LED device and preparation method thereof

Abstract

The invention discloses an LED (Light Emitting Diode) device. The LED device comprises a circuit board and an LED chip arranged on the circuit board, the circuit board comprises more than three electrical connection boards which are arranged in a laminated manner, and any electrical connection board comprises a BT substrate and a metal layer which are arranged in a laminated manner; according to the circuit board, a vertically-distributed circuit arrangement structure is formed by laminating and splicing more than three electrical connecting plates, and the LED chips are electrically connected in the circuit arrangement structure. The circuit board structure is formed by laminating and matching the plurality of electric connecting plates, and the expansion and shrinkage difference between the layers of the circuit board is reduced by reducing the use of ink, so that the risk of warping of the circuit board is reduced, the packaging quality of the LED device is improved, and meanwhile, the packaging reliability of the LED device can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED devices, and particularly relates to an LED device and a preparation method thereof. Background Art

[0002] In the existing circuit board design of GOB (Glue on Board) packaging devices, copper foil metal layers are generally covered on the top and bottom surfaces of a BT board, and epoxy resin ink is used for solder mask on the top surface copper foil. Since the expansion and contraction rate of the BT board is 10 - 30 PPM / °C, the expansion and contraction rate of the copper foil is 1.5% / °C, and the expansion and contraction rate of the epoxy resin ink is 2 - 8% / °C. Due to the large difference in the expansion and contraction rate between the BT board and the epoxy resin ink, when the thickness of the circuit board structure is less than 0.2 mm, the circuit board is prone to warping during the furnace passing process, affecting the device packaging quality and the device packaging reliability. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art. The present invention provides an LED device and a preparation method thereof. By laminating and matching multiple electrically conductive connection plates to form a circuit board structure, and by reducing the use of ink, the expansion and contraction difference between the layers of the circuit board is reduced, thereby reducing the risk of the circuit board warping and improving the LED device packaging quality and packaging reliability.

[0004] The present invention provides an LED device, and the LED device includes: a circuit board and an LED chip disposed on the circuit board;

[0005] The circuit board includes three or more electrically conductive connection plates arranged in a laminated manner, and any one of the electrically conductive connection plates includes a BT substrate and a metal layer arranged in a laminated manner;

[0006] The circuit board is formed by laminating and splicing three or more electrically conductive connection plates to form a vertically distributed circuit arrangement structure, and the LED chip is electrically connected within the circuit arrangement structure.

[0007] Further, any two adjacent electrically conductive connection plates are bonded based on an adhesive.

[0008] Further, the adhesive is liquid epoxy glue, or the adhesive is polypropylene glue.

[0009] Further, the thickness of the metal layer is h, and the value range of h is: 0.01 mm ± 0.003 mm.

[0010] Further, the thickness of the BT substrate is H, and the value range of H is: 0.03 mm ± 0.003 mm.

[0011] Further, more than three of the electrical connection plates include: a top electrical connection plate with a first circuit layout layer, a bottom electrical connection plate with a second circuit layout layer, and a middle electrical connection plate with a preset circuit layout layer;

[0012] The top electrical connection plate, the middle electrical connection plate, and the bottom electrical connection plate are stacked and arranged.

[0013] Further, the BT substrate of the top electrical connection plate is connected to the BT substrate of the middle electrical connection plate, such that the first circuit layout layer is exposed on the top of the circuit board;

[0014] The BT substrate of the bottom electrical connection plate is connected to the metal layer of the middle electrical connection plate, such that the second circuit layout layer is exposed on the bottom of the circuit board.

[0015] Further, the circuit layout structure includes a plurality of first electrical channels and a plurality of second electrical channels, and electrical connection is achieved between the first circuit wiring layer and the preset circuit wiring layer based on the first electrical channels;

[0016] Electrical connection is achieved between the second circuit wiring layer and the preset circuit wiring layer based on the second electrical channels.

[0017] Further, the preset circuit wiring layer is provided with a plurality of pads, and any one of the pads is provided with a first electrical connection point connected to the first electrical channel and a second electrical connection point connected to the second electrical channel.

[0018] Further, an insulating interval is provided between any two adjacent pads, the width of the insulating interval is w, and the value range of w is: 40μm ≤ w ≤ 50μm.

[0019] Further, the second circuit wiring layer is provided with a plurality of electrical pins, and the plurality of electrical pins are electrically connected to the plurality of pads in a one-to-one correspondence;

[0020] The side length of the electrical connection plate is D, and the distance between any two adjacent electrical pins is d. The constraint relationship between D and d is: D = 3d.

