Polishing solution as well as preparation method and application thereof

Abstract

The invention discloses a polishing solution as well as a preparation method and application thereof. The polishing solution comprises an abrasive, a corrosion inhibitor, a lubricant, a surfactant, a dispersant and a solvent, the grinding material comprises aluminum oxide; the corrosion inhibitor comprises octyl dodecyl alcohol; the dispersing agent comprises one or more of organic bentonite, magnesium aluminosilicate and sodium polyacrylate. The polishing solution is prepared by compounding specific components, so that the stability of the polishing solution can be remarkably improved, particularly, good fluidity is kept at low temperature, and crystallization is avoided. And meanwhile, the polishing performance of the polishing solution is greatly improved, the excellent polishing effect on metal workpieces is achieved, and particularly mirror polishing of aluminum alloy can be achieved.

Description

Technical Field

[0001] This application relates to the technical field of metal polishing, and particularly to a polishing liquid, a preparation method thereof, and an application thereof. Background Art

[0002] Polishing refers to a processing method that uses mechanical, chemical, or electrochemical means to reduce the surface roughness of a metal workpiece to obtain a bright and flat surface. Compared with mechanical polishing and chemical polishing, chemical mechanical polishing (CMP) is a technology that combines chemical polishing and mechanical polishing to process the surface of materials. It combines the advantages of chemical polishing and mechanical polishing. While ensuring the material removal efficiency, it can obtain a surface with a flatness significantly higher than that of single chemical polishing and mechanical polishing, and can achieve a surface roughness at the nanometer level and atomic level.

[0003] The polishing liquid is an important factor determining the polishing effect of CMP. During the CMP process, the abrasive in the polishing liquid interacts with the surface of the material to be polished. Under the action of mechanical force, the surface of the material to be polished is micro-cut and ground, and the protruding parts on the material surface are gradually removed, thereby realizing the removal of the material and the flattening of the surface. At the same time, the chemical substances in the polishing liquid will chemically react with the material surface to form a reaction layer that is easy to remove. This reaction layer is more easily removed under the mechanical action of the abrasive, thereby improving the polishing efficiency.

[0004] However, traditional CMP polishing liquids have poor stability, especially crystallization at low temperatures, and cannot be stably stored, resulting in poor polishing effects and low polishing efficiency during the application of the polishing liquid, making it impossible for workpieces to achieve ideal polishing effects and limiting their applications. Summary of the Invention

[0005] Based on this, this application provides a polishing liquid that has good stability at low temperatures and can exhibit excellent polishing effects on metal workpieces.

[0006] In a first aspect, an embodiment of this application provides a polishing liquid, which includes an abrasive, a corrosion inhibitor, a lubricant, a surfactant, a dispersant, and a solvent;

[0007] The abrasive includes aluminum oxide;

[0008] The corrosion inhibitor includes octyldodecanol;

[0009] The dispersant includes one or more of organic bentonite, magnesium aluminosilicate, and sodium polyacrylate.

[0010] In some of these embodiments, the particle size D50 of the abrasive is 1 μm - 5 μm; and / or, the aluminum oxide includes alumina.

[0011] In some of these embodiments, the polishing liquid satisfies at least one of the following conditions:

[0012] (1) The lubricant includes tall oil fatty acid;

[0013] (2) The surfactant includes fatty acid methyl ester ethoxylate.

[0014] In some of these embodiments, the polishing liquid comprises, by mass percentage: abrasive 1% - 3%, corrosion inhibitor 0.3% - 8%, lubricant 2% - 8%, surfactant 1% - 7%, dispersant 0.3% - 5%, and solvent 69% - 95.4%.

[0015] In some of these embodiments, the polishing liquid comprises, by mass percentage: abrasive 1% - 3%, corrosion inhibitor 1% - 3%, lubricant 2% - 3%, surfactant 5% - 7%, dispersant 0.3% - 0.5%, and solvent 83.5% - 90.7%.

[0016] In some of these embodiments, the polishing liquid satisfies at least one of the following conditions:

[0017] (1) The pH of the polishing liquid is 7.8 - 8.5;

[0018] (2) The viscosity of the polishing liquid is 100 cp - 121 cp;

[0019] (3) The surface tension of the polishing liquid is 28 N / m - 32 N / m.

[0020] In a second aspect, an embodiment of the present application provides a method for preparing a polishing liquid, comprising the following steps:

[0021] Mix an abrasive, a corrosion inhibitor, a lubricant, a surfactant, a dispersant, and a solvent to prepare the polishing liquid.

