Position detection device

Abstract

A position detection device is provided with: a substrate (100); a transmission coil (110) formed on the substrate; and a first reception coil (120) and a second reception coil (130) which are formed on the substrate and inductively coupled by electromagnetic induction caused by energization to the transmission coil. The substrate is a multilayer substrate in which six or more wiring layers (102, 1001-1010) and insulating layers (101) disposed between the six or more wiring layers are alternately laminated, and has a plurality of conductive through-holes (140, 1401-1407) that are formed so as to penetrate through at least one of the insulating layers and connect the six or more wiring layers. The first reception coil and the second reception coil are each wound a plurality of times on a wiring layer other than at least one wiring layer among the six or more wiring layers, and are connected via a plurality of conductive through portions. At least one of the plurality of conductive through portions is disposed inside the first receiving coil and the second receiving coil.

Description

[0001] Cross-reference to related applications

[0002] This application is based on Japanese Patent Application No. 2022-187596 filed on November 24, 2022, the contents of which are incorporated herein by reference. Technical field

[0003] The present disclosure relates to a position detection device. Background art

[0004] Conventionally, an angular position sensor for detecting the position of a rotatable detection body has been known (for example, see Patent Document 1). The angular position sensor has two exciting coils and two sensing coils. Further, the angular position sensor generates a magnetic field between the detection body by energizing the two exciting coils, and detects the rotation angle of the detection body based on a detection signal generated by a change in the magnetic field between the two sensing coils and the detection body.

[0005] Here, the two exciting coils and the two sensing coils are formed on a four-layer multi-layer substrate. Specifically, one of the two exciting coils is formed on the first and second layers, and the other of the two exciting coils is formed on the third and fourth layers.

[0006] In addition, the two sensing coils are formed in series from the first layer through the second and third layers to the fourth layer. Further, each of the two sensing coils has a portion formed by winding 4 times clockwise or counterclockwise in each layer for a total of 16 windings. Further, the portions of the two sensing coils formed by winding clockwise or counterclockwise in the four respective layers are electrically connected through any one of three through-holes formed by penetrating from the first layer to the fourth layer of the multi-layer substrate.

[0007] Prior art documents

[0008] Patent documents

[0009] Patent Document 1: International Publication No. 2022 / 015363 Summary of the invention

[0010] The inventors have studied a position detection device that can increase the total number of turns of a receiving coil in a position detection device using a transmitting coil that functions as an exciting coil and a receiving coil that functions as a sensing coil. The total number of turns of the receiving coil is the total number obtained by adding up the number of turns of the receiving coil wound in each layer of the multi-layer substrate. As a method of increasing the total number of receiving coils, there is a method of increasing the number of layers of the multi-layer substrate and increasing the number of turns of the receiving coil formed in each layer of the multi-layer substrate with the increased number of layers.

[0011] However, according to the in-depth research of the inventors, if a through-conductive portion such as a via hole is formed by penetrating all the layers of a multi-layer substrate, the area of the portion where the receiving coil can be formed in each layer is reduced due to this through-conductive portion. Therefore, in each layer, the number of turns of the receiving coil is limited, and it may not be possible to increase the total number of turns of the receiving coil to the desired number of turns.

[0012] An object of the present disclosure is to provide a position detection device capable of ensuring the formation area of a receiving coil.

[0013] According to one aspect of the present disclosure,

[0014] A position detection device includes:

[0015] A substrate;

[0016] A transmitting coil formed on the substrate; and

[0017] A first receiving coil and a second receiving coil formed on the substrate and inductively coupled by electromagnetic induction caused by energizing the transmitting coil,

[0018] The substrate is a multi-layer substrate formed by alternately laminating six or more wiring layers and insulating layers disposed between each of the six or more wiring layers, and has a plurality of conductive through portions formed by penetrating at least one of the insulating layers and connecting the six or more wiring layers,

[0019] The first receiving coil and the second receiving coil are wound multiple times on wiring layers other than at least one wiring layer among the six or more wiring layers, and are connected via the plurality of conductive through portions,

[0020] At least one of the plurality of conductive through portions is disposed inside the first receiving coil and the second receiving coil.

[0021] Thereby, compared with the case where the first receiving coil and the second receiving coil are formed on all six or more wiring layers, the number of conductive through portions for connecting the first receiving coil and the second receiving coil can be reduced. Therefore, in each wiring layer where the first receiving coil and the second receiving coil are respectively formed, the area where the first receiving coil and the second receiving coil can be respectively formed can be enlarged.

[0022] In addition, the reference numerals in parentheses attached to each component etc. indicate an example of the correspondence relationship between the component etc. and the specific components etc. described in the following embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a block diagram of an electrified system configured using the position detection device of the first embodiment.

[0024] Figure 2It is a diagram showing the relationship between the position detection device and the drive unit.

[0025] Figure 3 It is a top view of the rotating plate and the position detection device.

[0026] Figure 4 It is a perspective view of the position detection device.

[0027] Figure 5 It is along Figure 4 A cross-sectional view of the position detection device taken along the V-V line in

[0028] Figure 6 It is from Figure 5 A top view of the printed circuit board of the first embodiment observed from the direction of the arrow shown in VI of

[0029] Figure 7 It is a block diagram of the position detection device.

[0030] Figure 8 It is a cross-sectional view of the printed circuit board of the first embodiment.

[0031] Figure 9 It is a diagram for explaining the structure of the wiring layer, the first receiving coil, and the through hole in the printed circuit board of the first embodiment.

[0032] Figure 10 It is a diagram for explaining the connection of the first receiving coils formed in each wiring layer in the printed circuit board of the first embodiment.

[0033] Figure 11 It is a diagram for explaining the structure of the wiring layer, the first receiving coil, and the through hole in the printed circuit board of the comparative example.

[0034] Figure 12 It is a diagram for explaining the area where through holes can be formed in the printed circuit board of the comparative example.

[0035] Figure 13 It is a diagram for explaining the structure of the wiring layer, the first receiving coil, and the through hole in the printed circuit board of the second embodiment.

[0036] Figure 14 It is equivalent to Figure 6 in the printed circuit board of the second embodiment.

[0037] Figure 15 It is a diagram for explaining the structure of the wiring layer, the first receiving coil, and the through hole in the printed circuit board of the third embodiment.

[0038] Figure 16 It is equivalent to Figure 6 in the printed circuit board of the third embodiment.

[0039] Figure 17 This is the figure corresponding to the printed circuit board in the fourth embodiment Figure 6 of the Specific embodiments

[0040] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In addition, in the following embodiments, the same or equivalent parts as those described in the previous embodiments may be denoted by the same reference numerals, and their descriptions may be omitted. Further, in the embodiments, when only a part of the constituent elements is described, the other parts of the constituent elements can be applied to the constituent elements described in the previous embodiments. In the following embodiments, as long as there is no particular hindrance to the combination, the embodiments can be partially combined with each other even without being particularly specified explicitly.

[0041] (First Embodiment)

[0042] Referring to Figures 1 to 12 this embodiment will be described. In this embodiment, as a position detection device, a position detection device for detecting the rotation of a detection object will be described as an example. In addition, in this embodiment, an example in which the position detection device is applied to an electrified system mounted in a vehicle will be described.

[0043] 〔Electrified system〕

[0044] For example, as Figure 1 shown, the electrified system includes an actuator 1, a gear 2, a drive unit 3, an ECU 4 (abbreviation for Electronic Control Unit), and a position detection device S1. And this electrified system operates as follows. That is, the actuator 1 is controlled by the ECU 4 and rotates the gear 2 according to the control of the ECU 4. The drive unit 3 includes a detection object described later and is composed of components that operate by the rotation of the gear 2. The position detection device S1 detects the displacement of the detection object included in the drive unit 3 and outputs a detection signal to the ECU 4. In this embodiment, as described later, the detection object is composed of a rotating plate 30, and the rotation angle of the rotating plate 30 is output to the ECU 4. And the ECU 4 controls the actuator 1 in consideration of the detection signal from the position detection device S1.

[0045] Next, the configuration of the drive unit 3 in which the position detection device S1 is arranged will be described. In this embodiment, an example in which the position detection device S1 is arranged in a motor such as a main motor or an in-wheel motor will be described.

[0046] The drive unit 3 is assumed to be a motor rotor or the like, for example, as Figure 2As shown, there are a shaft 10 serving as a rotating shaft, a rotating plate 30, a fixed table 40, etc. Moreover, these components 10, 30, 40 are arranged coaxially with the axial direction Da of the shaft 10 as the center. Hereinafter, the axial direction Da of the shaft 10 will be simply referred to as the axial direction Da. In addition, in Figure 2 in order to facilitate observation, the following-described transmitting coil 110, first receiving coil 120, and second receiving coil 130 that constitute the position detection device S1 are simplified and shown.

[0047] The shaft 10 is, for example, a drive shaft and is composed of a cylindrical member. Moreover, the shaft 10 is arranged to have a tire on one end side, and the other end side opposite to the one end side is the vehicle body side. For example, in Figure 2 the upper side of the paper surface is the one end side of the shaft 10, and the lower side of the paper surface is the other end side of the shaft 10. In addition, although detailed description is omitted, the shaft 10 is, for example, equipped with a rotating wheel, a bearing member, etc. (not shown), and the rotating wheel is supported by the bearing member in a rotatable state.

[0048] The rotating plate 30 is made of metal and is formed in an annular plate shape with a through hole 30a formed therein. In addition, as Figure 3 shown, in the rotating plate 30 of the present embodiment, a plurality of concave portions 31 are formed evenly in the circumferential direction on the outer peripheral portion. In other words, the rotating plate 30 is configured to have a plurality of convex portions 32 arranged in the circumferential direction on the outer peripheral portion. That is, the rotating plate 30 is configured to have an uneven structure 33 with concave portions 31 and convex portions 32 formed in the circumferential direction on the outer peripheral portion.

[0049] Moreover, as Figure 2 shown, the rotating plate 30 is fixed to the shaft 10 in a state where it is inserted into the through hole 30a on the one end side of the shaft 10 so as to rotate with the rotation of the shaft 10. In addition, in the present embodiment, the rotating plate 30 corresponds to the detection object.

[0050] The fixed table 40 is in a plate shape with a through hole 40a formed therein. Moreover, the other end side of the shaft 10 is inserted into the through hole 40a of the fixed table 40, and a rotating wheel (not shown) is arranged in a rotatable state. In addition, on the fixed table 40, a position detection device S1 is provided so as to face the convex portion 32 of the rotating plate 30 in the axial direction Da. In addition, as Figure 3 shown, the position detection device S1 is arranged to have a predetermined gap (i.e., interval) d with the rotating plate 30.