[0021] The present invention also provides a method for manufacturing an LED device. The method for manufacturing the LED device is used to manufacture the LED device, and the manufacturing method includes:

[0022] Manufacturing more than three electrical connection plates, and etching the preset circuit wiring layer in one of the more than three electrical connection plates;

[0023] Gluing and thermally pressing the more than three electrical connection plates to form a substrate;

[0024] A number of first positioning points are arranged on the top surface of the substrate, and first electrical channels with a first depth are machined at the positions of the first positioning points;

[0025] A number of second positioning points are arranged on the bottom surface of the substrate, and second electrical channels with a second depth are machined at the positions of the second positioning points;

[0026] A first circuit layout layer is machined on the top surface of the substrate, and a second circuit layout layer is machined on the bottom surface of the substrate;

[0027] LED chips are die-bonded on the first circuit layer;

[0028] The LED chips are encapsulated and scribed according to a preset circuit to obtain a number of LED devices.

[0029] Further, preparing more than three electrical connection plates, and etching a preset circuit wiring layer in one of the more than three electrical connection plates includes:

[0030] A metal layer is electroplated on the surface of the BT substrate to form an electrical connection plate;

[0031] A preset circuit wiring layer is etched on the electrical connection plate through a photolithography process.

[0032] Further, bonding and hot pressing the more than three electrical connection plates to form a substrate includes:

[0033] The more than three electrical connection plates are bonded through an adhesive, and the electrical connection plate with the preset circuit wiring layer is located at the middle position;

[0034] After pre-pressing through ultrasonic vibration, hot pressing treatment is carried out in a high-temperature environment.

[0035] Further, arranging a number of first positioning points on the top surface of the substrate, and machining first electrical channels with a first depth at the positions of the first positioning points includes:

[0036] First positioning points are arranged at the top surface position of the substrate, and laser drilling operations are carried out at the coordinate positions of the first positioning points through a laser drilling device to obtain a number of first through holes communicating with the preset circuit wiring layer;

[0037] An electroplating hole filling process is carried out in the first through holes to form a number of first electrical channels.

[0038] Further, arranging a number of second positioning points on the bottom surface of the substrate, and machining second electrical channels with a second depth at the positions of the second positioning points includes:

[0039] A second positioning point is set at the bottom surface position of the substrate, and a laser drilling operation is performed at the coordinate position of the second positioning point by a laser drilling device to obtain a plurality of second through holes communicating with the preset circuit wiring layer;

[0040] A plating filling process is performed in the second through holes to form a plurality of second electrical channels.

[0041] Further, the processing of the first circuit arrangement layer on the top surface of the substrate and the processing of the second circuit arrangement layer on the bottom surface of the substrate include:

[0042] Taking the first electrical channel on the top surface of the substrate as the origin coordinates, a pattern mask is formed on the top surface of the substrate by a photolithography process, and the metal layer on the top surface of the substrate is processed according to the pattern mask to form the first circuit arrangement layer;

[0043] Taking the second electrical channel on the bottom surface of the substrate as the origin coordinates, a pattern mask is formed on the bottom surface of the substrate by a photolithography process, and the metal layer on the bottom surface of the substrate is processed according to the pattern mask to form the second circuit arrangement layer.

[0044] The present invention provides an LED device and a manufacturing method thereof. By forming a circuit board in a manner of stacking multiple electrical connection plates, the use of ink can be reduced, the shrinkage force difference between the electrical connection plates can be reduced, thereby reducing the risk of warping problems caused by the shrinkage difference between layers during the manufacturing process of the circuit board. Based on the stacked design of multiple electrical connection plates, the bonding connection stability between layers of the circuit board is improved, thereby improving the reliability of device packaging. Description of the Drawings

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0046] Figure 1 is a schematic structural diagram of an LED device in an embodiment of the present invention;

[0047] Figure 2 is a schematic structural diagram of an electrical connection plate in an embodiment of the present invention;

[0048] Figure 3 is a schematic structural diagram of the first circuit arrangement layer of the top electrical connection plate in an embodiment of the present invention;

[0049] Figure 4 is a schematic structural diagram of the preset circuit arrangement layer of the middle electrical connection plate in an embodiment of the present invention;

[0050] Figure 5 It is a schematic structural diagram of the second circuit layout layer of the bottom electrical connection board in the embodiment of the present invention;

[0051] Figure 6 It is a flowchart of the preparation method of the LED device in the embodiment of the present invention;

[0052] Figure 7 It is a schematic structural diagram of the substrate in the embodiment of the present invention;

[0053] Figure 8 It is a schematic diagram of the processing states of the first electrical channel and the second electrical channel in the embodiment of the present invention;

