit where the lower electrode device is located, as provided in an embodiment of the present invention. Detailed Implementation

[0043] To enable those skilled in the art to better understand the technical solution of the present invention, the lower electrode device and semiconductor process equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0044] Please see Figure 1The related technology provides a lower electrode device 01, which includes an electrostatic chuck 011, an interface plate 012, a cylinder 013, a cylinder fixing block 014, a cylinder connector 015, a height adjustment mechanism 016, and an RF column 017. The RF column 017 is fixedly connected to the interface plate 012 at its bottom center position using screws, feeding RF energy from the center position into the interface plate 012, and then transmitting it to the electrostatic chuck 011 through the interface plate 012, ensuring uniform RF energy distribution along the circumference of the electrostatic chuck 011. The cylinder 013 is biased and fixed to the bottom edge of the interface plate 012 by a resin-made cylinder fixing block 014. The resin-made cylinder fixing block 014 insulates the cylinder 013 from the interface plate 012, preventing RF path offset caused by current from the interface plate 012 being transmitted to the cylinder 013, thus affecting the uniformity of RF transmission. The cylinder rod of cylinder 013 is connected to the height adjustment mechanism 016 via cylinder connector 015. Driven by cylinder 013, the height adjustment mechanism 016 moves up and down. The height adjustment mechanism 016 includes an annular base 0161 and adjusting blocks. The annular base 0161 is arranged around the radio frequency column 017 and is fixedly connected to the cylinder connector 015. The annular base 0161 is connected to three ejector pin devices 018 via three adjusting blocks 0162. The adjusting blocks 0162 can adjust the height of the ejector pin devices 018 so that the tops of the three ejector pin devices 018 are flush.

[0045] Specifically, please refer to Figure 2 The ejector pin device 018 in the related technology includes an ejector pin (not shown in the figure) and a bellows 0182 sleeved on the ejector pin. The upper end of the bellows 0182 is sealed to the interface plate 012 via a resin isolator 0183, and the lower end is sealed to the outer peripheral wall of the mounting post located below the ejector pin. The resin isolator 0183 is used to prevent the radio frequency path from being deflected due to the current on the interface plate 012 being transmitted to the cylinder 013 through the bellows 0182. One end of the adjusting block 0162 is connected to the annular base 0161 via an adjusting screw 0163, and the other end is fixedly connected to the ejector pin. The adjusting block 0162, the ejector pin, and the bellows 0182 are set at the same potential. The adjusting screw 0163 is used to adjust the relative height between the adjusting block 0162 and the annular base 0161, thereby adjusting the relative height between the ejector pin and the annular base 0161. Therefore, by adjusting the relative height between the ejector pin and the annular base 0161, the height of the ejector pin relative to the interface plate 012 can be adjusted, thereby making the tops of the ejector pins of the three ejector pin devices 018 flush.

[0046] The related technologies have the following drawbacks in practical applications:

[0047] In high aspect ratio etching processes, higher radio frequency (RF) energy is required, necessitating a greater arc-proof safety distance. However, the space beneath the interface panel 12 is limited, and the RF post 017 is too close to the annular base 0161 and the adjusting block 0162 in the height adjustment mechanism 016, making arcing more likely. While increasing the arc-proof safety distance could be achieved, it would require more space, significantly complicating the installation, disassembly, and maintenance of the ejector pin assembly 018.

[0048] To resolve the above issues, please refer to the following: Figure 3 and Figure 4 The lower electrode device 100 provided in this embodiment of the invention is applied to semiconductor process equipment. It includes a chuck assembly 1, an RF feed component 2, a lifting drive component 3, and at least three connecting components 4. The chuck assembly 1 is used to carry the wafer. The chuck assembly 1 includes, for example, a chuck body 11 and an interface disk 12 disposed below the chuck body 11. The chuck body 11 is, for example, an electrostatic chuck. The RF feed component 2 is used to feed RF energy into the interface disk 12, which is responsible for uniformly transferring this energy to the electrostatic chuck. Furthermore, the interface disk 12 is also used to mount at least three ejector pin devices 5.