[0051] 〔Position Detection Device〕

[0052] Next, the configuration of the position detection device S1 of the present embodiment will be described. As Figure 4 and Figure 5As shown, the position detection device S1 of the present embodiment has a printed circuit board 100, which has one surface 100a and the other surface 100b. Moreover, the position detection device S1 is configured such that a circuit board 200 and terminals 400 are disposed on the one surface 100a side of the printed circuit board 100, and they are integrally sealed by a sealing member 500. Hereinafter, the normal direction Ds with respect to the surface direction of the printed circuit board 100 will be described simply as the normal direction Ds. In addition, when the position detection device S1 is disposed on a fixed table 40, the normal direction Ds of the printed circuit board 100 becomes a direction consistent with the axial direction Da. In addition, although not particularly illustrated, various electronic components such as capacitors and resistors are also appropriately disposed on the printed circuit board 100, for example.

[0053] The printed circuit board 100 of the present embodiment is in an arc plate shape. Specifically, the printed circuit board 100 is configured to be consistent with the arc of a virtual circle centered on the axis 10. That is, the printed circuit board 100 is formed in a shape such that the virtual circle with the printed circuit board 100 as the arc is consistent with the circle centered on the axis 10.

[0054] Moreover, as Figure 6 shown, a transmitting coil 110, a first receiving coil 120, and a second receiving coil 130 are formed on the printed circuit board 100. In addition, as Figure 7 shown, connection wirings 150 for connecting the circuit board 200 to the transmitting coil 110, the first receiving coil 120, and the second receiving coil 130 are formed on the printed circuit board 100. In addition, in Figure 5 , the respective transmitting coil 110, the first receiving coil 120, and the second receiving coil 130 are simply shown.

[0055] Specifically, as Figure 8 shown, the printed circuit board 100 of the present embodiment is a multilayer substrate in which an insulating layer 101 and a wiring layer 102 are alternately laminated. The printed circuit board 100 of the present embodiment has a 6-layer through-substrate in which the insulating layer 101 and the wiring layer 102 are alternately laminated. Moreover, the printed circuit board 100 is composed of a 10-layer laminated substrate in which two insulating layers 101 and wiring layers 102 are further laminated on one side and the other side in the normal direction Ds of the through-substrate, respectively. The 6-layer through-substrate is also referred to as a core layer. In addition, the layer composed of one insulating layer 101 and one wiring layer 102 formed on one side and the other side in the normal direction Ds of the core layer is also referred to as an assembly layer. The printed circuit board 100 of the present embodiment is a 10-layer laminated substrate in which two assembly layers are disposed on one side and the other side in the normal direction Ds of the core layer composed of 6 layers. The insulating layer 101 is composed of an insulating member, and is formed of, for example, epoxy resin. The wiring layer 102 is composed of a conductive member, and is formed of, for example, copper.

[0056] Moreover, in the printed circuit board 100 of the present embodiment, the first receiving coil 120 and the second receiving coil 130 are formed in the wiring layers 102 other than the specified wiring layer 102 among the ten wiring layers 102. As Figure 6 shown, the first receiving coil 120 and the second receiving coil 130 are arranged inside the transmitting coil 110. In addition, via holes 140 connecting the wiring layers 102 are formed in the printed circuit board 100 of the present embodiment. Moreover, the transmitting coil 110, the first receiving coil 120, and the second receiving coil 130 formed in the wiring layer 102 are appropriately connected via the via holes 140. The via holes 140 function as conductive through portions for electrically connecting the ten wiring layers 102. The shapes and connections of the first receiving coil 120 and the second receiving coil 130 formed in the wiring layer 102 will be described in detail later. In addition, a plurality of pad portions (not shown) are formed in the printed circuit board 100. Moreover, as Figure 5 shown, one end portion of a rod-shaped terminal 400 is connected to the printed circuit board 100 so as to be connected to the pad portion.

[0057] For example, the terminal 400 has three types: for power supply, for grounding, and for output. For example, the output terminal 400 is connected to the ECU 4 and is used to output the rotation angle of the detection object to the ECU 4. In addition, the number of terminals 400 is not particularly limited, and the connection target thereof can be appropriately changed according to the number of terminals 400.

[0058] The circuit board 200 is arranged via a joining member (not shown) in a portion of the printed circuit board 100 different from the portion where the transmitting coil 110, the first receiving coil 120, and the second receiving coil 130 are formed. Moreover, the circuit board 200 is connected to the transmitting coil 110, the first receiving coil 120, and the second receiving coil 130 via connection wirings 150 formed in the printed circuit board 100.

[0059] The circuit board 200 includes a microcomputer or the like having a storage unit such as a CPU, a ROM, a RAM, and a non-volatile RAM, and is connected to the transmitting coil 110, the first receiving coil 120, and the second receiving coil 130. Moreover, the circuit board 200 realizes various control actions by the CPU reading and executing a program from the ROM or the non-volatile RAM. In addition, various data (such as initial values, look-up tables, maps, etc.) used when executing the program are stored in advance in the ROM or the non-volatile RAM. In addition, storage media such as the ROM are non-transitory physical storage media. CPU is an abbreviation for Central Processing Unit, ROM is an abbreviation for Read Only Memory, and RAM is an abbreviation for Random Access Memory.

[0060] Specifically, as Figure 7As shown, the circuit board 200 includes a signal processing unit 210 that is connected to the transmission coil 110, the first reception coil 120, and the second reception coil 130 and performs prescribed processing. The signal processing unit 210 has, for example, an oscillation unit 220, a demodulation unit 230, an AD conversion unit 240, an angle calculation unit 250, an output unit 260, and a power supply unit 300. In addition, hereinafter, an example in which processing is performed by converting to a digital signal is taken as a representative example for explanation, but in the case of performing processing by an analog signal, the signal processing unit 210 may not include the AD conversion unit 240 and the like.

[0061] As Figure 4 and Figure 5 shown, the sealing member 500 integrally seals the printed circuit board 100, the circuit board 200, and the terminal 400 in such a manner that the other end portion of the terminal 400, which is opposite to one end portion connected to the printed circuit board 100, is exposed. Hereinafter, in the sealing member 500, a portion formed in an arc plate shape along the shape of the printed circuit board 100 is taken as the main portion 510, and a portion that seals the terminal 400 and enables connection to an external connector is taken as the connector portion 520 for explanation. The main portion 510 is formed, for example, along the shape of the printed circuit board 100, and at least the inner edge side portion is formed to coincide with an arc of a virtual circle centered on the axis 10. The connector portion 520 is, for example, a substantially cylindrical shape extending along the normal direction Ds, and an opening portion 520a is formed through which the other end portion of the terminal 400 is exposed on the side opposite to the main portion 510. The sealing member 500 is made of, for example, a thermosetting resin or a thermoplastic resin.

[0062] The sealing member 500 is formed with collar portions 530 through which fastening members for fixing to the fixing table 40 are inserted at stepped portions at both ends in the circumferential direction of the main portion 510 formed in an arc plate shape. The collar portion 530 is configured by disposing a metal collar 532 in a through hole 531 that penetrates the main portion 510 in the thickness direction. Alternatively, stepped portions may not be formed in the circumferential direction of the main portion 510, and the shapes of both ends of the main portion 510 can be appropriately changed according to the shape of the side to be fixed.

[0063] The above is the configuration of the position detection device S1 in the present embodiment. And, as Figure 2 shown, the above-described position detection device S1 is disposed on the fixing table 40 so as to face the rotating plate 30 in the axial direction Da. Specifically, as Figure 2 and Figure 3 shown, the position detection device S1 is configured such that when the rotating plate 30 rotates, states in which the coils 110, 120, and 130 face the convex portion 32 of the rotating plate 30 and states in which they do not face each other are alternately repeated in the axial direction Da.

[0064] 〔Signal Processing Unit〕

[0065] Next, the operation of the signal processing unit 210 in the circuit board 200 will be described.

[0066] As Figure 7 shown, the oscillation unit 220 is connected to both ends of the transmission coil 110, and an alternating current with a specified frequency is applied. In addition, for example, two capacitors 161 and 162 are connected in series between both ends of the transmission coil 110 and the oscillation unit 220, and the portion connecting the capacitors 161 and 162 to each other is grounded. Moreover, the transmission coil 110 generates a magnetic field in the axial direction Da that passes through the area surrounded by the first reception coil 120 and the area surrounded by the second reception coil 130. However, the connection method between the transmission coil 110 and the oscillation unit 220 can be appropriately changed. For example, one capacitor can also be arranged between both ends of the transmission coil 110 and the oscillation unit 220.

[0067] The demodulation unit 230 is connected to both ends of the first reception coil 120 and both ends of the second reception coil 130. Moreover, the demodulation unit 230 generates a first demodulation signal obtained by demodulating a first voltage value V1 (to be described later) of the first reception coil 120, and generates a second demodulation signal obtained by demodulating a second voltage value V2 (to be described later) of the second reception coil 130.

[0068] The AD conversion unit 240 is connected to, for example, the demodulation unit 230 and the angle calculation unit 250. Moreover, the AD conversion unit 240 outputs a first conversion signal S obtained by performing AD conversion on the first demodulation signal and a second conversion signal C obtained by performing AD conversion on the second demodulation signal to the angle calculation unit 250.

[0069] The angle calculation unit 250 calculates, for example, the rotation angle of the rotary plate 30 by operating the arctangent function using the first conversion signal S and the second conversion signal C.

[0070] The output unit 260 outputs, for example, the rotation angle of the rotary plate 30 obtained by the operation of the angle calculation unit 250 to the output terminal 400.

[0071] The power supply unit 300 is connected to each of the units 220 to 260 of the signal processing unit 210 and supplies power to each of the units 220 to 260.

[0072] The above is the basic configuration of the signal processing unit 210.

[0073] Next, the first voltage value V1 of the first reception coil 120 and the second voltage value V2 of the second reception coil 130 when the rotary plate 30 rotates will be described.

[0074] First, an alternating current with a specified frequency is applied from the oscillation unit 220 to the transmission coil 110. Thereby, electromagnetic induction is generated in the transmission coil 110. Then, through the generated electromagnetic induction, the transmission coil 110 is inductively coupled to the first reception coil 120 and the second reception coil 130. Moreover, a magnetic field in the axial direction Da is generated that passes through the region surrounded by the first reception coil 120 and the region surrounded by the second reception coil 130. In addition, since the magnetic field changes due to the alternating current, the induced electromotive force generated in the first reception coil 120, that is, the first voltage value V1, and the induced electromotive force generated in the second reception coil 130, that is, the second voltage value V2, change through electromagnetic induction.

