Multi-wire electrical discharge machine, machining control device, machining condition generating device, electrical discharge machining system, electrical discharge machining method, and thin plate manufacturing method

Abstract

The multi-wire electrical discharge machining (EDM) machine comprises: a wire cutting section which winds wire electrodes around multiple guide rollers arranged side-by-side opposite the workpiece; a drive section which adjusts the distance between the workpiece and the wire cutting section; a processing power supply which applies a pulse voltage between the workpiece and the wire cutting section; a processing control device (9) which controls the drive section and the processing power supply; and a processing condition generation device (30) which generates processing conditions, i.e., applicable processing conditions, for the next processing based on the measurement results of the thickness of the sheet cut by the wire cutting section at each processing position on the processing surface of the sheet. The processing condition generation device (30) corrects the basic processing conditions, i.e., the basic processing conditions, based on the difference between the reference value, i.e. the target value, of the thickness of the sheet at each processing position and the measurement results, thereby generating applicable processing conditions. The processing control device (9) controls at least one of the drive section and the processing power supply using the applicable processing conditions during the next processing.

Description

Technical Field

[0001] This invention relates to a multi-wire electrical discharge machining (EDM) machine, a processing control device, a processing condition generation device, an EDM system, an EDM method, and a thin plate manufacturing method that cuts the workpiece into multiple thin plates using multiple wires. Background Technology

[0002] Multi-wire electrical discharge machining (MED) is a device that cuts multiple thin sheets from a workpiece by applying pulse voltages between multiple wires and a cylindrical workpiece.

[0003] The multi-wire electrical discharge machining machine described in Patent Document 1 outputs an application command of a pulse voltage obtained according to the machining conditions for avoiding wire breakage to the machining power supply when the value representing the machining state exceeds a threshold, thereby avoiding wire breakage and increasing the machining speed.

[0004] Patent Document 1: Japanese Patent No. 6991414 Summary of the Invention

[0005] However, in the technology of the aforementioned Patent Document 1, due to the influence of assembly fluctuations of the components caused by the multi-wire electrical discharge machining machine or the assembly operator, there is a problem that even if the same processing conditions are applied to the same workpiece, the thickness of the processed sheet will fluctuate from the reference value within the processing surface for each multi-wire electrical discharge machining machine.

[0006] The present invention was made in view of the above circumstances, and its object is to provide a multi-wire electrical discharge machining (MED) machine that can suppress the error in the thickness of the processed sheet from the reference value in the processing surface of each MED machine.

[0007] To address the aforementioned issues and achieve the objectives, the multi-wire electrical discharge machining (EDM) machine of the present invention comprises: a wire-cutting section in which wire electrodes are wound around a plurality of guide rollers and arranged side-by-side, facing the workpiece; and a drive section that adjusts the distance between the workpiece and the wire-cutting section. Furthermore, the multi-wire EDM machine of the present invention comprises: a processing power supply that applies a pulse voltage between the workpiece and the wire-cutting section; and a processing control device that controls the drive section and the processing power supply. Additionally, the multi-wire EDM machine of the present invention comprises a processing condition generation device that generates applicable processing conditions for the next processing operation based on a measurement result of the thickness of the sheet metal at each processing position within the previously cut surface of the sheet metal by the wire-cutting section processing the workpiece. The processing condition generation device corrects the basic processing conditions based on the difference between a reference value (target value) of the sheet metal thickness at each processing position and the measurement result, thereby generating the applicable processing conditions. The processing control device controls at least one of the drive section and the processing power supply using the applicable processing conditions during the next processing operation.

[0008] The effects of the invention

[0009] The multi-wire electrical discharge machining (EDM) machine of the present invention has the following effect: it can suppress the error in the thickness of the processed sheet from the reference value for fluctuations that occur in the processing surface of each EDM machine. Attached Figure Description

[0010] Figure 1 This is a diagram showing the structure of the multi-wire electrical discharge machining machine according to Embodiment 1.

[0011] Figure 2 This is a diagram showing the structure of the processing condition generation apparatus according to Embodiment 1.

[0012] Figure 3 This is a diagram used to explain the thickness of the sheet metal collected by the processing result collection unit of the processing condition generation apparatus according to Embodiment 1.

[0013] Figure 4 This is a diagram showing the structure of the processing condition generator involved in Implementation 1.

[0014] Figure 5 This is a flowchart illustrating the processing sequence of the multi-wire electrical discharge machining (EDM) machine according to Embodiment 1.

[0015] Figure 6 This is a diagram illustrating other structural examples of the machining control device of the multi-wire electrical discharge machining machine according to Embodiment 1.

[0016] Figure 7This is a diagram illustrating an example of the hardware structure of the processing condition generation device according to Embodiment 1.

[0017] Figure 8 This is a diagram showing the structure of the electrical discharge machining system according to Embodiment 2. Detailed Implementation

[0018] The following description, based on the accompanying drawings, details the multi-wire electrical discharge machining (EDM) machine, machining control device, machining condition generation device, EDM system, EDM method, and thin plate manufacturing method according to embodiments of the present invention.

[0019] Implementation method 1.

[0020] Figure 1 This diagram illustrates the structure of the multi-wire electrical discharge machining (EDM) machine according to Embodiment 1. Furthermore, in the following description, the vertical direction is defined as the Z-axis, and the two axes in the horizontal plane that are orthogonal to each other are defined as the X-axis and Y-axis. That is, the X-axis, Y-axis, and Z-axis are three mutually perpendicular axes. The direction of the arrow in each axis direction is defined as the positive direction, and the direction opposite to the arrow is defined as the negative direction. The positive Z-direction is the vertical upward direction, and the negative Z-direction is the vertical downward direction.

[0021] The multi-wire electrical discharge machining (EDM) machine 1 is a device that uses electrical discharge to cut a cylindrical workpiece 2 into multiple sheets (multiple thin plates). The EDM machine 1 causes the wire electrodes 6 to rotate multiple times, and performs EDM on the workpiece 2 by applying pulse voltages to each of the multiple cutting wire sections 6a that travel in parallel with each other within the wire electrodes 6 and between them. The EDM machine 1 manufactures multiple thin plates by simultaneously cutting them from the workpiece 2. The EDM machine 1 controls the voltage applied through the processing power supply 7, thereby preventing the wire electrodes 6 from being cut due to instability in the processing or changes in mechanical time while performing EDM.

[0022] The multi-wire electrical discharge machining (EDM) machine 1 includes: a spool 4 for supplying wire electrodes 6; and a spool drive unit 17 for rotating the spool 4. Additionally, the MED machine 1 includes: a wire discharge roller 5 for discharging the wire electrodes 6 to the outside of the MED machine 1; guide rollers 3a to 3d for properly guiding the wire electrodes 6; and a guide roller drive unit 18 for driving the guide rollers 3a.

