Bonding device, bonding method, and wire cutter

Abstract

This bonding device comprises a capillary through which a wire is inserted, and a wire cutter that forms a cut in the wire delivered from the capillary. The wire cutter includes a cut part having a blade part that cuts into the wire, and a receiving part having a contact surface that comes into contact with the wire. In a state in which the wire cutter is closed, the blade part cuts into the wire and is separated from the contact surface while facing the contact surface. With said bonding device, it is possible to reliably form a cut in the wire.

Description

Bonding Apparatus, Bonding Method, and Wire Cutter

[0001] The present invention relates to a bonding apparatus, a bonding method, and a wire cutter.

[0002] There is known a bonding apparatus that forms pin wires at predetermined positions on a substrate, wafer, lead frame, etc. as bonding targets. The pin wire refers to a state in which a wire having a length of about 100 to 500 μm protrudes from a wire ball that has been bonded to and crushed against the bonding target. Various methods have been developed for forming pin wires. For example, after forming a free air ball at the tip of the wire, a method of making a cut such as a scratch or dent in the middle of the wire using a cutter or the like is known (see, for example, Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2001-160566

[0004] Generally, the diameter of the wire used in a bonding apparatus is very small, and it is practically difficult to form a cut on its surface. According to Patent Document 1, a technique of simply inserting and closing a cutter is disclosed, but it has been very difficult to control the wire and the cutter so as not to cut the wire and not to fail to form a cut.

[0005] The present invention has been made to solve such problems, and provides a bonding apparatus and the like that can surely form a cut in a wire.

[0006] The bonding apparatus according to the first aspect of the present invention includes a capillary through which a wire is inserted, and a wire cutter that forms a cut in the wire fed out from the capillary. The wire cutter includes a cutting portion having a blade portion that cuts into the wire, and a receiving portion having a contact surface that contacts the wire. In a state where the wire cutter is closed, the blade portion cuts into the wire and is separated while facing the contact surface.

[0007] A bonding method in a second aspect of the present invention includes a notch generation step in which a wire cutter is placed between a wire unwound from a capillary and a notch is formed in the wire, and a pin wire formation step in which the wire is cut in the notch by gripping the wire with a clamper and pulling it while the tip of the wire is bonded to the bonding target, thereby forming a pin wire on the bonding target, the wire cutter includes a receiving portion having a contact surface that contacts the wire and a notch portion having a blade portion that cuts into the wire, and when the wire cutter is closed the blade portion cuts into the wire and is separated from the contact surface while facing it, and in the notch generation step the receiving portion and the notch portion are brought into contact with each other by gripping the wire.

[0008] A wire cutter in a third aspect of the present invention comprises a receiving portion having a contact surface that contacts a wire, and a cutting portion having a blade portion that cuts into the wire, wherein when the receiving portion and the cutting portion are closed, the blade portion cuts into the wire to form a notch and is separated from the contact surface while facing it.

[0009] The present invention provides a bonding apparatus and the like that can reliably form cuts in a wire.

[0010] This is a schematic diagram of the bonding apparatus according to this embodiment, viewed from the side. This is a schematic diagram of the bonding apparatus according to this embodiment, viewed from above. This is a system configuration diagram of the bonding apparatus. This is an enlarged perspective view of the area around the wire cutter. This is a diagram illustrating the positional relationship between the tip of the blade and the tip of the protrusion. This is a process diagram showing the procedure for forming a pin wire. This is an enlarged perspective view of the area around the wire cutter according to the first modified example. This is an enlarged perspective view of the area around the wire cutter according to the second modified example.

[0011] The present invention will be described below through embodiments of the invention, but the invention claimed is not limited to the following embodiments. Furthermore, not all of the configurations described in the embodiments are necessarily essential as means for solving the problem. In each figure, components denoted by the same reference numeral have the same or similar configuration.