[0075] Moreover, when the convex portion 32 of the rotary plate 30 faces the transmission coil 110, the first reception coil 120, and the second reception coil 130, eddy currents, which are induced currents, are generated in the convex portion 32 through electromagnetic induction, and a magnetic field caused by the eddy currents is generated. Therefore, in the magnetic field in the axial direction Da that passes through the region surrounded by the first reception coil 120 and the region surrounded by the second reception coil 130, the magnetic field passing through the portion facing the convex portion 32 is canceled by the magnetic field caused by the eddy currents. Thereby, the first voltage value V1 generated in the first reception coil 120 and the second voltage value V2 generated in the second reception coil 130 change.

[0076] Moreover, as described above, a plurality of convex portions 32 are arranged at intervals in the circumferential direction, and recesses 31 are formed between the adjacent convex portions 32. Thereby, as the rotary plate 30 rotates, the area facing the convex portion 32 changes, and the size of the portion facing the convex portion 32 in the magnetic field in the axial direction Da that passes through the region surrounded by the first reception coil 120 and the region surrounded by the second reception coil 130 changes periodically. Therefore, as the rotary plate 30 rotates, the first voltage value V1 generated in the first reception coil 120 and the second voltage value V2 generated in the second reception coil 130 change periodically. In this way, the rotary plate 30 of the present embodiment changes the first voltage value V1 generated in the first reception coil 120 and the second voltage value V2 generated in the second reception coil 130 according to its own rotation position.

[0077] [Details of the First Reception Coil and the Second Reception Coil]

[0078] Next, the shapes and connections of the first reception coil 120 and the second reception coil 130 formed in the wiring layer 102 will be described in detail. As described above, the printed circuit board 100 of the present embodiment is composed of 10 laminated substrates. The first reception coil 120 and the second reception coil 130 are formed in the wiring layer 102 other than the specified wiring layer 102 among the 10 wiring layers 102.

[0079] As Figure 6As shown, the first receiving coil 120 and the second receiving coil 130 of this embodiment are mainly in a spiral shape. Moreover, the first receiving coil 120 has a first positive spiral portion 121 and a first negative spiral portion 122. The first positive spiral portion 121 and the first negative spiral portion 122 are the portions of the first receiving coil 120 that form a spiral shape. In addition, the second receiving coil 130 of this embodiment has a second positive spiral portion 131 and a second negative spiral portion 132. The second positive spiral portion 131 and the second negative spiral portion 132 are the portions of the second receiving coil 130 that form a spiral shape.

[0080] These first positive spiral portion 121, first negative spiral portion 122, second positive spiral portion 131, and second negative spiral portion 132 are arranged at a predetermined interval along the circumferential direction of the printed circuit board 100 extending in an arc plate shape. Specifically, the first positive spiral portion 121, second positive spiral portion 131, first negative spiral portion 122, and second negative spiral portion 132 are arranged in sequence from one side to the other side of the circumferential direction of the printed circuit board 100.

[0081] The first positive spiral portion 121 and the first negative spiral portion 122 are formed in a spiral pattern shape in such a way that a quadrilateral is depicted while changing the diameter. Moreover, the first positive spiral portion 121 and the first negative spiral portion 122 are each wound 3 times in the same direction in each of the wiring layers 102 of the 10-layer wiring layer 102 except for the two central wiring layers 102. However, the winding directions (i.e., the directions of the spirals) of the coils of the first positive spiral portion 121 and the first negative spiral portion 122 are opposite to each other. For example, the winding direction of the coil of the first positive spiral portion 121 as viewed from one side of the normal direction Ds is clockwise. In contrast, the winding direction of the coil of the first negative spiral portion 122 as viewed from one side of the normal direction Ds is counterclockwise.

[0082] The second positive spiral portion 131 and the second negative spiral portion 132 are the same as the first positive spiral portion 121 and the first negative spiral portion 122, and are formed in a spiral pattern shape in such a way that a quadrilateral is depicted while changing the diameter. Moreover, the second positive spiral portion 131 and the second negative spiral portion 132 are each wound 3 times in the same manner as the first positive spiral portion 121 and the first negative spiral portion 122 in each of the wiring layers 102 of the 10-layer wiring layer 102 except for the two central wiring layers 102. However, the directions of the spirals of the second positive spiral portion 131 and the second negative spiral portion 132 are opposite to each other. For example, the coil of the second positive spiral portion 131 is wound clockwise. In contrast, the coil of the second negative spiral portion 132 is wound counterclockwise.

[0083] In addition, the first positive spiral portion 121, the first negative spiral portion 122, the second positive spiral portion 131, and the second negative spiral portion 132 are formed in a plurality of wiring layers 102 in the 10-layer laminated substrate 10. Moreover, the first positive spiral portion 121, the first negative spiral portion 122, the second positive spiral portion 131, and the second negative spiral portion 132 are respectively formed such that the respective spiral portions formed in each wiring layer 102 overlap in the normal direction Ds.

[0084] For example, the first positive spiral portion 121 formed in the plurality of wiring layers 102 is formed such that the respective first positive spiral portions 121 formed in each wiring layer 102 overlap in the normal direction Ds. In addition, the first negative spiral portion 122 formed in the plurality of wiring layers 102 is formed such that the respective first negative spiral portions 122 formed in each wiring layer 102 overlap in the normal direction Ds. Moreover, the second positive spiral portion 131 formed in the plurality of wiring layers 102 is formed such that the respective second positive spiral portions 131 formed in each wiring layer 102 overlap in the normal direction Ds. Furthermore, the second negative spiral portion 132 formed in the plurality of wiring layers 102 is formed such that the respective second negative spiral portions 132 formed in each wiring layer 102 overlap in the normal direction Ds.

[0085] Here, as Figure 8 shown, the 10-layer wiring layer 102 is set as the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the fifth wiring layer 1005, the sixth wiring layer 1006, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010 from one side to the other side in the normal direction Ds.

[0086] The first positive spiral portion 121, the first negative spiral portion 122, the second positive spiral portion 131, and the second negative spiral portion 132 of the present embodiment are formed in the same wiring layer 102 among the 10-layer wiring layer 102. Specifically, the first positive spiral portion 121, the first negative spiral portion 122, the second positive spiral portion 131, and the second negative spiral portion 132 are formed in the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010. In other words, the first positive spiral portion 121, the first negative spiral portion 122, the second positive spiral portion 131, and the second negative spiral portion 132 are formed in the wiring layer 102 among the 10-layer wiring layer 102 except for the fifth wiring layer 1005 and the sixth wiring layer 1006.

[0087] Moreover, the first positive spiral portion 121, the first negative spiral portion 122, the second positive spiral portion 131, and the second negative spiral portion 132 are formed by winding coils three times respectively in the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010. Therefore, the total number of turns of the coils of the first positive spiral portion 121, the first negative spiral portion 122, the second positive spiral portion 131, and the second negative spiral portion 132 in the present embodiment is 24 turns.

[0088] The first positive spiral portion 121, the first negative spiral portion 122, the second positive spiral portion 131, and the second negative spiral portion 132 formed in the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010 are connected respectively through the through holes 140 formed in the printed circuit board 100.

[0089] Here, the connection method of the first positive spiral portion 121 formed in each of the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010 is the same as the connection methods of the first negative spiral portion 122, the second positive spiral portion 131, and the second negative spiral portion 132 respectively. Therefore, in the present embodiment, only the connection method of the first positive spiral portion 121 is referred to Figure 9 and Figure 10 is described in detail, and the detailed descriptions of the connection methods of the first negative spiral portion 122, the second positive spiral portion 131, and the second negative spiral portion 132 are omitted.

[0090] First, the through hole 140 connecting the first positive spiral portion 121 will be described. As Figure 9As shown, seven vias 140 are formed in the printed circuit board 100 of the present embodiment to connect the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the fifth wiring layer 1005, the sixth wiring layer 1006, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010. Specifically, a first via 1401 connecting the first wiring layer 1001 and the second wiring layer 1002 and a second via 1402 connecting the second wiring layer 1002 and the third wiring layer 1003 are formed in the printed circuit board 100. In addition, a third via 1403, a fourth via 1404, and a fifth via 1405 connecting the third wiring layer 1003, the fourth wiring layer 1004, the fifth wiring layer 1005, and the sixth wiring layer 1006 are formed in the printed circuit board 100. In addition, a sixth via 1406 connecting the eighth wiring layer 1008 and the ninth wiring layer 1009 and a seventh via 1407 connecting the ninth wiring layer 1009 and the tenth wiring layer 1010 are formed in the printed circuit board 100.

[0091] The first via 1401 is formed by penetrating an insulating layer 101 between the first wiring layer 1001 and the second wiring layer 1002 in the normal direction Ds. The second via 1402 is formed by penetrating an insulating layer 101 between the second wiring layer 1002 and the third wiring layer 1003 in the normal direction Ds. The third via 1403, the fourth via 1404, and the fifth via 1405 are formed by penetrating five insulating layers 101 between the third wiring layer 1003 and the eighth wiring layer 1008 in the normal direction Ds. The sixth via 1406 is formed by penetrating an insulating layer 101 between the eighth wiring layer 1008 and the ninth wiring layer 1009 in the normal direction Ds. The seventh via 1407 is formed by penetrating an insulating layer 101 between the ninth wiring layer 1009 and the tenth wiring layer 1010 in the normal direction Ds.

[0092] That is, the via 140 includes the first via 1401, the second via 1402, the sixth via 1406, and the seventh via 1407 formed by penetrating one insulating layer 101. Moreover, the via 140 includes the third via 1403, the fourth via 1404, and the fifth via 1405 formed by penetrating five insulating layers 101. The third via 1403, the fourth via 1404, and the fifth via 1405 function as a first conductive portion formed by penetrating five insulating layers 101. The first via 1401, the second via 1402, the sixth via 1406, and the seventh via 1407 function as a second conductive portion formed by penetrating one insulating layer 101.

[0093] The first through-hole 1401, the second through-hole 1402, the sixth through-hole 1406, and the seventh through-hole 1407 are formed by plating copper on holes formed in the insulating layer 101, for example, using a laser, in an assembly layer. The third through-hole 1403, the fourth through-hole 1404, and the fifth through-hole 1405 are formed by plating copper on through-holes that penetrate all wiring layers 102 and the insulating layer 101 in a core layer composed of six layers of through-substrates. In addition, in Figure 9 the insulating layer 101 between the respective wiring layers 102 is omitted in order to easily observe the drawings.