[0023] Each guide roller 3a to 3d is cylindrical. The guide rollers 3a to 3d guide the movement of the wire electrode 6 between the spool 4 and the wire discharge roller 5.

[0024] The wire electrode 6 is wound multiple times while maintaining a gap between the guide rollers 3a to 3d. That is, the four cylindrical guide rollers 3a to 3d are arranged with their central axes parallel to each other and separated by parallel axial directions. Figure 1 In this configuration, the central axis of each guide roller 3a to 3d is parallel to the Y-axis. That is, in... Figure 1 The diagram shows the configuration where guide rollers 3a to 3d extend in the Y-axis direction.

[0025] In addition, the four guide rollers 3a to 3d are in a plane orthogonal to the axial direction (in Figure 1 The central axis of each guide roller 3a to 3d is positioned within the XZ plane, forming the vertices of a quadrilateral. Specifically, the plane perpendicular to the central axis of each of the four guide rollers 3a to 3d is the XZ plane. Among the four guide rollers 3a to 3d, guide rollers 3a and 3b are positioned at the highest point in the Z-axis direction, guide roller 3c is positioned below guide roller 3b, and guide roller 3d is positioned below guide roller 3a and parallel to guide roller 3c. That is, the lines connecting guide rollers 3a and 3b and the lines connecting guide rollers 3c and 3d are parallel to the X-axis direction, and the lines connecting guide rollers 3b and 3c and the lines connecting guide rollers 3d and 3a are parallel to the Z-axis direction.

[0026] Furthermore, around the outer periphery (side surface) of the four guide rollers 3a-3d, multiple guide grooves for guiding the movement of the wire electrode 6 are formed at specific intervals in their respective axial directions. That is, in each guide roller 3a-3d, multiple guide grooves are formed at certain intervals in the direction of the central axis. The wire electrode 6, drawn from the spool 4, is wound along the guide grooves on each guide roller 3a-3d. In other words, in the example shown, when viewed from the negative Y direction, the wire electrode 6 is guided by the guide grooves of each of the guide rollers 3a-3d, which rotate to the right (clockwise).

[0027] After the wire electrode 6 is wound around the guide rollers 3a to 3d multiple times, it is discharged from the wire discharge roller 5. That is, after the wire electrode 6 is wound multiple times between the four guide rollers 3a to 3d, separated by specific intervals between the guide grooves, it is discharged from the wire discharge roller 5 to the outside of the multi-wire electrical discharge machine 1.

[0028] Here, the portions of the wire electrode 6 that are parallel to each other and stretched between the guide rollers 3c and 3d are respectively called cutting line portions 6a. That is, the cutting line portions 6a are multiple cutting lines arranged side by side opposite to the workpiece 2 by winding one wire electrode 6 around multiple guide rollers 3a to 3d. In other words, each of the multiple cutting line portions 6a is a portion of the wire electrode 6 that is supported between the guide rollers 3c and 3d, which serve as guide rollers. Multiple cutting line portions 6a that are parallel to each other are provided between the guide rollers 3c and 3d. The multiple cutting line portions 6a are portions of the wire electrode 6 that are parallel to each other between the guide rollers 3c and 3d. In Embodiment 1, the travel direction of the wire electrode 6 in the multiple cutting line portions 6a, i.e., the second direction, is the X-axis direction. The cutting line portions 6a in the wire electrode 6 cut the workpiece 2. The workpiece 2 is cylindrical and is arranged with its axial direction in the Y-axis direction.

[0029] Furthermore, the multi-wire electrical discharge machining (EDM) machine 1 includes: a power supply unit 12 that contacts the wire electrodes 6 to supply processing voltage to the wire electrodes 6; and a drive unit 14 that drives a processing table (not shown) capable of holding the workpiece 2 in the positive Z-direction. The multi-wire EDM machine 1 moves the processing table holding the workpiece 2 in the positive Z-direction, thereby processing the workpiece 2. That is, the drive unit 14, as the drive unit, moves the processing table in the Z-axis direction, which is the first direction. The first direction is the direction in which the workpiece 2 moves relative to the plurality of cutting wire portions 6a, and is also the direction of travel of the EDM in the workpiece 2.

[0030] Furthermore, the multi-wire electrical discharge machining (EDM) machine 1 includes, via a power supply unit 12, each of the wire cutting portions 6a included in the wire electrode 6; and a processing power supply 7, which applies a processing pulse voltage (hereinafter referred to as processing pulse voltage) to the workpiece 2. The processing power supply 7 applies a processing pulse voltage to each of the plurality of wire cutting portions 6a and the workpiece 2. Additionally, the multi-wire EDM machine 1 includes a cable 11 connecting the processing power supply 7 and the workpiece 2. Each processing power supply 7 has a plurality of processing power supply units 8 corresponding one-to-one with each wire cutting portion 6a.

[0031] In addition, the multi-wire electrical discharge machining machine 1 includes: a machining control device 9 that controls the electrical discharge machining; a machining status detection device 15 that detects the machining status in each cut wire section 6a; and a machining condition generation device 30 that outputs machining conditions to the machining control device 9.

[0032] exist Figure 1In the example shown, the guide roller drive unit 18 rotates the guide roller 3a. Additionally, the spool drive unit 17 rotates the spool 4 to maintain a constant tension on the wire electrode 6. The multi-wire electrical discharge machine 1 controls the rotation of the spool 4 via the spool drive unit 17 and the rotation of the guide roller 3a via the guide roller drive unit 18 to achieve a desired travel speed for the wire electrode 6.

[0033] The processing status detection device 15 detects the processing status of each cutting line section 6a. The processing status detection device 15 is disposed on the wiring connecting the power supply unit 12 and the processing power supply 7. The processing status detection device 15 monitors the inter-electrode voltage, current, number of discharges per unit time, number of short circuits per unit time, and the output voltage of the processing power supply 7 (i.e., the processing pulse voltage) via the power supply unit 12, thereby detecting the processing status of each cutting line section 6a. The inter-electrode voltage is the voltage applied between the electrodes, i.e., the workpiece 2, and each cutting line section 6a. Each processing status detection device 15 has multiple processing status detection units 16 corresponding one-to-one with each cutting line section 6a. The processing status detection device 15 detects the processing status of each cutting line section 6a through each processing status detection unit 16.