[0012] Figure 1 is a schematic diagram of the bonding apparatus 100 according to this embodiment, viewed from the side. Figure 2 is a schematic diagram of the same bonding apparatus 100, viewed from above. The bonding apparatus 100 shown in the figures is simplified for the sake of understanding, and the size and shape of its elements may differ from those of an actual apparatus. Elements not directly related to the characteristic elements of this embodiment may also be omitted. However, this is not intended to show any differences from an actual bonding apparatus.

[0013] The bonding apparatus 100 is a device that forms pin wires at predetermined positions on substrates, wafers, lead frames, etc., which are to be bonded. Figure 1 shows how pin wires 310 are formed on electrode pads 321 on substrate 320, which is to be bonded. The substrate 320 is fixed to the upper surface of the stage 170. In this embodiment, as shown in the coordinate axes in the figure, the vertical axis is the Z-axis and the horizontal plane is the XY-plane. The upper surface of the stage is parallel to the XY-plane.

[0014] The XY table 160 is displaced in the XY plane relative to the upper surface of the stage 170 by the driving of a part of the actuator 150. The support base 161 is fixed to the XY table 160 and mainly directly or indirectly supports the torch 111, capillary 112, transducer 113, Z rotation mechanism 114, support arm 122, slide mechanism 123, first clamper 131, second clamper 132, imaging unit 140, and wire cutter 200.

[0015] The torch 111 is equipped with a discharge electrode at its tip. Specifically, as will be described later, when a voltage is applied to the discharge electrode of the torch 111, a molten free air ball (FAB) is formed at the tip of the wire 300 that is fed out from the tip of the capillary 112. The specific procedure for generating the FAB will be described later. The capillary 112 guides the wire 300 and supplies it to the electrode pad 321, and during bonding, its tip presses the wire 300 against the electrode pad 321. During bonding, the transducer 113 applies ultrasonic vibrations near the tip of the wire 300 via the capillary 112, fixing the FAB to the electrode pad 321. The transducer 113 may also apply heat to the FAB.

[0016] The first clamper 131 has a hand that grips the wire 300 at the top of the capillary 112 and grips and releases the wire 300 according to the control of the bonding device 100. The capillary 112, transducer 113, and first clamper 131 are supported by a Z rotation mechanism 114. The Z rotation mechanism 114 is supported at its base end by a support base 161 and is displaced in the Z-axis direction relative to the support base 161 by driving a part of the actuator 150. That is, the capillary 112, transducer 113, and first clamper 131 can move closer to or further away from the surface of the stage 170 in accordance with the operation of the Z rotation mechanism 114.

[0017] The second clamper 132 is positioned above the first clamper 131 and, like the first clamper 131, has a hand for gripping the wire 300, gripping and releasing the wire 300 according to the control of the bonding device 100. The second clamper 132 is supported and fixed to a support base 161, and the position for gripping and releasing the wire 300 is at a constant height from the surface of the stage 170. The wire 300 is supplied from a wire supply unit (not shown) including a tensioner and a rotating spool. The material of the wire 300 may be, for example, gold wire, silver wire, copper wire, etc.

[0018] The wire cutter 200 is a cutter for forming cuts in the wire 300. The specific configuration of the wire cutter 200 will be described in detail later, but the wire cutter 200 mainly consists of a cutting section 210 and a receiving section 220. The cutting section 210 and the receiving section 220 are arranged facing each other, and when a part of the actuator 150 is driven, they move closer together (close) or further apart (open). The cuts formed in the wire 300 are scratches or indentations, and when pulled from both sides, tensile stress concentrates and causes the wire 300 to break.

[0019] The wire cutter 200 is supported at its base end by a support arm 122, and the support arm 122 is supported at its base end by a slide mechanism 123. The slide mechanism 123 is displaced horizontally relative to the support base 161 by the driving of a part of the actuator 150. This horizontal displacement enables the cutting portion 210 and receiving portion 220, which are in a separated (open) state, to be inserted into the wire 300 fed out from the capillary 112 from a direction perpendicular to the feeding direction (horizontal in this embodiment), or pulled out in the opposite direction. In this embodiment, the cutting portion 210 and receiving portion 220 are inserted into and pulled out from a direction perpendicular to the feeding direction, but the insertion and removal direction can be any direction that intersects with the feeding direction of the wire 300.