[0094] As Figure 6 well as Figure 9 shown, the first through-hole 1401 and the seventh through-hole 1407 are formed at positions that overlap each other in the normal direction Ds. Moreover, the first through-hole 1401 and the seventh through-hole 1407 are formed at positions that do not overlap with the second through-hole 1402, the third through-hole 1403, the fourth through-hole 1404, the fifth through-hole 1405, and the sixth through-hole 1406 in the normal direction Ds.

[0095] The second through-hole 1402 and the sixth through-hole 1406 are formed at positions that overlap each other in the normal direction Ds. Moreover, the second through-hole 1402 and the sixth through-hole 1406 are formed at positions that do not overlap with the third through-hole 1403, the fourth through-hole 1404, and the fifth through-hole 1405 in the normal direction Ds.

[0096] The third through-hole 1403, the fourth through-hole 1404, and the fifth through-hole 1405 are formed at positions that do not overlap with each other in the normal direction Ds.

[0097] Moreover, as Figure 6 shown, the first through-hole 1401, the second through-hole 1402, the third through-hole 1403, the fourth through-hole 1404, the fifth through-hole 1405, the sixth through-hole 1406, and the seventh through-hole 1407 are formed at positions that do not overlap with the first positive spiral portion 121 in the normal direction Ds. Specifically, the first through-hole 1401, the third through-hole 1403, the fifth through-hole 1405, and the seventh through-hole 1407 are formed inside the spiral shape of the first positive spiral portion 121. In contrast, the second through-hole 1402, the fourth through-hole 1404, and the sixth through-hole 1406 are formed outside the spiral shape of the first positive spiral portion 121. That is, the first through-hole 1401 to the seventh through-hole 1407 are alternately formed inside and outside the first positive spiral portion 121, with the through-holes 1401, 1403, 1405, 1407 formed inside and the through-holes 1402, 1404, 1406 formed outside.

[0098] The first via hole 1401 of the present embodiment corresponds to the inner layer 1 and layer 2 conductive parts. The second via hole 1402 corresponds to the outer layer 2 and layer 3 conductive parts. The third via hole 1403 corresponds to the inner layer 3 and layer 4 conductive parts. The fourth via hole 1404 corresponds to the outer layer 4 and layer 7 conductive parts. The fifth via hole 1405 corresponds to the inner layer 7 and layer 8 conductive parts. The sixth via hole 1406 corresponds to the outer layer 8 and layer 9 conductive parts. The seventh via hole 1407 corresponds to the inner layer 9 and layer 10 conductive parts.

[0099] Next, a connection method of the first positive spiral part 121 formed on the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010 will be described. In addition, in the following description, the first positive spiral parts 121 formed on the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010 are respectively referred to as the first spiral part 1201, the second spiral part 1202, the third spiral part 1203, the fourth spiral part 1204, the seventh spiral part 1207, the eighth spiral part 1208, the ninth spiral part 1209, and the tenth spiral part 1210.

[0100] The first positive spiral part 121 is electrically connected to the parts formed on each wiring layer 102 through the first via hole 1401, the second via hole 1402, the third via hole 1403, the fourth via hole 1404, the fifth via hole 1405, the sixth via hole 1406, and the seventh via hole 1407. Specifically, as Figure 9 shown, the first spiral part 1201 and the second spiral part 1202 are connected via the first via hole 1401. The second spiral part 1202 and the third spiral part 1203 are connected via the second via hole 1402. The third spiral part 1203 and the fourth spiral part 1204 are connected via the third via hole 1403. The fourth spiral part 1204 and the seventh spiral part 1207 are connected via the fourth via hole 1404. The seventh spiral part 1207 and the eighth spiral part 1208 are connected via the fifth via hole 1405. The eighth spiral part 1208 and the ninth spiral part 1209 are connected via the sixth via hole 1406. The ninth spiral part 1209 and the tenth spiral part 1210 are connected via the seventh via hole 1407.

[0101] Thus, in the present embodiment, the first helical portion 1201, the second helical portion 1202, the third helical portion 1203, the fourth helical portion 1204, the seventh helical portion 1207, the eighth helical portion 1208, the ninth helical portion 1209, and the tenth helical portion 1210 are electrically connected via the first through-hole 1401, the second through-hole 1402, the third through-hole 1403, the fourth through-hole 1404, the fifth through-hole 1405, the sixth through-hole 1406, and the seventh through-hole 1407.

[0102] Moreover, the first helical portion 1201 and the second helical portion 1202 are connected through the first through-hole 1401 formed inside the first positive helical portion 121. The second helical portion 1202 and the third helical portion 1203 are connected through the second through-hole 1402 formed outside the first positive helical portion 121. The third helical portion 1203 and the fourth helical portion 1204 are connected through the third through-hole 1403 formed inside the first positive helical portion 121. The fourth helical portion 1204 and the seventh helical portion 1207 are connected through the fourth through-hole 1404 formed outside the first positive helical portion 121. The seventh helical portion 1207 and the eighth helical portion 1208 are connected through the fifth through-hole 1405 formed inside the first positive helical portion 121. The eighth helical portion 1208 and the ninth helical portion 1209 are connected through the sixth through-hole 1406 formed outside the first positive helical portion 121. The ninth helical portion 1209 and the tenth helical portion 1210 are connected through the seventh through-hole 1407 formed inside the first positive helical portion 121.

[0103] Thus, the first positive helical portions 121 formed in the respective wiring layers 102 are electrically connected through the first through-hole 1401 to the seventh through-hole 1407 that are alternately formed inside and outside the first positive helical portion 121.

[0104] In addition, the first negative helical portions 122 formed in the respective wiring layers 102 are electrically connected through the first through-hole 1401 to the seventh through-hole 1407 that are alternately formed inside and outside the first negative helical portion 122. The second positive helical portions 131 formed in the respective wiring layers 102 are electrically connected through the first through-hole 1401 to the seventh through-hole 1407 that are alternately formed inside and outside the second positive helical portion 131. The second negative helical portions 132 formed in the respective wiring layers 102 are electrically connected through the first through-hole 1401 to the seventh through-hole 1407 that are alternately formed inside and outside the second negative helical portion 132.

[0105] The reason why the first through hole 1401 to the seventh through hole 1407 are alternately formed on the inner and outer sides of the first positive spiral portion 121, the first negative spiral portion 122, the second positive spiral portion 131, and the second negative spiral portion 132 will be described using the first positive spiral portion 121. As described above, the winding directions of the coils of the first spiral portion 1201, the second spiral portion 1202, the third spiral portion 1203, the fourth spiral portion 1204, the seventh spiral portion 1207, the eighth spiral portion 1208, the ninth spiral portion 1209, and the tenth spiral portion 1210 are the same direction (clockwise direction in this embodiment). And the first spiral portion 1201, the second spiral portion 1202, the third spiral portion 1203, the fourth spiral portion 1204, the seventh spiral portion 1207, the eighth spiral portion 1208, the ninth spiral portion 1209, and the tenth spiral portion 1210 are formed to overlap in the normal direction Ds.

[0106] Therefore, as Figure 10 shown, among the first spiral portion 1201, the second spiral portion 1202, the third spiral portion 1203, the fourth spiral portion 1204, the seventh spiral portion 1207, the eighth spiral portion 1208, the ninth spiral portion 1209, and the tenth spiral portion 1210, the adjacent spiral portions are formed such that the direction of the spiral is the clockwise direction, and the direction from the outside to the inside and the direction from the inside to the outside alternate.

[0107] For example, the first spiral portion 1201 is formed by winding the coil from the outside to the inside. In this case, the second spiral portion 1202 formed by the second wiring layer 1002 adjacent to the first wiring layer 1001 forming the first spiral portion 1201 is formed by winding the coil from the inside to the outside. Moreover, the third spiral portion 1203 formed by the third wiring layer 1003 adjacent to the second wiring layer 1002 forming the second spiral portion 1202 is formed by winding the coil from the outside to the inside.

[0108] Moreover, in this embodiment, the first positive spiral portion 121 is formed in the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010 among the first wiring layer 1001 to the tenth wiring layer 1010, except for the fifth wiring layer 1005 and the sixth wiring layer 1006.

[0109] In addition, in Figure 9In order to easily understand the electrical connection between each wiring layer 102 and the first positive spiral portion 121, each wiring layer 102, the first positive spiral portion 121, and the through hole 140 are schematically shown. Moreover, the wiring layer 102 on which the first positive spiral portion 121 is formed is represented by a solid line, and the wiring layer 102 on which the first positive spiral portion 121 is not formed is represented by a dashed line. The portions where the first spiral portion 1201, the second spiral portion 1202, the third spiral portion 1203, the fourth spiral portion 1204, the seventh spiral portion 1207, the eighth spiral portion 1208, the ninth spiral portion 1209, and the tenth spiral portion 1210 are electrically connected are represented by thick lines.

[0110] In addition, in Figure 10 In each wiring layer 102 on which the first positive spiral portion 121 is formed, the through hole 140 that appears when viewed from one side of the normal direction Ds is represented by a solid line, and the through hole 140 that does not appear is represented by a dashed line. In addition, the electrical connection between each through hole 140 is represented by a single-dot dash line.

[0111] Next, the reasons why the first positive spiral portion 121 is not formed in the fifth wiring layer 1005 and the sixth wiring layer 1006 among the first wiring layer 1001 to the tenth wiring layer 1010 will be described.

[0112] Assuming that the first positive spiral portion 121 is formed on the fifth wiring layer 1005 and the sixth wiring layer 1006, it is necessary to add through holes 140 for connecting the first positive spiral portion 121 formed on these fifth wiring layer 1005 and the sixth wiring layer 1006 on the printed circuit board 100.

[0113] Specifically, when the first positive spiral portion 121 is formed on the fifth wiring layer 1005 and the sixth wiring layer 1006, a through hole 140 for connecting the fourth spiral portion 1204 and the first positive spiral portion 121 formed on the fifth wiring layer 1005 is required on the printed circuit board 100. In addition, a through hole 140 for connecting the first positive spiral portion 121 formed on the fifth wiring layer 1005 and the first positive spiral portion 121 formed on the sixth wiring layer 1006 is required on the printed circuit board 100. Furthermore, a through hole 140 for connecting the first positive spiral portion 121 formed on the sixth wiring layer 1006 and the seventh spiral portion 1207 is required on the printed circuit board 100.