[0034] The machining control device 9 controls at least one of the drive unit 14 and the machining power supply 7 based on the machining result of the workpiece 2 (thickness at each machining position). Furthermore, the machining control device 9 generates a feed control command value as a position command based on the machining state detected by the machining state detection device 15. The machining control device 9 outputs the position command to the drive unit 14. The drive unit 14 moves the machining table in the Z-axis direction according to the position command. Thus, the drive unit 14 changes the relative position of the workpiece 2 and each cutting line portion 6a. As described above, the multi-wire electrical discharge machining machine 1 adjusts the distance between the workpiece 2 and each cutting line portion 6a via the drive unit 14.

[0035] Furthermore, the machining control device 9 outputs voltage application commands to each machining power supply unit 8 based on the machining state detected by the machining state detection device 15. Each machining power supply unit 8 applies a machining pulse voltage between the cutting line section 6a and the workpiece 2. The voltage application command includes various command values ​​such as the voltage amplitude, the frequency of the machining pulse voltage, and the on-pulse duration of the machining pulse voltage.

[0036] The processing control device 9 controls the distance between the workpiece 2 and each cutting line 6a by outputting a position command, and causes a discharge between each cutting line 6a and the workpiece 2 by outputting a voltage application command. As a result, the multi-wire EDM machine 1 cuts multiple thin plates from the workpiece 2.

[0037] The machining condition generation device 30 includes a machining condition generator 32, which will be described later. The machining condition generator 32, as a machining condition generation unit, is connected to the machining control device 9. The machining condition generator 32 compares the thickness of the sheet relative to its in-plane position (within the machining plane) with the machining results obtained by the machining result collection unit 31, which will be described later, to generate suitable machining conditions (target voltage, average machining current, etc.) for each machining position. The machining condition generation device 30 then sends the generated machining condition commands to the machining control device 9.

[0038] The workpiece 2 is an ingot (semiconductor ingot, etc.) that is cut into multiple thin plates. The raw material for the workpiece 2 is, for example, a metal such as tungsten or molybdenum used as a sputtering target, or a ceramic such as polycrystalline silicon carbide used as a component in various structures. The workpiece 2 can be monocrystalline silicon, used as a material for semiconductor wafers, or a semiconductor raw material such as monocrystalline silicon carbide, monocrystalline gallium nitride, monocrystalline gallium oxide, or monocrystalline diamond. Alternatively, the workpiece 2 can be a solar cell raw material such as monocrystalline silicon or polycrystalline silicon, used as a material for solar cell wafers. An example of the multi-wire electrical discharge machining (EDM) machine 1 is an apparatus that manufactures multiple semiconductor wafers by cutting multiple semiconductor wafers from an ingot. Furthermore, the shape of the workpiece 2 is not limited to a square column shape; it can also be cylindrical.

[0039] The resistivity of the metal in the material cited as an example of workpiece 2 is sufficiently low, so as not to hinder the application of electrical discharge machining. On the other hand, the materials that can be used for electrical discharge machining among semiconductor materials and solar cell materials are materials with sufficiently low resistivity of approximately less than or equal to 100 Ωcm, preferably materials with resistivity of less than or equal to 10 Ωcm.

[0040] Therefore, metals are suitable as workpiece 2. Among raw materials such as semiconductor materials or solar cell materials, materials with resistivity ranging from the resistivity equivalent to that of metals to 100 Ωcm are suitable as workpiece 2. Among raw materials such as semiconductor materials or solar cell materials, materials with resistivity ranging from the resistivity equivalent to that of metals to 10 Ωcm are even more suitable as workpiece 2.

[0041] The multi-wire electrical discharge machining (EDM) machine 1 supplies machining fluid between the workpiece 2 and each cutting wire section 6a, i.e., between the electrodes. Similar to a so-called single-type wire EDM machine, the multi-wire EDM machine 1 supplies machining fluid to the electrode space by spraying it or by immersing the workpiece 2 in the machining fluid. A diagram of the structure used for supplying the machining fluid is omitted.

[0042] The machining power supply 7 has multiple machining power supply units 8, each corresponding one-to-one with the cutting wire section 6a. The machining power supply 7 generates machining pulse voltages applied between electrodes according to voltage application commands from the machining control device 9. The machining power supply 7 generates the machining pulse voltages, for example, using a switching power supply. The machining power supply 7 applies machining pulse voltages individually to each of the multiple cutting wire sections 6a through the multiple machining power supply units 8. The machining power supply 7 has a ground electrode 10 that spans across the multiple machining power supply units 8. Grounding wires from each machining power supply unit 8 are connected to the ground electrode 10. The ground electrode 10 is connected to a workpiece fixture (not shown) via a cable 11. The workpiece 2 is connected to the ground electrode 10 via the workpiece fixture and the cable 11. Furthermore, the machining power supply 7 can appropriately reverse the polarity of the generated machining pulse voltage as needed.

[0043] The power supply component 12 is constructed by a plurality of power supply component units 13 that are insulated from each other. Each of the plurality of power supply component units 13 corresponds one-to-one with the power supply line section 6b. Figure 1 In the example shown, the parallel portion (parallel tensioned portion) between the guide rollers 3b and 3c in the in-line electrode 6 consists of multiple power supply lines 6b. The power supply lines 6b are slidably connected to each power supply unit 13. Each power supply unit 13 supplies power from the processing power supply unit 8 to the power supply lines 6b. The power supply unit 12 supplies power to each of the multiple power supply lines 6b individually via the multiple power supply units 13. Thus, a processing pulse voltage is individually applied to each cutting wire section 6a via each processing power supply unit 8.

[0044] Figure 2 This diagram illustrates the structure of the processing condition generation apparatus according to Embodiment 1. The processing condition generation apparatus 30 includes a processing result collection unit 31, a processing condition generator 32, and a subtractor 33. In the processing condition generation apparatus 30, the processing result collection unit 31 is connected to the subtractor 33, and the subtractor 33 is connected to the processing condition generator 32. Furthermore, the processing condition generator 32 is connected to the processing control device 9.

[0045] The processing result collection unit 31 collects the thickness (sheet thickness) of the sheet processed by the cutting line unit 6a for each processing position and outputs it to the subtractor 33. The thickness of the sheet for each processing position is the thickness of the sheet in the processing direction (Z-axis direction) for each processing position.

[0046] Figure 3 This is a diagram used to explain the sheet thickness collected by the processing result collection unit of the processing condition generation apparatus according to Embodiment 1. Figure 3 In order to illustrate the relationship between the position where the thickness of the sheet 2X is measured and the configuration positions of the guide rollers 3c and 3d, the figure shows guide rollers 3c and 3d. Figure 3The diagram shows the sheet metal 2X and guide rollers 3c and 3d as viewed from the Y-axis direction. Here, the case where the workpiece 2 is cylindrical and the sheet metal 2X is circular is explained.