[0022] In some of these embodiments, the method for preparing the polishing liquid comprises the following steps:

[0023] Add the dispersant and the corrosion inhibitor to the solvent, and then add the abrasive to prepare a first mixture;

[0024] Mix the lubricant and the surfactant to prepare a second mixture;

[0025] Mix the first mixture and the second mixture to prepare the polishing liquid.

[0026] In a third aspect, an embodiment of the present application provides an application of the polishing liquid in surface treatment, and the polishing liquid is the polishing liquid described in the first aspect of the present application or the polishing liquid prepared by the preparation method described in the second aspect of the present application.

[0027] In some of these embodiments, the material of the surface comprises aluminum alloy.

[0028] In some of these embodiments, the Ra value of the surface after being polished by the polishing liquid is 25 nm - 30 nm.

[0029] Compared with the conventional technology, the technical solution of the present application has the following beneficial effects:

[0030] The polishing liquid of the present application inhibits the low-temperature crystallization of the polishing liquid through the synergistic compounding effect between specific components, and enables it to have good fluidity and dispersibility at low temperatures, and can be stably stored at low temperatures, thus not affecting its polishing effect. The polishing liquid of the present application shows an excellent polishing effect on metal workpieces, especially enabling the surface of the workpiece to present a mirror effect. Detailed implementation manners

[0031] For the convenience of understanding the present application, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present application more thorough and comprehensive.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs. The terms used in the description of the present application in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0033] The "ranges" disclosed in this application are defined in the form of lower and upper limits. A given range is defined by selecting a lower limit and an upper limit, and the selected lower and upper limits define the boundaries of a particular range. The ranges defined in this way can include or exclude the end values, and can be combined arbitrarily, that is, any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60 - 120 and 80 - 110 are listed for a specific parameter, ranges of 60 - 110 and 80 - 120 are also contemplated. In addition, if the minimum range values 1 and 2 are listed, and if the maximum range values 3, 4, and 5 are listed, then the following ranges are all contemplated: 1 - 3, 1 - 4, 1 - 5, 2 - 3, 2 - 4, and 2 - 5. In this application, unless otherwise stated, the numerical range "a - b" represents an abbreviated representation of any combination of real numbers between a and b, where a and b are both real numbers. For example, the numerical range "0 - 5" means that all real numbers between "0 - 5" are fully listed herein, and "0 - 5" is only an abbreviated representation of these numerical combinations. Additionally, when stating that a certain parameter is an integer ≥ 2, it is equivalent to disclosing that the parameter is, for example, the integers 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc. For example, when stating that a certain parameter is an integer selected from "2 - 10", it is equivalent to listing the integers 2, 3, 4, 5, 6, 7, 8, 9, and 10.

[0034] Unless otherwise specified, all embodiments and optional embodiments of this application can be combined with each other to form new technical solutions.

[0035] Unless otherwise specified, all steps of this application can be carried out sequentially or randomly, preferably sequentially. For example, the method includes steps (a) and (b), which means that the method can include steps (a) and (b) carried out sequentially, or can also include steps (b) and (a) carried out sequentially. For example, when it is mentioned that the method may further include step (c), it means that step (c) can be added to the method in any order. For example, the method can include steps (a), (b), and (c), or can also include steps (a), (c), and (b), or can also include steps (c), (a), and (b), etc.

[0036] Unless otherwise specified, the terms "include", "contain", and "comprise" mentioned in this application can be open-ended or closed-ended. For the open-ended case, for example, the terms "include", "contain", and "comprise" can mean that other members, elements, or method steps not listed can also be included or contained, or can also mean that only the listed members, elements, or method steps are included or contained.

[0037] Unless otherwise specified, the term "or" is inclusive in this application. For example, the phrase "A or B" means "A, B, or both A and B". Further, any of the following conditions satisfies the condition "A or B": A is true (or exists) and B is false (or does not exist); A is false (or does not exist) and B is true (or exists); or both A and B are true (or exist).

[0038] In this application, unless otherwise stated, A (such as B) means that B is a non-limiting example of A, and it can be understood that A is not limited to B.

[0039] In this application, when it comes to "multiple", "a variety of", etc., unless otherwise specifically defined, it means greater than 2 or equal to 2 in quantity. For example, "one or more" means one or greater than or equal to two.

[0040] In this application, in "the first aspect", "the second aspect", "the third aspect", "the fourth aspect", etc., the terms "first", "second", "third", "fourth", etc. are only for descriptive purposes and cannot be understood as indicating or implying relative importance or quantity, nor can they be understood as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "first", "second", "third", "fourth", etc. only serve the purpose of non-exhaustive enumerative description and should be understood not to constitute a closed limitation on quantity.