[0049] The RF feed unit 2 is located at the center of the bottom of the chuck assembly 1 (i.e., interface disk 12) and is used to feed RF energy into the interface disk 12. Figure 5 and Figure 6 As shown, the RF feed component 2 is fixedly connected to the interface disk 12 by a plurality of fixing screws 21. The plurality of fixing screws 21 are evenly distributed along the circumference of the interface disk 12 to ensure that the RF energy can be evenly transferred to the interface disk 12.

[0050] like Figure 7As shown, the RF feed component 2 has a hollow space 22 and at least three openings 23. The at least three openings 23 are evenly distributed circumferentially along the RF feed component 2. Each opening 23 extends from the outer circumferential surface of the RF feed component 2 to the inner circumferential surface constituting the hollow space 22, and each opening 23 is used to connect the hollow space 22 with the space outside the RF feed component 2. In some embodiments, the RF feed component 2 includes, for example, a cylinder, which is coaxially arranged with the chuck assembly 1 (i.e., the interface disk 12) for feeding RF power into the chuck assembly 1. The interior of the cylinder forms the hollow space 22. The openings 23 penetrate the circumferential wall of the cylinder radially. In some examples, the upper end of the cylinder is an open end to facilitate the installation of the lifting drive component 3 in the hollow space 22, while the lower end of the cylinder is a closed end to facilitate the fixing and support of the lifting drive component 3. The upper end of the opening 23 can extend to the upper end face of the cylinder, that is, the opening 23 is open on the upper end face of the cylinder, so as to facilitate the insertion of the connecting member 4 through the opening 23. The opening 23 is, for example, strip-shaped, and the length direction of the opening 23 is parallel to the axial direction of the cylinder, so as to provide sufficient space for the lifting and lowering of the connecting member 4.

[0051] The lifting drive component 3 is disposed in the hollow space 22 and is equipotentially positioned with the RF feed component 2. The lifting drive component 3 provides lifting power. At least three connecting components 4 are connected to the drive section of the lifting drive component 3 for lifting under the drive of the lifting drive component 3; and each connecting component 4 extends through each opening 23 to the outside of the hollow space 22 for connecting to at least three ejector pin devices 5 of the semiconductor process equipment. Each connecting component 4 transmits the lifting power provided by the lifting drive component 3 to each ejector pin device 5 in a corresponding manner, so that each ejector pin device 5 can lift and lower synchronously, thereby rising above the bearing surface of the chuck assembly 1 (i.e., the chuck body 11) or descending below the bearing surface, so as to cooperate with the robot to realize wafer pick-and-place operations.

[0052] By configuring the RF feed component 2 as a hollow structure, i.e., providing a hollow space 22 and at least three openings 23, and placing the lifting drive component 3 within the hollow space 22, and ensuring that the lifting drive component 3 and the RF feed component 2 are at the same potential, the risk of discharge arcing caused by potential difference can be completely eliminated, thereby improving the safety and reliability of the equipment. Furthermore, by placing the lifting drive component 3 within the hollow space 22 and connecting its drive portion to each ejector pin device 5 via connecting components 4, the space occupied by the lifting drive component 3 can be reduced while still achieving the lifting of the ejector pin device 5. Compared to existing technologies, additional space is no longer needed to maintain a safe distance between the RF feed component 2 and the ejector pin device 5, thus providing more space for the maintenance of the entire lower electrode device 100, facilitating the installation, disassembly, and maintenance of the lower electrode device 100. In addition, since the RF feed component 2 is located at the center of the bottom of the chuck assembly 1, and the lifting drive component 3 is integrated at the same potential within the hollow space 22 of the RF feed component 2, a uniform RF circuit can be formed, such as... Figure 11 As shown, the black arrows indicate the path of the radio frequency (RF) circuit of the lower electrode where the lower electrode device provided in this embodiment of the invention is located; the gray arrows indicate the path of the RF circuit of the upper electrode of the semiconductor process equipment provided in this embodiment of the invention. Figure 11 It can be seen that the radio frequency fed by the radio frequency feed component 2 can form a uniform radio frequency circuit in the chuck assembly to generate uniform plasma. This eliminates the risk of arcing and increases maintenance space, without having any negative impact on the high requirements for plasma uniformity in the etching process, thus ensuring the high performance and high precision of the etching equipment.