[0047] The thickness of the sheet 2X cut from the workpiece 2 is measured at various positions in the processing direction. In Embodiment 1, the thickness of the sheet 2X is measured at multiple positions along the processing path of the sheet 2X in a direction parallel to the Z-axis, passing through the center of the sheet 2X during processing.

[0048] For example, if the positions for measuring thickness are designated as Z1 to Zn (where n is a natural number greater than or equal to 2), and the measurement results of the sheet thickness are designated as At1 to Atn, then the measurement results of the sheet thickness at each processing position are represented by the measurement results (Z1, At1), (Z2, At2), ..., (Zn, Atn). The positions Z1 to Zn are named Z1, Z2, ..., Zn in descending order of their Z-axis coordinates.

[0049] The processing result collection unit 31 collects the measurement results (Z1, At1), (Z2, At2), ..., (Zn, Atn) measured by the thickness measuring instrument (not shown) and outputs them to the subtractor 33.

[0050] Subtractor 33 receives the measurement results (processing results) of the sheet thickness for each processing position from the processing result collection unit 31. Additionally, subtractor 33 receives target values ​​(reference values) of the sheet thickness for each processing position pre-stored in a storage device (not shown) or similar device of the multi-wire electrical discharge machine 1. If the target values ​​of the sheet thickness are set to A1 to An, the target values ​​of the sheet thickness for each processing position where the thickness is measured are represented by target values ​​(Z1, A1), (Z2, A2), ..., (Zn, An). Subtractor 33 calculates the difference obtained by subtracting the measurement results of the sheet thickness for each processing position from the target values ​​of the sheet thickness for each processing position and sends the thickness difference to the processing condition generator 32. Furthermore, the target values ​​of the sheet thickness A1 to An can be the same value. That is, A1 = A2 = ..., ..., = An.

[0051] The processing condition generator 32 corrects the basic processing conditions pre-stored in the storage device of the multi-wire electrical discharge machine 1 based on the thickness difference. If the basic processing conditions are set as processing conditions C1 to Cn, the processing conditions for each processing position where the thickness is measured are represented by processing conditions (Z1, C1), (Z2, C2), ..., (Zn, Cn).

[0052] The processing condition generator 32 corrects the basic processing conditions using correction values ​​corresponding to the thickness difference. That is, the processing condition generator 32 compares the target values ​​(Z1, A1), (Z2, A2), ..., (Zn, An) of the sheet thickness for each processing position with the measured results (Z1, At1), (Z2, At2), ..., (Zn, Atn) of the sheet thickness for each processing position, and corrects the basic processing conditions for each processing position based on the thickness difference as a comparison result.

[0053] For example, when m is set to a natural number from 2 to n, the processing interval from position Z(m-1) to position Zm is processed using the processing conditions at position Z(m-1). Therefore, the processing condition generator 32 corrects the basic processing conditions for each processing interval. Furthermore, the processing interval from position Z(m-1) to position Zm can be processed using the intermediate value between the processing conditions at position Z(m-1) and the processing conditions at position Zm. The following description explains the case where the processing condition generator 32 corrects the basic processing conditions for each processing interval.

[0054] For example, for the thin plate 2X, a first processing interval is set up up to position Z1 to Z2, a second processing interval is set up up to position Z2 to Z3, and a (n-1)th processing interval is set up up to position Z(n-1) to Zn. The processing condition generator 32 corrects the basic processing conditions for each set processing interval.

[0055] The machining condition generator 32 generates applicable machining conditions by correcting the basic machining conditions to reduce the thickness difference in the next machining operation. These applicable machining conditions are the machining conditions used for subsequent machining control. The machining condition generator 32 sends the corrected machining conditions, i.e., the applicable machining conditions, to the machining control device 9. Thus, the machining control device 9 uses the applicable machining conditions in the next machining operation.

[0056] Basic and applicable processing conditions include at least one of the following: target voltage, average processing current, number of opening cycles, and opening voltage. The target voltage is the average value of the processing pulse voltage applied per unit time between the cutting wire 6a and the workpiece 2. The average processing current is the average value of the current flowing per unit time between the cutting wire 6a and the workpiece 2. The number of opening cycles is the number of times per unit time there is no discharge during electrical discharge machining. The opening voltage is the average value of the voltage per unit time during opening cycles (when there is no discharge).

[0057] As described above, in Embodiment 1, the processing condition generator 32 generates applicable processing conditions corresponding to the processing position (processing interval) and outputs them to the processing control device 9. That is, for each processing interval, the processing condition generator 32 generates applicable processing conditions such as voltage application commands corresponding to the target voltage and outputs them to the processing control device 9. Furthermore, the processing result collection unit 31 can also acquire measurement results measured by a thickness measuring device or the like via an existing information communication device, or it can acquire measurement results manually input by the operator. The method of acquiring the measurement results collected by the processing result collection unit 31 can be any method if it is information that can determine the thickness of the sheet 2X for each processing position.

[0058] The machining control device 9 controls at least one of the drive unit 14 and the machining power supply 7 based on applicable machining conditions. The machining control device 9 controls at least one of the drive unit 14 and the machining power supply 7 to achieve the target voltage, average machining current, number of opening cycles, or opening voltage specified by the applicable machining conditions.

[0059] Figure 4 This is a diagram showing the structure of the processing condition generator according to Embodiment 1. The processing condition generation device 30, which has a processing condition generator 32, processes the measurement results (At1, At2, ..., Atn) of the sheet thickness for each processing position as a set of data. In addition, the processing condition generation device 30 processes the target value (A1, A2, ..., An) of the sheet thickness for each processing position as a set of data.

[0060] Subtractor 33 calculates the difference e between the target value (A1, A2, ..., An) of the sheet thickness at each processing position and the measured result (At1, At2, ..., Atn) of the sheet thickness at each processing position, and sends it to processing condition generator 32.

[0061] The processing condition generator 32 receives the thickness difference, i.e., the difference e, from the subtractor 33. The processing condition generator 32 uses the difference e[i] input in this current (let's say the i-th (i is a natural number) time) and the difference e[i-1] input in the previous (i-1) time) time to generate the current processing condition correction amount u[i].

[0062] Specifically, the processing condition generator 32 uses the following equation (1), which is obtained by multiplying the current difference e[i] and the previous difference e[i-1] by coefficients K1 and K2, to generate the current processing condition correction amount u[i].