[0020] The imaging unit 140 includes an image sensor that outputs an image signal and an optical system that forms an image of the substrate 320 onto the image sensor. The bonding apparatus 100 uses the image signal output by the imaging unit 140 to recognize the position of the substrate 320 and displaces the XY table 160 and the like.

[0021] Figure 3 is a system configuration diagram of the bonding apparatus 100. The control system of the bonding apparatus 100 mainly consists of a calculation processing unit 190, a storage unit 181, an input / output device 182, a torch 111, a transducer 113, an imaging unit 140, and an actuator 150. Elements that involve displacement, such as the wire cutter 200, the first clamper 131, and the second clamper 132, are driven by their respective actuators among the actuators 150 provided in the bonding apparatus 100.

[0022] The arithmetic processing unit 190 is a processor (CPU: Central Processing Unit) that controls the bonding apparatus 100 and executes programs. The processor may be configured to work in conjunction with an arithmetic processing chip such as an ASIC (Application Specific Integrated Circuit) or a GPU (Graphics Processing Unit). The arithmetic processing unit 190 reads the control program stored in the memory unit 181 and executes various processes related to bonding.

[0023] The storage unit 181 is a non-volatile storage medium, and is composed of, for example, an HDD (Hard Disk Drive). In addition to programs that control and process the bonding apparatus 100, the storage unit 181 can store various parameter values, functions, lookup tables, etc., used for control and calculations. The input / output device 182 includes, for example, a keyboard, mouse, and display monitor, and is a device that accepts menu operations by the operator and presents information to the operator. For example, the calculation processing unit 190 may display an image acquired from the imaging unit 140 on the display monitor, which is one of the input / output devices 182.

[0024] When the torch 111 receives a discharge instruction signal from the arithmetic processing unit 190, it applies a voltage to the electrode. When a voltage is applied to the electrode, an arc discharge occurs between the electrode and the wire tip, forming a FAB (Fabricated Arm) at the tip of the wire 300. When the transducer 113 receives an excitation signal from the arithmetic processing unit 190, it vibrates its transducer. The ultrasonic vibration from the transducer 113 contributes to the bonding of the wire 300.

[0025] The imaging unit 140 receives an imaging request signal from the processing unit 190, performs imaging, and transmits the image output by the image sensor as an image signal to the processing unit 190. The actuator 150 receives a drive signal from the processing unit 190 and opens and closes the wire cutter 200, the first clamper 131, and the second clamper 132, or displaces other elements.

[0026] The arithmetic processing unit 190 also serves as a functional arithmetic unit that performs various calculations according to the processing instructed by the control program. The arithmetic processing unit 190 can function as a FAB generation unit 191, a cut generation unit 192, a feed amount adjustment unit 193, and a pin wire forming unit 194. The FAB generation unit 191 controls the torch 111 to generate a FAB at the tip of the wire 300. The cut generation unit 192 controls the actuator 150 to insert the separated cut portion 210 and receiving portion 220 into the wire 300 fed out from the capillary 112, and then closes them to form a cut in the wire 300.

[0027] The wire feed adjustment unit 193 controls the actuator 150 to adjust the length of the wire 300 fed out from the capillary 112. The pin wire forming unit 194 controls the actuator 150 to grip the wire 300 with the first clamper 131 or the second clamper 132 and pull it while the tip of the wire 300 is bonded to the substrate 320 (more precisely, the electrode pad 321), thereby cutting the wire 300 with the formed cut and forming a pin wire 310 on the substrate 320.