[0053] In some embodiments, such as Figure 5 and Figure 8 As shown, the lifting drive component 3 includes a first cylinder body 31 and a first cylinder rod 32. The first cylinder body 31 is disposed in the hollow space 22 and is fixedly connected to the radio frequency feed component 2 and electrically conductive, thereby achieving equipotential setting between the two. One end of the first cylinder rod 32 is located in the first cylinder body 31 and is electrically conductive to the first cylinder body 31, dividing the interior of the first cylinder body 31 into two first spaces 33. Figure 5 and Figure 8The end of the first cylinder rod 32 located within the first cylinder body 31 abuts against the bottom surface of the internal space of the first cylinder body 31. In this case, the volume of the first space 33 located below the end is zero, while the volume of the first space 33 located above the end is the largest. The other end of the first cylinder rod 32 extends vertically upward through the top of the first cylinder body 31 and outwards, and is fixedly connected to each connecting component 4, and is electrically conductive. In this way, the first cylinder rod 32, the first cylinder body 31, and each connecting component 4 are set at the same potential, thereby completely eliminating the risk of discharge and arcing between these components and the RF feed component 2, thus improving the safety and reliability of the device. The lifting and lowering of the first cylinder rod 32 is controlled by selectively introducing fluid (e.g., gas or liquid) into one of the first spaces 33, which in turn drives the connecting components 4 to lift and lower synchronously. Specifically, when fluid is introduced into the first space 33 located below the end of the first cylinder rod 32 in the first cylinder body 31, the first cylinder rod 32 rises under the action of fluid pressure, thereby driving each connecting component 4 and each ejector pin device 5 to rise synchronously; conversely, when fluid is introduced into the first space 33 located above the end of the first cylinder rod 32 in the first cylinder body 31, the first cylinder rod 32 falls under the action of fluid pressure, thereby driving each connecting component 4 and each ejector pin device 5 to fall synchronously.

[0054] In some embodiments, in order to enable the chuck assembly 1 and its connected components to move up and down as a whole, such as... Figure 5 and Figure 8 As shown, the lifting drive component 3 also includes a second cylinder 34 and a second cylinder rod 35. The second cylinder 34 is located between the bottom surface of the first cylinder 31 and the bottom surface constituting the hollow space 22. The second cylinder 34 is fixedly connected to the first cylinder 31 and the radio frequency feed component 2, and is electrically conductive, thereby achieving equipotential setting between the two. One end of the second cylinder rod 35 is located in the second cylinder 34 and is electrically conductive to the second cylinder 34, dividing the interior of the second cylinder 34 into two second spaces 36. Figure 5 and Figure 8The end of the second cylinder rod 35 located within the second cylinder body 34 abuts against the top surface of the internal space of the second cylinder body 34. In this case, the volume of the second space 36 above this end is zero, while the volume of the second space 36 below this end is the largest. The other end of the second cylinder rod 35 extends vertically downward through the bottom of the hollow space 22 and extends to the outside of the second cylinder body 34 and the RF feed component 2, for connection with a designated fastener (not shown in the figure). This designated fastener is, for example, the bottom wall of the process chamber or other fixed bracket, used to provide a mounting base for the second cylinder rod 35 and to provide support. The lifting and lowering of the second cylinder body 34 is controlled by selectively introducing fluid (e.g., gas or liquid) into one of the second spaces 36, which in turn drives the RF feed component 2 to lift and lower synchronously. Specifically, when fluid is introduced into the second space 36 located below the end of the second cylinder rod 35 within the second cylinder body 34, the second cylinder rod 35 remains stationary due to its connection with a designated fixing member. The second cylinder body 34 descends relative to the second cylinder rod 35 under fluid pressure, thereby causing the RF feed component 2, chuck assembly 1, first cylinder body 31, connecting components 4, and ejector pin devices 5, all fixedly connected to the second cylinder body 34, to descend synchronously. Conversely, when fluid is introduced into the second space 36 located above the end of the second cylinder rod 35 within the second cylinder body 34, the second cylinder rod 35 remains stationary due to its connection with a designated fixing member. The second cylinder body 34 rises relative to the second cylinder rod 35 under fluid pressure, thereby causing the RF feed component 2, chuck assembly 1, first cylinder body 31, connecting components 4, and ejector pin devices 5, all fixedly connected to the second cylinder body 34, to rise synchronously. Of course, in practical applications, the second cylinder body 34 and the second cylinder rod 35 can be omitted, or other drive mechanisms capable of driving the chuck assembly 1 to rise and fall can be used instead.