[0114] Here, in Figure 11A substrate with a first positive spiral portion 121 formed on the fifth wiring layer 1005 and the sixth wiring layer 1006 shown is used as a comparative printed substrate 100A. Moreover, in the comparative printed substrate 100A, the first positive spiral portion 121 formed on the fifth wiring layer 1005 is used as the fifth spiral portion 1205, and the first positive spiral portion 121 formed on the sixth wiring layer 1006 is used as the sixth spiral portion 1206. In addition, the through-hole 140 for connecting the fourth spiral portion 1204 and the fifth spiral portion 1205 is set as the eighth through-hole 1408, and the through-hole 140 for connecting the fifth spiral portion 1205 and the sixth spiral portion 1206 is set as the ninth through-hole 1409. Furthermore, when the eighth through-hole 1408 and the ninth through-hole 1409 are formed, the fourth through-hole 1404 connects the sixth spiral portion 1206 and the seventh spiral portion 1207.

[0115] As Figure 11 shown, the eighth through-hole 1408 connecting the fourth spiral portion 1204 and the fifth spiral portion 1205, like the third through-hole 1403, the fourth through-hole 1404, and the fifth through-hole 1405, is formed by penetrating the core layer composed of a 6-layer through-substrate. In addition, the ninth through-hole 1409 connecting the fifth spiral portion 1205 and the sixth spiral portion 1206 is also formed by penetrating the core layer composed of a 6-layer through-substrate, like the third through-hole 1403, the fourth through-hole 1404, and the fifth through-hole 1405.

[0116] Here, the first spiral portion 1201 to the tenth spiral portion 1210 need to be formed to overlap in the normal direction Ds. And, as Figure 12 shown, the first through-hole 1401 to the ninth through-hole 1409 need to be formed at positions that do not overlap with the first positive spiral portion 121 in the normal direction Ds.

[0117] Moreover, as described above, the first through-hole 1401 to the ninth through-hole 1409 need to be alternately formed inside and outside the first positive spiral portion 121. Therefore, as Figure 12 shown, the eighth through-hole 1408 after the third through-hole 1403 formed inside the first positive spiral portion 121 is formed outside the first positive spiral portion 121. In addition, the ninth through-hole 1409 after the eighth through-hole 1408 formed outside the first positive spiral portion 121 is formed inside the first positive spiral portion 121.

[0118] Moreover, when forming the first positive spiral portion 121 in all 10 wiring layers 102 of the printed circuit board 100A, the first positive spiral portion 121 needs to be formed at a position that does not overlap with these first vias 1401 to ninth vias 1409 in the normal direction Ds. Thus, the surface area of the wiring layer 102 where the first positive spiral portion 121 can be formed is limited. Specifically, by adding the ninth via 1409 to the comparative printed circuit board 100A, the surface area where the spiral coil can be formed inside the first positive spiral portion 121 of the wiring layer 102 is reduced. In other words, compared with the printed circuit board 100 of the present embodiment, the surface area of the wiring layer 102 of the comparative printed circuit board 100A where the first positive spiral portion 121 can be formed is reduced.

[0119] Accordingly, by adding the ninth via 1409 inside the first positive spiral portion 121, the comparative printed circuit board 100A can reduce the number of turns of the coil that can be formed inside the first positive spiral portion 121 compared with the printed circuit board 100 of the present embodiment. For example, by adding the ninth via 1409, the possible number of turns of the coil in the first positive spiral portion 121 is reduced from 3 turns to 2 turns. Thus, the first positive spiral portion 121 in the comparative printed circuit board 100A is composed of a coil wound 20 turns. In other words, the total number of turns of the coil constituting the first positive spiral portion 121 is 20 turns.

[0120] However, as the rotary plate 30 rotates, the first voltage value V1 generated in the first receiving coil 120 and the second voltage value V2 generated in the second receiving coil 130 change according to the total number of turns of the coils of the first receiving coil 120 and the second receiving coil 130, respectively. Specifically, the larger the total number of turns of the coils of the first receiving coil 120 and the second receiving coil 130, the larger the first voltage value V1 and the second voltage value V2.

[0121] Therefore, compared with the printed circuit board 100 of the present embodiment, the comparative printed circuit board 100A in which the total number of turns of the coil constituting the first positive spiral portion 121 is reduced has smaller first voltage value V1 and second voltage value V2.

[0122] In contrast, the position detection device S1 of the present embodiment includes a printed circuit board 100, which is a multilayer substrate formed by alternately laminating 10 wiring layers 102 and insulating layers 101 disposed between the 10 wiring layers 102. The 10 wiring layers 102 are electrically connected by vias 140 formed by penetrating at least one insulating layer 101.

[0123] The first receiving coil 120 and the second receiving coil 130 are each wound three times in the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010 of the 10-layer wiring layer 102, excluding the fifth wiring layer 1005 and the sixth wiring layer 1006. Moreover, the first receiving coil 120 and the second receiving coil 130 formed in these first wiring layer 1001, second wiring layer 1002, third wiring layer 1003, fourth wiring layer 1004, seventh wiring layer 1007, eighth wiring layer 1008, ninth wiring layer 1009, and tenth wiring layer 1010 are connected via vias 140.

[0124] Thus, compared with the case where the first receiving coil 120 and the second receiving coil 130 are formed in all 10 wiring layers 102, the number of vias 140 for connecting the first receiving coil 120 and the second receiving coil 130 can be reduced. Therefore, in each wiring layer 102 where the first receiving coil 120 and the second receiving coil 130 are respectively formed, the surface area where the first receiving coil 120 and the second receiving coil 130 can be respectively formed can be enlarged.

[0125] Therefore, it is easy to increase the number of turns of the coils constituting the first receiving coil 120 and the second receiving coil 130 in each wiring layer 102 where the first receiving coil 120 and the second receiving coil 130 are formed. Moreover, by increasing the number of turns of the coils constituting the first receiving coil 120 and the second receiving coil 130, the total number of turns of the coils of the first receiving coil 120 and the second receiving coil 130 in the entire printed circuit board 100 can be increased.

[0126] Moreover, by increasing the total number of turns of the coils of the first receiving coil 120 and the second receiving coil 130 respectively, the first voltage value V1 generated in the first receiving coil 120 and the second voltage value V2 generated in the second receiving coil 130 can be increased.

[0127] (Second Embodiment)

[0128] Next, refer to Figure 13 and Figure 14 to describe the second embodiment. In this embodiment, the configuration of the printed circuit board 100 is different from that of the first embodiment. Other than this, it is the same as the first embodiment. Therefore, in this embodiment, mainly the parts different from the first embodiment will be described, and sometimes the parts the same as the first embodiment will be omitted from the description.

[0129] The printed circuit board 100 of this embodiment is a four-layer through-hole substrate in which insulating layers 101 and wiring layers 102 are alternately stacked. Moreover, the printed circuit board 100 is composed of an eight-layer laminated substrate in which two insulating layers 101 and wiring layers 102 are further stacked on one side and the other side in the normal direction Ds of the through-hole substrate. The printed circuit board 100 of this embodiment is an eight-layer laminated substrate in which two assembly layers are respectively arranged on one side and the other side in the normal direction Ds of the core layer composed of four layers. Moreover, as Figure 13 shown, the printed circuit board 100 of this embodiment has first wiring layers 1001 to eighth wiring layers 1008.

[0130] In addition, on the printed circuit board 100, in each of the wiring layers 102 other than the two central wiring layers 102 among the eight wiring layers 102, the first receiving coil 120 and the second receiving coil 130 are each wound three times in the same direction. That is, the first receiving coil 120 and the second receiving coil 130 are formed by winding three times each in the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the sixth wiring layer 1006, the seventh wiring layer 1007, and the eighth wiring layer 1008 except for the fourth wiring layer 1004 and the fifth wiring layer 1005.

[0131] In addition, a first via hole 1401 connecting the first wiring layer 1001 and the second wiring layer 1002 and a second via hole 1402 connecting the second wiring layer 1002 and the third wiring layer 1003 are formed on the printed circuit board 100. In addition, a third via hole 1403 connecting the third wiring layer 1003, the fourth wiring layer 1004, the fifth wiring layer 1005, and the sixth wiring layer 1006 is formed on the printed circuit board 100. Moreover, a fourth via hole 1404 connecting the sixth wiring layer 1006 and the seventh wiring layer 1007 and a fifth via hole 1405 connecting the seventh wiring layer 1007 and the eighth wiring layer 1008 are formed on the printed circuit board 100.

[0132] The first via hole 1401 is formed by penetrating one insulating layer 101 between the first wiring layer 1001 and the second wiring layer 1002 in the normal direction Ds. The second via hole 1402 is formed by penetrating one insulating layer 101 between the second wiring layer 1002 and the third wiring layer 1003 in the normal direction Ds. The third via hole 1403 is formed by penetrating three insulating layers 101 between the third wiring layer 1003 and the sixth wiring layer 1006 in the normal direction Ds. The fourth via hole 1404 is formed by penetrating one insulating layer 101 between the sixth wiring layer 1006 and the seventh wiring layer 1007 in the normal direction Ds. The fifth via hole 1405 is formed by penetrating one insulating layer 101 between the seventh wiring layer 1007 and the eighth wiring layer 1008 in the normal direction Ds.

[0133] That is, the through-holes 140 include a first through-hole 1401, a second through-hole 1402, a fourth through-hole 1404, and a fifth through-hole 1405 formed by penetrating one insulating layer 101, and a third through-hole 1403 formed by penetrating three insulating layers 101. The third through-hole 1403 functions as a first conductive portion formed by penetrating three insulating layers 101. The first through-hole 1401, the second through-hole 1402, the fourth through-hole 1404, and the fifth through-hole 1405 function as second conductive portions formed by penetrating one insulating layer 101.

[0134] As Figure 13 well as Figure 14 shown, the first through-hole 1401 and the fifth through-hole 1405 are formed at positions that overlap each other in the normal direction Ds. Moreover, the first through-hole 1401 and the fifth through-hole 1405 are formed at positions that do not overlap with the second through-hole 1402, the third through-hole 1403, and the fourth through-hole 1404 in the normal direction Ds.

[0135] The second through-hole 1402 is formed at a position that does not overlap with the third through-hole 1403 and the fourth through-hole 1404 in the normal direction Ds.

[0136] The third through-hole 1403 and the fourth through-hole 1404 are formed at positions that do not overlap with each other in the normal direction Ds.