[0028] Figure 4 is an enlarged perspective view of the peripheral area of ​​the wire cutter 200. Specifically, it shows the wire cutter 200 in a closed state with the cutting portion 210 and receiving portion 220 that make up the wire cutter 200 sandwiched between them.

[0029] The notched portion 210 is mainly composed of a main body portion 211, a blade portion 212, and a protruding portion 213. The main body portion 211 is, for example, a metal block, and is supported by a support arm 122 at its base end. The blade portion 212 is formed as a flat blade on the tip side of the main body portion 211 (the side opposite to the base end) and in a position facing the receiving portion 220. The blade portion 212 may be formed by grinding a part of the main body portion 211, or it may be formed by manufacturing a separate part and fixing it to the main body portion 211.

[0030] The protruding portion 213 is formed to protrude from the main body portion 211 toward the contact surface 222, which will be described later, on the side of the wire 300's tip (the side of the FAB 300a) that is closer to the blade portion 212 when the notched portion 210 and the receiving portion 220 are sandwiching the wire 300. The protruding portion 213 may be formed integrally as part of the main body portion 211, or it may be formed by fixing a separately manufactured block to the main body portion 211.

[0031] The receiving portion 220 is mainly composed of a main body portion 221 and an offset portion 224. The main body portion 221 is, for example, a metal block and is supported by a support arm 122 at its base end. The main body portion 221 has a contact surface 222 that contacts the wire 300. Preferably, the contact surface 222 is a plane perpendicular to the line segment of the cutting edge of the blade portion 212.

[0032] The offset portion 224 is formed on the base end side of the main body portion 221 so as to protrude toward the notched portion 210 side beyond the contact surface 222 of the main body portion 221. The offset portion 224 may be formed integrally as part of the main body portion 221, or it may be formed by fixing a separately manufactured block to the main body portion 221.

[0033] As the actuator 150 drives the notched portion 210 and the receiving portion 220 move closer together, the offset portion 224 of the receiving portion 220 eventually comes into contact with the side surface of the main body portion 221 of the notched portion 210 (the surface facing the receiving portion 220), and it closes.

[0034] When the notched portion 210 and the receiving portion 220 are closed, the contact surface 222 of the receiving portion 220 contacts the wire 300, and the blade portion 212 of the notched portion 210 cuts into the wire 300 while being positioned away from the contact surface 222, thereby forming a notch 300b in the wire 300. In other words, because the offset portion 224 acts as a stopper for the main body portion 211 of the notched portion 210, the blade portion 212 and the contact surface 222 are closer than the diameter of the wire 300 but do not come into contact with each other, so the wire 300 is not cut and a notch 300b is formed. At this time, the contact surface 222 functions as a support surface that supports the wire 300 from the opposite side against the pressing force caused by the cutting of the blade portion 212. Furthermore, depending on the depth of the cut 300b to be formed, the distance between the blade portion 212 and the contact surface 222 when the cut portion 210 and the receiving portion 220 are closed is adjusted by the thickness D of the offset portion 224.

[0035] When the wire 300 is supported in contact with the contact surface 222 and subjected to the pressing force of the blade portion 212, the tip side (the side of FAB 300a) may bend toward the cut portion 210 at a point greater than the point of pressing force. Such bending causes the position of FAB 300a to shift relative to the wire 300's feeding direction, which is inconvenient for bonding positioning. The protrusion 213 is provided to prevent such bending, and is formed to protrude from the main body portion 211 toward the receiving portion 220 to the extent that it contacts the wire 300 when the cut portion 210 and the receiving portion 220 are closed. With the protrusion 213 formed in this way, even if the tip side of the wire 300 tries to bend due to the pressing force of the blade portion 212, it will come into contact with the protrusion 213 and will not bend at a greater angle.