[0054] Figure 9 It is a schematic diagram of the processing states of the first circuit layout layer and the second circuit layout layer in the embodiment of the present invention;

[0055] Figure 10 It is a schematic diagram of the state of the LED chip being fixed on the substrate in the embodiment of the present invention. Detailed implementation manners

[0056] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0057] Embodiment 1:

[0058] Figure 1 It shows a schematic structural diagram of the LED device in the embodiment of the present invention; Figure 2 It shows a schematic structural diagram of the electrical connection board in the embodiment of the present invention. The LED device includes: a circuit board 1 and an LED chip 4 disposed on the circuit board 1. The circuit board 1 includes three or more electrical connection boards arranged in layers. Any one of the electrical connection boards includes a BT substrate 100 and a metal layer 200 arranged in layers. The metal layer 200 is covered on the top surface of the BT substrate 100 through a plating process to meet the circuit design requirements of chip device packaging.

[0059] The BT substrate 100 (Bismaleimide Triazine, BT) is a high-performance substrate material synthesized based on bismaleimide (BMI) and cyanate ester (CE) resin, with high glass transition temperature, excellent dielectric properties, low thermal expansion rate, and good mechanical characteristics and other properties.

[0060] The circuit board 1 is formed by laminating and splicing three or more electrical connection plates to form a vertically distributed circuit layout structure. The LED chip 4 is electrically connected within the circuit layout structure. By setting the circuit layout structure with a vertical structure, the pads, electrical pins, and trace layout structure can be layered and distributed in the vertical direction. The insulating channels etched based on each layer of the circuit structure achieve electrical isolation, which can reduce the solder mask design on the circuit board 1, thereby avoiding the warping of the circuit board 1 caused by excessive difference in the expansion and contraction performance between the ink and the substrate material during the heat treatment process, and improving the stability of the structure of the circuit board 1.

[0061] Specifically, any two adjacent electrical connection plates are bonded based on an adhesive. The electrical connection plates are adhesively fixed and connected through the adhesive, which improves the bonding force between each electrical connection plate, thereby improving the stability of the structure of the circuit board 1.

[0062] Furthermore, the adhesive can be a liquid epoxy glue. The electrical connection plates are adhesively fixed by the epoxy glue, so that the bonding force between the electrical connection plates can meet the preparation requirements of the circuit board 1. The adhesive can also be a polypropylene glue, which has a good bonding effect.

[0063] Specifically, the LED device further includes a plastic encapsulation layer 5. The plastic encapsulation layer 5 covers the chip. The plastic encapsulation layer 5 is used to protect the LED device and its internal circuit structure, improve the working reliability of the LED device, and at the same time can improve the light extraction efficiency of the LED device.

[0064] Specifically, the thickness of the metal layer 200 is h, and the value range of h is: 0.01 mm ± 0.003 mm. The thickness of the BT substrate 100 is H, and the value range of H is: 0.03 mm ± 0.003 mm. By setting the electrical connection plates with a small thickness, the stability of the lamination connection of each layer of the electrical connection plates can be improved, and the thickness of the circuit board 1 of the LED device can be reduced, and the package size of the LED device can be reduced.

[0065] Specifically, Figure 3 shows a schematic structural diagram of the first circuit layout layer of the top electrical connection plate in the embodiment of the present invention; Figure 4 shows a schematic structural diagram of the preset circuit layout layer of the middle electrical connection plate in the embodiment of the present invention; Figure 5The structural schematic diagram of the second circuit layout layer of the bottom electrical connection board in the embodiment of the present invention is shown. The electrical connection board includes: a top electrical connection board 11 with a first circuit layout layer 10, a bottom electrical connection board 12 with a second circuit layout layer 30, and a middle electrical connection board 13 with a preset circuit layout layer 20. The top electrical connection board 11, the middle electrical connection board 13, and the bottom electrical connection board 12 are stacked. A preset circuit layout layer 20 is arranged on the middle electrical connection board 13, so that the top electrical connection board 11 and the bottom electrical connection board 12 can access the preset circuit layout layer 20 through vertically designed electrical channels, ensuring that the circuit board 1 can meet the circuit layout requirements of the LED device and improving the utilization rate of the internal space of the circuit board 1 to achieve miniaturized packaging.

[0066] Specifically, the BT substrate 100 of the top electrical connection board 11 is connected to the BT substrate 100 of the middle electrical connection board 13, so that the first circuit layout layer 10 is exposed on the top of the circuit board 1. The BT substrate 100 of the bottom electrical connection board 12 is connected to the metal layer 200 of the middle electrical connection board 13, so that the second circuit layout layer 30 is exposed on the bottom of the circuit board 1, that is, the bottom electrical connection board 12, the middle electrical connection board 13, and the top electrical connection board 11 are stacked in sequence, and the first circuit layout layer 10 of the top electrical connection board 11 is arranged on the top surface of the circuit board 1 for die bonding connection of the LED chip 4. The second circuit layout layer 30 of the bottom electrical connection board 12 is arranged on the bottom surface of the circuit board 1 for electrical connection between the LED device and the external working circuit.