[0063] Formula 1

[0064] u[i]=K1 e[i]+K2(e[i]+e[i-1])…(1)

[0065] also, Figure 4 The z shown -1 This corresponds to the difference e[i-1] of the (i-1)th iteration. The machining condition generator 32 generates the applicable machining conditions for this iteration by adding a machining condition correction amount u[i] to the basic machining conditions, thereby outputting them to the machining control device 9.

[0066] The multi-wire electrical discharge machining (EDM) machine 1 repeatedly processes the sheet metal 2X using the applicable processing conditions generated by the processing condition generator 32, thereby producing a sheet metal 2X with a thickness close to the reference thickness (target value) of the sheet metal 2X at each processing position. As a result, the multi-wire EDM machine 1 can reduce the thickness fluctuation of the sheet metal 2X from the reference value.

[0067] When multiple wire EDM machines 1 cut out thin plates 2X, each wire EDM machine 1 uses common basic processing conditions to cut out the thin plates 2X. As a result, the thickness of the thin plates 2X cut by each wire EDM machine 1 becomes the same, and the grinding and polishing of the thin plates 2X becomes easier.

[0068] The processing condition generator 32 generates new applicable processing conditions, for example, based on the thickness of the processed sheet 2X obtained from the processing result collection unit 31 for each processing position after each processing operation. The thickness for each processing position can be collected for multiple sheets 2X cut out in one processing operation. In this case, the processing result collection unit 31 collects the average thickness of the multiple sheets 2X as the thickness of the sheet 2X for each processing position.

[0069] Furthermore, the processing condition generator 32 can obtain the thickness of the processed sheet 2X for each processing position from the processing result collection unit 31 during each of multiple processing operations, and generate new applicable processing conditions using the average thickness for each processing position. The number of times the processing condition generator 32 generates applicable processing conditions (generation frequency) for a given number of processing operations is not limited.

[0070] Figure 5 This is a flowchart illustrating the processing sequence of the multi-wire electrical discharge machining (EDM) machine according to Embodiment 1. The processing result collection unit 31 of the MDM machine 1 collects the measurement results of the sheet thickness as a processing result for each processing position (step S10).

[0071] Subtractor 33 calculates the error of the sheet thickness from the reference value for each processing position (step S20). Specifically, for each processing position, subtractor 33 calculates the difference obtained by subtracting the processing result of the sheet thickness from the target value (reference) of the sheet thickness, and uses this difference as the error of the sheet thickness from the reference value.

[0072] The processing condition generator 32 corrects the basic processing conditions for each processing interval (step S30). Specifically, the processing condition generator 32 calculates the processing condition correction amount for each processing interval using the error in the sheet thickness from the reference value. Furthermore, the processing condition generator 32 corrects the basic processing conditions for each processing interval using the processing condition correction amount, thereby calculating the applicable processing conditions for each processing interval. The processing condition generator 32 outputs the applicable processing conditions for each processing interval to the processing control device 9.

[0073] The multi-wire electrical discharge machining (EDM) machine 1 controls at least one of the drive unit 14 and the processing power supply 7 via the processing control device 9, thereby processing the workpiece 2 under applicable processing conditions for each processing zone (step S40). The thin plate 2X obtained by processing the workpiece 2 has its thickness measured at each processing position using a thickness measuring device or the like. This thickness is sent to the processing result collection unit 31 as the thickness measurement result of the thin plate. The EDM machine 1 repeats the calculation of applicable processing conditions based on the thickness measurement result of the thin plate and the processing of the workpiece 2 using the applicable processing conditions.

[0074] Furthermore, reducing the processing fluctuations of the sliced ​​sheet 2X during the cutting process of workpiece 2 is important for reducing the load on subsequent grinding and lapping processes and improving the yield. Assuming that assembly fluctuations of components caused by the multi-wire electrical discharge machine (MED) or assembly operators affect the thickness of the processed sheet 2X, and that the error from the reference value fluctuates in the plane for each MED, reducing these fluctuations requires skilled operators to adjust the processing conditions for each MED, necessitating significant experience and time.

[0075] On the other hand, in the multi-wire electrical discharge machining 1 of Embodiment 1, since the thickness error of the processed sheet 2X from the reference value does not fluctuate in the plane, there is no need for the operator to adjust the processing conditions.

[0076] Furthermore, if the thickness of the machined sheet 2X fluctuates within the plane due to errors from the reference value, the grinding and lapping amounts of the sheet 2X must be adjusted to absorb these fluctuations. Consequently, the load on the grinding and lapping processes increases.

[0077] On the other hand, the multi-wire electrical discharge machining 1 of Embodiment 1 can reduce the load in the grinding and polishing processes because the thickness error of the processed sheet 2X from the reference value does not fluctuate in the plane.

[0078] In addition, the processing condition generation device 30 can also be configured within the processing control device 9. Figure 6 This is a diagram illustrating other structural examples of the machining control device of the multi-wire electrical discharge machining machine according to Embodiment 1.

[0079] The machining control device 9A includes a machining condition generation device 30 and a control unit 35. The control unit 35 has the same functions as the machining control device 9. When the machining condition generation device 30 is located inside the machining control device 9, the multi-wire electrical discharge machining machine 1 will perform the same processing as when the machining condition generation device 30 is located outside the machining control device 9.

[0080] Here, the hardware structure of the processing condition generation device 30 and the processing control devices 9 and 9A will be described. Furthermore, since the processing condition generation device 30 and the processing control devices 9 and 9A have the same hardware structure, the hardware structure of the processing condition generation device 30 will be described here.

[0081] Figure 7 This diagram illustrates an example of the hardware structure for implementing the processing condition generation apparatus according to Embodiment 1. The processing condition generation apparatus 30 can be implemented using an input device 300, a processor 100, a memory 200, and an output device 400. Examples of the processor 100 are CPUs (also known as Central Processing Units, processing devices, arithmetic units, microprocessors, microcomputers, DSPs (Digital Signal Processors)) or system LSIs (Large Scale Integration). Examples of the memory 200 are RAM (Random Access Memory) or ROM (Read Only Memory).

[0082] The processing condition generation device 30 is implemented by the processor 100 reading and executing a computer-executable processing program stored in the memory 200 for performing the actions of the processing condition generation device 30. The program for performing the actions of the processing condition generation device 30, i.e., the processing program, can be said to be the sequence or method by which the computer executes the processing condition generation device 30.

[0083] The processing program executed by the processing condition generation device 30 becomes a modular structure that includes the functions of the processing result collection unit 31, the processing condition generator 32, and the subtractor 33. The functions of the processing result collection unit 31, the processing condition generator 32, and the subtractor 33 are downloaded to the main storage device, and the functions of the processing result collection unit 31, the processing condition generator 32, and the subtractor 33 are generated on the main storage device.