[0036] Here, the positional relationship between the tip of the blade portion 212 and the tip of the projection portion 213 will be explained. Figure 5 is a diagram illustrating the positional relationship between the tip of the blade portion 212 and the tip of the projection portion 213. The positional relationship shown in Figure 5 is the same as the positional relationship shown in Figure 4, and in the projection direction shown, the tip of the blade portion 212 protrudes more than the tip of the projection portion 213. However, depending on the diameter and material of the wire 300 and the set cutting depth, the tip of the blade portion 212 and the tip of the projection portion 213 may be located on the same straight line, and the tip of the projection portion 213 may protrude more than the tip of the blade portion 212. Furthermore, a position adjustment mechanism may be provided in the main body portion 211 so that the position of the tip of the projection portion 213 relative to the tip of the blade portion 212 can be adjusted.

[0037] Figure 6 is a process diagram showing the procedure for forming the pin wire 310. Figures 6(a) to 6(k) are arranged in order of the process, and will be explained below in that order. Note that each figure in Figure 6 schematically shows only the essential parts as observed from direction A shown in Figure 2.

[0038] Figure 6(a) shows the initial state of the process, where the wire 300 has been fed out from the tip of the capillary 112 by a set amount. After the wire 300 has been fed out from the tip of the capillary 112, the feed amount adjustment unit 193 keeps the first clamper 131 in a gripping state (holding state) so that it is not pulled back by a tensioner (not shown). At this time, the tip of the wire 300, which has been fed out by the set amount, is located near the tip of the torch 111 where the electrode is provided.

[0039] Next, as shown in Figure 6(b), the FAB generation unit 191 applies voltage to the torch 111 to generate an arc discharge between the electrode and the wire tip, thereby generating FAB 300a. Once FAB 300a is formed on the tip of the wire 300, the notch generation unit 192 takes over the process. As shown in Figure 6(c), the notch generation unit 192 transitions the first clamper 131 from a gripping state to a disengaged state (not gripping), and uses the pull-back force of the tensioner to pull up the generated FAB 300a and bring it into contact with the tip of the capillary 112.

[0040] Next, the notch generating unit 192 displaces the Z rotation mechanism 114, thereby lowering the capillary 112 by a preset amount, as shown in Figure 6(d). At this time, the FAB 300a is lowered together with the capillary 112 because the second clamper 132 remains in a dissociated state.

[0041] As shown in Figure 6(e), the notch generating unit 192 first transitions the second clamper 132 to a gripping state while the first clamper 131 remains in a disengaged state, and pulls up the capillary 112 by a preset amount. As a result, the wire 300 remains stationary, the capillary 112 separates from the FAB 300a, and the wire 300 is extended from the tip of the capillary 112 by the amount of the pull-up.

[0042] Subsequently, the notch generating unit 192 inserts the notch portion 210 and the receiving portion 220 into the unfurled wire 300 from the horizontal direction by displacing the slide mechanism 123. At this time, the notch portion 210 and the receiving portion 220 are spaced apart, with a distance greater than the diameter of the wire 300. As shown in Figure 6(e), the amount by which the capillary 112 is pulled down in Figure 6(d) is determined such that the distance from the upper end of the pulled-down FAB 300a to the cutting edge of the blade portion 212 is a set value of Ph. Also, the amount by which the capillary 112 is pulled up in Figure 6(e) is determined such that the distance from the cutting edge of the blade portion 212 to the tip of the capillary 112 is a set value of Sh.

[0043] Next, as shown in Figure 6(f), the notch generating unit 192 moves the actuator 150 to bring the notch portion 210 and the receiving portion 220 closer together, closing them to each other. At this time, it is preferable that the contact surface 222 contacts the wire 300 before the blade portion 212 contacts the wire 300 and makes a cut. If the contact surface 222 and the wire 300 make contact first, the contact surface 222 can support the pressing force of the blade portion 212 without causing the wire 300 to wobble.

[0044] As shown in FIG. 6(g), the notch generation unit 192 separates the notch portion 210 and the receiving portion 220 by operating the actuator 150. A notch 300b is formed in the wire 300. After forming the notch 300b, the notch forming unit 192 moves the notch portion 210 and the receiving portion 220 to the standby position so as not to interfere with the subsequent downward movement of the capillary 112.