[0067] Further, a plurality of chip pads are arranged at the middle position of the first circuit layout layer 10 to meet the die bonding requirements of the LED chip 4.

[0068] Specifically, the circuit layout structure includes a plurality of first electrical channels 2 and a plurality of second electrical channels 3. Electrical connection is achieved between the first circuit wiring layer and the preset circuit wiring layer based on the first electrical channels 2, and electrical connection is achieved between the second circuit wiring layer and the preset circuit wiring layer based on the second electrical channels 3. The first electrical channel 2 is set to a first height, so that the first electrical channel 2 can penetrate through the BT substrate 100 parts of the top electrical connection board 11 and the middle electrical connection board 13, thereby realizing electrical connection between the first circuit layout layer 10 and the preset circuit layout layer 20.

[0069] Further, the second electrical channel 3 is set to a second height such that the second electrical channel 3 can penetrate the BT substrate 100 of the bottom electrical connection plate 12, enabling conduction between the second circuit layout layer 30 and the preset circuit layout layer 20. Based on the first electrical channel 2 and the second electrical channel 3, the first circuit layout layer 10 and the second circuit layout layer 30 are electrically connected correspondingly on the preset circuit layout layer 20, thereby constructing a circuit layout structure under a vertical structure to meet the electrical connection requirements of the LED chip 4.

[0070] Specifically, the preset circuit wiring layer is provided with a plurality of pads. Any one of the pads is provided with a first electrical connection point connected to the first electrical channel 2 and a second electrical connection point connected to the second electrical channel 3. Based on the first electrical connection point and the second electrical connection point on the pad, the electrical connection between the first electrical channel 2 and the second electrical channel 3 can be satisfied.

[0071] Specifically, an insulating interval is provided between any two adjacent pads. The width of the insulating interval is w, and the value range of w is: 40μm ≤ w ≤ 50μm. By patterning and etching the metal layer 200 of the middle electrical connection plate 13, a plurality of pad structures are formed, and an insulating interval is formed between any two adjacent pads based on the etching to meet the electrical isolation between the pads.

[0072] Specifically, the second circuit wiring layer is provided with a plurality of electrical pins. The plurality of electrical pins are electrically connected to the plurality of pads one by one. Based on the plurality of electrical pins, the LED device can be directly mounted on an external working circuit, thereby meeting the installation requirements of the LED device.

[0073] The side length of the electrical connection plate is D, and the distance between any two adjacent electrical pins is d. The constraint relationship between D and d is: D = 3d, that is, the distance between adjacent electrical pins is one-third of the side length of the device, so as to meet the mounting requirements of the external working circuit.

[0074] Further, in this embodiment, the preset circuit layout layer 20 is provided with a common electrode pad 201, a first electrical pad 202, a second electrical pad 203, and a third electrical pad 204. The second circuit layout layer 30 is provided with a common pin 301, a first electrical pin 302, a second electrical pin 303, and a third electrical pin 304. The preset circuit layout layer 20 and the second circuit layout layer 30 are electrically connected based on a plurality of second electrical channels 3, so that the common electrode pad 201 and the common pin 301 are electrically connected, the first electrical pad 202 and the first electrical pin 302 are electrically connected, the second electrical pad 203 and the second electrical pin 303 are electrically connected, and the third electrical pad 204 and the third electrical pin 304 are electrically connected, thereby meeting the electrical connection between the preset circuit layer and the second circuit layout layer 30.

[0075] Further, the LED chips 4 are die-bonded on the first circuit layout layer 10. Based on the electrical connection between the first circuit layout layer 10 and the preset circuit layout layer 20, a plurality of LED chips 4 can form a common electrode connection to meet the driving connection requirements of the LED device and an external working circuit.

[0076] The embodiment of the present invention provides an LED device. By forming a circuit board 1 by stacking multiple electrical connection plates, the use of ink can be reduced, the shrinkage force difference between the electrical connection plates can be reduced, and the risk of warping problems caused by shrinkage differences between layers during the preparation of the circuit board 1 can be reduced. Based on the stacked design of multiple electrical connection plates, the bonding stability between layers of the circuit board 1 is improved, thereby improving the reliability of device packaging.