[0041] In this application, for the unit of a data range, if the unit is only attached after the right endpoint, it means that the units of the left endpoint and the right endpoint are the same.

[0042] The term "CMP" is short for Chemical Mechanical Polishing, which is an advanced processing technology that combines chemical corrosion and mechanical removal, and is mainly used for global surface planarization in the process of semiconductor wafer manufacturing. With the continuous upgrading of the process technology, the sizes of wires and gates are gradually reduced, and the requirements for the flatness of the wafer surface are also increasing day by day.

[0043] The term "cp" is the smallest unit of dynamic viscosity, indicating the magnitude of the internal friction force when a liquid flows under a certain shear stress.

[0044] The term "polishing liquid" is a polishing agent with good degreasing, rust prevention, cleaning and brightening properties, which can make metal products show their true metallic luster. It has the functions of stable performance, non-toxicity and no pollution to the environment.

[0045] Traditional polishing fluids often crystallize at low or high temperatures. There are several possible reasons: on the one hand, to promote the suspension performance of the polishing fluid, especially to improve the suspension of abrasives in the polishing fluid, traditional polishing fluids need to add special thickening aids, which leads to crystallization at low or high temperatures. Crystallization by precipitation occurs at low temperatures, and evaporation crystallization occurs at high temperatures. These thickening aids are sensitive to temperature. Some thickeners are unstable at low temperatures. For polishing fluids containing such thickeners, they will further thicken during static storage at low temperatures, resulting in gelation crystallization. On the other hand, the charge on the surface of abrasive particles in a low-temperature environment weakens due to temperature changes, resulting in a decrease in the repulsive force between particles, making them prone to agglomeration or the formation of an ionic network structure, and ultimately crystals will also precipitate.

[0046] Based on this, the present application provides a polishing fluid with good stability, especially good stability at low or high temperatures and without crystallization.

[0047] In the first aspect of the embodiments of the present application, a polishing fluid is provided, which includes an abrasive, a corrosion inhibitor, a lubricant, a surfactant, a dispersant, and a solvent;

[0048] The abrasive includes aluminum oxide;

[0049] The corrosion inhibitor includes octyldodecanol;

[0050] The dispersant includes one or more of organobentonite, magnesium aluminosilicate, and sodium polyacrylate.

[0051] The polishing fluid provided by the present application contains specific components. Among them, the corrosion inhibitor can adsorb on the metal surface or form a dense protective film through a chemical reaction, isolating the metal surface to be polished from the corrosive substances in the polishing fluid, thereby inhibiting the corrosion of the metal in the polishing fluid. The corrosion inhibitor of the polishing fluid in the embodiments of the present application includes octyldodecanol. Octyldodecanol is a compound of fatty alcohols with an alkyl branch chain connected to the β-carbon. Its highly branched alkyl structure gives it the characteristics of a low freezing point and low viscosity, which can reduce the overall freezing point of the polishing fluid, improve the low-temperature fluidity of the polishing fluid, and enable the polishing fluid to still exhibit good polishing effects at low temperatures.

[0052] As a non-limiting example, the octyldodecanol in the embodiments of the present application includes, but is not limited to, one or more of 2-butyloctane (C12 octyldodecanol, Isofol 12), 2-hexyldecanol (C16 octyldodecanol, Isofol 16), 2-heptylundecanol (C18 octyldodecanol, Isofol 18), octyldodecanol (C20 octyldodecanol, Isofol 20), and decyltetradecanol (C24 octyldodecanol, Isofol 24).

[0053] The polishing liquid provided by the present application further contains a lubricant, which can be adsorbed on the surface of the metal polishing part. By adding the lubricant, a lubricating film can be formed on the abrasive particles and the surface of the workpiece to be polished, providing a smooth interface, reducing the frictional resistance and mechanical damage, effectively reducing the friction scratches, inhibiting and weakening the white pitting caused by chloride ion corrosion, and at the same time, it can adjust the pH of the polishing liquid to promote the mirror brightness.

[0054] The polishing liquid provided by the present application further contains a surfactant. In addition to emulsifying, dissolving and dispersing the lubricant, corrosion inhibitor and dispersant, the surfactant can reduce the surface tension of the polishing liquid, and also has an obvious light preservation effect, enhancing the penetration ability of the liquid to the surface of the workpiece to be polished, and ensuring that the abrasives uniformly contact the processing area.