[0137] Moreover, as Figure 14 shown, the first through-hole 1401, the second through-hole 1402, the third through-hole 1403, the fourth through-hole 1404, and the fifth through-hole 1405 are formed at positions that do not overlap with the first receiving coil 120 and the second receiving coil 130 in the normal direction Ds. Specifically, the first through-hole 1401, the third through-hole 1403, and the fifth through-hole 1405 are formed inside the spiral shapes of the first receiving coil 120 and the second receiving coil 130. In contrast, the second through-hole 1402 and the fourth through-hole 1404 are formed outside the spiral shapes of the first receiving coil 120 and the second receiving coil 130. Regarding the first through-hole 1401 to the fifth through-hole 1405, the through-holes 1401, 1403, 1405 formed inside the first receiving coil 120 and the second receiving coil 130 and the through-holes 1402, 1404 formed outside are formed alternately inside and outside.

[0138] Moreover, the first receiving coil 120 formed on the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the sixth wiring layer 1006, the seventh wiring layer 1007, and the eighth wiring layer 1008 is electrically connected through the first through-hole 1401 to the fifth through-hole 1405 alternately formed on the inner and outer sides of the first receiving coil 120. In addition, the second receiving coil 130 formed on the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the sixth wiring layer 1006, the seventh wiring layer 1007, and the eighth wiring layer 1008 is electrically connected through the first through-hole 1401 to the fifth through-hole 1405 alternately formed on the inner and outer sides of the second receiving coil 130.

[0139] For example, the first receiving coil 120 formed on the first wiring layer 1001 and the first receiving coil 120 formed on the second wiring layer 1002 are connected through the first through-hole 1401 formed on the inner side of the first receiving coil 120. The first receiving coil 120 formed on the second wiring layer 1002 and the first receiving coil 120 formed on the third wiring layer 1003 are connected through the second through-hole 1402 formed on the outer side of the first receiving coil 120. The first receiving coil 120 formed on the third wiring layer 1003 and the first receiving coil 120 formed on the sixth wiring layer 1006 are connected through the third through-hole 1403 formed on the inner side of the first receiving coil 120. The first receiving coil 120 formed on the sixth wiring layer 1006 and the first receiving coil 120 formed on the seventh wiring layer 1007 are connected through the fourth through-hole 1404 formed on the outer side of the first receiving coil 120. The first receiving coil 120 formed on the seventh wiring layer 1007 and the first receiving coil 120 formed on the eighth wiring layer 1008 are connected through the fifth through-hole 1405 formed on the inner side of the first receiving coil 120.

[0140] Accordingly, compared with the case where the first receiving coil 120 and the second receiving coil 130 are formed on all eight wiring layers 102, the number of through-holes 140 for connecting the first receiving coil 120 and the second receiving coil 130 can be reduced. Therefore, in each of the wiring layers 102 where the first receiving coil 120 and the second receiving coil 130 are respectively formed, the surface areas where the first receiving coil 120 and the second receiving coil 130 can be respectively formed can be enlarged.

[0141] Therefore, it is easy to increase the number of turns of the coils constituting the first receiving coil 120 and the second receiving coil 130 in each of the wiring layers 102 where the first receiving coil 120 and the second receiving coil 130 are formed. Moreover, by increasing the number of turns of the coils constituting the first receiving coil 120 and the second receiving coil 130, the total number of turns of the coils of the first receiving coil 120 and the second receiving coil 130 in the entire printed circuit board 100 can be increased.

[0142] Furthermore, by increasing the total number of turns of the coils constituting the first receiving coil 120 and the second receiving coil 130, it is possible to increase the first voltage value V1 generated in the first receiving coil 120 and the second voltage value V2 generated in the second receiving coil 130.

[0143] (Third Embodiment)

[0144] Next, refer to Figure 15 and Figure 16 to describe the third embodiment. In this embodiment, the configuration of the printed circuit board 100 is different from that of the first embodiment. Other than that, it is the same as the first embodiment. Therefore, in this embodiment, mainly the parts different from the first embodiment will be described, and sometimes the description of the parts the same as the first embodiment will be omitted.

[0145] The printed circuit board 100 of this embodiment has a four-layer through-substrate in which insulating layers 101 and wiring layers 102 are alternately stacked. Moreover, the printed circuit board 100 is composed of a six-layer laminated substrate in which one insulating layer 101 and one wiring layer 102 are further stacked on one side and the other side in the normal direction Ds of the through-substrate, respectively. And as Figure 15 shown, the printed circuit board 100 of this embodiment has a first wiring layer 1001 to a sixth wiring layer 1006.

[0146] In addition, on the printed circuit board 100, in each of the wiring layers 102 other than the two central wiring layers 102 in the six-layer wiring layer 102, the first receiving coil 120 and the second receiving coil 130 are each wound three times in the same direction. That is, the first receiving coil 120 and the second receiving coil 130 are each wound three turns on the first wiring layer 1001, the second wiring layer 1002, the fifth wiring layer 1005, and the sixth wiring layer 1006 other than the third wiring layer 1003 and the fourth wiring layer 1004 to form.

[0147] In addition, in the printed circuit board 100, a first through-hole 1401 connecting the first wiring layer 1001 and the second wiring layer 1002 and a second through-hole 1402 connecting the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, and the fifth wiring layer 1005 are formed. And a third through-hole 1403 connecting the fifth wiring layer 1005 and the sixth wiring layer 1006 is formed in the printed circuit board 100.

[0148] The first through-hole 1401 is formed by penetrating an insulating layer 101 between the first wiring layer 1001 and the second wiring layer 1002 in the normal direction Ds. The second through-hole 1402 is formed by penetrating three insulating layers 101 between the second wiring layer 1002 and the fifth wiring layer 1005 in the normal direction Ds. The third through-hole 1403 is formed by penetrating an insulating layer 101 between the fifth wiring layer 1005 and the sixth wiring layer 1006 in the normal direction Ds.

[0149] That is, the through-holes 140 include the first through-hole 1401 and the third through-hole 1403 formed by penetrating one insulating layer 101, and the second through-hole 1402 formed by penetrating three insulating layers 101. The second through-hole 1402 functions as a first conductive portion formed by penetrating three insulating layers 101. The first through-hole 1401 and the third through-hole 1403 function as second conductive portions formed by penetrating one insulating layer 101.

[0150] The first through-hole 1401, the second through-hole 1402, and the third through-hole 1403 are formed at positions that do not overlap each other in the normal direction Ds.

[0151] Moreover, as Figure 16 shown, the first through-hole 1401, the second through-hole 1402, and the third through-hole 1403 are formed at positions that do not overlap the first receiving coil 120 and the second receiving coil 130 in the normal direction Ds. Specifically, the first through-hole 1401 and the third through-hole 1403 are formed inside the spiral shapes of the first receiving coil 120 and the second receiving coil 130. In contrast, the second through-hole 1402 is formed outside the spiral shapes of the first receiving coil 120 and the second receiving coil 130. Regarding the first through-hole 1401 to the third through-hole 1403, the through-holes 1401 and 1403 formed inside the first receiving coil 120 and the through-hole 1402 formed outside are formed alternately inside and outside.

[0152] Moreover, the first receiving coil 120 and the second receiving coil 130 formed on the first wiring layer 1001, the second wiring layer 1002, the fifth wiring layer 1005, and the sixth wiring layer 1006 are electrically connected by the first through-hole 1401 to the third through-hole 1403 formed alternately inside and outside the first receiving coil 120.

[0153] For example, the first receiving coil 120 formed on the first wiring layer 1001 and the first receiving coil 120 formed on the second wiring layer 1002 are connected through the first through-hole 1401 formed inside the first receiving coil 120. The first receiving coil 120 formed on the second wiring layer 1002 and the first receiving coil 120 formed on the fifth wiring layer 1005 are connected through the second through-hole 1402 formed outside the first receiving coil 120. The first receiving coil 120 formed on the fifth wiring layer 1005 and the first receiving coil 120 formed on the sixth wiring layer 1006 are connected through the third through-hole 1403 formed inside the first receiving coil 120.

[0154] Accordingly, compared with the case where the first receiving coil 120 and the second receiving coil 130 are formed on all six wiring layers 102, the number of through-holes 140 for connecting the first receiving coil 120 and the second receiving coil 130 can be reduced. Therefore, in each of the wiring layers 102 where the first receiving coil 120 and the second receiving coil 130 are respectively formed, the surface area where the first receiving coil 120 and the second receiving coil 130 can be respectively formed can be enlarged.

[0155] Therefore, it is easy to increase the number of turns of the coils constituting the first receiving coil 120 and the second receiving coil 130 in each of the wiring layers 102 where the first receiving coil 120 and the second receiving coil 130 are formed. Moreover, by increasing the number of turns of the coils constituting the first receiving coil 120 and the second receiving coil 130, the total number of turns of the coils of the first receiving coil 120 and the second receiving coil 130 in the entire printed circuit board 100 can be increased.

[0156] Moreover, by increasing the total number of turns of the coils constituting the first receiving coil 120 and the second receiving coil 130, the first voltage value V1 generated in the first receiving coil 120 and the second voltage value V2 generated in the second receiving coil 130 can be increased.

[0157] (Fourth Embodiment)

[0158] Next, a description will be given with reference to Figure 17 the fourth embodiment. In this embodiment, the pattern shapes of the first receiving coil 120 and the second receiving coil 130 are different from those of the first embodiment. Other than this, it is the same as the first embodiment. Therefore, in this embodiment, mainly the parts different from the first embodiment will be described, and sometimes the description of the parts the same as the first embodiment will be omitted.

[0159] As Figure 17 shown, the first receiving coil 120 and the second receiving coil 130 of this embodiment wind the coil four times in the normal direction Ds and are formed in an arc frame shape with one direction (i.e., the circumferential direction of the printed circuit board 100) as the length direction.

[0160] In addition, the first receiving coil 120 and the second receiving coil 130 are disposed inside the transmitting coil 110 in the normal direction Ds. In addition, the first receiving coil 120 and the second receiving coil 130 are configured by appropriately connecting different wiring layers 102 via vias 140 in a non-interfering manner (i.e., not overlapping in the same layer).

[0161] The first receiving coil 120 is formed in a pattern shape that depicts a sine curve in a closed-loop sine wave form. Moreover, each wound portion of the first receiving coil 120 formed by winding the coil four times is formed by shifting a predetermined size in the amplitude direction for each turn. Moreover, the wound portions of the first receiving coil 120 formed by winding four times are connected in series and formed in one stroke.