[0077] Embodiment Two:

[0078] Figure 6 The flowchart of the preparation method of the LED device in the embodiment of the present invention is shown. The preparation method includes:

[0079] S11: Prepare more than three electrical connection plates, and etch a preset circuit wiring layer on one of the more than three electrical connection plates;

[0080] Electroplate a metal layer 200 on the surface of the BT substrate 100 to form an electrical connection plate. A metal layer 200 with a certain thickness can be plated on the BT substrate 100 through an electroplating process, so that the BT substrate 100 and the metal layer 200 cooperate to form an electrical connection plate.

[0081] Further, the electrical connection plate can be prepared by copper foil lamination on the BT substrate 100. The copper foil and the BT substrate 100 are laminated at high temperature to form the electrical connection plate.

[0082] Among them, the thickness range of the copper foil is 0.01 mm ± 0.003 mm, and the thickness range of the BT substrate is: 0.03 mm ± 0.003 mm.

[0083] Specifically, one of the three or more electrical connection plates is selected for the lithography process. A preset pattern is formed on the metal layer 200 of the electrical connection plate through the lithography process, and etching is performed on the metal layer 200 of the electrical connection plate according to the preset pattern by using a chemical etching process, so as to form a preset circuit wiring layer on the electrical connection plate.

[0084] Furthermore, the electrical connection plate is pre-treated, exposed, and developed to form a pattern mask on the metal layer 200 of the electrical connection plate. Metal etching is performed on the metal layer 200 of the electrical connection plate according to the pattern mask, so as to etch and form a preset circuit arrangement layer 20 on the metal layer 200 of the electrical connection plate.

[0085] Furthermore, the preset circuit arrangement can also be prepared based on laser etching. An etching operation is performed on the metal layer 200 of the electrical connection plate through a laser etching device, so that the metal layer 200 of the electrical connection plate can form a preset circuit arrangement layer 20. Based on the preset circuit arrangement layer 20, a plurality of pad structures are formed, so that the pads can meet the electrical connection requirements of the top and bottom circuits of the circuit board 1.

[0086] S12: Bond and hot-press three or more electrical connection plates to form a substrate.

[0087] Figure 7 The schematic diagram of the substrate structure in the embodiment of the present invention is shown; three or more electrical connection plates are bonded through an adhesive, and the electrical connection plate with the preset circuit wiring layer is located in the middle position;

[0088] After ultrasonic vibration pre-pressing, hot-press treatment is performed in a high-temperature environment.

[0089] In this embodiment, three electrical connection plates are used as raw materials. The three electrical connection plates are respectively set as the top electrical connection plate 11, the middle electrical connection plate 13, and the bottom electrical connection plate 12; the electrical connection plate with the preset circuit arrangement layer 20 is set as the middle electrical connection plate 13, and the top electrical connection plate 11, the middle electrical connection plate 13, and the bottom electrical connection plate 12 are stacked from top to bottom, so that the three electrical connection plates can form a substrate structure.

[0090] Specifically, the top electrical connection plate 11, the middle electrical connection plate 13, and the bottom electrical connection plate 12 are bonded by adhesive. Under the environment of 80 °C and 1.38 mpa pressure, ultrasonic waves are used to pre-press the top electrical connection plate 11, the middle electrical connection plate 13, and the bottom electrical connection plate 12, so that the top electrical connection plate 11, the middle electrical connection plate 13, and the bottom electrical connection plate 12 can be preliminarily bonded.

[0091] After the pre-pressing is completed, the temperature is adjusted to be between 170 °C and 190 °C, and the pressure is adjusted to be between 1.38 mpa and 3.45 mpa. Then, hot pressing is performed on the top electrical connection plate 11, the middle electrical connection plate 13, and the bottom electrical connection plate 12, so that the top electrical connection plate 11, the middle electrical connection plate 13, and the bottom electrical connection plate 12 can form an integral body.

[0092] Furthermore, the hot pressing time is set to be between 60 min and 120 min, which is set according to the number of electrical connection plate layers involved in the substrate structure, so as to ensure that the electrical connection plates of the substrate structure can be tightly bonded.

[0093] After the hot pressing operation is completed, the heating of the top electrical connection plate 11, the middle electrical connection plate 13, and the bottom electrical connection plate 12 is stopped. The top electrical connection plate 11, the middle electrical connection plate 13, and the bottom electrical connection plate 12 are cooled to room temperature under a high-pressure environment, so that the top electrical connection plate 11, the middle electrical connection plate 13, and the bottom electrical connection plate 12 can be laminated to form a substrate.