[0055] The polishing liquid provided by the present application further contains one or more dispersants including organic bentonite, magnesium aluminosilicate and sodium polyacrylate. On the one hand, it solves the crystallization phenomenon that occurs in the traditional polishing liquid at low temperature. On the other hand, the addition of the dispersant can make the abrasive particles uniformly dispersed, make the polishing liquid dispersed and suspended in the polishing liquid, prevent the abrasives from agglomerating and coarsening, reduce the scratches in the polishing process, and enable each abrasive particle to fully exert its cutting and grinding functions. During the polishing process, the abrasive particles can contact the surface to be polished more uniformly and effectively, improving the polishing efficiency.

[0056] It has been found through research that after the polishing liquid of the embodiment of the present application is stored statically for 72 hours in a low-temperature environment of 3-15 °C using the above specific polishing liquid, no crystallization phenomenon appears, showing excellent low-temperature fluidity.

[0057] In summary, the polishing liquid of the present application uses specific components to inhibit the low-temperature crystallization of the polishing liquid, so that it still has good fluidity and dispersibility at low temperature, and then exerts excellent polishing effects.

[0058] The present application does not make specific limitations on the specific components of the aluminum oxide. As a non-limiting example, in some of the embodiments, the aluminum oxide includes but is not limited to alumina. The embodiment of the present application uses alumina as the abrasive component of the polishing liquid, which mainly reflects the mechanical cutting and chemical polishing effects. The main mechanical effect is to cut the aluminum alloy polishing surface with amorphous fine particles with a sintered density of 3 g / cm³ - 4 g / cm³ by itself, and secondly, to polish the aluminum alloy polishing surface by virtue of its own alkaline corrosion, playing a dual role of chemical and physical polishing effects.

[0059] The particle size of the abrasive is a key factor affecting the processing efficiency and surface quality of the abrasive. During rough machining, in order to quickly remove a large amount of material and improve the processing efficiency, abrasives with a larger particle size are usually selected. In the finishing stage, in order to obtain a high surface finish and accuracy, abrasives with a smaller particle size are required for fine grinding and polishing. In some embodiments of the present application, the D50 of the abrasive particle size is 1 μm - 5 μm. Within the above particle size range, a better balance can be achieved between the polishing efficiency and the polishing effect. Exemplarily, the particle size of the abrasive can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm or any range formed by any two of the foregoing and any value within the range. If abrasives with a smaller particle size are used, the abrasives are prone to breakage during the polishing process, there are more adherents after polishing, and the polishing time and cleaning time are longer. If abrasives with a larger particle size are used, the suspension property becomes poor, the surface roughness after polishing is higher, and an excellent polishing effect cannot be achieved.

[0060] In some of these embodiments, the lubricant includes tall oil fatty acid, the main components of which are abietic acid, oleic acid, etc. It has a long-chain hydrocarbon group and a carboxyl group, and can adsorb on the surface of the abrasive to form an interfacial film with an oriented arrangement. Among them, the carboxyl group dissociates in water into a negatively charged carboxylate ion, increasing the negative charge density on the surface of the abrasive particles. The stability of the abrasive particles is maintained by inhibiting particle aggregation through electrostatic repulsion, while the long-chain hydrocarbon group can form a "steric barrier" on the surface of the abrasive particles to prevent the abrasive particles from colliding and aggregating due to Brownian motion at low temperatures, reducing the formation of crystal seeds, and inhibiting the low-temperature crystallization of the polishing liquid.

[0061] In some of these embodiments, the surfactant includes fatty acid methyl ester ethoxylate (FMEE). The hydrophilic ethoxy chain in its structure can disrupt the ordered arrangement of water molecules, lower the freezing point of the polishing liquid, and reduce the crystallization risk caused by the freezing of water at low temperatures. In addition, FMEE can form mixed micelles with octyldodecanol, improve its solubility and dispersibility in the polishing liquid, ensure the uniform distribution of octyldodecanol molecules and effectively inhibit crystallization, and FMEE can also dissolve and emulsify tall oil fatty acid to make it uniformly dispersed in water to play a lubricating role.

[0062] The dosage of each component in the polishing liquid is crucial for the polishing effect. A reasonable ratio can balance the chemical action and mechanical action, thereby optimizing the polishing effect, surface quality, and material removal rate. In some embodiments of the present application, the polishing liquid includes, by mass percentage, 1%-3% abrasive, 0.3%-8% corrosion inhibitor, 2%-8% lubricant, 1%-7% surfactant, 0.3%-5% dispersant, and 69%-95.4% solvent. Within the above ratio range, not only can the crystallization of the polishing liquid at low temperatures be effectively avoided, but also the polishing liquid can achieve a better balance in terms of chemical action and mechanical action, and exhibit a good polishing effect. Further, in some embodiments of the present application, the polishing liquid includes, by mass percentage, 1%-3% abrasive, 1%-3% corrosion inhibitor, 2%-3% lubricant, 5%-7% surfactant, 0.3%-0.5% dispersant, and 83.5%-90.7% solvent. The technical effects of the present application can be better achieved within the said ratio range.