[0084] The input device 300 receives measurement results (Z1, At1), (Z2, At2), ..., (Zn, Atn) from the thickness measuring device and sends them to the processor 100. The memory 200 stores processing programs, etc. In addition, the memory 200 is used as temporary memory when the processor 100 performs various processes. The output device 400 outputs applicable processing conditions to the processing control device 9.

[0085] The processing program can be provided as a computer program product by storing it on a computer-readable storage medium in an installable or executable form. Alternatively, the processing program can also be provided to the processing condition generation device 30 via a network such as the Internet. Furthermore, the functions of the processing condition generation device 30 can be partially implemented using dedicated hardware such as dedicated circuits, and partially implemented using software or firmware.

[0086] As described above, in Embodiment 1, the processing condition generation device 30 generates applicable processing conditions by correcting the basic processing conditions based on the difference between the reference value (target value) and the thickness measurement result of the sheet 2X for each processing position. Furthermore, during the next processing cycle, the processing control device 9 controls at least one of the drive unit 14 (which serves as the drive unit) and the processing power supply 7 using the applicable processing conditions. Thus, the multi-wire electrical discharge machining (EDM) machine 1 suppresses in-plane fluctuations in the thickness of the processed sheet 2X from the reference value.

[0087] Furthermore, the processing condition generation device 30 calculates the applicable processing conditions for the multi-wire electrical discharge machining (MEDM) 1 based on the measurement results (Z1, At1), (Z2, At2), ..., (Zn, Atn) of the thin plate 2X processed by the MEDM 1. Therefore, even when multiple MEDMs 1 exist, it is possible to suppress the in-plane fluctuations in the thickness of the thin plate 2X processed by each MEDM 1, starting from the reference value.

[0088] Implementation method 2.

[0089] Next, use Figure 8 Implementation method 2 will be described. In implementation method 2, applicable processing conditions are generated for multiple multi-wire electrical discharge machining (EDM) machines.

[0090] Figure 8 This is a diagram showing the structure of the electrical discharge machining system according to Embodiment 2. The electrical discharge machining system 50 has multiple multi-wire electrical discharge machining machines 1X1 to 1X of the same model. N (N is a natural number greater than or equal to 2) and the upper controller 40.

[0091] Multi-wire electrical discharge machining (1X1~1X) N Each has Figure 1 The structural elements of the multi-wire electrical discharge machining (EDM) machine 1 described herein, excluding the machining condition generation device 30. That is, the multi-wire EDM machine 1X1 to 1X N Each component includes a cutting section 6a, guide rollers 3a to 3d, a drive unit 14, a processing power supply 7, and a processing control device 9.

[0092] In embodiment 2, the multi-wire electrical discharge machining (MED) machine 1X1 is the first MED machine, and the multi-wire MED machines 1X2 to 1X... N This is the second multi-wire electrical discharge machining (MED) machine. The workpiece 2 processed by MED machine 1X1 is the first workpiece. MED machines 1X2 to 1X... N The workpiece 2 being processed is the second workpiece.

[0093] The wire cutting section 6a, guide rollers 3a to 3d, drive unit 14, processing power supply 7, and processing control device 9 of the multi-wire electrical discharge machining machine 1X1 are respectively the first wire cutting section, the first guide roller, the first drive unit, the first processing power supply, and the first processing control device.

[0094] Multi-wire electrical discharge machining (1X2~1X) NThe cutting section 6a, guide rollers 3a to 3d, drive unit 14, processing power supply 7, and processing control device 9 are respectively the second cutting section, the second guide roller, the second drive unit, the second processing power supply, and the second processing control device.

[0095] For example, semiconductor wafers are sometimes produced in the tens of thousands per month. However, due to the limited size of semiconductor ingots, only tens to hundreds of semiconductor wafers can be cut from a single ingot. Therefore, in order to process the target number of wafers produced, multiple multi-wire electrical discharge machining (EDM) machines (1X1 to 1X1) are used in the semiconductor wafer cutting process. N Semiconductor ingots are processed to ensure monthly production volume. It is desired to utilize multiple multi-wire electrical discharge machining (EDM) machines (1X1 to 1X1). N In this case, it will also reduce the thickness fluctuation of the sheet 2X from the reference value for each processing position.

[0096] In implementation method 2, the upper-level controller 40 controls each multi-wire electrical discharge machine 1X1 to 1X N The applicable processing conditions are calculated, and thus the use of multiple multi-wire electrical discharge machining centers 1X1 to 1X N In this case, it will also reduce the thickness fluctuation of the sheet 2X from the reference value for each processing position.

[0097] The upper-level controller 40 and the multi-wire electrical discharge machining machine 1X1~1X N Connection. The upper-level controller 40 has a processing condition generation device 302-30. N Processing condition conveying unit 43.

[0098] Various processing condition generation devices 302-30 N It has the same function as the processing condition generation device 30. That is, processing condition generation devices 302-30 N Each has a processing result collection unit 31, a processing condition generator 32, and a subtractor 33.

[0099] Processing condition generation device 302-30 N Each is connected to a multi-wire electrical discharge machining (EDM) machine 1X1 to 1X N Connection. The multi-wire electrical discharge machining (EDM) machine 1X1 processes the workpiece 2 using basic processing conditions. Therefore, the upper-level controller 40 does not have a processing condition generation device 301.

[0100] Processing condition generation device 302-30 N The thickness of the sheet 2X processed by the multi-wire electrical discharge machining (EDM) machine 1X1 at each processing position is collected, and this sheet thickness is set as the target value for the sheet thickness.

[0101] In addition, the processing condition generation device 302-30N For multi-wire electrical discharge machining (EDM) machines 1X2 to 1X N The thickness of the processed thin plates (2X) at each processing location is collected, and the thickness is recorded for each multi-wire electrical discharge machining (1X2~1X) machine. N The applicable processing conditions are calculated. That is, the processing condition generation device 30 M (M is a natural number from 2 to N) For multi-wire electrical discharge machining 1X M The thickness of the processed thin plates 2X is collected for each processing position, and the results are processed by the multi-wire electrical discharge machining (EDM) 1X. M The applicable processing conditions are calculated. Processing condition generation device 30 M The thickness of the sheet 2X processed by the multi-wire electrical discharge machining (MED) machine 1X1 at each processing position is taken as the target value of the sheet thickness. M The thickness of the processed sheet 2X at each processing position is used as the measurement result, and the applicable processing conditions are calculated.