[0094] Furthermore, the pre-pressing operation and the hot pressing operation can be carried out by ultrasonic vibration for pressing. By performing ultrasonic vibration treatment on the top electrical connection plate 11, the middle electrical connection plate 13, and the bottom electrical connection plate 12, and using ultrasonic waves with a frequency of 20 kHz - 40 kHz, the air between the top electrical connection plate 11, the middle electrical connection plate 13, and the bottom electrical connection plate 12 is discharged, thereby improving the stability and tightness of the press-fitting connection between the top electrical connection plate 11, the middle electrical connection plate 13, and the bottom electrical connection plate 12.

[0095] S13: Set a number of first positioning points on the top surface of the substrate, and process a first electrical channel 2 with a first depth at the positions of the first positioning points.

[0096] Specifically, Figure 8The figure shows a schematic diagram of the processing states of the first electrical channel and the second electrical channel in an embodiment of the present invention; a first positioning point is set at the top surface position of the substrate, and laser drilling operations are performed at the coordinate positions of the first positioning point by a laser drilling device to obtain a plurality of first through-holes communicating with the preset circuit wiring layer, and electroplating hole filling processes are performed in the first through-holes to form a plurality of first electrical channels 2.

[0097] The first electrical channel 2 is set to a first height such that the first electrical channel 2 can penetrate through the BT substrate 100 parts of the top electrical connection board 11 and the middle electrical connection board 13, so as to enable electrical connection between the first circuit layout layer 10 and the preset circuit layout layer 20.

[0098] Specifically, according to the circuit layout design of the LED device, a plurality of first positioning points are set on the metal layer 200 of the top electrical connection board 11, so that the plurality of first positioning points correspond to the pad structures of the preset circuit layout layer 20 of the middle electrical connection board 13, and first through-hole structures with a first height are processed at the positions corresponding to the first positioning points by laser perforation, so that the through-holes can be connected to the preset circuit layout of the middle electrical connection board 13

[0099] Through electroplating hole filling processes, metal is plated in the through-holes, so that a metal layer 200 is formed on the inner surface of the through-holes to meet the electrical connection transmission requirements of the through-holes, that is, the first electrical channels 2 are formed, and electrical connection between the metal layer 200 of the top electrical connection board 11 and the preset circuit layout layer 20 of the middle electrical connection board 13 is realized.

[0100] S14: A plurality of second positioning points are set on the bottom surface of the substrate, and second electrical channels 3 with a second depth are processed and formed at the positions of the second positioning points.

[0101] Second positioning points are set at the bottom surface position of the substrate, and laser drilling operations are performed at the coordinate positions of the second positioning points by a laser drilling device to obtain a plurality of second through-holes communicating with the preset circuit wiring layer;

[0102] Electroplating hole filling processes are performed in the second through-holes to form a plurality of second electrical channels 3.

[0103] The second electrical channel 3 is set to a second height such that the second electrical channel 3 can penetrate through the BT substrate 100 of the bottom electrical connection board 12, so that conduction can be achieved between the second circuit layout layer 30 and the preset circuit layout layer 20. Based on the first electrical channel 2 and the second electrical channel 3, the first circuit layout layer 10 and the second circuit layout layer 30 are correspondingly electrically connected to the preset circuit layout layer 20, so as to construct a circuit layout structure under a vertical structure and meet the electrical connection requirements of the LED chip 4.

[0104] S15: Process the first circuit layout layer 10 on the top surface of the substrate, and process the second circuit layout layer 30 on the bottom surface of the substrate.

[0105] Figure 9 The figure shows a schematic diagram of the processing states of the first circuit layout layer and the second circuit layout layer in an embodiment of the present invention; taking the first electrical channel 2 on the top surface of the substrate as the origin coordinate, a pattern mask is formed on the top surface of the substrate through a photolithography process, and the metal layer 200 on the top surface of the substrate is processed according to the pattern mask to form the first circuit layout layer 10, so that the first circuit layout layer 10 can form a die bonding area for accommodating the LED chip 4.

[0106] Further, based on the first circuit layout layer 10, the die bonding position of the LED chip 4 is set at the middle position on the top surface of the substrate, so that the light-emitting area of the LED device can be located at the middle position, thus meeting

[0107] Taking the second electrical channel 3 on the bottom surface of the substrate as the origin coordinate, a pattern mask is formed on the top surface of the substrate through a photolithography process, and the metal layer 200 on the bottom surface of the substrate is processed according to the pattern mask to form the second circuit layout layer 30, so that a plurality of electrical pins are formed on the bottom surface of the substrate, and the plurality of electrical pins are electrically connected to the pads of the preset circuit layout layer 20 one by one. Based on the electrical pins, the mounting of the LED device to an external working circuit can be satisfied, and the convenience of the electrical connection of the LED device can be improved.