[0063] Factors such as the pH, viscosity, and surface tension of the polishing liquid are key factors affecting the polishing effect and low-temperature crystallization performance of the polishing liquid. The acidic condition can promote metal oxidation and is suitable for rough polishing; the alkaline condition can enhance the chemical etching of non-metallic materials and is suitable for fine polishing. pH also affects the solubility and supersaturation of the components in the polishing liquid, and has an impact on the low-temperature crystallization performance. In some embodiments of the present application, the pH of the polishing liquid is 7.8-8.5. Exemplarily, the pH of the polishing liquid can be 7.8, 7.9, 8, 8.1, 8.2, 8.3, 8.4, 8.5, or any range formed by any two of the foregoing and any value within the range.

[0064] The polishing liquid has good fluidity at low viscosity and is suitable for rapid material removal. The polishing liquid has strong suspension at high viscosity, which can reduce abrasive settlement and is suitable for precision polishing. However, the diffusion efficiency of solutes in the high-viscosity polishing liquid is low, and it is easy to form a supersaturated solution at low temperatures, resulting in crystallization precipitation. In some embodiments of the present application, the viscosity of the polishing liquid is 100cp-121cp. Exemplarily, the viscosity of the polishing liquid can be 100cp, 105cp, 110cp, 115cp, 120cp, 121cp, or any range formed by any two of the foregoing and any value within the range.

[0065] Lower surface tension can enhance wettability, reduce bubble generation, and improve the contact efficiency between the abrasive and the workpiece to be processed. However, low surface tension also reduces the nucleation energy barrier of the crystal and promotes crystallization. Higher surface tension, on the other hand, can lead to uneven spreading of the polishing liquid and local drying, resulting in crystallization residue. In some embodiments of the present application, the surface tension of the polishing liquid is 28 N / m - 32 N / m. Exemplarily, the viscosity of the polishing liquid can be 28 N / m, 29 N / m, 30 N / m, 31 N / m, 32 N / m, or any value within the range formed by any two of the foregoing and within that range.

[0066] Based on the above considerations, when the pH, viscosity, and surface tension of the polishing liquid in the present application meet one of the above ranges, the polishing liquid is not likely to crystallize at low temperatures and maintains a good polishing effect.

[0067] In some embodiments of the present application, the solvent in the polishing liquid is selected from water, especially pure water without ion interference (such as pure water with a resistivity of 16 - 17 mΩ·cm), which can effectively prevent metal ions or other impurities in the water from depositing on the surface of the metal workpiece during the polishing process.

[0068] A second aspect of the embodiments of the present application provides a method for preparing a polishing liquid, including the following steps:

[0069] Mix the abrasive, corrosion inhibitor, lubricant, surfactant, dispersant, and solvent to prepare the polishing liquid.

[0070] The embodiments of the present application do not particularly limit the mixing method of each component. Specifically, high-speed stirring, ultrasonic treatment, or microfluidization technology can be used to uniformly disperse each component, avoiding agglomeration or sedimentation, thereby improving the polishing efficiency and the surface flatness of the workpiece to be polished while inhibiting low-temperature crystallization of the polishing liquid.

[0071] Using the method for preparing a polishing liquid provided in the second aspect of the embodiments of the present application, the polishing liquid provided in the first aspect of the embodiments of the present application can be prepared. This method is simple and convenient, and the prepared polishing liquid can still maintain a good polishing effect at low temperatures.

[0072] In some of these embodiments, the method for preparing the polishing liquid includes the following steps:

[0073] S10. Add the dispersant to the solvent, and then add the abrasive to prepare a first mixture;

[0074] S20. Mix the corrosion inhibitor, lubricant, and the surfactant to prepare a second mixture;

[0075] S30. Mix the first mixture and the second mixture to prepare the polishing liquid.

[0076] In step S10, the dispersant is added into water and dissolved, so that the dispersant is preferentially adsorbed on the surface of the abrasive to form an electrostatic repulsion or steric hindrance layer. This process can effectively prevent the abrasive particles from agglomerating due to van der Waals forces when added later, thereby significantly improving the dispersion uniformity.

[0077] In step S20, the lubricant, corrosion inhibitor and surfactant are premixed, which can promote the dissolution and emulsification of tall oil fatty acid and corrosion inhibitor in the surfactant and avoid the phase separation phenomenon caused by directly adding tall oil fatty acid and corrosion inhibitor containing long hydrocarbon chains into water.