[0102] Multi-wire electrical discharge machining 1X M The processed sheet 2X is the first sheet, and the sheet 2X processed by the multi-wire electrical discharge machining (MED) machine 1X1 is the second sheet. Additionally, the multi-wire MED machine 1X... M The thickness measurement results of the processed sheet 2X at each processing position are the first measurement results, and the thickness measurement results of the processed sheet 2X at each processing position are the second measurement results.

[0103] The processing condition transfer unit 43 transfers the processing condition generation device 30 M The calculated applicable processing conditions are sent to the multi-wire electrical discharge machine 1X. M Alternatively, the upper-level controller 40 may have a processing result collection unit 31 and processing condition generation devices 302-30. N The structure does not include a processing result collection unit 31. In this case, one processing result collection unit 31 is used for the multi-wire electrical discharge machining (EDM) machine 1X1 to 1X2. N The thickness of the processed thin plate 2X is collected for each processing position and sent to the respective processing condition generation devices 302-30. N That is, if the processing result collection unit 31 collects data from the multi-wire electrical discharge machining (MED) machine 1X... M The thickness of the processed sheet 2X for each processing position is then sent to the multi-wire electrical discharge machine 1X. M Corresponding processing condition generation device 30 MFurthermore, if the processing result collection unit 31 collects the sheet thickness of the sheet 2X processed by the multi-wire electrical discharge machining (EDM) machine 1X1 for each processing position, it sends this sheet thickness as a target value to the processing condition generation device 30. M .

[0104] As described above, in Embodiment 2, the processing condition generation apparatus 302-30 N The target value (reference value) of the sheet thickness used is the sheet thickness of the sheet 2X processed by the multi-wire electrical discharge machining (EDM) machine 1X1 for each processing position. That is, when the measurement results of the sheet thickness of the sheet 2X processed by the processing condition generation device 301 for each processing position are the measurement results (Z1, At1), (Z2, At2), ..., (Zn, Atn), the processing condition generation devices 302 to 30... N Set the measurement results (Z1, At1), (Z2, At2), ..., (Zn, Atn) as the target values ​​(Z1, A1), (Z2, A2), ..., (Zn, An).

[0105] Therefore, by using a multi-wire electrical discharge machining (EDM) machine 1X2~1X N The sheet thickness 2X being processed has a thickness at each processing position that is approximately equal to the sheet thickness at each processing position of the sheet 2X processed by the multi-wire electrical discharge machining (EDM) machine 1X1. As described above, the EDM system 50 utilizes multiple multi-wire EDM machines 1X1 to 1X1. N The thickness of the sheet 2X is taken as the reference by the processing result of one multi-wire electrical discharge machining (MED) machine 1X1, thereby multiple MED machines 1X1 to 1X N The machining results are close to those of the benchmark multi-wire electrical discharge machining (MED) machine 1X1. That is, it is possible to reduce the number of steps required by multiple MED machines 1X1 to 1X1. N The thickness fluctuation of the processed sheet 2X from the reference value.

[0106] Furthermore, similarly to multi-wire electrical discharge machining (DDM) machine 1, multi-wire DDM machine 1X1 can calculate applicable processing conditions based on pre-set target values ​​(Z1, A1), (Z2, A2), ..., (Zn, An). In this case, multi-wire DDM machines 1X1 to 1X... N The processing results are close to the target values ​​(Z1, A1), (Z2, A2), ..., (Zn, An).

[0107] Multiple multi-wire electrical discharge machining centers 1X1 to 1X N Even when cutting thin plates to 2X thicknesses, it is possible to reduce the number of passes through a multi-wire electrical discharge machining (EDM) machine from 1X1 to 1X. NThe thickness fluctuation of the processed sheet metal 2X from the reference value is negligible, therefore no skilled operator is required for each multi-wire EDM machine 1X1 to 1X. N Adjust the processing conditions. Additionally, multi-wire electrical discharge machining (EDM) machines 1X1 to 1X... N The thickness error of the processed sheet 2X from the reference value has no fluctuation in the plane, thus the load in the grinding and polishing processes can be minimized.

[0108] Furthermore, the processing condition generation device 30 can also be configured externally to the upper-level controller 40. For example, it can be used in multi-wire electrical discharge machining (1X2~1X) machines. N Each component is equipped with a processing result collection unit 31 and a processing condition generator 32. Alternatively, the processing result collection unit 31 can be configured in the upper-level controller 40, in the multi-wire electrical discharge machining (1X2~1X) N Each of them is equipped with a processing condition generator 32.

[0109] As described above, according to Embodiment 2, multiple multi-wire electrical discharge machining (EDM) machines 1X1 to 1X are applied. N The thickness of the sheet 2X is used as a reference based on the processing result of one multi-wire electrical discharge machining (MED) machine 1X1. Therefore, multiple MED machines 1X1 to 1X1 are used. N When cutting out a thin plate 2X, it is also possible to suppress the fluctuation of the thickness of the processed thin plate 2X from the reference value in the plane.

[0110] The structure shown in the above embodiments is an example, and it can also be combined with other known technologies, and the embodiments can be combined with each other. Without departing from the spirit of the subject, some parts of the structure can be omitted or changed.

[0111] Explanation of the label

[0112] 1. 1X1~1X N Multi-wire electrical discharge machining (EDM) machine, 2. Workpiece, 2X thin plate, 3a-3d guide rollers, 4. Wire spool, 5. Wire discharge roller, 6. Wire electrode, 6a. Wire cutting section, 6b. Power supply section, 7. Machining power supply, 8. Machining power supply unit, 9, 9A. Machining control device, 10. Grounding electrode, 11. Cable, 12. Power supply component, 13. Power supply component unit, 14. Drive unit, 15. Machining status detection device, 16. Machining status detection unit, 17. Wire spool drive section, 18. Guide roller drive section, 30, 301-30 N 31 Processing condition generation device, 32 Processing result collection unit, 33 Processing condition generator, 35 Subtractor, 40 Upper controller, 43 Processing condition transmission unit, 50 Electrical discharge machining system, 100 Processor, 200 Memory, 300 Input device, 400 Output device.

Claims

1. A multi-wire electrical discharge machining (EDM) machine, characterized in that, have: The wire cutting section has wire electrodes wound around multiple guide rollers arranged side by side, opposite to the workpiece; A drive unit that adjusts the distance between the workpiece and the cutting line; A processing power source that applies a pulsed voltage between the workpiece and the cutting wire portion; A machining control device that controls the drive unit and the machining power supply; as well as The processing condition generation device generates processing conditions, i.e., applicable processing conditions, based on the thickness of the sheet at each processing position within the processing surface of the previously cut sheet obtained by the cutting line section through processing the workpiece. The processing condition generation device corrects the basic processing conditions based on the difference between the reference value (target value) of the thickness of the thin plate at each processing position and the measurement result, thereby generating the applicable processing conditions. In the next processing cycle, the processing control device uses the applicable processing conditions to control at least one of the drive unit and the processing power supply.