[0055] In embodiments where the RF feed component 2 includes a cylinder, the first cylinder 31 and the second cylinder 34 can both be circular, square, or other arbitrary shapes. The maximum circumferential dimension of these cylinders is smaller than the inner diameter of the cylinder to ensure that these cylinders can be installed in the hollow space 22. Figure 5 and Figure 8 As shown, a pad 37 is provided between the bottom surface of the second cylinder 34 and the bottom surface of the hollow space 22 formed by the cylinder. This pad 37, for example, is made of a flexible material, to cushion the impact when the bottom surface of the second cylinder 34 descends and contacts the pad 37, thereby preventing vibration and impact on the cylinder and cylinder. Figure 8As shown, the pad 37 can be fixedly connected to the bottom of the cylinder by multiple fixing screws 38. Furthermore, the lower end of the second cylinder rod 35 sequentially passes through the bottom wall of the second cylinder body 34, the pad 37, and the bottom wall of the cylinder, extending to the bottom of the cylinder to connect with a designated fixing component. Additionally, the second cylinder body 34 and the second cylinder rod 35 are electrically connected to the cylinder through the pad 37, thereby achieving equipotential bonding.

[0056] In some embodiments, the top surface of the second cylinder 34 is in contact with the bottom surface of the first cylinder 31 to achieve equipotential bonding between the first cylinder 31 and the second cylinder 34. The first cylinder 31 and the second cylinder 34 are fixed together, for example, by a plurality of fixing screws (not shown in the figure).

[0057] In some embodiments, such as Figure 9 and Figure 10 As shown, each connecting component 4 is a connecting rod, with at least three connecting rods evenly distributed circumferentially along the RF feed component 2. One end of each of the at least three connecting rods is fixedly connected to the other end (i.e., the upper end) of the first cylinder rod 32 via a central connecting portion 41. This central connecting portion 41 is, for example, a circular connecting block, disposed within the hollow space 22 and coaxially arranged with the first cylinder rod 32. The upper end of the first cylinder rod 32 is fixedly connected to the circular connecting block, for example, by a fixing screw 42. The other ends of the at least three connecting rods pass through the openings 23 one by one and extend outwards from the hollow space 22 along different radial directions of the RF feed component 2. In other words, at least three connecting rods extend radially outwards from the central connecting portion 41, with the extension direction coinciding with one of the radial directions of the RF feed component 2, and the extension directions of different connecting rods coinciding with different radial directions. This design further enhances the uniformity of the RF signal. Because the connecting rods are evenly distributed circumferentially along the RF feed component 2, and the central connecting portion 41 is coaxially arranged with the first cylinder rod 32, this structure ensures a more uniform distribution of RF energy during transmission, thereby improving the quality and consistency of the etching process. For example, each connecting rod and the central connecting portion 41 are integrally formed to simplify the structure and improve the stability and reliability of the connection structure.

[0058] Based on this, the central connecting part 41 is electrically connected to each connecting rod and the first cylinder rod 32. This allows each connecting rod to be set at the same potential as the radio frequency feed component 2 through the first cylinder rod 32 and the first cylinder body 31 in sequence, thereby eliminating the risk of sparking.

[0059] In some embodiments, to ensure that the tops of at least three ejector pin devices 5 are flush with each other, the wafer's levelness can be guaranteed when carrying the wafer. For example... Figure 4 , Figure 5 and Figure 9As shown, the lower electrode device 100 also includes at least three height adjustment structures 6, each height adjustment structure 6 being used to connect each connecting component 4 to the corresponding ejector pin device 5 in a one-to-one correspondence, and being able to adjust the height of the corresponding ejector pin device 5.