[0045] Next, the pin wire forming unit 194 takes over the process. As shown in FIG. 6(h), the pin wire forming unit 194 transitions the second clamper 132 to the separated state and pulls back the wire 300 until the FAB 300a contacts the tip of the capillary 112. Then, as shown in FIG. 6(i), with the FAB 300a contacting the tip of the capillary 112, the capillary 112 is lowered, and the FAB 300a is pressed against the electrode pad 321. In this state, the transducer 113 is vibrated to fix the crushed FAB 300a to the electrode pad 321.

[0046] Subsequently, as shown in Figure 6(j), the notch generating unit 192 displaces the Z rotation mechanism 114 while keeping the first clamper 131 in a disengaged state, thereby raising the capillary 112 to a preset height. Then, the first clamper 131 is transitioned to a gripping state, and as shown in Figure 6(k), the capillary 112 is raised further, causing the wire 300 to break at the notch 300b, and a pin wire 310 to be formed on the electrode pad 321. At this time, the length of the remaining protruding wire 300 is the Ph adjusted in the steps shown in Figures 6(d) and 6(e). In other words, by pulling the wire 300 with the FAB 300a formed back to the tip of the capillary 112 and then controlling the displacement of the Z rotation mechanism 114 to feed out the wire 300 so that the FAB 300a is pushed down at the tip of the capillary 112, the feed amount can be adjusted with high precision. Therefore, by forming the pin wire 310 through such a process, the amount of wire 300 protruding can be adjusted to the set length. In other words, the pin wire 310 can be formed appropriately. Next, a modified version of the wire cutter will be described. Figure 7 is an enlarged perspective view of the peripheral part of the wire cutter 200' according to the first modified version. The wire cutter 200' differs from the wire cutter 200 described above in the configuration of the offset part.

[0047] Specifically, in wire cutter 200, the offset portion 224 was provided on the receiving portion 220, but in wire cutter 200', it is provided on the cutting portion 210'. That is, the receiving portion 220' is composed of a rectangular parallelepiped main body portion 221' as a whole, and the contact surface 222' that contacts the wire 300 forms one side of the rectangular parallelepiped. The offset portion 214' is provided on the base end side of the cutting portion 210', and is provided so as to protrude toward the receiving portion from the main body portion 211 by the thickness D of the offset portion 224 shown in Figure 4. Even with such a wire cutter 200', when the cutting portion 210' and the receiving portion 220' are closed, the blade portion 212 of the cutting portion 210' cuts into the wire 300 and is positioned apart from the contact surface 222', thereby forming a notch 300b in the wire 300.

[0048] FIG. 8 is an enlarged perspective view of the periphery of the wire cutter 200" according to the second modification. The wire cutter 200" is different from the above-described wire cutter 200 in that it does not include the protruding portion 213.

[0049] Specifically, the receiving portion 220 of the wire cutter 200" has the same structure as the receiving portion of the wire cutter 200. On the other hand, the cutting portion 210" of the wire cutter 200" does not include the protruding portion 213, and the blade portion 212" is provided below (the negative side of the Z axis) more than the position where the blade portion 212 is provided with respect to the main body portion 211 on the tip side of the main body portion 211".

[0050] Even in such a wire cutter 200", when the cutting portion 210" and the receiving portion 220 are in a closed state, the blade portion 212" of the cutting portion 210" cuts into the wire 300 and is arranged to be separated from the contact surface 222, so that a cut 300b can be formed in the wire 300. At this time, since the blade portion 212" is provided below the main body portion 211", the cut 300b can be formed in the immediate vicinity of the FAB 300a by adjusting the feeding amount of the wire 300. The wire cutter 200" adopting such a configuration is particularly suitable when forming bumps instead of forming the pin wire 310 on the electrode pad 321.