[0078] A third aspect of an embodiment of the present application provides an application of a polishing liquid in surface treatment, wherein the polishing liquid is the polishing liquid provided in the first aspect of the embodiment of the present application or the polishing liquid prepared by the preparation method of the second aspect of the embodiment of the present application.

[0079] The embodiments of the present application do not specifically limit the surface material, and they show good polishing effects on the surfaces of metal materials such as aluminum and aluminum alloys, copper and copper alloys, stainless steel and carbon steel, and are particularly excellent in the surface polishing of aluminum alloys.

[0080] Aluminum alloy itself is relatively monotonous in color. After polishing, it can present a mirror-like bright surface, which significantly reduces the surface roughness and the friction coefficient. When used in gears and bearings, it can effectively reduce friction loss and extend the service life of components; when used in optical instruments, it can provide a good reflective surface to meet specific optical reflection and refraction requirements and ensure the imaging quality and accuracy of optical devices.

[0081] In some of the embodiments, the polishing liquid can be used to perform chemical mechanical polishing on aluminum alloy for 2min-3min at 1000-1500 rpm and a pressure of 2kg-4kg, which can achieve better polishing effect at a higher polishing efficiency.

[0082] In some embodiments, the surface Ra value after polishing with the polishing liquid is 25nm-30nm. Exemplarily, the surface Ra value can be 25nm, 26nm, 27nm, 28nm, 29nm, 30nm or any value within the range formed by any two of the foregoing.

[0083] The alloy is polished using the polishing liquid provided in the first aspect of the embodiment of the present application or the polishing liquid prepared by the preparation method of the second aspect of the embodiment of the present application, which shows a good polishing effect, especially for aluminum alloys, copper alloys, etc., and can obtain alloy materials with excellent surface properties, especially in the surface polishing of aluminum alloy materials, and can obtain mirror aluminum alloys.

[0084] The embodiments of the present application will be described below. The embodiments described below are exemplary and are only used to explain the present application, and should not be construed as a limitation of the present application. For technologies or conditions not specified in the embodiments, they shall be carried out according to the technologies or conditions described in the literature in this field or according to the product specifications. For reagents or instruments whose manufacturers are not specified, they are all conventional products that can be obtained through commercial purchases.

[0085] Examples 1 - 9

[0086] Examples 1 - 9 provide a polishing liquid, and the preparation method is as follows:

[0087] Add the dispersant (organic bentonite) to pure water, and after stirring evenly, add the abrasive (aluminum oxide powder with a D50 particle size of 1 μm), and stir evenly to prepare a first mixture;

[0088] Mix the lubricant (tall oil fatty acid) and the surfactant (fatty acid methyl ester ethoxylate FMEE), and after stirring evenly, add the corrosion inhibitor (C12 octyldodecanol) and stir evenly to prepare a second mixture;

[0089] Mix the first mixture and the second mixture, and stir evenly to prepare the polishing liquid.

[0090] Based on the total mass of 100 kg of each component in the polishing liquid, the mass contents of each component in Examples 1 - 11 are shown in Table 1.

[0091] Table 1: Composition and content of the polishing liquid (kg)

[0092]

[0093] Example 9

[0094] This example provides a polishing liquid, whose composition and preparation method are basically the same as those of Example 1, except that the organic bentonite is replaced with an equal amount of magnesium aluminosilicate.

[0095] Example 10

[0096] This example provides a polishing liquid, whose composition and preparation method are basically the same as those of Example 1, except that the organic bentonite is replaced with an equal amount of sodium polyacrylate.

[0097] Example 11

[0098] This example provides a polishing liquid, whose composition and preparation method are basically the same as those of Example 1, except that the aluminum oxide is replaced with aluminum oxide with a D50 particle size of 0.1 μm.

[0099] Example 12

[0100] This embodiment provides a polishing liquid, whose composition and preparation method are basically the same as those of Embodiment 1, except that the alumina is replaced with alumina having a D50 particle size of 10 μm.

[0101] Embodiment 13

[0102] This embodiment provides a polishing liquid, whose preparation method is basically the same as that of Embodiment 1, except that the tall oil fatty acid is replaced with an equal amount of fatty acid amide.

[0103] Embodiment 14

[0104] This embodiment provides a polishing liquid, whose preparation method is basically the same as that of Embodiment 1, except that the fatty acid methyl ester ethoxylate FMEE is replaced with an equal amount of alkyl polyoxyethylene ether OP-10.