[0060] Each height adjustment structure 6 that achieves the above functions includes, for example, a mounting component 61, a first adjusting member 62, and a second adjusting member. The mounting component 61 is located below the corresponding connecting component 4 and is fixedly connected to the corresponding ejector pin device 5, for example, by a fastening screw 64. This mounting component 61 is, for example, a strip-shaped block or a stepped strip-shaped block. Figure 4 , Figure 5 and Figure 9 As shown, the ejector device 5 includes, for example, an ejector pin 51 and a bellows tube 52 sleeved on the ejector pin 51. The upper end of the bellows tube 52 is sealed to the interface plate 12 via a resin separator 53, and the lower end is sealed to the outer peripheral wall of the mounting column 54 located below the ejector pin 51. In this case, the mounting component 61 is fixedly connected to the corresponding mounting column 54 located below the ejector pin 51. The mounting column 54 provides a mounting base and support for the ejector pin 51, and can drive the ejector pin 51 to rise and fall under the action of the mounting component 61.

[0061] like Figure 4 As shown, a first adjusting member 62 extends vertically through the mounting member 61 and is threadedly connected to the connecting member 4. It is used to raise or lower the mounting member 61 relative to the connecting member 4 by rotation. The first adjusting member 62 is, for example, an adjusting screw. A second adjusting member extends vertically through the mounting member 61 and is threadedly connected to the connecting member 4. The second adjusting member is configured to adjust the distance between the mounting member 61 and the connecting member 4, thereby raising or lowering the mounting member 61 relative to the connecting member 4. By using the first adjusting member 62 and the second adjusting member in conjunction, the height of the mounting member 61 relative to the connecting member 4 can be adjusted, thereby adjusting the height of the corresponding ejector pin device 5.

[0062] Further, in some embodiments, the second adjusting member includes an adjusting screw 63 and an adjusting nut 66. The stud of the adjusting screw 63 passes vertically through the mounting member 61 and is fixedly connected to the connecting member 4. In this case, the adjusting screw 63 is fixed relative to the connecting member 4. The adjusting nut 66 is sleeved on the screw head and stud of the adjusting screw 63 and is located below the mounting member 61. The adjusting nut 66 is threadedly connected to the stud of the adjusting screw 63 and supports the mounting member 61. By rotating the adjusting nut 66, the adjusting nut 66 can be raised or lowered relative to the adjusting screw 63 in cooperation with the stud of the adjusting screw 63. At the same time, since the adjusting nut 66 supports the mounting member 61, the adjusting nut 66 can drive the mounting member 61 to rise or fall together, thereby adjusting the distance between the mounting member 61 and the connecting member 4, so that the mounting member 61 can rise or fall relative to the connecting member 4. Preferably, the diameter of the through hole on the mounting component 61 for the fastening screw 64 to pass through should be larger than the outer diameter of the stud and the screw head of the fastening screw 64, so that sufficient space can be reserved for the tilting of the mounting component 61 when adjusting the height of the mounting component 61.

[0063] As another technical solution, this embodiment of the invention also provides a semiconductor process apparatus, including the lower electrode device 100 provided in this embodiment of the invention, and at least three ejector pin devices 5. The at least three ejector pin devices 5 are evenly distributed around the chuck assembly 1 in the lower electrode device 100, and rise above the bearing surface of the chuck assembly 1 or fall below the bearing surface under the drive of each connecting component 4.

[0064] The semiconductor process equipment provided in this embodiment of the invention, by adopting the lower electrode device 100 provided in this embodiment of the invention, can completely eliminate the risk of discharge arcing caused by potential difference, thereby improving the safety and reliability of the equipment. At the same time, it increases the space for installation, disassembly and maintenance of the ejector pin device 5, and will not affect the uniformity of the radio frequency circuit.

[0065] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A lower electrode device, applied in semiconductor process equipment, characterized in that, include: Chuck assembly, used to carry wafers; An RF feed component is disposed at the center of the bottom of the chuck assembly, and has a hollow space and at least three openings. The at least three openings are evenly distributed along the circumference of the RF feed component, and each opening extends from the outer peripheral surface of the RF feed component to the inner peripheral surface constituting the hollow space. A lifting drive component is disposed in the hollow space and is equipotentially positioned with the radio frequency feed component; and At least three connecting components are connected to the driving part of the lifting drive component, and are used to lift and lower under the drive of the lifting drive component; Furthermore, each connecting component extends through each of the openings to the outside of the hollow space, for connection with the pin device of the semiconductor process equipment.