[0051] In the embodiment described above, the bonding apparatus includes two clamps, the first clamp 131 and the second clamp 132. However, one clamp may be provided. When one clamp is provided, it is preferable to provide a mechanism that can accurately feed out the wire 从300 from the tip of the capillary 112 by a set predetermined amount.

[0052] Further, in the embodiment described above, the wire cutters 200, 200', 200" are inserted into and pulled out from the wire 300 by displacing the slide mechanism 123 supported by the support base 161. However, these elements may be arranged with respect to, for example, the stage 170. In this case, it is preferable to provide an XY slide mechanism for inserting and pulling out the wire cutters 200, 200', 200" in the horizontal direction with respect to the wire 300. [[ID=十三]]<0000百零五>

[0053] 100...Bonding device, 111...Torch, 112...Capillary, 113...Transducer, 114...Z rotation mechanism, 122...Support arm, 123...Slide mechanism, 131...First clamper, 132...Second clamper, 140...Imaging unit, 150...Actuator, 160...XY table, 161...Support base, 170...Stage, 181...Storage unit, 182...Input / output device, 190...Calculation processing unit, 191...FAB generation unit, 192...Cutting generation unit, 193...Feed-out amount adjustment 194... Pin wire forming section, 200, 200', 200"... Wire cutter, 210, 210', 210"... Cutting section, 211, 211', 211"... Main body section, 212, 212"... Blade section, 213... Protruding section, 214... Offset section, 220, 220'... Receiving section, 221, 221'... Main body section, 222, 222'... Contact surface, 224... Offset section, 300... Wire, 300a... Free air ball, 300b... Cut, 310... Pin wire, 320... Substrate, 321... Electrode pad

Claims

1. A bonding apparatus comprising a capillary through which a wire is inserted, and a wire cutter that forms a notch in the wire unwound from the capillary, wherein the wire cutter includes a notching portion having a blade portion that cuts into the wire, and a receiving portion having a contact surface that contacts the wire, and in the closed state of the wire cutter, the blade portion cuts into the wire and is separated from the contact surface while facing it.

2. The bonding apparatus according to claim 1, wherein the notched portion has a protruding portion that extends toward the contact surface, on the side of the tip of the wire from the blade portion when the receiving portion and the wire are sandwiched together.

3. The bonding apparatus according to claim 1, wherein, when clamping the wire, the contact surface is brought into contact with the wire before the blade portion.

4. The bonding apparatus according to claim 1, wherein the receiving portion has an offset portion that protrudes toward the notched portion from the contact surface, and when the wire cutter is closed, the offset portion contacts the notched portion.

5. The bonding apparatus according to claim 1, wherein the notched portion has an offset portion that protrudes toward the receiving portion than the blade portion, and when the wire cutter is closed, the offset portion contacts the receiving portion.

6. The bonding apparatus according to claim 1, wherein the wire is gripped with a clamp and pulled while the tip of the wire is bonded to the bonding target, thereby cutting the wire with the notch and forming a bump on the bonding target.

7. A bonding method comprising: a notch generation step of clamping a wire cutter onto a wire unwound from a capillary to form a notch in the wire; and a pin wire forming step of gripping the wire with a clamper and pulling it while the tip of the wire is bonded to the bonding target to cut the wire at the notch and form a pin wire on the bonding target, wherein the wire cutter includes a receiving portion having a contact surface that contacts the wire and a notch portion having a blade portion that cuts into the wire, and when the wire cutter is closed, the blade portion cuts into the wire and is separated from the contact surface while facing it, and in the notch generation step, the receiving portion and the notch portion are brought into contact with each other by clamping the wire.

8. A wire cutter comprising a receiving portion having a contact surface that contacts a wire, and a cutting portion having a blade portion that cuts into the wire, wherein when the receiving portion and the cutting portion are closed, the blade portion cuts into the wire to form a notch and is separated from the contact surface while facing it.

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