[0105] Embodiment 15

[0106] This embodiment provides a polishing liquid, whose preparation method is basically the same as that of Embodiment 1, except that the content of the surfactant (fatty acid methyl ester ethoxylate FMEE) in the polishing liquid is 10 kg, and the amount of pure water used is reduced so that the total material is 100 kg.

[0107] Comparative Example 1

[0108] This comparative example provides a polishing liquid, whose composition and preparation method are basically the same as those of Embodiment 1, except that the organobentonite is replaced with polyethylene glycol 600.

[0109] Comparative Example 2

[0110] This comparative example provides a polishing liquid, whose composition and preparation method are basically the same as those of Embodiment 1, except that the organobentonite is replaced with polyacrylamide.

[0111] Comparative Example 3

[0112] This comparative example provides a polishing liquid, whose composition and preparation method are basically the same as those of Embodiment 1, except that the organobentonite is replaced with polyvinyl alcohol.

[0113] Comparative Example 4

[0114] This comparative example provides a polishing liquid, and its preparation method includes the following steps: Add 3 kg of alumina with a D50 particle size of 1 μm to 97 kg of pure water, and stir evenly to prepare the polishing liquid.

[0115] Comparative Example 5

[0116] This comparative example provides a polishing liquid, and its preparation method includes the following steps: Add 3 kg of tall oil fatty acid to 94 kg of pure water, stir evenly, and then add 3 kg of alumina with a D50 particle size of 1 μm thereto and stir evenly to obtain the polishing liquid.

[0117] Comparative Example 6

[0118] This comparative example provides a polishing liquid, and its preparation method includes the following steps: Add 3 kg of tall oil fatty acid to 93.5 kg of pure water, stir evenly, then add 0.5 kg of organic bentonite thereto and stir evenly, and then add 3 kg of alumina with a D50 particle size of 1 μm thereto and stir evenly to obtain the polishing liquid.

[0119] Comparative Example 7

[0120] This comparative example provides a polishing liquid, and its preparation method includes the following steps: Add 3 kg of tall oil fatty acid to 92 kg of pure water, stir evenly, then add 3 kg of C12 octyldodecanol thereto and stir evenly, and then add 2 kg of alumina with a D50 particle size of 1 μm thereto and stir evenly to obtain the polishing liquid.

[0121] Comparative Example 8

[0122] This comparative example provides a polishing liquid, and its preparation method includes the following steps: Add 3 kg of tall oil fatty acid to 90.5 kg of pure water, stir evenly, then add 3 kg of C12 octyldodecanol thereto and stir evenly, then add 0.5 kg of organic bentonite thereto and stir evenly, and then add 3 kg of alumina with a D50 particle size of 1 μm thereto and stir evenly to obtain the polishing liquid.

[0123] Comparative Example 9

[0124] This comparative example provides a polishing liquid, and its preparation method is basically the same as that of Example 1, except that C12 octyldodecanol is replaced with an equal amount of sodium tripolyphosphate.

[0125] Test Example 1. Performance Test of Polishing Liquid

[0126] Perform performance tests on the polishing liquids prepared in the above examples and comparative examples. The specific test indexes and methods are as follows:

[0127] (1) Low-temperature crystallization performance: Place the polishing liquid at 3°C - 15°C and let it stand for 72 hours, and observe the state of the polishing liquid.

[0128] (2) Viscosity: The viscosity of the sample was measured at 25 °C according to the ASTM D445 standard test method. Among them, for the uncrystallized polishing fluid, the capillary viscometer method with a capillary inner diameter of 0.4 mm - 0.6 mm was used for measurement, and for the crystallized polishing fluid, the rotational viscometer method was used for measurement.

[0129] (3) pH value: The pH value of the sample was measured at 25 °C by the potentiometric method (pH meter method).

[0130] (4) Surface tension: The surface tension of the sample was measured at 25 °C according to GB / T 27842-2011.

[0131] (5) Polishing effect: The aluminum alloy was polished with the polishing fluid at 1500 revolutions per minute and a pressure of 4 kg for 3 minutes, and the state of the polished surface was observed and the surface roughness Ra value of the polished surface was measured.

[0132] The results measured by the above test methods are listed in Table 2.