2. The lower electrode device according to claim 1, characterized in that, The lifting drive component includes a first cylinder and a first cylinder rod. The first cylinder is disposed in the hollow space and is fixedly connected to the radio frequency feed component. One end of the first cylinder rod is located in the first cylinder body and divides the interior of the first cylinder body into two first spaces; the other end of the first cylinder rod serves as the driving part of the lifting drive component, extends vertically upward through the top of the first cylinder body and extends to the outside of the first cylinder body, and is fixedly connected to each of the connecting components. The lifting and lowering of the first cylinder rod is controlled by selectively introducing fluid into one of the first spaces, thereby causing the connecting components to lift and lower synchronously.

3. The lower electrode device according to claim 2, characterized in that, The lifting drive component also includes a second cylinder and a second cylinder rod. The second cylinder is located between the bottom surface of the first cylinder and the bottom surface constituting the hollow space. The second cylinder is fixedly connected to the first cylinder and the radio frequency feed component, and is electrically conductive. One end of the second cylinder rod is located in the second cylinder body and is electrically connected to the second cylinder body, dividing the interior of the second cylinder body into two second spaces; the other end of the second cylinder rod extends vertically downward through the bottom of the hollow space and extends to the outside of the second cylinder body and the radio frequency feed component, for connection with a designated fixing component; The lifting and lowering of the second cylinder is controlled by selectively introducing fluid into one of the second spaces, which in turn drives the radio frequency feed component to lift and lower synchronously.

4. The lower electrode device according to claim 2, characterized in that, Each of the connecting components is a connecting rod, and at least three of the connecting rods are evenly distributed around the circumference of the radio frequency feed component. One end of each of the at least three connecting rods is fixedly connected to the other end of the first cylinder rod through a central connecting part. The other ends of each of the at least three connecting rods pass through the openings one by one and extend out of the hollow space along different radial directions of the radio frequency feed component. The central connecting portion is electrically connected to each of the connecting rods and the first cylinder rod.

5. The lower electrode device according to claim 1, characterized in that, The lower electrode device further includes at least three height adjustment structures, each of which is used to connect each of the connecting components to the corresponding ejector pin device in a one-to-one correspondence, and is capable of adjusting the height of the corresponding ejector pin device.

6. The lower electrode device according to claim 5, characterized in that, Each of the height adjustment structures includes a mounting component, a first adjusting member, and a second adjusting member. The mounting component is located below the corresponding connecting component and is fixedly connected to the corresponding ejector pin device. The first adjusting member supports the mounting component, penetrates the mounting component vertically, and is threadedly connected to the connecting component, allowing the mounting component to rise or fall relative to the connecting component by rotation. The second adjusting member penetrates the mounting component vertically and is threadedly connected to the connecting component. The second adjusting member is configured to adjust the distance between the mounting component and the connecting component, thereby allowing the mounting component to rise or fall relative to the connecting component.

7. The lower electrode device according to claim 6, characterized in that, The second adjusting component includes an adjusting screw and an adjusting nut. The stud of the adjusting screw passes through the mounting component vertically and is fixedly connected to the connecting component. The adjusting nut is sleeved on the stud and head of the adjusting screw and is located below the mounting component. The adjusting nut is threadedly connected to the stud and supports the mounting component.

8. The lower electrode device according to any one of claims 1-7, characterized in that, The radio frequency feed component includes a cylinder, which is coaxially arranged with the chuck assembly and is used to feed radio frequency power to the chuck assembly; the interior of the cylinder forms the hollow space; the opening extends radially through the circumferential wall of the cylinder.

9. The lower electrode device according to claim 8, characterized in that, The chuck assembly includes a chuck body and an interface disk disposed below the chuck body; The cylinder is fixedly connected to the center of the bottom of the interface plate.

10. A semiconductor process apparatus, characterized in that, include: The lower electrode device as described in any one of claims 1-9; At least three ejector pin devices are evenly distributed around the circumference of the chuck assembly in the lower electrode device, and rise above the bearing surface of the chuck assembly or descend below the bearing surface under the drive of each of the connecting components.

Images