[0108] Specifically, a gold plating operation is performed on the first circuit layout layer 10 and the second circuit layout layer 30, that is, nickel plating is performed on the first circuit layout layer 10 and the second circuit layout layer 30 and then gold plating is performed, thereby reducing the risk of oxidation of the first circuit layout layer 10 and the second circuit layout layer 30.

[0109] S16: Die bond the LED chip 4 on the first circuit layer.

[0110] Figure 10 The figure shows a schematic diagram of the die bonding state of the LED chip in an embodiment of the present invention. After the above-mentioned first circuit layout layer 10 with the coating is dehumidified, it is brushed with tin by a tin brushing machine. A tin brushing stencil is set on the first circuit layout layer 10, and solder paste is printed on the chip pads of the circuit board 1. Then, a die bonding machine is used to place the red light chip, the green light chip, and the blue light chip on the chip pads, and the LED chip 4 is die bonded to the chip pads of the first circuit layout layer 10 through a furnace process.

[0111] Further, place the circuit board 1 that has completed the plating operation in an environment of 80 - 100 °C, and perform a heating and dehumidification operation on the circuit board 1 under constant temperature conditions to reduce the moisture inside the circuit board 1.

[0112] Further, the thickness of the solder - brushing stencil is set between 0.02 - 0.03 mm, which can meet the die - bonding requirements of the LED chip 4 and reduce the packaging thickness of the LED device.

[0113] S17: Encapsulate the LED chip 4 and perform scribing according to a preset circuit to obtain a number of LED devices.

[0114] Specifically, use encapsulation glue to encapsulate and protect the circuit board 1 that has completed die - bonding of the chip. The encapsulation glue can be made of materials such as epoxy resin and anhydride resin. Perform chip encapsulation on the top surface of the circuit board 1 to form an encapsulation layer 5, thereby protecting the chip by encapsulation and reducing the risk of water vapor invading the internal circuit structure of the LED device.

[0115] Further, the thickness of the encapsulation layer 5 is set between 0.19 mm and 0.25 mm, which can meet the encapsulation requirements of the LED chip 4 and reduce the overall size of the LED device to achieve miniaturized packaging.

[0116] Further, after filling the encapsulation glue on the top surface of the circuit board 1, place the circuit board 1 in an environment of 145 °C - 155 °C for constant - temperature curing.

[0117] Further, perform scribing and splitting on the circuit board 1 that has completed encapsulation to obtain a number of LED devices.

[0118] The embodiment of the present invention provides a method for manufacturing an LED device. By forming the circuit board 1 in a way of stacking multiple electrical connection plates, the use of ink can be reduced, the difference in shrinkage and expansion forces between the electrical connection plates can be reduced, thereby reducing the risk of warping problems caused by the shrinkage and expansion differences between layers during the manufacturing process of the circuit board 1. Based on the stacked design of multiple electrical connection plates, the stability of the bonding connection between layers of the circuit board 1 is improved, thereby improving the reliability of device packaging.

[0119] In addition, the above has introduced in detail an LED device and its manufacturing method provided by the embodiment of the present invention. Specific examples are used in this article to elaborate on the principle and implementation method of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. An LED device, characterized in that, The LED device includes: a circuit board and an LED chip disposed on the circuit board; The circuit board includes more than three electrically conductive connection plates arranged in a stacked manner, and any one of the electrically conductive connection plates includes a BT substrate and a metal layer arranged in a stacked manner; The circuit board is formed by stacking and splicing more than three electrically conductive connection plates to form a vertically distributed circuit arrangement structure, and the LED chip is electrically connected within the circuit arrangement structure.

2. The LED device according to claim 1, wherein Any two adjacent electrically conductive connection plates are bonded based on an adhesive.

3. The LED device according to claim 1, characterized in that, The adhesive is a liquid epoxy glue, or the adhesive is a polypropylene glue.

4. The LED device according to claim 1, wherein The thickness of the metal layer is h, and the value range of h is: 0.01 mm ± 0.003 mm.

5. The LED device according to claim 1, wherein The thickness of the BT substrate is H, and the value range of H is: 0.03 mm ± 0.003 mm.

6. The LED device according to claim 1, characterized in that, The electrically conductive connection plate includes: a top electrically conductive connection plate with a first circuit arrangement layer, a bottom electrically conductive connection plate with a second circuit arrangement layer, and a middle electrically conductive connection plate with a preset circuit arrangement layer; The top electrically conductive connection plate, the middle electrically conductive connection plate, and the bottom electrically conductive connection plate are arranged in a stacked manner.