[0133] Table 2: Performance test results of the polishing fluid

[0134]

[0135] It can be seen from the results in Table 2 that the polishing fluids prepared in Examples 1 - 15 of this application have excellent stability at low temperatures. The polishing fluids are evenly dispersed and there is no crystallization phenomenon. Moreover, the polishing fluids prepared by the present invention have excellent polishing performance, can significantly reduce the roughness of the polished surface. In particular, when using the polishing fluids prepared in Examples 1 - 10, the Ra value of the polished surface is below 40 nm, with excellent polishing effect, the number of pits on the polished surface ≤ 12, the number of scratches ≤ 5, and the polished surface has a good state. For the polishing fluids prepared in Comparative Examples 1 - 3, there is an obvious crystallization phenomenon at low temperatures. Although there is no obvious crystallization phenomenon for the polishing fluids prepared in Comparative Examples 4 - 9, after surface polishing with the polishing fluids prepared in Comparative Examples 4 - 9, the surface is relatively rough and it is difficult to achieve the surface state and effect of the examples. For example, for the polishing fluid prepared by simply diluting water and mixing abrasives in Comparative Example 4, the polished aluminum alloy workpieces show roughness, and a variety of functional additives are required to make the workpieces produce a delicate mirror effect during the grinding process. The polishing fluid composition provided in this application includes abrasives, corrosion inhibitors, lubricants, surfactants, dispersants and solvents. For example, in Comparative Examples 5 - 8, the technical effects of this application cannot be achieved without one or more of them.

[0136] This application uses C12 octyldodecanol to effectively block the dissolved oxygen in the polishing fluid, effectively blocking the oxygen absorption corrosion of the aluminum alloy polished parts during the polishing process and generating a white misty surface, so as to achieve a mirror polishing effect. While in Comparative Example 9, using an equal amount of conventional corrosion inhibitor cannot achieve the technical effects of this application.

[0137] The descriptions of the various embodiments above tend to emphasize the differences between the various embodiments. For the same or similar parts, reference can be made to each other, and for the sake of brevity, they will not be elaborated herein.

[0138] It should be noted that the present application is not limited to the above embodiments. The above embodiments are only examples. Embodiments with the same composition and the same function and effect as the technical idea within the scope of the technical solution of the present application are all included in the technical scope of the present application. In addition, within the scope of not departing from the gist of the present application, various modifications that those skilled in the art can think of applied to the embodiments, and other forms constructed by combining some of the constituent elements in the embodiments are also included in the scope of the present application.

Claims

1. A polishing liquid, characterized in that, It includes abrasives, corrosion inhibitors, lubricants, surfactants, dispersants and solvents; The abrasives include aluminum oxides; The corrosion inhibitors include octyldodecanol; The dispersants include one or more of organobentonite, magnesium aluminosilicate and sodium polyacrylate.

2. The polishing liquid according to claim 1, characterized in that, The particle size D50 of the abrasives is 1 μm - 5 μm; and / or, the aluminum oxides include alumina.

3. The polishing liquid according to claim 1, wherein The polishing liquid satisfies at least one of the following conditions: (1) The lubricants include tall oil fatty acids; (2) The surfactants include fatty acid methyl ester ethoxylates.

4. The polishing liquid according to claim 1, wherein, The polishing liquid includes, by mass percentage, 0.4% - 6.5% of abrasives, 0.3% - 8% of corrosion inhibitors, 2% - 8% of lubricants, 1% - 7% of surfactants, 0.3% - 5% of dispersants and 65.5% - 96% of solvents.

5. The polishing liquid according to claim 4, wherein The polishing liquid includes, by mass percentage, 1% - 3% of abrasives, 1% - 8% of corrosion inhibitors, 2.5% - 3% of lubricants, 5% - 7% of surfactants, 0.3% - 0.5% of dispersants and 73.5% - 90.2% of solvents.

6. The polishing liquid according to any one of claims 1, 2, and 4, characterized in that The polishing liquid satisfies at least one of the following conditions: (1) The pH of the polishing liquid is 7.8 - 8.5; (2) The viscosity of the polishing liquid is 100 cp - 121 cp; (3) The surface tension of the polishing liquid is 28 N / m - 32 N / m.

7. A method for preparing a polishing liquid according to any one of claims 1 to 6, characterized in that, It includes the following steps: Mix the abrasives, corrosion inhibitors, lubricants, surfactants, dispersants and solvents to prepare the polishing liquid.

8. The preparation method according to claim 7, characterized in that, It includes the following steps Add the dispersants and corrosion inhibitors into the solvents, and then add the abrasives to prepare the first mixture; Mix the lubricants and the surfactants to prepare the second mixture; Mix the first mixture and the second mixture to prepare the polishing liquid.

9. Application of the polishing liquid in surface treatment, characterized in that, The polishing liquid is the polishing liquid according to any one of claims 1 to 6 or the polishing liquid prepared by the preparation method according to claim 7 or 8; Optionally, the material of the surface includes aluminum alloy.

10. The application according to claim 9, wherein The Ra value of the surface polished by the polishing liquid is 25 nm - 30 nm.

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