2. The multi-wire electrical discharge machining machine according to claim 1, characterized in that, The target value is the thickness measurement result of thin plates processed by other multi-wire electrical discharge machines of the same model for each processing position.

3. The multi-wire electrical discharge machining machine according to claim 1 or 2, characterized in that, The basic processing conditions include at least one of the following: the average value of the pulse voltage applied between the cutting wire and the workpiece per unit time, i.e., the target voltage; the average value of the current flowing between the cutting wire and the workpiece per unit time, i.e., the average processing current; the number of times there is no discharge per unit time during electrical discharge machining, i.e., the number of openings; and the average value of the voltage per unit time during openings, i.e., the opening voltage. The processing condition generation device generates the applicable processing conditions by correcting at least one of the target voltage, the average processing current, the number of openings, and the opening voltage included in the basic processing conditions.

4. A processing control device, characterized in that, have: The control unit controls the drive unit and the processing power supply. The drive unit adjusts the distance between the cutting wire section, which is arranged in parallel with multiple guide rollers and is opposite to the workpiece, and the workpiece. The processing power supply applies a pulse voltage between the workpiece and the cutting wire section. as well as The processing condition generation device generates processing conditions, i.e., applicable processing conditions, based on the thickness of the sheet at each processing position within the processing surface of the previously cut sheet obtained by the cutting line section through processing the workpiece. The processing condition generation device corrects the basic processing conditions based on the difference between the reference value (target value) of the thickness of the thin plate at each processing position and the measurement result, thereby generating the applicable processing conditions. During the next processing cycle, the control unit controls at least one of the drive unit and the processing power supply using the applicable processing conditions.

5. A processing condition generating device, characterized in that, have: The processing result collection unit collects the measurement results of the thickness of the sheet at each processing position on the processing surface of the sheet cut by the cutting line through the processing of the workpiece, i.e. the sheet result. The cutting line has wire electrodes wound around multiple guide rollers and arranged side by side, opposite to the workpiece. as well as A processing condition generator, based on the measurement results, generates the applicable processing conditions for the next processing step. The processing condition generator corrects the basic processing conditions based on the difference between the reference value (target value) of the thickness of the sheet at each processing position and the measurement result, thereby generating the applicable processing conditions.

6. An electrical discharge machining system, characterized in that, have: The first multi-wire electrical discharge machining (EDM) machine processes the first workpiece; The second multi-wire electrical discharge machining (MED) machine is the same model as the first MED machine and processes the second workpiece. as well as The processing condition generation device generates processing conditions, i.e., applicable processing conditions, based on a first measurement result of the thickness of the first thin plate cut from the second workpiece by the second multi-wire electrical discharge machining (EDM) for each processing position within the processing surface. The first multi-wire electrical discharge machining machine has the following features: The first cutting section has a first wire electrode wound around a plurality of first guide rollers arranged side by side, opposite to the first workpiece; The first drive unit adjusts the distance between the first workpiece and the first cutting line unit; A first processing power source applies a pulse voltage between the first workpiece and the first cutting line portion; as well as The first processing control device controls the first drive unit and the first processing power supply. The second multi-wire electrical discharge machining machine has the following features: The second cutting section has a second wire electrode wound around a plurality of second guide rollers arranged side by side, opposite to the second workpiece. The second drive unit adjusts the distance between the second workpiece and the second cutting line unit; The second processing power source applies a pulse voltage between the second workpiece and the second cutting line portion; as well as The second processing control device controls the second drive unit and the second processing power supply. The processing condition generation device corrects the basic processing conditions based on the difference between the reference value (target value) of the thickness of the first thin plate at each processing position and the first measurement result, thereby generating the applicable processing conditions. In the next processing cycle, the second processing control device uses the applicable processing conditions to control at least one of the second drive unit and the second processing power supply. The target value is a second measurement result of the thickness of the second sheet cut from the first workpiece by the first cutting line at each processing position on the processing surface.

7. The electrical discharge machining system according to claim 6, characterized in that, It also has a higher-level controller, which is connected to the first multi-wire electrical discharge machining (EDM) machine and the second multi-wire EDM machine. The upper-level controller has the processing condition generation device. The processing condition generation device collects the second measurement results from the first multi-wire electrical discharge machine and sends the applicable processing conditions to the second multi-wire electrical discharge machine.

8. A method for electrical discharge machining, characterized in that, Include: The processing condition generation step involves a multi-wire electrical discharge machining (EDM) machine that, based on the difference between a reference value (target value) and a measurement result for the thickness of the sheet metal at each processing position, corrects the basic processing conditions to generate applicable processing conditions. This multi-wire EDM machine includes a cutting wire section with wire electrodes wound around multiple guide rollers arranged side-by-side and facing the workpiece; a drive unit that adjusts the distance between the workpiece and the cutting wire section; a processing power supply that applies pulse voltages between the workpiece and the cutting wire section; a processing control device that controls the drive unit and the processing power supply; and a processing condition generation device that generates the applicable processing conditions for the next processing step based on the measurement result of the thickness of the sheet metal at each processing position on the previously cut surface of the sheet metal, obtained by the cutting wire section processing the workpiece. as well as In the control step, the multi-wire electrical discharge machining machine controls at least one of the drive unit and the machining power supply using the applicable machining conditions during the next machining operation.

9. A method for manufacturing a thin plate, characterized in that, Include: The processing condition generation step involves a multi-wire electrical discharge machining (EDM) machine that, based on the difference between a reference value (target value) and a measurement result for the thickness of the sheet metal at each processing position, corrects the basic processing conditions to generate applicable processing conditions. This multi-wire EDM machine includes a cutting wire section with wire electrodes wound around multiple guide rollers arranged side-by-side and facing the workpiece; a drive unit that adjusts the distance between the workpiece and the cutting wire section; a processing power supply that applies pulse voltages between the workpiece and the cutting wire section; a processing control device that controls the drive unit and the processing power supply; and a processing condition generation device that generates the applicable processing conditions for the next processing step based on the measurement result of the thickness of the sheet metal at each processing position on the previously cut surface of the sheet metal, obtained by the cutting wire section processing the workpiece. as well as In the control step, the multi-wire electrical discharge machining machine controls at least one of the drive unit and the machining power supply using the applicable machining conditions during the next machining operation.

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