7. The LED device according to claim 6, wherein, The BT substrate of the top electrically conductive connection plate is connected to the BT substrate of the middle electrically conductive connection plate, so that the first circuit arrangement layer is exposed at the top of the circuit board; The BT substrate of the bottom electrically conductive connection plate is connected to the metal layer of the middle electrically conductive connection plate, so that the second circuit arrangement layer is exposed at the bottom of the circuit board.

8. The LED device according to claim 6, characterized in that, The circuit arrangement structure includes a plurality of first electrical channels and a plurality of second electrical channels, and electrical connection is achieved between the first circuit wiring layer and the preset circuit wiring layer based on the first electrical channels; Electrical connection is achieved between the second circuit wiring layer and the preset circuit wiring layer based on the second electrical channels.

9. The LED device according to claim 8, wherein, The preset circuit wiring layer is provided with a plurality of pads, and any one of the pads is provided with a first electrical connection point connected to the first electrical channel and a second electrical connection point connected to the second electrical channel.

10. The LED device according to claim 9, characterized in that, An insulating interval is provided between any two adjacent pads, and the width of the insulating interval is w, and the value range of w is: 40 μm ≤ w ≤ 50 μm.

11. The LED device according to claim 9, characterized in that, The second circuit wiring layer is provided with a plurality of electrical pins, and the plurality of electrical pins are electrically connected to the plurality of pads in a one-to-one correspondence; The side length of the electrically conductive connection plate is D, and the distance between any two adjacent electrical pins is d, and the constraint relationship between D and d is: D = 3d.

12. A method for preparing an LED device, characterized in that, The manufacturing method of the LED device is used to manufacture the LED device according to any one of claims 1 to 11, and the manufacturing method includes: Manufacture more than three electrically conductive connection plates, and etch a preset circuit wiring layer in one of the more than three electrically conductive connection plates; Bond and hot-press more than three electrically conductive connection plates to form a substrate; Set a plurality of first positioning points on the top surface of the substrate, and process a first electrical channel with a first depth at the position of the first positioning points; Set a plurality of second positioning points on the bottom surface of the substrate, and process a second electrical channel with a second depth at the position of the second positioning points; Process a first circuit arrangement layer on the top surface of the substrate, and process a second circuit arrangement layer on the bottom surface of the substrate; Mount the LED chip on the first circuit layer; Encapsulate the LED chip and saw it according to a preset circuit to obtain a number of LED devices.

13. The method for manufacturing an LED device according to claim 12, wherein, The preparation of more than three electrical connection plates, and the etching of a preset circuit wiring layer on one of the more than three electrical connection plates includes: Electroplate a metal layer on the surface of the BT substrate to form an electrical connection plate; Etch a preset circuit wiring layer on the electrical connection plate through a photolithography process.

14. The method for manufacturing an LED device according to claim 12, wherein, The bonding and hot pressing treatment of more than three electrical connection plates to form a substrate includes: Bond more than three electrical connection plates through an adhesive, and make the electrical connection plate with the preset circuit wiring layer located in the middle position; After pre-pressing through ultrasonic vibration, perform hot pressing treatment in a high-temperature environment.

15. The manufacturing method of the LED device according to claim 12, characterized in that, The setting of a number of first positioning points on the top surface of the substrate, and the processing of a first electrical channel with a first depth at the position of the first positioning point includes: Set the first positioning points at the top surface position of the substrate, and perform laser drilling operations at the coordinate positions of the first positioning points through a laser drilling device to obtain a number of first through holes connected to the preset circuit wiring layer; Perform electroplating hole filling process in the first through holes to form a number of first electrical channels.

16. The method for preparing an LED device according to claim 12, wherein, The setting of a number of second positioning points on the bottom surface of the substrate, and the processing of a second electrical channel with a second depth at the position of the second positioning point includes: Set the second positioning points at the bottom surface position of the substrate, and perform laser drilling operations at the coordinate positions of the second positioning points through a laser drilling device to obtain a number of second through holes connected to the preset circuit wiring layer; Perform electroplating hole filling process in the second through holes to form a number of second electrical channels.

17. The manufacturing method of the LED device according to claim 12, characterized in that, The processing of a first circuit arrangement layer on the top surface of the substrate and a second circuit arrangement layer on the bottom surface of the substrate includes: Taking the first electrical channels on the top surface of the substrate as the origin coordinates, form a pattern mask on the top surface of the substrate through a photolithography process, and process the metal layer on the top surface of the substrate according to the pattern mask to form a first circuit arrangement layer; Taking the second electrical channels on the bottom surface of the substrate as the origin coordinates, form a pattern mask on the bottom surface of the substrate through a photolithography process, and process the metal layer on the bottom surface of the substrate according to the pattern mask to form a second circuit arrangement layer.

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