[0162] The second receiving coil 130 is formed in a pattern shape that depicts a cosine curve in a closed-loop cosine wave form. Moreover, each wound portion of the second receiving coil 130 formed by winding the coil four times is formed by shifting a predetermined size in the amplitude direction for each turn. Moreover, the wound portions of the first receiving coil 120 formed by winding four times are connected in series and formed in one stroke.

[0163] In addition, the first receiving coil 120 and the second receiving coil 130 formed by winding multiple times may also be formed with their phases shifted from each other. In addition, the first receiving coil 120 may be formed in a pattern shape that depicts a cosine curve in a closed-loop cosine wave form. In this case, the second receiving coil 130 is formed in a pattern shape that depicts a sine curve in a closed-loop sine wave form.

[0164] In addition, the first receiving coil 120 and the second receiving coil 130 are formed in the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010 of the 10-layer wiring layer 102. In other words, the first receiving coil 120 and the second receiving coil 130 are formed in the wiring layer 102 excluding the fifth wiring layer 1005 and the sixth wiring layer 1006 in the 10-layer wiring layer 102.

[0165] Moreover, in the 10-layer wiring layer 102, the wiring layers 102 in which the first receiving coil 120 and the second receiving coil 130 are formed and are adjacent to each other are connected by vias 140.

[0166] For example, the first receiving coil 120 formed on the first wiring layer 1001 and the first receiving coil 120 formed on the second wiring layer 1002 are connected through a through hole 140 formed between the first wiring layer 1001 and the second wiring layer 1002. The first receiving coil 120 formed on the second wiring layer 1002 and the first receiving coil 120 formed on the third wiring layer 1003 are connected through a through hole 140 formed between the second wiring layer 1002 and the third wiring layer 1003. The first receiving coil 120 formed on the third wiring layer 1003 and the first receiving coil 120 formed on the fourth wiring layer 1004 are connected through a through hole 140 formed between the third wiring layer 1003 and the fourth wiring layer 1004.

[0167] The first receiving coil 120 formed on the fifth wiring layer 1005 and the first receiving coil 120 formed on the seventh wiring layer 1007 are connected through a through hole 140 formed by penetrating from the fifth wiring layer 1005 to the seventh wiring layer 1007.

[0168] The first receiving coil 120 formed on the seventh wiring layer 1007 and the first receiving coil 120 formed on the eighth wiring layer 1008 are connected through a through hole 140 formed between the seventh wiring layer 1007 and the eighth wiring layer 1008. The first receiving coil 120 formed on the eighth wiring layer 1008 and the first receiving coil 120 formed on the ninth wiring layer 1009 are connected through a through hole 140 formed between the eighth wiring layer 1008 and the ninth wiring layer 1009. The first receiving coil 120 formed on the ninth wiring layer 1009 and the first receiving coil 120 formed on the tenth wiring layer 1010 are connected through a through hole 140 formed between the ninth wiring layer 1009 and the tenth wiring layer 1010.

[0169] In addition, in Figure 17 , for easy observation, solid lines and dashed lines are used to show the first receiving coil 120 and the second receiving coil 130 formed on the wiring layer 102 in which the first receiving coil 120 and the second receiving coil 130 are formed and are adjacent to each other among the first wiring layer 1001 to the tenth wiring layer 1010.

[0170] Accordingly, compared with the case where the first receiving coil 120 and the second receiving coil 130 are formed on all 10 wiring layers 102, the number of through holes 140 for connecting the first receiving coil 120 and the second receiving coil 130 can be reduced. In each wiring layer 102 where the first receiving coil 120 and the second receiving coil 130 are respectively formed, the surface area on which the first receiving coil 120 and the second receiving coil 130 can be respectively formed can be enlarged.

[0171] Therefore, it is easy to increase the number of turns of the coils forming the first receiving coil 120 and the second receiving coil 130 in each wiring layer 102. And by increasing the number of turns of the coils of the first receiving coil 120 and the second receiving coil 130 respectively, the total number of turns of the coils of the first receiving coil 120 and the second receiving coil 130 in the entire printed circuit board 100 can be increased.

[0172] Moreover, by increasing the total number of turns of the coils forming the first receiving coil 120 and the second receiving coil 130, the first voltage value V1 generated in the first receiving coil 120 and the second voltage value V2 generated in the second receiving coil 130 can be increased.

[0173] (Other embodiments)

[0174] The representative embodiments of the present disclosure have been described above, but the present disclosure is not limited to the above embodiments, and various modifications can be made as follows, for example.

[0175] In the above embodiment, an example in which the position detection device S1 is applied to an electrified system mounted on a vehicle has been described, but it is not limited thereto. For example, the position detection device S1 can also be mounted and used outside the vehicle.

[0176] In the above embodiment, an example in which the position detection device S1 detects the rotation angle of a rotating detection body has been described, but it is not limited thereto. For example, the position detection device S1 can also detect the displacement amount of a linearly moving detection body.

[0177] In the above embodiment, an example in which the first receiving coil 120 and the second receiving coil 130 are wound two or three times has been described, but it is not limited thereto. For example, the first receiving coil 120 and the second receiving coil 130 can also be wound four or more times.

[0178] In the above embodiment, an example in which the printed circuit board 100 is composed of a 6-layer, 8-layer or 10-layer laminated substrate has been described, but it is not limited thereto. The number of layers of the printed circuit board 100 can be appropriately changed.

[0179] In the above-described embodiments, an example has been described in which the printed circuit board 100 is a 6-layer, 8-layer, or 10-layer laminated substrate, and the first receiving coil 120 and the second receiving coil 130 are formed on the wiring layers 102 other than the two central wiring layers 102, but the present invention is not limited thereto. For example, the first receiving coil 120 and the second receiving coil 130 may also be configured such that they are not formed on the wiring layers 102 different from the two central wiring layers 102 of the 6-layer, 8-layer, or 10-layer laminated substrate. In addition, the first receiving coil 120 and the second receiving coil 130 may also be configured such that they are not formed on one or more than three wiring layers 102 of the 6-layer, 8-layer, or 10-layer laminated substrate.

[0180] In the above-described embodiments, the elements constituting the embodiments are not necessarily essential elements, except in cases where they are specifically indicated as being essential and in cases where they are clearly considered to be essential in principle.

[0181] In the above-described embodiments, when referring to numerical values such as the number, value, quantity, range, etc. of the constituent elements of the embodiments, they are not limited to the specific number, except in cases where they are specifically indicated as being essential and in cases where they are clearly limited to a specific number in principle.

[0182] In the above-described embodiments, when referring to the shape, positional relationship, etc. of the constituent elements, etc., they are not limited to the shape, positional relationship, etc., except in cases where they are specifically indicated and in cases where they are clearly limited to a specific shape, positional relationship, etc. in principle.

[0183] The control unit and method of the present disclosure can also be implemented by a dedicated computer provided by a processor and a memory configured to execute one or more functions embodied by a computer program. The control unit and method of the present disclosure can also be implemented by a dedicated computer provided by a processor constituted by one or more dedicated hardware logic circuits. The control unit and method of the present disclosure can also be implemented by one or more dedicated computers constituted by a combination of a processor and a memory configured to execute one or more functions and a processor constituted by one or more hardware logic circuits. In addition, the computer program can also be stored as instructions executable by a computer in a computer-readable non-transitory tangible recording medium.

[0184] (Features of the present invention)

[0185] [First aspect]

[0186] A position detection device, comprising:

[0187] A substrate (100);

[0188] A transmitting coil (110) formed on the substrate; and

[0189] The first receiving coil (120) and the second receiving coil (130) are formed on the substrate and are inductively coupled by electromagnetic induction caused by energizing the transmitting coil.

[0190] The substrate is a multilayer substrate formed by alternately laminating six or more wiring layers (102, 1001 - 1010) and insulating layers (101) disposed between each of the six or more wiring layers, and has a plurality of conductive vias (140, 1401 - 1407) formed by penetrating at least one of the insulating layers and connecting the six or more wiring layers.

[0191] The first receiving coil and the second receiving coil are wound multiple times on wiring layers other than at least one wiring layer among the six or more wiring layers, respectively, and are connected via the plurality of conductive vias.

[0192] At least one of the plurality of conductive vias is disposed inside the first receiving coil and the second receiving coil.

[0193] [Second viewpoint]

[0194] The position detection device according to the first viewpoint

[0195] The substrate has ten wiring layers.

[0196] The first receiving coil and the second receiving coil are wound multiple times on wiring layers other than at least one wiring layer among the ten wiring layers, respectively.

[0197] [Third viewpoint]

[0198] The position detection device according to the second viewpoint

[0199] The plurality of conductive vias include first conductive parts (1403, 1404, 1405) formed by penetrating five of the insulating layers and second conductive parts (1401, 1402, 1406, 1407) formed by penetrating one of the insulating layers.

[0200] Three first conductive parts are formed on the substrate, and at least one is disposed inside the first receiving coil and the second receiving coil.

[0201] Four second conductive parts are formed on the substrate, and at least one is disposed inside the first receiving coil and the second receiving coil.

[0202] [Fourth viewpoint]

[0203] The position detection device according to the third viewpoint

[0204] When the ten wiring layers are set as the first wiring layer (1001), the second wiring layer (1002), the third wiring layer (1003), the fourth wiring layer (1004), the fifth wiring layer (1005), the sixth wiring layer (1006), the seventh wiring layer (1007), the eighth wiring layer (1008), the ninth wiring layer (1009), and the tenth wiring layer (1010),

[0205] The first receiving coil and the second receiving coil are wound multiple times respectively on the first wiring layer, the second wiring layer, the third wiring layer, the fourth wiring layer, the seventh wiring layer, the eighth wiring layer, the ninth wiring layer, and the tenth wiring layer except for the fifth wiring layer and the sixth wiring layer.

[0206] The three first conductive parts formed on the substrate include: an inner 3-layer 4-layer conductive part (1403) that connects the first receiving coil and the second receiving coil respectively formed on the third wiring layer and the fourth wiring layer and is arranged inside the first receiving coil and the second receiving coil; an outer 4-layer 7-layer conductive part (1404) that connects the first receiving coil and the second receiving coil respectively formed on the fourth wiring layer and the seventh wiring layer and is arranged outside the first receiving coil and the second receiving coil; and an inner 7-layer 8-layer conductive part (1405) that connects the first receiving coil and the second receiving coil respectively formed on the seventh wiring layer and the eighth wiring layer and is arranged inside the first receiving coil and the second receiving coil.

[0207] The four second conductive parts formed on the substrate include: an inner 1-layer 2-layer conductive part (1401) that connects the first receiving coil and the second receiving coil respectively formed on the first wiring layer and the second wiring layer and is arranged inside the first receiving coil and the second receiving coil; an outer 2-layer 3-layer conductive part (1402) that connects the first receiving coil and the second receiving coil respectively formed on the second wiring layer and the third wiring layer and is arranged outside the first receiving coil and the second receiving coil; an outer 8-layer 9-layer conductive part (1406) that connects the first receiving coil and the second receiving coil respectively formed on the eighth wiring layer and the ninth wiring layer and is arranged outside the first receiving coil and the second receiving coil; and an inner 9-layer 10-layer conductive part (1407) that connects the first receiving coil and the second receiving coil respectively formed on the ninth wiring layer and the tenth wiring layer and is arranged inside the first receiving coil and the second receiving coil.

[0208] [Fifth Viewpoint]

[0209] The position detection device according to the fourth aspect

[0210] The inner layer 1 and layer 2 conductive parts and the inner layer 9 and layer 10 conductive parts are arranged at positions overlapping in the normal direction Ds in the plane direction of the substrate

[0211] The outer layer 2 and layer 3 conductive parts and the outer layer 8 and layer 9 side conductive parts are arranged at positions overlapping in the normal direction

[0212] [Sixth aspect]

[0213] The position detection device according to the first aspect

[0214] The substrate has 8 wiring layers

[0215] The first receiving coil and the second receiving coil are respectively wound multiple times on wiring layers other than at least one wiring layer among the 8 wiring layers

[0216] [Seventh aspect]

[0217] The position detection device according to the sixth aspect

[0218] The plurality of conductive through parts include a first conductive part (1403) formed by penetrating 3 of the insulating layers and second conductive parts (1401, 1402, 1404, 1405) formed by penetrating 1 of the insulating layers

[0219] The first conductive part is formed and arranged on the substrate, and is arranged inside the first receiving coil and the second receiving coil

[0220] The second conductive part is formed 4 on the substrate, and at least one is arranged inside the first receiving coil and the second receiving coil

[0221] [Eighth aspect]

[0222] The position detection device according to the first aspect

[0223] The substrate has 6 wiring layers

[0224] The first receiving coil and the second receiving coil are respectively wound multiple times on wiring layers other than at least one wiring layer among the 6 wiring layers

[0225] [Ninth aspect]

[0226] The position detection device according to the eighth aspect

[0227] The plurality of conductive vias include a first conductive part (1402) formed by penetrating through three of the insulating layers and second conductive parts (1401, 1403) formed by penetrating through one of the insulating layers.

[0228] One first conductive part is formed on the substrate and is disposed inside the first receiving coil and the second receiving coil.

[0229] Two second conductive parts are formed on the substrate, and at least one of them is disposed inside the first receiving coil and the second receiving coil.

[0230] [Tenth Viewpoint]

[0231] The position detection device according to any one of the sixth to ninth viewpoints.

[0232] The first receiving coil and the second receiving coil are respectively formed in wiring layers other than the two central wiring layers among the six or more wiring layers.

[0233] [Eleventh Viewpoint]

[0234] The position detection device according to any one of the first to tenth viewpoints.

[0235] The first receiving coil and the second receiving coil include portions having a spiral pattern shape.

[0236] [Twelfth Viewpoint]

[0237] The position detection device according to any one of the first to tenth viewpoints.

[0238] Regarding the first receiving coil and the second receiving coil, one of the first receiving coil and the second receiving coil includes a pattern shape depicting a sine curve, and the other of the first receiving coil and the second receiving coil includes a pattern shape depicting a cosine curve.

[0239] [Thirteenth Viewpoint]

[0240] The position detection device according to any one of the first to ninth viewpoints.

[0241] It includes a detection part (30) that is affected by the energized transmission coil to generate an induced current based on electromagnetic induction, and the generated induced current causes a change in the induced electromotive force generated in the first receiving coil and the second receiving coil.

[0242] [Fourteenth Viewpoint]

[0243] The position detection device according to the thirteenth viewpoint.

[0244] It is provided with a signal processing unit (210), and the signal processing unit (210) calculates the position of the detection unit based on the induced electromotive force output from the first receiving coil and the second receiving coil.

Claims

1. A position detection device, characterized in that, Comprising: a substrate (100); a transmitting coil (110) formed on the substrate; and a first receiving coil (120) and a second receiving coil (130) formed on the substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil, the substrate is a multilayer substrate formed by alternately laminating six or more wiring layers (102, 1001 to 1010) and insulating layers (101) disposed between each of the six or more wiring layers, and has a plurality of conductive vias (140, 1401 to 1407) formed by penetrating at least one of the insulating layers and connecting the six or more wiring layers, the first receiving coil and the second receiving coil are wound multiple times on each of the wiring layers other than at least one wiring layer among the six or more wiring layers, and are connected via the plurality of conductive vias, and at least one of the plurality of conductive vias is disposed inside the first receiving coil and the second receiving coil.

2. The position detection device according to claim 1, wherein the substrate has ten wiring layers, the first receiving coil and the second receiving coil are wound multiple times on the wiring layers other than at least one wiring layer among the ten wiring layers respectively.

3. The position detection device according to claim 2, wherein the plurality of conductive vias include a first conductive portion (1403, 1404, 1405) formed by penetrating five of the insulating layers and a second conductive portion (1401, 1402, 1406, 1407) formed by penetrating one of the insulating layers, three of the first conductive portions are formed on the substrate, and at least one is disposed inside the first receiving coil and the second receiving coil, four of the second conductive portions are formed on the substrate, and at least one is disposed inside the first receiving coil and the second receiving coil.

4. The position detection device according to claim 3, wherein when the ten wiring layers are set as a first wiring layer (1001), a second wiring layer (1002), a third wiring layer (1003), a fourth wiring layer (1004), a fifth wiring layer (1005), a sixth wiring layer (1006), a seventh wiring layer (1007), an eighth wiring layer (1008), a ninth wiring layer (1009), and a tenth wiring layer (1010) from one side to the other side in the normal direction of the surface direction with respect to the substrate, the first receiving coil and the second receiving coil are wound multiple times on each of the first wiring layer, the second wiring layer, the third wiring layer, the fourth wiring layer, the seventh wiring layer, the eighth wiring layer, the ninth wiring layer, and the tenth wiring layer other than the fifth wiring layer and the sixth wiring layer. The first conductive parts, of which three are formed on the substrate, include: an inner 3-layer to 4-layer conductive part (1403) that connects the first receiving coil and the second receiving coil respectively formed on the third wiring layer and the fourth wiring layer, and is disposed inside the first receiving coil and the second receiving coil; an outer 4-layer to 7-layer conductive part (1404) that connects the first receiving coil and the second receiving coil respectively formed on the fourth wiring layer and the seventh wiring layer, and is disposed outside the first receiving coil and the second receiving coil; and an inner 7-layer to 8-layer conductive part (1405) that connects the first receiving coil and the second receiving coil respectively formed on the seventh wiring layer and the eighth wiring layer, and is disposed inside the first receiving coil and the second receiving coil. The second conductive parts, of which four are formed on the substrate, include: an inner 1-layer to 2-layer conductive part (1401) that connects the first receiving coil and the second receiving coil respectively formed on the first wiring layer and the second wiring layer, and is disposed inside the first receiving coil and the second receiving coil; an outer 2-layer to 3-layer conductive part (1402) that connects the first receiving coil and the second receiving coil respectively formed on the second wiring layer and the third wiring layer, and is disposed outside the first receiving coil and the second receiving coil; an outer 8-layer to 9-layer conductive part (1406) that connects the first receiving coil and the second receiving coil respectively formed on the eighth wiring layer and the ninth wiring layer, and is disposed outside the first receiving coil and the second receiving coil; and an inner 9-layer to 10-layer conductive part (1407) that connects the first receiving coil and the second receiving coil respectively formed on the ninth wiring layer and the tenth wiring layer, and is disposed inside the first receiving coil and the second receiving coil.

5. The position detection device according to claim 4, wherein: the inner 1-layer to 2-layer conductive part and the inner 9-layer to 10-layer conductive part are disposed at positions overlapping in the normal direction; the outer 2-layer to 3-layer conductive part and the outer 8-layer to 9-layer conductive part are disposed at positions overlapping in the normal direction.

6. The position detection device according to claim 1, characterized in that The substrate has eight wiring layers. The first receiving coil and the second receiving coil are wound multiple times respectively on wiring layers among the eight wiring layers except for at least one wiring layer.

7. The position detection device according to claim 6, wherein: the plurality of conductive through-holes include a first conductive part (1403) formed by penetrating three of the insulating layers and second conductive parts (1401, 1402, 1404, 1405) formed by penetrating one of the insulating layers; the first conductive part is formed in the substrate in a number of, and is disposed inside the first receiving coil and the second receiving coil; the second conductive parts are formed in the substrate in a number of four, and at least one of them is disposed inside the first receiving coil and the second receiving coil.

8. The position detection device according to claim 1, wherein: the substrate has six wiring layers; the first receiving coil and the second receiving coil are each wound a plurality of times on wiring layers other than at least one of the six wiring layers.

9. The position detection device according to claim 8, wherein: the plurality of conductive through portions include a first conductive portion (1402) formed by penetrating three of the insulating layers and second conductive portions (1401, 1403) formed by penetrating one of the insulating layers; one first conductive portion is formed on the substrate and is disposed inside the first receiving coil and the second receiving coil; two second conductive portions are formed on the substrate, and at least one of them is disposed inside the first receiving coil and the second receiving coil.

10. The position detection device according to any one of claims 6 to 9, wherein: the first receiving coil and the second receiving coil are formed on each of the wiring layers other than the two central wiring layers among the six or more wiring layers.

11. The position detection device according to any one of claims 1 to 9, wherein: the first receiving coil and the second receiving coil include portions that are in a spiral pattern shape.

12. The position detection device according to any one of claims 1 to 7, wherein: with respect to the first receiving coil and the second receiving coil, one of the first receiving coil and the second receiving coil includes a pattern shape depicting a sine curve, and the other of the first receiving coil and the second receiving coil includes a pattern shape depicting a cosine curve.

13. The position detection device according to any one of claims 1 to 9, wherein: it includes a detection body (30) that is affected by the energized transmission coil to generate an induced current based on electromagnetic induction, and the induced electromotive force generated in the first receiving coil and the second receiving coil changes due to the generated induced current.

14. The position detection device according to claim 13, wherein: it includes a signal processing unit (210) that calculates the position of the detection body based on the induced electromotive force output from the first receiving coil and the second receiving coil.

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